TWI874602B - Component sealing method, component sealing device, and method for manufacturing semiconductor product - Google Patents

Abstract

[Topic] Provide a component sealing method, component sealing device and semiconductor product manufacturing method that can seal components with excellent accuracy and is easy to handle workpieces and sealing materials in the sealing process. [Solution] The component sealing method comprises: a first sealing process, in which a substrate 10 carrying an LED 11 and a sealing plate S are accommodated in a chamber 29, and the sealing plate S is brought into contact with the LED 11 mounting surface of the substrate 10 while the internal space of the chamber 29 is depressurized so that the sealing plate S covers the LED 11; and a second sealing process, in which, after the first sealing process, the pressure in the internal space of the chamber 29 is increased, and the LED 11 is sealed with the sealing plate S.

Description

Component sealing method, component sealing device, and method for manufacturing semiconductor product

The present invention relates to a component sealing method, a component sealing device and a method for manufacturing a semiconductor product for sealing a component such as a semiconductor chip or an electronic component carried by a workpiece such as a semiconductor wafer (hereinafter referred to as a "wafer") or a substrate.

In the manufacturing process of electronic products such as BGA (Ball grid array) packaging, a process is performed in which components such as semiconductor chips mounted on the surface of a workpiece such as a wafer or a substrate are sealed and packaged using a sealing material such as a resin composition. Examples of previous sealing methods include a method in which a liquid resin is poured into a mold on which a workpiece with mounted components is arranged, and the resin is thermally cured to seal the components (see, for example, Patent Document 1). [Prior Technical Document] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2017-087551

[Problems to be solved by the invention]

However, the above-mentioned conventional devices have the following problems.

In the previous sealing method using liquid resin, the flatness of the resin that seals the periphery of the component is very low when the sealing is completed, and the problem of reduced precision of electronic products occurs due to this low flatness. In order to avoid reduced precision of electronic products, a process of molding the surface of the packaged electronic products is required, which reduces the manufacturing efficiency of electronic products. In addition, the problem that liquid resins are difficult to handle in each process compared to solid resins is also a concern.

The present invention is developed in view of the above situation, and its main purpose is to provide a component sealing method, component sealing device and semiconductor product manufacturing method that can seal components with excellent accuracy and facilitate the handling of workpieces and sealing materials in the sealing process. [Means for solving the problem]

In order to achieve this purpose, the present invention adopts the following structure. That is, the component sealing method of the present invention comprises: a first sealing step, wherein a workpiece carrying a component and a sheet-shaped sealing material are accommodated in a chamber, and the sheet-shaped sealing material is brought into contact with the component carrying surface of the workpiece while the internal space of the chamber is depressurized, and the component is covered with the sheet-shaped sealing material; and a second sealing step, wherein after the first sealing step, the internal space of the chamber is pressurized to seal the component with the sheet-shaped sealing material.

(Function-Effect) According to this structure, the element is sealed using a sheet-shaped sealing material that is pre-flat. Therefore, when the element is already sealed, the flatness of the sheet-shaped sealing material that seals the element can be improved.

In addition, in the first sealing process, the space below the workpiece is depressurized inside the chamber. That is, the space around the component mounted on the workpiece is depressurized and evacuated. Therefore, when the sheet-shaped sealing material covers the component, it is possible to prevent gas from being drawn into the space between the sheet-shaped sealing material and the component. This can avoid the reduction of the adhesion caused by the entrainment of gas.

Furthermore, in the second sealing process, the pressure in the inner space of the chamber is increased to seal the element with the sheet-shaped sealing material. In this case, the internal space is pressurized so that the pushing force can be evenly applied to the entire sheet-shaped sealing material. Therefore, the unevenness on the surface of the sheet-shaped sealing material due to the bias of the force acting on the sheet-shaped sealing material can be reliably avoided, so the flatness of the sheet-shaped sealing material in the element sealing state can be more reliably improved.

In the second sealing process, by appropriately pressurizing the internal space, the air pressure in the internal space can be arbitrarily adjusted in the second sealing process. Therefore, a sufficiently large pushing force can be applied to the sheet-shaped sealing material. Therefore, the sheet-shaped sealing material can be filled in the gap between the components reliably. Therefore, the components can be sealed with higher precision.

Furthermore, in the above invention, preferably, in the first sealing step, the sheet-shaped sealing material is deformed into a convex shape toward the device mounting surface of the workpiece so as to contact the device mounting surface of the workpiece.

(Function-Effect) According to this structure, since the sheet-shaped sealing material can be deformed into a convex shape toward the component mounting surface of the workpiece, the sheet-shaped sealing material can contact the component mounting surface of the workpiece in a manner of radially expanding from a point. Therefore, when the sheet-shaped sealing material contacts the component, the inclusion of air bubbles can be avoided.

Furthermore, in the above invention, it is preferred that in the second sealing step, the pressure in the inner space of the chamber is increased to above atmospheric pressure. In this case, since a larger thrust force can be applied between the sheet-shaped sealing material and the element, the element can be more precisely sealed by the sheet-shaped sealing material.

Furthermore, in the above invention, the sheet-shaped sealing material is held in a long transfer plate; and the chamber is provided with an upper shell and a lower shell; the first sealing step preferably comprises: an upper and lower space forming step, which is to insert the transfer plate through the upper shell and the lower shell, thereby dividing the internal space of the chamber into: a lower space for arranging the workpiece with the component mounting surface set to an upward state, and a lower space for arranging the workpiece by holding the plate on the transfer plate; The sheet-like sealing material is disposed in an upper space opposite to the aforementioned lower space; a decompression process for the upper and lower spaces, which is to decompress the aforementioned upper space and the lower space; and a contact process, which is to increase the pressure of the aforementioned upper space to be higher than the pressure of the aforementioned lower space after the decompression process for the upper and lower spaces, and to deform the aforementioned sheet-like sealing material into a convex shape toward the aforementioned component mounting surface by the pressure difference generated between the aforementioned upper space and the aforementioned lower space, so that the aforementioned sheet-like sealing material contacts the aforementioned component mounting surface of the workpiece.

(Function-Effect) According to this structure, in the first sealing process, the upper space and the lower space are depressurized, and the pressure in the upper space is increased to a higher level than that in the lower space, thereby making the sheet-shaped sealing material contact the component mounting surface of the workpiece. That is, the sheet-shaped sealing material is brought into contact with the component while the lower space is evacuated by depressurization. Therefore, during sealing, it is possible to more reliably avoid the situation where air bubbles are drawn between the sheet-shaped sealing material and the component. In addition, since the pressure difference is applied evenly to the entire sheet-shaped sealing material, it is possible to avoid the situation where the workpiece or component is damaged due to the bias of the force.

Furthermore, in the above invention, the sheet-shaped sealing material is held in a long transfer plate, the chamber has an upper shell and a lower shell, and the first sealing step preferably comprises: an upper and lower space forming step, by inserting the transfer plate through the upper shell and the lower shell, the internal space of the chamber is divided into: a lower space for arranging the workpiece with the component mounting surface facing upward, and a lower space for separating the transfer plate from the workpiece. The upper space is opposite to the lower space and is made of the sheet-like sealing material held by a plate; only the upper space and the lower space are depressurized; and a depressurization contact process is performed, whereby the sheet-like sealing material is deformed into a convex shape toward the component mounting surface by the pressure difference generated between the upper space and the lower space, and the sheet-like sealing material contacts the component mounting surface of the workpiece when the lower space is depressurized.

(Function-Effect) According to this structure, in the first sealing process, only the lower space is depressurized, and the resulting pressure difference is used to make the sheet-shaped sealing material contact the component mounting surface of the workpiece. That is, the sheet-shaped sealing material is brought into contact with the component while the lower space is evacuated by depressurization, so that bubbles can be more reliably prevented from being drawn between the sheet-shaped sealing material and the component during sealing. Moreover, the pressure difference acts evenly on the entire sheet-shaped sealing material, so damage to the workpiece or component due to biased force can be avoided. In addition, since only the lower space needs to be depressurized, there is no need to depressurize the upper space. Therefore, the complexity and high cost of the device can be avoided.

Furthermore, in the above invention, it is preferred that the sheet-shaped sealing material has a predetermined shape corresponding to the component mounting surface of the workpiece, and is held by the long transfer sheet.

(Function-Effect) According to this structure, the sheet-shaped sealing material has a predetermined shape corresponding to the component mounting surface of the workpiece. Therefore, the sheet-shaped sealing material can properly seal the component according to the position and shape of the component mounting surface of the workpiece. Furthermore, since there is no need to cut the sheet-shaped sealing material into a suitable predetermined shape, the process of sealing the component can be shortened.

Furthermore, in the above invention, it is preferred to have a plate-like elastic body disposed inside the aforementioned upper shell, and in the aforementioned upper and lower space forming process, the aforementioned plate-like elastic body is disposed in such a manner that the aforementioned plate-like elastic body abuts against the surface of the aforementioned transfer plate that does not hold the aforementioned plate-like sealing material by inserting the aforementioned transfer plate through the aforementioned upper shell and the aforementioned lower shell. In this case, the plate-like elastic body can be deformed into a convex shape with a more uniform curvature as a whole by the pressure difference. Therefore, the plate-like sealing material can be easily deformed in response to the shape of the component mounting surface of the workpiece, and the filling property of the gap between the plate-like sealing material components can be improved. Therefore, the component sealing performed by the plate-like sealing material can be performed with better accuracy.

Furthermore, in the above invention, it is preferred to have a heating process for heating the sheet-like sealing material by heating at least one of the lower space and the upper space, and the first sealing process is to make the sheet-like sealing material heated by the heating process contact the component mounting surface of the workpiece.

(Function-Effect) If the sheet-shaped sealing material is heated by the heating process according to this structure, the sheet-shaped sealing material will be softer. In other words, because the sheet-shaped sealing material is easy to deform according to the shape of the component mounting surface of the workpiece, the filling property of the sheet-shaped sealing material in the gap between the components is improved.

Furthermore, in the above invention, it is preferred that the workpiece is provided with one or more convex components on the surface opposite to the component mounting surface, and more preferably, a retaining component having a recessed portion in the center is used to retain the workpiece in a state where the convex component is arranged inside the recessed portion; after the workpiece is retained by the retaining component, the first sealing step is performed.

(Function-Effect) According to this structure, the holding member has a recess in the center. Next, the holding member holds the workpiece in a state where the convex member provided on the non-mounting surface of the component of the workpiece is arranged inside the recess. In this case, the convex member will interfere with the surface of the holding member, and the presence of the recess can avoid the situation where the convex member is damaged. That is, even if the workpiece has a convex member, it is suitable for sealing the component without damaging the workpiece.

In order to achieve this purpose, the present invention may also adopt the following structure. That is, the component sealing device of the present invention comprises: a first sealing mechanism, which accommodates the workpiece carrying the component and the sheet-shaped sealing material in a chamber, and covers the component with the sheet-shaped sealing material by making the sheet-shaped sealing material contact the component carrying surface of the workpiece under the condition that the internal space of the chamber is depressurized; and a second sealing mechanism, which seals the component with the sheet-shaped sealing material by increasing the pressure of the internal space of the chamber after the first sealing step.

(Function-Effect) According to this structure, a sheet-shaped sealing material that is pre-flat is used to seal the element. Therefore, when the sealing of the element is completed, the flatness of the sheet-shaped sealing material that seals the element can be improved.

Furthermore, the first sealing mechanism is to reduce the pressure inside the lower space for placing the workpiece inside the chamber. That is, the space around the component mounted on the workpiece is evacuated by reducing the pressure, so when the plate-shaped sealing material covers the component, it can prevent gas from being drawn into the space between the plate-shaped sealing material and the component. Therefore, the reduction of the close contact force caused by the entrapment of gas can be avoided.

Furthermore, the second sealing mechanism seals the element with the sheet-shaped sealing material by increasing the pressure in the inner space of the chamber. In this case, the pushing force can be uniformly applied to the entire sheet-shaped sealing material by pressurizing the inner space. Therefore, the situation in which the surface of the sheet-shaped sealing material is uneven due to the bias of the force acting on the sheet-shaped sealing material can be reliably avoided, so the flatness of the sheet-shaped sealing material in the element sealing state can be more reliably improved.

In order to achieve this purpose, the present invention may also adopt the following structure. That is, the manufacturing method of the semiconductor product of the present invention is a method for manufacturing a semiconductor product, wherein the semiconductor product is in a state where a component mounted on a workpiece is sealed by a sheet-like sealing material, and comprises: a first sealing step, wherein the workpiece mounted with the component and the sheet-like sealing material are accommodated in a chamber, and the sheet-like sealing material is brought into contact with the component mounting surface of the workpiece while the internal space of the chamber is depressurized, thereby covering the component with the sheet-like sealing material; and a second sealing step, wherein after the first sealing step, the pressure of the internal space of the chamber is increased, thereby sealing the component with the sheet-like sealing material.

(Function-Effect) This structure can be used to manufacture semiconductor products in which the components mounted on the workpiece are sealed by a sheet-like sealing material. That is, since the components are sealed by a sheet-like sealing material that is pre-flat, the flatness of the sheet-like sealing material that seals the components in the semiconductor product can be improved. In addition, in the first sealing process, the inside of the chamber is evacuated by reducing the pressure, so that the gas can be prevented from being drawn between the component and the sheet-like sealing material. In addition, in the second sealing process, the component is sealed by increasing the pressure in the space inside the chamber, so the sheet-like sealing material can be reliably filled in the gap between the components by high pressure. Therefore, a semiconductor product in which the components are sealed with better precision can be manufactured. [Effect of the invention]

According to the device sealing method, device sealing apparatus and semiconductor product manufacturing method of the present invention, the device is sealed using a sheet-shaped sealing material that is previously flat. Therefore, when the device is sealed, the flatness of the sheet-shaped sealing material that seals the device can be improved.

Furthermore, in the first sealing process, the lower space in the chamber where the workpiece is placed is compressed. That is, the space around the component mounted on the workpiece is depressurized and evacuated, so when the sheet-shaped sealing material covers the component, it is possible to prevent gas from being drawn into the space between the sheet-shaped sealing material and the component. Therefore, it is possible to avoid a reduction in the adhesion due to the entrapment of gas.

Furthermore, in the second sealing process, the component is sealed with the sheet-shaped sealing material by increasing the pressure in the inner space of the chamber. In this case, the pushing force can be uniformly applied to the entire sheet-shaped sealing material by pressurizing the inner space. Therefore, the situation where the surface of the sheet-shaped sealing material is uneven due to the bias of the force acting on the sheet-shaped sealing material can be reliably avoided, and the flatness of the sheet-shaped sealing material in the state where the component has been sealed can be more reliably improved.

[Form used to implement the invention]

The following is a description of an embodiment of the present invention with reference to the accompanying drawings. Fig. 1(a) is a perspective view of the back side of a sealing member P, and Fig. 1(b) is a longitudinal cross-sectional view of the sealing member P. Fig. 2 is a perspective view of the substrate 10 to be sealed by the sealing member P and the ring frame f.

As shown in FIG. 1( a ), the sealing member P of the present embodiment includes a sealing plate S and a transfer plate T. The sealing plate S is pre-cut into a predetermined shape corresponding to the shape of the substrate 10. In the present embodiment, the sealing plate S is pre-cut into a roughly rectangular shape. Here, as shown in FIG. 1( a ), the so-called roughly rectangular shape means that each corner of the rectangle has an arc shape. In addition, in the present embodiment, the size of the sealing plate S is set to be larger than the substrate 10 and smaller than the inner diameter of the lower shell 29A described later.

The transfer plate T is long, and the sealing plate S is attached and held at a predetermined interval on the transfer plate T. The sealing plate S is equivalent to the plate-shaped sealing material of the present invention.

As shown in FIG1(b), the transfer plate T has a structure in which a non-adhesive base material Ta and an adhesive material Tb are laminated. Examples of materials constituting the base material Ta include polyolefins and polyethylene, and examples of materials constituting the adhesive material Tb include acrylic acid ester copolymers.

As shown in FIG. 1( b ), the sealing plate S has a structure formed by laminating a non-adhesive substrate Sa and an adhesive sealing material Sb. The substrate Sa is attached to the adhesive material Tb of the transfer plate T, so that the transfer plate T can hold the sealing plate S. Examples of materials constituting the substrate Sa include polyolefins, polyethylene, etc. In this embodiment, although the shape of the sealing plate S is roughly rectangular, it can be appropriately changed according to the shape of the substrate 10.

The sealing material Sb is provided with a separator S (not shown), and the adhesive surface of the sealing material Sb is exposed by peeling off the separator S. In this embodiment, the sealing material Sb is made of an optically transparent adhesive material OCA (Optica Clear Adhesive).

As shown in FIG2 , a plurality of LEDs 11 and TFTs (not shown) are arranged in parallel in a two-dimensional array in the central portion of the surface of the substrate 10. That is, the surface of the substrate 10 is formed with projections and depressions by the LEDs 11. The LEDs 11 are connected to the substrate 10 via TFTs or bumps (not shown). Examples of the substrate 10 include a glass substrate, an organic substrate, a circuit substrate, a silicon wafer, and the like. In this embodiment, although the substrate 10 is roughly rectangular, the shape of the substrate 10 can be appropriately changed to any shape, such as a rectangle, a circle, a polygon, or the like. The substrate 10 is equivalent to the workpiece in the present invention. The LEDs 11 are equivalent to the components in the present invention.

The ring frame f is sized and shaped to surround the substrate 10. The device sealing device 1 of the embodiment seals the LED 11 mounted on the substrate 10 with a sealing plate S, thereby forming a sealed body MF in which the P substrate 10 and the ring frame f are integrated by a sealing member.

<Description of the overall structure> Here, the overall structure of the component sealing device 1 of the embodiment is described. FIG3 is a top view showing the basic structure of the component sealing device 1 of the embodiment. The component sealing device 1 is a structure having a rectangular portion 1a with a longer horizontal side and a protruding portion 1b. The protruding portion 1b is a structure that is connected to the central portion of the rectangular portion 1a and protrudes to the upper side. In addition, in the following description, the long side direction of the rectangular portion 1a is referred to as the left-right direction (x direction), and the horizontal direction (y direction) orthogonal thereto is referred to as the front-back direction.

A substrate transfer mechanism 3 is provided on the right side of the rectangular portion 1a. Two containers 5 containing substrates 10 are placed side by side on the lower right side of the rectangular portion 1a. A sealing body collecting portion 6 for collecting a sealing body MF described later is provided at the left end of the rectangular portion 1a.

The aligner 7, the holding table 9 and the frame supply unit 12 are provided in order from the upper right side of the rectangular portion 1a. The sealing unit 13 for sealing each LED 11 mounted on the substrate 10 with a sealing plate S is provided in the protruding portion 1b.

As shown in Fig. 4, the substrate transfer mechanism 3 includes a substrate transfer device 16 supported on the right side of a guide rail 15 horizontally installed on the upper part of the rectangular portion 2a so as to be reciprocable. In addition, a frame transfer device 17 supported on the left side of the guide rail 15 so as to be movable left and right is provided.

The substrate transfer device 16 is configured to transfer the substrate 10 taken out from either side of the container 5 to the left and right and to the front and back. The substrate transfer device 16 is provided with a stage 18 that can be moved to the left and right and a stage 19 that can be moved to the front and back.

The left-right movable platform 18 is configured to be reciprocatingly movable in the left-right direction along the guide rail 15. The forward-backward movable platform 19 is configured to be reciprocatingly movable in the forward-backward direction along the guide rail 20 installed on the left-right movable platform 18.

Furthermore, a holding unit 21 for holding the substrate 10 is installed below the movable stage 19. The holding unit 21 is configured to be movable in a vertical direction (z direction) along a lifting rail 22 extending in the longitudinal direction. In addition, the holding unit 21 rotates around the z-direction axis by a rotating shaft (not shown).

A horseshoe-shaped holding arm 23 is mounted at the bottom of the holding unit 21. The holding surface of the holding arm 23 is provided with a plurality of slightly protruding adsorption pads, and the substrate 10 is adsorbed and held by the adsorption pads. Furthermore, the holding arm 23 is connected to the air pressure device via a flow path formed inside the holding arm 23 and a connecting flow path connected to the base end side of the flow path.

By utilizing the above movable structure, the substrate 10 held by adsorption can be moved forward and backward, left and right, and rotated around the z-axis by the holding arm 23 .

The frame transfer device 17 includes: a table 24 that can be moved left and right, a table 25 that can be moved forward and backward, a flexion-extension link mechanism 26 connected to the lower part of the flexion-extension link mechanism 26, and an adsorption plate 27 installed at the lower end of the flexion-extension link mechanism 26. The adsorption plate 27 adsorbs and holds the substrate 10. A plurality of adsorption pads 28 for adsorbing and holding the ring frame f are arranged around the adsorption plate 27. Therefore, the frame transfer device 21 can adsorb and hold the ring frame f or the sealing body MF mounted and held on the holding table 9 and perform lifting and lowering and forward and backward and left and right transfer. The adsorption pad 28 can be adjusted to slide in the horizontal direction according to the size of the ring frame f.

As shown in Fig. 5 and Fig. 6, the holding table 9 is a metal chuck table having the same shape or larger than the substrate 10, and is connected to the vacuum device 31 and the pressurizing device 32 installed outside. The operation of the vacuum device 31 and the pressurizing device 32 is controlled by the control unit 33.

Furthermore, as shown in FIG5 , the holding table 9 is housed in the lower housing 29A constituting the chamber 29 and is connected to one end of a rod 35 penetrating the lower housing 29A. The other end of the rod 35 is connected to an actuator 37 having a motor or the like. Therefore, the holding table 9 can be moved up and down inside the chamber 29.

The lower shell 29A has a frame holding portion 38 surrounding the lower shell 29A from the outside. The frame holding portion 38 is configured to form a flush surface with the upper surface of the ring frame f and the cylindrical top of the lower shell 29A when the ring frame f is placed. In addition, the cylindrical top of the lower shell 29A is preferably subjected to a demolding treatment.

In addition, as shown in Fig. 3, the holding table 9 is configured to be reciprocally movable between an initial position and a sealing position along a track 40 attached in the front-rear direction. The initial position is inside the rectangular portion 1a, and the position of the holding table 9 is indicated by a solid line in Fig. 3. In this setting position, the substrate 10 and the ring frame f are placed on the holding table 9.

The sealing position is inside the protruding portion 1b, and the holding table 9 is indicated by a dotted line in Fig. 3. By moving the holding table 9 to the sealing position, a sealing process using the sealing member P can be performed on the substrate 10 placed on the holding table 9.

The frame supply unit 12 is a drawer-type cassette for storing a predetermined number of stacked ring frames f.

As shown in FIG5 , the sealing unit 13 is composed of a sheet supply section 71, a separator recovery section 72, an element sealing section 73, and a sheet recovery section 74. The sheet supply section 71 is configured to supply the sealing member P to the sealing position from a supply reel loaded with a raw material roll on which a sealing member PS with a separator attached (sealing member P with a separator S attached) is wound, and the separator S is stripped by a separator stripping roller 75.

The separating member collecting portion 72 includes a collecting reel for collecting the separating member S separated from the sealing member P. The collecting reel is formed so as to be controllably driven in forward and reverse rotation by a motor.

The element sealing portion 73 is composed of the chamber 29, the element sealing mechanism 81, the plate cutting mechanism 82, and the like.

The chamber 29 is composed of a lower shell 29A and an upper shell 29B. The lower shell 29A is disposed so as to surround the holding platform 9 and reciprocates in the front-rear direction between the initial position and the sealing position together with the holding platform 9. The upper shell 29B is disposed on the protruding portion 1b and is configured to be able to rise and fall.

As shown in Fig. 6, the lower housing 29A and the upper housing 29B are connected to the vacuum device 31 and the pressurizing device 32 via the flow path 101. In addition, the flow path 101 on the upper housing 11B side is provided with an electromagnetic valve 103. In addition, the two housings 11A and 11B are connected to the flow path 109 having electromagnetic valves 105 and 107 for opening to the atmosphere, respectively.

Furthermore, the upper housing 29B is connected to a flow path 111, which has an electromagnetic valve 110 for adjusting the internal pressure of temporary decompression by venting. In addition, the opening and closing operations of these electromagnetic valves 103, 105, 107, 110, the operation of the vacuum device 31, and the operation of the pressurizing device 32 are executed by the control unit 33.

That is, the vacuum device 31 is configured so that the air pressure of the space on the side of the lower shell 29 and the air pressure of the space on the side of the upper shell can be independently depressurized. In addition, the pressurizing device 32 is configured so that the air pressure of the space on the side of the lower shell 29 and the air pressure of the space on the side of the upper shell can be independently pressurized.

The element sealing mechanism 81 includes a movable table 84, a sticking roller 85, and a pinch roller 86. The movable table 84 moves horizontally to the left and right along a guide rail 88 erected in the left and right directions. The sticking roller 85 is axially supported by a bracket connected to the front end of a cylinder disposed on the movable table 84. The pinch roller 86 is provided on the side of the sheet recovery section 74 and includes a feed roller 89 driven by a motor and a pinch roller 90 raised and lowered by a cylinder.

The plate cutting mechanism 82 is equipped with a support shaft 92 extending in the z direction on the lifting drive table 91 that lifts the upper shell 29B, and a hub 93 that rotates around the support shaft 92. The hub 93 has a plurality of support arms 94 extending in the radial direction. The front end of at least one support arm 94 is equipped with a circular plate-shaped cutter 95 that cuts the transfer plate T of the sealing member P along the ring frame f in a manner that can be moved up and down. The front ends of the other support arms 94 are equipped with a pressing roller 96 in a manner that can be moved up and down.

The sheet recovery unit 74 includes a recovery reel for reeling up the unnecessary transfer sheet T that has been removed after cutting. The recovery reel is driven in forward and reverse rotation by a motor (not shown).

As shown in FIG4 , the sealing body recovery unit 6 is equipped with a cassette 41 for storing and recovering the sealing body MF. The cassette 41 has a longitudinal rail 45 connected and fixed to the device frame 43, and a lifting platform 49, which is lifted and lowered by a motor 47 along the longitudinal rail 45 through screw feeding. Therefore, the sealing body recovery unit 6 is configured to place the sealing body MF on the lifting platform 49 and perform pitch feeding and lowering.

As shown in FIG. 6 and other figures, the element sealing mechanism 81 has a heating mechanism 120 inside the upper housing 29B. The heating mechanism 120 has a cylinder 121 and a heating member 123. The cylinder 121 is connected to the upper part of the heating member 123, and the heating member 123 can be raised and lowered inside the chamber 29 by the action of the cylinder 121. In addition, the heating member 123 may not be a structure that can be raised and lowered as long as it can heat the sealing member P.

The heating member 123 is generally in the shape of a disk and is slightly larger than the sealing plate S. A heater 125 for heating the transfer plate T and the sealing plate S is buried inside the heating member 123. The temperature heated by the heater 125 is adjusted to a temperature at which the transfer plate T and the sealing plate S can be softened. An example of the heating temperature is about 50°C to 70°C.

<Basic Operation Overview> Here, the basic operation of the device sealing device of the embodiment is described. FIG. 7 is a flow chart illustrating a series of steps of sealing the LED 11 mounted on the substrate 10 with the sealing plate S using the device sealing device 1.

Step S1 (supply of workpiece) When the sealing command is issued, the ring frame f is transferred from the frame supply unit 12 to the frame holding unit 38 of the lower shell 29A, and at the same time, the substrate 10 is transferred from the container 5 to the holding table 9.

That is, the frame transfer device 17 adsorbs the ring frame f from the frame supply unit 12 and transfers it to the frame holding unit 38. When the frame transfer device 17 releases the adsorption of the ring frame f and rises, the ring frame f is aligned. In one example of this alignment, it is performed by synchronously moving a plurality of support pins vertically arranged around the frame holding unit 38 toward the center. The ring frame f is set in the frame holding unit 38 and waits until the substrate 10 is transferred.

While the frame transfer device 17 transfers the ring frame f, the substrate transfer device 16 inserts the holding arm 23 between the substrates 10 stored in multiple stages. The holding arm 23 holds and absorbs the portion of the surface of the substrate 10 that is not equipped with the LED 11 (the portion on the peripheral side), moves it out, and transfers it to the aligner 7. The aligner 7 uses the suction pad protruding from the center to suck the center of the back of the substrate 10. At the same time, the substrate transfer device 16 releases the suction of the substrate 10 and retreats to the top. The aligner 7 holds the substrate 10 with the suction pad to rotate it, while aligning it according to the notch.

When the alignment is completed, the adsorption pad with the substrate 10 adsorbed thereon protrudes from the surface of the aligner 7. The substrate transfer device 16 moves to this position and adsorbs and holds the substrate 10 from the surface side. The adsorption pad releases adsorption and descends.

The substrate transfer device 16 moves to the top of the holding table 9, and places the substrate 10 on the holding table 9 with the surface side on which the LED 11 is mounted facing upward. When the holding table 9 absorbs and holds the substrate 10 and the frame holding portion 38 absorbs and holds the ring frame f, the lower housing 29A moves along the rail 40 from the initial position to the sealing position on the side of the element sealing mechanism 81. FIG. 8 shows the state in which the substrate 10 is supplied to the holding table 9 and moves to the sealing position.

Step S2 (supply of sealing plate) When the workpiece is supplied by the substrate transfer device 16, etc., the sealing plate S is supplied in the sealing unit 13. That is, a predetermined amount of sealing member P is sent out from the plate supply unit 71 while peeling off the separation member S. The sealing member P, which is elongated as a whole, is guided to the upper side of the sealing position along the predetermined transfer path. At this time, as shown in FIG. 9, the sealing plate S held on the transfer plate T is positioned so as to be located above the substrate 10 placed on the holding table 9.

Step S3 (Cavity Formation) When the workpiece and the sealing plate S are supplied, the attachment roller 85 descends as shown in FIG10. Then, as shown in FIG11, the transfer plate T is attached to the range covering the ring frame f and the top of the lower shell 29A while rotating above the transfer plate T. In conjunction with the movement of the attachment roller 85, a predetermined amount of the sealing member P is peeled off from the plate supply section 71 and sent out.

When the transfer plate T is attached to the ring frame f, the attachment roller 85 is reset to the initial position and the upper shell 29B is lowered. As the upper shell 29B is lowered, as shown in FIG. 11 , the transfer plate T attached to the top of the lower shell 29A is clamped by the upper shell 29B and the lower shell 29A to form a chamber 29.

At this time, the transfer plate T in the sealing member P functions as a sealing material, and the chamber 29 is divided into two spaces by the transfer plate T. That is, the chamber 29 is divided into a lower space H1 on the lower shell 29A side and an upper space H2 on the upper shell 29B side, sandwiching the transfer plate T. The substrate 10 and LED 11 located in the lower shell 29A are closely facing the sealing plate S with a predetermined clearance.

Step S4 (1st sealing process) After the chamber 29 is formed, the 1st sealing process begins. First, the control unit 33 operates the vacuum device 31 while the electromagnetic valves 105, 107, and 110 shown in FIG6 are closed, and the air pressure in the lower space H1 and the air pressure in the upper space H2 are reduced to a predetermined value. Examples of the predetermined value include 10Pa to 100Pa. At this time, the opening of the electromagnetic valve 103 can be adjusted so that the lower space H1 and the upper space H2 are depressurized at the same speed.

When the air pressure of the lower space H1 and the upper space H2 is reduced to a predetermined value, the control unit 33 will close the electromagnetic valve 103 and stop the operation of the vacuum device 31. Then, the control unit 33 will adjust the opening of each electromagnetic valve 103, 105, 107, and 110 to release the pressure so that the air pressure of the upper space H2 is higher than the air pressure of the lower space H1. As shown in FIG. 12, the air pressure of the lower space H1 is higher than the air pressure of the upper space H2, and a pressure difference Fa is generated between the two spaces. By generating the pressure difference Fa, the adhesive member P is pulled from the center portion to the lower shell 29A side and deformed into a convex shape.

In this embodiment, the electromagnetic valves 103 and 107 connected to the lower space H1 are kept closed, and the opening of the electromagnetic valve 110 connected to the upper space H2 is adjusted to release the pressure and finally fully open. By this adjustment, the pressure of the lower space H1 is maintained at a predetermined value while the pressure of the upper space H2 is gradually increased from the predetermined value to return to atmospheric pressure, so a pressure difference Fa is generated.

When the pressure difference Fa is generated, as shown in FIG13 , the actuator 37 is driven to raise the holding table 9. Due to the deformation of the adhesive member P and the rise of the holding table 9 caused by the pressure difference Fa, the sealing plate S contacts the surface of the substrate 10 in a radial manner from the center to the periphery inside the lower space H1 being evacuated. Through this contact, each LED 11 mounted on the substrate 10 is covered by the sealing plate S.

When the LED 11 is covered by the sealing plate S, the control unit 33 sets the electromagnetic valves 103, 105, 107, and 110 to be fully opened, so that the upper space H2 and the lower space H1 are opened to the atmosphere. By opening to the atmosphere, the first sealing process is completed. In this way, in the first sealing process, the sealing plate S is brought into contact with the surface of the substrate 10 in the depressurized state of the internal space of the chamber 29, and the operation of covering the LED 11 with the sealing plate S is performed.

In addition, it is preferred that the upper space H2 is preheated by the heating mechanism 120 before the start of step S4. That is, the control unit 33 operates the heater 125 to heat the upper space H2 to a predetermined temperature. The heating of the heating device 123 can heat the upper space H2 by the heat conduction effect, and the transfer plate T and the sealing plate S can be heated.

The transfer plate T and the sealing plate S become soft due to heating, so their deformability can be improved by the pressure difference Fa. That is, when the sealing plate S covers the LED 11, the compliance of the sealing member P to the upper surface of the substrate 10 and the LED 11 can be further improved. In addition, as shown in FIG. 15 , the heating member 123 can be lowered to abut against the transfer plate T so that the heating member 123 can directly heat the sealing member P.

Step S5 (Second Sealing Process) After the chamber 29 is formed, the second sealing process begins. First, the control unit 33 controls the actuator 37 to lower the holding table 9 to the initial position. Then, the control unit 33 operates the pressurizing device 32 while the solenoid valves 105, 107, and 110 shown in FIG6 are closed, and supplies gas to the lower space H1 and the upper space H2, and pressurizes the lower space H1 and the upper space H2 to a specific value. Examples of specific values include 0.3MPa to 0.5MPa. By performing the pressurizing operation through the pressurizing device 32, the air pressure of the lower space H1 and the air pressure of the upper space H2 are both higher than the atmospheric pressure.

Due to the pressurization of the upper space H2, as shown in FIG14, the pushing force V1 acts from the upper space H2 to the sealing plate S. In addition, since the upper space H2 is also pressurized as a whole, the pushing force V1 can act evenly on the entire sealing plate S. In addition, since the lower space H1 is pressurized as a whole, the pushing force V2 acts evenly from the lower space H1 to the back side of the substrate 10. That is, by the action of the pushing force V1 and the pushing force V2, the sealing material Sb of the sealing plate S can be continuously filled in the gap between the LEDs 11. As a result, the substrate 10 and the sealing plate S are more closely connected, and at the same time, the LEDs 11 are also sealed by the sealing plate S.

When the lower space H1 and the upper space H2 are pressurized to a pressure higher than the atmospheric pressure, and the pushing force acts between the sealing plate S and the LED 11 for a predetermined time, the control unit 33 stops the pressurizing device 32. Then, the control unit 33 sets the electromagnetic valves 103, 105, 107, and 110 to fully open, so that the lower space H1 and the upper space H2 are opened to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29, and raises the holding table 9 so that the back of the substrate 10 abuts against the substrate holding surface of the holding table 9.

Step S6 (cutting of the plate) In addition, during the process of step S4 and step S5 in the chamber 29, the plate cutting mechanism 82 is operated to cut the sealing member P. At this time, as shown in FIG16, the cutter 95 cuts the sealing member P (specifically, the transfer plate T) attached to the ring frame f into the shape of the ring frame f, and at the same time, the pressing roller 96 follows the cutter 95 to rotate and continuously press the plate cutting part on the ring frame f.

At the time when the upper shell 29B is raised, the sealing of the LED 11 by the sealing plate S and the cutting of the sealing member P are completed, so the clamping roller 90 is raised and the clamping of the transfer plate T is released. Then, as shown in FIG. 17 , the clamping roller 86 is moved to roll up and recover the cut useless transfer plate T to the plate recovery unit 74, and at the same time, a predetermined amount of sealing member P is pulled out from the plate supply unit 71. Through each process up to step S6, the sealing member P forms a sealing body MF that integrates the ring frame f and the substrate 10.

When the unnecessary transfer plate T is rolled up and recovered, the pinch roller 86 and the attaching roller 85 return to the initial position. Then, the holding table 9 moves from the sealing position to the initial position while holding the sealing body MF.

Step S7 (recovery of the sealed body) When the holding table 9 returns to the initial position, as shown in FIG18 , the suction pad 28 provided in the frame transfer device 17 will suction and hold the sealed body MF, so that the sealed body MF is separated from the lower shell 29A. The frame transfer device 17 that suctions and holds the sealed body MF will transfer the sealed body MF to the sealed body recovery unit 6. The transferred sealed body MF is stored in the cassette 41.

In the above manner, a series of actions of sealing the LED 11 mounted on the substrate 10 with the sealing plate S is completed. Afterwards, the above process is repeated until the sealed body MF reaches a predetermined amount. In this way, the sealed body MF in which the LED 11 is tightly sealed with the sealing plate S can be manufactured by the component sealing device 1. The sealed body MF in which the LED 11 is tightly sealed with the sealing plate S by the second sealing process is equivalent to the semiconductor device of the present invention.

In addition, although the embodiment uses the ring frame f, the process of manufacturing the sealing body MF of the semiconductor device is not limited to using the ring frame f. That is, by performing each process of steps S1 to S7, the sealing plate S can be made to seal the LED 11 mounted on the substrate 10 in close contact, and the sealing body MF in which the sealing plate S and the substrate 10 are integrated can also be manufactured.

<Effects Produced by the Structure of the Embodiment> According to the device of the embodiment described above, the LED 11 mounted on the substrate 10 is sealed with the sealing plate S by adjusting the air pressure inside the chamber 29. In the conventional sealing method in which a liquid sealing material is filled around the element and then cured, the flatness of the sealing material surface is reduced due to air bubbles mixed into the uncured resin.

On the other hand, in the configuration of the present invention, the base material Sa and the sealing material Sb of the sealing plate S are each in the form of a flat sheet in advance. Therefore, in the state where the sealing is completed by the sealing plate S, the flatness of the surface of the sealing plate S can be improved. Moreover, in the state where the substrate 10 and the sealing plate S are arranged inside the chamber 29, because the sealing is performed by adjusting the air pressure inside the chamber 29, the pressure difference Fa or the thrust forces V1 and V2 will act evenly on the entire sealing plate S. Therefore, it is possible to reliably avoid the unevenness of the surface of the sealing plate S caused by the bias of the force acting on the sealing plate S, and the flatness of the sealing plate S can be more reliably improved.

In the first sealing process of the present invention, the lower space H1 for arranging the substrate 10 in the chamber 29 is depressurized. That is, the space around the LED 11 mounted on the substrate 10 can be evacuated by depressurization, so when the sealing plate S contacts the LED 11 and covers the LED 11, it is possible to prevent gas from being drawn into the space between the sealing plate S and the LED 11. Therefore, it is possible to avoid a decrease in the close contact force due to the gas being drawn in.

Furthermore, in the second sealing step of the present invention, the pressure in the lower space H1 and the upper space H2 is made higher than the atmospheric pressure by applying pressure, so that the sealing material Sb of the sealing plate S is filled in the gap between the LEDs 11 with excellent accuracy.

In the case where the pressure difference Fa is generated by reducing the pressure inside the chamber by using a vacuum device, the magnitude of the pressure difference Fa generated by reducing the pressure from the atmospheric pressure state is below the atmospheric pressure. That is, when the sealing plate S is pressed against the LED 11 by the pressure difference Fa, there is an upper limit to the magnitude of the force that causes the LED 11 to press the sealing plate S. Therefore, when the sealing material Sb of the sealing plate S covers the LED 11 due to the pressure difference Fa generated by the decompression, as shown in FIG. 19(a), the sealing material Sb cannot completely fill the period space of the LED 11, and a gap J may be generated.

In contrast, in the present invention, the upper space H1 and the lower space H2 in the chamber 29 are pressurized by the pressurizing device 32 to form an air pressure greater than the atmospheric pressure. That is, in the second sealing process, the pushing forces V1 and V2 greater than the pressure difference Fa can be applied to the sealing plate S and the LED 11. As a result, as shown in FIG. 19(b), the uncured sealing material Sb is further pushed and deformed by the pushing forces V1 and V2, and the gap J is filled continuously and reliably. Therefore, by performing the second sealing process, the LED 11 can be sealed with better accuracy.

Furthermore, in the second sealing step, the magnitudes of the pushing forces V1 and V2 can be adjusted to any values by appropriately controlling the pressurizing device 32. Therefore, even when the sealing conditions such as the constituent material of the sealing material Sb or the specification and structure of the LED 11 are changed, the LED 11 can be reliably sealed by appropriately adjusting the magnitudes of the pushing forces V1 and V2. Furthermore, since the pushing forces V1 and V2 of appropriate magnitude act evenly on the entire sealing plate S, damage to the substrate 10 or the LED 11 caused by the action of excessive pushing forces or biased pushing forces can be avoided.

Furthermore, in the conventional component sealing method using a mold and a liquid sealant, it is necessary to prepare different molds according to the specifications or materials of the workpiece and the component, so the labor, time and cost required to manufacture the component sealing device are very large.

On the other hand, in the component sealing method of the present invention, the component can be sealed without using a mold, so the time and cost required to manufacture the component sealing device 1 can be greatly reduced. In addition, even if there are changes in various conditions such as workpieces or components, the shape of the sealing plate S can be changed to cope with the changes in the workpieces, etc. Therefore, a component sealing device that meets various conditions can be quickly and easily set.

In addition, the embodiments disclosed in this specification are exemplary in all respects and are not restrictive. The scope of the invention is based on the scope of the patent application, not on the description of the embodiments described above, and even all changes (variations) within the scope of the patent application that are equivalent in meaning and scope are also included. For example, the invention can be implemented in the following ways.

(1) As a workpiece of the embodiment, a substrate 10 having an LED 11 mounted on the front side and a flat back side is used for illustration, but the back side of the workpiece is not limited to a flat structure. That is, as shown in FIG. 20(a), a substrate 131 having a convex member 130 on the back side may also be used as a workpiece. In addition to electronic parts such as LEDs, the convex member 130 may also be a material of the substrate 131. That is, a substrate 131 having concave and convex surfaces on the back side also includes a structure in which the back side of the substrate 131 itself forms concave and convex surfaces.

When the LED 11 mounted on the front side of the substrate 131 having the convex member 130 on the back side is sealed with the sealing plate S, the element sealing device 1 may include a holding table 135 as shown in FIG. 20( b ) instead of the holding table 9 .

The holding platform 135 has an annular protrusion 137 at the outer periphery and a recess 139 at the center. That is, the holding platform 135 is hollow as a whole. In the top view, the recess 139 is formed to include the area where the convex member 130 is arranged on the substrate 131. By supporting the portion of the back side of the substrate 131 where the convex member 130 is not arranged with the protrusion 137, the holding platform 135 can hold the substrate 131 without contacting the convex member 130.

FIG. 21 shows a state where the substrate 131 is supported by the holding platform 135 in the configuration where the lower housing 29A is provided with the holding platform 135. This state corresponds to the process of forming the cavity 29 in step S3. In the configuration where the holding platform 135 is provided, the various processes of sealing the LED 11 on the substrate 10 with the sealing plate S are the same as those in the embodiment already described, and thus the detailed description thereof may be omitted.

(2) In step S4 of the embodiment, after the air pressures of the lower space H1 and the upper space H2 are reduced to predetermined values, the air pressure of the upper space H2 is returned to atmospheric pressure to generate a pressure difference Fa, but the adjustment of the air pressure in step S4 is not limited to this. That is, after the air pressures of the lower space H1 and the upper space H2 are reduced to predetermined values, the air pressure of the lower space H1 may be maintained at the predetermined value while the opening of the electromagnetic valve 105 is appropriately adjusted to cause the valve to be released.

In this case, the air pressure of the upper space H2 is controlled to rise from a predetermined value to a specific value lower than the atmospheric pressure. The pressure difference Fa is generated by this control. After the LED 11 is covered with the sealing plate S by the pressure difference Fa, the control unit 33 sets the electromagnetic valves 103, 105, 107, and 110 to be fully opened, so that the upper space H2 and the lower space H1 are opened to the atmosphere. By opening the atmosphere, the first sealing process is completed.

As in the embodiment, in the configuration in which the pressure difference Fa is generated by returning the air pressure of the upper space H2 to the atmospheric pressure, a larger pressure difference Fa can be obtained, so the sealing member P can be deformed and the process of covering the LED 11 with the sealing plate S can be completed more quickly. On the other hand, as in the variation (2), in the configuration in which the pressure difference Fa is generated by adjusting the air pressure of the upper space H2 to a specific value that is higher than the air pressure of the lower space H1 and lower than the atmospheric pressure, the deformation speed of the sealing member P can be suppressed. As a result, it is possible to avoid the situation in which the sealing plate S quickly covers the LED 11 while the evacuation of the lower space H1 is not completed, so that the situation in which a hole is generated between the sealing plate S and the LED 11 can be prevented.

(3) In step S5 of the embodiment, the pressurizing device 32 pressurizes the interior of both the lower space H1 and the upper space H2, but the present invention is not limited thereto. That is, the pressurizing device 32 only pressurizes the upper space H2 to a pressure higher than the atmospheric pressure, and seals the LED 11 with a higher precision by the push pressure V1.

As a further variation of the configuration of pressurizing only the upper space H2, the lower space H1 may be maintained at a pressure lower than the atmospheric pressure in a depressurized state, and the upper space H2 may be pressurized to a pressure higher than the atmospheric pressure to seal the LED 11. In this configuration, after the first sealing step is performed by the pressure difference Fa in step S4, the electromagnetic valve 105 connected to the upper space H2 is opened while the pressure of the lower space H1 is depressurized to a predetermined value, so that only the upper space H2 is opened to the atmosphere. Next, in step S5, the pressurizing device 32 is activated to pressurize the interior of the upper space H2 to a pressure higher than atmospheric pressure.

In this variation, in step S5, the interior of the upper space H2 is pressurized while the holding table 9 is raised so as to contact the back of the substrate 10. By pressurizing the upper space H2 to generate a push force V1 while the holding table 9 holds the substrate 10, the push force V1 can be evenly applied to the entire surface of the sealing plate S and the substrate 10 even when the lower space H1 is depressurized to a level lower than the atmospheric pressure.

(4) In step S4 of the embodiment, the pressure difference Fa is generated inside the chamber 29 by using the vacuum device 31, so that the sealing plate P is deformed into a convex shape and contacts the LED 11. However, the method of deforming the sealing plate P into a convex shape is not limited to the structure that generates the pressure difference Fa. That is, as shown in FIG. 22, a structure in which a pressing member 141 is provided inside the upper housing 29B may also be used.

The bottom surface of the pressing member 141 is convex (in one example, a hemispherical shape) and is arranged to be located above the sealing plate S. Therefore, by lowering the pressing member 141, the bottom surface of the convex pressing member 141 presses the sealing plate S, and the sealing plate S can be deformed into a convex shape and contact the LED. In this case, the vacuum device 31 required to generate the pressure difference Fa can be omitted. In addition, other structures that can deform the sealing plate P into a convex shape include a structure that uses a roller or the like to press the sealing plate P from above.

(5) In the embodiment, as shown in FIG. 23( a), the chamber 29 may also have a plate-shaped elastic body Ds. The elastic body Ds is configured to be arranged inside the upper shell 29B and to contact the inner diameter of the upper shell 29B. Furthermore, the bottom of the elastic body Ds is configured to be flush with the cylindrical bottom of the upper shell 29B. Therefore, when the lower shell 29A and the upper shell 29B sandwich the transfer plate T to form the chamber 29, the elastic body Ds will abut against the transfer plate T. Specifically, in the transfer plate T, the elastic body Ds will abut on the side opposite to the surface of the retaining sealing plate S (the upper side in the figure). Since the elastic body Ds is arranged to contact the inner diameter of the lower housing 29A, the elastic body Ds is not sandwiched when the cavity 29 is formed, so that the elastic body Ds can be prevented from reducing the airtightness of the cavity 29. Examples of materials constituting the elastic body Ds include rubber, elastomer, or colloidal polymer materials.

By providing the elastic body Ds in the sealing member P, the refractive index of the sealing member P can be made more uniform when the sealing member P is deformed into a convex shape in step S4. In one example, when the sealing plate S is made of a harder material, the refractive index of the sealing member P becomes non-uniform as shown in FIG. 23( b ).

That is, in the region P1 of the transfer plate T where the sealing plate S in the sealing member P is retained, the refractive index of the sealing member P due to the pressure difference Fa is very small due to the presence of the hard sealing plate S. On the other hand, in the region P2 of the sealing member P where the sealing plate S is not retained in the transfer plate T, the refractive index of the sealing member P due to the pressure difference Fa is larger. That is, the region P2 is more easily deformed due to the pressure difference Fa, and the refractive index of the sealing member P in the region P1 is further reduced. As a result, the sealing plate S is less likely to deform, so the filling property of the sealing material Sb in the concave and convex parts of the substrate 10 (the mounting area of the LED 11) is reduced.

On the other hand, in the case of an elastic body Ds, as shown in FIG23(c), the entire elastic body Ds is uniformly deformed into a convex shape by the pressure difference Fa. Therefore, the refractive index of the sealing member P in the area P1 is increased. In other words, the sealing plate S is easily deformed in accordance with the shape of the upper surface of the LED 11 mounting area of the substrate 10, so the filling property of the sealing material Sb for the concave and convex parts of the substrate 10 can be improved. As a result, the sealing of the LED 11 by the sealing plate S can be performed with better accuracy.

(6) In the embodiment, the heating mechanism 120 is disposed on the side of the upper space H2 in the chamber 29. Although it is a structure for heating the upper space H2, it is not limited to this. That is, the heating mechanism 120 may also be a structure for heating the lower space H1. In one example, a structure can be cited in which the heater 125 is disposed inside the holding table 9, and the heater 125 is used to heat the lower space H1, thereby heating the transfer plate T and the sealing plate S. In addition, the heating mechanism 120 may also be a structure for heating both the upper space H1 and the lower space H2.

(7) In the embodiment, the LED 11 is used as an example of the element to be sealed by the sealing plate S, but the present invention is not limited thereto. Other examples of elements include, in addition to the optical element exemplified by the LED 11, semiconductor elements, electronic parts, etc.

(8) In the embodiment, after the LED 11 is sealed by the sealing plate S, a step of curing the sealing material Sb of the sealing plate S may be performed. The step of curing the sealing material Sb may be appropriately changed depending on the material of the sealing material Sb, but as an example, curing by heat treatment or curing by ultraviolet treatment may be cited.

(9) In the embodiment, although OCA is used as the sealing material Sb, it is not limited to this. That is, in addition to optically transparent materials, the sealing material Sb may also be made of optically opaque materials, or colorless or colored materials.

(10) In the embodiment, although the sealing member P is described as having a long transfer plate T and a sealing plate S of a predetermined shape, the sealing member P is not limited to the structure having the transfer plate T. In one example, the sealing member P is as shown in FIG. 24(a), and can also be formed by a long sealing plate S. The structure of step S3 in the case of using a long sealing plate S to seal the LED 11 is shown in FIG. 24(b). That is, the lower shell 29A and the upper shell 29B form a chamber 29 by inserting the sealing plate S.

Next, in step S4, the long sealing plate S is deformed into a convex shape, as shown in Fig. 24(b), and the LED 11 is covered with the sealing plate S. Furthermore, in step S5, the air pressure of the upper space H2 is at least pressurized to above the atmospheric pressure, as shown in Fig. 24(c), and the sealing plate S seals the LED 11.

(11) In the embodiment, the LED 11 is sealed by moving the holding table 9 up and down at a predetermined timing, but the up and down movement of the holding table 9 can also be appropriately changed. In one example, the pressurization process in step S5 is not limited to the structure in which the holding table 9 is lowered, and the pressurization process can also be performed while maintaining the raised state.

(12) In the embodiment, the frame holding portion 38 is disposed outside the lower housing 29A, but the frame holding portion 38 may be disposed inside the lower housing 29A. In this case, the steps after step S4 are performed with the ring frame f and the substrate 10 each housed inside the chamber 29.

(13) In the embodiment, the sealing plate S of the sealing member P is pre-formed to a predetermined shape corresponding to the shape of the LED 11 mounting surface of the substrate 10, but it is not limited to this. That is, the plate supply unit 71 can also be loaded with the sealing member P loaded with the long sealing plate S on the long transfer plate T. The structure of the sealing member P with the long sealing plate S added to the long transfer plate T is as shown in Figure 25(a). In this case, the component sealing device 1 is provided with a plate cutting device 201 upstream of the chamber 29, and the plate cutting device 201 forms the long sealing plate S into a predetermined shape.

The structure of the plate cutting device 201 is shown in FIG25(b). The plate cutting device 201 includes a support table 203, a cutter 205, and a sealing plate recovery unit 207. The support table 203 is configured to horizontally receive the long sealing member P sent and supplied from the plate supply unit 71 along the direction L. The cutter 205 is disposed above the support table 203 and can be raised and lowered by a movable table not shown. In an example of the cutter 205, a roughly rectangular Demson cutter is used.

The sealing plate S layer in the sealing member P is cut into a roughly rectangular shape by the descending of the cutter 205. The configuration in which the cutter 205 cuts the sealing plate S is not limited to this. Other examples include a configuration in which the knife-shaped cutter 205 moves along a roughly rectangular track to cut the sealing plate S into a roughly rectangular shape.

The sealing plate recovery section 207 recovers the useless sealing plate Sn remaining around the sealing plate S cut into a roughly rectangular shape. The useless portion of the sealing plate Sn is peeled off from the transfer plate T after the feed roller 208. The peeled sealing plate Sn is guided to the recovery reel 210 by the guide roller 209. The recovery reel 201 rolls up and recovers the sealing plate Sn peeled off from the transfer plate T. Therefore, by the plate cutting device 201, the sealing member P is formed into a roughly rectangular sealing plate S by the tool 205 and becomes a state of remaining on the transfer plate T. The sealing plate S cut into a roughly rectangular shape is guided to the chamber 29 together with the transfer plate T.

1: Component sealing device 3: Substrate transfer mechanism 5: Container 6: Sealing body recovery unit 7: Alignment device 8: Holding table 9: Frame supply unit 10: Substrate (workpiece) 11: LED (component) 13: Sealing unit 16: Substrate transfer device 17: Frame transfer device 23: Holding arm 27: Adsorption plate 28: Adsorption pad 31: Vacuum device 32: Pressurization device 33: Control unit 38: Frame holding section 71: Plate supply section 72: Separation part recovery section 73: Component sealing section 74: Plate recovery section 81: Component sealing mechanism 82: Plate cutting mechanism 85: Attachment roller 86: Squeeze roller 95: Tool f: Ring frame T: Plate for transfer S: Sealing plate P: Sealing member MF: Sealing body Ta: Base material Tb: Adhesive material Sa: Base material Sb: Sealing material

FIG. 1 is a configuration diagram of a sealing member of an embodiment; wherein (a) is a perspective view of the back side of the sealing member, and (b) is a longitudinal cross-sectional view of the sealing member. FIG. 2 is a perspective view of the configuration of the substrate and the ring frame of the embodiment. FIG. 3 is a top view of the element sealing device of the embodiment. FIG. 4 is a front view of the element sealing device of the embodiment. FIG. 5 is a front view of the sealing unit of the embodiment. FIG. 6 is a longitudinal cross-sectional view of the chamber of the embodiment. FIG. 7 is an action flow chart of the element sealing device of the embodiment. FIG. 8 is an explanatory diagram of step S2 of the embodiment. FIG. 9 is an explanatory diagram of step S2 of the embodiment. FIG. 10 is an explanatory diagram of step S3 of the embodiment. FIG. 11 is an explanatory diagram of step S3 of the embodiment. FIG. 12 is an explanatory diagram of step S4 of the embodiment. FIG. 13 is an explanatory diagram of step S4 of the embodiment. FIG. 14 is an explanatory diagram of step S5 of the embodiment. FIG. 15 is an explanatory diagram of a configuration example of heating a sealing member. FIG. 16 is an explanatory diagram of step S6 of the embodiment. FIG. 17 is an explanatory diagram of step S6 of the embodiment. FIG. 18 is an explanatory diagram of step S7 of the embodiment. FIG. 19 is an explanatory diagram of the effect of the embodiment. Among them, (a) is a longitudinal sectional view illustrating the formation of the gap when the chamber is depressurized and sealed; (b) is a longitudinal sectional view illustrating the state in which the gap is continuously filled by pressurizing the chamber to seal. Figure 20 is an explanatory view of the structure of the variation. Among them, (a) is a longitudinal sectional view of the structure of the substrate of the variation; (b) is a longitudinal sectional view of the structure of the holding table of the variation. Figure 21 is a process explanatory view of step S3 of the variation. Figure 22 is a process explanatory view of step S4 of the variation. Figure 23 is an explanatory view of the structure of the variation. Among them, (a) is a longitudinal section view showing the structure of the sealing member of the variation; (b) is an explanatory diagram of the problem points that may occur in the sealing member of the comparative example without an elastic body; (c) is an explanatory diagram of the advantages of the comparative example with an elastic body. Figure 24 is an explanatory diagram of the structure of the variation. Among them, (a) is a longitudinal section view showing the structure of the sealing member of the variation; (b) is a state diagram of step S4 of the variation; (c) is a state diagram of step S5 of the variation. Figure 25 is an explanatory diagram of the structure of the variation. Among them, (a) is a longitudinal section view showing the structure of the sealing member of the variation; (b) is a three-dimensional diagram illustrating the structure of the plate cutting device provided in the variation.

9: Frame supply department

10: Substrate (workpiece)

11:LED(component)

29: Chamber

29A: Lower housing

35: Rods

37: Actuator

f: Ring frame

H1: Lower space

H2: Upper space

P: Sealing components

S: Sealing plate

T: Plate for transfer

V1, V2: Pushing pressure

Claims (11)

A component sealing method comprises: a first sealing step, wherein a workpiece carrying a component and a sheet-shaped sealing material are housed in a chamber, and the sheet-shaped sealing material is brought into contact with the component-carrying surface of the workpiece under a depressurized state inside the chamber, thereby covering the component with the sheet-shaped sealing material; and a second sealing step, wherein after the first sealing step, the pressure inside the chamber is increased, thereby sealing the component with the sheet-shaped sealing material. A component sealing method as claimed in claim 1, wherein, in the first sealing step, the sheet-like sealing material is brought into contact with the component mounting surface of the workpiece by deforming the sheet-like sealing material into a convex shape toward the component mounting surface of the workpiece. A component sealing method as claimed in claim 1, wherein in the second sealing step, the pressure of the internal space of the chamber is increased to a pressure higher than atmospheric pressure. The component sealing method of claim 2, wherein: the sheet-shaped sealing material is retained on a long transfer plate; the chamber has an upper shell and a lower shell; the first sealing step comprises: an upper and lower space forming step, in which the transfer plate is inserted through the upper shell and the lower shell to divide the internal space of the chamber into: a lower space for arranging the workpiece with the component mounting surface facing upward; and an upper space for retaining the transfer plate through the intermediary The aforementioned sheet-shaped sealing material is opposite to the aforementioned lower space; The upper and lower space decompression process is to decompress the aforementioned upper space and the aforementioned lower space; and The contact process is to increase the pressure of the aforementioned upper space to be higher than the pressure of the aforementioned lower space after the aforementioned upper and lower space decompression process, and by the pressure difference generated between the aforementioned upper space and the aforementioned lower space, the aforementioned sheet-shaped sealing material is deformed into a convex shape toward the aforementioned component mounting surface, so that the aforementioned sheet-shaped sealing material contacts the component mounting surface of the aforementioned workpiece. The component sealing method of claim 2, wherein, the sheet-shaped sealing material is held in a long transfer plate, the chamber has an upper shell and a lower shell, and the first sealing step comprises: an upper and lower space forming step, in which the transfer plate is inserted through the upper shell and the lower shell to divide the internal space of the chamber into: a lower space for arranging the workpiece with the component mounting surface facing upward; and an upper space , the sheet-shaped sealing material held on the transfer plate is opposed to the lower space; and a decompression contact process, by decompressing only the lower space of the upper space and the lower space, a pressure difference is generated between the upper space and the lower space, so that the sheet-shaped sealing material is deformed into a convex shape toward the component mounting surface, and the sheet-shaped sealing material is contacted with the component mounting surface of the workpiece in a state where the lower space is decompressed. A component sealing method as claimed in claim 4 or 5, wherein the sheet-shaped sealing material has a predetermined shape corresponding to the component mounting surface of the workpiece and is retained on the elongated transfer plate. A component sealing method as claimed in claim 4 or 5, wherein, a sheet-shaped elastic body is provided inside the upper shell, and in the upper and lower space forming step, the sheet-shaped elastic body is provided in such a manner that the sheet-shaped elastic body abuts against the surface of the sheet-shaped sealing material not holding the sheet-shaped elastic body in the sheet-shaped transfer plate by inserting the sheet-shaped transfer plate through the upper shell and the lower shell. The component sealing method of claim 4 or 5, wherein, a heating process is provided, which is to heat the sheet-like sealing material by heating at least one of the lower space and the upper space, the first sealing process is to make the sheet-like sealing material heated by the heating process contact the component mounting surface of the workpiece. A component sealing method as claimed in any one of claims 1 to 5, wherein the workpiece has one or more convex components on the surface opposite to the component mounting surface, and further comprises a holding step, which uses a holding component having a concave portion in the center portion to hold the workpiece while the convex component is arranged inside the concave portion, and after the workpiece is held by the holding component, the first sealing step is performed. A component sealing device comprises: a first sealing mechanism for accommodating a workpiece carrying a component and a sheet-like sealing material in a chamber, and covering the component with the sheet-like sealing material by bringing the sheet-like sealing material into contact with the component-carrying surface of the workpiece while reducing the pressure of the inner space of the chamber; and a second sealing mechanism for sealing the component with the sheet-like sealing material by increasing the pressure of the inner space of the chamber after the first sealing step. A method for manufacturing a semiconductor product is a method for manufacturing a semiconductor product, wherein a component mounted on a workpiece is sealed by a sheet-like sealing material, and comprises: a first sealing step, wherein the workpiece mounted with the component and the sheet-like sealing material are accommodated in a chamber, and the sheet-like sealing material is brought into contact with the component mounting surface of the workpiece while the internal space of the chamber is depressurized, thereby covering the component with the sheet-like sealing material; and a second sealing step, wherein after the first sealing step, the pressure of the internal space of the chamber is increased, thereby sealing the component with the sheet-like sealing material.