TWI880689B - Adhesion device and inspection method - Google Patents

Abstract

The invention provides a bonding device and bonding method that can inspect the adhesion state of ACF relative to a substrate and improve production efficiency. The bonding device in an implementation form has: a workbench that holds multiple substrates; a pressing part that presses ACF to the multiple substrates; a supply part that supplies ACF; a driving mechanism that aligns the substrate with the pressing part; a photographing part that photographs the ACF adhered to the substrate; a determination part that determines the inclination of the substrate in an image of another substrate photographed by the photographing part while the pressing part presses the ACF to the substrate; a correction part that corrects the inclination of the substrate in the image based on the inclination; and an inspection part that inspects the adhesion state of the ACF based on the image corrected by the correction part.

Description

Adhesion device and inspection method

The present invention relates to an adhesion device and an inspection method.

When electronic components such as an integrated circuit (IC) or a chip on film (CFO) or a flexible printed circuit (FPC) with an IC are bonded to a substrate such as a display panel via an anisotropic conductive film (ACF), the electronic components are pressed (bonded) after the ACF is bonded to the substrate by an ACF bonding device. The ACF bonded to the panel must be bonded normally to a predetermined position. Therefore, after bonding the ACF, the bonding state has been checked based on an image taken of the ACF. [Prior art literature] [Patent literature]

[Patent Document 1] Japanese Patent Publication No. 9-34372

[Problem to be solved by the invention]

In such a bonding device, from the perspective of inspection efficiency and reflection of inspection results on the bonding process, it is conceivable to inspect the adhesion state on the bonding device. In addition, from the perspective of adhesion efficiency, it is conceivable to process multiple substrates. For example, it is conceivable to improve production efficiency by holding two substrates on one workbench and adhering ACF to the two substrates. However, in this case, since the posture of the two substrates held on the workbench will deviate, it will affect the inspection and sometimes hinder the inspection. Therefore, if the posture of the substrate is corrected and then photographed to inspect the adhesion state, the cycle time will not be improved and production efficiency will be suppressed.

The embodiment of the present invention is designed to solve the above-mentioned problem, and its purpose is to provide a bonding device and bonding method that can inspect the bonding state of ACF relative to the substrate and improve production efficiency. [Technical means for solving the problem]

The embodiment of the present invention is a bonding device for bonding ACF to a substrate, and comprises: a workbench for holding a plurality of the substrates; a crimping section for crimping the ACF to each of the plurality of the substrates; a supply section for supplying the ACF to the crimping section; a driving mechanism for aligning the substrate with the crimping section by changing the relative position of the workbench with respect to the crimping section; and a photographing section for photographing the ACF bonded to the substrate. a judging section, which judges the inclination of the substrate in the image of another substrate photographed by the photographing section while the pressing section is pressing the ACF onto the substrate; a correcting section, which corrects the inclination of the substrate in the image based on the inclination determined by the judging section; and an inspecting section, which inspects the adhesion state of the ACF based on the image after the inclination is corrected by the correcting section.

The inspection method of the embodiment includes: a holding process, in which a workbench holds a plurality of substrates; a first pressing process, in which a pressing unit presses an ACF onto the substrate; and a second pressing process, in which a pressing unit presses an ACF onto another substrate; during the second pressing process, performing: a tilt determination process, in which a determination unit determines the tilt of the substrate in an image obtained by a photographing unit photographing the ACF adhered to the substrate; a correction process, in which a correction unit corrects the tilt of the substrate in the image based on the tilt determined by the determination unit; and an inspection process, in which the adhesion state of the ACF is inspected based on the image after the tilt is corrected by the correction unit. [Effect of the invention]

By using the bonding device of the present invention, the bonding state of the ACF relative to the substrate can be inspected and the production efficiency can be improved.

The embodiment of the present invention (hereinafter referred to as the present embodiment) is specifically described with reference to the attached drawings. In addition, the attached drawings are schematic diagrams, and the dimensions and proportions of each part include exaggerated parts for the sake of ease of understanding. [Attachment Object]

The substrate 1 and ACF 2 as the adhesion objects based on the present embodiment are explained with reference to FIG1. The substrate 1 is a display panel having a display area such as an organic electroluminescence (EL) display. A plurality of ACFs 2 are adhered to the substrate 1 of the present embodiment. However, there is also a case where a single ACF 2 is adhered. On one of the surfaces of the substrate 1, a portion having conductivity, i.e., an electrode, is provided along one side. The area where the electrode is provided is an adhesion area AR for adhering the ACF 2. On the substrate 1 of the present embodiment, a plurality of adhesion areas AR are provided in the direction along the end edge of the substrate 1. For example, in FIG1 , on a workbench 20 described later, when viewed from the front, a substrate 1A is held on the left side L, and a substrate 1B is held on the right side R, and four adhesion areas AR1 to AR4 are set on each substrate 1. In addition, alignment marks are marked on the substrate 1 (see FIG9 (A) to FIG9 (C)), and the positions of the plurality of adhesion areas AR are set based on the positions of the alignment marks.

ACF 2 is an anisotropic conductive member, which is a film formed by dispersing conductive particles on a substrate. As a substrate, a thermosetting resin that cures by heating can be used. ACF 2 can be clamped between electronic components and heated and pressed to achieve electrical and mechanical connection between the electronic components and the substrate 1. ACF 2 is a long and thin strip, with a release tape attached to one side and an adhesive surface on the other side. It is cut into appropriate lengths and the adhesive surface is adhered to the substrate 1.

[Structure] The structure of the adhesive device 10 of this embodiment is described with reference to FIG. 2 and FIG. 3. The adhesive device 10 is a device for pressing the ACF 2 onto the substrate 1. In addition, in FIG. 2 and FIG. 3, the direction in which the adhesive device 10 is pressed is set as the Z direction, and the directions orthogonal to each other in the plane orthogonal to the Z direction are set as the X direction and the Y direction. The Y direction is the direction between the front and the back in FIG. 2. When the adhesive device 10 is set in such a manner that the Z direction becomes a vertical direction, the XY plane becomes a horizontal plane. In this case, the Z direction is a height direction, the side of the setting surface is called the bottom, and the opposite side is called the top. In addition, the rotation direction parallel to the XY plane is set as the θ direction. Furthermore, in the figure, the side indicated by the white arrow is set as the front side, and the left side is set as the L side and the right side is set as the R side when viewed from the front. The bonding device 10 has a workbench 20, a crimping part 30, a supply part 40, a driving mechanism 50, a photographing part 60, and a control device 100. In this embodiment, the following description is made by taking an example of putting two (a pair) substrates into the bonding device 10.

[Workbench] As shown in FIGS. 1 to 3 , the workbench 20 holds a pair of substrates 1. More specifically, the workbench 20 is a flat rectangular table that supports the substrates 1 in a horizontal direction. Although not shown, a plurality of holes connected to a vacuum source are formed on the upper surface of the workbench 20. Thus, the workbench 20 is configured to be able to arrange a pair of substrates 1 at intervals along the X direction and hold them by adsorption. Each substrate 1 is held in a manner that the area for pressing the ACF 2 protrudes from the edge of the workbench 20. The area on the L side where the substrate 1 is held is set as the holding position P1, and the area on the R side where the substrate 1 is held is set as the holding position P2. In addition, the substrate 1 held at the holding position P1 is set as the substrate 1A, and the substrate 1 held at the holding position P2 is set as the substrate 1B.

[Compression-bonding section] The compression-bonding section 30 presses the ACF 2 onto the substrate 1. The compression-bonding section 30 includes a compression head 31, a head moving mechanism 32, and a support section 33.

In the present embodiment, one crimping section 30 is provided for each of a pair of substrates 1. That is, a pair of two crimping sections 30 corresponding to each of a pair of substrates 1 are provided. The crimping head 31, the head moving mechanism 32, the supply section 40 described later, and the photographing section 60 of each crimping section 30 are supported on a base 35 provided for each of a pair of substrates 1. The base 35 is provided with detection sections such as a linear ruler (linear encoder) and a rotary ruler (rotary encoder) on the XY axis, and is positioned relative to the adhesion area AR of the corresponding substrate 1 by independently moving in the X direction and the Y direction, respectively, through a base moving mechanism 36 including a ball screw mechanism driven by a motor. Hereinafter, the base 35 corresponding to the substrate 1A is referred to as a base 35A, and the base 35 corresponding to the substrate 1B is referred to as a base 35B. In addition, the base moving mechanism 36 corresponding to the substrate 1A is referred to as 36A, and the base moving mechanism 36 corresponding to the substrate 1B is referred to as 36B.

(Compression-bonding head) The compression-bonding head 31 clamps the ACF 2 supplied between the substrate 1 and the compression-bonding head 31 through the supply unit 40 described later, and compresses the ACF 2 to the substrate 1. The compression-bonding head 31 is a rectangular block. A flat pressurizing surface is horizontally provided on the bottom surface of the compression-bonding head 31. The compression-bonding heads 31 are arranged along the X direction and are provided for each of a pair of substrates 1. The L side is set as the compression-bonding head 31A, and the R side is set as the compression-bonding head 31B.

(Head moving mechanism) The head moving mechanism 32 moves the crimping head 31 toward or away from the substrate 1. The head moving mechanism 32 of this embodiment moves the crimping head 31 in the Z direction. The head moving mechanism 32 is, for example, a ball screw mechanism driven by a motor.

(Supporting portion) The supporting portion 33 sandwiches the ACF 2 and the substrate 1 between the crimping head 31 and supports the substrate 1 when the ACF 2 is crimped to the substrate 1. The supporting portion 33 has a flat supporting surface facing the pressurizing surface of the crimping head 31.

[Supply section] The supply section 40 supplies the ACF 2 between the crimping section 30 and the substrate 1. The supply section 40 is provided on the L side and the R side corresponding to the crimping head 31A and the crimping head 31B. The supply section 40 has a supply reel 41, a recovery reel 42, a guide roller 43, and a cutting section 44.

(Supply reel) The supply reel 41 is a reel that rolls up the ACF 2 and delivers the ACF 2 by rotating. The supply reel 41 is rotatably supported on the base 35. (Recovery reel) The recovery reel 42 is a reel that winds up the release tape of the ACF 2 and recovers it. The recovery reel 42 is rotatably supported on the base 35.

(Guide roller) The guide roller 43 is a roller that guides the ACF 2 supplied from the supply reel 41 so that it passes between the crimping section 30 and the substrate 1 and is recovered to the recovery reel 42. A plurality of guide rollers 43 are mounted on the base 35. In addition, although not shown, a feeding mechanism for feeding the ACF 2, a tensioning mechanism for applying tension to the ACF 2, and a stripping mechanism for stripping the release tape of the ACF 2 are provided on the passing path of the ACF 2.

(Cutting section) The cutting section 44 cuts (half cuts) the ACF 2 to the extent that the release tape is not cut. The cutting section 44 has a cutter 44a and a supporting member 44b. The cutter 44a is a member that is in contact with the ACF 2 and cuts. The cutter 44a uses a lifting mechanism (not shown) to make the knife at the front end contact or separate from the ACF 2. The supporting member 44b is a rectangular block. The supporting member 44b has a flat surface on the lower surface of the block, and the flat surface is in contact with the cutter 44a with the ACF 2 sandwiched therebetween. The ACF 2 is cut by the cutter 44a to a length that allows it to adhere to the substrate 1.

[Drive mechanism] The drive mechanism 50 aligns the crimping portion 30 with the substrate 1 by changing the relative position of the worktable 20 with respect to the crimping portion 30. The drive mechanism 50 is a device that moves the worktable 20 in the X direction, the Y direction, and the θ direction. For example, an XYθ-axis worktable mechanism driven by a ball screw mechanism and a rotary mechanism with a servo motor as a drive source can be used as the drive mechanism 50. In addition, although not shown in the figure, the drive mechanism 50 has detection parts such as a linear scale (linear encoder) and a rotary scale (rotary encoder) on the XYθ axis, and becomes a structure capable of detecting and controlling the movement amount in the XYθ direction.

[Photographing section] The photographing section 60 photographs the substrate 1. The photographing section 60 has a camera 61. The camera 61 is disposed above the surface of the substrate 1 to which the ACF 2 is adhered, and is positioned relative to the substrate 1 by moving the substrate 35 using the substrate moving mechanism 36, and photographs the substrate 1 downward. Regarding the photographing, when photographing the substrate 1, the photographing is performed in a manner that the alignment mark of the substrate 1 is converged within the field of view, and when photographing the ACF 2 adhered to the substrate 1, the photographing is performed in a manner that includes both the end line (outline) of the substrate 1 and the entire ACF 2. Hereinafter, the camera 61 corresponding to the substrate 1A is referred to as the camera 61A, and the camera 61 corresponding to the substrate 1B is referred to as the camera 61B.

[Control device] The control device 100 is a device for controlling the bonding device 10. The control device 100 includes, for example, a dedicated electronic circuit or a computer that operates according to a prescribed program. That is, the control device 100 controls the operation of the workbench 20, the crimping unit 30, the supply unit 40, the drive mechanism 50, and the camera unit 60.

The control device 100 stores a program for controlling the operation timing and amount of the vacuum source of the worktable 20, the head moving mechanism 32 of the crimping section 30, the substrate moving mechanism 36, the cutting section 44 of the supply section 40, the delivery mechanism, the tension mechanism, the peeling mechanism, the drive mechanism 50, and the camera 61. The control device 100 controls each part by having a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU) read out the program and data and execute them. By changing the program or data, it is possible to cope with various specifications of the substrate 1 and ACF 2 as the crimping object.

The control device 100 of the present embodiment includes a determination unit 110, a correction unit 120, and an inspection unit 130. The determination unit 110 determines the inclination of the substrate 1 in the image of the substrate 1. In the present embodiment, a virtual line VL is set in advance as a reference when adhering the ACF 2. The virtual line VL is one of the coordinate systems set in the adhering device, and is parallel to the X direction in the adhering device 10 of the present embodiment. The adhering area AR of the substrate 1 is set to be parallel to the virtual line VL, and the ACF 2 is supplied between the crimping unit 30 and the substrate 1 in a manner parallel to the virtual line VL, and is adhered to the adhering area AR.

The imaginary line VL is set at the designed position of the outer edge of the substrate 1 when the ACF 2 is adhered. The outer edge is set as the edge for adhering the ACF 2 (refer to Figure 1). The substrate 1 placed and held on the workbench 20 is sometimes not necessarily placed at the designed position, but is tilted in the rotation direction within the horizontal plane. For example, as shown in (A) of Figure 4, the substrate 1 is sometimes placed on the workbench 20 tilted relative to the imaginary line VL. The determination unit 110 detects the angle θ between the imaginary line VL and the end line of the substrate 1 (the outer periphery of the substrate 1) as the inclination. In addition, the determination unit 110 also detects the angle θ between the imaginary line VL and the substrate 1 as the inclination based on the image obtained by photographing the alignment mark provided on the substrate 1. That is, the determination by the determination unit 110 means to determine the relative angle (angle θ) between the reference line as the virtual line VL and the substrate 1 .

The correction unit 120 corrects the inclination of the substrate 1 in the image. As described later, the image of the ACF 2 taken is compared with a template showing a normal state to determine whether the ACF 2 is correctly adhered. The image taken when the substrate 1 is in the state shown in (A) of FIG. 4 becomes an image equivalent to the field of view S indicated by the double-point line. Since the template is based on the design position, even if the image is compared with the template, the ACF 2 photographed in the image is tilted, and therefore, a correct comparison cannot be made. Therefore, as shown in FIG. 4 (B), by rotating the image by an amount (angle θ) corresponding to the tilt obtained by the determination unit 110, the end line of the substrate 1 is made consistent with the virtual line VL, so that the ACF 2 captured in the image becomes comparable with the template (the rotated image G is represented by a dotted line). In addition, by including the position of the substrate 1 as a reference in the captured image, the deviation of the virtual line VL and the XY direction can be corrected. For example, the deviation in the XY direction can be corrected based on the angle VL0 designed when the substrate 1 is placed on the workbench 20 as shown in FIG. 4 (A) and the rotated position P' of the angle P of the substrate 1 in the captured image (FIG. 4 (B)).

The inspection unit 130 inspects the adhesion state of the ACF 2 based on the image corrected by the correction unit 120. The inspection unit 130 is provided with a template based on the same image size as the shooting size, for example. On the template, as shown in (A) of FIG. 5 , the area for adhering the ACF 2 is set to the reference area RA indicated by the white double-dot line. That is, the reference area RA is set to a shape similar to that of the ACF 2 to be adhered and the same size (exaggerated for explanation). The reference area RA is set at the center of the prescribed area, i.e., the template. Therefore, the image of the ACF 2 of the correctly adhered substrate 1 is consistent with the reference area RA. By binarizing the captured image, the area of the image to which the ACF 2 is attached is set to white, and the area other than the area of the image to which the ACF 2 is attached is set to black as the brightness of the substrate 1 .

Therefore, when the ACF 2 is correctly adhered as shown in FIG5(B), the white portion of the ACF 2 in the image is integrated into the reference area RA. That is, the reference area RA is 100% white. In the inspection unit 130, the adhesion state is inspected based on the ratio of white or black in the reference area RA, that is, the area ratio. For example, when the portion of the ACF 2 is not rectangular (the ACF 2 is rolled up) as shown in FIG5(C), or when it deviates from the correct position or tilts from the correct position as shown in FIG5(D), the black portion in the reference area RA becomes larger. Therefore, the ratio of the black portion to the entire reference area RA is set as a threshold value, and when it exceeds the threshold value, it is determined as adhesion abnormality. If it is determined to be abnormal, the operator can stop the bonding device 10 and remove the ACF 2 to perform bonding again (repair work).

Although not shown, the control device 100 has a storage unit for storing information required for the control of the present embodiment, an input unit for inputting information, and a display unit for displaying information. The storage unit stores the virtual line VL, the reference area RA, the threshold, etc. The display unit displays the captured image, the virtual line VL, and the reference area RA. In addition, the display unit can display the inspection result of the inspection unit 130. For example, if the inspection result is abnormal, the meaning is displayed on the display unit, and the operator who sees the meaning can stop the adhesion device 10 and perform repair work.

[Action] In addition to referring to (A) to (D) of Figures 1 to 5, the action example of this embodiment is described with reference to (A) to (E) to (8) of Figures 6. (A) to (E) of Figures 6 are explanatory diagrams showing the program of pressing and inspecting ACF 2. Figure 7 is a flow chart showing the action program of the bonding device 10, and Figure 8 is a flow chart showing the program of inspection.

First, as shown in FIG. 6 (A), a pair of substrates 1A and 1B are placed at holding positions P1 and P2 on the workbench 20 by a conveying device (not shown) in such a manner that the adhesion area AR of the substrate 1 protrudes from the edge of the workbench 20, and are held by suction by negative pressure (holding process). At this time, the postures (angles, positions) of the substrates 1A and 1B may differ due to inclination or displacement relative to the holding positions P1 and P2.

In the present embodiment, a pair of press-bonding portions 30 are prepared corresponding to a pair of substrates 1, respectively. The adhesion region AR of one substrate 1 to which the ACF 2 is to be adhered is positioned in parallel with the imaginary line VL, and one of the press-bonding portions 30 is positioned directly above the imaginary line VL to adhere the ACF 2. Next, the adhesion region AR of the other substrate 1 to which the ACF 2 is to be adhered is positioned in parallel with the imaginary line VL, and another press-bonding portion 30 is positioned directly above the imaginary line VL to adhere the ACF 2. While the ACF 2 is being adhered to the other substrate 1, a new ACF 2 is supplied from the supply portion 40 to one of the press-bonding portions 30.

In addition, the ACF 2 adhered to one of the substrates 1 is photographed, and the photographed image is used to check whether the ACF 2 is correctly adhered. After the ACF 2 is adhered to the other substrate 1, the adhesion area AR of one of the substrates 1 to which the ACF 2 is adhered is positioned parallel to the imaginary line VL, and one of the crimping parts 30 is repositioned directly above it, and the next ACF 2 is adhered to one of the substrates 1. At this time, a new ACF 2 is supplied to the other crimping part 30. At the same time, the ACF 2 adhered to the other substrate 1 is photographed, and the photographed image is used to check whether the ACF 2 is correctly adhered.

In this way, the ACF 2 is alternately attached to one of the substrates 1 and to the other substrate, and the ACF 2 is supplied and inspected at the same time. The above actions are repeated until the ACF 2 is attached to all the ACF 2 attachment areas AR. When all the ACF 2 are attached, a pair of substrates 1 is transported by the transport device, and a new pair of substrates 1 is supplied. The above content is an outline of the actions of this embodiment. The following is a detailed description.

As described above, when the substrate 1 is placed on the worktable by the conveying device, the ACF 2 supplied from the supply reel 41 is cut into appropriate lengths by the cutting section 44 and sequentially fed out to between the crimping head 31 and the substrate 1 by the feeding mechanism.

In this state, the substrate 35A is moved by the substrate moving mechanism 36A, and the camera 61A photographs the substrate 1A. Then, the determination unit 110 detects the alignment mark of the substrate 1A based on the photographed image, and obtains the inclination of the substrate 1A based on the position of the alignment mark, and rotates the worktable 20 through the drive mechanism 50 in such a manner that the inclination of the substrate 1A is parallel to the crimping head 31A (parallel to the imaginary line VL).

In addition, the position of the adhesion area AR1 of the substrate 1A (L side) is obtained based on the position of the alignment mark, and the worktable 20 is moved by the drive mechanism 50 in such a manner that the adhesion area AR1 of the substrate 1A (L side) is positioned on the support surface of the support portion 33. Then, the worktable 20 is lowered by the drive mechanism 50, and the bottom surface of the substrate 1A is placed on the support surface of the support portion 33.

At the same time, the base 35A is moved by the base moving mechanism 36A so that the crimping head 31A comes to the top of the adhesion area AR1 of the substrate 1A (L side). Then, as shown in FIG. 7 , the ACF 2 is adhered to the adhesion area AR1 by the crimping head 31A descending (first crimping process: step S101). After the adhesion, the crimping head 31A rises, and the worktable 20 is also raised by the driving mechanism 50, so that the substrate 1A is separated from the support portion 33.

Next, the substrate 35B is moved by the substrate moving mechanism 36B, and the camera 61B takes a picture of the R-side substrate 1B. Then, the position of the alignment mark of the substrate 1B is detected based on the image taken, and the inclination of the substrate 1B is calculated based on the position of the alignment mark. As shown in FIG. 6 (B), the worktable 20 is rotated by the drive mechanism 50 in such a manner that the inclination of the substrate 1B is parallel to the crimping head 31B (parallel to the imaginary line VL).

In addition, the position of the adhesion area AR1 of the substrate 1B (R side) is obtained based on the position of the alignment mark, and the worktable 20 is moved by the drive mechanism 50 in such a manner that the adhesion area AR1 of the substrate 1B (R side) is positioned on the support surface of the support portion 33. Then, the worktable 20 is lowered by the drive mechanism 50, and the bottom surface of the substrate 1B is placed on the support surface of the support portion 33.

At the same time, the substrate 35B is moved by the substrate moving mechanism 36B so that the crimping head 31B comes to the top of the adhesion area AR1 of the substrate 1B (R side). Then, as shown in FIG. 7 , the crimping head 31B is lowered to adhere the ACF 2 to the adhesion area AR1 (second crimping process: step S102). After adhesion, the crimping head 31B is raised, and the worktable 20 is also raised by the driving mechanism 50, so that the substrate 1B is separated from the support portion 33.

In the process of attaching the substrate 1B (R side), as shown in FIG6 (C), the substrate 35A is moved by the substrate moving mechanism 36A, and the camera 61A comes to the top of the attaching area AR1 of the substrate 1A (L side) held at the holding position P1, and takes a picture of the ACF 2 (first pressing process: ACF 2 attached in step S101) attached to the attaching area AR1 of the substrate 1A. The inspection unit 130 performs inspection based on the image taken. The dotted line in FIG6 (C) shows the shooting area of the camera 61A.

That is, as shown in the flowchart of FIG8 , the determination unit 110 determines the angle θ of the inclination of the end line of the substrate 1A in the captured image relative to the virtual line VL (see FIG4 (A)) (determination process: step S201), and the correction unit 120 rotates the image so as to correct the inclination (see FIG4 (B)) (correction process: step S202). Then, when the image is rotated relative to the template (see FIG5 (A)), the image is rotated relative to the virtual line VL. As shown in FIG5(B), when the ratio of the black portion of the binarized image in the reference area RA is below the threshold value (YES in step S203), it is determined that the adhesion state is normal (inspection process: step S204). As shown in FIG5(C) and FIG5(D), when it exceeds the threshold value (NO in step S203), it is determined that the adhesion state is abnormal (inspection process: step S205).

That is, the inspection unit 130 overlaps the image of the substrate 1A with the ACF 2 corrected by the correction unit 120 with the template, and determines whether it is normal or abnormal based on the overlapping state, thereby inspecting the adhesion state of the ACF 2.

As shown in the flowchart of FIG. 7 , when it is determined to be abnormal (Yes in step S103), the bonding device 10 is stopped (step S114) and the repair operation is performed. When it is determined to be normal (No in step S103), it is confirmed whether the next bonding area AR exists (step S104). When the bonding area AR2 in the substrate 1A on the L side as the next bonding area AR exists (Yes in step S104), the bonding is performed.

If there is no next adhesion area AR (No in step S104), the adhesion area AR on the R side that was last adhered is checked in the same manner as described above (step S112). If it is determined to be abnormal (Yes in step S113), the adhesion device 10 is stopped (step S114) and the repair operation is performed. If it is determined to be normal (No in step S113), the process ends.

The following description will be given of the case where the next adhesion area AR exists. In order to adhere the adhesion area AR2 in the substrate 1A on the L side of the next adhesion area AR, as shown in FIG6(D), the substrate 35A is moved by the substrate moving mechanism 36A, and the camera 61A takes an image of the substrate 1A. Then, the position of the alignment mark of the substrate 1A is detected based on the image taken, and the inclination of the substrate 1A is calculated based on the position of the alignment mark, and the worktable 20 is rotated by the drive mechanism 50 so that the inclination of the substrate 1A is parallel to the crimping head 31A (parallel to the virtual line VL).

In addition, the position of the adhesion area AR2 of the substrate 1A (L side) is determined based on the position of the alignment mark, and the workbench 20 is moved by the driving mechanism 50 in such a manner that the adhesion area AR2 of the substrate 1A is positioned on the supporting surface of the support portion 33, and the substrate 35A is moved by the substrate moving mechanism 36A in such a manner that the crimping head 31A comes directly above the adhesion area AR2 of the substrate 1A (step S105).

The rotation of the workbench 20 and the positioning of the adhesion area AR2 at this time can be performed based on the image taken when the ACF 2 is adhered to the adhesion area AR1 in step S101, or the position of the alignment mark of the substrate 1A and the rotation position of the workbench 20 at this time can be stored and performed based on the said positions.

Thereafter, as shown in FIG. 7 , the ACF 2 is bonded to the bonding area AR2 by lowering the crimping head 31A (first crimping process: step S106). After bonding, the crimping head 31A rises, and the worktable 20 is also raised by the drive mechanism 50, and the substrate 1A is separated from the support portion 33. In the bonding process, as shown in FIG. 6 (E), the substrate 35B is moved by the substrate moving mechanism 36B, and the camera 61B comes to the top of the bonding area AR1 of the substrate 1B (R side) held at the holding position P2, and the ACF 2 (second crimping process: ACF 2 bonded in step S102) bonded to the bonding area AR1 of the substrate 1B is photographed, and the inspection unit 130 performs inspection based on the image. The photographing area of the camera 61B is shown by a dotted line in (E) of Fig. 6. The procedure of the inspection is the same as that shown in Fig. 8 described above.

Returning to FIG. 7 , if it is determined to be abnormal (Yes in step S107), the bonding device 10 is stopped (step S114) and the repair operation is performed. If it is determined to be normal (No in step S107), the substrate 35B is moved by the substrate moving mechanism 36B, and the camera 61B takes a picture of the substrate 1B. Then, the position of the alignment mark of the substrate 1B is detected based on the image taken, and the inclination of the substrate 1B is calculated based on the position of the alignment mark. The worktable 20 is rotated by the drive mechanism 50 in such a way that the inclination of the substrate 1B is parallel to the crimping head 31B (parallel to the imaginary line VL).

In addition, regarding the substrate 1, the bonding is performed using a pair of substrates 1. Therefore, it is sufficient to confirm whether the next bonding area exists only on the side of one of the substrates 1 that starts bonding first. After bonding to one of the substrates 1, the other substrate 1 will definitely have a residual bonding area. Therefore, in the substrate 1B, it is not necessary to confirm whether the bonding area exists.

In addition, the position of the adhesion area AR2 of the substrate 1B (R side) is calculated based on the position of the alignment mark, and the workbench 20 is moved by the driving mechanism 50 in such a manner that the adhesion area AR2 of the substrate 1B is positioned on the supporting surface of the support portion 33, and the substrate 35B is moved by the substrate moving mechanism 36B in such a manner that the crimping head 31B comes to be directly above the adhesion area AR2 of the substrate 1B (step S108).

The rotation of the workbench 20 and the positioning of the adhesion area AR2 at this time can be performed based on the image taken when the ACF 2 is adhered to the adhesion area AR1 in step S102, or the position of the alignment mark of the substrate 1A and the rotation position of the workbench 20 at this time can be stored and performed based on the said positions.

Then, the ACF 2 is bonded to the bonding area AR2 by the lowering of the crimping head 31B (second crimping process: step S109 ). After bonding, the crimping head 31B rises, and the drive mechanism 50 also raises the stage 20 , and the substrate 1B leaves the support portion 33 .

In the bonding process, the substrate 35A is moved by the substrate moving mechanism 36A in the same manner as described above, and the camera 61A comes to the top of the bonding area AR2 of the substrate 1A (L side) held at the holding position P1, and the ACF 2 (first pressure bonding process: ACF 2 bonded in step S106) bonded to the bonding area AR2 of the substrate 1A is photographed, and the inspection unit 130 performs inspection. The inspection procedure is the same as the procedure shown in FIG. 8 described above.

If it is determined to be abnormal (Yes in step S110), the bonding device 10 is stopped (step S114) and a repair operation is performed. If it is determined to be normal (No in step S110), it is confirmed whether the next bonding area AR exists (step S111). If the next bonding area AR3 (the substrate 1A on the L side) exists (Yes in step S111), the processing from step S105 to step S111 is repeated.

If there is no next adhesion area AR (No in step S111), the adhesion area AR4 on the R side that is adhered last is checked in the same manner as described above (step S112). If it is determined to be abnormal (Yes in step S113), the adhesion device 10 is stopped (step S114) and the repair operation is performed. If it is determined to be normal (No in step S113), the process ends.

[Effects] (1) This embodiment is a bonding device 10 for bonding ACF 2 to a substrate 1, and comprises: a workbench 20 for holding a plurality of substrates 1; a crimping section 30 for crimping ACF to each of the plurality of substrates 1; a supply section 40 for supplying ACF 2 to the crimping section 30; a drive mechanism 50 for aligning the substrate 1 with the crimping section 30 by changing the relative position of the workbench 20 with respect to the crimping section 30; a photographing section 60 for photographing the ACF bonded to the substrate 1; and a determination section 110 for determining whether the ACF 2 is bonded to the crimping section 30. 2 is pressed onto the substrate 1, the inclination of the substrate 1 in the image of another substrate 1 photographed by the photographing unit 60 is determined; the correction unit 120 corrects the inclination of the substrate 1 in the image based on the inclination determined by the determination unit 110; and the inspection unit 130 inspects the adhesion state of the ACF 2 based on the image corrected by the correction unit 120.

In addition, the inspection method of this embodiment includes: a holding process, in which the workbench 20 holds multiple substrates 1; a first pressing process, in which the pressing section 30 presses the ACF 2 onto the substrate 1; a second pressing process, in which the pressing section 30 presses the ACF 2 onto another substrate 1, and during the second pressing process, includes: a tilt determination process, in which the determination section 110 determines the tilt of the substrate 1 in the image obtained by the photographing section 60 photographing the ACF 2 adhered to the substrate 1; a correction process, in which the correction section 120 corrects the tilt of the substrate 1 in the image based on the tilt determined by the determination section 110; and an inspection process, in which the adhesion state of the ACF 2 is inspected based on the image corrected by the correction section 120.

Thus, during the period of pressing ACF 2 onto substrate 1, the adhesion state of ACF 2 on another substrate 1 can be inspected. That is, after the pressing process of ACF 2 onto substrate 1 is completed, the pressing process of ACF 2 onto another substrate 1 can be immediately performed, so even if the postures of the plurality of substrates 1 held by the workbench 20 are offset and misaligned, the substrate 1 that has completed the pressing process can be correctly inspected, thereby improving production efficiency.

When a plurality of substrates 1 are held on a single workbench 20 and the ACF 2 is adhered and inspected as in the present embodiment in order to improve productivity, the postures of the plurality of substrates 1 held by the workbench 20 are often misaligned. Since the ACF 2 needs to be adhered to a specified area of the substrate 1, the posture of the substrate 1 is aligned with respect to the crimping portion 30. That is, in order to position the adhesion area AR of the substrate 1 at the crimping portion 30, one side of the substrate 1 where the adhesion area AR is located is aligned with a reference line aligned with the crimping portion 30. When the posture of one substrate 1 is aligned with the crimping portion 30, the other substrate 1 is no longer aligned with the crimping portion 30.

When inspecting the attached ACF 2, if the ACF inspection is performed directly after the ACF is attached (processed) to the substrate 1, the worktable 20 cannot be moved (the position of the substrate is corrected) before the ACF inspection is completed. Therefore, the ACF cannot be attached to another substrate 1 placed on the worktable 20, and the effect of placing a plurality of substrates 1 on the worktable 20 is reduced.

When the ACF 2 is attached to the other substrate 1 with priority and the ACF 2 is attached to the substrate 1 after completion, and then the workbench 20 is moved (the other substrate 1 is aligned to the crimping portion 30) to attach the ACF, the posture of the substrate 1 to which the ACF is attached is not aligned with the reference line, and the attachment position and the attachment direction deviate from the reference position. In this state, it is impossible to perform a correct inspection, resulting in an erroneous inspection. Therefore, it is impossible to photograph the ACF 2 attached to the substrate 1 at the same time as the ACF 2 is attached to the other substrate 1 and perform a correct inspection. Therefore, the effect of improving productivity is weakened.

When the ACF 2 is attached to another substrate 1, the substrate 1 is aligned with the reference line in order to attach it to the substrate 1 for the next time. Therefore, the attached ACF 2 can be accurately inspected by photographing it. However, after attaching the ACF to the substrate 1, the workbench is moved for each substrate to perform the inspection. Since the ACF 2 cannot be attached and inspected at the same time, the effect of improving productivity is suppressed.

That is, if the ACF 2 is to be attached and inspected at the same time, a correct inspection cannot be performed, and in order to perform a correct inspection, the ACF 2 cannot be attached and inspected at the same time. In any case, the effect of improving productivity is suppressed.

In this embodiment, while positioning another substrate 1 at another crimping portion 30 and attaching ACF 2 to another substrate 1, the ACF 2 attached to one of the substrates 1 is photographed and inspected based on the image. Thus, by supplying and processing a plurality of substrates 1, productivity can be improved. At this time, the posture of the substrate 1 to which the ACF 2 is attached when photographed is detected based on the photographed image, and the posture is corrected in alignment with the reference position. Thus, a correct inspection can be performed. That is, the ACF 2 can be attached to the substrate 1 and inspected at the same time, and a correct inspection can be performed.

(2) The determination unit 110 determines the inclination of the substrate 1 based on the edge line of the substrate 1 in the image. Therefore, compared with the case where the inclination of the substrate 1 is calculated by calculation, the amount of calculation can be reduced and the processing speed can be increased.

(3) The inspection unit 130 inspects the ACF 2 adhered to one location of the other substrate 1 each time the ACF 2 is adhered to one location of the substrate 1. Thus, if there is an adhesion abnormality, repair work can be performed immediately.

[Variation] (1) The determination unit 110 may determine the inclination of the substrate 1 based on the alignment mark of the substrate 1 captured by the imaging unit 60. For example, a line segment connecting a plurality of alignment marks of the substrate 1 may be obtained, and the inclination of the image may be corrected in such a way that the line segment coincides with the virtual line VL.

As shown in FIG. 9 (A), a plurality of alignment marks are provided on the substrate 1. In the present embodiment, two alignment marks are provided. An alignment mark M1 is provided on the substrate 1A on the L side of the plurality of substrates 1, and an alignment mark M2 is provided on the substrate 1B on the R side. The plurality of alignment marks M1 of the substrate 1A placed on the workbench 20 are detected, the inclination θa of the substrate 1A is obtained, and the rotation position θ1 of the workbench 20 at this time is stored. Then, as shown in FIG. 9 (B), when the substrate 1A is made parallel to the imaginary line VL, the workbench 20 is rotated by an amount corresponding to the inclination θa of the substrate 1A. The rotation position θ2 of the workbench 20 at this time is stored as the rotation position of the workbench 20 when the ACF 2 is adhered to the substrate 1A.

In addition, the inclination of the substrate 1B is obtained by detecting a plurality of alignment marks M2 of the substrate 1B placed on the worktable 20 in the state of FIG. 9 (B). Then, as shown in FIG. 9 (C), when the substrate 1B is parallel to the imaginary line VL, the worktable 20 is rotated by an amount corresponding to the inclination θb of the substrate 1B. At this time, the rotation position θ3 of the worktable 20 becomes θ2-θb, and is stored as the rotation position of the worktable 20 when the ACF 2 is attached to the substrate 1B.

Based on the inclination of the substrate 1 obtained in the above manner, the image obtained by photographing the ACF 2 is inspected after rotation correction. In addition, according to the above content, the relative angle between the substrate 1A and the substrate 1B is θb (the inclination of the other substrate when one substrate 1 is parallel to the virtual line VL), which is used for the correction angle of the image of the substrate 1 photographed with the ACF 2, or the rotation amount for positioning the worktable 20. The above form can also be applied to the case where it is difficult to judge the deviation in the XY direction, such as not including the angle even if the end line of the substrate 1 is photographed.

In the above-described embodiment, the inclination of the substrate 1 is determined using alignment marks provided on the substrate 1. However, when alignment marks are also present in each adhesion area AR, a shooting unit 60 with a wide field of view as used in (A) to (C) of FIG. 9 is not used, but a shooting unit 60 with a narrow field of view that uses the adhesion area AR as a field of view is used, thereby achieving a device that suppresses costs.

(2) In addition, as described in FIG. 9 (A) to FIG. 9 (C), the tilt can also be obtained based on the rotation position θ2 of the stage 20 when the substrate 1 is attached and the rotation position θ3 of the stage 20 when the alignment mark of the other substrate 1 is photographed and the stage 20 is positioned at the attachment area AR of the other substrate 1. According to the above form, the tilt can be obtained without having to obtain the tilt based on the image photographed after the ACF 2 is attached.

(3) The inspection unit 130 may inspect the ACF 2 adhered to a plurality of locations on another substrate 1 whenever the ACF 2 is adhered to a plurality of locations on the substrate 1 .

The above-described embodiment is described using (A) to (D) of FIG. 10 . The above-described embodiment has the same structure as that of the above-described embodiment, but the adhesion regions AR of the pair of substrates 1A and 1B are provided with five locations AR1 to AR5. In (A) to (D) of FIG. 10 , the adhesion regions AR to which the ACF 2 is not adhered are indicated by dotted lines, and the adhesion regions AR to which the ACF 2 is adhered are indicated by solid lines.

As shown in FIG. 10A , similarly to the above-described embodiment, after the base 35A moves to image the substrate 1A, the stage 20 moves to position the substrate 1A, and the ACF 2 is adhered to the plurality of adhesion areas AR1 to AR5 of the substrate 1A.

Next, as shown in FIG. 10B , after the base 35B moves to capture an image of the substrate 1B, the stage 20 is moved to position the substrate 1B, and the ACF 2 is adhered to the plurality of adhesion regions AR1 to AR5 of the substrate 1B.

Then, as shown in (C) of Figure 10, during the period when ACF 2 is adhered to the adhesion area AR1 to the adhesion area AR5 of the substrate 1B, the camera 61A arranged on the base 35A photographs the end line of the substrate 1A and the ACF 2 adhered to the adhesion area AR1 to the adhesion area AR5, and the inspection unit 130 inspects the status of the ACF 2 adhered to the adhesion area AR1 to the adhesion area AR5 based on the image.

Next, as shown in (D) of FIG. 10 , after ACF 2 is adhered to a plurality of adhesion areas AR1 to AR5 of the substrate 1B, the ACF 2 adhered to the adhesion areas AR1 to AR5 is photographed by the camera 61B provided on the base 35B, and the tilt inspection unit 130 inspects the state of the ACF 2 adhered to the adhesion areas AR1 to AR5 based on the image. After the photographing, the substrate 1 is conveyed. Of course, the same operation can be performed even when there are three or more substrates 1. Thus, compared with the case where the photographing unit 60 is positioned and the adhesion state is inspected one by one each time the substrates 1 are adhered, the production efficiency can be improved.

Furthermore, the imaging unit 60 may be capable of imaging the field of view of one adhesion area AR instead of the imaging unit 60 capable of imaging the field of view of a plurality of adhesion areas AR. As in the above-described embodiment, the production efficiency can be improved.

(4) In the above embodiment, the base 35 is provided for each substrate 1, and each base 35 supports the pressing section 30, the supply section 40, and the camera section 60, and moves independently. However, the pressing section 30, the supply section 40, and the camera section 60 corresponding to a plurality of substrates 1 may be supported on one base 35. In this case, since the base moving mechanism 36 is not provided for each base 35, cost reduction can be achieved.

(5) In the above embodiment, the number of substrates 1 supported on the worktable 20 is two, but it may be three or more. In this case, the number of the crimping section 30 or the crimping head 31 of the crimping section 30 may correspond to the number of substrates 1. Thus, similar to the above embodiment, the tilt of the image of the substrate 1 to be inspected among the plurality of substrates 1 may be corrected before inspection.

FIG. 11 shows a state where ACF 2 is adhered to three substrates 1A, 1B, and 1C held by a work table 20. In the figure, in the adhesion area AR, the area filled with black indicates the adhesion area AR to which ACF 2 has already been adhered, the area filled with hatching indicates the adhesion area AR to which ACF 2 has been adhered by a crimping head, and the area filled with dotted lines indicates the adhesion area AR to which ACF 2 is to be adhered next. That is, the adhesion area AR1 of each of the three substrates is filled with black, indicating that ACF 2 has already been adhered, and the adhesion area AR2 of the substrate 1A is also filled with black, indicating that ACF 2 has already been adhered. The adhesion area AR2 of the substrate 1B is hatched, indicating that ACF 2 has been adhered. In addition, the adhesion area AR2 of the substrate 1C is indicated by a dotted line, indicating a planned area to which the ACF 2 is to be adhered next.

Although not shown in FIG. 11 , the configuration is the same as that described above: the crimping head 31, the head moving mechanism 32, the supply unit 40, and the photographing unit 60 are respectively supported on a base 35A, a base 35B, and a base 35C respectively provided for each of the three substrates 1, and are independently moved in the X direction and the Y direction by a base moving mechanism 36 to be positioned relative to the adhesion area AR of the corresponding substrate 1.

Moreover, during the bonding process, in the substrate 1A, the substrate 35A is moved by the substrate moving mechanism 36A, and the camera 61A arranged on the substrate 35A comes to the top of the bonding area AR2 of the substrate 1A, and the ACF 2 adhered to the bonding area AR2 of the substrate 1A is photographed (the photographing field of view is indicated by a dotted line), and the inspection unit 130 corrects the inclination of the image of the substrate 1 and then performs inspection.

In addition, in the substrate 1C, in order to adhere the ACF 2 to the adhesion area AR2, the substrate 35C is moved by the substrate moving mechanism 36C, and the camera 61C provided on the substrate 35C takes an image of the substrate 1C (the photographing field is indicated by a dotted line). Then, the alignment mark of the substrate 1C is detected based on the photographed image, and the inclination of the substrate 1C is obtained based on the position of the alignment mark.

Then, after the inspection of the ACF 2 adhered to the adhesion area AR2 of the substrate 1A and the completion of the adhesion of the ACF 2 to the adhesion area AR2 of the substrate 1B, the worktable 20 is rotated by the driving mechanism 50 in such a manner that the inclination of the substrate 1C is parallel to the virtual line VL. In addition, based on the position of the adhesion area AR2 of the substrate 1C, the substrate 35C is moved by the substrate moving mechanism 36C to position the crimping head 31C just above the adhesion area AR2 of the substrate 1C.

In the embodiment, at the time point, the camera 61C is used to photograph the substrate 1C to calculate the rotation angle of the workbench 20 and the movement amount of the substrate 35C. However, the image taken when the ACF 2 is adhered to the adhesion area AR1 of the substrate 1C can also be used to calculate the rotation angle of the workbench 20 and the movement amount of the substrate 35C. The position of the alignment mark of the substrate 1C at this time can also be stored, and the rotation angle of the workbench 20 and the movement amount of the substrate 35C can be calculated based on the position.

Even if a plurality of substrates 1 are placed on the workbench 20, the adhesion state of the ACF 2 of another substrate 1 can be inspected while the ACF 2 is being pressed onto the substrate 1, just like two substrates 1. Therefore, even if the postures of the plurality of substrates 1 held by the workbench 20 are offset and misaligned, the substrate 1 that has completed the pressing process can be corrected and then inspected, thereby enabling accurate inspection and improving production efficiency.

(6) In the present embodiment, the bases 35 are provided corresponding to the substrates 1 placed on the workbench one by one, but the bases 35 may be provided corresponding to a plurality of substrates 1. For example, when four substrates 1 are placed on the workbench 20, two bases 35 may adhere ACF 2 to two substrates 1 respectively.

FIG. 12 shows a state where four substrates 1A to 1D are placed on a worktable 20, and a base 35A provided with a crimping head, a camera, etc., for attaching ACF 2 to substrates 1A and 1B, and a base 35C for attaching ACF 2 to substrates 1C and 1D are provided.

In the figure, two adhesion areas AR are set on each of the four substrates 1. The area filled with black indicates the adhesion area AR to which ACF 2 has been adhered, the area with shaded lines indicates the adhesion area AR to which ACF 2 is adhered using a crimping head, and the area with dotted lines indicates the adhesion area AR to which ACF 2 will be adhered next.

That is, the adhesion area AR1 and the adhesion area AR2 of the substrate 1A are filled with black, indicating that the ACF 2 is adhered to the substrate 1A by the substrate 35A. In addition, the adhesion area AR1 and the adhesion area AR2 of the substrate 1C are shaded, indicating that the ACF 2 is adhered by the substrate 35C. In addition, the adhesion area AR1 and the adhesion area AR2 of the substrate 1B and the substrate 1D are indicated by dotted lines, indicating that the predetermined area where the ACF 2 is to be adhered to the substrate 1B by the substrate 35A and the predetermined area where the ACF 2 is to be adhered to the substrate 1D by the substrate 35C.

In addition, in the above-described embodiment, after the ACF 2 is adhered to the two adhesion regions AR provided on the substrate 1, the adhesion state of the ACF 2 adhered to the other substrate 1 is inspected.

In the described state, while the ACF 2 is being adhered to the adhesion area AR1 and the adhesion area AR2 of the substrate 1C using the base 35C, an unillustrated camera arranged on the base 35A comes directly above the substrate 1A to photograph the end line of the substrate 1A and the adhered ACF 2 (the photographing field of view is indicated by a dotted line), and the inspection unit 130 inspects the adhesion state of the ACF 2 of the substrate 1A.

Next, since the next substrate 1 to which the ACF 2 is to be adhered is the substrate 1B, after the substrate 35A photographs the substrate 1A, the unillustrated camera disposed on the substrate 35A moves to the top of the substrate 1B and photographs the substrate 1B (the substrate 35A after movement is represented by a dotted line, and the photographing field of the camera is represented by a double-dotted line).

Then, the alignment mark of the substrate 1B is detected based on the captured image, and the inclination of the substrate 1B is calculated based on the position of the alignment mark.

When the ACF 2 of the base 35C is adhered to the substrate 1C, the substrate 1A is photographed, and the inclination of the substrate 1B is detected, the workbench 20 is rotated in a manner such that the inclination of the substrate 1B is parallel to the imaginary line VL based on the inclination of the substrate 1B, and the unillustrated crimping head of the base 35A is positioned at the adhesion area AR1 of the substrate 1B.

Then, the ACF 2 is adhered to the adhesion area AR1 and the adhesion area AR2 of the substrate 1B by the base 35A. During the adhesion, a camera (not shown) provided on the base 35C comes right above the substrate 1C to take pictures of the edge line of the substrate 1C and the adhered ACF 2, and the inspection unit 130 inspects the adhesion state of the ACF 2 on the substrate 1C. At this time, in the inspection by the inspection unit 130, a member is used to rotate the image by an amount corresponding to the angle of the substrate 1B obtained as described above.

In this way, even if a base 35 corresponding to a plurality of substrates 1 is provided, the adhesion state of the ACF 2 of another substrate 1 can be inspected while the ACF 2 is pressed against the substrate 1. Therefore, even if the postures of the plurality of substrates 1 held by the workbench 20 are offset and misaligned, correct inspection can be performed, thereby improving production efficiency.

[Other embodiments] The embodiments and variations of each part of the present invention are described above, but the embodiments or variations of each part are provided as examples and are not intended to limit the scope of the invention. These novel aspects can be implemented in various other forms, and various omissions, substitutions, changes, and combinations can be made without departing from the scope of the invention. These embodiments or variations thereof are included in the scope or the subject matter of the invention and are included in the invention described in the claims.

1, 1A, 1B, 1C, 1D: substrate 2: ACF 10: bonding device 20: workbench 30: crimping section 31, 31A, 31B: crimping head 32: head moving mechanism 33: support section 35, 35A, 35B, 35C: substrate 36, 36A, 36B: substrate moving mechanism 40: supply section 41: supply reel 42: recovery reel 43: guide roller 44: cutting section 44a: cutter 44b: support member 50: drive mechanism 60: shooting section 61, 61A, 61B: camera 100: control device 110: determination section 120: Correction section 130: Inspection section AR, AR1~AR5: Adhesion area G: Rotated image L: Left side M1, M2: Alignment mark P, VL0: Angle P': Position P1, P2: Hold position R: Right side RA: Reference area S: Field of view S101~S114, S201~S205: Steps VL: Imaginary line θ: Angle θa, θb: Tilt θ1, θ2, θ3: Rotation position X, Y, Z: Direction

FIG. 1 is a plan view of a substrate and an ACF to be pressed in an embodiment. FIG. 2 is a front view of a pressing device in an embodiment. FIG. 3 is a side view of a pressing device in an embodiment. FIG. 4 (A) and FIG. 4 (B) are explanatory diagrams showing image processing during inspection, FIG. 4 (A) is an example of a screen before correction, and FIG. 4 (B) is an example of a screen after correction. FIG. 5 (A) to FIG. 5 (D) are explanatory diagrams showing judgment processing during inspection, FIG. 5 (A) is an example of a screen under normal conditions, FIG. 5 (B) is an example of a screen when there is a rollover, and FIG. 5 (C) is an example of a screen when there is a deviation. Figures 6 (A) to 6 (E) are explanatory diagrams showing a procedure for crimping and inspecting ACF. Figure 7 is a flow chart showing a procedure for crimping using a crimping device. Figure 8 is a flow chart showing a procedure for inspecting using a crimping device. Figures 9 (A) to 9 (C) are explanatory diagrams for finding the inclination of a substrate based on alignment marks. Figures 10 (A) to 10 (D) are explanatory diagrams showing a form of inspecting after attaching multiple ACFs to a substrate. Figure 11 is an explanatory diagram showing a form of attaching ACFs to three substrates. Figure 12 is an explanatory diagram showing a form of attaching ACFs to multiple substrates by one crimping unit.

1. 1A, 1B: Substrate

2:ACF

10: Adhesion device

20: Workbench

30: Press-fitting part

31, 31A, 31B: compression fittings

32: Head moving mechanism

33: Supporting part

35A, 35B: Matrix

40: Supply Department

41: Supply reel

42: Recycling Scroll

43:Guide roller

44: Cutting section

44a: Cutter

44b: Supporting member

50: Driving mechanism

60: Photography Department

61A, 61B: Camera

100: Control device

110: Judgment Department

120: Correction Department

130: Inspection Department

L: Left side

R: Right side

θ: angle

X, Y, Z: direction

Claims (6)

A bonding device for bonding an anisotropic conductive film on a substrate, the bonding device comprising: a workbench for holding a plurality of the substrates; a crimping section for crimping the anisotropic conductive film onto each of the plurality of substrates; a supply section for supplying the anisotropic conductive film to the crimping section; a driving mechanism for aligning the substrate with the crimping section by changing the relative position of the workbench relative to the crimping section; a photographing section for photographing the anisotropic conductive film bonded to the substrate; a determination section for determining the inclination of the substrate in an image of another substrate photographed by the photographing section while the crimping section is crimping the anisotropic conductive film onto the substrate; A correction unit that corrects the inclination of the substrate in the image based on the inclination determined by the determination unit; and an inspection unit that inspects the adhesion state of the anisotropic conductive film based on the image after the inclination is corrected by the correction unit. The adhesion device as described in claim 1, wherein the determination unit determines the inclination of the substrate based on an end line of the substrate in the image. An adhesion device as described in claim 1, wherein the determination unit determines the inclination of the substrate based on an alignment mark of the substrate photographed by the photographing unit. The bonding device as described in claim 1, wherein each time the anisotropic conductive film is bonded to one portion of the substrate, the inspection section inspects the anisotropic conductive film bonded to one portion of another substrate. The bonding device as described in claim 1, wherein each time the anisotropic conductive film is bonded to a plurality of locations on the substrate, the inspection section inspects the anisotropic conductive film bonded to a plurality of locations on another substrate. An inspection method includes: A holding process, in which a workbench holds a plurality of substrates; A first pressing process, in which a pressing unit presses an anisotropic conductive film onto the substrate; and A second pressing process, in which the pressing unit presses the anisotropic conductive film onto another substrate. During the second pressing process, the following are performed: A tilt determination process, in which a determination unit determines the tilt of the substrate in an image obtained by a photographing unit photographing the anisotropic conductive film attached to the substrate; A correction process, in which a correction unit corrects the tilt of the substrate in the image based on the tilt determined by the determination unit; and The inspection step is to inspect the adhesion state of the anisotropic conductive film based on the image after the correction of the tilt by the correction unit.

Images