TWI874050B - Server device and server case thereof - Google Patents
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Description
本揭示是關於一種伺服器裝置,特別關於一種伺服器裝置的機箱。The present disclosure relates to a server device, and more particularly to a chassis of the server device.
一般來說,伺服器包含多種精密的電子元件,例如硬碟(Hard Disk Drive,簡稱HDD)、中央處理器(Central Processing Unit,簡稱CPU)及圖形處理器(Graphics Processing Unit,簡稱GPU)等。精密的電子元件的效能容易受到噪音及振動的影響,尤其是硬碟的效能容易被噪音所影響。Generally speaking, servers contain a variety of sophisticated electronic components, such as hard disk drives (HDDs), central processing units (CPUs), and graphics processing units (GPUs). The performance of sophisticated electronic components is easily affected by noise and vibration, especially the performance of hard disks.
目前伺服器的內部具有吸音或消音的結構,用以減少內部風扇產生的噪音,進而減少震動的情形。然而,對於伺服器外部產生的噪音的減少及阻隔缺乏有效的解決方案。Currently, the interior of the server has a sound-absorbing or noise-reducing structure to reduce the noise generated by the internal fan, thereby reducing the vibration. However, there is a lack of effective solutions for reducing and blocking the noise generated outside the server.
有鑑於上述課題,本揭示之主要目的是在提供一種伺服器裝置及其機箱,藉由機箱的一消音結構及其配置方式達到兼具散熱及減少外部噪音的功效。In view of the above-mentioned problems, the main purpose of the present disclosure is to provide a server device and a chassis thereof, which can achieve the effects of both heat dissipation and reduction of external noise through a sound-absorbing structure and configuration of the chassis.
為達成上述之目的,本揭示提供一種機箱,應用於一伺服器裝置。伺服器裝置包括複數個硬碟模組。機箱包括一本體、一隔板、一蓋板以及至少一消音結構。本體包括一開口及一容置空間,該些硬碟模組容置於容置空間。隔板設置於開口。隔板包括一第一側面、相反於第一側面的一第二側面、及至少一流道。第一側面朝向容置空間,且流道貫穿第一側面及第二側面。蓋板設置於本體的開口,且蓋板具有複數個通風孔。消音結構設置於隔板的第二側面及蓋板之間並對應於流道。消音結構包括一吸音元件及一反射元件。反射元件設置於吸音元件的其中一側面。To achieve the above-mentioned purpose, the present disclosure provides a chassis for application in a server device. The server device includes a plurality of hard disk modules. The chassis includes a body, a partition, a cover, and at least one sound-absorbing structure. The body includes an opening and a storage space, and the hard disk modules are accommodated in the storage space. The partition is arranged at the opening. The partition includes a first side, a second side opposite to the first side, and at least one flow channel. The first side faces the storage space, and the flow channel passes through the first side and the second side. The cover is arranged at the opening of the body, and the cover has a plurality of ventilation holes. The sound-absorbing structure is arranged between the second side of the partition and the cover and corresponds to the flow channel. The sound-absorbing structure includes a sound-absorbing element and a reflecting element. The reflective element is arranged on one side of the sound absorbing element.
為達成上述之目的,本揭示另提供一種伺服器裝置,其包括一機箱以及複數個硬碟模組。機箱包括一本體、一隔板、一蓋板及至少一消音結構。本體包括一開口及一容置空間。隔板設置於開口。隔板包括相反的一第一側面、相反於該第一側面的一第二側面、及至少一流道。第一側面朝向容置空間,且流道貫穿第一側面及第二側面。蓋板設置於本體的開口,且蓋板具有複數個通風孔。消音結構設置於隔板的第二側面與蓋板之間並對應於流道。消音結構包括一吸音元件及一反射元件。反射元件設置於吸音元件的其中一側面。硬碟模組容置於容置空間。To achieve the above-mentioned purpose, the present disclosure further provides a server device, which includes a chassis and a plurality of hard disk modules. The chassis includes a body, a partition, a cover and at least one sound-absorbing structure. The body includes an opening and a storage space. The partition is arranged at the opening. The partition includes a first opposite side, a second side opposite to the first side, and at least one flow channel. The first side faces the storage space, and the flow channel passes through the first side and the second side. The cover is arranged at the opening of the body, and the cover has a plurality of ventilation holes. The sound-absorbing structure is arranged between the second side of the partition and the cover and corresponds to the flow channel. The sound-absorbing structure includes a sound-absorbing element and a reflective element. The reflective element is arranged on one side of the sound-absorbing element. The hard disk module is accommodated in the storage space.
依據本揭示之一實施例,吸音元件為多孔性材料。According to an embodiment of the present disclosure, the sound absorbing element is a porous material.
依據本揭示之一實施例,反射元件為一塑膠板、或一金屬板。According to an embodiment of the present disclosure, the reflective element is a plastic plate or a metal plate.
依據本揭示之一實施例,反射元件設置於吸音元件朝向隔板的第二側面。According to an embodiment of the present disclosure, the reflective element is disposed on the second side of the sound absorbing element facing the partition.
依據本揭示之一實施例,流道具有一開放面。消音結構與開放面之間具有一第一間距。According to an embodiment of the present disclosure, the flow channel has an open surface, and there is a first distance between the muffler structure and the open surface.
依據本揭示之一實施例,第一間距之於流道的一內徑的比值介於0.5至2之間。According to an embodiment of the present disclosure, a ratio of the first distance to an inner diameter of the flow channel is between 0.5 and 2.
依據本揭示之一實施例,消音結構投影至隔板的一投影面遮蔽開放面。According to an embodiment of the present disclosure, a projection surface of the sound-absorbing structure projected onto the partition shields the open surface.
依據本揭示之一實施例,流道的一側壁與消音結構的一側壁的一延伸線之間具有一第二間距。第二間距之於第一間距的比值介於1至2之間。According to an embodiment of the present disclosure, a second distance is provided between a side wall of the flow channel and an extension line of a side wall of the muffler structure, and a ratio of the second distance to the first distance is between 1 and 2.
依據本揭示之一實施例,流道靠近該開放面的一端具有一導流部。According to an embodiment of the present disclosure, an end of the flow channel close to the open surface has a flow guide portion.
承上所述,依據本揭示之伺服器裝置及其機箱,且機箱包括一本體、一隔板及至少一消音結構。其中,隔板及消音結構皆設置於本體的開口,且消音結構設置於隔板的朝向外部的側面(即第二側面)並對應於流道。當伺服器裝置的外部噪音進入機箱時,聲音能量可先被消音結構所阻擋並吸收,進而可避免外部噪音影響硬碟模組的效能。又,消音結構包括吸音元件及反射元件,反射元件設置於吸音元件的其中一側面。其中,吸音元件可吸收聲音能量,而反射元件可將聲音能量再反射至吸音元件內,進而可提升消音結構的消音效果。As described above, according to the server device and its chassis disclosed herein, the chassis includes a body, a partition and at least one sound-absorbing structure. The partition and the sound-absorbing structure are both disposed at the opening of the body, and the sound-absorbing structure is disposed on the side of the partition facing outward (i.e., the second side) and corresponds to the flow channel. When the external noise of the server device enters the chassis, the sound energy can be first blocked and absorbed by the sound-absorbing structure, thereby preventing the external noise from affecting the performance of the hard disk module. In addition, the sound-absorbing structure includes a sound-absorbing element and a reflective element, and the reflective element is disposed on one side of the sound-absorbing element. The sound-absorbing element can absorb the sound energy, and the reflective element can reflect the sound energy back into the sound-absorbing element, thereby enhancing the sound-absorbing effect of the sound-absorbing structure.
為能更瞭解本揭示之技術內容,特舉較佳具體實施例說明如下。以下結合附圖和實施例,對本揭示的具體實施方式作進一步描述。以下實施例僅用於更加清楚地說明本揭示的技術方案,而不能以此限制本揭示的保護範圍。In order to better understand the technical content of the present disclosure, the preferred specific embodiments are described as follows. The following is combined with the attached drawings and embodiments to further describe the specific implementation of the present disclosure. The following embodiments are only used to more clearly illustrate the technical solutions of the present disclosure, and cannot be used to limit the protection scope of the present disclosure.
在各個實施例的說明中,所謂的「第一」、「第二」是用以描述不同的元件,這些元件並不因為此類謂辭而受到限制。另外,為了說明上的便利和明確,圖式中各元件的最大寬度或尺寸,係以誇張或省略或概略的方式表示,以供熟悉此技藝之人士之瞭解與閱讀,且每個元件的尺寸並未完全為其實際的尺寸,並非用以限定本揭示可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本揭示所能產生之功效及所能達成之目的下,均仍應落在本揭示所揭示之技術內容涵蓋之範圍內。在所有圖式中相同的標號將用於表示相同或相似的元件。In the description of each embodiment, the so-called "first" and "second" are used to describe different elements, and these elements are not limited by such terms. In addition, for the convenience and clarity of the description, the maximum width or size of each element in the drawings is expressed in an exaggerated, omitted or approximate manner for the understanding and reading of people familiar with this technology, and the size of each element is not completely its actual size, and is not used to limit the limiting conditions for the implementation of this disclosure, so it has no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this disclosure without affecting the effect and purpose that can be produced by this disclosure. The same reference numerals will be used to represent the same or similar elements in all drawings.
圖1為本揭示之一實施例之伺服器裝置的示意圖,圖2為圖1所示之伺服器裝置的分解示意圖,圖3為圖1所示之伺服器裝置於A-A線的立體剖面圖,圖4為圖1所示之伺服器裝置於A-A線的剖面圖,請參考圖1、圖2、圖3及圖4所示。本實施例之伺服器裝置S,其包括一機箱1以及複數個硬碟模組9。其中,機箱1包括一本體10、一隔板20、至少一消音結構30及一蓋板40。本體10包括一開口11及一容置空間12,如圖2所示。又,容置空間12可藉由開口11與本體10的外部相連通。硬碟模組9容置於本體10的容置空間12內,且靠近於開口11,如圖2及圖3所示。須說明的是,圖2所示的硬碟模組9位於本體10的容置空間12。FIG1 is a schematic diagram of a server device of an embodiment of the present disclosure, FIG2 is an exploded schematic diagram of the server device shown in FIG1, FIG3 is a three-dimensional cross-sectional view of the server device shown in FIG1 at line A-A, and FIG4 is a cross-sectional view of the server device shown in FIG1 at line A-A. Please refer to FIG1, FIG2, FIG3 and FIG4. The server device S of this embodiment includes a chassis 1 and a plurality of
在本實施例中,隔板20包括一第一側面21、相反於第一側面21的一第二側面22、及至少一流道23。其中,流道23貫穿第一側面21及第二側面22,如圖3所示。須說明的是,圖3及圖4的隔板20剛好剖在流道23處。在本實施例中,隔板20設置於本體10的開口11,且隔板20的第一側面21朝向容置空間12,而第二側面22朝向機箱1的外部。流道23為供伺服器裝置S外部的空氣流入機箱1內的風道。又,本實施例隔板20具有複數個流道23,其可分別對應至硬碟模組9,使外部的冷空氣可經流道23流入機箱1內,並流經硬碟模組9,以達到降溫的效果。In the present embodiment, the
在本實施例中,消音結構30及蓋板40設置於本體10的開口11,且消音結構30設置於隔板20的及蓋板40之間。換言之,於本體10的開口11處,由外而內依序設置蓋板40、消音結構30及隔板20。圖5為圖1所示之伺服器裝置於B-B線的剖面圖,請參考圖2及圖5所示。較佳的,消音結構30的數量與流道23的數量相同,使得各個消音結構30可分別對應於各個流道23。較佳的,消音結構30可遮蔽流道23的開口,於此稱為開放面231,如圖5所示。具體而言,流道23具有一開放面231,即為流道23朝向外部的開口。消音結構30的寬度大於流道23及其開放面231的內徑,故消音結構30投影至隔板20的投影面可遮蔽開放面231。In this embodiment, the
如圖3及圖4所示,蓋板40具有複數個通風孔41。藉由蓋板40固定消音結構30,其中,固定的方式可包括黏貼、鎖附、熱熔或是其他方式,並不以此為限。另外,蓋板40常被稱為是前窗,故本實施例之消音結構30是設置在蓋板40朝向本體10之容置空間12的一側。As shown in FIG. 3 and FIG. 4 , the
由於消音結構30設置於蓋板40及隔板20的第二側面22之間,其靠近於本體10的開口11,故伺服器裝置S的外部噪音進入機箱1時,聲音能量可先被消音結構30所阻擋並吸收。圖6為圖2所示之消音結構的放大示意圖,請參考圖2、圖4、圖5及圖6所示。在本實施例中,消音結構30包括一吸音元件31及一反射元件32。其中,反射元件32設置於吸音元件31的其中一側面。吸音元件31用於吸收聲音能量,而反射元件32可將聲音能量再反射至吸音元件31內,進而達到提升消音結構30的消音效果。具體而言,吸音元件31的密度小於反射元件32的密度,使得反射元件32可以達到反射聲音能量的效果。在本實施例中,吸音元件31可以為多孔性材料,例如吸音泡棉。反射元件32則可以為一塑膠板、或一金屬板。Since the sound-absorbing
較佳的,反射元件32設置於吸音元件31朝向隔板20的第二側面22。換言之,消音結構30的吸音元件31朝向(即靠近於)蓋板40,而反射元件32朝向(即靠近於)隔板20及硬碟模組9。因此,伺服器裝置S的外部噪音隨著氣流(如圖5的方向箭頭所示)經蓋板40的通風孔41進入機箱1後,先被消音結構30的吸音元件31所吸收。接著,聲音能量傳遞到反射元件32時,可再將部分的聲音能量反射回吸音元件31,進而提升消音結構30的消音效果,並大幅減少伺服器裝置S外部的噪音進入機箱1內。Preferably, the
圖7為圖5所示之伺服器裝置的部分放大示意圖,請參考圖5及圖7所示。較佳的,本實施例之消音結構30與隔板20之間具有間隙。具體而言,消音結構30與流道23的開放面231之間具有一第一間距D1,如圖7所示。因此,來自伺服器裝置S外部的氣流仍可經消音結構30與流道23之間的空隙,流入流道23內,並往硬碟模組9的方向流動,如圖5的方向箭頭所示。較佳的,第一間距D1之於流道23的內徑I的比值介於0.5至2之間。例如,若流道23的內徑I為2公分(cm),則第一間距D1可介於1公分至4公分之間。FIG7 is a partially enlarged schematic diagram of the server device shown in FIG5 , please refer to FIG5 and FIG7 . Preferably, there is a gap between the
如前述,本實施例之消音結構30的寬度大於流道23及其開放面231的內徑I,使得消音結構30投影至隔板20的投影面可遮蔽開放面231。換言之,流道23的側壁與消音結構30的側壁的延伸線之間具有一第二間距D2。較佳的,第二間距D2之於第一間距D1的比值介於1至2之間。例如,若第一間距D1為1公分,則第二間距D2可介於1公分至2公分之間。藉由第一間距D1及第二間距D2的限制,使得伺服器裝置S外部的氣流仍可流入流道23內,以達到對硬碟模組9降溫的功能,且外部的噪音又同時能被消音結構30所吸收,以避免影響硬碟模組9的效能。As mentioned above, the width of the
圖8為本揭示之另一實施例之機箱的剖面放大示意圖,請參考圖8所示。本實施例之機箱1a與前述實施例的差異在於隔板20a,故其他元件沿用與前述實施例相同的元件符號。本實施例之隔板20a的流道23a靠近開放面231a的一端具有一導流部232a。意即,導流部232a位於流道23a靠近開放面231a的一端。換言之,導流部232a靠近於隔板20a的第二側面22a。具體而言,本實施例之流道23a的內壁主要為垂直內壁,且位於流道23a中央偏向第一側面21a的區域。流道23a靠近第二側面22a及開放面231a的區域則形成不同於垂直內壁的導引結構,以作為導流部232a。FIG8 is an enlarged schematic cross-sectional view of a chassis of another embodiment of the present disclosure, please refer to FIG8 . The difference between the chassis 1a of the present embodiment and the aforementioned embodiment lies in the
在本實施例中,導流部232a可以為逐漸擴張的弧角或斜面,圖8是以逐漸擴張的弧面為例。導流部232a的結構可增強氣流的流順性,使氣流可平順地流入流道23a,以避免在開放面231a附近產生紊流。In this embodiment, the
另外,本揭示還提供一種機箱,其可應用於伺服器裝置。關於機箱的元件及其連接關係,可參考前述實施例之機箱1、1a,於此不加贅述。In addition, the present disclosure also provides a chassis that can be applied to a server device. For the components of the chassis and their connection relationships, reference can be made to the chassis 1 and 1a of the aforementioned embodiments, which will not be described in detail here.
綜上所述,依據本揭示之伺服器裝置及其機箱,且機箱包括一本體、一隔板及至少一消音結構。其中,隔板及消音結構皆設置於本體的開口,且消音結構設置於隔板的朝向外部的側面(即第二側面)並對應於流道。當伺服器裝置的外部噪音進入機箱時,聲音能量可先被消音結構所阻擋並吸收,進而可避免外部噪音影響硬碟模組的效能。又,消音結構包括吸音元件及反射元件,反射元件設置於吸音元件的其中一側面。其中,吸音元件可吸收聲音能量,而反射元件可將聲音能量再反射至吸音元件內,進而可提升消音結構的消音效果。In summary, according to the server device and its chassis disclosed herein, the chassis includes a body, a partition and at least one sound-absorbing structure. The partition and the sound-absorbing structure are both disposed at the opening of the body, and the sound-absorbing structure is disposed on the side of the partition facing outward (i.e., the second side) and corresponds to the flow channel. When the external noise of the server device enters the chassis, the sound energy can be first blocked and absorbed by the sound-absorbing structure, thereby preventing the external noise from affecting the performance of the hard disk module. In addition, the sound-absorbing structure includes a sound-absorbing element and a reflective element, and the reflective element is disposed on one side of the sound-absorbing element. The sound-absorbing element can absorb the sound energy, and the reflective element can reflect the sound energy back into the sound-absorbing element, thereby enhancing the sound-absorbing effect of the sound-absorbing structure.
應注意的是,上述諸多實施例係為了便於說明而舉例,本揭示所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。It should be noted that the above embodiments are given as examples for the purpose of explanation, and the scope of rights claimed by the present disclosure should be based on the scope of the patent application, rather than being limited to the above embodiments.
1、1a:機箱
10:本體
11:開口
12:容置空間
20、20a:隔板
21、21a:第一側面
22、22a:第二側面
23、23a:流道
231、231a:開放面
232a:導流部
30:消音結構
31:吸音元件
32:反射元件
40:蓋板
41:通風孔
9:硬碟模組
A-A:線
B-B:線
D1:第一間距
D2:第二間距
I:內徑
S:伺服器裝置1, 1a: Chassis
10: Body
11: Opening
12:
圖1為本揭示之一實施例之伺服器裝置的示意圖。 圖2為圖1所示之伺服器裝置的分解示意圖。 圖3為圖1所示之伺服器裝置於A-A線的立體剖面圖。 圖4為圖1所示之伺服器裝置於A-A線的剖面圖。 圖5為圖1所示之伺服器裝置於B-B線的剖面圖。 圖6為圖2所示之消音結構的放大示意圖。 圖7為圖5所示之伺服器裝置的部分放大示意圖。 圖8為本揭示之另一實施例之機箱的剖面放大示意圖。 FIG. 1 is a schematic diagram of a server device of one embodiment of the present disclosure. FIG. 2 is a schematic diagram of an exploded view of the server device shown in FIG. 1. FIG. 3 is a three-dimensional cross-sectional view of the server device shown in FIG. 1 at line A-A. FIG. 4 is a cross-sectional view of the server device shown in FIG. 1 at line A-A. FIG. 5 is a cross-sectional view of the server device shown in FIG. 1 at line B-B. FIG. 6 is an enlarged schematic diagram of the muffler structure shown in FIG. 2. FIG. 7 is a partially enlarged schematic diagram of the server device shown in FIG. 5. FIG. 8 is an enlarged schematic diagram of a cross-sectional view of a chassis of another embodiment of the present disclosure.
1:機箱 1: Chassis
10:本體 10: Body
11:開口 11: Open mouth
12:容置空間 12: Storage space
20:隔板 20: Partition
21:第一側面 21: First side
22:第二側面 22: Second side
23:流道 23: Runner
30:消音結構 30: Noise-absorbing structure
40:蓋板 40: Cover plate
9:硬碟模組 9: Hard disk module
S:伺服器裝置 S: Server device
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024064090A JP7612090B1 (en) | 2023-08-17 | 2024-04-11 | Server equipment and its case |
| US18/655,818 US12512087B2 (en) | 2023-08-17 | 2024-05-06 | Server and chassis thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202363533136P | 2023-08-17 | 2023-08-17 | |
| US63/533,136 | 2023-08-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI874050B true TWI874050B (en) | 2025-02-21 |
| TW202510648A TW202510648A (en) | 2025-03-01 |
Family
ID=95557395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112149099A TWI874050B (en) | 2023-08-17 | 2023-12-15 | Server device and server case thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI874050B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120293947A1 (en) * | 2011-05-19 | 2012-11-22 | Chen Ko-Wei | Rack mountable server apparatus |
| TWM554633U (en) * | 2017-08-22 | 2018-01-21 | Chenbro Micom Co Ltd | Shock-absorbing structure of access device in rack |
| CN207541566U (en) * | 2017-11-30 | 2018-06-26 | 勤昆科技(昆山)有限公司 | Put the shock-damping structure of access device in frame |
| TW202033864A (en) * | 2018-11-09 | 2020-09-16 | 美商3M新設資產公司 | Acoustic panels and structures including the same |
| TW202238309A (en) * | 2021-03-17 | 2022-10-01 | 英業達股份有限公司 | Server assembly |
| US20230178060A1 (en) * | 2021-12-03 | 2023-06-08 | Sungrow Power Supply Co., Ltd. | Noise reduction assembly and new energy equipment |
| CN219456810U (en) * | 2023-01-06 | 2023-08-01 | 恩平市恒胜电子科技有限公司 | Noise reduction machine case |
-
2023
- 2023-12-15 TW TW112149099A patent/TWI874050B/en active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120293947A1 (en) * | 2011-05-19 | 2012-11-22 | Chen Ko-Wei | Rack mountable server apparatus |
| TWM554633U (en) * | 2017-08-22 | 2018-01-21 | Chenbro Micom Co Ltd | Shock-absorbing structure of access device in rack |
| CN207541566U (en) * | 2017-11-30 | 2018-06-26 | 勤昆科技(昆山)有限公司 | Put the shock-damping structure of access device in frame |
| TW202033864A (en) * | 2018-11-09 | 2020-09-16 | 美商3M新設資產公司 | Acoustic panels and structures including the same |
| TW202238309A (en) * | 2021-03-17 | 2022-10-01 | 英業達股份有限公司 | Server assembly |
| US20230178060A1 (en) * | 2021-12-03 | 2023-06-08 | Sungrow Power Supply Co., Ltd. | Noise reduction assembly and new energy equipment |
| CN219456810U (en) * | 2023-01-06 | 2023-08-01 | 恩平市恒胜电子科技有限公司 | Noise reduction machine case |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202510648A (en) | 2025-03-01 |
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