TWI880496B - Vapor deposition device - Google Patents

Abstract

A vapor deposition device has a base body, a plurality of carriers, a plurality of locking elements, and a plurality of clamping modules. The carriers are detachably disposed on the base body. Each locking element is correspondingly disposed at a central location of each carrier, and the locking elements are inserted through the base body to secure the carriers. The clamping modules are disposed on the carriers. When each carrier carries a wafer and each clamping module clamps the wafer, the wafer is clamped between a portion of each carrier and the clamping modules.

Description

Evaporation equipment

The present invention relates to an evaporation device, in particular to an evaporation device in which a carrier for placing a wafer is fixed by a locking device and the carrier has a recessed space.

Evaporation process is a semiconductor process technology used to deposit thin film materials on the surface of wafers. Among them, the evaporation process mainly requires the use of evaporation equipment such as evaporation pots, whose function is to contain evaporation materials made of solid metal or other evaporation. The evaporation process is usually carried out in a vacuum environment. The evaporation pot is heated to evaporate the evaporation material inside it, and chemical vapor deposition (CVD) or physical vapor deposition (PVD) methods are used in combination. The evaporation of the evaporation material generates vapor, so that the thin film material can be deposited on the surface of the wafer or other substrate in the form of atoms or molecules to form the required thin film layer. However, as the demand for silicon wafers in many industries continues to grow, how to improve the stability of chips in the manufacturing process and the product yield has become one of the most important research topics at present.

Currently common evaporation devices usually use specific carriers and turntable bodies. There are multiple carriers on the turntable body, which are mainly used to fix and support wafers and place them in the evaporation device. However, this type of traditional evaporation device has some disadvantages that cannot be ignored. First, in the traditional evaporation process, the elastic components used in the evaporation device have a large elastic coefficient because they need to clamp the carrier and the wafer at the same time. Therefore, it is easy to generate external force on the thinned wafer, causing cracks on the wafer surface. In addition, as the coating process proceeds, the vibration of the turntable body may cause friction between the wafer and the carrier, which in turn causes scratches on the wafer surface, affecting the appearance yield loss of the component.

In view of this, the present invention proposes an evaporation device to solve the problem in the prior art that the elastic element is prone to wafer breakage due to the excessive elastic modulus.

The purpose of the present invention is to provide an evaporation device, aiming to provide an evaporation device that can reduce the degree of wafer breakage during the evaporation process and reduce the contact with the carrier. The present invention particularly uses a locking fixture to lock the carrier on which the wafer is placed on the base. Fixing the carrier with the locking fixture allows the elastic element to clamp the wafer without a too high elastic coefficient. This structure is less likely to cause the wafer to crack due to external force, especially for thinned wafers. On the other hand, there is a recessed space in the middle of the carrier, and there are multiple protrusions on the outer periphery of the carrier. The above design can greatly reduce the contact area between the wafer and the carrier, which in turn reduces the friction between the wafer and the carrier during the coating process, reduces scratches on the wafer surface, and further improves the appearance yield of the wafer.

To achieve the above-mentioned purpose, the present invention discloses an evaporation device, comprising a base, a plurality of carriers, a plurality of locking pieces and a plurality of clamping modules. The carrier is detachably arranged on the base. Each of the locking pieces is correspondingly arranged at a central position of each of the carriers, and the locking piece penetrates the base to lock the carrier. The clamping module is arranged on the carrier. When each of the carriers carries a wafer and each of the clamping modules clamps the wafer, the wafer is clamped between each of the carriers and the clamping module.

In one embodiment, each of the carriers further has a main body and a plurality of protrusions, wherein the protrusions are formed on the outer periphery of the main body for contacting the wafer.

In one embodiment, the body further includes a first surface and a second surface, the protrusion and the first surface form a first height difference, and the first surface and the second surface form a second height difference.

In one embodiment, the first surface and the second surface together define a recessed space.

In one embodiment, the clamping module is elastic and vertically arranged at a position of the main body relative to the protrusion.

In one embodiment, the clamping module has at least one first elastic member and at least one second elastic member, the first elastic member is fixed to the body, and the second elastic member is detachably disposed on the body.

In one embodiment, the number of the first elastic member and the second elastic member in each of the clamping modules is at least two.

In one embodiment, the base further includes a plurality of hollow holes and a plurality of supporting sheets, wherein the hollow holes are formed on two corresponding sides of each of the supporting sheets, and the supporting sheets are connected to the carrier via the locking member.

In one embodiment, when the wafer is clamped between the carrier and the clamping module, the wafer contacts the protrusion and the clamping module at the same time, and the wafer does not contact the first surface and the second surface.

In one embodiment, the base is rotatable.

After referring to the drawings and the implementation methods described subsequently, a person having ordinary knowledge in this technical field will understand other purposes of the present invention, as well as the technical means and implementation aspects of the present invention.

The content of the present invention will be explained below through embodiments. The embodiments of the present invention are not intended to limit the present invention to any specific environment, application or special method as described in the embodiments. Therefore, the description of the embodiments is only for the purpose of explaining the present invention, and is not intended to limit the present invention. It should be noted that in the following embodiments and drawings, components that are not directly related to the present invention have been omitted and not shown, and the size relationship between the components in the drawings is only for easy understanding and is not intended to limit the actual proportion.

Please refer to Figures 1 to 3. Figures 1 and 2 are schematic diagrams of the front and back of each carrier 2 of the evaporation device 1000 provided by the present invention. Figure 3 is a partial cross-sectional view of the evaporation device 1000 of the present invention. The evaporation device 1000 can be used to clamp a plurality of wafers 2000 so that the wafers 2000 undergo a subsequent evaporation process. As shown in Figure 6, in one embodiment of the present invention, the evaporation device 1000 includes a base 1, a plurality of carriers 2, a plurality of locking components 3, and a plurality of clamping modules 4. The carrier 2 is detachably disposed on the base 1, and the carrier 2 is used to place the wafer 2000. The locking member 3 and the clamping module 4 are disposed on each carrier 2 correspondingly.

For further explanation of the base 1, please refer to FIG. 4 and FIG. 5. FIG. 4 is a front view of an evaporation device 1000 according to an embodiment of the present invention, and FIG. 5 is a back view of an evaporation device 1000 according to an embodiment of the present invention. The base 1 includes a plurality of hollow holes 11 and a plurality of support sheets 12. The hollow holes 11 are formed on the corresponding sides of each support sheet 12. Each support sheet 12 has a locking hole for each locking member 3 to lock each carrier 2 to each support sheet 12. In this embodiment, when the wafer 2000 is placed on the carrier 2, the user can place the clamping module 4 on the carrier 2 through the space of the hollow hole 11, so that the wafer 2000 can be clamped and fixed on the carrier 2. Conversely, the user can also loosen part of the clamping module 4 from the hollow hole 11, and then remove the wafer 2000 placed on the carrier 2. It should be noted that the base 1 of the evaporation device 1000 of the present invention is rotatable, so that the user can easily install and remove the wafer 2000.

Please refer to FIG. 1 and FIG. 2 again. The carrier 2 includes a body 21 and four protrusions 22. The protrusions 22 are formed on the outer periphery of the body 21 and can be used to contact the wafer 2000. In detail, the body 21 further includes a first surface 211 and a second surface 212. As shown in FIG. 3, the protrusions 22 are disposed on the first surface 211 and form a first height difference H1 with the first surface 211. On the other hand, the first surface 211 and the second surface 212 form a second height difference H2. In addition, the first surface 211 and the second surface 212 jointly define a recessed space S. It should be noted that when each of the carriers 2 carries the wafer 2000 and each of the clamping modules 4 clamps the wafer 2000, the wafer 2000 is sandwiched between each of the carriers 2 and the clamping modules 4, as shown in FIG3. Then, by forming the convex portion 22 and the recessed space S, the wafer 2000 is sandwiched between the convex portion 22 and the clamping module 4. In other words, the wafer 2000 only contacts the convex portion 22 and the clamping module 4 at the same time, and the wafer 2000 does not contact the first surface 211 and the second surface 212. Different from the structure of the conventional evaporation device, this design allows the wafer 2000 to reduce the area in contact with the surface of the carrier 2, further avoiding possible scratches during the evaporation process. It should be noted that FIG. 4 and FIG. 5 show an evaporation device 1000 of one embodiment of the present invention, and FIG. 6 and FIG. 7 show an evaporation device 1000 of another embodiment of the present invention. The difference between the two is only the number of the carriers 2 disposed on the base 1. The position and number of the carriers 2 can be adjusted according to the size of the wafer to be clamped, and are not limited here.

Next, the locking pieces 3 and the clamping module 4 are described in detail. As shown in FIG3 and FIG6 , each of the locking pieces 3 is correspondingly disposed at a central position of each of the carriers 2, and the locking pieces 3 penetrate the base 1 and lock the carrier 2. In this embodiment, the locking pieces 3 are exemplified by a combination of a screw and a nut, and the user can adjust and replace it with other types of locking methods according to actual needs, and there is no limitation here. It should be noted that the carrier 2 is fixedly disposed on the base 1 by the locking pieces 3, and this fixing method can reduce the elastic coefficient of the clamping module 4 used to clamp the wafer 2000, so that the thinned wafer 2000 can be clamped with less cracks.

As mentioned above, the clamping module 4 is elastic and is vertically arranged at a position of the main body 21 relative to the protrusion 22. In detail, the clamping module 4 has at least one first elastic member 41 and at least one second elastic member 42, the first elastic member 41 is fixed to the main body 21, and the second elastic member 42 is detachably arranged on the main body 21. In this embodiment, the number of the first elastic member 41 and the second elastic member 42 in each of the clamping modules 4 is at least two. Preferably, the first elastic member 41 and the second elastic member 42 are two, respectively, so that the wafer 2000 can be fixed on the protrusion 22 of the carrier 2 in a four-corner positioning manner. Specifically, in this embodiment, the first elastic member 41 and the second elastic member 42 can be the same spring element, and the first elastic member 41 is fixedly disposed at a position of the carrier 2 relative to the outer peripheral area of the base 1, and the second elastic member 42 is detachably disposed at a position of the carrier 2 relative to the inner peripheral area of the base 1, as shown in FIG6. In addition, the step of clamping the wafer 2000 by the clamping module 4 includes firstly fixing the first elastic member 41, then clamping one side of the wafer 2000 between the first elastic member 41 and a part of the protrusion 22, and finally using the detachable second elastic member 42 to clamp the wafer 2000 and the remaining protrusion 22 of the carrier 2. On the contrary, when the wafer 2000 is to be disassembled, the second elastic member 42 may be removed first, and then the wafer 2000 may be taken out.

In summary, the evaporation device of the present invention includes a combination of a base, a carrier, a locking piece and a clamping module. The difference from the conventional evaporation device is that each carrier is fixed to the base with a corresponding locking piece, and there is no need to use an elastic element with a large elastic coefficient to clamp the carrier and the wafer. In addition, the carrier has a recessed space and only the convex portion provided on the carrier is required to contact and support the wafer, which can greatly reduce the contact area between the wafer and the carrier. In this way, the scratches and breakages of the wafer during the evaporation process can be reduced, and the appearance yield of the wafer can be improved.

The above embodiments are only used to illustrate the implementation of the present invention and to explain the technical features of the present invention, and are not used to limit the scope of protection of the present invention. Any changes or equivalent arrangements that can be easily completed by those familiar with this technology are within the scope of the present invention, and the scope of protection of the present invention shall be based on the scope of the patent application.

1000       Evaporation device 2000       Wafer 1            Base 11          Hollow hole 12          Support sheet 2            Carrier 21          Body 211         First surface 212         Second surface 22          Protrusion 3            Locking fixture 4            Clamping module 41          First elastic member 42          Second elastic member H1          First height difference H2          Second height difference S            Recessed space

Figure 1 is a schematic diagram of the front side of the carrier of the evaporation device of the present invention; Figure 2 is a schematic diagram of the back side of the carrier of the evaporation device of the present invention; Figure 3 is a partial cross-sectional view of the evaporation device of the present invention; Figure 4 is a schematic diagram of the front side of the evaporation device of one embodiment of the present invention; Figure 5 is a schematic diagram of the back side of the evaporation device of one embodiment of the present invention; Figure 6 is a schematic diagram of the front side of the evaporation device of another embodiment of the present invention; and Figure 7 is a schematic diagram of the back side of the evaporation device of another embodiment of the present invention.

1000: Evaporation device

2000: Wafer

1: Seat

11: Hollow holes

2: Carrier

21: Body

211: First surface

212: Second surface

22: convex part

3: Lock the firmware

4: Clamping module

41: First elastic member

42: Second elastic member

H1: The first high-low difference

H2: The second high-low difference

S: sunken space

Claims (10)

A vapor deposition device comprises: a base; a plurality of carriers detachably disposed on the base; a plurality of locking pieces, each of which is correspondingly disposed at a central position of each of the carriers, and the locking pieces penetrate the base to lock the carriers; and a plurality of clamping modules disposed on the carriers; wherein, when each of the carriers carries a wafer and each of the clamping modules clamps the wafer, the wafer is clamped between each of the carriers and the clamping modules. The evaporation device as described in claim 1, wherein each of the carriers further has a main body and a plurality of protrusions, wherein the protrusions are formed on the outer periphery of the main body for contacting the wafer. The evaporation device as described in claim 2, wherein the main body further includes a first surface and a second surface, the protrusion forms a first height difference with the first surface, and the first surface forms a second height difference with the second surface. The evaporation device as described in claim 3, wherein the first surface and the second surface jointly define a recessed space. The evaporation device as described in claim 2, wherein the clamping module is elastic and is vertically arranged at a position of the main body relative to the protrusion. The evaporation device as described in claim 2, wherein the clamping module has at least one first elastic member and at least one second elastic member, the first elastic member is fixed to the main body, and the second elastic member is detachably arranged on the main body. The evaporation device as described in claim 6, wherein the number of the first elastic member and the second elastic member in each of the clamping modules is at least two respectively. The evaporation device as described in claim 1, wherein the base further includes a plurality of hollow holes and a plurality of support plates, the hollow holes are formed on the corresponding sides of each of the support plates, and the support plates are connected to the carrier via the locking members. The evaporation device as described in claim 3, wherein when the wafer is clamped between each of the carriers and the clamping module, the wafer is in contact with the protrusion and the clamping module at the same time, and the wafer is not in contact with the first surface and the second surface. A evaporation device as described in claim 1, wherein the base is rotatable.

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