TWI885615B - Circuit substrate, circuit board and manufacturing method for circuit board - Google Patents

Abstract

A circuit substrate is divided into a main region and a plurality of bending regions, and the bending regions are adjacent to the main region. The circuit substrate includes a foldable circuit layer and a dielectric layer. The foldable circuit layer extends from the main region to the bending regions. The dielectric layer is disposed on the foldable circuit layer. The dielectric layer includes a first dielectric portion and a plurality of second dielectric portions, the first dielectric portion is disposed on the main region, and the second dielectric portions are disposed on the bending regions. Each of the second dielectric portions has a first sidewall facing to the first dielectric portion, a second sidewall opposite to the first sidewall, and a width between the first sidewall and the second sidewall, in which the widths of the second dielectric portions are equal to each other.

Description

Circuit substrate, circuit board, and method for manufacturing circuit board

The present invention relates to a circuit substrate, a circuit board and a method for manufacturing the circuit board.

Currently, there is a stacking structure formed by stacking multiple circuit boards. In this stacking structure, a support frame is set between the lower circuit board with electronic components installed and the upper circuit board to form a space for accommodating the electronic components between the lower circuit board and the upper circuit board. The support frame is usually made of metal material and welded to the upper circuit board and the lower circuit board so that the upper and lower circuit boards can be electrically connected to each other.

However, the support frame completely surrounds the electronic components on the lower circuit board so that the electronic components are sealed in a closed space, which makes it difficult for the heat generated by the electronic components to dissipate to the outside environment, thereby affecting the performance of the electronic components. Secondly, the support frame is usually welded to the upper circuit board and the lower circuit board, so at least two welding processes are required to set the support frame between the upper and lower circuit boards, which is not conducive to improving throughput. In view of the above, it is currently urgent to develop a circuit board and a manufacturing method thereof to overcome the above shortcomings.

The circuit substrate provided by the present invention has a plurality of bending areas protruding outward, and these bending areas are used for bending and serving as a supporting structure between the circuit substrate and another circuit substrate. The supporting structure in the circuit board of the present invention is formed by bending the bending area of the lower circuit substrate upward, and the supporting structure has a circuit structure, so the upper circuit substrate can be electrically connected to the lower circuit substrate through the supporting structure, thereby improving the integration of the circuit board. In addition, the present case can electrically connect the upper circuit substrate and the lower circuit substrate with only one reflow process, which can improve production capacity and reduce manufacturing costs. At the same time, there is a gap between the connection between the upper and lower circuit substrates in the present case, which is beneficial to the heat dissipation of electronic components.

The circuit substrate provided by at least one embodiment of the present invention is divided into a main area and a plurality of bending areas, wherein the plurality of bending areas are adjacent to the main area, and the circuit substrate includes a bendable circuit layer and a dielectric layer. The bendable circuit layer extends from the main area to the plurality of bending areas. The dielectric layer is disposed on the bendable circuit layer, wherein the dielectric layer includes a first dielectric portion and a plurality of second dielectric portions, wherein the first dielectric portion is located in the main area, and the plurality of second dielectric portions are respectively located in the plurality of bending areas. Each of the plurality of second dielectric portions has a first sidewall facing the first dielectric portion, a second sidewall opposite to the first sidewall, and a width between the first sidewall and the second sidewall, wherein the plurality of widths of the plurality of second dielectric portions are equal to each other. The first dielectric part, the plurality of second dielectric parts and the bendable circuit layer define a plurality of grooves, and each of the plurality of grooves is located between the first sidewalls of the adjacent first dielectric part and the second dielectric part.

In at least one embodiment of the present invention, the first dielectric portion has a first stepped sidewall, and the first sidewall has a second stepped sidewall, and the first stepped sidewall faces the second stepped sidewall.

In at least one embodiment of the present invention, the width of each of the plurality of grooves gradually widens along a direction from the bendable circuit layer toward the dielectric layer.

The circuit board provided by at least one embodiment of the present invention includes a first circuit substrate, a plurality of supporting structures, and a second circuit substrate. The first circuit substrate includes a dielectric layer and a bendable circuit layer, and the dielectric layer is disposed above the bendable circuit layer. The plurality of supporting structures are disposed above the first circuit substrate, and the bendable circuit layer includes a first circuit portion located in the first circuit substrate and a plurality of second circuit portions located in the plurality of supporting structures, wherein the first circuit portion is connected to the plurality of second circuit portions, and each of the plurality of second circuit portions extends from the first circuit portion to the supporting structure, wherein the first circuit portion and the second circuit portion are not coplanar. The second circuit substrate covers the plurality of supporting structures and the first circuit substrate, and is electrically connected to the first circuit substrate through the plurality of supporting structures.

In at least one embodiment of the present invention, the dielectric layer includes a first dielectric portion having a first stepped sidewall and a second dielectric portion having a second stepped sidewall, wherein when the bendable circuit layer is folded, the first stepped sidewall is connected to the second stepped sidewall.

In at least one embodiment of the present invention, the circuit board further includes a bonding material, wherein the bonding material is disposed between the plurality of supporting structures and the second circuit substrate.

In at least one embodiment of the present invention, the top of each of the plurality of supporting structures includes a conductive circuit layer, and the conductive circuit layer is electrically connected to the second circuit substrate.

In at least one embodiment of the present invention, the inner wall of each of the plurality of supporting structures has a conductive circuit layer, and the conductive circuit layer is electrically connected to the bendable circuit layer.

In at least one embodiment of the present invention, a plurality of gaps are provided between the first circuit substrate, the second circuit substrate and the plurality of supporting structures, wherein each gap is located between two adjacent supporting structures and is connected to the accommodation space between the first circuit substrate and the second circuit substrate.

The manufacturing method of the circuit board provided by at least one embodiment of the present invention comprises the following steps: providing a first circuit substrate, wherein the first circuit substrate is divided into a main area and a plurality of bending areas, the plurality of bending areas are adjacent to the main area, the first circuit substrate comprises a dielectric layer and a bendable circuit layer, the dielectric layer is arranged above the bendable circuit layer, the bendable circuit layer extends from the main area to the plurality of bending areas; folding the plurality of bending areas to the main area , wherein the first circuit portion of the bendable circuit layer is located at the outermost layer of the first circuit substrate, and the second circuit portion of each of the bendable circuit layers is located on the outer wall surface of multiple supporting structures, so that the first circuit portion and the second circuit portion are not coplanar; a second circuit substrate is arranged on the first circuit substrate, wherein the second circuit substrate covers the multiple supporting structures and the first circuit substrate, and is electrically connected to the first circuit substrate through the multiple supporting structures.

In at least one embodiment of the present invention, the method for manufacturing a circuit board further includes: before bending the plurality of bending regions to the main region, mounting electronic components on the upper surface of the first circuit substrate.

In at least one embodiment of the present invention, the manufacturing method of the circuit board further includes: after bending the plurality of bending regions to the main region, fixing the plurality of supporting structures on the upper surface of the first circuit substrate by using a glue material.

In the following text, in order to clearly present the technical features of the present invention, the dimensions (e.g., length, width, thickness, and depth) of the components (e.g., circuit substrates, dielectric layers, and bendable circuit layers, etc.) in the drawings will be enlarged in unequal proportions, and the number of some components will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of components in the drawings and the dimensions and shapes presented by the components, but should cover the dimensions, shapes, and deviations therefrom caused by actual processes and/or tolerances. For example, the flat surface shown in the drawings may have rough and/or nonlinear features, and the sharp corners shown in the drawings may be rounded. Therefore, the components presented in the drawings of the present invention are mainly used for illustration, and are not intended to accurately depict the actual shape of the components, nor are they intended to limit the scope of the patent application of the present invention.

In addition, spatially relative terms such as "below", "below", "lower than", "above", "above" and other similar terms are used here to conveniently describe the relationship between one element or feature in the figure and another element or feature. In addition to covering the orientation depicted in the figure, the spatially relative terms also cover other orientations of the device when in use or operation. In other words, when the orientation of the device is different from the figure (rotated 90 degrees or in other orientations), the spatially relative terms used in this disclosure can also be interpreted accordingly.

It will be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of the embodiments. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

1 to 6 are three-dimensional schematic diagrams of a circuit board 100 (please refer to FIG. 6 ) according to an embodiment of the present invention at various stages of the manufacturing process. Referring to FIG. 1 , the circuit substrate 110 is divided into a main region MR and a plurality of bending regions BR, and the plurality of bending regions BR are adjacent to the main region MR. In detail, the plurality of bending regions BR are respectively located around the main region MR. It can be understood that the plurality of bending regions BR protrude outward from the side boundaries of the main region MR, and the length of the plurality of bending regions BR is less than the length of the boundary of the main region MR. For example, in the present embodiment, the shape of each bending region BR is a strip, and the main region MR may protrude from both ends of each bending region BR, as shown in FIG. 1 . The circuit substrate 110 extends along the XY plane and has a thickness extending along the Z direction.

It should be noted that the diagrams shown in Figures 1 to 6 are only used to illustrate the relative positions of the main region MR, the bending region BR and each component. The detailed description of the various layer structures in the main region MR and the bending region BR and the groove formed between the main region MR and the bending region BR will be presented in Figures 7A, 7B, 8A and 8B.

FIG7A is a partial cross-sectional schematic diagram of the line A-A' of FIG1 according to an embodiment of the present invention. The circuit substrate 110 includes dielectric layers 112, 114, and 116 and a bendable circuit layer 118. The dielectric layers 112, 114, and 116 are disposed above the bendable circuit layer 118. In detail, the dielectric layers 112, 114, and 116 include first dielectric portions 112a, 114a, and 116a and second dielectric portions 112b, 114b, and 116b. The first dielectric portions 112a, 114a, and 116a are located in the main region MR, and the second dielectric portions 112b, 114b, and 116b are located in the bend region BR.

As shown in FIG7A , the bendable circuit layer 118 includes a first circuit portion 118a and a second circuit portion 118b, the first circuit portion 118a is connected to the second circuit portion 118b, and the bendable circuit layer 118 extends from the main region MR to the bending region BR. In some embodiments, the bendable circuit layer 118 may be, for example, formed by 1 layer or at least 2 layers of copper foil. In other embodiments, the bendable circuit layer 118 may be, for example, a circuit layer of a flexible circuit board (FCB). Therefore, a flexible substrate may be disposed below the bendable circuit layer 118 in FIG7A , wherein the flexible substrate may be made of a polymer material, such as polyimide (PI).

7A, the second dielectric portions 112b, 114b, and 116b have first sidewalls 112bs1, 114bs1, and 116bs1 and second sidewalls 112bs2, 114bs2, and 116bs2. The first sidewalls 112bs1, 114bs1, and 116bs1 face the first sidewalls 112as1, 114as1, and 116as1 of the first dielectric portions 112a, 114a, and 116a.

1 and 7A, the first sidewall 112bs1 and the second sidewall 112bs2 of the second dielectric portion 112b have a width W, wherein the widths of the plurality of second dielectric portions are equal to each other. In other words, referring to FIG. 1, the widths W in the four bending regions BR are equal to each other.

Referring again to FIG. 7A , the first dielectric portions 112a, 114a, and 116a, the second dielectric portions 112b, 114b, and 116b, and the flexible circuit layer 118 define a groove R (not shown in FIG. 1 ). The groove R is located between the first sidewalls 112as1, 114as1, and 116as1 of the first dielectric portions 112a, 114a, and 116a and the first sidewalls 112bs1, 114bs1, and 116bs1 of the second dielectric portions 112b, 114b, and 116b. The width of the groove R gradually widens in a direction from the flexible circuit layer 118 toward the dielectric layers 112, 114, and 116, as shown in FIG. 7A . In other words, the width (i.e., distance) between the first sidewall 112as1 and the first sidewall 112bs1 is smaller than the width (i.e., distance) between the first sidewall 114as1 and the first sidewall 114bs1, and the width (i.e., distance) between the first sidewall 114as1 and the first sidewall 114bs1 is smaller than the width (i.e., distance) between the first sidewall 116as1 and the first sidewall 116bs1.

As shown in FIG. 7A , the first sidewalls 112as1, 114as1, and 116as1 of the first dielectric portions 112a, 114a, and 116a have a first stepped sidewall. The first sidewalls 112bs1, 114bs1, and 116bs1 of the second dielectric portions 112b, 114b, and 116b have a second stepped sidewall. The first stepped sidewall faces the second stepped sidewall. In other words, the first stepped sidewall is formed by the first sidewalls 112as1, 114as1, and 116as1, and the second stepped sidewall is formed by the first sidewalls 112bs1, 114bs1, and 116bs1.

In other embodiments, the circuit substrate 110 may include only one dielectric layer. For example, the circuit substrate 110 in FIG. 7A may include only the dielectric layer 112, and the dielectric layers 114 and 116 in FIG. 7A may be omitted. Therefore, the number of dielectric layers included in the circuit substrate 110 may be only one layer, and is not limited to multiple layers. In addition, in the embodiment in which the number of dielectric layers is only one layer, the dielectric layer may also have stepped sidewalls, so the first and second stepped sidewalls are not limited to being composed of the sidewalls of multiple dielectric layers. In the embodiment where the number of the dielectric layer is only one, the dielectric layer may not have a stepped sidewall, that is, the first sidewall 112as1 of the first dielectric portion 112a and the first sidewall 112bs1 of the second dielectric portion 112b are both vertical sidewalls.

Referring to FIG. 2 , an electronic component 120 is mounted on the upper surface ts of the circuit substrate 110. The electronic component 120 may be, for example, a capacitor, a resistor, an inductor, a central processing unit (CPU) and/or a graphics processing unit (GPU), but is not limited thereto. It is understood that the size, quantity and arrangement of the electronic component 120 are not limited to those shown in FIG. 2 , and other sizes, quantities and arrangements of the electronic component 120 are also included in the embodiments of the present invention.

Please refer to Fig. 3, a plurality of bending regions BR (please refer to Fig. 2) are folded to the main region MR. Fig. 7B is a partial cross-sectional schematic diagram of the line B-B' of Fig. 3 according to an embodiment of the present invention.

In detail, please refer to FIG. 3, FIG. 7A and FIG. 7B simultaneously. After the bending region BR is rotated about 90 degrees to the main region MR, the original second dielectric portions 112b, 114b and 116b and the second circuit portion 118b form a support structure SS located in the main region MR.

Referring to FIG. 7B , the first circuit portion 118a of the bendable circuit layer 118 is located at the outermost layer of the circuit substrate 110, and the second circuit portion 118b of the bendable circuit layer 118 is located at the outer wall surface of the support structure SS, so that the first circuit portion 118a and the second circuit portion 118b are not coplanar. In other words, the first circuit portion 118a is a structure extending along the XY plane, and the second circuit portion 118b is a structure extending along the YZ plane. It can be understood that the support structure SS described herein includes the second dielectric portions 112b, 114b and 116b and the second circuit portion 118b.

Still referring to FIG. 7B , since the first sidewalls 112as1, 114as1, and 116as1 of the first dielectric parts 112a, 114a, and 116a have a first stepped sidewall, and the first sidewalls 112bs1, 114bs1, and 116bs1 of the second dielectric parts 112b, 114b, and 116b have a second stepped sidewall, after the bending area BR is folded about 90 degrees, the first stepped sidewall engages with the second stepped sidewall. In other words, the first stepped sidewall and the second stepped sidewall cooperate with each other, and the first dielectric parts 112a, 114a, and 116a and the supporting structure SS have a structure in close contact.

It is understood that the height of the support structure SS depends on the width W of the second dielectric portion 112b (see FIG. 7A ). The width W of the second dielectric portion 112b (ie, the height of the support structure SS) can be adjusted according to actual requirements of the circuit board.

Referring to FIG. 4 , after bending the plurality of bending regions BR (see FIG. 2 ) to the main region MR, the plurality of supporting structures SS are fixed on the upper surface ts of the circuit substrate 110 using a glue material 130. The glue material 130 may be, for example, a resin material. The glue material 130 can prevent the second dielectric portions 112 b, 114 b, and 116 b (see FIG. 7B ) from being deformed after being stacked, and can also prevent the second dielectric portions 112 b, 114 b, and 116 b from turning back to a planar shape as shown in FIG. 7B .

5 , a bonding material 140 is disposed on a plurality of supporting structures SS. The bonding material 140 may be, for example, solder paste, but is not limited thereto.

6 , a circuit substrate 150 is disposed on the circuit substrate 110, wherein the circuit substrate 150 covers a plurality of supporting structures SS and the circuit substrate 110, and is electrically connected to the circuit substrate 110 through the plurality of supporting structures SS. In other words, the bonding material 140 (see FIG. 5 ) is disposed between the plurality of supporting structures SS and the circuit substrate 150. It can be understood that by reflowing the bonding material 140, the circuit substrate 150 and the circuit substrate 110 are electrically connected together.

It is worth noting that, referring to FIG. 6 , there are multiple gaps G between the circuit substrate 150, the multiple supporting structures SS, and the circuit substrate 110, wherein each gap G is located between two adjacent supporting structures SS. Each of the gaps G is connected to the accommodation space (not shown) between the circuit substrates 150 and 110, which is also the space where the electronic component 120 is located, so that the outside air can enter the space where the electronic component 120 is located from the gap G, thereby facilitating the heat dissipation of the electronic component 120 on the circuit substrate 110.

Please refer to FIG. 6 and FIG. 7B again. The top of the support structure SS includes a conductive wiring layer 160 (as shown in FIG. 7B ). The conductive wiring layer 160 is electrically connected to the circuit substrate 150 (as shown in FIG. 6 ). It can be understood that the conductive wiring layer 160 is formed in advance before the second dielectric portions 112 b, 114 b and 116 b and the second wiring portion 118 b are bent. In addition, the conductive wiring layer 160 can be formed by laser cutting a conductive blind via.

FIG8A is a partial cross-sectional schematic diagram of line A-A' of FIG1 according to another embodiment of the present invention. FIG8B is a partial cross-sectional schematic diagram of line B-B' of FIG3 according to another embodiment of the present invention. FIG8A differs from FIG7A in the distribution of the conductive wiring layer 160, and FIG8B also differs from FIG7B in the distribution of the conductive wiring layer 160.

8A and 8B , the inner wall iw of the support structure SS has a conductive wiring layer 160, and the conductive wiring layer 160 is electrically connected to the bendable wiring layer 118. The conductive wiring layer 160 can be formed by laser cutting a conductive blind via.

In summary, the circuit substrate provided by the present invention has a plurality of bending areas protruding outward, and these bending areas are used for bending and serving as a supporting structure between the circuit substrate and another circuit substrate. The supporting structure in the circuit board of the present invention is formed by bending the bending area of the lower circuit substrate upward, and the supporting structure has a circuit structure, so that the upper circuit substrate can be electrically connected to the lower circuit substrate through the supporting structure, thereby improving the integration of the circuit board. In addition, the present case can electrically connect the upper circuit substrate and the lower circuit substrate with only one reflow process, which can improve production capacity and reduce the manufacturing cost of setting up an additional support frame. Secondly, in the present invention, there is a gap between the upper and lower circuit substrates, which is connected to the accommodation space between the upper and lower circuit substrates, thereby facilitating heat dissipation of electronic components.

The above outlines the features of multiple implementations so that those skilled in the art can better understand the state of the present application. Those skilled in the art should understand that the present application can be easily used as a basis for designing or modifying other processes and structures in order to perform the same purpose and/or achieve the same advantages of the implementations described herein. Those skilled in the art should also recognize that such equivalent structures do not deviate from the spirit and scope of the present application, and that various changes, substitutions, and modifications of the present application can be made without departing from the spirit and scope of the present application.

100: Circuit board 110: Circuit substrate 112, 114, 116: Dielectric layer 112a, 114a, 116a: First dielectric portion 112as1, 114as1, 116as1: First side wall 112bs1, 114bs1, 116bs1: First side wall 112bs2, 114bs2, 116bs2: Second side wall 112b, 114b, 116b: Second dielectric portion 118: Bendable circuit layer 118a: First circuit portion 118b: Second circuit portion 120: Electronic component 130: Glue dispensing material 140: Bonding material 150: Circuit board 160: Conductive wiring layer ts: Top surface iw: Inner wall MR: Main body area BR: Bending area SS: Support structure R: Groove W: Width A-A’: Line B-B’: Line X, Y, Z: Direction

When read in conjunction with the accompanying drawings, the various aspects of the present application can be best understood according to the following detailed description. It should be understood that various features are not drawn to scale according to standard practices in the industry. In fact, the sizes of various features can be arbitrarily increased or decreased for clarity. Figures 1 to 6 are three-dimensional schematic diagrams of a circuit board at various stages of the process according to an embodiment of the present invention. Figure 7A is a partial cross-sectional schematic diagram of line A-A' of Figure 1 according to an embodiment of the present invention. Figure 7B is a partial cross-sectional schematic diagram of line B-B' of Figure 3 according to an embodiment of the present invention. Figure 8A is a partial cross-sectional schematic diagram of line A-A' of Figure 1 according to another embodiment of the present invention. FIG8B is a partial cross-sectional schematic diagram of line B-B' of FIG3 according to another embodiment of the present invention.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

110: Circuit board 120: Electronic components MR: Main body region SS: Support structure B-B’: Line X, Y, Z: Direction

Claims (9)

A circuit substrate is divided into a main area and a plurality of bending areas, wherein the plurality of bending areas are adjacent to the main area, and the circuit substrate comprises: A bendable circuit layer extending from the main area to the plurality of bending areas; and A dielectric layer disposed on the bendable circuit layer, wherein the dielectric layer comprises a first dielectric portion and a plurality of second dielectric portions, wherein the first dielectric portion is located in the main area, and the plurality of second dielectric portions are respectively located in the plurality of bending areas, wherein each of the plurality of second dielectric portions has a first sidewall facing the first dielectric portion, a second sidewall opposite to the first sidewall, and a width between the first sidewall and the second sidewall, wherein the plurality of widths of the plurality of second dielectric portions are equal to each other, The first dielectric part, the second dielectric parts and the bendable circuit layer define a plurality of grooves, and each of the plurality of grooves is located between the first sidewalls of the adjacent first dielectric part and the second dielectric part, and the width of each of the plurality of grooves gradually widens along the direction from the bendable circuit layer toward the dielectric layer. A circuit substrate as described in claim 1, wherein the first dielectric portion has a first stepped sidewall, and the first sidewall has a second stepped sidewall, and the first stepped sidewall faces the second stepped sidewall. A circuit board comprises: A first circuit substrate comprising a dielectric layer and a bendable circuit layer, wherein the dielectric layer is disposed above the bendable circuit layer; A plurality of supporting structures disposed above the first circuit substrate, wherein a top portion or an inner wall of each of the plurality of supporting structures comprises a conductive circuit layer, the bendable circuit layer comprises a first circuit portion located in the first circuit substrate and a plurality of second circuit portions located in the plurality of supporting structures, the first circuit portion is connected to the plurality of second circuit portions, and each of the plurality of second circuit portions extends from the first circuit portion to the supporting structure, and the first circuit portion and the second circuit portion are not coplanar; and A second circuit substrate covers the multiple supporting structures and the first circuit substrate, and is electrically connected to the first circuit substrate through the conductive line layer of each of the multiple supporting structures. A circuit board as described in claim 3, wherein the dielectric layer includes a first dielectric portion having a first step-shaped sidewall and a second dielectric portion having a second step-shaped sidewall, wherein the first step-shaped sidewall is connected to the second step-shaped sidewall. The circuit board as described in claim 3 further comprises a bonding material, wherein the bonding material is disposed between the plurality of supporting structures and the second circuit substrate. A circuit board as described in claim 3, wherein there are multiple gaps between the first circuit substrate, the second circuit substrate and the multiple supporting structures, wherein each of the gaps is located between two adjacent supporting structures and is connected to a accommodating space between the first circuit substrate and the second circuit substrate. A method for manufacturing a circuit board, comprising: Providing a first circuit substrate, wherein the first circuit substrate is divided into a main area and a plurality of bending areas, the plurality of bending areas are adjacent to the main area, the first circuit substrate comprises a dielectric layer and a bendable circuit layer, the dielectric layer is disposed above the bendable circuit layer, and the bendable circuit layer extends from the main area to the plurality of bending areas; Folding the plurality of bending areas to the main area, wherein a first circuit portion of the bendable circuit layer is located at the outermost layer of the first circuit substrate, and a second circuit portion of each of the bendable circuit layers is located on the outer wall surface of a plurality of supporting structures, so that the first circuit portion and the second circuit portion are not coplanar; and A second circuit substrate is arranged on the first circuit substrate, wherein the second circuit substrate covers the plurality of supporting structures and the first circuit substrate, and is electrically connected to the first circuit substrate through the plurality of supporting structures. The method for manufacturing a circuit board as described in claim 7 further comprises: Before bending the multiple bending regions to the main region, mounting an electronic component on an upper surface of the first circuit substrate. The manufacturing method of the circuit board as described in claim 7 further includes: After bending the multiple bending areas to the main area, using a point of glue material to fix the multiple supporting structures on an upper surface of the first circuit substrate.

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