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TWI880722B - Automated pyrometer tracking - Google Patents

Automated pyrometer tracking Download PDF

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Publication number
TWI880722B
TWI880722B TW113115404A TW113115404A TWI880722B TW I880722 B TWI880722 B TW I880722B TW 113115404 A TW113115404 A TW 113115404A TW 113115404 A TW113115404 A TW 113115404A TW I880722 B TWI880722 B TW I880722B
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Taiwan
Prior art keywords
laser
pyrometer
measuring device
mold
laser beam
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TW113115404A
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Chinese (zh)
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TW202445111A (en
Inventor
路克 沃克
奧斯汀 祖德爾
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美商賀利氏科納米北美有限責任公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/0275Control or determination of height or distance or angle information for sensors or receivers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/105Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/04Casings
    • G01J5/047Mobile mounting; Scanning arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2203/00Controlling
    • B22F2203/11Controlling temperature, temperature profile

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Components, systems, assemblies, and methods related thereto for automatic alignment of a temperature measurement device with a die cavity in a sintering process are described. These include monitoring temperature of a location on a die, and include a pyrometer, laser measuring devices mounted to the pyrometer, and projecting a laser beam and measuring distance from the laser measuring device to a location on which the laser beam is projected. Each laser device outputs a signal and an actuator adjusts the pyrometer position in accordance with these signals.

Description

自動化高溫計追蹤Automated Pyrometer Tracking

本發明係關於用於火花電漿燒結(亦已知為直流燒結)之方法及系統,其中使用溫度測量裝置以監測在加工期間經歷諸如垂直、水平、或其組合之運動的模具上之特定位置的溫度。The present invention relates to methods and systems for spark plasma sintering (also known as DC sintering) in which a temperature measurement device is used to monitor the temperature of specific locations on a mold that undergoes motion, such as vertical, horizontal, or a combination thereof, during processing.

火花電漿燒結(spark plasma sintering,「SPS」)(亦稱為直流燒結(direct current sintering,「DCS」)及場輔助燒結技術(field assisted sintering technique,「FAST」))係能夠加工導電及非導電材料的壓力輔助燒結技術。SPS/DCS提供更快速的緻密化及材料性質增強,其機制仍在研究中。然而,最普遍接受的機制係更快的加熱速率、焦耳加熱、及可能的對緻密化的電場影響。Spark plasma sintering (SPS) (also known as direct current sintering (DCS) and field assisted sintering technique (FAST)) is a pressure-assisted sintering technique capable of processing both conductive and non-conductive materials. SPS/DCS provides faster densification and material property enhancement, the mechanisms of which are still under investigation. However, the most commonly accepted mechanisms are faster heating rates, Joule heating, and possibly the effect of the electric field on densification.

在典型SPS/DCS程序期間,開-關(ON-OFF)(通常係方波DC脈衝或連續直流電)經施加至衝頭及模具類型工具組內所含的粉末(該粉末一般由石墨構成,但不排除金屬、陶瓷、或複合物),以產生焦耳熱及含有壓力。石墨係最常見的材料,因為其係良好的電導體,且對極高的溫度係穩定的。縮寫DCS有時用以指示將非脈衝直流電提供至模具之系統。然而,SPS及DCS經常用以意指相同類型的設備且在本文中可互換地使用。在SPS/DCS設備中,該熱藉由來自模具的熱傳導而傳遞至粉末,且若粉末係導電的,則電流可流過粉末,而直接在被燒結的材料內產生焦耳熱。During a typical SPS/DCS process, an ON-OFF current (usually a square wave DC pulse or a continuous DC current) is applied to a powder (generally composed of graphite, but not excluding metals, ceramics, or composites) contained in a punch and die type tool set to generate Joule heat and contain pressure. Graphite is the most common material because it is a good conductor of electricity and is stable to extremely high temperatures. The abbreviation DCS is sometimes used to indicate a system that provides non-pulsed DC power to the die. However, SPS and DCS are often used to mean the same type of equipment and are used interchangeably herein. In an SPS/DCS equipment, the heat is transferred to the powder by thermal conduction from the die, and if the powder is conductive, the current can flow through the powder to generate Joule heat directly in the material being sintered.

SPS設備中的操作或監測溫度範圍在200℃至2400℃之範圍。相較於先前技術,SPS設備中的材料加工(壓力及溫度上升及保持時間)一般在更短的期間內完成。更快的加工時間提供對於晶粒生長及微結構更大的控制,而增強與微結構直接相關的材料性質,諸如強度、韌性、電性質、熱性質、光學性質、及抗腐蝕及沖蝕性。The operating or monitoring temperature range in SPS equipment is in the range of 200°C to 2400°C. Material processing (pressure and temperature ramp and hold time) in SPS equipment is generally completed in a shorter period of time than in previous technologies. Faster processing times provide greater control over grain growth and microstructure, which enhances material properties directly related to microstructure, such as strength, toughness, electrical properties, thermal properties, optical properties, and corrosion and erosion resistance.

一般使用定位於模具範圍內的熱電偶或高溫計來監測燒結期間的溫度。由於工具中存在電場,因此熱電偶由於其等對雜散電壓的靈敏度而較不佳。為了確保最佳的燒結條件,重要的是識別一致的控制點且在整個程序中監測該定位的溫度。然而,在燒結製程期間,發生粉末的壓實及緻密化,導致在形成燒結產物時動態定位高溫計的需求。更具體而言,高溫計必須移動的原因係模具殼體本身在壓實及緻密化期間移動。高溫計相對於模具的重新定位一般係手動完成,其常難以一致地且以及時方式進行,此係因為最佳定位隨著燒結時間而改變。不準確度造成產物品質的變化性,特別是運行間。Temperature during sintering is typically monitored using a thermocouple or pyrometer positioned within the confines of the mold. Thermocouples are less effective due to their sensitivity to stray voltages due to the presence of electric fields in the tool. In order to ensure optimal sintering conditions, it is important to identify a consistent control point and monitor the temperature at that location throughout the process. However, during the sintering process, compaction and densification of the powder occurs, resulting in the need to dynamically position the pyrometer as the sintered product is formed. More specifically, the reason the pyrometer must be moved is because the mold shell itself moves during compaction and densification. Repositioning of the pyrometer relative to the mold is typically done manually, which is often difficult to do consistently and in a timely manner because the optimal positioning changes over sintering time. Inaccuracies cause variability in product quality, especially from run to run.

用於在燒結中之自動高溫計追蹤的組件及方法係已知的,諸如在下列先前技術專利案、專利公開案、及非專利文獻(若有)(其等在附錄中見到且其等全文以引用方式併入)中見到者,其等僅出於先前技術目的且與目前最佳技術相關而揭示,但不含本發明之元件之一或多者:例如,在美國專利公開案第2016/0325353號及美國專利案第4,936,765號中,且可在附錄中見到。Components and methods for automatic pyrometer tracking in sintering are known, such as those found in the following prior art patents, patent publications, and non-patent documents (if any) (which are found in the Appendix and are incorporated by reference in their entirety), which are disclosed solely for prior art purposes and in relation to the best current technology, but do not contain one or more of the elements of the present invention: for example, in U.S. Patent Publication No. 2016/0325353 and U.S. Patent No. 4,936,765, and can be found in the Appendix.

實際上,典型SPS/DCS設備的基本方塊圖可在美國專利公開案第2016/0325353號(參見附錄)中見到,包括本發明之SPS/DCS系統。如美國專利公開案第2016/0325353號的圖1所示,燒結設備 100包括位於承載架 104內的真空腔室 102,且進一步包括觀察窗口 106及溫度測量裝置 108,兩者均併入至真空腔室 102中。待燒結之材料(一般係粉末材料)經裝載至模具組 111中並放置於燒結設備 100的真空腔室 102內,其中執行程序。更具體而言,如圖所示,模具組 111包括殼體 112及兩個相對的柱塞(下柱塞 120及上柱塞 122),形成待燒結之材料放置在其中的模具空腔 110。燒結設備 100進一步包括液壓動力單元 116及液壓缸 118。液壓動力單元將動力提供至液壓缸,其繼而用以上下移動下柱塞及上柱塞,以操縱所施加之機械力(或壓力),從而在程序期間壓縮可燒結材料。可諸如使用測力計(load cell)來測量及監測力。額外地,DC電源供應器 114在壓縮期間於真空腔室 102內提供必要的電流。如圖所示,燒結設備 100亦包括真空泵 124,其允許設備在負大氣壓力下操作。若在程序期間所欲,氣體 126亦可注入至真空腔室 102中。中央控制系統 128可用以在使用期間控制燒結設備的不同態樣。例如,控制系統可用以控制DC電源供應器、液壓動力單元、真空泵,以及控制在使用期間引入至真空腔室的任何惰性氣體量。 In fact, the basic block diagram of a typical SPS/DCS apparatus can be found in U.S. Patent Publication No. 2016/0325353 (see Appendix), including the SPS/DCS system of the present invention. As shown in FIG. 1 of U.S. Patent Publication No. 2016/0325353, the sintering apparatus 100 includes a vacuum chamber 102 located in a carrier 104 , and further includes an observation window 106 and a temperature measurement device 108 , both of which are incorporated into the vacuum chamber 102. The material to be sintered (generally a powder material) is loaded into a mold set 111 and placed in the vacuum chamber 102 of the sintering apparatus 100 , where a process is performed. More specifically, as shown, the mold assembly 111 includes a housing 112 and two opposing plungers (a lower plunger 120 and an upper plunger 122 ) forming a mold cavity 110 in which the material to be sintered is placed. The sintering apparatus 100 further includes a hydraulic power unit 116 and a hydraulic cylinder 118. The hydraulic power unit provides power to the hydraulic cylinder, which in turn is used to move the lower plunger and the upper plunger up and down to manipulate the applied mechanical force (or pressure) to compress the sinterable material during the process. The force can be measured and monitored, for example, using a load cell. Additionally, a DC power supply 114 provides the necessary current within the vacuum chamber 102 during compression. As shown, the sintering apparatus 100 also includes a vacuum pump 124 that allows the apparatus to operate under negative atmospheric pressure. If desired during the process, a gas 126 can also be injected into the vacuum chamber 102. A central control system 128 can be used to control various aspects of the sintering apparatus during use. For example, the control system can be used to control the DC power supply, the hydraulic power unit, the vacuum pump, and control the amount of any inert gas introduced into the vacuum chamber during use.

額外地,如美國專利公開案第2016/0325353號(參見附錄)的圖2所示,模具組 211包含殼體 212及兩個相對的柱塞(下柱塞 220及上柱塞 222),形成待燒結之材料 205(粉末)放置在其中的模具空腔。如圖所示,模具空腔係垂直對稱的,雖然其他形狀亦係可行的。模具空腔的目標位置經識別,其在此實例中係材料的幾何中心線。假設整個樣本(特別是垂直地)的密度恆定並加熱,此將係相對於粉末的最高可測量溫度的定位。如美國專利公開案第2016/0325353(參見附錄)的圖2中可看到,當粉末經燒結以形成所欲燒結部分 295時,中心線的定位改變。 Additionally, as shown in FIG. 2 of U.S. Patent Publication No. 2016/0325353 (see Appendix), a mold assembly 211 includes a housing 212 and two opposing plungers (lower plunger 220 and upper plunger 222 ) forming a mold cavity in which the material 205 (powder) to be sintered is placed. As shown, the mold cavity is vertically symmetrical, although other shapes are possible. The target position of the mold cavity is identified, which in this example is the geometric centerline of the material. Assuming that the density is constant throughout the sample (especially vertically) and heating is applied, this will be the location relative to the highest measurable temperature of the powder. As can be seen in FIG. 2 of U.S. Patent Publication No. 2016/0325353 (see Appendix), when the powder is sintered to form the desired sintered portion 295 , the positioning of the centerline changes.

先前技術並未揭示具有足夠準確度之提供用於場輔助燒結裝置之模具中的高溫計孔或凹部的無人式追蹤之方法或系統。The prior art does not disclose a method or system that provides unmanned tracking of pyrometer holes or recesses in a mold for a field assisted sintering apparatus with sufficient accuracy.

因此,雖然火花電漿方法及系統係已知的,但需要提供用於在循環期間及循環之間改善程序一致性之燒結系統及方法兩者。Therefore, while spark plasma methods and systems are known, there is a need to provide both a sintering system and method for improving process consistency both during and between cycles.

為了滿足此等及其他需求,並鑑於其目的,本揭露係關於用於在一燒結程序中將一溫度測量裝置與一模具空腔對準之組件及其相關方法。To meet these and other needs, and with these objectives in mind, the present disclosure relates to assemblies and related methods for aligning a temperature measurement device with a mold cavity during a sintering process.

在一個態樣中,本揭露描述一種用於監測一模具上之一位置的溫度之系統。該系統包括一高溫計,其具有一端,該高溫計經組態以基於在該高溫計之該端處所接收之熱輻射的強度而測量溫度,且該高溫計具有相對的側。In one aspect, the present disclosure describes a system for monitoring the temperature of a location on a mold. The system includes a pyrometer having one end, the pyrometer being configured to measure the temperature based on the intensity of thermal radiation received at the end of the pyrometer, and the pyrometer having opposing sides.

該系統亦包括第一雷射測量裝置及第二雷射測量裝置,其等安裝至該高溫計,該等雷射測量裝置之一者安裝在該高溫計的一個側附近,且該另一雷射測量裝置安裝在該高溫計之相對的該側附近,各雷射測量裝置投射一雷射束,並測量從該雷射測量裝置至該雷射束投射至其上之一位置的距離,各雷射測量裝置輸出指示經測量的該距離小於或等於一最小距離的一信號。該系統包括一致動器,其與各雷射測量裝置通訊連接並接收自各雷射測量裝置輸出的該信號,該致動器支撐該高溫計,且根據自該等雷射測量裝置接收的該等信號在彼此相對的第一方向及第二方向上移動該高溫計,直到經接收的各信號指示經測量的該距離不小於或等於該最小距離。The system also includes a first laser measurement device and a second laser measurement device, which are mounted to the pyrometer, one of the laser measurement devices is mounted near one side of the pyrometer, and the other laser measurement device is mounted near the opposite side of the pyrometer, each laser measurement device projects a laser beam and measures the distance from the laser measurement device to a location on which the laser beam is projected, and each laser measurement device outputs a signal indicating that the measured distance is less than or equal to a minimum distance. The system includes an actuator that is communicatively connected to each laser measuring device and receives the signal output from each laser measuring device. The actuator supports the pyrometer and moves the pyrometer in a first direction and a second direction relative to each other according to the signals received from the laser measuring devices until the received signals indicate that the measured distance is not less than or equal to the minimum distance.

當經接收的各信號指示經測量的該距離大於該最小距離時,該高溫計的該端相對於該模具上的該位置而定位,以用於自其接收熱輻射,並基於該熱輻射的該強度而輸出一溫度信號。When the received signals indicate that the measured distance is greater than the minimum distance, the end of the pyrometer is positioned relative to the location on the mold to receive thermal radiation therefrom and output a temperature signal based on the intensity of the thermal radiation.

該高溫計包括一頂部及一底部,其中該雷射測量裝置之一者安裝在該高溫計的該頂部附近,且該另一雷射測量裝置安裝在該模具的該底部附近,且該致動器將該高溫計向上及向下移動。當該致動器接收來自該等雷射測量裝置之一者的一信號時,該致動器將該高溫計向下移動,且當該致動器接收來自該另一雷射測量裝置的一信號時,該致動器將該高溫計向上移動。然而,若該系統接收來自該等雷射測量裝置兩者的一信號,該致動器並未調整該高溫計的該定位。The pyrometer includes a top and a bottom, wherein one of the laser measurement devices is mounted near the top of the pyrometer and the other laser measurement device is mounted near the bottom of the mold, and the actuator moves the pyrometer up and down. When the actuator receives a signal from one of the laser measurement devices, the actuator moves the pyrometer downward, and when the actuator receives a signal from the other laser measurement device, the actuator moves the pyrometer upward. However, if the system receives a signal from both of the laser measurement devices, the actuator does not adjust the positioning of the pyrometer.

該模具包括一高度,且該致動器將該高溫計平行於該模具的該高度移動。在另一態樣中,該雷射測量裝置沿著該模具的該高度垂直地對準。在一進一步態樣中,各雷射測量裝置安裝在距該模具的一相等距離,其中該距離係自最接近該雷射測量裝置之該模具的該外側壁上的一點而測量。進一步,該致動器係可程式化。The mold includes a height, and the actuator moves the pyrometer parallel to the height of the mold. In another aspect, the laser measurement device is vertically aligned along the height of the mold. In a further aspect, each laser measurement device is mounted at an equal distance from the mold, wherein the distance is measured from a point on the outer wall of the mold closest to the laser measurement device. Further, the actuator is programmable.

在另一態樣中,本揭露描述一種使用一溫度測量裝置追蹤一模具中的一凹部之方法。該方法包括:將一第一雷射及一第二雷射相對地安裝至一溫度測量裝置以建立一高溫計總成;使用該第一雷射以將一雷射束投射至該凹部中以測量一第一雷射束距離,並將該第二雷射束投射至該凹部中以測量一第二雷射束距離來將該溫度測量裝置與該凹部對準;及當偵測到該第一雷射束距離或該第二雷射束距離的一減小時,藉由移動該高溫計總成而將該溫度測量裝置與該凹部重新對準,使得該第一雷射束及該第二雷射束被投射至該凹部中。In another aspect, the present disclosure describes a method for tracking a recess in a mold using a temperature measurement device. The method includes: mounting a first laser and a second laser to a temperature measurement device in opposition to each other to create a pyrometer assembly; aligning the temperature measurement device with the recess using the first laser to project a laser beam into the recess to measure a first laser beam distance and projecting the second laser beam into the recess to measure a second laser beam distance; and when a decrease in the first laser beam distance or the second laser beam distance is detected, realigning the temperature measurement device with the recess by moving the pyrometer assembly so that the first laser beam and the second laser beam are projected into the recess.

該模具包括一高度,且該安裝步驟包括沿著該模具的該高度相對地安裝該第一雷射及該第二雷射。當偵測到該第一雷射束距離的一減小時,該高溫計總成在一第一方向上移動,且當偵測到該第二雷射束距離的一減小時,該高溫計總成在與該第一方向相對的一第二方向上移動。The mold includes a height, and the mounting step includes mounting the first laser and the second laser relatively along the height of the mold. When a decrease in the distance of the first laser beam is detected, the pyrometer assembly moves in a first direction, and when a decrease in the distance of the second laser beam is detected, the pyrometer assembly moves in a second direction opposite to the first direction.

各雷射與一雷射測量裝置整合,該雷射測量裝置偵測雷射束距離何時存在一減小並提供一信號。該方法之進一步包括將該高溫計總成安裝至一致動器而使用該致動器接收該等信號之步驟,及執行藉由使用該致動器根據所接收之該信號移動該高溫計總成而重新對準之步驟。Each laser is integrated with a laser measurement device that detects when there is a decrease in laser beam distance and provides a signal. The method further includes the steps of mounting the pyrometer assembly to an actuator and receiving the signals using the actuator, and performing a realignment step by moving the pyrometer assembly using the actuator in accordance with the received signals.

該方法額外包括將該高溫計總成安裝至一致動器並使用該致動器以執行該對準步驟及該重新對準步驟之步驟。該安裝步驟包括距該模具上最接近各雷射的一點等距地安裝該等雷射。The method further includes the steps of mounting the pyrometer assembly to an actuator and using the actuator to perform the aligning step and the realigning step. The mounting step includes mounting the lasers equidistant from a point on the mold that is closest to each laser.

在又另一態樣中,本揭露描述一種形成一燒結產物之方法,其以任何順序包含以下步驟:i)將待燒結的一材料裝載至一模具組的一模具空腔中,該模具組包含一殼體及經組態以壓縮該材料的相對的柱塞;ii)將該模具組放置至一燒結設備的一真空腔室中,該燒結設備包含:一溫度測量裝置,其經組態以在燒結期間判定該模具空腔中之材料的溫度;及一控制系統,其經組態以在燒結期間移動該溫度測量裝置;iii)使用一溫度測量裝置的一第一雷射及一第二雷射將該溫度測量裝置相對於該模具空腔的一目標位置定位以建立一高溫計總成;使用該第一雷射以將一雷射束投射至該模具空腔中以建立一第一雷射束距離,並使用該第二雷射束以投射至該模具空腔中以建立一第二雷射束距離來將該溫度測量裝置與該模具空腔對準;當偵測到該第一雷射束距離或該第二雷射束距離的一減小時,藉由移動該高溫計總成而將該溫度測量裝置與該模具空腔自動地重新對準,使得該第一雷射束及該第二雷射束被投射至該模具空腔中,及iv)壓縮地燒結該模具空腔中的該材料以形成該燒結產物,其中在該壓縮燒結期間,使用該控制系統移動該溫度測量裝置,以維持與該模具空腔的該目標位置的相對定位。In yet another aspect, the present disclosure describes a method for forming a sintered product, which includes the following steps in any order: i) loading a material to be sintered into a mold cavity of a mold set, the mold set including a shell and opposing plungers configured to compress the material; ii) placing the mold set into a vacuum chamber of a sintering apparatus, the sintering apparatus including: a temperature measuring device configured to determine the temperature of the material in the mold cavity during sintering; and a control system configured to move the temperature measuring device during sintering; iii) using a first laser and a second laser of a temperature measuring device to position the temperature measuring device relative to a target position of the mold cavity to establish a pyrometer assembly; using The first laser projects a laser beam into the mold cavity to establish a first laser beam distance, and uses the second laser beam to project into the mold cavity to establish a second laser beam distance to align the temperature measurement device with the mold cavity; when a decrease in the first laser beam distance or the second laser beam distance is detected, the temperature measurement device is automatically realigned with the mold cavity by moving the pyrometer assembly so that the first laser beam and the second laser beam are projected into the mold cavity, and iv) compressionally sintering the material in the mold cavity to form the sintered product, wherein during the compression sintering, the temperature measurement device is moved using the control system to maintain relative positioning with the target position of the mold cavity.

在前述方法的更詳細態樣中,該燒結設備進一步包含與該溫度測量裝置及該控制系統通訊的一重新定位裝置,且其中使用該控制系統藉由該重新定位裝置移動該溫度測量裝置。在該方法的又更多細節中,該模具組包括一外殼體、一上柱塞、及一下柱塞,且移動該溫度測量裝置之該步驟包括判定該上柱塞、該下柱塞、或兩者的一定位。在又進一步細節中,該溫度測量裝置在該壓縮燒結期間連續地移動。更細節地,移動該溫度測量裝置係自動的,且該燒結設備係一火花電漿燒結設備或一直流燒結設備。In a more detailed aspect of the aforementioned method, the sintering apparatus further comprises a repositioning device in communication with the temperature measuring device and the control system, and wherein the temperature measuring device is moved by the repositioning device using the control system. In still more details of the method, the mold assembly comprises a housing, an upper plunger, and a lower plunger, and the step of moving the temperature measuring device comprises determining a position of the upper plunger, the lower plunger, or both. In still further details, the temperature measuring device moves continuously during the compression sintering. In more detail, moving the temperature measuring device is automatic, and the sintering apparatus is a spark plasma sintering apparatus or a DC sintering apparatus.

在另一態樣上,本揭露描述一種自動高溫計追蹤之控制系統,其包含:一模具,其具有一模具空腔,該模具具有一溫度測量裝置開口,該溫度測量裝置開口具有具有一目標深度的一第一邊緣部分及一第二邊緣部分;一第一雷射,其具有一第一雷射束;一第二雷射,其具有一第二雷射束;一溫度測量裝置,其用於透過該溫度測量裝置開口而觀察該模具的一溫度;及至少一感測器,其用以測量至該目標深度的一第一雷射束距離、及至該目標深度的一第二雷射束距離;且其中該第一雷射及該第二雷射安裝在該溫度測量裝置的相對的側上,建立一高溫計總成;且其中該第一雷射束位於該第一邊緣部分附近,且該第二雷射束位於該第二邊緣部分附近,使得該第一雷射束及該第二雷射束接觸該目標深度,建立該第一雷射束距離及該第二雷射束距離;且其中該至少一感測器偵測該第一雷射束距離及該第二雷射束距離,且其中若該至少一感測器偵測到該第一雷射束距離或該第二雷射束距離的一減小,則該感測器提供一信號以重新對準該高溫計總成,所以該至少一感測器偵測到至該目標的一第一雷射束距離、及至該目標的一第二雷射束距離。In another aspect, the present disclosure describes an automatic pyrometer tracking control system, comprising: a mold having a mold cavity, the mold having a temperature measurement device opening, the temperature measurement device opening having a first edge portion and a second edge portion having a target depth; a first laser having a first laser beam; a second laser having a second laser beam; a temperature measurement device for observing a temperature of the mold through the temperature measurement device opening; and at least one sensor for measuring a first laser beam distance to the target depth and a second laser beam distance to the target depth; and wherein the first laser and the second laser are mounted on the temperature measurement device. A pyrometer assembly is established on opposite sides of the device; and wherein the first laser beam is located near the first edge portion, and the second laser beam is located near the second edge portion, so that the first laser beam and the second laser beam contact the target depth, establishing the first laser beam distance and the second laser beam distance; and wherein the at least one sensor detects the first laser beam distance and the second laser beam distance, and wherein if the at least one sensor detects a decrease in the first laser beam distance or the second laser beam distance, the sensor provides a signal to realign the pyrometer assembly, so that the at least one sensor detects a first laser beam distance to the target, and a second laser beam distance to the target.

透過本文較佳實施例的詳細描述及相關附圖的繪示,本發明之結構、整體操作、及技術特徵將變得顯而易見。Through the detailed description of the preferred embodiments herein and the illustrations of the related drawings, the structure, overall operation, and technical features of the present invention will become apparent.

應理解,前述的大致描述及下列的實施方式兩者皆僅係例示性及解釋性的,且意欲提供如所主張之本發明的進一步解釋。It should be understood that both the foregoing general description and the following embodiment are exemplary and explanatory only and are intended to provide further explanation of the invention as claimed.

本發明係關於用於在壓縮下燒結材料之方法及系統/設備。The present invention relates to methods and systems/apparatus for sintering materials under compression.

大致上,壓縮燒結程序,諸如熱壓及火花電漿燒結(SPS)(SPS亦已知為直流燒結(DCS))涉及使用壓力及高溫,以將待燒結之材料(特別是呈微粒或粉末(精細微粒)形式)轉換成更高密度的產物。SPS係壓力輔助的直流加熱燒結程序,其利用單軸力及直流電以固結粉末材料。具體而言,DC電壓及電流經施加至導電模具總成(模具組)。與熱必須藉由輻射加熱元件自外部傳遞至模具組中的習知熱壓相比,由於熱在模具組內且潛在地在粉末內產生,因此可達成高加熱速率。在SPS燒結期間,熱在模具之材料中及周圍產生,快速地加熱該材料並由於程序的速度而限制粒子/晶粒生長。從粉末至成品燒結樣本的整個程序以高均勻性更快地完成。Generally, compression sintering processes, such as hot pressing and spark plasma sintering (SPS) (SPS is also known as direct current sintering (DCS)) involve the use of pressure and high temperature to convert the material to be sintered, especially in the form of particles or powder (fine particles), into a higher density product. SPS is a pressure-assisted direct current heating sintering process that uses uniaxial force and direct current to consolidate powdered materials. Specifically, DC voltage and current are applied to a conductive mold assembly (mold set). Compared to conventional hot pressing, where heat must be transferred from the outside into the mold set by radiation heating elements, high heating rates can be achieved because the heat is generated within the mold set and potentially within the powder. During SPS sintering, heat is generated in and around the material in the mold, rapidly heating the material and limiting particle/grain growth due to the speed of the process. The entire process from powder to finished sintered sample is completed faster with high uniformity.

在SPS程序中,據信由於表面氧化物的介電崩潰及局部加熱,在粒子之間流動的電流可輔助移除粒子表面上及之間的精細雜質及氣體。額外地,可達成之較高加熱率允許精細粉末在可發生晶粒粗化之前被加熱至高溫,允許粉末保留高表面積以有助於燒結程序,其進展得更快速。In the SPS process, it is believed that the current flowing between the particles can assist in the removal of fine impurities and gases on and between the particle surfaces due to dielectric collapse and localized heating of the surface oxide. Additionally, the higher heating rates that can be achieved allow fine powders to be heated to high temperatures before grain coarsening can occur, allowing the powder to retain a high surface area to aid in the sintering process, which proceeds more rapidly.

力(壓力)在限制微粒生長及影響SPS系統的整體密度上亦發揮重要且可預測的作用。例如,當材料在壓力下移動時,特別是在早期燒結階段期間,力使整個樣本的擴散倍增。壓力太大及太小兩者皆可負面地影響該程序。在需要高密度的大型樣本中,力通常階段式增加以增強低溫下的除氣及高溫下的燒結擴散。據此,準確地操縱力可增強該程序。Force (pressure) also plays an important and predictable role in limiting particle growth and affecting the overall density of the SPS system. For example, when the material moves under pressure, especially during the early sintering stages, the force multiplies the diffusion of the entire sample. Both too much and too little pressure can negatively affect the process. In large samples where high density is required, the force is often increased in stages to enhance outgassing at low temperatures and sintering diffusion at high temperatures. Accordingly, accurate manipulation of force can enhance the process.

對於壓縮燒結系統,需要準確地判定溫度,以監測及控制該程序,從而一致地生產具有所欲及可預測性質的燒結產物。當該材料被固結及壓縮時,跨產物的溫度分布改變。例如,最高溫度跨材料的定位改變,且結果在燒結程序期間必須重新定位溫度測量裝置(諸如高溫計)以追蹤及維持對此定位的監測,以提供準確的程序控制。此一般係手動地完成,準確地進行其係耗時的,特別是對於需要數個小時的燒結項目。因此,在本發明之方法及設備中,一控制系統用以評定溫度測量裝置對模具組之模具空腔的目標位置的相對定位,其中控制系統造成溫度測量裝置的重新定位,從而維持恆定的相對定位。For compression sintering systems, temperatures need to be accurately determined in order to monitor and control the process to consistently produce sintered products with desired and predictable properties. As the material is consolidated and compressed, the temperature distribution across the product changes. For example, the highest temperature changes across the location of the material, and as a result, the temperature measuring device (such as a pyrometer) must be repositioned during the sintering process to track and maintain monitoring of this location to provide accurate process control. This is generally done manually, which is time consuming to do accurately, especially for sintering projects that take several hours. Therefore, in the method and apparatus of the present invention, a control system is used to assess the relative positioning of a temperature measuring device to a target position of a mold cavity of a mold assembly, wherein the control system causes a repositioning of the temperature measuring device to maintain a constant relative positioning.

具體實例在圖3及圖4中顯示。然而,對於所屬技術領域中具有通常知識者應顯而易見的是,此本質上僅是說明性而非限制性,僅以舉實例而呈現。許多修改及其他實施例係在所屬技術領域中具有通常知識者的範圍內,且設想為落入本發明的範圍內。額外地,所屬技術領域中具有通常知識者應瞭解,特定條件及組態係例示性的,且實際條件及組態將取決於特定系統。使用不多於例行實驗,所屬技術領域中具有通常知識者亦將能夠認知並識別所示之特定元件的等效物。Specific examples are shown in Figures 3 and 4. However, it should be apparent to those skilled in the art that this is merely illustrative and non-restrictive in nature and is presented by way of example only. Many modifications and other embodiments are within the skill of those skilled in the art and are contemplated to fall within the scope of the present invention. Additionally, those skilled in the art will appreciate that the specific conditions and configurations are exemplary and that actual conditions and configurations will depend on the particular system. Using no more than routine experimentation, those skilled in the art will also be able to recognize and identify equivalents to the specific elements shown.

在此實例中,高溫計經放置於相對於模具組的定位處以監測模具空腔之目標位置的溫度,該目標位置係模具空腔之中心線附近的模具外壁中的凹部。當壓縮燒結已開始,凹部相對於高溫計的定位便經監測及調整。In this example, the pyrometer is placed at a position relative to the mold assembly to monitor the temperature of a target location of the mold cavity, which is a recess in the mold outer wall near the centerline of the mold cavity. When compression sintering has begun, the position of the recess relative to the pyrometer is monitored and adjusted.

例如,電動平台可用以重新定位高溫計。此重新定位方法可在整個壓縮燒結程序中按需要時常重複,無論是逐步(半連續)或連續。此自動化程序消除在手動地調整高溫計定位時發生的人為錯誤,且藉由在各程序循環期間維持相同的高溫計定位而改善程序一致性。額外地,該方法及系統包括經組態以基於即時測量系統而在燒結期間移動溫度測量裝置的一控制系統。For example, a motorized stage can be used to reposition the pyrometer. This repositioning method can be repeated as often as desired throughout the compression sintering process, either stepwise (semi-continuously) or continuously. This automated process eliminates human error that occurs when manually adjusting the pyrometer positioning and improves process consistency by maintaining the same pyrometer positioning during each process cycle. Additionally, the method and system include a control system configured to move the temperature measurement device during sintering based on a real-time measurement system.

如圖3所示,本發明之一個實施例係關於用於監測模具12上之位置10的溫度的系統。圖3以誇大的形式繪示模具12之側視圖的一部分以促進其描述。模具12位於SPS機器的腔室中,以用於燒結含在模具12中的材料(未圖示)。SPS機器具有習知類型,其可商購自諸如Thermal Technology LLC of Minden, Nevada, USA的供應商。As shown in FIG3 , one embodiment of the present invention is directed to a system for monitoring the temperature of a location 10 on a mold 12. FIG3 shows a portion of a side view of the mold 12 in exaggerated form to facilitate description thereof. The mold 12 is located in a chamber of an SPS machine for sintering the material (not shown) contained in the mold 12. The SPS machine is of a known type and is commercially available from suppliers such as Thermal Technology LLC of Minden, Nevada, USA.

模具12由腔室的壁環繞,其之一個壁14顯示於圖3中。腔室壁(諸如壁14)圍封並絕緣腔室的內部與外部環境。一般而言,在燒結期間該腔室經抽真空,因為在氧氣的存在下構成模具的材料將在燒結程序期間一般達到的溫度下點燃及燃燒。The mold 12 is surrounded by the walls of the chamber, one of which 14 is shown in FIG3 . The chamber walls, such as wall 14 , enclose and insulate the interior of the chamber from the external environment. Generally, the chamber is evacuated during sintering because the material constituting the mold will ignite and burn in the presence of oxygen at the temperatures generally reached during the sintering process.

在燒結程序期間,溫度經監測以確保達到並維持適當的溫度,以燒結模具中之材料。圖3繪示高溫計16,其經定位用於監測模具12之前述位置10處的溫度。高溫計16具有習知設計,其可商購自諸如Fluke Process Instruments of Everett, WA, USA的供應商。During the sintering process, the temperature is monitored to ensure that the proper temperature is reached and maintained to sinter the material in the mold. FIG3 shows a pyrometer 16 positioned to monitor the temperature of the mold 12 at the aforementioned location 10. The pyrometer 16 is of known design and is commercially available from suppliers such as Fluke Process Instruments of Everett, WA, USA.

高溫計16係遙測溫度計的類型,其基於在高溫計16之一個端18處接收的熱輻射的強度而測量溫度。為了使高溫計16能夠接收自模具12放射的熱輻射,腔室壁14包括一窗口20(參見圖4),該窗口由對熱輻射實質上透明且能夠承受高溫的材料(諸如石英)製成。The pyrometer 16 is a type of remote thermometer that measures temperature based on the intensity of thermal radiation received at one end 18 of the pyrometer 16. In order to enable the pyrometer 16 to receive the thermal radiation radiated from the mold 12, the chamber wall 14 includes a window 20 (see FIG. 4 ) made of a material that is substantially transparent to the thermal radiation and can withstand high temperatures, such as quartz.

參考圖4,窗口20係伸長的,其具有實質上大於其寬度的高度。窗口20的長高度允許高溫計16的定位經調整至與模具12的位置10相對。具體而言,位置10位於形成於模具12之側中的凹部22的底部處。由於位於凹部22的底部或端處,位置10比沿著該10之側的其他位置更接近正被燒結的材料。進一步,凹部22傾向於沿著凹部22的中心軸23向外導引熱輻射。因此,將高溫計的端18調整至與凹部22之端處的位置10相對係用於最可靠且準確地測量模具12之溫度的最佳定位,亦即,大致上沿著凹部的中心軸面向模具12中之凹部22的端處的位置10。Referring to FIG. 4 , the window 20 is elongated, having a height that is substantially greater than its width. The long height of the window 20 allows the positioning of the pyrometer 16 to be adjusted to be opposite to the position 10 of the mold 12. Specifically, the position 10 is located at the bottom of a recess 22 formed in the side of the mold 12. Being located at the bottom or end of the recess 22, the position 10 is closer to the material being sintered than other positions along the side of the recess 10. Further, the recess 22 tends to direct thermal radiation outwardly along the central axis 23 of the recess 22. Therefore, adjusting the end 18 of the pyrometer to be opposite to the position 10 at the end of the recess 22 is the best positioning for most reliably and accurately measuring the temperature of the mold 12, that is, generally facing the position 10 at the end of the recess 22 in the mold 12 along the central axis of the recess.

用於監測凹部22之端的位置10處的溫度的系統包括安裝至高溫計16的第一及第二雷射測量裝置24。雷射測量裝置24之一者安裝在高溫計16的一側附近,且另一雷射測量裝置安裝在高溫計的相對側附近。在操作中,各雷射測量裝置24投射雷射束26並測量從雷射測量裝置至雷射束投射至其上之位置的距離。為了清楚地描述,圖3僅顯示投射雷射束26的上雷射測量裝置24。然而,在操作中,各雷射測量裝置24投射雷射束。雷射測量裝置24具有習知設計,且可商購自諸如Keyence Corporation of America in Itasca, IL, USA的供應商。A system for monitoring the temperature at a location 10 at the end of a recess 22 includes a first and a second laser measuring device 24 mounted to a pyrometer 16. One of the laser measuring devices 24 is mounted near one side of the pyrometer 16, and the other laser measuring device is mounted near the opposite side of the pyrometer. In operation, each laser measuring device 24 projects a laser beam 26 and measures the distance from the laser measuring device to the location onto which the laser beam is projected. For clarity of description, FIG. 3 shows only the upper laser measuring device 24 that projects the laser beam 26. However, in operation, each laser measuring device 24 projects a laser beam. The laser measuring devices 24 are of known design and are commercially available from suppliers such as Keyence Corporation of America in Itasca, IL, USA.

各雷射測量裝置24投射雷射束26並測量從雷射測量裝置至雷射束投射至其上之位置的距離。圖3繪示雷射26投射至模具12之側中的凹部22的端處的位置10上。然而,如將瞭解,若高溫計16沿著腔室壁14稍微較向上定位,則雷射束26將撞擊模具12的外側壁且不會投射至凹部22中。從各雷射測量裝置24至模具12之外側壁的距離在本文中經定義為最小距離28(參見圖5),且對於各雷射測量裝置24應該相同或接近相同的值。Each laser measurement device 24 projects a laser beam 26 and measures the distance from the laser measurement device to the location onto which the laser beam is projected. FIG. 3 shows the laser 26 projected onto a location 10 at the end of a recess 22 in the side of the mold 12. However, as will be appreciated, if the pyrometer 16 were positioned slightly higher up along the chamber wall 14, the laser beam 26 would hit the outside wall of the mold 12 and would not be projected into the recess 22. The distance from each laser measurement device 24 to the outside wall of the mold 12 is defined herein as a minimum distance 28 (see FIG. 5 ) and should be the same or close to the same value for each laser measurement device 24.

各雷射測量裝置24輸出指示經測量距離是否小於或等於最小距離28的信號;圖5示意性地繪示在監測系統12的簡化幾何形狀且在省略腔室壁14的情況下之最小距離28。在圖5中,相較於圖4的高溫計定位,高溫計16相對於凹部22定位得較高。因此,上雷射測量裝置測量的距離與最小距離28相同(不大於),且上雷射測量裝置據此輸出指示經測量距離小於或等於最小距離28的信號。相對地,下測量裝置24位於其雷射束投射至凹部22中的定位。因此,下測量裝置24輸出指示經測量距離不小於或等於最小距離的信號。替代地,各雷射測量裝置正輸出指示其雷射束是否投射至凹部22中的信號。若經測量距離小於或等於最小距離,則雷射束投射至模具12的側上,而不是投射至凹部22中。Each laser measuring device 24 outputs a signal indicating whether the measured distance is less than or equal to a minimum distance 28; FIG. 5 schematically illustrates the minimum distance 28 in a simplified geometry of the monitoring system 12 and when the chamber wall 14 is omitted. In FIG. 5 , the pyrometer 16 is positioned higher relative to the recess 22 than the pyrometer positioning of FIG. 4 . Therefore, the distance measured by the upper laser measuring device is the same as (not greater than) the minimum distance 28, and the upper laser measuring device accordingly outputs a signal indicating that the measured distance is less than or equal to the minimum distance 28. In contrast, the lower measuring device 24 is positioned such that its laser beam is projected into the recess 22. Therefore, the lower measuring device 24 outputs a signal indicating that the measured distance is not less than or equal to the minimum distance. Instead, each laser measurement device is outputting a signal indicating whether its laser beam is projected into the recess 22. If the measured distance is less than or equal to the minimum distance, the laser beam is projected onto the side of the mold 12 instead of into the recess 22.

在此方面,雷射測量裝置可程式化,使得最小距離28可經調整以對應於正與溫度監測系統一起使用的SPS設備。例如,若特定的SPS設備更大且具有更厚的腔室壁14,則最小距離28可經程式化至更大的值。額外地,信號可經修改以輸出指示經測量距離大於最小距離28的信號。替代地,信號可輸出測量距離而非二進制信號。In this regard, the laser measurement device can be programmed so that the minimum distance 28 can be adjusted to correspond to the SPS equipment being used with the temperature monitoring system. For example, if the particular SPS equipment is larger and has thicker chamber walls 14, the minimum distance 28 can be programmed to a larger value. Additionally, the signal can be modified to output a signal indicating that the measured distance is greater than the minimum distance 28. Alternatively, the signal can output the measured distance rather than a binary signal.

返回圖3,溫度監測系統包括致動器32,該致動器與各雷射測量裝置24通訊連接並接收自各雷射測量裝置輸出的信號。致動器32支撐高溫計16,且根據自雷射測量裝置接收的信號在彼此相對的第一方向及第二方向上移動高溫計,直到各經接收信號指示經測量距離不小於或等於最小距離。致動器具有習知類型,其包括具有機上可編程運動控制器及驅動電子器件的步進馬達。此類致動器包括以商標MDRIVE銷售者,其可購自Schneider Electric of Andover, Massachusetts, USA。Returning to FIG. 3 , the temperature monitoring system includes an actuator 32 that is communicatively coupled to each laser measurement device 24 and receives signals outputted from each laser measurement device. The actuator 32 supports the pyrometer 16 and moves the pyrometer in first and second directions relative to each other in response to signals received from the laser measurement devices until each received signal indicates that the measured distance is not less than or equal to a minimum distance. The actuator is of a known type that includes a stepper motor having an on-board programmable motion controller and drive electronics. Such actuators include those sold under the trademark MDRIVE, which are available from Schneider Electric of Andover, Massachusetts, USA.

最初,高溫計的定位由操作者手動調整以將高溫計相對於凹部22而定位。在此定位處,來自各裝置24的雷射束26投射至模具12的凹部22中,且起始溫度監測系統。隨著裝置12中的材料燒結,模具12上下移動,凹部22亦如此,此係因為凹部與模具一體地形成。若任一雷射測量裝置24測量到小於或等於最小距離28的距離,則雷射測量裝置向致動器23輸出一信號。致動器23根據所接收之信號而移動高溫計16。若所接收之信號係來自上雷射測量裝置24,則致動器23向下移動高溫計,直到不再存在指示經測量距離小於或等於最小距離28之來自上雷射測量裝置的信號。Initially, the positioning of the pyrometer is manually adjusted by the operator to position the pyrometer relative to the recess 22. At this position, the laser beam 26 from each device 24 is projected into the recess 22 of the mold 12 and the temperature monitoring system is initiated. As the material in the device 12 sinters, the mold 12 moves up and down, as does the recess 22 because it is formed integrally with the mold. If any of the laser measurement devices 24 measures a distance less than or equal to the minimum distance 28, the laser measurement device outputs a signal to the actuator 23. The actuator 23 moves the pyrometer 16 in accordance with the received signal. If the received signal is from the upper laser measuring device 24, the actuator 23 moves the pyrometer downward until there is no longer a signal from the upper laser measuring device indicating that the measured distance is less than or equal to the minimum distance 28.

相反地,若致動器接收到來自第二測量裝置24(下測量裝置)的信號,則致動器23向上移動高溫計16,直到不再接收到信號。若致動器23移除來自兩個雷射測量裝置24的信號,則此指示錯誤情況,需要來自操作者的介入以手動地重新定位高溫計16。在錯誤情況的事件下,致動器23並未在任一方向上移動高溫計16。Conversely, if the actuator receives a signal from the second measuring device 24 (lower measuring device), the actuator 23 moves the pyrometer 16 upward until no signal is received. If the actuator 23 removes the signals from both laser measuring devices 24, this indicates an error condition requiring intervention from an operator to manually reposition the pyrometer 16. In the event of an error condition, the actuator 23 does not move the pyrometer 16 in either direction.

圖6繪示溫度監測系統之邏輯的流程圖。系統在操作者已將高溫計16相對於凹部22定位之後(其中沒有接收到來自雷射測量裝置24之指示經測量距離小於或等於最小距離的信號)開始於方塊32。邏輯之後進行到方塊34,致動器23隨之監測信號的接收。若接收到信號,則邏輯在方塊36中判定指示經測量距離小於最小距離28的信號是否僅從雷射測量裝置24之一者接收到。若判定是肯定的,則致動器23根據方塊38中所接收之信號來移動高溫計。具體而言,若信號係來自上雷射測量裝置24,則上雷射裝置24太高且致動器23將高溫計16向下移動。若信號係來自下測量裝置24,則下雷射測量裝置24太低且致動器23將高溫計16向上移動。當雷射測量裝置安裝至高溫計16時,雷射測量裝置24與高溫計16一起移動。FIG6 is a flow chart of the logic of the temperature monitoring system. The system begins at block 32 after the operator has positioned the pyrometer 16 relative to the recess 22, wherein no signal is received from the laser measuring device 24 indicating that the measured distance is less than or equal to the minimum distance. The logic then proceeds to block 34, whereupon the actuator 23 monitors the receipt of a signal. If a signal is received, the logic determines in block 36 whether the signal indicating that the measured distance is less than the minimum distance 28 is received from only one of the laser measuring devices 24. If the determination is affirmative, the actuator 23 moves the pyrometer in accordance with the signal received in block 38. Specifically, if the signal comes from the upper laser measuring device 24, the upper laser measuring device 24 is too high and the actuator 23 moves the pyrometer 16 downward. If the signal comes from the lower measuring device 24, the lower laser measuring device 24 is too low and the actuator 23 moves the pyrometer 16 upward. When the laser measuring device is mounted to the pyrometer 16, the laser measuring device 24 moves with the pyrometer 16.

若方塊36中的判定係否定的,則邏輯流程進行到方塊40,其中致動器23不採取任何動作,亦即,高溫計16不移動,且邏輯之後返回至方塊34中之監測信號。If the determination in block 36 is negative, the logic flow proceeds to block 40, where the actuator 23 does not take any action, that is, the pyrometer 16 does not move, and the logic then returns to the monitoring signal in block 34.

為了便於解釋,在前面的描述中已使用用語上(upper)及下(lower)以將雷射測量裝置24彼此區分。然而,用語第一(first)及第二(second)、或一者(one)及另一者(the other)亦可使用,且在本文中係定義為與上及下同義。在此方面,一些燒結裝置並非垂直地配置,且可具有除了上及下以外的其他定向。For ease of explanation, the terms upper and lower have been used in the foregoing description to distinguish the laser measurement devices 24 from each other. However, the terms first and second, or one and the other may also be used and are defined herein as being synonymous with upper and lower. In this regard, some sintering devices are not vertically configured and may have other orientations besides upper and lower.

當雷射測量裝置24不輸出指示經測量距離小於或等於最小距離的信號時,高溫計的端相對於模具12之凹部22中的位置10而定位,以用於自其接收熱輻射,並基於所接收之熱輻射的強度而輸出溫度信號。When the laser measuring device 24 does not output a signal indicating that the measured distance is less than or equal to the minimum distance, the end of the pyrometer is positioned relative to the position 10 in the recess 22 of the mold 12 for receiving thermal radiation therefrom and outputting a temperature signal based on the intensity of the received thermal radiation.

本發明之較佳實施例的前述描述已出於說明及描述之目的而呈現。其並非意欲是詳盡無遺的,或將本發明限制於所揭示之精確形式。修改及變化鑑於上述教示是可能的,或可自本發明的實行中獲得。選擇及描述實施例是為了解釋本發明的原理及其實際應用,以使所屬技術領域中具有通常知識者能夠在各種實施例中且使用適合於所設想之特定用途的各種修改來利用本發明。所欲的是本發明之範圍由在此附加之請求項及其等之等效物定義。The foregoing description of the preferred embodiments of the present invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Modifications and variations are possible in light of the above teachings or may be acquired from practice of the present invention. The embodiments are chosen and described to explain the principles of the invention and its practical application so that one having ordinary knowledge in the art can utilize the invention in various embodiments and with various modifications suitable for the particular use contemplated. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

10:位置 12:模具;監測系統 14:壁 16:高溫計 18:端 20:窗口 22:凹部 23:中心軸;致動器 24:雷射測量裝置;測量裝置;裝置 26:雷射束;雷射 28:最小距離 32:方塊;致動器 34:方塊 36:方塊 38:方塊 40:方塊 100:燒結設備 102:真空腔室 104:承載架 106:觀察窗口 108:溫度測量裝置 110:模具空腔 111:模具組 112:殼體 114:DC電源供應器 116:液壓動力單元 118:液壓缸 120:下柱塞 122:上柱塞 124:真空泵 126:氣體 128:中央控制系統 205:材料 211:模具組 212:殼體 220:下柱塞 222:上柱塞 295:所欲燒結部分 附錄 美國專利公開案第2016/0325353號、及美國專利案第4,936,765號 10: position 12: mold; monitoring system 14: wall 16: pyrometer 18: end 20: window 22: recess 23: center axis; actuator 24: laser measuring device; measuring device; device 26: laser beam; laser 28: minimum distance 32: block; actuator 34: block 36: block 38: block 40: block 100: sintering equipment 102: vacuum chamber 104: carrier 106: observation window 108: temperature measuring device 110: mold cavity 111: mold assembly 112: housing 114: DC power supply 116: Hydraulic power unit 118: Hydraulic cylinder 120: Lower plunger 122: Upper plunger 124: Vacuum pump 126: Gas 128: Central control system 205: Material 211: Mold set 212: Shell 220: Lower plunger 222: Upper plunger 295: Sintering part Appendix U.S. Patent Publication No. 2016/0325353, and U.S. Patent No. 4,936,765

當結合隨附圖式閱讀時,可自下列詳細描述最佳地理解本揭露。所強調的是,根據慣例,圖式之各種特徵並非按比例繪製。相反地,為了清楚起見,各種特徵之尺寸係被任意擴大或縮小。圖式包括下列圖: [圖1]至[圖2]顯示美國專利公開案第2016/0325353號的先前技術。 [圖3]繪示本發明之一實施例的側視圖。 [圖4]繪示圖3所示之實施例的部分的透視圖。 [圖5]繪示圖3之實施例的簡化示意圖。 [圖6]繪示圖3之實施例的邏輯流程圖。 The present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It is emphasized that, according to convention, the various features of the drawings are not drawn to scale. Instead, the sizes of the various features are arbitrarily expanded or reduced for clarity. The drawings include the following figures: [Figure 1] to [Figure 2] show the prior art of U.S. Patent Publication No. 2016/0325353. [Figure 3] shows a side view of an embodiment of the present invention. [Figure 4] shows a perspective view of a portion of the embodiment shown in Figure 3. [Figure 5] shows a simplified schematic diagram of the embodiment of Figure 3. [Figure 6] shows a logical flow chart of the embodiment of Figure 3.

10:位置 10: Location

12:模具 12: Mould

14:壁 14: Wall

16:高溫計 16: Thermometer

18:端 18: End

22:凹部 22: Concave part

23:中心軸;致動器 23: Center axis; actuator

24:雷射測量裝置;測量裝置;裝置 24: Laser measuring device; measuring device; device

26:雷射束 26: Laser beam

Claims (20)

一種用於監測一模具上之一位置的溫度之系統,該系統包含: 一高溫計,其具有一端,該高溫計經組態以基於在該高溫計之該端處所接收之熱輻射的強度而測量溫度,該高溫計具有相對的側; 第一雷射測量裝置及第二雷射測量裝置,其等安裝至該高溫計,該等雷射測量裝置之一者安裝在該高溫計的一個側附近,且另一雷射測量裝置安裝在該高溫計之相對的側附近,各雷射測量裝置投射一雷射束,並測量從該雷射測量裝置至該雷射束投射至其上之一位置的距離,各雷射測量裝置輸出指示經測量的該距離小於或等於一最小距離的一信號,其中該最小距離為從各雷射測量裝置至該模具之一外側壁的距離;及 一致動器,其與各雷射測量裝置通訊連接並接收自各雷射測量裝置輸出的該信號,該致動器支撐該高溫計,且根據自該等雷射測量裝置接收的該等信號在彼此相對的第一方向及第二方向上移動該高溫計,直到經接收的各信號指示經測量的該距離不小於或等於該最小距離, 其中當經接收的各信號指示經測量的該距離大於該最小距離時,該高溫計的該端相對於該模具上的該位置而定位,以用於自其接收熱輻射,並基於該熱輻射的該強度而輸出一溫度信號。 A system for monitoring the temperature of a location on a mold, the system comprising: a pyrometer having one end, the pyrometer configured to measure temperature based on the intensity of thermal radiation received at the end of the pyrometer, the pyrometer having opposing sides; A first laser measuring device and a second laser measuring device, which are mounted to the pyrometer, one of the laser measuring devices is mounted near one side of the pyrometer, and the other laser measuring device is mounted near the opposite side of the pyrometer, each laser measuring device projects a laser beam and measures the distance from the laser measuring device to a position on which the laser beam is projected, each laser measuring device outputs a signal indicating that the measured distance is less than or equal to a minimum distance, wherein the minimum distance is the distance from each laser measuring device to an outer wall of the mold; and An actuator is connected to each laser measuring device in communication and receives the signal output from each laser measuring device, the actuator supports the pyrometer, and moves the pyrometer in a first direction and a second direction relative to each other according to the signals received from the laser measuring devices, until each received signal indicates that the measured distance is not less than or equal to the minimum distance, wherein when each received signal indicates that the measured distance is greater than the minimum distance, the end of the pyrometer is positioned relative to the position on the mold to receive thermal radiation therefrom and output a temperature signal based on the intensity of the thermal radiation. 如請求項1之系統,其中該致動器將該高溫計向上及向下移動,且該高溫計包括一頂部及一底部,其中該等雷射測量裝置之一者安裝在該高溫計的該頂部附近,且另一雷射測量裝置安裝在該模具的該底部附近,且當該致動器接收來自該等雷射測量裝置之該一者的一信號時,該致動器將該高溫計向下移動,且當該致動器接收來自該另一雷射測量裝置的一信號時,該致動器將該高溫計向上移動。A system as in claim 1, wherein the actuator moves the pyrometer up and down, and the pyrometer includes a top and a bottom, wherein one of the laser measuring devices is mounted near the top of the pyrometer and another laser measuring device is mounted near the bottom of the mold, and when the actuator receives a signal from one of the laser measuring devices, the actuator moves the pyrometer downward, and when the actuator receives a signal from the other laser measuring device, the actuator moves the pyrometer upward. 如請求項1或2之系統,其中該致動器接收來自該等雷射測量裝置兩者的一信號,該致動器並未調整該高溫計的定位。A system as claimed in claim 1 or 2, wherein the actuator receives a signal from both of the laser measurement devices and the actuator does not adjust the positioning of the pyrometer. 如請求項1或2之系統,其中該模具包括一高度,且該致動器將該高溫計平行於該模具的該高度移動。A system as in claim 1 or 2, wherein the mold includes a height and the actuator moves the pyrometer parallel to the height of the mold. 如請求項1或2之系統,其中該等雷射測量裝置沿著該模具的該高度垂直地對準。A system as claimed in claim 1 or 2, wherein the laser measurement devices are aligned vertically along the height of the mold. 如請求項1或2之系統,其中各雷射測量裝置安裝在距該模具的一相等距離,其中該距離係自最接近該雷射測量裝置之該模具的該外側壁上的一點而測量。A system as claimed in claim 1 or 2, wherein each laser measuring device is mounted at an equal distance from the mold, wherein the distance is measured from a point on the outer wall of the mold closest to the laser measuring device. 如請求項1或2之系統,其中該致動器可程式化。A system as claimed in claim 1 or 2, wherein the actuator is programmable. 一種使用一溫度測量裝置追蹤一模具中的一凹部之方法,該方法包含以下步驟: 將一第一雷射及一第二雷射相對地安裝至一溫度測量裝置以建立一高溫計總成; 使用該第一雷射將一雷射束投射至該凹部中以測量一第一雷射束距離,並將該第二雷射束投射至該凹部中以測量一第二雷射束距離來將該溫度測量裝置與該凹部對準;及 當偵測到該第一雷射束距離或該第二雷射束距離的一減小時,藉由移動該高溫計總成而將該溫度測量裝置與該凹部重新對準,使得該第一雷射束及該第二雷射束被投射至該凹部中。 A method for tracking a recess in a mold using a temperature measurement device, the method comprising the following steps: Mounting a first laser and a second laser to a temperature measurement device in opposition to each other to create a pyrometer assembly; Aligning the temperature measurement device with the recess by projecting a laser beam into the recess using the first laser to measure a first laser beam distance and projecting the second laser beam into the recess to measure a second laser beam distance; and When a decrease in the first laser beam distance or the second laser beam distance is detected, realigning the temperature measurement device with the recess by moving the pyrometer assembly so that the first laser beam and the second laser beam are projected into the recess. 如請求項8之方法,其中該模具包括一高度,且該安裝步驟包括沿著該模具的該高度相對地安裝該第一雷射及該第二雷射。The method of claim 8, wherein the mold includes a height, and the mounting step includes mounting the first laser and the second laser relative to each other along the height of the mold. 如請求項8或9之方法,其中當偵測到該第一雷射束距離的一減小時,該高溫計總成在一第一方向上移動,且當偵測到該第二雷射束距離的一減小時,該高溫計總成在與該第一方向相對的一第二方向上移動。A method as claimed in claim 8 or 9, wherein when a decrease in the distance of the first laser beam is detected, the pyrometer assembly moves in a first direction, and when a decrease in the distance of the second laser beam is detected, the pyrometer assembly moves in a second direction opposite to the first direction. 如請求項8或9之方法,其中各雷射與一雷射測量裝置整合,該雷射測量裝置偵測雷射束距離何時存在一減小並提供一信號。A method as in claim 8 or 9, wherein each laser is integrated with a laser measurement device that detects when there is a decrease in the laser beam distance and provides a signal. 如請求項11之方法,其進一步包含將該高溫計總成安裝至一致動器而使用該致動器接收該等信號之步驟,及執行藉由使用該致動器根據所接收之該信號移動該高溫計總成而重新對準之步驟。The method of claim 11 further comprises the steps of mounting the pyrometer assembly to an actuator and receiving the signals using the actuator, and performing a re-alignment step by moving the pyrometer assembly using the actuator according to the received signals. 如請求項8或9之方法,其進一步包含將該高溫計總成安裝至一致動器並使用該致動器執行該對準步驟及該重新對準步驟之步驟。The method of claim 8 or 9, further comprising the steps of mounting the pyrometer assembly to an actuator and using the actuator to perform the alignment step and the realignment step. 如請求項8或9之方法,其中該安裝步驟包括距該模具上最接近各雷射的一點等距地安裝該等雷射。A method as claimed in claim 8 or 9, wherein the mounting step includes mounting the lasers equidistant from a point on the mold closest to each laser. 一種形成一燒結產物之方法,其以任何順序包含以下步驟: i)      將待燒結的一材料裝載至一模具組的一模具空腔中,該模具組包含一殼體及經組態以壓縮該材料的相對的柱塞; ii)     將該模具組放置至一燒結設備的一真空腔室中,該燒結設備包含一溫度測量裝置及一控制系統,該溫度測量裝置經組態以在燒結期間判定該模具空腔中之材料的溫度,該控制系統經組態以在燒結期間移動該溫度測量裝置; iii)    使用一溫度測量裝置的一第一雷射及一第二雷射將該溫度測量裝置相對於該模具空腔的一目標位置定位以建立一高溫計總成;使用該第一雷射將一雷射束投射至該模具空腔中以建立一第一雷射束距離,並使用該第二雷射束以投射至該模具空腔中以建立一第二雷射束距離來將該溫度測量裝置與該模具空腔對準;當偵測到該第一雷射束距離或該第二雷射束距離的一減小時,藉由移動該高溫計總成而將該溫度測量裝置與該模具空腔自動地重新對準,使得該第一雷射束及該第二雷射束被投射至該模具空腔中,及 iv)    壓縮地燒結該模具空腔中的該材料以形成該燒結產物,其中在該壓縮燒結期間,使用該控制系統移動該溫度測量裝置,以維持與該模具空腔的該目標位置的相對定位。 A method for forming a sintered product, comprising the following steps in any order: i)      Loading a material to be sintered into a mold cavity of a mold set, the mold set comprising a shell and opposing plungers configured to compress the material; ii)     Placing the mold set in a vacuum chamber of a sintering apparatus, the sintering apparatus comprising a temperature measuring device and a control system, the temperature measuring device being configured to determine the temperature of the material in the mold cavity during sintering, and the control system being configured to move the temperature measuring device during sintering; iii)   Using a first laser and a second laser of a temperature measuring device to position the temperature measuring device relative to a target position of the mold cavity to establish a pyrometer assembly; using the first laser to project a laser beam into the mold cavity to establish a first laser beam distance, and using the second laser beam to project into the mold cavity to establish a second laser beam distance to align the temperature measuring device with the mold cavity; when a decrease in the first laser beam distance or the second laser beam distance is detected, automatically realigning the temperature measuring device with the mold cavity by moving the pyrometer assembly so that the first laser beam and the second laser beam are projected into the mold cavity, and iv)   The material in the mold cavity is compression-sintered to form the sintered product, wherein during the compression-sintering, the temperature measuring device is moved using the control system to maintain relative positioning with respect to the target position of the mold cavity. 如請求項15之方法,其中該燒結設備進一步包含與該溫度測量裝置及該控制系統通訊的一重新定位裝置,且其中使用該控制系統藉由該重新定位裝置移動該溫度測量裝置。A method as claimed in claim 15, wherein the sintering apparatus further comprises a repositioning device in communication with the temperature measuring device and the control system, and wherein the temperature measuring device is moved via the repositioning device using the control system. 如請求項15或16之方法,其中該模具組包含一外殼體、一上柱塞、及一下柱塞,且其中移動該溫度測量裝置之該步驟包含判定該上柱塞、該下柱塞、或兩者的一定位。A method as claimed in claim 15 or 16, wherein the mold assembly includes a housing, an upper plunger, and a lower plunger, and wherein the step of moving the temperature measuring device includes determining a position of the upper plunger, the lower plunger, or both. 如請求項15或16之方法,其中該溫度測量裝置在該壓縮燒結期間連續地移動。A method as claimed in claim 15 or 16, wherein the temperature measuring device moves continuously during the compression sintering period. 如請求項15或16之方法,其中移動該溫度測量裝置係自動的。A method as claimed in claim 15 or 16, wherein moving the temperature measuring device is automatic. 如請求項15或16之方法,其中該燒結設備係一火花電漿燒結設備或一直流燒結設備。A method as claimed in claim 15 or 16, wherein the sintering device is a spark plasma sintering device or a DC sintering device.
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