[go: up one dir, main page]

TWI882826B - Bluetooth communication system, bluetooth communication device, bluetooth communication chip, bluetooth communication method, and bluetooth signal tranmission method - Google Patents

Bluetooth communication system, bluetooth communication device, bluetooth communication chip, bluetooth communication method, and bluetooth signal tranmission method Download PDF

Info

Publication number
TWI882826B
TWI882826B TW113120707A TW113120707A TWI882826B TW I882826 B TWI882826 B TW I882826B TW 113120707 A TW113120707 A TW 113120707A TW 113120707 A TW113120707 A TW 113120707A TW I882826 B TWI882826 B TW I882826B
Authority
TW
Taiwan
Prior art keywords
bluetooth communication
bluetooth
module
wireless signal
chip
Prior art date
Application number
TW113120707A
Other languages
Chinese (zh)
Other versions
TW202549376A (en
Inventor
林京元
Original Assignee
象量科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 象量科技股份有限公司 filed Critical 象量科技股份有限公司
Priority to TW113120707A priority Critical patent/TWI882826B/en
Application granted granted Critical
Publication of TWI882826B publication Critical patent/TWI882826B/en
Priority to CN202510696840.4A priority patent/CN121078407A/en
Publication of TW202549376A publication Critical patent/TW202549376A/en

Links

Images

Landscapes

  • Mobile Radio Communication Systems (AREA)

Abstract

A Bluetooth communication system, a Bluetooth communication device, a Bluetooth communication chip, a Bluetooth communication method, and a Bluetooth signal transmission method are provided. The Bluetooth communication system includes a plurality of Bluetooth communication devices, and each of the plurality of Bluetooth communication devices is coupled to at least one of the others of the plurality of Bluetooth communication devices. Each of the plurality of Bluetooth communication devices includes the Bluetooth communication chip and a processing chip, and the Bluetooth communication chip includes a plurality of Bluetooth communication modules and an antenna module. Each of the plurality of Bluetooth communication modules is coupled to at least one of the others of the plurality of Bluetooth communication modules, and the antenna module is coupled to the plurality of Bluetooth communication modules. Each of the plurality of Bluetooth communication modules operates in a master mode or a slave mode.

Description

藍牙通訊系統、藍牙通訊裝置、藍牙通訊晶片、藍牙通訊方法及無線訊號傳輸方法Bluetooth communication system, Bluetooth communication device, Bluetooth communication chip, Bluetooth communication method and wireless signal transmission method

本案係有關於藍牙(Bluetooth)通訊技術,特別是有關於一種藍牙通訊系統、藍牙通訊裝置、藍牙通訊晶片、藍牙通訊方法及無線訊號傳輸方法。This case relates to Bluetooth communication technology, and in particular to a Bluetooth communication system, a Bluetooth communication device, a Bluetooth communication chip, a Bluetooth communication method, and a wireless signal transmission method.

隨著科技的發展,藍牙通訊技術已逐漸成熟且趨於穩定,使得目前市面上的電子產品係採用藍牙通訊技術作為其通訊方式之一,例如藍牙耳機、穿戴式手環、穿戴式手錶、車用安卓機(Android)、智慧型手機、平板電腦、筆記型電腦及智慧型家電。With the development of technology, Bluetooth communication technology has gradually matured and stabilized, so that electronic products on the market currently use Bluetooth communication technology as one of their communication methods, such as Bluetooth headsets, wearable bracelets, wearable watches, car Android phones, smartphones, tablets, laptops and smart home appliances.

然而,現有的藍牙通訊技術仍有一些問題需要解決。首先,現有的藍牙通訊技術具有最大通訊距離的限制。因此,如果二個電子裝置之間的距離超過藍牙通訊技術所能支援之最大通訊距離,此二個電子裝置之間需要設置有至少一通訊節點(例如,至少一個電子裝置),此二個電子裝置方能通訊。However, existing Bluetooth communication technology still has some problems to be solved. First, existing Bluetooth communication technology has a maximum communication distance limitation. Therefore, if the distance between two electronic devices exceeds the maximum communication distance supported by Bluetooth communication technology, at least one communication node (for example, at least one electronic device) needs to be set between the two electronic devices so that the two electronic devices can communicate.

此外,現有的電子裝置係無法同時與複數個另一電子裝置建立複數個藍牙通道。因此,相距超過藍牙通訊技術之最大通訊距離的二個電子裝置需要透過位於二者間的一或多個藍牙通訊節點作為中繼站方能建立一藍牙通訊路線。由於每個中繼的藍牙通訊節點同時間只能建立一個藍牙通道,因此當資料在此藍牙通訊路線傳遞時,中繼的藍牙通訊節點必須先和上游節點建立藍牙通道以自上游節點接收資料。完成資料接收後,前述中繼的藍牙通訊節點會中斷其與上游節點之間的藍牙通道,轉而跟下游節點建立藍牙通道,並將所接收到的資料傳送至下游節點。換言之,資料在此種架構下的藍牙通訊路線傳遞時的速率會有很大的延遲,而此延遲主要來自於中繼的藍牙通訊節點必須反覆進行「建立—中斷」藍牙通道的程序,此二個電子裝置方能通訊。再者,由於此二個電子裝置之間並無其他的通訊路線,若此藍牙通訊路線中有任何一個藍牙通訊節點損壞,此二個電子裝置即無法通訊。In addition, existing electronic devices cannot establish multiple Bluetooth channels with multiple other electronic devices at the same time. Therefore, two electronic devices that are farther apart than the maximum communication distance of Bluetooth communication technology need to use one or more Bluetooth communication nodes between them as relay stations to establish a Bluetooth communication route. Since each relay's Bluetooth communication node can only establish one Bluetooth channel at the same time, when data is transmitted along this Bluetooth communication route, the relay's Bluetooth communication node must first establish a Bluetooth channel with the upstream node to receive data from the upstream node. After completing the data reception, the aforementioned relay Bluetooth communication node will interrupt the Bluetooth channel between it and the upstream node, and instead establish a Bluetooth channel with the downstream node, and transmit the received data to the downstream node. In other words, the data transmission rate of the Bluetooth communication line under this architecture will be greatly delayed, and this delay mainly comes from the fact that the relay Bluetooth communication node must repeatedly perform the "establishment-disconnection" process of the Bluetooth channel before the two electronic devices can communicate. Furthermore, since there is no other communication line between the two electronic devices, if any Bluetooth communication node in the Bluetooth communication line is damaged, the two electronic devices will not be able to communicate.

有鑑於此,發明人提出一種藍牙通訊系統、藍牙通訊裝置、藍牙通訊晶片、藍牙通訊方法及無線訊號傳輸方法。在一些實施例中,藍牙通訊系統包含複數藍牙通訊裝置,並且各藍牙通訊裝置包含一藍牙通訊晶片以及一處理晶片。藍牙通訊晶片包含複數藍牙通訊模組以及一天線模組。各藍牙通訊模組耦接於其餘複數藍牙通訊模組中的至少一者,並且各藍牙通訊模組操作於一主機(Master)模式或一從機(Slave)模式。天線模組耦接於複數藍牙通訊模組。處理晶片耦接於藍牙通訊晶片。各藍牙通訊裝置耦接於其餘複數藍牙通訊裝置中的至少一者。In view of this, the inventor proposes a Bluetooth communication system, a Bluetooth communication device, a Bluetooth communication chip, a Bluetooth communication method and a wireless signal transmission method. In some embodiments, the Bluetooth communication system includes a plurality of Bluetooth communication devices, and each Bluetooth communication device includes a Bluetooth communication chip and a processing chip. The Bluetooth communication chip includes a plurality of Bluetooth communication modules and an antenna module. Each Bluetooth communication module is coupled to at least one of the other plurality of Bluetooth communication modules, and each Bluetooth communication module operates in a master mode or a slave mode. The antenna module is coupled to the plurality of Bluetooth communication modules. The processing chip is coupled to the Bluetooth communication chip. Each Bluetooth communication device is coupled to at least one of the other plurality of Bluetooth communication devices.

在一些實施例中,藍牙通訊系統更包含至少一電子裝置,並且至少一電子裝置耦接於複數藍牙通訊裝置中的一者。In some embodiments, the Bluetooth communication system further includes at least one electronic device, and the at least one electronic device is coupled to one of the plurality of Bluetooth communication devices.

在一些實施例中,藍牙通訊晶片更包含複數放大模組。各放大模組耦接於各藍牙通訊模組與天線模組之間。In some embodiments, the Bluetooth communication chip further includes a plurality of amplifier modules, each of which is coupled between each Bluetooth communication module and the antenna module.

在一些實施例中,藍牙通訊裝置包含一藍牙通訊晶片以及一處理晶片。藍牙通訊晶片包含複數藍牙通訊模組以及一天線模組。各藍牙通訊模組耦接於其餘複數藍牙通訊模組中的至少一者,並且各藍牙通訊模組操作於一主機(Master)模式或一從機(Slave)模式。天線模組耦接於複數藍牙通訊模組。處理晶片耦接於藍牙通訊晶片。In some embodiments, a Bluetooth communication device includes a Bluetooth communication chip and a processing chip. The Bluetooth communication chip includes a plurality of Bluetooth communication modules and an antenna module. Each Bluetooth communication module is coupled to at least one of the other plurality of Bluetooth communication modules, and each Bluetooth communication module operates in a master mode or a slave mode. The antenna module is coupled to the plurality of Bluetooth communication modules. The processing chip is coupled to the Bluetooth communication chip.

在一些實施例中,藍牙通訊晶片包含複數藍牙通訊模組以及一天線模組。各藍牙通訊模組耦接於其餘複數藍牙通訊模組中的至少一者,並且各藍牙通訊模組操作於一主機(Master)模式或一從機(Slave)模式。天線模組耦接於複數藍牙通訊模組。In some embodiments, the Bluetooth communication chip includes a plurality of Bluetooth communication modules and an antenna module. Each Bluetooth communication module is coupled to at least one of the other plurality of Bluetooth communication modules, and each Bluetooth communication module operates in a master mode or a slave mode. The antenna module is coupled to the plurality of Bluetooth communication modules.

在一些實施例中,藍牙通訊方法包含:建立複數藍牙通道;透過複數藍牙通道中的一者、一天線模組及一藍牙通訊模組接收來自一電子裝置之一無線訊號;將無線訊號自藍牙通訊模組傳輸至另一藍牙通訊模組;以及透過另一藍牙通訊模組、天線模組及複數藍牙通道中的另一者發送無線訊號至另一電子裝置。藍牙通訊模組及另一藍牙通訊模組設置於一藍牙通訊裝置中。In some embodiments, the Bluetooth communication method includes: establishing a plurality of Bluetooth channels; receiving a wireless signal from an electronic device through one of the plurality of Bluetooth channels, an antenna module, and a Bluetooth communication module; transmitting the wireless signal from the Bluetooth communication module to another Bluetooth communication module; and sending the wireless signal to another electronic device through another Bluetooth communication module, an antenna module, and another of the plurality of Bluetooth channels. The Bluetooth communication module and the other Bluetooth communication module are disposed in a Bluetooth communication device.

在一些實施例中,電子裝置為另一藍牙通訊裝置。In some embodiments, the electronic device is another Bluetooth communication device.

在一些實施例中,另一電子裝置為另一藍牙通訊裝置。In some embodiments, the another electronic device is another Bluetooth communication device.

在一些實施例中,無線訊號傳輸方法包含:透過一天線模組及一藍牙通訊模組接收一無線訊號;將無線訊號自藍牙通訊模組傳輸至另一藍牙通訊模組;以及透過另一藍牙通訊模組及天線模組發送無線訊號。藍牙通訊模組及另一藍牙通訊模組設置於一藍牙通訊裝置中。In some embodiments, the wireless signal transmission method includes: receiving a wireless signal through an antenna module and a Bluetooth communication module; transmitting the wireless signal from the Bluetooth communication module to another Bluetooth communication module; and sending the wireless signal through another Bluetooth communication module and the antenna module. The Bluetooth communication module and the other Bluetooth communication module are disposed in a Bluetooth communication device.

在一些實施例中,將無線訊號自藍牙通訊模組傳輸至另一藍牙通訊模組的步驟包含:將無線訊號自藍牙通訊模組傳輸至一處理晶片;處理無線訊號;以及將無線訊號自處理晶片傳輸至另一藍牙通訊模組。In some embodiments, the step of transmitting a wireless signal from a Bluetooth communication module to another Bluetooth communication module includes: transmitting the wireless signal from the Bluetooth communication module to a processing chip; processing the wireless signal; and transmitting the wireless signal from the processing chip to another Bluetooth communication module.

綜上所述,本申請案的其中一個關鍵特徵係將複數個藍牙通訊模組封裝成單一個藍牙通訊晶片。如此一來,包含此藍牙通訊晶片之藍牙通訊裝置便得以同時和複數個裝置(包含其他的藍牙通訊裝置及電子裝置)建立複數藍牙通道,使得包含此藍牙通訊裝置之藍牙通訊系統在傳輸無線訊號時有複數個傳輸路線可以選擇,進而降低藍牙通訊系統中某一電子裝置損壞導致訊號傳輸中斷的機率。此外,由於本申請案的藍牙通訊系統中的各節點係實時地建立好複數藍牙通道,資料在此藍牙通訊系統傳輸時無須反覆執行「建立—中斷」藍牙通道的程序,因而可節省重新建立藍牙通道的時間,使得藍牙通訊系統運作時的效率得以提升。In summary, one of the key features of the present application is to package multiple Bluetooth communication modules into a single Bluetooth communication chip. In this way, the Bluetooth communication device including the Bluetooth communication chip can simultaneously establish multiple Bluetooth channels with multiple devices (including other Bluetooth communication devices and electronic devices), so that the Bluetooth communication system including the Bluetooth communication device has multiple transmission routes to choose from when transmitting wireless signals, thereby reducing the probability of signal transmission interruption caused by damage to an electronic device in the Bluetooth communication system. In addition, since each node in the Bluetooth communication system of this application establishes multiple Bluetooth channels in real time, there is no need to repeatedly execute the "establishment-disconnection" Bluetooth channel procedure when transmitting data in this Bluetooth communication system, thereby saving the time for re-establishing the Bluetooth channel, thereby improving the efficiency of the Bluetooth communication system during operation.

針對本文所使用的術語,應能明瞭的是:術語「包含」係為一開放式的用語,故應解釋成「包含但不限定於」;「耦接」、「設置」及「電性連接」等術語,其係指二或多個元件相互「直接」作實體或電性接觸,或是相互「間接」作實體或電性接觸;以及「一」及「另一」等術語,其係用以區別所指之元件,除特別指出之外並非用以排序或限定所指元件之差異性。Regarding the terms used in this article, it should be understood that: the term "including" is an open term and should be interpreted as "including but not limited to"; the terms "coupled", "disposed" and "electrically connected" refer to two or more components being "directly" in physical or electrical contact with each other, or "indirectly" in physical or electrical contact with each other; and the terms "one" and "another" are used to distinguish the components referred to, and are not used to sort or limit the differences between the components referred to unless otherwise specified.

請參照圖1,圖1是藍牙通訊晶片100之第一實施例的模組方塊圖。藍牙通訊晶片100包含複數藍牙通訊模組101以及一天線模組102。其中,複數藍牙通訊模組101及天線模組102皆設置於藍牙通訊晶片100中。各藍牙通訊模組101耦接於其餘藍牙通訊模組101中的至少一者,並且天線模組102耦接於每一個藍牙通訊模組101。在一些實施例中,天線模組102具有複數饋入點(Feed point),並且各饋入點耦接於各藍牙通訊模組。以圖1為例,在本實施例中,藍牙通訊晶片100包含四個藍牙通訊模組101A、101B、101C、101D,並且天線模組102具有四個饋入點以分別耦接於藍牙通訊模組101A、101B、101C、101D。在另一些實施例中,天線模組102具有單一個饋入點,且藍牙通訊模組101A、101B、101C、101D均耦接至天線模組102的同一個饋入點。Please refer to FIG. 1 , which is a module block diagram of a first embodiment of a Bluetooth communication chip 100. The Bluetooth communication chip 100 includes a plurality of Bluetooth communication modules 101 and an antenna module 102. The plurality of Bluetooth communication modules 101 and the antenna module 102 are both disposed in the Bluetooth communication chip 100. Each Bluetooth communication module 101 is coupled to at least one of the other Bluetooth communication modules 101, and the antenna module 102 is coupled to each Bluetooth communication module 101. In some embodiments, the antenna module 102 has a plurality of feed points, and each feed point is coupled to each Bluetooth communication module. Taking FIG. 1 as an example, in this embodiment, the Bluetooth communication chip 100 includes four Bluetooth communication modules 101A, 101B, 101C, and 101D, and the antenna module 102 has four feeding points to be respectively coupled to the Bluetooth communication modules 101A, 101B, 101C, and 101D. In other embodiments, the antenna module 102 has a single feeding point, and the Bluetooth communication modules 101A, 101B, 101C, and 101D are all coupled to the same feeding point of the antenna module 102.

如圖1所示,在一些實施例中,藍牙通訊模組101B電性連接於藍牙通訊模組101A、101C,並且藍牙通訊模組101C電性連接於藍牙通訊模組101D。換言之,在本實施例中,藍牙通訊模組101A並未直接電性連接於藍牙通訊模組101C,並且藍牙通訊模組101B並未直接電性連接於藍牙通訊模組101D。As shown in FIG. 1 , in some embodiments, the Bluetooth communication module 101B is electrically connected to the Bluetooth communication modules 101A and 101C, and the Bluetooth communication module 101C is electrically connected to the Bluetooth communication module 101D. In other words, in this embodiment, the Bluetooth communication module 101A is not directly electrically connected to the Bluetooth communication module 101C, and the Bluetooth communication module 101B is not directly electrically connected to the Bluetooth communication module 101D.

請進一步參照圖2,圖2是藍牙通訊晶片100之第二實施例的模組方塊圖。在另一些實施例中,藍牙通訊模組101A電性連接於藍牙通訊模組101B、101C、101D,藍牙通訊模組101B電性連接於藍牙通訊模組101C、101D,並且藍牙通訊模組101C電性連接於藍牙通訊模組101D。換言之,在本實施例中,藍牙通訊模組101A、101B、101C、101D彼此之間係直接電性連接。於此,無論各藍牙通訊模組101A/101B/101C/101D之間是否直接電性連接,各藍牙通訊模組101A/101B/101C/101D皆耦接於其餘藍牙通訊模組101中的至少一者。Please further refer to FIG. 2, which is a module block diagram of the second embodiment of the Bluetooth communication chip 100. In other embodiments, the Bluetooth communication module 101A is electrically connected to the Bluetooth communication modules 101B, 101C, and 101D, the Bluetooth communication module 101B is electrically connected to the Bluetooth communication modules 101C and 101D, and the Bluetooth communication module 101C is electrically connected to the Bluetooth communication module 101D. In other words, in this embodiment, the Bluetooth communication modules 101A, 101B, 101C, and 101D are directly electrically connected to each other. Here, regardless of whether the Bluetooth communication modules 101A/101B/101C/101D are directly electrically connected to each other, each Bluetooth communication module 101A/101B/101C/101D is coupled to at least one of the other Bluetooth communication modules 101 .

各藍牙通訊模組101操作於一主機(Master)模式或一從機(Slave)模式。在一些實施例中,當藍牙通訊模組101操作於主機模式時,藍牙通訊模組101係可透過天線模組102發送無線訊號;當藍牙通訊模組101操作於從機模式時,藍牙通訊模組101係可透過天線模組102接收無線訊號。於此,各藍牙通訊模組101係可個別且獨立地運作,並且複數藍牙通訊模組101係共用同一個天線模組102以傳輸無線訊號。需注意的是,在一些實施例中,藍牙通訊模組101操作於主機模式時所發送之無線訊號及藍牙通訊模組101操作於從機模式時所接收之無線訊號可能為完全相同的訊號,也可能為二個不同的訊號。Each Bluetooth communication module 101 operates in a master mode or a slave mode. In some embodiments, when the Bluetooth communication module 101 operates in the master mode, the Bluetooth communication module 101 can send wireless signals through the antenna module 102; when the Bluetooth communication module 101 operates in the slave mode, the Bluetooth communication module 101 can receive wireless signals through the antenna module 102. Here, each Bluetooth communication module 101 can operate individually and independently, and multiple Bluetooth communication modules 101 share the same antenna module 102 to transmit wireless signals. It should be noted that in some embodiments, the wireless signal sent by the Bluetooth communication module 101 when operating in the master mode and the wireless signal received by the Bluetooth communication module 101 when operating in the slave mode may be exactly the same signal or may be two different signals.

請進一步參照圖3及圖4,圖3是圖1中藍牙通訊晶片100之一實施例的運作流程圖,並且圖4是圖1中藍牙通訊晶片100之一實施例的運作示意圖。如圖3所示,在一些實施例中,當藍牙通訊晶片100開始運作時,藍牙通訊晶片100係透過天線模組102及複數藍牙通訊模組101中的一者接收無線訊號SW(步驟S10)。接著,藍牙通訊晶片100係將無線訊號SW自複數藍牙通訊模組101中的一者傳輸至複數藍牙通訊模組101中的另一者(步驟S11)。最後,藍牙通訊晶片100係透過複數藍牙通訊模組101中的另一者及天線模組102發送無線訊號SW(步驟S12)。Please further refer to FIG. 3 and FIG. 4 , FIG. 3 is an operation flow chart of an embodiment of the Bluetooth communication chip 100 in FIG. 1 , and FIG. 4 is an operation schematic diagram of an embodiment of the Bluetooth communication chip 100 in FIG. 1 . As shown in FIG. 3 , in some embodiments, when the Bluetooth communication chip 100 starts to operate, the Bluetooth communication chip 100 receives the wireless signal SW through the antenna module 102 and one of the plurality of Bluetooth communication modules 101 (step S10 ). Then, the Bluetooth communication chip 100 transmits the wireless signal SW from one of the plurality of Bluetooth communication modules 101 to another of the plurality of Bluetooth communication modules 101 (step S11 ). Finally, the Bluetooth communication chip 100 transmits the wireless signal SW via another one of the plurality of Bluetooth communication modules 101 and the antenna module 102 (step S12 ).

以圖4為例,在本實施例中,藍牙通訊晶片100係透過天線模組102及藍牙通訊模組101A接收無線訊號SW(對應於步驟S10)。接著,藍牙通訊晶片100係將無線訊號SW自藍牙通訊模組101A傳輸至藍牙通訊模組101C(對應於步驟S11)。最後,藍牙通訊晶片100係透過藍牙通訊模組101C及天線模組102發送無線訊號SW(對應於步驟S12)。於此,在一些實施例中,藍牙通訊晶片100係可實現同一晶片中不同藍牙通訊模組101之間的無線訊號SW傳輸。Taking FIG. 4 as an example, in this embodiment, the Bluetooth communication chip 100 receives the wireless signal SW through the antenna module 102 and the Bluetooth communication module 101A (corresponding to step S10). Then, the Bluetooth communication chip 100 transmits the wireless signal SW from the Bluetooth communication module 101A to the Bluetooth communication module 101C (corresponding to step S11). Finally, the Bluetooth communication chip 100 sends the wireless signal SW through the Bluetooth communication module 101C and the antenna module 102 (corresponding to step S12). Here, in some embodiments, the Bluetooth communication chip 100 can realize the wireless signal SW transmission between different Bluetooth communication modules 101 in the same chip.

需注意的是,在一些實施例中,當藍牙通訊模組101A並未直接電性連接於藍牙通訊模組101C時,藍牙通訊晶片100係可先將無線訊號SW自藍牙通訊模組101A傳輸至藍牙通訊模組101B,之後再將無線訊號SW自藍牙通訊模組101B傳輸至藍牙通訊模組101C(如圖4所示)。在另一些實施例中,當藍牙通訊模組101A直接電性連接於藍牙通訊模組101C時,無線訊號SW係可直接將無線訊號SW自藍牙通訊模組101A傳輸至藍牙通訊模組101C(圖未示)。It should be noted that in some embodiments, when the Bluetooth communication module 101A is not directly electrically connected to the Bluetooth communication module 101C, the Bluetooth communication chip 100 can first transmit the wireless signal SW from the Bluetooth communication module 101A to the Bluetooth communication module 101B, and then transmit the wireless signal SW from the Bluetooth communication module 101B to the Bluetooth communication module 101C (as shown in FIG. 4 ). In other embodiments, when the Bluetooth communication module 101A is directly electrically connected to the Bluetooth communication module 101C, the wireless signal SW can directly transmit the wireless signal SW from the Bluetooth communication module 101A to the Bluetooth communication module 101C (not shown).

請進一步參照圖5,圖5是藍牙通訊晶片100之第三實施例的模組方塊圖。在一些實施例中,藍牙通訊晶片100更包含複數放大模組103。其中,複數放大模組103亦設置於藍牙通訊晶片100中。在一些實施例中,各放大模組103耦接於各藍牙通訊模組101與天線模組102之間。以圖5為例,在本實施例中,藍牙通訊晶片100包含四個放大模組103A、103B、103C、103D。其中,放大模組103A耦接於藍牙通訊模組101A與天線模組102之間,放大模組103B耦接於藍牙通訊模組101B與天線模組102之間,放大模組103C耦接於藍牙通訊模組101C與天線模組102之間,並且放大模組103D耦接於藍牙通訊模組101D與天線模組102之間。Please further refer to FIG. 5, which is a module block diagram of a third embodiment of the Bluetooth communication chip 100. In some embodiments, the Bluetooth communication chip 100 further includes a plurality of amplifier modules 103. The plurality of amplifier modules 103 are also disposed in the Bluetooth communication chip 100. In some embodiments, each amplifier module 103 is coupled between each Bluetooth communication module 101 and the antenna module 102. Taking FIG. 5 as an example, in this embodiment, the Bluetooth communication chip 100 includes four amplifier modules 103A, 103B, 103C, and 103D. Among them, the amplifier module 103A is coupled between the Bluetooth communication module 101A and the antenna module 102, the amplifier module 103B is coupled between the Bluetooth communication module 101B and the antenna module 102, the amplifier module 103C is coupled between the Bluetooth communication module 101C and the antenna module 102, and the amplifier module 103D is coupled between the Bluetooth communication module 101D and the antenna module 102.

在一些實施例中,放大模組103係用以放大藍牙通訊模組101所發送之無線訊號SW。於此,在一些實施例中,複數藍牙通訊模組101中的任一者透過天線模組102發送無線訊號SW之前(即於圖3所示之步驟S12之前),藍牙通訊晶片100係可透過相對應之放大模組103放大無線訊號SW以提升無線訊號SW的傳輸距離,進而提升藍牙通訊晶片100與其他硬體元件(例如,另一藍牙通訊晶片100)之間的最大通訊距離。In some embodiments, the amplifier module 103 is used to amplify the wireless signal SW sent by the Bluetooth communication module 101. Here, in some embodiments, before any of the plurality of Bluetooth communication modules 101 sends the wireless signal SW through the antenna module 102 (i.e., before step S12 shown in FIG. 3 ), the Bluetooth communication chip 100 can amplify the wireless signal SW through the corresponding amplifier module 103 to increase the transmission distance of the wireless signal SW, thereby increasing the maximum communication distance between the Bluetooth communication chip 100 and other hardware components (e.g., another Bluetooth communication chip 100).

請進一步參照圖6,圖6是藍牙通訊裝置10之一實施例的模組方塊圖。在一些實施例中,一種藍牙通訊裝置10包含前述任一實施例的藍牙通訊晶片100及一處理晶片110。換言之,前述任一實施例的藍牙通訊晶片100係可適用於藍牙通訊裝置10。如圖6所示,在一些實施例中,處理晶片110耦接於藍牙通訊晶片100,並且處理晶片110用以處理藍牙通訊晶片100所接收/發送之無線訊號SW。於此,在一些實施例中,藍牙通訊裝置10可以視為具有藍牙通訊功能的電子產品,例如但不限於藍牙耳機、穿戴式手環、穿戴式手錶、車用安卓機、智慧型手機、平板電腦、筆記型電腦及智慧型家電。Please further refer to FIG. 6, which is a module block diagram of an embodiment of a Bluetooth communication device 10. In some embodiments, a Bluetooth communication device 10 includes a Bluetooth communication chip 100 of any of the aforementioned embodiments and a processing chip 110. In other words, the Bluetooth communication chip 100 of any of the aforementioned embodiments can be applied to the Bluetooth communication device 10. As shown in FIG. 6, in some embodiments, the processing chip 110 is coupled to the Bluetooth communication chip 100, and the processing chip 110 is used to process the wireless signal SW received/sent by the Bluetooth communication chip 100. Here, in some embodiments, the Bluetooth communication device 10 can be regarded as an electronic product with Bluetooth communication function, such as but not limited to Bluetooth headsets, wearable bracelets, wearable watches, car Android phones, smart phones, tablet computers, laptops and smart home appliances.

請進一步參照圖7及圖8,圖7是圖6中藍牙通訊裝置10之一實施例的運作流程圖,並且圖8是圖6中藍牙通訊裝置10之一實施例的運作示意圖。如圖7所示,在一些實施例中,當藍牙通訊裝置10開始運作時,藍牙通訊裝置10係透過天線模組102及複數藍牙通訊模組101中的一者接收無線訊號SW(步驟S10)。接著,藍牙通訊裝置10係將無線訊號SW自複數藍牙通訊模組101中的一者傳輸至處理晶片110(步驟S111)。此時,藍牙通訊裝置10係透過處理晶片110處理無線訊號SW(步驟S112)。隨後,藍牙通訊裝置10係將處理完的無線訊號SW’自處理晶片110傳輸至複數藍牙通訊模組101中的另一者(步驟S113)。最後,藍牙通訊裝置10係透過複數藍牙通訊模組101中的另一者及天線模組102發送無線訊號SW’(步驟S12)。Please further refer to FIG. 7 and FIG. 8 , FIG. 7 is an operation flow chart of an embodiment of the Bluetooth communication device 10 in FIG. 6 , and FIG. 8 is an operation schematic diagram of an embodiment of the Bluetooth communication device 10 in FIG. 6 . As shown in FIG. 7 , in some embodiments, when the Bluetooth communication device 10 starts to operate, the Bluetooth communication device 10 receives the wireless signal SW through the antenna module 102 and one of the plurality of Bluetooth communication modules 101 (step S10 ). Then, the Bluetooth communication device 10 transmits the wireless signal SW from one of the plurality of Bluetooth communication modules 101 to the processing chip 110 (step S111 ). At this time, the Bluetooth communication device 10 processes the wireless signal SW through the processing chip 110 (step S112 ). Then, the Bluetooth communication device 10 transmits the processed wireless signal SW' from the processing chip 110 to another one of the plurality of Bluetooth communication modules 101 (step S113). Finally, the Bluetooth communication device 10 transmits the wireless signal SW' through another one of the plurality of Bluetooth communication modules 101 and the antenna module 102 (step S12).

以圖8為例,在本實施例中,藍牙通訊裝置10係透過天線模組102及藍牙通訊模組101B接收無線訊號SW(對應於步驟S10)。接著,藍牙通訊晶片100係將無線訊號SW自藍牙通訊模組101B傳輸至處理晶片110(對應於步驟S111)。此時,處理晶片110係處理無線訊號SW而產生另一無線訊號SW’(對應於步驟S112)。隨後,(對應於步驟S113)。最後,藍牙通訊晶片100係透過藍牙通訊模組101C及天線模組102發送無線訊號SW’(對應於步驟S12)。於此,在一些實施例中,藍牙通訊裝置10係可透過藍牙通訊晶片100實現同一裝置中不同藍牙通訊模組101之間的無線訊號SW傳輸。Taking FIG. 8 as an example, in this embodiment, the Bluetooth communication device 10 receives the wireless signal SW through the antenna module 102 and the Bluetooth communication module 101B (corresponding to step S10). Then, the Bluetooth communication chip 100 transmits the wireless signal SW from the Bluetooth communication module 101B to the processing chip 110 (corresponding to step S111). At this time, the processing chip 110 processes the wireless signal SW to generate another wireless signal SW' (corresponding to step S112). Subsequently, (corresponding to step S113). Finally, the Bluetooth communication chip 100 sends the wireless signal SW' through the Bluetooth communication module 101C and the antenna module 102 (corresponding to step S12). Here, in some embodiments, the Bluetooth communication device 10 can implement wireless signal SW transmission between different Bluetooth communication modules 101 in the same device through the Bluetooth communication chip 100.

需注意的是,在一些實施例中,於步驟S112中,處理晶片110可以透過不同的方式處理無線訊號SW而產生另一無線訊號SW’,例如但不限於調整頻率(Frequency)、調整振福(Amplitude)、調整相位(Phase)及調整脈衝寬度(Pulse width)。換言之,藍牙通訊裝置10係可透過處理晶片110以對無線訊號SW進行調變(Modulation)而產生另一無線訊號SW’。It should be noted that in some embodiments, in step S112, the processing chip 110 can process the wireless signal SW in different ways to generate another wireless signal SW', such as but not limited to adjusting the frequency, adjusting the amplitude, adjusting the phase, and adjusting the pulse width. In other words, the Bluetooth communication device 10 can modulate the wireless signal SW through the processing chip 110 to generate another wireless signal SW'.

此外,在一些實施例中,藍牙通訊裝置10亦可直接傳輸無線訊號SW而不透過處理晶片110處理無線訊號SW。換言之,在本實施例中,藍牙通訊裝置10同樣可以執行圖3所示之步驟S10至步驟S12以實現同一個無線訊號SW的傳輸。In addition, in some embodiments, the Bluetooth communication device 10 can also directly transmit the wireless signal SW without processing the wireless signal SW through the processing chip 110. In other words, in this embodiment, the Bluetooth communication device 10 can also execute steps S10 to S12 shown in FIG. 3 to achieve the transmission of the same wireless signal SW.

請進一步參照圖9,圖9是藍牙通訊系統1之一實施例的模組方塊圖。在一些實施例中,一種藍牙通訊系統1包含複數個前述任一實施例的藍牙通訊裝置10,並且各藍牙通訊裝置10耦接於其餘複數藍牙通訊裝置10中的至少一者。換言之,前述任一實施例的藍牙通訊裝置10係可適用於藍牙通訊系統1。以圖9為例,在本實施例中,藍牙通訊系統1包含七個藍牙通訊裝置10A、10B、10C、10D、10E、10F、10G,並且各藍牙通訊裝置10A/10B/10C/10D/10E/10F/10G之間係經由複數藍牙通道C1~C9中的至少一者彼此耦接。Please further refer to FIG. 9 , which is a module block diagram of an embodiment of a Bluetooth communication system 1. In some embodiments, a Bluetooth communication system 1 includes a plurality of Bluetooth communication devices 10 of any of the aforementioned embodiments, and each Bluetooth communication device 10 is coupled to at least one of the other plurality of Bluetooth communication devices 10. In other words, the Bluetooth communication device 10 of any of the aforementioned embodiments can be applied to the Bluetooth communication system 1. Taking FIG. 9 as an example, in this embodiment, the Bluetooth communication system 1 includes seven Bluetooth communication devices 10A, 10B, 10C, 10D, 10E, 10F, and 10G, and each Bluetooth communication device 10A/10B/10C/10D/10E/10F/10G is coupled to each other via at least one of a plurality of Bluetooth channels C1-C9.

在一些實施例中,藍牙通道CX係設置於二個藍牙通訊模組101之間,並且此二個藍牙通訊模組101係分別位於不同的藍牙通訊晶片100(或藍牙通訊裝置10)中。換言之,在一些實施例中,藍牙通訊晶片100(或藍牙通訊裝置10)中的藍牙通訊模組101更用以建立其與另一藍牙通訊晶片100(或藍牙通訊裝置10)中的藍牙通訊模組101之間的藍牙通道CX,使得二個藍牙通訊晶片100(或藍牙通訊裝置10)之間得以經由藍牙通道CX傳輸無線訊號SW。以圖9為例,在本實施例中,藍牙通道C1設置於藍牙通訊裝置10A、10B之間,藍牙通道C2設置於藍牙通訊裝置10A、10G之間,藍牙通道C3設置於藍牙通訊裝置10B、10C之間,藍牙通道C4設置於藍牙通訊裝置10B、10G之間,藍牙通道C5設置於藍牙通訊裝置10C、10D之間,藍牙通道C6設置於藍牙通訊裝置10C、10E之間,藍牙通道C7設置於藍牙通訊裝置10D、10E之間,藍牙通道C8設置於藍牙通訊裝置10E、10F之間,並且藍牙通道C9設置於藍牙通訊裝置10F、10G之間。In some embodiments, the Bluetooth channel CX is set between two Bluetooth communication modules 101, and the two Bluetooth communication modules 101 are respectively located in different Bluetooth communication chips 100 (or Bluetooth communication devices 10). In other words, in some embodiments, the Bluetooth communication module 101 in the Bluetooth communication chip 100 (or Bluetooth communication device 10) is further used to establish the Bluetooth channel CX between it and the Bluetooth communication module 101 in another Bluetooth communication chip 100 (or Bluetooth communication device 10), so that the two Bluetooth communication chips 100 (or Bluetooth communication devices 10) can transmit the wireless signal SW through the Bluetooth channel CX. Taking FIG. 9 as an example, in the present embodiment, the Bluetooth channel C1 is provided between the Bluetooth communication devices 10A and 10B, the Bluetooth channel C2 is provided between the Bluetooth communication devices 10A and 10G, the Bluetooth channel C3 is provided between the Bluetooth communication devices 10B and 10C, the Bluetooth channel C4 is provided between the Bluetooth communication devices 10B and 10G, the Bluetooth channel C5 is provided between the Bluetooth communication devices 10C and 10D, the Bluetooth channel C6 is provided between the Bluetooth communication devices 10C and 10E, the Bluetooth channel C7 is provided between the Bluetooth communication devices 10D and 10E, the Bluetooth channel C8 is provided between the Bluetooth communication devices 10E and 10F, and the Bluetooth channel C9 is provided between the Bluetooth communication devices 10F and 10G.

在一些實施例中,由於藍牙通訊裝置10中的藍牙通訊晶片100包含複數藍牙通訊模組101,藍牙通訊裝置10係可同時與複數藍牙通訊裝置10建立複數藍牙通道CX。以圖1及圖9為例,在本實施例中,各藍牙通訊裝置10A/10B/10C/10D/10E/10F/10G中的藍牙通訊晶片100包含四個藍牙通訊模組101A、101B、101C、101D。因此,各藍牙通訊裝置10A/10B/10C/10D/10E/10F/10G最多可以同時與四個藍牙通訊裝置10建立四個藍牙通道CX。In some embodiments, since the Bluetooth communication chip 100 in the Bluetooth communication device 10 includes a plurality of Bluetooth communication modules 101, the Bluetooth communication device 10 can simultaneously establish a plurality of Bluetooth channels CX with a plurality of Bluetooth communication devices 10. Taking FIG. 1 and FIG. 9 as examples, in this embodiment, the Bluetooth communication chip 100 in each Bluetooth communication device 10A/10B/10C/10D/10E/10F/10G includes four Bluetooth communication modules 101A, 101B, 101C, and 101D. Therefore, each Bluetooth communication device 10A/10B/10C/10D/10E/10F/10G can simultaneously establish four Bluetooth channels CX with four Bluetooth communication devices 10 at most.

請進一步參照圖10,圖10是圖9中藍牙通訊系統1之一實施例的運作流程圖。如圖10所示,當藍牙通訊系統1開始運作時,藍牙通訊系統1係先建立複數藍牙通道CX(步驟S13)。接著,藍牙通訊系統1中複數藍牙通訊裝置10中的一者(以下稱藍牙通訊裝置10)係透過複數藍牙通道CX中的一者、天線模組102及藍牙通訊模組101接收來自一電子裝置之無線訊號SW(步驟S14)。隨後,藍牙通訊裝置10係將無線訊號SW自藍牙通訊模組101傳輸至另一藍牙通訊模組101(步驟S15)。其中,藍牙通訊模組101及另一藍牙通訊模組101皆設置於藍牙通訊裝置10中。最後,藍牙通訊裝置10透過另一藍牙通訊模組101、天線模組102及複數藍牙通道CX中的另一者發送該無線訊號至另一電子裝置(步驟S16)。在一些實施例中,電子裝置可以是具有藍牙通訊功能的電子產品,例如但不限於藍牙耳機、穿戴式手環、穿戴式手錶、車用安卓機、智慧型手機、平板電腦、筆記型電腦及智慧型家電。在另一些實施例中,電子裝置可以是前述任一實施例的藍牙通訊裝置10。Please further refer to FIG. 10 , which is an operation flow chart of an embodiment of the Bluetooth communication system 1 in FIG. 9 . As shown in FIG. 10 , when the Bluetooth communication system 1 starts to operate, the Bluetooth communication system 1 first establishes a plurality of Bluetooth channels CX (step S13). Then, one of the plurality of Bluetooth communication devices 10 in the Bluetooth communication system 1 (hereinafter referred to as the Bluetooth communication device 10) receives a wireless signal SW from an electronic device through one of the plurality of Bluetooth channels CX, the antenna module 102 and the Bluetooth communication module 101 (step S14). Subsequently, the Bluetooth communication device 10 transmits the wireless signal SW from the Bluetooth communication module 101 to another Bluetooth communication module 101 (step S15). The Bluetooth communication module 101 and another Bluetooth communication module 101 are both installed in the Bluetooth communication device 10. Finally, the Bluetooth communication device 10 sends the wireless signal to another electronic device through another Bluetooth communication module 101, the antenna module 102 and another one of the plurality of Bluetooth channels CX (step S16). In some embodiments, the electronic device may be an electronic product with Bluetooth communication function, such as but not limited to a Bluetooth headset, a wearable bracelet, a wearable watch, an Android car, a smart phone, a tablet computer, a laptop computer and a smart home appliance. In other embodiments, the electronic device may be the Bluetooth communication device 10 of any of the aforementioned embodiments.

以圖9為例,在本實施例中,前述步驟中的電子裝置皆為藍牙通訊裝置10。於此,當圖9所示之藍牙通訊系統1開始運作時,藍牙通訊系統1係建立複數藍牙通道C1~C9(對應於步驟S13)。假設藍牙通訊系統1中有一無線訊號SW欲從藍牙通訊裝置10A傳輸至藍牙通訊裝置10E,藍牙通訊系統1係可透過藍牙通道C1、藍牙通訊裝置10B中的天線模組102及複數藍牙通訊模組101中的一者(以下以藍牙通訊模組101A為例說明)接收來自藍牙通訊裝置10A之無線訊號SW(對應於步驟S14)。接著,藍牙通訊系統1之藍牙通訊裝置10B係將無線訊號SW自藍牙通訊模組101A傳輸至複數藍牙通訊模組101中的另一者(以下以藍牙通訊模組101B為例說明)(對應於步驟S15)。隨後,藍牙通訊系統1之藍牙通訊裝置10B係透過藍牙通訊模組101B、天線模組102及藍牙通道C3發送無線訊號SW至藍牙通訊裝置10C。最後,藍牙通訊系統1係透過藍牙通訊裝置10C重複執行步驟S13至步驟S15以將無線訊號SW自藍牙通訊裝置10C傳輸至藍牙通訊裝置10E,進而完成無線訊號SW的傳輸流程。Taking FIG. 9 as an example, in this embodiment, the electronic devices in the aforementioned steps are all Bluetooth communication devices 10. Here, when the Bluetooth communication system 1 shown in FIG. 9 starts to operate, the Bluetooth communication system 1 establishes a plurality of Bluetooth channels C1 to C9 (corresponding to step S13). Assuming that there is a wireless signal SW in the Bluetooth communication system 1 to be transmitted from the Bluetooth communication device 10A to the Bluetooth communication device 10E, the Bluetooth communication system 1 can receive the wireless signal SW from the Bluetooth communication device 10A through the Bluetooth channel C1, the antenna module 102 in the Bluetooth communication device 10B, and one of the plurality of Bluetooth communication modules 101 (hereinafter, the Bluetooth communication module 101A is used as an example) (corresponding to step S14). Next, the Bluetooth communication device 10B of the Bluetooth communication system 1 transmits the wireless signal SW from the Bluetooth communication module 101A to another one of the plurality of Bluetooth communication modules 101 (hereinafter, the Bluetooth communication module 101B is used as an example) (corresponding to step S15). Subsequently, the Bluetooth communication device 10B of the Bluetooth communication system 1 sends the wireless signal SW to the Bluetooth communication device 10C through the Bluetooth communication module 101B, the antenna module 102 and the Bluetooth channel C3. Finally, the Bluetooth communication system 1 repeatedly executes steps S13 to S15 through the Bluetooth communication device 10C to transmit the wireless signal SW from the Bluetooth communication device 10C to the Bluetooth communication device 10E, thereby completing the transmission process of the wireless signal SW.

需注意的是,在一些實施例中,藍牙通訊系統1亦可透過其他的藍牙通道CX及藍牙通訊裝置10以傳輸無線訊號SW。換言之,藍牙通訊系統1係可針對不同的情況以選擇傳輸無線訊號SW的路線。舉例來說,當藍牙通訊裝置10C損壞而無法傳輸無線訊號SW時,藍牙通訊系統1亦可透過藍牙通道C2、C8、C9及藍牙通訊裝置10F、10G將無線訊號SW自藍牙通訊裝置10A傳輸至藍牙通訊裝置10E。It should be noted that in some embodiments, the Bluetooth communication system 1 can also transmit the wireless signal SW through other Bluetooth channels CX and Bluetooth communication devices 10. In other words, the Bluetooth communication system 1 can select a route for transmitting the wireless signal SW according to different situations. For example, when the Bluetooth communication device 10C is damaged and cannot transmit the wireless signal SW, the Bluetooth communication system 1 can also transmit the wireless signal SW from the Bluetooth communication device 10A to the Bluetooth communication device 10E through the Bluetooth channels C2, C8, C9 and the Bluetooth communication devices 10F and 10G.

請進一步參照圖11,圖11是藍牙通訊系統1之另一實施例的模組方塊圖。在一些實施例中,藍牙通訊系統1包含有至少一電子裝置11,並且電子裝置11同時只能與一個藍牙通訊裝置10(以下稱第一藍牙通訊裝置10)建立一個藍牙通道CX。換言之,當電子裝置11要與另一個藍牙通訊裝置10(以下稱第二藍牙通訊裝置10)進行藍牙通訊時,電子裝置11需要先中斷其與第一藍牙通訊裝置10之間的藍牙通道CX,隨後方能建立其與第二藍牙通訊裝置10之間的藍牙通道CX。Please further refer to FIG. 11 , which is a module block diagram of another embodiment of the Bluetooth communication system 1. In some embodiments, the Bluetooth communication system 1 includes at least one electronic device 11, and the electronic device 11 can only establish one Bluetooth channel CX with one Bluetooth communication device 10 (hereinafter referred to as the first Bluetooth communication device 10) at a time. In other words, when the electronic device 11 wants to perform Bluetooth communication with another Bluetooth communication device 10 (hereinafter referred to as the second Bluetooth communication device 10), the electronic device 11 needs to first interrupt the Bluetooth channel CX between it and the first Bluetooth communication device 10, and then it can establish the Bluetooth channel CX between it and the second Bluetooth communication device 10.

如圖11所示,在本實施例中,藍牙通訊系統1包含二個電子裝置11A、11B。於此,當圖10所示之藍牙通訊系統1開始運作時,藍牙通訊系統1係建立複數藍牙通道C1~C10(對應於步驟S13)。假設藍牙通訊系統1中有一無線訊號SW欲從電子裝置11A傳輸至電子裝置11B,藍牙通訊系統1係可透過藍牙通道C6、藍牙通訊裝置10C中的天線模組102及複數藍牙通訊模組101中的一者(以下以藍牙通訊模組101B為例說明)接收來自電子裝置11A之無線訊號SW(對應於步驟S14)。接著,藍牙通訊系統1之藍牙通訊裝置10C係將無線訊號SW自藍牙通訊模組101B傳輸至複數藍牙通訊模組101中的另一者(以下以藍牙通訊模組101C為例說明)(對應於步驟S15)。隨後,藍牙通訊系統1之藍牙通訊裝置10C係透過藍牙通訊模組101C、天線模組102及藍牙通道C3發送無線訊號SW至藍牙通訊裝置10D。最後,藍牙通訊系統1係透過藍牙通訊裝置10D、10E、10F分別重複執行步驟S13至步驟S15以將無線訊號SW自藍牙通訊裝置10C依序傳輸至藍牙通訊裝置10D、10E、10F及電子裝置11B,進而完成無線訊號SW的傳輸流程。As shown in FIG. 11 , in this embodiment, the Bluetooth communication system 1 includes two electronic devices 11A and 11B. Here, when the Bluetooth communication system 1 shown in FIG. 10 starts to operate, the Bluetooth communication system 1 establishes a plurality of Bluetooth channels C1 to C10 (corresponding to step S13). Assuming that there is a wireless signal SW in the Bluetooth communication system 1 to be transmitted from the electronic device 11A to the electronic device 11B, the Bluetooth communication system 1 can receive the wireless signal SW from the electronic device 11A through the Bluetooth channel C6, the antenna module 102 in the Bluetooth communication device 10C, and one of the plurality of Bluetooth communication modules 101 (hereinafter, the Bluetooth communication module 101B is used as an example) (corresponding to step S14). Next, the Bluetooth communication device 10C of the Bluetooth communication system 1 transmits the wireless signal SW from the Bluetooth communication module 101B to another one of the plurality of Bluetooth communication modules 101 (hereinafter, the Bluetooth communication module 101C is used as an example) (corresponding to step S15). Subsequently, the Bluetooth communication device 10C of the Bluetooth communication system 1 sends the wireless signal SW to the Bluetooth communication device 10D via the Bluetooth communication module 101C, the antenna module 102 and the Bluetooth channel C3. Finally, the Bluetooth communication system 1 repeatedly executes step S13 to step S15 through the Bluetooth communication devices 10D, 10E, and 10F to transmit the wireless signal SW from the Bluetooth communication device 10C to the Bluetooth communication devices 10D, 10E, 10F, and the electronic device 11B in sequence, thereby completing the transmission process of the wireless signal SW.

需注意的是,在一些實施例中,藍牙通訊系統1亦可透過其他的藍牙通道CX及藍牙通訊裝置10以傳輸來自電子裝置11之無線訊號SW。舉例來說,當藍牙通訊裝置10D損壞而無法傳輸無線訊號SW時,藍牙通訊系統1亦可透過藍牙通道C3、C4、C6、C8、C10及藍牙通訊裝置10B、10C、10E、10F將無線訊號SW自電子裝置11A傳輸至電子裝置11B。It should be noted that in some embodiments, the Bluetooth communication system 1 can also transmit the wireless signal SW from the electronic device 11 through other Bluetooth channels CX and the Bluetooth communication device 10. For example, when the Bluetooth communication device 10D is damaged and cannot transmit the wireless signal SW, the Bluetooth communication system 1 can also transmit the wireless signal SW from the electronic device 11A to the electronic device 11B through the Bluetooth channels C3, C4, C6, C8, C10 and the Bluetooth communication devices 10B, 10C, 10E, 10F.

在一些實施例中,藍牙通訊系統1之複數藍牙通訊裝置10中的至少一者係可先透過處理晶片110處理無線訊號SW,隨後才將處理完的無線訊號SW發送給後面的裝置。以圖9為例,當藍牙通訊裝置10C接收無線訊號SW時,藍牙通訊裝置10C之處理晶片110係可先處理無線訊號SW(例如但不限於調整無線訊號SW之頻率、振福、相位及脈衝寬度中的至少一者),隨後將無線訊號SW發送至藍牙通訊裝置10E。又以圖11為例,當藍牙通訊裝置10F接收無線訊號SW時,藍牙通訊裝置10F之處理晶片110係可先處理無線訊號SW,隨後將無線訊號SW發送至電子裝置11B。In some embodiments, at least one of the plurality of Bluetooth communication devices 10 of the Bluetooth communication system 1 may first process the wireless signal SW through the processing chip 110, and then send the processed wireless signal SW to the subsequent device. Taking FIG. 9 as an example, when the Bluetooth communication device 10C receives the wireless signal SW, the processing chip 110 of the Bluetooth communication device 10C may first process the wireless signal SW (for example, but not limited to, adjusting at least one of the frequency, amplitude, phase, and pulse width of the wireless signal SW), and then send the wireless signal SW to the Bluetooth communication device 10E. Taking FIG. 11 as an example, when the Bluetooth communication device 10F receives the wireless signal SW, the processing chip 110 of the Bluetooth communication device 10F may first process the wireless signal SW and then send the wireless signal SW to the electronic device 11B.

在一些實施例中,藍牙通訊模組101可以是具有藍牙訊號處理功能的硬體元件或電路模組,例如但不限於藍牙晶片、基頻處理器(Baseband Processor,BBP)及數位訊號處理器(Digital Signal Processor,DSP)。In some embodiments, the Bluetooth communication module 101 may be a hardware component or circuit module having a Bluetooth signal processing function, such as but not limited to a Bluetooth chip, a baseband processor (BBP) and a digital signal processor (DSP).

在一些實施例中,天線模組102可以是具有無線訊號傳輸功能的硬體元件,例如但不限於單極天線、偶極天線、環形天線、貼片天線、平面倒F型天線(PIFA)及槽孔天線。In some embodiments, the antenna module 102 may be a hardware component having a wireless signal transmission function, such as but not limited to a monopole antenna, a dipole antenna, a loop antenna, a patch antenna, a planar inverted F antenna (PIFA), and a slot antenna.

在一些實施例中,放大模組103可以是具有訊號放大功能的硬體元件,例如但不限於放大器(Amplifier)、雙極性接面電晶體(BJT)及金氧半場效電晶體(MOSFET)。In some embodiments, the amplifier module 103 may be a hardware component having a signal amplification function, such as but not limited to an amplifier, a bipolar junction transistor (BJT), and a metal oxide semi-conductor field effect transistor (MOSFET).

在一些實施例中,藍牙通訊晶片100係具有一印刷電路板(Printed Circuit Board,PCB),並且複數藍牙通訊模組101及天線模組102係個別地封裝為複數個積體電路(Integrated circuit,IC)。於此,複數藍牙通訊模組101、天線模組102及複數放大模組103係可焊接於此印刷電路板上。同理,在一些實施例中,圖3所示之複數放大模組103亦可個別地封裝為複數個積體電路並焊接於此印刷電路板上。In some embodiments, the Bluetooth communication chip 100 has a printed circuit board (PCB), and the plurality of Bluetooth communication modules 101 and the antenna module 102 are individually packaged as a plurality of integrated circuits (ICs). Here, the plurality of Bluetooth communication modules 101, the antenna module 102, and the plurality of amplifier modules 103 can be soldered on the printed circuit board. Similarly, in some embodiments, the plurality of amplifier modules 103 shown in FIG. 3 can also be individually packaged as a plurality of integrated circuits and soldered on the printed circuit board.

在另一些實施例中,藍牙通訊晶片100可以是一系統單晶片(System on Chip,SoC)。於此,複數藍牙通訊模組101及天線模組102係可整合於此系統單晶片中,進而封裝為一個積體電路。同理,在一些實施例中,圖3所示之複數放大模組103亦可整合於此系統單晶片中。In some other embodiments, the Bluetooth communication chip 100 may be a system on chip (SoC). Here, a plurality of Bluetooth communication modules 101 and antenna modules 102 may be integrated into the SoC and then packaged into an integrated circuit. Similarly, in some embodiments, the plurality of amplifier modules 103 shown in FIG. 3 may also be integrated into the SoC.

在一些實施例中,處理晶片110可以是具有訊號處理功能的硬體元件,例如但不限於中央處理器(CPU)、數位訊號處理器(Digital Signal Processor,DSP)、可程式化邏輯控制器(Programmable Logic Controller,PLC)、複雜可程式化邏輯裝置(Complex Programmable Logic Device,CPLD)、場式可程式閘陣列(Field Programmable Gate Array,FPGA)、特殊應用積體電路(Application Specific Integrated Circuits,ASIC)、微處理器(Microprocessor)、微控制器單元(Microcontroller Unit,MCU)及通用陣列邏輯(Generic Array Logic,GAL)。In some embodiments, the processing chip 110 may be a hardware component having a signal processing function, such as but not limited to a central processing unit (CPU), a digital signal processor (DSP), a programmable logic controller (PLC), a complex programmable logic device (CPLD), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a microprocessor (Microprocessor), a microcontroller unit (MCU) and a generic array logic (GAL).

綜上所述,本申請案的其中一個關鍵特徵係將複數個藍牙通訊模組封裝成單一個藍牙通訊晶片。如此一來,包含此藍牙通訊晶片之藍牙通訊裝置便得以同時和複數個裝置(包含其他的藍牙通訊裝置及電子裝置)建立複數藍牙通道,使得包含此藍牙通訊裝置之藍牙通訊系統在傳輸無線訊號時有複數個傳輸路線可以選擇,進而降低藍牙通訊系統中某一電子裝置損壞導致訊號傳輸中斷的機率。此外,由於本申請案的藍牙通訊系統中的各節點係實時地建立好複數藍牙通道,資料在此藍牙通訊系統傳輸時無須反覆執行「建立—中斷」藍牙通道的程序,因而可節省重新建立藍牙通道的時間,使得藍牙通訊系統運作時的效率得以提升。In summary, one of the key features of the present application is to package multiple Bluetooth communication modules into a single Bluetooth communication chip. In this way, the Bluetooth communication device including the Bluetooth communication chip can simultaneously establish multiple Bluetooth channels with multiple devices (including other Bluetooth communication devices and electronic devices), so that the Bluetooth communication system including the Bluetooth communication device has multiple transmission routes to choose from when transmitting wireless signals, thereby reducing the probability of signal transmission interruption caused by damage to an electronic device in the Bluetooth communication system. In addition, since each node in the Bluetooth communication system of this application establishes multiple Bluetooth channels in real time, there is no need to repeatedly execute the "establishment-disconnection" Bluetooth channel procedure when transmitting data in this Bluetooth communication system, thereby saving the time for re-establishing the Bluetooth channel, thereby improving the efficiency of the Bluetooth communication system during operation.

1:藍牙通訊系統 10,10A,10B,10C,10D,10E,10F,10G:藍牙通訊裝置 100:藍牙通訊晶片 101,101A,101B,101C,101D:藍牙通訊模組 102:天線模組 103,103A,103B,103C,103D:放大模組 110:處理晶片 11,11A,11B:電子裝置 C1,C2,C3,C4,C5,C6,C7,C8,C9,C10,CX:藍牙通道 SW,SW’:無線訊號 S10,S11,S12,S13,S14,S15,S16:步驟 S111,S112,S113:步驟1: Bluetooth communication system 10,10A,10B,10C,10D,10E,10F,10G: Bluetooth communication device 100: Bluetooth communication chip 101,101A,101B,101C,101D: Bluetooth communication module 102: Antenna module 103,103A,103B,103C,103D: Amplifier module 110: Processing chip 11,11A,11B: Electronic device C1,C2,C3,C4,C5,C6,C7,C8,C9,C10,CX: Bluetooth channel SW,SW’: Wireless signal S10,S11,S12,S13,S14,S15,S16: Steps S111, S112, S113: Steps

圖1是藍牙通訊晶片之第一實施例的模組方塊圖。 圖2是藍牙通訊晶片之第二實施例的模組方塊圖。 圖3是圖1中藍牙通訊晶片之一實施例的運作流程圖。 圖4是圖1中藍牙通訊晶片之一實施例的運作示意圖。 圖5是藍牙通訊晶片之第三實施例的模組方塊圖。 圖6是藍牙通訊裝置之一實施例的模組方塊圖。 圖7是圖6中藍牙通訊裝置之一實施例的運作流程圖。 圖8是圖6中藍牙通訊裝置之一實施例的運作示意圖。 圖9是藍牙通訊系統之一實施例的模組方塊圖。 圖10是圖9中藍牙通訊系統之一實施例的運作流程圖。 圖11是藍牙通訊系統之另一實施例的模組方塊圖。 FIG. 1 is a module block diagram of a first embodiment of a Bluetooth communication chip. FIG. 2 is a module block diagram of a second embodiment of a Bluetooth communication chip. FIG. 3 is an operation flow chart of an embodiment of the Bluetooth communication chip in FIG. 1. FIG. 4 is an operation schematic diagram of an embodiment of the Bluetooth communication chip in FIG. 1. FIG. 5 is a module block diagram of a third embodiment of the Bluetooth communication chip. FIG. 6 is a module block diagram of an embodiment of a Bluetooth communication device. FIG. 7 is an operation flow chart of an embodiment of the Bluetooth communication device in FIG. 6. FIG. 8 is an operation schematic diagram of an embodiment of the Bluetooth communication device in FIG. 6. FIG. 9 is a module block diagram of an embodiment of a Bluetooth communication system. FIG. 10 is an operation flow chart of one embodiment of the Bluetooth communication system in FIG. 9 . FIG. 11 is a module block diagram of another embodiment of the Bluetooth communication system.

100:藍牙通訊晶片 100: Bluetooth communication chip

101,101A,101B,101C,101D:藍牙通訊模組 101,101A,101B,101C,101D: Bluetooth communication module

102:天線模組 102: Antenna module

Claims (12)

一種藍牙通訊系統,包含複數藍牙通訊裝置,其中各該藍牙通訊裝置包含: 一藍牙通訊晶片,包含: 複數藍牙通訊模組,各該藍牙通訊模組耦接於其餘該複數藍牙通訊模組中的至少一者,並且各該藍牙通訊模組操作於一主機(Master)模式或一從機(Slave)模式;以及 一天線模組,耦接於該複數藍牙通訊模組;以及 一處理晶片,耦接於該藍牙通訊晶片; 其中,各該藍牙通訊裝置耦接於其餘該複數藍牙通訊裝置中的至少一者。 A Bluetooth communication system includes a plurality of Bluetooth communication devices, wherein each of the Bluetooth communication devices includes: A Bluetooth communication chip, including: A plurality of Bluetooth communication modules, each of which is coupled to at least one of the other plurality of Bluetooth communication modules, and each of which operates in a master mode or a slave mode; and An antenna module, coupled to the plurality of Bluetooth communication modules; and A processing chip, coupled to the Bluetooth communication chip; Wherein, each of the Bluetooth communication devices is coupled to at least one of the other plurality of Bluetooth communication devices. 如請求項1所述之藍牙通訊系統,更包含: 至少一電子裝置,耦接於該複數藍牙通訊裝置中的一者。 The Bluetooth communication system as described in claim 1 further comprises: At least one electronic device coupled to one of the plurality of Bluetooth communication devices. 如請求項1所述之藍牙通訊系統,其中該藍牙通訊晶片更包含: 複數放大模組,各該放大模組耦接於各該藍牙通訊模組與該天線模組之間。 The Bluetooth communication system as described in claim 1, wherein the Bluetooth communication chip further comprises: A plurality of amplifier modules, each of which is coupled between each of the Bluetooth communication modules and the antenna module. 一種藍牙通訊裝置,包含: 一藍牙通訊晶片,包含: 複數藍牙通訊模組,各該藍牙通訊模組耦接於其餘該複數藍牙通訊模組中的至少一者,並且各該藍牙通訊模組操作於一主機(Master)模式或一從機(Slave)模式;以及 一天線模組,耦接於該複數藍牙通訊模組;以及 一處理晶片,耦接於該藍牙通訊晶片。 A Bluetooth communication device comprises: A Bluetooth communication chip comprising: A plurality of Bluetooth communication modules, each of which is coupled to at least one of the other plurality of Bluetooth communication modules, and each of which operates in a master mode or a slave mode; and An antenna module coupled to the plurality of Bluetooth communication modules; and A processing chip coupled to the Bluetooth communication chip. 如請求項4所述之藍牙通訊裝置,其中該藍牙通訊晶片更包含: 複數放大模組,各該放大模組耦接於各該藍牙通訊模組與該天線模組之間。 The Bluetooth communication device as described in claim 4, wherein the Bluetooth communication chip further comprises: A plurality of amplifier modules, each of which is coupled between each of the Bluetooth communication modules and the antenna module. 一種藍牙通訊晶片,包含: 複數藍牙通訊模組,各該藍牙通訊模組耦接於其餘該複數藍牙通訊模組中的至少一者,並且各該藍牙通訊模組操作於一主機(Master)模式或一從機(Slave)模式;以及 一天線模組,耦接於該複數藍牙通訊模組。 A Bluetooth communication chip comprises: a plurality of Bluetooth communication modules, each of which is coupled to at least one of the other plurality of Bluetooth communication modules, and each of which operates in a master mode or a slave mode; and an antenna module coupled to the plurality of Bluetooth communication modules. 如請求項6所述之藍牙通訊晶片,更包含: 複數放大模組,各該放大模組耦接於各該藍牙通訊模組與該天線模組之間。 The Bluetooth communication chip as described in claim 6 further comprises: A plurality of amplifier modules, each of which is coupled between each of the Bluetooth communication modules and the antenna module. 一種藍牙通訊方法,包含: 建立複數藍牙通道; 透過該複數藍牙通道中的一者、一天線模組及一藍牙通訊模組接收來自一電子裝置之一無線訊號; 將該無線訊號自該藍牙通訊模組傳輸至另一藍牙通訊模組;以及 透過該另一藍牙通訊模組、該天線模組及該複數藍牙通道中的另一者發送該無線訊號至另一電子裝置; 其中,該藍牙通訊模組及該另一藍牙通訊模組設置於一藍牙通訊裝置中。 A Bluetooth communication method, comprising: establishing a plurality of Bluetooth channels; receiving a wireless signal from an electronic device through one of the plurality of Bluetooth channels, an antenna module and a Bluetooth communication module; transmitting the wireless signal from the Bluetooth communication module to another Bluetooth communication module; and sending the wireless signal to another electronic device through the other Bluetooth communication module, the antenna module and another of the plurality of Bluetooth channels; wherein the Bluetooth communication module and the other Bluetooth communication module are disposed in a Bluetooth communication device. 如請求項8所述之藍牙通訊方法,其中該電子裝置為另一藍牙通訊裝置。A Bluetooth communication method as described in claim 8, wherein the electronic device is another Bluetooth communication device. 如請求項8所述之藍牙通訊方法,其中該另一電子裝置為另一藍牙通訊裝置。A Bluetooth communication method as described in claim 8, wherein the other electronic device is another Bluetooth communication device. 一種無線訊號傳輸方法,包含: 透過一天線模組及一藍牙通訊模組接收一無線訊號; 將該無線訊號自該藍牙通訊模組傳輸至另一藍牙通訊模組;以及 透過該另一藍牙通訊模組及該天線模組發送該無線訊號; 其中,該藍牙通訊模組及該另一藍牙通訊模組設置於一藍牙通訊裝置中。 A wireless signal transmission method comprises: receiving a wireless signal through an antenna module and a Bluetooth communication module; transmitting the wireless signal from the Bluetooth communication module to another Bluetooth communication module; and sending the wireless signal through the other Bluetooth communication module and the antenna module; wherein the Bluetooth communication module and the other Bluetooth communication module are disposed in a Bluetooth communication device. 如請求項11所述之無線訊號傳輸方法,將該無線訊號自該藍牙通訊模組傳輸至該另一藍牙通訊模組的步驟包含: 將該無線訊號自該藍牙通訊模組傳輸至一處理晶片; 處理該無線訊號;以及 將該無線訊號自該處理晶片傳輸至該另一藍牙通訊模組。 As described in claim 11, the wireless signal transmission method of transmitting the wireless signal from the Bluetooth communication module to the other Bluetooth communication module comprises: Transmitting the wireless signal from the Bluetooth communication module to a processing chip; Processing the wireless signal; and Transmitting the wireless signal from the processing chip to the other Bluetooth communication module.
TW113120707A 2024-06-04 2024-06-04 Bluetooth communication system, bluetooth communication device, bluetooth communication chip, bluetooth communication method, and bluetooth signal tranmission method TWI882826B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW113120707A TWI882826B (en) 2024-06-04 2024-06-04 Bluetooth communication system, bluetooth communication device, bluetooth communication chip, bluetooth communication method, and bluetooth signal tranmission method
CN202510696840.4A CN121078407A (en) 2024-06-04 2025-05-28 Bluetooth communication system, Bluetooth communication device, Bluetooth communication chip, Bluetooth communication method and wireless signal transmission method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW113120707A TWI882826B (en) 2024-06-04 2024-06-04 Bluetooth communication system, bluetooth communication device, bluetooth communication chip, bluetooth communication method, and bluetooth signal tranmission method

Publications (2)

Publication Number Publication Date
TWI882826B true TWI882826B (en) 2025-05-01
TW202549376A TW202549376A (en) 2025-12-16

Family

ID=96581933

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113120707A TWI882826B (en) 2024-06-04 2024-06-04 Bluetooth communication system, bluetooth communication device, bluetooth communication chip, bluetooth communication method, and bluetooth signal tranmission method

Country Status (2)

Country Link
CN (1) CN121078407A (en)
TW (1) TWI882826B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201249118A (en) * 2011-05-24 2012-12-01 Wistron Corp Wireless communication device and portable electronic device
WO2014206987A1 (en) * 2013-06-24 2014-12-31 Euriware Portable device for the remote transmission of data
WO2024022600A1 (en) * 2022-07-29 2024-02-01 NEC Laboratories Europe GmbH Distributed configuration of ris swarm

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201249118A (en) * 2011-05-24 2012-12-01 Wistron Corp Wireless communication device and portable electronic device
WO2014206987A1 (en) * 2013-06-24 2014-12-31 Euriware Portable device for the remote transmission of data
WO2024022600A1 (en) * 2022-07-29 2024-02-01 NEC Laboratories Europe GmbH Distributed configuration of ris swarm

Also Published As

Publication number Publication date
CN121078407A (en) 2025-12-05

Similar Documents

Publication Publication Date Title
US7954001B2 (en) Nibble de-skew method, apparatus, and system
US11050455B2 (en) Radio-frequency signal sending/receiving circuit and radio-frequency signal sending/receiving device
EP1939986B1 (en) Local wireless communications within a device
CN101459442B (en) Method and system for processing communication signal
CN110620603A (en) Electronic device including a plurality of switches selectively connecting an antenna having a plurality of feed terminals and a communication circuit, and driving method thereof
CN106209268B (en) Communication system and communication method
TWI864692B (en) A multi-link communication setup method and a related apparatus
US10931033B2 (en) Multi-polarization millimeter wave (mmWave) transmitter/receiver architecture with shared power amplifiers
US12386770B2 (en) Interface bus combining
US20230239129A1 (en) Integrated circuit with radio frequency interconnect
TWI882826B (en) Bluetooth communication system, bluetooth communication device, bluetooth communication chip, bluetooth communication method, and bluetooth signal tranmission method
US9391765B2 (en) Wireless clock distribution
TW202549376A (en) Bluetooth communication system, bluetooth communication device, bluetooth communication chip, bluetooth communication method, and bluetooth signal tranmission method
US20100067585A1 (en) A wireless communication apparatus and the configuration method thereof
US10869323B2 (en) Wireless local area network and bluetooth device
US12388486B2 (en) Supporting multiple protocols with selective amplification
US20110217938A1 (en) Wireless Transceiver Device and Control Method
TW202306084A (en) An electronic device using architecture of cip package and its architecture of cip package
TW202243423A (en) Wireless communication chip
US9888516B1 (en) Redundant contactless communication
US11218179B2 (en) Radio frequency module and communication device
US20240006350A1 (en) Semiconductor package, base station, mobile device and method for forming a semiconductor package
US9014752B2 (en) Front end device
JP2004104475A (en) Radio communication equipment and radio communication method
JP2025087405A (en) COMMUNICATION CONTROL DEVICE, COMMUNICATION CONTROL METHOD, AND PROGRAM