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TWI878827B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
TWI878827B
TWI878827B TW112109595A TW112109595A TWI878827B TW I878827 B TWI878827 B TW I878827B TW 112109595 A TW112109595 A TW 112109595A TW 112109595 A TW112109595 A TW 112109595A TW I878827 B TWI878827 B TW I878827B
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substrate
contact
contact portion
peripheral portion
mentioned
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TW112109595A
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TW202343608A (en
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林宗儒
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日商斯庫林集團股份有限公司
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    • H10P52/00

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Abstract

A substrate processing apparatus (100) includes a substrate holding section (13) and a removal member (151). The substrate holding section (13) rotates a substrate W in which a liquid repellent material capable of repelling a processing liquid is attached to at least a main body surface peripheral part (501) and an edge surface (51) of the substrate W. During rotation of the substrate W, the removal member (151) contacts at least the main body surface peripheral part (501) of the substrate W while being separated from a side part (515) of the edge surface (51) in a radial direction RD of the substrate W to bring a remover capable of removing the liquid repellent material into contact with the liquid repellent material attached to the main body surface peripheral part (501). The main body surface peripheral part (501) of the substrate W is a peripheral area of a surface (A1) of a substrate main body (50). The edge surface (51) of the substrate W is an edge area located more outside in the radial direction RD than the substrate main body (50).

Description

基板處理裝置及基板處理方法Substrate processing device and substrate processing method

本發明係關於一種基板處理裝置及基板處理方法。 The present invention relates to a substrate processing device and a substrate processing method.

專利文獻1記載之基板處理裝置於基板之周緣部塗佈液狀之被覆劑,藉由液狀之被覆劑覆蓋附著於基板之周緣部之塵埃。且,藉由使覆蓋附著於基板周緣部之塵埃之被覆劑硬化,而將塵埃捕捉至硬化之被覆劑之內部。因此,可藉由自基板之周緣部去除被覆劑,而自基板之周緣部去除塵埃。再者,由於在基板之周緣部塗佈被覆劑後,於基板正面塗佈光阻劑,故於基板之周緣部中,光阻劑塗佈於被覆劑之上。因此,於自基板之周緣部去除被覆劑時,塗佈於被覆劑之上之光阻劑亦與被覆劑一起自基板之周緣部去除。如此,可將塵埃及光阻劑自基板之周緣部同時去除。 The substrate processing device described in Patent Document 1 applies a liquid coating agent to the periphery of the substrate, and covers the dust attached to the periphery of the substrate with the liquid coating agent. Furthermore, by hardening the coating agent covering the dust attached to the periphery of the substrate, the dust is captured inside the hardened coating agent. Therefore, the dust can be removed from the periphery of the substrate by removing the coating agent from the periphery of the substrate. Furthermore, since a photoresist is applied to the front surface of the substrate after the coating agent is applied to the periphery of the substrate, the photoresist is applied on the coating agent in the periphery of the substrate. Therefore, when the coating agent is removed from the periphery of the substrate, the photoresist coated on the coating agent is also removed from the periphery of the substrate together with the coating agent. In this way, the dusty photoresist can be removed from the periphery of the substrate at the same time.

[先前技術文獻] [Prior Art Literature] [專利文獻] [Patent Literature]

[專利文獻1] 日本專利特開2013-74126號公報 [Patent document 1] Japanese Patent Publication No. 2013-74126

然而,於專利文獻1之基板處理裝置中,去除機構以氮氣吹飛被覆劑而將光阻劑與被覆劑一起去除。因此,去除附著於基板之所有被覆劑。另一方面,本申請案之發明者對可彈斥處理液之撥液物質,就僅去除多餘之撥液物質反復深入研究。 However, in the substrate processing device of Patent Document 1, the removal mechanism uses nitrogen to blow away the coating agent and removes the photoresist together with the coating agent. Therefore, all the coating agents attached to the substrate are removed. On the other hand, the inventor of this application has repeatedly conducted in-depth research on the repellent substance that can repel the processing liquid, and only removes the excess repellent substance.

本發明係鑑於上述問題而完成者,其目的在於提供一種可自基板僅去除多餘之撥液物質之基板處理裝置及基板處理方法。 The present invention is completed in view of the above-mentioned problems, and its purpose is to provide a substrate processing device and a substrate processing method that can remove only the excess repellent substances from the substrate.

根據本發明之一態様,基板處理裝置具備基板保持部、及去除構件。基板保持部保持至少於本體正面周緣部及端面部附著有可彈斥處理液之撥液物質之基板且使之旋轉。去除構件於上述基板之旋轉期間,相對於上述基板之上述端面部中之徑向之側面部隔開,且至少與上述基板之上述本體正面周緣部接觸,藉此,使可去除上述撥液物質之去除劑接觸附著於上述本體正面周緣部之上述撥液物質。上述基板之上述本體正面周緣部表示基板本體之正面中之周緣區域。上述基板之上述端面部表示較上述基板本體更靠徑向外側之端面區域。 According to one aspect of the present invention, a substrate processing device includes a substrate holding portion and a removal member. The substrate holding portion holds and rotates a substrate having a repellent substance that repels a processing liquid attached to at least the peripheral portion and end portion of the front surface of the body. During the rotation of the substrate, the removal member is separated from the radial side portion in the end portion of the substrate and contacts at least the peripheral portion of the front surface of the body of the substrate, thereby allowing a removal agent that can remove the repellent substance to contact the repellent substance attached to the peripheral portion of the front surface of the body. The peripheral portion of the front surface of the body of the substrate refers to the peripheral area in the front surface of the substrate body. The end portion of the substrate refers to the end surface area that is radially more outward than the substrate body.

於本發明之一態様中,較佳為上述去除構件包含第1接觸部、及第2接觸部。第1接觸部較佳為於上述基板之旋轉期間,相對於上述基板之上 述側面部隔開,且至少與上述基板之上述本體正面周緣部接觸,藉此使上述去除劑接觸附著於上述本體正面周緣部之上述撥液物質。第2接觸部較佳為於上述基板之旋轉期間,相對於上述基板之上述側面部隔開,且至少與上述基板之本體背面周緣部接觸,藉此使上述去除劑接觸附著於上述本體背面周緣部之上述撥液物質。上述基板之上述本體背面周緣部較佳為表示上述基板本體之背面中之周緣區域。 In one aspect of the present invention, the removal member preferably includes a first contact portion and a second contact portion. The first contact portion is preferably separated from the side surface of the substrate during the rotation of the substrate and is in contact with at least the peripheral portion of the front surface of the main body of the substrate, so that the removal agent contacts the liquid-repellent substance attached to the peripheral portion of the front surface of the main body. The second contact portion is preferably separated from the side surface of the substrate during the rotation of the substrate and is in contact with at least the peripheral portion of the back surface of the main body of the substrate, so that the removal agent contacts the liquid-repellent substance attached to the peripheral portion of the back surface of the main body. The peripheral portion of the back side of the main body of the above-mentioned substrate preferably refers to the peripheral area on the back side of the above-mentioned substrate main body.

於本發明之一態様中,較佳為上述第1接觸部包含第1外側接觸部、及第1內側接觸部。第1外側接觸部較佳為藉由於上述基板之旋轉期間,與上述本體正面周緣部接觸,而使上述去除劑接觸附著於上述本體正面周緣部之上述撥液物質。第1內側接觸部較佳為藉由配置於上述第1外側接觸部之內側,且於上述基板之旋轉期間,與上述基板之上述端面部中之正面緣部接觸,而使上述去除劑接觸附著於上述正面緣部之上述撥液物質。上述端面部之上述正面緣部較佳為表示於上述基板之正面側,上述端面部中位於較上述本體正面周緣部更靠徑向外側之區域,且位於較上述側面部更靠徑向內側之區域。上述第2接觸部較佳為包含第2外側接觸部、及第2內側接觸部。第2外側接觸部較佳為藉由於上述基板之旋轉期間,與上述基板之上述本體背面周緣部接觸,而使上述去除劑接觸附著於上述本體背面周緣部之上述撥液物質。第2內側接觸部較佳為藉由配置於上述第2外側接觸部之內側,且於上述基板之旋轉期間,與上述基板之上述端面部中之背面緣部接觸,而使上述去除劑接觸附著於上述背面緣部之上述撥液物質。上述端面部之上述背面緣部較佳為表示於上述基板之背面側,上述端面部中位於較上述本體背面周緣部更靠徑向外側之區域,且位於較上述側面部更 靠徑向內側之區域。 In one aspect of the present invention, the first contact portion preferably includes a first outer contact portion and a first inner contact portion. The first outer contact portion preferably contacts the front peripheral portion of the body during the rotation of the substrate, so that the remover contacts the liquid-repellent substance attached to the front peripheral portion of the body. The first inner contact portion preferably contacts the front edge of the end face portion of the substrate disposed inside the first outer contact portion and contacts the front edge of the substrate during the rotation of the substrate, so that the remover contacts the liquid-repellent substance attached to the front edge. The front edge of the end face is preferably represented on the front side of the substrate, and is located in a region of the end face that is radially outward of the front peripheral portion of the body, and is located in a region that is radially inward of the side face. The second contact portion preferably includes a second outer contact portion and a second inner contact portion. The second outer contact portion is preferably in contact with the back peripheral portion of the body of the substrate during the rotation of the substrate, so that the remover contacts the liquid-repellent substance attached to the back peripheral portion of the body. The second inner contact portion is preferably arranged on the inner side of the second outer contact portion and contacts the back edge portion of the end face portion of the substrate during the rotation of the substrate, so that the remover contacts the liquid-repellent material attached to the back edge portion. The back edge portion of the end face portion is preferably represented on the back side of the substrate, in an area of the end face portion that is radially outward of the back peripheral portion of the body, and in an area that is radially inward of the side face portion.

於本發明之一態様中,較佳為上述第1外側接觸部具有與上述本體正面周緣部接觸之平坦面。上述第1內側接觸部較佳為具有與上述正面緣部接觸之傾斜面。上述第2外側接觸部較佳為具有與上述本體背面周緣部接觸之平坦面。上述第2內側接觸部較佳為具有與上述背面緣部接觸之傾斜面。 In one aspect of the present invention, the first outer contact portion preferably has a flat surface in contact with the front peripheral portion of the main body. The first inner contact portion preferably has an inclined surface in contact with the front peripheral portion. The second outer contact portion preferably has a flat surface in contact with the back peripheral portion of the main body. The second inner contact portion preferably has an inclined surface in contact with the back peripheral portion.

於本發明之一態様中,較佳為上述第1內側接觸部與上述第2內側接觸部之間隔可縮放。 In one aspect of the present invention, it is preferred that the interval between the first inner contact portion and the second inner contact portion is scalable.

於本發明之一態様中,較佳為基板處理裝置進而具備惰性氣體噴出部。惰性氣體噴出部較佳為自上述第1接觸部與上述第2接觸部之間,噴出惰性氣體。 In one aspect of the present invention, it is preferred that the substrate processing device further has an inert gas ejection unit. The inert gas ejection unit preferably ejects the inert gas from between the first contact unit and the second contact unit.

於本發明之一態様中,較佳為上述去除構件相對於上述基板之上述側面部隔開,且一面自轉,一面至少與上述本體正面周緣部接觸。 In one aspect of the present invention, it is preferred that the removal member is separated from the side surface of the substrate and is in contact with at least the peripheral portion of the front surface of the main body while rotating.

於本發明之一態様中,較佳為上述去除構件之至少一部分進入存在於上述基板之上述端面部之凹口,且接觸上述凹口之底點。 In one aspect of the present invention, it is preferred that at least a portion of the removal member enters the recess existing in the end surface portion of the substrate and contacts the bottom point of the recess.

於本發明之一態様中,較佳為基板處理裝置進而具備施力機構。施力機構較佳為將上述去除構件朝向上述基板之徑向內側施力。 In one aspect of the present invention, it is preferred that the substrate processing device further has a force-applying mechanism. The force-applying mechanism is preferably configured to apply force to the removal member inwardly of the diameter of the substrate.

於本發明之一態様中,較佳為基板處理裝置進而具備去除劑供給部。去除劑供給部較佳為對上述去除構件供給上述去除劑。 In one aspect of the present invention, it is preferred that the substrate processing device further has a removing agent supply unit. The removing agent supply unit preferably supplies the removing agent to the removing component.

根據本發明之另一態様,基板處理方法使用使可去除撥液物質之去除劑接觸上述撥液物質之去除構件。基板處理方法包含以下步驟:保持至少於本體正面周緣部及端面部附著有上述撥液物質之基板且使之旋轉;及於上述基板之旋轉期間,使上述去除構件相對於上述基板之上述端面部中之徑向之側面部分離,且使上述去除構件至少接觸上述基板之上述本體正面周緣部,藉此使上述去除劑接觸附著於上述本體正面周緣部之上述撥液物質。上述基板之上述本體正面周緣部表示基板本體之正面中之周緣區域。上述基板之上述端面部表示較上述基板本體更靠徑向外側之端面區域。 According to another aspect of the present invention, a substrate processing method uses a removal member that allows a removal agent capable of removing a repellent substance to contact the repellent substance. The substrate processing method includes the following steps: holding a substrate having the repellent substance attached to at least the front peripheral portion and the end surface portion of the body and rotating the substrate; and during the rotation of the substrate, separating the removal member from a radial side portion in the end surface portion of the substrate and allowing the removal member to contact at least the front peripheral portion of the body of the substrate, thereby allowing the removal agent to contact the repellent substance attached to the front peripheral portion of the body. The front peripheral portion of the body of the substrate refers to a peripheral area in the front of the substrate body. The above-mentioned end surface portion of the above-mentioned substrate refers to the end surface area which is closer to the outside than the above-mentioned substrate body.

於本發明之一態様中,較佳為上述去除構件包含於固定方向上空開間隔而排列之第1接觸部及第2接觸部。於使上述去除劑接觸上述撥液物質之上述步驟中,較佳為執行第1接觸動作及第2接觸動作。上述第1接觸動作較佳為於上述基板之旋轉期間,使上述第1接觸部相對於上述基板之上述側面部隔開,且使上述第1接觸部至少接觸上述基板之上述本體正面周緣部,藉此使上述去除劑接觸附著於上述本體正面周緣部之上述撥液物質之動作。上述第2接觸動作較佳為於上述基板之旋轉期間,使上述第2接觸部相對於上述基板之上述側面部隔開,且使上述第2接觸部至少接觸上述基板之本體背面周緣部,藉此使上述去除劑接觸附著於上述本體背面周緣 部之上述撥液物質之動作。上述基板之上述本體背面周緣部較佳為表示上述基板本體之背面中之周緣區域。 In one aspect of the present invention, the removal member preferably includes a first contact portion and a second contact portion arranged at intervals in a fixed direction. In the step of making the removal agent contact the liquid-repellent substance, it is preferred to perform a first contact action and a second contact action. The first contact action is preferably an action in which the first contact portion is spaced apart from the side surface of the substrate during the rotation of the substrate, and the first contact portion is made to contact at least the front peripheral portion of the main body of the substrate, thereby making the removal agent contact the liquid-repellent substance attached to the front peripheral portion of the main body. The second contact action is preferably to separate the second contact portion from the side surface of the substrate during the rotation of the substrate, and to make the second contact portion contact at least the peripheral portion of the back surface of the substrate body, thereby making the remover contact the liquid-repellent material attached to the peripheral portion of the back surface of the substrate body. The peripheral portion of the back surface of the substrate body preferably refers to the peripheral area on the back surface of the substrate body.

於本發明之一態様中,較佳為上述第1接觸部包含第1外側接觸部、及配置於上述第1外側接觸部之內側之第1內側接觸部。於使上述去除劑接觸上述撥液物質之上述步驟中,較佳為執行第1本體接觸動作及第1端面接觸動作,作為上述第1接觸動作。上述第1本體接觸動作較佳為藉由於上述基板之旋轉期間,使上述第1外側接觸部接觸上述本體正面周緣部,而使上述去除劑接觸附著於上述本體正面周緣部之上述撥液物質之動作。上述第1端面接觸動作較佳為藉由於上述基板之旋轉期間,使上述第1內側接觸部接觸上述基板之上述端面部中之正面緣部,而使上述去除劑接觸附著於上述正面緣部之上述撥液物質之動作。上述端面部之上述正面緣部較佳為表示於上述基板之正面側,上述端面部中位於較上述本體正面周緣部更靠徑向外側之區域,且位於較上述側面部更靠徑向內側之區域。上述第2接觸部較佳為包含第2外側接觸部、及配置於上述第2外側接觸部之內側之第2內側接觸部。於使上述去除劑接觸上述撥液物質之上述步驟中,較佳為執行第2本體接觸動作及第2端面接觸動作,作為上述第2接觸動作。上述第2本體接觸動作較佳為藉由於上述基板之旋轉期間,使上述第2外側接觸部接觸上述基板之上述本體背面周緣部,而使上述去除劑接觸附著於上述本體背面周緣部之上述撥液物質之動作。上述第2端面接觸動作較佳為藉由於上述基板之旋轉期間,使上述第2內側接觸部接觸上述基板之上述端面部中之背面緣部,而使上述去除劑接觸附著於上述背面緣部之上述撥液物質之動作。上述端面部之上述背面緣部較佳為表示於上述基板之背面 側,上述端面部中位於較上述本體背面周緣部更靠徑向外側之區域,且位於較上述側面部更靠徑向內側之區域。 In one aspect of the present invention, the first contact portion preferably includes a first outer contact portion and a first inner contact portion disposed inside the first outer contact portion. In the step of making the remover contact the liquid-repellent substance, it is preferred to perform a first body contact action and a first end face contact action as the first contact action. The first body contact action is preferably an action in which the first outer contact portion contacts the peripheral portion of the front surface of the body during the rotation of the substrate, thereby making the remover contact the liquid-repellent substance attached to the peripheral portion of the front surface of the body. The first end face contacting action is preferably an action of making the first inner contact part contact the front edge of the end face of the substrate during the rotation of the substrate, so that the remover contacts the liquid-repellent substance attached to the front edge. The front edge of the end face is preferably a region on the front side of the substrate, located radially outward from the front peripheral portion of the body, and radially inward from the side face. The second contact part preferably includes a second outer contact part and a second inner contact part disposed on the inner side of the second outer contact part. In the step of bringing the remover into contact with the repellent substance, it is preferred to perform a second body contacting action and a second end surface contacting action as the second contacting action. The second body contacting action is preferably an action of bringing the remover into contact with the repellent substance attached to the periphery of the back side of the body by bringing the second outer contact portion into contact with the periphery of the back side of the body of the substrate during the rotation of the substrate. The second end face contacting action is preferably an action in which the second inner side contacting portion contacts the back edge of the end face portion of the substrate during the rotation of the substrate, so that the remover contacts the liquid-repellent material attached to the back edge. The back edge of the end face portion is preferably a region on the back side of the substrate, located in a region of the end face portion that is radially outward of the back peripheral portion of the body, and radially inward of the side face portion.

於本發明之一態様中,較佳為上述第1外側接觸部具有與上述本體正面周緣部接觸之平坦面。上述第1內側接觸部較佳為具有與上述正面緣部接觸之傾斜面。上述第2外側接觸部較佳為具有與上述本體背面周緣部接觸之平坦面。上述第2內側接觸部較佳為具有與上述背面緣部接觸之傾斜面。 In one aspect of the present invention, the first outer contact portion preferably has a flat surface in contact with the front peripheral portion of the main body. The first inner contact portion preferably has an inclined surface in contact with the front peripheral portion. The second outer contact portion preferably has a flat surface in contact with the back peripheral portion of the main body. The second inner contact portion preferably has an inclined surface in contact with the back peripheral portion.

於本發明之一態様中,較佳為上述第1內側接觸部與上述第2內側接觸部之間隔可縮放。 In one aspect of the present invention, it is preferred that the interval between the first inner contact portion and the second inner contact portion is scalable.

於本發明之一態様中,較佳為於使上述去除劑接觸上述撥液物質之上述步驟中,自上述第1接觸部與上述第2接觸部之間噴出惰性氣體。 In one aspect of the present invention, it is preferred that in the step of bringing the remover into contact with the repellent substance, an inert gas is sprayed from between the first contact portion and the second contact portion.

於本發明之一態様中,較佳為於使上述去除劑接觸上述撥液物質之上述步驟中,使上述去除構件相對於上述基板之上述側面部隔開,且一面使上述去除構件自轉,一面使上述去除構件至少接觸上述本體正面周緣部。 In one aspect of the present invention, it is preferred that in the step of making the remover contact the repellent substance, the removal member is separated from the side surface of the substrate, and the removal member is rotated while at least contacting the peripheral portion of the front surface of the main body.

於本發明之一態様中,較佳為於使上述去除劑接觸上述撥液物質之上述步驟中,上述去除構件之至少一部分進入存在於上述基板之上述端面部之凹口,且接觸上述凹口之底點。 In one aspect of the present invention, it is preferred that in the step of bringing the remover into contact with the repellent substance, at least a portion of the removal member enters the recess existing in the end surface portion of the substrate and contacts the bottom point of the recess.

於本發明之一態様中,較佳為於使上述去除劑接觸上述撥液物質之上述步驟中,將上述去除構件朝向上述基板之徑向內側施力。 In one aspect of the present invention, it is preferred that in the step of bringing the remover into contact with the repellent substance, the removal member is forced radially inwardly toward the substrate.

於本發明之一態様中,較佳為基板處理方法進而包含對上述去除構件供給上述去除劑之步驟。 In one aspect of the present invention, it is preferred that the substrate processing method further includes the step of supplying the above-mentioned removal agent to the above-mentioned removal component.

根據本發明,可自基板僅去除多餘之撥液物質。 According to the present invention, only the excess repellent material can be removed from the substrate.

1:處理單元 1: Processing unit

2:控制裝置 2: Control device

2R:直徑 2R: Diameter

3:流體箱 3: Fluid box

4:藥液櫃 4: Liquid medicine cabinet

5:撥液劑處理單元 5: Repellent treatment unit

7:正面用噴嘴 7: Use the nozzle from the front

8:背面用噴嘴 8: Use a spray nozzle on the back

11:腔室 11: Chamber

13:旋轉夾盤(基板保持部) 13: Rotating chuck (substrate holding part)

15:撥液物質去除機構 15: Mechanism for removing liquid-repellent substances

17:去除劑供給部 17: Remover supply unit

19:受液部 19: Liquid receiving part

20:加熱部 20: Heating section

21:控制部 21: Control Department

22:記憶部 22: Memory Department

31:撥液劑塗佈部 31: Lotion application department

33:清洗液供給部 33: Cleaning fluid supply unit

35:惰性氣體供給部 35: Inert gas supply unit

41:第1非接觸部 41: 1st non-contact part

42:第2非接觸部 42: Second non-contact part

43,43d:第1傾斜接觸部 43,43d: 1st inclined contact part

44,44d:第2傾斜接觸部 44,44d: Second inclined contact part

50:基板本體 50: Substrate body

51:端面部 51: End face

52:凹口 52: Notch

55:第1嵌合部 55: 1st interlocking part

56:第2嵌合部 56: Second interlocking part

71:上表面 71: Upper surface

72:內部上表面 72: Inner upper surface

74:內周面 74: Inner Surface

75:外周面 75: Outer surface

81:撥液劑 81: Repellent

82,85:撥液物質 82,85: Dispelling substances

86:清洗液 86: Cleaning fluid

87:去除劑 87:Removal agent

91:上表面 91: Upper surface

92:內部上表面 92: Inner upper surface

94:內周面 94: Inner Surface

95:外周面 95: Outer surface

100:基板處理裝置 100: Substrate processing device

131:旋轉軸 131: Rotation axis

132:旋轉基座 132: Rotating base

133:旋轉馬達 133: Rotary motor

151,151A~151D:刷子(去除構件) 151,151A~151D: Brush (removal of components)

152:搖動臂 152: Swinging arm

153:搖動機構 153: Shaking mechanism

154:升降機構 154: Lifting mechanism

155:臂基軸 155: Arm base axis

156:臂本體 156: Arm body

157:支持軸 157: Support shaft

158:自轉機構 158: Rotation mechanism

159:施力機構 159: Force applying mechanism

160:刷子馬達 160: Brush motor

161:軸部 161: shaft

161a:對向軸部 161a: Opposite shaft

171:去除劑噴嘴 171: Remover nozzle

172:閥 172: Valve

173:配管 173: Piping

181,182:滑件 181,182: Sliders

185,186:本體 185,186:Entity

311:撥液劑噴嘴 311: Lotion spray nozzle

312:臂 312: Arm

313:轉動軸 313: Rotating shaft

314:噴嘴移動機構 314: Nozzle moving mechanism

315:閥 315: Valve

316:配管 316: Piping

331:清洗液噴嘴 331: Cleaning fluid nozzle

332,351:閥 332,351: Valve

333,352:配管 333,352: Piping

353:惰性氣體噴出部 353: Inert gas ejection unit

501:本體正面周緣部 501: The front edge of the body

502:本體背面周緣部 502: The back edge of the body

511:正面緣部 511: Front edge

512:正面肩部 512: Front shoulder

513:背面緣部 513: Back edge

514:背面肩部 514: Back shoulder

515:側面部 515: Lateral face

a1:上側區域 a1: upper area

a2:下側區域 a2: Lower area

A1:正面 A1: Front

A2:背面 A2: Back

AD:軸向 AD: Axial

AX1,AX2:旋轉軸線 AX1,AX2: Rotation axis

AX3:搖動軸線 AX3: rocking axis

b1:下側區域 b1: lower area

b2:上側區域 b2: upper area

B1:第1接觸部 B1: 1st contact part

B2:第2接觸部 B2: Second contact part

B11:第1外側接觸部 B11: 1st outer contact part

B11c:第1外側接觸部 B11c: 1st outer contact

B12,B12a,B12c,B12d:第1內側接觸部 B12, B12a, B12c, B12d: 1st inner contact

B13:傾斜面 B13: Inclined surface

B14:平坦面 B14: Flat surface

B15:第1接觸面 B15: 1st contact surface

B16:第2接觸面 B16: Second contact surface

B21:第2外側接觸部 B21: 2nd outer contact part

B21c:第2外側接觸部 B21c: 2nd outer contact part

B22,B22a,B22c,B22d:第2內側接觸部 B22, B22a, B22c, B22d: Second inner contact part

B23:傾斜面 B23: Inclined surface

B24:平坦面 B24: Flat surface

B25:第1接觸面 B25: 1st contact surface

B26:第2接觸面 B26: Second contact surface

BM:底點 BM: bottom point

C1:第1固定部 C1: 1st fixed part

C2:第2固定部 C2: Second fixed part

CD:周向 CD: Circumferential

CR:中心機器人 CR: Center Robot

d:厚度 d:Thickness

D:深度 D: Depth

D1:旋轉方向 D1: Rotation direction

DA:方向 DA: Direction

GP1,GP2,GP3,GP4:間隙 GP1,GP2,GP3,GP4: Gap

IR:傳載機器人 IR:Transmitter robot

L:寬度 L: Width

L0,L1,L2:長度 L0, L1, L2: length

LP:裝載埠 LP: Loading port

M1,M2,N1,N2:區域 M1,M2,N1,N2: Area

MX1:最大部分 MX1: Largest part

P1:去除位置 P1: Remove position

P2:待機位置 P2: Standby position

P3:塗佈位置 P3: Painting location

P4:待機位置 P4: Standby position

PL:假想平面 PL: imaginary plane

R:半徑 R: Radius

R0:曲率半徑 R0: Radius of curvature

RD,RDa:徑向 RD,RDa: radial direction

Rmx:半徑 Rmx: Radius

Rw:半徑 Rw: Radius

S1~S13:步驟 S1~S13: Steps

S100,S200,S300,S400,S500:步驟 S100,S200,S300,S400,S500: Steps

S1000:第1步驟 S1000: Step 1

S2000:第2步驟 S2000: Step 2

SP1,SP2:內部空間 SP1,SP2: Inner space

TW:塔 TW:Tower

W:基板 W: Substrate

θ:中心角 θ: center angle

θ1:傾斜角度 θ1: Tilt angle

θ2:傾斜角度 θ2: Tilt angle

圖1係顯示本發明之實施形態之基板處理裝置之內部之俯視圖。 FIG1 is a top view showing the interior of a substrate processing device according to an embodiment of the present invention.

圖2係顯示本實施形態之撥液劑處理單元之內部之俯視圖。 FIG. 2 is a top view showing the interior of the repellent treatment unit of this embodiment.

圖3係顯示本實施形態之撥液劑處理單元之內部之側視圖。 FIG3 is a side view showing the interior of the repellent treatment unit of this embodiment.

圖4係顯示本實施形態之基板之剖視圖。 FIG4 is a cross-sectional view showing the substrate of this embodiment.

圖5係顯示本實施形態之基板之一部分之俯視圖。 FIG5 is a top view showing a portion of the substrate of this embodiment.

圖6係顯示本實施形態之撥液物質去除方法之前段之圖。 FIG6 is a diagram showing the front section of the method for removing liquid-repellent substances in this embodiment.

圖7係顯示本實施形態之撥液物質去除方法之後段之圖。 FIG. 7 is a diagram showing the latter stage of the method for removing the repellent substance of this embodiment.

圖8係顯示本實施形態之刷子之側視圖。 Figure 8 is a side view of the brush of this embodiment.

圖9係顯示本實施形態之刷子之撥液物質之去除處理之一例之圖。 FIG. 9 is a diagram showing an example of the removal process of the liquid-repellent substance of the brush of this embodiment.

圖10係顯示本實施形態之變化例之刷子之撥液物質之去除處理之一例的圖。 FIG. 10 is a diagram showing an example of the removal of liquid-repellent substances from a brush in a variation of the present embodiment.

圖11係顯示本實施形態之另一變化例之刷子之撥液物質之去除處理 之一例的圖。 FIG. 11 is a diagram showing an example of a process for removing liquid-repellent substances from a brush in another variation of the present embodiment.

圖12係顯示本實施形態之基板處理方法之流程圖。 FIG12 is a flow chart showing the substrate processing method of this embodiment.

圖13係顯示本實施形態之基板之俯視圖。 FIG. 13 is a top view of the substrate of this embodiment.

圖14係顯示本實施形態之刷子接觸凹口之狀態之俯視圖。 Figure 14 is a top view showing the state of the brush contacting the recess in this embodiment.

圖15係顯示本實施形態之刷子及凹口之俯視圖。 Figure 15 is a top view showing the brush and recess of this embodiment.

圖16係顯示本實施形態之第1變化例之刷子之剖視圖。 FIG16 is a cross-sectional view showing the brush of the first variation of the present embodiment.

圖17係顯示第1變化例之刷子之撥液物質之去除處理之第1步驟之圖。 FIG. 17 is a diagram showing the first step of removing the liquid-repellent substance from the brush of the first variation.

圖18係顯示第1變化例之刷子之撥液物質之去除處理之第2步驟之圖。 FIG. 18 is a diagram showing the second step of the process of removing the liquid-repellent substance from the brush of the first variation.

圖19係顯示本實施形態之第2變化例之刷子之撥液物質之去除處理之一例之圖。 FIG. 19 is a diagram showing an example of the removal process of the liquid-repellent substance of the brush in the second variation of this embodiment.

以下,對於本發明之實施形態,一面參考圖式一面進行說明。另,對圖中相同或相當部分標註相同之參考符號而不重複說明。又,圖中,為容易理解,適當圖示出X軸、Y軸、及Z軸。X軸、Y軸及Z軸互相正交,X軸及Y軸與水平方向平行,Z軸與鉛直方向平行。另,「俯視」表示自鉛直上方觀察對象。又,「俯視圖」表示自鉛直上方觀察對象時之圖式。 Hereinafter, the implementation form of the present invention will be described with reference to the drawings. In addition, the same reference symbols are used for the same or equivalent parts in the drawings without repetitive description. In addition, in the drawings, the X-axis, Y-axis, and Z-axis are appropriately illustrated for easy understanding. The X-axis, Y-axis, and Z-axis are orthogonal to each other, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. In addition, "top view" means observing the object from the vertical above. In addition, "top view" means the diagram when observing the object from the vertical above.

參考圖1~圖12,說明本發明之實施形態之基板處理裝置100。首先,參考圖1,說明基板處理裝置100。圖1係顯示基板處理裝置100之內部之俯視圖。圖1所示之基板處理裝置100處理基板W。於基板W中,例如 形成有包含複數個構造物之圖案。 Referring to FIG. 1 to FIG. 12 , a substrate processing device 100 according to an embodiment of the present invention is described. First, referring to FIG. 1 , the substrate processing device 100 is described. FIG. 1 is a top view showing the interior of the substrate processing device 100. The substrate processing device 100 shown in FIG. 1 processes a substrate W. In the substrate W, for example, a pattern including a plurality of structures is formed.

基板W例如為半導體晶圓(例如,矽晶圓)、液晶顯示裝置用基板、電漿顯示器用基板、場發射顯示器(Field Emission Display:FED)用基板、光碟用基板、磁碟用基板、磁光碟用基板、光罩用基板、陶瓷基板、或太陽能電池用基板。以下,作為一例,基板W為矽晶圓。 The substrate W is, for example, a semiconductor wafer (e.g., a silicon wafer), a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a mask, a ceramic substrate, or a substrate for a solar cell. In the following, as an example, the substrate W is a silicon wafer.

如圖1所示,基板處理裝置100具備複數個裝載埠LP、傳載機器人IR、中心機器人CR、複數個處理單元1、控制裝置2、複數個流體箱3、藥液櫃4、及撥液劑處理單元5。 As shown in FIG. 1 , the substrate processing device 100 has a plurality of loading ports LP, a carrier robot IR, a central robot CR, a plurality of processing units 1, a control device 2, a plurality of fluid tanks 3, a chemical liquid tank 4, and a repellent processing unit 5.

裝載埠LP各者將複數片基板W積層而收納。傳載機器人IR於裝載埠LP與中心機器人CR之間搬送基板W。中心機器人CR於傳載機器人IR與處理單元1之間、傳載機器人IR與撥液劑處理單元5之間、或處理單元1與撥液劑處理單元5之間搬送基板W。撥液劑處理單元5於基板W塗佈撥液劑。撥液劑係包含可彈斥處理液之撥液物質之液體。且,撥液劑處理單元5自基板W去除附著於基板W之撥液物質中多餘之撥液物質。稍後敘述撥液劑處理單元5之細節。 Each loading port LP stores a plurality of substrates W by stacking them. The carrier robot IR transfers the substrates W between the loading port LP and the central robot CR. The central robot CR transfers the substrates W between the carrier robot IR and the processing unit 1, between the carrier robot IR and the repellent processing unit 5, or between the processing unit 1 and the repellent processing unit 5. The repellent processing unit 5 applies a repellent on the substrate W. The repellent is a liquid containing a repellent substance that repels the processing liquid. Furthermore, the repellent processing unit 5 removes excess repellent substances from the repellent substances attached to the substrate W. The details of the repellent processing unit 5 will be described later.

處理單元1各者藉由處理液處理基板W。處理單元1各者係逐片處理基板W之單片型之裝置。具體而言,處理單元1包含正面用噴嘴7及背面用噴嘴8。正面用噴嘴7對基板W之正面(上表面)與背面(下表面)中之基板W之正面供給處理液,處理基板W之正面。背面用噴嘴8對基板W之背面供 給處理液,處理基板W之背面。 Each processing unit 1 processes the substrate W with a processing liquid. Each processing unit 1 is a single-chip device that processes the substrate W piece by piece. Specifically, the processing unit 1 includes a front nozzle 7 and a back nozzle 8. The front nozzle 7 supplies the processing liquid to the front of the substrate W, which is one of the front (upper surface) and the back (lower surface) of the substrate W, to process the front of the substrate W. The back nozzle 8 supplies the processing liquid to the back of the substrate W, to process the back of the substrate W.

處理液係藥液或清洗液。藥液係用以處理基板W之液體。藥液例如為稀釋氫氟酸(DHF)、氫氟酸(HF)、緩衝氫氟酸(BHF)、氟化銨、HFEG(氟酸與乙二醇之混合液)、磷酸(H3PO4)、硫酸、乙酸、硝酸、鹽酸、氨水、過氧化氫水、有機酸(例如,檸檬酸、草酸)、有機鹼(例如,TMAH:四甲基氫氧化銨)、氨過氧化氫水混合液(SC1)、鹽酸過氧化氫水混合液(SC2)、異丙醇(IPA)、界面活性劑、或防腐劑。 The treatment liquid is a chemical liquid or a cleaning liquid. The chemical liquid is a liquid used to treat the substrate W. The chemical liquid is, for example, diluted hydrofluoric acid (DHF), hydrofluoric acid (HF), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H 3 PO 4 ), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide, organic acid (e.g., citric acid, oxalic acid), organic base (e.g., TMAH: tetramethylammonium hydroxide), ammonia hydrogen peroxide mixture (SC1), hydrochloric acid hydrogen peroxide mixture (SC2), isopropyl alcohol (IPA), surfactant, or preservative.

清洗液係用以自基板W沖洗藥液、藥液之處理後副產物、及/或異物之液體。清洗液例如為去離子水(DIW:Deionized Water)、碳酸水、電解離子水、氫水、臭氧水、或稀釋濃度(例如,10ppm~100ppm左右)之鹽酸水。 The cleaning liquid is a liquid used to rinse the chemical solution, byproducts after the chemical solution is processed, and/or foreign matter from the substrate W. The cleaning liquid is, for example, deionized water (DIW), carbonated water, electrolyzed ionized water, hydrogen water, ozone water, or hydrochloric acid water of dilute concentration (for example, about 10ppm~100ppm).

規定數量之處理單元1(於圖1之例中為3個處理單元1)於鉛直方向上積層而構成1個塔TW。但,於圖1之例中,複數個塔TW(於圖1之例中為4個塔TW)中之1個塔TW代替1個處理單元1而包含1個撥液劑處理單元5。複數個塔TW於俯視下以包圍中心機器人CR之方式配置。另,撥液劑處理單元5之配置無特別限定,例如,撥液劑處理單元5可配置於基板處理裝置100中之專用空間,亦可配置於基板處理裝置100之外部。又,基板處理裝置100亦可具備複數個撥液劑處理單元5。 A prescribed number of processing units 1 (three processing units 1 in the example of FIG. 1 ) are stacked in the vertical direction to form one tower TW. However, in the example of FIG. 1 , one of the plurality of towers TW (four towers TW in the example of FIG. 1 ) includes one repellent processing unit 5 instead of one processing unit 1. The plurality of towers TW are arranged so as to surround the central robot CR in a top view. In addition, the arrangement of the repellent processing unit 5 is not particularly limited. For example, the repellent processing unit 5 may be arranged in a dedicated space in the substrate processing device 100 or may be arranged outside the substrate processing device 100. Furthermore, the substrate processing device 100 may also have a plurality of repellent processing units 5.

複數個流體箱3之各者收納流體機器。複數個流體箱3分別與複數個 塔TW對應。藥液櫃4收納藥液。藥液櫃4內之藥液經由任一流體箱3,供給至與流體箱3對應之塔TW中包含之所有處理單元1。 Each of the plurality of fluid boxes 3 stores a fluid machine. The plurality of fluid boxes 3 correspond to the plurality of towers TW. The chemical liquid tank 4 stores chemical liquid. The chemical liquid in the chemical liquid tank 4 is supplied to all the processing units 1 included in the tower TW corresponding to the fluid box 3 through any fluid box 3.

控制裝置2控制裝載埠LP、傳載機器人IR、中心機器人CR、處理單元1、流體箱3、藥液櫃4、及撥液劑處理單元5。控制裝置2例如為電腦。 The control device 2 controls the loading port LP, the carrier robot IR, the central robot CR, the processing unit 1, the fluid tank 3, the liquid medicine cabinet 4, and the repellent processing unit 5. The control device 2 is, for example, a computer.

控制裝置2包含控制部21、及記憶部22。控制部21包含CPU(Central Processing Unit:中央處理單元)等處理器。記憶部22包含記憶裝置,記憶資料及電腦程式。具體而言,記憶部22包含半導體記憶體等主記憶裝置、與半導體記憶體、固態硬碟機、及/或、硬碟機等輔助記憶裝置。記憶部22亦可包含可移除式媒體。記憶部22相當於非暫時性電腦可讀取記憶媒體之一例。 The control device 2 includes a control unit 21 and a memory unit 22. The control unit 21 includes a processor such as a CPU (Central Processing Unit). The memory unit 22 includes a memory device that stores data and computer programs. Specifically, the memory unit 22 includes a main memory device such as a semiconductor memory, and an auxiliary memory device such as a semiconductor memory, a solid state hard drive, and/or a hard drive. The memory unit 22 may also include a removable medium. The memory unit 22 is equivalent to an example of a non-temporary computer-readable memory medium.

接著,參考圖2,說明撥液劑處理單元5。圖2係顯示撥液劑處理單元5之內部之俯視圖。如圖2所示,撥液劑處理單元5具備腔室11、旋轉夾盤13、撥液物質去除機構15、去除劑供給部17、受液部19、撥液劑塗佈部31、及清洗液供給部33。撥液物質去除機構15包含刷子151、及搖動臂152。去除劑供給部17包含去除劑噴嘴171、閥172、及配管173。撥液劑塗佈部31包含撥液劑噴嘴311、及臂312。清洗液供給部33包含清洗液噴嘴331。控制部21控制旋轉夾盤13、撥液物質去除機構15、去除劑供給部17、撥液劑塗佈部31、及清洗液供給部33。 Next, referring to FIG. 2 , the repellent treatment unit 5 is described. FIG. 2 is a top view showing the interior of the repellent treatment unit 5. As shown in FIG. 2 , the repellent treatment unit 5 includes a chamber 11, a rotary chuck 13, a repellent substance removal mechanism 15, a remover supply unit 17, a liquid receiving unit 19, a repellent application unit 31, and a cleaning liquid supply unit 33. The repellent substance removal mechanism 15 includes a brush 151 and a swing arm 152. The remover supply unit 17 includes a remover nozzle 171, a valve 172, and a pipe 173. The repellent application unit 31 includes a repellent nozzle 311 and an arm 312. The cleaning liquid supply unit 33 includes a cleaning liquid nozzle 331. The control unit 21 controls the rotary chuck 13, the repellent substance removal mechanism 15, the removal agent supply unit 17, the repellent agent application unit 31, and the cleaning liquid supply unit 33.

腔室11具有大致箱形狀。腔室11收納旋轉夾盤13、撥液物質去除機 構15、去除劑噴嘴171、受液部19、撥液劑塗佈部31、撥液劑噴嘴311、及清洗液噴嘴331。 The chamber 11 has a roughly box-like shape. The chamber 11 accommodates the rotary chuck 13, the repellent substance removal mechanism 15, the removal agent nozzle 171, the liquid receiving portion 19, the repellent agent application portion 31, the repellent agent nozzle 311, and the cleaning liquid nozzle 331.

旋轉夾盤13保持基板W且使基板W旋轉。具體而言,旋轉夾盤13將基板W大致水平地保持,且使基板W繞旋轉軸線AX1旋轉。旋轉夾盤13相當於本發明之「基板保持部」之一例。 The rotary chuck 13 holds the substrate W and rotates the substrate W. Specifically, the rotary chuck 13 holds the substrate W approximately horizontally and rotates the substrate W around the rotation axis AX1. The rotary chuck 13 is equivalent to an example of the "substrate holding portion" of the present invention.

撥液劑塗佈部31於塗佈位置P3中,於基板W之徑向RD外側之端面部51塗佈撥液劑。端面部51係基板W中繞旋轉軸線AX1之大致圓環狀之部分。具體而言,撥液劑塗佈部31於塗佈位置P3中,藉由撥液劑噴嘴311,對基板W之徑向RD外側之端面部51噴出撥液劑。本實施形態中,徑向RD與水平方向大致平行。又,徑向RD與旋轉軸線AX1正交。徑向RD亦可掌握為相對於旋轉軸線AX1之徑向。另,有將繞旋轉軸線AX1之圓周方向記載為周向CD之情形。周向CD亦可掌握為基板W之周向。 The repellent coating section 31 coats the repellent on the end face portion 51 on the radial outer side RD of the substrate W at the coating position P3. The end face portion 51 is a roughly annular portion of the substrate W around the rotation axis AX1. Specifically, the repellent coating section 31 sprays the repellent on the end face portion 51 on the radial outer side RD of the substrate W through the repellent nozzle 311 at the coating position P3. In this embodiment, the radial direction RD is roughly parallel to the horizontal direction. In addition, the radial direction RD is orthogonal to the rotation axis AX1. The radial direction RD can also be understood as the radial direction relative to the rotation axis AX1. In addition, there is a case where the circumferential direction around the rotation axis AX1 is recorded as the circumferential direction CD. The circumferential direction CD can also be understood as the circumferential direction of the substrate W.

塗佈位置P3表示基板W之端面部51之上方之位置。另一方面,待機位置P4表示較塗佈位置P3更靠徑向RD外側之位置。即,待機位置P4表示徑向RD上與基板W隔開之位置。 The coating position P3 indicates a position above the end surface 51 of the substrate W. On the other hand, the standby position P4 indicates a position further outward in the radial direction RD than the coating position P3. That is, the standby position P4 indicates a position separated from the substrate W in the radial direction RD.

撥液劑係包含撥液物質之液體。具體而言,撥液劑係包含撥液物質之溶液。撥液物質係可彈斥處理基板W之處理液之物質。即,撥液物質係具有較基板W更彈斥處理液之性質之物質。撥液物質具有撥液性。撥液性係指彈斥液體之性質。例如,接觸角為90度以上之物質為撥液物質。 A repellent is a liquid containing a repellent substance. Specifically, a repellent is a solution containing a repellent substance. A repellent substance is a substance that can repel a processing liquid for processing a substrate W. That is, a repellent substance is a substance that has the property of repelling the processing liquid more than the substrate W. A repellent substance has repellency. Repellency refers to the property of repelling a liquid. For example, a substance having a contact angle of 90 degrees or more is a repellent substance.

撥液劑係溶媒、與作為溶質之撥液物質之混合物。溶媒例如為水。水例如為與清洗液相同之液體。撥液物質例如為高分子化合物。撥液物質較佳為非氟系撥液物質。雖為一例,但作為撥液物質,亦可使用日華化學製之NeoSeed(註冊商標)。另,撥液劑亦可為蠟。 The repellent is a mixture of a solvent and a repellent substance as a solute. The solvent is, for example, water. The water is, for example, the same liquid as the cleaning solution. The repellent substance is, for example, a polymer compound. The repellent substance is preferably a non-fluorine-based repellent substance. Although this is an example, NeoSeed (registered trademark) manufactured by Nikka Chemical Co., Ltd. can also be used as the repellent substance. In addition, the repellent can also be wax.

撥液物質例如為撥水物質。撥水物質係可彈斥水之物質。即,撥水物質係具有較基板W更彈斥水之性質之物質。撥水物質具有撥水性。撥水性係指彈斥水之性質。例如,接觸角為90度以上之物質為撥水物質。此時之水例如為與清洗液相同之液體。於使用撥水物質,作為撥液物質之情形時,於處理液為水溶液時有效。另,於撥液物質為撥水物質之情形時,撥液劑為撥水劑。 The liquid repellent substance is, for example, a water-repellent substance. The water-repellent substance is a substance that repels water. That is, the water-repellent substance is a substance that repels water more than the substrate W. The water-repellent substance has water-repellency. Water-repellency refers to the property of repelling water. For example, a substance with a contact angle of 90 degrees or more is a water-repellent substance. The water at this time is, for example, the same liquid as the cleaning liquid. When the water-repellent substance is used as a liquid repellent substance, it is effective when the processing liquid is an aqueous solution. In addition, when the liquid repellent substance is a water-repellent substance, the liquid repellent is a water-repellent.

撥液物質例如可為矽系撥液物質,亦可為丙烯酸系撥液物質。矽系撥液物質對矽本身、及包含矽之化合物賦予撥液性。矽系撥液物質例如為矽烷偶合劑。矽烷偶合劑例如包含HMDS(六甲基二矽氮烷)、TMS(四甲基矽)、氟化烷基氯矽烷、烷基二矽氮烷、及非氯系疏水化劑之至少一者。非氯系疏水化劑例如包含二甲基甲矽烷基二甲胺、二甲基甲矽烷基二乙胺、六甲基二矽氮烷、四甲基二矽氮烷、雙(二甲基胺)二甲基矽烷、N,N-二甲基三甲基矽胺、N-(三甲基矽基)二甲胺及有機矽烷化合物之至少一者。 The repellent material may be, for example, a silicon-based repellent material or an acrylic-based repellent material. The silicon-based repellent material imparts repellency to silicon itself and compounds containing silicon. The silicon-based repellent material may be, for example, a silane coupling agent. The silane coupling agent may include, for example, at least one of HMDS (hexamethyldisilazane), TMS (tetramethylsilane), fluorinated alkylchlorosilane, alkyldisilazane, and a non-chlorine-based hydrophobizing agent. The non-chlorine hydrophobic agent includes, for example, at least one of dimethylsilyldimethylamine, dimethylsilyldiethylamine, hexamethyldisilazane, tetramethyldisilazane, bis(dimethylamine)dimethylsilane, N,N-dimethyltrimethylsilamine, N-(trimethylsilyl)dimethylamine and an organic silane compound.

另,撥液物質例如亦可為金屬系撥液物質。金屬系撥液物質對金屬 本身、及包含金屬之化合物賦予撥液性。金屬系撥液物質例如包含具有疏水基之胺、及有機矽化合物之至少一者。 In addition, the repellent substance may be, for example, a metal-based repellent substance. The metal-based repellent substance imparts repellency to the metal itself and a compound containing the metal. The metal-based repellent substance may include, for example, at least one of an amine having a hydrophobic group and an organic silicon compound.

撥液物質去除機構15於將噴出至基板W之撥液劑乾燥後,於去除位置P1中,使用含浸有去除劑之刷子151執行附著於基板W之撥液物質之去除處理。去除處理係指將附著於基板W之撥液物質與基板W分離之處理。該情形時,「分離」例如表示藉由去除劑研磨基板W中附著有撥液物質之部分,而將撥液物質與基板W分離。但,「分離」例如亦可為藉由去除劑溶解附著於基板W之撥液物質,而將撥液物質與基板W分離。 After the repellent sprayed onto the substrate W is dried, the repellent substance removal mechanism 15 performs a removal process of the repellent substance attached to the substrate W using a brush 151 impregnated with the remover at the removal position P1. The removal process refers to a process of separating the repellent substance attached to the substrate W from the substrate W. In this case, "separation" means, for example, separating the repellent substance from the substrate W by polishing the portion of the substrate W to which the repellent substance is attached with the remover. However, "separation" may also mean, for example, separating the repellent substance from the substrate W by dissolving the repellent substance attached to the substrate W with the remover.

去除位置P1表示徑向RD上面向基板W之端面部51之位置。另一方面,待機位置P2表示較去除位置P1更靠徑向RD外側之位置。即,待機位置P2表示徑向RD上與基板W隔開之位置。於待機位置P2之下方,配置受液部19。受液部19例如為罐狀物。 The removal position P1 indicates the position of the end surface portion 51 facing the substrate W in the radial direction RD. On the other hand, the standby position P2 indicates a position further outward in the radial direction RD than the removal position P1. That is, the standby position P2 indicates a position separated from the substrate W in the radial direction RD. Below the standby position P2, a liquid receiving portion 19 is arranged. The liquid receiving portion 19 is, for example, a can-shaped object.

去除劑係用以去除撥液物質之液體。換言之,去除劑係用以自基板W分離撥液物質之液體。去除劑例如為包含研磨劑之液體。研磨劑例如為氧化鈰。作為去除劑,例如,可使用PROSTAFF公司製之「Kirobin(註冊商標)」。另,只要可自基板W去除(分離)撥液物質,則去除劑中包含之研磨劑之種類無特別限定。又,只要可自基板W去除(分離)撥液物質,則例如去除劑亦可為包含使撥液物質溶解之成分之液體。 The remover is a liquid used to remove the repellent substance. In other words, the remover is a liquid used to separate the repellent substance from the substrate W. The remover is, for example, a liquid containing an abrasive. The abrasive is, for example, bismuth oxide. As the remover, for example, "Kirobin (registered trademark)" manufactured by PROSTAFF can be used. In addition, as long as the repellent substance can be removed (separated) from the substrate W, the type of abrasive contained in the remover is not particularly limited. In addition, as long as the repellent substance can be removed (separated) from the substrate W, for example, the remover can also be a liquid containing a component that dissolves the repellent substance.

清洗液供給部33於對附著於基板W之撥液物質執行去除處理後,藉 由清洗液將基板W洗淨。即,清洗液供給部33於執行去除處理後,藉由清洗液沖洗自基板W分離之撥液物質。具體而言,清洗液供給部33於執行去除處理後,藉由清洗液噴嘴331,對基板W之徑向RD外側部分(包含端面部51)噴出清洗液。 After performing a removal process on the repellent material attached to the substrate W, the cleaning liquid supply unit 33 cleans the substrate W with the cleaning liquid. That is, after performing the removal process, the cleaning liquid supply unit 33 rinses the repellent material separated from the substrate W with the cleaning liquid. Specifically, after performing the removal process, the cleaning liquid supply unit 33 sprays the cleaning liquid to the radial RD outer side portion (including the end surface portion 51) of the substrate W through the cleaning liquid nozzle 331.

去除劑供給部17於待機位置P2,對撥液物質去除機構15之刷子151供給去除劑。因此,根據本實施形態,可使去除劑有效地含浸至刷子151。刷子151相當於本發明之「去除構件」之一例。 The remover supply unit 17 supplies the remover to the brush 151 of the repellent material removal mechanism 15 at the standby position P2. Therefore, according to this embodiment, the remover can be effectively impregnated into the brush 151. The brush 151 is equivalent to an example of the "removal member" of the present invention.

刷子151例如具有大致圓柱形狀。刷子151例如具有彈性。刷子151例如包含多孔質物質。該情形時,例如,刷子151亦可為海綿狀。刷子151較佳為具有撥液性。這是因為容易使撥液劑轉移至基板W。刷子151之素材例如為PTFE(聚四氟乙烯)、或PFA(四氟乙烯-全氟烷基乙烯醚共聚物)。另,例如,刷子151可將複數個構件組合而構成,亦可包含複數根毛。 The brush 151 has, for example, a roughly cylindrical shape. The brush 151 has, for example, elasticity. The brush 151 includes, for example, a porous material. In this case, for example, the brush 151 may also be sponge-shaped. The brush 151 is preferably repellent. This is because the repellent is easily transferred to the substrate W. The material of the brush 151 is, for example, PTFE (polytetrafluoroethylene) or PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer). In addition, for example, the brush 151 may be composed of a plurality of components and may also include a plurality of hairs.

具體而言,去除劑供給部17之去除劑噴嘴171對位於待機位置P2之刷子151噴出去除劑。其結果,去除劑含浸至刷子151。 Specifically, the remover nozzle 171 of the remover supply unit 17 sprays the remover to the brush 151 located at the standby position P2. As a result, the remover is impregnated into the brush 151.

更具體而言,於去除劑噴嘴171連接配管173。配管173將去除劑供給至去除劑噴嘴171。於配管173配置閥172。閥172將配管173之流路封閉或開放。控制部21控制閥172,以使閥172將配管173之流路開放。其結果,由於閥172將配管173之流路開放,故去除劑噴嘴171向刷子151噴出去除 劑。未含浸至刷子151之去除劑下落至受液部19,且滯留於受液部19。 More specifically, the removal agent nozzle 171 is connected to the piping 173. The piping 173 supplies the removal agent to the removal agent nozzle 171. The valve 172 is arranged on the piping 173. The valve 172 closes or opens the flow path of the piping 173. The control unit 21 controls the valve 172 so that the valve 172 opens the flow path of the piping 173. As a result, since the valve 172 opens the flow path of the piping 173, the removal agent nozzle 171 sprays the removal agent to the brush 151. The removal agent that is not impregnated into the brush 151 falls to the liquid receiving unit 19 and stays in the liquid receiving unit 19.

接著,參考圖3詳細說明撥液劑處理單元5。圖3係顯示撥液劑處理單元5之內部之側視圖。如圖3所示,於撥液劑處理單元5中,旋轉夾盤13為真空吸附式夾盤。具體而言,旋轉夾盤13包含旋轉軸131、旋轉基座132、及旋轉馬達133。旋轉軸131沿大致鉛直方向延伸。旋轉基座132具有大致圓板形狀,安裝於旋轉軸131之上端。且,旋轉基座132將基板W以大致水平之姿勢保持。於圖3之例中,旋轉基座132吸附基板W之背面而將基板W以大致水平之姿勢保持。旋轉馬達133具有與旋轉軸131同軸連結之旋轉軸。且,旋轉馬達133於基板W保持於旋轉基座132之狀態下,使基板W繞旋轉軸131之旋轉軸線AX1旋轉。 Next, the repellent treatment unit 5 is described in detail with reference to FIG3. FIG3 is a side view showing the interior of the repellent treatment unit 5. As shown in FIG3, in the repellent treatment unit 5, the rotating chuck 13 is a vacuum adsorption type chuck. Specifically, the rotating chuck 13 includes a rotating shaft 131, a rotating base 132, and a rotating motor 133. The rotating shaft 131 extends in a substantially vertical direction. The rotating base 132 has a substantially circular plate shape and is mounted on the upper end of the rotating shaft 131. Moreover, the rotating base 132 holds the substrate W in a substantially horizontal posture. In the example of FIG3, the rotating base 132 adsorbs the back side of the substrate W and holds the substrate W in a substantially horizontal posture. The rotary motor 133 has a rotary shaft coaxially connected to the rotary shaft 131. In addition, the rotary motor 133 rotates the substrate W around the rotary axis AX1 of the rotary shaft 131 while the substrate W is held on the rotary base 132.

撥液劑處理單元5進而具備加熱部20。加熱部20於控制部21之控制下,自基板W之背面側,將基板W之徑向RD外側部分加熱。加熱部20配置於較旋轉夾盤13更靠徑向RD外側。加熱部20配置於較基板W更下方。具體而言,加熱部20配置於基板W之徑向RD外側部分之下方。於圖3之例中,加熱部20具有繞旋轉軸線AX1延伸之大致圓環形狀。加熱部20例如為加熱器。另,有時將沿旋轉軸線AX1之方向記載為軸向AD。軸向AD與基板W正交,與鉛直方向大致平行。 The repellent treatment unit 5 further includes a heating unit 20. The heating unit 20 heats the radial RD outer side portion of the substrate W from the back side of the substrate W under the control of the control unit 21. The heating unit 20 is arranged closer to the radial RD outer side than the rotating chuck 13. The heating unit 20 is arranged below the substrate W. Specifically, the heating unit 20 is arranged below the radial RD outer side portion of the substrate W. In the example of FIG. 3, the heating unit 20 has a generally annular shape extending around the rotation axis AX1. The heating unit 20 is, for example, a heater. In addition, the direction along the rotation axis AX1 is sometimes recorded as the axial direction AD. The axial direction AD is orthogonal to the substrate W and is generally parallel to the lead vertical direction.

撥液物質去除機構15於控制部21之控制下,使刷子151沿水平方向搖動,或使刷子151升降。撥液物質去除機構15使刷子151於去除位置P1(圖2)與待機位置P2(圖2)之間移動。稍後敘述刷子151之細節。 Under the control of the control unit 21, the repellent substance removal mechanism 15 causes the brush 151 to swing in the horizontal direction or to move the brush 151 up and down. The repellent substance removal mechanism 15 causes the brush 151 to move between the removal position P1 (FIG. 2) and the standby position P2 (FIG. 2). The details of the brush 151 will be described later.

具體而言,撥液物質去除機構15包含搖動臂152、搖動機構153、升降機構154、及臂基軸155。於搖動臂152之水平方向一側之前端安裝刷子151。且,搖動臂152使刷子151沿大致水平方向搖動,或使刷子151升降。 Specifically, the liquid-repellent substance removal mechanism 15 includes a rocking arm 152, a rocking mechanism 153, a lifting mechanism 154, and an arm base shaft 155. The brush 151 is installed at the front end of one side of the rocking arm 152 in the horizontal direction. In addition, the rocking arm 152 causes the brush 151 to rock in a substantially horizontal direction, or to lift and lower the brush 151.

更具體而言,搖動機構153於控制部21之控制下,使搖動臂152沿大致水平方向繞搖動軸線AX3搖動。詳細而言,臂基軸155之上端部連結於搖動臂152之水平方向另一側。搖動機構153之驅動力輸入至臂基軸155。藉由將搖動機構153之驅動力輸入至臂基軸155,使臂基軸155往復旋轉,使搖動臂152以臂基軸155為支點搖動。搖動機構153例如包含馬達。 More specifically, the rocking mechanism 153, under the control of the control unit 21, causes the rocking arm 152 to rock around the rocking axis AX3 in a substantially horizontal direction. Specifically, the upper end of the arm base shaft 155 is connected to the other side of the rocking arm 152 in the horizontal direction. The driving force of the rocking mechanism 153 is input to the arm base shaft 155. By inputting the driving force of the rocking mechanism 153 to the arm base shaft 155, the arm base shaft 155 is reciprocated, and the rocking arm 152 is rocked with the arm base shaft 155 as a fulcrum. The rocking mechanism 153 includes, for example, a motor.

又,升降機構154於控制部21之控制下,使搖動臂152升降。詳細而言,於臂基軸155連結有升降機構154。升降機構154使臂基軸155上下移動,使搖動臂152與臂基軸155一體上下移動。升降機構154例如包含滾珠螺桿機構、及對滾珠螺桿機構施加驅動力之馬達。 Furthermore, the lifting mechanism 154 raises and lowers the swing arm 152 under the control of the control unit 21. Specifically, the lifting mechanism 154 is connected to the arm base shaft 155. The lifting mechanism 154 moves the arm base shaft 155 up and down, so that the swing arm 152 and the arm base shaft 155 move up and down together. The lifting mechanism 154 includes, for example, a ball screw mechanism and a motor that applies a driving force to the ball screw mechanism.

具體而言,搖動臂152包含臂本體156、支持軸157、及自轉機構158。臂本體156為中空,於大致水平方向延伸。臂本體156藉由搖動機構153沿大致水平方向搖動。臂本體156藉由升降機構154而昇降。支持軸157位於臂本體156之水平方向一側,朝大致水平方向突出。自轉機構158由支持軸157支持。於自轉機構158之下端部安裝刷子151。 Specifically, the swing arm 152 includes an arm body 156, a support shaft 157, and a rotation mechanism 158. The arm body 156 is hollow and extends in a substantially horizontal direction. The arm body 156 is swung in a substantially horizontal direction by the swing mechanism 153. The arm body 156 is raised and lowered by the lifting mechanism 154. The support shaft 157 is located on one side of the arm body 156 in the horizontal direction and protrudes in a substantially horizontal direction. The rotation mechanism 158 is supported by the support shaft 157. The brush 151 is installed at the lower end of the rotation mechanism 158.

自轉機構158於控制部21之控制下,使刷子151繞旋轉軸線AX2旋轉。即,自轉機構158使刷子151自轉。具體而言,自轉機構158包含刷子馬達160、軸部161、第1固定部C1、及第2固定部C2。 The rotation mechanism 158 rotates the brush 151 around the rotation axis AX2 under the control of the control unit 21. That is, the rotation mechanism 158 rotates the brush 151. Specifically, the rotation mechanism 158 includes a brush motor 160, a shaft 161, a first fixing part C1, and a second fixing part C2.

刷子馬達160之輸出軸固定於軸部161。軸部161朝向鉛直下方延伸。即,軸部161沿軸向AD朝下方延伸。於軸部161之下部,安裝第1固定部C1及第2固定部C2。第1固定部C1及第2固定部C2將刷子151固定於軸部161。刷子馬達160藉由使軸部161旋轉,而使刷子151與第1固定部C1及第2固定部C2一起繞旋轉軸線AX2旋轉。本實施形態中,旋轉軸線AX2與旋轉軸線AX1大致平行。因此,相對於旋轉軸線AX1之軸向AD與旋轉軸線AX2大致平行。因此,軸向AD亦可掌握為相對於旋轉軸線AX2之軸向。 The output shaft of the brush motor 160 is fixed to the shaft 161. The shaft 161 extends straight downward. That is, the shaft 161 extends downward along the axial direction AD. The first fixing part C1 and the second fixing part C2 are installed at the lower part of the shaft 161. The first fixing part C1 and the second fixing part C2 fix the brush 151 to the shaft 161. The brush motor 160 rotates the shaft 161 to rotate the brush 151 around the rotation axis AX2 together with the first fixing part C1 and the second fixing part C2. In this embodiment, the rotation axis AX2 is roughly parallel to the rotation axis AX1. Therefore, the axial direction AD relative to the rotation axis AX1 is roughly parallel to the rotation axis AX2. Therefore, the axial direction AD can also be understood as the axial direction relative to the rotation axis AX2.

又,搖動臂152進而包含施力機構159。施力機構159於控制部21之控制下,經由支持軸157及自轉機構158,將刷子151朝向基板W之徑向RD內側施力。具體而言,施力機構159將刷子151相對於基板W之端面部51之徑向RD之推壓壓力保持為預設之推壓壓力。推壓壓力係於徑向RD上對端面部51按壓刷子151時之壓力。例如,施力機構159利用氣缸沿徑向RD驅動支持軸157,藉此將刷子151朝向基板W之徑向RD內側施力。 In addition, the swing arm 152 further includes a force-applying mechanism 159. Under the control of the control unit 21, the force-applying mechanism 159 applies force to the brush 151 toward the inner side of the radial direction RD of the substrate W via the support shaft 157 and the rotation mechanism 158. Specifically, the force-applying mechanism 159 maintains the pushing pressure of the brush 151 relative to the end surface 51 of the substrate W in the radial direction RD at a preset pushing pressure. The pushing pressure is the pressure when the brush 151 is pressed against the end surface 51 in the radial direction RD. For example, the force-applying mechanism 159 drives the support shaft 157 in the radial direction RD using a cylinder, thereby applying force to the brush 151 toward the inner side of the radial direction RD of the substrate W.

撥液劑塗佈部31除撥液劑噴嘴311及臂312外,進而包含轉動軸313、噴嘴移動機構314、閥315、及配管316。於撥液劑噴嘴311連接配管316。配管316將撥液劑供給至撥液劑噴嘴311。於配管316配置閥315。閥 315將配管316之流路封閉或開放。控制部21以使閥315將配管316之流路開放之方式控制閥315。其結果,由於閥315將配管316之流路開放,故撥液劑噴嘴311向基板W之端面部51噴出撥液劑。 The repellent applying unit 31 includes a repellent nozzle 311 and an arm 312, and further includes a rotating shaft 313, a nozzle moving mechanism 314, a valve 315, and a pipe 316. The repellent nozzle 311 is connected to the pipe 316. The pipe 316 supplies the repellent to the repellent nozzle 311. The valve 315 is disposed on the pipe 316. The valve 315 closes or opens the flow path of the pipe 316. The control unit 21 controls the valve 315 so that the valve 315 opens the flow path of the pipe 316. As a result, since the valve 315 opens the flow path of the pipe 316, the repellent nozzle 311 sprays the repellent toward the end surface 51 of the substrate W.

噴嘴移動機構314經由臂312及轉動軸313,於塗佈位置P3(圖2)與待機位置P4(圖2)之間移動撥液劑噴嘴311。 The nozzle moving mechanism 314 moves the repellent nozzle 311 between the coating position P3 (Figure 2) and the standby position P4 (Figure 2) via the arm 312 and the rotating shaft 313.

具體而言,臂312沿大致水平方向延伸。於臂312之前端部安裝撥液劑噴嘴311。臂312連結於轉動軸313。轉動軸313沿大致鉛直方向延伸。噴嘴移動機構314使轉動軸313繞沿大致鉛直方向之轉動軸線轉動,使臂312沿大致水平面轉動。其結果,撥液劑噴嘴311沿大致水平面移動。例如,噴嘴移動機構314包含使轉動軸313繞轉動軸線轉動之臂搖動馬達。臂搖動馬達例如為伺服馬達。又,噴嘴移動機構314使轉動軸313沿大致鉛直方向升降,使臂312升降。其結果,撥液劑噴嘴311沿大致鉛直方向移動。例如,噴嘴移動機構314包含滾珠螺桿機構、及對滾珠螺桿機構施加驅動力之臂升降馬達。臂升降馬達例如為伺服馬達。 Specifically, the arm 312 extends in a substantially horizontal direction. The repellent nozzle 311 is mounted at the front end of the arm 312. The arm 312 is connected to the rotating shaft 313. The rotating shaft 313 extends in a substantially vertical direction. The nozzle moving mechanism 314 rotates the rotating shaft 313 around a rotating axis in a substantially vertical direction, so that the arm 312 rotates along a substantially horizontal plane. As a result, the repellent nozzle 311 moves along a substantially horizontal plane. For example, the nozzle moving mechanism 314 includes an arm rocking motor that rotates the rotating shaft 313 around the rotating axis. The arm rocking motor is, for example, a servo motor. Furthermore, the nozzle moving mechanism 314 causes the rotating shaft 313 to rise and fall in a substantially vertical direction, thereby causing the arm 312 to rise and fall. As a result, the liquid dispensing nozzle 311 moves in a substantially vertical direction. For example, the nozzle moving mechanism 314 includes a ball screw mechanism and an arm lifting motor that applies a driving force to the ball screw mechanism. The arm lifting motor is, for example, a servo motor.

清洗液供給部33除清洗液噴嘴331外,進而包含閥332、及配管333。於清洗液噴嘴331連接配管333。配管333將清洗液供給至清洗液噴嘴331。於配管333配置閥332。閥332將配管333之流路封閉或開放。控制部21以使閥332將配管333之流路開放之方式控制閥332。其結果,由於閥332將配管333之流路開放,故清洗液噴嘴331向基板W之徑向RD外側部分(包含端面部51)噴出清洗液。 The cleaning liquid supply unit 33 further includes a valve 332 and a pipe 333 in addition to the cleaning liquid nozzle 331. The pipe 333 is connected to the cleaning liquid nozzle 331. The pipe 333 supplies the cleaning liquid to the cleaning liquid nozzle 331. The valve 332 is arranged on the pipe 333. The valve 332 closes or opens the flow path of the pipe 333. The control unit 21 controls the valve 332 in such a way that the valve 332 opens the flow path of the pipe 333. As a result, since the valve 332 opens the flow path of the pipe 333, the cleaning liquid nozzle 331 sprays the cleaning liquid toward the radial RD outer side portion (including the end surface portion 51) of the substrate W.

接著,參考圖4及圖5,說明基板W之細節。圖4係顯示基板W之剖視圖。圖4中,放大顯示基板W之徑向RD外側部分之剖面。圖5係顯示基板W之一部分之俯視圖。圖5中,放大顯示基板W之徑向RD外側部分之正面A1。 Next, referring to FIG. 4 and FIG. 5 , the details of the substrate W are described. FIG. 4 is a cross-sectional view of the substrate W. FIG. 4 shows an enlarged cross-sectional view of the radially outer portion of the substrate W. FIG. 5 is a top view of a portion of the substrate W. FIG. 5 shows an enlarged front view A1 of the radially outer portion of the substrate W.

如圖4及圖5所示,基板W具有本體50(以下,記載為「基板本體50」)、及端面部51。基板本體50表示基板W中除端面部51外之部分。換言之,基板本體50表示基板W中較端面部51更靠徑向RD內側部分。進而換言之,基板本體50表示基板W中沿徑向RD之大致平坦之部分。於基板本體50形成有圖案。例如,於基板W之正面A1側,於基板本體50形成有圖案。另,例如,亦可於基板W之背面A2側,於基板本體50形成有圖案。基板本體50具有大致圓板形狀。另,圖5中,為容易理解,而以虛線顯示基板本體50與端面部51之邊界。 As shown in FIG. 4 and FIG. 5 , the substrate W has a body 50 (hereinafter, described as "substrate body 50") and an end face portion 51. The substrate body 50 represents the portion of the substrate W excluding the end face portion 51. In other words, the substrate body 50 represents the portion of the substrate W that is closer to the inner side of the radial direction RD than the end face portion 51. In other words, the substrate body 50 represents the substantially flat portion of the substrate W along the radial direction RD. A pattern is formed on the substrate body 50. For example, a pattern is formed on the substrate body 50 on the front A1 side of the substrate W. In addition, for example, a pattern may also be formed on the substrate body 50 on the back A2 side of the substrate W. The substrate body 50 has a substantially circular plate shape. In addition, in FIG. 5 , for easy understanding, the boundary between the substrate body 50 and the end face portion 51 is shown by a dotted line.

具體而言,基板本體50包含本體正面周緣部501及本體背面周緣部502。本體正面周緣部501表示基板本體50之正面A1中之周緣區域。本體背面周緣部502表示基板本體50之背面A2中之周緣區域。本體正面周緣部501及本體背面周緣部502各者係繞旋轉軸線AX1(圖2)之大致圓環狀之區域。本體正面周緣部501及本體背面周緣部502各者之徑向RD之寬度例如為1mm以上且4mm以下。 Specifically, the substrate body 50 includes a body front peripheral portion 501 and a body back peripheral portion 502. The body front peripheral portion 501 represents a peripheral area in the front A1 of the substrate body 50. The body back peripheral portion 502 represents a peripheral area in the back A2 of the substrate body 50. The body front peripheral portion 501 and the body back peripheral portion 502 are each a roughly annular area around the rotation axis AX1 (Figure 2). The width of the radial direction RD of each of the body front peripheral portion 501 and the body back peripheral portion 502 is, for example, greater than 1 mm and less than 4 mm.

端面部51表示基板W中較基板本體50更靠徑向RD外側之部分。換言 之,端面部51表示基板W中較基板本體50更靠徑向RD外側之端面區域。進而換言之,端面部51表示基板W中較本體正面周緣部501及本體背面周緣部502更靠徑向RD外側之端面區域。端面部51具有正面緣部511、正面肩部512、側面部515、背面肩部514、及背面緣部513。 The end face portion 51 indicates a portion of the substrate W that is closer to the radial RD outer side than the substrate body 50. In other words, the end face portion 51 indicates an end face region of the substrate W that is closer to the radial RD outer side than the substrate body 50. In other words, the end face portion 51 indicates an end face region of the substrate W that is closer to the radial RD outer side than the body front peripheral portion 501 and the body back peripheral portion 502. The end face portion 51 has a front edge portion 511, a front shoulder portion 512, a side face portion 515, a back shoulder portion 514, and a back edge portion 513.

正面緣部511係於基板W之正面A1與背面A2中之正面A1側,端面部51中位於較基板本體50更靠徑向RD外側之區域,且位於較側面部515更靠徑向RD內側之區域。 The front edge 511 is located on the front A1 side of the front A1 and the back A2 of the substrate W, in an area of the end surface 51 that is closer to the outer side of the substrate body 50 in the radial direction RD, and is located in an area that is closer to the inner side of the radial direction RD than the side surface 515.

正面緣部511係繞旋轉軸線AX1(圖2)之大致圓環狀之區域。正面緣部511於俯視下,於周向CD上包圍基板本體50(具體而言為本體正面周緣部501)。正面緣部511包含於剖視下,自本體正面周緣部501朝向正面肩部512相對於基板本體50之正面A1傾斜之傾斜面。正面緣部511相對於本體正面周緣部501具有傾斜角度θ1。正面緣部511連接本體正面周緣部501與正面肩部512。 The front edge 511 is a roughly annular area around the rotation axis AX1 (Figure 2). The front edge 511 surrounds the substrate body 50 (specifically, the body front peripheral portion 501) in the circumferential direction CD when viewed from above. The front edge 511 includes an inclined surface that is inclined from the body front peripheral portion 501 toward the front shoulder 512 relative to the front surface A1 of the substrate body 50 when viewed from the cross-section. The front edge 511 has an inclination angle θ1 relative to the body front peripheral portion 501. The front edge 511 connects the body front peripheral portion 501 and the front shoulder 512.

正面肩部512係於正面A1側,端面部51中位於較正面緣部511更靠徑向RD外側之區域,且位於較側面部515更靠徑向RD內側之區域。 The front shoulder 512 is located on the front A1 side, in the end face portion 51, in a region closer to the outer side of the radial direction RD than the front edge portion 511, and in a region closer to the inner side of the radial direction RD than the side face portion 515.

正面肩部512係繞旋轉軸線AX1(圖2)之大致圓環狀之區域。正面肩部512於俯視下,於周向CD上包圍正面緣部511。正面肩部512包含於剖視下,自正面緣部511朝向側面部515彎曲之彎曲面。正面肩部512連接正面緣部511與側面部515。 The front shoulder 512 is a generally annular region around the rotation axis AX1 (FIG. 2). The front shoulder 512 surrounds the front edge 511 in the circumferential direction CD in a top view. The front shoulder 512 includes a curved surface that curves from the front edge 511 toward the side surface 515 in a cross-sectional view. The front shoulder 512 connects the front edge 511 and the side surface 515.

背面緣部513係於背面A2側,端面部51中位於較基板本體50更靠徑向RD外側之區域,且位於較側面部515更靠徑向RD內側之區域。 The back edge 513 is located on the back side A2, in the end surface 51, in a region closer to the outer side of the substrate body 50 in radial direction RD, and in a region closer to the inner side of the side surface 515 in radial direction RD.

背面緣部513係繞旋轉軸線AX1(圖2)之大致圓環狀之區域。背面緣部513於俯視下,於周向CD上包圍基板本體50(具體而言為本體背面周緣部502)。背面緣部513包含於剖視下,自本體背面周緣部502朝向背面肩部514相對於基板本體50之背面A2傾斜之傾斜面。背面緣部513相對於本體背面周緣部502具有傾斜角度θ2。例如,傾斜角度θ2與傾斜角度θ1大致相同。背面緣部513連接本體背面周緣部502與背面肩部514。 The back edge 513 is a roughly annular area around the rotation axis AX1 (Figure 2). The back edge 513 surrounds the substrate body 50 (specifically, the back edge 502 of the body) in the circumferential direction CD when viewed from above. The back edge 513 includes an inclined surface that is inclined from the back edge 502 of the body toward the back shoulder 514 relative to the back A2 of the substrate body 50 when viewed from the cross-section. The back edge 513 has an inclination angle θ2 relative to the back edge 502 of the body. For example, the inclination angle θ2 is substantially the same as the inclination angle θ1. The back edge 513 connects the back edge 502 of the body and the back shoulder 514.

背面肩部514係於背面A2側,端面部51中位於較背面緣部513更靠徑向RD外側之區域,且位於較側面部515更靠徑向RD內側之區域。 The back shoulder 514 is located on the back A2 side, in the end face portion 51, in a region closer to the outer side of the radial direction RD than the back edge portion 513, and in a region closer to the inner side of the radial direction RD than the side face portion 515.

背面肩部514係繞旋轉軸線AX1(圖2)之大致圓環狀之區域。背面肩部514於俯視下,於周向CD上包圍背面緣部513。背面肩部514包含於剖視下,自背面緣部513朝向側面部515彎曲之彎曲面。背面肩部514連接背面緣部513與側面部515。 The back shoulder 514 is a generally annular region around the rotation axis AX1 (FIG. 2). The back shoulder 514 surrounds the back edge 513 in the circumferential direction CD in a top view. The back shoulder 514 includes a curved surface that bends from the back edge 513 toward the side surface 515 in a cross-sectional view. The back shoulder 514 connects the back edge 513 and the side surface 515.

側面部515位於基板W之徑向RD之最外側。側面部515係繞旋轉軸線AX1(圖2)之大致圓環狀之區域。側面部515於俯視下,於周向CD上包圍正面肩部512及背面肩部514。側面部515包含於剖視下,自正面肩部512朝向背面肩部514延伸之平坦面。側面部515繞旋轉軸線AX1具有大致圓 筒形狀。側面部515連接正面肩部512與背面肩部514。 The side surface 515 is located at the outermost side of the substrate W in the radial direction RD. The side surface 515 is a roughly annular region around the rotation axis AX1 (FIG. 2). The side surface 515 surrounds the front shoulder 512 and the back shoulder 514 in the circumferential direction CD in a top view. The side surface 515 includes a flat surface extending from the front shoulder 512 toward the back shoulder 514 in a cross-sectional view. The side surface 515 has a roughly cylindrical shape around the rotation axis AX1. The side surface 515 connects the front shoulder 512 and the back shoulder 514.

此處,如圖4所示,例如,基板W之軸向AD之厚度d為765μm。又,例如,正面肩部512之曲率半徑為270μm,側面部515之軸向AD之長度L0為228μm,背面肩部514之曲率半徑為238μm。又,例如,長度L1為314μm,長度L2為323μm。長度L1表示自正面緣部511之徑向RD內側端部,至正面肩部512之徑向RD外側端部(側面部515)之沿徑向RD之距離。長度L2表示自背面緣部513之徑向RD內側端部,至背面肩部514之徑向RD外側端部(側面部515)之沿徑向RD之距離。又,例如,正面緣部511之傾斜角度θ1為22.3度,背面緣部513之傾斜角度θ2為23.3度。 Here, as shown in FIG. 4 , for example, the thickness d of the substrate W in the axial direction AD is 765 μm. Also, for example, the radius of curvature of the front shoulder 512 is 270 μm, the length L0 of the side surface 515 in the axial direction AD is 228 μm, and the radius of curvature of the back shoulder 514 is 238 μm. Also, for example, the length L1 is 314 μm, and the length L2 is 323 μm. The length L1 represents the distance along the radial direction RD from the radial RD inner end of the front edge 511 to the radial RD outer end (side surface 515) of the front shoulder 512. The length L2 represents the distance along the radial RD from the radial RD inner end of the back edge 513 to the radial RD outer end (side surface 515) of the back shoulder 514. For example, the tilt angle θ1 of the front edge 511 is 22.3 degrees, and the tilt angle θ2 of the back edge 513 is 23.3 degrees.

另,於以下所示之圖6~圖11及圖16~圖19中,以直線簡化顯示正面肩部512及背面肩部514。 In addition, in the following Figures 6 to 11 and Figures 16 to 19, the front shoulder 512 and the back shoulder 514 are simplified by straight lines.

接著,參考圖6及圖7,說明本實施形態之撥液物質去除方法。撥液物質去除方法構成本實施形態之基板處理方法之一部分。圖6及圖7係顯示本實施形態之撥液物質去除方法之圖。於圖6及圖7中,為易於觀察圖式,顯示刷子151之側面,且顯示基板W之剖面。 Next, referring to FIG. 6 and FIG. 7, the repellent substance removal method of this embodiment is described. The repellent substance removal method constitutes a part of the substrate processing method of this embodiment. FIG. 6 and FIG. 7 are diagrams showing the repellent substance removal method of this embodiment. In FIG. 6 and FIG. 7, for easy viewing of the diagram, the side of the brush 151 is shown, and the cross section of the substrate W is shown.

如圖6及圖7所示,撥液物質去除方法包含步驟S100、步驟S200、步驟S300、步驟S400、及步驟S500。 As shown in FIG6 and FIG7, the method for removing the repellent substance includes step S100, step S200, step S300, step S400, and step S500.

首先,如圖6所示,於步驟S100中,於待機位置P2,去除劑噴嘴171 向自轉中之刷子151噴出去除劑87。其結果,去除劑87含浸至刷子151。尤其,於步驟S100中,由於自轉機構158(圖3)使刷子151自轉,故去除劑87均等地滲入至刷子151。圖6中,去除劑噴嘴171於與旋轉軸線AX2交叉之方向上噴出去除劑87。具體而言,去除劑噴嘴171於與旋轉軸線AX2大致正交之方向上噴出去除劑87。又,搖動臂152(圖3)使刷子151沿軸向AD移動(升降)。因此,即便於固定有去除劑噴嘴171之情形時,亦可對刷子151整體噴出去除劑87。其結果,可將去除劑有效地含浸於刷子151整體。另,亦可為能藉由與噴嘴移動機構314同樣之機構,移動(升降)去除劑噴嘴171。 First, as shown in FIG6 , in step S100, at the standby position P2, the remover nozzle 171 sprays the remover 87 toward the rotating brush 151. As a result, the remover 87 is impregnated into the brush 151. In particular, in step S100, since the brush 151 is rotated by the rotation mechanism 158 ( FIG3 ), the remover 87 is uniformly infiltrated into the brush 151. In FIG6 , the remover nozzle 171 sprays the remover 87 in a direction intersecting the rotation axis AX2. Specifically, the remover nozzle 171 sprays the remover 87 in a direction substantially orthogonal to the rotation axis AX2. Furthermore, the swing arm 152 (Fig. 3) moves (lifts and lowers) the brush 151 along the axial direction AD. Therefore, even when the remover nozzle 171 is fixed, the remover 87 can be sprayed on the entire brush 151. As a result, the remover can be effectively impregnated into the entire brush 151. In addition, the remover nozzle 171 can be moved (lifted and lowered) by the same mechanism as the nozzle moving mechanism 314.

接著,於步驟S200中,於塗佈位置P3,撥液劑噴嘴311藉由對旋轉中之基板W之端面部51噴出撥液劑81,而於基板W之端面部51塗佈撥液劑81。該情形時,由於向基板W噴出撥液劑81,故撥液劑81不僅附著於端面部51,亦附著於本體正面周緣部501。又,亦有撥液劑81繞行至本體背面周緣部502之情形。 Next, in step S200, at the coating position P3, the repellent nozzle 311 sprays the repellent 81 onto the end surface 51 of the rotating substrate W, thereby coating the repellent 81 onto the end surface 51 of the substrate W. In this case, since the repellent 81 is sprayed onto the substrate W, the repellent 81 is not only attached to the end surface 51, but also to the front peripheral portion 501 of the body. In addition, there is also a case where the repellent 81 goes around to the back peripheral portion 502 of the body.

接著,於步驟S300中,加熱部20藉由自基板W之下方將旋轉中之基板W之徑向RD外側部分加熱,而使步驟S200中塗佈之撥液劑81乾燥。其結果,溶媒自撥液劑81蒸發,撥液物質82附著於基板W之端面部51、本體正面周緣部501及本體背面周緣部502。即,撥液劑81乾燥,撥液劑81中之撥液物質82附著於基板W之端面部51、本體正面周緣部501及本體背面周緣部502。 Next, in step S300, the heating unit 20 heats the outer portion of the diameter RD of the rotating substrate W from below the substrate W, thereby drying the repellent 81 applied in step S200. As a result, the solvent evaporates from the repellent 81, and the repellent substance 82 adheres to the end surface 51 of the substrate W, the peripheral portion 501 of the front surface of the body, and the peripheral portion 502 of the back surface of the body. That is, the repellent 81 dries, and the repellent substance 82 in the repellent 81 adheres to the end surface 51 of the substrate W, the peripheral portion 501 of the front surface of the body, and the peripheral portion 502 of the back surface of the body.

接著,如圖7所示,於步驟S400中,於去除位置P1,刷子151相對於旋轉中之基板W之側面部515、正面肩部512及背面肩部514隔開,且接觸旋轉中之基板W之本體正面周緣部501、正面緣部511、背面緣部513及本體背面周緣部502,藉此,使去除劑87接觸附著於本體正面周緣部501、正面緣部511、背面緣部513及本體背面周緣部502之撥液物質82(步驟S300)。其結果,於側面部515、正面肩部512及背面肩部514保留撥液物質82,且藉由去除劑87去除附著於本體正面周緣部501、正面緣部511、背面緣部513及本體背面周緣部502之撥液物質82。即,於側面部515、正面肩部512及背面肩部514保留撥液物質82,且附著於本體正面周緣部501、正面緣部511、背面緣部513及本體背面周緣部502之撥液物質82自本體正面周緣部501、正面緣部511、背面緣部513及本體背面周緣部502分離。其結果,根據本實施形態,可自基板W僅去除(分離)多餘之撥液物質82。 Next, as shown in FIG. 7 , in step S400, at the removal position P1, the brush 151 is separated from the side portion 515, the front shoulder 512 and the back shoulder 514 of the rotating substrate W, and contacts the main body front peripheral portion 501, the front edge 511, the back edge 513 and the main body back peripheral portion 502 of the rotating substrate W, thereby making the removing agent 87 contact the repellent substance 82 attached to the main body front peripheral portion 501, the front edge 511, the back edge 513 and the main body back peripheral portion 502 (step S300). As a result, the repellent substance 82 is retained on the side surface 515, the front shoulder 512 and the back shoulder 514, and the repellent substance 82 attached to the front peripheral portion 501, the front peripheral portion 511, the back peripheral portion 513 and the back peripheral portion 502 of the main body is removed by the remover 87. That is, the repellent substance 82 is retained on the side surface 515, the front shoulder 512 and the back shoulder 514, and the repellent substance 82 attached to the front peripheral portion 501, the front peripheral portion 511, the back peripheral portion 513 and the back peripheral portion 502 of the main body is separated from the front peripheral portion 501, the front peripheral portion 511, the back peripheral portion 513 and the back peripheral portion 502 of the main body. As a result, according to this embodiment, only the excess repellent substance 82 can be removed (separated) from the substrate W.

較佳為於步驟S400中,自轉機構158(圖3)使刷子151自轉。該情形時,刷子151相對於旋轉中之基板W之側面部515、正面肩部512及背面肩部514分離,且一面自轉,一面接觸旋轉中之基板W之本體正面周緣部501、正面緣部511、背面緣部513及本體背面周緣部502。其結果,根據本實施形態,可更有效地自基板W去除(分離)多餘之撥液物質82。 Preferably, in step S400, the self-rotating mechanism 158 (FIG. 3) causes the brush 151 to self-rotate. In this case, the brush 151 is separated from the side surface 515, the front shoulder 512, and the back shoulder 514 of the rotating substrate W, and contacts the body front peripheral portion 501, the front edge 511, the back edge 513, and the body back peripheral portion 502 of the rotating substrate W while self-rotating. As a result, according to this embodiment, the excess repellent substance 82 can be removed (separated) from the substrate W more effectively.

於圖7之例中,於基板W與刷子151之接觸位置,基板W之旋轉方向與刷子151之自轉方向相反。因此,可更確實地自基板W去除(分離)多餘之撥液物質82。另,於基板W與刷子151之接觸位置,基板W之旋轉方向 與刷子151之自轉方向亦可相同。 In the example of FIG. 7 , at the contact position between the substrate W and the brush 151, the rotation direction of the substrate W is opposite to the rotation direction of the brush 151. Therefore, the excess repellent substance 82 can be removed (separated) from the substrate W more reliably. In addition, at the contact position between the substrate W and the brush 151, the rotation direction of the substrate W and the rotation direction of the brush 151 can also be the same.

接著,於步驟S500中,清洗液噴嘴331藉由對旋轉中之基板W噴出清洗液86,而自基板W沖洗自基板W分離之多餘之撥液物質82。其後,藉由基板W之旋轉,使附著於基板W之清洗液乾燥。 Next, in step S500, the cleaning liquid nozzle 331 sprays the cleaning liquid 86 onto the rotating substrate W to rinse the excess repellent material 82 separated from the substrate W from the substrate W. Thereafter, the cleaning liquid attached to the substrate W is dried by the rotation of the substrate W.

例如,清洗液噴嘴331對本體正面周緣部501及端面部51噴出清洗液86。另,清洗液噴嘴331亦可對基板W之正面A1整體噴出清洗液86。又,除自基板W之正面A1噴出清洗液外,還可自基板W之背面A2噴出清洗液。 For example, the cleaning liquid nozzle 331 sprays the cleaning liquid 86 to the front peripheral portion 501 and the end surface portion 51 of the main body. In addition, the cleaning liquid nozzle 331 can also spray the cleaning liquid 86 to the entire front surface A1 of the substrate W. In addition, in addition to spraying the cleaning liquid from the front surface A1 of the substrate W, the cleaning liquid can also be sprayed from the back surface A2 of the substrate W.

例如,於步驟S500後,將於側面部515、正面肩部512及背面肩部514附著有撥液物質82之基板W搬入至處理單元1(圖1)。且,背面用噴嘴8(圖1)對基板W之背面A2噴出處理液。該情形時,由於附著於基板W之側面部515、正面肩部512及背面肩部514之撥液物質82彈斥處理液,故可抑制處理液自基板W之背面A2繞行至正面A1。其結果,可抑制形成於基板W之正面A1之圖案受到噴出至背面A2之處理液之影響。 For example, after step S500, the substrate W with the repellent substance 82 attached to the side surface 515, the front shoulder 512 and the back shoulder 514 is moved into the processing unit 1 (FIG. 1). And, the back nozzle 8 (FIG. 1) sprays the processing liquid to the back surface A2 of the substrate W. In this case, since the repellent substance 82 attached to the side surface 515, the front shoulder 512 and the back shoulder 514 of the substrate W repel the processing liquid, it is possible to prevent the processing liquid from detouring from the back surface A2 of the substrate W to the front surface A1. As a result, it is possible to prevent the pattern formed on the front surface A1 of the substrate W from being affected by the processing liquid sprayed to the back surface A2.

此處,附著於基板W之側面部515、正面肩部512及背面肩部514之撥液物質82為高分子化合物。因此,無需去除撥液物質82之作業。這是因為撥液物質82僅存在於側面部515、正面肩部512及背面肩部514。 Here, the repellent substance 82 attached to the side surface 515, the front shoulder 512, and the back shoulder 514 of the substrate W is a polymer compound. Therefore, there is no need to remove the repellent substance 82. This is because the repellent substance 82 only exists on the side surface 515, the front shoulder 512, and the back shoulder 514.

以上,已參考圖7,說明步驟S400,作為使去除劑接觸撥液物質之步 驟之一例。但,亦可進行如下變化。 In the above, step S400 has been described with reference to FIG. 7 as an example of a step of bringing the remover into contact with the repellent substance. However, the following changes may also be made.

即,旋轉夾盤13(圖3)保持至少於本體正面周緣部501及端面部51附著有撥液物質之基板W且使之旋轉。且,刷子151於基板W之旋轉期間,相對於基板W之端面部51中之徑向RD之側面部515隔開,且至少與基板W之本體正面周緣部501接觸,藉此,使可去除撥液物質之去除劑接觸附著於本體正面周緣部501之撥液物質。其結果,於側面部515保留撥液物質82,且至少藉由去除劑87去除附著於本體正面周緣部501之撥液物質82。即,於側面部515保留撥液物質82,且至少附著於本體正面周緣部501之撥液物質82自本體正面周緣部501分離。其結果,根據本實施形態,可自基板W僅去除(分離)多餘之撥液物質82。 That is, the rotating chuck 13 ( FIG. 3 ) holds and rotates the substrate W with the repellent substance attached to at least the body front peripheral portion 501 and the end surface portion 51. Also, during the rotation of the substrate W, the brush 151 is separated from the side surface portion 515 in the radial direction RD in the end surface portion 51 of the substrate W and contacts at least the body front peripheral portion 501 of the substrate W, thereby allowing the remover that can remove the repellent substance to contact the repellent substance attached to the body front peripheral portion 501. As a result, the repellent substance 82 is retained on the side surface portion 515, and the repellent substance 82 attached to the body front peripheral portion 501 is removed by at least the remover 87. That is, the liquid-repellent substance 82 is retained on the side surface 515, and at least the liquid-repellent substance 82 attached to the front peripheral portion 501 of the main body is separated from the front peripheral portion 501 of the main body. As a result, according to this embodiment, only the excess liquid-repellent substance 82 can be removed (separated) from the substrate W.

較佳為刷子151相對於基板W之側面部515隔開,且一面自轉一面至少與本體正面周緣部501接觸。該情形時,可至少自本體正面周緣部501更有效地去除(分離)撥液物質82。 It is preferred that the brush 151 is separated from the side surface 515 of the substrate W and at least contacts the front peripheral portion 501 of the body while rotating. In this case, the repellent substance 82 can be removed (separated) more effectively at least from the front peripheral portion 501 of the body.

又,亦有於本體背面周緣部502附著有撥液物質之情形。該情形時,旋轉夾盤13保持於本體正面周緣部501、本體背面周緣部502及端面部51附著有撥液物質之基板W且使之旋轉。且,刷子151於基板W之旋轉期間,相對於基板W之側面部515隔開,且至少與基板W之本體正面周緣部501及本體背面周緣部502接觸,藉此,使去除劑接觸附著於本體正面周緣部501及本體背面周緣部502之撥液物質。其結果,於側面部515保留撥液物質82,且至少藉由去除劑87去除附著於本體正面周緣部501及本體背 面周緣部502之撥液物質82。即,自基板W僅去除(分離)多餘之撥液物質82。 In addition, there is a case where a repellent substance is attached to the body back peripheral portion 502. In this case, the rotating chuck 13 holds the substrate W with the repellent substance attached to the body front peripheral portion 501, the body back peripheral portion 502 and the end surface portion 51 and rotates it. In addition, during the rotation of the substrate W, the brush 151 is separated from the side surface portion 515 of the substrate W and contacts at least the body front peripheral portion 501 and the body back peripheral portion 502 of the substrate W, thereby making the remover contact the repellent substance attached to the body front peripheral portion 501 and the body back peripheral portion 502. As a result, the repellent substance 82 is retained on the side surface 515, and at least the repellent substance 82 attached to the front peripheral portion 501 and the back peripheral portion 502 of the main body is removed by the remover 87. That is, only the excess repellent substance 82 is removed (separated) from the substrate W.

較佳為刷子151相對於基板W之側面部515隔開,且一面自轉一面至少與本體正面周緣部501及本體背面周緣部502接觸。該情形時,可至少自本體正面周緣部501及本體背面周緣部502更有效地去除(分離)撥液物質82。 Preferably, the brush 151 is separated from the side surface 515 of the substrate W, and contacts at least the front peripheral portion 501 and the back peripheral portion 502 of the body while rotating. In this case, the repellent substance 82 can be removed (separated) more effectively from at least the front peripheral portion 501 and the back peripheral portion 502 of the body.

接著,參考圖8,說明刷子151之細節。圖8係顯示刷子151之側視圖。如圖8所示,刷子151包含第1接觸部B1、及第2接觸部B2。第1接觸部B1與第2接觸部B2於固定方向上空開間隔而排列。於圖8之例中,第1接觸部B1與第2接觸部B2於軸向AD上空開間隔而排列。 Next, referring to FIG. 8 , the details of the brush 151 are described. FIG. 8 is a side view of the brush 151. As shown in FIG. 8 , the brush 151 includes a first contact portion B1 and a second contact portion B2. The first contact portion B1 and the second contact portion B2 are arranged at intervals in a fixed direction. In the example of FIG. 8 , the first contact portion B1 and the second contact portion B2 are arranged at intervals in the axial direction AD.

第1接觸部B1包含第1外側接觸部B11、及第1內側接觸部B12。第1外側接觸部B11具有大致圓柱形狀或大致圓板形狀。第1外側接觸部B11具有第1嵌合部55。第1嵌合部55包含大致圓柱狀或大致圓板狀之空間。第1外側接觸部B11包含平坦面B14。平坦面B14繞旋轉軸線AX2具有大致圓環形狀。平坦面B14為第1外側接觸部B11之下端面。 The first contact portion B1 includes a first outer contact portion B11 and a first inner contact portion B12. The first outer contact portion B11 has a roughly cylindrical shape or a roughly disk shape. The first outer contact portion B11 has a first fitting portion 55. The first fitting portion 55 includes a roughly cylindrical or roughly disk-shaped space. The first outer contact portion B11 includes a flat surface B14. The flat surface B14 has a roughly annular shape around the rotation axis AX2. The flat surface B14 is the lower end surface of the first outer contact portion B11.

第1固定部C1固定於第1外側接觸部B11之上表面。又,第1固定部C1固定於軸部161。 The first fixing portion C1 is fixed to the upper surface of the first outer contact portion B11. In addition, the first fixing portion C1 is fixed to the shaft portion 161.

第1內側接觸部B12配置於第1外側接觸部B11之內側。第1內側接觸 部B12具有第1非接觸部41、及第1傾斜接觸部43。第1非接觸部41具有大致圓柱形狀或大致圓板形狀。第1非接觸部41嵌合於第1嵌合部55,固定於第1外側接觸部B11之內部。第1傾斜接觸部43具有大致倒圓錐梯形形狀。第1傾斜接觸部43自第1外側接觸部B11朝向第2接觸部B2突出。第1傾斜接觸部43具有傾斜面B13。傾斜面B13相對於平坦面B14傾斜。傾斜面B13相對於平坦面B14具有傾斜角度θ1。傾斜面B13之傾斜角度θ1與正面緣部511之傾斜角度θ1(圖4)大致相同。傾斜面B13為大致倒截錐面。 The first inner contact portion B12 is arranged inside the first outer contact portion B11. The first inner contact portion B12 has a first non-contact portion 41 and a first inclined contact portion 43. The first non-contact portion 41 has a substantially cylindrical shape or a substantially circular plate shape. The first non-contact portion 41 is engaged with the first engagement portion 55 and fixed inside the first outer contact portion B11. The first inclined contact portion 43 has a substantially inverted cone trapezoidal shape. The first inclined contact portion 43 protrudes from the first outer contact portion B11 toward the second contact portion B2. The first inclined contact portion 43 has an inclined surface B13. The inclined surface B13 is inclined relative to the flat surface B14. The inclined surface B13 has an inclination angle θ1 relative to the flat surface B14. The inclination angle θ1 of the inclined surface B13 is substantially the same as the inclination angle θ1 of the front edge 511 (FIG. 4). The inclined surface B13 is substantially an inverted cone surface.

第2接觸部B2包含第2外側接觸部B21、及第2內側接觸部B22。第2外側接觸部B21具有大致圓柱形狀或大致圓板形狀。第2外側接觸部B21具有第2嵌合部56。第2嵌合部56包含大致圓柱狀或大致圓板狀之空間。第2外側接觸部B21包含平坦面B24。平坦面B24繞旋轉軸線AX2具有大致圓環形狀。平坦面B24為第2外側接觸部B21之上端面。 The second contact portion B2 includes a second outer contact portion B21 and a second inner contact portion B22. The second outer contact portion B21 has a roughly cylindrical shape or a roughly disk shape. The second outer contact portion B21 has a second fitting portion 56. The second fitting portion 56 includes a roughly cylindrical or roughly disk-shaped space. The second outer contact portion B21 includes a flat surface B24. The flat surface B24 has a roughly annular shape around the rotation axis AX2. The flat surface B24 is the upper end surface of the second outer contact portion B21.

第2固定部C2固定於第2外側接觸部B21之下表面。又,第2固定部C2固定於軸部161。 The second fixing portion C2 is fixed to the lower surface of the second outer contact portion B21. In addition, the second fixing portion C2 is fixed to the shaft portion 161.

第2內側接觸部B22配置於第2外側接觸部B21之內側。第2內側接觸部B22具有第2非接觸部42、及第2傾斜接觸部44。第2非接觸部42具有大致圓柱形狀或大致圓板形狀。第2非接觸部42嵌合於第2嵌合部56,固定於第2外側接觸部B21之內部。第2傾斜接觸部44具有大致圓錐梯形形狀。第2傾斜接觸部44自第2外側接觸部B21朝向第1接觸部B1突出。第2傾斜接觸部44具有傾斜面B23。傾斜面B23相對於平坦面B24傾斜。傾斜面B23 相對於平坦面B24具有傾斜角度θ2。傾斜面B23之傾斜角度θ2與正面緣部511之傾斜角度θ1(圖4)大致相同。傾斜面B23為大致截錐面。 The second inner contact portion B22 is arranged on the inner side of the second outer contact portion B21. The second inner contact portion B22 has a second non-contact portion 42 and a second inclined contact portion 44. The second non-contact portion 42 has a substantially cylindrical shape or a substantially circular plate shape. The second non-contact portion 42 is engaged with the second engaging portion 56 and is fixed to the inner part of the second outer contact portion B21. The second inclined contact portion 44 has a substantially conical trapezoidal shape. The second inclined contact portion 44 protrudes from the second outer contact portion B21 toward the first contact portion B1. The second inclined contact portion 44 has an inclined surface B23. The inclined surface B23 is inclined relative to the flat surface B24. The inclined surface B23 has an inclination angle θ2 relative to the flat surface B24. The inclination angle θ2 of the inclined surface B23 is substantially the same as the inclination angle θ1 (FIG. 4) of the front edge 511. The inclined surface B23 is substantially a truncated cone surface.

第1外側接觸部B11之平坦面B14與第2外側接觸部B21之平坦面B24於軸向AD上空開間隔而對向。又,第1內側接觸部B12之傾斜面B13與第2內側接觸部B22之傾斜面B23於軸向AD上空開間隔而對向。本實施形態中,第1接觸部B1與第2接觸部B2相對於假想平面PL對稱。假想平面PL係與旋轉軸線AX2正交之假想平面,通過對向軸部161a之軸向AD之中點。又,本實施形態中,傾斜角度θ1與傾斜角度θ2大致相同。 The flat surface B14 of the first outer contact portion B11 and the flat surface B24 of the second outer contact portion B21 are spaced apart and face each other in the axial direction AD. Furthermore, the inclined surface B13 of the first inner contact portion B12 and the inclined surface B23 of the second inner contact portion B22 are spaced apart and face each other in the axial direction AD. In this embodiment, the first contact portion B1 and the second contact portion B2 are symmetrical with respect to the imaginary plane PL. The imaginary plane PL is an imaginary plane orthogonal to the rotation axis AX2 and passes through the midpoint of the axial direction AD of the opposing axis 161a. Furthermore, in this embodiment, the tilt angle θ1 is substantially the same as the tilt angle θ2.

另,第1外側接觸部B11與第1內側接觸部B12亦可一體構成。第2外側接觸部B21與第2內側接觸部B22亦可一體構成。 In addition, the first outer contact portion B11 and the first inner contact portion B12 may also be integrally formed. The second outer contact portion B21 and the second inner contact portion B22 may also be integrally formed.

又,撥液劑處理單元5(圖3)進而具備惰性氣體供給部35。惰性氣體供給部35自第1接觸部B1與第2接觸部B2之間,供給惰性氣體。惰性氣體例如為氮或氬。具體而言,惰性氣體供給部35具備惰性氣體噴出部353、配管352、及閥351。惰性氣體噴出部353自第1接觸部B1與第2接觸部B2之間,朝向軸部161之外側噴出惰性氣體。惰性氣體噴出部353例如為噴嘴。 In addition, the repellent treatment unit 5 (FIG. 3) further includes an inert gas supply unit 35. The inert gas supply unit 35 supplies inert gas between the first contact portion B1 and the second contact portion B2. The inert gas is, for example, nitrogen or argon. Specifically, the inert gas supply unit 35 includes an inert gas ejection unit 353, a pipe 352, and a valve 351. The inert gas ejection unit 353 ejects inert gas from between the first contact portion B1 and the second contact portion B2 toward the outside of the shaft portion 161. The inert gas ejection unit 353 is, for example, a nozzle.

具體而言,於惰性氣體噴出部353連接配管352。配管352將惰性氣體供給至惰性氣體噴出部353。於配管352配置閥351。閥351將配管352之流路封閉或開放。控制部21以使閥351將配管352之流路開放之方式控制閥 351。其結果,由於閥351將配管352之流路開放,故惰性氣體噴出部353噴出惰性氣體。 Specifically, the piping 352 is connected to the inert gas ejection section 353. The piping 352 supplies the inert gas to the inert gas ejection section 353. The valve 351 is arranged on the piping 352. The valve 351 closes or opens the flow path of the piping 352. The control section 21 controls the valve 351 in such a way that the valve 351 opens the flow path of the piping 352. As a result, since the valve 351 opens the flow path of the piping 352, the inert gas ejection section 353 ejects the inert gas.

更具體而言,惰性氣體噴出部353配置於對向軸部161a。對向軸部161a係軸部161中位於第1接觸部B1與第2接觸部B2之間之部分。軸部161例如於軸向AD上貫通第1接觸部B1及第2接觸部B2。 More specifically, the inert gas ejection portion 353 is disposed on the opposing shaft portion 161a. The opposing shaft portion 161a is a portion of the shaft portion 161 located between the first contact portion B1 and the second contact portion B2. The shaft portion 161 passes through the first contact portion B1 and the second contact portion B2 in the axial direction AD, for example.

接著,參考圖9,說明刷子151之撥液物質82之去除處理之一例。圖9係顯示刷子151之撥液物質之去除處理之一例之圖。圖9中,為易於理解圖式,而顯示刷子151之側面,顯示基板W之剖面。又,為使圖式簡略化,而省略表示剖面之斜線。 Next, referring to FIG. 9, an example of the removal process of the repellent substance 82 of the brush 151 is described. FIG. 9 is a diagram showing an example of the removal process of the repellent substance of the brush 151. In FIG. 9, the side of the brush 151 is shown to facilitate understanding of the diagram, and the cross section of the substrate W is shown. In addition, the oblique lines representing the cross section are omitted to simplify the diagram.

如圖9所示,第1接觸部B1於基板W之旋轉期間,相對於基板W之側面部515隔開,且至少與基板W之本體正面周緣部501接觸,藉此,使去除劑接觸附著於本體正面周緣部501之撥液物質。即,將含浸於第1接觸部B1之去除劑轉移至本體正面周緣部501及撥液物質。因此,於側面部515保留撥液物質82,且可藉由去除劑自本體正面周緣部501去除(分離)撥液物質。 As shown in FIG. 9 , the first contact portion B1 is separated from the side portion 515 of the substrate W during the rotation of the substrate W, and is in contact with at least the main body front peripheral portion 501 of the substrate W, thereby allowing the remover to contact the repellent substance attached to the main body front peripheral portion 501. That is, the remover impregnated in the first contact portion B1 is transferred to the main body front peripheral portion 501 and the repellent substance. Therefore, the repellent substance 82 is retained on the side portion 515, and the repellent substance can be removed (separated) from the main body front peripheral portion 501 by the remover.

另一方面,第2接觸部B2於基板W之旋轉期間,相對於基板W之側面部515隔開,且至少與基板W之本體背面周緣部502接觸,藉此,使去除劑接觸附著於本體背面周緣部502之撥液物質。即,將含浸於第2接觸部B2之去除劑轉移至本體背面周緣部502及撥液物質。因此,於側面部515 保留撥液物質82,且可藉由去除劑自本體背面周緣部502去除(分離)撥液物質。 On the other hand, the second contact portion B2 is separated from the side portion 515 of the substrate W during the rotation of the substrate W, and is in contact with at least the back peripheral portion 502 of the substrate W, thereby making the remover contact the repellent material attached to the back peripheral portion 502 of the substrate W. That is, the remover impregnated in the second contact portion B2 is transferred to the back peripheral portion 502 of the substrate and the repellent material. Therefore, the repellent material 82 is retained on the side portion 515, and the repellent material can be removed (separated) from the back peripheral portion 502 of the substrate by the remover.

具體而言,第1外側接觸部B11藉由於基板W之旋轉期間,與本體正面周緣部501接觸,而使去除劑接觸附著於本體正面周緣部501之撥液物質。即,將含浸於第1外側接觸部B11之去除劑轉移至本體正面周緣部501及撥液物質。因此,可藉由去除劑自本體正面周緣部501有效地去除(分離)撥液物質。 Specifically, the first outer contact portion B11 contacts the body front peripheral portion 501 during the rotation of the substrate W, so that the remover contacts the repellent material attached to the body front peripheral portion 501. That is, the remover impregnated in the first outer contact portion B11 is transferred to the body front peripheral portion 501 and the repellent material. Therefore, the repellent material can be effectively removed (separated) from the body front peripheral portion 501 by the remover.

又,第1內側接觸部B12藉由於基板W之旋轉期間,與基板W之端面部51中之正面緣部511接觸,而使去除劑接觸附著於正面緣部511之撥液物質。即,將含浸於第1內側接觸部B12之去除劑轉移至正面緣部511及撥液物質。因此,可藉由去除劑自正面緣部511有效地去除(分離)撥液物質。 Furthermore, the first inner contact portion B12 contacts the front edge portion 511 in the end portion 51 of the substrate W during the rotation of the substrate W, so that the remover contacts the repellent material attached to the front edge portion 511. That is, the remover impregnated in the first inner contact portion B12 is transferred to the front edge portion 511 and the repellent material. Therefore, the repellent material can be effectively removed (separated) from the front edge portion 511 by the remover.

另一方面,第2外側接觸部B21藉由於基板W之旋轉期間,與基板W之本體背面周緣部502接觸,而使去除劑接觸附著於本體背面周緣部502之撥液物質。即,將含浸於第2外側接觸部B21之去除劑轉移至本體背面周緣部502及撥液物質。因此,可藉由去除劑自本體背面周緣部502有效地去除(分離)撥液物質。 On the other hand, the second outer contact portion B21 contacts the back peripheral portion 502 of the substrate W during the rotation of the substrate W, so that the remover contacts the repellent material attached to the back peripheral portion 502 of the body. That is, the remover impregnated in the second outer contact portion B21 is transferred to the back peripheral portion 502 of the body and the repellent material. Therefore, the repellent material can be effectively removed (separated) from the back peripheral portion 502 of the body by the remover.

又,第2內側接觸部B22藉由於基板W之旋轉期間,與基板W之端面部51中之背面緣部513接觸,而使去除劑接觸附著於背面緣部513之撥液 物質。即,將含浸於第2內側接觸部B22之去除劑轉移至背面緣部513及撥液物質。因此,可藉由去除劑自背面緣部513有效地去除(分離)撥液物質。 Furthermore, the second inner contact portion B22 contacts the back edge portion 513 in the end portion 51 of the substrate W during the rotation of the substrate W, so that the remover contacts the repellent material attached to the back edge portion 513. That is, the remover impregnated in the second inner contact portion B22 is transferred to the back edge portion 513 and the repellent material. Therefore, the repellent material can be effectively removed (separated) from the back edge portion 513 by the remover.

更具體而言,第1外側接觸部B11之平坦面B14與本體正面周緣部501接觸。因此,含浸於第1外側接觸部B11之去除液經由平坦面B14,接觸附著於本體正面周緣部501之撥液物質。且,附著於本體正面周緣部501之撥液物質例如由去除液及平坦面B14研磨,而自本體正面周緣部501分離。如此,可自本體正面周緣部501更有效地去除撥液物質。 More specifically, the flat surface B14 of the first outer contact portion B11 contacts the front peripheral portion 501 of the main body. Therefore, the removal liquid impregnated in the first outer contact portion B11 contacts the repellent material attached to the front peripheral portion 501 of the main body through the flat surface B14. Moreover, the repellent material attached to the front peripheral portion 501 of the main body is separated from the front peripheral portion 501 of the main body by, for example, grinding by the removal liquid and the flat surface B14. In this way, the repellent material can be removed more effectively from the front peripheral portion 501 of the main body.

又,第1內側接觸部B12之傾斜面B13與正面緣部511接觸。因此,含浸於第1內側接觸部B12之去除液經由傾斜面B13,接觸附著於正面緣部511之撥液物質。且,附著於正面緣部511之撥液物質例如由去除液及傾斜面B13研磨,而自正面緣部511分離。如此,可自正面緣部511更有效地去除撥液物質。傾斜面B13沿正面緣部511傾斜。 Furthermore, the inclined surface B13 of the first inner contact portion B12 contacts the front edge portion 511. Therefore, the removal liquid impregnated in the first inner contact portion B12 contacts the repellent material attached to the front edge portion 511 through the inclined surface B13. Moreover, the repellent material attached to the front edge portion 511 is separated from the front edge portion 511 by, for example, grinding by the removal liquid and the inclined surface B13. In this way, the repellent material can be removed more effectively from the front edge portion 511. The inclined surface B13 is inclined along the front edge portion 511.

另一方面,第2外側接觸部B21之平坦面B24與本體背面周緣部502接觸。因此,含浸於第2外側接觸部B21之去除液經由平坦面B24,接觸附著於本體背面周緣部502之撥液物質。且,附著於本體背面周緣部502之撥液物質例如由去除液及平坦面B24研磨,而自本體背面周緣部502分離。如此,可自本體背面周緣部502更有效地去除撥液物質。 On the other hand, the flat surface B24 of the second outer contact portion B21 contacts the peripheral portion 502 of the back of the body. Therefore, the removal liquid impregnated in the second outer contact portion B21 contacts the repellent material attached to the peripheral portion 502 of the back of the body through the flat surface B24. Moreover, the repellent material attached to the peripheral portion 502 of the back of the body is separated from the peripheral portion 502 of the back of the body by, for example, grinding by the removal liquid and the flat surface B24. In this way, the repellent material can be removed more effectively from the peripheral portion 502 of the back of the body.

又,第2內側接觸部B22之傾斜面B23與背面緣部513接觸。因此,含 浸於第2內側接觸部B22之去除液經由傾斜面B23,接觸附著於背面緣部513之撥液物質。且,附著於背面緣部513之撥液物質例如由去除液及傾斜面B23研磨,而自背面緣部513分離。如此,可自背面緣部513更有效地去除撥液物質。傾斜面B23沿背面緣部513傾斜。 In addition, the inclined surface B23 of the second inner contact portion B22 contacts the back edge portion 513. Therefore, the removal liquid impregnated in the second inner contact portion B22 contacts the repellent material attached to the back edge portion 513 through the inclined surface B23. Moreover, the repellent material attached to the back edge portion 513 is separated from the back edge portion 513 by, for example, grinding by the removal liquid and the inclined surface B23. In this way, the repellent material can be removed more effectively from the back edge portion 513. The inclined surface B23 is inclined along the back edge portion 513.

以上,執行參考圖9所說明之去除處理,結果,可自基板W之本體正面周緣部501、正面緣部511、背面緣部513及本體背面周緣部502去除撥液物質,且於基板W之端面部51之正面肩部512、側面部515及背面肩部514保留撥液物質82。 As a result of performing the removal process described with reference to FIG. 9 , the repellent substance can be removed from the body front peripheral portion 501, the front edge portion 511, the back edge portion 513 and the body back peripheral portion 502 of the substrate W, and the repellent substance 82 is retained on the front shoulder portion 512, the side portion 515 and the back shoulder portion 514 of the end portion 51 of the substrate W.

又,對向軸部161a相對於附著於基板W之端面部51之撥液物質82,於徑向RDa上空開間隔而對向。徑向RDa表示相對於旋轉軸線AX2之徑向,且與旋轉軸線AX2正交。惰性氣體噴出部353自對向軸部161a朝向徑向RDa外側噴出惰性氣體。其結果,撥液物質82暴露於惰性氣體中,可防止撥液物質82氧化。 Furthermore, the opposing shaft portion 161a is spaced apart from the repellent substance 82 attached to the end surface portion 51 of the substrate W in the radial direction RDa. The radial direction RDa represents the radial direction relative to the rotation axis AX2 and is orthogonal to the rotation axis AX2. The inert gas ejection portion 353 ejects the inert gas from the opposing shaft portion 161a toward the outer side of the radial direction RDa. As a result, the repellent substance 82 is exposed to the inert gas, which can prevent the repellent substance 82 from being oxidized.

另,第1內側接觸部B12(具體而言為傾斜面B13)亦可藉由於基板W之旋轉期間,與基板W之端面部51中之正面緣部511及正面肩部512接觸,而使去除劑接觸附著於正面緣部511及正面肩部512之撥液物質。該情形時,可藉由去除劑自正面緣部511及正面肩部512有效地去除(分離)撥液物質。另一方面,第2內側接觸部B22(具體而言為傾斜面B23)亦可藉由於基板W之旋轉期間,與基板W之端面部51中之背面緣部513及背面肩部514接觸,而使去除劑接觸附著於背面緣部513及背面肩部514之撥液物質。 該情形時,可藉由去除劑自背面緣部513及背面肩部514有效地去除(分離)撥液物質。 In addition, the first inner contact portion B12 (specifically, the inclined surface B13) can also contact the front edge portion 511 and the front shoulder portion 512 in the end portion 51 of the substrate W during the rotation of the substrate W, so that the remover can contact the repellent substance attached to the front edge portion 511 and the front shoulder portion 512. In this case, the repellent substance can be effectively removed (separated) from the front edge portion 511 and the front shoulder portion 512 by the remover. On the other hand, the second inner contact portion B22 (specifically, the inclined surface B23) can also contact the back edge 513 and the back shoulder 514 in the end surface portion 51 of the substrate W during the rotation of the substrate W, so that the remover can contact the repellent material attached to the back edge 513 and the back shoulder 514. In this case, the repellent material can be effectively removed (separated) from the back edge 513 and the back shoulder 514 by the remover.

該情形時,例如,控制部21藉由調整施力機構159(圖3)之施力(推壓壓力),使刷子151之第1內側接觸部B12及第2內側接觸部B22彈性變形,而使刷子151之第1內側接觸部B12接觸正面緣部511及正面肩部512,且使刷子151之第2內側接觸部B22接觸背面緣部513及背面肩部514。 In this case, for example, the control unit 21 adjusts the force (pressing pressure) of the force applying mechanism 159 (FIG. 3) to elastically deform the first inner contact portion B12 and the second inner contact portion B22 of the brush 151, so that the first inner contact portion B12 of the brush 151 contacts the front edge 511 and the front shoulder 512, and the second inner contact portion B22 of the brush 151 contacts the back edge 513 and the back shoulder 514.

接著,參考圖10,說明變化例之刷子151A之撥液物質82之去除處理之一例。圖10係顯示刷子151A之撥液物質之去除處理之一例之圖。圖10中,為易於理解圖式,而顯示刷子151A之側面,且顯示基板W之剖面。又,為使圖式簡略化,而省略表示剖面之斜線。 Next, referring to FIG. 10 , an example of the removal process of the repellent substance 82 of the brush 151A of the variation is described. FIG. 10 is a diagram showing an example of the removal process of the repellent substance of the brush 151A. In FIG. 10 , the side surface of the brush 151A is shown for easy understanding of the diagram, and the cross section of the substrate W is shown. In addition, the oblique lines representing the cross section are omitted to simplify the diagram.

如圖10所示,第1接觸部B1包含第1內側接觸部B12a。第1內側接觸部B12a之傾斜面B13與正面緣部511之上側區域a1接觸,且不與正面緣部511之下側區域b1接觸。因此,僅去除附著於上側區域a1之撥液物質,並保留附著於下側區域b1之撥液物質。 As shown in FIG. 10 , the first contact portion B1 includes the first inner contact portion B12a. The inclined surface B13 of the first inner contact portion B12a contacts the upper area a1 of the front edge portion 511 and does not contact the lower area b1 of the front edge portion 511. Therefore, only the liquid-repellent substance attached to the upper area a1 is removed, and the liquid-repellent substance attached to the lower area b1 is retained.

另一方面,第2接觸部B2包含第2內側接觸部B22a。第2內側接觸部B22a之傾斜面B23與背面緣部513之下側區域a2接觸,且不與背面緣部513之上側區域b2接觸。因此,僅去除附著於下側區域a2之撥液物質,並保留附著於上側區域b2之撥液物質。 On the other hand, the second contact portion B2 includes a second inner contact portion B22a. The inclined surface B23 of the second inner contact portion B22a contacts the lower side region a2 of the back edge portion 513 and does not contact the upper side region b2 of the back edge portion 513. Therefore, only the liquid-repellent substance attached to the lower side region a2 is removed, and the liquid-repellent substance attached to the upper side region b2 is retained.

以上,執行參考圖10所說明之去除處理,結果可自基板W之本體正面周緣部501、正面緣部511之上側區域a1、背面緣部513之下側區域a2及本體背面周緣部502去除撥液物質,且於基板W之端面部51之正面緣部511之下側區域b1、正面肩部512、側面部515、背面肩部514及背面緣部513之上側區域b2保留撥液物質82。 As a result of performing the removal process described with reference to FIG. 10 , the liquid-repellent substance can be removed from the main body front peripheral portion 501 of the substrate W, the upper side region a1 of the front edge portion 511, the lower side region a2 of the back edge portion 513, and the main body back peripheral portion 502, and the liquid-repellent substance 82 can be retained in the lower side region b1 of the front edge portion 511, the front shoulder portion 512, the side portion 515, the back shoulder portion 514, and the upper side region b2 of the back edge portion 513 of the end portion 51 of the substrate W.

另,第1外側接觸部B11與第1內側接觸部B12a亦可一體構成。第2外側接觸部B21與第2內側接觸部B22a亦可一體構成。 In addition, the first outer contact portion B11 and the first inner contact portion B12a may also be integrally formed. The second outer contact portion B21 and the second inner contact portion B22a may also be integrally formed.

接著,參考圖11,說明另一變化例之刷子151B之撥液物質82之去除處理之一例。圖11係顯示刷子151B之撥液物質之去除處理之一例之圖。圖11中,為易於理解圖式,而顯示刷子151B之側面,且顯示基板W之剖面。又,為將圖式簡略化,而省略表示剖面之斜線。 Next, referring to FIG. 11, an example of the removal process of the repellent substance 82 of the brush 151B in another variation is described. FIG. 11 is a diagram showing an example of the removal process of the repellent substance of the brush 151B. In FIG. 11, the side of the brush 151B is shown for easy understanding of the diagram, and the cross section of the substrate W is shown. In addition, the oblique lines representing the cross section are omitted to simplify the diagram.

如圖11所示,第1接觸部B1具有第1外側接觸部B11,且不具有第1內側接觸部B12(圖9)。即,第1接觸部B1之構成與第1外側接觸部B11之構成相同。該情形時,第1接觸部B1亦可不具有第1嵌合部55(圖9)。且,第1接觸部B1之平坦面B14相對於基板W之端面部51隔開,且與本體正面周緣部501接觸。因此,僅去除附著於本體正面周緣部501之撥液物質。 As shown in FIG. 11 , the first contact portion B1 has a first outer contact portion B11 and does not have a first inner contact portion B12 ( FIG. 9 ). That is, the structure of the first contact portion B1 is the same as that of the first outer contact portion B11. In this case, the first contact portion B1 may not have the first engaging portion 55 ( FIG. 9 ). Moreover, the flat surface B14 of the first contact portion B1 is separated from the end surface portion 51 of the substrate W and contacts the front peripheral portion 501 of the body. Therefore, only the liquid-repellent substance attached to the front peripheral portion 501 of the body is removed.

另一方面,第2接觸部B2具有第2外側接觸部B21,且不具有第2內側接觸部B22(圖9)。即,第2接觸部B2之構成與第2外側接觸部B21之構成相同。該情形時,第2接觸部B2亦可不具有第2嵌合部56(圖9)。且,第2接 觸部B2之平坦面B24相對於基板W之端面部51隔開,且與本體背面周緣部502接觸。因此,僅去除附著於本體背面周緣部502之撥液物質。 On the other hand, the second contact portion B2 has a second outer contact portion B21 and does not have a second inner contact portion B22 (Fig. 9). That is, the second contact portion B2 has the same structure as the second outer contact portion B21. In this case, the second contact portion B2 may not have the second engaging portion 56 (Fig. 9). Moreover, the flat surface B24 of the second contact portion B2 is separated from the end surface portion 51 of the substrate W and contacts the back peripheral portion 502 of the body. Therefore, only the liquid-repellent substance attached to the back peripheral portion 502 of the body is removed.

以上,執行參考圖11所說明之去除處理,結果可自基板W之本體正面周緣部501及本體背面周緣部502去除撥液物質,且於基板W之端面部51整體保留撥液物質82。 As described above, the removal process described in reference to FIG. 11 is performed, and as a result, the repellent substance can be removed from the peripheral portion 501 of the front surface and the peripheral portion 502 of the back surface of the substrate W, and the repellent substance 82 is retained on the entire end surface portion 51 of the substrate W.

接著,參考圖1~圖3及圖12,說明本實施形態之基板處理方法。基板處理方法使用使可去除撥液物質之去除劑接觸撥液物質之刷子151。基板處理方法包含撥液物質去除方法。圖12係顯示本實施形態之基板處理方法之流程圖。如圖12所示,基板處理方法包含步驟S1~步驟S13。步驟S1~步驟S13由基板處理裝置100執行。 Next, referring to FIG. 1 to FIG. 3 and FIG. 12, the substrate processing method of this embodiment is described. The substrate processing method uses a brush 151 that allows a remover capable of removing a repellent substance to contact the repellent substance. The substrate processing method includes a repellent substance removal method. FIG. 12 is a flow chart showing the substrate processing method of this embodiment. As shown in FIG. 12, the substrate processing method includes steps S1 to S13. Steps S1 to S13 are performed by the substrate processing device 100.

首先,如圖2、圖3及圖12所示,於步驟S1中,去除劑供給部17一面使位於待機位置P2之刷子151自轉,一面對刷子151供給去除劑。具體而言,控制部21以使刷子151自轉之方式控制自轉機構158。其結果,自轉機構158使刷子151自轉。再者,控制部21以將去除劑供給至刷子151之方式控制去除劑供給部17。其結果,去除劑供給部17對刷子151供給去除劑。另,刷子151之自轉與去除劑之供給可同時執行,亦可先執行自轉而後供給去除劑,又可先供給去除劑而後執行自轉。另,於對刷子151供給去除劑完成後,自轉機構158停止刷子151之自轉。 First, as shown in FIG. 2 , FIG. 3 and FIG. 12 , in step S1, the remover supply unit 17 causes the brush 151 located at the standby position P2 to rotate while supplying the remover to the brush 151. Specifically, the control unit 21 controls the rotation mechanism 158 so as to cause the brush 151 to rotate. As a result, the rotation mechanism 158 causes the brush 151 to rotate. Furthermore, the control unit 21 controls the remover supply unit 17 so as to supply the remover to the brush 151. As a result, the remover supply unit 17 supplies the remover to the brush 151. In addition, the rotation of the brush 151 and the supply of the remover may be performed simultaneously, or the rotation may be performed first and then the remover is supplied, or the remover may be supplied first and then the rotation may be performed. In addition, after the supply of the remover to the brush 151 is completed, the rotation mechanism 158 stops the rotation of the brush 151.

接著,如圖1及圖12所示,於步驟S2中,控制部21以將基板W搬入撥 液劑處理單元5之方式控制中心機器人CR。其結果,中心機器人CR將基板W搬入撥液劑處理單元5,使基板W保持於旋轉夾盤13。 Next, as shown in FIG. 1 and FIG. 12 , in step S2, the control unit 21 controls the central robot CR to carry the substrate W into the repellent processing unit 5. As a result, the central robot CR carries the substrate W into the repellent processing unit 5 and holds the substrate W on the rotary chuck 13.

接著,如圖2、圖3及圖12所示,於步驟S3中,控制部21以使基板W旋轉之方式控制旋轉夾盤13。其結果,旋轉夾盤13使基板W旋轉。 Next, as shown in FIG. 2, FIG. 3 and FIG. 12, in step S3, the control unit 21 controls the rotary chuck 13 in such a manner as to rotate the substrate W. As a result, the rotary chuck 13 rotates the substrate W.

接著,於步驟S4中,撥液劑塗佈部31於塗佈位置P3,向旋轉中之基板W之端面部51噴出撥液劑。具體而言,控制部21以使撥液劑噴嘴311對旋轉中之基板W之端面部51噴出撥液劑之方式控制閥315。其結果,由於閥315將配管316之流路開放,故撥液劑噴嘴311對基板W之端面部51噴出撥液劑。因此,於基板W之端面部51塗佈撥液劑。但,由於藉由撥液劑噴嘴311執行撥液劑之塗佈,故於基板W之本體正面周緣部501及本體背面周緣部502亦塗佈撥液劑。於撥液劑之塗佈完成後,撥液劑噴嘴311停止撥液劑之噴出。 Next, in step S4, the repellent coating section 31 sprays the repellent onto the end surface 51 of the rotating substrate W at the coating position P3. Specifically, the control section 21 controls the valve 315 so that the repellent nozzle 311 sprays the repellent onto the end surface 51 of the rotating substrate W. As a result, since the valve 315 opens the flow path of the pipe 316, the repellent nozzle 311 sprays the repellent onto the end surface 51 of the substrate W. Therefore, the repellent is coated onto the end surface 51 of the substrate W. However, since the repellent is applied by the repellent nozzle 311, the repellent is also applied to the peripheral portion 501 on the front side and the peripheral portion 502 on the back side of the substrate W. After the application of the repellent is completed, the repellent nozzle 311 stops spraying the repellent.

接著,於步驟S5中,旋轉夾盤13保持至少於本體正面周緣部501及端面部51附著有撥液物質之基板W且使之旋轉。典型而言,旋轉夾盤13保持於本體正面周緣部501、本體背面周緣部502及端面部51附著有撥液物質之基板W且使之旋轉。基板W之旋轉自步驟S3繼續。且,加熱部20自基板W之下方,將基板W之徑向RD外側部分加熱。具體而言,控制部21以將基板W加熱之方式控制加熱部20。其結果,加熱部20將基板W加熱,藉由熱使塗佈於基板W之撥液劑乾燥。因此,於基板W之端面部51、本體正面周緣部501、及本體背面周緣部502,附著撥液劑中包含之撥液物質。 Next, in step S5, the rotating chuck 13 holds and rotates the substrate W to which the repellent substance is attached at least on the front peripheral portion 501 and the end surface portion 51 of the body. Typically, the rotating chuck 13 holds and rotates the substrate W to which the repellent substance is attached on the front peripheral portion 501 of the body, the back peripheral portion 502 of the body, and the end surface portion 51. The rotation of the substrate W continues from step S3. Furthermore, the heating unit 20 heats the outer portion of the radial direction RD of the substrate W from below the substrate W. Specifically, the control unit 21 controls the heating unit 20 in such a manner that the substrate W is heated. As a result, the heating unit 20 heats the substrate W, and the repellent applied on the substrate W is dried by the heat. Therefore, the repellent substance contained in the repellent is attached to the end surface 51 of the substrate W, the peripheral portion 501 of the front surface of the body, and the peripheral portion 502 of the back surface of the body.

接著,於步驟S6中,刷子151一面自轉,一面與旋轉中之基板W接觸,自基板W去除(分離)多餘之撥液物質。 Next, in step S6, the brush 151 rotates while contacting the rotating substrate W to remove (separate) excess repellent substances from the substrate W.

具體而言,控制部21以使刷子151自轉之方式控制自轉機構158。其結果,自轉機構158使刷子151自轉。且,控制部21以使刷子151自待機位置P2移動至去除位置P1之方式控制搖動臂152。因此,搖動臂152使刷子151自待機位置P2移動至去除位置P1。其結果,刷子151於基板W保留必要之撥液物質,且僅自基板W去除多餘之撥液物質。於多餘之撥液物質之去除完成後,搖動臂152使刷子151自去除位置P1移動至待機位置P2,且自轉機構158停止刷子151之自轉。 Specifically, the control unit 21 controls the rotation mechanism 158 so that the brush 151 rotates. As a result, the rotation mechanism 158 rotates the brush 151. Furthermore, the control unit 21 controls the swing arm 152 so that the brush 151 moves from the standby position P2 to the removal position P1. Therefore, the swing arm 152 moves the brush 151 from the standby position P2 to the removal position P1. As a result, the brush 151 retains the necessary repellent substance on the substrate W and removes only the excess repellent substance from the substrate W. After the removal of the excess repellent substance is completed, the swing arm 152 moves the brush 151 from the removal position P1 to the standby position P2, and the rotation mechanism 158 stops the rotation of the brush 151.

詳細而言,於步驟S6中,於基板W之旋轉期間,使刷子151相對於基板W之端面部51中之徑向RD之側面部515隔開,且使刷子151至少與基板W之本體正面周緣部501接觸,藉此使去除劑接觸附著於本體正面周緣部501之撥液物質。 Specifically, in step S6, during the rotation of the substrate W, the brush 151 is separated from the side surface 515 in the radial direction RD in the end surface 51 of the substrate W, and the brush 151 is in contact with at least the main body front peripheral portion 501 of the substrate W, so that the remover contacts the repellent substance attached to the main body front peripheral portion 501.

更詳細而言,於步驟S6中,刷子151執行第1接觸動作與第2接觸動作。第1接觸動作係藉由於基板W之旋轉期間,使第1接觸部B1相對於基板W之側面部515隔開,且使第1接觸部B1至少與基板W之本體正面周緣部501接觸,而使刷子151接觸附著於本體正面周緣部501之撥液物質之動作。第2接觸動作係藉由於基板W之旋轉期間,使第2接觸部B2相對於基板W之側面部515隔開,且使第2接觸部B2至少與基板W之本體背面周緣 部502接觸,而使去除劑接觸附著於本體背面周緣部502之撥液物質82之動作。 In more detail, in step S6, the brush 151 performs a first contact operation and a second contact operation. The first contact operation is to separate the first contact portion B1 from the side surface 515 of the substrate W during the rotation of the substrate W, and to make the first contact portion B1 contact at least the main body front peripheral portion 501 of the substrate W, so that the brush 151 contacts the liquid-repellent substance attached to the main body front peripheral portion 501. The second contact action is to separate the second contact portion B2 from the side surface 515 of the substrate W during the rotation of the substrate W, and to make the second contact portion B2 contact at least with the back peripheral portion 502 of the substrate W, so that the remover contacts the repellent material 82 attached to the back peripheral portion 502 of the substrate.

更詳細而言,於步驟S6中,執行第1本體接觸動作與第1端面接觸動作,作為第1接觸動作。 More specifically, in step S6, the first body contact action and the first end surface contact action are performed as the first contact action.

第1本體接觸動作係藉由於基板W之旋轉期間,使第1外側接觸部B11接觸本體正面周緣部501,而使去除劑接觸附著於本體正面周緣部501之撥液物質之動作。 The first body contacting action is to make the first outer contact portion B11 contact the body front peripheral portion 501 during the rotation of the substrate W, so that the remover contacts the liquid-repellent substance attached to the body front peripheral portion 501.

第1端面接觸動作係藉由於基板W之旋轉期間,使第1內側接觸部B12接觸基板W之端面部51中之正面緣部511,而使去除劑接觸附著於正面緣部511之撥液物質之動作。另,第1端面接觸動作亦可為藉由於基板W之旋轉期間,使第1內側接觸部B12接觸基板W之正面緣部511及正面肩部512,而使去除劑接觸附著於正面緣部511及正面肩部512之撥液物質之動作。 The first end surface contact action is to make the first inner contact portion B12 contact the front edge portion 511 in the end surface portion 51 of the substrate W during the rotation of the substrate W, so that the remover contacts the liquid-repellent substance attached to the front edge portion 511. In addition, the first end surface contact action can also be to make the first inner contact portion B12 contact the front edge portion 511 and the front shoulder portion 512 of the substrate W during the rotation of the substrate W, so that the remover contacts the liquid-repellent substance attached to the front edge portion 511 and the front shoulder portion 512.

又,於步驟S6中,執行第2本體接觸動作與第2端面接觸動作,作為第2接觸動作。 Furthermore, in step S6, the second body contact action and the second end surface contact action are performed as the second contact action.

第2本體接觸動作係藉由於基板W之旋轉期間,使第2外側接觸部B21接觸基板W之本體背面周緣部502,而使去除劑接觸附著於本體背面周緣部502之撥液物質之動作。 The second body contacting action is to make the second outer contact portion B21 contact the body back peripheral portion 502 of the substrate W during the rotation of the substrate W, so that the remover contacts the liquid-repellent substance attached to the body back peripheral portion 502.

第2端面接觸動作係藉由於基板W之旋轉期間,使第2內側接觸部B22接觸基板W之端面部51中之背面緣部513,而使去除劑接觸附著於背面緣部513之撥液物質之動作。另,第2端面接觸動作亦可為藉由於基板W之旋轉期間,使第2內側接觸部B22接觸基板W之背面緣部513及背面肩部514,而使去除劑接觸附著於背面緣部513及背面肩部514之撥液物質之動作。 The second end surface contacting action is an action in which the second inner contact portion B22 contacts the back edge portion 513 in the end surface portion 51 of the substrate W during the rotation of the substrate W, so that the remover contacts the liquid-repellent substance attached to the back edge portion 513. In addition, the second end surface contacting action can also be an action in which the second inner contact portion B22 contacts the back edge portion 513 and the back shoulder portion 514 of the substrate W during the rotation of the substrate W, so that the remover contacts the liquid-repellent substance attached to the back edge portion 513 and the back shoulder portion 514.

又,較佳為於步驟S6中,使刷子151相對於基板W之側面部515隔開,且一面使刷子151自轉,一面使刷子151至少與本體正面周緣部501接觸。進而較佳為於步驟S6中,使刷子151相對於基板W之側面部515隔開,且一面使刷子151自轉,一面使刷子151至少與本體正面周緣部501及本體背面周緣部502接觸。進而較佳為於步驟S6中,使刷子151相對於基板W之側面部515、正面肩部512及背面肩部514隔開,且一面使刷子151自轉,一面使刷子151接觸本體正面周緣部501、正面緣部511、背面緣部513及本體背面周緣部502。進而較佳為於步驟S6中,使刷子151相對於基板W之側面部515隔開,且一面使刷子151自轉,一面使刷子151接觸本體正面周緣部501、正面緣部511、正面肩部512、背面肩部514、背面緣部513及本體背面周緣部502。 In addition, it is preferred that in step S6, the brush 151 is separated from the side surface 515 of the substrate W, and the brush 151 is rotated while the brush 151 is in contact with at least the front peripheral portion 501 of the body. Further, it is preferred that in step S6, the brush 151 is separated from the side surface 515 of the substrate W, and the brush 151 is rotated while the brush 151 is in contact with at least the front peripheral portion 501 of the body and the back peripheral portion 502 of the body. Furthermore, it is preferred that in step S6, the brush 151 is separated from the side surface 515, the front shoulder 512 and the back shoulder 514 of the substrate W, and the brush 151 is rotated while the brush 151 contacts the front peripheral portion 501, the front edge 511, the back edge 513 and the back peripheral portion 502 of the body. Furthermore, it is preferred that in step S6, the brush 151 is separated from the side surface 515 of the substrate W, and the brush 151 is rotated while the brush 151 contacts the front peripheral portion 501, the front edge 511, the front shoulder 512, the back shoulder 514, the back edge 513 and the back peripheral portion 502 of the body.

又,較佳為於步驟S6中,自刷子151之第1接觸部B1與第2接觸部B2之間,向撥液物質82噴出惰性氣體。 Furthermore, it is preferred that in step S6, an inert gas is sprayed toward the repellent material 82 from between the first contact portion B1 and the second contact portion B2 of the brush 151.

接著,於步驟S7中,清洗液供給部33藉由對基板W供給清洗液,而自基板W沖洗步驟S6中自基板W去除(分離)之多餘之撥液物質。具體而言,控制部21以使清洗液噴嘴331對旋轉中之基板W噴出清洗液暫之方式控制閥332。其結果,由於閥332將配管333之流路開放,故清洗液噴嘴331對基板W噴出清洗液。 Next, in step S7, the cleaning liquid supply unit 33 supplies cleaning liquid to the substrate W, thereby removing (separating) the excess repellent material from the substrate W in the substrate W rinse step S6. Specifically, the control unit 21 controls the valve 332 in such a way that the cleaning liquid nozzle 331 temporarily sprays the cleaning liquid to the rotating substrate W. As a result, since the valve 332 opens the flow path of the pipe 333, the cleaning liquid nozzle 331 sprays the cleaning liquid to the substrate W.

接著,於步驟S8中,旋轉夾盤13藉由使基板W旋轉,而將基板W乾燥。基板W之旋轉自步驟S3繼續。 Next, in step S8, the rotary chuck 13 dries the substrate W by rotating the substrate W. The rotation of the substrate W continues from step S3.

接著,於步驟S9中,控制部21以停止基板W之旋轉之方式控制旋轉夾盤13。其結果,旋轉夾盤13停止基板W之旋轉。 Next, in step S9, the control unit 21 controls the rotary chuck 13 to stop the rotation of the substrate W. As a result, the rotary chuck 13 stops the rotation of the substrate W.

接著,於步驟S10中,控制部21以將基板W自撥液劑處理單元5搬出之方式控制中心機器人CR。其結果,中心機器人CR將基板W自撥液劑處理單元5搬出。 Next, in step S10, the control unit 21 controls the central robot CR to move the substrate W out of the repellent treatment unit 5. As a result, the central robot CR moves the substrate W out of the repellent treatment unit 5.

接著,於步驟S11中,控制部21以將於側面部515附著有撥液物質之基板W、或於側面部515、正面肩部512及背面肩部514附著有撥液物質之基板W搬入處理單元1之方式控制中心機器人CR。其結果,中心機器人CR將基板W搬入至處理單元1。 Next, in step S11, the control unit 21 controls the central robot CR to carry the substrate W with the repellent substance attached to the side surface 515, or the substrate W with the repellent substance attached to the side surface 515, the front shoulder 512, and the back shoulder 514 into the processing unit 1. As a result, the central robot CR carries the substrate W into the processing unit 1.

接著,於步驟S12中,控制部21以藉由處理液處理基板W之方式控制處理單元1。其結果,處理單元1藉由處理液而處理基板W。作為一例,處 理單元1之背面用噴嘴8(圖1)藉由將處理液噴出至基板W之背面A2,而處理基板W之背面A2。作為另一例,處理單元1之正面用噴嘴7(圖1)藉由將處理液噴出至基板W之正面A1,而處理基板W之正面A1。 Next, in step S12, the control unit 21 controls the processing unit 1 in such a manner that the substrate W is processed by the processing liquid. As a result, the processing unit 1 processes the substrate W by the processing liquid. As an example, the back side nozzle 8 (FIG. 1) of the processing unit 1 processes the back side A2 of the substrate W by spraying the processing liquid onto the back side A2 of the substrate W. As another example, the front side nozzle 7 (FIG. 1) of the processing unit 1 processes the front side A1 of the substrate W by spraying the processing liquid onto the front side A1 of the substrate W.

接著,於步驟S13中,控制部21控制以將基板W自處理單元1搬出之方式中心機器人CR。其結果,中心機器人CR將基板W自處理單元1搬出。然後,處理結束。 Next, in step S13, the control unit 21 controls the central robot CR to carry out the substrate W from the processing unit 1. As a result, the central robot CR carries out the substrate W from the processing unit 1. Then, the processing is completed.

以上,如參考圖12所說明,根據本實施形態之基板處理方法,使刷子151相對於基板W之側面部515隔開,且去除多餘之撥液物質(步驟S6)。因此,可於基板W之側面部515保留撥液物質,且去除多餘之撥液物質。 As described above with reference to FIG. 12 , according to the substrate processing method of this embodiment, the brush 151 is separated from the side surface 515 of the substrate W, and the excess repellent substance is removed (step S6). Therefore, the repellent substance can be retained on the side surface 515 of the substrate W, and the excess repellent substance can be removed.

又,根據本實施形態,於步驟S12中,例如,即便於對基板W之背面A2噴出有處理液之情形時,亦可抑制處理液繞行至基板W之正面A1。這是因為於步驟S6中,僅去除多餘之撥液物質,而於基板W之側面部515中附著有撥液物質。 Furthermore, according to the present embodiment, in step S12, for example, even when the processing liquid is sprayed on the back surface A2 of the substrate W, the processing liquid can be prevented from circumventing the front surface A1 of the substrate W. This is because in step S6, only the excess repellent material is removed, and the repellent material is attached to the side surface 515 of the substrate W.

接著,參考圖13,說明形成於基板W之凹口52。圖13係顯示基板W之俯視圖。如圖13所示,有基板W具有凹口52之情形。凹口52係於俯視下,自基板W之端面部51朝徑向RD內側凹陷之凹部。凹口52之周向CD之寬度例如越靠徑向RD內側越小。 Next, referring to FIG. 13 , the recess 52 formed on the substrate W is described. FIG. 13 is a top view of the substrate W. As shown in FIG. 13 , there is a case where the substrate W has a recess 52. The recess 52 is a recessed portion that is recessed from the end surface 51 of the substrate W toward the inner side in the radial direction RD when viewed from above. The width of the recess 52 in the circumferential direction CD is, for example, smaller as it approaches the inner side in the radial direction RD.

接著,參考圖9及圖14,說明凹口52與刷子151之關係。圖14係顯示 刷子151接觸凹口52之狀態之俯視圖。圖14顯示出刷子151中第1傾斜接觸部43之最大部分MX1。又,以兩點鏈線表示第1外側接觸部B11。 Next, referring to FIG. 9 and FIG. 14 , the relationship between the recess 52 and the brush 151 is explained. FIG. 14 is a top view showing the state where the brush 151 contacts the recess 52. FIG. 14 shows the largest part MX1 of the first inclined contact portion 43 in the brush 151. In addition, the first outer contact portion B11 is represented by a two-point chain.

如圖14所示,刷子151之至少一部分進入存在於基板W之端面部51之凹口52,且接觸凹口52之底點BM。因此,根據本實施形態,與端面部51、本體正面周緣部501及本體背面周緣部502之情形同樣,可使撥液物質保留於凹口52中之撥液物質必要部分,且自凹口52中之撥液物質不必要部分及凹口52附近,去除撥液物質。撥液物質必要部分至少包含凹口52中與側面部515對應之部分。撥液物質必要部分亦可包含凹口52中與正面肩部512對應之部分、與背面肩部514對應之部分、與正面緣部511對應之部分、及與背面緣部513對應之部分中之1者以上。撥液物質不必要部分係凹口52中除撥液物質必要部分以外之部分。 As shown in FIG. 14 , at least a portion of the brush 151 enters the recess 52 existing in the end surface portion 51 of the substrate W and contacts the bottom point BM of the recess 52. Therefore, according to this embodiment, the repellent substance can be retained in the necessary portion of the repellent substance in the recess 52, and the repellent substance can be removed from the unnecessary portion of the repellent substance in the recess 52 and the vicinity of the recess 52, as in the case of the end surface portion 51, the body front peripheral portion 501, and the body back peripheral portion 502. The necessary portion of the repellent substance includes at least the portion of the recess 52 corresponding to the side surface portion 515. The liquid-repellent substance necessary portion may also include one or more of the portion of the notch 52 corresponding to the front shoulder 512, the portion corresponding to the back shoulder 514, the portion corresponding to the front edge 511, and the portion corresponding to the back edge 513. The liquid-repellent substance unnecessary portion is the portion of the notch 52 other than the liquid-repellent substance necessary portion.

於圖14之例中,於俯視下,刷子151之第1傾斜接觸部43整體及第2傾斜接觸部44(圖9)整體進入凹口52。但,只要刷子151之第1傾斜接觸部43及第2傾斜接觸部44接觸凹口52之底點BM,則亦可為於俯視下,第1傾斜接觸部43之一部分及第2傾斜接觸部44之一部分進入凹口52。 In the example of FIG. 14 , the entire first inclined contact portion 43 and the entire second inclined contact portion 44 ( FIG. 9 ) of the brush 151 enter the recess 52 in a top view. However, as long as the first inclined contact portion 43 and the second inclined contact portion 44 of the brush 151 contact the bottom point BM of the recess 52, a portion of the first inclined contact portion 43 and a portion of the second inclined contact portion 44 may enter the recess 52 in a top view.

又,於圖14之例中,刷子151之直徑2R小於凹口52之周向CD之最大寬度L。「R」表示俯視下之刷子151之半徑。如圖9所示,於本實施形態中,刷子151之半徑R表示刷子151之第1傾斜接觸部43之最大部分MX1之半徑Rmx。同樣地,刷子151之直徑2R表示刷子151之第1傾斜接觸部43之最大部分MX1之直徑2Rmx。又,於圖14之例中,刷子151之直徑2R小於 凹口52之徑向RD之深度D。因此,於俯視下,刷子151之第1傾斜接觸部43整體及第2傾斜接觸部44整體落於凹口52之內部。由於基板W於旋轉方向D1旋轉,故刷子151相對於凹口52相對移動。因此,可於俯視下,遍及凹口52整體,使撥液物質保留於撥液物質必要部分,且藉由第1傾斜接觸部43及第2傾斜接觸部44自撥液物質不必要部分去除撥液物質。同樣地,可於俯視下,遍及凹口52附近整體,藉由第1外側接觸部B11及第2外側接觸部B21(圖9)去除撥液物質。 In the example of FIG. 14 , the diameter 2R of the brush 151 is smaller than the maximum width L of the recess 52 in the circumferential direction CD. "R" represents the radius of the brush 151 in a top view. As shown in FIG. 9 , in this embodiment, the radius R of the brush 151 represents the radius Rmx of the largest portion MX1 of the first inclined contact portion 43 of the brush 151. Similarly, the diameter 2R of the brush 151 represents the diameter 2Rmx of the largest portion MX1 of the first inclined contact portion 43 of the brush 151. In the example of FIG. 14 , the diameter 2R of the brush 151 is smaller than the depth D of the recess 52 in the radial direction RD. Therefore, in a top view, the entire first inclined contact portion 43 and the entire second inclined contact portion 44 of the brush 151 fall inside the recess 52. Since the substrate W rotates in the rotation direction D1, the brush 151 moves relative to the recess 52. Therefore, in a top view, the entire recess 52 can be covered so that the repellent substance is retained in the necessary part of the repellent substance, and the repellent substance is removed from the unnecessary part of the repellent substance by the first inclined contact portion 43 and the second inclined contact portion 44. Similarly, in a top view, the entire vicinity of the recess 52 can be covered so that the repellent substance is removed by the first outer contact portion B11 and the second outer contact portion B21 (Figure 9).

尤其,於本實施形態中,施力機構159(圖3)將刷子151朝向基板W之徑向RD內側施力。因此,於刷子151隨著基板W之旋轉而位於凹口52之情形時,刷子151之第1傾斜接觸部43及第2傾斜接觸部44迅速進入凹口52。其結果,可更確實地自凹口52之撥液物質不必要部分去除撥液物質。 In particular, in this embodiment, the force applying mechanism 159 (FIG. 3) applies force to the brush 151 toward the inner side of the radial direction RD of the substrate W. Therefore, when the brush 151 is located in the recess 52 as the substrate W rotates, the first inclined contact portion 43 and the second inclined contact portion 44 of the brush 151 quickly enter the recess 52. As a result, the repellent substance can be more reliably removed from the unnecessary portion of the repellent substance in the recess 52.

接著,參考圖9、圖13及圖15,說明刷子151之半徑R之決定方法之一例。如圖13所示,凹口52之寬度L由式(1)表示。於式(1)中,「Rw」表示基板W之半徑。「θ」表示相對於凹口52之中心角。中心角θ之單位為「度」。 Next, referring to FIG. 9, FIG. 13 and FIG. 15, an example of a method for determining the radius R of the brush 151 is described. As shown in FIG. 13, the width L of the notch 52 is expressed by formula (1). In formula (1), "Rw" represents the radius of the substrate W. "θ" represents the center angle relative to the notch 52. The unit of the center angle θ is "degree".

L=2π×Rw×(θ/360)…(1) L=2π×Rw×(θ/360)…(1)

圖15係顯示刷子151及凹口52之俯視圖。圖15顯示刷子151中第1傾斜接觸部43之最大部分MX1。又,以兩點鏈線表示第1外側接觸部B11。如圖15所示,以凹口52之底點BM為原點0,定義x座標及y座標。且,以 拋物線y近似凹口52。因此,凹口52由式(2)表示。式(2)之係數a由式(3)表示。 FIG15 is a top view showing the brush 151 and the notch 52. FIG15 shows the largest part MX1 of the first inclined contact portion 43 in the brush 151. In addition, the first outer contact portion B11 is represented by a two-point chain. As shown in FIG15, the bottom point BM of the notch 52 is taken as the origin 0, and the x-coordinate and the y-coordinate are defined. And, the notch 52 is approximated by the parabola y. Therefore, the notch 52 is represented by formula (2). The coefficient a of formula (2) is represented by formula (3).

y=a×x2…(2) y=a×x 2 …(2)

a=y/x2=By/Ax2…(3) a=y/x 2 =By/Ax 2 …(3)

拋物線y之各點x處之曲率半徑Rc由式(4)表示。「y1」表示式(2)之1次微分,由式(5)表示。「y2」表示式(2)之2次微分,由式(6)表示。 The radius of curvature Rc at each point x of the parabola y is expressed by equation (4). "y1" represents the first differential of equation (2) and is expressed by equation (5). "y2" represents the second differential of equation (2) and is expressed by equation (6).

Rc=(1+y12)3/2/y2…(4) Rc=(1+y1 2 ) 3/2 /y2…(4)

y1=dy/dx…(5) y1=dy/dx…(5)

y2=dy/dx…(6) y2=dy/dx…(6)

拋物線y之原點0處之曲率半徑R0,即凹口52之底點BM處之曲率半徑R0由式(7)表示。即,於式(7)中,x=0。 The radius of curvature R0 at the origin 0 of the parabola y, that is, the radius of curvature R0 at the bottom point BM of the notch 52 is expressed by equation (7). That is, in equation (7), x=0.

R0=(1+(2a)2×x2)3/2/2a=1/2a…(7) R0=(1+(2a) 2 ×x 2 ) 3/2 /2a=1/2a…(7)

本實施形態中,將原點0處之曲率半徑R0設定為刷子151之半徑R。因此,可使刷子151之第1傾斜接觸部43及第2傾斜接觸部44確實地進入凹口52。其結果,可確實地自凹口52之撥液物質不必要部分去除撥液物質。 In this embodiment, the radius of curvature R0 at the origin 0 is set as the radius R of the brush 151. Therefore, the first inclined contact portion 43 and the second inclined contact portion 44 of the brush 151 can be surely entered into the recess 52. As a result, the repellent substance can be surely removed from the unnecessary part of the repellent substance in the recess 52.

此處,作為一例,算出刷子151之半徑R之最大值Rmax及最小值Rmin。 Here, as an example, the maximum value Rmax and the minimum value Rmin of the radius R of the brush 151 are calculated.

首先,算出最大值Rmax。該情形時,若設為基板W之半徑Rw=150mm,中心角θ=2,則根據式(1),凹口52之寬度L=5.24mm。又,若設為Ax=2.62mm,By=1.20mm,則根據式(3),係數a=0.175。若將係數a代入式(7),則曲率半徑R0之最大值為2.86mm。因此,將刷子151之半徑R之最大值Rmax設定為2.86mm。 First, calculate the maximum value Rmax. In this case, if the radius of the substrate W is Rw = 150mm and the center angle θ = 2, then according to formula (1), the width of the notch 52 is L = 5.24mm. Also, if Ax = 2.62mm, By = 1.20mm, then according to formula (3), the coefficient a = 0.175. If the coefficient a is substituted into formula (7), the maximum value of the curvature radius R0 is 2.86mm. Therefore, the maximum value Rmax of the radius R of the brush 151 is set to 2.86mm.

接著,算出最小值Rmin。該情形時,若設為基板W之半徑Rw=150mm,中心角θ=1.5,則根據式(1),為凹口52之寬度L=3.93mm。又,若設為Ax=1.96mm,By=1.20mm,則根據式(3),為係數a=0.31。若將係數a代入式(7),則曲率半徑R0之最小值成為1.61mm。因此,將刷子151之半徑R之最小值Rmin設定為1.61mm。 Next, the minimum value Rmin is calculated. In this case, if the radius of the substrate W is set to Rw = 150mm and the center angle θ = 1.5, then according to formula (1), the width of the notch 52 is L = 3.93mm. Also, if Ax = 1.96mm, By = 1.20mm, then according to formula (3), the coefficient a = 0.31. If the coefficient a is substituted into formula (7), the minimum value of the curvature radius R0 becomes 1.61mm. Therefore, the minimum value Rmin of the radius R of the brush 151 is set to 1.61mm.

即,例如,於凹口52之寬度L為3.93mm以上且5.24mm以下之情形時,將刷子151之半徑R設定為1.61mm以上且2.86mm以下。 That is, for example, when the width L of the notch 52 is greater than 3.93 mm and less than 5.24 mm, the radius R of the brush 151 is set to greater than 1.61 mm and less than 2.86 mm.

(第1變化例) (Variation 1)

參考圖16~圖18,說明本實施形態之第1變化例之刷子151C。第1變化例與參考圖8所說明之實施形態之不同點主要在於,第1變化例之刷子151C之第1內側接觸部B12c及第2內側接觸部B22c可動。以下,主要說明第1變化例與實施形態不同之點。 Referring to Figures 16 to 18, the brush 151C of the first variation of this embodiment is described. The main difference between the first variation and the embodiment described in Figure 8 is that the first inner contact portion B12c and the second inner contact portion B22c of the brush 151C of the first variation are movable. The following mainly describes the differences between the first variation and the embodiment.

圖16係顯示第1變化例之刷子151C之剖視圖。如圖16所示,第1外側 接觸部B11c具有內部空間SP1。內部空間SP1可收納第1內側接觸部B12c。 FIG. 16 is a cross-sectional view showing the brush 151C of the first variation. As shown in FIG. 16 , the first outer contact portion B11c has an inner space SP1. The inner space SP1 can accommodate the first inner contact portion B12c.

第1內側接觸部B12c包含滑件181及本體185。本體185安裝於滑件181之外周面。滑件181具有大致圓筒形狀。滑件181插入至軸部161。滑件181可於軸部161中沿軸向AD移動。因此,第1內側接觸部B12c可於軸部161中沿軸向AD移動。又,滑件181與軸部161一起繞旋轉軸線AX2旋轉。該情形時,滑件181之卡合部與軸部161之卡合部卡合。滑件181之卡合部例如為於軸向AD延伸之凸部,軸部161之卡合部例如為於軸向AD延伸之凹部。 The first inner contact portion B12c includes a slider 181 and a body 185. The body 185 is mounted on the outer circumference of the slider 181. The slider 181 has a substantially cylindrical shape. The slider 181 is inserted into the shaft 161. The slider 181 can move along the axial direction AD in the shaft 161. Therefore, the first inner contact portion B12c can move along the axial direction AD in the shaft 161. In addition, the slider 181 rotates around the rotation axis AX2 together with the shaft 161. In this case, the engaging portion of the slider 181 engages with the engaging portion of the shaft 161. The engaging portion of the slider 181 is, for example, a convex portion extending in the axial direction AD, and the engaging portion of the shaft 161 is, for example, a concave portion extending in the axial direction AD.

內部空間SP1包含間隙GP1及間隙GP2。間隙GP1表示第1內側接觸部B12c之上表面71與第1外側接觸部B11c之內部上表面72之間之空間。間隙GP2表示第1內側接觸部B12c之外周面75與第1外側接觸部B11c之內周面74之間之空間。 The inner space SP1 includes a gap GP1 and a gap GP2. The gap GP1 represents the space between the upper surface 71 of the first inner contact portion B12c and the inner upper surface 72 of the first outer contact portion B11c. The gap GP2 represents the space between the outer peripheral surface 75 of the first inner contact portion B12c and the inner peripheral surface 74 of the first outer contact portion B11c.

另一方面,第2外側接觸部B21c具有內部空間SP2。內部空間SP2可收納第2內側接觸部B22c。 On the other hand, the second outer contact portion B21c has an inner space SP2. The inner space SP2 can accommodate the second inner contact portion B22c.

第2內側接觸部B22c包含滑件182及本體186。本體186安裝於滑件182之外周面。滑件182具有大致圓筒形狀。滑件182插入至軸部161。滑件182可於軸部161中沿軸向AD移動。因此,第2內側接觸部B22c可於軸部161中沿軸向AD移動。又,滑件182與軸部161一起繞旋轉軸線AX2旋 轉。滑件182之構成與滑件181之構成同樣。 The second inner contact portion B22c includes a slider 182 and a body 186. The body 186 is mounted on the outer circumference of the slider 182. The slider 182 has a substantially cylindrical shape. The slider 182 is inserted into the shaft 161. The slider 182 can move along the axis AD in the shaft 161. Therefore, the second inner contact portion B22c can move along the axis AD in the shaft 161. In addition, the slider 182 rotates around the rotation axis AX2 together with the shaft 161. The structure of the slider 182 is the same as that of the slider 181.

內部空間SP2包含間隙GP3及間隙GP4。間隙GP3表示第2內側接觸部B22c之上表面91與第2外側接觸部B21c之內部上表面92之間之空間。間隙GP4表示第2內側接觸部B22c之外周面95與第2外側接觸部B21c之內周面94之間之空間。 The inner space SP2 includes a gap GP3 and a gap GP4. The gap GP3 represents the space between the upper surface 91 of the second inner contact portion B22c and the inner upper surface 92 of the second outer contact portion B21c. The gap GP4 represents the space between the outer peripheral surface 95 of the second inner contact portion B22c and the inner peripheral surface 94 of the second outer contact portion B21c.

另,作為第1例,亦可於間隙GP1配置將第1內側接觸部B12c朝下方施力之施力構件,於間隙GP3配置將第2內側接觸部B22c朝上方施力之施力構件。施力構件例如為彈簧等之彈性構件。又,作為第2例,亦可於間隙GP1及間隙GP3分別配置間隔件,固定第1內側接觸部B12c及第2內側接觸部B22c之位置。於第1例及第2例中,於對向軸部161a中,於第1內側接觸部B12c之下方、及第2內側接觸部B22c之上方配置擋止件。 In addition, as a first example, a force member for applying force to the first inner contact portion B12c downward may be arranged in the gap GP1, and a force member for applying force to the second inner contact portion B22c upward may be arranged in the gap GP3. The force member is, for example, an elastic member such as a spring. In addition, as a second example, spacers may be arranged in the gap GP1 and the gap GP3, respectively, to fix the positions of the first inner contact portion B12c and the second inner contact portion B22c. In the first and second examples, a stopper is arranged below the first inner contact portion B12c and above the second inner contact portion B22c in the opposing shaft portion 161a.

接著,參考圖17及圖18,說明第1變化例之刷子151C之撥液物質之去除處理。圖17係顯示刷子151C之撥液物質之去除處理之第1步驟S1000之圖。圖18係顯示刷子151C之撥液物質之去除處理之第2步驟S2000之圖。 Next, referring to FIG. 17 and FIG. 18 , the removal process of the liquid-repellent substance of the brush 151C in the first variation is described. FIG. 17 is a diagram showing the first step S1000 of the removal process of the liquid-repellent substance of the brush 151C. FIG. 18 is a diagram showing the second step S2000 of the removal process of the liquid-repellent substance of the brush 151C.

如圖17及圖18所示,於第1步驟S1000及第2步驟S2000中,滑件181移動至下方,第1內側接觸部B12c(具體而言為第1傾斜接觸部43)自第1外側接觸部B11c向下方突出。又,滑件182移動至上方,第2內側接觸部B22c(具體而言為第2傾斜接觸部44)自第2外側接觸部B21c向上方突出。 As shown in FIG. 17 and FIG. 18 , in the first step S1000 and the second step S2000, the slider 181 moves downward, and the first inner contact portion B12c (specifically, the first inclined contact portion 43) protrudes downward from the first outer contact portion B11c. In addition, the slider 182 moves upward, and the second inner contact portion B22c (specifically, the second inclined contact portion 44) protrudes upward from the second outer contact portion B21c.

首先,如圖17所示,於第1步驟S1000中,第1外側接觸部B11c之平坦面B14與本體正面周緣部501之區域M2接觸,第1內側接觸部B12c之傾斜面B13與正面緣部511接觸。其結果,附著於區域M2及正面緣部511之撥液物質由去除液去除(分離)。又,於第1步驟S1000中,第2外側接觸部B21c之平坦面B24與本體背面周緣部502之區域N2接觸,第2內側接觸部B22c之傾斜面B23與背面緣部513接觸。其結果,附著於區域N2及背面緣部513之撥液物質由去除液去除(分離)。 First, as shown in FIG. 17 , in the first step S1000, the flat surface B14 of the first outer contact portion B11c contacts the area M2 of the front peripheral portion 501 of the body, and the inclined surface B13 of the first inner contact portion B12c contacts the front edge 511. As a result, the repellent material attached to the area M2 and the front edge 511 is removed (separated) by the removal liquid. In addition, in the first step S1000, the flat surface B24 of the second outer contact portion B21c contacts the area N2 of the back peripheral portion 502 of the body, and the inclined surface B23 of the second inner contact portion B22c contacts the back edge 513. As a result, the repellent material attached to the area N2 and the back edge 513 is removed (separated) by the removal liquid.

但,於第1步驟S1000完成時,於本體正面周緣部501之區域M1及本體背面周緣部502之區域N1中,殘存有撥液物質85。 However, when the first step S1000 is completed, the repellent substance 85 remains in the area M1 of the front peripheral portion 501 of the main body and the area N1 of the back peripheral portion 502 of the main body.

因此,於第1步驟S1000完成後,搖動臂152(圖3)使刷子151C朝方向DA移動。方向DA表示朝向徑向RD外側之方向。具體而言,搖動臂152使刷子151C朝方向DA移動相當於區域M1及區域N1之距離。 Therefore, after the first step S1000 is completed, the swing arm 152 (Figure 3) moves the brush 151C in the direction DA. The direction DA indicates the direction toward the outside of the radial direction RD. Specifically, the swing arm 152 moves the brush 151C in the direction DA by a distance equivalent to the distance between the area M1 and the area N1.

另,區域M1表示本體正面周緣部501之徑向RD內側部分,區域M2表示本體正面周緣部501之徑向RD外側部分。區域N1表示本體背面周緣部502之徑向RD內側部分,區域N2表示本體背面周緣部502之徑向RD外側部分。 In addition, the area M1 represents the radial RD inner part of the front peripheral part 501 of the main body, and the area M2 represents the radial RD outer part of the front peripheral part 501 of the main body. The area N1 represents the radial RD inner part of the back peripheral part 502 of the main body, and the area N2 represents the radial RD outer part of the back peripheral part 502 of the main body.

接著,如圖18所示,於第2步驟S2000中,第1外側接觸部B11c之平坦面B14與本體正面周緣部501之區域M1接觸,第1內側接觸部B12c之傾 斜面B13與正面緣部511隔開。其結果,附著於區域M1之撥液物質由去除液去除(分離)。又,於第2步驟S2000中,第2外側接觸部B21c之平坦面B24與本體背面周緣部502之區域N1接觸,第2內側接觸部B22c之傾斜面B23與背面緣部513隔開。其結果,附著於區域N1之撥液物質由去除液去除(分離)。 Next, as shown in FIG. 18 , in the second step S2000, the flat surface B14 of the first outer contact portion B11c contacts the area M1 of the front peripheral portion 501 of the body, and the inclined surface B13 of the first inner contact portion B12c is separated from the front edge portion 511. As a result, the repellent material attached to the area M1 is removed (separated) by the removal liquid. In addition, in the second step S2000, the flat surface B24 of the second outer contact portion B21c contacts the area N1 of the back peripheral portion 502 of the body, and the inclined surface B23 of the second inner contact portion B22c is separated from the back edge portion 513. As a result, the repellent substances attached to the area N1 are removed (separated) by the removal liquid.

以上之結果,於第1變化例中,於基板W之側面部515、正面肩部512及背面肩部514殘存撥液物質82。另,亦可於第2步驟S2000之後,執行第1步驟S1000。 As a result of the above, in the first variation, the repellent substance 82 remains on the side surface 515, the front shoulder 512 and the back shoulder 514 of the substrate W. In addition, the first step S1000 can also be performed after the second step S2000.

又,於第1變化例中,刷子151C具有滑件181、182。因此,第1內側接觸部B12c與第2內側接觸部B22c之軸向AD上之間隔可縮放。其結果,可配合基板W之端面部51之形狀,設定第1內側接觸部B12c(傾斜面B13)及第2內側接觸部B22c(傾斜面B23)之軸向AD上之位置。 Furthermore, in the first variation, the brush 151C has sliders 181 and 182. Therefore, the interval between the first inner contact portion B12c and the second inner contact portion B22c in the axial direction AD can be scaled. As a result, the positions of the first inner contact portion B12c (inclined surface B13) and the second inner contact portion B22c (inclined surface B23) in the axial direction AD can be set in accordance with the shape of the end surface portion 51 of the substrate W.

(第2變化例) (Variation 2)

參考圖19,說明本實施形態之第2變化例之刷子151D。第2變化例與參考圖8所說明之實施形態之不同點主要在於,第2變化例之刷子151D之第1內側接觸部B12依循正面緣部511及正面肩部512之形狀。以下,主要說明第2變化例與實施形態不同之點。 Referring to FIG. 19 , the brush 151D of the second variation of this embodiment is described. The difference between the second variation and the embodiment described in FIG. 8 is mainly that the first inner contact portion B12 of the brush 151D of the second variation follows the shape of the front edge 511 and the front shoulder 512. The following mainly describes the differences between the second variation and the embodiment.

圖19係顯示第2變化例之刷子151D之撥液物質之去除處理之一例之圖。圖19中,為易於理解圖式,而顯示刷子151D之側面,且顯示基板W之 剖面。又,為使圖式簡略化,而省略表示剖面之斜線。 FIG. 19 is a diagram showing an example of the removal process of the repellent substance of the brush 151D of the second variation. In FIG. 19 , the side surface of the brush 151D is shown for easy understanding of the diagram, and the cross section of the substrate W is shown. In addition, the oblique lines representing the cross section are omitted to simplify the diagram.

如圖19所示,第1傾斜接觸部43d具有第1接觸面B15、及第2接觸面B16。第1接觸面B15具有依循正面緣部511之形狀。因此,藉由第1接觸面B15接觸正面緣部511,而由去除液去除(分離)附著於正面緣部511之撥液物質。第2接觸面B16具有依循正面肩部512之形狀。因此,藉由第2接觸面B16接觸正面肩部512,而由去除液去除(分離)附著於正面肩部512之撥液物質。 As shown in FIG. 19 , the first inclined contact portion 43d has a first contact surface B15 and a second contact surface B16. The first contact surface B15 has a shape following the front edge 511. Therefore, the first contact surface B15 contacts the front edge 511, and the liquid-repellent substance attached to the front edge 511 is removed (separated) by the removal liquid. The second contact surface B16 has a shape following the front shoulder 512. Therefore, the second contact surface B16 contacts the front shoulder 512, and the liquid-repellent substance attached to the front shoulder 512 is removed (separated) by the removal liquid.

又,第2傾斜接觸部44d具有第1接觸面B25、及第2接觸面B26。第1接觸面B25具有依循背面緣部513之形狀。因此,藉由第1接觸面B25接觸背面緣部513,而由去除液去除(分離)附著於背面緣部513之撥液物質。第2接觸面B26具有依循背面肩部514之形狀。因此,藉由第2接觸面B26接觸背面肩部514,而由去除液去除(分離)附著於背面肩部514之撥液物質。 Furthermore, the second inclined contact portion 44d has a first contact surface B25 and a second contact surface B26. The first contact surface B25 has a shape following the back edge 513. Therefore, the first contact surface B25 contacts the back edge 513, and the liquid-repellent substance attached to the back edge 513 is removed (separated) by the removal liquid. The second contact surface B26 has a shape following the back shoulder 514. Therefore, the second contact surface B26 contacts the back shoulder 514, and the liquid-repellent substance attached to the back shoulder 514 is removed (separated) by the removal liquid.

以上之結果,於第2變化例中,僅於基板W之側面部515殘存撥液物質82。 As a result of the above, in the second variation, the repellent substance 82 remains only on the side surface 515 of the substrate W.

以上,已參考圖式對本發明之實施形態進行說明。但,本發明並非限於上述實施形態者,可於不脫離其主旨之範圍內於各種態樣中實施。又,可適當改變上述實施形態所揭示之複數個構成要件。例如,可將某實施形態所示之所有構成要件中之某構成要件追加至其他實施形態之構成要件中,或,亦可將某實施形態所示之所有構成要件中之若干構成要件自實 施形態刪除。 The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the embodiments described above, and can be implemented in various forms without departing from the scope of the present invention. In addition, the multiple components disclosed in the embodiments described above can be appropriately changed. For example, a certain component of all the components shown in a certain embodiment can be added to the components of other embodiments, or some of the components of all the components shown in a certain embodiment can be deleted from the embodiment.

又,圖式為使發明容易理解,而以各個構成要件為主體進行模式性顯示,所圖示之各構成要件之厚度、長度、個數、間隔等有便於製作圖式而與實際不同之情形。又,當然上述實施形態所示之各構成要件之構成為一例,並非特別限定者,於不實質性脫離本發明之效果之範圍內可進行各種變更。 In addition, the drawings are mainly schematically displayed with each component as the main body to make the invention easier to understand. The thickness, length, number, spacing, etc. of each component shown in the drawings may be different from the actual ones for the convenience of making the drawings. In addition, of course, the composition of each component shown in the above-mentioned implementation form is an example and is not particularly limited. Various changes can be made within the scope that does not substantially deviate from the effect of the present invention.

(1)於參考圖3所說明之實施形態(包含變化例)中,刷子151藉由自轉機構158而自轉。但,刷子151亦可從動於基板W而自轉。另,刷子151亦可不自轉。 (1) In the embodiment (including variations) described with reference to FIG. 3 , the brush 151 rotates by the self-rotation mechanism 158. However, the brush 151 may also rotate by following the substrate W. In addition, the brush 151 may not rotate.

(2)於參考圖12所說明之實施形態中,於自基板W去除多餘之撥液物質後,處理單元1藉由處理液處理基板W。但,亦可於自基板W去除多餘之撥液物質後,由撥液劑處理單元5藉由處理液處理基板W。該情形時,撥液劑處理單元5具備將處理液噴出至基板W之噴嘴。例如,撥液劑處理單元5亦可具備正面用噴嘴7及/或背面用噴嘴8。 (2) In the embodiment described with reference to FIG. 12 , after removing excess repellent material from substrate W, processing unit 1 processes substrate W with processing liquid. However, after removing excess repellent material from substrate W, repellent processing unit 5 processes substrate W with processing liquid. In this case, repellent processing unit 5 has a nozzle for spraying processing liquid onto substrate W. For example, repellent processing unit 5 may also have a front nozzle 7 and/or a back nozzle 8.

(3)參考圖8~圖11及圖16~圖19所說明之刷子151、151A~151D具有平坦面B14、B24及傾斜面B13、B23、或、平坦面B14、B24、第1接觸面B15、B25、及第2接觸面B16、B26,但只要可去除多餘之撥液物質,則刷子151、151A~151D之形狀無特別限定。 (3) The brushes 151, 151A-151D described in FIG. 8-11 and FIG. 16-19 have flat surfaces B14, B24 and inclined surfaces B13, B23, or flat surfaces B14, B24, first contact surfaces B15, B25, and second contact surfaces B16, B26. However, as long as the excess repellent substances can be removed, the shapes of the brushes 151, 151A-151D are not particularly limited.

又,第1接觸部B1及第2接觸部B2亦可構成不同之刷子。該情形時,例如,對每個刷子設置軸部及自轉機構。再者,第1外側接觸部B11、第1內側接觸部B12、第2外側接觸部B21及第2內側接觸部B22亦可分別構成不同之刷子。該情形時,例如,對每個刷子設置軸部及自轉機構。 Furthermore, the first contact portion B1 and the second contact portion B2 may also constitute different brushes. In this case, for example, a shaft and a rotation mechanism are provided for each brush. Furthermore, the first outer contact portion B11, the first inner contact portion B12, the second outer contact portion B21, and the second inner contact portion B22 may also constitute different brushes respectively. In this case, for example, a shaft and a rotation mechanism are provided for each brush.

(4)參考圖3所說明之旋轉夾盤13為真空吸附式,但例如,亦可為夾持式或柏努利式。 (4) The rotary chuck 13 shown in FIG. 3 is of vacuum suction type, but it may also be of clamping type or Bernoulli type, for example.

[產業上之可利用性] [Industrial availability]

本發明較佳地用於基板處理裝置及基板處理方法。 The present invention is preferably used in a substrate processing device and a substrate processing method.

51:端面部 51: End face

82:撥液物質 82: Disinfectant substances

86:清洗液 86: Cleaning fluid

87:去除劑 87:Removal agent

151:刷子(去除構件) 151: Brush (removal of components)

161:軸部 161: shaft

331:清洗液噴嘴 331: Cleaning fluid nozzle

501:本體正面周緣部 501: The front edge of the body

502:本體背面周緣部 502: The back edge of the body

511:正面緣部 511: Front edge

512:正面肩部 512: Front shoulder

513:背面緣部 513: Back edge

514:背面肩部 514: Back shoulder

515:側面部 515: Lateral face

A1:正面 A1: Front

A2:背面 A2: Back

AX1,AX2:旋轉軸線 AX1,AX2: Rotation axis

P1:去除位置 P1: Remove position

S400,S500:步驟 S400,S500: Steps

W:基板 W: Substrate

Claims (18)

一種基板處理裝置,其具備:基板保持部,其保持附著有可彈斥處理液之撥液物質之基板且使之旋轉;及去除構件,其包含第1接觸部及第2接觸部;且上述第1接觸部於上述基板之旋轉期間,至少與上述基板之本體正面周緣部接觸,藉此,使可去除上述撥液物質之去除劑接觸附著於上述本體正面周緣部之上述撥液物質;上述第2接觸部於上述基板之旋轉期間,至少與上述基板之本體背面周緣部接觸,藉此,使上述去除劑接觸附著於上述本體背面周緣部之上述撥液物質;上述基板之上述本體正面周緣部表示基板本體之正面中之周緣區域;上述基板之上述本體背面周緣部表示上述基板本體之背面中之周緣區域;上述第1接觸部及上述第2接觸部係配置於同一軸線上;在上述第1接觸部接觸於上述本體正面周緣部,且上述第2接觸部接觸於上述本體背面周緣部之狀態下,上述第1接觸部及上述第2接觸部相對於上述基板之端面部中之徑向之側面部隔開;上述基板之上述端面部表示較上述基板本體更靠徑向外側之端面區域。 A substrate processing device comprises: a substrate holding portion, which holds and rotates a substrate to which a repellent substance capable of repelling a processing liquid is attached; and a removing member, which comprises a first contact portion and a second contact portion; and the first contact portion is in contact with at least a peripheral portion of a front surface of the substrate during the rotation of the substrate, thereby causing a removing agent capable of removing the repellent substance to contact the repellent substance attached to the peripheral portion of the front surface of the substrate; and the second contact portion is in contact with at least a peripheral portion of a back surface of the substrate during the rotation of the substrate, thereby causing the removing agent to contact the repellent substance attached to the peripheral portion of the back surface of the substrate. Liquid substance; the front peripheral portion of the above-mentioned body of the above-mentioned substrate refers to the peripheral area in the front of the substrate body; the back peripheral portion of the above-mentioned body of the above-mentioned substrate refers to the peripheral area in the back of the above-mentioned substrate body; the above-mentioned first contact portion and the above-mentioned second contact portion are arranged on the same axis; when the above-mentioned first contact portion contacts the front peripheral portion of the above-mentioned body and the above-mentioned second contact portion contacts the back peripheral portion of the above-mentioned body, the above-mentioned first contact portion and the above-mentioned second contact portion are separated from the radial side portion in the end portion of the above-mentioned substrate; the above-mentioned end portion of the above-mentioned substrate refers to the end portion area that is closer to the radial outside than the above-mentioned substrate body. 如請求項1之基板處理裝置,其中 上述第1接觸部包含:第1外側接觸部,其藉由於上述基板之旋轉期間,與上述本體正面周緣部接觸,而使上述去除劑接觸附著於上述本體正面周緣部之上述撥液物質;及第1內側接觸部,其藉由配置於上述第1外側接觸部之內側,於上述基板之旋轉期間,與上述基板之上述端面部中之正面緣部接觸,而使上述去除劑接觸附著於上述正面緣部之上述撥液物質;且上述端面部之上述正面緣部表示於上述基板之正面側,上述端面部中位於較上述本體正面周緣部更靠徑向外側之區域,且位於較上述側面部更靠徑向內側之區域;上述第2接觸部包含:第2外側接觸部,其藉由於上述基板之旋轉期間,與上述基板之上述本體背面周緣部接觸,而使上述去除劑接觸附著於上述本體背面周緣部之上述撥液物質;及第2內側接觸部,其藉由配置於上述第2外側接觸部之內側,且於上述基板之旋轉期間,與上述基板之上述端面部中之背面緣部接觸,而使上述去除劑接觸附著於上述背面緣部之上述撥液物質;且上述端面部之上述背面緣部表示於上述基板之背面側,上述端面部中位於較上述本體背面周緣部更靠徑向外側之區域,且位於較上述側面部更靠徑向內側之區域。 The substrate processing device of claim 1, wherein the first contact portion comprises: a first outer contact portion, which contacts the peripheral portion of the front surface of the body during the rotation of the substrate, so that the remover contacts the repellent material attached to the peripheral portion of the front surface of the body; and a first inner contact portion, which is disposed on the inner side of the first outer contact portion and contacts the peripheral portion of the front surface of the body. During the rotation of the substrate, the front edge of the end face of the substrate is contacted, so that the remover contacts the liquid-repellent material attached to the front edge; and the front edge of the end face is represented on the front side of the substrate, and the end face is located in a region that is radially outward of the front peripheral portion of the body and radially inward of the side face. The second contact portion includes: a second outer contact portion, which contacts the peripheral portion of the back side of the main body of the substrate during the rotation of the substrate, so that the remover contacts the liquid-repellent material attached to the peripheral portion of the back side of the main body; and a second inner contact portion, which is arranged on the inner side of the second outer contact portion and contacts the peripheral portion of the back side of the main body during the rotation of the substrate. During the process, the above-mentioned remover contacts the above-mentioned liquid-repellent substance attached to the above-mentioned back edge by contacting the back edge of the above-mentioned end face portion of the above-mentioned substrate; and the above-mentioned back edge of the above-mentioned end face portion is represented by the back side of the above-mentioned substrate, and the above-mentioned end face portion is located in a region that is radially outward of the back peripheral portion of the above-mentioned body, and is located in a region that is radially inward of the above-mentioned side face portion. 如請求項2之基板處理裝置,其中上述第1外側接觸部具有與上述本體正面周緣部接觸之平坦面; 上述第1內側接觸部具有與上述正面緣部接觸之傾斜面;上述第2外側接觸部具有與上述本體背面周緣部接觸之平坦面;上述第2內側接觸部具有與上述背面緣部接觸之傾斜面。 The substrate processing device of claim 2, wherein the first outer contact portion has a flat surface in contact with the front peripheral portion of the body; the first inner contact portion has an inclined surface in contact with the front peripheral portion; the second outer contact portion has a flat surface in contact with the back peripheral portion of the body; the second inner contact portion has an inclined surface in contact with the back peripheral portion. 如請求項2或3之基板處理裝置,其中上述第1內側接觸部與上述第2內側接觸部之間隔可縮放。 A substrate processing device as claimed in claim 2 or 3, wherein the interval between the first inner contact portion and the second inner contact portion is scalable. 如請求項1至3中任1項之基板處理裝置,其進而具備:惰性氣體噴出部,其自上述第1接觸部與上述第2接觸部之間噴出惰性氣體。 The substrate processing device according to any one of claims 1 to 3 further comprises: an inert gas spraying unit that sprays inert gas from between the first contact portion and the second contact portion. 如請求項1至3中任1項之基板處理裝置,其中上述去除構件相對於上述基板之上述側面部隔開,且一面自轉,一面至少與上述本體正面周緣部及上述本體背面周緣部接觸。 A substrate processing device as claimed in any one of claims 1 to 3, wherein the removal member is separated from the side surface of the substrate and contacts at least the front peripheral portion of the body and the back peripheral portion of the body while rotating. 如請求項1至3中任1項之基板處理裝置,其中上述去除構件之至少一部分進入存在於上述基板之上述端面部中之凹口,且接觸上述凹口之底點。 A substrate processing device as claimed in any one of claims 1 to 3, wherein at least a portion of the removal member enters a recess existing in the end surface portion of the substrate and contacts the bottom point of the recess. 如請求項7之基板處理裝置,其進而具備:施力機構,其將上述去除構件朝向上述基板之徑向內側施力。 The substrate processing device of claim 7 further comprises: a force applying mechanism, which applies force to the removal member inwardly toward the diameter of the substrate. 如請求項1至3中任1項之基板處理裝置,其進而具備: 去除劑供給部,其對上述去除構件供給上述去除劑。 The substrate processing device according to any one of claims 1 to 3 further comprises: A removing agent supply unit that supplies the removing agent to the removing component. 一種基板處理方法,其係使用使可去除撥液物質之去除劑接觸上述撥液物質之去除構件者,且包含以下步驟:保持附著有上述撥液物質之基板且使之旋轉;及同時執行第1接觸動作及第2接觸動作;且上述去除構件包含配置於同一軸線上之第1接觸部及第2接觸部;上述第1接觸動作係於上述基板之旋轉期間,使上述第1接觸部至少與上述基板之本體正面周緣部接觸,藉此使上述去除劑接觸附著於上述本體正面周緣部之上述撥液物質之動作;上述第2接觸動作係於上述基板之旋轉期間,使上述第2接觸部至少與上述基板之本體背面周緣部接觸,藉此使上述去除劑接觸附著於上述本體背面周緣部之上述撥液物質之動作;上述基板之上述本體正面周緣部表示基板本體之正面中之周緣區域;上述基板之上述本體背面周緣部表示上述基板本體之背面中之周緣區域;於上述第1接觸動作及上述第2接觸動作中,上述第1接觸部及上述第2接觸部相對於上述基板之端面部中之徑向之側面部隔開;上述基板之上述端面部表示較上述基板本體更靠徑向外側之端面區域。 A substrate processing method uses a removal agent capable of removing a repellent substance to contact a removal member of the repellent substance, and includes the following steps: holding the substrate to which the repellent substance is attached and rotating it; and simultaneously performing a first contact action and a second contact action; and the removal member includes a first contact portion and a second contact portion arranged on the same axis; the first contact action is to make the first contact portion contact at least the peripheral portion of the front surface of the substrate during the rotation of the substrate, thereby making the removal agent contact the repellent substance attached to the peripheral portion of the front surface of the substrate; the second contact action is to make the first contact portion contact the first contact portion during the rotation of the substrate, thereby making the removal agent contact the repellent substance attached to the peripheral portion of the front surface of the substrate; During the rotation period, the second contact portion is brought into contact with at least the peripheral portion of the back side of the main body of the substrate, thereby bringing the removal agent into contact with the liquid-repellent substance attached to the peripheral portion of the back side of the main body; the peripheral portion of the front side of the main body of the substrate refers to the peripheral area in the front side of the main body of the substrate; the peripheral portion of the back side of the main body of the substrate refers to the peripheral area in the back side of the main body of the substrate; in the first contact action and the second contact action, the first contact portion and the second contact portion are separated from the radial side portion in the end face portion of the substrate; the end face portion of the substrate refers to the end face region that is radially outward of the main body of the substrate. 如請求項10之基板處理方法,其中 上述第1接觸部包含第1外側接觸部、及配置於上述第1外側接觸部之內側之第1內側接觸部;於同時執行上述第1接觸動作及上述第2接觸動作之上述步驟中,執行第1本體接觸動作及第1端面接觸動作,作為上述第1接觸動作;上述第1本體接觸動作係藉由於上述基板之旋轉期間,使上述第1外側接觸部接觸上述本體正面周緣部,而使上述去除劑接觸附著於上述本體正面周緣部之上述撥液物質之動作;上述第1端面接觸動作係藉由於上述基板之旋轉期間,使上述第1內側接觸部接觸上述基板之上述端面部中之正面緣部,而使上述去除劑接觸附著於上述正面緣部之上述撥液物質之動作;上述端面部之上述正面緣部表示於上述基板之正面側,上述端面部中位於較上述本體正面周緣部更靠徑向外側之區域,且位於較上述側面部更靠徑向內側之區域;上述第2接觸部包含第2外側接觸部、及配置於上述第2外側接觸部之內側之第2內側接觸部;於同時執行上述第1接觸動作及上述第2接觸動作之上述步驟中,執行第2本體接觸動作及第2端面接觸動作,作為上述第2接觸動作;上述第2本體接觸動作係藉由於上述基板之旋轉期間,使上述第2外側接觸部接觸上述基板之上述本體背面周緣部,而使上述去除劑接觸附著於上述本體背面周緣部之上述撥液物質之動作;上述第2端面接觸動作係藉由於上述基板之旋轉期間,使上述第2內側接觸部接觸上述基板之上述端面部中之背面緣部,而使上述去除劑接觸附著於上述背面緣部之上述撥液物質之動作; 上述端面部之上述背面緣部表示於上述基板之背面側,上述端面部中位於較上述本體背面周緣部更靠徑向外側之區域,且位於較上述側面部更靠徑向內側之區域。 The substrate processing method of claim 10, wherein the first contact portion includes a first outer contact portion and a first inner contact portion disposed on the inner side of the first outer contact portion; in the step of simultaneously performing the first contact action and the second contact action, a first body contact action and a first end surface contact action are performed as the first contact action; the first body contact action is performed by causing the first outer contact portion to contact the peripheral portion of the front surface of the body during the rotation of the substrate, so that the removal agent The first end surface contacting action is to make the first inner contact portion contact the front edge of the end surface of the substrate during the rotation of the substrate, so that the removal agent contacts the liquid-repellent substance attached to the front edge; the front edge of the end surface is represented by the front side of the substrate, and the end surface is located in a region that is radially outward of the front peripheral portion of the body and is radially closer to the side surface than the side surface. The second contact portion includes a second outer contact portion and a second inner contact portion disposed inside the second outer contact portion; in the above-mentioned step of simultaneously performing the above-mentioned first contact action and the above-mentioned second contact action, performing a second body contact action and a second end face contact action as the above-mentioned second contact action; the above-mentioned second body contact action is to make the above-mentioned second outer contact portion contact the peripheral portion of the back side of the above-mentioned body of the above-mentioned substrate during the rotation of the above-mentioned substrate, so that the above-mentioned remover contacts and adheres to the above-mentioned first contact action and the second end face contact action. The second end surface contacting action is to make the second inner contact part contact the back edge of the end surface of the substrate during the rotation of the substrate, so that the removal agent contacts the liquid-repellent substance attached to the back edge; The back edge of the end surface is represented by the back side of the substrate, and the end surface is located in a region that is radially outward of the back edge of the body and radially inward of the side surface. 如請求項11之基板處理方法,其中上述第1外側接觸部具有與上述本體正面周緣部接觸之平坦面;上述第1內側接觸部具有與上述正面緣部接觸之傾斜面;上述第2外側接觸部具有與上述本體背面周緣部接觸之平坦面;上述第2內側接觸部具有與上述背面緣部接觸之傾斜面。 The substrate processing method of claim 11, wherein the first outer contact portion has a flat surface in contact with the front peripheral portion of the body; the first inner contact portion has an inclined surface in contact with the front peripheral portion; the second outer contact portion has a flat surface in contact with the back peripheral portion of the body; and the second inner contact portion has an inclined surface in contact with the back peripheral portion. 如請求項11或12之基板處理方法,其中上述第1內側接觸部與上述第2內側接觸部之間隔可縮放。 A substrate processing method as claimed in claim 11 or 12, wherein the interval between the first inner contact portion and the second inner contact portion is scalable. 如請求項10至12中任1項之基板處理方法,其中於同時執行上述第1接觸動作及上述第2接觸動作之上述步驟中,自上述第1接觸部與上述第2接觸部之間噴出惰性氣體。 A substrate processing method as claimed in any one of claims 10 to 12, wherein in the above step of performing the above first contact action and the above second contact action simultaneously, an inert gas is sprayed from between the above first contact portion and the above second contact portion. 如請求項10至12中任1項之基板處理方法,其中於同時執行上述第1接觸動作及上述第2接觸動作之上述步驟中,使上述去除構件相對於上述基板之上述側面部隔開,且一面使上述去除構件自轉,一面使上述去除構件至少接觸上述本體正面周緣部及上述本體背面周緣部。 A substrate processing method as claimed in any one of claims 10 to 12, wherein in the above step of simultaneously performing the above first contact action and the above second contact action, the above removal member is spaced apart from the above side surface of the above substrate, and the above removal member is rotated while the above removal member is in contact with at least the front peripheral portion of the above body and the back peripheral portion of the above body. 如請求項10至12中任1項之基板處理方法,其中於同時執行上述第1接觸動作及上述第2接觸動作之上述步驟中,上述去除構件之至少一部分進入存在於上述基板之上述端面部之凹口,且接觸上述凹口之底點。 A substrate processing method as claimed in any one of claims 10 to 12, wherein in the above step of simultaneously performing the above first contact action and the above second contact action, at least a portion of the above removal member enters the recess existing in the above end surface of the above substrate and contacts the bottom point of the above recess. 如請求項16之基板處理方法,其中於同時執行上述第1接觸動作及上述第2接觸動作之上述步驟中,將上述去除構件朝向上述基板之徑向內側施力。 As in the substrate processing method of claim 16, in the above step of simultaneously performing the above first contact action and the above second contact action, the above removal component is forced radially inward toward the above substrate. 如請求項10至12中任1項之基板處理方法,其進而包含以下步驟:對上述去除構件供給上述去除劑。 The substrate processing method of any one of claim 10 to 12 further comprises the following step: supplying the above-mentioned removal agent to the above-mentioned removal component.
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JP2003092278A (en) * 2001-09-18 2003-03-28 Shibaura Mechatronics Corp Substrate processing apparatus and processing method
JP2009032889A (en) * 2007-07-26 2009-02-12 Sokudo:Kk Substrate cleaning apparatus and substrate processing apparatus having the same
JP2009164405A (en) * 2008-01-08 2009-07-23 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092278A (en) * 2001-09-18 2003-03-28 Shibaura Mechatronics Corp Substrate processing apparatus and processing method
JP2009032889A (en) * 2007-07-26 2009-02-12 Sokudo:Kk Substrate cleaning apparatus and substrate processing apparatus having the same
JP2009164405A (en) * 2008-01-08 2009-07-23 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method

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