TWI879279B - Mobile device supporting wideband operation - Google Patents
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本發明係關於一種行動裝置,特別係關於一種可支援寬頻操作之行動裝置。The present invention relates to a mobile device, and more particularly to a mobile device capable of supporting broadband operation.
隨著行動通訊技術的發達,行動裝置在近年日益普遍,常見的例如:手提式電腦、行動電話、多媒體播放器以及其他混合功能的攜帶型電子裝置。為了滿足人們的需求,行動裝置通常具有無線通訊的功能。有些涵蓋長距離的無線通訊範圍,例如:行動電話使用2G、3G、LTE(Long Term Evolution)系統及其所使用700MHz、850 MHz、900MHz、1800MHz、1900MHz、2100MHz、2300MHz以及2500MHz的頻帶進行通訊,而有些則涵蓋短距離的無線通訊範圍,例如:Wi-Fi、Bluetooth系統使用2.4GHz、5.2GHz和5.8GHz的頻帶進行通訊。With the development of mobile communication technology, mobile devices have become increasingly popular in recent years, such as laptops, mobile phones, multimedia players and other hybrid portable electronic devices. In order to meet people's needs, mobile devices usually have wireless communication functions. Some cover long-distance wireless communication ranges, such as mobile phones using 2G, 3G, LTE (Long Term Evolution) systems and the 700MHz, 850 MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz, 2300MHz and 2500MHz frequency bands used for communication, while some cover short-distance wireless communication ranges, such as Wi-Fi, Bluetooth systems use 2.4GHz, 5.2GHz and 5.8GHz frequency bands for communication.
天線(Antenna)為無線通訊領域中不可缺少之元件。倘若用於接收或發射信號之天線其操作頻寬(Operational Bandwidth)過窄,則很容易造成行動裝置之通訊品質下降。因此,如何設計出一種小尺寸、寬頻帶之天線結構,對設計者而言是一項重要課題。Antennas are essential components in the field of wireless communications. If the operational bandwidth of an antenna used to receive or transmit signals is too narrow, it will easily cause the communication quality of mobile devices to deteriorate. Therefore, how to design a small-sized, wide-bandwidth antenna structure is an important issue for designers.
在較佳實施例中,本發明提出一種支援寬頻操作之行動裝置,包括:一接地元件;一環狀輻射部,耦接至該接地元件,其中一槽孔區域係形成於該環狀輻射部之內,而該環狀輻射部具有相對之一第一內緣和一第二內緣;一第一輻射部,具有一饋入點,其中該第一輻射部係耦接至該環狀輻射部之該第一內緣;一第二輻射部,鄰近於該第一輻射部,其中該第二輻射部係耦接至該環狀輻射部之該第二內緣;以及一介質基板,其中該環狀輻射部、該第一輻射部,以及該第二輻射部皆設置於該介質基板上;其中該環狀輻射部、該第一輻射部、該第二輻射部,以及該介質基板係共同形成一天線結構。In a preferred embodiment, the present invention provides a mobile device supporting broadband operation, comprising: a grounding element; an annular radiating portion coupled to the grounding element, wherein a slot area is formed in the annular radiating portion, and the annular radiating portion has a first inner edge and a second inner edge opposite to each other; a first radiating portion having a feed point, wherein the first radiating portion is coupled to the annular radiating portion. a first inner edge; a second radiating portion adjacent to the first radiating portion, wherein the second radiating portion is coupled to the second inner edge of the annular radiating portion; and a dielectric substrate, wherein the annular radiating portion, the first radiating portion, and the second radiating portion are all disposed on the dielectric substrate; wherein the annular radiating portion, the first radiating portion, the second radiating portion, and the dielectric substrate together form an antenna structure.
在一些實施例中,該環狀輻射部係呈現一較大矩形,而該槽孔區域係呈現一較小矩形。In some embodiments, the annular radiating portion is in the shape of a larger rectangle, and the slot region is in the shape of a smaller rectangle.
在一些實施例中,該第一輻射部係呈現一蜿蜒形狀,而該第二輻射部係呈現一直條形。In some embodiments, the first radiating portion is in a serpentine shape, and the second radiating portion is in a straight strip shape.
在一些實施例中,該第一輻射部包括彼此不互相平行之一第一部份和一第二部份,該第一部份係耦接至該饋入點,而該第二部份係耦接至該環狀輻射部之該第一內緣。In some embodiments, the first radiating portion includes a first portion and a second portion that are not parallel to each other, the first portion is coupled to the feeding point, and the second portion is coupled to the first inner edge of the annular radiating portion.
在一些實施例中,該第一輻射部之該第一部份係與該環狀輻射部之該第一內緣大致互相平行。In some embodiments, the first portion of the first radiating portion and the first inner edge of the annular radiating portion are substantially parallel to each other.
在一些實施例中,該第一輻射部之該第二部份係與該環狀輻射部之該第一內緣之間形成一銳夾角。In some embodiments, the second portion of the first radiating portion forms a sharp angle with the first inner edge of the annular radiating portion.
在一些實施例中,該第二輻射部和該第一輻射部之間形成一耦合間隙,而該耦合間隙之寬度係小於或等於1mm。In some embodiments, a coupling gap is formed between the second radiating portion and the first radiating portion, and a width of the coupling gap is less than or equal to 1 mm.
在一些實施例中,該天線結構涵蓋一第一頻帶、一第二頻帶,以及一第三頻帶,該第一頻帶係介於2400MHz至2500MHz之間,該第二頻帶係介於5150MHz至5850MHz之間,而該第三頻帶係介於5925至7125MHz之間。In some embodiments, the antenna structure covers a first frequency band, a second frequency band, and a third frequency band, the first frequency band is between 2400 MHz and 2500 MHz, the second frequency band is between 5150 MHz and 5850 MHz, and the third frequency band is between 5925 and 7125 MHz.
在一些實施例中,該環狀輻射部之長度係大致等於該第一頻帶之0.5倍波長,該第一輻射部之長度係大致等於該第二頻帶之0.5倍波長,而該第二輻射部之長度係大致等於該第三頻帶之0.25倍波長。In some embodiments, the length of the annular radiation portion is approximately equal to 0.5 times the wavelength of the first frequency band, the length of the first radiation portion is approximately equal to 0.5 times the wavelength of the second frequency band, and the length of the second radiation portion is approximately equal to 0.25 times the wavelength of the third frequency band.
在一些實施例中,該行動裝置更包括:一揚聲器元件,包括一非導體外殼;一鍵盤邊框,由一非導體材質所製成,其中該天線結構係設置於該鍵盤邊框和該揚聲器元件之該非導體外殼之間;一底座外殼,由一金屬材質所製成;一導電泡棉,其中該接地元件係經由該導電泡棉耦接至該底座外殼;以及一電池元件,鄰近於該導電泡棉;其中該接地元件、該揚聲器元件、該導電泡棉,以及該電池元件皆設置於該鍵盤邊框和該底座外殼之間。In some embodiments, the mobile device further includes: a speaker element including a non-conductive shell; a keyboard frame made of a non-conductive material, wherein the antenna structure is disposed between the keyboard frame and the non-conductive shell of the speaker element; a base shell made of a metal material; a conductive foam, wherein the grounding element is coupled to the base shell via the conductive foam; and a battery element adjacent to the conductive foam; wherein the grounding element, the speaker element, the conductive foam, and the battery element are all disposed between the keyboard frame and the base shell.
為讓本發明之目的、特徵和優點能更明顯易懂,下文特舉出本發明之具體實施例,並配合所附圖式,作詳細說明如下。In order to make the purpose, features and advantages of the present invention more clearly understood, specific embodiments of the present invention are specifically listed below and described in detail with reference to the accompanying drawings.
在說明書及申請專利範圍當中使用了某些詞彙來指稱特定的元件。本領域技術人員應可理解,硬體製造商可能會用不同的名詞來稱呼同一個元件。本說明書及申請專利範圍並不以名稱的差異來作為區分元件的方式,而是以元件在功能上的差異來作為區分的準則。在通篇說明書及申請專利範圍當中所提及的「包含」及「包括」一詞為開放式的用語,故應解釋成「包含但不僅限定於」。「大致」一詞則是指在可接受的誤差範圍內,本領域技術人員能夠在一定誤差範圍內解決所述技術問題,達到所述基本之技術效果。此外,「耦接」一詞在本說明書中包含任何直接及間接的電性連接手段。因此,若文中描述一第一裝置耦接至一第二裝置,則代表該第一裝置可直接電性連接至該第二裝置,或經由其它裝置或連接手段而間接地電性連接至該第二裝置。Certain terms are used in the specification and patent application to refer to specific components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. This specification and patent application do not use differences in names as a way to distinguish components, but use differences in the functions of components as the criterion for distinction. The words "include" and "including" mentioned throughout the specification and patent application are open terms and should be interpreted as "including but not limited to". The word "substantially" means that within an acceptable error range, those skilled in the art can solve the technical problem within a certain error range and achieve the basic technical effect. In addition, the word "coupled" in this specification includes any direct and indirect electrical connection means. Therefore, if a first device is described herein as being coupled to a second device, it means that the first device may be directly electrically connected to the second device, or may be indirectly electrically connected to the second device via other devices or connection means.
以下的揭露內容提供許多不同的實施例或範例以實施本案的不同特徵。以下的揭露內容敘述各個構件及其排列方式的特定範例,以簡化說明。當然,這些特定的範例並非用以限定。例如,若是本揭露書敘述了一第一特徵形成於一第二特徵之上或上方,即表示其可能包含上述第一特徵與上述第二特徵是直接接觸的實施例,亦可能包含了有附加特徵形成於上述第一特徵與上述第二特徵之間,而使上述第一特徵與第二特徵可能未直接接觸的實施例。另外,以下揭露書不同範例可能重複使用相同的參考符號及/或標記。這些重複係為了簡化與清晰的目的,並非用以限定所討論的不同實施例及/或結構之間有特定的關係。The following disclosure provides many different embodiments or examples for implementing different features of the present invention. The following disclosure describes specific examples of various components and their arrangements to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if the present disclosure describes a first feature formed on or above a second feature, it means that it may include an embodiment in which the first feature and the second feature are in direct contact, and may also include an embodiment in which an additional feature is formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, the same reference symbols and/or marks may be reused in different examples of the following disclosure. These repetitions are for the purpose of simplification and clarity, and are not intended to limit the specific relationship between the different embodiments and/or structures discussed.
此外,其與空間相關用詞。例如「在…下方」、「下方」、「較低的」、「上方」、「較高的」 及類似的用詞,係為了便於描述圖示中一個元件或特徵與另一個(些)元件或特徵之間的關係。除了在圖式中繪示的方位外,這些空間相關用詞意欲包含使用中或操作中的裝置之不同方位。裝置可能被轉向不同方位(旋轉90度或其他方位),則在此使用的空間相關詞也可依此相同解釋。In addition, spatially related terms such as "below," "below," "lower," "above," "higher," and similar terms are used to facilitate description of the relationship between one element or feature and another element or features in the diagram. In addition to the orientation shown in the drawings, these spatially related terms are intended to include different orientations of the device in use or operation. The device may be rotated to different orientations (rotated 90 degrees or other orientations), and the spatially related terms used herein may be interpreted accordingly.
第1圖係顯示根據本發明一實施例所述之行動裝置100之俯視圖。例如,行動裝置100可為一智慧型手機(Smart Phone)、一平板電腦(Tablet Computer),或是一筆記型電腦(Notebook Computer)。在第1圖之實施例中,行動裝置100包括:一接地元件(Ground Element)110、一環狀輻射部(Loop Radiation Element)120、一第一輻射部(Radiation Element)140、一第二輻射部150,以及一介質基板(Dielectric Substrate)160,其中接地元件110、環狀輻射部120、第一輻射部140,以及第二輻射部150皆可由金屬材質所製成,例如:銅、銀、鋁、鐵,或是其合金。必須理解的是,雖然未顯示於第1圖中,但行動裝置100更可包括其他元件,例如:一處理器(Processor)、一觸控面板(Touch Control Panel)、一供電模組(Power Supply Module),或(且)一外殼(Housing)。FIG. 1 is a top view of a
接地元件110可藉由一接地銅箔(Ground Copper Foil)來實施,其可用於提供一接地電位(Ground Voltage)。在一些實施例中,接地元件110更可耦接至行動裝置100之一系統接地面(System Ground Plane)(未顯示)。The
環狀輻射部120係耦接至接地元件110,其中一槽孔區域(Slot Region)130可形成於環狀輻射部120之內。詳細而言,環狀輻射部120具有一第一內緣(Inner Edge)121、一第二內緣122,以及一第三內緣123,其中第一內緣121和第二內緣122係彼此相對,而第三內緣123則介於第一內緣121和第二內緣122之間。另外,環狀輻射部120之第一內緣121和第二內緣122還可大致互相平行。在一些實施例中,環狀輻射部120可以大致呈現一較大矩形,而其槽孔區域130則可大致呈現一較小矩形,但亦不僅限於此。The annular
第一輻射部140可以大致呈現一蜿蜒形狀(Meandering Shape),例如:一L字形或一Z字形。詳細而言,第一輻射部140具有一第一端141和一第二端142,其中一饋入點(Feeding Point)FP係位於第一輻射部140之第一端141處。饋入點FP更可耦接至一信號源(Signal Source)190。例如,信號源190可為一射頻(Radio Frequency,RF)模組,而饋入點FP還可大致位於環狀輻射部120之槽孔區域130之正中心處。在一些實施例中,第一輻射部140包括鄰近於第一端141之一第一部份144和鄰近於第二端142之一第二部份145,其中第一部份144更耦接至饋入點FP,而第二部份145(或第二端142)更耦接至環狀輻射部120之第一內緣121。第一輻射部140之第一部份144和第二部份145彼此不互相平行。然而,第一輻射部140之第一部份144可與環狀輻射部120之第一內緣121大致互相平行。另外,第一輻射部140之第二部份145則可與環狀輻射部120之第一內緣121之間形成一銳夾角(Acute Angle)θ。必須注意的是,本說明書中所謂「鄰近」或「相鄰」一詞可指對應之二元件間距小於一既定距離(例如:10mm或更短),亦可包括對應之二元件彼此直接接觸之情況(亦即,前述間距縮短至0)。The first
第二輻射部150可以大致呈現一直條形。詳細而言,第二輻射部150具有一第一端151和一第二端152,其中第二輻射部150之第一端151係耦接至環狀輻射部120之第二內緣122,而第二輻射部150之第二端152為一開路端(Open End)並可朝靠近環狀輻射部120之第一內緣121之方向作延伸。在一些實施例中,第二輻射部150之第二端152係鄰近於第一輻射部140之第一端141,使得第二輻射部150和第一輻射部140之間可形成一耦合間隙(Coupling Gap)GC1。另外,第二輻射部150還可與第一輻射部140之第一部份144大致互相垂直。The second
例如,介質基板160可以是一FR4(Flame Retardant 4)基板、一印刷電路板(Printed Circuit Board,PCB),或是一軟性電路板(Flexible Printed Circuit,FPC)。環狀輻射部120、第一輻射部140,以及第二輻射部150皆可設置於介質基板160之同一表面上。在一些實施例中,接地元件110亦可部份地設置於介質基板160上,但亦不僅限於此。For example, the
在較佳實施例中,環狀輻射部120、第一輻射部140、第二輻射部150,以及介質基板160可共同形成行動裝置100之一天線結構(Antenna Structure)170。必須注意的是,由於前述之天線結構170為一平面化天線結構,故其整體製造成本還可進一步降低。In a preferred embodiment, the annular
第2圖係顯示根據本發明一實施例所述之行動裝置100之天線結構170之返回損失(Return Loss)圖,其中橫軸代表操作頻率(MHz),而縱軸代表返回損失(dB)。根據第2圖之量測結果,行動裝置100之天線結構170可涵蓋一第一頻帶(Frequency Band)FB1、一第二頻帶FB2,以及一第三頻帶FB3。例如,前述之第一頻帶FB1可介於2400MHz至2500MHz之間,前述之第二頻帶FB2可介於5150MHz至5850MHz之間,而前述之第三頻帶FB3可介於5925MHz至7125MHz之間。因此,行動裝置100將至少可支援WLAN(Wireless Local Area Network)、Wi-Fi 6E,以及Wi-Fi 7之寬頻操作。FIG. 2 is a graph showing the return loss of the
在一些實施例中,行動裝置100之天線結構170之操作原理可如下列所述。環狀輻射部120可激發產生前述之第一頻帶FB1。第一輻射部140可激發產生前述之第二頻帶FB2。第二輻射部150可激發產生前述之第三頻帶FB3。另外,環狀輻射部120之高階共振模態(Higher-Order Resonant Mode)還可貢獻前述之第二頻帶FB2和第三頻帶FB3。根據實際量測結果,若將饋入點FP設計於環狀輻射部120之槽孔區域130之正中心處,則將可微調前述之第一頻帶FB1之阻抗匹配(Impedance Matching),從而能增加天線結構170之操作頻寬(Operational Bandwidth)。In some embodiments, the operation principle of the
在一些實施例中,行動裝置100之元件尺寸可如下列所述。環狀輻射部120之長度L1可以大致等於行動裝置100之天線結構170之第一頻帶FB1之0.5倍波長(λ/2)。抑或,環狀輻射部120之長度L1可以大致等於行動裝置100之天線結構170之第二頻帶FB2之1倍波長(1λ)。又抑或,環狀輻射部120之長度L1可以大致等於行動裝置100之天線結構170之第三頻帶FB3之1.5倍波長(3λ/2)。環狀輻射部120之寬度W1可介於8mm至10mm之間。環狀輻射部120之邊寬(Border-Width)WB則可介於2mm至3mm之間。第一輻射部140之長度L2可以大致等於行動裝置100之天線結構170之第二頻帶FB2之0.5倍波長(λ/2)。第一輻射部140之寬度W2可介於1mm至2mm之間。第二輻射部150之長度L3可以大致等於行動裝置100之天線結構170之第三頻帶FB3之0.25倍波長(λ/4)。第二輻射部150之寬度W3可介於3mm至4mm之間。銳夾角θ可介於30度至80度之間,例如:約60度、約70度,或是約75度。環狀輻射部120之第三內緣123和第二輻射部150之間距D1可小於行動裝置100之天線結構170之第二頻帶FB2之0.5倍波長(λ/2)。耦合間隙GC1之寬度可小於或等於1mm。以上尺寸範圍係根據多次實驗結果而得出,其有助於最佳化行動裝置100之天線結構170之操作頻寬和阻抗匹配。In some embodiments, the dimensions of the components of the
以下將介紹行動裝置100之不同組態和細部結構特徵。必須理解的是,這些圖式和敘述僅為舉例,而非用於限制本發明。The following will introduce different configurations and detailed structural features of the
第3圖係顯示根據本發明一實施例所述之行動裝置300之剖面圖。第3圖和第1圖相似。在第3圖之實施例中,行動裝置300為一筆記型電腦,並更包括:一揚聲器元件(Speaker Element)310、一鍵盤邊框(Keyboard Frame)320、一底座外殼(Base Housing)330、一導電泡棉(Conductive Gasket)340,以及一電池元件(Battery Element)350,其中鍵盤邊框320可由一非導體材質所製成,而底座外殼330可由一金屬材質所製成。必須理解的是,前述之鍵盤邊框320和底座外殼330即可分別等同於筆記型電腦領域中俗稱之「C件」和「D件」。FIG. 3 is a cross-sectional view of a
揚聲器元件310包括一非導體外殼315,其中前述之天線結構170可設置於鍵盤邊框320和揚聲器元件310之非導體外殼315之間。前述之接地元件110更可經由導電泡棉340耦接至底座外殼330,其中電池元件350則可鄰近於導電泡棉340而設置。必須注意的是,接地元件110、天線結構170、揚聲器元件310、導電泡棉340,以及電池元件350皆可設置於行動裝置300之鍵盤邊框320和底座外殼330之間。The
根據實際量測結果,由於天線結構170係與揚聲器元件310進行適當整合,故行動裝置300不僅能維持良好之通訊品質,其整體之天線尺寸亦可進行大幅度微縮。另一方面,若以鍵盤邊框320上方之一箭號360作為一偵測方向,則由此行動裝置300所偵測出之一特定吸收率(Specific Absorption Rate,SAR)將能更容易符合法定規範。與傳統設計相比,所提之天線結構170於前述之第二頻帶FB2內之特定吸收率可降低約達50%,而所提之天線結構170於前述之第三頻帶FB3內之特定吸收率則可降低約達30%,但亦不僅限於此。第3圖之行動裝置300之其餘特徵皆與第1圖之行動裝置100類似,故此二實施例均可達成相似之操作效果。According to actual measurement results, since the
第4圖係顯示根據本發明一實施例所述之行動裝置300之天線結構170之輻射增益(Radiation Gain)圖,其中橫軸代表操作頻率(MHz),而縱軸代表輻射增益(dBi)。根據第4圖之量測結果,行動裝置300之天線結構170於前述之第一頻帶FB1和第二頻帶FB2內之輻射效率均可達約-4dBi,此已可滿足一般行動通訊裝置之實際應用需求。FIG. 4 is a diagram showing the radiation gain of the
本發明提出一種新穎之行動裝置及其天線結構。與傳統設計相比,本發明至少具有小尺寸、寬頻帶、高輻射效率、低製造成本,以及改良特定吸收率等優勢,故其很適合應用於各種各式之裝置當中。The present invention proposes a novel mobile device and antenna structure thereof. Compared with the traditional design, the present invention has at least the advantages of small size, wide bandwidth, high radiation efficiency, low manufacturing cost, and improved specific absorption rate, so it is very suitable for application in various devices.
值得注意的是,以上所述之元件尺寸、元件形狀,以及頻率範圍皆非為本發明之限制條件。天線設計者可以根據不同需要調整這些設定值。本發明之行動裝置並不僅限於第1-4圖所圖示之狀態。本發明可以僅包括第1-4圖之任何一或複數個實施例之任何一或複數項特徵。換言之,並非所有圖示之特徵均須同時實施於本發明之行動裝置當中。It is worth noting that the above-mentioned component size, component shape, and frequency range are not limiting conditions of the present invention. Antenna designers can adjust these settings according to different needs. The mobile device of the present invention is not limited to the states shown in Figures 1-4. The present invention may include only one or more features of any one or more embodiments of Figures 1-4. In other words, not all the features shown in the diagrams need to be implemented in the mobile device of the present invention at the same time.
在本說明書以及申請專利範圍中的序數,例如「第一」、「第二」、「第三」等等,彼此之間並沒有順序上的先後關係,其僅用於標示區分兩個具有相同名字之不同元件。Ordinal numbers in this specification and the scope of the patent application, such as "first", "second", "third", etc., have no sequential relationship with each other, and are only used to mark and distinguish two different components with the same name.
本發明雖以較佳實施例揭露如上,然其並非用以限定本發明的範圍,任何熟習此項技藝者,在不脫離本發明之精神和範圍內,當可做些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention is disclosed as above with the preferred embodiments, it is not intended to limit the scope of the present invention. Anyone skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the attached patent application.
100,300:行動裝置 110:接地元件 120:環狀輻射部 121:環狀輻射部之第一內緣 122:環狀輻射部之第二內緣 123:環狀輻射部之第三內緣 130:槽孔區域 140:第一輻射部 141:第一輻射部之第一端 142:第一輻射部之第二端 144:第一輻射部之第一部份 145:第一輻射部之第二部份 150:第二輻射部 151:第二輻射部之第一端 152:第二輻射部之第二端 160:介質基板 170:天線結構 190:信號源 310:揚聲器元件 315:非導體外殼 320:鍵盤邊框 330:底座外殼 340:導電泡棉 350:電池元件 360:箭號 D1:間距 FB1:第一頻帶 FB2:第二頻帶 FB3:第三頻帶 FP:饋入點 GC1:耦合間隙 L1,L2,L3:長度 W1,W2,W3:寬度 WB:邊寬 θ:銳夾角 100,300: mobile device 110: grounding element 120: annular radiating portion 121: first inner edge of the annular radiating portion 122: second inner edge of the annular radiating portion 123: third inner edge of the annular radiating portion 130: slot area 140: first radiating portion 141: first end of the first radiating portion 142: second end of the first radiating portion 144: first portion of the first radiating portion 145: second portion of the first radiating portion 150: second radiating portion 151: first end of the second radiating portion 152: second end of the second radiating portion 160: dielectric substrate 170: antenna structure 190: signal source 310: speaker element 315: non-conductive housing 320: keyboard frame 330: base housing 340: conductive foam 350: battery element 360: arrow D1: spacing FB1: first frequency band FB2: second frequency band FB3: third frequency band FP: feed point GC1: coupling gap L1, L2, L3: length W1, W2, W3: width WB: side width θ: sharp angle
第1圖係顯示根據本發明一實施例所述之行動裝置之俯視圖。 第2圖係顯示根據本發明一實施例所述之行動裝置之天線結構之返回損失圖。 第3圖係顯示根據本發明一實施例所述之行動裝置之剖面圖。 第4圖係顯示根據本發明一實施例所述之行動裝置之天線結構之輻射增益圖。 FIG. 1 is a top view of a mobile device according to an embodiment of the present invention. FIG. 2 is a return loss diagram of an antenna structure of a mobile device according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of a mobile device according to an embodiment of the present invention. FIG. 4 is a radiation gain diagram of an antenna structure of a mobile device according to an embodiment of the present invention.
100:行動裝置 100: Mobile devices
110:接地元件 110: Grounding element
120:環狀輻射部 120: Annular radiation section
121:環狀輻射部之第一內緣 121: The first inner edge of the annular radiation section
122:環狀輻射部之第二內緣 122: The second inner edge of the annular radiation
123:環狀輻射部之第三內緣 123: The third inner edge of the annular radiation
130:槽孔區域 130: Slot area
140:第一輻射部 140: First Radiation Division
141:第一輻射部之第一端 141: The first end of the first radiation section
142:第一輻射部之第二端 142: The second end of the first radiation section
144:第一輻射部之第一部份 144: The first part of the first radiation section
145:第一輻射部之第二部份 145: The second part of the first radiation section
150:第二輻射部 150: Second Radiation Division
151:第二輻射部之第一端 151: The first end of the second radiation section
152:第二輻射部之第二端 152: The second end of the second radiation section
160:介質基板 160: Dielectric substrate
170:天線結構 170: Antenna structure
190:信號源 190:Signal source
D1:間距 D1: Spacing
FP:饋入點 FP: Feed Point
GC1:耦合間隙 GC1: coupling gap
L1,L2,L3:長度 L1, L2, L3: Length
W1,W2,W3:寬度 W1,W2,W3:Width
WB:邊寬 WB:Border width
θ:銳夾角 θ: sharp angle
Claims (8)
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| TW112146989A TWI879279B (en) | 2023-12-04 | 2023-12-04 | Mobile device supporting wideband operation |
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| TW112146989A TWI879279B (en) | 2023-12-04 | 2023-12-04 | Mobile device supporting wideband operation |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140118204A1 (en) * | 2012-11-01 | 2014-05-01 | Nvidia Corporation | Antenna integrated with metal chassis |
| TW201807888A (en) * | 2016-08-30 | 2018-03-01 | 宏碁股份有限公司 | Mobile device |
| TW202002403A (en) * | 2018-06-07 | 2020-01-01 | 啓碁科技股份有限公司 | Antenna structure |
| TW202243330A (en) * | 2021-04-27 | 2022-11-01 | 廣達電腦股份有限公司 | Antenna structure |
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2023
- 2023-12-04 TW TW112146989A patent/TWI879279B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140118204A1 (en) * | 2012-11-01 | 2014-05-01 | Nvidia Corporation | Antenna integrated with metal chassis |
| TW201807888A (en) * | 2016-08-30 | 2018-03-01 | 宏碁股份有限公司 | Mobile device |
| TW202002403A (en) * | 2018-06-07 | 2020-01-01 | 啓碁科技股份有限公司 | Antenna structure |
| TW202243330A (en) * | 2021-04-27 | 2022-11-01 | 廣達電腦股份有限公司 | Antenna structure |
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