TWI885665B - Strength prediction method for laser bonded composite materials - Google Patents
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本發明關於一種強度預測方法,特別是一種針對複合材料雷射結合的強度預測方法。The present invention relates to a strength prediction method, and in particular to a strength prediction method for laser bonding of composite materials.
工具機大多是金屬材料製成,為了減少工具機運作時的耗能以降低碳排,部分開發商嘗試以金屬結合非金屬的複合材料來製造工具機。Most machine tools are made of metal. In order to reduce energy consumption during operation and thus lower carbon emissions, some developers have tried to manufacture machine tools by combining metal with non-metallic composite materials.
然而,在設計工具機的時候,無法明確地了解結合有金屬與非金屬之複合材料的強度,可能導致設計並製造出來的工具機強度不足而容易損壞,或是強度過強而難以減輕重量造成減少耗能的效果不佳。However, when designing machine tools, the strength of composite materials combining metal and non-metal is not clearly understood, which may lead to the design and manufacture of machine tools that are not strong enough and are easily damaged, or are too strong and difficult to reduce in weight, resulting in poor energy consumption reduction effect.
本發明在於提供一種強度預測方法,能夠模擬出金屬與非金屬之複合材料的結合強度,以方便使用此複合材料設計工具機。The present invention provides a strength prediction method which can simulate the bonding strength of metal and non-metal composite materials to facilitate the design of machine tools using the composite materials.
本發明之一實施例所揭露之複合材料雷射結合的強度預測方法係以一運算裝置執行。複合材料雷射結合的強度預測方法包含下列步驟:建立一初始幾何模型,其中初始幾何模型包含彼此接觸的一初始實體幾何模型以及一初始表面幾何模型;接收一金屬材料資訊、一非金屬材料資訊以及多個層體形成參數;根據金屬材料資訊,設定初始實體幾何模型的材料特性參數以產生一實體模型;根據非金屬材料資訊與層體形成參數,建立一層體模型,其中層體形成參數包含至少一層體厚度以及一層體數量;根據層體模型,設定初始表面幾何模型的材料特性參數以產生一表面模型;設定實體模型與表面模型之間的連接為雷射結合以產生一複合結構模型;以及對複合結構模型執行一拉伸試驗模擬以得到一模擬結果。The strength prediction method for composite material laser bonding disclosed in one embodiment of the present invention is executed by a computing device. The strength prediction method for composite material laser bonding includes the following steps: establishing an initial geometric model, wherein the initial geometric model includes an initial solid geometric model and an initial surface geometric model that are in contact with each other; receiving a metal material information, a non-metal material information and a plurality of layer formation parameters; according to the metal material information, setting the material property parameters of the initial solid geometric model to generate a solid model; according to the non-metal material information, The invention relates to a method for preparing a composite structure model of a composite structure comprising: obtaining a composite structure model by using material information and layer formation parameters, wherein the layer formation parameters include at least one layer thickness and a layer number; setting material property parameters of an initial surface geometry model according to the layer model to generate a surface model; setting a connection between the solid model and the surface model as laser bonding to generate a composite structure model; and performing a tensile test simulation on the composite structure model to obtain a simulation result.
根據上述實施例所揭露的複合材料雷射結合的強度預測方法,藉由建立包含初始實體幾何模型與初始表面幾何模型的初始幾何模型,可針對金屬與非金屬雷射結合的複合結構模型進行拉伸試驗模擬。相較於習知,利用本發明的方法可在設計階段便得知金屬與非金屬之複合材料的結合強度,進而有利於製造出適當強度的產品,避免強度設計不足或過度設計。According to the strength prediction method of composite laser bonding disclosed in the above embodiment, by establishing an initial geometric model including an initial solid geometric model and an initial surface geometric model, a tensile test simulation can be performed on a composite structure model of metal and non-metal laser bonding. Compared with the prior art, the method of the present invention can be used to know the bonding strength of metal and non-metal composite materials in the design stage, which is conducive to manufacturing products with appropriate strength and avoiding insufficient or excessive strength design.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及功效。以下之實施例進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable anyone familiar with the relevant technology to understand the technical content of the present invention and implement it accordingly. According to the contents disclosed in this specification, the scope of the patent application and the drawings, anyone familiar with the relevant technology can easily understand the relevant purposes and effects of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.
請參照圖1至圖8,其中圖1至圖4係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之流程圖,且圖5至圖8係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之示意圖。Please refer to Figures 1 to 8, wherein Figures 1 to 4 are flow charts of a method for predicting the intensity of composite material laser bonding according to an embodiment of the present invention, and Figures 5 to 8 are schematic diagrams of a method for predicting the intensity of composite material laser bonding according to an embodiment of the present invention.
如圖1所示,複合材料雷射結合的強度預測方法可包含步驟S101:建立初始幾何模型;步驟S102:將初始實體幾何模型與初始表面幾何模型各自劃分成多個元素;步驟S103:接收金屬材料資訊、非金屬材料資訊以及層體形成參數;步驟S104:根據金屬材料資訊,設定初始實體幾何模型的材料特性參數以產生實體模型;步驟S105:根據非金屬材料資訊與層體形成參數,建立層體模型;步驟S106:根據層體模型,設定初始表面幾何模型的材料特性參數以產生表面模型;步驟S107:設定實體模型與表面模型之間的連接為雷射結合以產生複合結構模型;以及步驟S108:基於有限元素法對複合結構模型執行拉伸試驗模擬以得到模擬結果。As shown in FIG. 1 , the strength prediction method for laser bonding of composite materials may include step S101: establishing an initial geometric model; step S102: dividing the initial solid geometric model and the initial surface geometric model into multiple elements; step S103: receiving metal material information, non-metal material information and layer formation parameters; step S104: setting the material property parameters of the initial solid geometric model according to the metal material information to generate a solid model ; Step S105: Establish a layer model based on non-metallic material information and layer formation parameters; Step S106: Set material property parameters of the initial surface geometry model based on the layer model to generate a surface model; Step S107: Set the connection between the solid model and the surface model to laser bonding to generate a composite structure model; and Step S108: Perform a tensile test simulation on the composite structure model based on the finite element method to obtain a simulation result.
如圖2所示,步驟S105可包含步驟S1051:根據非金屬材料資訊、層體厚度與層體數量,建立對應層體數量的初始層體;步驟S1052:接收對應層體數量的座標系;以及步驟S1053:根據座標系沿堆疊方向堆疊初始層體,以建立層體模型。As shown in FIG. 2 , step S105 may include step S1051: establishing an initial layer corresponding to the number of layers according to non-metallic material information, layer thickness and layer number; step S1052: receiving a coordinate system corresponding to the number of layers; and step S1053: stacking the initial layers along a stacking direction according to the coordinate system to establish a layer model.
如圖3所示,步驟S107可包含步驟S1071:在實體模型與表面模型之間的連接區域設定介接節點;步驟S1072:設定連接實體模型與表面模型的介接元素;以及步驟S1073:以雷射功率設定實體模型與表面模型之間的結合強度以產生複合結構模型。As shown in FIG. 3 , step S107 may include step S1071: setting an interface node in the connection area between the solid model and the surface model; step S1072: setting an interface element connecting the solid model and the surface model; and step S1073: setting the bonding strength between the solid model and the surface model with laser power to generate a composite structure model.
如圖4所示,複合材料雷射結合的強度預測方法更可包含步驟S201:接收回應於模擬結果的回饋訊號;步驟S202:根據回饋訊號,調整實體模型與表面模型之間雷射結合的雷射功率以產生更新複合結構模型;以及步驟S203:對更新複合結構模型執行拉伸試驗模擬以得到更新模擬結果。As shown in FIG. 4 , the strength prediction method of laser bonding of composite materials may further include step S201: receiving a feedback signal in response to a simulation result; step S202: adjusting the laser power of the laser bonding between the solid model and the surface model according to the feedback signal to generate an updated composite structure model; and step S203: performing a tensile test simulation on the updated composite structure model to obtain an updated simulation result.
將於下文以例如為電腦之中央處理器的運算裝置來示例性地說明圖1至圖4所示的複合材料雷射結合的強度預測方法,並請搭配對應的說明來一併參照圖5至圖8。The intensity prediction method for composite material laser bonding shown in FIGS. 1 to 4 will be exemplarily described below using a computing device such as a central processing unit of a computer, and please refer to FIGS. 5 to 8 for the corresponding descriptions.
在步驟S101中,如圖5所示,運算裝置建立一初始幾何模型10。初始幾何模型10包含彼此接觸的一初始實體幾何模型11以及一初始表面幾何模型12。初始實體幾何模型11例如為具有三維尺寸且具有一定程度之厚度的元件。請注意圖5中繪示成方塊狀的初始實體幾何模型11僅為示例;在部分實施例中,初始實體幾何模型亦可為任意形狀,本發明不以此為限。初始表面幾何模型12例如為具有三維尺寸且具有極小厚度的元件。請注意由於初始表面幾何模型12的厚度極小,故在圖5中僅示例性地繪示成平坦片狀,但本發明不以此為限;在部分實施例中,初始表面幾何模型亦可在三維空間中呈現彎曲等形狀。上述初始實體幾何模型11與初始表面幾何模型12之間的彼此接觸係指初始實體幾何模型11與初始表面幾何模型12輕輕抵靠而尚未有涉及連結力等連接關係。In step S101, as shown in FIG5, the computing device establishes an initial
在步驟S102中,如圖6所示,運算裝置將初始實體幾何模型11與初始表面幾何模型12各自劃分成多個元素。在圖6中,初始實體幾何模型11被劃分成多個六面體元素,而初始表面幾何模型12被劃分成多個四邊形元素,但本發明不以此為限。在部分實施例中,初始實體幾何模型亦可被劃分成多個任一種多面體元素。在其他部分實施例中,初始表面幾何模型亦可被劃分成多個任一種多邊形元素。此外,請注意在將初始表面幾何模型12劃分成多個元素後,初始表面幾何模型12被劃分成上表層與下表層以利於利用多個節點來進行計算,故為了讓元素劃分視覺化而在圖6中將初始表面幾何模型12繪示成具有厚度的外觀,但實際上初始表面幾何模型12仍維持為具有極小厚度的元件。上述也可被理解為,步驟S102並未改變初始表面幾何模型12的厚度。In step S102, as shown in FIG6 , the computing device divides the initial
在步驟S103中,運算裝置接收一金屬材料資訊、一非金屬材料資訊以及多個層體形成參數。其中,金屬材料資訊、非金屬材料資訊與層體形成參數可透過例如為電腦之滑鼠或鍵盤的輸入裝置由使用者輸入至電腦後由運算裝置接收。其中,層體形成參數可包含欲形成之層體(對應至下述之初始層體)的厚度與欲形成之層體(對應至下述之初始層體)的數量。In step S103, the computing device receives a metal material information, a non-metal material information and a plurality of layer formation parameters. The metal material information, the non-metal material information and the layer formation parameters can be inputted into the computer by a user through an input device such as a mouse or a keyboard of a computer and then received by the computing device. The layer formation parameters can include the thickness of the layer to be formed (corresponding to the initial layer described below) and the number of the layer to be formed (corresponding to the initial layer described below).
在步驟S104中,運算裝置根據接收到的金屬材料資訊,可透過例如為電腦之硬碟的儲存裝置內所預存的對應金屬材料特性參數,來設定初始實體幾何模型11的材料特性參數,以產生一實體模型13,如圖7所示。舉例來說,若使用者在步驟S103中輸入金屬材料資訊為鐵,運算裝置可在硬碟中找到預存的鐵相關特性參數,例如楊氏係數與蒲松比,並將這些鐵相關特性參數套用至初始實體幾何模型11而產生實體模型13。然而,本發明不以此為限。在部分實施例中,使用者所輸入的金屬材料資訊可例如為所述金屬(如,鐵)的楊氏係數與蒲松比,而運算裝置可直接以接收到的金屬之楊氏係數與蒲松比來設定初始實體幾何模型的材料特性參數。In step S104, the computing device can set the material property parameters of the initial solid
在步驟S105中,運算裝置根據接收到的非金屬材料資訊與層體形成參數,來建立一層體模型。In step S105, the computing device establishes a layer model according to the received non-metallic material information and layer formation parameters.
具體來說,步驟S105可包含步驟S1051至步驟S1053。在步驟S1051中,運算裝置根據接收到的非金屬材料資訊以及層體形成參數所包含的層體厚度與層體數量,來建立對應層體數量的初始層體。請注意層體數量可為1、2、3……等正整數,而初始層體的數量則可對應地為1層、2層、3層……等等。並且,初始層體的單層厚度可對應至其中一個層體厚度。舉例來說,層體形成參數所包含的層體厚度與層體數量例如為0.09公釐與4,則運算裝置可建立4層厚度為0.09公釐的初始層體。在另一示例中,層體厚度例如為0.09公釐、0.08公釐、0.09公釐與0.08公釐,層體數量例如為4,則運算裝置可建立4層厚度分別為0.09公釐、0.08公釐、0.09公釐與0.08公釐的初始層體。此外,初始層體的材料特性參數可對應至非金屬材料資訊,並可透過例如為電腦之硬碟的儲存裝置內所預存的對應非金屬材料特性參數來取得。舉例來說,若使用者在步驟S103中輸入非金屬材料資訊為碳纖維,運算裝置可在硬碟中找到預存的碳纖維相關特性參數,例如纖維角度及其對應的楊氏係數與蒲松比,並在建立初始層體時將這些碳纖維相關特性參數套用至初始層體。然而,本發明不以此為限。在部分實施例中,使用者所輸入的非金屬材料資訊可例如為所述非金屬(如,碳纖維)的纖維角度及其對應的楊氏係數與蒲松比,而運算裝置可直接以接收到的非金屬之纖維角度、楊氏係數與蒲松比來建立初始層體的材料特性參數。請注意初始層體的數量為多層時,這些初始層體可同時建立,亦可批次建立,本發明不以此為限。在部分實施例中,所述非金屬亦可為環氧樹脂(epoxy resin)。Specifically, step S105 may include step S1051 to step S1053. In step S1051, the computing device creates an initial layer corresponding to the number of layers according to the received non-metallic material information and the layer thickness and number of layers included in the layer formation parameters. Please note that the number of layers can be a positive integer such as 1, 2, 3, etc., and the number of initial layers can be 1 layer, 2 layers, 3 layers, etc., respectively. In addition, the single layer thickness of the initial layer can correspond to one of the layer thicknesses. For example, the layer thickness and the number of layers included in the layer formation parameters are, for example, 0.09 mm and 4, and the computing device can create 4 initial layers with a thickness of 0.09 mm. In another example, the layer thicknesses are, for example, 0.09 mm, 0.08 mm, 0.09 mm, and 0.08 mm, and the number of layers is, for example, 4, and the computing device can create 4 initial layers with thicknesses of 0.09 mm, 0.08 mm, 0.09 mm, and 0.08 mm, respectively. In addition, the material property parameters of the initial layer can correspond to non-metallic material information and can be obtained through the corresponding non-metallic material property parameters pre-stored in a storage device such as a hard disk of a computer. For example, if the user inputs the non-metallic material information as carbon fiber in step S103, the computing device can find the pre-stored carbon fiber-related characteristic parameters in the hard disk, such as the fiber angle and its corresponding Young's modulus and Pusson's ratio, and apply these carbon fiber-related characteristic parameters to the initial layer when establishing the initial layer. However, the present invention is not limited to this. In some embodiments, the non-metallic material information input by the user can be, for example, the fiber angle of the non-metal (such as carbon fiber) and its corresponding Young's modulus and Pusson's ratio, and the computing device can directly use the received fiber angle, Young's modulus and Pusson's ratio of the non-metal to establish the material characteristic parameters of the initial layer. Please note that when there are multiple initial layers, these initial layers can be built simultaneously or in batches, and the present invention is not limited thereto. In some embodiments, the non-metallic material can also be epoxy resin.
在步驟S1052中,運算裝置接收對應層體數量的座標系。舉例來說,層體數量例如為4,則運算裝置可接收四個座標系,以分別對應到4層初始層體。In step S1052, the computing device receives coordinate systems corresponding to the number of layers. For example, if the number of layers is 4, the computing device may receive four coordinate systems corresponding to the four initial layers respectively.
在步驟S1053中,運算裝置根據對應層體數量的座標系沿一堆疊方向堆疊對應層體數量的初始層體,以建立層體模型。舉例來說,請參照圖9,係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之堆疊初始層體的示意圖。在圖9中,堆疊方向例如為圖9所示之整體系統(global system)的正Z軸方向,數量例如為四個的座標系各自的正X軸方向例如與整體系統的正X軸方向分別差45度、135度、135度以及45度,則運算裝置會例如沿正Z軸方向將對應到四個數量的初始層體161、162、163、164以相對於整體系統的45度、135度、135度與45度分別依序堆疊,而形成層體模型16。在圖9中,四個數量的初始層體161、162、163、164例如為碳纖維材質,且其纖維161a、162a、163a、164a沿各自的纖維角度延伸的方向例如與各自座標系的X軸平行,而在堆疊初始層體161、162、163、164時,以45度、135度、135度以及45度作為纖維161a、162a、163a、164a相對於整體系統X軸的纖維角度來沿正Z軸方向堆疊初始層體161、162、163、164。請注意本發明並不限定於僅以相對於一個整體系統的夾角來堆疊初始層體;在部分實施例中,亦可用相對於鄰近初始層體的相對夾角來堆疊初始層體;在部分實施例中,初始層體所對應的座標系可皆與整體系統的座標系對齊(亦可理解為各座標系的正X軸方向皆相同),而以纖維各自的延伸方向來展現各個初始層體的纖維角度。請注意纖維161a、162a、163a、164a各自的延伸方向與對應座標系的X軸之間的夾角並非用來限定本發明。在部分實施例中,單一初始層體的纖維延伸方向與對應座標系的X之間可為任意夾角。此外,堆疊後的初始層體的纖維角度可相異。以圖9為例,初始層體161之纖維161a的纖維角度與初始層體162之纖維162a的纖維角度相差90度,而初始層體161之纖維161a的纖維角度與初始層體164之纖維164a的纖維角度相同。In step S1053, the computing device stacks the initial layers corresponding to the number of layers along the stacking direction according to the coordinate system corresponding to the number of layers to establish a layer model. For example, please refer to FIG. 9, which is a schematic diagram of stacking initial layers according to an embodiment of the present invention for predicting the strength of composite material laser bonding. In FIG. 9 , the stacking direction is, for example, the positive Z-axis direction of the global system shown in FIG. 9 , and the positive X-axis directions of the four coordinate systems are, for example, 45 degrees, 135 degrees, 135 degrees, and 45 degrees different from the positive X-axis direction of the global system, respectively. Then, the computing device will, for example, stack the corresponding four
在步驟S106中,運算裝置根據步驟S105中所建立的層體模型,設定初始表面幾何模型12的材料特性參數以產生一表面模型14,如圖7所示。請注意圖9中的層體模型16可為步驟S106中所使用之層體模型的其中一種態樣,本發明不以此為限。請注意步驟S105中層體模型會因堆疊層數與單個初始層體的厚度而有不同的強度相關參數(舉例來說,堆疊的層數越多,或是堆疊的厚度越厚,皆會增加層體模型的強度相關參數),而步驟S106是將步驟S105中經堆疊的層體模型所展現之強度相關參數設定成初始表面幾何模型12的材料特性參數,強度相關參數並不包含層體模型的厚度,故步驟S106中所產生的表面模型14仍是維持在極小的厚度;圖7中所呈現的表面模型14之厚度如前所述,同樣是因為元素劃分視覺化而在圖7中繪示成具有厚度的外觀。In step S106, the computing device sets the material property parameters of the initial
在步驟S107中,運算裝置設定實體模型13與表面模型14之間的連接為雷射結合以產生一複合結構模型20。In step S107 , the computing device sets the connection between the
具體來說,步驟S107可包含步驟S1071至步驟S1073。在步驟S1071中,如圖7與圖8所示,運算裝置在實體模型13與表面模型14之間的連接區域設定多個介接節點18,其中介接節點18的相鄰兩者保持一間距地排列。如局部放大的圖8所示,介接節點18的數量例如為72個,並且在25公釐×25公釐的連接區域內以例如2到2.5公釐之間的一個定值作為間距等間距地排列,這些介接節點18所排列而成的陣列於長邊處與短邊處分別例如在25公釐×12.5公釐的範圍內分布有12個與6個介接節點18,且這些介接節點18所排列而成的陣列在短邊方向上與連接區域的邊界皆例如為6.25公釐。請注意介接節點的間距並非用來限制本發明。在部分實施例中,介接節點亦可用上述範圍以外的間距排列,或是用不相等的間距排列。Specifically, step S107 may include step S1071 to step S1073. In step S1071, as shown in FIG7 and FIG8, the computing device sets a plurality of
在步驟S1072中,運算裝置設定連接實體模型13與表面模型14的一介接元素,其中介接元素例如為彈簧,藉以利用彈簧的特性來進行連接模擬。請注意介接元素的種類並非用來限制本發明,亦可設定成其他種類的介接元素。In step S1072, the computing device sets an interface element connecting the
在步驟S1073中,運算裝置以一雷射功率設定實體模型13與表面模型14之間的結合強度以產生複合結構模型20。至此,運算裝置完成以雷射結合的金屬與非金屬之複合結構模型20。In step S1073, the computing device sets the bonding strength between the
由於在步驟S102中運算裝置已將初始幾何模型10劃分成多個元素,因此在步驟S108中,運算裝置可基於有限元素法對複合結構模型20執行一拉伸試驗模擬以得到一模擬結果。模擬結果可例如參照圖10,係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之模擬結果的圖表。如圖10的AA點所示,複合結構模型20可承受最大為3.6 牛頓/平方公釐 (N/mm
2)的拉伸應力,並且最大伸長率可為8.4 %。請注意圖10所示的模擬結果可為對同一複合結構模型20進行多次拉伸試驗模擬的平均模擬結果,亦可為單次拉伸試驗模擬的模擬結果,本發明不以此為限。
Since the computing device has divided the initial
接著,運算裝置可透過例如為電腦之螢幕的顯示裝置顯示模擬結果。使用者可透過顯示裝置來觀察模擬結果是否符合所需。若使用者判斷模擬結果不符所需,例如想減緩圖10中的線條斜率,則可透過輸入裝置輸入回應於前述模擬結果的一回饋訊號,並在步驟S201中由運算裝置接收前述回饋訊號。Then, the computing device may display the simulation result through a display device such as a computer screen. The user may observe whether the simulation result meets the requirements through the display device. If the user determines that the simulation result does not meet the requirements, for example, if the user wants to reduce the slope of the line in Figure 10, a feedback signal in response to the above-mentioned simulation result may be input through the input device, and the above-mentioned feedback signal is received by the computing device in step S201.
在步驟S202中,運算裝置可根據前述回饋訊號,來調整實體模型13與表面模型14之間雷射結合的雷射功率以產生一更新複合結構模型22。舉例來說,為了減緩圖10模擬結果的線條斜率,運算裝置可將雷射功率調整為原本的0.9倍,而不改變其他相關於介接節點或介接元素的設定。請注意運算裝置亦可調整雷射功率、介接節點與介接元素當中一或多者的相關設定,本發明不以此為限。In step S202, the computing device may adjust the laser power of the laser combination between the
在步驟S203中,運算裝置對更新複合結構模型22執行拉伸試驗模擬以得到一更新模擬結果。更新模擬結果可例如參照圖11,係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之更新模擬結果的圖表。如圖11的BB點所示,更新複合結構模型22可承受最大為3.75 牛頓/平方公釐 (N/mm
2)的拉伸應力,並且最大伸長率可為9.0 %。請注意圖11所示的更新模擬結果可為對同一更新複合結構模型22進行多次拉伸試驗模擬的平均更新模擬結果,亦可為單次拉伸試驗模擬的更新模擬結果,本發明不以此為限。
In step S203, the computing device performs a tensile test simulation on the updated
類似地,使用者可透過顯示裝置來觀察更新模擬結果是否符合所需,並可再次提供回饋訊號以再次執行步驟S201至步驟S203。請注意判斷模擬結果或更新模擬結果是否符合所需亦可由一判斷裝置進行並據此選擇性地發出回饋訊號,本發明不以此為限。Similarly, the user can observe whether the updated simulation result meets the requirements through the display device, and can provide a feedback signal again to execute steps S201 to S203 again. Please note that the judgment of whether the simulation result or the updated simulation result meets the requirements can also be performed by a judgment device and the feedback signal can be selectively issued accordingly, and the present invention is not limited to this.
請注意上述步驟的順序並非用來限制本發明。在部分實施例中,亦可先執行步驟S105後再執行步驟S104。在其他部分實施例中,亦可先執行步驟S103至步驟S105再執行步驟S101至步驟S102。在其他部分實施例中,亦可同時執行步驟S101至步驟S102與步驟S103至步驟S105。Please note that the order of the above steps is not intended to limit the present invention. In some embodiments, step S105 may be performed first and then step S104. In other embodiments, steps S103 to S105 may be performed first and then steps S101 to S102. In other embodiments, steps S101 to S102 and steps S103 to S105 may be performed simultaneously.
根據上述實施例之複合材料雷射結合的強度預測方法,藉由建立包含初始實體幾何模型與初始表面幾何模型的初始幾何模型,可針對金屬與非金屬雷射結合的複合結構模型進行拉伸試驗模擬。相較於習知,利用本發明的方法可在設計階段便得知金屬與非金屬之複合材料的結合強度,進而有利於製造出適當強度的產品,避免強度設計不足或過度設計。According to the strength prediction method of composite laser bonding of the above embodiment, by establishing an initial geometric model including an initial solid geometric model and an initial surface geometric model, a tensile test simulation can be performed on a composite structure model of metal and non-metal laser bonding. Compared with the prior art, the method of the present invention can be used to know the bonding strength of metal and non-metal composite materials in the design stage, which is conducive to manufacturing products with appropriate strength and avoiding insufficient or excessive strength design.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone skilled in similar techniques may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.
10:初始幾何模型
11:初始實體幾何模型
12:初始表面幾何模型
13:實體模型
14:表面模型
16:層體模型
161、162、163、164:初始層體
161a、162a、163a、164a:纖維
18:介接節點
20:複合結構模型
22:更新複合結構模型
AA、BB:點
S101~S108、S1051~S1053、S1071~S1073、S201~S203:步驟
X、Y、Z:軸
10: Initial geometry model
11: Initial solid geometry model
12: Initial surface geometry model
13: Solid model
14: Surface model
16:
圖1至圖4係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之流程圖。 圖5至圖8係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之示意圖。 圖9係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之堆疊初始層體的示意圖。 圖10係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之模擬結果的圖表。 圖11係根據本發明之一實施例所繪示的複合材料雷射結合的強度預測方法之更新模擬結果的圖表。 Figures 1 to 4 are flow charts of a composite material laser bonding intensity prediction method according to an embodiment of the present invention. Figures 5 to 8 are schematic diagrams of a composite material laser bonding intensity prediction method according to an embodiment of the present invention. Figure 9 is a schematic diagram of stacking initial layers of a composite material laser bonding intensity prediction method according to an embodiment of the present invention. Figure 10 is a graph of simulation results of a composite material laser bonding intensity prediction method according to an embodiment of the present invention. Figure 11 is a graph of updated simulation results of a composite material laser bonding intensity prediction method according to an embodiment of the present invention.
S101~S108:步驟 S101~S108: Steps
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| CN116341351A (en) * | 2021-12-21 | 2023-06-27 | 季华实验室 | Parameter design method, equipment and medium of metal matrix composites based on deep learning |
| CN115655882A (en) * | 2022-10-20 | 2023-01-31 | 辽宁科技大学 | Method for calculating tensile strength of carbon fiber metal laminated plate |
| CN116542064A (en) * | 2023-05-16 | 2023-08-04 | 黄淮学院 | Iso-geometric analysis simulation method for interlayer stress of composite material laminated plate |
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