TWI880830B - Substrate state measurement device, coating device, and substrate state measurement method - Google Patents

Abstract

The present invention measures the state of a substrate to be plated. The substrate state measuring device of the present invention comprises: a stage that supports a substrate having a seed layer and an anti-etching layer formed on the seed layer and is passively rotated; at least one white confocal point detector for measuring the surface of the substrate supported by the stage; and a state measuring module that measures the state of the feed component contact area by detecting the feed component contact area in the substrate as the area in contact with the feed component through the white confocal point detector.

Description

Substrate state measurement device, coating device, and substrate state measurement method

This application relates to a substrate state measurement device, a coating device, and a substrate state measurement method.

As an example of a coating device, a cup-type electrolytic coating device is known (for example, refer to Patent Document 1). The cup-type electrolytic coating device immerses a substrate (for example, a semiconductor wafer) held in a substrate holder with the surface to be coated facing downward in a coating liquid, and applies a voltage between the substrate and the anode, thereby depositing a conductive film on the surface of the substrate.

When electroplating a substrate, an anti-corrosion layer with an anti-corrosion pattern is formed on a substrate such as a semiconductor wafer with a seed layer formed thereon. Then, the substrate with the anti-corrosion layer is irradiated with ultraviolet light, etc. to remove the anti-corrosion residue on the substrate surface (ashing treatment) and perform a hydrophilization treatment on the anti-corrosion surface (descum treatment).

In addition, in general, the plating device pre-sets parameters such as the plating current value and the plating time as a plating process recipe by the user according to the target plating film thickness and the actual plating area of the substrate to be plated, and performs the plating process according to the set process recipe (for example, refer to patent document 2). Then, the plating process is performed on multiple wafers on the same carrier using the same process recipe.

[Prior technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 2008-19496

[Patent Document 2] Japanese Patent Publication No. 2002-105695

As mentioned above, a seed layer and an anti-etching layer are formed on the substrate before the plating process. However, sometimes the uniformity of the thickness of the plating film formed on the substrate is damaged due to the state of the seed layer and the anti-etching layer formed on the substrate. One example is that the substrate is contacted with the feeding component (contact) of the substrate holder for feeding. However, when the area of the substrate in contact with the feeding component has anti-etching residues that become a barrier to power conduction, the plating process cannot be properly and correctly implemented. In addition, one example is that the electrolytic plating device sometimes uses a so-called dry contact method in which a sealing component is used to shield the contact area between the feeding component and the substrate to prevent the intrusion of the plating liquid. At this time, if there are bumps or foreign objects on the contact area of the substrate that contacts the sealing component, the plating liquid will invade the contact part between the feeding component and the substrate, and it will be impossible to implement the appropriate and correct plating process. In addition, the desired anti-corrosion pattern is formed on the substrate according to the desired plating pattern formed on the substrate. However, the anti-corrosion pattern formed on the substrate, especially when the aperture ratio of the substrate is different, the current density flowing between the substrate and the anode changes, which will affect the uniformity of the plating film thickness or the time spent on the plating process. As described above, by understanding the state of the substrate to be plated, it is possible to avoid plating abnormal substrates, or to perform appropriate plating according to the state of the substrate.

In view of the above facts, one purpose of this application is to measure the state of the substrate to be coated.

One embodiment provides a substrate state measurement device, which comprises: a stage, which is configured to support a substrate having a seed layer and an anti-etching layer formed on the seed layer and to be passively rotated; and at least one white confocal point detector, which is used to measure the surface of the substrate supported by the stage; and based on detecting the feed component contact area in the substrate as an area in contact with the feed component by the white confocal point detector, the state of the feed component contact area is measured.

One embodiment provides a substrate state measurement device, which comprises: a stage, which is configured to support a substrate having a seed layer and an anti-etching layer formed on the seed layer and to be passively rotated; and at least one white confocal point detector, which is used to measure the plate surface of the substrate supported by the stage; and based on detecting the sealing member contact area in the substrate as an area in contact with the sealing member by the white confocal point detector, the state of the sealing member contact area is measured.

One embodiment provides a substrate state measurement device, which comprises: a stage, which is configured to support a substrate having a seed layer and an anti-etching layer formed on the seed layer and to be passively rotated; and at least one white confocal point detector, which is used to measure the surface of the substrate supported by the stage; and the state of the coated area is measured by detecting the coated area in the substrate by the white confocal point detector.

Another embodiment provides a substrate state measurement method, which includes the following steps: placing a substrate having a seed layer and an anti-corrosion layer formed on the seed layer on a carrier; rotating the substrate placed on the carrier while detecting a feed component contact area in the substrate that is in contact with the feed component by a white confocal point detector; and measuring the state of the feed component contact area based on the detection by the white confocal point detector.

Another embodiment provides a substrate state measurement method, which includes the following steps: placing a substrate having a seed layer and an anti-etching layer formed on the seed layer on a stage; rotating the substrate placed on the stage while detecting the sealing member contact area of the substrate that contacts the sealing member using a white confocal point detector; and measuring the state of the sealing member contact area based on the detection performed by the white confocal point detector.

Another embodiment provides a substrate state measurement method, which includes the following steps: placing a substrate having a seed layer and an anti-etching layer formed on the seed layer on a carrier; rotating the substrate placed on the carrier while detecting the coated area in the substrate by a white confocal point detector; and measuring the state of the coated area based on the detection by the white confocal point detector.

100: Loading port

110: Transport robot

120: Alignment device

130,130A: Substrate status measurement module

132: Carrier

134: Rotating mechanism

136: White confocal point detector

136a~136c: The first~third white confocal point detectors

138: Mobile mechanism

142: State variable acquisition unit

144: Learning model generation department

145: Valuation Calculation Department

146: Study Department

148: Decision-making Department

150: Memory Department

200: Pre-wetting module

300: Prepreg module

400: Coating module

410: Plated groove

412: Inner groove

414: External groove

420: Diaphragm

422:Cathode region

424: Anode area

430: Yang pole

440: Substrate holder

441: Sealing component

442: Lifting mechanism

448: Rotating mechanism

500: Cleaning module

600: Spin washing dryer

700: Transport device

800: Control module

1000: Coating device

1362: Processing Department

1364: Light source

1366: Light Receiving Department

CA: Contact Area

PA: coated area

SA: Sealed area

RL: Anti-corrosion layer

SL:Seed layer

SV: state variable

Wf: Substrate

Wf-a: coated

Figure 1 is a three-dimensional diagram showing the overall structure of the coating device in the implementation form.

Figure 2 is a top view showing the overall structure of the coating device in the implementation form.

FIG3 is a longitudinal cross-sectional view schematically showing the structure of the coating module in the implementation form.

FIG4 is a schematic diagram showing the surface of the substrate in the implementation form.

FIG5 is a longitudinal cross-sectional view schematically showing the structure of the substrate state measurement module in an implementation form.

FIG6 is a schematic diagram for explaining the measurement state of the substrate state measurement module of the implementation form.

FIG. 7 is an example diagram showing a cross section of a white confocal point detector and a substrate in this embodiment.

Figure 8 is an example of a graph showing the signal detection value of a white confocal point detector.

FIG9 is a flow chart showing an example of a substrate state measurement method implemented by a substrate state measurement module.

Figure 10 is a schematic functional block diagram of the substrate state measurement module in this embodiment.

FIG11 is a longitudinal cross-sectional view schematically showing the structure of a substrate state measurement module of a variation.

The following is a description of the implementation of the present invention with reference to the drawings. In the drawings described below, the same symbols are marked on the same or equivalent components, and repeated descriptions are omitted.

FIG1 is a perspective view showing the overall structure of the coating device 1000 of this embodiment. FIG2 is a top view showing the overall structure of the coating device 1000. As shown in FIG1 and FIG2, the coating device 1000 has: a loading port 100, a transfer robot 110, an aligner 120, a pre-wetting module 200, a pre-preg module 300, a coating module 400, a cleaning module 500, a spin-rinse dryer 600, a transfer device 700, and a control module 800.

The loading port 100 is used to carry in a substrate of a coating object stored in a cassette such as a FOUP (not shown) in the coating device 1000, or a module to carry out a substrate from the coating device 1000 to a cassette. In this embodiment, four loading ports 100 are arranged in parallel in the horizontal direction, but the number and arrangement of the loading ports 100 are not limited. The transport robot 110 is a robot for transporting substrates, and is configured in a manner of transferring substrates between the loading port 100, the aligner 120, and the transport device 700. When the transport robot 110 and the transport device 700 transfer substrates between the transport robot 110 and the transport device 700, the transfer of substrates can be performed via a temporary stage (not shown).

The aligner 120 is a module used to align the position of the orientation plane and notch of the substrate in a specified direction. In this embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are not limited. The pre-wetting module 200 replaces the air inside the pattern formed on the surface of the substrate with the processing liquid by wetting the coated surface of the substrate before the plating process with a processing liquid (pre-wetting liquid) such as pure water or degassed water. The pre-wetting module 200 is constructed in a manner that, during plating, the processing liquid inside the pattern is replaced with the plating liquid, thereby facilitating the pre-wetting process of supplying the plating liquid inside the pattern. This implementation form is to arrange two pre-wetting modules 200 in parallel in the vertical direction, but the number and arrangement of the pre-wetting modules 200 are not limited.

The prepreg module 300 is constructed by, for example, performing a prepreg treatment by etching with a treatment liquid such as sulfuric acid or hydrochloric acid to remove the oxide film with high resistance existing on the surface of the seed layer of the plated surface of the substrate before the plating treatment, so as to clean or activate the surface of the plated substrate. In this embodiment, two prepreg modules 300 are arranged in parallel in the vertical direction, but the number and arrangement of the prepreg modules 300 are not limited. The plating module 400 performs a plating treatment on the substrate. In this embodiment, there are two sets of plating modules 400, each of which has three units arranged in parallel in the vertical direction and four units arranged in parallel in the horizontal direction, and a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are not limited.

The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the residual coating liquid and the like on the substrate after the coating process. In this embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are not limited. The spin-wash dryer 600 is a module used to spin and dry the substrate after the cleaning process at high speed. In this embodiment, two spin-wash dryers are arranged side by side in the vertical direction, but the number and arrangement of the spin-wash dryers are not limited. The transport device 700 is a device used to transport substrates between multiple modules in the coating device 1000. The control module 800 is configured to control multiple modules of the coating device 1000, and can be, for example, a general computer or a dedicated computer having an input/output interface with operators.

An example of a continuous coating process implemented by the coating device 1000 is described. First, the substrate stored in the cassette is moved into the loading port 100. Then, the transport robot 110 takes out the substrate from the cassette of the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the position of the orientation plane and groove of the substrate in a specified direction. The transport robot 110 delivers the substrate, which has been aligned by the aligner 120, to the transport device 700.

The conveying device 700 conveys the substrate received from the conveying robot 110 to the pre-wetting module 200. The pre-wetting module 200 performs a pre-wetting treatment on the substrate. The conveying device 700 conveys the substrate that has been pre-wetted to the pre-preg module 300. The pre-preg module 300 performs a pre-preg treatment on the substrate. The conveying device 700 conveys the substrate that has been pre-preg to the coating module 400. The coating module 400 performs a coating treatment on the substrate.

The transport device 700 transports the substrate subjected to the coating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the substrate subjected to the cleaning process to the spin-rinse dryer 600. The spin-rinse dryer 600 performs a drying process on the substrate. The transport device 700 delivers the substrate subjected to the drying process to the transport robot 110. The transport robot 110 transports the substrate received from the transport device 700 to the cassette of the loading port 100. Finally, the cassette containing the substrate is removed from the loading port 100.

<Composition of the coating module>

Next, the structure of the coating module 400 is described. Since the 24 coating modules 400 in this embodiment have the same structure, only one coating module 400 is described. FIG. 3 is a longitudinal cross-sectional view schematically showing the structure of the coating module 400 of this embodiment. As shown in FIG. 3 , the coating module 400 has a coating tank 410 for containing the coating liquid. The structure of the coating tank 410 includes: a cylindrical inner tank 412 with an opening on the top; and an outer tank 414 arranged around the inner tank 412 in a manner to prevent the coating liquid from overflowing from the upper edge of the inner tank 412.

The plating module 400 has a membrane 420 that separates the interior of the inner tank 412 in the vertical direction. The interior of the inner tank 412 is divided into a cathode region 422 and an anode region 424 by the membrane 420. Plating liquid is filled in the cathode region 422 and the anode region 424, respectively. An anode 430 is provided on the bottom surface of the inner tank 412 in the anode region 424. A resistor 450 is arranged in the cathode region 422 to face the membrane 420. The resistor 450 is a member used to achieve uniform plating treatment on the plated surface Wf-a of the substrate Wf. In addition, this embodiment shows an example of providing a diaphragm 420, but the diaphragm 420 may not be provided.

In addition, the coating module 400 has a substrate holder 440 for holding the substrate Wf in a state where the coated surface Wf-a faces downward. The substrate holder 440 holds the edge of the substrate Wf in a state where a portion of the coated surface Wf-a (coated area) is exposed. The substrate holder 440 has a feeding contact that contacts the substrate Wf and is used to feed electricity from a power source (not shown) to the substrate Wf. This embodiment adopts a so-called dry contact method in which the contact portion between the feeding contact of the substrate holder 440 and the substrate Wf is shielded to prevent the plating liquid or other liquids from invading. The substrate holder 440 has a sealing member 441 that seals the feeding contact area (contact area CA) of the substrate Wf in a manner that prevents the coating liquid from acting on the contact portion between the feeding contact and the substrate Wf.

FIG. 4 is a diagram schematically showing the plate surface (coated surface Wf-a) of the substrate Wf in the present embodiment. The substrate Wf in the present embodiment is a circular substrate. As shown in the figure, the substrate Wf has a circular coated area PA formed on the inner circumference, and an annular contact area CA for contacting with the feeding contact of the substrate holder 440 is formed on the outer circumference of the coated area PA. In addition, an annular sealing member contact area (sealing area) SA is provided between the coated area PA and the contact area CA, which contacts with the sealing member 441 of the substrate holder 440. In addition, FIG. 4 is hatched in the sealing area SA for easy understanding. In this embodiment, the seed layer SL is formed in the contact area CA in a manner that is conductive by contacting with the feeding contact of the substrate holder 440, without being covered by the anti-etching layer RL (see FIG. 6). In addition, in the sealing area SA, the anti-etching layer RL is similarly formed in a manner that is conductive by contacting with the sealing member 441 of the substrate holder 440 to seal the plating liquid (see FIG. 6). Then, in the plating area PA, the anti-etching layer RL having an anti-etching pattern with an opening leading to the seed layer SL is formed in a manner that forms a desired plating pattern by plating treatment (see FIG. 6).

Referring again to FIG. 3 , the coating module 400 has a lifting mechanism 442 for lifting and lowering the substrate holder 440. In addition, one embodiment is that the coating module 400 has a rotating mechanism 448 for rotating the substrate holder 440 around the lead straight axis. The lifting mechanism 442 and the rotating mechanism 448 can be implemented by a known mechanism such as a motor. By using the lifting mechanism 442 to immerse the substrate Wf in the coating liquid in the cathode area 422, the coating area PA of the substrate Wf is exposed to the coating liquid. In addition, one embodiment is that the coating process is performed while the substrate holder 440 is rotated using the rotating mechanism 448. The coating module 400 is configured to perform a coating process on the coating surface Wf-a (coating area PA) of the substrate Wf by applying a voltage between the anode 430 and the substrate Wf in this state.

In addition, the above-mentioned coating module 400 performs the coating process with the coating surface Wf-a of the substrate Wf facing downward, but it is not limited to this example. For example, the coating module 400 can also perform the coating process with the coating surface Wf-a facing upward or sideways.

<Substrate status measurement module>

The coating device 1000 has a substrate state measurement module 130 for measuring the state of the substrate Wf before the coating module 400 performs the coating process. The substrate state measurement module 130 is equivalent to an example of a substrate state measurement device. FIG. 5 is a longitudinal cross-sectional view schematically showing the structure of a substrate state measurement module 130 in an implementation form, and FIG. 6 is a schematic diagram for explaining the state measured by the substrate state measurement module 130. An example of the substrate state measurement module 130 is provided in the aligner 120. However, the substrate state measurement module 130 can also be provided in any of the pre-wetting module 200, the pre-preg module 300, or the conveying device 700. In addition, the substrate state measurement module 130 can also be provided as an independent module.

The substrate state measurement module 130 has a stage 132 that is configured to support the substrate Wf and passively rotate. The rotating mechanism 134 that rotates the stage 132 can be realized by a known mechanism such as a motor. In addition, the substrate state measurement module 130 has a white confocal point detector 136 for measuring the surface of the substrate Wf loaded on the stage 132. The example shown in FIG. 5 is that the white confocal point detector 136 is configured to be movable by a moving mechanism 138. In this way, the detection position of the white confocal point detector 136 can be changed. In addition, the moving mechanism 138 can also be configured to move the white confocal point detector 136 along the radial direction of the substrate Wf, but this is not a limitation. In this embodiment, the substrate state measurement module 130 has a white confocal point detector 136, and as shown in FIG6, the detection position of the white confocal point detector 136 can be changed to the contact area CA, the sealing area SA and the coated area PA by the moving mechanism 138.

FIG7 is an example diagram showing a cross section of a white confocal point detector and a substrate in this embodiment, and FIG8 is an example diagram showing a signal detection value of the white confocal point detector. The white confocal point detector 136 has: a light source 1364 that generates irradiation light having a plurality of wavelength components; a light receiving unit 1366 that receives reflected light from the substrate Wf; and a processing unit 1362 that measures the distance to the interface position of the reflected light based on the wavelength component of the light received by the light receiving unit 1366.

When the irradiation light is irradiated to the exposed region of the seed layer SL in the substrate Wf, the irradiation light is reflected by the surface of the seed layer SL. As a result, the signal intensity of the distance to the seed layer SL (A1 in FIG. 5 ) calculated by the processing unit 1362 is increased and displayed. In addition, when the irradiation light is irradiated to the anti-etching layer RL in the substrate Wf, the irradiation light is mainly reflected by the surface of the anti-etching layer RL. As a result, the signal intensity of the distance to the anti-etching layer RL (A2 in FIG. 5 ) calculated by the processing unit 1362 is increased and displayed. In addition, when the anti-etching layer RL allows a part of the irradiation light to pass through, a part of the irradiation light irradiated on the anti-etching layer RL is reflected by the surface of the anti-etching layer RL, and another part of the irradiation light passes through the anti-etching layer RL and is reflected by the seed layer SL on the back of the anti-etching layer RL. Thus, as the distance to the substrate Wf calculated by the processing unit 1362, the signal intensities of the distance to the anti-etching layer RL (A2) and the distance to the seed layer SL (A1) are increased and displayed respectively.

The substrate state measurement module 130 measures the state of the substrate Wf based on the detection performed by such a white confocal point detector 136. An example of measuring the state of the substrate Wf based on the detection of the white confocal point detector 136 is performed by the control module 800. At this time, the control module 800 constitutes a part of the substrate state measurement module 130. However, it is not limited to this example, and the substrate state measurement module 130 may also have a structure for measuring the state of the substrate Wf that is different from the control module 800.

FIG9 is a flowchart showing an example of a substrate state measurement method implemented by the substrate state measurement module 130. In the substrate state measurement method of this embodiment, first, the substrate Wf is arranged on the carrier 132 (step S10). The substrate Wf is arranged on the carrier 132, for example, by the transport robot 110.

Next, while the substrate Wf disposed on the stage 132 rotates, the white confocal point detector 136 detects the contact area (contact area) CA of the feed component (step S12), and then measures the state of the contact area CA based on the detection (step S14). The detection of the contact area CA by the white confocal point detector 136 should be carried out at least as the substrate Wf rotates for one week.

Here, the first example of the processing of step S12 is a method that includes measuring the distance between the white confocal point detector 136 and the substrate Wf in the entire contact area CA, and the substrate Wf is rotated at a slow speed according to the sampling period of the white confocal point detector 136. As mentioned above, the contact area CA is not covered by the anti-etching layer RL and a seed layer SL is formed. Under the appropriate substrate Wf state, the detection of the white confocal point detector 136 in the entire contact area CA is constant. Therefore, the processing of step S14 in the first example is that when the detection value of the entire contact area CA by the substrate state measurement module 130 (control module 800) is within the predetermined normal range, the contact area CA can be judged as normal. In addition, when the substrate state measurement module 130 measures a detection value that deviates from the normal area, it can be determined that the contact area CA has unevenness and is an abnormality that will cause poor contact between the power supply contact and the substrate holder 440. In addition, the first example is that the substrate state measurement module 130 should consider the tilt of the substrate Wf and detect noise to measure the state of the contact area CA.

In addition, the second example of the processing of step S12 is that when the contact area CA contains unevenness, the substrate Wf is rotated quickly to a large extent so that the signal strength of multiple distances is displayed in the white confocal point detector 136. At this time, under the appropriate state of the substrate Wf, the signal strength of a single distance is detected and displayed in the entire contact area CA by the white confocal point detector 136. Therefore, the processing of step S14 in the second example is that when the substrate state measurement module 130 (control module 800) detects a single distance in the entire contact area CA, the contact area CA can be judged to be normal. In addition, when the substrate state measurement module 130 measures the signal strength at multiple distances separated by a specified distance, it can be determined that the contact area CA is uneven and abnormal. In addition, the second example is that the substrate state measurement module 130 should consider the detection noise to measure the state of the contact area CA. In addition, the second example is superior to the first example in that the tilt of the substrate Wf has little effect on the detection.

Secondly, the substrate state measurement method is to rotate the substrate Wf disposed on the stage 132 while detecting the sealing member contact area (sealing area) SA by the white confocal point detector 136 (step S22). And based on the detection, measure the state of the sealing area SA (step S24). It is advisable to detect the sealing area SA by the white confocal point detector 136 at least when the substrate Wf rotates for one week.

The first example of the processing of step S22 can be performed by rotating the substrate Wf at a slow speed, similarly to the first example of the processing of step S12. As described above, an anti-etching layer RL is also formed in the sealing area SA, and under the appropriate substrate Wf state, the detection performed by the white confocal point detector 136 is constant in the entire sealing area SA. Therefore, the processing of step S24 in the first example is that when the detection value of the substrate state measurement module 130 (control module 800) in the entire sealing area SA is within the predetermined normal area, the sealing area SA can be judged to be normal. In addition, when the substrate state measurement module 130 measures a detection value that deviates from the normal area, it can be judged that the sealing area SA has unevenness and is abnormal.

In addition, the second example of the processing of step S22 can be performed by quickly rotating the substrate Wf, similarly to the processing of the second example of step S12. In the second example, the processing of step S24 is that when the substrate state measurement module 130 (control module 800) detects a certain number (1 or 2) of distances in the entire sealing area SA, the sealing area SA can be judged to be normal. In addition, when the substrate state measurement module 130 detects a change in distance as an example, it can be judged that there are bumps in the sealing area SA and it is abnormal.

Next, the substrate state measurement method is to rotate the substrate Wf disposed on the stage 132 while detecting the coated area PA by the white confocal point detector 136 (step S32), and measure the state of the coated area PA based on the detection (step S34). The detection of the coated area PA by the white confocal point detector 136 is preferably performed at least as the substrate Wf rotates for one week. In addition, the detection of the coated area PA by the white confocal point detector 136 is preferably performed at multiple different positions in the radial direction of the substrate Wf. The detection of the coated area PA by the white confocal point detector 136 can also be performed as the white confocal point detector 136 moves by the moving mechanism 138. Here, the coated area PA detected by the white confocal point detector 136 is preferably an area less than 25% of the coated area PA.

The processing of step S32 preferably includes a method in which the distance between the white confocal point detector 136 and the substrate Wf can be measured in the entire detection area, and the substrate Wf is rotated at a slow speed according to the sampling cycle of the white confocal point detector 136. As described above, an anti-etching layer RL having an anti-etching pattern is formed in the coated area PA, and the detection performed by the white confocal point detector 136 changes according to the anti-etching pattern. An example of the processing of step S34 is preferably that the substrate state measurement module 130 (control module 800) measures the aperture ratio of the anti-etching layer RL according to the detection performed by the white confocal point detector 136. In addition, the substrate state measurement module 130 can also detect the coated area PA based on the white confocal point detector 136 to measure whether the coated area PA is normal/abnormal as the state of the substrate Wf. For example, the substrate state measurement module 130 can also determine that the coated area PA is abnormal when the anti-etching pattern of the coated area PA is abnormal or the anti-etching layer RL of the coated area PA is abnormal.

When the state of the substrate Wf is measured by the detection performed by the white confocal point detector 136, the substrate state measurement module 130 (control module 800) determines whether the state of the substrate Wf is normal (step S40). For example, when the substrate state measurement module 130 determines that the coating process can be normally performed on the substrate Wf according to the state of the contact area CA or the sealing area SA, it is determined that the state of the substrate Wf is normal. In addition, when the substrate state measurement module 130 determines that the substrate Wf is not suitable for being held by the substrate holder 440 according to the state of the contact area CA or the sealing area SA, it is determined that the state of the substrate Wf is abnormal. In addition, the substrate state measurement module 130 can also determine that the state of the substrate Wf is abnormal based on the state of the coated area PA.

When it is determined that the state of the substrate Wf is normal (S40: Yes), the substrate Wf is subjected to a coating process (step S42) according to the state of the coated area PA, and the flowchart shown in FIG. 9 ends. The coating process may also determine the voltage applied to the substrate Wf according to the aperture ratio of the coated area PA, for example. In addition, when it is determined that the state of the substrate Wf is abnormal (S40: No), the coating process is not performed, and the substrate Wf is returned to a cassette such as a FOUP (not shown) (step S44), and the flowchart shown in FIG. 9 ends. At this time, a buzzer or monitor (not shown) may be used to notify the user of the abnormality of the substrate Wf. When this method is adopted, the coating process can be performed according to the state of the substrate Wf. In addition, when the substrate Wf is in a state where the coating process cannot be performed, the process of the substrate Wf can be terminated to improve the process efficiency.

In addition, the substrate state measurement method shown in FIG9 is to detect the contact area CA, the sealing area SA, and the coated area PA in sequence by the white confocal point detector 136. However, the detection order of the white confocal point detector 136 is not restricted. In addition, at least one detection may not be performed in the contact area CA, the sealing area SA, and the coated area PA. For example, when the substrate holder 440 does not have a sealing member 441, etc., because there is no sealing area SA in the substrate Wf, the processing of steps S22 and S24 can be omitted. In addition, the substrate state measurement method shown in FIG9 is to determine whether the state of the substrate Wf is normal after measuring the state of the coated area PA. However, it is also possible to first determine whether the state of the substrate Wf is normal based on the measurement of the state of the contact area CA or the sealing area SA, and when the state of the substrate Wf is normal, measure the state of the coated area PA, and perform coating processing on the substrate Wf.

<Using machine learning to measure the state of the substrate>

The state of the substrate Wf (the state of the contact area CA, the state of the sealing area SA, the state of the coated area PA (aperture ratio of the coated area)) is measured by the substrate state measurement module 130, and a learning model constructed by mechanical learning can also be used. FIG10 is a schematic functional block diagram of the substrate state measurement module 130 in this embodiment. In addition, the functional blocks shown in FIG10 can also be implemented by the control module 800 as a part of the substrate state measurement module 130 (substrate state measurement device). The substrate state measurement module 130 includes: a state variable acquisition unit 142 that acquires a state variable SV; a learning model generation unit 144 that learns and generates a learning model stored in a memory unit 150 based on the acquired state variable SV; and a meaning determination unit 148 that measures (determines) the state of the substrate Wf based on the acquired state variable SV and the learning model. In addition, the meaning determination unit 148 can also produce image information showing the surface state of the substrate Wf as the state of the substrate Wf based on the state variable SV.

The state variable acquisition unit 142 acquires the state variable SV at each specified time (for example, several msec, several tens of msec). One example is that the specified time can be the same as or corresponding to the learning cycle based on the learning model generation unit 144. In addition, in this embodiment, the input from the white confocal point detector 136 is equivalent to obtaining the state variable SV by the state variable acquisition unit 142. The state variable SV may also include: the detection position information of the white confocal point detector 136, or the rotation speed of the substrate Wf. In addition, the state variable SV may also include information that is pre-input into the coating device 1000 by the user. One example is that the state variable SV may also include information such as the material of the substrate Wf.

The learning model generation unit 144 learns the learning model (the state of the substrate with respect to the state variable SV) according to an arbitrary learning algorithm generally referred to as mechanical learning. The learning model generation unit 144 repeatedly performs learning based on the state variable SV obtained by the state variable acquisition unit 142. The learning model generation unit 144 obtains a plurality of state variable SVs, identifies the characteristics of the state variable SVs, and explains the correlation. In addition, the learning model generation unit 144 explains the correlation of the state variable SV obtained next time when the substrate state is measured for the current state variable SV. Then, the learning model generation unit 144 estimates the state of the substrate Wf for the obtained state variable SV by repeated learning to optimize.

One example is that the learning model generation unit 144 is constructed by learning with a teacher. Learning with a teacher can also be performed at the location where the coating device 1000 is installed, or at a manufacturing plant or a dedicated learning location. As an example of learning with a teacher, the learning model generation unit 144 can also use measurement information of a substrate whose substrate state is measured in advance or whose substrate state is determined in advance as teacher data. As an example of such a substrate, a substrate having an anti-corrosion film formed with a certain anti-corrosion pattern can also be used.

In addition, the learning model generation unit 144 can also perform reinforcement learning to learn the learning model. Reinforcement learning is a method of generating a learning model that obtains the maximum reward by giving a reward to an action (output) performed in a current state (input) in a certain environment. An example of performing reinforcement learning is that the learning model generation unit 144 has: an evaluation value calculation unit 145 that calculates an evaluation value based on a state variable SV; and a learning unit 146 that learns the learning model based on the evaluation value. An example is that the evaluation value calculation unit 145 can also be a unit that gives a greater reward the shorter the time required for the plating device 1000 to perform a plating process on the substrate Wf. In addition, one example is that the evaluation value calculation unit 145 may also be one that gives a greater reward when the profile of the coating formed on the substrate Wf is more constant.

The substrate state measurement module 130 of the embodiment described above is to place the substrate Wf on the stage 132, rotate the substrate Wf while detecting the surface of the substrate Wf by the white confocal point detector 136, and then measure the state of the substrate Wf according to the detection. In this way, the state of the substrate Wf as the coating object can be measured to implement the coating process. In particular, by measuring the substrate state by detecting the contact area CA, the sealing area SA, and the coated area PA, the coating process can be well implemented.

<Example of changes>

FIG. 11 is a longitudinal cross-sectional view schematically showing the structure of the substrate state measurement module of the variation. Regarding the substrate state measurement module 130A of the variation, the description of the parts that are repeated with the substrate state measurement module 130 of the above-mentioned embodiment is omitted. The substrate state measurement module 130A of the variation has a plurality of white confocal point detectors 136. In one example, the substrate state measurement module 130A has at least two of: a first white confocal point detector 136a that detects the contact area CA; a second white confocal point detector 136b that detects the sealing area SA; and a third white confocal point detector 136c that detects the coated area PA. In this way, the state of the substrate Wf can be detected by each white confocal point detector 136. In addition, at least one of the first to third white confocal point detectors 136a to 136c can also be configured to move along the surface of the substrate Wf by a moving mechanism 138, similarly to the white confocal point detector 136 of the above-mentioned embodiment. In addition, the third white confocal point detector 136c, which takes the coated area PA as the detection object, can also be set in a plurality of detectors for detecting different coated areas PA in the radial direction of the substrate Wf as shown in FIG. 11. In addition, the second and third white confocal point detectors 136b and 136c of the substrate state measurement module 130A of the variation are equivalent to an example of a white confocal point detector for detecting an area other than the contact area CA.

The present invention can also be recorded in the following forms.

[Form 1] Form 1 proposes a substrate state measurement device, which comprises: a stage, which is configured to support a substrate having a seed layer and an anti-etching layer formed on the seed layer and to be passively rotated; and at least one white confocal point detector, which is used to measure the surface of the substrate supported by the stage; and based on detecting the feed component contact area in the substrate as an area in contact with the feed component by the white confocal point detector, the state of the feed component contact area is measured.

When using form 1, the state of the feeding component contact area of the substrate to be plated can be measured.

[Form 2] Form 2 proposes a substrate state measurement device, which comprises: a stage, which is configured to support a substrate having a seed layer and an anti-etching layer formed on the seed layer and to be passively rotated; and at least one white confocal point detector, which is used to measure the plate surface of the substrate supported by the stage; and based on detecting the sealing member contact area in the substrate as an area in contact with the sealing member by the white confocal point detector, the state of the sealing member contact area is measured.

When using form 2, the state of the sealing component contact area of the substrate can be measured.

[Form 3] Form 3 proposes a substrate state measurement device, which comprises: a stage, which is configured to support a substrate having a seed layer and an anti-etching layer formed on the seed layer and to be passively rotated; and at least one white confocal point detector, which is used to measure the surface of the substrate supported by the stage; and the state of the coated area is measured by detecting the coated area in the substrate by the white confocal point detector.

When using form 3, the state of the coated area of the substrate can be measured.

[Form 4] Form 4 is like Form 3, wherein the coated area in the substrate is detected by the white confocal detector, and the detection is performed on an area less than 25% of the coated area.

[Form 5] Form 5 is like Form 3 or 4, wherein the state of the aforementioned coated area is to measure the aperture ratio of the anti-corrosion layer of the aforementioned coated area.

When using form 5, the aperture ratio of the coated area can be measured.

[Form 6] Form 6 is like Form 5, wherein a memory unit is provided, which stores a learning model constructed by mechanical learning, inputs the detection information of the white confocal point detector into the learning model, learns the learning model, and uses the learning model to measure the aperture ratio of the anti-corrosion layer in the coated area.

When using Form 6, the learned model can be used to appropriately measure the porosity of the coated area.

[Form 7] Form 7 is like Forms 1 to 6, wherein a moving mechanism is provided, which is configured to move the aforementioned white confocal point detector along the surface of the aforementioned substrate.

When using form 7, the detection position of the white confocal point detector can be changed by moving the mechanism.

[Form 8] Form 8 is as in Forms 1 to 7, wherein the aforementioned at least one white confocal point detector comprises: a first white confocal point detector, which is used to detect the aforementioned feeding component contact area; and a second white confocal point detector, which is used to detect an area of the aforementioned substrate that is not the aforementioned feeding component contact area.

[Form 9] Form 9 proposes a plating device, which comprises: a substrate state measuring device of any one of forms 1 to 8; a substrate holder, which has the aforementioned power feeding component and is used to hold the aforementioned substrate; and a plating tank, which contains a plating liquid and is used to apply a voltage between the aforementioned substrate and the aforementioned anode when the substrate held in the aforementioned substrate holder and the anode are immersed in the aforementioned plating liquid to perform plating.

[Form 10] Form 10 proposes a substrate state measurement method, which includes the following steps: placing a substrate having a seed layer and an anti-corrosion layer formed on the seed layer on a stage; rotating the substrate placed on the stage while detecting a feed component contact area in the substrate that is in contact with a feed component by a white confocal point detector; and measuring the state of the feed component contact area based on the detection by the white confocal point detector.

[Form 11] Form 11 proposes a substrate state measurement method, which includes the following steps: placing a substrate having a seed layer and an anti-etching layer formed on the seed layer on a stage; while the substrate placed on the stage is rotated, a sealing member contact area in the substrate that is in contact with the sealing member is detected by a white confocal point detector; and based on the detection performed by the white confocal point detector, the state of the sealing member contact area is measured.

[Form 12] Form 12 proposes a substrate state measurement method, which includes the following steps: placing a substrate having a seed layer and an anti-etching layer formed on the seed layer on a carrier; rotating the substrate placed on the carrier while detecting a coated area in the substrate by a white confocal point detector; and measuring the state of the coated area based on the detection by the white confocal point detector.

The above describes the implementation form of the present invention, but the implementation form of the above invention is for easy understanding of the present invention, and does not limit the present invention. The present invention can be changed and improved without departing from its purpose, and the present invention certainly includes its equivalents. In addition, within the scope that can solve at least part of the above-mentioned problems, or within the scope that can achieve at least part of the effect, the implementation form and the variation examples can be arbitrarily combined, and the various components described in the patent application scope and the specification can be arbitrarily combined or omitted.

130: Substrate status measurement module

132: Carrier

134: Rotating mechanism

136: White confocal point detector

138: Mobile mechanism

CA: Contact Area

PA: coated area

SA: Sealed area

Wf: Substrate

Wf-a: coated

Claims (9)

A substrate state measurement device comprises: a stage, which is configured to support a substrate having a seed layer and an anti-corrosion layer formed on the seed layer and to rotate passively; and at least one white confocal point detector, which is used to measure the surface of the substrate supported by the stage; and a memory unit, which stores a learning model constructed by mechanical learning, and inputs information obtained by detecting a coated area in the substrate by the white confocal point detector into the learning model to learn the learning model, and uses the learning model to measure the aperture ratio of the anti-corrosion layer in the coated area. As in claim 1, the substrate state measurement device detects the coated area in the substrate by the white confocal point detector, which is performed in an area less than 25% of the coated area. The substrate state measurement device of claim 1 is provided with a detector moving mechanism, which is constructed in such a way that the aforementioned white confocal point detector moves along the surface of the aforementioned substrate. The substrate state measurement device of claim 1, wherein the aforementioned at least one white confocal point detector comprises: a first white confocal point detector, which is used to detect the aforementioned coated area in the aforementioned substrate; and a second white confocal point detector, which is used to detect an area in the aforementioned substrate that is not the aforementioned coated area. As in claim 1, the substrate state measurement device further measures the state of the feed component contact area by detecting the feed component contact area in the substrate as the area in contact with the feed component using the white confocal point detector. As in claim 1, the substrate state measurement device further measures the state of the sealing member contact area by detecting the sealing member contact area in the substrate as the area in contact with the sealing member using the white confocal point detector. A plating device comprises: a substrate state measuring device according to any one of claims 1 to 4 and 6; a substrate holder having a feeding component and used to hold the substrate; and a plating tank containing a plating liquid, used to perform plating by applying a voltage between the substrate and the anode while the substrate and the anode held in the substrate holder are immersed in the plating liquid. A plating device comprises: a substrate state measuring device according to claim 5; a substrate holder having the aforementioned power feeding component and used to hold the aforementioned substrate; and a plating tank containing a plating liquid, used to apply a voltage between the aforementioned substrate and the aforementioned anode to perform plating while the substrate and the anode held in the aforementioned substrate holder are immersed in the aforementioned plating liquid. A substrate state measurement method includes the following steps: placing a substrate having a seed layer and an anti-corrosion layer formed on the seed layer on a stage; rotating the substrate placed on the stage while detecting a coated area in the substrate by a white confocal point detector; and inputting information obtained by the detection by the white confocal point detector into a learning model constructed by mechanical learning to learn the learning model, and using the learning model to measure the aperture ratio of the anti-corrosion layer in the coated area.