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TWI880111B - A method and a device for copper recycling via precipitation and regenerating via electrolysis from acidic cupric chloride etchant waste - Google Patents

A method and a device for copper recycling via precipitation and regenerating via electrolysis from acidic cupric chloride etchant waste Download PDF

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TWI880111B
TWI880111B TW111131153A TW111131153A TWI880111B TW I880111 B TWI880111 B TW I880111B TW 111131153 A TW111131153 A TW 111131153A TW 111131153 A TW111131153 A TW 111131153A TW I880111 B TWI880111 B TW I880111B
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TW202308947A (en
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葉濤
葉旖婷
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葉旖婷
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00Obtaining copper
    • C22B15/0063Hydrometallurgy
    • C22B15/0084Treating solutions
    • C22B15/0089Treating solutions by chemical methods
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/006Wet processes
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00Electrolytic production of inorganic compounds or non-metals
    • C25B1/01Products
    • C25B1/02Hydrogen or oxygen
    • C25B1/04Hydrogen or oxygen by electrolysis of water
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00Electrolytic production of inorganic compounds or non-metals
    • C25B1/01Products
    • C25B1/24Halogens or compounds thereof
    • C25B1/26Chlorine; Compounds thereof
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/12Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
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  • Mechanical Engineering (AREA)
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  • General Life Sciences & Earth Sciences (AREA)
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  • Electrolytic Production Of Metals (AREA)

Abstract

The invention provides a method and a device for copper recycling via precipitation and regenerating via electrolysis from acidic cupric chloride etchant waste. The method includes the following steps. Step 1: oxidizing working etchant by an electrolytic cell during an etching process, and the electrolytic cell is divided into cathode area and anode area. Step 2: at least one of the following or at least one mixed solution of the following is reacted with the copper extractant to generate copper salt precipitate, the electrolysed anolyte, the electrolysed catholyte, the oxidized catholyte, and the cupric chloride etchant waste; step 3: the mixture is solid-liquid separated to obtain solid copper salt precipitate and acidic filtrate, and the obtained acidic filtrate is directly used as a regenerated etchant or made up into a regenerated etchant which is applied on an etching production line, and the solid copper salt obtained is seen as the copper recovery product. The invention effectively solves the problem of the increasing etchant waste amount during the existing production process of acidic cupric chloride etching.

Description

酸性氯化銅蝕刻廢液沉澱取銅電解再生方法及其裝置Acidic copper chloride etching waste liquid precipitation copper electrolytic regeneration method and device

本發明屬於線路板生產蝕刻領域,具體涉及一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法及其裝置。The invention belongs to the field of etching for circuit board production, and specifically relates to a method and device for electrolytically regenerating copper by precipitation of waste liquid from acidic copper chloride etching.

酸性氯化銅蝕刻製程是線路板圖形製造工序中最常用的酸性蝕刻製程之一,其以氯化銅作為蝕銅劑,對覆銅板上未被油墨或菲林抗蝕層覆蓋保護的裸露金屬銅進行蝕刻溶解,從而形成線路。蝕刻化學反應方程式:Cu+CuCl 2→2CuCl。 The acid copper chloride etching process is one of the most commonly used acid etching processes in the circuit board pattern manufacturing process. It uses copper chloride as an etchant to etch and dissolve the exposed metal copper on the copper-clad board that is not covered and protected by ink or film anti-etching layer, thereby forming a circuit. Etching chemical reaction equation: Cu+CuCl 2 →2CuCl.

酸性氯化銅蝕刻液的主要成分為鹽酸、氯化銅、以及可選的氯鹽和添加劑,常見的所述氯鹽有氯化銨、氯化鈉和氯化鐵,常見的添加劑為有機酸。由於蝕刻液中的蝕銅劑氯化銅與被蝕刻的金屬銅反應後形成不具備蝕刻能力的氯化亞銅,為了保持蝕刻液的蝕刻能力穩定性,通常在蝕刻過程中不斷向蝕刻工作液補充鹽酸和蝕刻氧化劑以將氯化亞銅氧化成為氯化銅再次參與蝕刻。當氯化銅蝕刻液中含有氯鹽和/或添加劑時,蝕刻過程中除了需要添加鹽酸和蝕刻氧化劑以外也需要根據製程對氯鹽和添加劑進行補充,因此業界常見將鹽酸與氯鹽和/或添加劑混合後一起進行添加,所述的混合液被稱為蝕刻子液。蝕刻作業需在50℃左右進行,蝕刻液的鹽酸越低酸霧揮發越少。但因氯化亞銅氧化成為氯化銅的反應需要氯離子的參與,所以現有酸度較低的蝕刻液以氯化鐵成分來確保蝕刻液中有足夠的氯離子來維持蝕刻反應。The main components of acidic copper chloride etching solution are hydrochloric acid, copper chloride, and optional chloride salts and additives. Common chloride salts are ammonium chloride, sodium chloride and ferric chloride, and common additives are organic acids. Since the copper chloride in the etching solution reacts with the metal copper to be etched to form cuprous chloride that has no etching ability, in order to maintain the etching ability stability of the etching solution, hydrochloric acid and etching oxidant are usually continuously added to the etching working solution during the etching process to oxidize cuprous chloride into cupric chloride to participate in etching again. When the copper chloride etching solution contains chloride salt and/or additives, in addition to adding hydrochloric acid and etching oxidant, the chloride salt and additives need to be supplemented according to the process. Therefore, it is common in the industry to mix hydrochloric acid with chloride salt and/or additives and add them together. The mixed solution is called etching liquid. The etching operation needs to be carried out at about 50°C. The lower the hydrochloric acid in the etching solution, the less acid mist will evaporate. However, because the reaction of cuprous chloride oxidizing to cupric chloride requires the participation of chloride ions, the existing etching solution with lower acidity uses ferric chloride as a component to ensure that there are enough chloride ions in the etching solution to maintain the etching reaction.

目前,行業採用雙氧水或者氯酸鈉溶液作為酸性氯化銅蝕刻的蝕刻氧化劑,其中也常見將氯鹽與作為蝕刻氧化劑的氯酸鈉混合一起加投。隨著蝕刻氧化劑和鹽酸和/或蝕刻子液的補充加入,蝕刻工作液其體積增加的部分從蝕刻生產線裡溢出,行業上將因蝕刻工作液體積增加而溢出的溶液稱為蝕刻廢液。一直以來,線路板生產廠都將這些蝕刻廢液低價出售給具備資質的環保公司進行處理。近幾年來,為響應減排的環保號召和提高線路板廠的生產經濟效益,有部分線路板生產廠開始在其廠內對蝕刻廢液進行銅回收處理。現有的酸性氯化銅蝕刻廢液線上回收技術中一般採用以下兩種方法:(1)通過向酸性氯化銅蝕刻廢液加入氫氧化鈉和/或碳酸鈉進行酸鹼中和反應,過濾後取得氫氧化銅或碳酸銅濾渣和氯鹽濾液。將濾渣作為銅產品回收,濾液外排處理。(2)對酸性氯化銅蝕刻廢液進行線上電解回收銅處理,使廢液中的銅離子在電解陰極上電析金屬銅來進行回收。對於不含鐵的酸性氯化銅蝕刻廢液,電解過程中電解陽極上使氯離子發生電化學氧化反應而析出的氯氣,氯氣的一部分回用於蝕刻線中,其餘被採用氫氧化鈉溶液或者氯化亞鐵溶液進行吸收處理。上述的方法(1)以及對不含鐵的酸性氯化銅蝕刻廢液採用方法(2)均無法將蝕刻廢液中的氯離子全部返回到原蝕刻液系統中被循環利用,並且上述兩種方法在生產過程中仍需要加投外來的蝕刻氧化劑,使廢液量不斷增大。因此現有的回收技術僅能對銅作回收利用,不能很好地回用原蝕刻系統中的氯鹽,難以實現環保減排循環再用的製程要求。而對含鐵的酸性氯化銅蝕刻廢液,雖然電解過程中電解陽極上析出的氯氣能被廢液有效地吸收,但電解陰極上電析銅時亦需將廢液中的三價鐵離子全部還原為二價鐵離子後才能實現銅的電化學還原反應,耗電量大。At present, the industry uses hydrogen peroxide or sodium chlorate solution as the etching oxidant for acidic copper chloride etching. It is also common to mix chlorine salt with sodium chlorate as the etching oxidant. With the addition of etching oxidant and hydrochloric acid and/or etching liquid, the increased volume of the etching working liquid overflows from the etching production line. The industry calls the solution overflowed due to the increase in the volume of the etching working liquid as etching waste liquid. Circuit board manufacturers have always sold these etching waste liquids at low prices to qualified environmental protection companies for treatment. In recent years, in response to the environmental call for emission reduction and to improve the production economic benefits of circuit board factories, some circuit board manufacturers have begun to recover copper from etching waste liquid in their factories. The existing online recovery technology of acid copper chloride etching waste liquid generally adopts the following two methods: (1) by adding sodium hydroxide and/or sodium carbonate to the acid copper chloride etching waste liquid for acid-base neutralization reaction, after filtering, copper hydroxide or copper carbonate filter residue and chloride salt filter liquid are obtained. The filter residue is recovered as a copper product, and the filter liquid is discharged for external treatment. (2) The waste liquid from acid copper chloride etching is treated by online electrolysis to recover copper, so that the copper ions in the waste liquid are electrolyzed on the electrolytic cathode to recover metallic copper. For the acid copper chloride etching waste liquid that does not contain iron, during the electrolysis process, the chlorine ions undergo an electrochemical oxidation reaction on the electrolytic anode to precipitate chlorine gas. Part of the chlorine gas is recycled in the etching line, and the rest is absorbed by sodium hydroxide solution or ferrous chloride solution. The above method (1) and the method (2) for the iron-free acidic copper chloride etching waste liquid cannot return all the chlorine ions in the etching waste liquid to the original etching liquid system for recycling. In addition, the above two methods still need to add external etching oxidants during the production process, which increases the amount of waste liquid. Therefore, the existing recycling technology can only recycle copper and cannot well reuse the chlorine salt in the original etching system, making it difficult to achieve the process requirements of environmental protection, emission reduction and recycling. As for the iron-containing acidic copper chloride etching waste liquid, although the chlorine gas released on the electrolytic anode during the electrolysis process can be effectively absorbed by the waste liquid, when electrolyzing copper on the electrolytic cathode, the trivalent iron ions in the waste liquid must be completely reduced to divalent iron ions before the electrochemical reduction reaction of copper can be realized, which consumes a lot of electricity.

此外,使用酸性氯化銅蝕刻液的蝕刻生產過程中,由於蝕刻溫度通常為50℃,在蝕刻溫度和蝕刻液噴淋壓力的雙重作用下,常有作為抗蝕層的油墨或菲林溶下成為油狀物存於蝕刻液中,累積到一定程度時會影響蝕刻品質和效率。而現有的酸性氯化銅蝕刻廢液回收製程中,對其廢液中所含有的油墨、菲林有機雜質的處理效果不明顯,回用會令其不斷累積,影響到蝕刻生產品質和效率。In addition, in the etching production process using acid copper chloride etching solution, since the etching temperature is usually 50°C, under the dual effects of etching temperature and etching solution spraying pressure, the ink or film used as the anti-corrosion layer often dissolves into oily substances in the etching solution. When accumulated to a certain extent, it will affect the etching quality and efficiency. In the existing acid copper chloride etching waste liquid recycling process, the treatment effect of the organic impurities in the ink and film contained in the waste liquid is not obvious. Reuse will cause them to accumulate continuously, affecting the quality and efficiency of etching production.

綜上所述,有必要對現有酸性氯化銅蝕刻廢液回收製程作出優化改良。In summary, it is necessary to optimize and improve the existing acid copper chloride etching waste liquid recovery process.

本發明的第一個目的在於提供一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法,其能有效解決現有酸性氯化銅蝕刻液在生產過程中加投蝕刻氧化劑使蝕刻廢液存有增量的缺點;本發明還提供一種通過化學反應獲得銅鹽的回收銅產品方式,或者提供一種通過電解提銅再生蝕刻液和化學反應獲得銅鹽兩種方法同時結合使用的方式來對廢液中銅離子作回收和對蝕刻廢液作氧化再生反應。過程中得到的濾液可直接或經調配後循環用於蝕刻工序中。本製程既能在蝕刻生產過程中即時地對酸性氯化銅蝕刻工作液進行電解氧化再生作節省蝕刻氧化劑或不需使用外加蝕刻氧化劑,又可根據具體用電情況對採用電解氧化再生提銅方法和化學反應沉澱取銅方法的兩種製程結合的方案中作取銅量的調節分配,使得酸性氯化銅蝕刻液中的氯離子能循環利用從而節省鹽酸和/或氯鹽添加劑生產原料,比起現有電解回收銅的技術和化學中和反應技術,本發明的製程更加節能環保和高效高質,實現進一步減少三廢甚至無三廢的回收循環再用製程。The first purpose of the present invention is to provide a method for electrolytic regeneration of copper from acidic copper chloride etching waste liquid, which can effectively solve the defect that the existing acidic copper chloride etching solution has an incremental amount of etching waste liquid due to the addition of etching oxidant in the production process; the present invention also provides a method for recovering copper products by obtaining copper salts through chemical reactions, or provides a method for recovering copper ions in waste liquid and performing oxidation regeneration reaction on etching waste liquid by combining the two methods of electrolytic copper extraction and regeneration of etching solution and chemical reaction to obtain copper salts. The filtered liquid obtained in the process can be directly or circulated in the etching process after being prepared. The process can not only electrolytically oxidize and regenerate the acidic copper chloride etching working solution in real time during the etching production process to save etching oxidants or eliminate the need for using external etching oxidants, but also adjust and allocate the amount of copper to be extracted in a scheme combining the two processes of electrolytic oxidation regeneration copper extraction method and chemical reaction precipitation copper extraction method according to the specific electricity consumption situation, so that the chlorine ions in the acidic copper chloride etching solution can be recycled to save hydrochloric acid and/or chlorine salt additive production raw materials. Compared with the existing electrolytic copper recovery technology and chemical neutralization reaction technology, the process of the present invention is more energy-saving, environmentally friendly, efficient and high-quality, and realizes a recycling and reuse process that further reduces the three wastes or even eliminates the three wastes.

本發明的第二個目的在於提供一種所述酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置。The second object of the present invention is to provide a device used in the method of electrolytic regeneration of copper by precipitation of waste solution from acidic copper chloride etching.

為了實現上述第一個目的,本發明採用的技術方案是:In order to achieve the above first purpose, the technical solution adopted by the present invention is:

一種酸性氯化銅蝕刻廢液沉澱取銅電解再生回用方法,包括以下步驟。A method for electrolyzing and regenerating copper from waste acid copper chloride etching solution by precipitation includes the following steps.

步驟一:使用電解反應槽在蝕刻過程中即時對蝕刻工作液進行氧化,所述電解反應槽中設置有電解槽分隔物使電解槽分成為電解槽陽極區和電解槽陰極區;所述電解槽陽極區盛放有陽極和陽極電解液,所述電解槽陰極區盛放有陰極和陰極電解液,所述陽極電解液為來自酸性氯化銅蝕刻生產線的蝕刻工作液和/或蝕刻廢液;將經過電解處理的陽極電解液作為再生蝕刻工作液返回到酸性氯化銅蝕刻生產線上使用,電解過程中陽極所產生的氯氣用於氧化陰極電解液、再生蝕刻子液、蝕刻工作液、蝕刻廢液、步驟三中所得的酸性濾液中的至少一種或一種以上的混合液,所述的陰極電解液為電解質溶液。Step 1: using an electrolytic reaction tank to oxidize the etching working solution in real time during the etching process, wherein the electrolytic reaction tank is provided with an electrolytic tank separator to divide the electrolytic tank into an electrolytic tank anode area and an electrolytic tank cathode area; the electrolytic tank anode area contains an anode and an anode electrolyte, and the electrolytic tank cathode area contains a cathode and a cathode electrolyte, wherein the anode electrolyte is an etching working solution from an acidic copper chloride etching production line. The anodic electrolyte treated by electrolysis is returned to the acid copper chloride etching production line as a regeneration etching working solution, and the chlorine gas generated by the anode during the electrolysis process is used to oxidize at least one of the cathode electrolyte, the regeneration etching sub-liquid, the etching working solution, the etching waste solution, and the acidic filter solution obtained in step three, or a mixture of more than one of them, wherein the cathode electrolyte is an electrolyte solution.

步驟二:將經過電解處理的陽極電解液、經過電解處理的陰極電解液、經過氧化處理的陰極電解液、氯化銅蝕刻廢液中的至少一種或一種以上的混合液與銅提取劑混合,使來自於氯化銅蝕刻廢液和/或氯化銅蝕刻工作液的銅離子在反應混合液中反應生成銅鹽沉澱物。Step 2: mixing at least one of the electrolytically treated anodic electrolyte, the electrolytically treated cathodic electrolyte, the oxidized cathodic electrolyte, and the copper chloride etching waste solution, or a mixture of more than one of the above, with a copper extractant, so that copper ions from the copper chloride etching waste solution and/or the copper chloride etching working solution react in the reaction mixture to generate copper salt precipitates.

步驟三:將步驟二中反應所得的固液混合物經固液分離後獲得固體銅鹽沉澱物和酸性濾液,將所得的酸性濾液直接作為再生蝕刻子液回用於蝕刻工序中或者調配後成為再生蝕刻子液回用於蝕刻工序中,所得的固體銅鹽作為銅的回收產品。Step 3: The solid-liquid mixture obtained by the reaction in step 2 is subjected to solid-liquid separation to obtain a solid copper salt precipitate and an acidic filter solution, the obtained acidic filter solution is directly used as a regenerated etching sub-liquid for recycling in the etching process or is prepared as a regenerated etching sub-liquid for recycling in the etching process, and the obtained solid copper salt is used as a copper recovery product.

本發明所述的酸性氯化銅蝕刻廢液的主要成分是鹽酸、氯化銅,並可以含有氯化鐵、氯化銨、氯化鈉、添加劑,步驟三中所得的酸性濾液其主要成分為鹽酸溶液或者為鹽酸和氯鹽的混合液。The main components of the acid copper chloride etching waste liquid of the present invention are hydrochloric acid and copper chloride, and may contain ferric chloride, ammonium chloride, sodium chloride and additives. The main component of the acidic filter liquid obtained in step three is hydrochloric acid solution or a mixture of hydrochloric acid and chloride salt.

步驟一中所述電解槽中的電解槽分隔物為能有效減少甚至阻止陽極電解液中的陽離子在電場力作用下從陽極區遷移至陰極區的材料,具體為陰離子交換膜、雙極膜、反滲透膜中的至少一種。優選地,步驟一中所述電解槽中的電解槽分隔物為陰離子交換膜,從而允許陰極電解液中的氯離子通過所述的電解槽分隔物進入電解槽陽極區,令陽極電解液得以補充氯離子更有效地進行氧化。所述陰極電解液是電解質的水溶液,優選為鹽酸溶液或者氯鹽的酸性溶液。所述的氯鹽的酸性溶液為鹽酸與至少一種氯鹽的混合溶液,優選為是鹽酸與氯化鐵和/或氯化銨和/或氯化鈉和/或氯化銅的混合液。酸性氯化銅蝕刻廢液、酸性氯化銅蝕刻工作液、經電解的陽極電解液、經氧化的陰極電解液、步驟三中所得的酸性濾液、再生蝕刻子液也屬於上述鹽酸溶液或者氯鹽的酸性溶液範疇。The electrolytic cell separator in the electrolytic cell described in step 1 is a material that can effectively reduce or even prevent the cations in the anodic electrolyte from migrating from the anodic region to the cathodic region under the action of the electric field force, and is specifically at least one of an anion exchange membrane, a bipolar membrane, and a reverse osmosis membrane. Preferably, the electrolytic cell separator in the electrolytic cell described in step 1 is an anion exchange membrane, thereby allowing the chlorine ions in the cathodic electrolyte to enter the anodic region of the electrolytic cell through the electrolytic cell separator, so that the anodic electrolyte can be supplemented with chlorine ions for more effective oxidation. The cathodic electrolyte is an aqueous solution of an electrolyte, preferably a hydrochloric acid solution or an acidic solution of a chlorine salt. The acidic solution of chlorine salt is a mixed solution of hydrochloric acid and at least one chlorine salt, preferably a mixed solution of hydrochloric acid and ferric chloride and/or ammonium chloride and/or sodium chloride and/or cupric chloride. Acidic copper chloride etching waste liquid, acidic copper chloride etching working liquid, electrolyzed anode electrolyte, oxidized cathode electrolyte, acidic filter liquid obtained in step 3, and regenerated etching sub-liquid also belong to the above-mentioned hydrochloric acid solution or acidic solution of chlorine salt.

步驟一的主要功能作用是在電解槽陽極區中電解氧化再生蝕刻工作液,使蝕刻時少添加甚至不添加外來蝕刻氧化劑,避免蝕刻生產中需要外投蝕刻氧化劑而導致蝕刻廢液體積數量過度增大膨脹,以令後續化學反應提銅中所產生的濾液能作為再生蝕刻子液被回用消耗。作為本製程實施方案,所述電解槽陽極區用於對蝕刻工作液進行線上即時的電化學氧化反應。The main function of step 1 is to electrolytically oxidize and regenerate the etching working solution in the anode area of the electrolytic cell, so that less or even no external etching oxidant is added during etching, avoiding the need to add external etching oxidant during etching production, which causes excessive expansion of the volume of the etching waste liquid, so that the filter liquid produced in the subsequent chemical reaction copper extraction can be recycled and consumed as the regenerated etching sub-liquid. As an implementation scheme of this process, the anode area of the electrolytic cell is used to perform an online and instant electrochemical oxidation reaction on the etching working solution.

電解過程中,本發明所用電解槽陽極區上發生氯離子被氧化為氯氣的電化學反應。當氯化銅蝕刻廢液中含有一價銅離子或二價鐵離子時,會發生其被氯氣氧化轉化為二價銅離子或三價鐵離子的化學反應,由此使陽極電解液的氧化還原電位得到提升。而電解槽陰極區,當陰極電解液含有銅離子時則會發生二價銅離子被還原為一價銅離子甚至析出金屬銅的電化學反應,當陰極電解液中含有三價鐵離子時還會發生三價鐵離子被還原為二價鐵離子的電化學反應。當陰極電解液中既不含有二價銅離子也不含有三價鐵離子的酸性溶液時(例如鹽酸)或者酸性溶液中可變價態金屬離子的含量濃度較低時(例如鹽酸中僅含微量氯化銅和/或氯化鐵),則會發生水的電解反應而產出氫氣。上述電化學反應的反應方程式具體如下: (1)    電解陽極上發生的電化學反應 Cu +-e -→Cu 2+; 2Cl --2e -→Cl 2↑; Fe 2+-e -→Fe 3+(當氯化銅蝕刻工作液中含有Fe 2+時); (2)    電解陰極上發生的電化學反應 Cu 2++e -→Cu +; Cu ++e -→Cu; Fe 3++e -→Fe 2+(當陰極電解液中含有Fe 3+時); 2H 2O+2e -→2OH -+H 2↑(當陰極電解液中不含可變價金屬離子或者可變價金屬離子濃度較低時)。 During the electrolysis process, an electrochemical reaction occurs in the anode region of the electrolytic cell used in the present invention, in which chlorine ions are oxidized to chlorine gas. When the copper chloride etching waste liquid contains monovalent copper ions or divalent iron ions, a chemical reaction occurs in which they are oxidized by chlorine gas and converted into divalent copper ions or trivalent iron ions, thereby increasing the redox potential of the anode electrolyte. In the cathode area of the electrolytic cell, when the cathode electrolyte contains copper ions, an electrochemical reaction occurs in which the divalent copper ions are reduced to monovalent copper ions and even metallic copper is precipitated. When the cathode electrolyte contains trivalent iron ions, an electrochemical reaction occurs in which the trivalent iron ions are reduced to divalent iron ions. When the cathode electrolyte contains neither divalent copper ions nor trivalent iron ions in an acidic solution (such as hydrochloric acid) or when the concentration of variable valence metal ions in the acidic solution is low (for example, hydrochloric acid contains only trace amounts of cupric chloride and/or ferric chloride), an electrolysis reaction of water occurs to produce hydrogen. The reaction equations of the above electrochemical reactions are as follows: (1) The electrochemical reactions occurring at the electrolytic anode are Cu + -e - →Cu 2+ ; 2Cl - -2e - →Cl 2 ↑; Fe 2+ -e - →Fe 3+ (when the copper chloride etching working solution contains Fe 2+ ); (2) The electrochemical reactions occurring at the electrolytic cathode are Cu 2+ +e - →Cu + ; Cu + +e - →Cu; Fe 3+ +e - →Fe 2+ (when the cathode electrolyte contains Fe 3+ ); 2H 2 O+2e - →2OH - +H 2 ↑ (when the cathode electrolyte does not contain variable-valence metal ions or the concentration of variable-valence metal ions is low).

發明人經過多次實驗還發現,採用電解槽陽極槽區來電解氧化再生蝕刻工作液,能夠有效氧化降解以油狀存於蝕刻液中的油墨和菲林有機雜質,解決回用而帶來的油墨和菲林有機雜質累積問題,保障蝕刻品質和效率的穩定。這可能是因為,採用電解槽陽極槽區來電解氧化再生蝕刻工作液,電解陽極上產生的強氧化性以及生成的氯氣等氧化劑對溶液中的油狀有機雜質有較好的降解作用。The inventors have also found through many experiments that the use of the anode tank area of the electrolytic cell to electrolytically oxidize and regenerate the etching working solution can effectively oxidize and degrade the oily organic impurities in the ink and film in the etching solution, solve the problem of ink and film organic impurity accumulation caused by recycling, and ensure the stability of etching quality and efficiency. This may be because the strong oxidizing property generated on the electrolytic anode and the generated chlorine and other oxidants have a better degradation effect on the oily organic impurities in the solution when the anode tank area of the electrolytic cell is used to electrolytically oxidize and regenerate the etching working solution.

作為本發明優選的實施方案,本發明的製程的作用物件為含有鐵離子的酸性氯化銅蝕刻液,所述的蝕刻工作液和蝕刻廢液中均含有鐵離子。含鐵的酸性氯化銅蝕刻液參與蝕刻時發生三價鐵離子還原為二價鐵離子的化學反應,故其蝕刻工作液和蝕刻廢液中均含有二價鐵離子。發明人通過實驗結果發現,當本發明的製程的作用物件為含有鐵離子的酸性氯化銅蝕刻液時,其對存於蝕刻液中的油墨和菲林油狀有機雜質的處理情況更為顯著。這可能是因為,電解過程中電解槽陽極上析出的氯氣溶於陽極電解液中生成次氯酸,其能與二價鐵離子反應生成具有強氧化性的羥基自由基•OH,將有機雜質氧化去除: HClO+Fe 2+→Fe 3++Cl -+•OH。 As a preferred embodiment of the present invention, the process of the present invention is carried out on an acidic copper chloride etching solution containing iron ions, and both the etching working solution and the etching waste solution contain iron ions. When the iron-containing acidic copper chloride etching solution is involved in etching, a chemical reaction occurs in which trivalent iron ions are reduced to divalent iron ions, so both the etching working solution and the etching waste solution contain divalent iron ions. The inventors have found through experimental results that when the process of the present invention is carried out on an acidic copper chloride etching solution containing iron ions, the treatment of oily organic impurities in ink and film in the etching solution is more significant. This may be because the chlorine gas released from the anode of the electrolytic cell during the electrolysis process dissolves in the anode electrolyte to generate hypochlorous acid, which can react with divalent iron ions to generate highly oxidizing hydroxyl free radicals •OH, which oxidize and remove organic impurities: HClO+Fe 2+ →Fe 3+ +Cl - +•OH.

再者,當蝕刻工作液和蝕刻廢液中含有氯化銨成分時,採用電解槽陽極槽區進行電解氧化再生的過程中,陽極上析出的氯氣在酸性條件下能與氯化銨發生化學反應生成易爆的三氯化氮。由於二價鐵離子能將三氯化氮還原為氯化銨,將本發明的製程作用於含鐵的酸性氯化銅蝕刻液時能有效避免三氯化氮危險源的產生,提升製程的安全性。Furthermore, when the etching working solution and the etching waste solution contain ammonium chloride, during the electrolytic oxidation regeneration process using the anode tank area of the electrolytic cell, the chlorine gas precipitated on the anode can react with the ammonium chloride under acidic conditions to generate explosive nitrogen trichloride. Since divalent iron ions can reduce nitrogen trichloride to ammonium chloride, the process of the present invention can effectively avoid the generation of nitrogen trichloride hazards when applied to iron-containing acidic copper chloride etching solutions, thereby improving the safety of the process.

此外,將本發明的製程用於含鐵的酸性氯化銅蝕刻製程,避免了採用現有電解回收製程時的耗電缺點,無需通過電解廢液中的三價鐵離子全部還原為二價鐵離子後才能便能取銅。在能耗、設備投資、環保三方面都有明顯的優勢。In addition, the process of the present invention is used in the iron-containing acidic copper chloride etching process, which avoids the power consumption disadvantage of the existing electrolytic recovery process, and it is not necessary to reduce all the trivalent iron ions in the electrolytic waste liquid to divalent iron ions before copper can be extracted. It has obvious advantages in terms of energy consumption, equipment investment, and environmental protection.

本發明應用電解槽對蝕刻工作液進行線上即時地氧化再生處理,在正常電解氧化的工作狀態下其電解槽的電解槽陰極區會出現如下三種不同的工作狀況方式:The present invention uses an electrolytic cell to perform online real-time oxidation and regeneration treatment on the etching working solution. Under normal electrolytic oxidation working conditions, the cathode area of the electrolytic cell will exhibit the following three different working conditions:

1. 所述的陰極電解液中不含銅離子且不含三價鐵離子或者三價鐵離子濃度較低時,電解槽陰極區發生水的電解反應或酸液的氫離子被還原而產出氫氣。1. When the cathode electrolyte does not contain copper ions and does not contain trivalent iron ions or the concentration of trivalent iron ions is low, water electrolysis occurs in the cathode region of the electrolytic cell or hydrogen ions in the acid solution are reduced to produce hydrogen gas.

2. 向電解槽陰極區溶液加投補充含有銅離子和/或三價鐵離子的酸性溶液,當所述陰極電解液中的銅離子濃度較高時電解陰極上主要發生電析金屬銅的電化學反應,當所述陰極電解液中的三價鐵離子濃度較高時電解陰極上主要發生三價鐵離子被還原為二價鐵離子的電化學反應。而在所述陰極電解液中的銅離子濃度和/或三價鐵離子濃度較低時電解陰極上會析出氫氣。因此,電解過程中可以進一步採用比重計、光電比色計、氧化還原電位計來控制陰極電解液中的含銅量和/或三價鐵離子濃度。而在所述陰極電解液中包含酸性氯化銅蝕刻廢液、經過氧化處理的含銅陰極溢出液、經過電解處理的陽極電解液中的至少一種或其混合液,可通過對所述的陰極電解液中的銅離子或三價鐵離子的濃度控制,則能由此選擇和分配電解取銅與化學反應取銅兩種方法中的工作分配量。這工作方式既可以通過電解槽作電解取銅,又可以採用所述的陰極電解溢出液與銅提取劑作混合反應得到銅鹽作回收銅製程的相結合。2. Add an acidic solution containing copper ions and/or trivalent iron ions to the cathode solution of the electrolytic cell. When the copper ion concentration in the cathode electrolyte is high, an electrochemical reaction of electrolyzing metallic copper mainly occurs on the electrolytic cathode. When the trivalent iron ion concentration in the cathode electrolyte is high, an electrochemical reaction of reducing trivalent iron ions to divalent iron ions mainly occurs on the electrolytic cathode. When the copper ion concentration and/or trivalent iron ion concentration in the cathode electrolyte is low, hydrogen gas will be precipitated on the electrolytic cathode. Therefore, a hydrometer, a photoelectric colorimeter, and a redox potentiometer can be further used to control the copper content and/or the concentration of trivalent iron ions in the cathode electrolyte during the electrolysis process. The cathode electrolyte contains at least one of acidic copper chloride etching waste liquid, copper-containing cathode overflow liquid subjected to oxidation treatment, and an electrolytically treated anodic electrolyte, or a mixture thereof. By controlling the concentration of copper ions or trivalent iron ions in the cathode electrolyte, the work distribution amount of the two methods of electrolytic copper extraction and chemical reaction copper extraction can be selected and allocated. This working method can not only extract copper through electrolysis in an electrolytic cell, but also combine the process of recovering copper by mixing the overflow liquid from the cathode electrolysis with a copper extractant to obtain copper salt.

3. 所述的陰極電解液中含有銅離子和/或鐵離子時,令陰極電解液與氧化劑混合進行氧化再生二價銅離子和/或三價鐵離子反應,從而減少甚至避免電解陰極上析出氫氣。當所述的陰極電解液中含有銅離子時,可以進一步根據電解機的結構和製程要求採用氧化還原電位計來控制向電解槽陰極區溶液加投氧化劑,使得陰極盡少電析出銅甚至不電析出金屬銅。當電解槽分隔物為陰離子交換膜時,隨著電解反應以及與氧化劑的化學反應進行,陰極電解液中的氯離子濃度和酸濃度不斷降低,此時可進一步利用酸度計控制向所電解槽陰極區加投鹽酸、酸性再生蝕刻子液、酸性氯化銅蝕刻廢液中的至少一種以維持陰極電解液與氧化劑的化學反應,使電解槽的正常工作。優選地,所述的陰極電解液為酸性氯化銅蝕刻廢液和/或含鐵再生蝕刻子液和/或步驟三中所得的含鐵濾液,並且所述的電解槽陰極區結構採用配置溢流口,向電解槽陰極區溶液加投氧化劑進行氧化反應、加投酸性氯化銅蝕刻廢液和/或含鐵再生蝕刻子液和/或步驟三中所得的含鐵酸性濾液以補充陰極電解液中的氯離子和酸;對所溢出的陰極電解液另作加投鹼性物質或銅提取劑作混合反應令其中的銅離子和/或鐵離子變為氫氧化物或碳酸鹽或草酸鹽等沉澱得到分離,或通過電解方法對所溢出的陰極電解液作提銅處理;所得的去除銅離子後的溶液可調配回用或作為廢水外排處理。3. When the cathode electrolyte contains copper ions and/or iron ions, the cathode electrolyte is mixed with an oxidant to oxidize and regenerate divalent copper ions and/or trivalent iron ions, thereby reducing or even avoiding the precipitation of hydrogen gas on the electrolytic cathode. When the cathode electrolyte contains copper ions, a redox potentiometer can be used to control the addition of an oxidant to the cathode solution of the electrolytic cell according to the structure and process requirements of the electrolyzer, so that the cathode electrolyzes as little copper as possible or even no metallic copper. When the separator of the electrolytic cell is an anion exchange membrane, as the electrolytic reaction and the chemical reaction with the oxidant proceed, the chloride ion concentration and acid concentration in the cathode electrolyte continue to decrease. At this time, the acidity meter can be further used to control the addition of at least one of hydrochloric acid, acidic regeneration etching solution, and acidic copper chloride etching waste solution to the cathode area of the electrolytic cell to maintain the chemical reaction between the cathode electrolyte and the oxidant, so as to enable the electrolytic cell to work normally. Preferably, the cathode electrolyte is acidic copper chloride etching waste solution and/or iron-containing regeneration etching sub-liquid and/or iron-containing filter solution obtained in step three, and the cathode region structure of the electrolytic cell is configured with an overflow port, and an oxidant is added to the cathode region solution of the electrolytic cell to carry out an oxidation reaction, and acidic copper chloride etching waste solution and/or iron-containing regeneration etching sub-liquid and/or iron-containing acid filter solution obtained in step three is added. To replenish the chloride ions and acid in the cathodic electrolyte; to add alkaline substances or copper extractants to the overflowed cathodic electrolyte for mixed reaction so that the copper ions and/or iron ions therein are converted into hydroxides or carbonates or oxalates for precipitation and separation; or to extract copper from the overflowed cathodic electrolyte by electrolysis; the solution obtained after the removal of copper ions can be prepared for reuse or discharged as wastewater.

作為本發明上述方式3的一種優選的實施方式:電解過程中,為使陰極電解液中保持有一定數量的二價銅離子和/或三價鐵離子,避免電解陰極上析出帶有爆炸危險性的氫氣和避免陰極大量析銅,加投所述的氧化劑為氯酸鈉、氯酸鉀、高氯酸鈉、高氯酸鉀、亞氯酸鈉、亞氯酸鉀、氯氣、氧氣、臭氧、空氣、雙氧水中的至少一種或其混合物。所述的氯氣除了外來的氯氣之外還可以直接採用所述電解槽陽極區反應析出的氯氣。As a preferred implementation of the above-mentioned method 3 of the present invention: during the electrolysis process, in order to keep a certain amount of divalent copper ions and/or trivalent iron ions in the cathode electrolyte, to avoid the precipitation of explosive hydrogen gas on the electrolytic cathode and to avoid a large amount of copper precipitation on the cathode, the oxidant added is at least one of sodium chlorate, potassium chlorate, sodium perchlorate, potassium perchlorate, sodium chlorite, potassium chlorite, chlorine, oxygen, ozone, air, hydrogen peroxide or a mixture thereof. In addition to external chlorine, the chlorine can also be directly used as the chlorine precipitated by the reaction in the anode area of the electrolytic cell.

步驟二中所述的銅提取劑為能在鹽酸溶液環境下與二價銅離子形成固體沉澱物的化學品,具體的銅提取劑為草酸。步驟二中採用銅提取劑與經過電解處理的陽極電解液、經過電解處理的陰極電解液、經過氧化處理的陰極電解液、氯化銅蝕刻廢液中的至少一種或一種以上的混合液進行混合反應時,各種溶液可以分別與銅提取劑混合,也可以將二種或多種的含銅溶液在一起混合後再與銅提取劑混合反應製得沉澱銅鹽。The copper extractant described in step 2 is a chemical that can form a solid precipitate with divalent copper ions in a hydrochloric acid solution environment, and the specific copper extractant is oxalic acid. In step 2, when the copper extractant is used to carry out a mixed reaction with at least one or more mixed solutions of an electrolytically treated anodic electrolyte, an electrolytically treated cathodic electrolyte, an oxidized cathodic electrolyte, and copper chloride etching waste solution, each solution can be mixed with the copper extractant separately, or two or more copper-containing solutions can be mixed together and then mixed with the copper extractant to produce precipitated copper salt.

其化學反應式為:H 2C 2O 4+CuCl 2→2HCl+CuC 2O 2↓。 The chemical reaction formula is: H 2 C 2 O 4 +CuCl 2 →2HCl+CuC 2 O 2 ↓.

步驟二中,所述經氧化處理的陰極電解液具體為,當溢出電解槽後的所述陰極電解液中含有銅離子時,採用氧化劑對經電解的陰極電解液進行氧化後所得的溶液。發明人發現,以鹽酸為主的酸性環境中,二價銅離子能夠與草酸結合形成較穩定的草酸銅沉澱物,而一價銅離子以及亞鐵離子因其草酸鹽易溶於鹽酸溶液中而無法生成穩定的沉澱物。在電解過程中電解陰極上發生的是電化學還原反應,故陰極電解液中含有一價銅離子的銅鹽;另外,當陰極電解液中含有三價鐵離子時還會發生三價鐵離子被還原為二價鐵離子的電化學反應。因此,對於含有一價銅鹽的陰極電解液而言,採用先對從所述電解槽陰極區的溢流口所溢出的陰極電解液進行氧化處理以製成為含有大量二價銅離子而少含三價鐵離子的含銅溶液即所述的經氧化處理的陰極電解液後再參與跟銅提取劑作提銅反應,通過此方法處理後能夠有效地提高銅鹽收取率和減少因三價鐵離子含量高而多消耗草酸。In step 2, the oxidized cathodic electrolyte is specifically a solution obtained by oxidizing the electrolyzed cathodic electrolyte with an oxidant when the cathodic electrolyte contains copper ions after overflowing the electrolytic cell. The inventors have found that in an acidic environment dominated by hydrochloric acid, divalent copper ions can combine with oxalic acid to form a relatively stable copper oxalate precipitate, while monovalent copper ions and ferrous ions cannot form a stable precipitate because their oxalates are easily soluble in hydrochloric acid solutions. During the electrolysis process, an electrochemical reduction reaction occurs at the electrolytic cathode, so the cathode electrolyte contains copper salt with monovalent copper ions. In addition, when the cathode electrolyte contains trivalent iron ions, an electrochemical reaction occurs in which the trivalent iron ions are reduced to divalent iron ions. Therefore, for the cathodic electrolyte containing monovalent copper salt, the cathodic electrolyte overflowing from the overflow port of the cathode region of the electrolytic cell is first oxidized to produce a copper-containing solution containing a large amount of divalent copper ions and a small amount of trivalent iron ions, i.e., the oxidized cathodic electrolyte, and then reacted with a copper extractant to perform a copper extraction reaction. After treatment by this method, the copper salt recovery rate can be effectively improved and the consumption of oxalic acid due to the high content of trivalent iron ions can be reduced.

其氧化處理陰極電解液所使用的氧化劑優選為氯酸鈉、氯酸鉀、高氯酸鈉、高氯酸鉀、亞氯酸鈉、亞氯酸鉀、次氯酸鈉、過碳酸鈉、氯氣、氧氣、臭氧、空氣、雙氧水中的至少一種,所述的氯氣除了外來的氯氣之外還可以直接採用所述電解陽極上生成析出的氯氣。當所述酸性氯化銅蝕刻液中含有氯化鐵時,也可以利用蝕刻廢液和/或蝕刻工作液和/或陽極電解液作為氧化處理陰極電解液的氧化劑,利用其中具有氧化性的氯化鐵對所述陰極電解液中的一價銅離子進行氧化,以製配出酸性的二價銅鹽和亞鐵鹽的理想溶液與草酸進行反應製得高收率的草酸銅。The oxidant used in the oxidation treatment of the cathode electrolyte is preferably at least one of sodium chlorate, potassium chlorate, sodium perchlorate, potassium perchlorate, sodium chlorite, potassium chlorite, sodium hypochlorite, sodium percarbonate, chlorine, oxygen, ozone, air, and hydrogen peroxide. In addition to external chlorine, the chlorine can also be directly used as the chlorine generated and precipitated on the electrolytic anode. When the acidic copper chloride etching solution contains ferric chloride, the etching waste solution and/or etching working solution and/or anodic electrolyte can also be used as an oxidant for oxidation treatment of the cathodic electrolyte, and the oxidizing ferric chloride therein is used to oxidize the monovalent copper ions in the cathodic electrolyte to prepare an ideal solution of acidic divalent cupric salt and ferrous salt to react with oxalic acid to obtain high-yield copper oxalate.

本發明可作以下改進:當所述的陰極電解液含有銅離子時,通過向電解槽陰極區溶液加投補充含有銅離子和/或三價鐵離子的酸性溶液,或者通過令陰極電解液與氧化劑混合進行氧化再生,控制所述陰極電解液的氧化還原電位不低於250mV。所述的陰極電解液含有銅離子且其氧化還原電位不低於250mV時,所述陰極電解液中含有適量二價銅離子,能夠實現較好的銅鹽回收效果。The present invention can be improved as follows: when the cathode electrolyte contains copper ions, an acidic solution containing copper ions and/or trivalent iron ions is added to the cathode zone solution of the electrolytic cell, or the cathode electrolyte is mixed with an oxidant for oxidation regeneration, so that the redox potential of the cathode electrolyte is controlled to be not less than 250 mV. When the cathode electrolyte contains copper ions and its redox potential is not less than 250 mV, the cathode electrolyte contains an appropriate amount of divalent copper ions, which can achieve a better copper salt recovery effect.

此外,本發明將電解過程中通過製程控制使電解陽極上產生的氯氣用於氧化陰極電解液、蝕刻廢液、陽極電解液、蝕刻工作液中的至少一種或一種以上的混合液,能使被氧化溶液中的一價銅離子氧化為二價銅離子。當本發明的方法用於包含鐵離子的酸性氯化銅蝕刻製程,電解過程中電解陽極上產生的氯氣被來自於蝕刻工作液和/或蝕刻廢液中的亞鐵離子反應吸收,進一步減少氯氣逸出提升了回收處理製程的安全性和可控性。並使到來自於氯化銅蝕刻廢液所電析的氯氣能夠返回原蝕刻液系統中,既可充分循環利用,又能避免有害氯氣排放增加處理成本。In addition, the present invention uses the chlorine gas generated on the electrolytic anode during the electrolysis process to oxidize at least one or a mixture of the cathode electrolyte, the etching waste liquid, the anodic electrolyte, and the etching working solution through process control, so that the monovalent copper ions in the oxidized solution can be oxidized into divalent copper ions. When the method of the present invention is used in an acidic copper chloride etching process containing iron ions, the chlorine gas generated on the electrolytic anode during the electrolysis process is absorbed by the ferrous ions in the etching working solution and/or the etching waste liquid, further reducing the chlorine gas leakage and improving the safety and controllability of the recycling process. The chlorine gas electrolyzed from copper chloride etching waste liquid can be returned to the original etching liquid system, which can be fully recycled and avoid the increase of treatment cost by harmful chlorine gas emission.

其再生氧化反應:2Cu ++Cl 2→2Cu 2++2Cl -; 2Fe 2++Cl 2→2Fe 3++2Cl -Its regenerative oxidation reaction is: 2Cu + +Cl 2 →2Cu 2+ +2Cl - ; 2Fe 2+ +Cl 2 →2Fe 3+ +2Cl - .

本發明可作以下改進:當採用含有氯化鐵的酸性氯化銅蝕刻製程時,步驟三中先對所得的酸性濾液作氧化後,再將其直接或者作配製後成為再生蝕刻子液循環回用於蝕刻生產線上,以有效提升蝕刻工作液的穩定度。當採用含有氯化鐵的酸性氯化銅蝕刻製程時,步驟二中與所述銅提取劑混合反應的溶液中也會存有鐵離子,由於草酸具有還原性,化學反應提銅的過程中會將部分的三價鐵離子還原為二價鐵離子。根據發明人的試驗結果,被還原的三價鐵離子占比約為20%。此時將所得濾液直接作為再生蝕刻子液或者作配製後為再生蝕刻子液回用於蝕刻生產線上,因再生蝕刻子液中含有二價鐵離子,投入後需在蝕刻生產線中進行氧化反應轉為三價鐵離子後才能成為蝕刻劑參與蝕刻反應,使到蝕刻品質帶來不穩定性因素。氧化步驟三中對所得酸性濾液的氧化劑與氧化處理陰極電解液的氧化劑選擇範圍相同。The present invention can be improved as follows: when an acid copper chloride etching process containing ferric chloride is used, the obtained acidic filter solution is first oxidized in step three, and then it is directly or prepared as a regenerated etching liquid for recycling in the etching production line to effectively improve the stability of the etching working liquid. When an acid copper chloride etching process containing ferric chloride is used, iron ions will also exist in the solution mixed with the copper extractant in step two. Since oxalic acid has reducing properties, part of the trivalent iron ions will be reduced to divalent iron ions during the chemical reaction copper extraction process. According to the test results of the inventor, the reduced trivalent iron ions account for about 20%. At this time, the obtained filter solution is directly used as a regenerated etching solution or is prepared as a regenerated etching solution and reused in the etching production line. Because the regenerated etching solution contains divalent iron ions, it needs to be oxidized in the etching production line to be converted into trivalent iron ions before it can become an etchant to participate in the etching reaction, which brings instability to the etching quality. The oxidant of the obtained acidic filter solution in the oxidation step three is selected in the same range as the oxidant of the cathode electrolyte in the oxidation treatment.

本發明可以作以下改進:對步驟三中的所得固體銅鹽沉澱物優選作清洗處理。由於蝕刻廢液中常含有氯鹽(如氯化銨、氯化鈉、氯化鐵等)添加劑,在第一次固液分離後所得的固體銅鹽沉澱物除了包含殘餘鹽酸外也難免含有這些雜質。具體清洗方法是採用稀鹽酸溶液或者清水對所得的固體銅鹽沉澱物進行一次或一次以上的清洗,以去除銅鹽沉澱物中的鹽酸和能夠溶解於酸液或者水中的氯鹽雜質,從而提高回收所得的銅鹽產品純度。The present invention can be improved as follows: the solid copper salt precipitate obtained in step 3 is preferably cleaned. Since etching waste liquid often contains chloride salt additives (such as ammonium chloride, sodium chloride, ferric chloride, etc.), the solid copper salt precipitate obtained after the first solid-liquid separation will inevitably contain these impurities in addition to residual hydrochloric acid. The specific cleaning method is to use a dilute hydrochloric acid solution or clean water to clean the solid copper salt precipitate once or more to remove the hydrochloric acid in the copper salt precipitate and the chloride salt impurities that can be dissolved in the acid solution or water, thereby improving the purity of the recovered copper salt product.

本發明還可以作以下改進:對用作所述銅提取劑的草酸與蝕刻廢液等混合反應後作固液分離的所述酸性濾液加入鋇源進行硫酸根雜質的去除處理,在除雜後才作為再生蝕刻子液回用於蝕刻生產線中或者經調配製成為再生蝕刻子液回用於蝕刻工序中。所述的鋇源為氯化鋇、碳酸鋇、氫氧化鋇中的至少一種。這是因為目前市售的草酸產品中常含有硫酸根雜質,在採用草酸作為銅提取劑進行取銅反應所得的酸性濾液中會含有硫酸根。若將含有硫酸根雜質的再生蝕刻子液回用於蝕刻工序中,則產出少量的硫酸會與覆銅板上的油墨或菲林抗蝕層發生化學反應使油墨或菲林溶脫,令到部分原被油墨或菲林抗蝕層覆蓋所保護的底銅裸露出來,在線路圖形蝕刻中被腐蝕為崩缺甚至斷路,導致線路板蝕刻出現品質問題。所以需要對所述酸性濾液或者再生蝕刻子液中的硫酸根採用與鋇源反應產生固體硫酸鋇雜質從溶液中分離除去。The present invention can also be improved as follows: a barium source is added to the acidic filter liquid used as the copper extractant for solid-liquid separation after a mixed reaction with the etching waste liquid, etc. to remove sulfate impurities, and only after the impurities are removed can it be reused in the etching production line as a regenerated etching sub-liquid or it can be prepared into a regenerated etching sub-liquid and reused in the etching process. The barium source is at least one of barium chloride, barium carbonate, and barium hydroxide. This is because the oxalic acid products currently available on the market often contain sulfate impurities, and the acidic filter liquid obtained by using oxalic acid as a copper extractant for copper extraction reaction will contain sulfate. If the regenerated etchant containing sulfate impurities is reused in the etching process, a small amount of sulfuric acid will react chemically with the ink or film anti-etching layer on the copper-clad board to dissolve the ink or film, exposing part of the bottom copper originally protected by the ink or film anti-etching layer, which will be corroded into chipping or even disconnection during the etching of the circuit pattern, resulting in quality problems in the etching of the circuit board. Therefore, it is necessary to separate and remove solid barium sulfate impurities from the solution by reacting the sulfate in the acidic filter solution or the regenerated etchant with the barium source.

優選地,所述鋇源材料所加投的莫耳量少於或等於被處理溶液中所含硫酸根的化學反應莫耳量,從而避免有未反應的鋇離子殘餘於溶液中。Preferably, the molar amount of the barium source material added is less than or equal to the chemical reaction molar amount of sulfate contained in the treated solution, thereby avoiding unreacted barium ions remaining in the solution.

本發明可以作以下改進:電解過程中,採用循環交換槽將來自氯化銅蝕刻生產線上的蝕刻工作液與來自電解槽陽極區的陽極電解液進行循環交換混合,同時將所得的混合液分別返回氯化銅蝕刻生產線上和電解槽陽極區中,使蝕刻工作液在電解槽陽極區得到氧化,以穩控蝕刻工作液的氧化還原電位數值並進行蝕刻的化學反應。具體而言,電解後的陽極電解液其氧化還原電位數值得到氧化上升,在循環交換槽中與氯化銅蝕刻生產線上的蝕刻工作液混合後所得循環交換槽中的混合液其氧化還原電位數值也高於生產線上的蝕刻工作液的數值,當所述混合液進入蝕刻生產線後即可參與新的蝕刻銅化學反應。The present invention can be improved as follows: during the electrolysis process, a circulating exchange tank is used to circulate and exchange the etching working solution from the copper chloride etching production line with the anodic electrolyte from the anodic area of the electrolytic cell, and the obtained mixed solution is returned to the copper chloride etching production line and the anodic area of the electrolytic cell respectively, so that the etching working solution is oxidized in the anodic area of the electrolytic cell, so as to stabilize the redox potential value of the etching working solution and carry out the chemical reaction of etching. Specifically, the redox potential of the anodic electrolyte after electrolysis is increased by oxidation, and the mixed solution in the circulating exchange tank obtained after mixing with the etching working solution on the copper chloride etching production line has a higher redox potential than the etching working solution on the production line. When the mixed solution enters the etching production line, it can participate in a new copper etching chemical reaction.

從上說明:採用本發明的電解氧化再生方法和化學反應沉澱取銅方法的兩種製程方法結合有如下三個優點。From the above explanation, the combination of the electrolytic oxidation regeneration method and the chemical reaction precipitation method for copper extraction has the following three advantages.

1. 本發明通過化學反應沉澱取銅後將酸性濾液回用於蝕刻工序中,可實現原來的蝕刻系統中氯的化合物原材料作循環再用。1. The present invention uses chemical reaction precipitation to extract copper and then reuses the acidic filter solution in the etching process, thereby realizing the recycling of chlorine compound raw materials in the original etching system.

2. 能通過電解氧化再生方式製造出含鐵、銅離子的一種新型的高氧化還原電位數值的酸性蝕刻工作液,不僅能滿足5G高精密線板生產品質要求,還能將生產效率提高50%。2. A new type of acidic etching working fluid with high redox potential values containing iron and copper ions can be produced by electrolytic oxidation regeneration, which can not only meet the production quality requirements of 5G high-precision line boards, but also increase production efficiency by 50%.

3. 回收過程中所產出的氣體、液體、固體都能夠得到循環利用,實現無新增三廢的效果,克服了現有回收技術中污水增量問題,大幅度降低汙水處理成本。3. The gas, liquid and solid produced in the recycling process can be recycled, achieving the effect of no additional three wastes, overcoming the problem of wastewater increase in existing recycling technology, and greatly reducing the cost of sewage treatment.

以上三個優點針對性地說明和解決了現有酸性氯化銅電解回收製程技術中所存在的製程難題。The above three advantages specifically explain and solve the process difficulties existing in the existing acid copper chloride electrolytic recovery process technology.

本發明的第二個目的通過以下技術方案實現:The second object of the present invention is achieved by the following technical solutions:

一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置,其包括:酸性蝕刻生產線、電解槽、電解槽分隔物、陽極、陰極、電解電源、銅鹽提取反應槽和銅鹽提取固液分離器。A device used in a method for electrolytic regeneration of copper from acidic copper chloride etching waste liquid precipitation includes: an acidic etching production line, an electrolytic cell, an electrolytic cell separator, an anode, a cathode, an electrolytic power source, a copper salt extraction reaction tank and a copper salt extraction solid-liquid separator.

其中:所述電解槽分隔物將電解槽分成電解槽陽極區和電解槽陰極區,所述的陽極和陰極分別放置在所述的電解槽陽極區和電解槽陰極區中;所述電解槽陽極區通過管道與蝕刻生產線的蝕刻液缸連接,所述電解槽陽極區的頂部設有抽氣蓋板,所述抽氣蓋板的出氣口連接有氣體引流管道;所述的蝕刻生產線和/或所述的電解槽陽極區和/或電解槽陰極區通過設有泵浦的管道與銅鹽提取反應槽連接,所述的銅鹽提取反應槽與銅鹽提取固液分離器作管道連接。Wherein: the electrolytic cell separator divides the electrolytic cell into an electrolytic cell anode area and an electrolytic cell cathode area, and the anode and cathode are placed in the electrolytic cell anode area and the electrolytic cell cathode area respectively; the electrolytic cell anode area is connected to the etching liquid cylinder of the etching production line through a pipeline, and the top of the electrolytic cell anode area is provided with an exhaust cover plate, and the gas outlet of the exhaust cover plate is connected to a gas drainage pipeline; the etching production line and/or the electrolytic cell anode area and/or the electrolytic cell cathode area are connected to the copper salt extraction reactor through a pipeline provided with a pump, and the copper salt extraction reactor is connected to the copper salt extraction solid-liquid separator by a pipeline.

所述的陽極為不溶性電極,所述的陰極為不溶性電極。The anode is an insoluble electrode, and the cathode is an insoluble electrode.

所述電解槽分隔物為能有效減少甚至阻止陽極電解液中的陽離子在電場力作用下從陽極區遷移至陰極區的材料,具體為陰離子交換膜、雙極膜、反滲透膜中的至少一種。The electrolytic cell separator is a material that can effectively reduce or even prevent cations in the anodic electrolyte from migrating from the anodic region to the cathodic region under the action of an electric field force, and is specifically at least one of an anion exchange membrane, a bipolar membrane, and a reverse osmosis membrane.

所述的陽極優選包括導電石墨、裸露金屬、表面塗有電解陽極塗層或鍍有惰性金屬的金屬電極、表面塗有電解陽極塗層或鍍有惰性金屬的非金屬物件中的至少一種;用於陽極的裸露金屬為鉑、金、含有鉑和/或金的合金中的至少一種;所述陽極的表面塗有電解陽極塗層或鍍有惰性金屬的金屬電極中的金屬基體為鈦、鉑、金、銀、銅、鐵、鎳含有上述任意金屬的合金、不銹鋼中的至少一種,用於陽極的惰性金屬為鉑、金中的至少一種。The anode preferably includes at least one of conductive graphite, bare metal, a metal electrode coated with an electrolytic anode coating or plated with an inert metal, and a non-metallic object coated with an electrolytic anode coating or plated with an inert metal; the bare metal used for the anode is platinum, gold, or an alloy containing platinum and/or gold. The surface of the anode is coated with an electrolytic anode coating or plated with an inert metal. The metal substrate in the metal electrode is at least one of titanium, platinum, gold, silver, copper, iron, nickel, an alloy containing any of the above metals, and stainless steel. The inert metal used for the anode is at least one of platinum and gold.

所述的陰極優選包括導電石墨、裸露金屬、表面鍍有惰性金屬的金屬電極、表面鍍有惰性金屬的非金屬物件中的至少一種;所述陰極的裸露金屬為鉑、金、銅、含有上述任意金屬的合金中的至少一種,當所述陰極電解液中不含硫酸時陰極的裸露金屬還可以是鈦、銀、含有鈦和/或銀的合金;所述陰極的表面鍍有惰性金屬的金屬電極的金屬基體為鈦、鉑、金、銀、銅、鐵、含有上述任意金屬的合金、不銹鋼中的至少一種,用於所述陰極的惰性金屬為鉑和/或金,所述陰極電解液中不含硫酸時用於所述陰極的惰性金屬還可以是鈦、銀。The cathode preferably includes at least one of conductive graphite, bare metal, a metal electrode with an inert metal plated on the surface, and a non-metallic object with an inert metal plated on the surface; the bare metal of the cathode is at least one of platinum, gold, copper, and an alloy containing any of the above metals. When the cathode electrolyte does not contain sulfuric acid, the bare metal of the cathode can also be titanium, silver, or a metal containing The metal substrate of the metal electrode whose surface is plated with an inert metal is at least one of titanium, platinum, gold, silver, copper, iron, alloys containing any of the above metals, and stainless steel. The inert metal used for the cathode is platinum and/or gold. When the cathode electrolyte does not contain sulfuric acid, the inert metal used for the cathode can also be titanium or silver.

本發明可以作以下改進:增設蝕刻廢液或陰極電解溢出液氧化槽。將所述的蝕刻廢液或陰極電解溢出液氧化槽與銅鹽提取反應槽通過設有閥門和泵浦的管道連接,以便蝕刻廢液或陰極電解溢出液進行銅鹽提取前在所述的蝕刻廢液或陰極電解溢出液氧化槽中進行氧化,以提高銅鹽收率。The present invention can be improved as follows: an etching waste liquid or cathodic electrolysis overflow liquid oxidation tank is added. The etching waste liquid or cathodic electrolysis overflow liquid oxidation tank is connected to the copper salt extraction reaction tank through a pipeline provided with a valve and a pump, so that the etching waste liquid or cathodic electrolysis overflow liquid is oxidized in the etching waste liquid or cathodic electrolysis overflow liquid oxidation tank before copper salt extraction, so as to improve the copper salt yield.

本發明可以作以下改進:增設電解槽陰極區氧化裝置,用於對陰極電解液進行氧化。所述電解槽陰極區氧化裝置與陰極電解溢出液氧化槽安裝連接。所述的陰極電解溢出液氧化槽為連接有帶加投泵浦管道的氧化劑槽、氧化劑固體加投裝置、連接有氧化性氣體源的氣體引流的氣液混合裝置中的至少一種。The present invention can be improved as follows: an electrolytic cell cathode region oxidation device is added to oxidize the cathode electrolyte. The electrolytic cell cathode region oxidation device is installed and connected to the cathode electrolysis overflow liquid oxidation tank. The cathode electrolysis overflow liquid oxidation tank is at least one of an oxidant tank connected to a dosing pump pipeline, an oxidant solid dosing device, and a gas-liquid mixing device connected to a gas drainage of an oxidizing gas source.

本發明還可以作以下改進:增設溢出緩衝槽,用於各類槽在生產過程中出現滿液溢出作收集並按製程要求泵送溶液以解決流動溶液的液位問題。所述的電解槽陰極區的溢出緩衝槽設置於所述電解槽陰極區的溢流口與對應的其他槽之間。所述的電解槽陽極區的溢出緩衝槽設置於所述電解槽陽極區溢流口與對應的其他槽之間;所述的蝕刻工作線的溢出緩衝槽設置於所述蝕刻生產線的蝕刻液缸的溢出管口與對應的其他槽之間。The present invention can also be improved as follows: an overflow buffer tank is added to collect the overflow of various tanks during the production process and pump the solution according to the process requirements to solve the liquid level problem of the flowing solution. The overflow buffer tank of the cathode area of the electrolytic tank is arranged between the overflow port of the cathode area of the electrolytic tank and the corresponding other tanks. The overflow buffer tank of the anode area of the electrolytic tank is arranged between the overflow port of the anode area of the electrolytic tank and the corresponding other tanks; the overflow buffer tank of the etching working line is arranged between the overflow pipe port of the etching liquid cylinder of the etching production line and the corresponding other tanks.

本發明還可以作以下改進:增設蝕刻廢液暫存槽,用於暫存氯化銅蝕刻廢液;所述的蝕刻廢液暫存槽通過管道與所述電解槽陽極區、電解槽陰極區、蝕刻生產線上的蝕刻液缸、循環交換槽、銅鹽提取反應槽中的至少一種槽罐連接。The present invention can also be improved as follows: an etching waste liquid temporary storage tank is added to temporarily store copper chloride etching waste liquid; the etching waste liquid temporary storage tank is connected to at least one tank of the electrolytic cell anode area, the electrolytic cell cathode area, the etching liquid cylinder on the etching production line, the circulation exchange tank, and the copper salt extraction reaction tank through a pipeline.

本發明還可以作以下改進:增設循環交換槽,所述循環交換槽作為陽極電解液與蝕刻工作液的混合交換反應中心。其混合管道的連通構造致使溶液混合效率和生產安全性有所不同。The present invention can also be improved as follows: a circulating exchange tank is added, which serves as a mixing exchange reaction center for the anode electrolyte and the etching working solution. The interconnected structure of the mixing pipeline makes the solution mixing efficiency and production safety different.

優選地,循環交換槽分別與蝕刻生產線上的蝕刻液缸和電解槽陽極區分別連接構成兩組獨立的循環液流回路,使來自氯化銅蝕刻生產線上的蝕刻工作液與來自電解槽陽極區的陽極電解液在減少環節下以最短時間到達循環交換槽中作交匯混合,同時所製得的混合液以最短的回應時間返回氯化銅蝕刻生產線上和返回到電解反應槽陽極區中,使氯化銅蝕刻生產線上蝕刻工作液的氧化還原電位數值快速收斂於控制值的範圍中,使蝕刻工作液的氧化再生過程更為安全。Preferably, the circulation exchange tank is respectively connected to the etching liquid cylinder and the anode area of the electrolytic cell on the etching production line to form two independent circulation liquid flow loops, so that the etching working liquid from the copper chloride etching production line and the anode electrolyte from the anode area of the electrolytic cell can reach the circulation exchange tank in the shortest time for intersection and mixing under reduced links, and at the same time, the prepared mixed liquid returns to the copper chloride etching production line and returns to the anode area of the electrolytic reaction cell in the shortest response time, so that the redox potential value of the etching working liquid on the copper chloride etching production line quickly converges within the control value range, making the oxidation regeneration process of the etching working liquid safer.

進一步優選地,所述循環交換槽的出液口與蝕刻生產線上的蝕刻液缸的連接管道上設有液體流量調節控制器;所述的液體流量調節控制器為通過調節管道的閥門開度大小來控制通過管道的液體流量,或者通過開啟或關停泵浦或者改變泵浦電機的轉速來控制調節管道的液體流量大小,以控制蝕刻工作液的氧化還原電位值的穩定性。其中,所述的液體流量調節控制器受控於蝕刻生產線上的蝕刻工作液氧化還原電位氧化還原檢測裝置。蝕刻工作液在蝕刻液缸滿液後通過溢流口將溢出的蝕刻廢液引流到溢出緩衝槽中並由泵浦將溢出緩衝槽中溶液泵送回所述的循環交換槽中作溶液混合或泵送到蝕刻廢液暫存槽中暫儲。所述的循環交換槽通過管道與電解槽陽極區的溢出緩衝槽連接,當所述循環交換槽中溶液通過泵浦泵送到所述電解槽陽極區中,因電解槽陽極區的滿液溢出到其溢出緩衝槽後再由泵浦泵送回所述循環交換槽中使包含氯氣的陽極電解液能快速地與蝕刻工作液作混合反應以減少氯氣逸出。Further preferably, a liquid flow regulating controller is provided on the connecting pipe between the liquid outlet of the circulation exchange tank and the etching liquid cylinder on the etching production line; the liquid flow regulating controller controls the liquid flow through the pipe by adjusting the valve opening of the pipe, or controls the liquid flow of the regulating pipe by turning on or off the pump or changing the speed of the pump motor to control the stability of the redox potential value of the etching working fluid. The liquid flow regulating controller is controlled by the redox potential redox detection device of the etching working fluid on the etching production line. After the etching liquid tank is full of liquid, the etching working liquid drains the overflowed etching waste liquid into the overflow buffer tank through the overflow port, and the solution in the overflow buffer tank is pumped back to the circulation exchange tank for solution mixing or pumped to the etching waste liquid temporary storage tank for temporary storage. The circulation exchange tank is connected to the overflow buffer tank of the anode area of the electrolytic cell through a pipeline. When the solution in the circulation exchange tank is pumped to the anode area of the electrolytic cell by a pump, the full liquid in the anode area of the electrolytic cell overflows into its overflow buffer tank and is then pumped back to the circulation exchange tank by the pump, so that the anode electrolyte containing chlorine can quickly mix and react with the etching working solution to reduce the escape of chlorine.

進一步地,所述循環交換槽通過管道與所述電解槽陰極區、電解槽陰極區的氧化裝置的氧化劑槽、蝕刻廢液暫存槽中的至少一種作連接。Furthermore, the circulation exchange tank is connected to at least one of the cathode region of the electrolytic cell, the oxidant tank of the oxidizing device of the cathode region of the electrolytic cell, and the etching waste liquid temporary storage tank through a pipeline.

進一步地,所述循環交換槽的頂部設有抽氣蓋板,該抽氣蓋板的出氣口通過氣體引流管道與電解槽陰極區、蝕刻生產線上的蝕刻液缸、陰極電解溢出液氧化槽、電解槽陰極區的溢出緩衝槽、蝕刻廢液暫存槽、再生蝕刻子液配製槽、再生蝕刻子液暫存槽或尾氣吸收液槽中的至少一種連接。Furthermore, a vacuum cover is provided at the top of the circulation exchange tank, and the gas outlet of the vacuum cover is connected to at least one of the cathode area of the electrolytic cell, the etching liquid cylinder on the etching production line, the cathode electrolysis overflow liquid oxidation tank, the overflow buffer tank of the cathode area of the electrolytic cell, the etching waste liquid temporary storage tank, the regenerated etching sub-liquid preparation tank, the regenerated etching sub-liquid temporary storage tank or the tail gas absorption liquid tank through a gas drainage pipe.

本發明還可以作以下改進:增設銅鹽清洗槽和銅鹽清洗固液分離器,分別用於對銅鹽沉澱物固體進行清洗和固液分離。The present invention can also be improved as follows: a copper salt cleaning tank and a copper salt cleaning solid-liquid separator are added to clean the copper salt precipitate solid and separate the solid and liquid, respectively.

本發明還可以作以下改進:增設再生蝕刻子液配製槽,用於採用來自銅鹽提取固液分離器的酸性濾液來配製再生蝕刻子液;所述的再生蝕刻子液配製槽設置於所述銅鹽提取固液分離器和再生蝕刻子液暫存槽之間。The present invention can also be improved as follows: a regeneration etching liquid preparation tank is added to prepare the regeneration etching liquid using the acidic filter liquid from the copper salt extraction solid-liquid separator; the regeneration etching liquid preparation tank is arranged between the copper salt extraction solid-liquid separator and the regeneration etching liquid temporary storage tank.

本發明還可以作以下改進:增設溶液雜質去除槽和雜質去除固液分離器,分別用於對從所述銅鹽提取固液分離器獲得的酸性濾液中所含的硫酸根進行化學反應沉澱和對沉澱硫酸鹽作固液分離去除。所述的溶液雜質去除槽和雜質去除固液分離器設置於所述銅鹽提取固液分離器和再生蝕刻子液暫存槽之間,或者所述銅鹽提取固液分離器和再生蝕刻子液配製槽之間,或者所述再生蝕刻子液暫存槽之後。The present invention can also be improved as follows: a solution impurity removal tank and an impurity removal solid-liquid separator are added, which are used to chemically react and precipitate the sulfate contained in the acidic filter liquid obtained from the copper salt extraction solid-liquid separator and to perform solid-liquid separation and removal of the precipitated sulfate. The solution impurity removal tank and the impurity removal solid-liquid separator are arranged between the copper salt extraction solid-liquid separator and the regeneration etching sub-liquid temporary storage tank, or between the copper salt extraction solid-liquid separator and the regeneration etching sub-liquid preparation tank, or after the regeneration etching sub-liquid temporary storage tank.

本發明還可以作以下改進:所述電解槽陽極區頂部抽氣蓋板的氣體引流管道與電解槽陽極區、電解槽陰極區、蝕刻生產線上的蝕刻液缸、陰極電解溢出液氧化槽、電解槽陰極區的溢出緩衝槽、電解槽陽極區的溢出緩衝槽、循環交換槽、蝕刻廢液暫存槽、再生蝕刻子液配製槽、再生蝕刻子液暫存槽中的至少一種槽罐連接。The present invention can also be improved as follows: the gas drainage pipe of the exhaust cover plate at the top of the anode zone of the electrolytic cell is connected to at least one of the anode zone of the electrolytic cell, the cathode zone of the electrolytic cell, the etching liquid cylinder on the etching production line, the cathode electrolysis overflow liquid oxidation tank, the overflow buffer tank of the cathode zone of the electrolytic cell, the overflow buffer tank of the anode zone of the electrolytic cell, the circulation exchange tank, the etching waste liquid temporary storage tank, the regenerated etching sub-liquid preparation tank, and the regenerated etching sub-liquid temporary storage tank.

本發明還可以作以下改進:在本發明中的氣體引流管上增設氣泵、真空射流裝置、噴淋裝置中的至少一種,以加速氣液混合反應。The present invention can also be improved as follows: at least one of an air pump, a vacuum jet device, and a spray device is added to the gas drainage pipe in the present invention to accelerate the gas-liquid mixing reaction.

本發明還可以作以下改進:增設所述陰極溢出液化學反應暫存槽,用於對陰極溢出液作加投鹼物質或銅提取劑草酸作反應處理。The present invention can also be improved as follows: a temporary storage tank for the chemical reaction of the cathode overflow liquid is added to perform a reaction treatment on the cathode overflow liquid by adding alkaline substances or copper extracting agent oxalic acid.

本發明還可以作以下改進:增設檢測裝置,所述檢測裝置的探頭設置於線路板的所述蝕刻生產線、所述電解槽陽極區、電解槽陰極區、銅鹽提取反應槽、再生蝕刻子液暫存槽、陰極電解溢出液氧化槽、電解槽陰極區的溢出緩衝槽、循環交換槽、電解槽陽極區的溢出緩衝槽、蝕刻廢液暫存槽、銅鹽清洗槽、陰極溢出液化學反應暫存槽、再生蝕刻子液配製槽、溶液雜質去除槽中的至少一種槽罐中。所述檢測裝置包括氧化還原電位計、光電比色計、比重計、溫度計、酸度計、濁度計、PH計、液位計、氫氣檢測儀、氯氣檢測儀中的至少一種,按檢測裝置的感測器功能用於檢測槽內溶液的氧化還原電位值和/或比色值和/或酸度和/或渾濁度和/或溫度和/或液位元和/或比重值多項製程參數,或用於檢測車間環境的氫氣、氯氣的濃度含量。The present invention can also be improved as follows: a detection device is added, and the probe of the detection device is arranged in at least one tank of the etching production line of the circuit board, the anode area of the electrolytic cell, the cathode area of the electrolytic cell, the copper salt extraction reaction tank, the regeneration etching sub-liquid temporary storage tank, the cathode electrolysis overflow liquid oxidation tank, the overflow buffer tank of the cathode area of the electrolytic cell, the circulation exchange tank, the overflow buffer tank of the anode area of the electrolytic cell, the etching waste liquid temporary storage tank, the copper salt cleaning tank, the cathode overflow liquid chemical reaction temporary storage tank, the regeneration etching sub-liquid preparation tank, and the solution impurity removal tank. The detection device includes at least one of a redox potential meter, a photocolorimeter, a densimeter, a thermometer, an acidity meter, a turbidity meter, a pH meter, a liquid level meter, a hydrogen detector, and a chlorine detector. According to the sensor function of the detection device, it is used to detect multiple process parameters such as the redox potential value and/or the colorimetric value and/or the acidity and/or the turbidity and/or the temperature and/or the liquid level and/or the specific gravity value of the solution in the tank, or to detect the concentration content of hydrogen and chlorine in the workshop environment.

本發明還可以作以下改進:增設自動投料控制器,所述的自動投料控制器通過檢測裝置的資料線連接,其輸出端與本發明裝置中的泵浦、閥門、液體流量調節控制器、電解電源中的至少一種連接,並通過時間程式和/或所述檢測裝置即時檢測得到的製程參數來控制相應的泵浦、閥門、液體流量調節控制器、電解電源執行工作。The present invention can also be improved as follows: an automatic feeding controller is added, the automatic feeding controller is connected via a data line of the detection device, and its output end is connected to at least one of the pump, valve, liquid flow regulating controller, and electrolytic power supply in the device of the present invention, and the corresponding pump, valve, liquid flow regulating controller, and electrolytic power supply are controlled to perform work through a time program and/or process parameters detected in real time by the detection device.

本發明還可以作以下改進:增設攪拌裝置,以使槽內液體的各組分均勻分佈;所述攪拌裝置設置於所述電解槽陽極區、電解槽陰極區、銅鹽提取反應槽、再生蝕刻子液暫存槽、陰極電解溢出液氧化槽、電解槽陰極區的溢出緩衝槽、循環交換槽、電解槽陽極區的溢出緩衝槽、蝕刻廢液暫存槽、銅鹽清洗槽、再生蝕刻子液配製槽、陰極溢出液化學反應暫存槽、溶液雜質去除槽中的至少一種中。所述的攪拌裝置為液體回流攪拌裝置、葉輪攪拌裝置、氣動攪拌裝置中至少一種。所述液體回流攪拌裝置包括出液管、回流管、受控的泵浦和/或閥門,所述氣動攪拌裝置為可向所述電解槽中通入氣體使其中的液體發生流動的裝置。其中,銅鹽提取反應槽和溶液雜質去除槽均可選用反應槽、或者帶濾網反應槽;再生蝕刻子液暫存槽、再生蝕刻子液配製槽、陰極電解溢出液氧化槽、陰極溢出液化學反應暫存槽、蝕刻廢液暫存槽、清洗廢液暫存槽以及存儲生產原料的槽罐產品均可使用通用的暫存槽代替。The present invention can also be improved as follows: a stirring device is added to make the components of the liquid in the tank evenly distributed; the stirring device is arranged in at least one of the anode area of the electrolytic cell, the cathode area of the electrolytic cell, the copper salt extraction reaction tank, the regeneration etching sub-liquid temporary storage tank, the cathode electrolysis overflow liquid oxidation tank, the overflow buffer tank of the cathode area of the electrolytic cell, the circulation exchange tank, the overflow buffer tank of the anode area of the electrolytic cell, the etching waste liquid temporary storage tank, the copper salt cleaning tank, the regeneration etching sub-liquid preparation tank, the cathode overflow liquid chemical reaction temporary storage tank, and the solution impurity removal tank. The stirring device is at least one of a liquid reflux stirring device, an impeller stirring device, and a pneumatic stirring device. The liquid reflux stirring device includes a liquid outlet pipe, a reflux pipe, a controlled pump and/or a valve, and the pneumatic stirring device is a device that can introduce gas into the electrolytic cell to cause the liquid therein to flow. Among them, the copper salt extraction reaction tank and the solution impurity removal tank can both use reaction tanks or reaction tanks with filters; the regeneration etching sub-liquid temporary storage tank, the regeneration etching sub-liquid preparation tank, the cathode electrolysis overflow liquid oxidation tank, the cathode overflow liquid chemical reaction temporary storage tank, the etching waste liquid temporary storage tank, the cleaning waste liquid temporary storage tank, and the tank products for storing production raw materials can all be replaced by universal temporary storage tanks.

本發明還可以作以下改進:增設尾氣處理系統,所述的尾氣處理系統包括抽氣罩和尾氣吸收液槽,還可以進一步包括噴淋裝置、真空射流裝置中的任意一種或以上;所述抽氣罩設於所述電解槽陽極區、電解槽陰極區、銅鹽提取反應槽、再生蝕刻子液暫存槽、陰極電解溢出液氧化槽、陰極溢出液化學反應暫存槽、電解槽陰極區的溢出緩衝槽、循環交換槽、電解槽陽極區的溢出緩衝槽、蝕刻生產線的溢出緩衝槽、蝕刻廢液暫存槽、銅鹽清洗槽、再生蝕刻子液配製槽、溶液雜質去除槽中任意一種或一種以上的頂部,所述尾氣吸收液槽裝有尾氣吸收液。當所述尾氣處理系統僅包含抽氣罩和尾氣吸收液槽時,所述抽氣罩的出氣口置於所述尾氣吸收液槽中。當所述尾氣處理系統進一步包含噴淋裝置和/或射流吸氣裝置時,所述抽氣罩的出氣口與所述噴淋裝置和/或射流吸氣裝置的吸氣口相連,所述噴淋裝置和/或射流吸氣裝置的入液口與所述尾氣吸收液槽相連,所述噴淋裝置和/或射流吸氣裝置的出液口與所述尾氣吸收液槽相連和/或插置於所述尾氣吸收液槽內以作吸收液體循環流動。當所述尾氣處理系統進一步包含氣泵時,所述氣泵設置於與所述抽氣罩連接的氣體引流管道上。The present invention can also be improved as follows: an exhaust gas treatment system is added, the exhaust gas treatment system includes an exhaust hood and an exhaust gas absorption tank, and can further include any one or more of a spray device and a vacuum jet device; the exhaust hood is arranged in the anode area of the electrolytic cell, the cathode area of the electrolytic cell, the copper salt extraction reaction tank, the regeneration etching sub-liquid temporary storage tank, the cathode electrolysis overflow liquid oxygen storage tank, and the exhaust gas treatment system. The tail gas absorption liquid tank is provided at the top of any one or more of the following: a chemical reaction storage tank for cathode overflow liquid, an overflow buffer tank of the cathode zone of the electrolytic cell, a circulating exchange tank, an overflow buffer tank of the anode zone of the electrolytic cell, an overflow buffer tank of the etching production line, a temporary storage tank for etching waste liquid, a copper salt cleaning tank, a regeneration etching sub-liquid preparation tank, and a solution impurity removal tank, and the tail gas absorption liquid tank is filled with tail gas absorption liquid. When the tail gas treatment system only includes an exhaust hood and a tail gas absorption liquid tank, the gas outlet of the exhaust hood is placed in the tail gas absorption liquid tank. When the exhaust gas treatment system further includes a spray device and/or a jet suction device, the air outlet of the exhaust hood is connected to the air intake of the spray device and/or the jet suction device, the liquid inlet of the spray device and/or the jet suction device is connected to the exhaust gas absorption liquid tank, and the liquid outlet of the spray device and/or the jet suction device is connected to the exhaust gas absorption liquid tank and/or inserted in the exhaust gas absorption liquid tank for circulation of the absorption liquid. When the exhaust gas treatment system further includes an air pump, the air pump is arranged on the gas drainage pipe connected to the exhaust hood.

進一步地,所述的尾氣處理系統採用多級串聯使用。當所述的尾氣處理系統採用多級串聯使用時,下一級尾氣處理系統的抽氣罩設於上一級尾氣處理系統的尾氣吸收液槽頂部,或者直接通過管道將上一級尾氣處理系統的尾氣吸收液槽設有的排/出氣口與下一級所述尾氣處理系統中原來與所述抽氣罩出氣口連接的部件進行連接作尾氣處理。Furthermore, the exhaust gas treatment system is used in multiple stages in series. When the exhaust gas treatment system is used in multiple stages in series, the exhaust hood of the next-stage exhaust gas treatment system is arranged on the top of the exhaust gas absorption liquid tank of the previous-stage exhaust gas treatment system, or the exhaust/gas outlet provided in the exhaust gas absorption liquid tank of the previous-stage exhaust gas treatment system is directly connected to the component originally connected to the exhaust hood outlet in the next-stage exhaust gas treatment system through a pipeline for exhaust gas treatment.

本發明還可以作以下改進:增設氫氣外排系統,用於引流外排電解槽陰極區中因電解反應而生成的氫氣,從而避免氫氣聚積而帶來安全隱患;所述氫氣外排系統設置於所述電解槽陰極區上作收集外排。所述的氫氣外排系統可以採用符合安全要求的動力抽風系統,也可以採用簡單的直排氣管道,所述的氫氣外排系統可以進一步設置阻火器。The present invention can also be improved as follows: a hydrogen exhaust system is added to drain and exhaust the hydrogen generated by the electrolytic reaction in the cathode region of the electrolytic cell, thereby avoiding the accumulation of hydrogen and causing safety hazards; the hydrogen exhaust system is arranged on the cathode region of the electrolytic cell for collection and exhaust. The hydrogen exhaust system can adopt a power exhaust system that meets safety requirements, or a simple straight exhaust pipe, and the hydrogen exhaust system can be further provided with a flame arrester.

本發明還可以作以下改進:增設過濾器,以去除蝕刻工作液或者蝕刻廢液中的固體雜質和有機污染物;所述的過濾器設置於蝕刻廢液暫存槽和/或蝕刻生產線和/或電解槽的入液管道和/或出液管道上。The present invention can also be improved as follows: a filter is added to remove solid impurities and organic pollutants in the etching working liquid or the etching waste liquid; the filter is arranged on the liquid inlet pipe and/or liquid outlet pipe of the etching waste liquid temporary storage tank and/or the etching production line and/or the electrolytic cell.

本發明還可以作以下改進:增設水油分離器,以去除蝕刻工作液或者蝕刻廢液中的有機油層雜質;所述的水油分離器設置於蝕刻生產線出液管與蝕刻廢液槽、循環交換槽所連接的入液管道上。The present invention can also be improved as follows: a water-oil separator is added to remove organic oil layer impurities in the etching working fluid or etching waste liquid; the water-oil separator is arranged on the liquid inlet pipe connecting the etching production line outlet pipe and the etching waste liquid tank and the circulation exchange tank.

與現有技術相比,本發明具有以下有益效果:Compared with the prior art, the present invention has the following beneficial effects:

1. 本發明的方法採用電解氧化再生蝕刻工作液和化學方法提銅方法相結合,實現無三廢的酸性蝕刻廢液回收利用製程,既減少環境污染又能循環回用降低生產成本。1. The method of the present invention combines electrolytic oxidation to regenerate the etching working solution with a chemical copper extraction method to achieve a waste acid etching solution recycling process without three wastes, which not only reduces environmental pollution but also reduces production costs through recycling.

2. 本發明能減少甚至免去外來蝕刻氧化劑的加投使用,有效解決現有技術其蝕刻廢液處理過程中產生增量的製程難題,並節省新增廢液量的處理成本。2. The present invention can reduce or even eliminate the use of external etching oxidants, effectively solving the process problem of increasing the amount of waste liquid produced during the treatment of etching waste liquid in the prior art, and saving the cost of treating the additional waste liquid.

3. 本發明從蝕刻廢液中獲得的銅鹽在作提純處理後可直接回用於線路板銅的光亮電鍍生產中,以減少磷銅的另一污染。3. The copper salt obtained from the etching waste liquid in the present invention can be directly reused in the bright electroplating production of circuit board copper after purification to reduce the pollution of phosphorus copper.

4. 本發明的操作方法簡單製程耗能少,完全符合國家環保政策的碳減排方針。4. The operation method of the present invention is simple and the process consumes little energy, which is fully in line with the carbon emission reduction policy of the national environmental protection policy.

5. 本發明的裝置結構安全簡單可靠,運行安全性高而且設備製造和維護成本低。5. The device structure of the present invention is safe, simple and reliable, with high operational safety and low equipment manufacturing and maintenance costs.

以下通過具體的實施例對本發明作進一步的說明。The present invention is further described below through specific embodiments.

本發明的一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法,包括以下步驟:The present invention discloses a method for electrolytically regenerating copper by precipitation of waste acid copper chloride etching solution, comprising the following steps:

步驟一:使用電解槽在蝕刻過程中即時對蝕刻工作液進行氧化,所述電解槽中設置有電解槽分隔物使電解槽分成為電解槽陽極區和電解槽陰極區,所述電解槽陽極區盛放有陽極和陽極電解液,所述電解槽陰極區盛放陰極和陰極電解液,所述陽極電解液為來自酸性氯化銅蝕刻生產線的蝕刻工作液和/或蝕刻廢液,將經過電解處理的陽極電解液作為再生蝕刻工作液返回到酸性氯化銅蝕刻生產線上使用,電解過程中陽極所產生的氯氣用於氧化陰極電解液、再生蝕刻子液、蝕刻工作液、蝕刻廢液中的至少一種或一種以上的混合液,所述的陰極電解液為電解質溶液。Step 1: Use an electrolytic cell to oxidize the etching working solution in real time during the etching process. The electrolytic cell is provided with an electrolytic cell separator to divide the electrolytic cell into an electrolytic cell anode area and an electrolytic cell cathode area. The electrolytic cell anode area contains an anode and an anode electrolyte, and the electrolytic cell cathode area contains a cathode and a cathode electrolyte. The anode electrolyte is from an acidic copper chloride etching production line. The etching working solution and/or etching waste solution are recycled, and the anode electrolyte treated by electrolysis is returned to the acid copper chloride etching production line as the regenerated etching working solution. The chlorine gas generated by the anode during the electrolysis process is used to oxidize at least one or a mixture of more than one of the cathode electrolyte, the regenerated etching sub-liquid, the etching working solution, and the etching waste solution. The cathode electrolyte is an electrolyte solution.

步驟二:將經過電解處理的陽極電解液、經過電解處理的陰極電解液、經過氧化處理的陰極電解液、氯化銅蝕刻廢液中的至少一種或一種以上的混合液與銅提取劑混合,使來自於氯化銅蝕刻廢液和/或氯化銅蝕刻工作液的銅離子在反應混合液中反應生成銅鹽沉澱物。Step 2: mixing at least one of the electrolytically treated anodic electrolyte, the electrolytically treated cathodic electrolyte, the oxidized cathodic electrolyte, and the copper chloride etching waste solution, or a mixture of more than one of the above, with a copper extractant, so that copper ions from the copper chloride etching waste solution and/or the copper chloride etching working solution react in the reaction mixture to generate copper salt precipitates.

步驟三:將步驟二中反應所得的固液混合物經固液分離後獲得固體銅鹽沉澱物和酸性濾液,將所得的酸性濾液直接作為再生蝕刻子液回用於蝕刻生產線的蝕刻工序中或者調配後成為再生蝕刻子液回用於蝕刻工序中,所得的固體銅鹽作為銅的回收產品。Step 3: The solid-liquid mixture obtained by the reaction in step 2 is subjected to solid-liquid separation to obtain a solid copper salt precipitate and an acidic filter solution. The obtained acidic filter solution is directly used as a regenerated etching sub-liquid for recycling in the etching process of the etching production line or is prepared as a regenerated etching sub-liquid for recycling in the etching process. The obtained solid copper salt is used as a copper recovery product.

在下述實施例中,所使用的線路板蝕刻生產線為廣州市科杰電路板裝置有限公司所生產的產品;所使用的循環交換槽、電解槽、反應槽、帶濾網反應槽、暫存槽均為佛山市業高環保設備製造有限公司生產製造的產品;固液分離器、射流吸氣裝置、溫度冷熱交換器、檢測裝置、閥門和泵浦均為市售產品。任意線路板蝕刻生產線都可以搭配本發明的製程使用。除上述列舉的之外,本領域技術人員根據常規選擇,也可以選擇其他具有與本發明列舉的上述產品具有相似性能的產品均可以實現本發明的目的。In the following embodiments, the circuit board etching production line used is a product produced by Guangzhou Kejie Circuit Board Equipment Co., Ltd.; the circulating exchange tank, electrolytic cell, reaction tank, filter reaction tank, and temporary storage tank used are all products produced by Foshan Yegao Environmental Protection Equipment Manufacturing Co., Ltd.; the solid-liquid separator, jet suction device, temperature hot and cold exchanger, detection device, valve and pump are all commercially available products. Any circuit board etching production line can be used in conjunction with the process of the present invention. In addition to the above-mentioned, technical personnel in this field can also choose other products with similar performance to the above-mentioned products listed in the present invention according to routine selection to achieve the purpose of the present invention.

以下實施例中,一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置,主要包括酸性蝕刻生產線、電解槽、電解槽分隔物、陽極、陰極、電解電源、銅鹽提取反應槽和銅鹽提取固液分離器,其中:In the following embodiments, a device used in a method for electrolytic regeneration of copper from acidic copper chloride etching waste liquid precipitation mainly includes an acidic etching production line, an electrolytic cell, an electrolytic cell separator, an anode, a cathode, an electrolytic power source, a copper salt extraction reaction tank and a copper salt extraction solid-liquid separator, wherein:

所述電解槽分隔物將所述電解槽分成電解槽陽極區和電解槽陰極區,所述的陽極和陰極分別放置在所述電解槽陽極區和電解槽陰極區,所述電解槽陽極區通過管道與蝕刻生產線的蝕刻液缸連接,所述電解槽陽極區的頂部設有抽氣蓋板,該抽氣蓋板的出氣口連接有氣體引流管道,所述的蝕刻生產線和/或所述的電解槽陽極區和/或電解槽陰極區通過設有泵浦的管道與銅鹽提取反應槽連接,所述的銅鹽提取反應槽與銅鹽提取固液分離器作管道連接;The electrolytic cell separator divides the electrolytic cell into an electrolytic cell anode area and an electrolytic cell cathode area, the anode and cathode are placed in the electrolytic cell anode area and the electrolytic cell cathode area respectively, the electrolytic cell anode area is connected to the etching liquid cylinder of the etching production line through a pipeline, the top of the electrolytic cell anode area is provided with a vacuum cover plate, the gas outlet of the vacuum cover plate is connected to a gas drainage pipeline, the etching production line and/or the electrolytic cell anode area and/or the electrolytic cell cathode area are connected to the copper salt extraction reactor through a pipeline provided with a pump, and the copper salt extraction reactor is connected to the copper salt extraction solid-liquid separator by a pipeline;

所述的陽極為不溶性電極,所述的陰極為不溶性電極。The anode is an insoluble electrode, and the cathode is an insoluble electrode.

下述實施例中,銅鹽提取反應槽和溶液雜質去除槽均可選用普通反應槽、或者帶濾網反應槽;再生蝕刻子液暫存槽、再生蝕刻子液配製槽、陰極電解溢出液氧化槽、陰極溢出液化學反應暫存槽、蝕刻廢液暫存槽、清洗廢液暫存槽以及存儲生產原料的槽罐產品均可使用通用的暫存槽代替。具體實施例中的各槽罐產品都設有投料口和排氣口,連接各槽罐的管道上設置有閥門和泵浦,部分管道為氣體引流管道,其上增設氣泵、真空射流裝置或噴淋裝置,以加速氣液混合反應。下面通過實施例及其對應的附圖對本發明的優選技術方案作具體說明。In the following embodiments, the copper salt extraction reaction tank and the solution impurity removal tank can be selected as ordinary reaction tanks or reaction tanks with filters; the regeneration etching sub-liquid temporary storage tank, the regeneration etching sub-liquid preparation tank, the cathode electrolysis overflow liquid oxidation tank, the cathode overflow liquid chemical reaction temporary storage tank, the etching waste liquid temporary storage tank, the cleaning waste liquid temporary storage tank and the tank products for storing production raw materials can all be replaced by universal temporary storage tanks. Each tank product in the specific embodiment is provided with a feeding port and an exhaust port, and valves and pumps are provided on the pipes connecting the tanks. Some pipes are gas drainage pipes, on which air pumps, vacuum jet devices or spray devices are added to accelerate the gas-liquid mixing reaction. The preferred technical scheme of the present invention is specifically described below through embodiments and their corresponding drawings.

實施例1Embodiment 1

如圖1所示,為本發明一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法及其裝置的基礎實施例。其包括有線路板蝕刻生產線1、電解槽3、反應槽19、固液分離器49、再生蝕刻子液配製槽26、閥門89至92、泵浦116至119、銅提取劑136,其中電解槽分隔物169為陰離子交換膜。As shown in FIG1 , a basic embodiment of the present invention is a method and device for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid. The method comprises a circuit board etching production line 1, an electrolytic cell 3, a reaction tank 19, a solid-liquid separator 49, a regeneration etching liquid preparation tank 26, valves 89 to 92, pumps 116 to 119, and a copper extractor 136, wherein the electrolytic cell separator 169 is an anion exchange membrane.

線路板的蝕刻生產線1使用的酸性氯化銅蝕刻液其主要成分為鹽酸與氯化銅的混合液,酸度為1.4莫耳/升,銅離子濃度200克/升。The acidic copper chloride etching solution used in the etching production line 1 of the circuit board is mainly composed of a mixture of hydrochloric acid and copper chloride, with an acidity of 1.4 mol/L and a copper ion concentration of 200 g/L.

蝕刻生產線1通過閥門89、泵浦116的管道從蝕刻生產線1將蝕刻液泵往流向電解槽3的電解槽陽極區。電解槽3的電解槽陽極區另外通過電解槽陽極區溢流口的含泵浦117的管道泵回陽極電解液到蝕刻生產線1中連接形成蝕刻工作液的電解再生循環回流系統。其中檢測裝置75、76、77分別是酸度計、氧化還原電位計和比重計。The etching production line 1 pumps the etching liquid from the etching production line 1 to the anode area of the electrolytic cell 3 through the valve 89 and the pipeline of the pump 116. The anode area of the electrolytic cell 3 also pumps the anode electrolyte back to the etching production line 1 through the pipeline containing the pump 117 at the overflow port of the anode area of the electrolytic cell to form an electrolytic regeneration circulation reflux system of the etching working liquid. The detection devices 75, 76, and 77 are respectively an acidity meter, a redox potentiometer, and a hydrometer.

打開閥門89啟動泵浦116和117,使蝕刻工作液與陽極電解液混合並循環流動。隨著蝕刻生產進行需要往蝕刻生產線1中投入線路銅板,開啟電解電源13將蝕刻工作不斷循環流動氧化,除蝕刻生產線上所加投回用再生子液外,需要適時地向蝕刻生產線投入外來鹽酸以保持蝕刻工作液的酸度穩定。當蝕刻生產線1的液位滿到一定高度的液位時則蝕刻生產線1通過蝕刻生產線溢流口將溢出的蝕刻廢液引到反應槽19中,該反應槽19即用於銅鹽提取的銅鹽提取反應槽。Open valve 89 to start pumps 116 and 117, so that the etching working solution and the anode electrolyte are mixed and circulated. As the etching production is carried out, the line copper plate needs to be added to the etching production line 1, and the electrolytic power supply 13 is turned on to circulate and oxidize the etching work continuously. In addition to the recycled regeneration liquid added to the etching production line, it is necessary to timely add external hydrochloric acid to the etching production line to keep the acidity of the etching working solution stable. When the liquid level of the etching production line 1 reaches a certain height, the etching production line 1 guides the overflowed etching waste liquid into the reaction tank 19 through the etching production line overflow port. The reaction tank 19 is a copper salt extraction reaction tank for copper salt extraction.

電解槽3因結構有電解槽分隔物169將電解槽分有電解槽陽極區和電解槽陰極區,其陽極電解液為蝕刻生產線上的溶液,而陰極電解液為鹽酸137和酸性濾液180的混合溶液(混合比例1:15)。在電解過程中陰極液作電化學反應析出氫氣。電解槽陽極區逸出的氯氣通過電解槽蓋罩17(相當於電解槽陽極區的抽氣蓋板)上的排氣口引流到蝕刻生產線上,用於氧化蝕刻工作液。過程中通過操作工根據檢測裝置76的數值大小來調節電解電源13的電流輸出大小值或關停。The electrolytic cell 3 has an electrolytic cell partition 169 that divides the electrolytic cell into an electrolytic cell anode area and an electrolytic cell cathode area. The anode electrolyte is a solution on the etching production line, and the cathode electrolyte is a mixed solution of hydrochloric acid 137 and acidic filter 180 (mixing ratio 1:15). During the electrolysis process, the cathodic solution undergoes an electrochemical reaction to precipitate hydrogen. The chlorine gas escaping from the anode area of the electrolytic cell is drained to the etching production line through the exhaust port on the electrolytic cell cover 17 (equivalent to the exhaust cover plate of the anode area of the electrolytic cell) to oxidize the etching working solution. During the process, the operator adjusts the current output value of the electrolytic power source 13 or shuts it down according to the value of the detection device 76.

投入銅提取劑136到反應槽19的溶液中,反應槽19中溶液發生化學反應生成沉澱物銅鹽141。通過閥門90、泵浦118、固液分離器49對反應槽19的固液混合物作分離,該固液分離器49即用於銅鹽提取的固液分離器,固液分離後得濾液引流到再生蝕刻子液配製槽26中。打開閥門91、根據檢測裝置75的數值啟動泵浦119將再生蝕刻子液配製槽26的酸性濾液180泵送到蝕刻生產線1中作循環使用。酸性濾液180主要成分是鹽酸溶液,另外所得的沉澱物銅鹽141截留在固液分離器49中待取回用。Copper extractant 136 is added to the solution in reaction tank 19, and the solution in reaction tank 19 undergoes a chemical reaction to generate precipitate copper salt 141. The solid-liquid mixture in reaction tank 19 is separated by valve 90, pump 118, and solid-liquid separator 49. The solid-liquid separator 49 is a solid-liquid separator used for copper salt extraction. The filtered liquid obtained after solid-liquid separation is drained into regeneration etching sub-liquid preparation tank 26. Valve 91 is opened, and pump 119 is started according to the value of detection device 75 to pump acidic filtered liquid 180 in regeneration etching sub-liquid preparation tank 26 into etching production line 1 for circulation. The main component of the acidic filtrate 180 is hydrochloric acid solution, and the obtained precipitate copper salt 141 is retained in the solid-liquid separator 49 to be retrieved.

本實施例用於酸性氯化銅蝕刻廢液沉澱取銅電解再生回用的方法。步驟如下:This embodiment is used for the method of electrolyzing and regenerating copper from waste solution of acidic copper chloride etching. The steps are as follows:

1. 將蝕刻生產工作液與陽極電解液作交換混合,使蝕刻工作液通過電解槽作電化學氧化處理使其再生並回用到蝕刻生產線上。1. The etching production working solution is exchanged and mixed with the anode electrolyte, and the etching working solution is electrochemically oxidized through an electrolytic cell to be regenerated and reused in the etching production line.

2. 將蝕刻生產線上溢出的蝕刻廢液通過管道送到反應槽中,按與溶液中銅離子反應所需量的100%通過向反應槽中的溶液投入銅提取劑,使溶液發生化學反應生成銅鹽沉澱,其中銅提取劑為能在鹽酸溶液環境下與二價銅離子形成固定沉澱物的化學品,本實施例中為草酸。2. The etching waste liquid overflowing from the etching production line is sent to the reaction tank through a pipeline, and a copper extractant is added to the solution in the reaction tank according to 100% of the amount required to react with the copper ions in the solution, so that the solution undergoes a chemical reaction to generate copper salt precipitation, wherein the copper extractant is a chemical that can form a fixed precipitate with divalent copper ions in a hydrochloric acid solution environment, and in this embodiment, it is oxalic acid.

3. 設置固液分離器對反應槽中的固液混合物作固液分離處理,得到酸性濾液和銅鹽。3. Set up a solid-liquid separator to perform solid-liquid separation on the solid-liquid mixture in the reaction tank to obtain acidic filtrate and copper salt.

4. 將所得酸性濾液作為再生蝕刻子液回用於蝕刻生產線上,銅鹽待收取回用。4. The obtained acidic filter solution is reused as regenerated etching solution in the etching production line, and the copper salt is collected and reused.

實施例2Embodiment 2

如圖2所示,為本發明一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法及其裝置的實施例。其包括有線路板蝕刻生產線1、循環交換槽2、電解槽3、暫存槽26即陰極電解溢出液氧化槽、暫存槽27即蝕刻廢液暫存槽、反應槽19和20、固液分離器49至55、檢測裝置75至84、銅鹽清洗槽139和140、閥門89至107、泵浦116至131、銅提取劑136、清水138、去硫酸根雜質劑167,其中電解槽分隔物169為陰離子交換膜。As shown in FIG2 , an embodiment of the present invention is a method and device for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid. The method comprises a circuit board etching production line 1, a circulating exchange tank 2, an electrolytic tank 3, a temporary storage tank 26, i.e., a cathode electrolysis overflow liquid oxidation tank, a temporary storage tank 27, i.e., an etching waste liquid temporary storage tank, reaction tanks 19 and 20, solid-liquid separators 49 to 55, detection devices 75 to 84, copper salt cleaning tanks 139 and 140, valves 89 to 107, pumps 116 to 131, a copper extractant 136, clean water 138, and a sulfate impurity removal agent 167, wherein the electrolytic tank separator 169 is an anion exchange membrane.

線路板的蝕刻生產線1內裝有三個檢測裝置75~77,依次是酸度計、比重計、氧化還原電位計,蝕刻工作液為主要包含鹽酸、氯化銅、氯化銨、氯化鈉的混合液,酸度為3.5莫耳/升,銅離子濃度120克/升。The etching production line 1 of the circuit board is equipped with three detection devices 75-77, which are an acidity meter, a hydrometer, and a redox potentiometer. The etching working fluid is a mixed solution mainly including hydrochloric acid, cupric chloride, ammonium chloride, and sodium chloride, with an acidity of 3.5 mol/L and a copper ion concentration of 120 g/L.

循環交換槽2與蝕刻生產線1通過蝕刻生產線1的溢流口69、水油分離器42、閥門89、泵浦116、固液分離器49的管道作從蝕刻生產線1液體流向循環交換槽2的支流和通過閥門90、液體流量調節控制器74、固液分離器50的管道作泵送循環交換槽2液體流向蝕刻生產線1的支流來形成再生蝕刻工作液的循環回流系統;循環交換槽2與電解槽3的電解槽陽極區通過閥門92、泵浦118的管道作從循環交換槽2液體流向電解槽陽極區的支流和通過電解槽陽極區的溢流口70、溢出緩衝槽43、閥門91、泵浦111的管道作從電解槽陽極區的液體流向循環交換槽2的支流來形成蝕刻工作液被氧化的循環回流系統。使循環交換槽2構成為陽極電解液與蝕刻工作液的混和交換中心。過程中由安裝在循環交換槽2上的檢測裝置78即氧化還原電位計來控制電解電源14的工作電流大小或關停。由蝕刻生產線1的檢測裝置77來控制液體流量調節控制器74將循環交換槽2的溶液泵回蝕刻生產線1中。The circulation exchange tank 2 and the etching production line 1 are connected through the overflow port 69 of the etching production line 1, the water-oil separator 42, the valve 89, the pump 116, and the pipeline of the solid-liquid separator 49 as a branch flow from the etching production line 1 to the circulation exchange tank 2 and through the valve 90, the liquid flow regulating controller 74, and the pipeline of the solid-liquid separator 50 as a pump to send the liquid from the circulation exchange tank 2 to the branch flow of the etching production line 1 to form a regenerated etching working liquid. The circulation reflux system of the circulation exchange tank 2 and the electrolytic tank 3 is formed by the valve 92 and the pipeline of the pump 118 as a branch flow from the circulation exchange tank 2 to the electrolytic tank anode area and the overflow port 70 of the electrolytic tank anode area, the overflow buffer tank 43, the valve 91, and the pipeline of the pump 111 as a branch flow from the electrolytic tank anode area to the circulation exchange tank 2 to form a circulation reflux system for the etching working liquid to be oxidized. The circulation exchange tank 2 constitutes the mixing and exchange center of the anode electrolyte and the etching working liquid. During the process, the working current of the electrolytic power source 14 is controlled or shut down by the detection device 78, i.e., the redox potentiometer, installed on the circulation exchange tank 2. The detection device 77 of the etching production line 1 controls the liquid flow regulating controller 74 to pump the solution of the circulation exchange tank 2 back to the etching production line 1.

隨著蝕刻生產進行要往蝕刻生產線1中投入蝕刻銅板,蝕刻生產線1需不斷投入再生蝕刻子液或外來鹽酸。根據循環交換槽2的工作液位來控制泵浦120的開啟關停將蝕刻生產線1所溢出的蝕刻廢液泵送到暫存槽27即蝕刻廢液暫存槽中暫儲。As the etching production proceeds, the etching copper plate needs to be put into the etching production line 1, and the etching production line 1 needs to continuously put in the regenerated etching liquid or external hydrochloric acid. According to the working liquid level of the circulation exchange tank 2, the pump 120 is controlled to start and stop to pump the etching waste liquid overflowed from the etching production line 1 to the temporary storage tank 27, i.e., the etching waste liquid temporary storage tank, for temporary storage.

為保證蝕刻工作液的溫度恒定,特在循環交換槽2中設置有溫度冷熱交換器66,使對加投入蝕刻生產線1的溶液溫度符合蝕刻製程要求。In order to ensure that the temperature of the etching working solution is constant, a temperature hot-cold exchanger 66 is provided in the circulation exchange tank 2 so that the temperature of the solution added to the etching production line 1 meets the requirements of the etching process.

電解槽3的電解槽陽極區的陽極電解液原為循環交換槽2中的溶液,電解槽陰極區的陰極電解液原為蝕刻廢液。在電解過程中陰極溶液作電化學反應使銅離子由原二價降價還原為一價亞銅離子並在陰極上電析出銅。通過檢測裝置79即比重計來控制加投蝕刻廢液到電解槽陰極區溶液中以維持陰極電解液中具有製程設定的含銅量,使陰極電解溢出液仍含有一定量的銅離子濃度留待與草酸反應進行化學取銅。電解槽陽極區逸出的氯氣通過電解槽蓋罩17上的排氣口155引流到射流吸氣裝置38將與循環交換槽2溶液作氣液混合用於氧化蝕刻工作液和蝕刻廢液。電解槽陰極區溶液析出氣體經排氣口156被引流到尾氣吸收液槽34作處理。The anodic electrolyte in the anode area of the electrolytic cell 3 is originally the solution in the circulating exchange tank 2, and the cathodic electrolyte in the cathode area of the electrolytic cell is originally the etching waste liquid. During the electrolysis process, the cathodic solution undergoes an electrochemical reaction to reduce the copper ions from the original divalent to monovalent cuprous ions and electrolyze copper on the cathode. The addition of etching waste liquid to the solution in the cathode area of the electrolytic cell is controlled by a detection device 79, i.e., a hydrometer, to maintain the copper content in the cathodic electrolyte set by the process, so that the cathode electrolysis overflow still contains a certain amount of copper ion concentration to be reacted with oxalic acid for chemical copper extraction. The chlorine gas released from the anode region of the electrolytic cell is led to the jet suction device 38 through the exhaust port 155 on the electrolytic cell cover 17 to mix with the solution in the circulation exchange tank 2 to be used as the oxidation etching working solution and etching waste solution. The gas released from the solution in the cathode region of the electrolytic cell is led to the tail gas absorption liquid tank 34 through the exhaust port 156 for treatment.

電解槽陰極區的溢流口71通過溢出緩衝槽44、閥門95、泵浦121、投料口145將溢出的陰極電解液泵送入暫存槽26即陰極電解溢出液氧化槽中。在暫存槽26的槽頂安裝連接有包含射流吸氣裝置39的電解槽陰極區氧化裝置用於吸收循環交換槽2所逸出的氣體對暫存槽26內的陰極溢出液進行氧化反應,在所述循環交換槽2中有未被吸收的氯氣時其被引至暫存槽26中用於氧化陰極電解液。通過閥門97、泵浦122、投料口148的管道將溶液泵送到反應槽19即本實施例的銅鹽提取反應槽。The overflow port 71 of the cathode region of the electrolytic cell pumps the overflowed cathode electrolyte into the temporary storage tank 26, i.e., the cathode electrolysis overflow liquid oxidation tank, through the overflow buffer tank 44, the valve 95, the pump 121, and the feeding port 145. The cathode region oxidation device of the electrolytic cell connected to the jet suction device 39 is installed on the tank top of the temporary storage tank 26 to absorb the gas escaping from the circulation exchange tank 2 to oxidize the cathode overflow liquid in the temporary storage tank 26. When there is unabsorbed chlorine in the circulation exchange tank 2, it is introduced into the temporary storage tank 26 to oxidize the cathode electrolyte. The solution is pumped to the reaction tank 19, i.e., the copper salt extraction reaction tank of the present embodiment, through the valve 97, the pump 122, and the pipeline of the feeding port 148.

反應槽19內裡安裝了檢測裝置81和82、葉輪攪拌器59。檢測裝置81為氧化還原電位計以檢測二價銅離子濃度,檢測裝置82為光電比色計和/或酸度計和/或比重計和/液位計以檢測其酸度和銅離子濃度和液位作控制。先將暫存槽26的槽內液體通過閥門97、泵浦122、投料口148的管道泵送入反應槽19中。通過檢測裝置81檢測反應槽19內溶液的二價銅離子的濃度含量,如未達標則投入氧化劑166(高氯酸鈉、高氯酸鉀、亞氯酸鈉、亞氯酸鉀、次氯酸鈉、氯酸鈉、過碳酸鈉的混合物和雙氧水,各成分配比為1:1:1:1:1:1:1:1)使溶液中的一價銅金屬離子作氧化。確保所述溶液的氧化還原電位不低於250mV後投入銅提取劑136草酸到反應槽19內溶液中,其投入量由檢測裝置81和/或82作設定控制。反應槽19中溶液在反應過程中生成沉澱物銅鹽141。反應完成後打開閥門100、泵浦126、固液分離器51的設備將酸性濾液經投料口149泵送到暫存槽28中,另沉澱物銅鹽141截留在固液分離器51中。The reaction tank 19 is equipped with detection devices 81 and 82 and an impeller agitator 59. The detection device 81 is a redox potentiometer to detect the concentration of divalent copper ions, and the detection device 82 is a photoelectric colorimeter and/or an acidity meter and/or a specific gravity meter and/or a liquid level meter to detect its acidity and copper ion concentration and liquid level for control. The liquid in the temporary tank 26 is first pumped into the reaction tank 19 through the valve 97, the pump 122, and the pipeline of the feeding port 148. The concentration of divalent copper ions in the solution in the reaction tank 19 is detected by the detection device 81. If the concentration does not meet the standard, an oxidant 166 (a mixture of sodium perchlorate, potassium perchlorate, sodium chlorite, potassium chlorite, sodium hypochlorite, sodium chlorate, sodium percarbonate and hydrogen peroxide, with the proportion of each component being 1:1:1:1:1:1:1:1) is added to oxidize the monovalent copper metal ions in the solution. After ensuring that the redox potential of the solution is not less than 250 mV, a copper extractant 136, oxalic acid, is added to the solution in the reaction tank 19, and the amount of the copper extractant 136 is set and controlled by the detection device 81 and/or 82. The solution in the reaction tank 19 generates a precipitate copper salt 141 during the reaction process. After the reaction is completed, the valve 100 , the pump 126 , and the solid-liquid separator 51 are opened to pump the acidic filtrate into the temporary storage tank 28 through the feed port 149 , while the precipitate copper salt 141 is retained in the solid-liquid separator 51 .

將暫存槽28的槽內溶液通過閥門102、泵浦128、投料口150的管道泵送到所述反應槽20中,其槽中安裝有檢測裝置84和葉輪攪拌器60,其中檢測裝置84為光電比色計或濁度計或酸度計,以檢測溶液的透光度或其酸度。反應槽20是專用於去除硫酸根雜質的反應槽,對反應槽20中溶液通過化驗員檢測其硫酸根的濃度,並經投料口151向反應槽20中投入等化學反應當量的所述去硫酸根雜質劑167與溶液中的硫酸鹽或硫酸發生化學反應生成硫酸鋇沉澱物。過程中通過檢測裝置84的檢測資料作參照控制。其含硫酸鋇沉澱物的溶液通過閥門103、泵浦129、固液分離器54的設備做固液分離處理。酸性濾液經投料口152被泵送到暫存槽29中,而硫酸鋇固體被截留在所述固液分離器54中。The solution in the temporary tank 28 is pumped into the reaction tank 20 through the valve 102, the pump 128, and the pipe of the feeding port 150. The detection device 84 and the impeller agitator 60 are installed in the tank, wherein the detection device 84 is a photoelectric colorimeter or a turbidity meter or an acidity meter to detect the light transmittance or acidity of the solution. The reaction tank 20 is a reaction tank dedicated to removing sulfate impurities. The concentration of sulfate in the solution in the reaction tank 20 is detected by the laboratory technician, and the desulfurization impurity agent 167 of the same chemical reaction equivalent is added into the reaction tank 20 through the feeding port 151 to react with the sulfate or sulfuric acid in the solution to generate barium sulfate precipitate. The detection data of the detection device 84 is used as a reference control during the process. The solution containing the barium sulfate precipitate is subjected to solid-liquid separation through the valve 103, the pump 129, and the solid-liquid separator 54. The acidic filtrate is pumped into the temporary storage tank 29 through the feed port 152, while the barium sulfate solid is retained in the solid-liquid separator 54.

暫存槽29中的溶液主要成分是鹽酸、氯化銅、氯化銨和氯化鈉的混合液。蝕刻生產線1的檢測裝置75通過閥門104、泵浦130、固液分離器55的管道控制泵浦130將暫存槽29中溶液作蝕刻子液泵送回線路板蝕刻生產線1中循環使用,暫存槽29設置溫度冷熱交換器67和排氣口163。另外,在生產製程需要時,檢測裝置75送出檢測資料對外來鹽酸向線路板蝕刻生產線1作加投控制。The solution in the temporary storage tank 29 is mainly composed of a mixture of hydrochloric acid, cupric chloride, ammonium chloride and sodium chloride. The detection device 75 of the etching production line 1 controls the pump 130 through the valve 104, the pump 130 and the pipeline of the solid-liquid separator 55 to pump the solution in the temporary storage tank 29 back to the circuit board etching production line 1 for recycling. The temporary storage tank 29 is provided with a temperature cold and hot exchanger 67 and an exhaust port 163. In addition, when the production process requires, the detection device 75 sends the detection data to control the addition of external hydrochloric acid to the circuit board etching production line 1.

所述的銅鹽141從打開的固液分離器51中取得並將其投入到銅鹽清洗槽139中。向銅鹽清洗槽139投入清水138作洗滌以除去銅鹽141中的鹽酸和氯鹽。清洗後經閥門101、泵浦127、固液分離器52的設備做固液分離處理,清洗廢液通過閥門105、投料口153引排到暫存槽30中暫儲,暫存槽30設有排氣口164。銅鹽142被截留在固液分離器52中。將所述銅鹽142再投入到銅鹽清洗槽140中通過清水138進行清洗,清洗液經閥門106、泵浦131的管道泵送至固液分離器53,在固液分離器53中作固液分離後得到較純淨的銅鹽143。The copper salt 141 is obtained from the opened solid-liquid separator 51 and put into the copper salt cleaning tank 139. Clean water 138 is put into the copper salt cleaning tank 139 for washing to remove hydrochloric acid and chlorine salt in the copper salt 141. After washing, the solid-liquid separation treatment is performed through the valve 101, the pump 127, and the equipment of the solid-liquid separator 52. The washing waste liquid is discharged to the temporary tank 30 through the valve 105 and the feeding port 153 for temporary storage. The temporary tank 30 is provided with an exhaust port 164. The copper salt 142 is trapped in the solid-liquid separator 52. The copper salt 142 is then put into the copper salt cleaning tank 140 and cleaned with clean water 138. The cleaning liquid is pumped to the solid-liquid separator 53 through the valve 106 and the pipeline of the pump 131. After solid-liquid separation in the solid-liquid separator 53, a relatively pure copper salt 143 is obtained.

打開固液分離器53取出產品銅鹽143得草酸銅,經固液分離器53後的濾液通過閥門107、投料口153的管道引排到暫存槽30。The solid-liquid separator 53 is opened to take out the copper salt product 143 to obtain copper oxalate. The filtered liquid after the solid-liquid separator 53 is discharged to the temporary storage tank 30 through the valve 107 and the pipeline of the feeding port 153.

在電解氧化回收循環再用過程中將多個槽上排氣口包括排氣口156~158,排氣口160~163中所排出的尾氣C均引到尾氣處理系統中處理,其中尾氣吸收液槽34中安裝有檢測裝置83,以控制鹼性物質的投入或更換槽液以保證尾氣被有效吸收,尾氣吸收液槽34內溶液通過閥門99、泵浦125、射流吸氣裝置40進行循環,尾氣吸收液槽34設有排氣口159。In the process of electrolytic oxidation recovery and recycling, the tail gas C discharged from multiple exhaust ports on the tank, including exhaust ports 156~158 and exhaust ports 160~163, is introduced into the tail gas treatment system for treatment, wherein a detection device 83 is installed in the tail gas absorption liquid tank 34 to control the input of alkaline substances or replace the tank liquid to ensure that the tail gas is effectively absorbed. The solution in the tail gas absorption liquid tank 34 is circulated through the valve 99, the pump 125, and the jet suction device 40, and the tail gas absorption liquid tank 34 is provided with an exhaust port 159.

本實施例中,蝕刻生產線1的出液管道上設置固液分離器49、入液管道上設置有固液分離器50,再生蝕刻子液的暫存槽29的入液管道設置固液分離器54、出液管道設置固液分離器55,固液分離器49~50以及固液分離器54~55作為過濾器,以去除蝕刻工作液或者蝕刻廢液中的固體雜質和有機污染物。進一步地,蝕刻廢液暫存槽、電解槽的入液管道和/或出液管道上也可以設置適用的過濾器。另外的固液分離器51~53用作銅鹽提取固液分離器。In this embodiment, a solid-liquid separator 49 is provided on the liquid outlet pipe of the etching production line 1, and a solid-liquid separator 50 is provided on the liquid inlet pipe. A solid-liquid separator 54 is provided on the liquid inlet pipe of the temporary storage tank 29 for regenerating the etching sub-liquid, and a solid-liquid separator 55 is provided on the liquid outlet pipe. The solid-liquid separators 49-50 and the solid-liquid separators 54-55 are used as filters to remove solid impurities and organic pollutants in the etching working liquid or the etching waste liquid. Furthermore, suitable filters can also be provided on the liquid inlet pipe and/or liquid outlet pipe of the etching waste liquid temporary storage tank and the electrolytic cell. The other solid-liquid separators 51-53 are used as copper salt extraction solid-liquid separators.

本實施例電解氧化再生設備系統的特點是:所述的陰極電解液是取自暫存槽27內的蝕刻廢液溶液,通過電解槽陰極區的檢測裝置79即比重計來控制泵浦124執行加投,蝕刻廢液經閥門98、泵浦124的管道進入電解槽陰極區。電解槽陰極區的陰極電解溢出液被引流到暫存槽26中跟氯氣作氧化反應。製程中通過控制其陰極電解液中的含銅量,實現既能通過電解回收取銅,又能使其溢出的陰極電解液中含有餘銅,可通過草酸的化學方法作收取。這是電解取銅和化學取銅相結合的典型製程。The characteristics of the electrolytic oxidation regeneration equipment system of this embodiment are: the cathode electrolyte is taken from the etching waste solution in the temporary tank 27, and the pump 124 is controlled to perform addition through the detection device 79, i.e., the hydrometer, in the cathode area of the electrolytic cell. The etching waste liquid enters the cathode area of the electrolytic cell through the valve 98 and the pipeline of the pump 124. The cathode electrolysis overflow liquid in the cathode area of the electrolytic cell is drained into the temporary tank 26 to react with chlorine for oxidation. In the process, by controlling the copper content in the cathode electrolyte, it is possible to recover copper through electrolysis and to make the overflowed cathode electrolyte contain residual copper, which can be collected by the chemical method of oxalic acid. This is a typical process that combines electrolytic copper extraction with chemical copper extraction.

一種適用於酸性氯化銅蝕刻廢液沉澱取銅電解再生回用的方法。步驟如下:A method for electrolyzing and regenerating copper from waste solution of acidic copper chloride etching. The steps are as follows:

1. 設置循環交換槽將蝕刻生產工作液與陽極電解液作交換混合,使蝕刻工作液通過電解槽作電化學氧化處理使其再生回用到蝕刻生產線上。1. Set up a circulating exchange tank to exchange and mix the etching production working solution with the anode electrolyte, so that the etching working solution passes through the electrolytic tank for electrochemical oxidation treatment and is regenerated and reused in the etching production line.

2. 設置酸性濾液除雜設備,投入去除硫酸根雜質劑將反應生成的不溶性硫酸鹽作去除,得到符合酸性氯化銅蝕刻技術品質要求的再生回用蝕刻子液。2. Set up acid filter liquid impurity removal equipment, add sulfate impurity removal agent to remove the insoluble sulfate generated by the reaction, and obtain regenerated and reused etching liquid that meets the quality requirements of acid copper chloride etching technology.

3. 設置帶濾網反應槽,將陰極溢出液通過管道泵送到帶濾網反應槽中,對槽中溶液調整氧化還原電位數值後按與溶液中銅離子反應所需量的10%向帶濾網反應槽中的溶液投入銅提取劑,使溶液發生化學反應生成銅鹽沉澱。3. Set up a filter-belt reaction tank, pump the cathode overflow liquid into the filter-belt reaction tank through a pipeline, adjust the redox potential value of the solution in the tank, and then add copper extractant to the solution in the filter-belt reaction tank at 10% of the amount required to react with the copper ions in the solution, so that the solution undergoes a chemical reaction to generate copper salt precipitation.

4. 設置固液分離器對帶濾網反應槽中的固液混合物作固液分離處理,得到酸性濾液和銅鹽。4. A solid-liquid separator is set up to perform solid-liquid separation on the solid-liquid mixture in the filter reaction tank to obtain acidic filter liquid and copper salt.

5. 設置清洗銅鹽設備,使銅鹽在清洗過程中去除氯鹽和/或鹽酸,生產製出符合品質要求的草酸銅。5. Set up copper salt cleaning equipment to remove chloride salt and/or hydrochloric acid during the cleaning process to produce copper oxalate that meets quality requirements.

實施例3Embodiment 3

如圖3所示,為本發明一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法及其裝置的其中一實施例。其包括有線路板蝕刻生產線1、循環交換槽2、電解槽3、暫存槽26即陰極電解液溢出液氧化槽、暫存槽27即蝕刻廢液暫存槽、暫存槽31即陰極溢出液化學反應暫存槽,帶濾網反應槽23~24、固液分離器49~53、檢測裝置75~88、閥門89~106、三通閥門115、泵浦116~134、銅提取劑136、清水138、去硫酸根雜質劑167。其中,電解槽分隔物169和170是陰離子交換膜,電解槽分隔物171和172為雙極膜。As shown in FIG3 , it is one embodiment of the present invention of a method and device for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid. It includes a circuit board etching production line 1, a circulation exchange tank 2, an electrolytic tank 3, a temporary storage tank 26, i.e., a cathode electrolyte overflow liquid oxidation tank, a temporary storage tank 27, i.e., an etching waste liquid temporary storage tank, a temporary storage tank 31, i.e., a cathode overflow liquid chemical reaction temporary storage tank, a filter reaction tank 23-24, a solid-liquid separator 49-53, a detection device 75-88, a valve 89-106, a three-way valve 115, a pump 116-134, a copper extractant 136, clean water 138, and a sulfate impurity removal agent 167. Among them, the electrolytic cell separators 169 and 170 are anion exchange membranes, and the electrolytic cell separators 171 and 172 are bipolar membranes.

線路板蝕刻生產線1內裝有三個檢測裝置75~77,依次是酸度計、比重計、氧化還原電位計。蝕刻工作液為酸性氯化銅蝕刻溶液,主要成分為鹽酸與氯化銅的混合液,其中還含有添加劑氯化鐵。其酸度為0.7莫耳/升,銅離子濃度130克/升,鐵離子濃度7克/升。The circuit board etching production line 1 is equipped with three detection devices 75-77, which are an acidity meter, a hydrometer, and a redox potentiometer. The etching working fluid is an acidic copper chloride etching solution, the main components of which are a mixture of hydrochloric acid and copper chloride, and which also contains an additive of ferric chloride. Its acidity is 0.7 mol/L, the copper ion concentration is 130 g/L, and the iron ion concentration is 7 g/L.

循環交換槽2與蝕刻生產線1通過蝕刻生產線溢流口69、溢出緩衝槽43、閥門89、泵浦116、固液分離器50的管道作從蝕刻生產線1液體流向循環交換槽2的支流和通過閥門90、液體流量調節控制器74、固液分離器49的管道作泵送循環交換槽2液體流向蝕刻生產線1的支流來形成蝕刻生產線1與循環交換槽2的液體循環回流系統;循環交換槽2與電解槽3的電解槽陽極區5和6通過閥門94、泵浦120的管道作從循環交換槽2液體流向電解槽陽極區5和6的支流和另通過電解槽陽極區5和6的陽極電解液溢流管15、溢出緩衝槽44、閥門95、泵浦121的管道作從電解槽陽極區5和6的液體流向循環交換槽2支流來形成兩槽溶液的循環回流系統。使循環交換槽2構成為陽極電解液與蝕刻工作液的液體混和交換中心。過程中由檢測裝置78即氧化還原電位計來控制電解電源14的輸出工作電流大小或關停,由檢測裝置77控制液體流量調節控制器74來執行將循環交換槽2溶液向蝕刻生產線1中的投送量。The circulation exchange tank 2 and the etching production line 1 are connected through the overflow port 69 of the etching production line, the overflow buffer tank 43, the valve 89, the pump 116, and the pipeline of the solid-liquid separator 50 as a branch flow from the etching production line 1 to the circulation exchange tank 2, and through the valve 90, the liquid flow regulating controller 74, and the pipeline of the solid-liquid separator 49 as a branch flow pumping the circulation exchange tank 2 to the etching production line 1 to form a liquid circulation between the etching production line 1 and the circulation exchange tank 2. Reflux system: The circulation exchange tank 2 and the electrolytic tank anode regions 5 and 6 of the electrolytic tank 3 are connected through valve 94 and pump 120 as a branch flow from the circulation exchange tank 2 to the electrolytic tank anode regions 5 and 6, and another branch flow from the electrolytic tank anode regions 5 and 6 to the circulation exchange tank 2 through the anode electrolyte overflow pipe 15, overflow buffer tank 44, valve 95, and pump 121. The circulation reflux system of the two tank solutions is formed. The circulation exchange tank 2 is used as a liquid mixing and exchange center for the anode electrolyte and the etching working solution. During the process, the output working current of the electrolytic power source 14 is controlled or shut down by the detection device 78, i.e., the redox potentiometer, and the liquid flow regulating controller 74 is controlled by the detection device 77 to execute the delivery amount of the solution of the circulating exchange tank 2 to the etching production line 1.

隨著蝕刻生產進行要往蝕刻生產線中投入蝕刻銅板,蝕刻生產線需不斷投入再生蝕刻子液或外來鹽酸或其混合液。循環交換槽2蝕刻工作液與陽極電解液的混合液其體積會不斷增大,當循環交換槽2液滿時通過控制泵浦117將循環交換槽2內的部分溶液(即蝕刻廢液與經過電解處理的陽極電解液的混合液)轉儲到暫存槽27中暫儲。As the etching production proceeds, the etching copper plate needs to be put into the etching production line, and the etching production line needs to continuously put in the regenerated etching solution or external hydrochloric acid or a mixture thereof. The volume of the mixed solution of the etching working solution and the anodic electrolyte in the circulating exchange tank 2 will continue to increase. When the circulating exchange tank 2 is full, the pump 117 is controlled to transfer part of the solution in the circulating exchange tank 2 (i.e., the mixed solution of the etching waste solution and the anodic electrolyte that has been electrolytically treated) to the temporary storage tank 27 for temporary storage.

為保證蝕刻工作液的溫度恒定,特在循環交換槽2中設置有溫度冷熱交換器66,使所加投入到蝕刻生產線的溶液溫度符合蝕刻製程要求。In order to ensure that the temperature of the etching working solution is constant, a temperature hot-cold exchanger 66 is provided in the circulation exchange tank 2 so that the temperature of the solution added to the etching production line meets the requirements of the etching process.

電解槽3因結構共有四張電解槽分隔物169至172將電解槽3和4分別分隔為兩個電解槽陽極區和一個電解槽陰極區,其中兩電解槽陽極區的槽盒又被電解槽陰極區所分隔。其陽極電解液原為循環交換槽2中的溶液,陰極電解液原為蝕刻廢液。在電解過程中陰極電解液作電化學反應使溶液中的銅離子由原二價銅離子降價還原為一價亞銅離子,原三價鐵離子降價為二價鐵離子。為避免進一步電解時使陰極上析出銅金屬,按實操經驗設定氧化電位控制值並通過電解槽陰極區的檢測裝置79即氧化還原電位計控制,通過連接在暫存槽26上的氧化劑固體加投裝置往暫存槽26中加投氧化劑166(氯酸鉀、高氯酸鈉、高氯酸鉀、亞氯酸鈉、亞氯酸鉀的混合物,混合比例1:1:1:1:1)使陰極電解液得到被氧化處理。同時,在暫存槽26頂部安裝射流吸氣裝置39作氣體引流的氣液混合裝置來吸收暫存槽2逸出的氯氣,利用氯氣對陰極電解液進行氧化,使陰極區溶液中維持陰極不電析出銅的製程條件正常工作。另外,通過電解槽陰極區7的檢測裝置87的酸度計控制泵浦127,使暫存槽27的蝕刻廢液經閥門101、泵浦127的管道加投到電解槽陰極區7,以確保陰極電解液的酸度符合製程要求。其中陰極電解溢出液通過溢流口70、溢出緩衝槽45作循環回流到暫存槽26中與氧化劑進行氧化反應,過程中受檢測裝置79監控。The electrolytic cell 3 has four electrolytic cell partitions 169 to 172 to separate the electrolytic cells 3 and 4 into two electrolytic cell anode areas and one electrolytic cell cathode area, respectively. The tank boxes of the two electrolytic cell anode areas are separated by the electrolytic cell cathode area. The anode electrolyte is originally the solution in the circulating exchange tank 2, and the cathode electrolyte is originally the etching waste liquid. During the electrolysis process, the cathode electrolyte undergoes an electrochemical reaction to reduce the copper ions in the solution from the original divalent cupric ions to monovalent cuprous ions, and the original trivalent iron ions to divalent iron ions. In order to avoid the precipitation of copper metal on the cathode during further electrolysis, the oxidation potential control value is set according to practical experience and controlled by the detection device 79, i.e., the redox potentiometer, in the cathode region of the electrolytic cell. The oxidant 166 (a mixture of potassium chlorate, sodium perchlorate, potassium perchlorate, sodium chlorite, and potassium chlorite, in a mixing ratio of 1:1:1:1:1) is added to the temporary storage tank 26 through the oxidant solid adding device connected to the temporary storage tank 26 to allow the cathode electrolyte to be oxidized. At the same time, a jet suction device 39 is installed on the top of the temporary tank 26 as a gas-liquid mixing device for gas drainage to absorb the chlorine gas escaping from the temporary tank 2, and the chlorine gas is used to oxidize the cathode electrolyte, so that the cathode solution in the cathode region maintains the process conditions of no copper electrolysis. In addition, the acidity meter of the detection device 87 of the cathode region 7 of the electrolytic cell controls the pump 127, so that the etching waste liquid of the temporary tank 27 is added to the cathode region 7 of the electrolytic cell through the valve 101 and the pipeline of the pump 127 to ensure that the acidity of the cathode electrolyte meets the process requirements. The cathode electrolysis overflow liquid circulates back through the overflow port 70 and the overflow buffer tank 45 to the temporary storage tank 26 to undergo oxidation reaction with the oxidant, and is monitored by the detection device 79 during the process.

電解槽陽極區5和6通過設置在電解槽蓋罩17上陽極電解液溢流管15將陽極電解液引流到溢出緩衝槽中44並通過泵浦121送到循環交換槽2中。溢出緩衝槽44上的排氣口155將陽極電解液逸出的氣體引流到射流吸氣裝置38將與循環交換槽2溶液作氣液混合。同時採取了將循環交換槽2的溶液通過閥門93、泵浦119泵送循環交換槽2溶液進入溢出緩衝槽44中吸收陽極電解液中的氯氣或氧氣。The anode areas 5 and 6 of the electrolytic cell drain the anode electrolyte into the overflow buffer tank 44 through the anode electrolyte overflow pipe 15 arranged on the electrolytic cell cover 17 and send it to the circulation exchange tank 2 through the pump 121. The exhaust port 155 on the overflow buffer tank 44 drains the gas escaping from the anode electrolyte to the jet suction device 38 to mix the gas and liquid with the solution of the circulation exchange tank 2. At the same time, the solution of the circulation exchange tank 2 is pumped into the overflow buffer tank 44 through the valve 93 and the pump 119 to absorb the chlorine or oxygen in the anode electrolyte.

在電解過程中需要往暫存槽26的陰極電解溢出液中投入氧化劑166,在累積加投氧化劑後,檢測裝置80的比重計檢測得到暫存槽26的溶液比重數值大於製程設定值時,則打開閥門99、泵浦125將暫存槽26的部分溶液作部分外排,其液位由暫存槽27蝕刻廢液通過泵浦127作補充,以稀釋陰極電解液的含鹽量。對暫存槽26中所外排的部分溶液引排入到暫存槽31即陰極溢出液化學反應暫存槽中處理。啟動葉輪攪拌器62並通過檢測裝置88即PH計的控制來加投氫氧化鈉179使暫存槽31中的反應液作中和反應並析出有沉澱物。暫存槽31內溶液經閥門106、泵浦135的管道進入固液分離器53,對暫存槽31中的固液混合物作分離,其濾渣氫氧化銅和氫氧化鐵被截留在固液分離器53中,其固體氫氧化鐵和氫氧化銅176經分離處理後將鐵化合物回用於蝕刻系統中;其濾液為氯化鈉溶液即廢鹽水178則作外排廢水處理。During the electrolysis process, an oxidant 166 needs to be added to the cathode electrolysis overflow liquid in the temporary storage tank 26. After the oxidant is added cumulatively, when the specific gravity value of the solution in the temporary storage tank 26 detected by the hydrometer of the detection device 80 is greater than the process setting value, the valve 99 is opened and the pump 125 is used to partially discharge part of the solution in the temporary storage tank 26. The liquid level is supplemented by the etching waste liquid in the temporary storage tank 27 through the pump 127 to dilute the salt content of the cathode electrolyte. The part of the solution discharged from the temporary storage tank 26 is introduced into the temporary storage tank 31, i.e., the cathode overflow liquid chemical reaction temporary storage tank for treatment. The impeller agitator 62 is started and sodium hydroxide 179 is added through the control of the detection device 88, i.e., the pH meter, to neutralize the reaction solution in the temporary storage tank 31 and precipitate the precipitate. The solution in the temporary storage tank 31 enters the solid-liquid separator 53 through the valve 106 and the pipeline of the pump 135 to separate the solid-liquid mixture in the temporary storage tank 31. The filter residue copper hydroxide and iron hydroxide are retained in the solid-liquid separator 53. The solid iron hydroxide and copper hydroxide 176 are separated and the iron compound is reused in the etching system; the filter liquid is a sodium chloride solution, i.e., waste brine 178, which is discharged as waste water.

將暫存槽27的槽內蝕刻廢液通過閥門102、泵浦128的管道泵送入帶濾網反應槽23中。帶濾網反應槽23內裡安裝了檢測裝置81和82、葉輪攪拌器61。檢測裝置81為氧化還原電位計以檢測二價銅離子濃度。檢測裝置82為光電比色計和/或酸度計和/或比重計和/或氧化還原電位計和液位計以檢測其酸度、銅離子濃度以及液位。通過檢測裝置81檢測溶液的二價銅離子的濃度含量,如未達標則投入氧化劑166至帶濾網反應槽23使其溶液中的銅金屬離子氧化為二價銅離子,令所述溶液的氧化還原電位不低於250mV。達標後投入銅提取劑136到溶液中,其投入量由檢測人員或根據檢測裝置82的設定數值作控制。帶濾網反應槽23中溶液在反應過程中生成沉澱物銅鹽141,通過三通閥門115、泵浦129、固液分離器51的管道設備將酸性濾液泵送到暫存槽28中,而沉澱物銅鹽141被截留在帶濾網反應槽23裡面,並有少許銅鹽也被截留在固液分離器51中。The etching waste liquid in the temporary tank 27 is pumped into the filter-belt reaction tank 23 through the valve 102 and the pipeline of the pump 128. The filter-belt reaction tank 23 is equipped with detection devices 81 and 82 and an impeller agitator 61. The detection device 81 is a redox potentiometer to detect the concentration of divalent copper ions. The detection device 82 is a photoelectric colorimeter and/or an acidity meter and/or a hydrometer and/or a redox potentiometer and a liquid level meter to detect its acidity, copper ion concentration and liquid level. The concentration of divalent copper ions in the solution is detected by the detection device 81. If it does not meet the standard, the oxidant 166 is added to the filter reaction tank 23 to oxidize the copper metal ions in the solution into divalent copper ions, so that the redox potential of the solution is not less than 250mV. After meeting the standard, the copper extractant 136 is added to the solution, and the amount of the copper extractant 136 is controlled by the detection personnel or according to the set value of the detection device 82. The solution in the filter screen reaction tank 23 generates a precipitate copper salt 141 during the reaction process. The acidic filter liquid is pumped to the temporary storage tank 28 through the three-way valve 115, the pump 129, and the pipeline equipment of the solid-liquid separator 51. The precipitate copper salt 141 is retained in the filter screen reaction tank 23, and a small amount of copper salt is also retained in the solid-liquid separator 51.

將暫存槽28的槽內溶液通過閥門103、泵浦130的管道泵送到帶濾網反應槽24中,其槽中安裝有檢測裝置83和葉輪攪拌器60,其中檢測裝置83是一光電比色計或濁度計或酸度計,以檢測溶液的透光度或酸度。帶濾網反應槽24是專用於去除硫酸根雜質的反應槽。向帶濾網反應槽24中投入去硫酸根雜質劑167氯化鋇與溶液中的可溶性硫酸鹽或硫酸作反應生成硫酸鋇沉澱物。其含硫酸鋇沉澱物的溶液通過閥門104、泵浦131的管道將酸性溶液被泵送到暫存槽29中,而硫酸鋇固體則被截留在帶濾網反應槽24中。The solution in the temporary tank 28 is pumped to the filter-belt reaction tank 24 through the valve 103 and the pipeline of the pump 130. The detection device 83 and the impeller agitator 60 are installed in the tank. The detection device 83 is a photoelectric colorimeter or a turbidity meter or an acidity meter to detect the transmittance or acidity of the solution. The filter-belt reaction tank 24 is a reaction tank dedicated to removing sulfate impurities. The sulfate-belt impurity removal agent 167 barium chloride is added to the filter-belt reaction tank 24 to react with the soluble sulfate or sulfuric acid in the solution to generate a barium sulfate precipitate. The solution containing the barium sulfate precipitate is pumped into the temporary storage tank 29 through the valve 104 and the pipeline of the pump 131, while the barium sulfate solid is retained in the filter reaction tank 24.

暫存槽29中的溶液主要成分是鹽酸、氯化鐵、氯化亞鐵和少量氯化銅的混合液。蝕刻生產線1內檢測裝置75通過閥門105、泵浦132、固液分離器52的管道控制泵浦132將暫存槽29中溶液作蝕刻子液泵送回線路板蝕刻生產線1中作循環使用。另外,在製程控制需要時,檢測裝置75送出檢測資料使用外來鹽酸或鹽酸與添加劑的混合液加投到線路板蝕刻生產線1中作補充使用。The solution in the temporary storage tank 29 is mainly composed of a mixture of hydrochloric acid, ferric chloride, ferrous chloride and a small amount of cupric chloride. The detection device 75 in the etching production line 1 controls the pump 132 through the valve 105, the pump 132 and the pipeline of the solid-liquid separator 52 to pump the solution in the temporary storage tank 29 back to the circuit board etching production line 1 for circulation. In addition, when the process control requires, the detection device 75 sends the detection data to add external hydrochloric acid or a mixture of hydrochloric acid and additives to the circuit board etching production line 1 for supplementary use.

銅鹽141仍暫留在帶濾網反應槽23中,通過三通閥門115選擇關閉向泵浦129的通道。啟動攪拌器61向帶濾網反應槽23中加投稀鹽酸137作清洗,酸洗完畢後打開三通閥門115將帶濾網反應槽23中的清洗廢液排向暫存槽30中待處理。隨後關閉三通閥門115將清水138再次加入到帶濾網反應槽23中用清水洗銅鹽得到草酸銅,清洗完成後繼續打開三通閥門115將洗滌廢水排往暫存槽30中。The copper salt 141 is still temporarily retained in the belt filter reaction tank 23, and the passage to the pump 129 is closed through the three-way valve 115. The agitator 61 is started to add dilute hydrochloric acid 137 to the belt filter reaction tank 23 for cleaning. After the acid cleaning is completed, the three-way valve 115 is opened to discharge the cleaning waste liquid in the belt filter reaction tank 23 to the temporary storage tank 30 for treatment. Then the three-way valve 115 is closed and clean water 138 is added to the belt filter reaction tank 23 again to wash the copper salt with clean water to obtain copper oxalate. After the cleaning is completed, the three-way valve 115 is continued to be opened to discharge the washing waste water to the temporary storage tank 30.

清洗完畢後打開帶濾網反應槽23中的槽蓋取出產品銅鹽141。After cleaning, the tank cover in the filter reaction tank 23 is opened to take out the copper salt product 141.

尾氣吸收液槽34與噴淋裝置37和尾氣吸收液槽35與射流吸氣裝置40組成相串聯的尾氣處理系統,對多個槽中所排出的尾氣C作吸收處理。其中檢測裝置84和85的pH計用於提示更換槽液,使尾氣吸收液槽35正常工作。The tail gas absorption liquid tank 34 and the spray device 37 and the tail gas absorption liquid tank 35 and the jet suction device 40 form a series-connected tail gas treatment system to absorb the tail gas C discharged from multiple tanks. The pH meters of the detection devices 84 and 85 are used to prompt the replacement of the tank liquid so that the tail gas absorption liquid tank 35 can work normally.

本實施例電解氧化再生設備系統的特點是:陰極電解液取自循環交換槽2中的溶液,檢測裝置79為ORP計按實操經驗設定氧化還原電位控制值來控制加投外來的氧化劑166使陰極電解液符合陰極不電析出金屬銅的製程要求,即製程可以根據電解機結構特意設計為只作陽極電解液氧化而控制陰極不電析出銅金屬。使用這類結構的電解機能降低槽壓減少電解氧化耗能。檢測裝置87是一個比重計或酸度計,優選為酸度計。對酸度計在設定製程控制值後當溶液降低達到設定值時則泵浦127啟動將暫存槽27中蝕刻廢液加投到電解槽陰極區中補充酸液,使電解機正常工作。The characteristics of the electrolytic oxidation regeneration equipment system of this embodiment are: the cathode electrolyte is taken from the solution in the circulation exchange tank 2, and the detection device 79 is an ORP meter that sets the redox potential control value according to practical experience to control the addition of external oxidant 166 so that the cathode electrolyte meets the process requirement that the cathode does not electrolyze copper metal, that is, the process can be specially designed according to the structure of the electrolytic machine to only oxidize the anode electrolyte and control the cathode not to electrolyze copper metal. The use of an electrolytic machine with this type of structure can reduce the cell pressure and reduce the energy consumption of electrolytic oxidation. The detection device 87 is a hydrometer or an acidometer, preferably an acidometer. After the process control value is set for the acidity meter, when the solution drops to the set value, the pump 127 is started to add the etching waste liquid in the temporary tank 27 to the cathode area of the electrolytic cell to replenish the acid solution, so that the electrolyzer can work normally.

本實施例是僅運用化學反應方法製得銅鹽作回收銅產品,過程中沒有使蝕刻廢液產有增量。This embodiment uses only a chemical reaction method to produce copper salt as a recovered copper product, and the etching waste liquid production is not increased during the process.

一種適用於酸性氯化銅蝕刻廢液沉澱取銅電解再生方法。步驟如下:A method for electrolytic regeneration of copper from waste solution of acidic copper chloride etching by precipitation. The steps are as follows:

1. 設置循環交換槽將蝕刻工作液與陽極電解液作混合交換,使蝕刻工作液在循環回用蝕刻生產過程中其銅離子濃度和氧化還原電位均得到穩定控制。1. A circulating exchange tank is set up to mix and exchange the etching working solution with the anode electrolyte, so that the copper ion concentration and redox potential of the etching working solution can be stably controlled during the recycling etching production process.

2. 設置帶濾網反應槽將經氧化的蝕刻廢液泵送到帶濾網反應槽中,通過對溶液檢測或調整氧化還原電位數值後按與溶液中銅離子反應所需量的40%向反應槽中的溶液投入銅提取劑,使溶液發生化學反應析出銅鹽沉澱。帶濾網反應槽中自帶有濾網或濾布,可作為銅鹽提取固液分離器對槽中的固液混合物作固液分離處理,得到酸性濾液和銅鹽。2. Set up a filter-belt reaction tank to pump the oxidized etching waste liquid into the filter-belt reaction tank. After detecting the solution or adjusting the redox potential value, add 40% of the copper extractant required to react with the copper ions in the solution into the solution in the reaction tank to make the solution undergo a chemical reaction to precipitate copper salt. The filter-belt reaction tank is equipped with a filter or filter cloth, which can be used as a copper salt extraction solid-liquid separator to perform solid-liquid separation on the solid-liquid mixture in the tank to obtain acidic filter liquid and copper salt.

3. 設置酸性濾液除雜設備,投入去除硫酸根雜質劑使溶液反應生成不溶性硫酸鹽作雜質去除,得到符合酸性氯化銅蝕刻製程技術要求的再生蝕刻子液。3. Set up acidic filter liquid impurity removal equipment, add sulfate impurity removal agent to make the solution react to generate insoluble sulfate for impurity removal, and obtain regenerated etching liquid that meets the technical requirements of acid copper chloride etching process.

4. 設置清洗銅鹽設備,使銅鹽在清洗過程中去除氯鹽和/或鹽酸,生產製出符合品質要求的草酸銅產品。4. Set up copper salt cleaning equipment to remove chloride salt and/or hydrochloric acid during the cleaning process and produce copper oxalate products that meet quality requirements.

實施例4Embodiment 4

如圖4所示,為本發明一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法及其裝置的實施例。其包括有線路板蝕刻生產線1、循環交換槽2、電解槽3、暫存槽26~32、反應槽19~21、固液分離器49~55、檢測裝置75~87、銅鹽清洗槽139~140、閥門89~111、泵浦116~133、銅提取劑136、清水138、去硫酸根雜質劑167、自動檢測投料控制器168。其中,電解槽分隔物169為反滲透膜。As shown in FIG4 , an embodiment of the present invention is a method and device for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid. It includes a circuit board etching production line 1, a circulation exchange tank 2, an electrolytic tank 3, temporary tanks 26-32, reaction tanks 19-21, solid-liquid separators 49-55, detection devices 75-87, copper salt cleaning tanks 139-140, valves 89-111, pumps 116-133, copper extractants 136, clean water 138, sulfate impurity removal agents 167, and automatic detection and feeding controllers 168. Among them, the electrolytic tank separator 169 is a reverse osmosis membrane.

線路板的蝕刻生產線1內裝有三個檢測裝置75~77,依次是酸度計、比重計、氧化還原電位計,蝕刻工作液為酸性氯化銅蝕刻溶液,為主要包含鹽酸、氯化銅和氯化鐵的混合液。酸度為1.0莫耳/升,銅離子濃度120克/升,鐵離子濃度40克/升。The etching production line 1 of the circuit board is equipped with three detection devices 75-77, which are an acidity meter, a hydrometer, and a redox potentiometer. The etching working fluid is an acidic copper chloride etching solution, which is a mixture of mainly hydrochloric acid, copper chloride and ferric chloride. The acidity is 1.0 mol/L, the copper ion concentration is 120 g/L, and the iron ion concentration is 40 g/L.

循環交換槽2與蝕刻生產線1通過蝕刻生產線1的溢流口69、溢出緩衝槽43、閥門89、泵浦116、固液分離器49的管道作從蝕刻生產線1液體流向循環交換槽2,而另一支流通過閥門91、液體流量調節控制器73、固液分離器50的管道將循環交換槽2的液體泵向蝕刻生產線1中使兩條支流形成一個液體的循環回流系統;循環交換槽2與電解槽3的電解槽陽極區5通過閥門94、泵浦120的管道作從循環交換槽2液體流向電解槽陽極區5的支流和另一通過電解槽陽極區5的溢流口70、溢出緩衝槽44、閥門90、泵浦117的管道作從電解陽極區5的液體流向循環交換槽2支流合併形成液體的循環回流系統。使循環交換槽2構成為陽極電解液與蝕刻工作液的混和交換中心。控制系統採用PLC的自動檢測投料控制器168作資料處理控制,過程中以檢測裝置78即氧化還原電位計的檢測資料處理來控制電解電源14的工作電流大小或關停,取檢測裝置77即氧化還原電位計的資料控制液體流量調節控制器73自循環交換槽2向蝕刻生產線1的溶液加投量。檢測裝置75的酸度計是控制加投再生蝕刻子液或外來鹽酸。檢測裝置76的比重計是控制向蝕刻生產線1加投清水。The circulation exchange tank 2 and the etching production line 1 are connected through the overflow port 69 of the etching production line 1, the overflow buffer tank 43, the valve 89, the pump 116, and the pipeline of the solid-liquid separator 49. The liquid from the etching production line 1 flows to the circulation exchange tank 2, and the other branch flows through the valve 91, the liquid flow control controller 73, and the pipeline of the solid-liquid separator 50 to pump the liquid from the circulation exchange tank 2 to the etching production line 1 so that the two branches form a liquid. The circulation exchange tank 2 and the electrolytic tank anode area 5 of the electrolytic tank 3 are connected through a pipeline of valve 94 and pump 120 as a branch flow from the circulation exchange tank 2 to the electrolytic tank anode area 5, and another branch flow from the electrolytic anode area 5 to the circulation exchange tank 2 is combined through an overflow port 70, an overflow buffer tank 44, a valve 90, and a pump 117 of the electrolytic tank anode area 5 to form a circulation reflux system of the liquid. The circulation exchange tank 2 is formed as a mixing and exchange center for the anode electrolyte and the etching working liquid. The control system uses the automatic detection and feeding controller 168 of PLC for data processing control. During the process, the detection data of the detection device 78, i.e., the redox potentiometer, is used to control the working current size or shut down of the electrolytic power source 14. The data of the detection device 77, i.e., the redox potentiometer, is used to control the amount of solution added from the circulation exchange tank 2 to the etching production line 1 by the liquid flow regulating controller 73. The acidity meter of the detection device 75 controls the addition of regenerated etching liquid or external hydrochloric acid. The hydrometer of the detection device 76 controls the addition of clean water to the etching production line 1.

隨著蝕刻生產進行需往蝕刻生產線1中投入蝕刻銅板,蝕刻生產線1需不斷投入再生蝕刻子液或外來鹽酸或其它液體。蝕刻生產線1所溢出的蝕刻廢液是根據循環交換槽2的液位將通過泵浦116開啟泵送到循環交換槽2中或通過泵浦118泵送到蝕刻廢液的暫存槽26中暫儲。As the etching production proceeds, the etching copper plate needs to be put into the etching production line 1, and the etching production line 1 needs to continuously put in the regenerated etching liquid or external hydrochloric acid or other liquid. The etching waste liquid overflowed from the etching production line 1 is pumped into the circulation exchange tank 2 by the pump 116 according to the liquid level of the circulation exchange tank 2, or is pumped into the temporary storage tank 26 of the etching waste liquid by the pump 118 for temporary storage.

為保證蝕刻工作液的溫度恒定,特在循環交換槽2中設置有溫度冷熱交換器66,使加投入蝕刻生產線中的溶液溫度符合蝕刻製程要求。In order to ensure that the temperature of the etching working solution is constant, a temperature hot-cold exchanger 66 is provided in the circulation exchange tank 2 so that the temperature of the solution added to the etching production line meets the requirements of the etching process.

電解槽3因結構電解槽分隔物169將電解槽分有電解槽陽極區5和電解槽陰極區7,其陽極電解液為從循環交換槽2中泵進的溶液,陰極電解液為鹽酸和氯化鈉的混合液(鹽酸10%、氯化鈉5%)。在電解過程中根據電解槽分隔物169性質主要發生水的電解,其陽極電解液主要發生二價鐵被氧化為三價鐵的氧化反應,電解槽陽極區所析出的氣體分別有氯氣和氧氣的氧化性氣體。陰極電解液作電化學反應析出氫氣。將所析出氫氣通過氫氣外排系統174和阻火器175直接外排。為避免電解槽陰極區7在電解過程中出現缺少電解液,通過電解槽陰極區的檢測裝置79即液位元計控制加投清水138來維持陰極正常的電化學反應。電解槽陽極區5溢出的氣體通過電解槽蓋罩17上的排氣口156和溢出緩衝槽44所逸出的氣體一起被引流到射流吸氣裝置38將與反應槽21中溶液作氣液混合被再生蝕刻子液反應吸收。The electrolytic cell 3 is divided into an electrolytic cell anode area 5 and an electrolytic cell cathode area 7 by a structural electrolytic cell partition 169. The anode electrolyte is a solution pumped in from the circulation exchange tank 2, and the cathode electrolyte is a mixture of hydrochloric acid and sodium chloride (10% hydrochloric acid, 5% sodium chloride). During the electrolysis process, water is mainly electrolyzed according to the properties of the electrolytic cell partition 169, and the anode electrolyte mainly undergoes an oxidation reaction in which divalent iron is oxidized to trivalent iron. The gases released from the anode area of the electrolytic cell are oxidizing gases of chlorine and oxygen. The cathode electrolyte undergoes an electrochemical reaction to release hydrogen. The released hydrogen is directly discharged through the hydrogen exhaust system 174 and the flame arrester 175. In order to avoid the lack of electrolyte in the cathode region 7 of the electrolytic cell during the electrolysis process, the detection device 79 of the cathode region of the electrolytic cell, i.e., the liquid level meter, controls the addition of clean water 138 to maintain the normal electrochemical reaction of the cathode. The gas overflowing from the anode region 5 of the electrolytic cell is guided to the jet suction device 38 through the exhaust port 156 on the electrolytic cell cover 17 and the gas escaping from the overflow buffer tank 44 to mix with the solution in the reaction tank 21 to be absorbed by the regenerated etching sub-liquid reaction.

電解槽陰極區的溢流口71的閥門95作關閉。暫存槽26的蝕刻廢液中安裝檢測裝置80即氧化還原電位計用來顯示蝕刻廢液該製程參數。生產需要時打開閥門97、通過閥門111、泵浦123的管道將溶液泵送到反應槽19中。The valve 95 of the overflow port 71 of the cathode region of the electrolytic cell is closed. A detection device 80, namely a redox potentiometer, is installed in the etching waste liquid in the temporary tank 26 to display the process parameters of the etching waste liquid. When production needs it, the valve 97 is opened and the solution is pumped into the reaction tank 19 through the valve 111 and the pipeline of the pump 123.

反應槽19內裡安裝了檢測裝置81~82、葉輪攪拌器59。檢測裝置81為氧化還原電位計以檢測二價銅離子濃度。檢測裝置82為光電比色計和/或酸度計和/或比重計和/或氧化還原電位計和液位計以檢測其酸度、銅離子濃度以及液位以作控制。將暫存槽26的蝕刻廢液泵送入反應槽19後開啟葉輪攪拌器59。通過檢測裝置81檢測溶液的二價銅離子的濃度含量,如未達標則投入氧化劑166(氯氣和氧氣,混合比例5:1)使溶液中的銅金屬離子氧化,令所述溶液的氧化還原電位不低於250mV。達標後投入銅提取劑136到溶液中,其投入量由檢測裝置82的檢測資料送往自動檢測投料控制器168中處理作設定值控制。反應槽19作為銅鹽提取反應槽,其中溶液在反應過程中生成沉澱物銅鹽141,固液分離器51作銅鹽提取固液分離器,檢測裝置82的檢測值達標反應完成後通過閥門101、泵浦125、固液分離器51的管道設備作固液分離並將酸性濾液泵送到暫存槽28中,其沉澱物銅鹽141截留在固液分離器51中。The reaction tank 19 is equipped with detection devices 81-82 and an impeller agitator 59. The detection device 81 is a redox potentiometer to detect the concentration of divalent copper ions. The detection device 82 is a photoelectric colorimeter and/or an acidity meter and/or a specific gravity meter and/or a redox potentiometer and a liquid level meter to detect its acidity, copper ion concentration and liquid level for control. The impeller agitator 59 is turned on after the etching waste liquid from the temporary tank 26 is pumped into the reaction tank 19. The concentration of divalent copper ions in the solution is detected by the detection device 81. If it does not meet the standard, the oxidant 166 (chlorine and oxygen, mixed in a ratio of 5:1) is added to oxidize the copper metal ions in the solution so that the redox potential of the solution is not less than 250mV. After meeting the standard, the copper extractant 136 is added to the solution, and the amount of the copper extractant 136 is sent to the automatic detection and feeding controller 168 for processing and setting value control based on the detection data of the detection device 82. The reaction tank 19 is used as a copper salt extraction reaction tank, wherein the solution generates a precipitate copper salt 141 during the reaction process, and the solid-liquid separator 51 is used as a copper salt extraction solid-liquid separator. After the detection value of the detection device 82 reaches the standard, the solid-liquid separation is performed through the valve 101, the pump 125, and the pipeline equipment of the solid-liquid separator 51 after the reaction is completed, and the acidic filter liquid is pumped into the temporary tank 28, and the precipitate copper salt 141 is retained in the solid-liquid separator 51.

將暫存槽28中的溶液通過閥門102、泵浦128的管道泵送到反應槽20中,反應槽20中安裝有檢測裝置83和葉輪攪拌器60,其中檢測裝置83是一酸度計或光電比色計或濁度計和液位計,以檢測溶液的酸度或透光度以及液位。反應槽20是專用於去除硫酸根雜質的反應槽,啟動葉輪攪拌器60和向反應槽中投入去除硫酸根雜質劑167即氫氧化鋇與溶液中的可溶性硫酸鹽或硫酸反應生成硫酸鋇沉澱物。在檢測裝置83達標後將其含硫酸鋇沉澱物的溶液通過閥門103、泵浦129、固液分離器52的管道設備中做固液分離處理。酸性濾液被泵送到暫存槽29中,而硫酸鋇固體被截留在固液分離器52中。The solution in the temporary tank 28 is pumped into the reaction tank 20 through the valve 102 and the pipeline of the pump 128. The detection device 83 and the impeller agitator 60 are installed in the reaction tank 20. The detection device 83 is an acidity meter or a photoelectric colorimeter or a turbidity meter and a liquid level meter to detect the acidity or transmittance of the solution and the liquid level. The reaction tank 20 is a reaction tank dedicated to removing sulfate impurities. The impeller agitator 60 is started and the sulfate impurity removal agent 167, i.e., barium hydroxide, is added into the reaction tank to react with the soluble sulfate or sulfuric acid in the solution to generate a barium sulfate precipitate. After the detection device 83 reaches the standard, the solution containing the barium sulfate precipitate is subjected to solid-liquid separation through the pipeline equipment of the valve 103, the pump 129, and the solid-liquid separator 52. The acidic filtrate is pumped to the temporary tank 29, and the barium sulfate solid is retained in the solid-liquid separator 52.

為使再生蝕刻子液更適合作蝕刻再生子液使用,將暫存槽29中的溶液通過閥門104、泵浦130泵送到反應槽21與氧化劑166氯氣和氧氣作氧化反應。反應槽21內安裝有檢測裝置84和葉輪攪拌器62,其檢測裝置84為氧化還原電位計和液位計,槽蓋頂安裝有射流吸氣裝置38,將循環交換槽2所逸出的氣體以及電解槽陽極區5、緩衝槽44逸出的氣體一起引入到反應槽21中與溶液作氧化反應,以提高其三氯化鐵的濃度含量。當檢測裝置84達到製程設定後,通過閥門105、泵浦131和固液分離器53作固液分離處理,將已氧化處理的再生蝕刻子液泵送到暫存槽30中暫存,雜質固體被截留在固液分離器53中。In order to make the regenerated etching liquid more suitable for use as etching regenerated liquid, the solution in the temporary tank 29 is pumped to the reaction tank 21 through the valve 104 and the pump 130 to react with the oxidant 166 chlorine and oxygen for oxidation. The reaction tank 21 is equipped with a detection device 84 and an impeller agitator 62. The detection device 84 is a redox potentiometer and a liquid level gauge. The top of the tank cover is equipped with a jet suction device 38 to introduce the gas escaping from the circulation exchange tank 2 and the gas escaping from the anode area 5 and the buffer tank 44 of the electrolytic cell into the reaction tank 21 to react with the solution for oxidation to increase the concentration of ferric chloride. When the detection device 84 reaches the process setting, solid-liquid separation is performed through the valve 105, the pump 131 and the solid-liquid separator 53, and the regenerated etching liquid that has been oxidized is pumped to the temporary storage tank 30 for temporary storage, and the impurity solids are trapped in the solid-liquid separator 53.

暫存槽30中的溶液主要成分是鹽酸和氯化鐵的混合液。通過對蝕刻生產線內檢測裝置75的資料處理,自動檢測投料控制器168打開閥門106、液體流量調節控制器74將暫存槽30中溶液作蝕刻子液泵送回線路板蝕刻生產線1中作循環使用。另根據生產需要可向蝕刻生產線1加投外來鹽酸。The solution in the temporary storage tank 30 is mainly composed of a mixture of hydrochloric acid and ferric chloride. By processing the data of the detection device 75 in the etching production line, the automatic detection feed controller 168 opens the valve 106, and the liquid flow control controller 74 pumps the solution in the temporary storage tank 30 as an etching liquid back to the circuit board etching production line 1 for circulation. In addition, external hydrochloric acid can be added to the etching production line 1 according to production needs.

銅鹽141從固液分離器51中打開取得並將其投入到銅鹽清洗槽139中。銅鹽清洗槽139內檢測裝置85為PH計和液位計,向銅鹽清洗槽139投入清水138作洗滌以除去銅鹽141中的鹽酸和氯鹽。清洗後經閥門107、泵浦126、固液分離器54的管道設備做固液分離處理,清洗廢液通過管道引排到暫存槽31中暫儲。銅鹽142被截留在固液分離器54中。The copper salt 141 is opened and taken out from the solid-liquid separator 51 and put into the copper salt cleaning tank 139. The detection device 85 in the copper salt cleaning tank 139 is a pH meter and a liquid level meter. Clean water 138 is put into the copper salt cleaning tank 139 for washing to remove hydrochloric acid and chlorine salt in the copper salt 141. After washing, the solid-liquid separation treatment is performed through the valve 107, the pump 126, and the pipeline equipment of the solid-liquid separator 54. The washing waste liquid is discharged through the pipeline to the temporary storage tank 31 for temporary storage. The copper salt 142 is trapped in the solid-liquid separator 54.

將固液分離器54打開取出銅鹽142投入到銅鹽清洗槽140中,銅鹽清洗槽140槽中的檢測裝置86為PH計和液位計。投入清水138第二次清洗銅鹽,清洗完成後自動檢測投料控制器168打開閥門108和啟動泵浦127通過固液分離器55進行固液分離處理。清洗廢液被引流到暫存槽31暫儲,而銅鹽143被截留在固液分離器55中。打開固液分離器55取出銅鹽143即草酸銅放置於暫存槽32中。The solid-liquid separator 54 is opened to take out the copper salt 142 and put it into the copper salt cleaning tank 140. The detection device 86 in the copper salt cleaning tank 140 is a pH meter and a liquid level meter. Clean water 138 is added to clean the copper salt for the second time. After the cleaning is completed, the automatic detection feeding controller 168 opens the valve 108 and starts the pump 127 to perform solid-liquid separation through the solid-liquid separator 55. The cleaning waste liquid is drained to the temporary storage tank 31 for temporary storage, while the copper salt 143 is retained in the solid-liquid separator 55. The solid-liquid separator 55 is opened to take out the copper salt 143, i.e., copper oxalate, and place it in the temporary storage tank 32.

本電解氧化回收循環再用的設備系統中將多個槽上排氣口所排出的尾氣C均引到尾氣處理系統中處理,其中尾氣吸收液槽34中安裝有檢測裝置,以控制鹼性物質的投入或更換槽液。In the electrolytic oxidation recovery and recycling equipment system, the tail gas C discharged from the exhaust ports on multiple tanks is introduced into the tail gas treatment system for treatment, wherein a detection device is installed in the tail gas absorption liquid tank 34 to control the input of alkaline substances or replace the tank liquid.

本實施例電解氧化再生設備系統的特點是:陰極電解液採用鹽酸和氯化鈉的混合液,過程中通過檢測裝置79即液位元計作加投清水138補充液位。因陰極電解液不含有銅離子故陰極只作電解水的電化學反應而析出氫氣。對所析出的氫氣通過收集後作高空排放。The characteristics of the electrolytic oxidation regeneration equipment system of this embodiment are: the cathode electrolyte adopts a mixed solution of hydrochloric acid and sodium chloride, and the liquid level is supplemented by adding clean water 138 through the detection device 79, i.e., the liquid level meter. Since the cathode electrolyte does not contain copper ions, the cathode only performs an electrochemical reaction of electrolyzing water to precipitate hydrogen. The precipitated hydrogen is collected and discharged into the air.

一種適用於酸性氯化銅蝕刻廢液沉澱取銅電解再生的方法。步驟如下:A method for electrolytic regeneration of copper from waste solution of acidic copper chloride etching. The steps are as follows:

1. 設置循環交換槽將蝕刻生產工作液與陽極電解液作交換混合,使蝕刻工作液在蝕刻生產過程中其銅離子濃度和氧化還原電位均得到穩定控制;同時通過電解槽將蝕刻工作液作電化學氧化處理使其再生回用。電解槽陰極區析氫收集高空排放。1. A circulating exchange tank is set up to exchange and mix the etching working solution with the anode electrolyte, so that the copper ion concentration and redox potential of the etching working solution can be stably controlled during the etching production process; at the same time, the etching working solution is electrochemically oxidized through the electrolytic tank for regeneration and reuse. The hydrogen generated in the cathode area of the electrolytic tank is collected and discharged into the air.

2. 設置酸性濾液除雜設備和氧化再生設備,投入去除硫酸根雜質劑將反應生成的不溶性硫酸鹽去除,後向處理液投入氯氣和氧氣配製得到符合酸性氯化銅蝕刻製程要求的再生蝕刻子液。2. Set up acid filter liquid impurity removal equipment and oxidation regeneration equipment, add sulfate impurity removal agent to remove the insoluble sulfate generated by the reaction, and then add chlorine and oxygen to the treated liquid to obtain a regenerated etching liquid that meets the requirements of the acid copper chloride etching process.

3. 設置反應槽將蝕刻廢液泵送到反應槽中,達到氧化還原電位數值後按與溶液中銅離子反應所需量的80%向反應槽中投入銅提取劑,使溶液發生化學反應合成銅鹽沉澱。3. Set up a reaction tank to pump the etching waste liquid into the reaction tank. After reaching the redox potential value, add 80% of the copper extractant required to react with the copper ions in the solution into the reaction tank to make the solution undergo a chemical reaction to synthesize copper salt precipitation.

4. 設置固液分離器對反應槽中的固液混合物作固液分離處理,得到酸性濾液和銅鹽。4. Set up a solid-liquid separator to perform solid-liquid separation on the solid-liquid mixture in the reaction tank to obtain acidic filtrate and copper salt.

5. 設置清洗銅鹽設備,使銅鹽在清洗過程中去除氯鹽和/或鹽酸,生產製出符合品質要求的草酸銅。5. Set up copper salt cleaning equipment to remove chloride salt and/or hydrochloric acid during the cleaning process to produce copper oxalate that meets quality requirements.

實施例5Embodiment 5

如圖5所示,為本發明一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法及其裝置的實施例。其主要包括有線路板蝕刻生產線1、循環交換槽2、電解槽3、電解槽4、暫存槽26即蝕刻廢液暫存槽、反應槽19~21、固液分離器49~52、檢測裝置75~86、尾氣吸收液槽34、冷熱溫度交換器66~67、葉輪攪拌器59~61、液流循環攪拌器64~65、泵浦116~133、銅提取劑136、氫氧化鈉179、清水138、去硫酸根雜質劑167、自動檢測投料控制器168,其中電解槽分隔物169和170均為陰離子交換膜。As shown in FIG5 , it is an embodiment of a method and device for electrolytic regeneration of copper by precipitation of waste solution from acidic copper chloride etching of the present invention. It mainly includes a circuit board etching production line 1, a circulation exchange tank 2, an electrolytic tank 3, an electrolytic tank 4, a temporary tank 26, i.e., an etching waste liquid temporary tank, reaction tanks 19-21, solid-liquid separators 49-52, detection devices 75-86, an exhaust gas absorption tank 34, a cold and hot temperature exchanger 66-67, an impeller agitator 59-61, a liquid circulation agitator 64-65, a pump 116-133, a copper extractant 136, sodium hydroxide 179, clean water 138, a sulfate impurity removal agent 167, and an automatic detection and feeding controller 168, wherein the electrolytic tank separators 169 and 170 are both anion exchange membranes.

線路板的蝕刻生產線1內裝有三個檢測裝置75~77,依次是酸度計、是比重計、氧化還原電位計,蝕刻工作液為酸性氯化銅蝕刻溶液為主要包含鹽酸、氯化銅、氯化銨和氯化鐵的混合液,酸度為2.0莫耳/升,銅離子濃度為80克/升,銨離子濃度為10g/L,鐵離子濃度為108克/升。其中檢測裝置76是控制加投清水來維持蝕刻工作液的比重恒定,即能夠使銅離子和鐵離子的濃度在溶液中得到穩定。The etching production line 1 of the circuit board is equipped with three detection devices 75-77, which are an acidity meter, a hydrometer, and a redox potentiometer. The etching working solution is an acidic copper chloride etching solution, which is a mixture of hydrochloric acid, copper chloride, ammonium chloride, and ferric chloride, with an acidity of 2.0 mol/L, a copper ion concentration of 80 g/L, an ammonium ion concentration of 10 g/L, and an iron ion concentration of 108 g/L. Among them, the detection device 76 controls the addition of clean water to maintain a constant specific gravity of the etching working solution, that is, it can stabilize the concentration of copper ions and iron ions in the solution.

蝕刻生產線1通過蝕刻生產線溢流口、水油分離器42、泵浦116的管道流進到循環交換槽2中,循環交換槽2通過液體流量調節器74的管道將循環交換槽2的溶液泵送入蝕刻生產線1。電解槽3和電解槽4的陽極電解液分別通過溢出緩衝槽45、泵浦118的管道和溢出緩衝槽43、泵浦125的管道被泵送到循環交換槽2中進行溶液混合;另循環交換槽2的溶液通過泵浦117和泵浦123的管道分別進入電解槽陽極區5和6,使蝕刻生產線1的液體流入電解槽陽極區進行氧化反應。隨著蝕刻生產進行需往蝕刻生產線1中投入蝕刻銅板,蝕刻生產線1需不斷投入再生蝕刻子液或外來鹽酸與添加劑的混合液。當蝕刻生產線1滿液則通過溢流口流入水油分離器42中並根據循環交換槽2的液位來作分配。當循環交換槽2的液位低於製程控制高度時則啟動泵浦116將蝕刻廢液泵送入循環交換槽2中,使循環交換槽2構成為陽極電解液與蝕刻工作液的混和交換中心。當循環交換槽2液位高於控制值時啟動泵浦122將溢出的蝕刻廢液泵送到暫存槽26中。電解過程中由檢測裝置78即ORP計來控制電解電源13和/或14的輸出工作電流大小或關停。由檢測裝置77來控制液體流量調節器74泵送循環交換槽2的溶液到蝕刻生產線1中參與蝕刻化學反應。The etching production line 1 flows into the circulation exchange tank 2 through the overflow port of the etching production line, the water-oil separator 42, and the pipeline of the pump 116. The circulation exchange tank 2 pumps the solution of the circulation exchange tank 2 into the etching production line 1 through the pipeline of the liquid flow regulator 74. The anode electrolytes of the electrolytic cells 3 and 4 are pumped into the circulation exchange tank 2 through the pipelines of the overflow buffer tank 45 and the pump 118 and the pipelines of the overflow buffer tank 43 and the pump 125 for solution mixing; the solution of the circulation exchange tank 2 enters the anode areas 5 and 6 of the electrolytic cell through the pipelines of the pump 117 and the pump 123, respectively, so that the liquid of the etching production line 1 flows into the anode area of the electrolytic cell for oxidation reaction. As the etching production proceeds, the etching copper plate needs to be added to the etching production line 1, and the etching production line 1 needs to continuously add the regenerated etching liquid or the mixture of external hydrochloric acid and additives. When the etching production line 1 is full of liquid, it flows into the water-oil separator 42 through the overflow port and is distributed according to the liquid level of the circulation exchange tank 2. When the liquid level of the circulation exchange tank 2 is lower than the process control height, the pump 116 is started to pump the etching waste liquid into the circulation exchange tank 2, so that the circulation exchange tank 2 constitutes a mixing exchange center for the anode electrolyte and the etching working liquid. When the liquid level in the circulation exchange tank 2 is higher than the control value, the pump 122 is started to pump the overflowed etching waste liquid into the temporary storage tank 26. During the electrolysis process, the output working current of the electrolysis power source 13 and/or 14 is controlled or shut down by the detection device 78, i.e., the ORP meter. The detection device 77 controls the liquid flow regulator 74 to pump the solution in the circulation exchange tank 2 into the etching production line 1 to participate in the etching chemical reaction.

為保證蝕刻工作液的溫度恒定,特在循環交換槽2中設置有溫度冷熱交換器66,使對加投入蝕刻生產線的溶液溫度符合蝕刻製程要求。In order to ensure that the temperature of the etching working solution is constant, a temperature hot-cold exchanger 66 is provided in the circulation exchange tank 2 so that the temperature of the solution added to the etching production line meets the requirements of the etching process.

電解槽3和4因結構均有電解槽分隔物169和170將兩個電解槽分別劃為陽極區和陰極區,其陽極電解液均為循環交換槽2中的溶液。而電解槽4的陰極電解液原為蝕刻廢液,在電解過程中電解槽4的陰極電解液在陰極上作電化學反應使三價鐵離子還原為二價鐵離子,並會有銅離子由原二價降價還原為一價亞銅離子後甚至電析出金屬銅。為避免電解槽4的陰極上電析出銅,通過檢測裝置82的ORP計控制加投暫存槽26中的蝕刻廢液使到電解槽4的陰極電解液按實操經驗維持一定的氧化還原電位數值令其陰極不電析出銅。當暫存槽26中沒有蝕刻廢液時,則電解槽4的電解電源14作關停。另電解槽3的電解槽陰極區中的陰極電解液是使用不含銅的蝕刻再生子液,通過檢測裝置79的pH計控制泵浦133加投暫存槽31的再生蝕刻子液。檢測裝置80為ORP計按實操經驗設定控制暫存槽28中的氧化劑166氯酸鈉溶液通過泵浦121投入到電解槽3的電解電解槽陰極區中,其陰極不電析出氫氣。其陰極溢出液通過溢出緩衝槽46、泵浦119泵送入暫存槽32中。The electrolytic cells 3 and 4 are divided into an anode region and a cathode region by electrolytic cell separators 169 and 170, respectively, and the anode electrolytes are the solutions in the circulating exchange cell 2. The cathode electrolyte of the electrolytic cell 4 is originally the etching waste liquid. During the electrolysis process, the cathode electrolyte of the electrolytic cell 4 undergoes an electrochemical reaction on the cathode to reduce the trivalent iron ions to divalent iron ions, and the copper ions are reduced from the original divalent to monovalent cuprous ions, and even metal copper is electrolyzed. In order to prevent copper from being electrolyzed on the cathode of the electrolytic cell 4, the ORP meter of the detection device 82 controls the addition of etching waste liquid in the temporary storage tank 26 so that the cathode electrolyte of the electrolytic cell 4 maintains a certain redox potential value according to practical experience so that copper is not electrolyzed on the cathode. When there is no etching waste liquid in the temporary storage tank 26, the electrolytic power supply 14 of the electrolytic cell 4 is shut down. In addition, the cathode electrolyte in the cathode area of the electrolytic cell 3 uses etching regeneration liquid that does not contain copper, and the pH meter of the detection device 79 controls the pump 133 to add the regeneration etching liquid of the temporary storage tank 31. The detection device 80 is an ORP meter set according to practical experience to control the oxidant 166 sodium chlorate solution in the temporary storage tank 28 through the pump 121 into the cathode area of the electrolytic cell 3. The cathode does not electrolyze hydrogen. The cathode overflow liquid is pumped into the temporary storage tank 32 through the overflow buffer tank 46 and the pump 119.

暫存槽32中的溶液其主要成分為鹽酸、氯化鐵、氯化銨、氯化亞鐵和氯化鉀的混合液。按程式由自動檢測投料控制器168發出指令啟動泵浦134將暫存槽32中溶液泵送到反應槽19中,開啟葉輪攪拌器59,反應槽19的檢測裝置81的PH計控制加控氫氧化鈉184到反應槽19溶液中。在檢測裝置81的PH計達到設定的製程數值時則反應槽19中的反應液已生成有氫氧化鐵和氫氧化亞鐵固體沉澱物。依程式控制關停葉輪攪拌器59,打開閥門和開啟泵浦120對反應槽19中的固液混合物進行固液分離,其氫氧化鐵177和氫氧化亞鐵185被截留在固液分離器49中,待後取出回用於配製再生蝕刻子液中;其濾液引流進暫存槽27中,濾液的主要成分是氯化鈉、氫氧化鈉和氫氧化銨的混合液,將其作外排廢液處理。The solution in the temporary tank 32 is mainly composed of a mixture of hydrochloric acid, ferric chloride, ammonium chloride, ferrous chloride and potassium chloride. According to the program, the automatic detection and feeding controller 168 issues a command to start the pump 134 to pump the solution in the temporary tank 32 into the reaction tank 19, turn on the impeller stirrer 59, and the pH meter of the detection device 81 of the reaction tank 19 controls the addition of sodium hydroxide 184 to the solution in the reaction tank 19. When the pH meter of the detection device 81 reaches the set process value, the reaction solution in the reaction tank 19 has generated ferric hydroxide and ferrous hydroxide solid precipitates. The impeller agitator 59 is shut down according to program control, and the valve is opened and the pump 120 is turned on to separate the solid-liquid mixture in the reaction tank 19. The ferric hydroxide 177 and ferrous hydroxide 185 are retained in the solid-liquid separator 49 and are later taken out and reused in the preparation of the regenerated etching liquid; the filtered liquid is drained into the temporary storage tank 27. The main component of the filtered liquid is a mixed liquid of sodium chloride, sodium hydroxide and ammonium hydroxide, which is treated as an external waste liquid.

電解槽4的電解槽陰極區滿液後經溢出緩衝槽44溢液至暫存槽29,暫存槽29中的溶液其主要成分為鹽酸、氯化銅、氯化鐵、氯化亞鐵和氯化銨的混合液。其中溶液中的氯化鐵與氯化亞鐵的比例由檢測裝置82的ORP計控制。將暫存槽29中的溶液按液位作自動控制泵浦127泵送到反應槽20中,反應槽作為銅鹽提取反應槽20中安裝有檢測裝置83的ORP計、檢測裝置84即比重計和葉輪攪拌器60。啟動葉輪攪拌器60並且檢測裝置83和84將現場資料傳送到自動檢測投料控制器168中作處理,若檢測裝置83未達標時則控制加投氧化劑166氯酸鈉溶液,達標後則由檢測裝置84即比重計控制投入銅提取劑136。當檢測裝置84的比重值下降到製程設定值時,則反應槽20中反應液按製程製得草酸銅的固液混合物。關停葉輪攪拌器60並打開閥門和開啟泵浦128對固液混合物通過銅鹽提取的固液分離器50作固液分離,其固體濾渣草酸銅被截留在固液分離器50中,待後回收處理;其濾液被引流到反應槽21中。完成後關閉閥門和泵浦128。濾液的主要成分是鹽酸、氯化鐵、氯化亞鐵、氯化銨、微量草酸和硫酸的混合液。After the cathode area of the electrolytic cell 4 is full of liquid, the liquid overflows from the overflow buffer tank 44 to the temporary storage tank 29. The solution in the temporary storage tank 29 is mainly composed of a mixture of hydrochloric acid, cupric chloride, ferric chloride, ferrous chloride and ammonium chloride. The ratio of ferric chloride to ferrous chloride in the solution is controlled by the ORP meter of the detection device 82. The solution in the temporary storage tank 29 is pumped into the reaction tank 20 by the automatic control pump 127 according to the liquid level. The reaction tank 20 is used as a copper salt extraction reaction tank 20. The ORP meter of the detection device 83, the detection device 84, i.e., the hydrometer and the impeller agitator 60 are installed. The impeller agitator 60 is started and the detection devices 83 and 84 transmit the on-site data to the automatic detection and feeding controller 168 for processing. If the detection device 83 does not meet the standard, the oxidant 166 sodium chlorate solution is controlled to be added. After the standard is met, the copper extracting agent 136 is controlled by the detection device 84, i.e., the hydrometer. When the specific gravity value of the detection device 84 drops to the process setting value, the reaction liquid in the reaction tank 20 produces a solid-liquid mixture of copper oxalate according to the process. The impeller agitator 60 is turned off, and the valve and pump 128 are opened to separate the solid-liquid mixture through the solid-liquid separator 50 for copper salt extraction. The solid slag copper oxalate is retained in the solid-liquid separator 50 for later recycling and treatment; the filtrate is drained into the reaction tank 21. After completion, the valve and pump 128 are closed. The main components of the filtrate are a mixture of hydrochloric acid, ferric chloride, ferrous chloride, ammonium chloride, trace amounts of oxalic acid and sulfuric acid.

對反應槽21中的含硫酸溶液作去除硫酸根雜質處理。啟動葉輪攪拌器61,根據檢測裝置85的酸度計數值由自動檢測投料控制器168對去硫酸根雜質劑167的氫氧化鋇作控投。反應過程中生成硫酸鋇不溶物,完成後則關停葉輪攪拌器61和打開閥門和開啟泵浦129,通過固液分離器51對反應槽21的固液混合物進行固液分離。硫酸鋇雜質被截留在固液分離器51中,其濾液被引流到暫存槽30中。其濾液的主要成分是鹽酸、三氯化鐵、氯化亞鐵、氯化銨、微痕量的草酸和氯化鋇的混合液。The sulfuric acid solution in the reaction tank 21 is treated to remove sulfate impurities. The impeller agitator 61 is started, and the barium hydroxide of the sulfate removal impurity agent 167 is controlled by the automatic detection and feeding controller 168 according to the acidity meter value of the detection device 85. Insoluble barium sulfate is generated during the reaction process. After completion, the impeller agitator 61 is turned off, the valve is opened, and the pump 129 is turned on. The solid-liquid separation is performed on the solid-liquid mixture in the reaction tank 21 through the solid-liquid separator 51. The barium sulfate impurities are trapped in the solid-liquid separator 51, and the filtrate is drained into the temporary storage tank 30. The main components of the filter liquid are a mixture of hydrochloric acid, ferric chloride, ferrous chloride, ammonium chloride, trace amounts of oxalic acid and barium chloride.

暫存槽30頂部安裝射流吸氣裝置38,該射流吸氣裝置作為氣液混合裝置將來自循環交換槽2、電解槽3陽極區、電解槽4陽極區的氯氣吸引至暫存槽30中與槽內溶液反應。氯氣將溶液中的微痕量的草酸作氧化反應除去,並將氯化亞鐵氧化為氯化鐵。當暫存槽30內檢測裝置86的ORP計達到設定值後,則開啟泵浦131將暫存槽30中的部分溶液抽送到暫存槽31中作為再生蝕刻子液準備回用到蝕刻生產線上。A jet suction device 38 is installed on the top of the temporary storage tank 30. The jet suction device acts as a gas-liquid mixing device to attract chlorine gas from the circulation exchange tank 2, the anode area of the electrolytic tank 3, and the anode area of the electrolytic tank 4 into the temporary storage tank 30 to react with the solution in the tank. The chlorine gas removes the trace amount of oxalic acid in the solution through oxidation reaction, and oxidizes ferrous chloride to ferric chloride. When the ORP meter of the detection device 86 in the temporary storage tank 30 reaches the set value, the pump 131 is turned on to pump part of the solution in the temporary storage tank 30 into the temporary storage tank 31 as a regenerated etching liquid to be reused in the etching production line.

暫存槽31中的溶液經過氯氣氧化處理後,其主要成分是鹽酸、氯化銨和三氯化鐵的混合液,蝕刻生產線1上的檢測裝置77資料送自動檢測投料控制器168處理並控制泵浦132將暫存槽31中的溶液向蝕刻生產線1加投,使廢液回收處理過程中所產出的酸性濾液全部得到循環回用。After the solution in the temporary storage tank 31 is oxidized by chlorine, its main component is a mixture of hydrochloric acid, ammonium chloride and ferric chloride. The detection device 77 on the etching production line 1 sends data to the automatic detection and feeding controller 168 for processing and controls the pump 132 to add the solution in the temporary storage tank 31 to the etching production line 1, so that all the acidic filter liquid produced in the waste liquid recovery process can be recycled.

本實施例電解氧化再生設備系統的特點:應用兩台電解機。其中電解槽3為蝕刻工作液氧化再生機。電解槽4是製作含三氯化鐵濃度較低的含銅溶液,使其在與草酸反應時因含三價鐵離子少而降低草酸損耗。所述的兩台電解機在其陰極均不電析出金屬銅的製程情況下其陽極析氯對蝕刻工作液進行氧化反應和對蝕刻工作液中的有機雜質作氧化去除。電解過程中兩個陰極均不析銅也不析氫氣。The features of the electrolytic oxidation regeneration equipment system of this embodiment are as follows: two electrolytic machines are used. Among them, electrolytic cell 3 is an etching working solution oxidation regeneration machine. Electrolytic cell 4 is used to produce a copper-containing solution with a relatively low concentration of ferric chloride, so that when it reacts with oxalic acid, the oxalic acid loss is reduced due to the small amount of trivalent iron ions contained. Under the process condition that the cathodes of the two electrolytic machines do not electrolyze metallic copper, the anodes of the two electrolytic machines release chlorine to oxidize the etching working solution and oxidize and remove organic impurities in the etching working solution. During the electrolysis process, neither cathode releases copper nor hydrogen.

一種適用於酸性氯化銅蝕刻廢液沉澱取銅電解再生方法。步驟如下:A method for electrolytic regeneration of copper from waste solution of acidic copper chloride etching by precipitation. The steps are as follows:

1. 設置循環交換槽將蝕刻生產工作液與兩槽陽極電解液作交換混合,使蝕刻工作液在蝕刻生產過程中其銅離子濃度和氧化還原電位數值均得到穩定控制,同時通過電解槽將蝕刻工作液作電化學氧化處理使其再生回用,電解過程中陰極既不析銅也不析氫氣。1. A circulating exchange tank is set up to exchange and mix the etching production working solution with the two tanks of anode electrolyte, so that the copper ion concentration and redox potential value of the etching working solution can be stably controlled during the etching production process. At the same time, the etching working solution is electrochemically oxidized through the electrolytic tank to be regenerated and reused. During the electrolysis process, the cathode neither releases copper nor hydrogen.

2. 設置反應槽將電解槽4的陰極電解溢出液泵送到化學反應取銅的反應槽中,當反應液的氧化還原電位數值符合製程要求後按與溶液中銅離子反應所需量向反應槽中溶液投入銅提取劑,使溶液發生化學反應合成銅鹽沉澱。2. A reaction tank is set up to pump the cathode electrolysis overflow liquid of the electrolytic tank 4 to the reaction tank for chemical reaction to extract copper. When the redox potential value of the reaction liquid meets the process requirements, a copper extractant is added to the solution in the reaction tank according to the amount required to react with the copper ions in the solution, so that the solution undergoes a chemical reaction to synthesize copper salt precipitation.

3. 設置固液分離器對反應槽中的固液混合物作固液分離處理,得到酸性濾液和銅鹽。3. Set up a solid-liquid separator to perform solid-liquid separation on the solid-liquid mixture in the reaction tank to obtain acidic filtrate and copper salt.

4. 設置酸性濾液除雜設備和氧化再生設備,投入去除硫酸根雜質劑使反應液中生成不溶性硫酸鹽固體作去除,隨後向處理液引入氯氣作氧化再生處理,製得符合酸性氯化銅蝕刻技術品質要求的再生回用蝕刻子液。4. Set up acid filter liquid impurity removal equipment and oxidation regeneration equipment, add sulfate impurity removal agent to generate insoluble sulfate solids in the reaction liquid for removal, and then introduce chlorine gas into the treated liquid for oxidation regeneration treatment to obtain regenerated and recycled etching liquid that meets the quality requirements of acid copper chloride etching technology.

5. 廢液回收製程處理過程實行生產程式自動化控制。5. The waste liquid recovery process is subject to automated production process control.

比較例1Comparison Example 1

線路板的蝕刻生產線使用的酸性氯化銅蝕刻液其主要成分為鹽酸與氯化銅的混合液,酸度為1.4莫耳/升,銅離子濃度200克/升。The acidic copper chloride etching solution used in the etching production line of circuit boards is mainly composed of a mixture of hydrochloric acid and copper chloride, with an acidity of 1.4 mol/L and a copper ion concentration of 200 g/L.

蝕刻生產線上設有酸度計、氧化還原電位計和比重計。隨著蝕刻生產進行需要往蝕刻生產線1中投入線路銅板,適時地向蝕刻生產線投入外來鹽酸和蝕刻氧化劑以保持蝕刻工作液的酸度穩定。The etching production line is equipped with an acidity meter, a redox potentiometer and a specific gravity meter. As the etching production proceeds, the circuit copper plate needs to be put into the etching production line 1, and external hydrochloric acid and etching oxidant are put into the etching production line in time to keep the acidity of the etching working solution stable.

實施例1~5可明顯減少蝕刻工作液中的有機雜質,具體情況如下表。Examples 1 to 5 can significantly reduce organic impurities in the etching working solution, as shown in the following table.

表1-蝕刻工作液中油狀有機雜質情況   蝕刻工作液中油狀有機雜質情況 實施例1 有輕微油花,但未見累積 實施例2 有輕微油花,但未見累積 實施例3 未觀察到油狀物 實施例4 未觀察到油狀物 實施例5 未觀察到油狀物 比較例1 液面明顯浮有油層 Table 1- Oily organic impurities in etching working fluid Oily organic impurities in etching working fluid Embodiment 1 There is slight oiliness, but no accumulation Embodiment 2 There is slight oiliness, but no accumulation Embodiment 3 No oil was observed Embodiment 4 No oil was observed Embodiment 5 No oil was observed Comparison Example 1 There is a clear layer of oil on the surface of the liquid

1:蝕刻生產線 2:循環交換槽 3,4:電解槽 5,6:電解槽陽極區 7,8:電解槽陰極區 9,10:陽極 11,12:陰極 13,14:電解電源 15:陽極電解液溢流管 17,18:電解槽的蓋罩(抽氣蓋板) 19~22:反應槽 23,24:帶濾網反應槽 26~32:暫存槽 34,35:尾氣吸收液槽 37:噴淋裝置 38~40:射流吸氣裝置 42:水油分離器 43~46:溢出緩衝槽 49~55:固液分離器 59~62:葉輪攪拌器 64,65:液流循環攪拌器 66~68:溫度冷熱交換器 69~71:溢流口 73,74:液體流量調節控制器 75~88:檢測裝置 89~111:閥門 115:三通閥門 116~135:泵浦 136:銅提取劑 137:鹽酸 138:清水 139,140:銅鹽清洗槽 141~143:銅鹽 144~153:投料口 154~164:排氣口 166:氧化劑 167:去硫酸根雜質劑 168:自動檢測投料控制器 169~172:電解槽分隔物 174:氫氣外排系統 175:阻火器 176:氫氧化銅 177:氫氧化鐵 178:廢鹽水 179:氫氧化鈉 180:酸性濾液 184:氯化鈉 185:氫氧化亞鐵 C:尾氣 1: Etching production line 2: Circulation exchange tank 3,4: Electrolyzer 5,6: Anode area of electrolyzer 7,8: Cathode area of electrolyzer 9,10: Anode 11,12: Cathode 13,14: Electrolysis power supply 15: Anode electrolyte overflow pipe 17,18: Electrolyzer cover (exhaust cover) 19~22: Reactor 23,24: Reactor with filter 26~32: Temporary storage tank 34,35: Tail gas absorption tank 37: Spraying device 38~40: Jet suction device 42: Water-oil separator 43~46: Overflow buffer tank 49~55: solid-liquid separator 59~62: impeller agitator 64,65: liquid circulation agitator 66~68: temperature heat exchanger 69~71: overflow port 73,74: liquid flow control controller 75~88: detection device 89~111: valve 115: three-way valve 116~135: pump 136: copper extractor 137: hydrochloric acid 138: clean water 139,140: copper salt cleaning tank 141~143: copper salt 144~153: feeding port 154~164: exhaust port 166: oxidant 167: Sulfate removal agent 168: Automatic detection feed controller 169~172: Electrolytic cell partition 174: Hydrogen exhaust system 175: Flame arrester 176: Copper hydroxide 177: Ferric hydroxide 178: Waste brine 179: Sodium hydroxide 180: Acid filter 184: Sodium chloride 185: Ferrous hydroxide C: Tail gas

圖1為本發明實施例1的一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法的裝置其基礎實施例示意圖。 圖2為本發明實施例2的一種酸性氯化銅和氯化鐵蝕刻廢液沉澱取銅電解再生方法的裝置示意圖。 圖3為本發明實施例3的一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法的裝置示意圖。 圖4為本發明實施例4的一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法的裝置示意圖。 圖5為本發明實施例5的一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法的裝置示意圖。 FIG1 is a schematic diagram of a basic embodiment of a method for electrolytically regenerating copper from an acidic copper chloride etching waste solution according to Example 1 of the present invention. FIG2 is a schematic diagram of a method for electrolytically regenerating copper from an acidic copper chloride and iron chloride etching waste solution according to Example 2 of the present invention. FIG3 is a schematic diagram of a method for electrolytically regenerating copper from an acidic copper chloride etching waste solution according to Example 3 of the present invention. FIG4 is a schematic diagram of a method for electrolytically regenerating copper from an acidic copper chloride etching waste solution according to Example 4 of the present invention. FIG5 is a schematic diagram of a method for electrolytically regenerating copper from an acidic copper chloride etching waste solution according to Example 5 of the present invention.

1:蝕刻生產線 1: Etching production line

3:電解槽 3: Electrolyzer

9:陽極 9: Yang pole

11:陰極 11: cathode

13:電解電源 13:Electrolysis power source

17:電解槽的蓋罩(抽氣蓋板) 17: Electrolytic cell cover (exhaust cover)

19:反應槽 19: Reactor

26:暫存槽 26: Cache slot

49:固液分離器 49: Solid-liquid separator

75~77:檢測裝置 75~77: Detection device

89~92:閥門 89~92: Valve

116~119:泵浦 116~119: Pumping

136:銅提取劑 136: Copper extractant

137:鹽酸 137: Hydrochloric acid

141:銅鹽 141: Copper salt

169:電解槽分隔物 169: Electrolyzer separator

180:酸性濾液 180: Acidic filter

Claims (14)

一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法,包括以下步驟:步驟一:使用電解槽在蝕刻過程中即時對蝕刻工作液進行氧化,所述蝕刻工作液包括鹽酸及氯化銅,所述電解槽中設置有電解槽分隔物使電解槽分成為電解槽陽極區和電解槽陰極區,所述電解槽陽極區盛放有陽極和陽極電解液,所述電解槽陰極區盛放陰極和陰極電解液,所述陽極電解液為來自酸性氯化銅蝕刻生產線的蝕刻工作液和/或蝕刻廢液,將經過電解處理的所述陽極電解液作為再生蝕刻工作液返回到所述酸性氯化銅蝕刻生產線上使用,電解過程中所述陽極所產生的氯氣用於氧化所述陰極電解液、再生蝕刻子液、所述蝕刻工作液、所述蝕刻廢液、步驟三中所得的酸性濾液中的至少一種或一種以上的混合液,所述的陰極電解液為電解質溶液;步驟二:將經過電解處理的所述陽極電解液、經過電解處理的所述陰極電解液、經過氧化處理的所述陰極電解液、氯化銅蝕刻廢液中的至少一種或一種以上的混合液與銅提取劑混合,使來自於所述氯化銅蝕刻廢液和/或氯化銅蝕刻工作液的銅離子在反應混合液中反應生成銅鹽沉澱物以及鹽酸,其中所述銅提取劑為草酸;以及步驟三:將步驟二中反應所得的固液混合物經固液分離後獲得固體銅鹽沉澱物和酸性濾液,將所得的固體銅鹽作為銅的回收 產品,將所得的酸性濾液直接作為再生蝕刻子液回用於蝕刻生產線的蝕刻工序中或者作為再生蝕刻子液的原料之一回用於蝕刻工序中。 A method for electrolytic regeneration of copper from acidic copper chloride etching waste solution precipitation, comprising the following steps: Step 1: using an electrolytic cell to oxidize an etching working solution in real time during the etching process, wherein the etching working solution comprises hydrochloric acid and copper chloride, and an electrolytic cell separator is provided in the electrolytic cell to divide the electrolytic cell into an electrolytic cell anode area and an electrolytic cell cathode area, wherein the electrolytic cell anode area contains an anode and an anode electrolyte, and the electrolytic cell cathode area contains a cathode and a cathode electrolyte. The cathode electrolyte is an etching working solution and/or etching waste solution from an acid copper chloride etching production line. The electrolytically treated anode electrolyte is returned to the acid copper chloride etching production line as a regenerated etching working solution. The chlorine gas generated by the anode during the electrolysis process is used to oxidize the cathode electrolyte, the regenerated etching sub-liquid, the etching working solution, the etching waste solution, and the acidic filter solution obtained in step three. The cathode electrolyte is an electrolyte solution; Step 2: mixing at least one or more of the anode electrolyte treated by electrolysis, the cathode electrolyte treated by electrolysis, the cathode electrolyte treated by oxidation, and the copper chloride etching waste solution with a copper extractant, so that the copper ions from the copper chloride etching waste solution and/or the copper chloride etching working solution are reacted in the reaction mixture. The copper extractant is oxalic acid, and the solid-liquid mixture obtained by the reaction in step 2 is subjected to solid-liquid separation to obtain a solid copper salt precipitate and an acidic filter solution, the solid copper salt obtained is used as a copper recovery product, and the acidic filter solution obtained is directly used as a regenerated etching sub-liquid for recycling in the etching process of the etching production line or as one of the raw materials for the regenerated etching sub-liquid for recycling in the etching process. 如請求項1所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法,其中所述步驟一中所述電解槽分隔物為陰離子交換膜、雙極膜、反滲透膜中的至少一種。 The method for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid as described in claim 1, wherein the electrolytic cell separator in step 1 is at least one of an anion exchange membrane, a bipolar membrane, and a reverse osmosis membrane. 如請求項2所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法,其中所述陰極電解液是電解質的水溶液,包括鹽酸溶液或者氯鹽的酸性溶液,所述氯鹽的酸性溶液為鹽酸與至少一種氯鹽的混合溶液。 The method for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid as described in claim 2, wherein the cathode electrolyte is an aqueous solution of electrolyte, including a hydrochloric acid solution or an acidic solution of a chlorine salt, and the acidic solution of a chlorine salt is a mixed solution of hydrochloric acid and at least one chlorine salt. 如請求項3所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法,其中所述陰極電解液為酸性氯化銅蝕刻廢液和/或含鐵再生蝕刻子液和/或所述步驟三中所得的含鐵酸性濾液,所述電解槽陰極區設置有溢流口,向所述電解槽陰極區加投氧化劑進行氧化反應、加投所述酸性氯化銅蝕刻廢液和/或所述含鐵再生蝕刻子液和/或所述步驟三中所得的含鐵酸性濾液以補充所述陰極電解液中的氯離子和酸,對從所述電解槽陰極區的所述溢流口所溢出的所述陰極電解液加投鹼性物質或所述銅提取劑作混合反應令其中的銅離子和/或鐵離子變為氫氧化物或碳酸鹽或草酸鹽沉澱後分離,或者通過電解方法對從所述電解槽陰極區的所述溢流口所溢出的所述陰極電解液作提銅處理,所得的去除銅離子後的溶液調配回用或作為廢水外排處理。 The method for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste solution as described in claim 3, wherein the cathode electrolyte is acidic copper chloride etching waste solution and/or iron-containing regeneration etching sub-liquid and/or the iron-containing acidic filter solution obtained in step 3, and the cathode region of the electrolytic cell is provided with an overflow port, and an oxidant is added to the cathode region of the electrolytic cell to carry out an oxidation reaction, and the acidic copper chloride etching waste solution and/or the iron-containing regeneration etching sub-liquid and/or the iron-containing acidic filter solution obtained in step 3 are added to replenish The chlorine ions and acid in the cathodic electrolyte are mixed with alkaline substances or the copper extractant to react with the cathodic electrolyte overflowing from the overflow port of the cathode area of the electrolytic cell so that the copper ions and/or iron ions therein are converted into hydroxides, carbonates or oxalates for precipitation and separation, or the cathodic electrolyte overflowing from the overflow port of the cathode area of the electrolytic cell is subjected to copper extraction treatment by electrolysis, and the solution obtained after the removal of copper ions is prepared for reuse or discharged as waste water. 如請求項1所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法,其中所述的蝕刻工作液和所述蝕刻廢液中均含有鐵離子。 The method for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid as described in claim 1, wherein both the etching working liquid and the etching waste liquid contain iron ions. 如請求項5所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法,其中所述電解槽陰極區的所述陰極電解液的氧化還原電位不低於250mV。 The method for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid as described in claim 5, wherein the redox potential of the cathode electrolyte in the cathode region of the electrolytic cell is not less than 250mV. 如請求項6所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法,其中電解過程中,採用循環交換槽將來自氯化銅蝕刻生產線上的蝕刻工作液與來自所述電解槽陽極區的所述陽極電解液進行循環交換混合,同時將所得的混合液分別返回所述氯化銅蝕刻生產線上和所述電解槽陽極區,使蝕刻工作液在所述電解槽陽極區得到氧化。 As described in claim 6, the method for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid, wherein during the electrolysis process, a circulating exchange tank is used to circulate and exchange the etching working solution from the copper chloride etching production line with the anodic electrolyte from the anodic area of the electrolytic cell, and the obtained mixed solution is returned to the copper chloride etching production line and the anodic area of the electrolytic cell respectively, so that the etching working solution is oxidized in the anodic area of the electrolytic cell. 一種酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置,包括酸性蝕刻生產線、電解槽、電解槽分隔物、陽極、陰極、電解電源、銅鹽提取反應槽和銅鹽提取固液分離器,其中:所述電解槽分隔物將所述電解槽分成電解槽陽極區和電解槽陰極區,所述陽極和所述陰極分別放置在所述電解槽陽極區和所述電解槽陰極區,所述電解槽陽極區通過管道與蝕刻生產線的蝕刻液缸連接,所述電解槽陽極區的頂部設有抽氣蓋板,所述抽氣蓋板的出氣口連接有氣體引流管道,所述的蝕刻生產線和/或所述的電解槽陽極區和/或所述電解槽陰極區通過設有泵浦的管道與銅 鹽提取反應槽連接,所述銅鹽提取反應槽與所述銅鹽提取固液分離器作管道連接;所述的陽極為不溶性電極,所述的陰極為不溶性電極;所述電解槽分隔物為陰離子交換膜、雙極膜、反滲透膜中的至少一種。 A device for electrolytic regeneration of copper from acidic copper chloride etching waste liquid precipitation, comprising an acidic etching production line, an electrolytic cell, an electrolytic cell separator, an anode, a cathode, an electrolytic power source, a copper salt extraction reaction tank and a copper salt extraction solid-liquid separator, wherein: the electrolytic cell separator divides the electrolytic cell into an electrolytic cell anode area and an electrolytic cell cathode area, the anode and the cathode are placed in the electrolytic cell anode area and the electrolytic cell cathode area respectively, the electrolytic cell anode area is connected to the etching liquid cylinder of the etching production line through a pipeline, and the electrolytic cell separator is used to separate the electrolytic cell into an electrolytic cell anode area and an electrolytic cell cathode area. The top of the anode area of the electrolytic cell is provided with an exhaust cover plate, and the gas outlet of the exhaust cover plate is connected to a gas drainage pipeline. The etching production line and/or the anode area of the electrolytic cell and/or the cathode area of the electrolytic cell are connected to the copper salt extraction reactor through a pipeline provided with a pump, and the copper salt extraction reactor is connected to the copper salt extraction solid-liquid separator by a pipeline; the anode is an insoluble electrode, and the cathode is an insoluble electrode; the electrolytic cell separator is at least one of an anion exchange membrane, a bipolar membrane, and a reverse osmosis membrane. 如請求項8所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置,還包括蝕刻廢液或陰極電解溢出液氧化槽,將所述蝕刻廢液或陰極電解溢出液氧化槽與所述銅鹽提取反應槽通過閥門和泵浦的管道連接。 The device used in the method of electrolytic regeneration of copper from acidic copper chloride etching waste liquid precipitation as described in claim 8 also includes an etching waste liquid or cathode electrolysis overflow liquid oxidation tank, and the etching waste liquid or cathode electrolysis overflow liquid oxidation tank is connected to the copper salt extraction reaction tank through a valve and a pump pipeline. 如請求項9所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置,還包括電解槽陰極區氧化裝置,用於對陰極電解液進行氧化,所述電解槽陰極區氧化裝置與陰極電解溢出液氧化槽安裝連接,所述的陰極電解溢出液氧化槽為連接有帶加投泵浦管道的氧化劑槽、氧化劑固體加投裝置、連接有氧化性氣體源的氣體引流的氣液混合裝置中的至少一種。 The device used in the method for electrolytic regeneration of copper from acidic copper chloride etching waste liquid precipitation as described in claim 9 also includes an electrolytic cell cathode zone oxidation device for oxidizing the cathode electrolyte, the electrolytic cell cathode zone oxidation device is installed and connected to the cathode electrolysis overflow liquid oxidation tank, the cathode electrolysis overflow liquid oxidation tank is connected to at least one of an oxidant tank with a dosing pump pipeline, an oxidant solid dosing device, and a gas-liquid mixing device connected to an oxidizing gas source for gas drainage. 如請求項10所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置,還包括循環交換槽,所述循環交換槽作為陽極電解液與蝕刻工作液的混合交換反應中心。 The device used in the method of electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid as described in claim 10 also includes a circulating exchange tank, which serves as a mixed exchange reaction center for the anodic electrolyte and the etching working solution. 如請求項11所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置,其中所述循環交換槽的出液口與所述蝕刻生產線上的所述蝕刻液缸的連接管道上設有液體流量調節控制器。 As described in claim 11, the device used in the method for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid, wherein a liquid flow regulating controller is provided on the connecting pipe between the liquid outlet of the circulation exchange tank and the etching liquid cylinder on the etching production line. 如請求項12所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置,其中所述循環交換槽通過管道與所述電解槽陰極區、所述電解槽陰極區氧化裝置的氧化劑槽、蝕刻廢液暫存槽的至少一種作連接。 The device used in the method of electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid as described in claim 12, wherein the circulating exchange tank is connected to at least one of the cathode area of the electrolytic cell, the oxidant tank of the cathode area oxidation device of the electrolytic cell, and the etching waste liquid temporary storage tank through a pipeline. 如請求項13所述的酸性氯化銅蝕刻廢液沉澱取銅電解再生方法所採用的裝置,還包括陰極溢出液化學反應暫存槽,用於對所述電解槽陰極區的陰極溢出液作加投鹼性物質或銅提取劑。 The device used in the method of electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid as described in claim 13 also includes a cathode overflow liquid chemical reaction temporary storage tank for adding alkaline substances or copper extractants to the cathode overflow liquid in the cathode area of the electrolytic cell.
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