TWI885697B - Burn-in test structure - Google Patents

Abstract

A burn-in test structure is provided and comprising: an electronic carrier having a first surface and a second surface opposite to the first surface; at least one test unit provided on the first surface of the electronic carrier; at least one carrying element provided on the second surface of the electronic carrier; and at least one conductive element provided within the carrying element and on the second surface of the electronic carrier, and is adjacent to one side of the test unit.

Description

Pre-burn test structure

The present invention relates to a semiconductor test structure, and in particular to a pre-burn test structure capable of improving voltage drop.

In response to technological development and product demand, the design and manufacturing of high-power chips (such as AI/CPU chips) are becoming increasingly complex, and their power consumption is gradually increasing. High-power chips must undergo aging/pre-burning/breakdown (Burn-in) tests at high temperatures before leaving the factory to confirm their reliability. This test mainly uses a pre-burn test board (Burn-in Board, BIB), and installs a high-power chip on the pre-burn test board. The copper layer in the pre-burn test board transmits voltage/current to the high-power chip. During this test process, since high-power chips need to be supplied with low voltage/high current (more than 300A), the copper layer impedance will have different voltage drops (IR Drop) depending on the current size, which will affect the test.

Therefore, how to overcome the above-mentioned problems of knowledge and technology has become an urgent issue to be solved.

In view of the various deficiencies of the above-mentioned prior art, the present invention provides a pre-burn test structure, comprising: an electronic carrier having a first surface and a second surface opposite to each other; at least one test unit disposed on the first surface of the electronic carrier; at least one supporting element disposed on the second surface of the electronic carrier; and at least one conductive element disposed in the supporting element and on the second surface of the electronic carrier, and adjacent to one side of the test unit.

As in the aforementioned pre-burn test structure, the conductive element includes a body and a connecting portion. The body is formed by extending along an axis and is disposed on one side adjacent to the test unit. The connecting portion extends outward from one end of the body along the axis and is exposed to the supporting element.

As in the aforementioned pre-burn test structure, the conductive element further includes a plurality of conductive posts, which extend outward from the body in a direction perpendicular to the axis at intervals, penetrate the electronic carrier, protrude from the first surface, and are adjacent to one side of the test unit.

As in the aforementioned pre-burn test structure, the electronic carrier further has a circuit layer located on the first surface, and the plurality of conductive posts are electrically connected to the circuit layer.

As in the aforementioned pre-burn test structure, the conductive element further includes an insulating layer, the insulating layer is coated on the outer side of the body, and the plurality of conductive posts and the connecting portion are exposed on the insulating layer.

As in the aforementioned pre-burn test structure, the connection portion is used to connect the system power supply or ground.

As in the aforementioned pre-burn test structure, the supporting element has a groove extending along the axis, and the conductive element is disposed in the groove.

As mentioned above in the pre-burn test structure, the material of the conductive element is copper.

As in the aforementioned pre-burn test structure, the number of the conductive elements is two, adjacent to two opposite sides of the test unit.

As in the aforementioned pre-burn test structure, the conductive element and the supporting element are not located directly below the test unit.

In summary, the pre-burn test structure of the present invention uses a carrier element to carry a conductive element, so that the conductive element can be designed to facilitate large current transmission. The large current does not pass through the copper layer in the electronic substrate for long-distance transmission, so it can effectively solve the problem of voltage drop in the previous technology. Therefore, the thickness and number of copper layers in the electronic substrate can also be reduced, which can further reduce the manufacturing cost of the electronic substrate. In addition, the conductive element is not located directly below the test unit, so it does not hinder the heat dissipation function of the electronic substrate.

1: Pre-burn test structure

11: Electronic carrier

11a: First surface

11b: Second surface

111: Line layer

12: Test unit

13: Carrying components

131: Groove

14: Conductive element

141:Entity

142:Connection part

143:Conductive pillar

144: Insulation layer

X: axis

Figure 1 is a schematic diagram of the pre-burning test structure of the present invention from the front view.

Figure 2 is a side view of the pre-burning test structure of the present invention.

Figure 3 is a schematic diagram of the conductive element in the pre-burning test structure of the present invention.

Figure 4 is a front view schematic diagram of another embodiment of the pre-burning test structure of the present invention.

The following is a specific and concrete example to illustrate the implementation of the present invention. People familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this manual.

It should be noted that the structures, proportions, sizes, etc. depicted in the drawings attached to this specification are only used to match the contents disclosed in the specification for understanding and reading by people familiar with this technology, and are not used to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "above", "first", "second", "at least one" etc. used in this specification are only used to facilitate the description, and are not used to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships, without substantially changing the technical content, should also be regarded as the scope of implementation of the present invention.

Please refer to Figures 1, 2 and 3. The pre-burn test structure 1 of the present invention includes an electronic carrier 11, at least one test unit 12, at least one supporting element 13 and at least one conductive element 14.

The electronic carrier 11 has a first surface 11a and a second surface 11b opposite to each other. In this embodiment, the electronic carrier 11 is a pre-burned test board (BIB).

The test unit 12 is disposed on the first surface 11a of the electronic carrier 11. In this embodiment, the test unit 12 is a chip socket for installing a high-power chip.

In one embodiment, the number of test units 12 can be plural and arranged in an array on the first surface 11a of the electronic carrier 11 to test multiple high-power chips at the same time.

The supporting element 13 is disposed on the second surface 11b of the electronic carrier 11. In this embodiment, the supporting element 13 is a bracket having a groove 131 extending along the axis X, and is locked on the electronic carrier 11 by, for example, screws with the groove 131 facing the second surface 11b. The locking position does not correspond to being directly below the test unit 12, but is adjacent to one side of the test unit 12.

In one embodiment, the number of the supporting elements 13 may be more than two, and they are adjacent to two opposite sides of the test unit 12. If there are multiple test units 12 in an array, the supporting elements 13 may be disposed on two opposite sides of the test units 12 in the same row (or line), and none of them corresponds to being directly below the test units 12 in the same row (or line).

The conductive element 14 is disposed inside the supporting element 13 and on the second surface 11b of the electronic carrier 11, and is adjacent to one side of the test unit 12.

In this embodiment, the conductive element 14 includes a body 141, a connecting portion 142, a plurality of conductive posts 143 and an insulating layer 144. The body 141 is roughly in the shape of a long strip (or cable) and extends along the axis X, and is disposed in the groove 131 and adjacent to one side of the test unit 12. The connecting portion 142 extends outward from one end of the body 141 along the axis X and is exposed to the supporting element 13 for connecting to a system power supply or grounding. The system power supply can be, for example, a low voltage and high current direct current to supply the test unit 12.

A plurality of conductive posts 143 extend outward from the body 141 along the vertical axis X at intervals, penetrate the second surface 11b and the first surface 11a of the electronic carrier 11, and then protrude from the first surface 11a, and are spaced apart and adjacent to one side of the test unit 12. In one embodiment, the number of conductive posts 143 can be designed according to the layout and power of the test unit 12.

The insulating layer 144 is wrapped around the outer side of the body 141 to insulate the supporting element 13. However, the insulating layer 144 does not wrap around the plurality of conductive posts 143 and the connecting portion 142, so that the plurality of conductive posts 143 and the connecting portion 142 are exposed to the insulating layer 144 and the supporting element 13.

In this embodiment, the material of the conductive element 14 is copper.

In one embodiment, the number of conductive elements 14 can match the number of supporting elements 13. For example, when the number of supporting elements 13 is two, the number of conductive elements 14 is also two. At this time, the conductive elements 14 are also adjacent to the two opposite sides of the test unit 12, and are not located directly below the test unit 12.

Please refer to FIG. 4 . The electronic carrier 11 in the pre-burn test structure 1 of the present invention may further have a circuit layer 111 . The circuit layer 111 is located on the first surface 11a . The plurality of conductive posts 143 are electrically connected to the circuit layer 111 . In one embodiment, the plurality of conductive posts 143 and the circuit layer 111 may be fixed by welding.

In summary, the pre-burn test structure of the present invention uses a carrier element to carry a conductive element, so that the conductive element can be designed to facilitate large current transmission. The large current does not pass through the copper layer in the electronic substrate for long-distance transmission, so it can effectively solve the problem of voltage drop in the previous technology. Therefore, the thickness and number of copper layers in the electronic substrate can also be reduced, which can further reduce the manufacturing cost of the electronic substrate. In addition, the conductive element is not located directly below the test unit, so it does not hinder the heat dissipation function of the electronic substrate.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the scope of the patent application described below.

1: Pre-burn test structure

11: Electronic carrier

11a: First surface

11b: Second surface

12: Test unit

13: Carrying components

131: Groove

141:Entity

142:Connection part

143:Conductive pillar

Claims (10)

A pre-burn test structure includes: an electronic carrier having a first surface and a second surface opposite to each other; at least one test unit disposed above the first surface of the electronic carrier but not in the electronic carrier; at least one carrier element disposed on the second surface of the electronic carrier; and at least one conductive element disposed in the carrier element and below the second surface of the electronic carrier, wherein the conductive element in the carrier element and below the second surface of the electronic carrier is adjacent to one side of the test unit above the first surface of the electronic carrier. The pre-burn test structure as described in claim 1, wherein the conductive element comprises a body and a connecting portion, the body is extended along an axis and is disposed on one side adjacent to the test unit, and the connecting portion extends outward from one end of the body along the axis and is exposed to the supporting element. The pre-burn test structure as described in claim 2, wherein the conductive element further comprises a plurality of conductive posts, the plurality of conductive posts extend outward from the body in a direction perpendicular to the axis at intervals, penetrate the electronic carrier and protrude from the first surface, and are adjacent to one side of the test unit. The pre-burn test structure as described in claim 3, wherein the electronic carrier further has a circuit layer located on the first surface, and the plurality of conductive posts are electrically connected to the circuit layer. The pre-burn test structure as described in claim 3, wherein the conductive element further comprises an insulating layer, the insulating layer is coated on the outer side of the body, and the plurality of conductive posts and the connecting portion are exposed on the insulating layer. A pre-burn test structure as described in claim 2, wherein the connection portion is used to connect to a system power supply or ground. The pre-burn test structure as described in claim 2, wherein the supporting element has a groove extending along the axis, and the conductive element is disposed in the groove. A pre-burn test structure as described in claim 1, wherein the material of the conductive element is copper. The pre-burn test structure as described in claim 1, wherein the number of the conductive elements is two, respectively adjacent to two opposite sides of the test unit. The pre-burn test structure as described in claim 1, wherein the conductive element and the supporting element are not located directly below the test unit.

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