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TWI876761B - Conveying device and control method of conveying device - Google Patents

Conveying device and control method of conveying device Download PDF

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Publication number
TWI876761B
TWI876761B TW112148598A TW112148598A TWI876761B TW I876761 B TWI876761 B TW I876761B TW 112148598 A TW112148598 A TW 112148598A TW 112148598 A TW112148598 A TW 112148598A TW I876761 B TWI876761 B TW I876761B
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clamping
end effector
distance
sensors
light
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TW112148598A
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TW202524645A (en
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濱田浩三
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日商Jel股份有限公司
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Abstract

搬送機器人(1A)包含:具有複數個夾頭部(21)之末端執行器(20),複數個夾頭部(21)沿上下方向排列且分別對晶圓進行夾持;至少二個光電感測器(31),係以自複數個夾頭部(21)中之位於最上方的最上位夾頭部(21)至位於最下方之最下位夾頭部(21)的距離(D1)之一半以下的間距(P2)排列,在複數個夾頭部(21)之側方,對側方是否存在物體進行檢測;位置資料儲存部;控制部;以及運算部。The transport robot (1A) comprises: an end actuator (20) having a plurality of chuck parts (21), wherein the plurality of chuck parts (21) are arranged in an up-down direction and respectively chuck wafers; at least two photoelectric sensors (31) are arranged at a spacing (P2) less than half of the distance (D1) from the topmost chuck part (21) to the bottommost chuck part (21) of the plurality of chuck parts (21), and detect whether there are objects on the sides of the plurality of chuck parts (21); a position data storage unit; a control unit; and a calculation unit.

Description

搬送裝置及搬送裝置之控制方法Conveying device and control method of conveying device

本發明係關於一種搬送裝置以及搬送裝置之控制方法。 The present invention relates to a conveying device and a control method of the conveying device.

以往,已知一種包含複數個夾頭部以對複數個基板成批地進行搬送之搬送裝置。在此種搬送裝置中,有為了利用夾頭部在不使基板破損之情況下對基板進行夾持,而對夾頭部或基板之高度進行測定者。 In the past, there is a known conveying device that includes a plurality of chucks for conveying a plurality of substrates in batches. In such a conveying device, there is a device that measures the height of the chuck or substrate in order to clamp the substrate without damaging the substrate using the chuck.

例如,在專利文獻1中揭示了一種搬送裝置,其包含:設置於搬送裝置主體與收容基板之卡式盒之間並利用升降機構進行升降之基底;設置於基底上並藉由基底之升降而測定卡式盒內的複數個基板各自之高度的感測器;以及基於感測器所測定之基板的高度而調整夾頭部之高度的致動器。 For example, Patent Document 1 discloses a transport device, which includes: a base disposed between the transport device body and a cassette containing substrates and lifted and lowered by a lifting mechanism; a sensor disposed on the base and measuring the height of each of a plurality of substrates in the cassette by lifting and lowering the base; and an actuator that adjusts the height of the chuck head based on the height of the substrate measured by the sensor.

另外,在專利文獻2中揭示了一種搬送裝置,其包含:分別具有升降墊且利用升降墊來夾持基板之複數個夾頭部;以及使感測器升降之升降機構,該感測器對收容於卡式盒中之基板進行檢測。專利文獻2所記載之搬送裝置係利用升降機構使感測器升降,藉此不僅對基板進行檢測,亦對升降墊是否為所期望之升降狀態而進行檢測。 In addition, Patent Document 2 discloses a transport device, which includes: a plurality of clamping heads each having a lifting pad and using the lifting pad to clamp a substrate; and a lifting mechanism for lifting a sensor, which detects the substrate contained in the cassette. The transport device described in Patent Document 2 uses a lifting mechanism to lift the sensor, thereby not only detecting the substrate, but also detecting whether the lifting pad is in the desired lifting state.

[先前技術文獻] [Prior Art Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特開第2004-22807號公報 [Patent document 1] Japanese Patent Publication No. 2004-22807

[專利文獻2]日本專利特開第2017-224658號公報 [Patent Document 2] Japanese Patent Publication No. 2017-224658

在專利文獻1所記載之搬送裝置中,升降機構係使基底升降,藉此使感測器升降。因此,為了測定在卡式盒內之複數個基板全部的高度,需要使感測器升降相當於自卡式盒之底至頂板之距離。其結果為,感測器之升降距離變大,導致測定花費時間。 In the transport device described in Patent Document 1, the lifting mechanism lifts the base, thereby lifting the sensor. Therefore, in order to measure the height of all the multiple substrates in the cassette, it is necessary to lift the sensor by a distance from the bottom of the cassette to the top plate. As a result, the lifting distance of the sensor becomes larger, causing the measurement to take time.

另外,在專利文獻2所記載之搬送裝置中,為了對全部夾頭部之升降墊的升降狀態以及基板之有無進行檢測,亦需要在夾頭部進入卡式盒內之狀態下,使感測器升降相當於:自處於卡式盒之最下層之基板下方的位於最下方之夾頭部至處於卡式盒之最上層之基板上方的距離。其結果為,感測器之升降距離變大,導致測定花費時間。 In addition, in the conveying device described in Patent Document 2, in order to detect the lifting status of the lifting pads of all the chuck parts and the presence or absence of the substrate, it is also necessary to lift the sensor by a distance equivalent to: from the lowest chuck part below the substrate at the bottom layer of the chuck to the top of the substrate at the top layer of the chuck when the chuck part enters the cassette. As a result, the lifting distance of the sensor becomes larger, causing the measurement to take time.

本發明係為用於解決該課題而成者,其目的在於提供一種搬送裝置以及搬送裝置之控制方法,可在短時間內檢測出對基板進行夾持之夾頭部各自的高度是否有異常。 This invention is designed to solve this problem. Its purpose is to provide a conveying device and a control method for the conveying device, which can detect whether the height of each clamping head for clamping the substrate is abnormal in a short time.

為了達成上述目的,本發明之第一觀點之搬送裝置之特徵在於包含:末端執行器,具有沿上下方向排列且分別夾持基板之複數個夾頭部;至少二個第一感測器,係以自該複數個夾頭部中之位於最上方的最上位夾頭部至位於最下方之最下位夾頭部的距離之一半以下的間距排列,在 該複數個夾頭部之側方,對側方是否存在物體進行檢測;位置資料儲存部,儲存有資料庫,該資料庫保存有該複數個夾頭部各自之正常上下方向位置的資料;控制部,在使該最下位夾頭部位於第一基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器上升至少相當於該間距,該第一基準位置係比該至少二個第一感測器中之位於最下方的第一感測器低了相當於該間距,或者在使該最上位夾頭部位於第二基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器下降至少相當於該間距,該第二基準位置係比該至少二個第一感測器中之位於最上方的第一感測器高了相當於該間距;以及運算部,在使該末端執行器相對於該至少二個第一感測器而上升或下降之期間,自該控制部獲取該末端執行器從該第一基準位置或該第二基準位置相對移動之移動距離的資料,並且自該至少二個第一感測器獲取檢測資料,基於所獲取之移動距離的資料與該檢測資料,運算各該夾頭部之上下方向的位置,進而根據該位置資料儲存部中所儲存之資料庫與所運算出之各該上下方向的位置,運算各該夾頭部之從正常上下方向的位置起算之偏離量,並基於所運算出之偏離量求出該複數個夾頭部各自有無異常。 In order to achieve the above-mentioned purpose, the conveying device of the first aspect of the present invention is characterized by comprising: an end actuator having a plurality of clamping heads arranged in the vertical direction and clamping the substrates respectively; at least two first sensors arranged at a distance less than half of the distance from the topmost clamping head located at the top to the bottommost clamping head located at the bottom of the plurality of clamping heads, and detecting whether there is an object on the side of the plurality of clamping heads; position data A storage unit stores a database, wherein the database stores data of normal vertical positions of the plurality of chuck units; a control unit causes the end actuator to rise relative to the at least two first sensors by at least the distance when the lowest chuck unit is at a first reference position, wherein the first reference position is lower than the lowest first sensor of the at least two first sensors by the distance, or when the highest chuck unit is at a first reference position. The end effector is caused to descend relative to the at least two first sensors by at least the distance in a state of the second reference position, the second reference position being higher than the first sensor located at the top of the at least two first sensors by the distance; and the calculation unit obtains from the control unit the relative movement of the end effector from the first reference position or the second reference position during the period of ascending or descending the end effector relative to the at least two first sensors. The moving distance data is obtained, and the detection data is obtained from the at least two first sensors. Based on the obtained moving distance data and the detection data, the vertical position of each of the chuck parts is calculated. Then, according to the database stored in the position data storage unit and the calculated vertical positions, the deviation of each of the chuck parts from the normal vertical position is calculated, and based on the calculated deviation, whether each of the plurality of chuck parts is abnormal is determined.

該間距可與該最上位夾頭部至該最下位夾頭部之距離除以該第一感測器之個數而得之長度相同。 The spacing may be the same as the length obtained by dividing the distance from the uppermost clamp head to the lowermost clamp head by the number of the first sensors.

搬送裝置可更包含:基底,對該末端執行器以使其能夠進退之方式支撐;以及支柱,設置於該基底上,從與進退方向及上下方向垂直的方向之側而 在相鄰於該末端執行器進退之進退路徑的位置,對該至少二個第一感測器進行支撐。 The conveying device may further include: a base, which supports the end effector in a manner that enables it to move forward and backward; and a support, which is arranged on the base and supports the at least two first sensors from the side in a direction perpendicular to the forward and backward direction and the up and down direction and at a position adjacent to the forward and backward path of the end effector.

該資料庫中所保存之各該夾頭部之正常上下方向的位置可為該夾頭部之尖端部的位置,該至少二個第一感測器可在該複數個夾頭部之尖端部的側方,對側方是否存在物體進行檢測,該運算部可基於該資料庫、所獲取之移動距離的資料及該檢測資料,運算該複數個夾頭部之各該尖端部相對於正常上下方向的位置在上下方向上之偏離量,進而判定所運算出之各該尖端部之偏離量是否超過第一容許值,在該運算部判定各該尖端部之偏離量之至少一者超過該第一容許值的情況下,該控制部可使該末端執行器之移動停止。 The normal up-down position of each of the chuck parts stored in the database may be the position of the tip of the chuck part. The at least two first sensors may detect whether there is an object on the side of the tip of the plurality of chuck parts. The calculation unit may calculate the deviation of each of the tip of the plurality of chuck parts in the up-down direction relative to the normal up-down position based on the database, the obtained moving distance data and the detection data, and further determine whether the calculated deviation of each of the tip exceeds the first allowable value. When the calculation unit determines that at least one of the deviations of each of the tip exceeds the first allowable value, the control unit may stop the movement of the end effector.

該搬送裝置可更包含:警告裝置,在該運算部判定各該尖端部之偏離量之至少一者超過該第一容許值的情況下,該警告裝置係警告有異常。 The conveying device may further include: a warning device, which warns of an abnormality when the calculation unit determines that at least one of the deviation amounts of each of the tip portions exceeds the first allowable value.

該資料庫中所保存之各該夾頭部之正常上下方向的位置可為該夾頭部之尖端部的位置,該至少二個第一感測器可在該複數個夾頭部之尖端部的側方,對側方是否存在物體進行檢測,該運算部可基於該資料庫、所獲取之移動距離的資料及該檢測資料,運算該複數個夾頭部之各該尖端部相對於正常上下方向的位置在上下方向上之偏離量,根據所運算出之該偏離量來運算該複數個夾頭部各自相對於 水平方向之傾斜角,進而判定所運算出之該複數個夾頭部各自的傾斜角是否超過第二容許值,在該運算部判定該複數個夾頭部各自的傾斜角之至少一者超過該第二容許值的情況下,該控制部可使該末端執行器之移動停止。 The normal up-down position of each of the clip parts stored in the database may be the position of the tip of the clip part. The at least two first sensors may be located on the side of the tip of the plurality of clip parts to detect whether there is an object on the side. The calculation unit may calculate the position of each of the tip of the plurality of clip parts relative to the normal up-down direction based on the database, the obtained moving distance data and the detection data. The calculation unit calculates the deviation amount in the vertical direction, and calculates the tilt angle of each of the plurality of chuck parts relative to the horizontal direction according to the calculated deviation amount, and then determines whether the calculated tilt angle of each of the plurality of chuck parts exceeds the second allowable value. When the calculation unit determines that at least one of the tilt angles of each of the plurality of chuck parts exceeds the second allowable value, the control unit can stop the movement of the end effector.

在該位置資料儲存部中可儲存有該基板之厚度資料,該運算部可基於所獲取之移動距離的資料與該檢測資料,運算各該夾頭部之上下方向的位置,進而基於該位置資料儲存部中所儲存之資料庫、該基板之厚度資料及所運算出之該上下方向的位置,判定該複數個夾頭部各自是否夾持有該基板。 The thickness data of the substrate can be stored in the position data storage unit, and the calculation unit can calculate the vertical position of each chuck unit based on the obtained moving distance data and the detection data, and then determine whether each of the multiple chuck units clamps the substrate based on the database stored in the position data storage unit, the thickness data of the substrate and the calculated vertical position.

該末端執行器可具有夾緊部,該夾緊部在該複數個夾頭部各自夾持該基板之情況下自側面側成批地夾緊該基板,該控制部在該等夾頭部之全部或一部分夾持該基板之情況下,可使該夾緊部夾緊該基板,且保持該基板被該夾緊部夾緊之狀態,在使該最下位夾頭部位於該第一基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器上升至少相當於該間距,或者在使該最上位夾頭部位於該第二基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器下降至少相當於該間距。 The end effector may have a clamping part, and the clamping part clamps the substrate in batches from the side when the plurality of clamping parts clamp the substrate respectively. When all or part of the clamping parts clamp the substrate, the control part may clamp the substrate by the clamping part and keep the substrate clamped by the clamping part, and when the lowermost clamping part is in the first reference position, the end effector is raised relative to the at least two first sensors by at least the distance, or when the uppermost clamping part is in the second reference position, the end effector is lowered relative to the at least two first sensors by at least the distance.

該搬送裝置可更包含:基底,對該末端執行器以使其能夠進退之方式支撐;第一移動機構,對該基底進行支撐,並且能夠沿與該末端執行器之進退方向及上下方向垂直的方向移動;支撐體,對該第一移動機構以使其能夠移動之方式支撐;以及 第二感測器,設置於該基底上,檢測該基底相對於該支撐體之上表面的進退方向上的傾斜,在該第二感測器之輸出超過第三容許值的情況下,該運算部判定該基底相對於該支撐體的進退方向上的傾斜有異常,在該運算部判定在進退方向上的傾斜有異常的情況下,該控制部可使該末端執行器之移動停止。 The conveying device may further include: a base, which supports the end effector in a manner that enables it to move forward and backward; a first moving mechanism, which supports the base and can move in a direction perpendicular to the forward and backward direction and the up and down direction of the end effector; a support body, which supports the first moving mechanism in a manner that enables it to move; and a second sensor, which is disposed on the base and detects the inclination of the base in the forward and backward direction relative to the upper surface of the support body. When the output of the second sensor exceeds a third allowable value, the operation unit determines that the inclination of the base in the forward and backward direction relative to the support body is abnormal. When the operation unit determines that the inclination in the forward and backward direction is abnormal, the control unit may stop the movement of the end effector.

該第二感測器可具有:發光部,設置於該基底上,向該進退方向射出光;受光部,設置於該基底上,與該發光部在該進退方向上相向而接受該發光部之光,並對所接受之光的量進行測定;以及遮光板,設置於該支撐體上,自該支撐體向該發光部與該受光部之間延伸而遮擋該發光部之光的一部分,在該基底相對於該支撐體的進退方向上的傾斜發生變化的情況下,相對於該發光部及該受光部之該遮光板的位置可發生變化,從而遮擋該發光部之光的量可發生變化,該運算部可在該受光部所測定之光量之變化超過該第三容許值的情況下,判定該基底相對於該支撐體的進退方向上的傾斜有異常。 The second sensor may include: a light-emitting portion, which is disposed on the substrate and emits light in the advancing and retreating direction; a light-receiving portion, which is disposed on the substrate and faces the light-emitting portion in the advancing and retreating direction and receives the light from the light-emitting portion and measures the amount of the received light; and a light shielding plate, which is disposed on the supporting body and extends from the supporting body to between the light-emitting portion and the light-receiving portion to shield a part of the light from the light-emitting portion. When the inclination of the base relative to the support body in the advancing and retreating direction changes, the position of the light shielding plate relative to the light emitting part and the light receiving part may change, thereby the amount of light shielding the light emitting part may change. When the change of the light amount measured by the light receiving part exceeds the third allowable value, the calculation unit may determine that the inclination of the base relative to the support body in the advancing and retreating direction is abnormal.

該搬送裝置可更包含:第一馬達,對第二移動機構進行驅動,該第二移動機構係使該末端執行器進退;以及第二馬達,對第三移動機構進行驅動,該第三移動機構係使該第二移動機構升降, 該運算部可分別自該第一馬達與該第二馬達獲取轉矩值之資料,並判定所獲取之該第一馬達之轉矩值是否超過第一閾值,進而判定所獲取之該第二馬達之轉矩值是否超過第二閾值,在該運算部判定該第一馬達之轉矩值超過第一閾值的情況下,該控制部可使該第一馬達停止,或者在該運算部判定該第二馬達之轉矩值超過第二閾值的情況下,該控制部可使該第二馬達停止。 The conveying device may further include: a first motor driving a second moving mechanism, the second moving mechanism causing the end effector to move forward and backward; and a second motor driving a third moving mechanism, the third moving mechanism causing the second moving mechanism to move up and down. The calculation unit may obtain torque value data from the first motor and the second motor respectively, and determine whether the torque value of the first motor obtained exceeds a first threshold value, and further determine whether the torque value of the second motor obtained exceeds a second threshold value. If the calculation unit determines that the torque value of the first motor exceeds the first threshold value, the control unit may stop the first motor, or if the calculation unit determines that the torque value of the second motor exceeds the second threshold value, the control unit may stop the second motor.

本發明之第二觀點之搬送裝置之控制方法係為如下搬送裝置之控制方法,該搬送裝置包含:末端執行器,具有沿上下方向排列且分別夾持基板之複數個夾頭部;以及至少二個第一感測器,係以自該複數個夾頭部中之位於最上方的最上位夾頭部至位於最下方之最下位夾頭部的距離之一半以下的間距排列,在該複數個夾頭部之側方,對側方是否存在物體進行檢測,該搬送裝置之控制方法之特徵在於包含如下步驟:在使該最下位夾頭部位於第一基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器上升至少相當於該間距的步驟,該第一基準位置係比該至少二個第一感測器中之位於最下方的第一感測器低了相當於該間距,或者在使該最上位夾頭部位於第二基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器下降至少相當於該間距的步驟,該第二基準位置係比該至少二個第一感測器中之位於最上方的第一感測器高了相當於該間距; 在執行使該末端執行器相對於該至少二個第一感測器上升或下降之步驟之期間,獲取該末端執行器從該第一基準位置或該第二基準位置相對移動之移動距離的資料,並且自該至少二個第一感測器獲取檢測資料的步驟;基於所獲取之移動距離的資料與該檢測資料,運算各該夾頭部之上下方向的位置,進而根據保存該複數個夾頭部各自之正常上下方向的位置之資料的資料庫與所運算出之各該上下方向的位置,運算各該夾頭部之從正常上下方向的位置起算之偏離量,並基於所運算出之偏離量求出該複數個夾頭部各自有無異常的步驟;以及在該複數個夾頭部之至少一者有異常的情況下,使該末端執行器之移動停止的步驟。 The control method of the conveying device of the second aspect of the present invention is a control method of the conveying device as follows, the conveying device comprises: an end actuator, having a plurality of clamping heads arranged in the up-down direction and clamping the substrates respectively; and at least two first sensors, arranged at a distance less than half of the distance from the topmost clamping head at the top to the bottommost clamping head at the bottom of the plurality of clamping heads, on the sides of the plurality of clamping heads, to detect whether there are objects on the sides, the conveying device comprises: an end actuator, having a plurality of clamping heads arranged in the up-down direction and clamping the substrates respectively; and at least two first sensors, arranged at a distance less than half of the distance from the topmost clamping head at the top to the bottommost clamping head at the bottom of the plurality of clamping heads, on the sides of the plurality of clamping heads, to detect whether there are objects on the sides, The control method of the device is characterized in that it includes the following steps: when the lowermost clamping head is in a first reference position, the end actuator is raised relative to the at least two first sensors by at least the distance, and the first reference position is lower than the lowermost first sensor of the at least two first sensors by the distance, or when the uppermost clamping head is in a second reference position, the end actuator is lowered relative to the at least two first sensors to The second reference position is higher than the uppermost first sensor of the at least two first sensors by a distance equal to the distance; During the step of raising or lowering the end actuator relative to the at least two first sensors, data of the movement distance of the end actuator relative to the first reference position or the second reference position is obtained, and detection data is obtained from the at least two first sensors; based on the obtained movement distance data and the at least two first sensors, Detecting data, calculating the up-down position of each of the chuck parts, and then calculating the deviation of each of the chuck parts from the normal up-down position based on the database storing the data of the normal up-down position of each of the chuck parts and the calculated up-down position, and determining whether each of the chuck parts has an abnormality based on the calculated deviation; and stopping the movement of the end effector when at least one of the chuck parts has an abnormality.

根據本發明之結構,控制部係使末端執行器相對於至少二個第一感測器上升或下降相當於至少二個第一感測器排列之間距。而且,運算部係使用末端執行器從第一基準位置或第二基準位置相對移動之移動距離的資料以及至少二個第一感測器之檢測資料,求出複數個夾頭部各自有無異常,前述移動距離的資料及第一感測器之檢測資料係在使末端執行器相對於至少二個第一感測器上升或下降之期間獲取的。在本發明中,無需使末端執行器上升或下降相當於最上位夾頭部至最下位夾頭部之距離,只要使末端執行器上升或下降相當於至少二個第一感測器排列之間距即可,因此可在短時間內檢測出各夾頭部之高度是否有異常。 According to the structure of the present invention, the control unit causes the end effector to rise or fall relative to at least two first sensors by a distance equal to the arrangement distance of the at least two first sensors. Furthermore, the calculation unit uses the data of the movement distance of the end effector relative to the first reference position or the second reference position and the detection data of at least two first sensors to determine whether each of the plurality of chuck parts has abnormalities, and the aforementioned movement distance data and the detection data of the first sensors are obtained during the period of causing the end effector to rise or fall relative to the at least two first sensors. In the present invention, it is not necessary to raise or lower the end effector to a distance equal to the distance between the uppermost clamping head and the lowermost clamping head. It is sufficient to raise or lower the end effector to a distance equal to the distance between at least two first sensors. Therefore, it is possible to detect whether the height of each clamping head is abnormal in a short time.

1A,1B:搬送機器人 1A, 1B: Transport robots

2:搬送系統 2: Transport system

3:FOUP 3:FOUP

4:裝載埠 4: Loading port

10:機器人主體 10: Robot subject

11:第一直動機構 11: The first straight-acting mechanism

12:第二直動機構 12: Second direct-acting mechanism

15:框體 15: Frame

20:末端執行器 20: End effector

21:夾頭部 21: Clip head

30:框架 30: Framework

31:光電感測器(第一感測器) 31: Photosensor (first sensor)

32,33:支柱 32,33: Pillars

34,35:樑構件 34,35: beam components

40:控制器 40: Controller

41:處理器 41: Processor

42:記憶體 42: Memory

43:介面 43: Interface

44:匯流排 44: Bus

45:顯示裝置(警告裝置) 45: Display device (warning device)

46:控制部 46: Control Department

47:運算部 47: Operation Department

50:夾緊部 50: Clamping part

60:基底 60: Base

61:傾斜檢測感測器 61: Tilt detection sensor

62:支撐框架 62: Support frame

63:第三直動機構 63: The third direct-acting mechanism

64:第三滑動件(第一移動機構) 64: Third sliding member (first moving mechanism)

65:架台(支撐體) 65: Stand (support body)

111:第一滑動件(第二移動機構) 111: First sliding member (second moving mechanism)

112:馬達(驅動部) 112: Motor (drive unit)

113:線性導軌 113: Linear guide rails

121:第二滑動件(第三移動機構) 121: Second sliding member (third moving mechanism)

122:馬達(驅動部) 122: Motor (drive unit)

211,212:握持爪 211,212: Gripping claws

213,214:支撐銷 213,214: Support pin

421:位置資料儲存部 421: Location data storage unit

422:判定參數儲存部 422: Judgment parameter storage unit

611:發光部 611: Illumination Department

612:受光部 612: Light receiving part

613:遮光板 613: Sunshade

D1:距離 D1: Distance

D2:直徑 D2: Diameter

L1:長度 L1: Length

P1,P2:間距 P1, P2: spacing

S1,S2,S3,S4,S5:步驟 S1,S2,S3,S4,S5: Steps

T1,T2:厚度 T1, T2: thickness

VIII:區域 VIII: Region

W:晶圓(基板) W: Wafer (substrate)

X,Y,Z:方向 X,Y,Z: Direction

Y1:位置 Y1: Location

Z1:座標 Z1: coordinates

第1圖係為本發明之實施態樣1之搬送機器人的透視圖。 Figure 1 is a perspective view of the transport robot of embodiment 1 of the present invention.

第2圖係為組入有實施態樣1之搬送機器人之搬送系統的左側視圖。 Figure 2 is a left side view of the transport system incorporating the transport robot of implementation example 1.

第3圖係為將實施態樣1之搬送機器人的包含末端執行器之前方部分放大後的右側視圖。 Figure 3 is an enlarged right side view of the front part of the transfer robot including the end effector of implementation example 1.

第4圖係為實施態樣1之搬送機器人所包含之控制器的硬體結構圖。 Figure 4 is a hardware structure diagram of the controller included in the transport robot of implementation example 1.

第5圖係為實施態樣1之搬送機器人所包含之控制器的方塊圖。 Figure 5 is a block diagram of the controller included in the transport robot of implementation example 1.

第6圖係為實施態樣1之搬送機器人所包含之控制器所進行的異常判定處理的流程圖。 Figure 6 is a flow chart of the abnormality determination process performed by the controller included in the transport robot of implementation example 1.

第7圖係為實施態樣2之搬送機器人所包含之控制器的方塊圖。 Figure 7 is a block diagram of the controller included in the transport robot of implementation example 2.

第8圖係為實施態樣2之搬送機器人所包含之基底及其附近的放大左側視圖。 Figure 8 is an enlarged left side view of the base and its vicinity included in the transfer robot of implementation mode 2.

以下,參照圖式對本發明實施態樣之搬送裝置以及搬送裝置之控制方法進行詳細說明。再者,圖中對相同或同等之部分係附註相同之符號。另外,在圖中所示之正交座標系統XYZ中,當將機器人主體之進退方向設為Y軸、將機器人主體之升降方向設為Z軸時,與Y軸及Z軸正交之方向係為X軸。以下,適宜地引用該座標系進行說明。 Hereinafter, the conveying device and the control method of the conveying device of the embodiment of the present invention are described in detail with reference to the drawings. Furthermore, the same symbols are attached to the same or equivalent parts in the drawings. In addition, in the orthogonal coordinate system XYZ shown in the drawings, when the forward and backward direction of the robot body is set to the Y axis and the lifting direction of the robot body is set to the Z axis, the direction orthogonal to the Y axis and the Z axis is the X axis. Hereinafter, the coordinate system is appropriately cited for description.

(實施態樣1) (Implementation Example 1)

實施態樣1之搬送裝置係為搬送機器人,該搬送機器人包含複數個夾 頭部以成批地搬送複數個基板。在該搬送機器人中,若夾頭部傾斜,則有時會使晶圓破損,因此亦包含檢測夾頭部有無傾斜之感測器及控制器。以下,以成批地搬送複數個晶圓之批量式搬送機器人為例,對實施態樣1之搬送裝置之結構進行說明。首先,參照第1圖及第2圖,對作為感測器之檢測對象及控制器之控制對象的搬送機器人的結構進行說明。 The transport device of implementation form 1 is a transport robot, which includes a plurality of grippers to transport a plurality of substrates in batches. In the transport robot, if the grippers are tilted, the wafer may be damaged, so a sensor and a controller for detecting whether the grippers are tilted are also included. The structure of the transport device of implementation form 1 is described below by taking a batch transport robot that transports a plurality of wafers in batches as an example. First, referring to Figures 1 and 2, the structure of the transport robot that is the detection object of the sensor and the control object of the controller is described.

第1圖係為實施態樣1之搬送機器人1A的透視圖。第2圖係為組入有搬送機器人1A之搬送系統2的左側視圖。再者,為了容易理解,第2圖示出在搬送系統2中載置搬送機器人1A與FOUP(front opening unified pod,前開式晶圓傳送盒)3的裝載埠4。另外,除示出外觀之外,亦一併示出內部結構。另外,在第1圖與第2圖中,示出夾持著晶圓W之搬送機器人1A。 FIG. 1 is a perspective view of the transport robot 1A of embodiment 1. FIG. 2 is a left side view of the transport system 2 in which the transport robot 1A is incorporated. Furthermore, for easy understanding, FIG. 2 shows the loading port 4 for placing the transport robot 1A and the FOUP (front opening unified pod) 3 in the transport system 2. In addition, in addition to showing the appearance, the internal structure is also shown. In addition, FIG. 1 and FIG. 2 show the transport robot 1A holding the wafer W.

如第1圖所示,搬送機器人1A係包含機器人主體10及末端執行器20,該末端執行器20安裝於機器人主體10且用於夾持晶圓W。 As shown in FIG. 1 , the transport robot 1A includes a robot body 10 and an end effector 20. The end effector 20 is mounted on the robot body 10 and is used to clamp the wafer W.

搬送機器人1A係為如下所述之機器人:從作為收容晶圓W之容器之一種的FOUP 3中將複數個晶圓W成批地取出,或者將複數個晶圓W成批地放入FOUP 3中。如第2圖所示,機器人主體10係具有第一直動機構11及第二直動機構12,第一直動機構11為了使末端執行器20在該FOUP 3中出入而使末端執行器20沿前後方向進行直線運動,第二直動機構12為了利用末端執行器20抬起或放下該FOUP 3內之晶圓W而使末端執行器20沿上下方向進行直線運動。 The transport robot 1A is a robot that takes out a plurality of wafers W in batches from a FOUP 3, which is a container for accommodating wafers W, or puts a plurality of wafers W in batches into a FOUP 3. As shown in FIG. 2, the robot body 10 has a first linear motion mechanism 11 and a second linear motion mechanism 12. The first linear motion mechanism 11 makes the end effector 20 move linearly in the front-back direction so that the end effector 20 can enter and exit the FOUP 3. The second linear motion mechanism 12 makes the end effector 20 move linearly in the up-down direction so that the end effector 20 can lift or lower the wafers W in the FOUP 3.

第一直動機構11係具有沿前後方向(即Y方向)延伸之圖未示出之滾珠螺桿(以下,稱為第一滾珠螺桿)、藉由第一滾珠螺桿之旋 轉而沿Y方向移動之第一滑動件111、以及使第一滾珠螺桿旋轉而使第一滑動件111往Y方向之位置移動的馬達112(亦稱為第一馬達)。在第一直動機構11中,後述之控制器係使馬達112往所期望之方向旋轉所期望之旋轉量,藉此使第一滑動件111往所期望之Y方向的位置移動。在該第一滑動件111之上面(即+Z側),搭載有第二直動機構12。 The first linear motion mechanism 11 has a ball screw (hereinafter referred to as the first ball screw) not shown in the figure extending in the front-rear direction (i.e., the Y direction), a first slider 111 that moves in the Y direction by the rotation of the first ball screw, and a motor 112 (also referred to as the first motor) that rotates the first ball screw to move the first slider 111 to a position in the Y direction. In the first linear motion mechanism 11, the controller described later rotates the motor 112 in the desired direction by the desired amount of rotation, thereby moving the first slider 111 to a desired position in the Y direction. The second linear motion mechanism 12 is mounted on the upper side (i.e., the +Z side) of the first slider 111.

第二直動機構12係具有沿上下方向(即Z方向)延伸且不同於第一滾珠螺桿之圖未示出的滾珠螺桿(以下,稱為第二滾珠螺桿)、藉由第二滾珠螺桿之旋轉而沿Z方向移動之第二滑動件121、以及使第二滾珠螺桿旋轉而使第二滑動件121往Z方向位置移動的馬達122(亦稱為第二馬達)。 The second direct-acting mechanism 12 has a ball screw (hereinafter referred to as the second ball screw) that is not shown in the figure and extends in the up-down direction (i.e., the Z direction) and is different from the first ball screw, a second sliding member 121 that moves in the Z direction by the rotation of the second ball screw, and a motor 122 (also referred to as the second motor) that rotates the second ball screw to move the second sliding member 121 to the Z direction position.

如第2圖所示,在第二直動機構12中,在第二滑動件121之前表面側(即+Y面側),固定有用於收容對夾緊部50進行驅動之設備、電線、管等之框體15。進而,在框體15之+Y面側安裝有末端執行器20。因此,當藉由上述之控制器對第一直動機構11之馬達112的旋轉進行控制而使第一直動機構11之第一滑動件111往所期望之Y方向的位置移動時,不僅第一滑動件111上所搭載之第二直動機構12移動,末端執行器20亦往所期望之Y方向的位置移動。 As shown in FIG. 2, in the second direct-acting mechanism 12, a frame 15 for accommodating equipment, wires, pipes, etc. for driving the clamping part 50 is fixed on the front surface side (i.e., +Y side) of the second slider 121. Furthermore, an end effector 20 is installed on the +Y side of the frame 15. Therefore, when the rotation of the motor 112 of the first direct-acting mechanism 11 is controlled by the above-mentioned controller to move the first slider 111 of the first direct-acting mechanism 11 to the desired Y direction position, not only the second direct-acting mechanism 12 carried on the first slider 111 moves, but also the end effector 20 moves to the desired Y direction position.

進而,在第二直動機構12中,控制器係使第二直動機構12之馬達122往所期望之方向旋轉所期望之旋轉量,藉此使第二滑動件121往所期望之Z方向的位置移動。在第二滑動件121上,經由框體15而安裝有末端執行器20,因此,當控制器使第二滑動件121往所期望之Z方向的位置移動時,末端執行器20亦往所期望之Z方向的位置移動。 Furthermore, in the second direct-acting mechanism 12, the controller causes the motor 122 of the second direct-acting mechanism 12 to rotate in the desired direction by the desired amount, thereby causing the second slider 121 to move to the desired position in the Z direction. The end effector 20 is mounted on the second slider 121 via the frame 15, so when the controller causes the second slider 121 to move to the desired position in the Z direction, the end effector 20 also moves to the desired position in the Z direction.

再者,第一滑動件111與第二滑動件121係為對申請專利範圍中所提及之第二移動機構與第三移動機構進行具體例示者。另外,馬達112與馬達122係為對申請專利範圍中所提及之驅動部進行具體例示者。 Furthermore, the first sliding member 111 and the second sliding member 121 are specific examples of the second moving mechanism and the third moving mechanism mentioned in the scope of the patent application. In addition, the motor 112 and the motor 122 are specific examples of the driving part mentioned in the scope of the patent application.

如此,末端執行器20係藉由第一直動機構11與第二直動機構12而往Y方向與Z方向之所期望的位置移動。例如,末端執行器20係移動至FOUP 3內。末端執行器20係具有複數個夾頭部21,以夾持並搬送該FOUP 3中所收容之複數個晶圓W。 Thus, the end effector 20 is moved to the desired position in the Y direction and the Z direction by the first linear motion mechanism 11 and the second linear motion mechanism 12. For example, the end effector 20 is moved into the FOUP 3. The end effector 20 has a plurality of clamping heads 21 to clamp and transport a plurality of wafers W contained in the FOUP 3.

如第1圖所示,各夾頭部21係形成為具有二個刃之叉之形狀且形成為平板之形狀。夾頭部21係使板面朝向鉛直方向,且使叉之形狀的刃尖朝向前方。進而,夾頭部21係在該等刃之尖端的板面上具有握持爪211、212。另外,夾頭部21係在叉之後端的板面上具有支撐銷213、214。在機器人主體10設置有夾緊部50,夾緊部50在夾頭部21抬起晶圓W時自側方夾緊晶圓W之後端部。當夾頭部21在夾緊部50夾緊了晶圓W時,係將晶圓W夾入握持爪211、212與支撐銷213、214之間來進行夾持。藉此,夾頭部21係穩定地搬送晶圓W。 As shown in FIG. 1, each chuck portion 21 is formed in the shape of a fork having two blades and in the shape of a flat plate. The chuck portion 21 has the plate surface facing the vertical direction and the fork-shaped blade tip facing forward. Furthermore, the chuck portion 21 has gripping claws 211, 212 on the plate surface at the tip of the blades. In addition, the chuck portion 21 has support pins 213, 214 on the plate surface at the rear end of the fork. The robot body 10 is provided with a clamping portion 50, which clamps the rear end of the wafer W from the side when the chuck portion 21 lifts the wafer W. When the chuck part 21 clamps the wafer W in the clamping part 50, the wafer W is clamped between the gripping claws 211, 212 and the supporting pins 213, 214. In this way, the chuck part 21 stably transports the wafer W.

末端執行器20係具有複數個此種夾頭部21。詳言之,末端執行器20係具有與FOUP 3中所能夠收容之最大晶圓W片數(例如25片)為相同個數之夾頭部21。藉此,末端執行器20能夠將FOUP 3中所收容之晶圓W全部成批地搬出、或者向FOUP 3內成批地搬入最大收容數之晶圓W。 The end effector 20 has a plurality of such chuck parts 21. Specifically, the end effector 20 has the same number of chuck parts 21 as the maximum number of wafers W that can be accommodated in the FOUP 3 (e.g., 25 wafers). Thus, the end effector 20 can move all the wafers W accommodated in the FOUP 3 out in batches, or move the maximum number of wafers W accommodated in the FOUP 3 into the FOUP 3 in batches.

另外,在末端執行器20中,係成批地搬送FOUP 3內之複數個晶圓W,因此夾頭部21彼此係以與FOUP 3內之晶圓W的排列間距為 相同之一定值的間距P1沿上下方向排列。另外,夾頭部21彼此係如上所述使板面朝向鉛直方向且板面沿水平方向延伸,其結果為,夾頭部21係彼此相互平行。藉此,在末端執行器20中,可將水平地收容於FOUP 3內之晶圓W在不使其破損的情況下抬起並搬送。 In addition, in the end effector 20, a plurality of wafers W in the FOUP 3 are transported in batches, so the chuck parts 21 are arranged in the vertical direction at a certain spacing P1 that is the same as the arrangement spacing of the wafers W in the FOUP 3. In addition, the chuck parts 21 are arranged so that the plate surfaces face the vertical direction and the plate surfaces extend in the horizontal direction as described above, and as a result, the chuck parts 21 are parallel to each other. In this way, in the end effector 20, the wafers W horizontally accommodated in the FOUP 3 can be lifted and transported without damaging them.

然而,在因末端執行器20之長時間使用而夾頭部21發生經年劣化、或者根據FOUP 3之種類而對夾頭部21等零件進行了更換之情況下,有時會導致夾頭部21往前後方向或左右方向傾斜。另外,有時會導致在上下方向上之間距P1發生變化。若有夾頭部21發生傾斜或者夾頭部21之間距P1自一定值偏離等狀況,則有晶圓W破損之虞。 However, if the chuck 21 deteriorates over time due to long-term use of the end effector 20, or if the chuck 21 and other parts are replaced according to the type of FOUP 3, the chuck 21 may tilt in the front-back direction or the left-right direction. In addition, the distance P1 in the vertical direction may change. If the chuck 21 tilts or the distance P1 of the chuck 21 deviates from a certain value, the wafer W may be damaged.

因此,為了抑制晶圓W之破損,搬送機器人1A係包含光電感測器,控制器係根據該光電感測器之輸出而對夾頭部21之傾斜、間距偏離等異常進行判定。 Therefore, in order to suppress the damage of the wafer W, the transport robot 1A includes a photo sensor, and the controller determines abnormalities such as the tilt and spacing deviation of the chuck part 21 based on the output of the photo sensor.

另外,在該情況下,考慮以下方式:使用設置於末端執行器20之側方的一個光電感測器來檢測沿上下方向排列之複數個夾頭部21的傾斜或間距之偏離。然而,在此種情況下,相較於處於最上方之夾頭部21的下表面至處於最下方之夾頭部21的下表面的距離(後述第3圖所示之距離D1)再加上夾頭部21的厚度T1所得之距離,需要使末端執行器20相對於光電感測器升降得更多。其結果為,利用光電感測器進行之測定係花費時間,夾頭部21之異常的判定係花費時間。 In this case, the following method is considered: using a photo sensor disposed on the side of the end effector 20 to detect the inclination or spacing deviation of a plurality of chuck parts 21 arranged in the vertical direction. However, in this case, compared with the distance from the lower surface of the top chuck part 21 to the lower surface of the bottom chuck part 21 (the distance D1 shown in FIG. 3 described later) plus the thickness T1 of the chuck part 21, the end effector 20 needs to be raised and lowered more relative to the photo sensor. As a result, the measurement using the photo sensor takes time, and the determination of the abnormality of the chuck part 21 takes time.

因此,在搬送機器人1A中,在夾頭部21之異常的判定時係使用沿上下方向排列之複數個光電感測器。接著,參照第3圖至第5圖,對搬送機器人1A所包含之光電感測器及控制器的結構進行說明。 Therefore, in the transport robot 1A, a plurality of photo sensors arranged in the vertical direction are used to determine the abnormality of the clamp head 21. Next, referring to Figures 3 to 5, the structure of the photo sensors and controller included in the transport robot 1A is described.

第3圖係為將搬送機器人1A之包含末端執行器20之前方部分放大後的右側視圖。第4圖係為搬送機器人1A所包含之控制器40的硬體結構圖。第5圖係為控制器40的方塊圖。再者,在第3圖中,為了容易理解,僅在框架30所包含之支柱32之一者上示出光電感測器31的位置,但實際上,在支柱32與33上各自設置有光電感測器31之發光部與受光部的各者。第1圖、第2圖亦同樣。另外,在第4圖及第5圖中,為了容易理解,除了控制器40之外,亦示出與控制器40連接之其他設備的結構。 FIG. 3 is an enlarged right side view of the front part of the transport robot 1A including the end effector 20. FIG. 4 is a hardware structure diagram of the controller 40 included in the transport robot 1A. FIG. 5 is a block diagram of the controller 40. Furthermore, in FIG. 3, for easy understanding, the position of the photo sensor 31 is shown only on one of the pillars 32 included in the frame 30, but in fact, the light emitting part and the light receiving part of the photo sensor 31 are respectively provided on the pillars 32 and 33. The same is true for FIG. 1 and FIG. 2. In addition, in FIG. 4 and FIG. 5, for easy understanding, in addition to the controller 40, the structure of other equipment connected to the controller 40 is also shown.

如第3圖所示,搬送機器人1A更包含設置於機器人主體10之前端部分的框架30、以及由框架30所支撐且為了檢測末端執行器20所包含之夾頭部21的高度而設置的複數個光電感測器31。 As shown in FIG. 3 , the transport robot 1A further includes a frame 30 disposed at the front end portion of the robot body 10 and a plurality of photo sensors 31 supported by the frame 30 and disposed to detect the height of the chuck portion 21 included in the end effector 20.

在搬送機器人1A中,係使末端執行器20之尖端部(以下,亦稱為前端部)後退至框架30上所安裝之複數個光電感測器31,在該狀態下使末端執行器20升降,藉此使複數個光電感測器31對末端執行器20之各夾頭部21進行檢測。框架30係形成為四角框狀,以呈現該末端執行器20可進退且可升降之狀態。 In the transport robot 1A, the tip of the end effector 20 (hereinafter also referred to as the front end) is retracted to the plurality of photo sensors 31 mounted on the frame 30, and the end effector 20 is raised and lowered in this state, so that the plurality of photo sensors 31 detect each chuck portion 21 of the end effector 20. The frame 30 is formed in a square frame shape to present a state in which the end effector 20 can move forward and backward and can be raised and lowered.

詳言之,如第1圖所示,框架30係具有沿鉛直方向延伸之二個支柱32、33、以及沿水平方向延伸並連接支柱32、33之上端及下端的樑構件34、35。而且,相較於末端執行器20之處於最上方的夾頭部21至處於最下方之夾頭部21的在上下方向上的距離D1再加上第3圖所示之夾頭部21的厚度T1與晶圓W的厚度T2所得之長度而言,支柱32、33係充分長。另外,相較於第1圖所示之晶圓W的直徑D2,樑構件34、35係充分長。其結果為,框架30係為末端執行器20能夠在其內部空間進退之 四角框形狀。另外,係為末端執行器20能夠在其內部空間升降之四角框形狀。 Specifically, as shown in FIG. 1, the frame 30 has two pillars 32 and 33 extending in the vertical direction, and beam members 34 and 35 extending in the horizontal direction and connecting the upper and lower ends of the pillars 32 and 33. Moreover, the pillars 32 and 33 are sufficiently long in comparison with the length obtained by adding the thickness T1 of the chuck part 21 shown in FIG. 3 and the thickness T2 of the wafer W to the distance D1 in the vertical direction from the uppermost chuck part 21 of the end effector 20 to the lowermost chuck part 21. In addition, the beam members 34 and 35 are sufficiently long in comparison with the diameter D2 of the wafer W shown in FIG. 1. As a result, the frame 30 is a square frame shape in which the end effector 20 can move forward and backward in its internal space. In addition, it is a square frame shape in which the end effector 20 can be raised and lowered within its internal space.

另外,為了使靜止狀態之複數個光電感測器31對升降中之末端執行器20之各夾頭部21進行檢測,如第3圖所示,框架30係固定於搬送機器人1A之不與末端執行器20之升降一起移動的部位。 In addition, in order to enable the multiple photoelectric sensors 31 in a stationary state to detect each clamping head 21 of the end effector 20 during lifting, as shown in Figure 3, the frame 30 is fixed to a portion of the transport robot 1A that does not move with the lifting of the end effector 20.

詳言之,搬送機器人1A係包含用於支撐第一直動機構11之基底60,在該基底60上固定有線性導軌113之框體,線性導軌113係將第一直動機構11所具有之第一滑動件111沿Y方向進行引導。框架30係固定於該基底60上。如此,框架30係固定於如下部位:與經由第一滑動件111之末端執行器20的進退不相關、且與經由第二滑動件121之末端執行器20的升降不相關的部位。 In detail, the transport robot 1A includes a base 60 for supporting the first linear motion mechanism 11, and a frame of a linear guide 113 is fixed on the base 60. The linear guide 113 guides the first slider 111 of the first linear motion mechanism 11 along the Y direction. The frame 30 is fixed on the base 60. In this way, the frame 30 is fixed to the following position: a position that is not related to the advance and retreat of the end effector 20 through the first slider 111 and is not related to the lifting and lowering of the end effector 20 through the second slider 121.

進而,框架30係配置於線性導軌113之框體的前方且與其鄰接之位置,俾使複數個光電感測器31對末端執行器20之各夾頭部21的前端部分進行檢測。框架30之前後方向上的長度L1係充分小於被線性導軌113引導之第一滑動件111所能夠前進的距離。另外,末端執行器20係位於比第一滑動件111更靠前的位置。藉由此種位置關係,當第一滑動件111進退時,(a)末端執行器20之夾頭部21的全部以及(b)晶圓W被夾頭部21夾持之情況下的晶圓W全部,係進入框架30之內部空間或者通過框架30之內部空間。其結果為,框架30之支柱32、33係位於末端執行器20進退之路徑(亦稱為進退路徑)的右側或左側。然後,在支柱32、33上設置有複數個光電感測器31,以對在該路徑上進退或升降之末端執行器20之夾頭部21的高度與晶圓W之有無進行檢測。 Furthermore, the frame 30 is arranged in front of and adjacent to the frame of the linear guide 113 so that a plurality of photo sensors 31 can detect the front end portion of each chuck portion 21 of the end effector 20. The length L1 of the frame 30 in the front-to-back direction is sufficiently smaller than the distance that the first slider 111 guided by the linear guide 113 can move forward. In addition, the end effector 20 is located at a position further forward than the first slider 111. Due to this positional relationship, when the first slider 111 moves forward and backward, (a) the entire chuck portion 21 of the end effector 20 and (b) the entire wafer W when the wafer W is clamped by the chuck portion 21 enter the internal space of the frame 30 or pass through the internal space of the frame 30. As a result, the pillars 32 and 33 of the frame 30 are located on the right or left side of the path (also called the advance and retreat path) of the end effector 20. Then, a plurality of photoelectric sensors 31 are arranged on the pillars 32 and 33 to detect the height of the chuck 21 of the end effector 20 advancing, retreating or ascending and descending on the path and the presence or absence of the wafer W.

雖然圖未示出,但各光電感測器31係具有發光部、以及接受該發光部所發出之光束的受光部。該光電感測器31之發光部係設置於支柱32與支柱33之任一者,並沿水平方向發出光束。另外,光電感測器31之受光部係設置於支柱32與33中之另一者的與受光部為相同高度的部位,並接受光束。然後,各光電感測器31係根據受光部所檢測出之光量,判定發光部與受光部之間是否存在物體,並對於物體之有無進行輸出。詳言之,各光電感測器31係對於處於支柱32與33之間的物體的有無進行輸出。亦即,末端執行器20之夾頭部21係通過支柱32與33之間,作為其結果,各光電感測器31係對於在支柱32與33之間是否存在有夾頭部21進行輸出。或者,對於在支柱32與33之間是否存在有晶圓W進行輸出。 Although not shown in the figure, each photo sensor 31 has a light emitting part and a light receiving part that receives the light beam emitted by the light emitting part. The light emitting part of the photo sensor 31 is set on either the support 32 or the support 33, and emits a light beam in the horizontal direction. In addition, the light receiving part of the photo sensor 31 is set at a position at the same height as the light receiving part of the other support 32 and 33, and receives the light beam. Then, each photo sensor 31 determines whether there is an object between the light emitting part and the light receiving part based on the amount of light detected by the light receiving part, and outputs whether there is an object. In detail, each photo sensor 31 outputs whether there is an object between the support 32 and 33. That is, the chuck portion 21 of the end effector 20 passes between the pillars 32 and 33, and as a result, each photo sensor 31 outputs whether the chuck portion 21 exists between the pillars 32 and 33. Alternatively, it outputs whether the wafer W exists between the pillars 32 and 33.

另外,為了檢測在支柱32與33之間升降的末端執行器20的夾頭部21,如第1圖至第3圖所示,光電感測器31係沿著支柱32、33之柱軸而在上下方向上以間距P2(亦稱為第二間距)排列,間距P2大於夾頭部21之間距P1。 In addition, in order to detect the chuck portion 21 of the end effector 20 that rises and falls between the pillars 32 and 33, as shown in Figures 1 to 3, the photoelectric sensors 31 are arranged along the axis of the pillars 32 and 33 in the vertical direction at a spacing P2 (also called the second spacing), and the spacing P2 is greater than the spacing P1 of the chuck portion 21.

詳言之,複數個光電感測器31中之處於最低位置的光電感測器31係配置於與如下高度相同之高度:在末端執行器20藉由第二直動機構12而移動至基準位置(亦稱為原點,在申請專利範圍中稱為第一基準位置)的情況下,從該基準位置的高度(第3圖所示之Z方向的座標Z1)往上高出相當於間距P2之高度。然後,其他光電感測器31係從該處於最低位置之光電感測器31往上以間距P2排列。 In detail, the photosensor 31 at the lowest position among the plurality of photosensors 31 is arranged at the same height as the following height: when the end actuator 20 moves to the reference position (also called the origin, called the first reference position in the scope of the patent application) by the second linear motion mechanism 12, the height of the reference position (the coordinate Z1 in the Z direction shown in FIG. 3) is higher than the height of the reference position by a distance P2. Then, the other photosensors 31 are arranged upward from the photosensor 31 at the lowest position with a distance P2.

此處,間距P2係具有與如下距離為相同之長度:上述之處於最上方之夾頭部21在上下方向上的中央至處於最下方之夾頭部21在上下方向上的中央之距離D1除以光電感測器31的個數而得之距離。 Here, the spacing P2 has the same length as the following distance: the distance D1 from the center of the uppermost clamp portion 21 in the vertical direction to the center of the lowermost clamp portion 21 in the vertical direction divided by the number of photo sensors 31.

由於光電感測器31係呈現此種排列,若末端執行器20從基準位置之高度上升相當於間距P2,則末端執行器20之夾頭部21係全部均通過任一光電感測器31之側方。其結果為,複數個光電感測器31全體能夠對末端執行器20之全部夾頭部21的高度與夾頭部21各自之晶圓W的有無進行檢測。 Since the photo sensors 31 are arranged in this way, if the end effector 20 rises from the reference position by a height equal to the spacing P2, all the chucks 21 of the end effector 20 pass through the side of any photo sensor 31. As a result, the plurality of photo sensors 31 can detect the height of all the chucks 21 of the end effector 20 and the presence or absence of the wafer W in each chuck 21.

另外,理想的是光電感測器31之個數係為FOUP 3內之晶圓W的最大收容數的約數。但,理想的是該約數係不包含該最大收容數。其原因在於:若為此種個數,則能夠儘可能減少使末端執行器20從基準位置上升之距離。另外,不需要使末端執行器20過多地上升。在搬送機器人1A中,FOUP 3內之晶圓W的最大收容數為25片。因此,為滿足上述條件,在搬送機器人1A中,僅設置有5個光電感測器31。藉此,在搬送機器人1A中,係使上述之間距P2比距離D1小,從而縮短為了檢測夾頭部21之高度與晶圓W之有無而使末端執行器20上升的距離。 In addition, it is ideal that the number of photo sensors 31 is a divisor of the maximum number of wafers W that can be accommodated in FOUP 3. However, it is ideal that the divisor does not include the maximum number. The reason is that if the number is such, the distance that the end effector 20 is raised from the reference position can be minimized. In addition, there is no need to raise the end effector 20 too much. In the transport robot 1A, the maximum number of wafers W that can be accommodated in FOUP 3 is 25. Therefore, in order to meet the above conditions, only 5 photo sensors 31 are provided in the transport robot 1A. Thus, in the transport robot 1A, the above-mentioned distance P2 is made smaller than the distance D1, thereby shortening the distance that the end effector 20 rises in order to detect the height of the chuck 21 and the presence or absence of the wafer W.

各光電感測器31係對夾頭部21或晶圓W之有無(亦即,遮擋光電感測器31之發光部的光之物體的有無)進行檢測,並將檢測資料發送至控制器40。 Each photo sensor 31 detects the presence of the chuck portion 21 or the wafer W (i.e., the presence of an object blocking the light from the light-emitting portion of the photo sensor 31) and sends the detection data to the controller 40.

再者,光電感測器31係為對申請專利範圍中所提及之第一感測器進行具體例示者。 Furthermore, the photoelectric sensor 31 is a specific example of the first sensor mentioned in the scope of the patent application.

如第4圖所示,控制器40係包含處理器41、記憶體42及介面43。然後,處理器41、記憶體42及介面43係藉由匯流排44而連接。 As shown in FIG. 4 , the controller 40 includes a processor 41 , a memory 42 , and an interface 43 . Then, the processor 41 , the memory 42 , and the interface 43 are connected via a bus 44 .

介面43係將處理器41及記憶體42連接至其他設備,以便能夠與其他設備進行通訊。詳言之,介面43係連接於機器人主體10所包含之複數個光電感測器31、第一直動機構11之馬達112以及第二直動機構12之馬達122。另外,係連接於顯示裝置45。藉此,介面43係使得該等設備能夠與處理器41及記憶體42進行資料之收發。 The interface 43 connects the processor 41 and the memory 42 to other devices so as to communicate with other devices. Specifically, the interface 43 is connected to the plurality of photoelectric sensors 31, the motor 112 of the first linear motion mechanism 11, and the motor 122 of the second linear motion mechanism 12 included in the robot body 10. In addition, it is connected to the display device 45. Thus, the interface 43 enables these devices to send and receive data with the processor 41 and the memory 42.

處理器41及記憶體42係構成電腦。而且,控制器40係藉由處理器41讀出並執行記憶體42中所儲存之各種程式,而進行對機器人主體10之第一直動機構11的馬達112及第二直動機構12的馬達122等各部進行控制之各種處理。例如,控制器40係藉由讀出並執行記憶體42中所儲存之異常判定程式,進行根據上述之光電感測器31的輸出而判定夾頭部21之傾斜、間距偏離等異常之末端執行器20的異常判定處理。控制器40係包含第5圖所示之控制部46及運算部47以進行該處理。接著,對該等之結構進行說明。 The processor 41 and the memory 42 constitute a computer. The controller 40 performs various processes for controlling the motor 112 of the first linear motion mechanism 11 and the motor 122 of the second linear motion mechanism 12 of the robot body 10 by reading and executing various programs stored in the memory 42 by the processor 41. For example, the controller 40 performs abnormality determination processing of the end effector 20 to determine abnormalities such as inclination and spacing deviation of the chuck part 21 based on the output of the above-mentioned photo sensor 31 by reading and executing the abnormality determination program stored in the memory 42. The controller 40 includes a control unit 46 and a calculation unit 47 shown in FIG. 5 to perform the processing. Next, the structures are explained.

控制部46係對機器人主體10之各部進行控制。例如,控制部46係對第一直動機構11之馬達112及第二直動機構12之馬達122進行控制。藉此,係使第一滑動件111及第二滑動件121移動,而使末端執行器20進退或升降至所期望之位置。另外,控制部46係將從上述之基準位置(原點)起算之移動距離資料發送至運算部47。 The control unit 46 controls each part of the robot body 10. For example, the control unit 46 controls the motor 112 of the first linear motion mechanism 11 and the motor 122 of the second linear motion mechanism 12. In this way, the first slider 111 and the second slider 121 are moved, and the end effector 20 is moved forward or backward or raised and lowered to the desired position. In addition, the control unit 46 sends the moving distance data calculated from the above-mentioned reference position (origin) to the calculation unit 47.

對此,運算部47係從控制部46接收末端執行器20之移動距離資料。另外,運算部47係從各光電感測器31接收物體之檢測資料。 In this regard, the calculation unit 47 receives the moving distance data of the end effector 20 from the control unit 46. In addition, the calculation unit 47 receives the detection data of the object from each photo sensor 31.

此處,物體之檢測資料係指末端執行器20之夾頭部21或晶圓W之檢測資料。由於光電感測器31之發光部與受光部係分別設置於支柱32與33,因此遮擋光電感測器31之光束的物體僅限於末端執行器20之夾頭部21、或被夾頭部21夾持之晶圓W。運算部47係接收此種夾頭部21或晶圓W之檢測資料。 Here, the detection data of the object refers to the detection data of the chuck part 21 of the end effector 20 or the wafer W. Since the light emitting part and the light receiving part of the photo sensor 31 are respectively arranged on the pillars 32 and 33, the object that blocks the light beam of the photo sensor 31 is limited to the chuck part 21 of the end effector 20 or the wafer W clamped by the chuck part 21. The calculation unit 47 receives the detection data of the chuck part 21 or the wafer W.

運算部47係在接收到末端執行器20之移動距離資料與物體之檢測資料時,基於所接收之末端執行器20的移動距離資料及物體的檢測資料,求出末端執行器20之夾頭部21的位置以及夾頭部21之異常的有無。藉此,進行判定夾頭部21之傾斜、間距偏離等異常之末端執行器20的異常判定處理。接著,參照第6圖,對末端執行器20之異常判定處理更詳細地進行說明。 When the calculation unit 47 receives the movement distance data of the end effector 20 and the detection data of the object, it obtains the position of the clamping head 21 of the end effector 20 and the presence or absence of abnormality of the clamping head 21 based on the received movement distance data of the end effector 20 and the detection data of the object. In this way, the abnormality determination processing of the end effector 20 is performed to determine abnormalities such as the tilt and spacing deviation of the clamping head 21. Next, referring to Figure 6, the abnormality determination processing of the end effector 20 is described in more detail.

第6圖係為控制器40所進行之異常判定處理的流程圖。 Figure 6 is a flow chart of the abnormality determination process performed by the controller 40.

在搬送機器人1A中,(1)在使末端執行器20前進而將FOUP 3中所收容之晶圓W取出的情況下、或者(2)在夾頭部21夾持著晶圓W之狀態下使末端執行器20前進而將晶圓W收容於FOUP 3中的情況下,若夾頭部21發生傾斜或夾頭部21之間距P1發生偏離,則有晶圓W破損之虞。 In the transport robot 1A, (1) when the end effector 20 is advanced to take out the wafer W contained in the FOUP 3, or (2) when the end effector 20 is advanced with the chuck 21 holding the wafer W to contain the wafer W in the FOUP 3, if the chuck 21 is tilted or the distance P1 of the chuck 21 is deviated, the wafer W may be damaged.

因此,控制器40在即將進行(1)之晶圓W的取出動作與(2)之晶圓W的收容動作之前,係進行利用光電感測器31之末端執行器20的第6圖所示異常判定處理。詳言之,當前端部在比框架30更靠前的位置且該位置係在末端執行器20之基準位置(原點)時,控制器40在即將進行上述(1)或(2)的動作之前,係使末端執行器20保持基準位置(原 點)之高度而後退,並在夾頭部21之前端部分在前後方向上的位置(即Y座標)與支柱32、33之Y座標為一致的情況下,判定為能夠進行異常判定處理,而執行異常判定處理。具體言之,處理器41係讀出並執行記憶體42中所儲存之異常判定程式。其結果為,末端執行器20之異常判定處理的流程係開始。 Therefore, the controller 40 performs the abnormality determination process shown in FIG. 6 of the end effector 20 using the photo sensor 31 before performing the (1) wafer W removal operation and the (2) wafer W storage operation. Specifically, when the front end portion is at a position further forward than the frame 30 and the position is at the reference position (origin) of the end effector 20, the controller 40 retreats the end effector 20 while maintaining the height of the reference position (origin) before performing the above-mentioned (1) or (2) operation, and when the position of the front end portion of the chuck portion 21 in the front-rear direction (i.e., the Y coordinate) coincides with the Y coordinate of the pillars 32 and 33, the controller determines that the abnormality determination process can be performed, and performs the abnormality determination process. Specifically, the processor 41 reads out and executes the abnormality determination program stored in the memory 42. As a result, the abnormality determination processing flow of the end executor 20 starts.

當末端執行器20之異常判定處理的流程開始時,夾頭部21之前端部分係處於自左右方向觀察時與支柱32、33重疊之位置,且為可利用光電感測器31進行檢測之狀態,基於此,如第6圖所示,控制器40係首先使末端執行器20上升,並且獲取上升距離資料以及光電感測器31之檢測資料(步驟S1)。 When the abnormality determination process of the end effector 20 begins, the front end of the chuck 21 is in a position overlapping with the pillars 32 and 33 when viewed from the left and right directions, and is in a state that can be detected by the photo sensor 31. Based on this, as shown in FIG. 6, the controller 40 first raises the end effector 20 and obtains the rise distance data and the detection data of the photo sensor 31 (step S1).

詳言之,控制部46係藉由使第二直動機構12之馬達122往正方向以一定之旋轉速度旋轉,從而使第二滑動件121以一定之速度上升。藉此,係使末端執行器20以一定之速度上升。在該末端執行器20的上升中,控制部46係使末端執行器20僅上升與光電感測器31沿上下方向排列之間距P2為相同之距離。即便使末端執行器20僅上升此種距離,由於光電感測器31係以間距P2沿上下方向排列,各夾頭部21可被任一光電感測器31檢測到。 In detail, the control unit 46 causes the motor 122 of the second linear motion mechanism 12 to rotate in the positive direction at a certain rotation speed, thereby causing the second slider 121 to rise at a certain speed. In this way, the end effector 20 is raised at a certain speed. During the rise of the end effector 20, the control unit 46 causes the end effector 20 to rise only by a distance that is the same as the distance P2 at which the photosensors 31 are arranged in the vertical direction. Even if the end effector 20 is raised by only this distance, since the photosensors 31 are arranged in the vertical direction at a distance P2, each chuck portion 21 can be detected by any photosensor 31.

以與該末端執行器20之上升為並行的方式,運算部47係每經過一定之時間便從控制部46獲取末端執行器20之移動距離資料(亦即,自步驟S1之開始起至當前為止末端執行器20所上升之距離的資料)。另外,運算部47係每經過上述一定之時間,便從各光電感測器31獲取檢測 資料。運算部47係藉由將一定之時間設為短時間而可幾乎隨時獲取該等資料。 In parallel with the rise of the end effector 20, the calculation unit 47 obtains the moving distance data of the end effector 20 from the control unit 46 every certain time (that is, the data of the distance the end effector 20 has risen from the start of step S1 to the present). In addition, the calculation unit 47 obtains the detection data from each photo sensor 31 every certain time. The calculation unit 47 can obtain such data almost at any time by setting the certain time to a short time.

接著,運算部47係算出各夾頭部21之高度(步驟S2)。 Next, the calculation unit 47 calculates the height of each clamping head 21 (step S2).

在步驟S1中,末端執行器20係以一定之速度僅上升與間距P2相同之距離,藉此夾頭部21之前端部分係相對於各光電感測器31而相對移動。或者,在夾頭部21夾持著晶圓W之情況下,該晶圓W係相對於各光電感測器31而相對移動。因此,運算部47係藉由在步驟S1中獲取上升距離資料及光電感測器31之檢測資料,從而獲取以下資料:在各光電感測器31所處之在前後方向上的位置(第3圖所示之位置Y1)上,朝向上下方向,在相當於光電感測器31的個數乘以間距P2的距離而得之長度中,物體的有無的資料。運算部47係根據此種資料,製作朝向上下方向之物體存在或不存在的映射資料。然後,運算部47係根據該映射資料中存在有物體之部分的上表面或下表面的高度,求出各夾頭部21之上表面或下表面的高度。 In step S1, the end effector 20 rises at a constant speed by a distance equal to the pitch P2, whereby the front end portion of the chuck portion 21 moves relative to each photosensor 31. Alternatively, when the chuck portion 21 holds a wafer W, the wafer W moves relative to each photosensor 31. Therefore, the calculation unit 47 obtains the following data by obtaining the rising distance data and the detection data of the photosensor 31 in step S1: data on the presence or absence of an object in the length obtained by multiplying the number of photosensors 31 by the pitch P2 in the vertical direction at the position of each photosensor 31 in the front-back direction (position Y1 shown in FIG. 3). The calculation unit 47 generates mapping data indicating the presence or absence of an object in the up-down direction based on such data. Then, the calculation unit 47 calculates the height of the upper surface or lower surface of each chuck portion 21 based on the height of the upper surface or lower surface of the portion where the object exists in the mapping data.

接著,如第6圖所示,運算部47係判定夾頭部21之任一者是否有高度之異常(步驟S3)。 Next, as shown in FIG. 6, the calculation unit 47 determines whether any of the chuck parts 21 has a height abnormality (step S3).

上述之記憶體42係包含第5圖所示之位置資料儲存部421與判定參數儲存部422。在位置資料儲存部421中,保存有各夾頭部21之上表面或下表面的正常高度資料(在申請專利範圍中亦稱為資料庫)與晶圓W之厚度T2的正常厚度資料(在申請專利範圍中亦稱為基板之厚度資料)。另外,在判定參數儲存部422中,保存有從應該判定成非為異常之 夾頭部21的理想高度起算之偏離量的閾值(在申請專利範圍中亦稱為第一容許值)。 The memory 42 includes the position data storage unit 421 and the judgment parameter storage unit 422 shown in FIG. 5. The position data storage unit 421 stores normal height data of the upper surface or lower surface of each chuck unit 21 (also referred to as a database in the scope of the patent application) and normal thickness data of the thickness T2 of the wafer W (also referred to as substrate thickness data in the scope of the patent application). In addition, the judgment parameter storage unit 422 stores a threshold value of the deviation amount calculated from the ideal height of the chuck unit 21 that should be judged as non-abnormal (also referred to as the first allowable value in the scope of the patent application).

運算部47係自位置資料儲存部421讀出各夾頭部21之上表面或下表面的正常高度資料與晶圓W之厚度T2的正常厚度資料,並將所讀出之各夾頭部21之上表面或下表面的正常高度資料與在步驟S2中求出之各夾頭部21之上表面或下表面的高度資料加以比較,求出各夾頭部21之上表面或下表面的高度之從正常高度起算的偏離量。 The calculation unit 47 reads the normal height data of the upper surface or lower surface of each chuck unit 21 and the normal thickness data of the thickness T2 of the wafer W from the position data storage unit 421, and compares the read normal height data of the upper surface or lower surface of each chuck unit 21 with the height data of the upper surface or lower surface of each chuck unit 21 obtained in step S2, and obtains the deviation of the height of the upper surface or lower surface of each chuck unit 21 from the normal height.

進而,運算部47係從判定參數儲存部422讀出偏離量之閾值,並判定所求出之各夾頭部21之上表面或下表面的高度之從正常高度起算的偏離量之任一個是否大於所讀出之偏離量的閾值。然後,運算部47在判定該偏離量大於所讀出之偏離量的閾值的情況下,係判定夾頭部21之任一個有高度的異常。然後,運算部47再對被判定有異常之夾頭部21是發生了傾斜、亦或是間距P1產生了偏離的狀況進行判定。另一方面,運算部47在判定該偏離量為所讀出之偏離量的閾值以下的情況下,係判定在任一夾頭部21中均無高度之異常。如此,運算部47係進行步驟S3之夾頭部21的任一者有無高度異常的判定。 Furthermore, the calculation unit 47 reads the threshold value of the deviation amount from the judgment parameter storage unit 422, and judges whether any of the deviation amounts of the height of the upper surface or the lower surface of each chuck portion 21 calculated from the normal height is greater than the threshold value of the deviation amount read. Then, when the calculation unit 47 judges that the deviation amount is greater than the threshold value of the deviation amount read, it judges that any of the chuck portions 21 has a height abnormality. Then, the calculation unit 47 further judges whether the chuck portion 21 judged to have an abnormality is tilted or the spacing P1 has deviated. On the other hand, when the calculation unit 47 determines that the deviation amount is less than the threshold value of the read deviation amount, it determines that there is no height abnormality in any of the chuck parts 21. In this way, the calculation unit 47 performs the determination of whether any of the chuck parts 21 has a height abnormality in step S3.

再者,在該步驟S3中,在以下情況下運算部47係判定在該夾頭部21夾持有晶圓W:在步驟S2中所求出之各夾頭部21的上表面的高度資料中,夾頭部21之上表面的高度資料係比所讀出之各夾頭部21的上表面的正常高度要高出相當於所讀出之晶圓W的厚度T2的正常厚度值。此處,在比所讀出之各夾頭部21的上表面的正常高度要高出相當於所讀出之晶圓W之厚度T2的正常厚度值這樣的情況中,係設為包含在上述偏離 量之閾值以內有偏差者。然後,運算部47係將晶圓W之有無的判定結果輸出至其他設備(例如,第5圖所示之顯示裝置45)。 Furthermore, in step S3, the calculation unit 47 determines that the wafer W is clamped by the chuck portion 21 in the following case: in the height data of the upper surface of each chuck portion 21 obtained in step S2, the height data of the upper surface of the chuck portion 21 is higher than the normal height of the upper surface of each chuck portion 21 read by a normal thickness value corresponding to the thickness T2 of the wafer W read. Here, in the case where the normal height of the upper surface of each chuck portion 21 is higher than the normal height of the upper surface of each chuck portion 21 read by a normal thickness value corresponding to the thickness T2 of the wafer W read, it is set as a deviation within the threshold value of the above-mentioned deviation amount. Then, the calculation unit 47 outputs the determination result of the presence or absence of the wafer W to other equipment (for example, the display device 45 shown in FIG. 5 ).

在步驟S3之判定中,於判定在夾頭部21之任一者中有高度之異常的情況下(步驟S3之「Yes」),運算部47係向控制部46發送異常訊號,且控制部46係使末端執行器20之移動停止。藉此,係抑制末端執行器20進入FOUP 3而晶圓W發生破損之情況。另外,運算部47係向顯示裝置45發送異常訊號並使其顯示警告(步驟S4)。藉此,運算部47係提醒使用者進行夾頭部21之更換、調整。此時,可將被判定為高度有異常之夾頭部21的編號(例如,從上方開始數的編號)顯示於顯示裝置45。再者,顯示裝置45係為申請專利範圍中所提及之警告有異常的警告裝置的一例,例如亦可為警告燈。 In the determination of step S3, when it is determined that any of the chuck parts 21 has an abnormal height ("Yes" in step S3), the calculation unit 47 sends an abnormal signal to the control unit 46, and the control unit 46 stops the movement of the end effector 20. In this way, the end effector 20 is prevented from entering the FOUP 3 and the wafer W is damaged. In addition, the calculation unit 47 sends an abnormal signal to the display device 45 and causes it to display a warning (step S4). In this way, the calculation unit 47 reminds the user to replace or adjust the chuck part 21. At this time, the number of the chuck part 21 determined to have an abnormal height (for example, the number counted from the top) can be displayed on the display device 45. Furthermore, the display device 45 is an example of a warning device for warning of abnormality mentioned in the scope of the patent application, and may also be a warning light, for example.

接著,運算部47係結束異常判定處理。在異常判定處理結束後,控制部46係使搬送機器人1A之動作保持停止的狀態,直到搬送機器人1A之使用者使其回到原點而對夾頭部21進行更換、調整並解除警告。 Then, the calculation unit 47 ends the abnormality determination process. After the abnormality determination process is completed, the control unit 46 keeps the movement of the transport robot 1A stopped until the user of the transport robot 1A returns it to the origin and replaces and adjusts the chuck part 21 and cancels the warning.

另一方面,在步驟S3之判定中,於判定任一夾頭部21均無高度之異常的情況下(步驟S3之「No」),運算部47係將該結果發送至控制部46,控制部46係使末端執行器20下降(步驟S5),返回至步驟S1中末端執行器20上升之前的狀態。然後,運算部47係結束異常判定處理。控制部46係推定夾頭部21無異常、無晶圓W破損之虞,而使機器人主體10執行上述(1)之晶圓W的取出動作、或(2)之晶圓W的收容動作。 On the other hand, in the judgment of step S3, when it is judged that there is no height abnormality in any chuck part 21 ("No" in step S3), the calculation unit 47 sends the result to the control unit 46, and the control unit 46 makes the end effector 20 descend (step S5) and returns to the state before the end effector 20 rises in step S1. Then, the calculation unit 47 ends the abnormality judgment processing. The control unit 46 infers that there is no abnormality in the chuck part 21 and there is no risk of damage to the wafer W, and makes the robot body 10 perform the above-mentioned (1) wafer W removal action or (2) wafer W storage action.

如上所述,在實施態樣1之搬送機器人1A中,控制部46係藉由控制第二直動機構12之馬達122,而使末端執行器20上升相當於間距P2,該間距P2係小於距離D1,距離D1為複數個夾頭部21中之位於最上方的夾頭部21至位於最下方之夾頭部21的距離。而且,運算部47係使用以下資料而求出各夾頭部21有無異常:在使末端執行器20上升相當於間距P2之期間內所獲取之末端執行器20的上升距離資料以及檢測資料。在搬送機器人1A中,不需要使末端執行器20上升相當於間距P1,而只要使末端執行器20至少升降相當於間距P2即可。因此,在搬送機器人1A中,可在短時間內檢測出各夾頭部21之高度是否有異常。 As described above, in the handling robot 1A of the embodiment 1, the control unit 46 controls the motor 122 of the second linear mechanism 12 to raise the end effector 20 by a distance equal to the spacing P2, which is smaller than the distance D1, which is the distance from the topmost chuck portion 21 to the bottommost chuck portion 21 among the plurality of chuck portions 21. Furthermore, the calculation unit 47 uses the following data to find out whether each chuck portion 21 has an abnormality: the rising distance data of the end effector 20 obtained during the period of raising the end effector 20 by the spacing P2 and the detection data. In the transport robot 1A, it is not necessary to raise the end effector 20 by the distance P1, but it is sufficient to raise or lower the end effector 20 by at least the distance P2. Therefore, in the transport robot 1A, it is possible to detect whether the height of each chuck 21 is abnormal in a short time.

具體言之,在搬送機器人1A中,包含有5個光電感測器31的結果為,間距P2係為上述距離D1之1/5。因此,在搬送機器人1A中,相較於使末端執行器20上升相當於間距P1以使光電感測器31檢測夾頭部21的形態,可在短時間內檢測出各夾頭部21之高度是否有異常。 Specifically, in the transport robot 1A, as a result of including 5 photo sensors 31, the spacing P2 is 1/5 of the above distance D1. Therefore, in the transport robot 1A, compared with raising the end effector 20 by the spacing P1 so that the photo sensor 31 detects the shape of the chuck part 21, it is possible to detect whether the height of each chuck part 21 is abnormal in a short time.

另外,在搬送機器人1A中,當運算部47判定在夾頭部21之任一者中有高度的異常時,係使末端執行器20之移動停止。其結果為,在搬送機器人1A中,使有異常之夾頭部21進入FOUP 3導致晶圓W破損之情況可獲得抑制。例如,晶圓W係不易損傷。 In addition, in the transport robot 1A, when the calculation unit 47 determines that there is a high degree of abnormality in any of the chuck units 21, the movement of the end effector 20 is stopped. As a result, in the transport robot 1A, the situation in which the abnormal chuck unit 21 enters the FOUP 3 and causes the wafer W to be damaged can be suppressed. For example, the wafer W is not easily damaged.

在搬送機器人1A中,光電感測器31係經由框架30而固定於支撐第一直動機構11之基底60。在搬送機器人1A中,基底60係為機器人主體10之一部分,因此相較於使搬送機器人移動至其他設備並利用該設備測定夾頭部之高度的情況,夾頭部21之高度異常的檢測所花費的時間係較短。 In the transport robot 1A, the photo sensor 31 is fixed to the base 60 supporting the first linear motion mechanism 11 via the frame 30. In the transport robot 1A, the base 60 is a part of the robot body 10, so the time spent on detecting the height abnormality of the chuck portion 21 is shorter than when the transport robot is moved to other equipment and the height of the chuck portion is measured by the equipment.

進而,由於框架30係位於第一直動機構11之前方且與其鄰接,故為了檢測夾頭部21之高度異常而使末端執行器20移動之距離係較短。因此,夾頭部21之高度異常的檢測所花費的時間係更短。 Furthermore, since the frame 30 is located in front of the first linear motion mechanism 11 and adjacent to it, the distance that the end effector 20 moves in order to detect the height abnormality of the chuck portion 21 is shorter. Therefore, the time spent on detecting the height abnormality of the chuck portion 21 is shorter.

在搬送機器人1A中,由於係使光電感測器31對末端執行器20之夾頭部21的前端部分進行檢測,故在夾頭部21發生了傾斜的情況下,係容易檢測出該傾斜。 In the transport robot 1A, since the photo sensor 31 detects the front end portion of the chuck portion 21 of the end effector 20, when the chuck portion 21 is tilted, the tilt can be easily detected.

(變形態樣) (Transformed form)

再者,在實施態樣1中,在末端執行器20之異常判定處理中,係求出各夾頭部21之上表面或下表面的高度之從正常高度起算的偏離量,並根據該偏離量來判定夾頭部21有無高度之異常。但判定夾頭部21有無高度之異常亦可基於夾頭部21之傾斜角來進行。 Furthermore, in the implementation sample 1, in the abnormality determination process of the end effector 20, the deviation of the height of the upper surface or lower surface of each chuck portion 21 from the normal height is calculated, and the chuck portion 21 is determined based on the deviation to determine whether there is a height abnormality. However, the determination of whether there is a height abnormality of the chuck portion 21 can also be performed based on the tilt angle of the chuck portion 21.

例如,運算部47亦可基於各夾頭部21之上表面或下表面的高度之從正常高度起算的偏離量、以及夾頭部21的前端部分(作為光電感測器31之測定部位)至夾頭部21之基端的長度,而求出各夾頭部21之傾斜角,在該傾斜角超過容許值(在申請專利範圍中稱為第二容許值)的情況下,可判定夾頭部21有異常。 For example, the calculation unit 47 can also calculate the tilt angle of each chuck portion 21 based on the deviation of the height of the upper surface or lower surface of each chuck portion 21 from the normal height and the length from the front end of the chuck portion 21 (as the measurement position of the photo sensor 31) to the base end of the chuck portion 21. If the tilt angle exceeds the allowable value (referred to as the second allowable value in the patent application scope), it can be determined that the chuck portion 21 is abnormal.

另外,在實施態樣1中,當夾緊部50夾緊了晶圓W時,夾頭部21係利用握持爪211、212與支撐銷213、214夾入晶圓W來進行夾持。但夾緊部50並非僅在夾頭部21夾持晶圓W時使用。 In addition, in embodiment 1, when the clamping part 50 clamps the wafer W, the chuck part 21 clamps the wafer W by using the gripping claws 211, 212 and the supporting pins 213, 214. However, the clamping part 50 is not only used when the chuck part 21 clamps the wafer W.

在夾頭部21夾持著晶圓W之狀態而進行末端執行器20之異常判定處理的情況下,當於步驟S1中之末端執行器20的上升時,可使用夾緊部50。亦即,夾緊部50係利用直動機構(圖未示出)而沿前後方 向進退,但在步驟S1中之末端執行器20的上升之前,控制部46可控制直動機構(圖未示出)以使夾緊部50前進而夾緊晶圓W。而且,可在晶圓W被夾緊之狀態下,進行於步驟S1中之末端執行器20的上升。若為此種末端執行器20之上升,則晶圓W不會發生偏離,因此可準確地進行光電感測器31對晶圓W之檢測。 When the abnormality determination process of the end effector 20 is performed while the chuck portion 21 is clamping the wafer W, the clamping portion 50 may be used when the end effector 20 is ascending in step S1. That is, the clamping portion 50 is moved forward and backward in the front-back direction by a direct-acting mechanism (not shown), but before the end effector 20 is ascending in step S1, the control portion 46 may control the direct-acting mechanism (not shown) to move the clamping portion 50 forward to clamp the wafer W. Furthermore, the end effector 20 may be ascended in step S1 while the wafer W is clamped. If the end effector 20 is raised in this way, the wafer W will not deviate, so the photo sensor 31 can accurately detect the wafer W.

(實施態樣2) (Implementation Example 2)

在實施態樣1中,為了抑制晶圓W之破損,運算部47係判定各夾頭部21有無異常。但本發明並不限定於此。在本發明中,為了抑制晶圓W之破損,運算部47亦可進一步判定支撐第一直動機構11之基底60有無傾斜。 In the embodiment 1, in order to suppress the damage of the wafer W, the calculation unit 47 determines whether each chuck part 21 has an abnormality. However, the present invention is not limited to this. In the present invention, in order to suppress the damage of the wafer W, the calculation unit 47 can further determine whether the base 60 supporting the first linear motion mechanism 11 is tilted.

在實施態樣2之搬送機器人1B中,係包含檢測基底60之傾斜的傾斜檢測感測器。而且,運算部47係根據傾斜檢測感測器之檢測結果,來判定可否容許基底60之傾斜。 In the conveying robot 1B of the implementation form 2, a tilt detection sensor for detecting the tilt of the base 60 is included. Moreover, the calculation unit 47 determines whether the tilt of the base 60 is allowed based on the detection result of the tilt detection sensor.

以下,參照第7圖及第8圖,對實施態樣2之搬送機器人1B的結構進行說明。在實施態樣2中,係以不同於實施態樣1之結構為中心進行說明。 The structure of the transport robot 1B of Implementation Example 2 is described below with reference to Figures 7 and 8. In Implementation Example 2, the description is centered on the structure that is different from Implementation Example 1.

第7圖係為搬送機器人1B所包含之控制器40的方塊圖。第8圖係為搬送機器人1B所包含之基底60及其附近的放大左側視圖。再者,在第7圖中,為了容易理解,除控制器40之外,亦示出了與控制器40連接之其他設備的結構。另外,第8圖中,對搬送機器人1B所包含之第2圖中所示VIII區域進行了放大。 FIG. 7 is a block diagram of the controller 40 included in the transport robot 1B. FIG. 8 is an enlarged left side view of the base 60 and its vicinity included in the transport robot 1B. Furthermore, in FIG. 7, in addition to the controller 40, the structure of other equipment connected to the controller 40 is also shown for easy understanding. In addition, in FIG. 8, the VIII area shown in FIG. 2 included in the transport robot 1B is enlarged.

如第7圖所示,搬送機器人1B除了包含設置於機器人主體10的光電感測器31之外,更包含傾斜檢測感測器61。 As shown in FIG. 7 , the transport robot 1B includes a tilt detection sensor 61 in addition to the photoelectric sensor 31 provided on the robot body 10 .

首先,對作為傾斜檢測感測器61之檢測對象的基底60的傾斜進行說明。如在實施態樣1中所說明,基底60係支撐第一直動機構11。詳言之,如第2圖所示,基底60係形成為平板狀,且進一步經由設置於下方之支撐框架62而被支撐。然後,支撐框架62係被第三直動機構63所包含之第三滑動件64(亦簡稱為滑動件)支撐。第三直動機構63係具有固定於架台65且沿左右方向(即X方向)延伸之軌道,第三滑動件64係沿著該軌道而直線移動。第三滑動件64係藉由沿X方向直線移動,而使被基底60支撐之搬送機器人1B其本身沿X方向直線移動。藉此,實現了使末端執行器20沿XYZ方向移動之搬送系統2。 First, the inclination of the base 60, which is the detection object of the inclination detection sensor 61, is described. As described in the embodiment 1, the base 60 supports the first linear motion mechanism 11. In detail, as shown in FIG. 2, the base 60 is formed in a flat plate shape, and is further supported by a support frame 62 disposed thereunder. Then, the support frame 62 is supported by a third slide 64 (also referred to as a slide) included in the third linear motion mechanism 63. The third linear motion mechanism 63 has a rail fixed to a stand 65 and extending in the left-right direction (i.e., the X direction), and the third slide 64 moves linearly along the rail. The third slide 64 moves linearly in the X direction, thereby causing the transport robot 1B supported by the base 60 to move linearly in the X direction. In this way, a conveying system 2 is realized that moves the end effector 20 in the XYZ direction.

然而,在基底60上,框體15與末端執行器20係藉由第一直動機構11、第二直動機構12而移動。其結果為,容易因經年劣化而發生變形、位置偏離等不良情況。因此,有時會導致基底60相對於第三滑動件64而發生傾斜。當基底60相對於第三滑動件64而發生傾斜時,不僅導致末端執行器20之夾頭部21發生傾斜,而且實施態樣1中所說明之支撐光電感測器31的框架30亦發生傾斜。其結果為,難以利用光電感測器31來檢測出起因於基底60之傾斜的夾頭部21的傾斜。因此,在搬送機器人1B中設置有傾斜檢測感測器61。再者,傾斜檢測感測器61係為對申請專利範圍中所提及之第二感測器進行具體例示者。 However, on the base 60, the frame 15 and the end effector 20 are moved by the first linear motion mechanism 11 and the second linear motion mechanism 12. As a result, deformation, positional deviation and other undesirable conditions may occur due to years of degradation. Therefore, the base 60 may sometimes tilt relative to the third slider 64. When the base 60 tilts relative to the third slider 64, not only the chuck portion 21 of the end effector 20 tilts, but also the frame 30 supporting the photo sensor 31 described in the implementation sample 1 tilts. As a result, it is difficult to use the photo sensor 31 to detect the tilt of the chuck portion 21 caused by the tilt of the base 60. Therefore, a tilt detection sensor 61 is provided in the transport robot 1B. Furthermore, the tilt detection sensor 61 is a specific example of the second sensor mentioned in the patent application scope.

如第8圖所示,傾斜檢測感測器61係具有設置於基底60之發光部611及受光部612、以及設置於架台65並在發光部611與受光部612之間對發光部之光進行遮光的遮光板613。 As shown in FIG. 8 , the tilt detection sensor 61 has a light emitting portion 611 and a light receiving portion 612 disposed on a base 60, and a light shielding plate 613 disposed on a stand 65 and shielding light from the light emitting portion between the light emitting portion 611 and the light receiving portion 612.

發光部611係設置於基底60之下部,並向後方射出光束。對此,受光部612係設置於基底60之下部且比發光部611更靠後方處。而且,接受發光部611發出之光束。 The light-emitting portion 611 is disposed at the lower portion of the base 60 and emits a light beam to the rear. In contrast, the light-receiving portion 612 is disposed at the lower portion of the base 60 and further rearward than the light-emitting portion 611. Furthermore, the light beam emitted by the light-emitting portion 611 is received.

另外,發光部611在基底60之板面呈水平的狀態下,係沿水平方向射出光束。而且,受光部612係在Y方向上與發光部611相向。 In addition, the light-emitting portion 611 emits a light beam in a horizontal direction when the surface of the base 60 is horizontal. Moreover, the light-receiving portion 612 faces the light-emitting portion 611 in the Y direction.

另一方面,遮光板613係設置於架台65之+Z面。而且,具有與YZ平面平行地延伸之尖端部。該尖端部係延伸至發光部611與受光部612之間。而且,在基底60之板面呈水平的狀態下,遮光板613係遮擋發光部611之光束的一半。在該狀態下,當基底60之板面往Y方向傾斜時,遮光板613之尖端部係遮擋更多的光束。亦即,遮光板613對光束之遮光率係發生變化。受光部612係對此種光量進行測定,並發送至第7圖所示之運算部47。 On the other hand, the light shielding plate 613 is disposed on the +Z plane of the stand 65. Moreover, it has a tip extending parallel to the YZ plane. The tip extends between the light emitting portion 611 and the light receiving portion 612. Moreover, when the plate surface of the base 60 is horizontal, the light shielding plate 613 blocks half of the light beam of the light emitting portion 611. In this state, when the plate surface of the base 60 is tilted in the Y direction, the tip of the light shielding plate 613 blocks more light beams. That is, the light shielding rate of the light shielding plate 613 to the light beam changes. The light receiving portion 612 measures this amount of light and sends it to the calculation unit 47 shown in Figure 7.

運算部47係從傾斜檢測感測器61接收受光部612所測定之光量資料。另一方面,在判定參數儲存部422中保存有光量之正常值與光量變化之容許值(在申請專利範圍中稱為第三容許值)之資料。運算部47係讀出光量之正常值與光量變化之容許值的資料,並求出所接收之光量資料之從光量的正常值起算的變化量。然後,運算部47係判定所求出之變化量是否超過容許值。藉此,運算部47係判定基底60是否相對於架台65之+Z面傾斜。 The calculation unit 47 receives the light quantity data measured by the light receiving unit 612 from the tilt detection sensor 61. On the other hand, the data of the normal value of the light quantity and the allowable value of the light quantity change (referred to as the third allowable value in the scope of the patent application) are stored in the judgment parameter storage unit 422. The calculation unit 47 reads the data of the normal value of the light quantity and the allowable value of the light quantity change, and calculates the change amount of the received light quantity data from the normal value of the light quantity. Then, the calculation unit 47 determines whether the calculated change amount exceeds the allowable value. In this way, the calculation unit 47 determines whether the substrate 60 is tilted relative to the +Z plane of the stage 65.

運算部47在所求出之變化量超過容許值的情況下,係判定基底60相對於架台65之傾斜大,並向控制部46發送異常訊號。控制部46在接收到異常訊號時,與實施態樣1中所說明的末端執行器20之異常判定處理的步驟S4同樣,係使末端執行器20之移動停止,並且向顯示裝置45發送異常訊號並使其進行警告顯示。實施態樣2之搬送機器人1B在起動期間,係始終執行該利用運算部47進行之判定。藉此,在搬送機器人1B中,起因於基底60之傾斜的晶圓W的破損可被抑制。 When the calculated variation exceeds the allowable value, the calculation unit 47 determines that the inclination of the substrate 60 relative to the stage 65 is large, and sends an abnormal signal to the control unit 46. When the control unit 46 receives the abnormal signal, it stops the movement of the end effector 20, and sends an abnormal signal to the display device 45 to display a warning, similar to step S4 of the abnormal determination processing of the end effector 20 described in the implementation form 1. During the startup period, the transport robot 1B of the implementation form 2 always executes the determination performed by the calculation unit 47. In this way, in the transport robot 1B, the damage of the wafer W caused by the inclination of the substrate 60 can be suppressed.

上述之傾斜檢測感測器61係設置於基底60之前後方向上的後方部分。詳言之,如第2圖所示,基底60係經由支撐框架62而被第三滑動件64所支撐。該第三滑動件64係位於基底60之前後方向上的中央的下方。另一方面,第2圖所示之VIII區域係處於基底60之後方部分,由此可知,傾斜檢測感測器61係設置於比第三滑動件64更靠後的基底60之後方部分處。其結果為,傾斜檢測感測器61容易受到基底60在前後方向上之傾斜的影響,從而容易檢測出該傾斜。其結果為,在搬送機器人1B中,起因於基底60之傾斜的晶圓W的破損係得到更有效的抑制。 The above-mentioned tilt detection sensor 61 is arranged at the rear part of the substrate 60 in the front-back direction. In detail, as shown in FIG. 2, the substrate 60 is supported by the third slider 64 via the support frame 62. The third slider 64 is located below the center of the substrate 60 in the front-back direction. On the other hand, the VIII region shown in FIG. 2 is located at the rear part of the substrate 60, from which it can be seen that the tilt detection sensor 61 is arranged at the rear part of the substrate 60 further back than the third slider 64. As a result, the tilt detection sensor 61 is easily affected by the tilt of the substrate 60 in the front-back direction, and thus the tilt is easily detected. As a result, in the transfer robot 1B, the damage of the wafer W caused by the tilt of the substrate 60 is more effectively suppressed.

再者,第三滑動件64係為對申請專利範圍中所提及之第一移動機構進行具體例示者。架台65係為對申請專利範圍中所提及之支撐體進行具體例示者。 Furthermore, the third sliding member 64 is a specific example of the first moving mechanism mentioned in the scope of the patent application. The stand 65 is a specific example of the supporting body mentioned in the scope of the patent application.

如上所述,在實施態樣2之搬送機器人1B中,基於在基底60及架台65上所設置之傾斜檢測感測器61的輸出,運算部47係判定基底60相對於架台65的上表面有無傾斜。其結果為,在搬送機器人1B中,不易發生起因於基底60之傾斜的晶圓W的破損。 As described above, in the transport robot 1B of the embodiment 2, based on the output of the tilt detection sensor 61 provided on the substrate 60 and the stage 65, the calculation unit 47 determines whether the substrate 60 is tilted relative to the upper surface of the stage 65. As a result, in the transport robot 1B, it is not easy to cause damage to the wafer W due to the tilt of the substrate 60.

(實施態樣3) (Implementation Example 3)

在實施態樣1中,為了抑制晶圓W之破損,運算部47係判定各夾頭部21有無異常。另外,在實施態樣2中,運算部47係判定基底60有無傾斜。但本發明並不限定於此。在本發明中,為了抑制晶圓W之破損,運算部47亦可判定第一直動機構11之馬達112與第二直動機構12之馬達122有無異常。 In implementation sample 1, in order to suppress the damage of the wafer W, the calculation unit 47 determines whether each chuck part 21 has an abnormality. In addition, in implementation sample 2, the calculation unit 47 determines whether the base 60 is tilted. However, the present invention is not limited to this. In the present invention, in order to suppress the damage of the wafer W, the calculation unit 47 can also determine whether the motor 112 of the first linear mechanism 11 and the motor 122 of the second linear mechanism 12 have an abnormality.

在實施態樣2之結構之基礎上,實施態樣3之搬送機器人之運算部47係判定馬達112、馬達122等有無異常。以下,對實施態樣3之搬送機器人的結構進行說明。在實施態樣3中,係以不同於實施態樣1、實施態樣2之結構為中心進行說明。 Based on the structure of implementation example 2, the calculation unit 47 of the transport robot of implementation example 3 determines whether the motor 112, the motor 122, etc. have abnormalities. The structure of the transport robot of implementation example 3 is described below. In implementation example 3, the description is centered on the structure that is different from implementation examples 1 and 2.

再者,實施態樣3之搬送機器人的方塊圖係與實施態樣2之搬送機器人1B相同,因此省略圖示。 Furthermore, the block diagram of the transport robot of implementation example 3 is the same as the transport robot 1B of implementation example 2, so the diagram is omitted.

第一直動機構11之馬達112與第二直動機構12之馬達122分別具有轉矩測定單元,並將所測定之轉矩值資料發送至運算部47。另外,在實施態樣2中所說明之第三直動機構63中亦設置有用於使第三滑動件64移動之馬達。該第三直動機構63之馬達亦具有轉矩測定單元,並將所測定之轉矩值資料發送至運算部47。 The motor 112 of the first direct-acting mechanism 11 and the motor 122 of the second direct-acting mechanism 12 each have a torque measuring unit, and send the measured torque value data to the calculation unit 47. In addition, the third direct-acting mechanism 63 described in the embodiment 2 is also provided with a motor for moving the third slide 64. The motor of the third direct-acting mechanism 63 also has a torque measuring unit, and sends the measured torque value data to the calculation unit 47.

另一方面,在判定參數儲存部422中,保存有第一直動機構11之馬達112、第二直動機構12之馬達122及第三直動機構63之馬達的轉矩值被判定為異常的第一閾值、第二閾值及第三閾值。運算部47係從判定參數儲存部422讀出第一閾值、第二閾值及第三閾值。然後,運算部47係從第一直動機構11之馬達112、第二直動機構12之馬達122、第三直 動機構63之馬達的各者接收到各轉矩值資料,並對各該資料是否超過第一閾值、第二閾值、第三閾值之各者進行判定。 On the other hand, the first threshold, second threshold, and third threshold of the torque values of the motor 112 of the first direct-acting mechanism 11, the motor 122 of the second direct-acting mechanism 12, and the motor 63 of the third direct-acting mechanism are stored in the judgment parameter storage unit 422. The calculation unit 47 reads the first threshold, the second threshold, and the third threshold from the judgment parameter storage unit 422. Then, the calculation unit 47 receives each torque value data from each of the motor 112 of the first direct-acting mechanism 11, the motor 122 of the second direct-acting mechanism 12, and the motor 63 of the third direct-acting mechanism, and determines whether each of the data exceeds each of the first threshold, the second threshold, and the third threshold.

在第一直動機構11之馬達112的轉矩值資料超過第一閾值的情況下,運算部47係向控制部46發送第一轉矩異常訊號。控制部46在接收到第一轉矩異常訊號時,係使第一直動機構11之動作停止,並且使顯示裝置45顯示警告,警告內容為第一直動機構11中有異常。 When the torque value data of the motor 112 of the first linear motion mechanism 11 exceeds the first threshold value, the calculation unit 47 sends a first torque abnormality signal to the control unit 46. When the control unit 46 receives the first torque abnormality signal, it stops the operation of the first linear motion mechanism 11 and displays a warning on the display device 45, the warning content of which is that there is an abnormality in the first linear motion mechanism 11.

同樣地,在第二直動機構12之馬達122的轉矩值資料超過第二閾值的情況下,運算部47係向控制部46發送第二轉矩異常訊號。控制部46在接收到第二轉矩異常訊號時,係使第二直動機構12之動作停止,並且使顯示裝置45顯示警告,警告內容為第二直動機構12中有異常。 Similarly, when the torque value data of the motor 122 of the second direct-acting mechanism 12 exceeds the second threshold value, the calculation unit 47 sends a second torque abnormality signal to the control unit 46. When the control unit 46 receives the second torque abnormality signal, it stops the action of the second direct-acting mechanism 12 and displays a warning on the display device 45, the warning content of which is that there is an abnormality in the second direct-acting mechanism 12.

進而,在第三直動機構63之馬達的轉矩值資料超過第三閾值的情況下,運算部47係向控制部46發送第三轉矩異常訊號。控制部46在接收到第三轉矩異常訊號時,係使第三直動機構63之動作停止,並且使顯示裝置45顯示警告,警告內容為第三直動機構63中有異常。 Furthermore, when the torque value data of the motor of the third direct-acting mechanism 63 exceeds the third threshold value, the calculation unit 47 sends a third torque abnormality signal to the control unit 46. When the control unit 46 receives the third torque abnormality signal, it stops the action of the third direct-acting mechanism 63 and displays a warning on the display device 45, the warning content of which is that there is an abnormality in the third direct-acting mechanism 63.

如上所述,在實施態樣3之搬送機器人中,係根據第一直動機構11之馬達112、第二直動機構12之馬達122及第三直動機構63之馬達各自的轉矩值,來檢測第一直動機構11、第二直動機構12、第三直動機構63各自之異常。在實施態樣3之搬送機器人中,在檢測出異常的情況下停止動作,因此可抑制搬送時導致晶圓W破損之情況。 As described above, in the transport robot of implementation form 3, the first direct motion mechanism 11, the second direct motion mechanism 12, and the third direct motion mechanism 63 are detected for each abnormality based on the torque values of the motor 112 of the first direct motion mechanism 11, the motor 122 of the second direct motion mechanism 12, and the motor 63 of the third direct motion mechanism. In the transport robot of implementation form 3, the operation is stopped when an abnormality is detected, thereby preventing the wafer W from being damaged during transport.

以上,係針對本發明之實施態樣1至實施態樣3的搬送裝置以及搬送裝置之控制方法,以搬送機器人1A、搬送機器人1B為例進行了說明,但搬送裝置以及搬送裝置之控制方法並不限定於此。 The above is an explanation of the conveying device and the control method of the conveying device of the embodiments 1 to 3 of the present invention, taking the conveying robot 1A and the conveying robot 1B as examples, but the conveying device and the control method of the conveying device are not limited to these.

例如,在實施態樣1至實施態樣3中,在框架30上安裝有光電感測器31,但本發明並不限定於此。在本發明中,光電感測器31只要為如下之至少二個第一感測器即可:該至少二個第一感測器係以自複數個夾頭部21中之位於最上方的最上位夾頭部21至位於最下方之最下位夾頭部21的距離D1之一半以下的間距P2排列,且在複數個夾頭部21之側方,對側方是否存在物體進行檢測。光電感測器31只要處於複數個夾頭部21之側方即可,因此亦可安裝於不具有樑構件34、35之狀態下的支柱32、33。另外,光電感測器31亦可安裝於支柱32、33之任一者。只要是此種形態,則可藉由末端執行器20之進退而位於複數個夾頭部21的側方。其結果為,光電感測器31可檢測夾頭部21的有無。 For example, in Embodiments 1 to 3, photo sensors 31 are mounted on the frame 30, but the present invention is not limited thereto. In the present invention, the photo sensors 31 may be at least two first sensors as follows: the at least two first sensors are arranged at a distance P2 less than half of the distance D1 from the topmost clamp portion 21 to the bottommost clamp portion 21 among the plurality of clamp portions 21, and are located on the sides of the plurality of clamp portions 21 to detect whether an object exists on the sides. The photo sensors 31 may be located on the sides of the plurality of clamp portions 21, and therefore may be mounted on the pillars 32 and 33 without the beam members 34 and 35. In addition, the photo sensor 31 can also be installed on either of the pillars 32 and 33. As long as it is in this form, it can be located on the side of multiple chuck parts 21 by the advance and retreat of the end effector 20. As a result, the photo sensor 31 can detect the presence or absence of the chuck part 21.

另外,在實施態樣1至實施態樣3中,光電感測器31係包含分開設置之發光部與受光部,但本發明並不限定於此。在本發明中,如上所述,光電感測器31只要為檢測側方是否存在物體之感測器即可。例如,光電感測器31亦可為以下之反射型的感測器:發光部與受光部設置於一體之框體中且受光部接受來自檢測對象之物體的反射光。另外,光電感測器31亦可為以下之回歸反射型的感測器:發光部與受光部設置於一體之框體中、並且更包含與發光部及受光部分開設置的反射部。 In addition, in embodiments 1 to 3, the photosensor 31 includes a light-emitting part and a light-receiving part that are separately arranged, but the present invention is not limited to this. In the present invention, as described above, the photosensor 31 only needs to be a sensor that detects whether there is an object on the side. For example, the photosensor 31 can also be a reflective sensor as follows: the light-emitting part and the light-receiving part are arranged in a single frame and the light-receiving part receives reflected light from the object to be detected. In addition, the photosensor 31 can also be a retro-reflective sensor as follows: the light-emitting part and the light-receiving part are arranged in a single frame and further include a reflective part that is separately arranged from the light-emitting part and the light-receiving part.

進而,在實施態樣1至實施態樣3中,光電感測器31設置有5個。但本發明並不限定於此。在本發明中,如上所述,光電感測器31只要至少有二個即可。例如,光電感測器31可為二個。即便在此種情況下,末端執行器20亦只要從原點之高度(第3圖所示之Z方向的座標Z1)上升相當於距離D1的一半即可。再者,在實施態樣1中進行了說明,理想的 是光電感測器31之個數係為FOUP 3內之晶圓W的最大收容數的約數。但,理想的是該約數係不包含上述最大收容數。 Furthermore, in Embodiment 1 to Embodiment 3, five photosensors 31 are provided. However, the present invention is not limited thereto. In the present invention, as described above, at least two photosensors 31 are sufficient. For example, there may be two photosensors 31. Even in this case, the end effector 20 only needs to rise from the height of the origin (coordinate Z1 in the Z direction shown in FIG. 3) by half the distance D1. Furthermore, it is described in Embodiment 1 that it is ideal that the number of photosensors 31 is a divisor of the maximum number of wafers W that can be accommodated in FOUP 3. However, it is ideal that the divisor does not include the above-mentioned maximum number of wafers.

在實施態樣1至實施態樣3中,在利用光電感測器31對夾頭部21進行檢測的情況下,末端執行器20係從原點之高度(第3圖所示之Z方向的座標Z1)上升。但本發明並不限定於此。在本發明中,在利用光電感測器31對夾頭部21進行檢測的情況下,亦可在使位於最下方之最下位夾頭部21位於第一基準位置的狀態下,使末端執行器20相對於至少二個第一感測器至少上升相當於間距P2,該第一基準位置係比複數個光電感測器31(即,本發明中所提及之至少二個第一感測器)中之位於最下方的第一感測器低了相當於間距P2。因此,末端執行器20亦可從比原點更往上的地方開始上升。 In implementation examples 1 to 3, when the chuck portion 21 is detected by the photosensor 31, the end effector 20 rises from the height of the origin (the coordinate Z1 in the Z direction shown in FIG. 3). However, the present invention is not limited to this. In the present invention, when the chuck portion 21 is detected by the photosensor 31, the end effector 20 can be raised by at least the distance P2 relative to at least two first sensors when the lowest chuck portion 21 is located at a first reference position. The first reference position is lower than the lowest first sensor among the plurality of photosensors 31 (i.e., the at least two first sensors mentioned in the present invention) by the distance P2. Therefore, the end effector 20 can also start to rise from a position higher than the origin.

再者,在本發明中,在利用光電感測器31對夾頭部21進行檢測的情況下,不僅可使末端執行器20上升,亦可使其下降。亦即,在本發明中,亦可在使位於最上方之最上位夾頭部21位於第二基準位置的狀態下,使末端執行器20相對於至少二個第一感測器至少下降相當於間距P2,該第二基準位置係比複數個光電感測器31(即,本發明中所提及之至少二個第一感測器)中之位於最上方的第一感測器高出相當於間距P2。 Furthermore, in the present invention, when the chuck portion 21 is detected by the photoelectric sensor 31, the end effector 20 can be not only raised but also lowered. That is, in the present invention, the end effector 20 can be lowered at least by the distance P2 relative to at least two first sensors when the uppermost chuck portion 21 is located at the second reference position, and the second reference position is higher than the uppermost first sensor among the plurality of photoelectric sensors 31 (i.e., the at least two first sensors mentioned in the present invention) by the distance P2.

在實施態樣中,夾頭部21係具有握持爪211、212與支撐銷213、214。而且,夾頭部21係對晶圓W進行夾持。但本發明並不限定於此。在本發明中,夾頭部21只要分別能夠對基板進行夾持即可。因此,在本發明中,夾頭部21之對基板進行夾持的具體部件係為任意部件。例如,夾頭部21亦可利用真空吸盤來夾持晶圓W。另外,夾頭部21之具體形狀 亦可為任意形狀。例如,夾頭部21亦可具有能夠搭載基板之矩形形狀來代替叉形狀。進而,作為夾持對象之晶圓W亦可為玻璃基板等其他基板。 In the embodiment, the chuck part 21 has gripping claws 211, 212 and support pins 213, 214. Moreover, the chuck part 21 clamps the wafer W. However, the present invention is not limited to this. In the present invention, the chuck part 21 only needs to be able to clamp the substrate. Therefore, in the present invention, the specific part of the chuck part 21 that clamps the substrate is an arbitrary part. For example, the chuck part 21 can also use a vacuum suction cup to clamp the wafer W. In addition, the specific shape of the chuck part 21 can also be an arbitrary shape. For example, the chuck part 21 can also have a rectangular shape that can carry a substrate instead of a fork shape. Furthermore, the wafer W as the clamping object can also be other substrates such as a glass substrate.

本發明能夠在不脫離本發明之廣義精神與範圍之情況下採用各種實施態樣及變形。另外,上述之態樣方式僅用於對本發明進行說明,而非限定本發明之範圍者。亦即,本發明之範圍係由申請專利範圍而非實施態樣所示出。而且,在申請專利範圍內以及與其同等之發明意義之範圍內實施之各種變形係被視為在本發明之範圍內。 The present invention can adopt various implementation modes and variations without departing from the broad spirit and scope of the present invention. In addition, the above-mentioned modes are only used to illustrate the present invention, not to limit the scope of the present invention. That is, the scope of the present invention is shown by the scope of the patent application rather than the implementation mode. Moreover, various variations implemented within the scope of the patent application and the scope of the invention meaning equivalent thereto are deemed to be within the scope of the present invention.

1A:搬送機器人 1A: Transport robot

10:機器人主體 10: Robot subject

11:第一直動機構 11: The first straight-acting mechanism

20:末端執行器 20: End effector

21:夾頭部 21: Clip head

30:框架 30: Framework

31:光電感測器(第一感測器) 31: Photosensor (first sensor)

32,33:支柱 32,33: Pillars

34,35:樑構件 34,35: beam components

50:夾緊部 50: Clamping part

60:基底 60: Base

113:線性導軌 113: Linear guide rails

D1:距離 D1: Distance

L1:長度 L1: Length

P1,P2:間距 P1, P2: spacing

T1,T2:厚度 T1, T2: thickness

X,Y,Z:方向 X,Y,Z: Direction

Y1:位置 Y1: Location

Z1:座標 Z1: coordinates

Claims (12)

一種搬送裝置,包含: 末端執行器,具有沿上下方向排列且分別夾持基板之複數個夾頭部; 至少二個第一感測器,係以自該複數個夾頭部中之位於最上方的最上位夾頭部至位於最下方之最下位夾頭部的距離之一半以下的間距排列,在該複數個夾頭部之側方,對側方是否存在物體進行檢測; 位置資料儲存部,儲存有資料庫,該資料庫保存有該複數個夾頭部各自之正常上下方向之位置的資料; 控制部,在使該最下位夾頭部位於第一基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器上升至少相當於該間距,該第一基準位置係比該至少二個第一感測器中之位於最下方的第一感測器低了相當於該間距,或者在使該最上位夾頭部位於第二基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器下降至少相當於該間距,該第二基準位置係比該至少二個第一感測器中之位於最上方的第一感測器高了相當於該間距;以及 運算部,在使該末端執行器相對於該至少二個第一感測器上升或下降之期間,自該控制部獲取該末端執行器從該第一基準位置或該第二基準位置相對移動之移動距離的資料,並且自該至少二個第一感測器獲取檢測資料,基於所獲取之移動距離的資料與該檢測資料,運算各該夾頭部之上下方向的位置,進而根據該位置資料儲存部中所儲存之資料庫與所運算出之各該上下方向的位置,運算各該夾頭部之從正常上下方向的位置起算之偏離量,並基於所運算出之偏離量求出該複數個夾頭部各自有無異常。 A conveying device, comprising: An end actuator, having a plurality of clamping heads arranged in the vertical direction and clamping substrates respectively; At least two first sensors, arranged at a distance less than half of the distance from the topmost clamping head located at the top to the bottommost clamping head located at the bottom of the plurality of clamping heads, detecting whether there are objects on the sides of the plurality of clamping heads; A position data storage unit, storing a database, which stores data on the normal vertical position of each of the plurality of clamping heads; The control unit, when the lowermost clamping head is in a first reference position, causes the end actuator to rise relative to the at least two first sensors by at least the distance, wherein the first reference position is lower than the lowermost first sensor among the at least two first sensors by the distance, or when the uppermost clamping head is in a second reference position, causes the end actuator to descend relative to the at least two first sensors by at least the distance, wherein the second reference position is higher than the uppermost first sensor among the at least two first sensors by the distance; and The calculation unit obtains the data of the movement distance of the end effector relative to the first reference position or the second reference position from the control unit while the end effector is raised or lowered relative to the at least two first sensors, and obtains detection data from the at least two first sensors, calculates the vertical position of each chuck based on the obtained movement distance data and the detection data, and further calculates the deviation of each chuck from the normal vertical position based on the database stored in the position data storage unit and the calculated vertical positions, and finds out whether each of the plurality of chucks has an abnormality based on the calculated deviation. 如請求項1所述之搬送裝置,其中, 該間距係與該最上位夾頭部至該最下位夾頭部之距離除以該第一感測器之個數而得之長度相同。 The conveying device as described in claim 1, wherein, the spacing is the same as the length obtained by dividing the distance from the uppermost clamp head to the lowermost clamp head by the number of the first sensors. 如請求項1或2所述之搬送裝置,更包含: 基底,對該末端執行器以使其能夠進退之方式支撐;以及 支柱,設置於該基底上,從與進退方向及上下方向垂直的方向之側而在相鄰於該末端執行器進退之進退路徑的位置,對該至少二個第一感測器進行支撐。 The conveying device as described in claim 1 or 2 further comprises: A base, which supports the end effector in a manner that enables it to move forward and backward; and A support, which is disposed on the base and supports the at least two first sensors from a side in a direction perpendicular to the forward and backward direction and the up and down direction and at a position adjacent to the forward and backward path of the end effector. 如請求項1或2所述之搬送裝置,其中, 該資料庫中所保存之各該夾頭部之正常上下方向的位置係為該夾頭部之尖端部的位置, 該至少二個第一感測器係在該複數個夾頭部之尖端部的側方,對側方是否存在物體進行檢測, 該運算部係基於該資料庫、所獲取之移動距離的資料及該檢測資料,運算該複數個夾頭部之各該尖端部相對於正常上下方向的位置在上下方向上之偏離量,進而判定所運算出之各該尖端部之該偏離量是否超過第一容許值, 在該運算部判定各該尖端部之該偏離量之至少一者超過該第一容許值的情況下,該控制部係使該末端執行器之移動停止。 The conveying device as described in claim 1 or 2, wherein, the normal vertical position of each of the clamping parts stored in the database is the position of the tip of the clamping part, the at least two first sensors are located on the side of the tip of the plurality of clamping parts to detect whether there is an object on the side, the calculation unit calculates the deviation of each of the tip of the plurality of clamping parts in the vertical direction relative to the normal vertical position based on the database, the obtained moving distance data and the detection data, and further determines whether the calculated deviation of each of the tip exceeds the first allowable value, when the calculation unit determines that at least one of the deviations of each of the tip exceeds the first allowable value, the control unit stops the movement of the end effector. 如請求項4所述之搬送裝置,更包含: 警告裝置,在該運算部判定各該尖端部之該偏離量之至少一者超過該第一容許值的情況下,該警告裝置係警告有異常。 The conveying device as described in claim 4 further comprises: A warning device, which warns of an abnormality when the calculation unit determines that at least one of the deviation amounts of each of the tip portions exceeds the first allowable value. 如請求項1或2所述之搬送裝置,其中, 該資料庫中所保存之各該夾頭部之正常上下方向的位置係為該夾頭部之尖端部的位置, 該至少二個第一感測器係在該複數個夾頭部之尖端部的側方,對側方是否存在物體進行檢測, 該運算部係基於該資料庫、所獲取之移動距離的資料及該檢測資料,運算該複數個夾頭部之各該尖端部相對於正常上下方向的位置在上下方向上之偏離量,根據所運算出之該偏離量來運算該複數個夾頭部各自相對於水平方向之傾斜角,進而判定所運算出之該複數個夾頭部各自之該傾斜角是否超過第二容許值, 在該運算部判定該複數個夾頭部各自之該傾斜角之至少一者超過該第二容許值的情況下,該控制部係使該末端執行器之移動停止。 A conveying device as described in claim 1 or 2, wherein, the normal vertical position of each of the clamping parts stored in the database is the position of the tip of the clamping part, the at least two first sensors are located on the side of the tip of the plurality of clamping parts to detect whether there is an object on the side, the calculation unit calculates the vertical deviation of each of the tip of the plurality of clamping parts relative to the normal vertical position based on the database, the obtained moving distance data and the detection data, calculates the tilt angle of each of the plurality of clamping parts relative to the horizontal direction according to the calculated deviation, and further determines whether the calculated tilt angle of each of the plurality of clamping parts exceeds the second allowable value, When the calculation unit determines that at least one of the tilt angles of each of the plurality of chuck parts exceeds the second allowable value, the control unit stops the movement of the end effector. 如請求項1或2所述之搬送裝置,其中, 在該位置資料儲存部中儲存有該基板之厚度資料, 該運算部係基於所獲取之移動距離的資料與該檢測資料,運算各該夾頭部之上下方向的位置,進而基於該位置資料儲存部中所儲存之資料庫、該基板之厚度資料及所運算出之該上下方向的位置,判定該複數個夾頭部各自是否夾持有該基板。 A conveying device as described in claim 1 or 2, wherein, the thickness data of the substrate is stored in the position data storage unit, the calculation unit calculates the vertical position of each of the clamping head parts based on the obtained moving distance data and the detection data, and further determines whether each of the plurality of clamping head parts clamps the substrate based on the database stored in the position data storage unit, the thickness data of the substrate and the calculated vertical position. 如請求項1或2所述之搬送裝置,其中, 該末端執行器具有夾緊部,該夾緊部在該複數個夾頭部各自夾持該基板之情況下自側面側成批地夾緊該基板, 該控制部在該複數個夾頭部之全部或一部分夾持該基板的情況下,使該夾緊部夾緊該基板,且保持該基板被該夾緊部夾緊之狀態,在使該最下位夾頭部位於該第一基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器上升至少相當於該間距,或者在使該最上位夾頭部位於該第二基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器下降至少相當於該間距。 The conveying device as described in claim 1 or 2, wherein, the end actuator has a clamping portion, and the clamping portion clamps the substrate in batches from the side when the plurality of clamping head portions each clamp the substrate, The control unit causes the clamping unit to clamp the substrate and maintain the substrate clamped by the clamping unit when all or part of the plurality of clamping units clamp the substrate, and causes the end effector to rise relative to the at least two first sensors by at least the distance when the lowest clamping unit is at the first reference position, or causes the end effector to descend relative to the at least two first sensors by at least the distance when the highest clamping unit is at the second reference position. 如請求項1或2所述之搬送裝置,更包含: 基底,對該末端執行器以使其能夠進退之方式支撐; 第一移動機構,對該基底進行支撐,並且能夠沿與該末端執行器之進退方向及上下方向垂直的方向移動; 支撐體,對該第一移動機構以使其能夠移動之方式支撐;以及 第二感測器,設置於該基底上,檢測該基底相對於該支撐體之上表面的進退方向上的傾斜, 在該第二感測器之輸出超過第三容許值的情況下,該運算部判定該基底相對於該支撐體的進退方向上的傾斜有異常, 在該運算部判定在進退方向上的傾斜有異常的情況下,該控制部係使該末端執行器之移動停止。 The conveying device as described in claim 1 or 2 further includes: a base, which supports the end effector in a manner that enables it to move forward and backward; a first moving mechanism, which supports the base and is capable of moving in a direction perpendicular to the forward and backward direction and the up and down direction of the end effector; a support body, which supports the first moving mechanism in a manner that enables it to move; and a second sensor, which is disposed on the base and detects the inclination of the base in the forward and backward direction relative to the upper surface of the support body, when the output of the second sensor exceeds the third allowable value, the calculation unit determines that the inclination of the base in the forward and backward direction relative to the support body is abnormal, When the calculation unit determines that the tilt in the forward and backward direction is abnormal, the control unit stops the movement of the end effector. 如請求項9所述之搬送裝置,其中, 該第二感測器具有: 發光部,設置於該基底上,向該進退方向射出光; 受光部,設置於該基底上,與該發光部在該進退方向上相向而接受該發光部之光,並對所接受之光的量進行測定;以及 遮光板,設置於該支撐體上,自該支撐體向該發光部與該受光部之間延伸而遮擋該發光部之光的一部分, 在該基底相對於該支撐體的進退方向上的傾斜發生變化的情況下,相對於該發光部及該受光部之該遮光板的位置係發生變化,從而遮擋該發光部之光的量係發生變化, 該運算部在該受光部所測定之光量之變化超過該第三容許值的情況下,判定該基底相對於該支撐體的進退方向上的傾斜有異常。 The conveying device as described in claim 9, wherein, the second sensor comprises: a light-emitting portion, disposed on the base, emitting light in the advancing and retreating direction; a light-receiving portion, disposed on the base, facing the light-emitting portion in the advancing and retreating direction and receiving light from the light-emitting portion, and measuring the amount of light received; and a light-shielding plate, disposed on the supporting body, extending from the supporting body to between the light-emitting portion and the light-receiving portion to block a portion of the light from the light-emitting portion, when the inclination of the base in the advancing and retreating direction relative to the supporting body changes, the position of the light-shielding plate relative to the light-emitting portion and the light-receiving portion changes, thereby changing the amount of light blocked from the light-emitting portion, When the change in the amount of light measured by the light receiving unit exceeds the third allowable value, the calculation unit determines that the inclination of the base relative to the advancing and retreating direction of the support body is abnormal. 如請求項1或2所述之搬送裝置,更包含: 第一馬達,對第二移動機構進行驅動,該第二移動機構係使該末端執行器進退;以及 第二馬達,對第三移動機構進行驅動,該第三移動機構係使該第二移動機構升降, 該運算部分別自該第一馬達與該第二馬達獲取轉矩值之資料,並判定所獲取之該第一馬達之轉矩值是否超過第一閾值,進而判定所獲取之該第二馬達之轉矩值是否超過第二閾值, 在該運算部判定該第一馬達之轉矩值超過第一閾值的情況下,該控制部係使該第一馬達停止,或者在該運算部判定該第二馬達之轉矩值超過第二閾值的情況下,該控制部係使該第二馬達停止。 The conveying device as described in claim 1 or 2 further includes: A first motor drives a second moving mechanism, the second moving mechanism moves the end actuator forward and backward; and A second motor drives a third moving mechanism, the third moving mechanism moves the second moving mechanism up and down, The calculation unit obtains torque value data from the first motor and the second motor respectively, and determines whether the torque value of the first motor obtained exceeds the first threshold value, and further determines whether the torque value of the second motor obtained exceeds the second threshold value, When the calculation unit determines that the torque value of the first motor exceeds the first threshold value, the control unit stops the first motor, or when the calculation unit determines that the torque value of the second motor exceeds the second threshold value, the control unit stops the second motor. 一種搬送裝置之控制方法,該搬送裝置包含: 末端執行器,具有沿上下方向排列且分別夾持基板之複數個夾頭部;以及 至少二個第一感測器,係以自該複數個夾頭部中之位於最上方的最上位夾頭部至位於最下方之最下位夾頭部的距離之一半以下的間距排列,在該複數個夾頭部之側方,對側方是否存在物體進行檢測, 該搬送裝置之控制方法包含以下步驟: 在使該最下位夾頭部位於第一基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器上升至少相當於該間距的步驟,該第一基準位置係比該至少二個第一感測器中之位於最下方的第一感測器低了相當於該間距,或者在使該最上位夾頭部位於第二基準位置的狀態下,使該末端執行器相對於該至少二個第一感測器下降至少相當於該間距的步驟,該第二基準位置係比該至少二個第一感測器中之位於最上方的第一感測器高了相當於該間距; 在執行使該末端執行器相對於該至少二個第一感測器上升或下降之步驟之期間,獲取該末端執行器從該第一基準位置或該第二基準位置相對移動之移動距離的資料,並且自該至少二個第一感測器獲取檢測資料的步驟; 基於所獲取之移動距離的資料與該檢測資料,運算各該夾頭部之上下方向的位置,進而根據保存該複數個夾頭部各自之正常上下方向的位置之資料的資料庫與所運算出之各該上下方向的位置,運算各該夾頭部之從正常上下方向的位置起算之偏離量,並基於所運算出之偏離量求出該複數個夾頭部各自有無異常的步驟;以及 在該複數個夾頭部之至少一者有異常的情況下,使該末端執行器之移動停止的步驟。 A control method for a conveying device, the conveying device comprising: an end actuator having a plurality of clamping heads arranged in the vertical direction and clamping substrates respectively; and at least two first sensors arranged at a distance less than half of the distance from the topmost clamping head located at the top to the bottommost clamping head located at the bottom of the plurality of clamping heads, on the sides of the plurality of clamping heads, detecting whether there are objects on the sides, the control method for the conveying device comprises the following steps: In the state where the lowermost clamping head is at the first reference position, the step of raising the end actuator relative to the at least two first sensors by at least the distance, the first reference position is lower than the lowermost first sensor among the at least two first sensors by the distance, or in the state where the uppermost clamping head is at the second reference position, the step of lowering the end actuator relative to the at least two first sensors by at least the distance, the second reference position is higher than the uppermost first sensor among the at least two first sensors by the distance; During the step of causing the end effector to rise or fall relative to the at least two first sensors, data of the movement distance of the end effector relative to the first reference position or the second reference position is obtained, and detection data is obtained from the at least two first sensors; Based on the obtained movement distance data and the detection data, the up-down position of each of the chuck parts is calculated, and then the deviation of each of the chuck parts from the normal up-down position is calculated based on a database storing data of the normal up-down position of each of the chuck parts and the calculated up-down positions, and whether each of the chuck parts is abnormal is determined based on the calculated deviation; and In the event that at least one of the plurality of chucks is abnormal, the step of stopping the movement of the end effector.
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