TWI874373B - Exposure device, illumination optical system, and device manufacturing method - Google Patents

Abstract

An exposure device includes: an illumination optical system having an optical integrator; a projection optical system; a substrate stage for moving an exposed substrate relative to the projection optical system in a scanning direction; an illumination changing component configured to be relatively movable relative to the optical integrator to relatively change an exposure amount for exposing a second area and an exposure amount for exposing a first area relative to the other, wherein the second area is an area where a part of each area of the first exposure area and the second exposure area on the exposed substrate overlaps, and the first area is an area of the other part of the first exposure area and the other part of the second exposure area; and a control unit for moving the illumination changing component in such a way that the exposure amount in the first area becomes relatively larger than the exposure amount in the second area.

Description

Exposure device, illumination optical system, and device manufacturing method

The present invention relates to an exposure device, an illumination optical system and a component manufacturing method.

As a device for transferring the pattern original on the mask to a large substrate by exposure, a scanning exposure device is known that performs exposure by scanning the mask and the substrate relative to the projection optical system. By scanning exposure, the exposure field is expanded in the scanning direction (scanning direction), but there is also a known exposure device that performs multiple scanning exposures by overlapping the exposure area in the non-scanning direction in order to further expand the exposure field in the direction intersecting the scanning direction (non-scanning direction).

Furthermore, the following method is also known: multiple projection optical systems are arranged in parallel in the non-scanning direction, and the exposure is performed while overlapping a portion of the exposure fields of the multiple projection optical systems, thereby utilizing a single scan to transfer the exposure of the electronic circuit to the substrate (e.g., Patent Document 1).

[Prior art literature]

[Patent Literature]

Patent document 1: Japanese Patent Publication No. 2016-54230

According to a first aspect, an exposure device is provided, which uses a first exposure to expose a first exposure area on the exposed substrate within a first time, and a second exposure to expose a second exposure area on the exposed substrate within a second time different from the first time, to expose the exposed substrate, the exposure device comprising: an illumination optical system having an optical integrator for supplying illumination light; a projection optical system; a substrate stage for moving the exposed substrate relative to the projection optical system in a scanning direction in such a manner that a prescribed pattern is exposed on the exposed substrate; and an illumination changing component, which is arranged on the incident surface side of the optical integrator at a position where the incident surface of the illumination light is incident and becomes conjugate with the upper surface of the exposed substrate. The illumination light intensity of the illumination light can be changed by relatively changing the exposure amount of the second area and the exposure amount of the first area relative to the other, wherein the second area is a region where a part of each region of the first exposure area and the second exposure area on the exposed substrate overlaps, and the first area is a region of the other part of the first exposure area and the other part of the second exposure area; and a control unit, which controls the relative movement of the illumination intensity changing component relative to the optical integrator; the control unit moves the illumination intensity changing component relative to the optical integrator in a manner that the exposure amount in the first area becomes relatively larger than the exposure amount in the second area.

According to a second aspect, an exposure device is provided, which uses a first exposure to expose a first exposure area on the exposure substrate within a first time, and a second exposure to expose a second exposure area on the exposure substrate within a second time different from the first time, to expose the exposure substrate, the exposure device comprising: an illumination optical system having an optical integrator for supplying illumination light; a projection optical system; a substrate stage for moving the exposure substrate relative to the projection optical system in a scanning direction in such a manner that a prescribed pattern is exposed on the exposure substrate; an illumination changing member for moving the illumination light at an incident surface of the optical integrator disposed at a position where the incident surface of the illumination light is conjugated with the upper surface of the exposure substrate; The illumination light is changed by changing the exposure ratio of the exposure amount of the second area and the exposure amount of the first area to the other, wherein the second area is a region where a part of each region of the first exposure area and the second exposure area on the exposed substrate overlaps, and the first area is a region where the other part of the first exposure area and the other part of the second exposure area are overlapped; and a control unit controls the relative movement of the illumination changing component relative to the optical integrator; the control unit causes the illumination changing component to move relative to the optical integrator during the movement of the substrate stage relative to the projection optical system.

According to a third aspect, an exposure device comprises: a projection optical system; an illumination optical system having an optical integrator for supplying illumination light to the projection optical system; a substrate stage for moving the exposed substrate relative to the projection optical system in a scanning direction in such a manner that a prescribed pattern is exposed on the exposed substrate; and an illumination changing component for relatively changing the exposure amount of a first area and a second area relative to the exposure amount of the other area, wherein the first area is the exposed area that is continuously exposed in time by the scanning exposure field of the projection optical system during the exposure. The second area is an area that is exposed discretely in time by the scanning exposure field; and a control unit causes the illumination changing component to move relative to the optical integrator in a first direction that optically corresponds to the scanning direction, the optical integrator being arranged at a position where the incident surface of the illumination light becomes a concentric surface relative to the scanning exposure field on the exposed substrate; the control unit causes the illumination changing component to move relative to the optical integrator in such a way that the exposure amount in the first area becomes relatively larger than the exposure amount in the second area.

According to a fourth aspect, an exposure device comprises: a projection optical system; an illumination optical system having an optical integrator for supplying illumination light to the projection optical system; a substrate stage for causing the exposed substrate to move relative to the projection optical system in a scanning direction in a manner such that a prescribed pattern is exposed on the exposed substrate; and an illumination changing component disposed on the incident surface side of the optical integrator at a position where the incident surface of the illumination light is incident on is conjugated with the upper surface of the exposed substrate, and configured to be relatively movable relative to the optical integrator to change the exposure amount in a first area and the exposure amount in a second area. The illumination light is changed in a manner of changing the illumination light in a ratio of one exposure amount to the other exposure amount in the projection optical system, wherein the first area is an area on the exposed substrate that is continuously exposed in time by the scanning exposure field of view of the projection optical system, and the second area is an area that is discretely exposed in time by the scanning exposure field of view; and a control unit controls the relative movement of the illumination changing component relative to the optical integrator; the control unit causes the illumination changing component to move relative to the optical integrator during the movement of the substrate stage relative to the projection optical system.

According to the fifth aspect, a device manufacturing method includes: performing an exposure process on a substrate to be exposed using an exposure device of any one of the first to fourth aspects; and performing a development process on the exposed substrate to be exposed.

According to a sixth aspect, an illumination optical system is an illumination optical system used in an exposure device for irradiating illumination light onto a substrate, wherein the illumination light is irradiated onto a first illumination area on an object moving in a scanning direction within a first time, and the illumination light is irradiated onto a second illumination area on the object moving in the scanning direction within a second time different from the first time, wherein the illumination optical system comprises: an optical integrator disposed at a position where an incident surface of the illumination light is conjugated with an upper surface of the substrate; an illumination changing component for changing the illumination of the illumination light irradiated onto the second area relative to the illumination of the illumination light irradiated onto the first area; The second area is an area where a part of each of the first illumination area and the second illumination area overlaps in the illumination area on the object irradiated with the illumination light, and the first area is an illumination area of the other parts of the first illumination area and the other parts of the second illumination area; and a control unit controls the relative movement of the illumination changing component relative to the optical integrator; the control unit causes the illumination changing component to move relative to the optical integrator during the movement of the substrate stage relative to the projection optical system.

According to a seventh aspect, an illumination optical system is an illumination optical system used in an exposure device for irradiating illumination light onto a substrate, wherein the illumination light is irradiated onto a first illumination area on an object moving in a scanning direction within a first time, and the illumination light is irradiated onto a second illumination area on the object moving in the scanning direction within a second time different from the first time, wherein the illumination optical system comprises: an optical integrator disposed at a position where an incident surface of the illumination light is conjugated with an upper surface of the substrate; an illumination changing member for changing the illumination intensity of the illumination light irradiating the second area, and an illumination changing member for changing the illumination intensity of the illumination light irradiating the second area. The illumination ratio of one of the illuminations of the illumination light of the first area illumination to the other illumination, the second area is an area where a part of each area of the first illumination area and the second illumination area on the substrate overlaps, and the first area is an area of the other part of the first illumination area and the other part of the second illumination area; and a control unit, controlling the relative movement of the illumination changing component relative to the optical integrator; the control unit causes the illumination changing component to move relative to the optical integrator during the movement of the substrate stage relative to the projection optical system.

According to the eighth aspect, an exposure device comprises: the illumination optical system of the sixth or seventh aspect; and a substrate stage, which holds the substrate and moves the substrate relative to the illumination light in a first direction in such a manner that a prescribed pattern of the object is exposed on the substrate.

1: Light source

2: Oval mirror

3: Deflecting mirror

4: Relay lens

5: Deflecting mirror

6: Relay lens

7: Optical fiber

8a, 8b: Input lens

9a, 9b, 9ca, 9cb, 9cc: dimming component holding part

10a~10e: dimming components (illuminance changing components)

10ca1, 10ca2: The third dimming component

10cb1, 10cb2: first end dimming component

10cc1, 10cc2: Second end dimming component

11a~11e: Compound eye lens (optical integrator)

11ci: Incident surface

12a~12e: Focusing lens

13: Moving mirror

14: Laser interferometer

15: Mask

16: Mask carrier

17: Masking platform

19a~19e: Projection optical system

20: Middle image plane

21a~21e: Field of view aperture

21bo, 21co: opening part

22: Substrate

23: Position detection optical system

24: Moving mirror

25: Laser interferometer

26: Illuminance sensor

27: Substrate carrier

28: Substrate carrier platform

50: Control Department

71: Incident side

72a, 72b: ejection side

91a, 91b, 91c: Slides

100:Exposure device

110: Lens element

CP: Conjugate Surface

E, E1: Exposure

ILa~ILe: Illumination optical system

IPIc: Exposure field corresponding area

IXa, IXb, PAXa, PAXb: optical axis

MIa~MIe: lighting field of view

MIb2, MIc2: lighting

Oa~Od: Overlapping part

PIa~PIe: Exposure field of view

PIbc, PIcc: Central area

PIbl, PIcl: left end area

PIbr, PIcr: right end area

PX: Pitch

Sa~Se: non-overlapping part

SIa~SIe: Scanning exposure field of view

SigA, SigB, SigCa, SigCb, SigCc: control signals

Wa, Wb, Ws, Wo: width

X, Y, Z: direction

FIG1 is a side view showing the structure of the exposure device of the first embodiment.

FIG2 is a perspective view showing a portion of the exposure device of the first embodiment.

FIG3 is a three-dimensional diagram showing the exposure device of the first embodiment from the fly-eye lens to the mask in an enlarged manner.

FIG4 is a diagram showing the relationship between the field of view on the mask and the field of view on the substrate of the exposure device of the first embodiment. FIG4 (a1), FIG4 (a2), and FIG4 (a3) are diagrams showing the field of view on the mask in the projection optical system 19c in FIG1, the field of view aperture in the projection optical system, and the field of view on the substrate, respectively. FIG4 (b1), FIG4 (b2), and FIG4 (b3) are diagrams showing the field of view on the mask in the projection optical system 19b in FIG1, the field of view aperture in the projection optical system, and the field of view on the substrate, respectively.

FIG. 5 is a diagram showing an example of exposure energy irradiated onto a substrate and an effective light-sensitive amount in a photosensitive material when the exposure device of the first embodiment performs scanning exposure on a substrate. FIG. 5 (a) is a diagram showing the exposure field of view on a substrate of each projection optical system, FIG. 5 (b) is a diagram showing an exposure area formed on a substrate 22, FIG. 5 (c) is a diagram showing an example of the exposure amount irradiated onto a substrate, and FIG. 5 (d) is a diagram showing another example of the exposure amount irradiated onto a substrate.

FIG6 is a diagram of the compound eye lens, the light-reducing component, and the light-reducing component holding portion of the exposure device of the first embodiment, viewed from the light source side.

(First embodiment of the exposure device)

FIG. 1 is a side view of an exposure device 100 according to the first embodiment. As described later, the exposure device 100 includes five projection optical systems 19a to 19e, but FIG. 1 only shows two of them, namely, the projection optical system 19a and the projection optical system 19b.

The projection optical system 19a to the projection optical system 19e is an optical system that forms an erected image with a projection magnification (horizontal magnification) of +1, and transfers the pattern drawn on the mask 15 to the photosensitive material formed on the upper surface of the substrate 22 by exposure. Furthermore, the substrate 22 formed with the photosensitive material can be interpreted as an exposed substrate.

The substrate 22 is held by the substrate stage 27 via a substrate holder not shown. The substrate stage 27 is scanned in the X direction on the substrate stage platform 28 by a linear motor not shown, and can be moved in the Y direction. The position of the substrate stage 27 in the X direction is measured by the laser interferometer 25 via the position of the moving mirror 24 mounted on the substrate stage 27. The position of the substrate stage 27 in the Y direction is also measured by the laser interferometer not shown.

The position detection optical system 23 detects the position of existing patterns such as alignment marks formed on the substrate 22.

The mask 15 is held by the mask carrier 16. The mask carrier 16 is scanned in the X direction on the mask carrier platform 17 by a linear motor (not shown) and can be moved in the Y direction. The position of the mask carrier 16 in the X direction is measured by the laser interferometer 14 via the position of the moving mirror 13 installed on the mask carrier 16. The position of the mask carrier 16 in the Y direction is also measured by the laser interferometer (not shown).

The control system (not shown) controls the linear motor (not shown) to control the XY positions of the mask stage 16 and the substrate stage 27 according to the measured values of the laser interferometer 14 and the laser interferometer 25. When exposing the mask pattern on the substrate 22, the control system (not shown) scans the mask 15 and the substrate 22 in the X direction relative to the projection optical system 19a to the projection optical system 19e at approximately the same speed while maintaining the imaging relationship formed by the projection optical system 19a to the projection optical system 19e.

In this specification, the direction in which the substrate 22 is scanned during exposure (X direction) is also referred to as the "scanning direction" and the "scanning direction". In addition, the direction (Y direction) orthogonal to the X direction contained in the surface of the substrate 22 is also referred to as the "non-scanning direction" and the "non-scanning direction". The Z direction is a direction orthogonal to the X direction and the Y direction.

Furthermore, in Figure 1 and the following figures, the X direction, Y direction, and Z direction indicated by arrows are set as the + direction.

FIG. 2 is a perspective view showing the portion of the exposure device 100 of the first embodiment from the downstream portion of the illumination optical system ILa to the illumination optical system ILe to the substrate 22. The following description will also be continued with reference to FIG. 2.

As shown in FIG2 , among the five projection optical systems 19a to 19e, three projection optical systems 19a, 19c, and 19e (hereinafter, collectively or individually referred to as "the projection optical system 19F of the first row") are arranged in the Y direction. In addition, two projection optical systems 19b and 19d (hereinafter, collectively or individually referred to as "the projection optical system 19R of the second row") are arranged in the Y direction and are arranged on the +X side compared to the projection optical system 19F of the first row.

Each projection optical system of the first row projection optical system 19F is configured in such a manner that its optical axis is separated at a predetermined interval in the Y direction. Each optical system of the second row projection optical system 19R is configured in the same manner as the projection optical system 19F in the first row. In addition, projection optical system 19b is configured in such a manner that the position of its optical axis in the Y direction coincides with the approximate center of the straight line connecting the respective optical axes of projection optical system 19a and projection optical system 19c. In addition, projection optical system 19d is also configured in the same manner as projection optical system 19b.

The exposure device 100 of the first embodiment includes a plurality of illumination optical systems ILa to ILe corresponding to each of the projection optical systems 19a to 19e. As an example, as shown in FIG1 , the illumination optical system ILa corresponding to the projection optical system 19a includes an input lens 8a, a compound eye lens 11a, and a focusing lens 12a along the optical axis IXa. The other illumination optical systems ILb to ILe also include input lenses 8b to 8e, compound eye lenses 11b to 11e, and focusing lenses 12b to 12e. Furthermore, as mentioned above, FIG. 2 only shows the compound eye lens 11a to compound eye lens 11e and the focusing lens 12a to focusing lens 12e in each illumination optical system ILa to ILe.

Furthermore, in FIG. 1 which is a side view, the projection optical system 19c to the projection optical system 19e are not shown because their positions in the X direction overlap with the projection optical system 19a or the projection optical system 19b. Similarly, the illumination optical system ILc to the illumination optical system ILe are not shown because their positions in the X direction overlap with the illumination optical system ILa or the illumination optical system ILb.

The illumination light supplied from the light source 1 such as a lamp is supplied to each illumination optical system ILa~ILe through the light guide optical system such as the elliptical mirror 2, the deflecting mirror 3, the relay lens 4, the deflecting mirror 5, the relay lens 6, and the optical fiber 7. The optical fiber 7 branches the illumination light that has been incident on one incident side 71 approximately equally and emits it to five emission sides 72a~72e. The illumination light that has been emitted from the five emission sides 72a~72e of the optical fiber 7 is incident on the input lens 8a~input lens 8e in each illumination optical system ILa~ILe. Furthermore, the illumination light passes through the compound eye lens 11a to compound eye lens 11e and the focusing lens 12a to focusing lens 12e, and is irradiated to each illumination area MIa to MIe on the mask 15.

The compound eye lenses 11a to 11e are arranged at a position where their incident side surfaces (surfaces on the sides of the input lenses 8a to 8e) become conjugate surfaces CP, and the conjugate surfaces CP are conjugate (imaging relationship) with the upper surface of the substrate 22 (the upper surface of the substrate holder on which the substrate 22 is placed or its vicinity) through the projection optical system 19a to 19e, the focusing lens 12a to 12e, and the compound eye lenses 11a to 11e.

As an example, FIG3 is a three-dimensional diagram showing an enlarged view of the compound eye lens 11c and the focusing lens 12c included in the illumination optical system ILc, and the illumination area MIc on the mask 15.

The compound eye lens 11c is formed by arranging a plurality of lens elements 110 in the X direction and the Y direction, and the lens element 110 has a cross-sectional shape (shape in the XY plane) of a rectangle that is long in the Y direction and has a shape similar to that of the illumination area MIc. The incident surface 11ci (the upper surface, i.e., the surface on the +Z side) of each lens element 110 becomes a conjugate surface CP with respect to the illumination area MIc on the mask 15 (the upper surface of the mask carrier on which the mask 15 is placed or its vicinity) by an optical system including each lens element 110 and a focusing lens 12c. Therefore, the incident surface 11ci is also a conjugate surface CP with respect to the exposure field PIc on the substrate 22. The illumination light irradiated to the incident surface of each lens element 110 is overlapped and irradiated to the illumination area MIc on the mask 15. Thereby, the illumination intensity of the illumination light in the illumination area MIc is roughly uniform.

The configurations of the other illumination optical systems ILa~ILe except the illumination optical system ILc are the same as those shown in FIG. 3.

Compound eye lenses 11a to 11e are examples of optical integrators that irradiate illumination light to each illumination area MIa to MIe in a superimposed manner.

The dimming components 10a to 10e described later are arranged on the incident surfaces 11ai to 11ei of the compound eye lenses 11a to 11e (on the input lens 8a to 8e sides), and the dimming components 10a to 10e are held by the dimming component holding portions 9a to 9e.

In order to form an upright image, the projection optical system 19a to the projection optical system 19e respectively include, for example, a secondary imaging type optical system. In this case, the optical system constituting the upper half of each projection optical system 19a to 19e forms an intermediate image of the pattern of the mask 15 at the intermediate image plane 20 located near the middle of the direction (Z direction) of the optical axis PAXa to the optical axis PAXe of each projection optical system 19a to 19e. The intermediate image is imaged again by the optical system constituting the lower half of each projection optical system 19a to 19e, and an image of the pattern of the mask 15 is formed on the substrate 22.

The intermediate image plane 20 is conjugate with the substrate 22, so the intermediate image plane 20 in each projection optical system 19a~19e is respectively configured with field apertures 21a~21e, thereby defining the exposure field PIa~PIe of each projection optical system 19a~19e on the substrate 22.

FIG. 4 is a diagram showing the relationship between the illumination area MIa to the illumination area Mie on the mask 15, the field aperture 21a to the field aperture 21e, and the exposure field PIa to the exposure field PIe.

(a1) of FIG. 4 is a diagram showing the illumination area MIc on the mask 15 corresponding to the projection optical system 19c. The illumination area MIc becomes a rectangle similar to the cross-sectional shape of the lens element 110 of the compound eye lens 11c.

(a2) of Fig. 4 is a diagram showing the field aperture 21c in the projection optical system 19c and the illumination light MIc2 irradiated to the field aperture 21c. The illumination light MIc2 represented by the dotted line, which is the intermediate image of the illumination area MIc on the mask 15, is irradiated to the field aperture 21c. Among the illumination light MIc2, the illumination light that has been irradiated to the light-shielding portion (the portion represented by the oblique lines) of the field aperture 21c is shielded by the field aperture 21c. On the other hand, the illumination light that has passed through the opening 21co of the field aperture 21c is imaged again on the substrate 22 by the optical system constituting the lower half of the projection optical system 19c, forming an exposure field PIc on the substrate 22.

(a3) of Figure 4 shows the exposure field PIc on the substrate 22.

As an example, when the projection optical system 19c~projection optical system 19e includes a total refractive optical system, the illumination light MIc2 as the intermediate image is an inverted erect image relative to the illumination area MIc (the image is reversed in both the X and Y directions, and is not a mirror image), and the exposure field of view PIc becomes an inverted erect image relative to the field aperture 21c. Therefore, as shown in (a2) and (a3) of Figure 4, the shape of the opening 21co of the field aperture 21c and the shape of the exposure field of view PIc are consistent with each other and the shape formed by rotating 180 degrees around the Z axis.

As an example, the exposure field of view PIc is a trapezoid in which the short side of the two sides parallel to the Y direction is located on the +X side and the long side is located on the -X side. Here, a rectangular area in the exposure field of view PIc surrounded by the entire short side on the +X side and a part of the long side on the -X side is called a central area PIcc. On the other hand, the end of the exposure field of view PIc in the +Y direction that is not included in the central area PIcc is called the left end area PIcl, and the end of the exposure field of view PIc in the -Y direction that is not included in the central area PIcc is called the right end area PIcr.

The length (width) of the center area PIcc in the Y direction is called the width Ws, and the length (width) of the left end area PIcl and the right end area PIcr in the Y direction is equal and is called the width Wo.

On the other hand, FIG. 4 (b1) to FIG. 4 (b3) are diagrams respectively showing the illumination area MIb, the field aperture 21b, and the exposure field PIb on the mask 15 corresponding to the projection optical system 19b. As shown in FIG. 4 (b2), in the projection optical system 19b, the shape of the opening 21bo of the field aperture 21b becomes the shape obtained by reversing the shape of the opening 21co of the field aperture 21c of the projection optical system 19c in the X direction. As a result, as shown in FIG. 4 (b3), the shape of the exposure field PIb of the projection optical system 19b becomes the shape obtained by reversing the shape of the exposure field PIc of the projection optical system 19c in the X direction.

Similar to the exposure field of view PIc, the rectangular area surrounded by the entire short side on the -X side and a part of the long side on the +X side of the exposure field of view PIb is called the central area PIbc. The end of the exposure field of view PIb in the +Y direction that is not included in the central area PIbc is called the left end area PIbl, and the end of the exposure field of view PIb in the -Y direction that is not included in the central area PIbc is called the right end area PIbr.

(a) of FIG. 5 is a diagram showing exposure fields PIa to PIe of the five projection optical systems 19a to 19e on the substrate 22. The exposure fields PIa and PIe of the projection optical systems 19a and 19e of the projection optical system 19F in the first row are trapezoids in which the short side of the two sides parallel to the Y direction is located on the +X side and the long side is located on the -X side, like the exposure field PIc of the projection optical system 19c. On the other hand, the exposure field of view PId of the projection optical system 19d as the projection optical system 19R of the second row is, similarly to the exposure field of view PIb of the projection optical system 19b. A trapezoid in which the short side of the two sides parallel to the Y direction is located on the -X side and the long side is located on the +X side.

Regarding the exposure fields of view PIa, PId, and PIe of the projection optical system 19a, 19d, and 19e, the central area PIac, the central area PIdc, the central area PIec, and the left end area PIal, the left end area PIdl, the left end area PIel, the right end area PIar, the right end area PIdr, and the right end area PIer can be defined in the same manner as the exposure fields of view PIb and PIc. However, the exposure field PIa disposed at the end in the -Y direction is shielded from illumination light by the field aperture 21a so that the end in the -Y direction becomes parallel to the X direction, and therefore the right end area PIar does not exist. In addition, the exposure field PIe disposed at the end in the +Y direction is shielded from illumination light by the field aperture 21e so that the end in the +Y direction becomes parallel to the X direction, and therefore the left end area PIal does not exist. Furthermore, the shapes of the field aperture 21a and the field aperture 21e may be different from the shape of the field aperture 21c, and other components may be used to shield the illumination light in a manner that the right end area PIar does not exist in the exposure field of view PIa.

The length of each central area PIac~PIec of each exposure field PIa~PIe in the Y direction is equal to the width Ws, and the length of the left end area PIal~left end area PIdl and the right end area PIbr~right end area PIer are equal to the width Wo. Moreover, in the two exposure fields adjacent in the Y direction in the exposure field PIa~exposure field PIe, the Y direction positions of the adjacent left end area PIal~left end area PIdl and right end area PIbr~right end area PIer are consistent.

The shape and position of each exposure field PIa~PIe can be set by setting the configuration position of the projection optical system 19a~projection optical system 19e, and the shape and position of the opening 21ao~opening 21eo of the field aperture 21a~field aperture 21e.

FIG5(b) is a diagram showing an exposure area formed on the substrate 22 when the substrate 22 is scanned in the X direction by the substrate stage 27 and is exposed by the exposure fields PIa to PIe shown in FIG5(a). On the substrate 22, scanning exposure fields SIa to SIe exposed by the exposure fields PIa to PIe are formed by scanning exposure. In FIG5(b), the scanning exposure fields SIa, SIc, and SIe formed by the projection optical system 19a, the projection optical system 19c, and the projection optical system 19e in the first row are indicated by double-dotted lines, and the scanning exposure fields SIb and SId formed by the projection optical system 19b and the projection optical system 19d in the second row are indicated by dotted lines.

These scanning exposure fields SIa~SIe are formed by extending the exposure fields PIa~PIe in the X direction by scanning exposure in the X direction. The ends of each scanning exposure field SIa~SIe in the Y direction (non-scanning direction) overlap with the ends of other adjacent scanning exposure fields SIa~SIe in the non-scanning direction. For example, the exposure area formed by the left end area PIal is consistent with the exposure area formed by the right end area PIbr. The same is true in other exposure areas, so the description is omitted.

Hereinafter, the portion exposed by one of the scanning exposure fields SIa to SIe in the Y direction is also referred to as the non-overlapping portion Sa to the non-overlapping portion Se, and the portion exposed by overlapping two of the scanning exposure fields SIa to SIe is also referred to as the overlapping portion Oa to the overlapping portion Od.

Among the exposure fields PIa to PIe, the left end area PIal to the left end area PIdl and the right end area PIbr to the right end area PIer correspond to the exposure fields of the overlapping portion Oa to the overlapping portion Od, and the center area PIac to the center area PIec correspond to the exposure fields of the non-overlapping portion Sa to the non-overlapping portion Se.

The overlapping parts Oa to Od exposed by the two overlapping parts of each scanning exposure field SIa to SIe are first exposed by the projection optical system 19a, projection optical system 19c, and projection optical system 19e of the first row, and then exposed by the projection optical system 19b and projection optical system 19d of the second row, so they are divided in time for exposure. In other words, the overlapping parts Oa to Od are discretely exposed in time. In contrast, the non-overlapping parts Sa to Se are areas exposed by one of the scanning exposure fields SIa to SIe, and are areas that are not divided in time but continuously exposed.

The non-overlapping portion Sa to the non-overlapping portion Se that are exposed continuously in time can also be interpreted as the first region. On the other hand, the overlapping portion Oa to the overlapping portion Od that are exposed discretely in time can also be interpreted as the second region.

FIG5(c) is a graph showing the exposure amount E exposed on the substrate 22 by scanning exposure in the X direction. The vertical axis of the graph is the coordinate of the exposure amount, and the horizontal axis is the coordinate of the Y direction. As shown in FIG5(c), the values accumulated in the X direction of each exposure field PIa~PIe in each micro interval in the Y direction are equal, and the illumination in each exposure field PIa~PIe is uniform due to the action of the compound eye lens 11, so the exposure amount E on the substrate 22 becomes a fixed value E1.

That is, in the Y direction, the exposure amount E in the non-overlapping part Sa~non-overlapping part Se and the exposure amount E in the overlapping part Oa~overlapping part Od both become E1 and are equal.

However, for example, when the scanning exposure fields SIa, SIc, SIe and the scanning exposure fields SIb and SId are mutually offset in the Y direction from the state of (a) in FIG5 , the exposure amount in the overlapping portion Oa to the overlapping portion Od becomes different from the exposure amount E1 in the non-overlapping portion Sa to the non-overlapping portion Se. For example, this phenomenon occurs when the scanning exposure fields SIa, SIc, and SIe of the projection optical system 19a, the projection optical system 19c, and the projection optical system 19e in the first row and the scanning exposure fields SIb and SId of the projection optical system 19b and the projection optical system 19d in the second row are mutually offset in the Y direction. Alternatively, this phenomenon may also occur when the exposed substrate 22 is deformed due to heat generated by the process, and in order to correct the deformation, the substrate stage 27 is scanned in a direction deviating from the X direction for exposure.

(d) of Figure 5 is a graph showing the exposure amount E when the exposure amount in the overlapping portion Oa to the overlapping portion Od is different from the exposure amount E1 in the non-overlapping portion Sa to the non-overlapping portion Se.

As an example, Fig. 5(d) shows an example in which the scanning exposure field SIb and the scanning exposure field SId are offset in the -Y direction relative to the scanning exposure field SIa, the scanning exposure field SIc, and the scanning exposure field SIe. In this case, the exposure amount is increased in the overlapping portion Oa and the overlapping portion Oc, and the exposure amount is reduced in the overlapping portion Ob and the overlapping portion Od, relative to the exposure amount E1. Although not shown, when the scanning exposure field SIb and the scanning exposure field SId deviate in the +Y direction relative to the scanning exposure field SIa, the scanning exposure field SIc, and the scanning exposure field SIe, the exposure in the overlapping part Oa and the overlapping part Oc decreases, and the exposure in the overlapping part Ob and the overlapping part Od increases relative to the exposure amount E1.

When exposure is performed with the exposure amount shown in FIG. 5( d ), the degree of reaction of the photosensitive material on the substrate 22 is different in the overlapping portion Oa to the overlapping portion Od and the non-overlapping portion Sa to the non-overlapping portion Se, so the line width or thickness of the pattern transferred to the photosensitive material changes. Furthermore, in addition to the above-mentioned situation, the same phenomenon also occurs when the exposed substrate 22 is partially deformed due to heat generated by the process. However, in this case, the distribution of the exposure amount E shown in the graph of FIG. 5( d ) is not obtained in the entire surface of the exposed substrate 22, and only the area of the exposed substrate 22 that has been partially deformed has the distribution of the exposure amount E shown in the graph of FIG. 5( d ). In addition, not all areas of the overlapping area Oa to the overlapping area Od have an exposure amount different from the exposure amount E1 in at least one overlapping area. In addition, it is not limited to the local deformation of the exposed substrate 22. Due to the uneven thickness of the photosensitive material applied to the exposed substrate 22, an exposure amount different from the exposure amount E1 is generated in at least one overlapping area as described above.

Therefore, in the exposure device 100 of the first embodiment, dimming components 10a to 10e as an example of an illumination changing component are provided on the incident surface 11ai to 11ei sides of the compound eye lenses 11a to 11e of the illumination optical system ILa to ILe, that is, at a position between the input lens 8a to 8e and the compound eye lens 11a to 11e, and near the incident surface 11ai to 11ei of the compound eye lens 11a to 11e. Furthermore, the dimming components 10a to 10e are held by the dimming component holding parts 9a to 9e so as to be movable in the X direction which is a direction substantially orthogonal to the optical axes IXa to IXe of the respective illumination optical systems ILa to ILe. The positions of the dimming components 10a to 10e in the X direction are controlled by the control signals SigA to SigE from the control unit 50.

FIG6 is a diagram of the compound eye lens 11c, the dimming component 10c (10ca1, 10ca2, 10cb1, 10cb2, 10cc1, 10cc2), and the dimming component holding portion 9c (9ca, 9cb, 9cc) provided in the illumination optical system ILc, as viewed from the input lens 8c side. Hereinafter, the dimming component 10c and the dimming component holding portion 9c provided in the illumination optical system ILc will be described with reference to FIG6. Furthermore, the dimming components 10a to 10e and the dimming component holding portions 9a to 9e provided in other illumination optical systems ILa to ILe are also the same as below.

The compound eye lens 11c has a plurality of lens blocks arranged in the Y direction, and the lens blocks are formed by arranging a plurality of lens elements 110 having a rectangular cross section that is long in the Y direction in the X direction. As described above, FIG. 6 is a diagram of the compound eye lens 11c observed from the input lens 8c side that is the incident surface 11ai to the incident surface 11ei side. Moreover, the incident side surface of each lens element 110 becomes a conjugate surface CP relative to the exposure field of view PIc formed on the substrate 22. Therefore, in FIG. 6, in each lens element 110, the exposure field of view corresponding area IPIc as the area corresponding to the exposure field of view PIc is indicated by a dotted line. Furthermore, the lateral magnification of the exposure field of view corresponding area IPIc to the exposure field of view PIc is set to β times.

The exposure device 100 of the first embodiment includes a first end dimming component 10cb1, a first end dimming component 10cb2, a second end dimming component 10cc1, a second end dimming component 10cc2, and a third dimming component 10ca1, a third dimming component 10ca2 as a dimming component 10c.

The width Wb of the first end dimming component 10cb1, the first end dimming component 10cb2, the second end dimming component 10cc1, and the second end dimming component 10cc2 in the Y direction is approximately equal to β times the width Wo of the right end area PIcr and the left end area PIcl of the exposure field PIc.

The first end dimming component 10cb1 and the first end dimming component 10cb2 are arranged on the +X direction side of the compound eye lens 11c, covering the portion corresponding to the left end area PIcl of the exposure field PIc in the exposure field corresponding area IPIc of several lens elements 110 to perform dimming.

The second end dimming component 10cc1 and the second end dimming component 10cc2 are arranged on the +X direction side of the compound eye lens 11c, covering the portion corresponding to the right end area PIcr of the exposure field of view PIc in the exposure field of view corresponding area IPIc of several lens elements 110 to perform dimming.

Furthermore, as described above, the compound eye lens 11c has a plurality of lens groups arranged in the Y direction, and the lens group is formed by arranging a plurality of lens elements 110 in the X direction. Therefore, the first end dimming component 10cb1 and the first end dimming component 10cb2 can be interpreted as the following components, which dim at least a portion of the left end area PIcl corresponding to the overlapping portion Oc of one or more lens elements 110 arranged in at least one lens group. Similarly, the second end dimming component 10cc1 and the second end dimming component 10cc2 can be interpreted as the following components, which dim at least a portion of the right end area PIcr corresponding to the overlapping portion Ob of one or more lens elements 110 arranged in at least one lens group.

The width Wa of the third dimming component 10ca1 and the third dimming component 10ca2 in the Y direction is approximately equal to β times the width Ws of the central area PIcc of the exposure field of view PIc.

The third light reduction component 10ca1 and the third light reduction component 10ca2 are arranged on the -X direction side of the compound eye lens 11c, covering the portion corresponding to the central area PIcc of the exposure field of view PIc in the exposure field of view corresponding area IPIc of several lens elements 110 to reduce light.

The third dimming component 10ca1 and the third dimming component 10ca2 can be interpreted as components that dim at least a portion of the central area PIcc corresponding to the non-overlapping portion Sc of one or more lens elements 110 configured in at least one lens group.

The first end dimming member 10cb1 and the first end dimming member 10cb2 are held by the slider 91b, and the slider 91b is held by the dimming member holding portion 9cb so as to be freely movable in the X direction. The relative position relationship between the slider 91b and the dimming member holding portion 9cb is measured by an encoder, etc., and transmitted to the control portion 50. In addition, the relative position relationship between the slider 91b and the dimming member holding portion 9cb, that is, the X-direction position of the first end dimming member 10cb1 and the first end dimming member 10cb2 is controlled by the control signal SigCb from the control portion 50.

The second end dimming component 10cc1 and the second end dimming component 10cc2 are also held by the slider 91c. The slider 91c is held by the dimming component holding portion 9cc so that it can move freely in the X direction.

The third dimming component 10ca1 and the third dimming component 10ca2 are also held by the slider 91a. The slider 91a is held by the dimming component holding portion 9ca so as to be movable in the X direction.

The X-direction positions of the second end dimming component 10cc1, the second end dimming component 10cc2, the third dimming component 10ca1, and the third dimming component 10ca2 are also measured in the same manner as described above, and are controlled by the control signal SigCc and the control signal SigCa from the control unit 50, respectively.

The first end dimming components 10cb1 and 10cb2 are moved in the ±X direction, thereby changing the number of lens elements 110 that are dimmed by the first end dimming components 10cb1 and 10cb2. In this way, the exposure amount of the overlapping portion Oc on the substrate 22 can be increased or decreased.

The second end dimming components 10cc1 and 10cc2 are moved in the ±X direction, thereby changing the number of lens elements 110 that are dimmed by the second end dimming components 10cc1 and 10cc2. In this way, the exposure amount of the overlapping portion Ob on the substrate 22 can be increased or decreased.

Similarly, the third light reduction components 10ca1 and 10ca2 are moved in the ±X direction, thereby changing the number of lens elements 110 that are light-reduced by the third light reduction components 10ca1 and 10ca2. In this way, the exposure amount of the non-overlapping portion Sc on the substrate 22 can be increased or decreased.

According to the above, by appropriately adjusting the X-direction positions of the first end dimming member 10cb1, the first end dimming member 10cb2, the second end dimming member 10cc1, the second end dimming member 10cc2, the third dimming member 10ca1, and the third dimming member 10ca2, the exposure amount of the overlapping portion Ob on the substrate 22 can be relatively increased or decreased compared to the exposure amount of the non-overlapping portion Sc on the substrate 22.

In addition, the control unit 50 can also appropriately adjust the X-direction positions of the first end dimming component 10cb1, the first end dimming component 10cb2, the second end dimming component 10cc1, the second end dimming component 10cc2, the third dimming component 10ca1, and the third dimming component 10ca2 during scanning in the X-direction for exposing the substrate 22. The control unit 50 may also appropriately adjust the respective X-direction positions of the first end dimming component 10cb1, the first end dimming component 10cb2, the second end dimming component 10cc1, the second end dimming component 10cc2, the third dimming component 10ca1, and the third dimming component 10ca2 before exposing the locally deformed area of the substrate 22, and change the respective X-direction positions of the first end dimming component 10cb1, the first end dimming component 10cb2, the second end dimming component 10cc1, the second end dimming component 10cc2, the third dimming component 10ca1, and the third dimming component 10ca2 after the exposure of the deformed area is completed. In addition, when exposing a substrate 22 with uneven coating of photosensitive material, the control unit can also move the light-reducing components in the X direction respectively according to the thickness of the photosensitive material on the substrate 22. Furthermore, the exposure device 100 can also be provided with the following measuring unit, which detects local deformation or uneven coating of photosensitive material on the substrate 22 during scanning in the X direction for exposure on the substrate 22 or before scanning and exposing the substrate 22.

The dimming member 10c (first end dimming member 10cb1, first end dimming member 10cb2, second end dimming member 10cc1, second end dimming member 10cc2, third dimming member 10ca1, third dimming member 10ca2) can be a metal thin plate, or a dimming film formed on a transparent glass plate by the dimming member. The dimming member 10c is not limited to a member that completely blocks the illumination light like a filter, but can also be a member that only blocks a part of the illumination light and allows the remaining illumination light to pass through. That is, the dimming member 10c can be any illumination changing member used to change the illumination.

The structures of the dimming components 10a, 10b, 10d, 10e, and the dimming component holding parts 9a, 9b, 9d, and 9e included in the other lighting optical systems ILa, ILb, ILd, and ILe are also the same as those of the dimming components 10c and 9c.

Thus, the exposure ratio of the overlapping portion Oa to the overlapping portion Od and the exposure ratio of the non-overlapping portion Sa to the non-overlapping portion Se can be adjusted in each illumination optical system ILa to ILe, thereby preventing the line width or thickness of the pattern transferred to the overlapping portion Oa to the overlapping portion Od and the non-overlapping portion Sa to the non-overlapping portion Se from changing.

As an example, in the state as shown in (d) of Figure 5, the second end dimming component in the illumination optical system ILb and the illumination optical system ILd is moved in the +X direction to reduce the exposure of the right end area PIbr and the right end area PIdr of each exposure field PIb and PId, or the first end dimming component in the illumination optical system ILa, the illumination optical system ILc, and the illumination optical system ILe is moved in the -X direction to increase the exposure of the left end area PIal, the left end area PIcl, and the left end area PIel of each exposure field PIa, PIc, and PIe, thereby making the exposure of the overlapping part Oa and the overlapping part Oc equal to the exposure of the non-overlapping part Sa to the non-overlapping part Se. Furthermore, the exposure amount can be adjusted by moving the second end dimming component in the +X direction and the first end dimming component in the -X direction. In addition, regarding the overlapping portion Ob and the overlapping portion Od, the second end dimming component in the illumination optical system ILa, the illumination optical system ILc, and the illumination optical system ILe can be moved in the +X direction, or the first end dimming component in the illumination optical system ILb and the illumination optical system ILd can be moved in the -X direction, or both can be moved, so that the exposure amount of the overlapping portion Ob and the overlapping portion Od is equal to the exposure amount of the non-overlapping portion Sa to Se.

If the dimming component 10c moves from the top of the compound eye lens 11c toward the -X direction, the exposure amount of the non-overlapping portion Sc increases compared to before the movement, so it can be said that the dimming component 10c functions as an increasing component. Similarly, if the first end dimming component and the second end dimming component move from the top of the compound eye lens 11c toward the +X direction, the exposure amount of the overlapping portion Oc increases compared to before the movement, so it can be said that the first end dimming component and the second end dimming component function as an increasing component. The dimming component 10c moves from above the compound eye lens 11c in the -X direction, but can also move to a position where it does not overlap with the compound eye lens 11c in the X direction, or can move in a manner such that the amount of overlap between the dimming component 10c and the compound eye lens 11c in the X direction becomes smaller.

The dimmer member 10c is disposed at a position separated from the incident surface 11ci of the compound eye lens 11c by a predetermined distance in the Z direction, so that the edge of the dimmer member 10c in the XY direction is blurredly projected on the incident surface 11ci of the compound eye lens 11c. In other words, the distance at which the dimmer member 10c is separated from the incident surface 11ci of the compound eye lens 11c in the Z direction can be determined based on the following values: the lateral magnification (the aforementioned β) between the incident surface 11ci of the compound eye lens 11c and the substrate 22, which is a parameter that determines the amount of penumbra blur of the edge of the dimmer member 10c on the substrate 22, and the numerical aperture of the illumination light at the incident surface 11ci of the compound eye lens 11c. Furthermore, it can also be determined by referring to the width of the overlapping parts Oa to Od on the substrate 22 in the Y direction. Furthermore, it is preferable to have a mechanism that can change the position of the light-reducing component 10c in the Z direction relative to the incident surface 11ci of the compound eye lens 11c, that is, a mechanism that can change the distance between the light-reducing component 10c and the compound eye lens 11c in the Z direction.

For example, when the width of the overlapping portion Oa to the overlapping portion Od in the Y direction is set to DW, the lateral magnification of the substrate 22 with respect to the incident surface 11ci of the compound eye lens 11c is set to β, and the numerical aperture of the illumination light in the incident surface 11ci of the compound eye lens 11c is set to NA, it is preferable to set the distance D of the dimmer component 10c from the incident surface 11ci of the compound eye lens 11c in the Z direction to 0≦D≦1.2×DW/(β‧NA)…(1).

When the distance D satisfies formula (1), the influence of exposure variation (uneven exposure) on the substrate 22 caused by the edge of the light-reducing component 10c can be further reduced.

Furthermore, the position of the light-reducing component 10c in the X direction is preferably determined by setting the insertion amount (position in the X direction) of the light-reducing component 10c to different stages and performing test exposure under multiple conditions, and determining the most appropriate insertion amount based on the results.

In addition, the thickness of the coated photosensitive material on the substrate 22 can be measured by a measuring device installed inside the exposure device 100, and the most appropriate insertion amount of the light-reducing component 10c can be determined based on the result. Furthermore, the measuring device can also be installed outside the exposure device 100.

In addition, when determining the insertion amount of the dimming component 10c, it is best to use the illumination sensor 26 installed on the substrate stage 27 to measure the illumination of each part within the exposure field of view PIc while making the determination.

Furthermore, the ends of the two light-reducing components 10ca1 and 10ca2 constituting the third light-reducing component shown in FIG. 6 in the +X direction are respectively offset by only half of the pitch PX of the arrangement of the lens element 110 in the X direction of the compound eye lens 11c. As described above, there is an exposure field corresponding area IPIc corresponding to the exposure field PIc in each lens element 110, but the exposure field corresponding area IPIc does not extend across the entire surface of the lens element 110 in the X direction. That is, the two ends of the lens element 110 in the X direction are not corresponding to the exposure field PIc on the substrate 22, and are projected on the field aperture 21c in the projection optical system 19c, and are shielded by the field aperture 21c.

Therefore, when the ends of the dimming components 10ca1 and 10ca2 in the +X direction are located near the ends of the lens element 110 in the X direction, even if the dimming components 10ca1 and 10ca2 are moved in the X direction, the exposure amount on the substrate 22 cannot be changed.

Therefore, in the first embodiment, the ends of the two dimming components 10ca1 and 10ca2 in the +X direction are offset from the arrangement distance PX of the lens element 110 in the X direction by only half.

With this arrangement, when the +X direction end of one of the two dimming components 10ca1 and 10ca2 is located near the two ends of the lens element 110 in the X direction, the +X direction end of the other is located near the center of the lens element 110 in the X direction. Therefore, by moving both the two dimming components 10ca1 and 10ca2 in the X direction, the exposure amount on the substrate 22 can be constantly changed. Furthermore, the dimming components 10ca1 and 10ca2 can also be configured to move independently in the X direction.

Furthermore, the dimming components 10ca1 and 10ca2 are not limited to the two mentioned above, but may be three or more and respectively arranged in different lens groups. In this case, if the number of dimming components is m (m is a natural number greater than 2), the ends of each dimming component in the +X direction are preferably set in a manner that is only deviated from the spacing PX by PX/m.

The position or number of the +X direction ends of the dimming components 10ca1 and 10ca2 constituting the third dimming component can also be similarly applied to the position or number of the -X direction ends of the dimming components 10cb1 and 10cb2 constituting the first end dimming component and the dimming components 10cc1 and 10cc2 constituting the second end dimming component.

Furthermore, the dimming component 10c is disposed at a position separated by a predetermined distance in the Z direction from the incident surface 11ci of the compound eye lens 11c, but the present invention is not limited thereto. The dimming component 10c may also be disposed on the conjugate surface CP of the upper surface of the substrate 22, which is opposite to the incident surface 11ci of the compound eye lens 11c. If the dimming component 10c completely shields the illumination light, when it is disposed in accordance with the conjugate surface CP, there is a risk that the exposure amount of the overlapping portion Oa to the overlapping portion Od and the exposure amount of the non-overlapping portion Sa to the non-overlapping portion Se will not change continuously. Therefore, in this case, the dimming component 10c is preferably deformed in shape or continuously changes the shading rate of the illumination light in the position corresponding to the Y direction like a filter. In addition, the shading rate of the illumination light can also be changed by the first end dimming component 10cb1, the first end dimming component 10cb2, the second end dimming component 10cc1, the second end dimming component 10cc2, and the third dimming component 10ca1, the third dimming component 10ca2.

(Variant 1)

In the first embodiment described above, the first end dimming components 10cb1 and 10cb2 and the second end dimming components 10cc1 and 10cc2 are arranged on the +X direction side of the compound eye lens 11c, and the third dimming components 10ca1 and 10ca2 are arranged on the -X direction side of the compound eye lens 11c, but the configuration is not limited thereto. As long as the dimming components 10c do not collide or mechanically interfere with each other when the dimming components 10c are moved in the X direction, all the dimming components 10c may be arranged on the +X direction side or -X direction side of the compound eye lens 11c, and the size of the illumination optical system ILa to the illumination optical system ILe in the X direction may be reduced.

(Variant 2)

Since the dimming component 10c can change the ratio of the exposure amount of the overlapping portion Ob, the overlapping portion Od to the exposure amount of the non-overlapping portion Sa~the non-overlapping portion Se by moving the first end dimming component 10cb1, the first end dimming component 10cb2 and the second end dimming component 10cc1, the second end dimming component 10cc2 in the X direction, the third dimming component 10ca1, the third dimming component 10ca2 can be omitted, and only the first end dimming component 10cb1, the first end dimming component 10cb2 and the second end dimming component 10cc1, the second end dimming component 10cc2 are included. In addition, the dimming component 10 may also omit the first end dimming component 10cb1, the first end dimming component 10cb2 and the second end dimming component 10cc1, the second end dimming component 10cc2, and only include the third dimming component 10ca1, the third dimming component 10ca2.

Furthermore, in the first embodiment, the dimming components 10a to 10e in all the illumination optical systems ILa to ILe are configured to be the same, but this is not limited thereto. For example, the dimming components may be configured differently in the projection optical system 19F in the first row and the projection optical system 19R in the second row, or in each illumination optical system ILa to ILe.

In addition, in the case where the substrate 22 is partially deformed or the photosensitive material is unevenly coated, only the dimming components of the illumination optical system ILa to the illumination optical system ILe that project the illumination light toward the area are moved, and the dimming components of the illumination optical system that projects the illumination light toward other areas may not be moved.

(Variant 3)

In the above, in the first embodiment, the first end dimming components 10cb1 and 10cb2 are relatively moved toward the X direction relative to the two rows in the +Y direction of the lens element, the second end dimming components 10cc1 and 10cc2 are relatively moved toward the X direction relative to the two rows in the -Y direction of the lens element, and the third dimming components 10ca1 and 10ca2 are relatively moved toward the X direction relative to the two central rows of the lens element, but the present invention is not limited thereto. The first end dimming component 10cb1, the first end dimming component 10cb2, the second end dimming component 10cc1, the second end dimming component 10cc2, the third dimming component 10ca1, and the third dimming component 10ca2 can all be moved relative to the lens elements arranged in the same row in the X direction, or some of them can be different.

(Variant 4)

The dimming components 10a to 10e as an example of an illumination changing component are described as being freely movable in the X direction relative to the compound eye lens 11, but they may also be freely movable in the Z direction. In addition, each of the dimming components 10a to 10e may also include a plurality of dimming components stacked in the Z direction. The plurality of dimming components may also be relatively movable in the Y direction relative to each other, in other words, the plurality of dimming components may also be relatively movable in the Y direction relative to the compound eye lens 11. In this way, the illumination changing component moves relatively in any direction of the X direction, the Y direction, and the Z direction relative to the compound eye lens 11, thereby changing the exposure distribution on the substrate 22.

(Variant 5)

In the first embodiment and various variations above, there are five projection optical systems 19a to 19e, but the number of projection optical systems is not limited to five, and may be any number such as three or eight.

In addition, in the first embodiment and various variations described above, it is assumed that there are multiple projection optical systems 19a~19e, and through a single scan in the X direction, multiple exposure fields SIa~SIe formed by each projection optical system overlap each other in the Y direction.

However, the projection optical system may be one, and the substrate 22 and the mask 15 may be moved in the Y direction while performing multiple scanning exposures of the substrate 22 in the X direction, so that the multiple exposure fields formed by each scanning exposure overlap each other in the Y direction. In this case, it is ideal that the illumination optical system corresponding to one projection optical system also includes the same structure as the illumination optical system ILa~illumination optical system ILe.

Furthermore, the device having multiple projection optical systems 19a-19e as in the first embodiment and various variations can expose more areas on the substrate 22 by a single scanning exposure, and has excellent processing capabilities.

In the first embodiment and various variations above, the multiple projection optical systems 19a~19e are configured to include a total refractive optical system, but are not limited thereto, and a reflective refractive optical system or a total reflective optical system may also be used.

In addition, in the first embodiment and various variations above, the shape of the exposure field of view PIa to the exposure field of view PIe is set to a trapezoid, but it is not limited to a trapezoid. For example, the shape of the portion corresponding to the central portion may be an arc, and the fields of view including the right end area and the left end area of the triangle at both ends of the arc.

In the first embodiment and various variations described above, the optical axes PAXa to PAXe of the projection optical systems 19a to 19e and the optical axes IXa to IXe of the illumination optical systems ILa to ILe are basically set parallel to the Z direction. However, when a deflecting mirror is used in any optical system, the direction of the optical axis becomes non-parallel to the Z direction.

In addition, when a deflecting mirror is used in any optical system, the moving direction of the dimmer components 10a to 10e also becomes a direction different from the scanning direction (X direction) of the substrate 22. However, even in this case, the dimmer components 10a to 10e can be freely moved in a direction optically corresponding to the scanning direction of the substrate 22 based on the conjugate relationship between the substrate 22 including the deflecting mirror and the compound eye lenses 11a to 11e.

In addition, in the above embodiment, each projection optical system 19a~19e is set to be an optical system with two rows of projection optical systems 19F in the first row and projection optical systems 19R in the second row arranged in the X direction, but it is not limited to two rows, and more than three rows of optical systems can also be arranged in the X direction.

As an optical integrator, a rod integrator may be used instead of the compound eye lens 11. When a rod integrator is used, the conjugate surface CP with the substrate 22 and the mask 15 becomes the exit side of the rod integrator (the mask 15 side), so the light reduction component 10 is also arranged near the exit side of the rod integrator. Moreover, it is set to partially block light near one end of the X side of the exit surface of the rod integrator.

The dimming components 10a to 10e may also be arranged near the intermediate image plane 20 of the projection optical system 19a to 19e, instead of being arranged in the illumination optical system ILa to ILe. In this case, the dimming components are also arranged near the intermediate image plane 20 to shield the portion corresponding to the central area PIac to the central area PIec of the exposure field PIa to the exposure field PIe.

Alternatively, an intermediate image plane (a conjugate plane relative to the mask 15) may be provided inside the illumination optical system ILa to ILe, and a field aperture that specifies the shape of the exposure field PIa to PIe on the substrate 22 may be provided on the intermediate image plane in the illumination optical system ILa to ILe, instead of configuring the field aperture 21a to 21e in the projection optical system 19a to 19e.

In the above embodiment, the projection optical system 19a~19e and the illumination optical system ILa~ILe are fixed, and the substrate 22 is moved by the substrate stage 27. However, the projection optical system 19a~19e and the illumination optical system ILa~ILe may be placed on the substrate stage to scan the substrate 22 instead.

In addition, the mask 15 is not limited to a mask with a pattern formed on a glass substrate, but can also be a deformable mask including a digital multi-mirror element or a liquid crystal element.

As a use of the exposure device 100, it can also be applied to an exposure device for liquid crystal that transfers a liquid crystal display element pattern to a square glass plate, such as an exposure device for manufacturing an organic electroluminescence (EL) panel. In addition, it can also be applied to an exposure device that transfers a circuit pattern to a glass substrate or a silicon wafer in order to manufacture not only micro components such as semiconductor components, but also masks or photomasks for optical exposure devices, extreme ultraviolet (EUV) exposure devices, X-ray exposure devices, and electron beam exposure devices.

The substrate (glass plate, etc.) exposed by the exposure device 100 is developed by a developing device (not shown), and etching is performed as needed according to the pattern of the photosensitive material formed by the exposure and development process.

In addition, the exposure object is not limited to a glass substrate, and may be other objects such as a wafer, a ceramic substrate, a film component, or a blank mask. In addition, when the exposure object is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film-shaped (a flexible sheet-shaped component) is also included. Furthermore, when the exposure object is a substrate with a length of one side or a diagonal length of 500 mm or more, the exposure device of the first embodiment and each variant is particularly effective. In addition, when the exposure object substrate is a flexible sheet-shaped material, the sheet can also be formed into a roll shape.

According to the first embodiment and various variations, the following effects can be obtained.

(1) The exposure device 100 of the first embodiment or each variant uses a first exposure to expose a first exposure area (scanning exposure field SIa, scanning exposure field SIc, scanning exposure field SIe) on the exposed substrate 22 within a first time, and a second exposure to expose a second exposure area (scanning exposure field SIb, scanning exposure field SId) on the exposed substrate 22 within a second time different from the first time, to expose the exposed substrate 22. Exposure is performed, and the exposure device includes: an illumination optical system ILa~illumination optical system ILe, which has an optical integrator 11a~optical integrator 11e, which supplies illumination light; a projection optical system 19a~projection optical system 19e; and a substrate stage 27, which moves the exposed substrate 22 relative to the projection optical system 19a~projection optical system 19e in the scanning direction (X direction) in a manner that a prescribed pattern is exposed on the exposed substrate 22.

The illumination changing member 10a to 10e is provided on the incident surface side of the optical integrator 11a to 11e provided at a position (conjugated surface CP) where the incident surface 11ai to 11ei of the incident illumination light is conjugated with the upper surface of the exposure substrate 22, and is relatively movable relative to the optical integrator 11a to 11e so as to change the exposure amount for exposing the second area (overlapping portion Oa to Od) and the exposure amount for exposing the first area (non-overlapping portion Sa to Sa) to the exposure amount. The illumination light is changed in a manner that the exposure amount of the non-overlapping portion (Se) is changed relatively to the other, the second area is an area where a part of each area of the first exposure area and the second exposure area on the exposed substrate 22 is overlapped, and the first area is an area of the other part of the first exposure area and the other part of the second exposure area; and the control unit 50 controls the relative movement of the illumination changing components 10a~10e relative to the optical integrators 11a~11e.

Furthermore, the control unit 50 moves the illumination changing components 10a to 10e relative to the optical integrator so that the exposure amount in the first area (non-overlapping part Sa to non-overlapping part Se) becomes relatively larger than the exposure amount in the second area (overlapping part Oa to overlapping part Od).

With the above structure, the ratio of the exposure amount of the first area (non-overlapping part Sa~non-overlapping part Se) to the exposure amount of the second area (overlapping part Oa~overlapping part Od) can be adjusted, and the line width or thickness of the pattern transferred to the first area and the second area can be prevented from changing.

(2) The exposure device 100 of the first embodiment or each variant uses a first exposure to expose a first exposure area (SIa, SIc, SIe) on the exposed substrate 22 within a first time, and a second exposure to expose a second exposure area (SIb, SId) on the exposed substrate 22 within a second time different from the first time, to expose the exposed substrate 22, and the exposure device includes: an illumination optical system ILa~illumination optical system ILe, which has an optical integrator 11a~optical integrator 11e, and supplies illumination light; a projection optical system 19a~projection optical system 19e; and a substrate stage 27, which moves the exposed substrate 22 relative to the projection optical system 19a~projection optical system 19e in a scanning direction (X direction) in a manner that a predetermined pattern is exposed on the exposed substrate 22.

The illumination changing member 10a to 10e is disposed on the incident surface side of the optical integrator at a position where the incident surface 11ai to 11ei of the incident illumination light is conjugated with the upper surface of the exposure substrate 22, and is relatively movable relative to the optical integrator to change the exposure amount for exposing the second area (overlapping portion Oa to overlapping portion Od) and the exposure amount for exposing the first area (non-overlapping portion Sa to non-overlapping portion Sa). The illumination light is changed in a manner that the exposure amount of one of the overlapping parts (Se) is the exposure amount ratio of the other, the second area is an area where a part of each area of the first exposure area and the second exposure area on the exposed substrate 22 is overlapped, and the first area is an area of the other part of the first exposure area and the other part of the second exposure area; and the control unit 50 controls the relative movement of the illumination changing component relative to the optical integrator.

Furthermore, the control unit 50 causes the illumination changing components 10a to 10e to move relative to the optical integrator during the movement of the substrate stage 27 relative to the projection optical system 19a to 19e.

With the above structure, the ratio of the exposure amount of the first area (non-overlapping part Sa~non-overlapping part Se) to the exposure amount of the second area (overlapping part Oa~overlapping part Od) can be adjusted, and the line width or thickness of the pattern transferred to the first area and the second area can be prevented from changing.

(3) The exposure device 100 of the first embodiment or each variant includes: a projection optical system 19a to a projection optical system 19e; an illumination optical system ILa to an illumination optical system ILe, which has an optical integrator 11a to an optical integrator 11e, and supplies illumination light to the projection optical system 19a to the projection optical system 19e; and a substrate stage 27, which moves the exposure substrate 22 relative to the projection optical system 19a to the projection optical system 19e in a scanning direction in such a manner that a predetermined pattern is exposed on the exposure substrate 22.

Furthermore, the illumination changing components 10a to 10e are provided for changing the exposure amount of the first area (non-overlapping part Sa to non-overlapping part Se) and the second area (overlapping part Oa to overlapping part Od) relative to the exposure amount of the other area, wherein the first area is an area on the exposure substrate 22 that is continuously exposed in time by the scanning exposure field SIa to scanning exposure field SIe of the projection optical system during exposure, The second area is an area that is exposed discretely in time by scanning the exposure field; and a control unit that causes the illumination changing components 10a to 10e to move relative to the optical integrator in a first direction optically corresponding to the scanning direction, and the optical integrator is set at a position where the incident surface 11ai to 11ei of the illumination light becomes a conjugate surface CP relative to the scanning exposure field SIa to the scanning exposure field SIe on the exposed substrate 22.

Furthermore, the control unit 50 moves the illumination changing components 10a to 10e relative to the optical integrator so that the exposure amount in the first area (non-overlapping portion Sa to non-overlapping portion Se) becomes relatively larger than the exposure amount in the second area (overlapping portion Oa to overlapping portion Od).

With the above structure, the ratio of the exposure amount of the first area (non-overlapping part Sa~non-overlapping part Se) to the exposure amount of the second area (overlapping part Oa~overlapping part Od) can be adjusted, and the line width or thickness of the pattern transferred to the first area and the second area can be prevented from changing.

(4) The exposure device 100 of the first embodiment or each variant includes: a projection optical system 19a to a projection optical system 19e; an illumination optical system ILa to an illumination optical system ILe, which has an optical integrator 11a to an optical integrator 11e, and supplies illumination light to the projection optical system 19a to the projection optical system 19e; and a substrate stage 27, which moves the exposure substrate 22 relative to the projection optical system 19a to the projection optical system 19e in a scanning direction (X direction) in such a manner that a predetermined pattern is exposed on the exposure substrate 22.

The invention also includes: illumination changing components 10a to 10e, which are arranged on the incident surface side of the optical integrator at a position (conjugate surface CP) where the incident surface 11ai to 11ei of the incident illumination light is conjugate with the upper surface of the exposure substrate 22, and are relatively movable relative to the optical integrator, so as to change the illumination of the illumination light by changing the exposure amount ratio of the first area (non-overlapping portion Sa to non-overlapping portion Se) and the second area (overlapping portion Oa to overlapping portion Od) to the other, wherein the first area is formed by the projection optical system 19a to projection optical system 19b. The first area is a region on the exposed substrate 22 that is continuously exposed in time by scanning the exposure field of view of the projection optical system 19e, and the second area is a region that is discretely exposed in time by scanning the exposure field of view; and the control unit 50 controls the relative movement of the illumination changing components 10a~10e relative to the optical integrators 11a~11e; the control unit 50 causes the illumination changing components 10a~10e to move relative to the optical integrators 11a~11e during the movement of the substrate stage relative to the projection optical system 19a~19e.

With the above structure, the ratio of the exposure amount of the first area (non-overlapping part Sa~non-overlapping part Se) to the exposure amount of the second area (overlapping part Oa~overlapping part Od) can be adjusted, and the line width or thickness of the pattern transferred to the first area and the second area can be prevented from changing.

(5) By configuring the illumination changing components 10a to 10e to include the first end dimming components 10cb1 and 10cb2 and the second end dimming components 10cc1 and 10cc2, the exposure amount of the overlapping portion Oa to the overlapping portion Od can be reduced with high precision. The second end dimming component 10cc1 and the second end dimming component 10cc2 are arranged near the end of the second side of the second direction intersecting the first direction in the portion corresponding to the second area (overlapping portion Oa to overlapping portion Od) in the conjugate plane CP, and are arranged near the end of the second side of the second direction opposite to the first side in the portion corresponding to the second area (overlapping portion Oa to overlapping portion Od) in the conjugate plane CP.

(6) By setting the control unit 50 to control the first end dimming component 10cb1, the first end dimming component 10cb2 and the second end dimming component 10cc1, the second end dimming component 10cc2 to move these dimming components in the first direction, the exposure amount of each of the plurality of second areas (overlapping portion Oa to overlapping portion Od) can be adjusted individually, so that the line width or thickness of the transferred pattern can become more uniform.

(7) By setting the illumination changing components 10a~10e to include the third light reducing components 10ca1 and the third light reducing components 10ca2 which are arranged in the conjugate plane CP and correspond to the first area (non-overlapping portion Sa~non-overlapping portion Se), the ratio of the exposure amount of the first area (non-overlapping portion Sa~non-overlapping portion Se) to the exposure amount of the second area (overlapping portion Oa~overlapping portion Od) can be adjusted with higher precision. (8) By setting the control unit 50 to move the third dimming components 10ca1 and 10ca2 in the first direction independently of the first end dimming components 10cb1 and 10cb2 and the second end dimming components 10cc1 and 10cc2, the ratio of the exposure amount of the first area (non-overlapping part Sa to non-overlapping part Se) to the exposure amount of the second area (overlapping part Oa to overlapping part Od) can be adjusted with higher precision.

Various implementations and variations are described above, but the present invention is not limited to these contents. In addition, each implementation and variation can be applied separately or in combination. Other forms that can be imagined within the scope of the technical concept of the present invention are also included in the scope of the present invention.

The disclosure contents of the following priority application are incorporated into this case as citations.

Japanese Patent Application No. 2019-069148 (applied on March 29, 2019)

9ca, 9cb, 9cc: dimming component holding part

10ca1, 10ca2: The third dimming component

10cb1, 10cb2: first end dimming component

10cc1, 10cc2: Second end dimming component

11c: Compound eye lens (optical integrator)

91a, 91b, 91c: Slides

110: Lens element

IPIc: Exposure field corresponding area

PX: Pitch

SigCa, SigCb, SigCc: control signals

Wa, Wb: width

X, Y, Z: direction

Claims (18)

An exposure device for exposing a substrate to be exposed, the exposure device comprising: a substrate carrier for moving the substrate to be exposed in a scanning direction; an illumination optical system for supplying illumination light, comprising: an optical integrator located at a position where an incident surface of the illumination light is incident and becomes conycular with an upper surface of the substrate to be exposed; and an illumination changing component disposed on the incident surface side of the optical integrator; a projection optical system for incident illumination light, comprising an aperture for setting an illumination area of the substrate to be exposed by the illumination light, located in an optical path between the optical integrator and the substrate to be exposed and conycular with the substrate to be exposed; and a control unit for moving the illumination changing component in a first direction relative to the optical integrator to change the amount of overlap of the illumination changing component with the incident surface in the direction of the optical axis of the optical integrator, the first direction being The optical method corresponds to the scanning direction; the illumination changing component has: a first dimming component, which can move toward the first direction and overlap with a first part of the incident surface in the direction of the optical axis, the first part corresponds to a first end, the first end includes an end on a side of the non-scanning direction in the illumination area orthogonal to the scanning direction; and a second dimming component, which can move toward the first direction and overlap with a second part of the incident surface in the direction of the optical axis, the second part corresponds to a second end, the second end includes an end on the other side of the non-scanning direction in the illumination area, the control unit moves the first dimming component toward the first direction by a first control signal, and moves the second dimming component toward the first direction by a second control signal, and the second control signal is different from the first control signal. An exposure device is provided for exposing a substrate to be exposed, the exposure device comprising: a substrate stage for moving the substrate to be exposed in a scanning direction; an illumination optical system for supplying illumination light, comprising: an optical integrator arranged at a position where an incident surface of the illumination light is incident and the upper surface of the substrate to be exposed is conjugated; and an illumination changing component arranged on the incident surface side of the optical integrator; and a projection optical system for incident illumination light, comprising an aperture for setting the illumination light. The illumination area of the exposed substrate by the bright light is arranged on the optical path between the optical integrator and the exposed substrate and at a position conyx to the exposed substrate; and a control unit moves the illumination changing component in a first direction relative to the optical integrator to change the amount of overlap of the illumination changing component with the incident surface in the direction of the optical axis of the optical integrator, wherein the first direction optically corresponds to the scanning direction; the illumination changing component has: a first subtraction An optical component is movable in the first direction and overlaps with a first portion of the incident surface in the direction of the optical axis, the first portion corresponds to a first end, the first end includes an end on one side of the illumination area that is orthogonal to the scanning direction and is not in the scanning direction; and a second light-reducing component is movable in the first direction and overlaps with a second portion of the incident surface in the direction of the optical axis, the second portion corresponds to a second end, the second end includes an end on the other side of the non-scanning direction in the illumination area, the control unit causes the illumination changing component to move relative to the optical integrator during the movement of the substrate stage relative to the projection optical system, the control unit causes the first light-reducing component to move in the first direction by a first control signal, and causes the second light-reducing component to move in the first direction by a second control signal, the second control signal being different from the first control signal. An exposure device is provided for exposing a substrate to be exposed, comprising: a substrate stage for moving the substrate to be exposed in a scanning direction; a projection optical system for incident illumination light; an illumination optical system for supplying illumination light to the projection optical system, and comprising: an optical integrator disposed at a position where an incident surface for incident illumination light is conjugate with an upper surface of the substrate to be exposed; and an illumination changing component disposed on the incident surface side of the optical integrator. The illumination of the illumination light is changed by changing the exposure ratio of the first area to the exposure ratio of the second area and the third area, wherein the first area is a area on the substrate to be exposed that is continuously exposed in time by the scanning exposure field of the projection optical system, and the second area and the third area are discretely exposed in time by the scanning exposure field and are exposed in a non-scanning direction orthogonal to the scanning direction. The first area is arranged upwardly interposed with the first area; and a control unit moves the illumination changing component in a first direction; the illumination changing component comprises: a first dimming component that can be moved in the first direction and overlaps with a first part of the incident surface corresponding to the second area in the optical axis direction of the optical integrator; and a second dimming component that can be moved in the first direction and overlaps with a second part of the incident surface corresponding to the third area in the optical axis direction; the control unit moves the illumination changing component relative to the optical integrator during the movement of the substrate stage relative to the projection optical system, and the control unit moves the first dimming component in the first direction by a first control signal and moves the second dimming component in the first direction by a second control signal, and the second control signal is different from the first control signal. An exposure device as described in any one of claim 1 to claim 3, wherein the first light-reducing component can move toward the first direction, and overlap with the first part in the direction of the optical axis when the second part does not overlap with the first part in the direction of the optical axis, and the second light-reducing component can move toward the first direction, and overlap with the second part in the direction of the optical axis when the first part does not overlap with the first part in the direction of the optical axis. An exposure device as described in claim 3, wherein the illumination changing component includes a third light-reducing component, and the third light-reducing component overlaps with a portion of the first area corresponding to the incident surface in the direction of the optical axis. An exposure device as described in claim 5, wherein the control unit moves the third light-reducing component toward the first direction by a third control signal, and the third control signal is different from the first control signal and the second control signal. An exposure device as described in claim 3, wherein the first light-reducing component and the second light-reducing component are each disposed at a position separated by a specified distance from the incident surface in the optical axis direction of the illumination optical system, and the specified distance is determined by the width of the second region in the non-scanning direction, the lateral magnification of the substrate relative to the incident surface, and the numerical aperture of the illumination light in the incident surface. An exposure device as described in claim 7, wherein the optical integrator is a compound eye lens having a plurality of lens groups arranged in a second direction intersecting the first direction, the lens group comprising a plurality of lens elements arranged in a first direction optically corresponding to the scanning direction, the first light reduction component performs light reduction on at least a portion of the portion corresponding to the second region of one or more lens elements arranged in at least one of the lens groups, and the second light reduction component performs light reduction on at least a portion of the portion corresponding to the third region of one or more lens elements arranged in at least one of the lens groups. An exposure device as described in claim 8, wherein the first light-reducing component and the second light-reducing component are arranged in m numbers corresponding to each of the m lens groups (m is a natural number greater than 2) in the plurality of lens groups, and the ends of the m first light-reducing components and the second light-reducing components on one side of the first direction are set at the following positions, which are positions that differ by only P/m in the first direction relative to the period P of the arrangement of the lens elements in the lens group in the first direction. The exposure device as described in claim 3, wherein the projection optical system and the illumination optical system are arranged in parallel in a direction intersecting the scanning direction, the second area on the exposed substrate is an area where a part of the first exposure area and a part of the second exposure area overlap, the first exposure area is an area on the exposed substrate exposed by the scanning exposure field of the first projection optical system among the plurality of projection optical systems during the exposure, and the second exposure area is an area on the exposed substrate exposed by the scanning exposure field of the second projection optical system separated in the scanning direction and in a non-scanning direction orthogonal to the scanning direction relative to the first projection optical system. The exposure device as described in claim 10, wherein the first area on the exposed substrate is an area of other parts of the first exposure area on the exposed substrate exposed by the scanning exposure field of the first projection optical system during the exposure, or an area of other parts of the second exposure area on the exposed substrate exposed by the scanning exposure field of the second projection optical system. A component manufacturing method, comprising: performing an exposure process on the exposed substrate using an exposure device as described in any one of claim 1 to claim 11; and performing a development process on the exposed substrate. An illumination optical system is an illumination optical system used in an exposure device for exposing a substrate, and irradiates an illumination light to an illumination area on an object moving in a scanning direction. The illumination optical system comprises: an optical integrator located at a position where an incident surface on which the illumination light is incident is concentric with an upper surface of the substrate; an illumination changing component disposed on the incident surface side of the optical integrator; and a control unit that moves the illumination changing component relative to a first direction of the optical integrator to change the amount of overlap of the illumination changing component with the incident surface in the direction of an optical axis of the optical integrator, wherein the first direction optically corresponds to the scanning direction; and the illumination changing component comprises: a first light-reducing component that can be moved in the first direction. , and overlaps with the first part of the incident surface in the direction of the optical axis, the first part corresponds to the first end, and the first end includes an end on one side of the non-scanning direction of the illumination area orthogonal to the scanning direction; and a second light-reducing component, which can move toward the first direction and overlaps with the second part of the incident surface in the direction of the optical axis, the second part corresponds to the second end, and the second end includes an end on the other side of the non-scanning direction in the illumination area, the control unit moves the first light-reducing component toward the first direction by a first control signal, and moves the second light-reducing component toward the first direction by a second control signal, and the second control signal is different from the first control signal. An illumination optical system is an illumination optical system used in an exposure device for exposing a substrate, and irradiates an illumination light to an illumination area on an object moving in a scanning direction. The illumination optical system comprises: an optical integrator, which is located at a position where an incident surface on which the illumination light is incident is concentric with an upper surface of the substrate; an illumination changing component, which is arranged on the incident surface side of the optical integrator; and a control unit, which moves the illumination changing component in a first direction relative to the optical integrator to change the amount by which the illumination changing component overlaps with the incident surface in the direction of an optical axis of the optical integrator; the illumination changing component comprises: a first light-reducing component, which can be moved in the first direction and overlaps with a first portion of the incident surface in the direction of the optical axis, wherein the first portion corresponds to a first end The first end portion includes an end on a non-scanning direction side of the illumination area orthogonal to the scanning direction; and a second light-reducing component, which can move toward the first direction and overlap with a second portion of the incident surface in the direction of the optical axis, the second portion corresponds to the second end portion, and the second end portion includes an end on the other side of the non-scanning direction in the illumination area. The control unit causes the illumination changing component to move relative to the optical integrator during the movement of the substrate relative to the illumination light. The control unit causes the first light-reducing component to move toward the first direction by a first control signal, and causes the second light-reducing component to move toward the first direction by a second control signal, and the second control signal is different from the first control signal. The illumination optical system as described in claim 13 or claim 14, wherein the first dimming component can move toward the first direction, and overlap with the first part in the direction of the optical axis when the first part does not overlap with the second part in the direction of the optical axis, and the second dimming component can move toward the first direction, and overlap with the second part in the direction of the optical axis when the first part does not overlap with the first part in the direction of the optical axis. An illumination optical system as described in claim 15, wherein the illumination changing component includes a third dimming component, and the third dimming component overlaps with a portion of the incident surface corresponding to a central area of the illumination area including the center of the non-scanning direction in the direction of the optical axis. An illumination optical system as described in claim 16, wherein the control unit moves the third dimming component toward the first direction via a third control signal, and the third control signal is different from the first control signal and the second control signal. An exposure device, comprising: an illumination optical system as described in any one of claim 13 to claim 17; and a substrate stage, which holds the substrate and moves the substrate relative to the illumination light in the scanning direction in such a manner that a predetermined pattern of the object is transferred onto the substrate.

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