TWI881454B - Antenna structure - Google Patents
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本發明係有關一種天線,尤指一種直立式的焊接於電路板上的天線結構。The present invention relates to an antenna, in particular to an upright antenna structure welded on a circuit board.
隨著網路的普及,人們對於網路的日漸依賴,也發展出越來越多上網裝置,例如Wi-Fi產品、網通產品、物聯網、網路攝影機(IP CAM)、路由器或數據機等設備。而在這些設備所使用的天線結構大多數都是在電路板上的銅箔製作不同的輻射層圖案來進行訊號的接收與傳遞。As the Internet becomes more popular, people are becoming more and more dependent on it, and more and more Internet devices have been developed, such as Wi-Fi products, network communication products, Internet of Things, network cameras (IP CAM), routers or modems, etc. Most of the antenna structures used in these devices are made of copper foil on the circuit board with different radiation layer patterns to receive and transmit signals.
過去的天線結構的設計上,是備有一印刷電路板,分別在該印刷電路板的正面及背面製作有該高頻輻射層及該低頻輻射層的圖案,透過該高頻輻射層與該低頻輻射層在與主機板的接地層電性連結後,由該高頻輻射層與該低頻輻射層耦合出可以收發頻率的頻寬。由於前述的該高頻輻射層與低頻輻射層雖然設於該印刷電路板的正面及背面,但是高頻輻射層與低頻輻射層兩者卻形成彼此相互重疊,導致相互干擾、阻擋或遮蔽,造成天線結構的收發效能特性降低。In the design of the antenna structure in the past, a printed circuit board is provided, and the patterns of the high-frequency radiation layer and the low-frequency radiation layer are respectively made on the front and back of the printed circuit board. After the high-frequency radiation layer and the low-frequency radiation layer are electrically connected to the ground layer of the motherboard, the high-frequency radiation layer and the low-frequency radiation layer are coupled to produce a bandwidth that can receive and transmit frequencies. Although the high-frequency radiation layer and the low-frequency radiation layer are disposed on the front and back of the printed circuit board, the high-frequency radiation layer and the low-frequency radiation layer overlap each other, causing mutual interference, blocking or shielding, resulting in a reduction in the transmitting and receiving performance characteristics of the antenna structure.
以目前使用之天線結構居多數都是屬於直立式的焊接於電子裝置的主機板上。在直立式的天線結構與主機板焊接時,該天線結構是直接將電路板上的電極層與主機板的電極層焊接,由於該天線結構的電極層使用的面積大或者數量較多,相對所使用的銅材料也相對的多,因此會導致製作成本的增加。又,在直立式的天線結構與主機板焊接時,該主機板上焊接該天線結構的位置上必需鑽一個或數個孔,使該天線結構可以直接以直立式的插入該孔中,讓該天線結構上的電極層可以與孔邊緣的電極層電性固接。如此一來,雖然讓天線結構可以直立式的焊接在主機板上,但是這樣的設計將要破壞主機板原有的結構設計,因此造成製作上的費工、費時的麻煩程序。Most of the antenna structures currently used are vertically welded on the motherboard of the electronic device. When the vertical antenna structure is welded to the motherboard, the antenna structure directly welds the electrode layer on the circuit board to the electrode layer of the motherboard. Since the electrode layer of the antenna structure is used in a large area or in large quantities, the copper material used is relatively large, which will lead to an increase in manufacturing costs. In addition, when the vertical antenna structure is welded to the motherboard, one or more holes must be drilled at the position of the motherboard where the antenna structure is welded, so that the antenna structure can be directly inserted into the hole in a vertical manner, so that the electrode layer on the antenna structure can be electrically fixed to the electrode layer at the edge of the hole. In this way, although the antenna structure can be welded upright on the motherboard, such a design will destroy the original structural design of the motherboard, thus resulting in a labor-intensive and time-consuming manufacturing process.
再者,直立式的天線結構的輻射層在設計過程中,當輻射層的收發頻率要達到某一特定收發頻率時,若是受到天線結構本體的面積不夠時,將會導致輻射層的圖案形狀不易設計,就必需在主機板上再製作一個輻射層與該天線結構上的輻射層電性連結,以延伸天線結構的輻射層長度。如此一來,將增加天線結構與主機板在製作的困難度。Furthermore, during the design process of the radiation layer of the vertical antenna structure, when the receiving and transmitting frequency of the radiation layer is to reach a certain receiving and transmitting frequency, if the area of the antenna structure itself is insufficient, it will make it difficult to design the pattern shape of the radiation layer, and it is necessary to make another radiation layer on the motherboard to electrically connect with the radiation layer on the antenna structure to extend the length of the radiation layer of the antenna structure. This will increase the difficulty of manufacturing the antenna structure and the motherboard.
所以,要如何來讓天線結構的收發頻率效能特性,以及降低天線結構製作成本,且又不會破壞原有主機板的結構設計,又可以依天線結構的收發頻率所需來延長輻射層的長度,乃是本發明主要解決的課題。Therefore, how to improve the receiving and transmitting frequency performance characteristics of the antenna structure and reduce the manufacturing cost of the antenna structure without destroying the original motherboard structure design and extending the length of the radiation layer according to the receiving and transmitting frequency of the antenna structure is the main problem to be solved by the present invention.
因此,本發明之主要目的,在於解決傳統缺失,本發明將天線結構重新設計,使天線結構上的高頻輻射層與低頻輻射層彼此之間不相互重疊、干擾、阻導或遮蔽,並可以降低天線結構的製作成本,且又不會破壞原有主機板的結構設計,更可以依天線結構的收發頻率所需來延長輻射層的長度。Therefore, the main purpose of the present invention is to solve the traditional defects. The present invention redesigns the antenna structure so that the high-frequency radiation layer and the low-frequency radiation layer on the antenna structure do not overlap, interfere, block or shield each other, and can reduce the manufacturing cost of the antenna structure without destroying the original structural design of the motherboard. The length of the radiation layer can be extended according to the transmission and reception frequency of the antenna structure.
為達上述之目的,本發明提供一種天線結構,係以電性固接於在電子裝置的主機板,包括:一電路板、一高頻輻射層及一低頻輻射層。該電路板呈一方形體,其上具有一正面、一背面、一頂邊、一底邊及二側邊。該高頻輻射層係設於該電路板的該正面上,其上具有一高頻耦合邊。該低頻輻射層係設於該電路板的該背面上,其上具有一低頻耦合邊。其中,該高頻輻射層與該低頻輻射層兩者不相互重疊,並以該高頻耦合邊與該低頻耦合邊進行耦合出該天線結構的收發頻率的頻寬。To achieve the above-mentioned purpose, the present invention provides an antenna structure, which is electrically fixed to a motherboard of an electronic device, comprising: a circuit board, a high-frequency radiation layer and a low-frequency radiation layer. The circuit board is a square body, having a front side, a back side, a top side, a bottom side and two side sides. The high-frequency radiation layer is disposed on the front side of the circuit board, and has a high-frequency coupling side thereon. The low-frequency radiation layer is disposed on the back side of the circuit board, and has a low-frequency coupling side thereon. The high-frequency radiation layer and the low-frequency radiation layer do not overlap each other, and the high-frequency coupling edge and the low-frequency coupling edge are used to couple out the bandwidth of the receiving and transmitting frequency of the antenna structure.
在本發明之一實施例中,該高頻耦合邊包含有一高頻直線邊及一高頻斜線邊。In an embodiment of the present invention, the high-frequency coupling edge includes a high-frequency straight edge and a high-frequency oblique edge.
在本發明之一實施例中,該高頻輻射層設於該電路板的該正面上,並對應該電路板的該背面包含有一裸空區,該裸空區更設有另一個高頻輻射層,以該背面的裸空區的該高頻輻射層與該正面的該高頻輻射層重疊並電性連結,以形成一個雙路徑的該高頻輻射層。In one embodiment of the present invention, the high-frequency radiation layer is disposed on the front side of the circuit board, and the back side of the circuit board includes a bare area, and the bare area is further provided with another high-frequency radiation layer. The high-frequency radiation layer in the bare area on the back side overlaps and is electrically connected with the high-frequency radiation layer on the front side to form a dual-path high-frequency radiation layer.
在本發明之一實施例中,該低頻輻射層包含有一第一低頻輻射層及一第二低頻輻射層;另,該第一低頻輻射層係設於該電路板的該背面上,該第一低頻輻射層包含有該低頻耦合邊,該低頻頻耦合邊包含有一低頻直線邊及一低頻斜線邊。In an embodiment of the present invention, the low-frequency radiation layer includes a first low-frequency radiation layer and a second low-frequency radiation layer; in addition, the first low-frequency radiation layer is disposed on the back surface of the circuit board, and the first low-frequency radiation layer includes the low-frequency coupling edge, and the low-frequency coupling edge includes a low-frequency straight edge and a low-frequency oblique edge.
在本發明之一實施例中,該第二低頻輻射層為U形的設於該電路板的正面的一裸空區上,並與該電路板的背面的該第一低頻輻射層重疊並電性連結,以形成雙路徑的低頻輻射層。In one embodiment of the present invention, the second low-frequency radiation layer is U-shaped and disposed on a bare area on the front side of the circuit board, and overlaps and is electrically connected to the first low-frequency radiation layer on the back side of the circuit board to form a dual-path low-frequency radiation layer.
在本發明之一實施例中,該高頻輻射層的頻率為5.15GHZ~5.85GH Z及5.925GH Z~7.125GH Z。 In one embodiment of the present invention, the frequency of the high frequency radiation layer is 5.15 GHZ~5.85 GH Z and 5.925 GH Z ~7.125 GH Z.
在本發明之一實施例中,該低頻輻射層頻率為2.4GH Z~2.5GH Z。 In one embodiment of the present invention, the frequency of the low frequency radiation layer is 2.4 GHz ~ 2.5 GHz .
在本發明之一實施例中,該高頻耦合邊及該低頻耦合邊為對稱或非對稱的圖形設計。In one embodiment of the present invention, the high-frequency coupling edge and the low-frequency coupling edge are symmetrical or asymmetrical in graphic design.
在本發明之一實施例中,該高頻耦合邊及該低頻耦合邊為直線邊、斜邊或多邊形,或者混合兩種以上的形狀。In one embodiment of the present invention, the high-frequency coupling edge and the low-frequency coupling edge are straight edges, oblique edges, polygons, or a mixture of two or more shapes.
在本發明之一實施例中,該高頻耦合邊與該低頻耦合邊之間具有一耦合間距。In one embodiment of the present invention, there is a coupling distance between the high-frequency coupling edge and the low-frequency coupling edge.
在本發明之一實施例中,該耦合間距為0mm~8mm。In one embodiment of the present invention, the coupling distance is 0 mm to 8 mm.
在本發明之一實施例中,該耦合間距為0mm~3mm。In one embodiment of the present invention, the coupling distance is 0 mm to 3 mm.
在本發明之一實施例中,該電路板的該底邊更包含有半孔電極層,其一該半孔電極層係與該電路板的該正面的該高頻輻射層及該背面的一裸空區的一電極層電性連結,以及另一個該半孔電極層與該電路板的該背面的該低頻輻射層及該正面的一裸空區的一電極層電性連結。In one embodiment of the present invention, the bottom edge of the circuit board further includes a half-hole electrode layer, one of the half-hole electrode layers is electrically connected to the high-frequency radiation layer on the front side of the circuit board and an electrode layer in a bare area on the back side, and the other half-hole electrode layer is electrically connected to the low-frequency radiation layer on the back side of the circuit board and an electrode layer in a bare area on the front side.
在本發明之一實施例中,該電路板的該底邊更包含有半孔電極層,其一該半孔電極層係與該電路板的該正面的該高頻輻射層及該背面的一裸空區的另一高頻輻射層電性連結,以及另一個該半孔電極層與該電路板的該背面的該低頻輻射層的一第一低頻輻射層及該正面的一裸空區的一第二低頻輻射層電性連結。In one embodiment of the present invention, the bottom edge of the circuit board further includes a half-hole electrode layer, one of the half-hole electrode layers is electrically connected to the high-frequency radiation layer on the front side of the circuit board and another high-frequency radiation layer in a bare area on the back side, and the other half-hole electrode layer is electrically connected to a first low-frequency radiation layer of the low-frequency radiation layer on the back side of the circuit board and a second low-frequency radiation layer in a bare area on the front side.
在本發明之一實施例中,該電路板的其一該側邊或該頂邊上更包含有一半孔電極層,該半孔電極層與該高頻輻射層電性連結,使該天線結構的輻射場型圖更佳。In one embodiment of the present invention, one of the side edges or the top edge of the circuit board further includes a half-hole electrode layer, and the half-hole electrode layer is electrically connected to the high-frequency radiation layer, so that the radiation pattern of the antenna structure is better.
在本發明之一實施例中,該半孔電極層為半圓形、半橢圓形或多邊形。In one embodiment of the present invention, the semi-hole electrode layer is semi-circular, semi-elliptical or polygonal.
在本發明之一實施例中,該電路板的該頂邊或其一該側邊更包含有一側邊輻射層,以該側邊輻射層與該高頻輻射層電性連結,使該天線結構的輻射場型圖更佳。In one embodiment of the present invention, the top side or one of the sides of the circuit board further includes a side radiation layer, and the side radiation layer is electrically connected to the high-frequency radiation layer to make the radiation pattern of the antenna structure better.
在本發明之一實施例中,該主機板的正面及背面各具有一相對稱的一第一接地層、一第二接地層、一第一淨空區及一第二淨空區,該第一淨空區上具有一第一電極固接層及一第二電極固接層;另,於該主機板該正面具有一與該第一接地層耦合的訊號饋入層,該訊號饋入層係與該第一電極固接層電性連結。In one embodiment of the present invention, the front and back sides of the motherboard each have a symmetrical first grounding layer, a second grounding layer, a first clear area and a second clear area, and the first clear area has a first electrode fixing layer and a second electrode fixing layer; in addition, a signal feeding layer coupled with the first grounding layer is provided on the front side of the motherboard, and the signal feeding layer is electrically connected to the first electrode fixing layer.
在本發明之一實施例中,該第一電極固接層及該第二電極固接層分別各電性連結一匹配元件與第一接地層電性連結,以該匹配元件來調整天線特性。In one embodiment of the present invention, the first electrode fixing layer and the second electrode fixing layer are respectively electrically connected to a matching element and the first ground layer, and the antenna characteristics are adjusted by the matching element.
在本發明之一實施例中,該第一淨空區及該第二淨空區的長度為10mm~20mm及寬度為3mm~8mm。In one embodiment of the present invention, the length of the first clear area and the second clear area is 10 mm to 20 mm and the width is 3 mm to 8 mm.
茲有關本發明之技術內容及詳細說明,現在配合圖式說明如下:The technical content and detailed description of the present invention are now described as follows with reference to the drawings:
請參閱圖1~4,係本發明之第一實施例的天線結構及主機板分解、圖1的另一視角的天線結構與主機板的分解、圖1及圖2的立體組合示意圖。如圖所示:本發明的直立式的天線結構,該天線結構10包含:一電路板1、一高頻輻射層2及一低頻輻射層3。其中,以該高頻輻射層2與該低頻輻射層3彼此之間不相互重疊、干擾、阻擋或遮蔽,以增加天線收發效能。Please refer to Figures 1 to 4, which are the antenna structure and motherboard decomposition of the first embodiment of the present invention, the decomposition of the antenna structure and motherboard from another perspective of Figure 1, and the three-dimensional combination schematic diagram of Figures 1 and 2. As shown in the figure: the vertical antenna structure of the present invention, the
該電路板1,係呈一方形體,其上具有一正面11、一背面12、一頂邊13、一底邊14及二側邊15。在本圖式中,該電路板1為印刷電路板。The
該高頻輻射層2,係設於該電路板1的正面11上,該高頻輻射層2設有一高頻耦合邊21,該高頻耦合邊21包含有一高頻直線邊211及一高頻斜線邊212。在本圖式中,該高頻輻射層2的頻率為5.15GH
Z~5.85GH
Z及5.925GH
Z~7.125GH
Z。
The high
值得一提的事,該高頻輻射層2設於該電路板1的正面11上,對應該電路板1的背面12更包含有一裸空區121,該裸空區121更設有一電極層5或另一個高頻輻射層(圖中未示),該背面12的裸空區121的高頻輻射層與該電路板1的正面11的高頻輻射層2重疊並電性連結,以形成一個雙路徑的高頻輻射層2設計,以增加天線結構10的收發效能。It is worth mentioning that the high-
低頻輻射層3,包含有一第一低頻輻射層31及一第二低頻輻射層32。另,該第一低頻輻射層31係設於該電路板1的背面12上,與該高頻輻射層2彼此之間不相互重疊、干擾、阻擋或遮蔽,該第一低頻輻射層31同樣地具有一低頻耦合邊33,該低頻耦合邊33包含有一低頻直線邊331及一低頻斜線邊332。又,該第二低頻輻射層32為U形的設於該電路板1的正面11的裸空區111上,並與該電路板1的背面12的該第一低頻輻射層31重疊並電性連結。由於該低頻輻射層3的第一低頻輻射層31及一第二低頻輻射層32分別設於該電路板1的正面11及背面12,以形成雙路徑的低頻輻射層3設計,可以提升低頻輻射層3的效率。在本圖式中,該低頻輻射層3頻率為2.4GH
Z~2.5GH
Z。
The low-
在本發明之天線結構10與電子裝置的主機板20運用時,該主機板20的正面及背面各具有一相對稱的一第一接地層201、一第二接地層202、一第一淨空區203及一第二淨空區204。該主機板20的第一淨空區203上具有一第一電極固接層205及一第二電極固接層206。另,於主機板201正面具有一與該第一接地層201耦合的訊號饋入層207,該訊號饋入層207係與該第一電極固接層205電性連結,同時該第一電極固接層205及該第二電極固接層206分別各電性連結一匹配元件(電感器或電容器)(圖中未示)與第一接地層201電性連結,以匹配元件來調整天線特性,可以調整天線最佳收發效果。在本圖式中,該第一淨空區203及該第二淨空區204的長度(L)為10mm~20mm及寬度(W)為3mm~8mm。When the
在該天線結構10與該主機板20進行焊接時,將該電路板1上的高頻輻射層2及電極層5與該第一電極固接層205電性固接,該低頻輻射層3的第一低頻輻射層31及第二低頻輻射層32與該第二電極固接層206電性固接。When the
請參閱圖5,係本發明之第一實施例的天線結構正面視示意圖。如圖所示:本發明之天線結構10的高頻輻射層2及低頻輻射層3分別設於該電路板1的正面11及背面12上,且該高頻輻射層2及該低頻輻射層3彼此之間不相互重疊、干擾、阻擋或遮蔽,並以該高頻輻射層2的該高頻耦合邊21與該低頻輻射層3的該低頻耦合邊33進行耦合出天線結構10的收發頻率特性及效能。Please refer to FIG5, which is a front view schematic diagram of the antenna structure of the first embodiment of the present invention. As shown in the figure: the high-
而且,以該高頻輻射層2與該低頻輻射層3的該高頻耦合邊21、低頻耦合邊33,可以使用對稱或非對稱的圖形設計,例如直線邊、斜邊或多邊形,或者混合兩種以上的形狀的變化,可以使該高頻輻射層2及該低頻輻射層3的頻寬增加。Moreover, the high-
此外,更以該高頻輻射層2的該高頻耦合邊21與該低頻輻射層3的該低頻耦合邊33之間的耦合間距30來達到要求天線結構10的特性。對比過去舊有的天線結構的高頻輻射層與低頻輻射層彼此之間是相互重疊、干擾、阻擋或遮蔽,本發明之天線結構10的高頻輻射層與低頻輻射層彼此之間不相互重疊、干擾、阻擋或遮蔽,可以讓天線結構10的效率、場型、實測數據皆提升。在本圖式中,該耦合間距30為0mm~8mm,以0mm~3mm為最佳。In addition, the
請參閱圖6,係本發明之第二實施例的天線結構的外觀立體示意圖。如圖所示:本實施例與第一實施例大致相同,所不同處係在該電路板1上更包含有半孔電極層4,該半孔電極層4分別設於該電路板1的底邊14上,其一該半孔電極層4係與該電路板1的正面11的高頻輻射層2及背面12的裸空區121的電極層5或另一高頻輻射層(圖中未示)電性連結,以及另一個該半孔電極層4與該電路板1的背面12的低頻輻射層3或第一低頻輻射層31及正面11的裸空區111的電極層(圖中未示)或第二低頻輻射層32電性連結。Please refer to FIG. 6 , which is a three-dimensional schematic diagram of the antenna structure of the second embodiment of the present invention. As shown in the figure: this embodiment is substantially the same as the first embodiment, except that the
該半孔電極層4的設計,係以降低天線結構10的製作成本,且在不破壞原有的主機板20結構的原則下,可以使該天線結構10與該主機板20上的第一電極固接層205及第二電極固接層206電性固接在一起。在本圖式中,該半孔電極層4為半圓形、半橢圓形或多邊形。The design of the half-
請參閱圖7,係本發明之第三實施例的天線結構的外觀立體示意圖。如圖所示:本實施例與第一、二實施例大致相同,所不同處係在於該半孔電極層4a除了可以設於該底邊14上當電極層使用外,該半孔電極4a還可以設於該電路板1的頂邊13上與該高頻輻射層2電性連結,使天線結構10的輻射場型圖更佳,以提升天線結構的收發效能及增益。Please refer to FIG. 7, which is a three-dimensional schematic diagram of the antenna structure of the third embodiment of the present invention. As shown in the figure: this embodiment is substantially the same as the first and second embodiments, except that the half-
請參閱圖8,係本發明之第四實施例的天線結構的外觀立體示意圖。如圖所示:本實施例與第一、二實施例大致相同,所不同處係在於電路板1的頂邊13或其一側邊15上更包含有一側邊輻射層6,以該側邊輻射層6與該高頻輻射層2電性連結,使天線結構10的輻射場型圖更佳,以提升天線結構10的收發效能及增益。Please refer to FIG8 , which is a three-dimensional schematic diagram of the antenna structure of the fourth embodiment of the present invention. As shown in the figure: this embodiment is substantially the same as the first and second embodiments, except that a
惟以上所述僅為本發明之較佳實施例,非意欲侷限本發明的專利保護範圍,故舉凡運用本發明說明書或圖式內容所為的等效變化,均同理皆包含於本發明的權利保護範圍內,合予陳明。However, the above is only a preferred embodiment of the present invention and is not intended to limit the patent protection scope of the present invention. Therefore, all equivalent changes made by using the contents of the description or drawings of the present invention are also included in the scope of protection of the present invention and are appropriately stated.
10:天線結構
1:電路板
11:正面
111:裸空區
12:背面
121:裸空區
13:頂邊
14:底邊
15:二側邊
2:高頻輻射層
21:高頻耦合邊
211:高頻直線邊
212:高頻斜線邊
3:低頻輻射層
31:第一低頻輻射層
32:第二低頻輻射層
33:低頻耦合邊
331:低頻直線邊
332:低頻斜線邊
4、4a:半孔電極層
5:電極層
6:側邊輻射層
20:主機板
201:第一接地層
202:第二接地層
203:第一淨空區
204:第二淨空區
205:第一電極固接層
206:第二電極固接層
207:訊號饋入層
10: Antenna structure
1: Circuit board
11: Front
111: Bare area
12: Back
121: Bare area
13: Top edge
14: Bottom edge
15: Side edges
2: High-frequency radiation layer
21: High-frequency coupling edge
211: High-frequency straight edge
212: High-frequency oblique edge
3: Low-frequency radiation layer
31: First low-frequency radiation layer
32: Second low-frequency radiation layer
33: Low-frequency coupling edge
331: Low-frequency straight edge
332: Low-frequency
圖1,係本發明之第一實施例的天線結構與主機板的分解示意圖﹔FIG. 1 is an exploded schematic diagram of the antenna structure and the motherboard of the first embodiment of the present invention;
圖2,係圖1的另一視角的天線結構與主機板的分解示意圖﹔Figure 2 is a schematic diagram of the antenna structure and motherboard exploded from another angle of Figure 1.
圖3,係圖1的立體組合示意圖﹔FIG. 3 is a schematic diagram of the three-dimensional combination of FIG. 1;
圖4,係圖2的立體組合示意圖﹔FIG. 4 is a schematic diagram of a three-dimensional assembly of FIG. 2;
圖5,係本發明之第一實施例的天線結構正面視示意圖;FIG5 is a front view schematic diagram of the antenna structure of the first embodiment of the present invention;
圖6,係本發明之第二實施例的天線結構的外觀立體示意圖﹔FIG. 6 is a three-dimensional schematic diagram of the antenna structure of the second embodiment of the present invention;
圖7,係本發明之第三實施例的天線結構的外觀立體示意圖﹔FIG. 7 is a three-dimensional schematic diagram of the antenna structure of the third embodiment of the present invention;
圖8,係本發明之第四實施例的天線結構的外觀立體示意圖。FIG8 is a three-dimensional schematic diagram of the antenna structure of the fourth embodiment of the present invention.
10:天線結構 10: Antenna structure
1:電路板 1: Circuit board
11:正面 11: Front
111:裸空區 111: Naked area
12:背面 12: Back
121:裸空區 121: Naked area
13:頂邊 13: Top edge
14:底邊 14: Bottom edge
15:二側邊 15: Both sides
2:高頻輻射層 2: High frequency radiation layer
21:高頻耦合邊 21: High frequency coupling edge
211:高頻直線邊 211: High frequency straight line edge
212:高頻斜線邊 212: High frequency slash edge
3:低頻輻射層 3: Low frequency radiation layer
31:第一低頻輻射層 31: The first low-frequency radiation layer
32:第二低頻輻射層 32: Second low-frequency radiation layer
33:低頻耦合邊 33: Low frequency coupling edge
331:低頻直線邊 331: Low frequency straight line edge
332:低頻斜線邊 332: low frequency oblique edge
5:電極層 5: Electrode layer
20:主機板 20: Motherboard
201:第一接地層 201: First ground layer
202:第二接地層 202: Second ground layer
203:第一淨空區 203: The first clear area
204:第二淨空區 204: Second clear area
205:第一電極固接層 205: First electrode fixing layer
206:第二電極固接層 206: Second electrode fixing layer
207:訊號饋入層 207:Signal Feed Layer
Claims (20)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112133905A TWI881454B (en) | 2023-09-06 | 2023-09-06 | Antenna structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112133905A TWI881454B (en) | 2023-09-06 | 2023-09-06 | Antenna structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202512576A TW202512576A (en) | 2025-03-16 |
| TWI881454B true TWI881454B (en) | 2025-04-21 |
Family
ID=95828588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112133905A TWI881454B (en) | 2023-09-06 | 2023-09-06 | Antenna structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI881454B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6300909B1 (en) * | 1999-12-14 | 2001-10-09 | Murata Manufacturing Co., Ltd. | Antenna unit and communication device using the same |
| US20050134510A1 (en) * | 2003-12-04 | 2005-06-23 | Yokowo Co., Ltd. | Dielectric antenna and communication device incorporating the same |
| TWM630795U (en) * | 2022-04-20 | 2022-08-11 | 台灣禾邦電子有限公司 | Coplanar pannel antenna module |
-
2023
- 2023-09-06 TW TW112133905A patent/TWI881454B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6300909B1 (en) * | 1999-12-14 | 2001-10-09 | Murata Manufacturing Co., Ltd. | Antenna unit and communication device using the same |
| US20050134510A1 (en) * | 2003-12-04 | 2005-06-23 | Yokowo Co., Ltd. | Dielectric antenna and communication device incorporating the same |
| TWM630795U (en) * | 2022-04-20 | 2022-08-11 | 台灣禾邦電子有限公司 | Coplanar pannel antenna module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202512576A (en) | 2025-03-16 |
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