TWI883704B - A precision electroplating equipment - Google Patents

Abstract

The invention discloses a precision electroplating equipment, which includes a fixed anode plating module, a movable anode plating module and an actuator arranged in an electroplating tank. The actuator can drive the movable anode plating module away from the fixed anode. The electroplating modules open the longitudinal space between each other, so that the cathode plate (substrate) of the cathode rack can be placed into the electroplating tank; then the actuator drives the movable anode electroplating module to move back to its original position. Even if the vertical space between the fixed anode plating module and the movable anode plating module is reduced, the cathode plate can be placed in a small space, thereby achieving more precise, uniform and efficient coverage of cations. The surface of the cathode plate has high current efficiency, improves the speed of reactive plating, and reduces power consumption and plating costs.

Description

Precision plating equipment

The present invention relates to the technical field of electroplating equipment, and in particular to a precision electroplating equipment composed of a fixed anodic electroplating module, a movable anodic electroplating module, and a driving device for moving the movable anodic electroplating module.

The structure of a current electroplating device, such as the electroplating device shown in the patent announcement No. I575117 of our country, is provided with two anode plates (electroplating materials) in an electroplating tank, and a cathode plate (electroplated object) is placed between the two anode plates. Then, by controlling the current output state of the power supply, the metal ions of the electroplating material from the anode plate can be deposited on the surface of the cathode plate (electroplated object). Since the electroplating device must allow the cathode plate to be placed between the two anode plates, and based on safety considerations, the distance between the two anode plates is usually set to 200~400mm.

However, the distance between the two anode plates of the above-mentioned conventional electroplating equipment is too large, resulting in excessive radiation diffusion of cations and failure to effectively cover the surface of the cathode plate, resulting in uneven thickness and poor quality of the coating on the surface of the cathode plate; and the longer distance between the anode plate and the cathode plate will reduce the current efficiency and slow down the electroplating rate, so more electricity is required to complete the electroplating, which increases the electroplating cost; and if the distance between the two anode plates is reduced, it will interfere with the path of the cathode plate between the two anode plates, which may cause safety problems in operation.

Therefore, how to solve the problem of the distance between the two anode plates of the conventional electroplating equipment being too large, so that the distance between the two anode plates can be reduced as much as possible, and the cathode plate can still be safely placed in the smaller space, is the problem that the present invention is actively trying to overcome.

In view of the shortcomings of the above-mentioned known technology, the inventor felt that it was not perfect, so he devoted all his energy to research and overcome it. Based on his many years of experience in the industry, he further developed a precision electroplating equipment in order to improve the shortcomings of the above-mentioned known electroplating equipment.

The main purpose of the present invention is to provide a precision electroplating equipment. Through the fixed anode electroplating module, movable anode electroplating module and driving device mechanism design set in the electroplating tank, the cathode plate can be placed in the narrow space between the two anode plates. During the electroplating process, the cations are more precisely, evenly and efficiently covered on the surface of the cathode plate. It has higher current efficiency, improves the reaction electroplating rate, reduces power consumption and reduces electroplating costs.

In order to achieve the above-mentioned purpose, the present invention provides a precision electroplating device, and its preferred technical solution includes: a fixed anode electroplating module and a movable anode electroplating module are vertically arranged in an electroplating tank, and an anode plate is provided in each of the fixed anode electroplating module and the movable anode electroplating module. The anode plating module and the movable anode plating module extend in parallel with each other in the length direction of the plating tank; the anode plates of the fixed anode plating module and the movable anode plating module are separated from each other to form a longitudinal space, and the longitudinal space provides a cathode plate of a cathode rack to be placed from above the longitudinal space. The fixed anode plating module is arranged under an immovable fixed suspension frame and is fixedly arranged on the first side of the cathode plate; the movable anode plating module is arranged under a movable movable suspension frame and can be movably arranged on the second side of the cathode plate by the movable suspension frame; the fixed suspension frame and the movable suspension frame are arranged on the plating tank in parallel with the length direction of the plating tank. The cathode hanger is placed between the fixed suspension and the movable suspension by a transport mechanism, and extends parallel to the fixed suspension and the movable suspension, so that the cathode plate is placed in the longitudinal space; conversely, the cathode hanger is removed by the transport mechanism, so that the cathode plate is separated from the longitudinal space. and a set of driving devices, which are pneumatic or electric devices, driving the movable suspension frame and the movable anode electroplating module to move to an open position away from the fixed anode electroplating module, so that the lateral spacing of the longitudinal space is expanded, allowing the cathode plate of the cathode hanger to be placed in the longitudinal space. The driving device can also reversely drive the movable suspension frame and the movable anode electroplating module to move to a closed position close to the fixed anode electroplating module, so that the lateral spacing of the longitudinal space is reduced, and the anode plate of the movable anode electroplating module is close to the side of the cathode plate.

The present invention uses a fixed anode plating module, a movable anode plating module and a driving device mechanism arranged in the plating tank. Before the cathode rack is about to place the cathode plate (substrate) into the plating tank, the driving device first drives the movable anode plating module away from the fixed anode plating module to reach an open position, so that the longitudinal space between the two is widened. Then, the cathode rack is placed on the plating tank through a transport mechanism, so that the cathode plate (substrate) is placed into the plating tank and then moves toward the fixed anode plating module. Afterwards, the driving device is used to drive the movable anodic plating module close to the fixed anodic plating module to reach the closed position, so that the longitudinal distance between the fixed anodic plating module and the movable anodic plating module can be reduced to 80 mm, thereby allowing the cathode plate (substrate) to be safely and undisturbedly placed in such a small space.

Since the present invention can reduce the longitudinal space between the fixed anodic plating module and the movable anodic plating module, it can avoid the problem that the cation radiation diffusion cannot effectively cover the surface of the cathode plate due to the excessive distance between the anode plate and the cathode plate. Therefore, during the plating process, the cations can be more precisely, uniformly and efficiently covered on the surface of the cathode plate, so that the plating layer on the surface of the cathode plate (substrate) is more uniform, the plating layer quality and the plating efficiency are improved. And because the spacing is smaller, the resistance between them is smaller, the available current density is increased, and the higher current efficiency can increase the reaction plating rate, reduce power consumption and reduce plating costs.

One of the better technical solutions, in the above-mentioned precision electroplating equipment, the fixed anode electroplating module and the movable anode electroplating module are respectively provided with an anode box, an anode plate, an anode film and a shielding plate; the anode box is a non-metallic box body with three closed sides and an opening facing the cathode plate, the anode plate is vertically arranged in the anode box, the anode film is vertically shielded on the side of the anode plate facing the opening, and the shielding plate is vertically shielded on the opening surface of the anode box.

One of the better technical solutions is that in the above-mentioned precision electroplating equipment, the anode plate includes one or more regions in the same longitudinal plane, and one or more power supplies, and the power supplies are respectively connected to the regions to supply power.

One of the better technical solutions is that in the above-mentioned precision electroplating equipment, the movable suspension has a curved track, and the driving device is a pneumatic cylinder or an electric cylinder, and the pneumatic cylinder or the electric cylinder drives the movable suspension and the movable anode electroplating module to move along the curved track to the open position and the closed position.

One of the better technical solutions, in the above-mentioned precision electroplating equipment, the cathode hanger has a hanger and a frame composed of a plurality of conductive components, and cathode conductive elements are provided on both sides of the hanger; the frame is provided with an upper fixture for clamping the upper end of the cathode plate, and a lower fixture for clamping the lower end of the cathode plate.

One of the better technical solutions is that in the above-mentioned precision electroplating equipment, a saddle is provided on the electroplating tank, and the cathode conductive element can be detachably arranged on the saddle.

One of the better technical solutions is that the above-mentioned precision electroplating equipment further includes two sets of electroplating solution and ion exchange device, each of which has a driving motor and an ion exchange plate. The two sets of electroplating solution and ion exchange device are respectively arranged between the fixed anode electroplating module, the movable anode electroplating module and the cathode rack, so that the ion exchange plate is immersed in the electroplating tank, and the driving motor drives the ion exchange plate to move back and forth in a direction parallel to the cathode plate.

One of the better technical solutions is that in the above-mentioned precision electroplating equipment, the transport mechanism is used to place the cathode rack on the electroplating tank, so that the cathode plate (substrate) is placed in the electroplating tank and then close to the fixed anode electroplating module.

10: Electroplating tank

11: Saddle

20A: Fixed anode plating module

20B: Active anodic plating module

21B: Movable hanging bracket

22: Anode plate

221: Area

23: Anode box

231:Open face

24: Anode film

25: Shielding plate

26: Curved track

30:Cathode rack

31: Hanging rack

32:Framework

33: Cathode conductive element

34: Upper fixator

35: Lower retainer

40:Cathode plate

50: Driving device

60: Power supply

70: Plating solution and ion exchange device

71: Driving motor

72: Ion exchange plate

80:Transportation agency

L1: Open position

L2: Closed position

W1: Longitudinal space

Figure 1 is a top view of the structure of the precision electroplating equipment of the present invention.

Figure 2 is a schematic diagram of the electroplating tank, movable anode electroplating module and driving device of the present invention.

Figure 3 is a schematic diagram of the anode plate and power supply of the present invention.

Figure 4 is a schematic diagram of the cathode rack and cathode plate of the present invention.

Figure 5 is a schematic diagram of the plating solution, ion exchange device and ion exchange plate of the present invention.

Figure 6 is a schematic diagram of the transport mechanism of the cathode rack of the present invention.

Figure 7 is a schematic diagram of the closed position and open position of the movable anode electroplating module of the present invention.

Figure 8 is a schematic diagram of the continuous operation of the movable anode electroplating module and cathode rack of the present invention.

Referring to FIG. 1 and FIG. 2 , the present invention is a precision electroplating device, and a preferred specific embodiment thereof includes: an electroplating tank 10, which is a rectangular electroplating tank surrounded by two long side walls, two short side walls and a bottom wall, and an opening is formed at the upper end of the electroplating tank 10. A fixed anode electroplating module 20A and a movable anode electroplating module 20B are vertically arranged in the electroplating tank 10, and the fixed anode electroplating module 20A and the movable anode electroplating module 20B are respectively provided with an anode plate 22. The fixed anode plating module 20A and the movable anode plating module 20B are arranged in parallel with the longitudinal direction of the plating tank 10, and the two anode plates 22 are also arranged in parallel in the plating tank 10. The anode plates 22 of the fixed anode plating module 20A and the anode plates 22 of the movable anode plating module 20B are separated from each other by a longitudinal space W1 in the plating tank 10. The electroplating tank 10 is provided with a cathode rack 30 (as shown in FIG. 4 ), and the cathode rack 30 is transported by a transport mechanism 80 so that a cathode plate 40 fixed thereunder is placed in the longitudinal space W1, so that the cathode plate 40 is located between the two anode plates 22 and extends parallel to the two anode plates 22. Specifically, the fixed anode electroplating module 20A is disposed under an immovable fixed suspension (refer to FIG. 2 , the fixed suspension structure is the same as the movable suspension 21B structure), and is fixedly disposed on a first side of the cathode plate 40. The movable anode electroplating module 20B is disposed under a movable movable suspension 21B (as shown in FIG. 2 ), and can therefore be movably disposed on the second side of the cathode plate 40 by the movable suspension 21B. The fixed suspension and the movable suspension 21B are disposed above the electroplating tank 10 in parallel with the longitudinal direction of the electroplating tank 10, and the cathode hanger 30 is disposed in parallel between the fixed suspension (not shown) and the movable suspension 21B, and the cathode hanger 30 can be lifted and lowered by the transport mechanism 80, so that the cathode plate 40 below it is placed in the longitudinal space W1, and vice versa, it can be vertically lifted and taken out from the longitudinal space W1.

Referring to FIG. 2 , the movable anodic plating module 20B is provided with a driving device 50, which may be a pneumatic cylinder or an electric cylinder, etc. The driving device 50 is used to drive the movable suspension frame 21B and the movable anodic plating module 20B to move away from the fixed anodic plating module. 7 and 8 ), the lateral spacing of the longitudinal space W1 between the anode plates 22 of the fixed anode plating module 20A and the movable anode plating module 20B is expanded, allowing the cathode plate 40 of the cathode rack 30 to be safely placed vertically in the longitudinal space W1. The driving device 50 can also reversely drive the movable suspension frame 21B and the movable anode plating module 20B to move to a closed position L2 close to the fixed anode plating module 20A, so that the lateral spacing of the longitudinal space W1 between the anode plates 22 of the fixed anode plating module 20A and the movable anode plating module 20B is further reduced, thereby making the anode plates 22 of the fixed anode plating module 20A and the movable anode plating module 20B approximately 80 mm apart, and thus very close to the two sides of the cathode plate 40.

Referring to FIG. 1 and FIG. 2 , the preferred embodiments of the fixed anode plating module 20A and the movable anode plating module 20B are respectively provided with an anode box 23, which is a non-metal box body with three closed sides and an opening 231 facing the cathode plate 40. The anode plate 22 is arranged in each anode box 23, so that the anode plate 22 is vertically arranged in the anode box 23. Each anode box 23 is also provided with an anode film 24 and a shielding plate 25, wherein the anode film 24 serves as a filter material to isolate from the plating solution, vertically shielding the side of the anode plate 22 facing the opening surface 231, allowing only ions and metal ions to pass through the anode film 24, thereby preventing other substances or bubbles that may be generated during the reaction process from moving to the cathode plate 40 (substrate), thereby ensuring the stability and quality of the plating process. The shielding plate 25 vertically shields the opening surface 231 of the anode box 23 to prevent unnecessary electroplating parts from being formed on the surface of the cathode plate 40 (substrate), ensuring that only specific areas of the cathode plate 40 are exposed to cations (metal ions), which helps to precisely control the position and thickness of the plating layer, reduce unnecessary plating material usage and reduce costs. More specifically, the shielding plate 25 can be shielded at a position corresponding to the periphery of the cathode plate 40, and the shielding plate 25 can also be provided with a hollow pattern to only generate electroplating patterns on the surface of the cathode plate 40, which is particularly suitable for electroplating of circuit boards.

Referring to FIG. 3 again, one of the preferred embodiments of the anode plate 22 includes a plurality of regions 221 in the same longitudinal plane. The regions 221 can be connected to the cathode plates 40 (substrates) of different patterns, high and low current regions, or sparse and dense hole regions through a plurality of power supplies 60 to supply power to the regions 221 respectively, so as to achieve different current density control through the respective power supplies, thereby achieving the effect of precision electroplating of the cathode plate 40 (substrate).

As shown in FIG8 , the movable suspension bracket 20B may be implemented with a curved track 26, and the pneumatic cylinder or electric cylinder as the driving device 50 drives the movable suspension bracket 21B and the movable anodic electroplating module 20B to move along the curved track 26 to the open position L1 and the closed position L2, ensuring that the movable anodic electroplating module 20B can move precisely.

Referring to FIG. 4 , a preferred embodiment of the cathode bracket 30 comprises a suspension bracket 31 and a frame 32 composed of a plurality of conductive components (metal rods, etc.), wherein a cathode conductive element 33 is provided on both sides of the suspension bracket 31, and the cathode conductive element 33 is used to be connected to the negative pole of the power circuit. For example, as shown in FIG. 1 , a saddle 11 is provided on the electroplating tank 10, so that the cathode conductive element 33 can be detachably arranged on the saddle 11. The frame 32 is a conductive rectangular frame, and is provided with an upper fixture 34 for clamping the upper end of the cathode plate 40 and being conductive, and a lower fixture 35 for clamping the lower end of the cathode plate 40 and being conductive, thereby vertically fixing the cathode plate 40 in the frame 32.

1 and 5 , a preferred embodiment of the present invention further comprises two sets of plating solution and ion exchange device 70, each of the plating solution and ion exchange device 70 comprises a driving motor 71 and an ion exchange plate 72, the driving motor 71 is used to drive the ion exchange plate 72 to move back and forth in a direction parallel to the cathode plate 40. The two sets of plating solution and ion exchange device 70 are respectively arranged between the fixed anodic plating module 20A, the movable anodic plating module 20B and the cathode rack 30, and the ion exchange plate 72 is immersed in the plating tank 10 so that the ion exchange plate 72 is blocked between the cathode plate 40 and the shielding plate 25; and one set of plating solution and ion exchange device 70 is linked with the movable anodic plating module 20B so that the ion exchange plate 72 can be moved to an open position L1 and a closed position L2 (as shown in FIG. 7 ). Thus, the present invention uses the reciprocating movement of the ion exchange plate 72 on both sides of the cathode plate 40 to fully and evenly exchange the ion-carrying liquid on the surface of the cathode plate 40 through the ion exchange plate 72, thereby achieving the effect of improving the uniformity of the coating. More specifically, the ion exchange plate 72 can be a grid plate body, and can also be implemented as a customized exchange plate in response to different customer needs.

The present invention is designed through the mechanism of the fixed anode plating module 20A, the movable anode plating module 20B and the driving device 50 disposed in the plating tank 10. When in use, refer to FIG8 . Before the cathode plate 40 (substrate) is placed in the plating tank 10 by the cathode rack 30, the driving device 50 first drives the movable anode plating module 20B away from the fixed anode plating module 20A to the open position L1, so that the longitudinal space W1 between the two is widened (as shown in FIG7 ). Then, the cathode rack 30 is placed on the electroplating tank 10 by a conveying mechanism 80 (as shown in FIG. 6 , the conveying mechanism 80 is a known mechanism, usually an electric linear lead screw set or an oil/pneumatic cylinder, etc.), so that the cathode plate 40 is placed in the electroplating tank 10 and then moved toward the fixed anode electroplating module 20A. Then, as shown in FIG8 , the driving device 50 is used to drive the movable anode plating module 20B to approach the fixed anode plating module 20A to reach the closed position L2, so that the longitudinal space W1 between the fixed anode plating module 20A and the movable anode plating module 20B can be reduced to 80 mm, thereby allowing the cathode plate 40 to be safely placed in a narrow space.

The present invention has been disclosed in the above text with a preferred embodiment, but those familiar with the present technology should understand that the embodiment is only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to the embodiment should be included in the scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined by the patent application.

10: Electroplating tank

11: Saddle

20A: Fixed anode plating module

20B: Active anodic plating module

22: Anode plate

23: Anode box

231:Open face

24: Anode film

25: Shielding plate

40:Cathode plate

70: Plating solution and ion exchange device

71: Driving motor

72: Ion exchange plate

Claims (9)

A precision electroplating device comprises: a fixed anode electroplating module and a movable anode electroplating module are vertically arranged in an electroplating tank, the fixed anode electroplating module and the movable anode electroplating module are respectively provided with an anode plate, the anode plate of the fixed anode electroplating module and the movable anode electroplating module are connected to each other. The anode plates of the fixed anode plating module extend parallel to each other in the length direction of the plating tank; the anode plates of the fixed anode plating module and the movable anode plating module are separated from each other to form a longitudinal space, and the longitudinal space provides a cathode plate of a cathode rack to be placed from above the longitudinal space; The fixed anode plating module is arranged under an immovable fixed suspension bracket and fixedly arranged on the first side of the cathode plate; the movable anode plating module is arranged under a movable suspension bracket and can be movably arranged on the second side of the cathode plate by the movable suspension bracket; the fixed suspension bracket and the movable suspension bracket are arranged on the plating tank in parallel with the length direction of the plating tank; The cathode rack is placed between the fixed suspension rack and the movable suspension rack by a transport mechanism, and the cathode rack extends parallel to the fixed suspension rack and the movable suspension rack, placing the cathode plate in the longitudinal space; conversely, the cathode rack is removed by the transport mechanism, so that the cathode plate is separated from the longitudinal space; and A set of driving devices, which are pneumatic or electric devices, drive the movable suspension frame and the movable anode electroplating module to move to an open position away from the fixed anode electroplating module, so that the lateral spacing of the longitudinal space is expanded, allowing the cathode plate of the cathode hanger to be placed in the longitudinal space. The driving device can also reversely drive the movable suspension frame and the movable anode electroplating module to move to a closed position close to the fixed anode electroplating module, so that the lateral spacing of the longitudinal space is reduced, and the anode plate of the movable anode electroplating module is close to the side of the cathode plate. The precision electroplating equipment as described in claim 1, wherein the fixed anode electroplating module and the movable anode electroplating module are respectively provided with an anode box, an anode plate, an anode film and a shielding plate; the anode box is a non-metallic box body with three sides closed and an opening facing the cathode plate, the anode plate is vertically arranged in the anode box, the anode film is vertically shielded on the side of the anode plate facing the opening, and the shielding plate is vertically shielded on the opening surface of the anode box. A precision electroplating device as described in claim 2, wherein the anode plate includes one or more regions in the same longitudinal plane, and one or more power supplies, wherein the power supplies are respectively connected to the regions to supply power respectively. The precision electroplating equipment as described in claim 1 or 2, wherein the movable suspension bracket has a curved track, and the driving device is a pneumatic cylinder or an electric cylinder, and the pneumatic cylinder or the electric cylinder drives the movable suspension bracket and the movable anode electroplating module to move along the curved track to the open position and the closed position. The precision electroplating equipment as described in claim 1, wherein the cathode hanger comprises a suspension rack and a frame composed of a plurality of conductive components, cathode conductive elements are arranged on both sides of the suspension rack; the frame is provided with an upper fixture for clamping the upper end of the cathode plate, and a lower fixture for clamping the lower end of the cathode plate. A precision electroplating device as described in claim 5, wherein a saddle is provided on the electroplating tank, and the cathode conductive element can be detachably arranged on the saddle. The precision electroplating equipment as described in claim 1 further includes two sets of plating solution and ion exchange devices, each of which has a driving motor and an ion exchange plate. The two sets of plating solution and ion exchange devices are respectively arranged between the fixed anode plating module, the movable anode plating module and the cathode rack, so that the ion exchange plate is immersed in the plating tank, and the driving motor drives the ion exchange plate to move back and forth in a direction parallel to the cathode plate. A precision electroplating apparatus as described in claim 7, wherein the ion exchange plate is a grid plate body. The precision electroplating equipment as described in claim 1 or 5, wherein the transport mechanism is used to place the cathode rack on the electroplating tank, so that the cathode plate is placed in the longitudinal space in the electroplating tank and then leans against one side of the fixed anode electroplating module.

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