TWI874296B - Adhesive composition and structure for circuit connection - Google Patents

Abstract

A bonding agent composition, which contains an anionically polymerizable or cationically polymerizable epoxy resin or cyclohexane resin, a first silane compound having a functional group reactive with the epoxy resin or cyclohexane resin, and a second silane compound reactive with the first silane compound.

Description

Adhesive compositions and structures for circuit connection

This disclosure relates to a bonding agent composition and structure.

In semiconductor devices and liquid crystal display devices (display devices), various adhesives have been used for the purpose of bonding various components in the device. The properties required of adhesives include adhesiveness, heat resistance, reliability under high temperature and high humidity conditions, and many other aspects. In addition, as the adherends used in the bonding, printed wiring boards, organic substrates (polyimide substrates, etc.), metals (titanium, copper, aluminum, etc.), substrates with surface conditions such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), _SiNx , _SiO2, etc. are used, and it is necessary to design the molecules of the adhesive according to each adherend.

In the past, thermosetting resins (epoxy resins, acrylic resins, etc.) showing high adhesion and high reliability were used in adhesives for semiconductor elements or adhesives for liquid crystal display elements. As the components of adhesives using epoxy resins, epoxy resins and latent curing agents are generally used. The latent curing agent generates cationic species or anionic species reactive to the epoxy resin by heat or light. The latent curing agent is an important factor that determines the curing temperature and curing speed. From the perspective of storage stability at room temperature and curing speed when heated, various compounds can be used. In the actual step, the desired adhesion is obtained by curing at a temperature of 170°C to 250°C for 10 seconds to 3 hours.

In addition, there have been concerns in recent years that as semiconductor components become more integrated and liquid crystal display components become more precise, the spacing between components and wiring becomes smaller, and the heat during curing may have an adverse effect on peripheral components. Furthermore, in order to reduce costs, it is necessary to increase throughput, requiring low-temperature (90°C to 170°C) and short-time (within 1 hour, preferably within 10 seconds, and more preferably within 5 seconds) bonding, in other words, low-temperature and short-time curing (low-temperature rapid curing) bonding. It is known that in order to achieve this low-temperature and short-time curing, it is necessary to use a more active thermal latent catalyst, but it is very difficult to have storage stability near room temperature.

Therefore, in recent years, cationic curing systems of epoxy resins using onium salts as thermal latent catalysts have attracted attention. Cationic curing systems can cure in a short time because cations, which are reactive species, are very reactive, and the catalyst exists stably below the decomposition temperature of the onium salt. Therefore, it is a curing system that takes into account both low-temperature short-time curing and storage stability (for example, storage stability near room temperature). As the cationic curing adhesive, for example, a cationic curing adhesive composition containing a silane compound (silane coupling agent, etc.) having a cationically polymerizable functional group (epoxy group, etc.) is known (for example, refer to the following Patent Document 1).

On the other hand, adhesives that were previously used under curing conditions such as a temperature of 170°C to 250°C and a curing time of 10 seconds to 3 hours are also being required to have longer storage stability in order to improve productivity and simplify inventory management. Among the adhesives, for example, anion-curing adhesive compositions containing silane compounds (silane coupling agents, etc.) having anionically polymerizable functional groups (epoxy groups, etc.) are known (for example, refer to the following patent document 1). [Prior Art Document] [Patent Document]

Patent document 1: Japanese Patent No. 5768676

[Problem to be Solved by the Invention] The silane compound is used to improve the adhesiveness of an adhesive composition. However, when a conventional adhesive composition (mixture) containing only a silane compound having a functional group that utilizes a cation- or anion-curing reaction as a silane compound is stored, there is a problem that the properties of the silane compound are significantly deteriorated, and the adhesiveness of the adhesive composition is reduced. Therefore, it is required that the storage stability of the conventional adhesive composition be improved.

Therefore, the object of the present disclosure is to provide an adhesive composition having excellent storage stability and a structure using the same. [Means for Solving the Problem]

The inventors of the present invention have speculated as follows about the main reason for the degradation of the properties of the silane compound in the previous adhesive composition. That is, during the storage of the adhesive composition, when other initiators different from the silane compound start the polymerization reaction, the silane compound is mixed into the polymerization reaction, and thus mixed into the inside of the constituent materials (resin, etc.) of the adhesive composition. It is speculated that the number of molecules of the silane compound that can act on the interface between the adhesive composition and the adherend is reduced, so the properties are degraded.

The inventors of the present invention have repeatedly conducted research to improve the storage stability (pot life characteristics) of anionic or cationic polymerization systems containing silane compounds (e.g., anionic curing systems of epoxy resins or cationic curing systems of epoxy resins). As a result, they have found that in epoxy resins containing epoxy groups as epoxy group-containing compounds, In a binder composition of an epoxy resin or an oxycyclobutane resin as an oxycyclobutane resin containing a compound having an oxycyclobutane group, when a first silane compound having a functional group reactive with an epoxy resin or an oxycyclobutane resin and a second silane compound reactive with the first silane compound are used in combination, the storage stability of the binder composition is significantly improved.

That is, one aspect of the present disclosure provides a bonding agent composition, which contains an anionically polymerizable or cationically polymerizable epoxy resin or cyclohexane resin, a first silane compound having a functional group reactive with the epoxy resin or cyclohexane resin, and a second silane compound reactive with the first silane compound.

The adhesive composition disclosed in the present invention has better storage stability than before. This adhesive composition can suppress the phenomenon that the adhesiveness of the adhesive composition decreases over time during storage. The inventors of the present invention speculate the main reason for this effect as follows. That is, by allowing the first silane compound having a functional group reactive with an epoxy resin or an oxycyclobutane resin and the second silane compound reactive with the first silane compound to be present in the adhesive composition, even if the first silane compound is polymerized and incorporated into the polymer by a polymerization reaction of an anion or cation curing system during storage, the second silane compound can cross-link with the first silane compound in the polymer and the adherend, thereby maintaining the adhesion between the adhesive composition or its cured product and the adherend.

The functional group of the first silane compound preferably includes at least one selected from the group consisting of an epoxy group, an oxacyclobutane group, an amine group, an acid anhydride group, an isocyanate group, and an alkyl group. The second silane compound preferably includes at least one selected from the group consisting of an alkyl group, a phenyl group, an alkoxysilane group, a hydroxyl group, a fluorine-containing group, a (meth)acryl group, and a vinyl group.

The adhesive composition disclosed herein may further contain conductive particles.

The adhesive composition disclosed herein can also be used for circuit connection (adhesive composition for circuit connection).

Another aspect of the present disclosure provides a structure comprising the adhesive composition or a cured product thereof according to one aspect of the present disclosure.

Another aspect of the present disclosure provides a structure, which includes: a first circuit component having a first circuit electrode, a second circuit component having a second circuit electrode, and a circuit connection component disposed between the first circuit component and the second circuit component, wherein the first circuit electrode and the second circuit electrode are electrically connected, and the circuit connection component includes the adhesive composition or a cured product thereof of one aspect of the present disclosure. [Effect of the Invention]

The present disclosure can provide an adhesive composition having better storage stability than before and a structure using the same.

The present disclosure may provide an adhesive composition or a cured product thereof for use in a structure or its manufacture. The present disclosure may provide an adhesive composition or a cured product thereof for use in circuit connection. The present disclosure may provide an adhesive composition or a cured product thereof for use in a circuit connection structure or its manufacture.

The following describes the implementation methods of the present disclosure, but the present disclosure is not limited to these implementation methods.

In this specification, "(meth)acrylate" means at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions such as "(meth)acryl", "(meth)acrylic acid", etc. Unless otherwise specified, the materials exemplified below may be used alone or in combination of two or more. As for the content of each component in the composition, when there are multiple substances equivalent to each component in the composition, unless otherwise specified, the total amount of the multiple substances present in the composition is indicated. The numerical range expressed using "~" indicates a range that includes the numerical values recorded before and after "~" as the minimum and maximum values, respectively. The so-called "A or B" may include either A and B, or both. The so-called "normal temperature" means 25°C.

In the numerical ranges recorded in stages in this specification, the upper limit or lower limit of a numerical range in a certain stage may also be replaced by the upper limit or lower limit of a numerical range in another stage. Moreover, in the numerical ranges recorded in this specification, the upper limit or lower limit of the numerical range may also be replaced by the values shown in the embodiments.

<Adhesive Composition> The adhesive composition of the present embodiment contains an anionically or cationically polymerizable epoxy resin or cyclohexane resin (anionically or cationically polymerizable substance), a first silane compound having a functional group reactive with the epoxy resin or cyclohexane resin, and a second silane compound reactive with the first silane compound. The adhesive composition of the present embodiment contains a first silane compound and a second silane compound (excluding compounds equivalent to the first silane compound) that reacts with the first silane compound as silane compounds, and the first silane compound has a functional group that reacts with an epoxy resin or an oxycyclobutane resin (a functional group that participates in a polymerization reaction of an anionic or cationic curing system. A functional group that can react with an epoxy resin or an oxycyclobutane resin in an anionic or cationic polymerization system). The adhesive composition of the present embodiment is an anionic or cationic curing system (anionic polymerization system or cationic polymerization system) adhesive composition. The adhesive composition of this embodiment can be suitably used as an adhesive composition for circuit connection. Hereinafter, each component will be described.

(Silane compound) The adhesive composition of the present embodiment contains a first silane compound and a second silane compound that reacts with the first silane compound, wherein the first silane compound has a functional group that reacts with an epoxy resin or an oxycyclobutane resin in an anionic or cationic polymerization system. The second silane compound is a compound that is not equivalent to the first silane compound and does not have a functional group that reacts with an epoxy resin or an oxycyclobutane resin in an anionic or cationic polymerization system. The silane compound may also be a silane coupling agent. For example, when both the first silane compound and the second silane compound are silane coupling agents, the second silane compound can react with the first silane compound through a hydrolysis/condensation reaction of an alkoxysilyl group.

Examples of the functional group that reacts with the epoxy resin or the cyclohexane resin include an epoxy group, a cyclohexane group, an amine group, an acid anhydride group, an isocyanate group, and an alkyl group. From the viewpoint of obtaining better storage stability and adhesion, the functional group that reacts with the epoxy resin or the cyclohexane resin is preferably at least one selected from the group consisting of an epoxy group and a cyclohexane group, and more preferably an epoxy group.

The second silane compound may also have a functional group that does not participate in anionic or cationic polymerization (does not react with epoxy resin or cyclohexane resin in anionic or cationic polymerization system). Examples of the functional group that does not participate in anionic or cationic polymerization include: alkyl, phenyl, alkoxysilyl, hydroxyl, fluorine-containing group, (meth)acryl, vinyl, urea, etc. From the perspective of obtaining better storage stability, the second silane compound preferably has at least one selected from the group consisting of alkyl, phenyl and alkoxysilyl, and more preferably has an alkoxysilyl.

As the silane compound, a compound represented by the following general formula (I) can be used. The compound represented by the formula (I) can be synthesized by, for example, reacting an organic chlorosilane with an alcohol.

[Chemistry 1] _{XCsH2s -} Si〔 ^R1 〕 _m 〔 ^OR2 〕 _3-m ···(I) [wherein X represents an organic group, ^R1 and ^R2 each independently represent an alkyl group, m represents an integer of 0 to 2, and s represents an integer greater than 0. When there are multiple ^R1s , each ^R1 may be the same as or different from each other. When there are multiple ^R2s , each ^R2 may be the same as or different from each other. ^R1 , ^R2 and _CsH2s may each be _branched ]

As the organic group X, there can be listed an ethylenic unsaturated bond-containing group (a group containing an ethylenic unsaturated bond), a nitrogen atom-containing group (a group containing a nitrogen atom), a sulfur atom-containing group (a group containing a sulfur atom), an epoxide group, etc. As the ethylenic unsaturated bond-containing group, there can be listed a (meth)acryl group, a vinyl group, a styryl group, etc. As the nitrogen atom-containing group, there can be listed an amino group, a monosubstituted amino group, a disubstituted amino group, an isocyanate group, an imidazole group, a urea group, a maleimide group, etc. As the monosubstituted amino group, there can be listed an alkylamino group (a methylamino group, etc.), a benzylamino group, a phenylamino group, a cycloalkylamino group (a cyclohexylamino group, etc.), etc. As the disubstituted amino group, there can be listed a non-cyclic disubstituted amino group, a cyclic disubstituted amino group, etc. Examples of the non-cyclic disubstituted amino group include dialkylamino groups (dimethylamino groups, etc.). Examples of the cyclic disubstituted amino group include morpholinyl groups, piperazinyl groups, etc. Examples of the sulfur atom-containing group include pentyl groups, etc. An epoxy group may be contained in an epoxy group-containing group (an epoxy group-containing group) such as a glycidyl group and a glycidyloxy group. A (meth)acryloyl group may be contained in a (meth)acryloyloxy group.

When the compound represented by the general formula (I) is used as the first silane compound, a functional group that reacts with an epoxy resin or an oxycyclobutane resin is selected from the above-mentioned organic group X. Furthermore, when the compound represented by the general formula (I) is used as the second silane compound, a functional group that does not react with an epoxy resin or an oxycyclobutane resin (does not participate in anionic or cationic polymerization reaction) is selected from the above-mentioned organic group X.

The carbon number of the alkyl group of ^R1 and ^R2 is, for example, 1 to 20. Specific examples of the alkyl group include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl, nonadecyl, eicosyl, etc. As ^R1 and ^R2 , each structural isomer of the alkyl group can be used. From the viewpoint that the alkoxysilyl moiety is unlikely to cause stereo hindrance when reacting with the adherend, and better adhesion with the adherend is obtained, the carbon number of the alkyl group of ^R1 is preferably 1 to 10, and more preferably 1 to 5. From the viewpoint of obtaining better adhesion to an adherend, the carbon number of the alkyl group of ^R2 is preferably 1 to 10, more preferably 1 to 5.

m is an integer of 0 to 2. From the viewpoint of obtaining better adhesion to the adherend since the alkoxysilyl moiety is less likely to cause stereo hindrance when reacting with the adherend, m is preferably 0 to 1, and more preferably 0. s is an integer greater than 0. From the viewpoint of obtaining better storage stability, s is preferably an integer of 1 to 20, and more preferably an integer of 1 to 10.

As the first silane compound, there can be mentioned glycidyloxyalkyltrialkoxysilanes (e.g., 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 8-glycidyloxyoctyltrimethoxysilane, 8-glycidyloxyoctyltriethoxysilane, etc.), glycidyloxyalkylalkyldialkoxysilanes (e.g., 3-glycidyloxypropylmethyldimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 8-glycidyloxyoctyltrimethoxysilane, etc.), 8-aminooctylmethyldimethoxysilane, 8-glycidyloxyoctylmethyldiethoxysilane, etc.), N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-8-aminooctylmethyldimethoxysilane, N-2-(aminoethyl)-8-aminooctyltrimethoxysilane, 3-aminooctyltrimethoxysilane, 3-aminooctyltriethoxysilane, 3-triethoxysilyl- N-(1,3-dimethylbutylene)octylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-phenyl-8-aminooctyltrimethoxysilane, 3-butylpropylmethyldimethoxysilane, 3-butylpropyltrimethoxysilane, 8-butyloctylmethyldimethoxysilane, 8-butyloctyltrimethoxysilane, trimethoxysilylpropylsuccinic anhydride, triethoxysilylpropylsuccinic anhydride, 3-[(3-ethyloxycyclobutane-3-yl)methoxy]propyltrialkoxy Silane (for example, 3-[(3-ethyloxycyclobutane-3-yl)methoxy]propyl(trimethoxy)silane, 3-[(3-ethyloxycyclobutane-3-yl)methoxy]propyl(triethoxy)silane, etc.), isocyanate alkyltrialkoxysilane (for example, 3-isocyanatepropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, 8-isocyanateoctyltrimethoxysilane, 8-isocyanateoctyltriethoxysilane, etc.), isocyanatealkylalkyldialkoxysilane, etc. From the viewpoint of obtaining better storage stability and adhesion, the first silane compound is preferably at least one selected from the group consisting of glycidyloxyalkyltrialkoxysilane and glycidyloxyalkylalkyldialkoxysilane. The first silane compound may be used alone or in combination of two or more.

Examples of the second silane compound include alkyltrialkoxysilane, dialkyldialkoxysilane, phenyltrialkoxysilane, fluoroalkyltrialkoxysilane, fluoroalkylalkyldialkoxysilane, (meth)acryloxyalkyltrialkoxysilane, (meth)acryloxyalkylalkyldialkoxysilane, (meth)acryloxytrialkylalkoxysilane, alkenyltrialkoxysilane, alkenylalkyldialkoxysilane, styryltrialkoxysilane, styrylalkyltrialkoxysilane, 3-ureidopropyltriethoxysilane, 8-ureidooctyltriethoxysilane, and the like.

Examples of the alkyltrialkoxysilane include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, butyltrimethoxysilane, butyltriethoxysilane, pentyltrimethoxysilane, pentyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, heptyltrimethoxysilane, heptyltriethoxysilane, octyltrimethoxysilane, octyltriethoxysilane, nonyltrimethoxysilane, nonyltriethoxysilane, decyltrimethoxysilane, decyltriethoxysilane and the like.

Examples of the dialkyldialkoxysilane include dimethyldimethoxysilane, dimethyldiethoxysilane, ethylmethyldimethoxysilane, ethylmethyldiethoxysilane, propylmethyldimethoxysilane, propylmethyldiethoxysilane, butylmethyldimethoxysilane, butylmethyldiethoxysilane, pentylmethyldimethoxysilane, pentylmethyldiethoxysilane, hexylmethyldimethoxysilane, hexylmethyldiethoxysilane, heptylmethyldimethoxysilane, heptylmethyldiethoxysilane, octylmethyldimethoxysilane, octylmethyldiethoxysilane, nonylmethyldimethoxysilane, nonylmethyldiethoxysilane, decylmethyldimethoxysilane, decylmethyldiethoxysilane and the like.

Examples of the phenyltrialkoxysilane include phenyltrimethoxysilane, phenyltriethoxysilane, and the like.

Examples of the fluoroalkyltrialkoxysilane include trifluoropropyltrimethoxysilane and trifluoropropyltriethoxysilane.

Examples of the fluoroalkylalkyldialkoxysilane include trifluoropropylmethyldimethoxysilane and trifluoropropylmethyldiethoxysilane.

Examples of the (meth)acryloxyalkyltrialkoxysilane include 3-(meth)acryloxypropyltrimethoxysilane, 3-(meth)acryloxypropyltriethoxysilane, 8-(meth)acryloxyoctyltrimethoxysilane, and 8-(meth)acryloxyoctyltriethoxysilane.

Examples of the (meth)acryloxyalkylalkyldialkoxysilane include 3-(meth)acryloxypropylmethyldimethoxysilane, 3-(meth)acryloxypropylmethyldiethoxysilane, 8-(meth)acryloxyoctylmethyldimethoxysilane, and 8-(meth)acryloxyoctylmethyldiethoxysilane.

Examples of the alkenyltrialkoxysilane include vinyltrialkoxysilane, octenyltrialkoxysilane and the like.

Examples of the vinyl trialkoxysilane include vinyl trimethoxysilane and vinyl triethoxysilane.

Examples of the octenyltrialkoxysilane include 7-octenyltrimethoxysilane and 7-octenyltriethoxysilane.

Examples of the alkenylalkyldialkoxysilane include vinylalkyldialkoxysilane, octenylalkyldialkoxysilane and the like.

Examples of the vinylalkyldialkoxysilane include vinylmethyldimethoxysilane and vinylmethyldiethoxysilane.

Examples of the octenylalkyldialkoxysilane include 7-octenylmethyldimethoxysilane and 7-octenylmethyldiethoxysilane.

Examples of the styryltrialkoxysilane include p-styryltrimethoxysilane and the like.

Examples of the styrylalkyltrialkoxysilane include p-styryloctyltrimethoxysilane and the like.

From the viewpoint of obtaining better storage stability, the second silane compound is preferably at least one selected from the group consisting of alkyltrialkoxysilane, phenyltrialkoxysilane and (meth)acryloxyalkyltrialkoxysilane, and more preferably at least one selected from the group consisting of methyltrimethoxysilane and 3-(meth)acryloxypropyltrimethoxysilane. The second silane compound may be used alone or in combination of two or more.

Examples of the second silane compound other than the compound represented by formula (I) include tetraalkoxysilane, alkyltrialkoxysilane, dialkyldialkoxysilane, etc. Examples of such a second silane compound include methyltrimethoxysilane, methyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, dimethyldimethoxysilane, tetramethoxysilane, tetraethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, etc. From the viewpoint of obtaining better storage stability, the second silane compound other than the compound represented by formula (I) is preferably at least one selected from the group consisting of alkyltrialkoxysilanes and tetraalkoxysilanes, and more preferably at least one selected from the group consisting of methyltrimethoxysilane, ethyltriethoxysilane, tetramethoxysilane and tetraethoxysilane. The second silane compound other than the compound represented by formula (I) may be used alone or in combination of two or more.

The content of the silane compound (including the first silane compound, the second silane compound and other silane compounds) is not particularly limited, but from the viewpoint of easily suppressing the generation of peeling bubbles (parts where peeling occurs at the interface between the adhesive composition and the adherend and bubbles are observed as a result) at the interface between the adherend (circuit component, etc.) and the adhesive composition or its cured product (circuit connecting component, etc.), the content is preferably within the following range based on the total mass of the adhesive components of the adhesive composition (solid components other than the conductive particles in the adhesive composition. The same applies hereinafter). The content of the silane compound is preferably 0.1% by mass or more, more preferably 0.25% by mass or more, further preferably 0.5% by mass or more, particularly preferably 1% by mass or more, extremely preferably 2% by mass or more, and very preferably 3% by mass or more. The content of the silane compound is preferably 20% by mass or less, more preferably 15% by mass or less, further preferably 10% by mass or less, and particularly preferably 5% by mass or less. From these viewpoints, the content of the silane compound is preferably 0.1% by mass to 20% by mass, more preferably 0.25% by mass to 15% by mass, further preferably 0.5% by mass to 10% by mass, particularly preferably 1% by mass to 5% by mass, extremely preferably 2% by mass to 5% by mass, and very preferably 3% by mass to 5% by mass.

From the viewpoint of easily suppressing the generation of exfoliation bubbles at the interface between the adherend (circuit component, etc.) and the adhesive composition or its cured product (circuit connection component, etc.), the content of the first silane compound is preferably in the following range based on the total mass of the adhesive component of the adhesive composition. The content of the first silane compound is preferably 0.1 mass% or more, more preferably 0.25 mass% or more, further preferably 0.5 mass% or more, particularly preferably 1 mass% or more, and extremely preferably 1.5 mass% or more. The content of the first silane compound is preferably 20 mass% or less, more preferably 15 mass% or less, further preferably 10 mass% or less, particularly preferably 5 mass% or less, and extremely preferably 3 mass% or less. From these viewpoints, the content of the first silane compound is preferably 0.1 mass % to 20 mass %, more preferably 0.25 mass % to 15 mass %, further preferably 0.5 mass % to 10 mass %, particularly preferably 1 mass % to 5 mass %, and extremely preferably 1.5 mass % to 3 mass %.

From the viewpoint of easily suppressing the generation of exfoliation bubbles at the interface between the adherend (circuit component, etc.) and the adhesive composition or its cured product (circuit connection component, etc.), the content of the second silane compound is preferably in the following range based on the total mass of the adhesive component of the adhesive composition. The content of the second silane compound is preferably 0.1 mass% or more, more preferably 0.25 mass% or more, further preferably 0.5 mass% or more, particularly preferably 1 mass% or more, and extremely preferably 1.5 mass% or more. The content of the second silane compound is preferably 20 mass% or less, more preferably 15 mass% or less, further preferably 10 mass% or less, particularly preferably 5 mass% or less, and extremely preferably 3 mass% or less. From these viewpoints, the content of the second silane compound is preferably 0.1 mass % to 20 mass %, more preferably 0.25 mass % to 15 mass %, further preferably 0.5 mass % to 10 mass %, particularly preferably 1 mass % to 5 mass %, and extremely preferably 1.5 mass % to 3 mass %.

From the viewpoint of obtaining better storage stability and adhesion, the ratio of the content of the first silane compound to the content of the second silane compound (mass ratio. Relative value relative to the content of the second silane compound 1) is preferably 0.01 or more, more preferably 0.1 or more, further preferably 0.2 or more, particularly preferably 0.5 or more, and extremely preferably 1 or more. From the viewpoint of obtaining better storage stability and adhesion, the ratio is preferably 100 or less, more preferably 10 or less, further preferably 5 or less, particularly preferably 3 or less, and extremely preferably 2 or less.

(Anionic or cationic polymerizable component: anionic or cationic polymerizable epoxy resin or cyclohexane resin) Examples of anionic or cationic polymerizable epoxy resins as anionic or cationic polymerizable components include: bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, Epoxy resins, bisphenol A novolac type epoxy resins, bisphenol F novolac type epoxy resins, aliphatic epoxy resins, glycidyl ester type epoxy resins, glycidylamine type epoxy resins, hydantoin type epoxy resins, isocyanurate type epoxy resins, aliphatic chain epoxy resins, etc. Examples of anionically or cationically polymerizable cyclohexane resins as anionically or cationically polymerizable components include 3-ethyl-3-hydroxymethylcyclohexane, 2-ethylhexylcyclohexane, xylylbiscyclohexane, 3-ethyl-3{[(3-ethylcyclohexane-3-yl)methoxy]methyl}cyclohexane, (3-ethylcyclohexane-3-yl)methyl acrylate, and (3-ethylcyclohexane-3-yl)methyl methacrylate. The anionically or cationically polymerizable component may be halogenated or hydrogenated. The anionic or cationic polymerizable components may be used alone or in combination of two or more.

From the viewpoint of further improving the adhesion to the adherend, the content of the anionic or cationic polymerizable component is preferably in the following range based on the total mass of the adhesive component of the adhesive composition. The content of the anionic or cationic polymerizable component is preferably 5 mass % or more, more preferably 10 mass % or more, and further preferably 15 mass % or more. The content of the anionic or cationic polymerizable component is preferably 90 mass % or less, more preferably 80 mass % or less, and further preferably 70 mass % or less. From these viewpoints, the content of the anionic or cationic polymerizable component is preferably 5% by mass to 90% by mass, more preferably 10% by mass to 80% by mass, and further preferably 15% by mass to 70% by mass.

(Hardener) The adhesive composition of the present embodiment may further include a hardener. The hardener is not particularly limited as long as it is capable of hardening anionically or cationically polymerizable epoxy resins or cyclohexane resins. Examples of the hardener include hardeners that can generate anionic species by heat or light (cationically polymerizable catalytic hardeners, etc.), hardeners that can generate cationic species by heat or light (cationically polymerizable catalytic hardeners, etc.), and addition polymerization hardeners. The hardener may be used alone or in combination of two or more. From the viewpoint of excellent self-curing property and no need to consider chemical equivalent, the hardener is preferably a hardener that can generate anionic species or cationic species by heat or light, and more preferably a cationic or cationic catalytic hardener.

Examples of anionic polymerization catalyst-type hardeners include imidazole-based hardeners, hydrazide-based hardeners, boron trifluoride-amine complexes, amine imides, tertiary amines, diamino cis-butylene dinitrile, melamine and its derivatives, salts of polyamines, dicyandiamide, etc., and their modified products can also be used. Examples of cationic polymerization catalyst-type hardeners include diazonium salts, coronium salts, etc., and their modified products can also be used. Examples of addition polymerization hardeners include polyamines, polythiols, polyphenols, acid anhydrides, etc.

When using tertiary amines, imidazole-based hardeners, etc. as anionic polymerizable catalytic hardeners, epoxy resins or cyclohexane resins can be hardened by heating at a medium temperature of about 160°C to 200°C for tens of seconds to hours. Therefore, the usable life (pot life) can be relatively long.

As a catalytic curing agent of cationic polymerization, for example, a photosensitive onium salt (aromatic diazonium salt, aromatic cobalt salt, etc.) that can cure epoxy resin or cyclobutane resin by irradiation with energy rays is preferred. In addition, as a curing agent that can be activated by heat other than irradiation with energy rays to cure epoxy resin or cyclobutane resin, aliphatic cobalt salts can be cited. Such a curing agent is preferred because it has a rapid curing property.

It is better to use a hardener that is coated with a polymer (polyurethane, polyester, etc.), a metal (nickel, ketone, etc.) film, an inorganic (calcium silicate, etc.) and then microencapsulated to extend the service life.

From the viewpoint of further improving the adhesion to the adherend, the content of the hardener is preferably in the following range relative to 100 parts by mass of the anionic or cationic polymerizable component. The content of the hardener is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, and further preferably 30 parts by mass or more. The content of the hardener is preferably 500 parts by mass or less, more preferably 100 parts by mass or less, and further preferably 70 parts by mass or less. From these viewpoints, the content of the hardener is preferably 10 to 500 parts by mass, more preferably 20 to 100 parts by mass, and further preferably 30 to 70 parts by mass.

(Film-forming material) The adhesive composition of the present embodiment may also contain a film-forming material as needed. When the liquid adhesive composition is solidified into a film, the film-forming material can improve the operability of the film under normal conditions (normal temperature and pressure) and give the film properties such as being difficult to crack, difficult to damage, and difficult to get sticky. Examples of the film-forming material include phenoxy resins, polyvinyl formaldehyde, polystyrene, polyvinyl butyral, polyester, polyamide, xylene resins, and polyurethane. From the perspective of excellent self-adhesion, compatibility, heat resistance, and mechanical strength, phenoxy resins are preferred. The film-forming material may be used alone or in combination of two or more.

Examples of phenoxy resins include resins obtained by addition polymerization of bifunctional epoxy resins and bifunctional phenols, and resins obtained by reacting bifunctional phenols with epihalogen alcohols until they are polymerized. Phenoxy resins can be obtained, for example, by reacting 1 mol of bifunctional phenols with 0.985 mol to 1.015 mol of epihalogen alcohols in a non-reactive solvent at a temperature of 40°C to 120°C in the presence of a catalyst such as an alkaline metal hydroxide. From the viewpoint of excellent mechanical and thermal properties of the resin, the phenoxy resin is particularly preferably obtained by setting the equivalent ratio of a bifunctional epoxy resin to a bifunctional phenol to 1/0.9 to 1/1.1, heating to 50°C to 200°C in an organic solvent (amide, ether, ketone, lactone, alcohol, etc.) having a boiling point of 120°C or more under the condition that the reaction solid content is 50% by mass or less, and performing addition polymerization. The phenoxy resin may be used alone or in combination of two or more.

Examples of bifunctional epoxy resins include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol AD epoxy resins, bisphenol S epoxy resins, biphenyl diglycidyl ether, and methyl-substituted biphenyl diglycidyl ether. Bifunctional phenols are compounds having two phenolic hydroxyl groups. Examples of bifunctional phenols include hydroquinones, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, bisphenol fluorene, methyl-substituted bisphenol fluorene, dihydroxybiphenyl, and methyl-substituted dihydroxybiphenyl. Phenoxy resins can also be modified with free radical polymerizable functional groups or other reactive compounds (e.g. epoxy modification).

The content of the film-forming material is preferably 10% to 90% by mass, more preferably 20% to 60% by mass, and further preferably 30% to 50% by mass, based on the total amount of the adhesive components of the adhesive composition.

(Conductive particles) The adhesive composition of the present embodiment may further contain conductive particles. As constituent materials of the conductive particles, metals such as gold (Au), silver (Ag), nickel (Ni), copper (Cu), solder, and carbon may be listed. Furthermore, it may be a coated conductive particle having a non-conductive resin, glass, ceramic, plastic, etc. as a core, on which the metal (metal particles, etc.) or carbon is coated. Coated conductive particles or hot-melt metal particles are deformable due to heating and pressurization, so that the uneven height of the circuit electrode is eliminated during connection, and the contact area with the electrode is increased during connection, so the reliability is improved and it is better.

From the viewpoint of excellent self-dispersibility and conductivity, the average particle size of the conductive particles is preferably 1 μm to 50 μm, more preferably 2 μm to 30 μm, and further preferably 3 μm to 20 μm. The average particle size of the conductive particles can be measured by machine analysis such as laser diffraction method.

From the viewpoint of excellent conductivity, the content of the conductive particles is preferably 0.1 parts by volume or more, and more preferably 1 part by volume or more, relative to 100 parts by volume of the total volume of the adhesive component of the adhesive composition. From the viewpoint of easily suppressing short circuits of electrodes (circuit electrodes, etc.), the content of the conductive particles is preferably 50 parts by volume or less, more preferably 20 parts by volume or less, further preferably 10 parts by volume or less, particularly preferably 5 parts by volume or less, and extremely preferably 3 parts by volume or less, based on the total volume of the adhesive component of the adhesive composition. From these viewpoints, the content of the conductive particles is preferably 0.1 to 50 parts by volume, more preferably 0.1 to 20 parts by volume, further preferably 1 to 20 parts by volume, particularly preferably 1 to 10 parts by volume, extremely preferably 1 to 5 parts by volume, and very preferably 1 to 3 parts by volume. In addition, "parts by volume" is determined based on the volume of each component before curing at 23°C, but the volume of each component can also be converted from mass to volume using specific gravity. Furthermore, the volume of the target component may be obtained by adding the target component into a container such as a measuring cylinder in which a suitable solvent (water, alcohol, etc.) that does not dissolve or swell the target component but sufficiently wets the target component is placed.

(Other components) The adhesive composition of the present embodiment may further contain a homopolymer or copolymer obtained by polymerizing at least one monomer component selected from the group consisting of (meth)acrylic acid, (meth)acrylate and acrylonitrile. From the viewpoint of excellent stress relief, it is preferred that the adhesive composition of the present embodiment contains an acrylic rubber, etc., wherein the acrylic rubber is a copolymer obtained by polymerizing (meth)acrylate having a glycidyl ether group. From the viewpoint of improving the cohesive force of the adhesive composition, the weight average molecular weight of the acrylic rubber is preferably 200,000 or more. Based on the total amount of the adhesive components in the adhesive composition, the content of the acrylic rubber is preferably 1% to 60% by mass, more preferably 10% to 50% by mass, and further preferably 20% to 40% by mass.

The adhesive composition of this embodiment may also contain coated microparticles whose surfaces are coated with a polymer resin or the like. When such coated microparticles are used together with the conductive particles, even when the content of the conductive particles is increased, it is easy to suppress short circuits caused by contact between the conductive particles, thereby improving the insulation between adjacent circuit electrodes. The coated microparticles may be used alone instead of conductive particles, or the coated microparticles may be used together with the conductive particles. Furthermore, when the adhesive composition contains coated microparticles, the "adhesive component of the adhesive composition" in this specification refers to the solid components other than the conductive particles and coated microparticles in the adhesive composition.

The adhesive composition of the present embodiment may also contain rubber particles, fillers (such as silicon dioxide particles), softeners, promoters, anti-aging agents, colorants, flame retardants, thiophene agents, etc. In addition, the adhesive composition of the present embodiment may also contain additives such as tackifiers, levelers, and weather resistance enhancers.

The rubber particles preferably have an average particle size of less than 2 times the average particle size of the conductive particles, and a storage elastic modulus at room temperature of less than 1/2 of the storage elastic modulus of the conductive particles and the adhesive composition at room temperature. In particular, when the material of the rubber particles is silicone, acrylic emulsion, styrene-butadiene rubber (SBR), nitrile rubber (NBR) or polybutadiene rubber, the rubber particles are preferably used alone or in combination of two or more. The three-dimensionally cross-linked rubber particles have excellent solvent resistance and are easily dispersed in the adhesive composition.

Fillers can improve the electrical properties (connection reliability, etc.) between circuit electrodes. As fillers, for example, particles having an average particle size of less than 1/2 of the average particle size of conductive particles can be appropriately used. When particles that do not have conductivity are used together with fillers, particles having an average particle size less than that of particles that do not have conductivity can be used as fillers. Based on the total amount of the adhesive components of the adhesive composition, the content of the filler is preferably 0.1% by mass to 60% by mass. By making the content less than 60% by mass, there is a tendency to more fully obtain the effect of improving connection reliability. By making the content greater than 0.1% by mass, there is a tendency to fully obtain the effect of adding the filler.

When the adhesive composition of the present embodiment is in liquid form at room temperature, it can be used in a paste form. When the adhesive composition is in a solid form at room temperature, in addition to being heated for use, it can also be pasted using a solvent. As a solvent that can be used, there is no particular limitation as long as it is a solvent that is non-reactive with the components in the adhesive composition and shows sufficient solubility. The solvent is preferably a solvent having a boiling point of 50°C to 150°C at normal pressure. If the boiling point is above 50°C, the volatility of the solvent is poor at room temperature, so it can be used even in an open system. If the boiling point is below 150°C, the solvent is easily volatilized, so good reliability can be obtained after bonding.

The adhesive composition of this embodiment may also be in the form of a film. The adhesive composition containing a solvent or the like as needed may be applied to a fluororesin film, a polyethylene terephthalate film, a release substrate (release paper, etc.), and then the solvent or the like is removed to obtain a film-like adhesive composition. Furthermore, after the solution is impregnated in a substrate such as a nonwoven fabric and placed on a release substrate, the film-like adhesive composition may be obtained by removing the solvent or the like. If the adhesive composition is used in the form of a film, the operability and the like are excellent.

The adhesive composition of the present embodiment can be bonded by pressurizing together with heating or light irradiation. By using heating and light irradiation together, bonding can be performed at a low temperature and for a short time. It is preferred that light irradiation is light in the wavelength region of 150 nm to 750 nm. The light source may be a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp (ultra-high-pressure mercury lamp, etc.), a xenon lamp, a metal halogen lamp, etc. The irradiation amount may be 0.1 J/cm ² to 10 J/cm ^2. The heating temperature is not particularly limited, but is preferably a temperature of 50°C to 170°C. The pressure is not particularly limited as long as it does not cause damage to the adherend, but is preferably 0.1 MPa to 10 MPa. The heating and pressurization are preferably performed in the range of 0.5 seconds to 3 hours.

The adhesive composition of the present embodiment can be used as an adhesive for the same kind of adherends, or as an adhesive for different kinds of adherends with different thermal expansion coefficients. Specifically, it can be used as circuit connection materials represented by anisotropic conductive adhesives, silver pastes, silver films, etc.; semiconductor element bonding materials represented by chip size package (CSP) elastomers, CSP bottom fill materials, lead on chip (LOC) tapes, etc.

<Structure and its manufacturing method> The structure of the present embodiment includes the adhesive composition of the present embodiment or its hardened product. The structure of the present embodiment is, for example, a semiconductor device such as a circuit connection structure. As an embodiment of the structure of the present embodiment, the circuit connection structure includes a first circuit component having a first circuit electrode, a second circuit component having a second circuit electrode, and a circuit connection component arranged between the first circuit component and the second circuit component. The first circuit component includes, for example, a first substrate and a first circuit electrode arranged on the first substrate. The second circuit component includes, for example, a second substrate and a second circuit electrode arranged on the second substrate. The first circuit electrode and the second circuit electrode are opposite to each other and electrically connected. The circuit connection component includes the adhesive composition of the present embodiment or its hardened product. The structure of the present embodiment only needs to include the adhesive composition of the present embodiment or a cured product thereof, and a member (substrate, etc.) not having a circuit electrode may be used instead of the circuit member of the circuit connection structure.

The manufacturing method of the structure of the present embodiment includes a step of hardening the adhesive composition of the present embodiment. As an embodiment of the manufacturing method of the structure of the present embodiment, the manufacturing method of the circuit connection structure includes: a configuration step of configuring the adhesive composition of the present embodiment between a first circuit component having a first circuit electrode and a second circuit component having a second circuit electrode, a heating and pressurizing step of pressurizing the first circuit component and the second circuit component to electrically connect the first circuit electrode and the second circuit electrode, and heating the adhesive composition to harden it. In the configuration step, the first circuit electrode and the second circuit electrode can be configured in a manner that they face each other. In the heating and pressurizing step, pressure may be applied in the direction opposite to the first circuit component and the second circuit component.

Hereinafter, a circuit connection structure and a method for manufacturing the same will be described as an embodiment of the present embodiment using drawings. FIG. 1 is a schematic cross-sectional view showing an embodiment of the structure. The circuit connection structure 100a shown in FIG. 1 includes a circuit component (first circuit component) 20 and a circuit component (second circuit component) 30 facing each other, and a circuit connection component 10 for connecting these components is arranged between the circuit component 20 and the circuit component 30. The circuit connection component 10 includes a cured product of the adhesive composition of the present embodiment.

The circuit component 20 includes a substrate (first substrate) 21 and a circuit electrode (first circuit electrode) 22 disposed on a main surface 21a of the substrate 21. An insulating layer (not shown) may also be disposed on the main surface 21a of the substrate 21 as required.

The circuit component 30 includes a substrate (second substrate) 31 and a circuit electrode (second circuit electrode) 32 disposed on a main surface 31a of the substrate 31. An insulating layer (not shown) may be disposed on the main surface 31a of the substrate 31 as required.

The circuit connection member 10 includes an insulating material (a hardened material of components other than conductive particles) 10a and conductive particles 10b. The conductive particles 10b are disposed at least between the opposing circuit electrodes 22 and 32. In the circuit connection structure 100a, the circuit electrodes 22 and 32 are electrically connected via the conductive particles 10b.

The circuit components 20 and the circuit components 30 have a single or multiple circuit electrodes (connection terminals). As the circuit components 20 and the circuit components 30, for example, components including electrodes that need to be electrically connected can be used. As the circuit components, chip parts such as semiconductor chips (IC chips), resistor chips, and capacitor chips; substrates such as printed circuit boards and semiconductor mounting substrates can be used. As a combination of the circuit components 20 and the circuit components 30, for example, semiconductor chips and semiconductor mounting substrates can be used. As the material of the substrate, for example, inorganic substances such as semiconductors, glass, and ceramics; organic substances such as polyimide, polyethylene terephthalate, polycarbonate, (meth) acrylic resin, and cyclic olefin resin; composites of glass and epoxy, etc. can be listed. The substrate can also be a plastic substrate.

FIG2 is a schematic cross-sectional view showing another embodiment of the structure. The circuit connection structure 100b shown in FIG2 has the same structure as the circuit connection structure 100a except that the circuit connection member 10 does not contain the conductive particles 10b. In the circuit connection structure 100b shown in FIG2, the circuit electrode 22 and the circuit electrode 32 are directly in contact without the conductive particles, thereby being electrically connected.

The circuit connection structure 100a and the circuit connection structure 100b can be manufactured, for example, by the following method. First, when the adhesive composition is in a paste state, the adhesive composition is applied and dried, thereby configuring a resin layer containing the adhesive composition on the circuit component 20. When the adhesive composition is in a film state, the film-like adhesive composition is attached to the circuit component 20, thereby configuring a resin layer containing the adhesive composition on the circuit component 20. Then, the circuit component 30 is placed on the resin layer configured on the circuit component 20 in a manner that the circuit electrode 22 and the circuit electrode 32 are configured opposite to each other. Next, the resin layer containing the adhesive composition is subjected to a heat treatment or light irradiation to cure the adhesive composition and obtain a cured product (circuit connection member 10). In this way, circuit connection structures 100a and 100b are obtained. [Embodiment]

The present disclosure is described in more detail below with reference to the following embodiments and comparative examples, but the present disclosure is not limited to the following embodiments.

[Example 1 to Example 14 and Comparative Example 1 to Comparative Example 11] (Production of Conductive Particles) A nickel layer with a thickness of 0.2 μm was formed on the surface of polystyrene particles. Furthermore, a gold layer with a thickness of 0.04 μm was formed on the outer side of the nickel layer. In this way, conductive particles with an average particle size of 4 μm were produced.

(Preparation of film-like adhesive) The components shown in Tables 1 and 2 are mixed at the mass ratios (solid content) shown in Tables 1 and 2 to obtain a mixture. The conductive particles are dispersed in the mixture at a ratio of 1.5 parts by volume (basic: ratio relative to 100 parts by volume of the total volume of the adhesive components of the adhesive composition) to obtain a coating liquid for forming a film-like adhesive. The coating liquid is applied on a polyethylene terephthalate (PET) film having a thickness of 50 μm using a coating device. The coating film is hot-air dried at 70°C for 10 minutes to form film-like adhesives of Examples 1 to 14 and Comparative Examples 1 to 11 having a thickness of 18 μm.

The details of the components shown in Tables 1 and 2 are as follows. Phenoxy resin: 40 g of PKHC (trade name, manufactured by Union Carbide Co., Ltd., weight average molecular weight 45,000) was dissolved in 60 g of methyl ethyl ketone to prepare a solution having a solid content of 40% by mass. Acrylic rubber: Acrylic rubber (a copolymer of 40 parts by mass of butyl acrylate, 30 parts by mass of ethyl acrylate, 30 parts by mass of acrylonitrile, and 3 parts by mass of glycidyl methacrylate, weight average molecular weight 800,000) was prepared as a rubber component and the acrylic rubber was dissolved in a mixed solvent of toluene/ethyl acetate = 50/50 (mass ratio) to prepare a solution having a solid content of 15% by mass. Epoxy resin containing hardener: A liquid epoxy resin containing hardener (epoxy equivalent: 202) containing a microencapsulated latent hardener (microencapsulated amine hardener), a bisphenol F type epoxy resin, and a naphthalene type epoxy resin in a mass ratio of 34:49:17 was used.

<First Silane Compound> Silane Compound A1: 3-Glycidyloxypropylmethyldimethoxysilane (trade name: KBM-402, manufactured by Shin-Etsu Chemical Co., Ltd.) was used. Silane Compound A2: 3-Glycidyloxypropyltrimethoxysilane (trade name: KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) was used. Silane Compound A3: 3-Glycidyloxypropylmethyldiethoxysilane (trade name: KBE-402, manufactured by Shin-Etsu Chemical Co., Ltd.) was used. Silane Compound A4: 3-Glycidyloxypropyltriethoxysilane (trade name: KBE-403, manufactured by Shin-Etsu Chemical Co., Ltd.) was used.

<Second Silane Compound> Silane Compound B1: Methyltrimethoxysilane (trade name: KBM-13, manufactured by Shin-Etsu Chemical Co., Ltd.) was used. Silane Compound B2: 3-Methacryloyloxypropyltrimethoxysilane (trade name: KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.) was used. Silane Compound B3: Tetraethoxysilane (trade name: KBE-04, manufactured by Shin-Etsu Chemical Co., Ltd.) was used.

(Production of Connectors) A flexible printed circuit board (FPC) having 2,200 copper circuits with a line width of 75 μm, a pitch of 150 μm (a gap of 75 μm), and a thickness of 18 μm was connected to a SiN _x substrate (thickness 0.7 mm) including a glass substrate and a 0.2 μm thick silicon nitride (SiN _x ) thin layer formed on the glass substrate using the film adhesive of Examples 1 to 14 and Comparative Examples 1 to 11. The connection was performed by heating and pressing at 200°C and 5 MPa for 15 seconds. In this way, a connection body is produced in which the FPC and the SiN _x substrate are connected with a width of 1.5 mm by using a cured film adhesive. The pressure applied is calculated by setting the press-bonded area to 0.495 cm ² .

(Peeling evaluation) Use an optical microscope to observe the appearance of the connection after placing the connection body in a constant temperature and humidity chamber at 85°C and 85% RH for 250 hours (after the high temperature and high humidity test). Measure the area of the gap part where peeling occurs at the interface between the _SiNx substrate and the hardened material (peeling area) to evaluate the presence or absence of peeling. When the ratio of the peeling area to the total gap exceeds 30%, it is evaluated as "B" (peeling exists), and when the ratio of the peeling area is less than 30%, it is evaluated as "A" (no peeling). The evaluation results are shown in Tables 1 and 2 as the peeling evaluation results of the untreated film.

(Evaluation of storage stability (shelf life characteristics)) The film adhesive was treated in a constant temperature bath at 40°C for 3 days. A joint body was prepared using the film adhesive in the same manner as described above, and then a high temperature and high humidity test was performed in the same manner as described above to evaluate the peeling performance. The evaluation results are shown in Tables 1 and 2 as the peeling evaluation results of the film treated at 40°C for 3 days.

[Table 1]

[Table 2]

According to Tables 1 and 2, it can be confirmed that the film adhesive of the embodiment can maintain good adhesion on the surface of the substrate (inorganic substrate) and has excellent storage stability compared to the film adhesive of the comparative example, even when a connector is made using the film adhesive treated in a constant temperature bath at 40°C for 3 days and subjected to high temperature and high humidity treatment.

10‧‧‧Circuit connection member 10a‧‧‧Insulating material 10b‧‧‧Conductive particles 20‧‧‧First circuit member 21‧‧‧First substrate 21a, 31a‧‧‧Main surface 22‧‧‧First circuit electrode 30‧‧‧Second circuit member 31‧‧‧Second substrate 32‧‧‧Second circuit electrode 100a, 100b‧‧‧Circuit connection structure

Fig. 1 is a schematic cross-sectional view showing one embodiment of a structure of the present disclosure. Fig. 2 is a schematic cross-sectional view showing another embodiment of a structure of the present disclosure.

10: Circuit connection components

10a: Insulating substances

10b: Conductive particles

20: First circuit component

21: First substrate

21a, 31a: Main surface

22: First circuit electrode

30: Second circuit component

31: Second substrate

32: Second circuit electrode

100a: Circuit connection structure

Claims (5)

A circuit connection adhesive composition comprising: an anionically or cationically polymerizable epoxy resin or cyclohexane resin, a first silane compound having a functional group reactive with the epoxy resin or cyclohexane resin, a second silane compound other than a compound reactive with the first silane compound and equivalent to the first silane compound, a phenoxy resin, conductive particles, and a homopolymer or copolymer obtained by polymerizing at least one monomer component selected from the group consisting of (meth)acrylic acid, (meth)acrylate, and acrylonitrile, wherein at least one of the first silane compound and the second silane compound is a compound represented by the following general formula (I): _{XCsH2s -} Si〔 ^R1 〕 _m 〔 ^OR2 〕 _3-m …(I) wherein X represents an organic group; when the first silane compound is a compound represented by the general formula (I), the organic group is a functional group that reacts with the epoxy resin or the cyclohexane resin; when the second silane compound is a compound represented by the general formula (I), the organic group is a functional group that does not react with the epoxy resin or the cyclohexane resin; ^R1 and ^R2 each independently represent an alkyl group; m represents an integer of 0 to 2; and s represents an integer greater than 0; when there are multiple ^R1s , each ^R1 may be the same as or different from each other; when there are multiple ^R2s , each ^R2 may be the same as or different from each other; _and ^R1 , ^R2 and _CsH2s may each be branched. As described in item 1 of the patent application scope, the circuit connection adhesive composition, wherein the functional group of the first silane compound includes at least one selected from the group consisting of epoxy group, cyclohexane group, amine group, acid anhydride group, isocyanate group and butyl group. As described in item 1 or 2 of the patent application scope, the second silane compound contains at least one selected from the group consisting of alkyl, phenyl, alkoxysilane, hydroxyl, fluorine-containing, (meth)acryl and vinyl. A structure comprising a circuit connection adhesive composition or a cured product thereof as described in any one of items 1 to 3 of the patent application scope. A structure, comprising: a first circuit component having a first circuit electrode; a second circuit component having a second circuit electrode; and a circuit connection component disposed between the first circuit component and the second circuit component, wherein the first circuit electrode and the second circuit electrode are electrically connected, and the circuit connection component comprises a circuit connection adhesive composition or a hardened product thereof as described in any one of items 1 to 3 of the patent application scope.