TWI880749B - Server system and heat dissipation module - Google Patents

Abstract

A server system includes a rack, a plurality of servers and a heat dissipation module. The servers are disposed in the rack. The heat dissipation module includes a pump assembly, a main manifold assembly, a plurality of heat exchange assemblies and a sub manifold assembly. The pump assembly is disposed in the rack. The main manifold assembly includes a first main pipeline and a second main pipeline. The first main pipeline is connected to a main outlet of the pump assembly and inlets of the servers. The second main pipeline is connected to outlets of the servers and a main inlet of the pump assembly. The heat exchange assemblies are removably disposed in the rack. The sub manifold assembly includes a first sub pipeline and a second sub pipeline. The first sub pipeline is connected to a sub outlet of the pump assembly and inlets of the heat exchange assemblies. The second sub pipeline is connected to outlets of the heat exchange assemblies and a sub inlet of the pump assembly.

Description

Server system and cooling module

The present invention relates to a server system and a heat dissipation module.

Currently, the multiple servers in the server cabinet are mostly cooled by liquid cooling modules. There are generally three configuration methods for the liquid cooling modules, namely, the liquid cooling module is configured in an additional independent cabinet, the liquid cooling module is configured on the back door of the server cabinet, and the liquid cooling module is configured in the server cabinet.

In the case where the liquid cooling module is configured in an additional independent cabinet, the liquid cooling module and the servers are located in two different cabinets, so the pipelines connecting the liquid cooling module and the servers cannot be pre-assembled before the two cabinets are placed in the predetermined position in the computer room, otherwise the two cabinets will be difficult to transport. In addition, because the two cabinets must be used in groups, when the remaining space in the computer room can only accommodate one cabinet, the two cabinets that must be used in groups are difficult to be placed at the same time, resulting in idle space in the computer room that cannot be effectively used.

For example, if the liquid cooling module is installed at the back door of the server cabinet, the back door and the liquid cooling module will not only increase the overall space occupied, but also cause maintenance personnel to be in a higher temperature environment at the back of the cabinet during maintenance, which does not meet safety regulations.

For example, when a liquid cooling module is configured in a server cabinet, since the pump, radiator and fan are integrated in the same casing and installed in the cabinet through the casing, the size of the radiator is limited by the space in the casing, resulting in insufficient heat dissipation capacity of the radiator, which in turn affects the number of servers that can be accommodated in the server cabinet.

The present invention provides a server system and a heat dissipation module, which can avoid the problems derived from the configurations of the above three liquid cooling heat dissipation modules.

A server system disclosed in an embodiment of the present invention includes a cabinet, a plurality of servers and a heat dissipation module. These servers are arranged in the cabinet and each has a liquid inlet and a liquid outlet. The heat dissipation module includes a pump assembly, a main manifold assembly, a plurality of heat exchange assemblies and a sub-manifold assembly. The pump assembly is arranged in the cabinet and has a main liquid inlet, a sub-liquid inlet, a main liquid outlet and a sub-liquid outlet. The main manifold assembly includes a first main line and a second main line, the first main line is connected to the main liquid outlet of the pump assembly and the liquid inlets of these servers, and the second main line is connected to the liquid outlets of these servers and the main liquid inlet of the pump assembly. These heat exchange assemblies can be detachably arranged in the cabinet and each has a liquid inlet and a liquid outlet. The sub-manifold assembly includes a first sub-pipeline and a second sub-pipeline, the first sub-pipeline is connected to the sub-liquid outlet of the pump assembly and the liquid inlets of the heat exchange assemblies, and the second sub-pipeline is connected to the liquid outlets of the heat exchange assemblies and the sub-liquid inlet of the pump assembly.

Another embodiment of the present invention discloses a heat dissipation module, which includes a pump assembly, a plurality of heat exchange assemblies and a sub-manifold assembly. The pump assembly has a sub-liquid inlet and a sub-liquid outlet. These heat exchange assemblies each have a liquid inlet and a liquid outlet. The sub-manifold assembly includes a first sub-pipeline and a second sub-pipeline. The first sub-pipeline is connected to the sub-liquid outlet of the pump assembly and the liquid inlets of these heat exchange assemblies, and the second sub-pipeline is connected to the liquid outlets of these heat exchange assemblies and the sub-liquid inlet of the pump assembly.

Yet another embodiment of the present invention discloses a server system, comprising a cabinet, a plurality of servers and a heat dissipation module. The cabinet has a storage space and an inner bottom surface, and the inner bottom surface is located at the bottom of the storage space. The servers are arranged in the storage space. The heat dissipation module comprises a pump assembly and a plurality of heat exchange assemblies. The pump assembly is arranged in the storage space and is connected to the server. The heat exchange assemblies can be detachably arranged in the storage space and are connected to the pump assembly. The heights of the servers, the pump assembly and the heat exchange assemblies relative to the inner bottom surface are different from each other.

According to the server system and heat dissipation module disclosed in the above embodiments, by accommodating these servers and these heat exchange components in a cabinet and connecting to a pump component, the pipes between these servers, these heat exchange components and the pump component can be pre-connected when the server system is transported to the preset position in the machine room. In this way, after the server system is placed in the preset position in the machine room, it is not necessary to arrange personnel to go to the machine room to assemble the pipes, thereby saving manpower. In addition, these heat exchange components and pump components are arranged in the same cabinet as these servers, so it is convenient to configure the server system in the odd-shaped space in the machine room, thereby improving the space utilization rate of the machine room.

Furthermore, these heat exchange components and pump components are installed inside the cabinet, not behind it, so they do not increase the space occupied by the entire server system, and do not require personnel to perform maintenance work in the higher ambient temperature behind the cabinet.

On the other hand, the heat exchange components are modular and removable, so the number of heat exchange components can be flexibly adjusted according to the cooling requirements of the servers in the cabinet, thereby avoiding the situation where the cooling capacity provided by these heat exchange components cannot meet the cooling requirements of these servers or is excessively higher than the cooling requirements of these servers, resulting in energy waste.

The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figures 1 to 4. Figure 1 is a three-dimensional schematic diagram of a server system disclosed according to an embodiment of the present invention. Figure 2 is a three-dimensional schematic diagram of the server system of Figure 1 from another perspective. Figure 3 is a partially enlarged front view of the server system of Figure 1. Figure 4 is a plan view of the server system of Figure 1. In order to clearly describe the connection relationship between the components of the server system, Figure 4 is only drawn in a schematic manner, and the positions of the components in Figure 4 do not represent the actual positions.

In this embodiment, the server system 1 includes a cabinet 10, a plurality of servers 20 and a heat dissipation module 30. In addition, the server system 1 further includes a plurality of rail assemblies 40. The heat dissipation module 30 includes a pump assembly 31, a plurality of heat exchange assemblies 32, a main manifold assembly 33 and a sub-manifold assembly 34.

The cabinet 10 has a storage space 11 and an inner bottom surface 12, and the inner bottom surface 12 of the cabinet 10 is located at the bottom of the storage space 11. The servers 20, the pump assembly 31, and the heat exchange assemblies 32 are located in the storage space 11, and the heights relative to the inner bottom surface 12 are different from each other. For example, the heat exchange assemblies 32 are located between the servers 20 and the pump assembly 31, and the pump assembly 31 is closer to the inner bottom surface 12 than the heat exchange assemblies 32 and the servers 20. In other words, the heat exchange assemblies 32 are located above the pump assembly 31, and the servers 20 are located above the heat exchange assemblies 32. It should be noted that the relative positions of the pump assembly 31, the heat exchange assemblies 32 and the servers 20 are not intended to limit the present invention, but can be adjusted as needed.

Next, please refer to Figures 4 and 5. Figure 5 is a three-dimensional schematic diagram of the pump assembly of Figure 1.

In this embodiment, the servers 20 are, for example but not limited to, 1U servers 20. Each of the servers 20 has a liquid inlet 21, a liquid outlet 22, and two connectors 23, 24. The two connectors 23, 24 are disposed at the liquid inlet 21 and the liquid outlet 22, respectively.

The pump assembly 31 includes a housing 311, two pump units 312, two main connectors 313, 314, two sub connectors 315, 316 and a controller 317. The housing 311 has a main liquid outlet 3111, a main liquid inlet 3112, a sub liquid outlet 3113 and a sub liquid inlet 3114. The two pump units 312 are detachably disposed in the housing 311, and the two pump units 312 are connected to the main liquid outlet 3111, the main liquid inlet 3112, the sub liquid outlet 3113 and the sub liquid inlet 3114 in parallel by pipelines (not shown). The two main connectors 313 and 314 are respectively disposed at the main liquid outlet 3111 and the main liquid inlet 3112, and the two sub-connectors 315 and 316 are respectively disposed at the sub-liquid outlet 3113 and the sub-liquid inlet 3114. The controller 317 is electrically connected to the two pumping units 312, for example.

As shown in FIG5 , the main liquid outlet 3111, the main liquid inlet 3112, the sub-liquid outlet 3113 and the sub-liquid inlet 3114 are located on the same side of the housing 311, but the present invention is not limited thereto. The positions of the main liquid outlet, the main liquid inlet, the sub-liquid outlet and the sub-liquid inlet can be adjusted as required. For example, the main liquid outlet and the main liquid inlet can be located on one side of the housing, while the sub-liquid outlet and the sub-liquid inlet can be located on the other side of the housing.

In this embodiment, one of the pump units 312 of the pump assembly 31 is, for example, a main pump unit 312 responsible for driving the coolant to flow, and the other pump unit 312 is, for example, a spare pump unit 312. When the controller 317 detects that the main pump unit 312 fails, the controller 317 activates the spare pump unit 312 to drive the coolant to flow.

It should be noted that the number of pump units 312 is not intended to limit the present invention, but can be increased or decreased according to actual needs.

The main manifold assembly 33 includes a first main passage 331 and a second main passage 332. The first main passage 331 includes a first main pipe component 3311 and a plurality of first main connectors 3312, which are disposed on the first main pipe component 3311. The first main connectors 3312 of the first main passage 331 are respectively assembled to the connectors 23 of the servers 20 and the main connectors 313 of the pump assembly 31, so that the main liquid outlet 3111 of the pump assembly 31 is connected to the liquid inlet 21 of the servers 20 through the first main passage 331. The second main passage 332 includes a second main pipe component 3321 and a plurality of second main connectors 3322, which are disposed on the second main pipe component 3321. The second main connectors 3322 of the second main line 332 are respectively assembled to the connectors 24 of the servers 20 and the main connectors 314 of the pump assembly 31 , so that the main liquid inlet 3112 of the pump assembly 31 is connected to the liquid outlet 22 of the servers 20 through the second main line 332 .

In this embodiment, the two main connectors 313, 314 of the pump assembly 31, the first main connectors 3312 of the first main line 331, the connectors 23, 24 of the server 20 and the second main connectors 3322 of the second main line 332 are, for example, tool-free quick-release connectors, which can improve assembly efficiency.

It should be noted that the first main pipe component 3311 of the first main pipe 331 is not limited to being connected to the liquid inlet 21 of the servers 20 and the main liquid outlet 3111 of the pump assembly 31 via a connector, and the second main pipe component 3321 of the second main pipe 332 is not limited to being connected to the liquid outlet 22 of the servers 20 and the main liquid inlet 3112 of the pump assembly 31 via a connector. In other embodiments, the first main pipe component of the first main pipe can be directly connected to the liquid inlet of the servers and the main liquid outlet of the pump assembly, and the second main pipe component of the second main pipe can be directly connected to the liquid outlet of the servers and the main liquid inlet of the pump assembly. In other words, the connector can be omitted for each server, the main connector can be omitted for the pump assembly, the first main pipe can omit the first main pipe, and the second main pipe can omit the second main pipe.

Next, please refer to Figures 4, 6, and 7. Figure 6 is a three-dimensional schematic diagram of the heat exchange assembly of Figure 1. Figure 7 is a three-dimensional schematic diagram of the heat exchange assembly of Figure 1 from another viewing angle.

In this embodiment, each heat exchange assembly 32 is detachably disposed in the accommodation space 11 of the cabinet 10, for example, through a slide rail assembly 40. For example, the slide rail assembly 40 includes two slide rails 41. The two slide rails 41 are, for example but not limited to, three-section slide rails, and each slide rail 41 includes a first rail 411, a second rail 412, and a third rail 413. The two first rails 411 of the two slide rails 41 are fixed to opposite sides of the cabinet 10, respectively. The second rails 412 of the two slide rails 41 are fixed to opposite sides of the heat exchange assembly 32, and the two second rails 412 of the two slide rails 41 are slidably disposed on the two first rails 411 through the two third rails 413, so that the heat exchange assembly 32 can be detachably disposed in the accommodating space 11 of the cabinet 10.

However, each heat exchange assembly 32 is not limited to being detachably disposed in the accommodation space 11 of the cabinet 10 through the slide rail assembly 40. In other embodiments, the server system may not have a slide rail assembly, but instead include a plurality of support members. These support members may be L-shaped brackets, and these support members are disposed on opposite sides of the cabinet and form a plurality of assembly slides to guide the assembly or withdrawal of these heat exchange assemblies. After these heat exchange assemblies slide into these assembly slides, these heat exchange assemblies can be fixed to these support members by screws, mechanism buckles that can be operated by hand, or hand-turned screws to be positioned.

These heat exchange components 32 have the same structure, so only one of them is described in detail below. The heat exchange component 32 includes a housing 321, a heat exchanger 322, two joints 323, 324 and a plurality of fans 325. The heat exchanger 322 is located in the housing 321. The heat exchanger 322 is, for example, a water cooling radiator, which includes, for example, a bottom plate 3221, a top plate 3222, a plurality of connecting plates 3223 and a plurality of fin structures 3224. The bottom plate 3221 is connected to the top plate 3222 through these connecting plates 3223 and are thermally coupled to each other. The bottom plate 3221, the top plate 3222 and the connecting plates 3223 are all provided with flow channel structures (not shown), and the fin structures 3224 are located between any two adjacent connecting plates 3223 and are thermally coupled to the connecting plates 3223. The width W of the heat exchanger 322 is about 530 mm, and the height H is about 4U, where 4U can be 4RU (rack unit) or 4OU (open rack unit). The bottom plate 3221 has a liquid inlet 3221a and a liquid outlet 3221b, and the liquid inlet 3221a and the liquid outlet 3221b are located on one side of the heat exchanger 322. The two joints 323 and 324 are respectively disposed at the liquid inlet 3221a and the liquid outlet 3221b. The fans 325 are located in the housing 321 and at the other side of the heat exchanger 322 relative to the liquid inlet 3221a and the liquid outlet 3221b.

It should be noted that the size of the heat exchanger 322 is not intended to limit the present invention, but the size of the heat exchanger can be adjusted according to actual needs. For example, the width of the heat exchanger can be adjusted accordingly according to the width of the actual cabinet, and the height of the heat exchanger can be less than 4U or greater than 4U. If a heat exchanger with a smaller height can provide the required heat dissipation capacity, then using a heat exchanger with a smaller height can reduce the space it occupies in the cabinet, which is beneficial to the expansion of the number of servers in the cabinet.

It should be noted that the structure of the heat exchanger 322 is merely an example and is not intended to limit the present invention. Instead, a heat exchanger with other structures may be selected as required.

The sub-manifold assembly 34 includes a first sub-pipeline 341 and a second sub-pipeline 342. The first sub-pipeline 341 includes a first sub-pipeline 3411 and a plurality of first sub-connectors 3412, which are disposed on the first sub-pipeline 3411. The first sub-connectors 3412 of the first sub-pipeline 341 are respectively assembled to the connectors 323 of the heat exchangers 322 and the sub-connectors 315 of the pump assembly 31, so that the sub-liquid outlet 3113 of the pump assembly 31 is connected to the liquid inlet 3221a of the heat exchangers 322 through the first sub-pipeline 341. The second sub-pipeline 342 includes a second sub-pipeline 3421 and a plurality of second sub-connectors 3422, which are disposed on the second sub-pipeline 3421. The second sub-connectors 3422 of the second sub-pipeline 342 are respectively connected to the connectors 324 of the heat exchangers 322 and the sub-connectors 316 of the pump assembly 31 , so that the sub-liquid inlet 3114 of the pump assembly 31 is connected to the liquid outlet 3221 b of the heat exchangers 322 through the second sub-pipeline 342 .

In this embodiment, the two sub-connectors 315, 316 of the pump assembly 31, the first sub-connectors 3412 of the first sub-pipeline 341, the connectors 323, 324 of the heat exchanger 322, and the second sub-connectors 3422 of the second sub-pipeline 342 are, for example, tool-free quick-release connectors, which can improve assembly efficiency.

It should be noted that the first sub-pipeline 341 is not limited to being connected to the liquid inlet 3221a of the heat exchanger 322 and the sub-liquid outlet 3113 of the pump assembly 31 via a connector, and the second sub-pipeline 342 is not limited to being connected to the liquid outlet 3221b of the heat exchanger 322 and the sub-liquid inlet 3114 of the pump assembly 31 via a connector. In other embodiments, the first sub-pipeline of the first sub-pipeline may be directly connected to the liquid inlet of the heat exchanger and the sub-liquid outlet of the pump assembly, and the second sub-pipeline of the second sub-pipeline may be directly connected to the liquid outlet of the heat exchanger and the sub-liquid inlet of the pump assembly. That is, each heat exchanger can omit the connector, the pump assembly can omit the sub-connector, the first sub-pipeline can omit the first sub-connector, and the second main pipeline can omit the second sub-connector.

Next, the operation process of the server system 1 will be described below. As shown in FIG. 4 , when the main pump unit 312 in the pump assembly 31 operates, it drives the cooling liquid to flow out of the pump assembly 31, and then flows into the server 20 through the first main pipe 331 to absorb the heat generated by the server 20. Then, the cooling liquid that absorbs the heat generated by the server 20 flows out of the server 20, and then flows back to the pump assembly 31 through the second main pipe 332. Then, the main pump unit 312 in the pump assembly 31 drives the cooling liquid to flow out of the pump assembly 31 again, and then flows into the heat exchangers 322 through the first sub-pipeline 341 to transfer the heat absorbed by the cooling liquid to the heat exchanger 322, thereby cooling the cooling liquid. At this time, the heat absorbed by the heat exchanger 322 is dissipated by forced convection under the operation of the fan 325. Then, the cooled cooling liquid flows out of the heat exchanger 322 and then flows back to the pump assembly 31 through the second sub-pipeline 342. In this way, the main pump unit 312 continuously drives the cooling liquid to repeat the above-mentioned flow cycle, so that the server 20 can operate at an appropriate temperature.

In this embodiment, since the servers 20 and the heat exchange components 32 are accommodated in the cabinet 10 and connected to the pump component 31, the pipes between the servers 20, the heat exchange components 32 and the pump component 31 can be pre-connected when the server system 1 is transported to the preset position in the machine room. In this way, after the server system 1 is placed in the preset position in the machine room, it is not necessary to arrange personnel to go to the machine room to connect the pipes, thereby saving manpower. In addition, the heat exchange components 32 and the pump component 31 are arranged in the same cabinet 10 as the servers 20, so it is convenient to configure the server system 1 in the odd-shaped space in the machine room, thereby improving the space utilization rate of the machine room.

Furthermore, these heat exchange components 32 and pump components 31 are arranged inside the cabinet 10, rather than behind the cabinet 10, so they do not increase the space occupied by the entire server system 1, and do not require personnel to perform maintenance operations in the higher ambient temperature behind the cabinet 10.

On the other hand, the heat exchange components 32 are modular and removable, so the number of heat exchange components 32 can be flexibly adjusted according to the heat dissipation requirements of the servers 20 in the cabinet 10. For example, if the servers 20 currently configured in the cabinet 10 require a heat dissipation requirement of 40KW, and each of the heat exchange components 32 provides a heat dissipation capacity of 10KW, the user can configure four heat exchange components 32 in the cabinet 10 to meet the heat dissipation requirements of the servers 20. Similarly, if the servers 20 require a heat dissipation requirement of 30KW, and each of the heat exchange components 32 provides a heat dissipation capacity of 10KW, the user can configure three heat exchange components 32 in the cabinet 10 to meet the heat dissipation requirements of the servers 20. In this way, the heat exchange components 32 are modular and removable, which can avoid the situation where the heat dissipation capacity provided by these heat exchange components 32 cannot meet the heat dissipation requirements of these servers 20 or is excessively higher than the heat dissipation requirements of these servers 20, thereby causing energy waste.

In this embodiment, the pump assembly 31 is connected in parallel to the heat exchangers 322 of the heat exchange assemblies 32, but the present invention is not limited thereto. In other embodiments, the pump assembly can be connected in series to the heat exchangers of the heat exchange assemblies.

In this embodiment, as shown in FIG. 4 , the heat dissipation module 30 may further include two pressure sensors 35, which are electrically connected to the controller 317 and are respectively disposed at the sub-liquid outlet 3113 and the sub-liquid inlet 3114 of the pump assembly 31 to sense the cooling liquid pressure there. In this way, when the number of heat exchange components 32 is increased or decreased, the controller 317 may, for example, automatically control the pump unit 312 to adjust the flow of the cooling liquid according to the pressure difference change sensed by the two pressure sensors 35, so that the cooling liquid can maintain the flow at the preset pressure difference. It should be noted that the pressure sensor 35 is an optional component and can be selected or omitted according to needs.

In this embodiment, the controller 317 can also be electrically connected to the fans 325 of the heat exchange components 32 to adjust the rotation speed of the fans 325 according to demand, thereby adjusting the heat dissipation capacity of each heat exchange component 32. In addition, the number of fans 325 of each heat exchange component 32 is a plurality of configurations, so that when one of the fans 325 fails, other fans 325 are still running to maintain the heat dissipation capacity of each heat exchange component 32. It should be noted that the number of fans 325 can be increased or decreased according to demand.

According to the server system and heat dissipation module disclosed in the above embodiments, by accommodating these servers and these heat exchange components in a cabinet and connecting to a pump component, the pipes between these servers, these heat exchange components and the pump component can be pre-connected when the server system is transported to the preset position in the machine room. In this way, after the server system is placed in the preset position in the machine room, it is not necessary to arrange personnel to go to the machine room to assemble the pipes, thereby saving manpower. In addition, these heat exchange components and pump components are arranged in the same cabinet as these servers, so it is convenient to configure the server system in the odd-shaped space in the machine room, thereby improving the space utilization rate of the machine room.

Furthermore, these heat exchange components and pump components are installed inside the cabinet, not behind it, so they do not increase the space occupied by the entire server system, and do not require personnel to perform maintenance work in the higher ambient temperature behind the cabinet.

On the other hand, the heat exchange components are modular and removable, so the number of heat exchange components can be flexibly adjusted according to the cooling requirements of the servers in the cabinet, thereby avoiding the situation where the cooling capacity provided by these heat exchange components cannot meet the cooling requirements of these servers or is excessively higher than the cooling requirements of these servers, resulting in energy waste.

Although the present invention is disclosed as above with the aforementioned preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

1: Server system 10: Cabinet 11: Storage space 12: Inner bottom 20: Server 21: Liquid inlet 22: Liquid outlet 23,24: Connector 30: Heat dissipation module 31: Pump assembly 311: Housing 3111: Main liquid outlet 3112: Main liquid inlet 3113: Sub-liquid outlet 3114: Sub-liquid inlet 312: Pump unit 313,314: Main connector 315,316: Sub-connector 317: Controller 32: Heat exchange assembly 321: Housing 322: Heat exchanger 3221: Bottom plate 3221a: Liquid inlet 3221b: Liquid outlet 3222: Top plate 3223: Connecting plate 3224: Fin structure 323,324: Connector 325: Fan 33: Main manifold assembly 331: First main line 3311: First main part 3312: First main joint 332: Second main line 3321: Second main part 3322: Second main joint 34: Sub-manifold assembly 341: First sub-line 3411: First sub-line 3412: First sub-line 342: Second sub-line 3421: Second sub-line 3422: Second sub-line 35: Pressure sensor 40: Slide rail assembly 41: Slide rail 411: First rail 412: Second rail 413: Third rail W: Width H: Height

FIG. 1 is a three-dimensional schematic diagram of a server system disclosed according to an embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of the server system of FIG. 1 from another perspective. FIG. 3 is a partially enlarged front view of the server system of FIG. 1. FIG. 4 is a plan view of the server system of FIG. 1. FIG. 5 is a three-dimensional schematic diagram of the pump assembly of FIG. 1. FIG. 6 is a three-dimensional schematic diagram of the heat exchange assembly of FIG. 1. FIG. 7 is a three-dimensional schematic diagram of the heat exchange assembly of FIG. 1 from another perspective.

10: Cabinet

20: Server

21: Liquid inlet

22: Liquid outlet

23,24: Connectors

31: Pump assembly

3111: Main liquid outlet

3112: Main liquid inlet

3113: Liquid outlet

3114: Liquid inlet

312: Pump unit

313,314: Main connector

315,316: Sub-connector

317: Controller

32: Heat exchange component

322: Heat exchanger

3221a: Liquid inlet

3221b: Liquid outlet

323,324:Connection

325: Fan

331: First main road

3311: First main component

3312: First main connector

332: Second main road

3321: Second main component

3322: Second main connector

341: First sub-pipeline

3411: First sub-pipe fitting

3412: First sub-connector

342: Second sub-pipeline

3421: Second sub-pipe fitting

3422: Second sub-connector

35: Pressure sensor

Claims (11)

A heat dissipation module comprises: a pump assembly having a sub-liquid inlet and a sub-liquid outlet; a plurality of heat exchange assemblies, each having a liquid inlet and a liquid outlet; and a sub-manifold assembly, comprising a first sub-pipeline and a second sub-pipeline, wherein the first sub-pipeline is connected to the sub-liquid outlet of the pump assembly and the liquid inlets of the heat exchange assemblies, and the second sub-pipeline is connected to the liquid outlets of the heat exchange assemblies and the sub-liquid inlet of the pump assembly. A heat dissipation module as described in claim 1, wherein each of the heat exchange components comprises a housing, a heat exchanger and a plurality of fans; in each of the heat exchange components, the heat exchanger and the fans are located in the housing, the liquid inlet and the liquid outlet are located on one side of the heat exchanger, and the fans are located on the other side of the heat exchanger relative to the liquid inlet and the liquid outlet. A heat dissipation module as described in claim 2, wherein the heat exchanger is a water cooling radiator. A heat dissipation module as described in claim 2, wherein the heat exchanger has a height of 4U. The heat dissipation module as described in claim 1 further includes two pressure sensors, which are respectively arranged at the sub-liquid outlet and the sub-liquid inlet of the pump assembly. A heat dissipation module as described in claim 1, wherein the pump assembly includes a housing and at least two pump units, and the at least two pump units are detachably disposed in the housing. A server system includes: a cabinet having a storage space and an inner bottom surface, wherein the inner bottom surface is located at the bottom of the storage space; a plurality of servers arranged in the storage space; and a heat dissipation module including: a pump assembly arranged in the storage space and connected to the server; and a plurality of heat exchange assemblies detachably arranged in the storage space and connected to the pump assembly; wherein the heights of the servers, the pump assembly and the heat exchange assemblies relative to the inner bottom surface are different from each other. A server system as described in claim 7, wherein the heat exchange components are located between the servers and the pump component. A server system as described in claim 8, wherein the pump assembly is closer to the inner bottom surface than the heat exchange assemblies and the servers. A server system as described in claim 7, wherein each of the heat exchange components comprises a housing, a heat exchanger and a plurality of fans; in each of the heat exchange components, the heat exchanger and the fans are located in the housing, the heat exchanger has a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are located on one side of the heat exchanger, and the fans are located on the other side of the heat exchanger relative to the liquid inlet and the liquid outlet. A server system as described in claim 10, wherein the heat exchanger is a water cooling radiator and the height of the heat exchanger is 4U.

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