TWI880849B - Electronic assembly - Google Patents

Abstract

An electronic assembly including a first circuit board assembly, a second circuit board assembly and a fin assembly. The first circuit board assembly includes a first circuit board and a first heat source disposed thereon. The second circuit board assembly includes a second circuit board and a second heat source disposed thereon. The first and second circuit boards are spaced apart from each other with the fin assembly therebetween. The fin assembly includes a base part, fin parts and a conductive cover part. The base part has a hole. The fin parts and the conductive cover part protrude from the same side of the base part. The conductive cover part covers the hole and forms at least one heat dissipation channel connected to the hole. The base part is thermally coupled to the second heat source, and two opposite sides of the conductive cover part are thermally coupled to the base part and the first heat source, respectively.

Description

Electronic components

The present invention relates to an electronic component, and more particularly to an electronic component comprising a heat source and a heat sink fin assembly.

Generally speaking, in order to maximize space utilization, electronic components are increasingly composed of two adjacent circuit board assemblies. In such electronic assemblies, in order to effectively cool the two circuit board assemblies, each circuit board assembly needs a dedicated heat sink assembly to absorb heat.

However, the structure of the heat sink fin assembly is relatively complex and requires the development of a complex mold during manufacturing. Therefore, the above method of manufacturing a dedicated heat sink fin assembly for each circuit board assembly (i.e., developing a dedicated mold) will greatly increase the manufacturing cost of the electronic assembly. In other words, traditional electronic assemblies will have the problem of being difficult to take into account both the heat dissipation efficiency of the circuit board assembly and the manufacturing cost of the electronic assembly.

The present invention provides an electronic component that takes into account both the heat dissipation efficiency of the circuit board component and the manufacturing cost of the electronic component.

The electronic assembly disclosed in an embodiment of the present invention includes a first circuit board assembly, a second circuit board assembly and a heat sink fin assembly. The first circuit board assembly includes a first circuit board and a first heat source disposed on the first circuit board. The second circuit board assembly includes a second circuit board and a second heat source disposed on the second circuit board. The first circuit board and the second circuit board are spaced apart. The heat sink fin assembly is between the first circuit board and the second circuit board and includes a base portion, a plurality of fin portions and a heat conductive cover portion. The base portion has a broken hole. The fin portion and the heat conductive cover portion protrude from the same side of the base portion. The heat conductive cover portion shields the broken hole and surrounds at least one heat dissipation channel connected to the broken hole. The base portion is thermally coupled to the second heat source, and opposite sides of the heat conductive cover portion are thermally coupled to the base portion and the first heat source, respectively.

According to the electronic assembly disclosed in the above-mentioned embodiment, the base portion of the heat sink fin assembly is thermally coupled to the second heat source, and the opposite sides of the heat conductive cover portion are thermally coupled to the base portion of the heat sink fin assembly and the first heat source, respectively, and the heat conductive cover portion surrounds at least one heat dissipation channel. Through the above-mentioned configuration of the heat conductive cover portion, the heat conductive cover portion can not only serve as a heat transfer medium for the first heat source and the heat sink fin assembly, but also can avoid the problem of blocking cold air through the design of the heat dissipation channel. Therefore, only through the cooperation of a single heat sink fin assembly and its heat conductive cover portion, the heat generated by the first heat source and the second heat source can be effectively absorbed, thereby saving the cost of manufacturing multiple heat sink fin assemblies with complex structures. In this way, the heat dissipation efficiency of the first circuit board assembly and the second circuit board assembly and the manufacturing cost of the electronic assembly can be taken into consideration.

In addition, the base portion has a hole connected to the heat dissipation channel. In other words, the base portion, the fin portion and the heat conductive cover portion of the heat dissipation fin assembly are formed in one piece by, for example, a mold misalignment (i.e., by breaking) during die casting. In this way, there is no need to spend money to assemble the heat conductive cover portion to the base portion, thereby further reducing the manufacturing cost of the electronic component.

The following detailed description of the features and advantages of the embodiments of the present invention is provided in the embodiments, and the contents are sufficient to enable any person with ordinary knowledge in the field to understand the technical contents of the embodiments of the present invention and implement them accordingly. Moreover, according to the contents disclosed in this specification, the scope of the patent application and the drawings, any person with ordinary knowledge in the field can easily understand the relevant purposes and advantages of the present invention. The following embodiments are further detailed descriptions of the viewpoints of the present invention, but are not intended to limit the scope of the present invention by any viewpoint.

Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a perspective view of an electronic assembly according to an embodiment of the present invention. FIG. 2 is a side cross-sectional view of the electronic assembly in FIG. 1 along the cutting line 2 - 2 . In this embodiment, the electronic assembly 10 includes, for example, a first circuit board assembly 100 , a second circuit board assembly 200 , a heat sink fin assembly 300 , two sealing pads 400 , a wind shielding film 500 and a fan 600 .

The first circuit board assembly 100 includes a first circuit board 110 and a first heat source 120 disposed on the first circuit board 110. The second circuit board assembly 200 includes a second circuit board 210 and a second heat source 220 disposed on the second circuit board 210. The first circuit board 110 and the second circuit board 210 are spaced apart.

In addition, as shown in FIG. 2 , the first heat source 120 and the second heat source 220 are misaligned with each other, for example, along a stacking direction S of the first circuit board 110 and the second circuit board 210 .

Please refer to Figures 2 to 4. Figure 3 is a three-dimensional view of the heat sink fin assembly of the electronic component in Figure 1. Figure 4 is a partial enlarged view of the electronic component in Figure 2.

The heat sink fin assembly 300 is located between the first circuit board 110 and the second circuit board 210 and includes a base portion 310, a plurality of fin portions 320 and a heat conductive cover portion 330. The base portion 310 includes a bottom plate 311 and two side plates 312. The two side plates 312 are respectively connected to opposite sides of the bottom plate 311, so that the two side plates 312 and the bottom plate 311 together form two vents 315. The bottom plate 311 has a hole 3110. The fin portion 320 and the heat conductive cover portion 330 protrude from the same side of the bottom plate 311. A side of the bottom plate 311 away from the fin portion 320 can be thermally coupled to the second heat source 220, for example, through a heat conductive bump 340 and a heat conductive pad (not shown).

The heat-conducting cover portion 330 has a first thermal coupling surface 331, a second thermal coupling surface 332, two ventilation surfaces 333 and a plurality of heat dissipation channels 334. The first thermal coupling surface 331 and the second thermal coupling surface 332 are opposite to each other. The two ventilation surfaces 333 are opposite to each other and connect the first thermal coupling surface 331 and the second thermal coupling surface 332. In addition, the two ventilation surfaces 333 face the two vents 315 respectively. The heat-conducting cover portion 330 shields the broken hole 3110 and surrounds the heat dissipation channels 334 connected to the broken hole 3110. The heat dissipation channels 334 penetrate the two ventilation surfaces 333. The first thermal coupling surface 331 and the second thermal coupling surface 332 are thermally coupled to the bottom plate 311 and the first heat source 120 respectively. The second thermal coupling surface 332 can be thermally coupled to the first heat source 120 through a heat sink (not shown), for example. The hole 3110 is located at the connection between the first thermal coupling surface 331 and the bottom plate 311. In this embodiment, the base portion 310, the fin portions 320 and the heat conductive cover portion 330 are formed in one piece by, for example, mold misalignment (i.e., breaking) during die casting, so that the bottom plate 311 has the hole 3110.

In addition, in this embodiment, the heat conductive cover part 330 further has a plurality of partition plates 335. These partition plates 335 separate the heat dissipation channels 334 connected to the holes 3110. In other embodiments, the number of heat dissipation channels may also be single. In other words, in other embodiments, the heat conductive cover part may not need to have partition plates.

In addition, in this embodiment, as shown in FIG. 2 , two sealing pads 400 are respectively sandwiched between the two side plates 312 and the first circuit board 110 to improve the airtightness between the heat sink fin assembly 300 and the first circuit board 110. The two sealing pads 400 are, for example, foam. It should be noted that in other embodiments, if the power of the first heat source and the second heat source is relatively low, the electronic assembly may not need to include the sealing pad 400.

In addition, in this embodiment, as shown in FIG. 4 , the arrangement direction A of the heat dissipation channels 334 is, for example, perpendicular to the protruding direction P of the fin portions 320 protruding from the bottom plate 311. Therefore, the cold air can flow through the heat dissipation channels 334 and flow to the fin portions 320 more smoothly. In other words, the resistance of the cold air flowing through the heat dissipation channels 334 and flowing to the fin portions 320 will be relatively small. However, in other embodiments, if the power of the first heat source and the second heat source is relatively low, the arrangement direction of the heat dissipation channels can also be parallel to the protruding direction of the fin portions protruding from the bottom plate.

In addition, in this embodiment, as shown in FIG. 4 , the wind shielding film 500 is disposed on a side of the bottom plate 311 away from the fin portion 320 and the heat conductive cover portion 330 and covers the hole 3110 to improve the airtightness between the heat dissipation fin assembly 300 and the first circuit board 110. The wind shielding film 500 is, for example, Mylar. It should be noted that in other embodiments, if the power of the first heat source and the second heat source is relatively low, the electronic component may not need to include the wind shielding film 500.

Please refer to FIG. 1 and FIG. 2 again, the fan 600 and the first circuit board assembly 100 are located on the same side of the heat sink fin assembly 300. The fan 600 can be fixed to the base portion 310 of the heat sink fin assembly 300, for example, and is used to guide an airflow (not shown) through the heat dissipation channel 334 and flow to the fin portion 320. In other embodiments, the electronic assembly may not include the fan 600, and a fan outside the electronic assembly may be used to guide the airflow.

According to the electronic assembly disclosed in the above-mentioned embodiment, the base portion of the heat sink fin assembly is thermally coupled to the second heat source, and the opposite sides of the heat conductive cover portion are thermally coupled to the base portion of the heat sink fin assembly and the first heat source, respectively, and the heat conductive cover portion surrounds at least one heat dissipation channel. Through the above-mentioned configuration of the heat conductive cover portion, the heat conductive cover portion can not only serve as a heat transfer medium for the first heat source and the heat sink fin assembly, but also can avoid the problem of blocking cold air through the design of the heat dissipation channel. Therefore, only through the cooperation of a single heat sink fin assembly and its heat conductive cover portion, the heat generated by the first heat source and the second heat source can be effectively absorbed, thereby saving the cost of manufacturing multiple heat sink fin assemblies with complex structures. In this way, the heat dissipation efficiency of the first circuit board assembly and the second circuit board assembly and the manufacturing cost of the electronic assembly can be taken into consideration.

In addition, the base portion has a hole connected to the heat dissipation channel. In other words, the base portion, the fin portion and the heat conductive cover portion of the heat dissipation fin assembly are formed in one piece by, for example, a mold misalignment (i.e., by breaking) during die casting. In this way, there is no need to spend money to assemble the heat conductive cover portion to the base portion, thereby further reducing the manufacturing cost of the electronic component.

In one embodiment of the present invention, the electronic component of the present invention can be applied to a server, and the server can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, cloud server or Internet of Vehicles server.

In one embodiment of the present invention, the electronic component of the present invention can be applied to vehicle-mounted devices, such as vehicle-mounted computers or servers of in-vehicle infotainment (IVI) systems, etc.; it can also be applied to 5G servers, cloud servers or vehicle-connected Internet servers.

Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone skilled in similar techniques may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

10: electronic component 100: first circuit board assembly 110: first circuit board 120: first heat source 200: second circuit board assembly 210: second circuit board 220: second heat source 300: heat dissipation fin assembly 310: base 311: bottom plate 3110: hole 312: side plate 315: vent 320: fin part 330: heat conductive cover part 331: first thermal coupling surface 332: second thermal coupling surface 333: ventilation surface 334: heat dissipation channel 335: partition plate 340: heat conductive bump 400: sealing pad 500: wind shield film 600: fan S: stacking direction A: arrangement direction P: protrusion direction

FIG. 1 is a three-dimensional view of an electronic component according to an embodiment of the present invention. FIG. 2 is a schematic side-sectional view of the electronic component in FIG. 1 along the cutting line 2-2. FIG. 3 is a three-dimensional view of the heat sink fin assembly of the electronic component in FIG. 1. FIG. 4 is a partial enlarged view of the electronic component in FIG. 2.

110: First circuit board

120: First heat source

311: Base plate

3110:Broken hole

320: Fins

330: Heat-conducting cover

331: First thermal coupling surface

332: Second thermal coupling surface

333: Ventilated noodles

334: Heat dissipation channel

335:Separator

500: Windproof film

A: Arrangement direction

P: bulge direction

Claims (10)

An electronic component includes: a first circuit board assembly, including a first circuit board and a first heat source disposed on the first circuit board; a second circuit board assembly, including a second circuit board and a second heat source disposed on the second circuit board, the first circuit board and the second circuit board are spaced apart; and a heat dissipation fin assembly, which is between the first circuit board and the second circuit board and includes a base portion, a plurality of fin portions and a heat conductive cover portion, the base portion having a hole, the fin portions and the heat conductive cover portion protruding from the same side of the base portion, the heat conductive cover portion shielding the hole and surrounding at least one heat dissipation channel connected to the hole, the base portion being thermally coupled to the second heat source, and opposite sides of the heat conductive cover portion being thermally coupled to the base portion and the first heat source respectively. An electronic component as described in claim 1, wherein the base portion, the fin portions and the heat conductive cover portion are integrally formed. An electronic assembly as described in claim 1, wherein the first heat source and the second heat source are offset from each other along a stacking direction of the first circuit board and the second circuit board. The electronic assembly as described in claim 1 further comprises a wind shielding film, which is arranged on a side of the base portion away from the fin portions and the heat conductive cover portion and covers the hole. An electronic component as described in claim 1, wherein the heat-conducting cover portion has a first thermal coupling surface, a second thermal coupling surface, two ventilation surfaces and at least one heat dissipation channel, the first thermal coupling surface and the second thermal coupling surface are opposite to each other, the two ventilation surfaces are opposite to each other and connect the first thermal coupling surface and the second thermal coupling surface, the at least one heat dissipation channel passes through the two ventilation surfaces, the first thermal coupling surface and the second thermal coupling surface are thermally coupled to the base portion and the first heat source respectively, and the hole is located at the connection between the first thermal coupling surface and the base portion. An electronic component as described in claim 5, wherein the heat conductive cover portion further has at least one partition plate, the number of the at least one heat dissipation channel is multiple, and the at least one partition plate separates the heat dissipation channels connected to the hole. An electronic component as described in claim 6, wherein the arrangement direction of the heat dissipation channels is perpendicular to the protrusion direction of the fin portions from the base portion. An electronic component as described in claim 5, wherein the base portion includes a bottom plate and two side plates, the two side plates are respectively connected to opposite sides of the bottom plate, so that the two side plates and the bottom plate together form two vents, the hole is located in the bottom plate, the fin portions and the heat-conducting cover portion protrude from the same side of the bottom plate, a side of the bottom plate away from the fin portions is thermally coupled to the second heat source, and the two ventilation surfaces of the heat-conducting cover portion face the two vents respectively. The electronic assembly as described in claim 8 further includes two sealing pads, which are respectively sandwiched between the two side plates and the first circuit board. The electronic assembly as described in claim 1 further includes a fan, which is located on the same side of the heat sink fin assembly as the first circuit board assembly. The fan is fixed to the base portion of the heat sink fin assembly and is used to guide an air flow through the at least one heat sink channel and flow to the fin portions.

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