TWI874126B - Vapor chamber sealing structure and manufacturing method thereof - Google Patents

Abstract

The invention relates to a vapor chamber sealing structure and its manufacturing method. The vapor chamber sealing structure includes an upper plate, a water injection pipe and a lower plate. The upper plate has a protruding part, a first wing end and a first recessed part. The first recessed part is formed between the protruding parts; the water injection pipe has an opposite first end and a second end, and the first end is arranged in the first recess; the lower plate has a second recessed part and a second wing end. The first wing end is attached to the second wing end. The second recessed part accommodates the first end of the water injection pipe, and the second end extends from the upper plate and the lower plate outside; wherein, the protruding part further includes a first surface, a second surface, a third surface and a fourth surface. And the second recessed part includes a fifth surface and a sixth surface, when the upper plate, the water injection pipe and the lower plate are joined to each other, the first end of the water injection pipe is accommodated in the first recess, the first surface is joined to the fifth surface, and the fourth surface is joined to the sixth surface to form an upper plate and The lower plate tightly seals and covers the water injection pipe.

Description

Heat balancing plate sealing structure and manufacturing method thereof

This case is about a heat spreader sealing structure and a manufacturing method thereof, and in particular, a heat spreader sealing structure and a manufacturing method thereof with good structural strength and easy construction.

With the development of technology, the heat dissipation standards of electronic equipment are getting higher and higher. The heat dissipation requirements of general electronic equipment such as personal computers, servers, gaming laptops, etc. are different from the past. The conventional heat dissipation system such as traditional heat spreader (2D heat spreader) can no longer meet the heat dissipation requirements of advanced equipment. Therefore, 3D heat spreader is developed to improve the heat dissipation efficiency.

3D temperature-averaging panels are composed of heat pipes and temperature-averaging panels. In the past, the upper and lower panels and water injection pipes of the temperature-averaging panels were usually sealed and joined by direct welding, which resulted in gaps on both sides of the water injection pipes. The sealing and joining relied solely on welding solder, which was not only labor-intensive and material-intensive, but also had poor strength. Furthermore, in an environment where the water injection pipes could not be placed upright and operated, the positioning of the water injection pipe welding was prone to deviation, either to the left or to the right, which would affect the stability of the water injection volume. What's worse, it would affect the heat dissipation efficiency of the 3D temperature-averaging panels. The creator of this case believes that improvements are necessary.

In view of the deficiencies described in the prior art, this case proposes a solution, which is about a temperature equalizing plate sealing structure, including an upper plate, a water injection pipe and a lower plate, the upper plate having left-right symmetrical protrusions, left-right symmetrical first wing ends and a first recessed portion, the first recessed portion being formed between the protrusions; the water injection pipe having a first end and a second end opposite to each other, the first end being arranged in the first recessed portion; the lower plate having a second recessed portion and a left-right symmetrical second wing end, the first wing end being attached to the second wing end, the second recessed portion accommodating the first end of the water injection pipe, and the second end extending outside the upper plate and the lower plate.

Among them, the protrusion further includes a first surface, a second surface, a third surface and a fourth surface, and the second recessed portion includes a fifth surface and a sixth surface. When the upper plate, the water injection pipe and the lower plate are connected to each other, the first end of the water injection pipe is accommodated in the first recessed portion, the first surface is connected to the fifth surface, and the fourth surface is connected to the sixth surface, so that the upper plate and the lower plate are tightly connected, sealed and covered.

When the upper plate is joined with the lower plate and the water injection pipe, the protrusion clamps and tightly presses the water injection pipe located in the first recessed portion and the second recessed portion, so as to achieve a limiting effect, and also make the sealing structure strength of the three better after being combined. In addition, it is not easy to generate gaps on both sides of the water injection pipe, thereby improving the overall sealing effect. Furthermore, this structure can save labor hours and processes, improve production efficiency, and has a high finished product yield, good durability, low processing cost, and low technical difficulty, which is superior to general traditional sealing structures.

In one embodiment, a solder structure is further included, and the solder structure is in contact with the upper plate, the lower plate and the water injection pipe.

In one embodiment, the lower plate is an integral stamped plate structure.

In one embodiment, the first end is a non-circular tube.

In one embodiment, the water injection pipe is a copper pipe.

In one embodiment, the solder structure is silver or copper.

This case also proposes a manufacturing method for a temperature equalizing plate sealing structure, including: A.  Provide a lower plate, and perform a stamping process on a first surface of the lower plate to form a groove; B.  Provide a water injection pipe, and place one end of the water injection pipe in the groove, so that the water injection pipe overlaps with the lower plate portion, forming a water injection pipe portion exposed outside the lower plate; C.  Provide an upper plate, and place the upper plate on the water injection pipe, so that the upper plate, the water injection pipe and the lower plate overlap each other; D.  Provide a jig with a double-pointed punch, and use the jig to act on the overlapped upper plate, the water injection pipe and the lower plate, and press the overlapped portion of the upper plate, the water injection pipe and the lower plate, so that the upper plate, the water injection pipe and the lower plate are tightly fitted.

When the upper plate is joined with the lower plate and the water injection pipe, the jig with a double-pointed punch is used to press the overlapping upper plate, water injection pipe and lower plate, so that the sealing structure strength of the three after pressing is better, and it is not easy to generate gaps on both sides of the water injection pipe, thereby improving the overall sealing effect. Furthermore, this pressing process is different from the previous direct welding. This method can save labor time and processes, improve production efficiency, and cost-effective. The product has high yield rate, good durability, low processing cost, low technical difficulty, and is superior to the general traditional sealing structure. The internal cavity of the water injection pipe of this invention is more stable, and at the same time, the stable water injection volume during operation is ensured. In addition, the known sealing and bonding method is carried out in an environment where the water injection pipe cannot be placed upright and operated, which causes the positioning of the water injection pipe to easily deviate. Through this method, it can be accurately pressed and the heat dissipation efficiency of its 3D temperature spreader can be further stabilized.

In one embodiment, after step D, a step E is further included: copper paste welding is performed to reinforce the pressed part to ensure the strength and stability after pressing.

In one embodiment, in step A, a lower plate is provided, a first capillary structure is first formed on one side of the lower plate, and then a stamping process is performed on a first side of the lower plate to form a groove.

In one embodiment, in step C, an upper plate is provided, a second capillary structure is first formed on one side of the upper plate, and the upper plate is placed on the water injection pipe to form the upper plate, the water injection pipe and the lower plate overlapping each other.

Please refer to FIG. 1, FIG. 2, FIG. 3 and FIG. 4 at the same time. As shown in the figure, the present invention is about a temperature equalizing plate sealing structure 1, which includes an upper plate 100, a water injection pipe 104 and a lower plate 102. Please refer to FIG. 1, which is a schematic cross-sectional view of the upper plate of an embodiment of the temperature equalizing plate sealing structure of the present invention. As shown in the figure, the upper plate 100 has two symmetrical protrusions 1002, two symmetrical first wing ends 1004 and a first concave portion 1006. 06, the first recessed portion 1006 is formed between the two protruding portions 1002, that is, the first recessed portion 1006 is defined by the two protruding portions 1002, the two protruding portions 1002 can be in the form of a sharp-angled triangle or a triangular pyramid, and the left and right protruding portions 1002 have the same shape, the first recessed portion 1006 between the two protruding portions 1002 is in the form of a trapezoid, and the two first wing ends 1004 are coplanar. Please continue to refer to Figures 3 and 4, which are a cross-sectional schematic diagram and a top view schematic diagram of an embodiment of the sealing structure of the temperature equalizing plate of the present case. As shown in the figure, the water injection pipe 104 has a first end 1042 and a second end 1044 relative to each other, that is, the first end 1042 and the second end 1044 are the head and tail ends of the water injection pipe 104, the first end 1042 is arranged in the first recessed portion 1006, and the second end 1044 is exposed outside the upper plate 100 and the lower plate 102. Please refer to Figure 2, which is a schematic cross-sectional view of the lower plate of an embodiment of the sealing structure of the temperature equalizing plate in the present case. As shown in the figure, the lower plate 102 has a second recessed portion 1022 and two second wing ends 1024 that are symmetrical on the left and right. Each first wing end 1004 is attached to each second wing end 1024. Specifically, each first wing end 1004 is attached to the top of each second wing end 1024. The second recessed portion 1022 accommodates the first end 1042 of the water injection pipe 104, and the second end 1044 extends outside the upper plate 100 and the lower plate 102. The second recessed portion 1022 is preferably in the form of a trapezoidal recessed body, and the two second wing ends 1024 are in a coplanar state.

Please continue to refer to Figures 1, 2, 3 and 4 simultaneously, wherein the two protrusions 1002 further include a first surface 10022, a second surface 10024, a third surface 10026 and a fourth surface 10028, the first surface 10022 and the second surface 10024 are two inclined surfaces of one of the protrusions 1002, and the first surface 10022 and the second surface 10024 intersect and clamp a sharp angle, the third surface 10026 and the fourth surface 10028 are two inclined surfaces of the other protrusion 1002, and the third surface 10026 and the fourth surface 10028 intersect and clamp another sharp angle, and the two sharp angles have the same angle. The second recessed portion 1022 includes a fifth surface 10222 and a sixth surface 10224. The fifth surface 10222 and one of the second wing ends 1024 in contact with each other have a blunt angle, and the sixth surface 10224 and the other second wing end 1024 in contact with each other also have a blunt angle, and the angles of the two blunt angles are consistent. Please refer to Figures 3 and 4. When the upper plate 100, the water injection pipe 104 and the lower plate 102 are connected to each other, the first end 1042 of the water injection pipe 104 is accommodated in the first recessed portion 1006, and the first surface 10022 is connected to the fifth surface 10222 without any gap, that is, the first surface 10022 and the fifth surface 10222 are inclined at the same angle; the fourth surface 10028 and the sixth surface 10224 are connected to each other without any gap, that is, the fourth surface 10028 and the sixth surface 10224 are inclined at the same angle, so that the upper plate 100 and the lower plate 102 are tightly connected, sealed and covered. It is worth mentioning that the two protrusions 1002 further have two vertices P1 and P2, and the water injection pipe 104 has a center C1, and the two vertices P1 and P2 are located lower than the center C1 of the water injection pipe 104.

Please continue to refer to FIG. 3. As shown in the figure, the temperature plate sealing structure 1 further includes at least one solder structure 106. Each solder structure 106 is in contact with the upper plate 100, the lower plate 102 and the water injection pipe 104. To further illustrate, when the upper plate 100, the water injection pipe 104 and the lower plate 102 are tightly sealed, in order to strengthen the structure and ensure the strength and Stability, the temperature-averaging plate sealing structure 1 further includes at least one solder structure 106, and the solder structure 106 is in contact with the upper plate 100, the lower plate 102 and the water injection pipe 104 to enhance the strength of the sealing structure. In addition, the solder structure 106 is made of silver or copper and is welded by one of the welding methods including brazing, soft soldering, high frequency and resistance welding.

Please continue to refer to FIG. 1 and FIG. 2. As shown in the figure, the lower plate 102 is a one-piece stamped plate structure, and the upper plate 100 is also a one-piece stamped plate structure. The one-piece stamped plate structure can strengthen the overall structure, while saving production costs and simplifying the process.

Please continue to refer to Figure 3. As shown in the figure, the water injection pipe 104 is a copper pipe, and the first end 1042 of the water injection pipe 104 is a non-circular pipe. To further explain, the vertical cross-section of the first end 1042 of the water injection pipe 104 is an ellipse, and the vertical cross-section of the second end 1044 of the water injection pipe 104 can be either a perfect circle or an ellipse.

It is worth mentioning that in another embodiment, when the upper plate 100 and the lower plate 102 are combined, a thermally conductive sealing adhesive structure (not shown) is included between the two. After the thermally conductive sealing adhesive structure is hot-melted, the surface has good fluidity and can completely fill the uneven gaps on the bonding surface of the upper plate 100 and the lower plate 102, thereby improving the bonding strength and sealing degree.

In summary, when the upper plate 100 is joined with the lower plate 102 and the water injection pipe 104, the protrusion 1002 clamps the water injection pipe 104 located in the first recessed portion 1006 and the second recessed portion 1022, so as to achieve a limiting effect, and the sealing structure strength of the three after being combined is better. In addition, it is not easy to generate gaps on both sides of the water injection pipe 104, thereby improving the overall sealing effect. Furthermore, this structure can save labor hours and processes, improve production efficiency, and has a high yield rate of finished products, good durability, low processing cost, and low technical difficulty, which is better than the general traditional sealing structure, and the internal cavity of the water injection pipe of this invention is more stable, while ensuring the stability of the water injection volume during operation.

Please refer to FIG. 5, which is a flow chart of an embodiment of a method for manufacturing a sealing structure of a heat spreader in the present case. As shown in the figure, a method for manufacturing a sealing structure of a heat spreader proposed in the present case includes the following steps: A. Provide a lower plate, and perform a stamping process on a first surface of the lower plate to form a groove; B. Provide a water injection pipe, and place one end of the water injection pipe in the groove, so that the water injection pipe overlaps with the lower plate portion, forming a water injection pipe portion exposed outside the lower plate; C. Provide an upper plate, and place the upper plate on the water injection pipe, so that the upper plate, the water injection pipe and the lower plate overlap each other; D. A jig with a double-pointed punch is provided, and the jig acts on the overlapping upper plate, water injection pipe and lower plate, and the upper plate, water injection pipe and lower plate are pressed at their overlapping parts, so that the upper plate, water injection pipe and lower plate are tightly fitted. It is worth mentioning that the upper plate provided in the above step C is initially in a full plane state, and only after being pressed by the jig in step D, the upper plate with double protrusions 1002 is formed.

Please refer to Figure 6, which is a flow chart of another embodiment of the manufacturing method of the temperature equalizer sealing structure of the present case. As shown in the figure, a manufacturing method of the temperature equalizer sealing structure proposed in the present case, wherein, after step D, further includes a step E: copper paste welding reinforcement is performed on the pressed part to ensure the strength and stability after pressing.

Please refer to Figure 7, which is a flow chart of another embodiment of the manufacturing method of the temperature equalizing plate sealing structure of the present case. As shown in the figure, a manufacturing method of the temperature equalizing plate sealing structure proposed in the present case, wherein, in step A, a lower plate is provided, a first capillary structure is first formed on one side of the lower plate, and then a stamping process is performed on a first side of the lower plate to form a groove.

Please refer to Figure 8, which is a flow chart of another embodiment of the manufacturing method of the sealing structure of the temperature equalizing plate in the present case. As shown in the figure, a manufacturing method of the sealing structure of the temperature equalizing plate proposed in the present case, wherein, in step C, an upper plate is provided, a second capillary structure is first formed on one side of the upper plate, and the upper plate is placed on the water injection pipe to form an upper plate, a water injection pipe and a lower plate overlapping each other.

Please refer to Figure 9, which is a flow chart of another embodiment of the manufacturing method of the sealing structure of the temperature equalizing plate of the present case. Furthermore, in step C, an upper plate is provided, a second capillary structure is first formed on one side of the upper plate, and then a heat-conductive sealing glue structure is applied on two opposite sides of the upper plate and the lower plate, and then the upper plate is placed on the water injection pipe to form an upper plate, a water injection pipe and a lower plate overlapping each other.

Through the above steps, when the upper plate is joined with the lower plate and the water injection pipe, the jig with a double-pointed punch acts and presses the overlapping upper plate, the water injection pipe and the lower plate to achieve a limiting effect, and the sealing structure strength of the three after pressing is better, and it is not easy to generate gaps on both sides of the water injection pipe, thereby improving the overall sealing effect. Furthermore, through this process of pressing, different from the previous direct welding connection, this method can save labor time and processes, improve The invention has high production efficiency, high finished product yield, good durability, low processing cost, and low technical difficulty, which is superior to the general traditional sealing structure. The internal cavity of the water injection pipe of the invention is more stable, and at the same time ensures the stability of the water injection volume during operation. In addition, the known sealing and bonding method is carried out in an environment where the water injection pipe cannot be placed upright and operated, which causes the positioning of the water injection pipe to deviate easily. Through this method, it can be limited and accurately pressed, and the heat dissipation efficiency of the 3D temperature spreader can be further stabilized.

In summary, this case does meet the requirements of industrial applicability, and has not been published or publicly used before the application, nor is it known to the public, and is non-obvious, meeting the requirements of patentability, so a patent application is filed in accordance with the law. However, the above is a better example of the industry in this case, and all equal changes made according to the scope of the patent application in this case are within the scope of the subject matter of this case.

1: Sealing structure of temperature equalizing plate 100: Upper plate 1004: First wing end 1002: Protrusion 1006: First recessed portion 10022: First surface 10024: Second surface 10026: Third surface 10028: Fourth surface 1022: Second recessed portion 10222: Fifth surface 10224: Sixth surface 1024: Second wing end 102: Lower plate 104: Water injection pipe 1042: First end 1044: Second end 106: Solder structure P1, P2: Vertex C1: Center of circle A, B, C, D, E: Steps

Figure 1 is a schematic diagram of the upper plate section of an embodiment of the sealing structure of the temperature averaging plate in this case; Figure 2 is a schematic diagram of the lower plate section of an embodiment of the sealing structure of the temperature averaging plate in this case; Figure 3 is a schematic diagram of the cross section of an embodiment of the sealing structure of the temperature averaging plate in this case; Figure 4 is a schematic diagram of the top view of an embodiment of the sealing structure of the temperature averaging plate in this case; Figure 5 is a flow chart of an embodiment of the manufacturing method of the sealing structure of the temperature averaging plate in this case; Figure 6 is a flow chart of another embodiment of the manufacturing method of the sealing structure of the temperature averaging plate in this case; Figure 7 is a flow chart of another embodiment of the manufacturing method of the sealing structure of the temperature averaging plate in this case; Figure 8 is a flow chart of another embodiment of the manufacturing method of the sealing structure of the temperature averaging plate in this case; Figure 9 is a flow chart of another embodiment of the manufacturing method of the sealing structure of the temperature averaging plate in this case.

1: Sealing structure of the temperature equalizing plate

100: On board

1004: First wing end

1024: Second wing end

102: Lower the board

104: Water injection pipe

106: Solder structure

P1, P2: Vertex

C1: Center of circle

Claims (10)

A sealing structure of a temperature equalizing plate comprises: an upper plate having two symmetrical protrusions, two symmetrical first wing ends and a first recessed portion, wherein the first recessed portion is formed between the protrusions; a water injection pipe having a first end and a second end opposite to each other, wherein the first end is disposed in the first recessed portion; a lower plate having a second recessed portion and two symmetrical second wing ends, wherein each first wing end is attached to each second wing end, wherein the first end of the water injection pipe is accommodated in the second recessed portion, and the second end extends outside the upper plate and the lower plate; The two protruding parts further include a first surface, a second surface, a third surface and a fourth surface, and the second recessed part includes a fifth surface and a sixth surface. When the upper plate, the water injection pipe and the lower plate are connected to each other, the first end of the water injection pipe is accommodated in the first recessed part, the first surface is connected to the fifth surface, and the fourth surface is connected to the sixth surface, so that the upper plate and the lower plate are tightly connected, sealed and covered with the water injection pipe. The temperature equalizing plate sealing structure as described in claim 1 further comprises at least one solder structure, each of which is in contact with the upper plate, the lower plate and the water injection pipe. The temperature equalizing plate sealing structure as described in claim 1, wherein the lower plate is an integral stamped plate structure. A temperature equalizing plate sealing structure as described in claim 1, wherein the first end is a non-circular tube. A temperature equalizing plate sealing structure as described in claim 4, wherein the water injection pipe is a copper pipe. A temperature-averaging plate sealing structure as described in claim 2, wherein at least one solder structure is silver or copper. A method for manufacturing a sealing structure of a temperature equalizing plate includes the following steps: A.  Provide a lower plate, and perform a stamping process on a first surface of the lower plate to form a groove; B.  Provide a water injection pipe, and place one end of the water injection pipe in the groove, so that the water injection pipe overlaps with the lower plate portion, so that the water injection pipe portion is exposed outside the lower plate; C.  Provide an upper plate, and place the upper plate on the water injection pipe, so that the upper plate, the water injection pipe and the lower plate overlap each other; D.  Provide a fixture with a double-pointed punch, and use the fixture to act on the overlapped upper plate, the water injection pipe and the lower plate, and press the overlapped portion of the upper plate, the water injection pipe and the lower plate, so that the upper plate, the water injection pipe and the lower plate are tightly fitted. The manufacturing method of the temperature-averaging plate sealing structure as described in claim 7 further includes, after step D, a step E: copper paste welding reinforcement is performed on the pressed part to ensure the strength and stability after pressing. A method for manufacturing a temperature-averaging plate sealing structure as described in claim 8, wherein in step A, a lower plate is provided, a first capillary structure is first formed on one side of the lower plate, and then a stamping process is performed on a first side of the lower plate to form a groove. A method for manufacturing a temperature equalizing plate sealing structure as described in claim 9, wherein in step C, an upper plate is provided, a second capillary structure is first formed on one side of the upper plate, and the upper plate is placed on the water injection pipe to form an upper plate, a water injection pipe and a lower plate overlapping each other.