TWI876172B - Double-sided polishing conditioner - Google Patents

Abstract

A double-sided polishing conditioner includes a carrier, a plurality of polishing plates, and a binding material. The carrier has an upper surface and a lower surface opposite to the upper surface, and has a center and a plurality of opened structures distributed at intervals around the center. The polishing plates are respectively disposed in the opened structures of the carrier. Each of the polishing plates has a first polishing surface exposed from the upper surface of the carrier and a second polishing surface exposed from the lower surface of the carrier. The binding material is filled in the opened structures, so as to fix in position the polishing plates. Therefore, the double-sided polishing conditioner has the advantages of a longer service life, small quantities of materials, and lower costs, and is more convenient and flexible in use and maintenance.

Description

Double-sided grinding dresser

The present invention relates to a grinding tool, in particular to a grinding dresser for use on both sides, which can be widely used in the processing of brittle and hard materials such as ceramics, metals, glass, wafers, etc.

In the semiconductor manufacturing process, wafers are continuously deposited, exposed, developed, and etched to form layers of microcircuits. If each layer of microcircuit is uneven, it will inevitably affect the stacking of layers. Therefore, a certain degree of flatness must be achieved in order to produce integrated circuits with good performance.

Chemical Mechanical Polishing (CMP) is one of the common planarization technologies in semiconductor manufacturing. It uses a polishing pad (Pad) to contact the wafer (or other semiconductor components), and uses polishing fluid as needed to remove impurities or uneven structures on the wafer surface through chemical reactions and physical mechanical forces. After the polishing pad has been used for a period of time, the grinding debris generated during the grinding process is likely to accumulate on the surface of the polishing pad, resulting in reduced polishing effect and efficiency. At this time, a conditioner must be used to condition the surface of the polishing pad to keep the polishing pad in the best use condition.

However, in the existing dressers, the grinding unit (such as the grinding block) with abrasive grains attached is fixed to the carrier by the non-working surface, that is, only one side can actually play a role, and the abrasive grains that actually participate in dressing the polishing pad are very limited; this not only causes a waste of abrasive grains, but also shortens the service life of the dresser. In addition, when the existing dresser loses its dressing ability due to operational defects or wear and tear, the entire dresser can only be replaced.

The technical problem to be solved by the present invention is to provide a double-sided grinding dresser to address the shortcomings of the prior art. Both the front and back sides of the grinding dresser can be used to dress the polishing pad, for example, to remove the waste accumulated on the surface of the polishing pad to maintain good processing quality and efficiency.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a double-sided grinding dresser, which includes a carrier, a plurality of grinding blocks and a bonding material. The carrier has an upper surface and a lower surface opposite to the upper surface, and has a carrier center and a plurality of opening structures distributed at intervals around the carrier center. The plurality of grinding blocks are respectively arranged in the plurality of opening structures, wherein each of the grinding blocks has a first grinding surface exposed on the upper surface of the carrier and a second grinding surface exposed on the lower surface of the carrier. The bonding material is filled into the plurality of opening structures to fix the plurality of grinding blocks.

In an embodiment of the present invention, each of the opening structures has a hollow portion and at least one supporting portion disposed around the hollow portion. Each of the grinding blocks includes a grinding portion and at least one wing portion disposed around the grinding portion, the grinding portion is accommodated in the hollow portion of the corresponding opening structure, and the first grinding surface and the second grinding surface are formed on the grinding portion opposite to each other, and at least one wing portion abuts against at least one supporting portion of the corresponding opening structure. The bonding material is configured to connect at least one wing portion of each grinding block and at least one supporting portion of the corresponding opening structure into one body.

In one embodiment of the present invention, at least one wing portion of each of the grinding blocks is fixed to at least one supporting portion of the corresponding opening structure by a portion of the bonding material.

In one embodiment of the present invention, at least one wing portion of each of the grinding blocks has at least one through hole, and another portion of the bonding material passes through at least one through hole to contact at least one supporting portion of the corresponding opening structure.

In an embodiment of the present invention, at least one of the supporting portions completely surrounds the hollow portion.

In an embodiment of the present invention, the carrier has a plurality of first fixing holes that do not overlap with the positions of the plurality of opening structures, and the plurality of first fixing holes are adjacent to the edge of the carrier.

In one embodiment of the present invention, the double-sided grinding dresser further includes a mounting pad, which is fixed on the upper surface or the lower surface of the carrier and avoids the position where the plurality of opening structures are located.

In one embodiment of the present invention, the thickness of the mounting pad is greater than the height of the first grinding surface relative to the upper surface of the carrier, or greater than the height of the second grinding surface relative to the lower surface of the carrier.

In one embodiment of the present invention, the carrier has a plurality of first fixing holes that do not overlap with the positions of the plurality of opening structures, and the plurality of first fixing holes are adjacent to the edge of the carrier. In addition, the mounting pad has a plurality of first mounting holes corresponding to the positions of the plurality of first fixing holes.

In one embodiment of the present invention, each of the abrasive blocks comprises a plurality of abrasive grains, and the abrasive grains are a plurality of diamond grains or a plurality of cubic boron nitride grains. Alternatively, each of the abrasive blocks comprises a cemented carbide body and an abrasive layer coated on an outer surface of the cemented carbide body.

In one embodiment of the present invention, the carrier is in the shape of a disk, and the number of the plurality of opening structures is four and they are evenly distributed around the center of the carrier.

One of the beneficial effects of the present invention is that, by virtue of the technical features of "multiple grinding blocks are respectively disposed in multiple opening structures of a carrier, wherein each grinding block has a first grinding surface exposed on the upper surface of the carrier and a second grinding surface exposed on the lower surface of the carrier" and "a bonding material is filled in the multiple opening structures of the carrier to fix the multiple grinding blocks", both sides of the grinding dresser of the present invention can be used. When one side has been passivated to the point of losing the dressing ability, it only needs to be turned over to perform the dressing work on the other side. In addition, the multiple grinding blocks exist independently, and the grinding blocks that do not meet the working requirements (such as damaged grinding blocks) can be directly removed from the carrier for replacement without replacing the entire dresser.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.

The following is an explanation of the implementation of the "double-sided grinding dresser" disclosed in the present invention through specific concrete embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used herein may include any one or more combinations of the associated listed items as appropriate.

Unless otherwise defined, the terms used herein have the same meanings as those generally understood by those skilled in the art. The materials involved in each embodiment are commercially available or prepared according to prior art unless otherwise specified.

[First embodiment]

Referring to FIGS. 1 to 4 , the first embodiment of the present invention provides a grinding dresser Z, which mainly includes a carrier 1, a plurality of grinding blocks 2 and a bonding material 3. The carrier 1 has an upper surface 101 and an opposite lower surface 102, and has a carrier center 1c and a plurality of opening structures 11 distributed at intervals around the carrier center 1c. The plurality of grinding blocks 2 are respectively disposed in the plurality of opening structures 11, wherein each grinding block 2 has a first grinding surface 201 exposed on the upper surface 101 of the carrier 1 and a second grinding surface 202 exposed on the lower surface 102 of the carrier 1. The bonding material 3 is filled into the plurality of opening structures 11 to fix the plurality of grinding blocks 2. Therefore, both the front and back sides of the grinding dresser Z of the present invention can be used to dress the polishing pad, for example, to remove the waste material accumulated on the surface of the polishing pad, so that the surface of the polishing pad has a certain degree of roughness to maintain good processing quality and efficiency.

Furthermore, both the first grinding surface 201 and the second grinding surface 202 of the multiple grinding blocks 2 can be used as working surfaces. When the first grinding surface 201 of the multiple grinding blocks 2 has been passivated to the point where it is difficult to trim the polishing pad, the carrier 1 only needs to be turned over and the second grinding surface 202 of the multiple grinding blocks 2 can be used for trimming.

It should be noted that, although the features of the grinding dresser Z of the present invention are described in this article by taking the dressing of wafer polishing pads as an example, the grinding dresser Z of the present invention can also be used in other dressing processes to perform dressing work on various brittle and hard materials such as ceramics, metals, glass, wafers, etc.

In this embodiment, the carrier 1 can be configured to hold a plurality of grinding blocks 2 on a driving head (not shown) of a polishing machine, so that the plurality of grinding blocks 2 can perform trimming work on the polishing pad under the drive of the driving head to restore the surface morphology of the polishing pad and remove the waste accumulated on the surface of the polishing pad. The carrier 1 can be a metal carrier such as a metal disc, but is not limited thereto; the outer diameter of the carrier 1 can be 9 cm to 50 cm, and the thickness can be 0.2 cm to 3 cm. However, the outer diameter and thickness of the carrier 1 can be flexibly adjusted according to actual application requirements. In some embodiments, the carrier 1 can also be a hard plastic carrier.

In addition, the carrier 1 may have a plurality of first fixing holes 1h1, and a plurality of fixing members F such as screws or bolts may be respectively inserted into the plurality of first fixing holes 1h1 to achieve a fixed connection between the carrier 1 and the driving head of the polishing machine. In other words, the plurality of first fixing holes 1h1 are arranged to avoid the plurality of opening structures 11, that is, the positions of the plurality of first fixing holes 1h1 and the plurality of opening structures 11 do not overlap each other, and the plurality of first fixing holes 1h1 are adjacent to the edge of the carrier 1.

Optionally, the carrier 1 may also have a plurality of second fixing holes 1h2 to accommodate machines of different manufacturers and models, or fixing parts of different structures and sizes. In other words, the plurality of second fixing holes 1h2 are arranged to avoid the plurality of opening structures 11 and the plurality of first fixing holes 1h1, that is, the positions of the plurality of second fixing holes 1h2, the plurality of opening structures 11 and the plurality of first fixing holes 1h1 do not overlap, and the positions of the plurality of second fixing holes 1h2 are closer to the center 1c of the carrier than the plurality of first fixing holes 1h1.

As shown in FIG. 2 and FIG. 4 , in order to skillfully and compactly combine a plurality of grinding blocks 2 on the carrier 1, each opening structure 11 of the carrier 1 has a hollow portion 111 and at least one supporting portion 112 disposed around the hollow portion 111; each grinding block 2 includes a grinding portion 21 and at least one wing portion 22 disposed around the grinding portion 21, wherein the grinding portion 21 is accommodated in the hollow portion 111 of the corresponding opening structure 11, and the first grinding surface 201 and the second grinding surface 202 are formed on the grinding portion 21 opposite to each other, and the at least one wing portion 22 abuts against the at least one supporting portion 112 of the corresponding opening structure 11. In addition, the bonding material 3 is configured to connect the at least one wing portion 22 of each grinding block 2 with the at least one supporting portion 112 of the corresponding opening structure 11 into one body. Specifically, at least one wing portion 22 of each grinding block 2 is fixed to at least one supporting portion 112 of the corresponding opening structure 11 by a portion of the bonding material 3 .

In practical application, the plurality of opening structures 11 may have substantially the same directionality relative to the carrier center 1c, and in each opening structure 11, at least one supporting portion 112 may completely surround the hollow portion 111; the hollow portion 111 may be a hollow groove, and the number of at least one supporting portion 112 may be one and formed in a ring shape. The bonding material 3 may be an adhesive material such as a synthetic resin composition, which has good adhesion to the carrier 1. However, the above description is only a feasible implementation method and is not intended to limit the present invention.

As shown in FIG. 4 , in order to better fix the bonding material 3 to the multiple grinding blocks 2, the wing portion 22 of the grinding block 2 may have at least one through hole 22h, and part of the bonding material 3 may pass through at least one through hole 22h to contact the supporting portion 112 below, producing an effect similar to locking.

Please refer to FIG. 11 . In this embodiment, the grinding block 2 may include a carbide body 21a and a grinding layer 21b coated on the outer surface of the carbide body 21a. The carbide body 21a is the base of the grinding block 2, and has a three-dimensional pattern with ups and downs on the outer surface. The carbide may be made of tungsten carbide, silicon carbide or other hard metals, and the grinding layer 21b may be a diamond film layer, but the present invention is not limited to the above examples.

In some embodiments, the abrasive block 2 may include a binder and abrasive grains, and the forming method of the abrasive block 2 may include a hot pressing or cold pressing forming step, a sintering, a coating step, and a fine processing step (i.e., a step of processing the abrasive portion 21 and the wing portion 22 on the sintered body). The binder may be a resin, a metal, or a ceramic binder; the abrasive grains may be diamond abrasive grains or cubic boron nitride abrasive grains, and their size may be micrometer-level or nanometer-level.

Please refer to Figures 7 to 10. It should be noted that the grinding dresser Z of the present invention can perform dressing work on objects made of different brittle and hard materials by changing the number, shape and arrangement of multiple grinding blocks 2; in addition, the size and type of abrasive particles in multiple grinding blocks 2 can also be changed at the same time.

[Second embodiment]

Referring to FIG. 5 and FIG. 6 , the second embodiment of the present invention provides a grinding dresser Z, which includes a carrier 1, a plurality of grinding blocks 2, a bonding material 3, and a mounting pad 4. The carrier 1 has an upper surface 101 and a lower surface 102 opposite to the upper surface 101, and has a carrier center 1c and a plurality of opening structures 11 distributed at intervals around the carrier center 1c. The plurality of grinding blocks 2 are respectively disposed in the plurality of opening structures 11, wherein each grinding block 2 has a first grinding surface 201 exposed on the upper surface 101 of the carrier 1 and a second grinding surface 202 exposed on the lower surface 102 of the carrier 1. The bonding material 3 is filled into the plurality of opening structures 11 to fix the plurality of grinding blocks 2. The mounting pad 4 can be fixed on the upper surface 101 or the lower surface 102 of the carrier 1 and avoid the location of the plurality of opening structures 11 to prevent the first polishing surfaces 201 or the second polishing surfaces 202 of the plurality of polishing blocks 2 from being squeezed and damaged.

Furthermore, in the trimming process of the wafer polishing pad, the carrier 1 and the driving head of the polishing machine (not shown in the figure) can be fixedly connected by the mounting pad 4, so that the driving head can drive the carrier 1, so that the multiple grinding blocks 2 perform trimming work on the polishing pad with one of the first grinding surface 201 and the second grinding surface 202, and in the presence of the mounting pad 4, the other side of the first grinding surface 201 and the second grinding surface 202 can maintain a safe distance from the driving head.

In actual application, the thickness of the mounting pad 4 is greater than the height of the first grinding surface 201 relative to the upper surface 101 of the carrier 1, or greater than the height of the second grinding surface 202 relative to the lower surface 102 of the carrier 1. In addition, the mounting pad 4 has a plurality of first mounting holes 4h1, the number and position of which correspond to the plurality of first fixing holes 1h1 of the carrier 1. When in use, the fixing member F such as a screw or a bolt can be sequentially inserted into the first fixing hole 1h1 and the first mounting hole 4h1, and locked into the drive head of the polishing machine. In order to adapt to different fixing members or machines, the mounting pad 4 can also have a plurality of second mounting holes 4h2, the number and position of which correspond to the plurality of second fixing holes 1h2 of the carrier 1.

The relevant technical details mentioned in the first embodiment are still valid in this embodiment, and in order to reduce repetition, they are not repeated here. Similarly, the relevant technical details mentioned in this embodiment can also be applied in the first embodiment.

[Beneficial Effects of Embodiments]

One of the beneficial effects of the present invention is that, by virtue of the technical features of "multiple grinding blocks are respectively disposed in multiple opening structures of a carrier, wherein each grinding block has a first grinding surface exposed on the upper surface of the carrier and a second grinding surface exposed on the lower surface of the carrier" and "a bonding material is filled in the multiple opening structures of the carrier to fix the multiple grinding blocks", both sides of the grinding dresser of the present invention can be used. When one side has been passivated to the point of losing the dressing ability, it only needs to be turned over to perform the dressing work on the other side. In addition, the multiple grinding blocks exist independently, and the grinding blocks that do not meet the working requirements (such as damaged grinding blocks) can be directly removed from the carrier for replacement without replacing the entire dresser.

In addition, when the grinding dresser of the present invention is used, the mounting pad can be fixed on the upper surface or the lower surface of the carrier to prevent the first grinding surface or the second grinding surface of the plurality of grinding blocks from being squeezed and damaged.

Furthermore, the grinding dresser of the present invention has the advantages of longer service life, less material, lower cost, more convenient and flexible use and maintenance, etc.

The above disclosed contents are only the preferred feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the scope of the patent application of the present invention.

Z: Grinding dresser 1: Carrier 1c: Carrier center 1h1: First fixing hole 1h2: Second fixing hole 101: Upper surface 102: Lower surface 11: Opening structure 111: Hollow part 112: Support part 2: Grinding block 201: First grinding surface 202: Second grinding surface 21: Grinding part 21a: Carbide body 21b: Grinding layer 22: Wing part 22h: Through hole 3: Bonding material 4: Mounting pad 4h1: First mounting hole 4h2: Second mounting hole F: Fixing part

FIG1 is a three-dimensional schematic diagram of a grinding dresser assembly according to a first embodiment of the present invention.

FIG. 2 is a partially exploded perspective view of the grinding dresser of the first embodiment of the present invention.

FIG. 3 is a schematic top view of the grinding dresser of the first embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view along the IV-IV section line in FIG. 3 , showing the sintered abrasive block.

FIG5 is a three-dimensional schematic diagram of a grinding dresser assembly according to a second embodiment of the present invention.

FIG6 is a partially exploded perspective view of a grinding dresser according to a second embodiment of the present invention.

7 to 10 are schematic diagrams of different implementations of the grinding dresser of the first and second embodiments of the present invention.

FIG. 11 is another schematic cross-sectional view along the IV-IV section line in FIG. 3 , showing the film-coated polishing block.

Z: grinding dresser 1: carrier 1c: carrier center 1h1: first fixing hole 1h2: second fixing hole 101: upper surface 102: lower surface 11: opening structure 111: hollow part 112: supporting part 2: grinding block 21: grinding part 22: wing part 22h: through hole 3: bonding material

Claims (10)

A double-sided grinding dresser comprises: A carrier having an upper surface and a lower surface opposite to the upper surface, wherein the carrier has a carrier center and a plurality of opening structures spaced around the carrier center; A plurality of grinding blocks are respectively arranged in the plurality of opening structures, wherein each of the grinding blocks has a first grinding surface exposed on the upper surface of the carrier and a second grinding surface exposed on the lower surface of the carrier; and A bonding material is filled into the plurality of opening structures to fix the plurality of grinding blocks; wherein the carrier has a plurality of first fixing holes that do not overlap with the positions of the plurality of opening structures, and the plurality of first fixing holes are adjacent to the edge of the carrier. A double-sided grinding dresser as described in claim 1, wherein each of the opening structures has a hollow portion and at least one supporting portion arranged around the hollow portion; each of the grinding blocks includes a grinding portion and at least one wing portion arranged around the grinding portion, the grinding portion is accommodated in the hollow portion of the corresponding opening structure, and the first grinding surface and the second grinding surface are formed on the grinding portion opposite to each other, and at least one of the wing portions rests on at least one of the supporting portions of the corresponding opening structure; the bonding material is configured so that at least one of the wing portions of each grinding block is connected to at least one of the supporting portions of the corresponding opening structure as a whole. A double-sided grinding dresser as described in claim 2, wherein at least one wing portion of each grinding block is fixed to at least one supporting portion of the corresponding opening structure by a portion of the bonding material. A double-sided grinding dresser as described in claim 3, wherein at least one wing portion of each grinding block has at least one through hole, and another portion of the bonding material passes through at least one through hole to contact at least one supporting portion of the corresponding opening structure. A double-sided grinding dresser as described in claim 2, wherein at least one of the supporting portions completely surrounds the hollow portion. The double-sided grinding dresser as described in claim 1 further includes a mounting pad, which is fixed on the upper surface or the lower surface of the carrier and avoids the position where the multiple opening structures are located. A double-sided grinding dresser as described in claim 6, wherein the thickness of the mounting pad is greater than the height of the first grinding surface relative to the upper surface of the carrier, or greater than the height of the second grinding surface relative to the lower surface of the carrier. A double-sided grinding dresser as described in claim 6, wherein the mounting pad has a plurality of first mounting holes corresponding to the positions of the plurality of first fixing holes. A double-sided grinding dresser as described in claim 1, wherein each of the grinding blocks comprises a plurality of abrasive grains, and the plurality of abrasive grains are a plurality of diamond grains or a plurality of cubic boron nitride grains. A double-sided grinding dresser as described in claim 1, wherein each of the grinding blocks includes a cemented carbide body and a grinding layer coated on an outer surface of the cemented carbide body.

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