TWI884610B - Vacuum negative pressure detection device for semiconductor packaging - Google Patents

Abstract

Disclosed is a vacuum negative pressure detection device for semiconductor packaging. A vacuum module, a detection module and a tube are respectively disposed on a body. The body has an inner space, the vacuum module communicates with the inner space, and the tube has two openings in the same axial direction, one of the openings is connected with the body and communicates with the inner space, and the other opening is connected with a packaging. The interior of the tube has a first channel and a second channel, the first channel communicates with the inner space, the second channel is disposed through the body and is connected with the detection module. When the detection device is used in a semiconductor packaging product, the air flow in the semiconductor packaging product directly passes through the second channel to the detection module. Abnormalities are detected by the detection module to avoid blind vacuuming that may cause internal product damage or packaging product rupture.

Description

Vacuum negative pressure detection device for semiconductor packaging

The present invention relates to a vacuum pumping device for semiconductor packaging, and more particularly to a vacuum pumping negative pressure detection device for semiconductor packaging.

Traditional semiconductor packaging technology mainly uses a vacuum pumping device to connect a vacuum generating device and a semiconductor packaging product, and the vacuum generating device vacuumizes the semiconductor packaging product through the vacuum pumping device.

However, the vacuum generating device needs to operate for a fixed time each time it is started, and different semiconductor packaged products have different applicable pressures, which makes it easy for the vacuum generating device to blindly evacuate the product, thereby causing damage to the product inside or rupture of the semiconductor packaged product.

In view of the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a vacuum negative pressure detection device for semiconductor packaging, which improves the structure and technology of the vacuum device for semiconductor packaging to avoid blind vacuuming and causing the semiconductor package product to rupture.

To achieve the above-mentioned purpose, the main technical means adopted by the present invention is to make the vacuum negative pressure detection device of the above-mentioned semiconductor package include: A body, which has an internal space; A vacuum module, which is arranged on the body; A tube, which has a first opening and a second opening in the same axial direction, the first opening is connected to the body, and the interior between the first opening and the second opening of the tube has a first channel and a second channel, the first channel is connected to the internal space of the body, and the second channel penetrates the body; A detection module, which is arranged on the body and connected to the second channel of the tube.

Through the above structure, the present invention is used for semiconductor packaged products. The semiconductor packaged products are evacuated through the first channel of the tube, the internal space of the main body and the vacuum module. The airflow in the semiconductor packaged product directly passes through the second channel to the detection module. The detection module can detect abnormalities, thereby achieving the purpose of avoiding blind vacuuming and causing the semiconductor packaged products to rupture.

In an embodiment of the present invention, a semiconductor package vacuum negative pressure detection device is provided. Please refer to FIG. 1 and FIG. 2 at the same time, which includes a body 10, a vacuum module 20, a tube 30 and a detection module 40. The vacuum module 20, the tube 30 and the detection module 40 are arranged on the body 10; the body 10 has an internal space 11; the tube 30 is formed with a first opening 301 and a second opening at the front and rear opposite ends in the same axial direction. 302, wherein the first opening 301 is connected to the body 10 and communicates with the internal space 11, the interior between the first opening 301 and the second opening 302 of the tube body 30 has a first channel C1 and a second channel C2, the first channel C1 is communicated with the internal space 11; the second channel C2 penetrates the body 10, and the second channel C2 is not connected to the internal space 11; the detection module 40 is connected to the second channel C2 of the tube body 30.

Therefore, the present invention, through the aforementioned structure, when used for semiconductor packaged products, vacuum is performed on the semiconductor packaged product through the first channel C1 of the tube 30, the internal space 11 of the main body 10 and the vacuum module 20, and the airflow in the semiconductor packaged product will directly pass through the second channel C2 to the detection module 40, and the abnormality can be detected by the detection module 40, thereby avoiding blind vacuuming and causing the semiconductor packaged product to rupture.

As shown in FIG. 1 and FIG. 2 , in this embodiment, the main body 10 is rectangular and has a top side 12, a front side 13 and a rear side 14. The vacuum module 20, the tube body 30 and the detection module 40 are respectively disposed on the top side 12, the front side 13 and the rear side 14 of the main body 10. The front side 13 and the rear side 14 form an opening respectively, and the openings are respectively located at the center of the top side 12, the front side 13 and the rear side 14, and the openings are all connected to the internal space 11. The vacuum module 20 is connected to the opening of the top side 12 of the body 10 and is connected to the internal space 11 of the body 10. In this embodiment, the first opening 301 of the tube 30 is connected to the opening of the front side 13 of the body 10, and the second channel C2 of the tube 30 passes through the opening of the front side 13 and the opening of the rear side 14 of the body 10 at the same time to connect with the detection module 40.

Please refer to Figure 2. In this embodiment, the tube body 30 further includes a hollow outer tube 31 and a hollow inner tube 32. The outer tube 31 is arranged on the front side 13 of the main body 10, and the inner tube 32 is inserted into the outer tube 31. In this embodiment, the outer tube 31 and the inner tube 32 can be formed by integral injection molding or by metal injection molding.

In this embodiment, the outer tube 31 has a first section 311 and a second section 312. The first section 311 and the second section 312 have a front end and a rear end opposite to each other. The front end of the first section 311 is connected to the rear end of the second section 312. The rear end of the first section 311 is sleeved with the opening of the front side 13 of the body 10. In this embodiment, the rear end of the first section 311 of the outer tube 31 is formed with an opening, which constitutes the first opening 301 of the tube body 30.

As shown in FIG. 2 and FIG. 3 , in this embodiment, the inner tube 32 also has a front end and a rear end opposite to each other. In this embodiment, the front end of the inner tube 32 can be flush with the front end of the second section 312 of the outer tube 31; but further, in this embodiment, the front end and the rear end of the inner tube 32 can protrude and be exposed outside the outer tube 31, and the rear end of the inner tube 32 passes through the front opening 13 and the rear opening 14 of the body 10. In this embodiment, the front end of the inner tube 32 is formed with another opening, and the opening at the front end of the inner tube 32 and the front end of the second section 312 of the outer tube 31 constitute the second opening 302 of the tube body 30.

In this embodiment, the first channel C1 is formed between the outer tube 31 and the inner tube 32, and the second channel C2 is formed by the inside of the inner tube 32. When the present invention is used, the second section 312 of the outer tube 31 and the front end of the inner tube 32 are placed in the semiconductor packaged product, and vacuum is performed through the first channel C1 between the outer tube 31 and the inner tube 32, the internal space 11 of the main body 10 and the vacuum module 20. At the same time, the airflow in the semiconductor packaged product will directly pass through the second channel C2 in the inner tube 32 to the detection module 40, and the abnormality is detected by the detection module 40, which can be processed in advance to avoid blind vacuuming and causing the semiconductor packaged product to rupture.

As shown in FIG. 2 and FIG. 3 , in the present embodiment, a front protection unit 50 is further provided. The front protection unit 50 is disposed on the front side 13 of the main body 10, and a through hole is formed in the front protection unit 50. The front protection unit 50 is sleeved on the outer tube 31 through the through hole. The front protection unit 50 is used to protect the outer tube 31 to prevent the outer tube 31 from being broken by external force.

As shown in FIG. 2 and FIG. 3, in this embodiment, the detection module 40 includes a rear protection unit 41 and a connection terminal 42. The rear protection unit 41 is disposed on the rear side 14 of the body 10, and the connection terminal 42 is disposed on the rear protection unit 41. The rear protection unit 41 has a front side and a rear side opposite to each other. The front side of the rear protection unit 41 is adjacent to the rear side 14 of the body 10. The front side of the rear protection unit 41 is formed with a connection hole, and the rear side of the rear protection unit 41 is formed with a connection port, the connection hole is connected with the connection port, the rear protection unit 41 is sleeved on the rear end of the inner tube 32 through the connection hole on the front side, and the connection terminal 42 is sleeved with the connection port to make the second channel C2 in the inner tube 32 connected with the connection terminal 42. In this embodiment, the rear protection unit 41 is used to protect the inner tube 32 to prevent the inner tube 32 from being broken by external impact.

As shown in FIG. 3 , in the present embodiment, a front sealing ring 60 and a rear sealing ring 61 are further provided. The front sealing ring 60 is sleeved on the outer tube 31 and is located between the front protection unit 50 and the main body 10. The rear sealing ring 61 is sleeved on the inner tube 32 and is located between the rear protection unit 41 and the main body 10. The front sealing ring 60 and the rear sealing ring 61 are used to prevent external air from entering the internal space 11 of the main body 10, thereby enhancing the vacuuming effect of the present invention.

Please refer to FIG. 2 and FIG. 5 at the same time. Further, in this embodiment, the specific shape of the first section 311 of the outer tube 31 is cylindrical, and the specific shape of the second section 312 of the outer tube 31 is duck-billed. Such a structural design can increase the pressure resistance of the outer tube 31 and also make the outer tube 31 have a good vacuum effect. As shown in FIG. 4 and FIG. 5, in this embodiment, the first channel C1 is formed by a first distance and a second distance formed between the inner wall surface of the outer tube 31 and the outer wall surface of the inner tube 32. The first distance is the distance in the vertical direction, and the second distance is the distance in the horizontal direction. When the outer tube 31 is duck-billed, the distance of the second distance is greater than the distance of the first distance; the second channel C2 is formed by the inner diameter of the inner tube 32.

As shown in FIG. 5 , in this embodiment, a first connection portion 70 and a second connection portion 71 are further provided. The body 10 further has a right side 15 and a left side 16. The first connection portion 70 and the second connection portion 71 are respectively disposed on the right side 15 and the left side 16 of the body 10. The first connection portion 70 and the second connection portion 71 are used to connect to a machine so that the present invention is disposed on the machine. In this embodiment, the first connection portion 70 and the second connection portion 71 can be locked with the machine through a plurality of screws.

To illustrate the specific application of the embodiment of the present invention, please refer to FIG. 6 , further providing a control module 80 and a vacuum generator 90, the control module 80 is connected to the connection terminal 42 of the detection module 40 and the vacuum generator 90, the vacuum generator 90 is connected to the vacuum pumping module 20, in this embodiment, the vacuum pumping module 20 is a gas valve, the vacuum generator 90 extracts the air in the semiconductor packaged product through the first channel C1, the internal space 11 and the gas valve. In this embodiment, the control module 80 includes a detector 81 and an electric control proportional valve 82, the detector 81 is connected to the connection terminal 42 of the detection module 40 and the electric control proportional valve 82, the electric control proportional valve 82 is connected to the vacuum generator 90.

The detector 81 generates a detection signal according to the airflow from the semiconductor packaged product, and when the detector 81 determines that the detection signal exceeds a preset threshold, the detector 81 transmits a control signal to the electronic proportional valve 82, and the electronic proportional valve 82 adjusts the vacuum generator 90 according to the control signal to achieve a pressure value of the optimal vacuum state. The control module 80 and the vacuum generator 90 can adapt to the pressure applicable to different semiconductor packaged products, so as to greatly reduce the chance of semiconductor packaged products breaking when using the present invention.

10: Main body 11: Internal space 12: Top side 13: Front side 14: Back side 15: Right side 16: Left side 20: Vacuum module 30: Tube body 301: First opening 302: Second opening 31: Outer tube 311: First section 312: Second section 32: Inner tube 40: Detection module 41: Rear protection unit 42: Connection terminal 50: Front protection unit 60: Front sealing ring 61: Rear sealing ring 70: First connection part 71: Second connection part 80: Control module 81: Detector 82: Electronic proportional valve 90: Vacuum generator C1: First channel C2: Second channel

Figure 1 is a three-dimensional diagram of an embodiment of the vacuum negative pressure detection device of the present invention. Figure 2 is a schematic diagram of the A-A’ side section of the embodiment of Figure 1 of the present invention. Figure 3 is a partial enlarged view of the C part in the embodiment of Figure 2 of the present invention. Figure 4 is a partial enlarged view of the D part in the embodiment of Figure 2 of the present invention. Figure 5 is a schematic diagram of the B-B’ front section of the embodiment of Figure 1 of the present invention. Figure 6 is a block diagram of the application state of the embodiment of the present invention.

10: Body

12: Top side

13:Front side

14: Back side

20: Vacuum module

30: Tube body

302: Second opening

40: Detection module

Claims (10)

A semiconductor package vacuum negative pressure detection device, comprising: a body having an internal space; a vacuum module disposed on the body; a tube having a first opening and a second opening in the same axial direction, the first opening being connected to the body, the interior of the tube having a first channel and a second channel between the first opening and the second opening, the first channel being connected to the internal space of the body, and the second channel penetrating the body; a detection module disposed on the body and connected to the second channel of the tube. The vacuum negative pressure detection device for semiconductor packaging as described in claim 1, wherein the main body has a top side, a front side and a rear side, and the vacuum module, the tube body and the detection module are respectively arranged on the top side, the front side and the rear side of the main body. The vacuum negative pressure detection device for semiconductor packaging as described in claim 1, wherein the tube body includes an outer tube and an inner tube, and the inner tube is arranged inside the outer tube. The vacuum negative pressure detection device for semiconductor packaging as described in claim 3, wherein the outer tube and the inner tube of the tube body are formed by one-piece injection molding or by metal injection molding. A vacuum negative pressure detection device for semiconductor packaging as described in claim 3 or 4, wherein the front end of the inner tube is flush with the front end of the outer tube. A vacuum negative pressure detection device for semiconductor packaging as described in claim 3 or 4, wherein, further, the front end of the inner tube protrudes and is exposed outside the outer tube. The vacuum negative pressure detection device for semiconductor packaging as described in claim 6, wherein the first channel is formed from the outer tube to the inner tube, and the second channel is formed from the inside of the inner tube. The semiconductor package vacuum negative pressure detection device as described in claim 1, wherein a control module and a vacuum generator are further provided, the control module is connected to the detection module and the vacuum generator, and the vacuum generator is connected to the vacuum module. The semiconductor package vacuum negative pressure detection device as described in claim 8, wherein the control module includes a detector and an electric proportional valve, the detector is connected to the detection module and the electric proportional valve, and the electric proportional valve is connected to the vacuum generator. The vacuum negative pressure detection device for semiconductor packaging as described in claim 3, wherein the outer tube has a first section and a second section, the first section and the second section respectively have a front end and a rear end opposite to each other, the front end of the first section is connected to the rear end of the second section, and the rear end of the first section is sleeved with the body; wherein the second section of the outer tube is in a duck-billed shape.