TWI882875B - Glass composition and copper paste for terminal electrode, multilayer ceramic capacitor and method of forming the same - Google Patents
Glass composition and copper paste for terminal electrode, multilayer ceramic capacitor and method of forming the same Download PDFInfo
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本發明是關於一種端電極玻璃組成物,特別是關於一種端電極玻璃組成物、端電極銅膏、多層陶瓷電容及其製造方法。The present invention relates to a terminal electrode glass composition, in particular to a terminal electrode glass composition, a terminal electrode copper paste, a multi-layer ceramic capacitor and a manufacturing method thereof.
多層陶瓷電容(Multilayer Ceramic Capacitor,MLCC)依據電極材料不同可分為卑金屬電極(Base Metal Electrode,BME)及貴金屬電極(Noble Metal Electrode,NME)的製程。一般BME的MLCC之端電極由內而外依序為燒附(curing)銅、電鍍鎳及電鍍錫,其中燒附銅係將銅膏進行燒附,以使銅金屬在高溫下與內電極的鎳形成合金導通後,以形成端電極。Multilayer Ceramic Capacitor (MLCC) can be divided into base metal electrode (BME) and noble metal electrode (NME) processes according to the electrode materials. The terminal electrodes of BME MLCC are usually made of copper, nickel and tin from the inside to the outside. The copper is sintered by sintering copper paste to form an alloy with the nickel of the inner electrode at high temperature to form the terminal electrode.
上述的銅膏原料中須包含玻璃組成物,以作為與陶瓷電容元件中的陶瓷材料的媒合劑。玻璃組成物的組成元素會影響所製得之端電極的品質及電性表現。The copper paste raw material mentioned above must contain a glass component to act as a medium for the ceramic material in the ceramic capacitor element. The constituent elements of the glass component will affect the quality and electrical performance of the resulting terminal electrode.
由於現今產品微小化的趨勢,MLCC元件層厚度也更趨薄膜化,並因應高容需求,而使層數再增加,但此設計會使MLCC累積應力,進而降低MLCC的可靠度。此外,在電鍍製程後發現電鍍鎳滲透至端電極中,會造成元件的異常,且產品發生龜裂的比例也隨之上升。Due to the current trend of product miniaturization, the thickness of MLCC components is also becoming thinner, and the number of layers is increased in response to the demand for high capacitance. However, this design will cause MLCC to accumulate stress, thereby reducing the reliability of MLCC. In addition, after the electroplating process, it was found that the electroplated nickel penetrated into the terminal electrode, causing component abnormalities and the proportion of product cracking also increased.
端電極可包覆內電極的鎳,故兼具保護效果。因此,端電極對於後續的酸性電鍍製程須具有抵抗能力,以防止電鍍鎳滲透至內電極。此外,可藉由降低端電極的燒附溫度,以降低MLCC內部應力,藉以提升薄層化MLCC的可靠度水準。The terminal electrode can cover the nickel of the inner electrode, so it also has a protective effect. Therefore, the terminal electrode must be resistant to the subsequent acid plating process to prevent the electroplated nickel from penetrating into the inner electrode. In addition, the internal stress of the MLCC can be reduced by lowering the sintering temperature of the terminal electrode, thereby improving the reliability level of the thin-layer MLCC.
有鑑於此,亟須提供一種端電極玻璃組成物及端電極銅膏,以強化端電極的抗酸能力,並降低端電極的燒附溫度。In view of this, it is urgent to provide a terminal electrode glass composition and a terminal electrode copper paste to enhance the acid resistance of the terminal electrode and reduce the sintering temperature of the terminal electrode.
本發明之一態樣是提供一種端電極玻璃組成物,其係包含特定的組成元素及含量,以達到降低燒附溫度及抗酸蝕的效果。One aspect of the present invention is to provide a terminal electrode glass composition, which contains specific constituent elements and contents to achieve the effects of lowering the sintering temperature and resisting acid corrosion.
本發明之另一態樣是提供一種端電極銅膏,其係包含上述態樣的端電極玻璃組成物。Another aspect of the present invention is to provide a terminal electrode copper paste, which comprises the terminal electrode glass composition of the above aspect.
本發明之再一態樣是提供一種多層陶瓷電容的製造方法,其係藉由較低的燒附溫度來製得多層陶瓷電容。Another aspect of the present invention is to provide a method for manufacturing a multi-layer ceramic capacitor, which is manufactured by using a lower sintering temperature.
本發明之再一態樣是提供一種多層陶瓷電容,其係利用上述態樣的方法所製得。Another aspect of the present invention is to provide a multi-layer ceramic capacitor, which is manufactured using the method of the above aspect.
根據本發明之一態樣,提供一種端電極玻璃組成物,其係包含第一主成分、第一副成分及第二副成分。第一主成分包含鹼土金屬氧化物;第一副成分包含鋅元素;而第二副成分包含鋁元素及矽元素。基於端電極玻璃組成物為100 wt%,第一主成分為70 wt%至75 wt%。基於第一主成分為100 wt%,第一副成分為25 wt%至30 wt%,且第二副成分為7 wt%至11 wt%。According to one aspect of the present invention, a terminal electrode glass composition is provided, which includes a first main component, a first auxiliary component and a second auxiliary component. The first main component includes an alkali metal oxide; the first auxiliary component includes a zinc element; and the second auxiliary component includes an aluminum element and a silicon element. Based on the terminal electrode glass composition being 100 wt%, the first main component is 70 wt% to 75 wt%. Based on the first main component being 100 wt%, the first auxiliary component is 25 wt% to 30 wt%, and the second auxiliary component is 7 wt% to 11 wt%.
根據本發明之一實施例,基於上述第一主成分為100 wt%,鋁元素的含量為5 wt%至7.9 wt%。According to one embodiment of the present invention, based on the first main component being 100 wt%, the content of the aluminum element is 5 wt% to 7.9 wt%.
根據本發明之一實施例,基於上述第一主成分為100 wt%,矽元素的含量為2 wt%至3.1 wt%。According to one embodiment of the present invention, based on the first main component being 100 wt%, the content of silicon element is 2 wt% to 3.1 wt%.
根據本發明之一實施例,上述矽元素與鋁元素的含量比例為不大於1/2。According to one embodiment of the present invention, the content ratio of the silicon element to the aluminum element is no more than 1/2.
根據本發明之一實施例,上述矽元素與鋁元素的含量比例為1/5至1/2。According to one embodiment of the present invention, the content ratio of the silicon element to the aluminum element is 1/5 to 1/2.
根據本發明之另一態樣,提供一種端電極銅膏,其係包含銅粉及上述態樣之端電極玻璃組成物。According to another aspect of the present invention, a terminal electrode copper paste is provided, which includes copper powder and the terminal electrode glass composition of the above aspect.
根據本發明之一實施例,基於上述銅粉為100 wt%,端電極玻璃組成物為9 wt%至11 wt%。According to one embodiment of the present invention, based on the copper powder being 100 wt%, the terminal electrode glass component is 9 wt% to 11 wt%.
根據本發明之再一態樣,提供一種多層陶瓷電容的製造方法。方法包含提供多層電容元件;塗佈上述態樣之端電極銅膏在多層電容元件上,以獲得多層陶瓷電容半成品;以及對多層陶瓷電容半成品進行燒附製程,以獲得多層陶瓷電容,其中燒附製程的燒附溫度為小於850℃。According to another aspect of the present invention, a method for manufacturing a multi-layer ceramic capacitor is provided. The method includes providing a multi-layer capacitor element; applying the terminal electrode copper paste of the above aspect on the multi-layer capacitor element to obtain a multi-layer ceramic capacitor semi-finished product; and performing a sintering process on the multi-layer ceramic capacitor semi-finished product to obtain the multi-layer ceramic capacitor, wherein the sintering temperature of the sintering process is less than 850°C.
根據本發明之一實施例,上述燒附溫度為760℃至小於850℃。According to one embodiment of the present invention, the sintering temperature is 760°C to less than 850°C.
根據本發明之再一態樣,提供一種多層陶瓷電容,其係利用上述態樣之多層陶瓷電容的製造方法所製得。According to another aspect of the present invention, a multi-layer ceramic capacitor is provided, which is manufactured using the manufacturing method of the multi-layer ceramic capacitor of the above aspect.
應用本發明之端電極玻璃組成物、端電極銅膏、多層陶瓷電容及其製造方法,以藉由具有特定組成元素及含量的端電極玻璃組成物,以提升端電極的抗酸蝕效果,並降低多層陶瓷電容製程中的燒附溫度,進而提升所得之多層陶瓷電容的可靠度。The terminal electrode glass composition, terminal electrode copper paste, multi-layer ceramic capacitor and the manufacturing method thereof of the present invention are applied to improve the acid corrosion resistance of the terminal electrode by using the terminal electrode glass composition having specific composition elements and contents, and reduce the sintering temperature in the multi-layer ceramic capacitor manufacturing process, thereby improving the reliability of the obtained multi-layer ceramic capacitor.
以下揭露提供許多不同實施例或例示,以實施發明的不同特徵。以下敘述之組件和配置方式的特定例示是為了簡化本揭露。這些當然僅是做為例示,其目的不在構成限制。舉例而言,第一特徵形成在第二特徵之上或上方的描述包含第一特徵和第二特徵有直接接觸的實施例,也包含有其他特徵形成在第一特徵和第二特徵之間,以致第一特徵和第二特徵沒有直接接觸的實施例。除此之外,本揭露在各種具體例中重覆元件符號及/或字母。此重覆的目的是為了使說明簡化且清晰,並不表示各種討論的實施例及/或配置之間有關係。The following disclosure provides many different embodiments or examples to implement different features of the invention. The specific examples of components and configurations described below are intended to simplify the disclosure. These are of course only examples and are not intended to be limiting. For example, a description of a first feature formed on or above a second feature includes embodiments in which the first feature and the second feature are in direct contact, and also includes embodiments in which other features are formed between the first feature and the second feature, so that the first feature and the second feature are not in direct contact. In addition, the disclosure repeats component symbols and/or letters in various specific examples. The purpose of this repetition is to simplify and clarify the description and does not represent a relationship between the various discussed embodiments and/or configurations.
以下仔細討論本發明實施例之製造和使用。然而,可以理解的是,實施例提供許多可應用的發明概念,其可實施於各式各樣的特定內容中。所討論之特定實施例僅供說明,並非用以限定本發明之範圍。The making and using of embodiments of the present invention are discussed in detail below. However, it will be appreciated that the embodiments provide many applicable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are for illustration only and are not intended to limit the scope of the present invention.
如本發明所使用的「大約(around)」、「約(about)」、「近乎 (approximately)」或「實質上(substantially)」一般係代表在所述之數值或範圍的百分之20以內、或百分之10以內、或百分之5以內。As used in the present invention, "around", "about", "approximately" or "substantially" generally means within 20%, within 10%, or within 5% of the stated value or range.
承上所述,本發明提供一種端電極玻璃組成物、端電極銅膏、多層陶瓷電容及其製造方法,以藉由具有特定組成元素及含量的端電極玻璃組成物,以提升端電極的抗酸蝕效果,並降低多層陶瓷電容製程中的燒附溫度,進而提升所得之多層陶瓷電容的可靠度。As described above, the present invention provides a terminal electrode glass composition, a terminal electrode copper paste, a multi-layer ceramic capacitor and a manufacturing method thereof, so as to enhance the acid corrosion resistance of the terminal electrode by using a terminal electrode glass composition having specific composition elements and contents, and reduce the sintering temperature in the multi-layer ceramic capacitor manufacturing process, thereby enhancing the reliability of the obtained multi-layer ceramic capacitor.
本發明的端電極玻璃組成物包含第一主成分、第一副成分及第二副成分。第一主成分包含鹼土金屬氧化物,其中鹼土金屬氧化物包含鈹(Be)、鎂(Mg)、鈣(Ca)、鍶(Sr)及/或鋇(Ba)的氧化物。在一些實施例中,基於端電極玻璃組成物為100 wt%,第一主成分的含量為約70 wt%至約75 wt%。若第一主成分的含量過少(例如小於約70 wt%),則後續端電極進行燒附時的溫度過高,則薄層化的多層陶瓷電容可能因內部應力過大可發生龜裂;反之,若第一主成分的含量太多(例如大於約75 wt%),則所得之端電極的抗酸蝕能力不佳,進而會導致多層陶瓷電容的可靠度下降。The terminal electrode glass composition of the present invention comprises a first main component, a first auxiliary component and a second auxiliary component. The first main component comprises an alkali earth metal oxide, wherein the alkali earth metal oxide comprises an oxide of benzene (Be), magnesium (Mg), calcium (Ca), strontium (Sr) and/or barium (Ba). In some embodiments, based on the terminal electrode glass composition being 100 wt%, the content of the first main component is about 70 wt% to about 75 wt%. If the content of the first main component is too small (e.g., less than about 70 wt%), the temperature of the subsequent terminal electrode during sintering is too high, and the thinned multi-layer ceramic capacitor may crack due to excessive internal stress; conversely, if the content of the first main component is too large (e.g., greater than about 75 wt%), the acid corrosion resistance of the obtained terminal electrode is poor, which will lead to a decrease in the reliability of the multi-layer ceramic capacitor.
上述第一副成分包含鋅元素,添加鋅元素有助於降低端電極的燒附溫度,並兼具與陶瓷電容元件的陶瓷材料黏合的功能。在一些具體例中,鋅元素的來源可為氧化鋅。在一些實施例中,基於第一主成分為100 wt%,第一副成分的添加量為約25 wt%至約30 wt%。若第一副成分的添加量太少(例如小於約25 wt%),則無法有效降低端電極的燒附溫度,且與陶瓷的黏結效果不佳;反之,若第一副成分的添加量太多(例如大於約30 wt%),則所得之端電極的抗酸蝕能力不佳,進而會導致多層陶瓷電容的可靠度下降。The first subcomponent mentioned above includes zinc element. The addition of zinc element helps to reduce the sintering temperature of the terminal electrode and has the function of bonding with the ceramic material of the ceramic capacitor element. In some specific examples, the source of the zinc element may be zinc oxide. In some embodiments, based on the first main component being 100 wt%, the addition amount of the first subcomponent is about 25 wt% to about 30 wt%. If the addition amount of the first subcomponent is too small (for example, less than about 25 wt%), the sintering temperature of the terminal electrode cannot be effectively reduced, and the bonding effect with the ceramic is not good; on the contrary, if the addition amount of the first subcomponent is too much (for example, greater than about 30 wt%), the resulting terminal electrode has poor acid corrosion resistance, which will lead to a decrease in the reliability of the multi-layer ceramic capacitor.
上述第二副成分包含鋁元素及矽元素,添加鋁元素及矽元素有助於抗酸蝕的能力。在一些具體例中,鋁元素的來源可為氧化鋁,而矽元素的來源可為氧化矽。在一些實施例中,基於第一主成分為100 wt%,第二副成分的添加量為約7 wt%至約11 wt%。若第二副成分的添加量太少(例如小於約7 wt%),則所得之端電極的抗酸蝕能力不佳;反之若第二副成分的添加量太多(例如大於約11 wt%),則無法有效降低端電極的燒附溫度。The second subcomponent includes aluminum and silicon. The addition of aluminum and silicon contributes to the ability to resist acid corrosion. In some specific examples, the source of aluminum may be aluminum oxide, and the source of silicon may be silicon oxide. In some embodiments, based on the first main component being 100 wt%, the amount of the second subcomponent added is about 7 wt% to about 11 wt%. If the amount of the second subcomponent added is too little (e.g., less than about 7 wt%), the resulting terminal electrode has poor acid corrosion resistance; conversely, if the amount of the second subcomponent added is too much (e.g., greater than about 11 wt%), the sintering temperature of the terminal electrode cannot be effectively reduced.
在一些實施例中,基於第一主成分為100 wt%,鋁元素的含量為5 wt%至7.9 wt%,而矽元素的含量為2 wt%至3.1 wt%。由於鋁元素與矽元素分別針對不同種類的酸有較佳的抗性,故當鋁元素及矽元素的添加量分別為前述範圍時,可使端電極的抗酸蝕效果更佳。In some embodiments, based on the first main component being 100 wt%, the content of aluminum is 5 wt% to 7.9 wt%, and the content of silicon is 2 wt% to 3.1 wt%. Since aluminum and silicon have better resistance to different types of acids, when the addition amounts of aluminum and silicon are respectively within the aforementioned ranges, the acid corrosion resistance of the terminal electrode can be better.
在一些實施例中,矽元素與鋁元素的含量比例為不大於1/2,較佳為約1/5至約1/2。當矽元素與鋁元素的含量比例控制為前述範圍時,可避免過多的矽元素影響降低燒附溫度的效果。In some embodiments, the content ratio of silicon to aluminum is no more than 1/2, preferably about 1/5 to about 1/2. When the content ratio of silicon to aluminum is controlled within the above range, the effect of reducing the sintering temperature due to excessive silicon can be avoided.
本發明的端電極銅膏包含銅粉及分散於銅粉中的端電極玻璃組成物。在一些實施例中,基於銅粉為100 wt%,端電極銅膏包含約9 wt%至約11 wt%的端電極玻璃組成物。具有前述含量範圍的端電極玻璃組成物,可使端電極銅膏在燒附後具有較高的表面緻密度及適當的導電度。The terminal electrode copper paste of the present invention comprises copper powder and a terminal electrode glass composition dispersed in the copper powder. In some embodiments, based on 100 wt% of the copper powder, the terminal electrode copper paste comprises about 9 wt% to about 11 wt% of the terminal electrode glass composition. The terminal electrode glass composition having the above content range can make the terminal electrode copper paste have a higher surface density and appropriate conductivity after sintering.
請參閱圖1,其係繪示根據本發明一些實施例之多層陶瓷電容100的剖面視圖。以下利用圖1說明多層陶瓷電容的製造方法。首先,提供多層電容元件110,其中多層電容元件包含內電極120。將上述之端電極銅膏塗佈在多層電容元件110兩側上,以獲得多層陶瓷電容半成品。接著,對多層陶瓷電容半成品進行燒附製程,以將端電極銅膏燒附成端電極130,製得多層陶瓷電容100。Please refer to FIG. 1, which is a cross-sectional view of a multilayer
在一些實施例中,上述燒附製程的燒附溫度為小於約850℃,較佳為約760℃至小於約850℃,更佳為約760℃。習知須利用850℃以上的燒附溫度才可使所製得之端電極具有95%緻密的水準,但會使應力累積劇增,而導致所得之多層陶瓷電容的龜裂風險提高,且可靠度測試僅有50%的良率。相對地,本發明在降低燒附溫度的情況下,仍可使端電極具有95%以上的緻密水準,且可靠度測試更具有95%的通過水準。補充說明的是,前述可靠度測試主要是指針對電性之絕緣電阻於85℃的額定電壓下,測試500小時,若絕緣電阻都沒有下降,即定義為可通過的水準。In some embodiments, the sintering temperature of the sintering process is less than about 850°C, preferably about 760°C to less than about 850°C, and more preferably about 760°C. It is known that a sintering temperature of more than 850°C is required to make the terminal electrode have a 95% density level, but the stress accumulation will increase dramatically, resulting in an increased risk of cracking of the obtained multi-layer ceramic capacitor, and the reliability test has only a 50% yield. In contrast, the present invention can still make the terminal electrode have a density level of more than 95% under the condition of lowering the sintering temperature, and the reliability test has a passing level of 95%. It should be noted that the aforementioned reliability test mainly refers to the insulation resistance of the electrical property, which is tested at a rated voltage of 85°C for 500 hours. If the insulation resistance does not decrease, it is defined as a passing level.
習知若欲製作介電層厚度僅為約0.8μm,且具有近兩百層的有效面積層數的多層陶瓷電容,其殘存應力所造成的風險較高,且可靠度檢驗良率不高。然而,應用本發明之端電極玻璃組成物及端電極銅膏可藉由降低燒附溫度,而減少應力造成的影響。It is known that if a multi-layer ceramic capacitor with a dielectric layer thickness of only about 0.8 μm and an effective area of nearly 200 layers is to be manufactured, the risk caused by residual stress is relatively high and the reliability test yield is not high. However, the application of the terminal electrode glass composition and the terminal electrode copper paste of the present invention can reduce the influence of stress by lowering the sintering temperature.
再者,由於端電極除了燒附銅之外,還須利用電鍍製程電鍍鎳及錫於銅上,而本發明之端電極玻璃組成物及端電極銅膏於燒附後,在低於pH 5的電鍍酸液中,被侵蝕的面積可低於1%。因此,所製得之多層陶瓷電容可具有高可靠度,而有利於量產。Furthermore, in addition to sintering copper, the terminal electrode also needs to use an electroplating process to electroplate nickel and tin on copper. After sintering, the terminal electrode glass composition and the terminal electrode copper paste of the present invention can be corroded less than 1% in an electroplating acid solution with a pH lower than 5. Therefore, the multi-layer ceramic capacitor produced can have high reliability and is conducive to mass production.
以下利用數個實施例以說明本發明之應用,然其並非用以限定本發明,本發明技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。 實驗例1至9 Several examples are used below to illustrate the application of the present invention, but they are not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make various changes and modifications without departing from the spirit and scope of the present invention. Experimental Examples 1 to 9
實驗例1至9係混合鹼土金屬氧化物、氧化鋅、氧化鋁及氧化矽,以製備端電極玻璃組成物。以鹼土金屬氧化物為100 wt%,實驗例1至9分別以不同比例的氧化鋅、氧化鋁及氧化矽進行混合,其混合比例如表一所示。Experimental Examples 1 to 9 are to mix alkaline earth metal oxide, zinc oxide, aluminum oxide and silicon oxide to prepare the terminal electrode glass composition. Alkaline earth metal oxide is 100 wt%, and Experimental Examples 1 to 9 are respectively mixed with zinc oxide, aluminum oxide and silicon oxide in different proportions, and the mixing ratios are shown in Table 1.
將實驗例1至9的端電極玻璃組成物與銅粉混合成端電極銅膏,其中相對於銅粉,端電極玻璃組成物的含量為12 wt%。接著,利用760℃(±5℃)的溫度進行燒附,以量測端電極之銅層表面緻密度,量測結果如下表一所示。The terminal electrode glass composition of Experimental Examples 1 to 9 was mixed with copper powder to form a terminal electrode copper paste, wherein the content of the terminal electrode glass composition relative to the copper powder was 12 wt%. Then, the surface density of the copper layer of the terminal electrode was measured by sintering at a temperature of 760°C (±5°C). The measurement results are shown in Table 1 below.
補充說明的是,銅層表面緻密度的量測步驟包含將燒附後的端電極以掃描式電子顯微鏡(scanning electron microscope,SEM)以3k的倍率拍攝端電極表面。接著,以繪圖軟體計算孔洞占比後得到表面緻密度。若孔洞愈少,則表面緻密度愈大。若有過燒的現象,則可於端電極表面觀察到玻璃大量析出,其會增加端電極表面阻值,並降低後續的電鍍效率。It should be noted that the measurement step of the copper layer surface density includes photographing the end electrode surface with a scanning electron microscope (SEM) at a magnification of 3k after the end electrode is burned. Then, the surface density is obtained by calculating the hole ratio with drawing software. The fewer the holes, the greater the surface density. If there is overburning, a large amount of glass precipitation can be observed on the surface of the end electrode, which will increase the surface resistance of the end electrode and reduce the subsequent electroplating efficiency.
表一
根據表一,雖然實驗例1及實驗例6的端電極玻璃組成物的表面緻密度為過燒,但過燒表示有機會得到較符合標準的表面緻密度(即95%~100%),故使用實驗例1及實驗例6之端電極玻璃組成物的配方,並改變端電極玻璃組成物與銅粉的混合比例,以製得實驗例1-1至1-5及實驗例6-1至6-5的端電極,並利用與上述相同的條件,來量測銅層表面緻密度,其混合比例與表面緻密度如下表二所示。According to Table 1, although the surface density of the terminal electrode glass composition of Experimental Examples 1 and 6 is over-burned, over-burning means that there is a chance to obtain a surface density that is more in line with the standard (i.e., 95%~100%). Therefore, the formula of the terminal electrode glass composition of Experimental Examples 1 and 6 is used, and the mixing ratio of the terminal electrode glass composition and the copper powder is changed to prepare the terminal electrodes of Experimental Examples 1-1 to 1-5 and Experimental Examples 6-1 to 6-5. The surface density of the copper layer is measured using the same conditions as above. The mixing ratio and surface density are shown in Table 2 below.
表二 Table 2
根據表二,實驗例1、實驗例6及實驗例6-1檢測表面緻密度的結果為過燒,其表示有玻璃大量析出的情形,可能導致導電度下降;而實驗例1-4、實驗例1-5、實驗例6-4及實驗例6-5則因包含太少量的端電極玻璃組成物,而無法達到符合標準的表面緻密度。因此,選擇實驗例1-1至實驗例1-3、實驗例6-2及實驗例6-3進行進一步的測試。According to Table 2, the results of the surface density test of Experimental Examples 1, 6 and 6-1 are over-burned, which means that a large amount of glass is precipitated, which may cause the conductivity to decrease; while Experimental Examples 1-4, 1-5, 6-4 and 6-5 cannot reach the surface density that meets the standard because they contain too little end electrode glass composition. Therefore, Experimental Examples 1-1 to 1-3, Experimental Examples 6-2 and Experimental Examples 6-3 were selected for further testing.
將實驗例1-1至實驗例1-3、實驗例6-2及實驗例6-3燒附後的端電極於低於pH 5的電鍍酸液中,觀察銅層表面被酸蝕的面積比例。補充說明的是,銅層酸蝕面積比例的測試步驟包含先將燒附後的端電極浸泡於電鍍鎳酸液內,且其浸泡條件為溫度60℃,浸泡2小時。浸泡後進行清洗及乾燥,然後以掃描式電子顯微鏡拍攝,然後以製圖軟體計算酸蝕後表面緻密性的變化。另外,將實驗例1-1至實驗例1-3、實驗例6-2及實驗例6-3燒附後的端電極進行可靠度測試,即於85℃的額定電壓下,測試500小時,以量測絕緣電阻的衰退比例。前述兩種測試結果如下表三所示。The sintered terminal electrodes of Experimental Examples 1-1 to 1-3, Experimental Examples 6-2 and Experimental Examples 6-3 were placed in an electroplating acid solution with a pH lower than 5, and the area ratio of the copper layer surface etched by acid was observed. It is to be noted that the test step of the area ratio of copper layer etched by acid includes first immersing the sintered terminal electrodes in an electroplating nickel acid solution at a temperature of 60°C for 2 hours. After immersion, the electrodes were cleaned and dried, and then photographed with a scanning electron microscope, and then the changes in surface density after acid etching were calculated using a mapping software. In addition, the terminal electrodes of Experimental Examples 1-1 to 1-3, Experimental Examples 6-2 and Experimental Examples 6-3 were subjected to reliability testing after sintering, that is, the test was conducted at a rated voltage of 85°C for 500 hours to measure the degradation ratio of the insulation resistance. The above two test results are shown in Table 3 below.
表三
根據表三,實驗例1-1至實驗例1-3的酸蝕面積比例皆小於1%,且絕緣電阻的衰退比例皆不大於5%;相對地,實驗例6-2及實驗例6-3的酸蝕面積比例及絕緣電阻衰退比例都較高。因此,由上述實驗例可得知,使用特定組成比例之端電極玻璃組成物的實驗例1-1至實驗例1-3,並以特定比例的端電極玻璃組成物與銅粉混合後所製得之端電極銅膏在經過較低溫度的燒附製程後,仍可具有高表面緻密度,酸蝕面積比例低,且長時間高溫下的絕緣電阻衰退比例低。According to Table 3, the acid etched area ratios of Experimental Examples 1-1 to 1-3 are all less than 1%, and the insulation resistance degradation ratios are all no more than 5%; in contrast, the acid etched area ratios and insulation resistance degradation ratios of Experimental Examples 6-2 and 6-3 are both higher. Therefore, it can be seen from the above experimental examples that the terminal electrode copper paste prepared by mixing the terminal electrode glass composition with copper powder in a specific ratio in Experimental Examples 1-1 to 1-3 can still have a high surface density, a low acid etched area ratio, and a low insulation resistance degradation ratio under long-term high temperature after a relatively low temperature sintering process.
根據上述實施例,本發明提供之端電極玻璃組成物、端電極銅膏、多層陶瓷電容及其製造方法可藉由具有特定組成元素及含量的端電極玻璃組成物,以提升端電極的抗酸蝕效果,並降低多層陶瓷電容製程中的燒附溫度,進而提升所得之多層陶瓷電容的可靠度。According to the above embodiments, the terminal electrode glass composition, terminal electrode copper paste, multi-layer ceramic capacitor and the manufacturing method thereof provided by the present invention can enhance the acid corrosion resistance of the terminal electrode by using the terminal electrode glass composition having specific composition elements and contents, and reduce the sintering temperature in the multi-layer ceramic capacitor manufacturing process, thereby enhancing the reliability of the obtained multi-layer ceramic capacitor.
雖然本發明已以數個實施例揭露如上,然其並非用以限定本發明,在本發明所屬技術領域中任何具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed as above with several embodiments, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the scope of the attached patent application.
100:多層陶瓷電容 110:多層電容元件 120:內電極 130:端電極100: Multi-layer ceramic capacitor 110: Multi-layer capacitor element 120: Internal electrode 130: Terminal electrode
根據以下詳細說明並配合附圖閱讀,使本揭露的態樣獲致較佳的理解。需注意的是,如同業界的標準作法,許多特徵並不是按照比例繪示的。事實上,為了進行清楚討論,許多特徵的尺寸可以經過任意縮放。 [圖1]係繪示根據本發明一些實施例之多層陶瓷電容的剖面視圖。 The present disclosure is best understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, as is standard practice in the industry, many features are not drawn to scale. In fact, for the sake of clarity of discussion, the dimensions of many features may be arbitrarily scaled. [Figure 1] shows a cross-sectional view of a multi-layer ceramic capacitor according to some embodiments of the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None
100:多層陶瓷電容 100: Multi-layer ceramic capacitor
110:多層電容元件 110: Multi-layer capacitor element
120:內電極 120: Inner electrode
130:端電極 130: terminal electrode
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| CN1965381A (en) * | 2004-06-09 | 2007-05-16 | 费罗公司 | Copper termination inks containing lead free and cadmium free glasses for capacitors |
| CN101238531A (en) * | 2005-08-10 | 2008-08-06 | 费罗公司 | Copper Termination Ink Containing Lead-Free and Cadmium-Free Glass for Capacitors |
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| CN1965381A (en) * | 2004-06-09 | 2007-05-16 | 费罗公司 | Copper termination inks containing lead free and cadmium free glasses for capacitors |
| CN101238531A (en) * | 2005-08-10 | 2008-08-06 | 费罗公司 | Copper Termination Ink Containing Lead-Free and Cadmium-Free Glass for Capacitors |
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