TWI877313B - Thin film peeling method and thin film peeling device - Google Patents
Thin film peeling method and thin film peeling device Download PDFInfo
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- TWI877313B TWI877313B TW110106023A TW110106023A TWI877313B TW I877313 B TWI877313 B TW I877313B TW 110106023 A TW110106023 A TW 110106023A TW 110106023 A TW110106023 A TW 110106023A TW I877313 B TWI877313 B TW I877313B
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- H10P72/0442—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/54—Article strippers, e.g. for stripping from advancing elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
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- H10P72/7402—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
- B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
- B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/17—Nature of material
- B65H2701/172—Composite material
- B65H2701/1726—Composite material including detachable components
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- H10P72/7442—
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
一種薄片剝離方法,是將被貼附在被黏附體(WK)的黏著薄片(AS)從該被黏附體(WK)剝離的方法,實施:使黏著薄片(AS)的剝離開始部(AS1)的彈性復原力被減弱的彈性復原力減弱過程;及將彈性復原力已被減弱的剝離開始部(AS1)及被黏附體(WK)彼此相對移動,從被黏附體(WK)將黏著薄片剝離的剝離過程。A sheet peeling method is a method for peeling an adhesive sheet (AS) attached to an adherend (WK) from the adherend (WK), implementing: an elastic restoring force weakening process in which the elastic restoring force of a peeling starting portion (AS1) of the adhesive sheet (AS) is weakened; and a peeling process in which the peeling starting portion (AS1) with weakened elastic restoring force and the adherend (WK) are moved relative to each other to peel the adhesive sheet from the adherend (WK).
Description
本發明,是有關於薄片剝離方法及薄片剝離裝置。The present invention relates to a thin film peeling method and a thin film peeling device.
已知的薄片剝離方法,是將被貼附在被黏附體的黏著薄片的剝離開始部保持,將該剝離開始部及被黏附體彼此相對移動從該被黏附體將黏著薄片剝離(例如文獻1:日本特開平11-16862號公報參照)。A known sheet peeling method is to hold the peeling start portion of an adhesive sheet attached to an adherend, move the peeling start portion and the adherend relative to each other, and peel the adhesive sheet from the adherend (for example, document 1: see Japanese Patent Publication No. 11-16862).
在文獻1的薄片剝離方法中,保護薄片F(黏著薄片)的彈性復原力若變大的話,從半導體晶圓W(被黏附體)剝離之後的黏著薄片的曲折部ASR(本案的第1C圖參照)的圓弧半徑會變大。如此的話,黏著薄片欲將被黏附體從載置台203(支撐手段)擧升的力(支撐手段從黏著薄片的支撐面分離的方向,且與該支撐面垂直交叉的方向的力成分)會變大,該被黏附體會具有從支撐手段脫落而破損的可能性。In the sheet peeling method of document 1, if the elastic restoring force of the protective sheet F (adhesive sheet) increases, the arc radius of the bent portion ASR (see FIG. 1C of this case) of the adhesive sheet after being peeled from the semiconductor wafer W (adherend) will increase. In this case, the force of the adhesive sheet to lift the adherend from the mounting table 203 (supporting means) (the force component in the direction in which the supporting means separates from the supporting surface of the adhesive sheet and perpendicularly intersects the supporting surface) will increase, and the adherend may fall off the supporting means and be damaged.
本發明的目的,是提供一種薄片剝離方法及薄片剝離裝置,可以極力地減少被黏附體從支撐手段脫落而破損的可能性。The object of the present invention is to provide a thin film peeling method and a thin film peeling device, which can greatly reduce the possibility of an adherend falling off from a supporting means and being damaged.
本發明,是採用了如申請專利範圍所記載的構成。The present invention adopts the structure described in the patent application scope.
依據本發明的話,因為黏著薄片的彈性復原力被減弱,所以可抑制黏著薄片的曲折部的圓弧半徑變大,該黏著薄片將被黏附體從支撐手段擧升的力不會變大,可以極力地減少被黏附體從支撐手段脫落而破損的可能性。According to the present invention, since the elastic restoring force of the adhesive sheet is weakened, the arc radius of the bent portion of the adhesive sheet can be suppressed from increasing, and the force of the adhesive sheet to lift the adherend from the supporting means will not increase, which can greatly reduce the possibility of the adherend falling off the supporting means and being damaged.
以下,依據第1A圖~第1E圖說明本發明的一實施方式。An implementation method of the present invention is described below with reference to FIGS. 1A to 1E.
又,本實施方式的X軸、Y軸、Z軸,是各別具有彼此相互垂直交叉的關係,X軸及Y軸,是規定平面內的軸,Z軸,是與前述規定平面垂直交叉的軸。進一步,在本實施方式中,若以從與Y軸平行的第1A圖的前方方向觀看的情況作為基準而顯示方向的情況時,「上」是Z軸的箭頭方向,而「下」是其相反方向,「左」是X軸的箭頭方向,而「右」是其相反方向,「前」是與Y軸平行的第1A圖的前方方向,而「後」是其相反方向。In addition, the X-axis, Y-axis, and Z-axis of the present embodiment are each perpendicular to each other. The X-axis and the Y-axis are axes within a predetermined plane, and the Z-axis is an axis perpendicular to the predetermined plane. Furthermore, in the present embodiment, when directions are displayed based on the situation of viewing from the front direction of FIG. 1A parallel to the Y-axis, "up" is the arrow direction of the Z-axis, and "down" is the opposite direction thereof, "left" is the arrow direction of the X-axis, and "right" is the opposite direction thereof, and "front" is the front direction of FIG. 1A parallel to the Y-axis, and "rear" is the opposite direction thereof.
本發明的薄片剝離裝置EA,是將被貼附在被黏附體WK的黏著薄片AS從該被黏附體WK剝離的裝置,具備:使黏著薄片AS的剝離開始部AS1的彈性復原力被減弱的彈性復原力減弱手段10;及將彈性復原力已被減弱的剝離開始部AS1及被黏附體WK彼此相對移動,從被黏附體WK將黏著薄片AS剝離的剝離手段20;且該裝置是被配置於將被黏附體WK支撐的支撐手段30的附近。The sheet peeling device EA of the present invention is a device for peeling an adhesive sheet AS attached to an adherend WK from the adherend WK, and comprises: an elastic restoring force weakening means 10 for weakening the elastic restoring force of a peeling starting portion AS1 of the adhesive sheet AS; and a peeling means 20 for moving the peeling starting portion AS1 whose elastic restoring force has been weakened and the adherend WK relative to each other to peel the adhesive sheet AS from the adherend WK; and the device is arranged in the vicinity of a supporting
彈性復原力減弱手段10,是採用藉由將黏著薄片AS的一部分的厚度變薄而使該黏著薄片AS的彈性復原力被減弱的彈性復原力減弱手段10A。這種彈性復原力減弱手段10A,是具備:由複數臂所構成,在其作業範圍內,可將由作業部也就是前端臂11A支撐者朝其中任一的位置、其中任一的角度變位的一種驅動機器也就是多關節機械手臂11;及被支撐於前端臂11A的作為切斷構件的切斷刀片12。The elastic restoring
剝離手段20,是具備:將感熱黏著性的剝離用膠帶PT吐出的吐出手段21、及將剝離用膠帶PT推壓並貼附在黏著薄片AS用的推壓手段22、及將剝離用膠帶PT切斷成規定長度的切斷手段23、及作為驅動機器的線性馬達24。The peeling means 20 includes: a discharging means 21 for discharging the heat-sensitive adhesive peeling tape PT, a
吐出手段21,是具備:將剝離用膠帶PT支撐的支撐滾子21A、及導引剝離用膠帶PT的導引滾子21B、及被支撐於作為驅動機器的線性馬達21C的滑件21D的滑動托板21E、及作為可旋轉地被支撐於作為驅動機器的直線馬達21F的輸出軸21G的推壓構件的推滾子21H、及具有一對的把持爪21J的保持手段且作為驅動機器的夾持筒21K。The discharging means 21 comprises: a supporting
推壓手段22,是具備:作為驅動機器的直線馬達22A、及被支撐於直線馬達22A的輸出軸22B的線圈加熱器和加熱管的加熱側等的加熱手段22C、及作為被支撐於加熱手段22C的推壓構件的推壓頭22D。The pressing
切斷手段23,是具備:作為驅動機器的直線馬達23A、及被支撐於直線馬達23A的輸出軸23B的作為切斷構件的切斷刀片23C。The cutting means 23 includes a
支撐手段30,是具備載置台31,其被支撐於線性馬達24的滑件24A,且具有可藉由減壓泵和真空噴射器等的無圖示的減壓手段(保持手段)而被吸附保持的支撐面31A。The supporting
說明以上的薄片剝離裝置EA的動作。The operation of the above-mentioned sheet peeling device EA is described.
首先,對於各構件是被配置在第1A圖中實線所示的初期位置的薄片剝離裝置EA,該薄片剝離裝置EA的使用者(以下,只是稱為「使用者」)是如同圖將剝離用膠帶PT組裝好之後,透過無圖示的操作盤和個人電腦等的操作手段將自動運轉開始的訊號輸入。接著,使用者或是多關節機械手臂和皮帶輸送帶等的無圖示的搬運手段,是如第1A圖中實線所示,將貼附有黏著薄片AS的被黏附體WK載置在支撐面31A上的話,支撐手段30是將無圖示的減壓手段驅動,開始進行支撐面31A中的被黏附體WK的吸附保持。First, for the sheet peeling device EA, each component of which is arranged at the initial position shown by the solid line in FIG. 1A, the user of the sheet peeling device EA (hereinafter simply referred to as "user") assembles the peeling tape PT as shown in the figure, and then inputs a signal for starting automatic operation through an operating means such as an unillustrated operation panel and a personal computer. Then, if the user or an unillustrated transport means such as a multi-jointed robot arm and a belt conveyor places an adherend WK attached with an adhesive sheet AS on the
其後,彈性復原力減弱手段10是將多關節機械手臂11驅動,如第1A圖中二點鎖線所示,藉由切斷刀片12在黏著薄片AS形成不會到達被黏附體WK的切溝CU(第1B圖參照),將該黏著薄片AS的一部分的厚度變薄,使該黏著薄片AS的彈性復原力被減弱(彈性復原力減弱過程)。本實施方式的情況,彈性復原力減弱手段10,是如第1B圖所示,朝與黏著薄片AS的剝離方向(以下,也只稱為「剝離方向」)垂直交叉的方向呈平行的方向延伸的切溝CU,是在黏著薄片AS的剝離方向複數形成。Thereafter, the elastic restoring force weakening means 10 drives the
接著,剝離手段20是將線性馬達24驅動,將載置台31朝右方移動,黏著薄片AS的右端部若位於推壓頭22D的正下方的話,就停止線性馬達24的驅動。且,剝離手段20是將線性馬達21C驅動,如第1A圖中二點鎖線所示,將滑動托板21E朝右方移動,朝一對的把持爪21J之間將剝離用膠帶PT吐出。接著,剝離手段20是將直線馬達21F及線性馬達21C驅動,將推滾子21H朝上方退避,並且將滑動托板21E復歸至初期位置之後,將夾持筒21K驅動,由把持爪21J將剝離用膠帶PT把持。其後,剝離手段20是將直線馬達22A及加熱手段22C驅動,將被加熱的推壓頭22D下降,如第1C圖所示,藉由該推壓頭22D將剝離用膠帶PT推壓貼附在黏著薄片AS的右端部,而將剝離開始部AS1保持。Next, the peeling means 20 drives the
接著,剝離手段20是將直線馬達21F驅動,將推滾子21H復歸至初期位置之後,將直線馬達23A驅動,如第1C圖所示,將切斷刀片23C下降將剝離用膠帶PT切斷。且,剝離手段20是將直線馬達22A、23A驅動,將推壓頭22D及切斷刀片23C復歸至初期位置之後,將線性馬達24驅動,如第1C圖中二點虛線所示,將載置台31朝右方移動,從被黏附體WK將黏著薄片AS剝離(剝離過程)。此時,未形成有切溝CU的黏著薄片AS的情況,如第1C圖中二點鎖線所示,曲折部ASR,是成為圓弧半徑大的曲折部ASR1,對於此,藉由切溝CU而使彈性復原力被減弱的黏著薄片AS,其與曲折部ASR1相比成為圓弧半徑小的曲折部ASR2。Next, the peeling means 20 drives the
黏著薄片AS整體從被黏附體WK被剝離的話,剝離手段20停止線性馬達24的驅動之後,支撐手段30也停止無圖示的減壓手段的驅動,解除支撐面31A中的被黏附體WK的吸附保持。接著,剝離手段20是將夾持筒21K驅動,將把持爪21J復歸至初期位置,並解除剝離用膠帶PT的把持,將已剝離的黏著薄片AS交付至回收箱和回收袋等的無圖示的回收手段和使用者。其後,使用者或是無圖示的搬運手段將被黏附體WK朝次過程搬運之後,各手段是將各個的驅動機器驅動,將各個的構件復歸至初期位置,之後反覆上述同樣的動作。When the adhesive sheet AS is completely peeled off from the adherend WK, the peeling means 20 stops driving the
依據如以上的實施方式的話,因為可將黏著薄片AS的彈性復原力減弱,所以可抑制黏著薄片AS的曲折部ASR的圓弧半徑變大,該黏著薄片AS將被黏附體WK從支撐手段30擧升的力不會變大,可以極力地減少被黏附體WK從支撐手段30脫落而破損的可能性。According to the above implementation method, since the elastic restoring force of the adhesive sheet AS can be weakened, the arc radius of the bending portion ASR of the adhesive sheet AS can be suppressed from increasing. The force of the adhesive sheet AS to lift the adherend WK from the supporting
如以上,本發明實施用的最佳的結構、方法等,雖是如前述,但是本發明,不限定於此。即,本發明,只有特別圖示並說明主要且特定的實施方式,但是在不脫離本發明的技術的思想及目的之範圍,對於以上述及的實施方式,本行業者可以在形狀、材質、數量、其他的詳細的結構上,加上各式各樣的變形。且,上述限定的形狀、材質等的記載,只是為了容易理解本發明而例示者,不是用於限定本發明,因此即使沒有限定記載那些的形狀、材質等的一部分或是全部的構件的名稱者,也被包含於本發明。As mentioned above, the best structures, methods, etc. for practicing the present invention are as mentioned above, but the present invention is not limited to them. That is, the present invention only specifically illustrates and explains the main and specific implementation methods, but within the scope of the technical ideas and purposes of the present invention, the industry can add various deformations to the above-mentioned implementation methods in terms of shape, material, quantity, and other detailed structures. Moreover, the description of the above-mentioned limited shapes, materials, etc. is only for the purpose of easily understanding the present invention, and is not used to limit the present invention. Therefore, even if the names of some or all components of those shapes, materials, etc. are not limited, they are also included in the present invention.
例如,彈性復原力減弱手段10,是如第1D圖所示,也可以採用由切斷刀片23C在黏著薄片AS形成溝DC的結構,這種溝DC,是例如,同圖所示的剖面視V字形狀也可以,其他U字形狀、コ字形狀等任何的形狀也可以,如同圖的二點鎖線所示,溝DC的上部即使是連接也可以。For example, the elastic restoring force reducing means 10, as shown in FIG. 1D, may also adopt a structure in which a groove DC is formed in the adhesive sheet AS by the
彈性復原力減弱手段10,是形成朝與剝離方向垂直交叉的方向呈非平行方向延伸的切溝CU和溝DC也可以,彼此平行或是彼此非並行的切溝CU和溝DC,是在黏著薄片AS的剝離方向複數形成也可以,彼此交叉地形成複數切溝CU和溝DC也可以,在黏著薄片AS整體形成切溝CU和溝DC也可以,在貼附有剝離用膠帶PT的黏著薄片AS形成切溝CU和溝DC也可以,在黏著薄片AS的規定的一部分形成切溝CU和溝DC也可以,形成單數的切溝CU和溝DC也可以,如第1B圖所示,形成到達被黏附體WK的外緣的切溝CU和溝DC也可以,形成不會到達被黏附體WK的外緣的切溝CU和溝DC也可以,切溝CU和溝DC,是直線、彎曲線、折曲線、波線、圓環狀的線、多角環狀的線等任何的形狀也可以。The elastic restoring force weakening means 10 may be formed by forming the grooves CU and the grooves DC extending in a non-parallel direction in a direction perpendicular to the peeling direction, or by forming the grooves CU and the grooves DC parallel to or non-parallel to each other in the peeling direction of the adhesive sheet AS in plurality, or by forming the grooves CU and the grooves DC in a cross-sectional manner, or by forming the grooves CU and the grooves DC in the entire adhesive sheet AS, or by forming the grooves CU and the grooves DC in the adhesive sheet AS to which the peeling tape PT is attached. Groove DC may be formed in a specified portion of the adhesive sheet AS, or an odd number of grooves CU and DC may be formed. As shown in FIG. 1B , grooves CU and DC may be formed to reach the outer edge of the adherend WK, or grooves CU and DC may be formed to not reach the outer edge of the adherend WK. Grooves CU and DC may be in any shape, such as straight lines, curved lines, folded lines, wavy lines, circular lines, polygonal lines, etc.
彈性復原力減弱手段10,也可以採用如第1E圖所示,藉由將黏著薄片AS整體變薄而使該黏著薄片AS的彈性復原力被減弱的彈性復原力減弱手段10B。這種彈性復原力減弱手段10B,可以例示例如,具備被支撐於作為驅動機器的轉動馬達13的輸出軸13A的砂輪機、磨石、銼刀、砂紙等的磨削手段14的結構。又,彈性復原力減弱手段10B,是例如,藉由磨削手段14將黏著薄片AS的一部分變薄而使該黏著薄片AS的彈性復原力被減弱也可以。The elastic restoring
彈性復原力減弱手段10,是藉由將黏著薄片AS整體或是一部分變柔軟而使該黏著薄片AS的彈性復原力被減弱也可以,例如,黏著薄片AS是藉由加熱和冷卻而變柔軟使彈性復原力被減弱的情況時,對於黏著薄片AS賦予熱風和熱水等,或賦予冷卻風和冷水等而使該黏著薄片的彈性復原力被減弱也可以,黏著薄片AS是由微波、X線、伽馬射線、紫外線、可視光線、紅外線等的能量射線的賦予、和藥液的賦予等而變柔軟,使彈性復原力被減弱的情況時,藉由對於黏著薄片AS賦予能量射線,或賦予藥液而使該黏著薄片AS的彈性復原力被減弱也可以,熱風、熱水、冷卻風、冷水、能量射線或是藥液等,是對於黏著薄片AS的整體賦予,或對於黏著薄片AS的規定的一部分賦予,而使黏著薄片AS整體或是一部分變柔軟也可以。The elastic restoring force weakening means 10 may be to weaken the elastic restoring force of the adhesive sheet AS by softening the adhesive sheet AS as a whole or in part. For example, when the adhesive sheet AS is softened by heating and cooling to weaken the elastic restoring force, the adhesive sheet AS may be weakened by applying hot air and hot water, or applying cooling air and cold water, etc. The adhesive sheet AS is subjected to microwave, X-ray, gamma ray, ultraviolet ray, visible light, etc. In the case where the elastic restoring force is weakened by applying energy rays such as infrared rays, or applying chemical liquid, the elastic restoring force of the adhesive sheet AS may be weakened by applying energy rays to the adhesive sheet AS, or applying chemical liquid to the adhesive sheet AS. Hot air, hot water, cooling air, cold water, energy rays, or chemical liquid may be applied to the entire adhesive sheet AS, or to a specified part of the adhesive sheet AS, thereby making the adhesive sheet AS soft as a whole or in part.
彈性復原力減弱手段10,是藉由切溝CU的形成、溝DC的形成、黏著薄片AS的磨削、熱風和熱水的賦予、冷卻風和冷水的賦予、能量射線的賦予、藥液的賦予等,將那些之中至少2個施加在黏著薄片AS而使該黏著薄片AS的彈性復原力被減弱也可以,使被貼附在被黏附體WK之前的黏著薄片AS的彈性復原力被減弱也可以。The elastic restoring force weakening means 10 is to form a groove CU, form a groove DC, grind the adhesive sheet AS, apply hot air and hot water, apply cooling air and cold water, apply energy rays, apply a chemical solution, etc., and at least two of them are applied to the adhesive sheet AS to weaken the elastic restoring force of the adhesive sheet AS, or the elastic restoring force of the adhesive sheet AS before being attached to the adherend WK can be weakened.
剝離手段20,是採用例如,具有將夾持筒21K支撐的滑件的作為驅動機器的線性馬達,藉由使載置台31不移動或是移動,且將夾持筒21K移動,而使剝離開始部AS1及被黏附體WK彼此相對移動也可以,由多關節機械手臂等的驅動機器將夾持筒21K及載置台31彼此相對移動也可以,作業者是將剝離開始部AS1及被黏附體WK彼此相對移動也可以,將剝離用膠帶PT貼附在形成有切溝CU的位置也可以,將剝離用膠帶PT貼附未形成有切溝CU的位置也可以,不使用剝離用膠帶PT,而將彈性復原力已被減弱的剝離開始部AS1由吸盤和夾持筒等的保持手段直接保持,使該剝離開始部AS1及被黏附體WK彼此相對移動也可以。The peeling means 20 is, for example, a linear motor having a slide supporting the
剝離用膠帶PT,也可以採用感壓黏著性的剝離用膠帶PT。又,感壓黏著性的剝離用膠帶PT所採用的情況,剝離手段20,是具備加熱手段22C也可以,不具備也可以。The peeling tape PT may be a pressure-sensitive adhesive peeling tape PT. Furthermore, when the pressure-sensitive adhesive peeling tape PT is used, the peeling means 20 may or may not be equipped with the heating means 22C.
推壓手段22,是採用放電加熱器、微波照射裝置、暖風吹附裝置等的加熱手段也可以,取代或是併用加熱手段,將推壓頭22D振動的超音波振動裝置和振動器等的振動手段也可以。The pushing means 22 may be a heating means such as a discharge heater, a microwave irradiation device, a warm air blowing device, etc., or a vibration means such as an ultrasonic vibration device and a vibrator that vibrates the pushing
支撐手段30,是不具備無圖示的減壓手段也可以,在本發明的薄片剝離裝置EA中具備也可以,不具備也可以。The supporting means 30 may not be provided with a decompression means (not shown), and the sheet peeling apparatus EA of the present invention may or may not be provided with the decompression means.
薄片剝離裝置EA,是具備將被黏附體WK磨削將該被黏附體WK的厚度變薄的磨削手段也可以,具備透過切割膠帶和可伸縮膠帶等的其他的黏著薄片將被黏附體WK及框架構件一體化的一體化手段也可以。The sheet peeling device EA may include grinding means for grinding the adherend WK to reduce the thickness of the adherend WK, or may include integration means for integrating the adherend WK and the frame member via other adhesive sheets such as dicing tape and stretch tape.
框架構件,雖是環狀者、和非環狀(外周未連繋)者,但是圓形、橢圓形、三角形以上的多角形、其他的形狀也可以。The frame member may be annular or non-annular (not connected at the outer circumference), but may also be circular, elliptical, a polygon larger than a triangle, or other shapes.
本發明的手段及過程,只要可達成所說明的那些手段及過程動作、功能或是過程的話,沒有任何限定,更不用說,完全不限定於前述實施方式所示的一實施方式的構成物和過程。例如,剝離過程,是從被黏附體將黏著薄片剝離的過程的話,任何的過程也可以,與申請日當時的技術常識相比對,在其技術範圍內的話,無任何限定(其他的手段及過程也相同)。The means and processes of the present invention are not limited in any way as long as they can achieve the described means and process actions, functions or processes, and are not limited to the components and processes of one embodiment shown in the above-mentioned embodiment. For example, if the peeling process is a process of peeling the adhesive sheet from the adherend, any process is acceptable, and there is no limitation if it is within the technical scope compared with the technical common sense at the time of the application (the same applies to other means and processes).
黏著薄片AS、剝離用膠帶PT及被黏附體WK的材質、種別、形狀等,也無特別限定。例如,黏著薄片AS及被黏附體WK,是圓形、橢圓形、三角形和四角形等的多角形、其他的形狀也可以,黏著薄片AS,是感壓黏著性、感熱黏著性等的黏著形態者也可以。且,這種黏著薄片AS,是例如:只有黏著劑層的單層者、在基材及黏著劑層之間具有中間層者、在基材的上面具有蓋層的等3層以上者,進一步,可以將基材從黏著劑層剝離的雙面黏著薄片者也可以,雙面黏著薄片,是具有單層或是複層的中間層者、和無中間層的單層或是複層者也可以。且,被黏附體WK,是例如,食品、樹脂容器、矽半導體晶圓和化合物半導體晶圓等的半導體晶圓、電路基板、光碟片等的資訊記錄基板、玻璃板、鋼板、陶器、木板或是樹脂等的單體物也可以,由那些2個以上形成的複合物也可以,任意的形態的構件和物品等皆可以作為對象。又,黏著薄片AS,是換成功能性、用途的記載方式,例如,資訊記載用標籤、裝飾用標籤、保護薄片、切割膠帶、晶片固定片、黏晶膠帶、記錄層形成樹脂薄片等的任意的薄片、薄膜、膠帶等也可以。The materials, types, shapes, etc. of the adhesive sheet AS, the peeling tape PT, and the adherend WK are not particularly limited. For example, the adhesive sheet AS and the adherend WK may be circular, elliptical, triangular, quadrilateral, or other polygonal shapes, and the adhesive sheet AS may be a pressure-sensitive adhesive, a heat-sensitive adhesive, or other adhesive form. Furthermore, this adhesive sheet AS may be, for example, a single-layered sheet having only an adhesive layer, a sheet having an intermediate layer between the substrate and the adhesive layer, a sheet having three or more layers, etc. Furthermore, it may be a double-sided adhesive sheet from which the substrate can be peeled off from the adhesive layer. The double-sided adhesive sheet may be a single-layered or multiple-layered intermediate layer, or a single-layered or multiple-layered adhesive sheet without an intermediate layer. Furthermore, the adherend WK may be, for example, a food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer and a compound semiconductor wafer, a circuit substrate, an information recording substrate such as an optical disk, a glass plate, a steel plate, a ceramic, a wood board, or a resin, or a composite formed of two or more of these, or any form of components and articles. Furthermore, the adhesive sheet AS may be any sheet, film, tape, etc., which is changed into a recording method with functionalities and uses, for example, an information recording label, a decorative label, a protective sheet, a dicing tape, a chip fixing sheet, a die bonding tape, a recording layer forming resin sheet, etc.
前述實施方式的驅動機器,可以採用:轉動馬達、直線馬達、線性馬達、單軸機械手臂、具備2軸或是3軸以上的關節的多關節機械手臂等的電動機器、氣壓缸、油壓缸、無桿壓缸及旋轉壓缸等的致動器等,且將那些直接或是間接地組合者也可以。The driving machine of the above-mentioned embodiment can adopt: electric machines such as rotary motors, linear motors, linear motors, single-axis robots, multi-joint robots with 2-axis or 3-axis joints, pneumatic cylinders, hydraulic cylinders, rodless cylinders and rotary cylinders, etc., and those can be directly or indirectly combined.
在前述實施方式中,採用滾子等的旋轉構件的情況時,具備將該旋轉構件旋轉驅動的驅動機器也可以,將旋轉構件的表面和旋轉構件本身由橡膠和樹脂等的可變形的構件構成也可以,將旋轉構件的表面和旋轉構件本身由不會變形的構件構成也可以,可取代滾子而採用旋轉或是不旋轉的軸和葉片等的其他的構件也可以。採用將推壓滾子和推壓頭等的推壓手段和推壓構件的被推壓物進行推壓的情況時,可取代或是併用上述例示者,採用滾子、圓棒、葉片材、橡膠、樹脂、海綿等的構件,或採用藉由大氣和氣體等的氣體的吹附而推壓的結構也可以,推壓者是由橡膠和樹脂等的可變形的構件構成也可以,由不變形的構件構成也可以。採用將支撐(保持)手段和支撐(保持)構件等的被支撐構件(被保持構件)支撐(保持)者的情況時,採用由機械挾盤和夾持筒等的把持手段、庫侖力、黏著劑(黏著薄片、黏著膠帶)、黏接劑(黏接薄片、黏膠帶)、磁力、柏努利吸附、吸引吸附、驅動機器等將被支撐構件支撐(保持)的結構也可以。採用切斷手段和切斷構件等的將被切斷構件切斷或是在被切斷構件形成切入和切斷線的者的情況時,可取代或是併用上述例示者,採用由裁刀、雷射裁刀、離子束、火力、熱、水壓、電熱線、氣體和液體等的吹附等進行切斷,或藉由移動被組合了適宜的驅動機器而成的切斷者進行切斷也可以。In the above-mentioned embodiment, when a rotating component such as a roller is used, a driving machine for driving the rotating component to rotate may be provided, the surface of the rotating component and the rotating component itself may be composed of deformable components such as rubber and resin, the surface of the rotating component and the rotating component itself may be composed of non-deformable components, and other components such as rotating or non-rotating shafts and blades may be used instead of rollers. When pushing is performed by using a pushing means such as a pushing roller and a pushing head and a pushed object of a pushing component, the above-mentioned examples may be replaced or used in combination with components such as rollers, round bars, leaf materials, rubber, resin, sponges, etc., or a structure in which pushing is performed by blowing gas such as air and gas may be adopted. The pusher may be composed of a deformable component such as rubber and resin, or may be composed of a non-deformable component. In the case of using a supporting (holding) means and a supporting (holding) member to support (hold) a supported member (held member), a structure in which the supported member is supported (held) by a holding means such as a mechanical chuck and a clamping cylinder, Coulomb force, an adhesive (adhesive sheet, adhesive tape), an adhesive (adhesive sheet, adhesive tape), a magnetic force, Bernoulli adsorption, suction adsorption, a driving mechanism, etc. may be used. In the case of using cutting means and cutting members to cut the member to be cut or forming an incision and cutting line in the member to be cut, the above-mentioned examples can be replaced or used in combination with cutting by a cutter, a laser cutter, an ion beam, fire, heat, water pressure, an electric heating wire, blowing of gas and liquid, etc., or by moving a cutter combined with an appropriate driving machine.
10:彈性復原力減弱手段
10A:彈性復原力減弱手段
10B:彈性復原力減弱手段
11:多關節機械手臂
11A:前端臂
12:切斷刀片
13:轉動馬達
13A:輸出軸
14:磨削手段
20:剝離手段
21:吐出手段
21A:支撐滾子
21B:導引滾子
21C:線性馬達
21D:滑件
21E:滑動托板
21F:直線馬達
21G:輸出軸
21H:推滾子
21J:把持爪
21K:夾持筒
22:推壓手段
22A,23A:直線馬達
22B:輸出軸
22C:加熱手段
22D:推壓頭
23:切斷手段
23A:直線馬達
23B:輸出軸
23C:切斷刀片
24:線性馬達
24A:滑件
30:支撐手段
31:載置台
31A:支撐面
203:載置台
AS:黏著薄片
AS1:剝離開始部
ASR:曲折部
ASR1:曲折部
ASR2:曲折部
DC:溝
EA:薄片剝離裝置
F:保護薄片
PT:剝離用膠帶
W:半導體晶圓
WK:被黏附體10: Elastic restoring force weakening means
10A: Elastic restoring force weakening means
10B: Elastic restoring force weakening means
11:
[第1A圖],是本發明的一實施方式的薄片剝離裝置的說明圖。 [第1B圖],是本發明的一實施方式的薄片剝離裝置的說明圖。 [第1C圖],是本發明的一實施方式的薄片剝離裝置的說明圖。 [第1D圖],是本發明的變形例的說明圖。 [第1E圖],是本發明的變形例的說明圖。[Figure 1A] is an explanatory diagram of a sheet peeling device of an embodiment of the present invention. [Figure 1B] is an explanatory diagram of a sheet peeling device of an embodiment of the present invention. [Figure 1C] is an explanatory diagram of a sheet peeling device of an embodiment of the present invention. [Figure 1D] is an explanatory diagram of a modified example of the present invention. [Figure 1E] is an explanatory diagram of a modified example of the present invention.
10:彈性復原力減弱手段 10: Measures to reduce elastic resilience
10A:彈性復原力減弱手段 10A: Elastic resilience reduction measures
11:多關節機械手臂 11: Multi-joint robotic arm
11A:前端臂 11A: Front arm
12:切斷刀片 12: Cutting blade
20:剝離手段 20: Divorce means
21:吐出手段 21: Spitting method
21A:支撐滾子 21A: Support roller
21B:導引滾子 21B: Guide roller
21C:線性馬達 21C: Linear Motor
21D:滑件 21D: Slide
21E:滑動托板 21E: Sliding pallet
21F:直線馬達 21F: Linear Motor
21G:輸出軸 21G: Output shaft
21H:推滾子 21H: Push the roller
21J:把持爪 21J: Gripping claws
21K:夾持筒 21K: Clamping tube
22:推壓手段 22: Pushing method
22A:直線馬達 22A: Linear Motor
22B:輸出軸 22B: Output shaft
22C:加熱手段 22C: Heating method
22D:推壓頭 22D: Pushing head
23:切斷手段 23: Cut-off means
23A:直線馬達 23A: Linear Motor
23B:輸出軸 23B: Output shaft
23C:切斷刀片 23C: Cutting blade
24:線性馬達 24: Linear Motor
24A:滑件 24A: Slider
30:支撐手段 30: Supporting means
31:載置台 31: Loading platform
31A:支撐面 31A: Support surface
AS:黏著薄片 AS: Adhesive Sheet
AS1:剝離開始部 AS1: Peel off the start part
EA:薄片剝離裝置 EA: Flake stripping device
PT:剝離用膠帶 PT: Peeling tape
WK:被黏附體 WK: Adhesion
Claims (2)
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| JP2020-034740 | 2020-03-02 | ||
| JP2020034740A JP7463131B2 (en) | 2020-03-02 | 2020-03-02 | Sheet peeling method and sheet peeling device |
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| TW202139278A TW202139278A (en) | 2021-10-16 |
| TWI877313B true TWI877313B (en) | 2025-03-21 |
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|---|---|
| JP (1) | JP7463131B2 (en) |
| KR (1) | KR102813013B1 (en) |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011018678A (en) * | 2009-07-07 | 2011-01-27 | Lintec Corp | Apparatus and method for peeling sheet |
| JP2011114271A (en) * | 2009-11-30 | 2011-06-09 | Lintec Corp | Bonding sheet for processing semiconductor wafer and method for processing semiconductor wafer employing the sheet |
| JP2011114270A (en) * | 2009-11-30 | 2011-06-09 | Lintec Corp | Sheet peeling device, and sheet peeling method |
| JP2019186488A (en) * | 2018-04-16 | 2019-10-24 | 株式会社ディスコ | Wafer processing method |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100378571B1 (en) * | 2000-11-08 | 2003-03-31 | 앰코 테크놀로지 코리아 주식회사 | Method for detaching mounting tape of wafer |
| JP2004079743A (en) * | 2002-08-16 | 2004-03-11 | Nec Kansai Ltd | Adhesive tape for protecting surface of semiconductor substrate and peeling method therefor |
| JP2010021344A (en) * | 2008-07-10 | 2010-01-28 | Disco Abrasive Syst Ltd | Protective tape and method of grinding wafer |
| JP5421749B2 (en) | 2009-11-30 | 2014-02-19 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5421747B2 (en) | 2009-11-30 | 2014-02-19 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5421748B2 (en) | 2009-11-30 | 2014-02-19 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5352438B2 (en) | 2009-11-30 | 2013-11-27 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5534594B2 (en) * | 2010-03-30 | 2014-07-02 | リンテック株式会社 | Sheet sticking method and wafer processing method |
| JP5921473B2 (en) * | 2013-03-21 | 2016-05-24 | 株式会社東芝 | Manufacturing method of semiconductor device |
| JP6449024B2 (en) | 2015-01-22 | 2019-01-09 | 株式会社ディスコ | Protective member peeling method and peeling device |
| JP6938261B2 (en) * | 2017-07-21 | 2021-09-22 | 株式会社ディスコ | Wafer processing method and cutting equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011018678A (en) * | 2009-07-07 | 2011-01-27 | Lintec Corp | Apparatus and method for peeling sheet |
| JP2011114271A (en) * | 2009-11-30 | 2011-06-09 | Lintec Corp | Bonding sheet for processing semiconductor wafer and method for processing semiconductor wafer employing the sheet |
| JP2011114270A (en) * | 2009-11-30 | 2011-06-09 | Lintec Corp | Sheet peeling device, and sheet peeling method |
| JP2019186488A (en) * | 2018-04-16 | 2019-10-24 | 株式会社ディスコ | Wafer processing method |
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| JP2021141096A (en) | 2021-09-16 |
| KR20210111166A (en) | 2021-09-10 |
| TW202139278A (en) | 2021-10-16 |
| JP7463131B2 (en) | 2024-04-08 |
| KR102813013B1 (en) | 2025-05-26 |
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