TWI873892B - Electronic package and manufacturing method thereof - Google Patents

Abstract

Disclosed is an electronic package in which an antenna module is stacked on a package module, the package module includes an electronic component and a plurality of electrical contacts electronically connected to the electronic component, and the antenna module includes a plate, a wiring line portion and an antenna portion respectively combined to the opposite surface of the plate, wherein the wiring line portion is connected to the plurality of electrical contacts and the antenna portion and the wiring line portion are electromagnetically coupled to each other, so that a standing wave is formed in the antenna module.

Description

Electronic packaging and its manufacturing method

The present invention relates to a semiconductor packaging process, in particular to an electronic package with an antenna.

As the image quality of current multimedia content increases, the file size becomes larger, so the bandwidth of wireless transmission also needs to increase, resulting in the fifth generation of wireless transmission (5G) technology. In addition, due to the higher transmission frequency of 5G, the size requirements of its related wireless communication modules are also higher.

In addition, when the antenna structure is planar, the electromagnetic radiation characteristics between the antenna structure and the electronic components will be limited, making it difficult to improve the antenna performance.

Therefore, how to overcome the above-mentioned knowledge and technology problems has become an urgent issue that the industry needs to overcome.

In view of the above-mentioned deficiencies in the prior art, the present invention provides an electronic package, comprising: a package module, comprising an electronic component and a plurality of electrical contacts electrically connected to the electronic component; and an antenna module, stacked on the package module, and the antenna module comprises a plate having a first surface and a second surface opposite to each other, a circuit portion coupled to the first surface, and an antenna portion coupled to the second surface, wherein the circuit portion is connected to the plurality of electrical contacts, and the antenna portion and the circuit portion are electromagnetically coupled to each other to form a stationary wave in the antenna module.

The present invention further provides a method for manufacturing an electronic package, comprising: forming a package module on a carrier, wherein the package module includes an electronic component and a plurality of electrical contacts electrically connected to the electronic component; stacking an antenna module on the package module, wherein the antenna module includes a plate having a first surface and a second surface opposite to each other, a circuit portion coupled to the first surface, and an antenna portion coupled to the second surface, wherein the circuit portion is connected to the plurality of electrical contacts, and the antenna portion and the circuit portion are electromagnetically coupled to each other to form a stationary wave in the antenna module; and removing the carrier.

In the aforementioned electronic package and its manufacturing method, the manufacturing process of the packaging module includes: forming a supporting structure on the supporting member; forming a plurality of conductive posts on the supporting structure, and arranging the electronic component on the supporting structure so that the supporting structure electrically connects the electronic component and the plurality of conductive posts; and forming a coating layer on the supporting structure, so that the coating layer covers the plurality of conductive posts and the electronic component, and the end faces of the plurality of conductive posts are exposed on the coating layer to serve as the electrical contacts.

In the aforementioned electronic package and its manufacturing method, the plurality of electrical contacts provide grounding.

In the aforementioned electronic package and its manufacturing method, the board is a semiconductor board having a plurality of conductive silicon through-holes.

In the aforementioned electronic package and its manufacturing method, the antenna portion is in the form of an antenna layer.

As can be seen from the above, the electronic package and its manufacturing method of the present invention mainly obtain better antenna performance by stacking the antenna module on the package module, and the antenna module generates stationary waves.

1: Electronic packaging

2a: Packaging module

2b: Antenna module

20: Load-bearing structure

20a: First side

20b: Second side

200: First insulation layer

201: First circuit layer

21: Electronic components

21a: Action surface

21b: Non-active surface

210:Electrode pad

211: Conductive bump

22: Antenna Department

23: Conductive column

23a: End face

230: Electrical contact

24: Board

24a: First surface

24b: Second surface

240: Conductive silicon vias

25: Coating layer

26: Circuit Department

260: Second insulation layer

261: Second circuit layer

27: Conductive element

28: Conductive bump

9: Carrier

90: Temporary bonding layer

F: Resident in Bo

L: Transmission path

S: cutting path

Figure 1 is a schematic cross-sectional view of the electronic package of the present invention.

Figures 2A to 2E are schematic cross-sectional views of the manufacturing method of the electronic package of the present invention.

The following is a specific and concrete example to illustrate the implementation of the present invention. People familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this manual.

It should be noted that the structures, proportions, sizes, etc. depicted in the drawings attached to this specification are only used to match the contents disclosed in the specification for understanding and reading by people familiar with this technology, and are not used to limit the restrictive conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "above", "first", "second" and "one" used in this specification are only used to facilitate the clarity of the description, and are not used to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships, without substantially changing the technical content, should also be regarded as the scope of implementation of the present invention.

FIG1 is a schematic cross-sectional view of the electronic package 1 of the present invention. As shown in FIG1 , the electronic package 1 includes a package module 2a and an antenna module 2b stacked on the package module 2a.

The packaging module 2a includes at least one electronic component 21 and a plurality of electrical contacts 230 electrically connected to the electronic component 21.

The antenna module 2b comprises a plate 24 having a first surface 24a and a second surface 24b opposite to each other, a circuit portion 26 coupled to the first surface 24a, and an antenna portion 22 coupled to the second surface 24b, wherein the circuit portion 26 is connected to the plurality of electrical contacts 230, and the antenna portion 22 and the circuit portion 26 are electromagnetically coupled to each other to form a stationary wave F in the antenna module 2b.

In one embodiment, the package module 2a further comprises: a supporting structure 20, which supports the electronic component 21 and is electrically connected to the electronic component 21; a plurality of conductive posts 23, which are disposed on the supporting structure 20 and are electrically connected to the supporting structure 20; and a coating layer 25, which covers the plurality of conductive posts 23 and the electronic component 21, so that the end surfaces of the plurality of conductive posts 23 are exposed on the coating layer 25, so as to serve as the electrical contacts 230, so that the antenna module 2b can be connected to the plurality of electrical contacts 230 through a plurality of conductive bumps 28.

In one embodiment, the plurality of electrical contacts 230 provide grounding.

In one embodiment, the plate 24 is a semiconductor plate having a plurality of conductive silicon through-holes 240 passing therethrough.

In one embodiment, the antenna portion 22 is in the form of an antenna layer.

Therefore, the electronic package 1 of the present invention mainly forms a three-dimensional antenna by stacking the antenna module 2b on the package module 2a, and the antenna module 2b generates a stationary wave F, which is then transmitted to the electronic component 21 through the plurality of conductive posts 23 (as shown in the transmission path L in FIG. 1 ), thereby achieving better antenna performance.

Figures 2A to 2E are cross-sectional schematic diagrams of the manufacturing method of the electronic package 1 of the present invention.

As shown in FIG. 2A , a supporting structure 20 is formed on a supporting member 9 , which has a first side 20a and a second side 20b opposite to each other, and a plurality of conductive pillars 23 are formed on the first side 20a of the supporting structure 20 , and at least one electronic component 21 is disposed on the first side 20a of the supporting structure 20 .

In this embodiment, the carrier 9 can be selected as a tape, a wafer form substrate or a general panel form substrate according to the needs, which can include a semiconductor material carrier such as a wafer, a silicon plate, or a circular temporary carrier of a glass material. For example, a temporary bonding layer 90 such as a release film can be formed on the carrier 9 to bond the second side 20b of the carrier structure 20.

Furthermore, the carrier structure 20 is, for example, a coreless circuit structure, which includes at least one first insulating layer 200 and at least one first circuit layer 201 combined with the first insulating layer, such as at least one fan-out redistribution layer (RDL), and the material forming the first insulating layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP).

Furthermore, the conductive column 23 is formed by a metal plating process, and the material forming the conductive column 23 is a metal material such as copper or a solder material.

In addition, the electronic component 21 is an active component, a passive component or a combination thereof. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. In the present embodiment, the electronic component 21 is a semiconductor chip having an active surface 21a and an inactive surface 21b opposite to each other. The active surface 21a has a plurality of electrode pads 210, which are disposed on the first circuit layer 201 on the first side 20a of the supporting structure 20 by a flip chip method through a plurality of conductive bumps 211 such as solder materials, metal pillars or others and are electrically connected to the first circuit layer 201; alternatively, the electronic component 21 can be electrically connected to the first circuit layer 201 on the first side 20a of the supporting structure 20 by a plurality of bonding wires (not shown) by bonding; alternatively, the electronic component 21 can directly contact the first circuit layer 201 on the first side 20a of the supporting structure 20. Therefore, the required type and quantity of electronic components can be placed on the carrier structure 20 to enhance its electrical function, and there are many ways to electrically connect the electronic component 21 to the carrier structure 20, which are not limited to the above.

As shown in FIG. 2B , a coating layer 25 is formed on the first side 20a of the supporting structure 20 so that the coating layer 25 covers the electronic component 21 and the conductive pillars 23 to form a package module 2a, and the end surface 23a of the conductive pillar 23 is exposed from the coating layer 25 to serve as an electrical contact 230.

In this embodiment, the material forming the coating layer 25 is an insulating material such as polyimide (PI), dry film, epoxy or molding compound, but is not limited to the above. For example, the coating layer 25 can be formed on the first side 20a of the supporting structure 20 by lamination or molding.

Furthermore, a flattening process can be performed as required to make the upper surface of the coating layer 25 flush with the end surface 23a of the conductive column 23, so that the end surface 23a of the conductive column 23 is exposed from the coating layer 25, or even to make the upper surface of the coating layer 25 flush with the inactive surface 21b, so that the inactive surface 21b is exposed from the coating layer 25. For example, the flattening process can be performed by grinding to remove part of the material of the conductive column 23 and part of the material of the coating layer 25.

Furthermore, the encapsulation layer 25 encapsulates the conductive bumps 211; alternatively, the conductive bumps 211 may be first encapsulated with an insulating material such as a primer or a non-conductive film (NCF), and then the encapsulation layer 25 encapsulates the insulating material.

As shown in FIG. 2C , an antenna module 2b is stacked on the package module 2a, and the antenna module 2b includes a board 24 having a first surface 24a and a second surface 24b opposite to each other, a circuit portion 26 coupled to the first surface 24a, and an antenna portion 22 coupled to the second surface 24b.

In this embodiment, the plate 24 is a semiconductor plate, such as a silicon substrate, a glass plate or other suitable plate, which has a plurality of through-silicon vias (TSV) 240 to form a Through Silicon interposer (TSI).

Furthermore, the circuit portion 26 is connected to the electrical contact 230 of the conductive pillar 23 via a plurality of conductive bumps 28, and the circuit portion 26 includes a second insulating layer 260 and a second circuit layer 261 disposed on the insulating layer 260 and electrically connected to the plurality of conductive TSVs 240, such as a redistribution layer (RDL). For example, the conductive bump 28 may include a solder material or a metal column, and the material forming the second circuit layer 261 is copper, and the material forming the second insulating layer 260 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP).

Furthermore, the antenna portion 22 is in the form of an antenna layer, such as a patch material, and transmits signals with the second circuit layer 261 in a coupled manner. For example, the antenna portion 22 and the second circuit layer 261 can be electromagnetically coupled to each other, so that the antenna signal can be transmitted between the antenna portion 22 and the second circuit layer 261.

In addition, the electrical contact 230 provides grounding, and the second circuit layer 261 also has a ground pad, so that the electrical contact 230 and the ground pad are connected through the conductive bump 28, so that the signal of the antenna part 22 and the second circuit layer 261 is coupled between the plurality of electrical contacts 230 to form a stationary wave F.

As shown in FIG. 2D and FIG. 2E, the carrier 9 and the temporary bonding layer 90 are removed, and a plurality of conductive elements 27 such as solder balls are formed on the first circuit layer 201 of the second side 20b of the carrier structure 20.

Next, a singulation process is performed along the cutting path S shown in FIG. 2D to obtain the electronic package 1.

In this embodiment, the electronic package 1 can be bonded to a circuit board (not shown) via the plurality of conductive elements 27.

Therefore, the manufacturing method of the electronic package of the present invention is mainly to stack the antenna module 2b on the package module 2a to form a three-dimensional antenna, so there is no need to increase the layout area on the supporting structure 20. Therefore, the present invention can increase the antenna function under the predetermined size of the supporting structure 20, so that the electronic package 1 can meet the needs of miniaturization.

In summary, the electronic package and its manufacturing method of the present invention achieves better antenna performance by stacking the antenna module on the package module and the antenna module generates a stationary wave.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the scope of the patent application described below.

1: Electronic packaging components

2a: Packaging module

2b: Antenna module

20: Load-bearing structure

21: Electronic components

22: Antenna Department

23: Conductive column

230: Electrical contact

24: Board

24a: First surface

24b: Second surface

25: Coating layer

26: Circuit Department

28: Conductive bump

L: Transmission path

F: Resident in Bo

Claims (10)

An electronic package includes: a package module including an electronic component and a plurality of electrical contacts electrically connected to the electronic component; and an antenna module stacked on the package module, and the antenna module includes a board having a first surface and a second surface opposite to each other, a circuit portion combined with the first surface, and an antenna portion combined with the second surface, wherein the board has a plurality of conductive silicon through-holes penetrating therethrough, the antenna portion is composed of a plurality of pasting sheets, the plurality of conductive silicon through-holes are arranged in the gaps between the plurality of pasting sheets, the circuit portion is connected to the plurality of electrical contacts and includes a circuit layer electrically connected to the plurality of conductive silicon through-holes, and the antenna portion and the circuit layer are mutually electromagnetically coupled to form a stationary wave in the antenna module. The electronic package as described in claim 1, wherein the package module further comprises: a supporting structure for supporting and electrically connecting the electronic component; a plurality of conductive posts disposed on the supporting structure and electrically connecting the supporting structure; and a coating layer covering the plurality of conductive posts and the electronic component, and exposing the end surfaces of the plurality of conductive posts to the coating layer to serve as the plurality of electrical contacts. An electronic package as described in claim 1, wherein the plurality of electrical contacts provide grounding. An electronic package as described in claim 1, wherein the board is a semiconductor board. An electronic package as described in claim 1, wherein the antenna portion is in the form of an antenna layer. A method for manufacturing an electronic package comprises: forming a package module on a carrier, wherein the package module comprises an electronic component and a plurality of electrical contacts electrically connected to the electronic component; stacking an antenna module on the package module, wherein the antenna module comprises a plate having a first surface and a second surface opposite to each other, a circuit portion connected to the first surface, and a The antenna part, wherein the plate body has a plurality of conductive silicon through-holes penetrating therethrough, the antenna part is composed of a plurality of patch sheets, the plurality of conductive silicon through-holes are arranged in the gaps between the plurality of patch sheets, the circuit part is connected to the plurality of electrical contacts and includes a circuit layer electrically connected to the plurality of conductive silicon through-holes, and the antenna part and the circuit layer are mutually electromagnetically coupled to form a stationary wave in the antenna module; and the carrier is removed. The method for manufacturing an electronic package as described in claim 6, wherein the manufacturing process of the package module includes: forming a supporting structure on the supporting member; forming a plurality of conductive posts on the supporting structure and arranging the electronic component so that the supporting structure electrically connects the electronic component and the plurality of conductive posts; and forming a coating layer on the supporting structure so that the coating layer covers the plurality of conductive posts and the electronic component, and the end surfaces of the plurality of conductive posts are exposed on the coating layer to serve as the plurality of electrical contacts. A method for manufacturing an electronic package as described in claim 6, wherein the plurality of electrical contacts provide grounding. A method for manufacturing an electronic package as described in claim 6, wherein the board is a semiconductor board. A method for manufacturing an electronic package as described in claim 6, wherein the antenna portion is in the form of an antenna layer.

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