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TWI878981B - Magnetic component - Google Patents

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Publication number
TWI878981B
TWI878981B TW112126647A TW112126647A TWI878981B TW I878981 B TWI878981 B TW I878981B TW 112126647 A TW112126647 A TW 112126647A TW 112126647 A TW112126647 A TW 112126647A TW I878981 B TWI878981 B TW I878981B
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Taiwan
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magnetic element
magnetic core
magnetic
coil
core
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TW112126647A
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Chinese (zh)
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TW202505550A (en
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程信榮
簡伯修
徐永壽
陳渾能
謝協伸
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乾坤科技股份有限公司
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Abstract

A magnetic component includes a core, at least one spacer and at least two coils. The core includes an inner leg and at least two outer legs. The at least two coils and the at least one spacer are stacked with each other and directly sleeved on the inner leg. Each of the at least two coils is formed by winding a wire covered by at least three misaligned layers of insulating tape.

Description

磁性元件 Magnetic components

本發明關於一種磁性元件,尤指一種可降低磁芯的熱應力之磁性元件。 The present invention relates to a magnetic element, in particular to a magnetic element capable of reducing the thermal stress of a magnetic core.

因應電動車快速充電需求,操作的功率越來越大,使電子元件本身發熱量也越來越高。車載充電器(on-board charger,OBC)的磁性元件,如變壓器,工作時會因損耗而發熱,而熱不均勻下會對變壓器的磁芯產生額外熱應力,熱應力則會增加變壓器的磁芯損耗,持續循環下熱將無法收斂,導致溫度與損耗過高,嚴重則會造成磁芯不可逆的受損破裂。 In response to the demand for fast charging of electric vehicles, the operating power is getting higher and higher, causing the heat generated by the electronic components themselves to increase. The magnetic components of the on-board charger (OBC), such as the transformer, will generate heat due to loss during operation, and the uneven heat will generate additional thermal stress on the transformer's magnetic core, which will increase the transformer's magnetic core loss. Under continuous circulation, the heat will not be able to converge, resulting in excessive temperature and loss, and in severe cases, it will cause irreversible damage and rupture of the magnetic core.

本發明提供一種可降低磁芯的熱應力之磁性元件,以解決上述問題。 The present invention provides a magnetic element that can reduce the thermal stress of the magnetic core to solve the above problems.

根據一實施例,本發明之磁性元件包含一磁芯、至少一線圈以及一導熱填料。磁芯包含一內柱、至少二外柱以及至少一非接合區。至少一線圈纏繞於內柱或至少二外柱。導熱填料包覆磁芯之一部分。至少一非接合區之至少一部分不被導熱填料包覆。 According to one embodiment, the magnetic element of the present invention includes a magnetic core, at least one coil and a thermally conductive filler. The magnetic core includes an inner column, at least two outer columns and at least one non-joining area. At least one coil is wound around the inner column or at least two outer columns. The thermally conductive filler covers a portion of the magnetic core. At least a portion of at least one non-joining area is not covered by the thermally conductive filler.

根據另一實施例,本發明之磁性元件包含一磁芯、至少一線圈以及一導熱填料。磁芯包含一內柱、至少二外柱以及至少一非接合區。至少一非接合區位於至少二外柱處。至少一線圈纏繞於內柱或至少二外柱。導熱填料包覆磁芯之一部分與位於至少二外柱處之至少一非接合區。 According to another embodiment, the magnetic element of the present invention includes a magnetic core, at least one coil and a thermally conductive filler. The magnetic core includes an inner column, at least two outer columns and at least one non-bonding area. The at least one non-bonding area is located at at least two outer columns. At least one coil is wound around the inner column or at least two outer columns. The thermally conductive filler covers a portion of the magnetic core and at least one non-bonding area located at at least two outer columns.

根據另一實施例,本發明之磁性元件包含一磁芯、一支架、至少一線圈以及一導熱填料。磁芯包含一內柱、至少二外柱以及複數個非接合區。複 數個非接合區位於內柱與至少二外柱處。支架套設於內柱上。支架之一上表面接合於磁芯之一內板表面。至少一線圈設置於支架上。導熱填料包覆磁芯之一部分且未包覆複數個非接合區。 According to another embodiment, the magnetic element of the present invention includes a magnetic core, a bracket, at least one coil and a thermal conductive filler. The magnetic core includes an inner column, at least two outer columns and a plurality of non-joining areas. The plurality of non-joining areas are located at the inner column and at least two outer columns. The bracket is sleeved on the inner column. An upper surface of the bracket is joined to an inner plate surface of the magnetic core. At least one coil is disposed on the bracket. The thermal conductive filler covers a portion of the magnetic core and does not cover the plurality of non-joining areas.

根據另一實施例,本發明之磁性元件包含一磁芯、至少一隔板以及至少二線圈。磁芯包含一內柱以及至少二外柱。至少二線圈與至少一隔板相互堆疊且直接地套設在內柱。各線圈是由至少三層絕緣帶錯位包覆的導線所繞製而成。 According to another embodiment, the magnetic element of the present invention comprises a magnetic core, at least one partition and at least two coils. The magnetic core comprises an inner column and at least two outer columns. The at least two coils and at least one partition are stacked on each other and directly sleeved on the inner column. Each coil is wound by a wire with at least three layers of insulation strip staggered coating.

綜上所述,在一實施例中,至少一非接合區可位於內柱或至少二外柱處,且至少一非接合區之至少一部分可不被導熱填料包覆。藉此,具有非接合區之內柱或至少二外柱即可在磁芯的溫度差(或最大溫度)增加時自由變形,使得磁芯的熱應力降低,進而避免磁芯的損耗增加。此外,在另一實施例中,至少一非接合區可位於至少二外柱處,且導熱填料可包覆至少一非接合區。同樣地,具有非接合區之至少二外柱即可在磁芯的溫度差(或最大溫度)增加時自由變形,使得磁芯的熱應力降低,進而避免磁芯的損耗增加。在另一實施例中,可將線圈與隔板相互堆疊且直接地套設在磁芯的內柱,使得線圈不須纏繞於支架,就可以提升一次側線圈與二次側線圈之間、線圈與磁芯之間的絕緣性及散熱效果。藉此,磁性元件便不會受到支架的尺寸與空間限制,且隔板可與線圈緊密接觸,或利用引線蓋的結構延伸到二線圈之間來固定及最小化隔板與線圈兩者之間距及間隙,以使磁性元件的尺寸小型化。 In summary, in one embodiment, at least one non-bonding area may be located at the inner column or at least two outer columns, and at least a portion of at least one non-bonding area may not be covered by a thermally conductive filler. Thus, the inner column or at least two outer columns having a non-bonding area can be freely deformed when the temperature difference (or maximum temperature) of the magnetic core increases, so that the thermal stress of the magnetic core is reduced, thereby avoiding an increase in the loss of the magnetic core. In addition, in another embodiment, at least one non-bonding area may be located at at least two outer columns, and a thermally conductive filler may cover at least one non-bonding area. Similarly, at least two outer columns having a non-bonding area can be freely deformed when the temperature difference (or maximum temperature) of the magnetic core increases, so that the thermal stress of the magnetic core is reduced, thereby avoiding an increase in the loss of the magnetic core. In another embodiment, the coil and the partition can be stacked and directly sleeved on the inner column of the magnetic core, so that the coil does not need to be wrapped around the bracket, and the insulation and heat dissipation effect between the primary coil and the secondary coil, and between the coil and the magnetic core can be improved. In this way, the magnetic element will not be limited by the size and space of the bracket, and the partition can be in close contact with the coil, or the lead cover structure can be extended between the two coils to fix and minimize the distance and gap between the partition and the coil, so as to miniaturize the size of the magnetic element.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the attached drawings.

1,1',1",1''',1'''',3:磁性元件 1,1',1",1''',1'''',3: Magnetic components

10,30:磁芯 10,30: Magnetic core

10a:第一芯體 10a: First core

10b:第二芯體 10b: Second core

10c:第三芯體 10c: The third core

12:線圈 12: Coil

12a:一次側線圈 12a: Primary coil

12b:二次側線圈 12b: Secondary coil

14:導熱填料 14: Thermal conductive filler

16:殼體 16: Shell

18:隔板 18: Partition

18a:空隙 18a: Gap

18b,19a:導線槽 18b,19a: Wire duct

19:引線蓋 19: Lead cover

20,20':支架 20,20': Bracket

22:散熱件 22: Heat sink

100:內柱 100: Inner column

102:外柱 102: Outer column

104,104a,104b:非接合區 104,104a,104b: Non-joint area

106:接合區 106: Junction area

108a,108b:側壁 108a,108b: Side wall

110,112:內板表面 110,112: Inner panel surface

120:絕緣帶 120: Insulation zone

122:導線 122: Conductor wire

200:凸台 200: Boss

202,202a,202b:孔洞 202,202a,202b: Holes

202c:邊界 202c:Border

204:上板 204: Go up

206:下板 206: Lower board

208:上表面 208: Upper surface

210:下表面 210: Lower surface

300:板部 300: Board

302:V形槽 302: V-groove

1000:懸浮部 1000: Suspended part

H1,H2,H3:高度 H1,H2,H3:Height

L,X1,X2:長度 L, X1, X2: length

R:弧度 R: radians

S1:頂面 S1: Top surface

S2:側面 S2: Side

W1,W2:寬度 W1,W2: Width

第1圖為根據本發明一實施例之磁性元件的剖面圖。 Figure 1 is a cross-sectional view of a magnetic element according to an embodiment of the present invention.

第2圖為根據本發明另一實施例之磁性元件的剖面圖。 Figure 2 is a cross-sectional view of a magnetic element according to another embodiment of the present invention.

第3圖為第2圖中的隔板、引線蓋與二線圈的爆炸圖。 Figure 3 is an exploded view of the partition, lead cover and second coil in Figure 2.

第4圖為具有不同形狀的四隔板的示意圖。 Figure 4 is a schematic diagram of four partitions with different shapes.

第5圖為三層絕緣帶錯位包覆的導線的示意圖。 Figure 5 is a schematic diagram of a conductor with three layers of insulation tape wrapped in an offset manner.

第6圖為根據本發明另一實施例之磁性元件的立體圖。 Figure 6 is a three-dimensional diagram of a magnetic element according to another embodiment of the present invention.

第7圖為第6圖中的磁性元件的剖面圖。 Figure 7 is a cross-sectional view of the magnetic element in Figure 6.

第8圖為第6圖中的磁性元件的另一剖面圖。 Figure 8 is another cross-sectional view of the magnetic element in Figure 6.

第9圖為第7圖中的支架的立體圖。 Figure 9 is a three-dimensional image of the bracket in Figure 7.

第10圖為第9圖中的支架的俯視圖。 Figure 10 is a top view of the bracket in Figure 9.

第11圖為根據本發明另一實施例之磁性元件的剖面圖。 Figure 11 is a cross-sectional view of a magnetic element according to another embodiment of the present invention.

第12圖為根據本發明另一實施例之磁性元件的剖面圖。 Figure 12 is a cross-sectional view of a magnetic element according to another embodiment of the present invention.

第13圖為根據本發明另一實施例之磁性元件的剖面圖。 Figure 13 is a cross-sectional view of a magnetic element according to another embodiment of the present invention.

第14圖為根據本發明另一實施例之磁性元件的立體圖。 Figure 14 is a three-dimensional diagram of a magnetic element according to another embodiment of the present invention.

第15圖為根據本發明另一實施例之磁性元件的立體圖。 Figure 15 is a three-dimensional diagram of a magnetic element according to another embodiment of the present invention.

請參閱第1圖,第1圖為根據本發明一實施例之磁性元件1的剖面圖。 Please refer to Figure 1, which is a cross-sectional view of a magnetic element 1 according to an embodiment of the present invention.

本發明之磁性元件1可為電抗器、變壓器、電感器或其它磁性元件。如第1圖所示,磁性元件1包含一磁芯10、至少一線圈12以及一導熱填料14。磁芯10包含一內柱100、至少二外柱102、至少一非接合區104以及至少一接合區106。在本實施例中,磁芯10可包含一第一芯體10a以及一第二芯體10b,其中內柱100可為自第一芯體10a延伸出之一中柱,且二外柱102可為自第一芯體10a之周圍延伸出之側柱。因此,在本實施例中,第一芯體10a可為E型磁芯、PQ型磁芯、T型磁芯或F型磁芯,且第二芯體10b可為I型磁芯、UU型磁芯、U型磁芯、U-I型磁芯、E-I型磁芯或F型磁芯。然而,第一芯體10a與第二芯體10b的類型可根據實際應用 而決定,本發明不以圖中所繪示之實施例為限。 The magnetic element 1 of the present invention can be a reactor, a transformer, an inductor or other magnetic elements. As shown in FIG. 1 , the magnetic element 1 includes a magnetic core 10, at least one coil 12 and a thermally conductive filler 14. The magnetic core 10 includes an inner column 100, at least two outer columns 102, at least one non-joining area 104 and at least one joining area 106. In this embodiment, the magnetic core 10 can include a first core 10a and a second core 10b, wherein the inner column 100 can be a middle column extending from the first core 10a, and the two outer columns 102 can be side columns extending from the periphery of the first core 10a. Therefore, in this embodiment, the first core 10a can be an E-type magnetic core, a PQ-type magnetic core, a T-type magnetic core or an F-type magnetic core, and the second core 10b can be an I-type magnetic core, a UU-type magnetic core, a U-type magnetic core, a U-I-type magnetic core, an E-I-type magnetic core or an F-type magnetic core. However, the types of the first core 10a and the second core 10b can be determined according to actual applications, and the present invention is not limited to the embodiments shown in the figure.

至少一線圈12可纏繞於內柱100或至少二外柱102。在本實施例中,線圈12可纏繞於內柱100,但不以此為限。在另一實施例中,線圈12亦可纏繞於至少二外柱102。在本實施例中,第二芯體10b係設置於第一芯體10a上,且內柱100與第二芯體10b接合而形成接合區106。此外,第二芯體10b未與二外柱102接合,使得二非接合區104位於二外柱102與第二芯體10b之間。線圈12的類型可為圓線、矩形線或多股線。 At least one coil 12 can be wound around the inner column 100 or at least two outer columns 102. In this embodiment, the coil 12 can be wound around the inner column 100, but is not limited thereto. In another embodiment, the coil 12 can also be wound around at least two outer columns 102. In this embodiment, the second core 10b is disposed on the first core 10a, and the inner column 100 and the second core 10b are joined to form a joint area 106. In addition, the second core 10b is not joined to the two outer columns 102, so that two non-joint areas 104 are located between the two outer columns 102 and the second core 10b. The type of the coil 12 can be round wire, rectangular wire or multi-strand wire.

在本實施例中,磁芯10可設置於殼體16中,且導熱填料14可充填於殼體16中,使得導熱填料14包覆磁芯10之一部分。此時,至少一非接合區104之至少一部分不被導熱填料14包覆。如第1圖所示,二非接合區104與接合區106不被導熱填料14包覆。藉此,具有二非接合區104之二外柱102即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。以功率6.6KW的電感器為例,最大熱應力可由68Mpa降低為27Mpa,且磁芯10的最高溫度可由154℃降低為96℃。需說明的是,磁芯10之一內板表面110可不被導熱填料14包覆。 In this embodiment, the magnetic core 10 can be disposed in the housing 16, and the thermal conductive filler 14 can be filled in the housing 16, so that the thermal conductive filler 14 covers a portion of the magnetic core 10. At this time, at least a portion of at least one non-bonding area 104 is not covered by the thermal conductive filler 14. As shown in FIG. 1, the two non-bonding areas 104 and the bonding area 106 are not covered by the thermal conductive filler 14. Thereby, the two outer columns 102 having the two non-bonding areas 104 can be deformed freely when the temperature difference (or maximum temperature) of the magnetic core 10 increases, so that the thermal stress of the magnetic core 10 is reduced, thereby avoiding the increase of the loss of the magnetic core 10. Taking a 6.6KW inductor as an example, the maximum thermal stress can be reduced from 68Mpa to 27Mpa, and the maximum temperature of the magnetic core 10 can be reduced from 154°C to 96°C. It should be noted that one of the inner plate surfaces 110 of the magnetic core 10 may not be covered by the thermal conductive filler 14.

在本實施例中,導熱填料14的導熱係數可大於0.3W/mk,且導熱填料14的材料可包含環氧樹脂(epoxy)、矽膠(silicone)、聚氨酯(polyurethane,PU)、酚醛樹脂(phenolic resins)、熱塑性聚對苯二甲酸乙二醇酯(thermoplastic polyethylene terephthalate,PET)、聚醯胺(polyamide,PA)、聚苯硫醚(polyphenylene sulfide,PPS)、聚醚醚酮(polyetheretherketone,PEEK)等。 In this embodiment, the thermal conductivity of the thermal conductive filler 14 may be greater than 0.3W/mk, and the material of the thermal conductive filler 14 may include epoxy, silicone, polyurethane (PU), phenolic resins, thermoplastic polyethylene terephthalate (PET), polyamide (PA), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), etc.

請參閱第2圖至第5圖,第2圖為根據本發明另一實施例之磁性元件1的剖面圖,第3圖為第2圖中的隔板18、引線蓋19與二線圈12的爆炸圖,第4圖為具有不同形狀的四隔板18的示意圖,第5圖為三層絕緣帶120錯位包覆的導線122的示意圖。在一些實施例中,隔板18的材料具有導磁性與電性絕緣性、或是導 熱性且電性絕緣性。舉例而言,隔板18可藉由磁粉與塑料混合後射出成型、或是選用磁性體(例如Ferrite)、或是高導熱性且電性絕緣性(例如陶瓷材料)。在本實施例中,至少一線圈12可包含一一次側線圈(primary coil)12a以及一二次側線圈(secondary coil)12b,其剖面可以是圓形、橢圓形或是矩形,其中,矩形可以有效提升體積利用率。如第4圖所示,隔板18可包含設置於一次側線圈12a與二次側線圈12b之間的一環形結構(例如,圓形、橢圓形、半圓形或半橢圓形)。藉此,可增加漏電感(leakage inductance,Lk)與功率密度(power density)。此外,磁性元件1更可包含引線蓋19,直接地套設在磁芯10的內柱100且堆疊於隔板18與二線圈12的上方處,用以將線圈12的端線經由引線蓋19的導線槽19a引出磁芯10外,本實施例中,引線蓋19為電性絕緣性材料。本實施例中,隔板18更包含導線槽18b對應於引線蓋19的導線槽19a,隔板18、引線蓋19以及二線圈12相互堆疊且直接地套設在磁芯10的內柱100時,線圈12的端線會經由引線蓋19的導線槽19a及隔板18的導線槽18b引出磁芯10外。 Please refer to Figures 2 to 5. Figure 2 is a cross-sectional view of a magnetic element 1 according to another embodiment of the present invention. Figure 3 is an exploded view of the partition 18, the lead cover 19 and the second coil 12 in Figure 2. Figure 4 is a schematic diagram of four partitions 18 with different shapes. Figure 5 is a schematic diagram of a wire 122 covered with three layers of insulating tape 120 in a staggered manner. In some embodiments, the material of the partition 18 has magnetic permeability and electrical insulation, or thermal conductivity and electrical insulation. For example, the partition 18 can be formed by injection molding after mixing magnetic powder and plastic, or by using a magnetic body (such as Ferrite), or by using a high thermal conductivity and electrical insulation (such as a ceramic material). In this embodiment, at least one coil 12 may include a primary coil 12a and a secondary coil 12b, and the cross-section thereof may be circular, elliptical or rectangular, wherein the rectangular shape may effectively improve the volume utilization. As shown in FIG. 4 , the partition 18 may include an annular structure (e.g., circular, elliptical, semicircular or semi-elliptical) disposed between the primary coil 12a and the secondary coil 12b. In this way, the leakage inductance (Lk) and the power density may be increased. In addition, the magnetic element 1 may further include a lead cover 19, which is directly sleeved on the inner column 100 of the magnetic core 10 and stacked above the partition 18 and the two coils 12, so as to lead the end wire of the coil 12 out of the magnetic core 10 through the wire groove 19a of the lead cover 19. In this embodiment, the lead cover 19 is an electrically insulating material. In this embodiment, the partition 18 further includes a wire groove 18b corresponding to the wire groove 19a of the lead cover 19. When the partition 18, the lead cover 19 and the two coils 12 are stacked on each other and directly sleeved on the inner column 100 of the magnetic core 10, the end wire of the coil 12 will be led out of the magnetic core 10 through the wire groove 19a of the lead cover 19 and the wire groove 18b of the partition 18.

如第2圖與第3圖所示,磁性元件1可包含一磁芯10、至少一隔板18以及至少二線圈12,其中至少二線圈12與至少一隔板18相互堆疊且直接地套設在內柱100。在本實施例中,磁性元件1可包含相互堆疊的一隔板18、一引線蓋19以及二線圈12。線圈12不須纏繞於支架。在將線圈12繞製成空氣線圈後,可將線圈12與隔板18相互堆疊且直接地套設在磁芯10的內柱100。在本實施例中,線圈12的繞製結構是由上下兩層的外側出線(外外繞),不同於由內側出線的繞製結構(內外繞),有較佳的平整性。藉此,磁性元件1便不會受到支架的尺寸與空間限制,且隔板18可與線圈12緊密接觸,或利用引線蓋19的結構延伸到二線圈12之間來固定及最小化隔板18與線圈12兩者之間距及間隙,以使磁性元件1的尺寸小型化。由於磁性元件1的空間與尺寸可小型化,散熱路徑即可縮短且沒有包覆內柱的結構的(繞線)支架及引線蓋,以得到良好的散熱效果。本實施例中,隔板18具有空 隙18a,隔板18與二線圈12堆疊時,導熱填料14可以填入二線圈12的相對重疊表面之間的空隙18a、內柱與二線圈12之間相對的表面,導熱填料14更可以包覆二線圈12及隔板18向外的表面,使二線圈12的散熱表面增加,進而得到良好的散熱效果。於一些實施例中,不含導熱填料14,在沒有套設隔板及線圈的支架下,氣流較易於進入隔板18、引線蓋19以及二線圈12,可以得到良好的散熱效果。於一些實施例中,為了在沒有支架下可以使其兩線圈12之間、兩線圈12分別與磁芯10之間的絕緣性維持一樣,兩線圈12是由至少三層絕緣帶120錯位包覆的導線122(如第5圖所示)所繞製而成,單一個絕緣帶120由第一層錯位地堆疊到至少第二、三層,其錯位重疊比例(W2/W1)大於67%,其中W1為單片絕緣帶120的寬度,且W2為重疊寬度。絕緣帶120可選用PI絕緣膜(聚醯亞胺(Polyimide Film))。單條導線122或多條導線122為具有絕緣層包覆的漆包線較佳。 As shown in FIG. 2 and FIG. 3, the magnetic element 1 may include a magnetic core 10, at least one partition 18 and at least two coils 12, wherein the at least two coils 12 and the at least one partition 18 are stacked on each other and directly sleeved on the inner column 100. In this embodiment, the magnetic element 1 may include a partition 18, a lead cover 19 and two coils 12 stacked on each other. The coil 12 does not need to be wound around the bracket. After the coil 12 is wound into an air coil, the coil 12 and the partition 18 can be stacked on each other and directly sleeved on the inner column 100 of the magnetic core 10. In this embodiment, the winding structure of the coil 12 is composed of two layers of outer wires (outside-outside winding), which is different from the winding structure of the inner wires (inside-outside winding), and has better flatness. Thus, the magnetic element 1 will not be limited by the size and space of the bracket, and the partition 18 can be in close contact with the coil 12, or the lead cover 19 can be used to extend between the two coils 12 to fix and minimize the distance and gap between the partition 18 and the coil 12, so as to miniaturize the size of the magnetic element 1. Since the space and size of the magnetic element 1 can be miniaturized, the heat dissipation path can be shortened and there is no (winding) bracket and lead cover of the structure covering the inner column to obtain a good heat dissipation effect. In this embodiment, the partition 18 has a gap 18a. When the partition 18 and the second coil 12 are stacked, the thermally conductive filler 14 can fill the gap 18a between the relatively overlapping surfaces of the second coil 12 and the relatively opposite surfaces between the inner column and the second coil 12. The thermally conductive filler 14 can also cover the outward surfaces of the second coil 12 and the partition 18, so that the heat dissipation surface of the second coil 12 is increased, thereby obtaining a good heat dissipation effect. In some embodiments, the thermally conductive filler 14 is not included. In the case of a bracket without a partition and a coil, the airflow is easier to enter the partition 18, the lead cover 19 and the second coil 12, and a good heat dissipation effect can be obtained. In some embodiments, in order to maintain the same insulation between the two coils 12 and between the two coils 12 and the magnetic core 10 without a support, the two coils 12 are wound by at least three layers of insulating tape 120 staggeredly wrapped with a conductor 122 (as shown in FIG. 5 ). A single insulating tape 120 is staggeredly stacked from the first layer to at least the second and third layers, and the staggered overlap ratio (W2/W1) is greater than 67%, where W1 is the width of the single insulating tape 120, and W2 is the overlap width. The insulating tape 120 can be made of PI insulating film (Polyimide Film). The single wire 122 or the multiple wires 122 are preferably enameled wires covered with an insulating layer.

請參閱第6圖至第10圖,第6圖為根據本發明另一實施例之磁性元件1'的立體圖,第7圖為第6圖中的磁性元件1'的剖面圖,第8圖為第6圖中的磁性元件1'的另一剖面圖,第9圖為第7圖中的支架20的立體圖,第10圖為第9圖中的支架20的俯視圖。 Please refer to Figures 6 to 10. Figure 6 is a three-dimensional view of a magnetic element 1' according to another embodiment of the present invention, Figure 7 is a cross-sectional view of the magnetic element 1' in Figure 6, Figure 8 is another cross-sectional view of the magnetic element 1' in Figure 6, Figure 9 is a three-dimensional view of the bracket 20 in Figure 7, and Figure 10 is a top view of the bracket 20 in Figure 9.

磁性元件1'與上述的磁性元件1的主要不同之處在於,磁性元件1'另包含一支架20,且內柱100另包含一懸浮部1000,如第6圖至第9圖所示。在本實施例中,懸浮部1000佔內柱100的比例T可為50%或2%~95%。進一步來說,內柱100具有長度X1,且懸浮部1000具有長度X2,則懸浮部1000佔內柱100的比例T係為X2/X1。支架20套設於內柱100上,且至少一線圈12設置於支架20上。因此,線圈12仍是纏繞於內柱100。在本實施例中,支架20之內側具有一凸台200,且內柱100之懸浮部1000支撐於凸台200,使得懸浮部1000位於第一芯體10a與第二芯體10b之間。在本實施例中,凸台200可自內柱100之外側朝內側延伸,以支撐懸浮部1000。 The main difference between the magnetic element 1' and the above-mentioned magnetic element 1 is that the magnetic element 1' further includes a bracket 20, and the inner column 100 further includes a suspension portion 1000, as shown in Figures 6 to 9. In this embodiment, the proportion T of the suspension portion 1000 to the inner column 100 can be 50% or 2%~95%. Furthermore, the inner column 100 has a length X1, and the suspension portion 1000 has a length X2, then the proportion T of the suspension portion 1000 to the inner column 100 is X2/X1. The bracket 20 is sleeved on the inner column 100, and at least one coil 12 is disposed on the bracket 20. Therefore, the coil 12 is still wrapped around the inner column 100. In this embodiment, the inner side of the bracket 20 has a boss 200, and the suspended portion 1000 of the inner column 100 is supported on the boss 200, so that the suspended portion 1000 is located between the first core 10a and the second core 10b. In this embodiment, the boss 200 can extend from the outer side of the inner column 100 toward the inner side to support the suspended portion 1000.

在本實施例中,第一芯體10a與第二芯體10b在二外柱102處相互接合而形成二接合區106。此外,第二芯體10b不與懸浮部1000接合,且懸浮部1000支撐於凸台200,使得二非接合區104a、104b位於懸浮部1000之相對二側。在導熱填料14充填於殼體16中後,二非接合區104a、104b的其中之一不被導熱填料14(完全)包覆。如第7圖所示,在懸浮部1000下方的非接合區104a與二接合區106皆被導熱填料14包覆,且在懸浮部1000上方的非接合區104b不被導熱填料14包覆。藉此,具有非接合區104b之內柱100即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。 In this embodiment, the first core 10a and the second core 10b are bonded to each other at the two outer columns 102 to form two bonding areas 106. In addition, the second core 10b is not bonded to the suspension 1000, and the suspension 1000 is supported on the boss 200, so that the two non-bonding areas 104a, 104b are located on opposite sides of the suspension 1000. After the thermal conductive filler 14 is filled in the shell 16, one of the two non-bonding areas 104a, 104b is not (completely) covered by the thermal conductive filler 14. As shown in FIG. 7, the non-bonding area 104a and the two bonding areas 106 below the suspension 1000 are both covered by the thermal conductive filler 14, and the non-bonding area 104b above the suspension 1000 is not covered by the thermal conductive filler 14. Thus, the inner column 100 having the non-joining area 104b can be deformed freely when the temperature difference (or maximum temperature) of the magnetic core 10 increases, so that the thermal stress of the magnetic core 10 is reduced, thereby avoiding the increase of the loss of the magnetic core 10.

在本實施例中,導熱填料14之高度H1可小於或等於支架20之高度H2,使得導熱填料14不接觸第二芯體10b的底面。因此,導熱填料14的熱膨脹應力可大幅降低,且第二芯體10b與內柱100不會因導熱填料14的較高熱應力而相互作用,進而降低磁芯10的溫度差(或最大溫度)。藉此,磁芯10的熱應力即可降低,進而避免磁芯10的損耗增加。 In this embodiment, the height H1 of the thermally conductive filler 14 can be less than or equal to the height H2 of the bracket 20, so that the thermally conductive filler 14 does not contact the bottom surface of the second core 10b. Therefore, the thermal expansion stress of the thermally conductive filler 14 can be greatly reduced, and the second core 10b and the inner column 100 will not interact due to the higher thermal stress of the thermally conductive filler 14, thereby reducing the temperature difference (or maximum temperature) of the magnetic core 10. In this way, the thermal stress of the magnetic core 10 can be reduced, thereby avoiding the increase of the loss of the magnetic core 10.

如第7圖與第9圖所示,至少一孔洞202可形成於支架20上,以使導熱填料14接觸至少一線圈12之內側,且增加導熱填料14與內柱100間之接觸面積,進而增加散熱路徑,有效降低溫度差(或最大溫度),且降低因熱造成的額外損耗。在本實施例中,至少一孔洞202的其中之一可自支架20之一上板204朝支架20之一下板206延伸,且至少一孔洞202的其中之一之邊界可在支架20之上板204與下板206重疊。如第9圖所示,至少一孔洞202包含二孔洞202a以及二孔洞202b。二孔洞202b可自支架20之上板204朝支架20之下板206延伸,且各孔洞202b之邊界202c可在上板204與下板206重疊,如第9圖與第10圖所示。藉此,導熱填料14更容易流入支架20,以自線圈12傳導更多的熱量。此外,可以較少的模具製造支架20(射出成型),以降低成本。 As shown in FIG. 7 and FIG. 9, at least one hole 202 can be formed on the bracket 20 so that the thermal conductive filler 14 contacts the inner side of at least one coil 12, and increases the contact area between the thermal conductive filler 14 and the inner column 100, thereby increasing the heat dissipation path, effectively reducing the temperature difference (or maximum temperature), and reducing the additional loss caused by heat. In this embodiment, one of the at least one hole 202 can extend from an upper plate 204 of the bracket 20 toward a lower plate 206 of the bracket 20, and the boundary of one of the at least one hole 202 can overlap the upper plate 204 and the lower plate 206 of the bracket 20. As shown in FIG. 9, the at least one hole 202 includes two holes 202a and two holes 202b. The two holes 202b can extend from the upper plate 204 of the bracket 20 toward the lower plate 206 of the bracket 20, and the boundaries 202c of each hole 202b can overlap the upper plate 204 and the lower plate 206, as shown in Figures 9 and 10. In this way, the thermal conductive filler 14 can flow into the bracket 20 more easily to transfer more heat from the coil 12. In addition, the bracket 20 can be manufactured with fewer molds (injection molding) to reduce costs.

舉例而言,當磁性元件1'為功率5.5KW的電感器或變壓器,且懸浮部 1000佔內柱100的比例為30%時,最大熱應力可由52Mpa降低為28.6Mpa,且磁芯10的最高溫度可由110℃降低為87.106℃。雖然懸浮部1000的溫度為128.45℃,懸浮部1000是簡單的柱狀,不會開裂。若進一步考量具有大截面積的線圈的繞線位置時,懸浮部1000佔內柱100的比例與具有大線徑的線圈的繞線位置如下。需說明的是,至少一線圈12可包含一一次側線圈12a以及一二次側線圈12b,其中二次側線圈12b之位置對應懸浮部1000,且一次側線圈12a之位置對應第一芯體10a之內柱100。一次側線圈12a具有一截面積D1,且二次側線圈12b具有一截面積D2。若一次側線圈12a之截面積D1大於二次側線圈12b之截面積D2,則一次側線圈12a之運作溫度高於二次側線圈12b之運作溫度,且懸浮部1000佔內柱100的比例T可滿足50%<T≦95%。若一次側線圈12a之截面積D1小於二次側線圈12b之截面積D2,則二次側線圈12b之運作溫度高於一次側線圈12a之運作溫度,且懸浮部1000佔內柱100的比例T可滿足2%≦T<50%。 For example, when the magnetic element 1' is an inductor or transformer with a power of 5.5KW, and the proportion of the suspension part 1000 to the inner column 100 is 30%, the maximum thermal stress can be reduced from 52Mpa to 28.6Mpa, and the maximum temperature of the magnetic core 10 can be reduced from 110℃ to 87.106℃. Although the temperature of the suspension part 1000 is 128.45℃, the suspension part 1000 is a simple columnar shape and will not crack. If the winding position of the coil with a large cross-sectional area is further considered, the proportion of the suspension part 1000 to the inner column 100 and the winding position of the coil with a large wire diameter are as follows. It should be noted that at least one coil 12 may include a primary coil 12a and a secondary coil 12b, wherein the position of the secondary coil 12b corresponds to the suspension portion 1000, and the position of the primary coil 12a corresponds to the inner column 100 of the first core 10a. The primary coil 12a has a cross-sectional area D1, and the secondary coil 12b has a cross-sectional area D2. If the cross-sectional area D1 of the primary coil 12a is greater than the cross-sectional area D2 of the secondary coil 12b, the operating temperature of the primary coil 12a is higher than the operating temperature of the secondary coil 12b, and the ratio T of the suspension portion 1000 to the inner column 100 may satisfy 50%<T≦95%. If the cross-sectional area D1 of the primary coil 12a is smaller than the cross-sectional area D2 of the secondary coil 12b, the operating temperature of the secondary coil 12b is higher than the operating temperature of the primary coil 12a, and the ratio T of the suspension portion 1000 to the inner column 100 can satisfy 2% ≦ T < 50%.

如第6圖與第7圖所示,磁性元件1'可另包含一散熱件22,設置於磁芯10上,其中散熱件22接觸磁芯10之一頂面S1與一側面S2。在本實施例中,磁性元件1'可包含二散熱件22,設置於磁芯10之相對二側,但不以此為限。在本實施例中,散熱件22可為L形,且散熱件22接觸磁芯10之側面S2的部分之長度L可小於磁芯10之高度H3。藉此,即使磁芯10在高度上存在公差,散熱件22亦可與磁芯10之頂面S1保持接觸而無間隙,進而增進散熱效果。此外,由於有二散熱件22貼合於頂面S1與側面S2,散熱件22可藉由成本較低與公差較高的製程來製造。具有L形的散熱件22不限制應用,亦可應用在其他實施例中。 As shown in FIG. 6 and FIG. 7 , the magnetic element 1 ′ may further include a heat sink 22 disposed on the magnetic core 10, wherein the heat sink 22 contacts a top surface S1 and a side surface S2 of the magnetic core 10. In the present embodiment, the magnetic element 1 ′ may include two heat sinks 22 disposed on opposite sides of the magnetic core 10, but is not limited thereto. In the present embodiment, the heat sink 22 may be L-shaped, and the length L of the portion of the heat sink 22 contacting the side surface S2 of the magnetic core 10 may be less than the height H3 of the magnetic core 10. Thus, even if there is a tolerance in the height of the magnetic core 10, the heat sink 22 can maintain contact with the top surface S1 of the magnetic core 10 without a gap, thereby enhancing the heat dissipation effect. In addition, since there are two heat sinks 22 attached to the top surface S1 and the side surface S2, the heat sink 22 can be manufactured by a process with lower cost and higher tolerance. The L-shaped heat sink 22 is not limited in application and can also be applied in other embodiments.

在本實施例中,導熱填料14可包覆散熱件22之一部分,使得散熱件22可將熱傳導至底部。此外,散熱件22可藉由肖氏D或肖氏A硬度(Shore D or Shore A hardness)小於80的膠體貼附於磁芯10上,以降低磁芯10的溫度差(或最大溫度)且降低熱應力。舉例而言,若肖氏D硬度大於80,磁芯10對應的最大溫度可 為59.3℃;若肖氏D硬度小於80,磁芯10對應的最大溫度可為50.6℃。 In this embodiment, the thermal conductive filler 14 can cover a portion of the heat sink 22 so that the heat sink 22 can conduct heat to the bottom. In addition, the heat sink 22 can be attached to the magnetic core 10 by a colloid with a Shore D or Shore A hardness less than 80 to reduce the temperature difference (or maximum temperature) of the magnetic core 10 and reduce thermal stress. For example, if the Shore D hardness is greater than 80, the corresponding maximum temperature of the magnetic core 10 can be 59.3°C; if the Shore D hardness is less than 80, the corresponding maximum temperature of the magnetic core 10 can be 50.6°C.

請參閱第11圖,第11圖為根據本發明另一實施例之磁性元件1"的剖面圖。 Please refer to Figure 11, which is a cross-sectional view of a magnetic element 1" according to another embodiment of the present invention.

磁性元件1"與上述的磁性元件1的主要不同之處在於,除了第一芯體10a與第二芯體10b外,磁性元件1"另包含一第三芯體10c。如第11圖所示,第一芯體10a與第二芯體10b並排且在二外柱102處與第三芯體10c接合,而形成接合區106。此外,第一芯體10a與第二芯體10b之二相鄰側壁108a、108b未相互接合,使得非接合區104a位於第一芯體10a與第二芯體10b之二相鄰側壁108a、108b之間。在本實施例中,二相鄰側壁108a、108b形成內柱100之一部分。第三芯體10c之內柱100與第一芯體10a及第二芯體10b之內柱100相對設置且未接合,進而形成另一非接合區104b。第三芯體10c之內柱100係一體成型而無間隙。第一芯體10a與第二芯體10b之二相鄰側壁108a、108b在內柱100處彼此相對。 The main difference between the magnetic element 1" and the above-mentioned magnetic element 1 is that, in addition to the first core 10a and the second core 10b, the magnetic element 1" further includes a third core 10c. As shown in Figure 11, the first core 10a and the second core 10b are arranged side by side and are joined to the third core 10c at two outer columns 102 to form a joining area 106. In addition, the two adjacent side walls 108a and 108b of the first core 10a and the second core 10b are not joined to each other, so that the non-joining area 104a is located between the two adjacent side walls 108a and 108b of the first core 10a and the second core 10b. In the present embodiment, the two adjacent side walls 108a and 108b form a part of the inner column 100. The inner column 100 of the third core 10c is arranged opposite to the inner columns 100 of the first core 10a and the second core 10b and is not joined, thereby forming another non-joined area 104b. The inner column 100 of the third core 10c is formed in one piece without a gap. The two adjacent side walls 108a and 108b of the first core 10a and the second core 10b are opposite to each other at the inner column 100.

在導熱填料14充填於殼體16中後,非接合區104a的至少一部分不被導熱填料14包覆。如第11圖所示,二相鄰側壁108a、108b之間的非接合區104a的下方部分與二接合區106被導熱填料14包覆,且非接合區104a的上方部分不被導熱填料14包覆。此外,第三芯體10c之內柱100上方的非接合區104b亦被導熱填料14包覆。藉此,具有非接合區104a的上方部分之內柱100即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。舉例而言,當磁性元件1"為功率3.7KW的電感器或變壓器時,最大熱應力可由48Mpa降低為16Mpa,且磁芯10的最高溫度可由150℃降低為120℃。 After the thermally conductive filler 14 is filled in the shell 16, at least a portion of the non-joining area 104a is not covered by the thermally conductive filler 14. As shown in FIG. 11, the lower portion of the non-joining area 104a between the two adjacent side walls 108a and 108b and the two joining areas 106 are covered by the thermally conductive filler 14, and the upper portion of the non-joining area 104a is not covered by the thermally conductive filler 14. In addition, the non-joining area 104b above the inner column 100 of the third core 10c is also covered by the thermally conductive filler 14. Thus, the inner column 100 having the upper portion of the non-joining area 104a can be deformed freely when the temperature difference (or maximum temperature) of the magnetic core 10 increases, so that the thermal stress of the magnetic core 10 is reduced, thereby avoiding an increase in the loss of the magnetic core 10. For example, when the magnetic component 1" is an inductor or transformer with a power of 3.7KW, the maximum thermal stress can be reduced from 48Mpa to 16Mpa, and the maximum temperature of the magnetic core 10 can be reduced from 150℃ to 120℃.

請參閱第12圖,第12圖為根據本發明另一實施例之磁性元件1'''的剖面圖。 Please refer to Figure 12, which is a cross-sectional view of a magnetic element 1''' according to another embodiment of the present invention.

磁性元件1'''與上述的磁性元件1的主要不同之處在於,導熱填料14包覆至少一非接合區104,其中至少一非接合區104位於至少二外柱102處,且至少 一接合區106位於內柱100處,如第12圖所示。在本實施例中,第一芯體10a與第二芯體10b為E型磁芯、PQ型磁芯、T型磁芯、UU型磁芯、U型磁芯、U-I型磁芯、E-I型磁芯、I型磁芯或F型磁芯中的其中之二,使得二非接合區104位於二外柱102處,且一接合區106位於內柱100處。換言之,磁芯10之二外柱102未接合,且磁芯10之內柱100被接合。在導熱填料14充填於殼體16中後,導熱填料14包覆磁芯10之一部分、位於二外柱102處之二非接合區104以及位於內柱100處之接合區106。藉此,具有非接合區104的二外柱102即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。舉例而言,當磁性元件1'''為功率6.6KW的電感器或變壓器時,最大熱應力可由68Mpa降低為32.4Mpa,且磁芯10的最高溫度可由154℃降低為115.2℃。 The main difference between the magnetic element 1''' and the magnetic element 1 mentioned above is that the thermal conductive filler 14 covers at least one non-joining area 104, wherein at least one non-joining area 104 is located at at least two outer columns 102, and at least one joining area 106 is located at the inner column 100, as shown in FIG. 12. In this embodiment, the first core 10a and the second core 10b are two of an E-type magnetic core, a PQ-type magnetic core, a T-type magnetic core, a UU-type magnetic core, a U-type magnetic core, a U-I-type magnetic core, an E-I-type magnetic core, an I-type magnetic core, or an F-type magnetic core, so that two non-joining areas 104 are located at two outer columns 102, and one joining area 106 is located at the inner column 100. In other words, the two outer columns 102 of the magnetic core 10 are not joined, and the inner column 100 of the magnetic core 10 is joined. After the heat conductive filler 14 is filled in the shell 16, the heat conductive filler 14 covers a portion of the magnetic core 10, two non-joining areas 104 located at the two outer columns 102, and the joining area 106 located at the inner column 100. Thus, the two outer columns 102 with the non-joining areas 104 can be deformed freely when the temperature difference (or maximum temperature) of the magnetic core 10 increases, so that the thermal stress of the magnetic core 10 is reduced, thereby avoiding the increase of the loss of the magnetic core 10. For example, when the magnetic element 1''' is an inductor or transformer with a power of 6.6KW, the maximum thermal stress can be reduced from 68Mpa to 32.4Mpa, and the maximum temperature of the magnetic core 10 can be reduced from 154℃ to 115.2℃.

請參閱第13圖,第13圖為根據本發明另一實施例之磁性元件1''''的剖面圖。 Please refer to Figure 13, which is a cross-sectional view of a magnetic element 1'''' according to another embodiment of the present invention.

磁性元件1''''與上述的磁性元件1的主要不同之處在於,除了磁芯10、至少一線圈12與導熱填料14外,磁性元件1''''另包含一支架20',如第13圖所示。磁芯10包含一內柱100、至少二外柱102以及複數個非接合區104。複數個非接合區104位於內柱100與至少二外柱102處。支架20'套設於內柱100上。支架20'之一上表面208可藉由膠體接合於磁芯10之一內板表面110。至少一線圈12設置於支架20'上。在導熱填料14充填於殼體16中後,導熱填料14包覆磁芯10之一部分且未包覆複數個非接合區104。藉此,具有複數個非接合區104的內柱100與至少二外柱102即可在磁芯10的溫度差(或最大溫度)增加時自由變形,使得磁芯10的熱應力降低,進而避免磁芯10的損耗增加。在另一實施例中,支架20'之一下表面210可進一步藉由膠體接合於磁芯10之另一內板表面112,其中二內板表面110、112彼此相對。 The main difference between the magnetic element 1'''' and the above-mentioned magnetic element 1 is that, in addition to the magnetic core 10, at least one coil 12 and the thermally conductive filler 14, the magnetic element 1'''' further includes a bracket 20', as shown in Figure 13. The magnetic core 10 includes an inner column 100, at least two outer columns 102 and a plurality of non-bonding areas 104. The plurality of non-bonding areas 104 are located at the inner column 100 and the at least two outer columns 102. The bracket 20' is sleeved on the inner column 100. An upper surface 208 of the bracket 20' can be bonded to an inner plate surface 110 of the magnetic core 10 by means of a glue. At least one coil 12 is disposed on the bracket 20'. After the thermally conductive filler 14 is filled in the shell 16, the thermally conductive filler 14 covers a portion of the magnetic core 10 and does not cover the plurality of non-bonding areas 104. Thus, the inner column 100 having a plurality of non-bonding areas 104 and at least two outer columns 102 can be deformed freely when the temperature difference (or maximum temperature) of the magnetic core 10 increases, so that the thermal stress of the magnetic core 10 is reduced, thereby avoiding the increase of the loss of the magnetic core 10. In another embodiment, a lower surface 210 of the bracket 20' can be further bonded to another inner plate surface 112 of the magnetic core 10 by means of glue, wherein the two inner plate surfaces 110, 112 are opposite to each other.

請參閱第14圖,第14圖為根據本發明另一實施例之磁性元件3的立體 圖。 Please refer to Figure 14, which is a three-dimensional diagram of the magnetic element 3 according to another embodiment of the present invention.

如第14圖所示,磁性元件3之磁芯30具有一板部300以及一V形槽302,其中V形槽302形成於板部300之一側邊。在本實施例中,具有V形槽302的板部300之側邊為不具有非連續幾何結構的連續側邊,以避免應力集中。在本實施例中,V形槽302之二側邊之間的接合處的位置對應磁芯30之內柱。 As shown in FIG. 14 , the magnetic core 30 of the magnetic element 3 has a plate portion 300 and a V-shaped groove 302, wherein the V-shaped groove 302 is formed on one side of the plate portion 300. In this embodiment, the side of the plate portion 300 having the V-shaped groove 302 is a continuous side without a discontinuous geometric structure to avoid stress concentration. In this embodiment, the position of the joint between the two sides of the V-shaped groove 302 corresponds to the inner column of the magnetic core 30.

請參閱第15圖,第15圖為根據本發明另一實施例之磁性元件3的立體圖。 Please refer to Figure 15, which is a three-dimensional diagram of the magnetic element 3 according to another embodiment of the present invention.

如第15圖所示,V形槽302之尖端的弧度R可為大於5,以避免V形槽302過於尖銳而影響板部300的強度。舉例而言,若弧度R為0.8,對應V形槽302的最大熱應力可為85.6MPa;若弧度R為5,對應V形槽302的最大熱應力可為64.3MPa。具有V形槽302及弧度R的磁芯30不限制應用,亦可應用在其他實施例中。 As shown in FIG. 15 , the curvature R of the tip of the V-groove 302 can be greater than 5 to prevent the V-groove 302 from being too sharp and affecting the strength of the plate 300. For example, if the curvature R is 0.8, the maximum thermal stress of the corresponding V-groove 302 can be 85.6MPa; if the curvature R is 5, the maximum thermal stress of the corresponding V-groove 302 can be 64.3MPa. The magnetic core 30 with the V-groove 302 and curvature R is not limited in application and can also be applied in other embodiments.

綜上所述,在一實施例中,至少一非接合區可位於內柱或至少二外柱處,且至少一非接合區之至少一部分可不被導熱填料包覆。藉此,具有非接合區之內柱或至少二外柱即可在磁芯的溫度差(或最大溫度)增加時自由變形,使得磁芯的熱應力降低,進而避免磁芯的損耗增加。此外,在另一實施例中,至少一非接合區可位於至少二外柱處,且導熱填料可包覆至少一非接合區或/及位於內柱處的接合區。同樣地,具有非接合區之至少二外柱即可在磁芯的溫度差(或最大溫度)增加時自由變形,使得磁芯的熱應力降低,進而避免磁芯的損耗增加。需說明的是,本文所述之溫度差係指同一時間在磁芯的兩個不同位置之間的溫度差。在另一實施例中,可將線圈與隔板相互堆疊且直接地套設在磁芯的內柱,使得線圈不須纏繞於支架,就可以提升一次側線圈與二次側線圈之間、線圈與磁芯之間的絕緣性及散熱效果。藉此,磁性元件便不會受到支架的尺寸與空間限制,且隔板可與線圈緊密接觸,或利用引線蓋的結構延伸到二線圈之間來固定及最小化隔板與線圈兩者之間距及間隙,以使磁性元件的尺寸 小型化。 In summary, in one embodiment, at least one non-bonding area may be located at the inner column or at least two outer columns, and at least a portion of at least one non-bonding area may not be covered by a thermally conductive filler. Thus, the inner column or at least two outer columns having a non-bonding area can be deformed freely when the temperature difference (or maximum temperature) of the magnetic core increases, so that the thermal stress of the magnetic core is reduced, thereby avoiding an increase in the loss of the magnetic core. In addition, in another embodiment, at least one non-bonding area may be located at at least two outer columns, and the thermally conductive filler may cover at least one non-bonding area and/or a bonding area located at the inner column. Similarly, at least two outer columns having a non-bonding area can be deformed freely when the temperature difference (or maximum temperature) of the magnetic core increases, so that the thermal stress of the magnetic core is reduced, thereby avoiding an increase in the loss of the magnetic core. It should be noted that the temperature difference described in this article refers to the temperature difference between two different positions of the magnetic core at the same time. In another embodiment, the coil and the partition can be stacked and directly sleeved on the inner column of the magnetic core, so that the coil does not need to be wrapped around the bracket, and the insulation and heat dissipation effect between the primary coil and the secondary coil, and between the coil and the magnetic core can be improved. In this way, the magnetic element will not be limited by the size and space of the bracket, and the partition can be in close contact with the coil, or the lead cover structure can be extended between the two coils to fix and minimize the distance and gap between the partition and the coil, so as to miniaturize the size of the magnetic element.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above is only the preferred embodiment of the present invention. All equivalent changes and modifications made within the scope of the patent application of the present invention shall fall within the scope of the present invention.

1:磁性元件 1: Magnetic components

10:磁芯 10: Magnetic core

10a:第一芯體 10a: First core

10b:第二芯體 10b: Second core

12:線圈 12: Coil

12a:一次側線圈 12a: Primary coil

12b:二次側線圈 12b: Secondary coil

14:導熱填料 14: Thermal conductive filler

18:隔板 18: Partition

19:引線蓋 19: Lead cover

100:內柱 100: Inner column

Claims (17)

一種磁性元件,包含:一磁芯,包含一內柱以及至少二外柱;至少一隔板;以及至少二線圈,該至少二線圈與該至少一隔板相互堆疊且直接地套設在該內柱;其中,各該線圈是由至少三層絕緣帶錯位包覆的導線以堆疊式地繞製而成。 A magnetic element comprises: a magnetic core, comprising an inner column and at least two outer columns; at least one partition; and at least two coils, wherein the at least two coils and the at least one partition are stacked on each other and directly sleeved on the inner column; wherein each coil is wound in a stacked manner by at least three layers of insulating strip staggered coated wires. 如請求項1所述之磁性元件,其中該絕緣帶由第一層錯位地堆疊到至少第二、三層,錯位重疊比例W2/W1大於67%,W1為該絕緣帶的寬度,且W2為重疊寬度。 A magnetic element as described in claim 1, wherein the insulating tape is stacked misaligned from the first layer to at least the second and third layers, and the misaligned overlap ratio W2/W1 is greater than 67%, W1 is the width of the insulating tape, and W2 is the overlap width. 如請求項1所述之磁性元件,另包含一導熱填料,包覆該磁芯之一部分且填入該至少二線圈的相對重疊表面之間的空隙。 The magnetic element as described in claim 1 further comprises a thermally conductive filler that covers a portion of the magnetic core and fills the gap between the relatively overlapping surfaces of the at least two coils. 如請求項3所述之磁性元件,其中該導熱填料填入該內柱與該至少二線圈之間相對的表面。 A magnetic element as described in claim 3, wherein the thermally conductive filler is filled into the surfaces facing each other between the inner column and the at least two coils. 如請求項3所述之磁性元件,其中該導熱填料包覆該至少二線圈及該至少一隔板向外的表面。 A magnetic element as described in claim 3, wherein the thermally conductive filler covers the outward surface of the at least two coils and the at least one partition. 如請求項1所述之磁性元件,其中各該線圈的繞製結構是由上下兩層的外側出線。 As described in claim 1, the winding structure of each coil is composed of two layers of wires extending from the outside. 如請求項1所述之磁性元件,另包含一引線蓋,直接地套設在該內柱且堆疊於該至少一隔板與該至少二線圈的上方處,該至少一隔板更包含一導線槽對應於該引線蓋的一導線槽,該線圈的端線經由該引線蓋的該導線槽及該隔板的該導線槽引出該磁芯外。 The magnetic element as described in claim 1 further comprises a lead cover, which is directly sleeved on the inner column and stacked above the at least one partition and the at least two coils, and the at least one partition further comprises a wire groove corresponding to a wire groove of the lead cover, and the end wire of the coil is led out of the magnetic core through the wire groove of the lead cover and the wire groove of the partition. 如請求項7所述之磁性元件,其中該引線蓋的結構延伸到該至少二 線圈之間,以固定及最小化該至少一隔板與該至少二線圈之間距。 A magnetic element as described in claim 7, wherein the structure of the lead cover extends between the at least two coils to fix and minimize the distance between the at least one partition and the at least two coils. 如請求項1所述之磁性元件,其中該至少一隔板的材料具有導磁性與電性絕緣性。 A magnetic element as described in claim 1, wherein the material of at least one partition has magnetic permeability and electrical insulation. 如請求項1所述之磁性元件,其中該磁性元件沒有包覆該內柱的支架。 A magnetic element as described in claim 1, wherein the magnetic element does not cover the bracket of the inner column. 如請求項1所述之磁性元件,其中該磁芯具有一板部以及一V形槽,該V形槽形成於該板部之一側邊。 A magnetic element as described in claim 1, wherein the magnetic core has a plate portion and a V-shaped groove, and the V-shaped groove is formed on one side of the plate portion. 如請求項11所述之磁性元件,其中該V形槽之二側邊之間的接合處的位置對應該內柱。 A magnetic element as described in claim 11, wherein the position of the junction between the two sides of the V-shaped groove corresponds to the inner column. 如請求項11所述之磁性元件,其中該V形槽之尖端的弧度大於5。 A magnetic element as described in claim 11, wherein the curvature of the tip of the V-shaped groove is greater than 5. 如請求項1所述之磁性元件,另包含一散熱件,設置於該磁芯上,其中該散熱件接觸該磁芯之一頂面與一側面。 The magnetic element as described in claim 1 further comprises a heat sink disposed on the magnetic core, wherein the heat sink contacts a top surface and a side surface of the magnetic core. 如請求項14所述之磁性元件,其中該散熱件為L形,且該散熱件接觸該磁芯之該側面的部分之長度小於該磁芯之高度。 A magnetic element as described in claim 14, wherein the heat sink is L-shaped, and the length of the portion of the heat sink contacting the side of the magnetic core is less than the height of the magnetic core. 如請求項14所述之磁性元件,其中該散熱件藉由肖氏D或肖氏A硬度小於80的膠體貼附於該磁芯上。 A magnetic element as described in claim 14, wherein the heat sink is attached to the magnetic core by a colloid having a Shore D or Shore A hardness less than 80. 如請求項1所述之磁性元件,其中該至少二線圈包含一一次側線圈以及一二次側線圈,該至少一隔板包含設置於該一次側線圈與該二次側線圈之間的一環形結構。 The magnetic element as described in claim 1, wherein the at least two coils include a primary coil and a secondary coil, and the at least one partition includes an annular structure disposed between the primary coil and the secondary coil.
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TW201917745A (en) * 2017-10-19 2019-05-01 光壽科技有限公司 Capacitive resistance voltage conversion apparatus enables the magnet core having relatively smaller sizes to take stronger power and prevents leakage from happening

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201917745A (en) * 2017-10-19 2019-05-01 光壽科技有限公司 Capacitive resistance voltage conversion apparatus enables the magnet core having relatively smaller sizes to take stronger power and prevents leakage from happening

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