TWI878981B - Magnetic component - Google Patents
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- TWI878981B TWI878981B TW112126647A TW112126647A TWI878981B TW I878981 B TWI878981 B TW I878981B TW 112126647 A TW112126647 A TW 112126647A TW 112126647 A TW112126647 A TW 112126647A TW I878981 B TWI878981 B TW I878981B
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Abstract
Description
本發明關於一種磁性元件,尤指一種可降低磁芯的熱應力之磁性元件。 The present invention relates to a magnetic element, in particular to a magnetic element capable of reducing the thermal stress of a magnetic core.
因應電動車快速充電需求,操作的功率越來越大,使電子元件本身發熱量也越來越高。車載充電器(on-board charger,OBC)的磁性元件,如變壓器,工作時會因損耗而發熱,而熱不均勻下會對變壓器的磁芯產生額外熱應力,熱應力則會增加變壓器的磁芯損耗,持續循環下熱將無法收斂,導致溫度與損耗過高,嚴重則會造成磁芯不可逆的受損破裂。 In response to the demand for fast charging of electric vehicles, the operating power is getting higher and higher, causing the heat generated by the electronic components themselves to increase. The magnetic components of the on-board charger (OBC), such as the transformer, will generate heat due to loss during operation, and the uneven heat will generate additional thermal stress on the transformer's magnetic core, which will increase the transformer's magnetic core loss. Under continuous circulation, the heat will not be able to converge, resulting in excessive temperature and loss, and in severe cases, it will cause irreversible damage and rupture of the magnetic core.
本發明提供一種可降低磁芯的熱應力之磁性元件,以解決上述問題。 The present invention provides a magnetic element that can reduce the thermal stress of the magnetic core to solve the above problems.
根據一實施例,本發明之磁性元件包含一磁芯、至少一線圈以及一導熱填料。磁芯包含一內柱、至少二外柱以及至少一非接合區。至少一線圈纏繞於內柱或至少二外柱。導熱填料包覆磁芯之一部分。至少一非接合區之至少一部分不被導熱填料包覆。 According to one embodiment, the magnetic element of the present invention includes a magnetic core, at least one coil and a thermally conductive filler. The magnetic core includes an inner column, at least two outer columns and at least one non-joining area. At least one coil is wound around the inner column or at least two outer columns. The thermally conductive filler covers a portion of the magnetic core. At least a portion of at least one non-joining area is not covered by the thermally conductive filler.
根據另一實施例,本發明之磁性元件包含一磁芯、至少一線圈以及一導熱填料。磁芯包含一內柱、至少二外柱以及至少一非接合區。至少一非接合區位於至少二外柱處。至少一線圈纏繞於內柱或至少二外柱。導熱填料包覆磁芯之一部分與位於至少二外柱處之至少一非接合區。 According to another embodiment, the magnetic element of the present invention includes a magnetic core, at least one coil and a thermally conductive filler. The magnetic core includes an inner column, at least two outer columns and at least one non-bonding area. The at least one non-bonding area is located at at least two outer columns. At least one coil is wound around the inner column or at least two outer columns. The thermally conductive filler covers a portion of the magnetic core and at least one non-bonding area located at at least two outer columns.
根據另一實施例,本發明之磁性元件包含一磁芯、一支架、至少一線圈以及一導熱填料。磁芯包含一內柱、至少二外柱以及複數個非接合區。複 數個非接合區位於內柱與至少二外柱處。支架套設於內柱上。支架之一上表面接合於磁芯之一內板表面。至少一線圈設置於支架上。導熱填料包覆磁芯之一部分且未包覆複數個非接合區。 According to another embodiment, the magnetic element of the present invention includes a magnetic core, a bracket, at least one coil and a thermal conductive filler. The magnetic core includes an inner column, at least two outer columns and a plurality of non-joining areas. The plurality of non-joining areas are located at the inner column and at least two outer columns. The bracket is sleeved on the inner column. An upper surface of the bracket is joined to an inner plate surface of the magnetic core. At least one coil is disposed on the bracket. The thermal conductive filler covers a portion of the magnetic core and does not cover the plurality of non-joining areas.
根據另一實施例,本發明之磁性元件包含一磁芯、至少一隔板以及至少二線圈。磁芯包含一內柱以及至少二外柱。至少二線圈與至少一隔板相互堆疊且直接地套設在內柱。各線圈是由至少三層絕緣帶錯位包覆的導線所繞製而成。 According to another embodiment, the magnetic element of the present invention comprises a magnetic core, at least one partition and at least two coils. The magnetic core comprises an inner column and at least two outer columns. The at least two coils and at least one partition are stacked on each other and directly sleeved on the inner column. Each coil is wound by a wire with at least three layers of insulation strip staggered coating.
綜上所述,在一實施例中,至少一非接合區可位於內柱或至少二外柱處,且至少一非接合區之至少一部分可不被導熱填料包覆。藉此,具有非接合區之內柱或至少二外柱即可在磁芯的溫度差(或最大溫度)增加時自由變形,使得磁芯的熱應力降低,進而避免磁芯的損耗增加。此外,在另一實施例中,至少一非接合區可位於至少二外柱處,且導熱填料可包覆至少一非接合區。同樣地,具有非接合區之至少二外柱即可在磁芯的溫度差(或最大溫度)增加時自由變形,使得磁芯的熱應力降低,進而避免磁芯的損耗增加。在另一實施例中,可將線圈與隔板相互堆疊且直接地套設在磁芯的內柱,使得線圈不須纏繞於支架,就可以提升一次側線圈與二次側線圈之間、線圈與磁芯之間的絕緣性及散熱效果。藉此,磁性元件便不會受到支架的尺寸與空間限制,且隔板可與線圈緊密接觸,或利用引線蓋的結構延伸到二線圈之間來固定及最小化隔板與線圈兩者之間距及間隙,以使磁性元件的尺寸小型化。 In summary, in one embodiment, at least one non-bonding area may be located at the inner column or at least two outer columns, and at least a portion of at least one non-bonding area may not be covered by a thermally conductive filler. Thus, the inner column or at least two outer columns having a non-bonding area can be freely deformed when the temperature difference (or maximum temperature) of the magnetic core increases, so that the thermal stress of the magnetic core is reduced, thereby avoiding an increase in the loss of the magnetic core. In addition, in another embodiment, at least one non-bonding area may be located at at least two outer columns, and a thermally conductive filler may cover at least one non-bonding area. Similarly, at least two outer columns having a non-bonding area can be freely deformed when the temperature difference (or maximum temperature) of the magnetic core increases, so that the thermal stress of the magnetic core is reduced, thereby avoiding an increase in the loss of the magnetic core. In another embodiment, the coil and the partition can be stacked and directly sleeved on the inner column of the magnetic core, so that the coil does not need to be wrapped around the bracket, and the insulation and heat dissipation effect between the primary coil and the secondary coil, and between the coil and the magnetic core can be improved. In this way, the magnetic element will not be limited by the size and space of the bracket, and the partition can be in close contact with the coil, or the lead cover structure can be extended between the two coils to fix and minimize the distance and gap between the partition and the coil, so as to miniaturize the size of the magnetic element.
關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the attached drawings.
1,1',1",1''',1'''',3:磁性元件 1,1',1",1''',1'''',3: Magnetic components
10,30:磁芯 10,30: Magnetic core
10a:第一芯體 10a: First core
10b:第二芯體 10b: Second core
10c:第三芯體 10c: The third core
12:線圈 12: Coil
12a:一次側線圈 12a: Primary coil
12b:二次側線圈 12b: Secondary coil
14:導熱填料 14: Thermal conductive filler
16:殼體 16: Shell
18:隔板 18: Partition
18a:空隙 18a: Gap
18b,19a:導線槽 18b,19a: Wire duct
19:引線蓋 19: Lead cover
20,20':支架 20,20': Bracket
22:散熱件 22: Heat sink
100:內柱 100: Inner column
102:外柱 102: Outer column
104,104a,104b:非接合區 104,104a,104b: Non-joint area
106:接合區 106: Junction area
108a,108b:側壁 108a,108b: Side wall
110,112:內板表面 110,112: Inner panel surface
120:絕緣帶 120: Insulation zone
122:導線 122: Conductor wire
200:凸台 200: Boss
202,202a,202b:孔洞 202,202a,202b: Holes
202c:邊界 202c:Border
204:上板 204: Go up
206:下板 206: Lower board
208:上表面 208: Upper surface
210:下表面 210: Lower surface
300:板部 300: Board
302:V形槽 302: V-groove
1000:懸浮部 1000: Suspended part
H1,H2,H3:高度 H1,H2,H3:Height
L,X1,X2:長度 L, X1, X2: length
R:弧度 R: radians
S1:頂面 S1: Top surface
S2:側面 S2: Side
W1,W2:寬度 W1,W2: Width
第1圖為根據本發明一實施例之磁性元件的剖面圖。 Figure 1 is a cross-sectional view of a magnetic element according to an embodiment of the present invention.
第2圖為根據本發明另一實施例之磁性元件的剖面圖。 Figure 2 is a cross-sectional view of a magnetic element according to another embodiment of the present invention.
第3圖為第2圖中的隔板、引線蓋與二線圈的爆炸圖。 Figure 3 is an exploded view of the partition, lead cover and second coil in Figure 2.
第4圖為具有不同形狀的四隔板的示意圖。 Figure 4 is a schematic diagram of four partitions with different shapes.
第5圖為三層絕緣帶錯位包覆的導線的示意圖。 Figure 5 is a schematic diagram of a conductor with three layers of insulation tape wrapped in an offset manner.
第6圖為根據本發明另一實施例之磁性元件的立體圖。 Figure 6 is a three-dimensional diagram of a magnetic element according to another embodiment of the present invention.
第7圖為第6圖中的磁性元件的剖面圖。 Figure 7 is a cross-sectional view of the magnetic element in Figure 6.
第8圖為第6圖中的磁性元件的另一剖面圖。 Figure 8 is another cross-sectional view of the magnetic element in Figure 6.
第9圖為第7圖中的支架的立體圖。 Figure 9 is a three-dimensional image of the bracket in Figure 7.
第10圖為第9圖中的支架的俯視圖。 Figure 10 is a top view of the bracket in Figure 9.
第11圖為根據本發明另一實施例之磁性元件的剖面圖。 Figure 11 is a cross-sectional view of a magnetic element according to another embodiment of the present invention.
第12圖為根據本發明另一實施例之磁性元件的剖面圖。 Figure 12 is a cross-sectional view of a magnetic element according to another embodiment of the present invention.
第13圖為根據本發明另一實施例之磁性元件的剖面圖。 Figure 13 is a cross-sectional view of a magnetic element according to another embodiment of the present invention.
第14圖為根據本發明另一實施例之磁性元件的立體圖。 Figure 14 is a three-dimensional diagram of a magnetic element according to another embodiment of the present invention.
第15圖為根據本發明另一實施例之磁性元件的立體圖。 Figure 15 is a three-dimensional diagram of a magnetic element according to another embodiment of the present invention.
請參閱第1圖,第1圖為根據本發明一實施例之磁性元件1的剖面圖。
Please refer to Figure 1, which is a cross-sectional view of a
本發明之磁性元件1可為電抗器、變壓器、電感器或其它磁性元件。如第1圖所示,磁性元件1包含一磁芯10、至少一線圈12以及一導熱填料14。磁芯10包含一內柱100、至少二外柱102、至少一非接合區104以及至少一接合區106。在本實施例中,磁芯10可包含一第一芯體10a以及一第二芯體10b,其中內柱100可為自第一芯體10a延伸出之一中柱,且二外柱102可為自第一芯體10a之周圍延伸出之側柱。因此,在本實施例中,第一芯體10a可為E型磁芯、PQ型磁芯、T型磁芯或F型磁芯,且第二芯體10b可為I型磁芯、UU型磁芯、U型磁芯、U-I型磁芯、E-I型磁芯或F型磁芯。然而,第一芯體10a與第二芯體10b的類型可根據實際應用
而決定,本發明不以圖中所繪示之實施例為限。
The
至少一線圈12可纏繞於內柱100或至少二外柱102。在本實施例中,線圈12可纏繞於內柱100,但不以此為限。在另一實施例中,線圈12亦可纏繞於至少二外柱102。在本實施例中,第二芯體10b係設置於第一芯體10a上,且內柱100與第二芯體10b接合而形成接合區106。此外,第二芯體10b未與二外柱102接合,使得二非接合區104位於二外柱102與第二芯體10b之間。線圈12的類型可為圓線、矩形線或多股線。
At least one
在本實施例中,磁芯10可設置於殼體16中,且導熱填料14可充填於殼體16中,使得導熱填料14包覆磁芯10之一部分。此時,至少一非接合區104之至少一部分不被導熱填料14包覆。如第1圖所示,二非接合區104與接合區106不被導熱填料14包覆。藉此,具有二非接合區104之二外柱102即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。以功率6.6KW的電感器為例,最大熱應力可由68Mpa降低為27Mpa,且磁芯10的最高溫度可由154℃降低為96℃。需說明的是,磁芯10之一內板表面110可不被導熱填料14包覆。
In this embodiment, the
在本實施例中,導熱填料14的導熱係數可大於0.3W/mk,且導熱填料14的材料可包含環氧樹脂(epoxy)、矽膠(silicone)、聚氨酯(polyurethane,PU)、酚醛樹脂(phenolic resins)、熱塑性聚對苯二甲酸乙二醇酯(thermoplastic polyethylene terephthalate,PET)、聚醯胺(polyamide,PA)、聚苯硫醚(polyphenylene sulfide,PPS)、聚醚醚酮(polyetheretherketone,PEEK)等。
In this embodiment, the thermal conductivity of the thermal
請參閱第2圖至第5圖,第2圖為根據本發明另一實施例之磁性元件1的剖面圖,第3圖為第2圖中的隔板18、引線蓋19與二線圈12的爆炸圖,第4圖為具有不同形狀的四隔板18的示意圖,第5圖為三層絕緣帶120錯位包覆的導線122的示意圖。在一些實施例中,隔板18的材料具有導磁性與電性絕緣性、或是導
熱性且電性絕緣性。舉例而言,隔板18可藉由磁粉與塑料混合後射出成型、或是選用磁性體(例如Ferrite)、或是高導熱性且電性絕緣性(例如陶瓷材料)。在本實施例中,至少一線圈12可包含一一次側線圈(primary coil)12a以及一二次側線圈(secondary coil)12b,其剖面可以是圓形、橢圓形或是矩形,其中,矩形可以有效提升體積利用率。如第4圖所示,隔板18可包含設置於一次側線圈12a與二次側線圈12b之間的一環形結構(例如,圓形、橢圓形、半圓形或半橢圓形)。藉此,可增加漏電感(leakage inductance,Lk)與功率密度(power density)。此外,磁性元件1更可包含引線蓋19,直接地套設在磁芯10的內柱100且堆疊於隔板18與二線圈12的上方處,用以將線圈12的端線經由引線蓋19的導線槽19a引出磁芯10外,本實施例中,引線蓋19為電性絕緣性材料。本實施例中,隔板18更包含導線槽18b對應於引線蓋19的導線槽19a,隔板18、引線蓋19以及二線圈12相互堆疊且直接地套設在磁芯10的內柱100時,線圈12的端線會經由引線蓋19的導線槽19a及隔板18的導線槽18b引出磁芯10外。
Please refer to Figures 2 to 5. Figure 2 is a cross-sectional view of a
如第2圖與第3圖所示,磁性元件1可包含一磁芯10、至少一隔板18以及至少二線圈12,其中至少二線圈12與至少一隔板18相互堆疊且直接地套設在內柱100。在本實施例中,磁性元件1可包含相互堆疊的一隔板18、一引線蓋19以及二線圈12。線圈12不須纏繞於支架。在將線圈12繞製成空氣線圈後,可將線圈12與隔板18相互堆疊且直接地套設在磁芯10的內柱100。在本實施例中,線圈12的繞製結構是由上下兩層的外側出線(外外繞),不同於由內側出線的繞製結構(內外繞),有較佳的平整性。藉此,磁性元件1便不會受到支架的尺寸與空間限制,且隔板18可與線圈12緊密接觸,或利用引線蓋19的結構延伸到二線圈12之間來固定及最小化隔板18與線圈12兩者之間距及間隙,以使磁性元件1的尺寸小型化。由於磁性元件1的空間與尺寸可小型化,散熱路徑即可縮短且沒有包覆內柱的結構的(繞線)支架及引線蓋,以得到良好的散熱效果。本實施例中,隔板18具有空
隙18a,隔板18與二線圈12堆疊時,導熱填料14可以填入二線圈12的相對重疊表面之間的空隙18a、內柱與二線圈12之間相對的表面,導熱填料14更可以包覆二線圈12及隔板18向外的表面,使二線圈12的散熱表面增加,進而得到良好的散熱效果。於一些實施例中,不含導熱填料14,在沒有套設隔板及線圈的支架下,氣流較易於進入隔板18、引線蓋19以及二線圈12,可以得到良好的散熱效果。於一些實施例中,為了在沒有支架下可以使其兩線圈12之間、兩線圈12分別與磁芯10之間的絕緣性維持一樣,兩線圈12是由至少三層絕緣帶120錯位包覆的導線122(如第5圖所示)所繞製而成,單一個絕緣帶120由第一層錯位地堆疊到至少第二、三層,其錯位重疊比例(W2/W1)大於67%,其中W1為單片絕緣帶120的寬度,且W2為重疊寬度。絕緣帶120可選用PI絕緣膜(聚醯亞胺(Polyimide Film))。單條導線122或多條導線122為具有絕緣層包覆的漆包線較佳。
As shown in FIG. 2 and FIG. 3, the
請參閱第6圖至第10圖,第6圖為根據本發明另一實施例之磁性元件1'的立體圖,第7圖為第6圖中的磁性元件1'的剖面圖,第8圖為第6圖中的磁性元件1'的另一剖面圖,第9圖為第7圖中的支架20的立體圖,第10圖為第9圖中的支架20的俯視圖。
Please refer to Figures 6 to 10. Figure 6 is a three-dimensional view of a magnetic element 1' according to another embodiment of the present invention, Figure 7 is a cross-sectional view of the magnetic element 1' in Figure 6, Figure 8 is another cross-sectional view of the magnetic element 1' in Figure 6, Figure 9 is a three-dimensional view of the
磁性元件1'與上述的磁性元件1的主要不同之處在於,磁性元件1'另包含一支架20,且內柱100另包含一懸浮部1000,如第6圖至第9圖所示。在本實施例中,懸浮部1000佔內柱100的比例T可為50%或2%~95%。進一步來說,內柱100具有長度X1,且懸浮部1000具有長度X2,則懸浮部1000佔內柱100的比例T係為X2/X1。支架20套設於內柱100上,且至少一線圈12設置於支架20上。因此,線圈12仍是纏繞於內柱100。在本實施例中,支架20之內側具有一凸台200,且內柱100之懸浮部1000支撐於凸台200,使得懸浮部1000位於第一芯體10a與第二芯體10b之間。在本實施例中,凸台200可自內柱100之外側朝內側延伸,以支撐懸浮部1000。
The main difference between the magnetic element 1' and the above-mentioned
在本實施例中,第一芯體10a與第二芯體10b在二外柱102處相互接合而形成二接合區106。此外,第二芯體10b不與懸浮部1000接合,且懸浮部1000支撐於凸台200,使得二非接合區104a、104b位於懸浮部1000之相對二側。在導熱填料14充填於殼體16中後,二非接合區104a、104b的其中之一不被導熱填料14(完全)包覆。如第7圖所示,在懸浮部1000下方的非接合區104a與二接合區106皆被導熱填料14包覆,且在懸浮部1000上方的非接合區104b不被導熱填料14包覆。藉此,具有非接合區104b之內柱100即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。
In this embodiment, the
在本實施例中,導熱填料14之高度H1可小於或等於支架20之高度H2,使得導熱填料14不接觸第二芯體10b的底面。因此,導熱填料14的熱膨脹應力可大幅降低,且第二芯體10b與內柱100不會因導熱填料14的較高熱應力而相互作用,進而降低磁芯10的溫度差(或最大溫度)。藉此,磁芯10的熱應力即可降低,進而避免磁芯10的損耗增加。
In this embodiment, the height H1 of the thermally
如第7圖與第9圖所示,至少一孔洞202可形成於支架20上,以使導熱填料14接觸至少一線圈12之內側,且增加導熱填料14與內柱100間之接觸面積,進而增加散熱路徑,有效降低溫度差(或最大溫度),且降低因熱造成的額外損耗。在本實施例中,至少一孔洞202的其中之一可自支架20之一上板204朝支架20之一下板206延伸,且至少一孔洞202的其中之一之邊界可在支架20之上板204與下板206重疊。如第9圖所示,至少一孔洞202包含二孔洞202a以及二孔洞202b。二孔洞202b可自支架20之上板204朝支架20之下板206延伸,且各孔洞202b之邊界202c可在上板204與下板206重疊,如第9圖與第10圖所示。藉此,導熱填料14更容易流入支架20,以自線圈12傳導更多的熱量。此外,可以較少的模具製造支架20(射出成型),以降低成本。
As shown in FIG. 7 and FIG. 9, at least one
舉例而言,當磁性元件1'為功率5.5KW的電感器或變壓器,且懸浮部
1000佔內柱100的比例為30%時,最大熱應力可由52Mpa降低為28.6Mpa,且磁芯10的最高溫度可由110℃降低為87.106℃。雖然懸浮部1000的溫度為128.45℃,懸浮部1000是簡單的柱狀,不會開裂。若進一步考量具有大截面積的線圈的繞線位置時,懸浮部1000佔內柱100的比例與具有大線徑的線圈的繞線位置如下。需說明的是,至少一線圈12可包含一一次側線圈12a以及一二次側線圈12b,其中二次側線圈12b之位置對應懸浮部1000,且一次側線圈12a之位置對應第一芯體10a之內柱100。一次側線圈12a具有一截面積D1,且二次側線圈12b具有一截面積D2。若一次側線圈12a之截面積D1大於二次側線圈12b之截面積D2,則一次側線圈12a之運作溫度高於二次側線圈12b之運作溫度,且懸浮部1000佔內柱100的比例T可滿足50%<T≦95%。若一次側線圈12a之截面積D1小於二次側線圈12b之截面積D2,則二次側線圈12b之運作溫度高於一次側線圈12a之運作溫度,且懸浮部1000佔內柱100的比例T可滿足2%≦T<50%。
For example, when the magnetic element 1' is an inductor or transformer with a power of 5.5KW, and the proportion of the
如第6圖與第7圖所示,磁性元件1'可另包含一散熱件22,設置於磁芯10上,其中散熱件22接觸磁芯10之一頂面S1與一側面S2。在本實施例中,磁性元件1'可包含二散熱件22,設置於磁芯10之相對二側,但不以此為限。在本實施例中,散熱件22可為L形,且散熱件22接觸磁芯10之側面S2的部分之長度L可小於磁芯10之高度H3。藉此,即使磁芯10在高度上存在公差,散熱件22亦可與磁芯10之頂面S1保持接觸而無間隙,進而增進散熱效果。此外,由於有二散熱件22貼合於頂面S1與側面S2,散熱件22可藉由成本較低與公差較高的製程來製造。具有L形的散熱件22不限制應用,亦可應用在其他實施例中。
As shown in FIG. 6 and FIG. 7 , the
在本實施例中,導熱填料14可包覆散熱件22之一部分,使得散熱件22可將熱傳導至底部。此外,散熱件22可藉由肖氏D或肖氏A硬度(Shore D or Shore A hardness)小於80的膠體貼附於磁芯10上,以降低磁芯10的溫度差(或最大溫度)且降低熱應力。舉例而言,若肖氏D硬度大於80,磁芯10對應的最大溫度可
為59.3℃;若肖氏D硬度小於80,磁芯10對應的最大溫度可為50.6℃。
In this embodiment, the thermal
請參閱第11圖,第11圖為根據本發明另一實施例之磁性元件1"的剖面圖。
Please refer to Figure 11, which is a cross-sectional view of a
磁性元件1"與上述的磁性元件1的主要不同之處在於,除了第一芯體10a與第二芯體10b外,磁性元件1"另包含一第三芯體10c。如第11圖所示,第一芯體10a與第二芯體10b並排且在二外柱102處與第三芯體10c接合,而形成接合區106。此外,第一芯體10a與第二芯體10b之二相鄰側壁108a、108b未相互接合,使得非接合區104a位於第一芯體10a與第二芯體10b之二相鄰側壁108a、108b之間。在本實施例中,二相鄰側壁108a、108b形成內柱100之一部分。第三芯體10c之內柱100與第一芯體10a及第二芯體10b之內柱100相對設置且未接合,進而形成另一非接合區104b。第三芯體10c之內柱100係一體成型而無間隙。第一芯體10a與第二芯體10b之二相鄰側壁108a、108b在內柱100處彼此相對。
The main difference between the
在導熱填料14充填於殼體16中後,非接合區104a的至少一部分不被導熱填料14包覆。如第11圖所示,二相鄰側壁108a、108b之間的非接合區104a的下方部分與二接合區106被導熱填料14包覆,且非接合區104a的上方部分不被導熱填料14包覆。此外,第三芯體10c之內柱100上方的非接合區104b亦被導熱填料14包覆。藉此,具有非接合區104a的上方部分之內柱100即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。舉例而言,當磁性元件1"為功率3.7KW的電感器或變壓器時,最大熱應力可由48Mpa降低為16Mpa,且磁芯10的最高溫度可由150℃降低為120℃。
After the thermally
請參閱第12圖,第12圖為根據本發明另一實施例之磁性元件1'''的剖面圖。 Please refer to Figure 12, which is a cross-sectional view of a magnetic element 1''' according to another embodiment of the present invention.
磁性元件1'''與上述的磁性元件1的主要不同之處在於,導熱填料14包覆至少一非接合區104,其中至少一非接合區104位於至少二外柱102處,且至少
一接合區106位於內柱100處,如第12圖所示。在本實施例中,第一芯體10a與第二芯體10b為E型磁芯、PQ型磁芯、T型磁芯、UU型磁芯、U型磁芯、U-I型磁芯、E-I型磁芯、I型磁芯或F型磁芯中的其中之二,使得二非接合區104位於二外柱102處,且一接合區106位於內柱100處。換言之,磁芯10之二外柱102未接合,且磁芯10之內柱100被接合。在導熱填料14充填於殼體16中後,導熱填料14包覆磁芯10之一部分、位於二外柱102處之二非接合區104以及位於內柱100處之接合區106。藉此,具有非接合區104的二外柱102即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。舉例而言,當磁性元件1'''為功率6.6KW的電感器或變壓器時,最大熱應力可由68Mpa降低為32.4Mpa,且磁芯10的最高溫度可由154℃降低為115.2℃。
The main difference between the magnetic element 1''' and the
請參閱第13圖,第13圖為根據本發明另一實施例之磁性元件1''''的剖面圖。 Please refer to Figure 13, which is a cross-sectional view of a magnetic element 1'''' according to another embodiment of the present invention.
磁性元件1''''與上述的磁性元件1的主要不同之處在於,除了磁芯10、至少一線圈12與導熱填料14外,磁性元件1''''另包含一支架20',如第13圖所示。磁芯10包含一內柱100、至少二外柱102以及複數個非接合區104。複數個非接合區104位於內柱100與至少二外柱102處。支架20'套設於內柱100上。支架20'之一上表面208可藉由膠體接合於磁芯10之一內板表面110。至少一線圈12設置於支架20'上。在導熱填料14充填於殼體16中後,導熱填料14包覆磁芯10之一部分且未包覆複數個非接合區104。藉此,具有複數個非接合區104的內柱100與至少二外柱102即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。在另一實施例中,支架20'之一下表面210可進一步藉由膠體接合於磁芯10之另一內板表面112,其中二內板表面110、112彼此相對。
The main difference between the magnetic element 1'''' and the above-mentioned
請參閱第14圖,第14圖為根據本發明另一實施例之磁性元件3的立體
圖。
Please refer to Figure 14, which is a three-dimensional diagram of the
如第14圖所示,磁性元件3之磁芯30具有一板部300以及一V形槽302,其中V形槽302形成於板部300之一側邊。在本實施例中,具有V形槽302的板部300之側邊為不具有非連續幾何結構的連續側邊,以避免應力集中。在本實施例中,V形槽302之二側邊之間的接合處的位置對應磁芯30之內柱。
As shown in FIG. 14 , the
請參閱第15圖,第15圖為根據本發明另一實施例之磁性元件3的立體圖。
Please refer to Figure 15, which is a three-dimensional diagram of the
如第15圖所示,V形槽302之尖端的弧度R可為大於5,以避免V形槽302過於尖銳而影響板部300的強度。舉例而言,若弧度R為0.8,對應V形槽302的最大熱應力可為85.6MPa;若弧度R為5,對應V形槽302的最大熱應力可為64.3MPa。具有V形槽302及弧度R的磁芯30不限制應用,亦可應用在其他實施例中。
As shown in FIG. 15 , the curvature R of the tip of the V-
綜上所述,在一實施例中,至少一非接合區可位於內柱或至少二外柱處,且至少一非接合區之至少一部分可不被導熱填料包覆。藉此,具有非接合區之內柱或至少二外柱即可在磁芯的溫度差(或最大溫度)增加時自由變形,使得磁芯的熱應力降低,進而避免磁芯的損耗增加。此外,在另一實施例中,至少一非接合區可位於至少二外柱處,且導熱填料可包覆至少一非接合區或/及位於內柱處的接合區。同樣地,具有非接合區之至少二外柱即可在磁芯的溫度差(或最大溫度)增加時自由變形,使得磁芯的熱應力降低,進而避免磁芯的損耗增加。需說明的是,本文所述之溫度差係指同一時間在磁芯的兩個不同位置之間的溫度差。在另一實施例中,可將線圈與隔板相互堆疊且直接地套設在磁芯的內柱,使得線圈不須纏繞於支架,就可以提升一次側線圈與二次側線圈之間、線圈與磁芯之間的絕緣性及散熱效果。藉此,磁性元件便不會受到支架的尺寸與空間限制,且隔板可與線圈緊密接觸,或利用引線蓋的結構延伸到二線圈之間來固定及最小化隔板與線圈兩者之間距及間隙,以使磁性元件的尺寸 小型化。 In summary, in one embodiment, at least one non-bonding area may be located at the inner column or at least two outer columns, and at least a portion of at least one non-bonding area may not be covered by a thermally conductive filler. Thus, the inner column or at least two outer columns having a non-bonding area can be deformed freely when the temperature difference (or maximum temperature) of the magnetic core increases, so that the thermal stress of the magnetic core is reduced, thereby avoiding an increase in the loss of the magnetic core. In addition, in another embodiment, at least one non-bonding area may be located at at least two outer columns, and the thermally conductive filler may cover at least one non-bonding area and/or a bonding area located at the inner column. Similarly, at least two outer columns having a non-bonding area can be deformed freely when the temperature difference (or maximum temperature) of the magnetic core increases, so that the thermal stress of the magnetic core is reduced, thereby avoiding an increase in the loss of the magnetic core. It should be noted that the temperature difference described in this article refers to the temperature difference between two different positions of the magnetic core at the same time. In another embodiment, the coil and the partition can be stacked and directly sleeved on the inner column of the magnetic core, so that the coil does not need to be wrapped around the bracket, and the insulation and heat dissipation effect between the primary coil and the secondary coil, and between the coil and the magnetic core can be improved. In this way, the magnetic element will not be limited by the size and space of the bracket, and the partition can be in close contact with the coil, or the lead cover structure can be extended between the two coils to fix and minimize the distance and gap between the partition and the coil, so as to miniaturize the size of the magnetic element.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above is only the preferred embodiment of the present invention. All equivalent changes and modifications made within the scope of the patent application of the present invention shall fall within the scope of the present invention.
1:磁性元件 1: Magnetic components
10:磁芯 10: Magnetic core
10a:第一芯體 10a: First core
10b:第二芯體 10b: Second core
12:線圈 12: Coil
12a:一次側線圈 12a: Primary coil
12b:二次側線圈 12b: Secondary coil
14:導熱填料 14: Thermal conductive filler
18:隔板 18: Partition
19:引線蓋 19: Lead cover
100:內柱 100: Inner column
Claims (17)
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