TWI872726B - Circuit board assembly and manufacturing method thereof - Google Patents

Abstract

According to the present disclosure, a circuit board assembly includes a first circuit board. The first circuit board includes a first substrate, a first circuit structure, a first magnetic layer and a connecting pillar. The first circuit structure is connected to the first substrate. The first magnetic layer is connected to the first circuit structure, which makes the first circuit structure be disposed between the first magnetic layer and the first substrate, and the first magnetic layer is not electrically connected to the first circuit structure. The connecting pillar is connected to the first circuit structure. The connecting pillar is extended from the first circuit structure toward the first magnetic layer and through the first magnetic layer, and the connecting pillar is electrically connected to the first circuit structure.

Description

Circuit board assembly and manufacturing method thereof

The present application relates to a circuit board assembly and a manufacturing method thereof, and in particular to a circuit board assembly assembled by magnetic force and a manufacturing method thereof.

With the rapid development of technology, printed circuit boards are also developing towards high density and high reliability, so the connection technology between different circuit boards is becoming more and more important. Known circuit board connection technologies include anisotropic conductive film (ACF) bonding, hot bar welding (HotBar) and board to board (BTB) connection, but in view of the future development needs of high-density integration, the above connection technologies all have certain technical limitations. Furthermore, when using anisotropic conductive film bonding, hot bar welding and board to board connection, the circuit board needs to reserve a certain space for assembly parts to be installed, and the use of assembly parts as connections also brings limitations and defects to the assembly of the circuit board.

If the above connection technology is used, there will be some exposed conductor layers on the circuit board, which are easily damaged by water or humidity, so an additional waterproof process (such as applying waterproof glue) is required to make the circuit board waterproof. In addition, the solder paste used in hot-pressed soldering or the assembly parts of the board-to-board connection contain toxic substances or pollutants, which can easily cause harm to the environment.

An embodiment of the present application provides a circuit board assembly, which includes a first circuit board. The first circuit board includes a first substrate, a first circuit structure, a first magnetic attraction layer and a connecting post. The first circuit structure is connected to the first substrate. The first magnetic attraction layer is connected to the first circuit structure and the first circuit structure is located between the first magnetic attraction layer and the first substrate, and the first magnetic attraction layer is not electrically connected to the first circuit structure. The connecting post is connected to the first circuit structure, the connecting post extends from the first circuit structure to the first magnetic attraction layer and passes through the first magnetic attraction layer, and the connecting post is electrically connected to the first circuit structure.

In some embodiments, the circuit board assembly further includes a second circuit board. The second circuit board includes a second circuit structure, a second magnetic attraction layer and at least one assembly hole. The second magnetic attraction layer is disposed on the second circuit structure. The assembly hole is formed in the second magnetic attraction layer so that the second circuit structure is partially exposed in the assembly hole. A mutual attraction magnetic force is generated between the first magnetic attraction layer and the second magnetic attraction layer, and the mutual attraction magnetic force connects the first circuit board to the second circuit board. After the first circuit board is connected to the second circuit board using the mutual attraction magnetic force, the connecting post is inserted into the assembly hole, and the connecting post is electrically connected to the second circuit structure.

In some embodiments, the second circuit board may further include a conductive layer electrically connected to the second circuit structure, and the conductive layer may be electrically connected to at least one of a side surface and an end surface of the connecting post.

In some implementations, the material of the first magnetic attraction layer and the second magnetic attraction layer may include a ferromagnetic material or a ferrite magnetic material.

In some embodiments, the material of the first magnetic attraction layer and the second magnetic attraction layer may include the ferromagnetic material, the first circuit board may further include a first rubber layer disposed between the first circuit structure and the first magnetic attraction layer, and the second circuit board may further include a second rubber layer disposed between the second circuit structure and the second magnetic attraction layer.

In some embodiments, the second circuit board may further include a second waterproof layer connected to the second magnetic layer so that the second magnetic layer is located between the second circuit structure and the second waterproof layer.

In some embodiments, the first circuit board may further include a first waterproof layer connected to the first magnetic layer and located between the first waterproof layer and the first circuit structure.

Another embodiment of the present application provides a method for manufacturing a circuit board assembly, which includes the following steps. A first circuit board is provided, the first circuit board includes a first substrate, a first circuit structure, a first magnetic attraction layer and a connecting post. The first circuit structure is connected to the first substrate. The first magnetic attraction layer is connected to the first circuit structure and the first circuit structure is located between the first magnetic attraction layer and the first substrate, and the first magnetic attraction layer is not electrically connected to the first circuit structure. The connecting post is connected to the first circuit structure, the connecting post extends from the first circuit structure toward the first magnetic attraction layer and passes through the first magnetic attraction layer, and the connecting post is electrically connected to the first circuit structure. A second circuit board is provided, the second circuit board includes a second circuit structure, a second magnetic attraction layer and at least one assembly hole. The second magnetic attraction layer is disposed on the second circuit structure. The assembly hole is formed in the second magnetic attraction layer so that the second circuit structure is partially exposed in the assembly hole. The second circuit board is assembled with the first circuit board by utilizing the magnetic attraction force generated between the first magnetic attraction layer and the second magnetic attraction layer, so that the connecting post is inserted into the assembly hole and the connecting post is electrically connected to the second circuit structure.

In some embodiments, the manufacturing steps of the first circuit board may include the following steps. Provide the first substrate. Make a circuit on the first substrate to obtain the first circuit structure. Connect the first magnetic layer to one side of the first circuit structure so that the first circuit structure is located between the first magnetic layer and the first substrate. Connect a release layer to the first magnetic layer so that the first magnetic layer is located between the release layer and the first circuit structure. Cut the first magnetic layer and the release layer to form an injection hole. Inject a conductive material into the injection hole to form the connecting column. When the connecting column is set, remove the release layer.

In some embodiments, the manufacturing step of the second circuit board may include the following steps: providing a second substrate; making a circuit on the second substrate to obtain the second circuit structure; disposing the second magnetic attraction layer on the second circuit structure; and cutting the second magnetic attraction layer and the second circuit structure to form the assembly hole.

The following application content provides many different embodiments or examples for realizing different features of the provided subject matter. Specific examples of the like of elements, values, operations, materials, configurations, etc. are described below to simplify the present application. Of course, the examples are merely examples and are not intended to be limiting. Other elements, values, operations, materials, configurations, etc., etc., are also to be considered. For example, in the following description, forming a first feature above a second feature may include an embodiment in which the first feature and the second feature are formed in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact. In addition, the present application may repeat reference numbers and/or text in various examples. This repetition itself does not indicate the relationship between the various embodiments and/or configurations discussed.

In the following text, in order to clearly present the technical features of the present application, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions, etc.) in the drawings will be enlarged in unequal proportions, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the dimensions and shapes presented by the elements, but should cover the dimensions, shapes, and deviations therefrom caused by actual manufacturing steps and/or tolerances. For example, the flat surface shown in the drawings may have rough and/or nonlinear features, and the sharp corners shown in the drawings may be rounded. Therefore, the elements presented in the drawings of the present application are mainly for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the scope of the patent application of the present application.

Please refer to FIG. 1 and FIG. 2 , FIG. 1 is a cross-sectional schematic diagram of a circuit board assembly 100 according to an embodiment of the present application, and FIG. 2 is a cross-sectional exploded schematic diagram of the circuit board assembly 100 of FIG. 1 . In some embodiments of the present application, the circuit board assembly 100 includes a first circuit board 200 .

In detail, the first circuit board 200 includes a first substrate (not numbered), a first circuit structure 210, a first magnetic layer 220 and a connecting post 230. The first circuit structure 210 is connected to the first substrate. The first magnetic layer 220 is connected to the first circuit structure 210 and the first circuit structure 210 is located between the first magnetic layer 220 and the first substrate, and the first magnetic layer 220 is not electrically connected to the first circuit structure 210, thereby preventing the first magnetic layer 220 from affecting the current transmission of the first circuit structure 210.

The connecting post 230 is connected to the first circuit structure 210. The connecting post 230 extends from the first circuit structure 210 toward the first magnetic layer 220 and passes through the first magnetic layer 220. The connecting post 230 is electrically connected to the first circuit structure 210. Therefore, in addition to being used for positioning and assembling the first circuit board 200 and other components, the connecting post 230 also has the function of conducting the circuit. The connection structure and circuit type between the first circuit board 200 and other components will be introduced in the subsequent paragraphs and will not be elaborated here.

In some embodiments, the circuit board assembly 100 further includes a second circuit board 300, and the first circuit board 200 is connected to the second circuit board 300. The second circuit board 300 includes a second circuit structure 310, a second magnetic layer 320, and at least one assembly hole 330. The second magnetic layer 320 is disposed on the second circuit structure 310, and the assembly hole 330 is formed in the second magnetic layer 320 so that the second circuit structure 310 is partially exposed in the assembly hole 330, that is, the assembly hole 330 can extend from a surface of the second magnetic layer 320 away from the second circuit structure 310 to the second circuit structure 310 as shown in FIG. 2, and form a blind hole structure, but the assembly hole 330 can also have other structures according to assembly requirements, so the present application is not limited thereto.

When the first circuit board 200 and the second circuit board 300 are assembled, a mutual attraction magnetic force is generated between the first magnetic attraction layer 220 and the second magnetic attraction layer 320, and the mutual attraction magnetic force connects the first circuit board 200 to the second circuit board 300. In this way, the connection and positioning of the first circuit board 200 and the second circuit board 300 can be achieved by relying on the adsorption effect of the first magnetic attraction layer 220 and the second magnetic attraction layer 320, and the magnetic force between the first magnetic attraction layer 220 and the second magnetic attraction layer 320 can be greater than the weight of the first circuit board 200 and the second circuit board 300, so as to ensure that the first circuit board 200 and the second circuit board 300 will not separate when no external force is applied.

After the first circuit board 200 is connected to the second circuit board 300 by using the magnetic attraction force, the connecting post 230 is inserted into the assembly hole 330, and the connecting post 230 is electrically connected to the second circuit structure 310. Therefore, the electrical conduction between the first circuit board 200 and the second circuit board 300 can be completed through the connecting post 230. The circuit board assembly 100 does not need to be provided with a cover film opening as a reserved opening for a mounted area or other electrical connection, and the positions of the connecting post 230 and the assembly hole 330 can also be adjusted to obtain different circuit layouts, which helps to improve the flexibility of the configuration.

It should be particularly noted that in FIG. 1 and FIG. 2, a first circuit board 200 and two second circuit boards 300 are used as schematic diagrams, so the connecting posts 230 can pass through the two sides of the first circuit board 200 and fix the two second circuit boards 300 on the two sides of the first circuit board 200, and the first circuit board 200 has two first magnetic layers 220, so that the two second circuit boards 300 are respectively adsorbed on the two sides of the first circuit board 200. In other embodiments, the number of the first circuit board 200 and the number of the second circuit board 300 may be one each, and the second circuit board 300 may be assembled on a single side of the first circuit board 200, or a plurality of second circuit boards 300 may be installed on one side of the first circuit board 200. Therefore, the present application is not limited to the number or assembly position of the first circuit board 200 and the second circuit board 300.

In addition, the second circuit board 300 may further include a conductive layer 340 electrically connected to the second circuit structure 310, and the conductive layer 340 may be electrically connected to at least one of a side surface and an end surface of the connecting column 230. In detail, the conductive layer 340 may be located around the assembly hole 330, have a U-shaped cross section, or be located only at the end of the assembly hole 330 as shown in FIG. 2 . When the conductive layer 340 is located around the assembly hole 330, the conductive layer 340 can be electrically connected to the side of the connecting column 230. When the cross-section of the conductive layer 340 is U-shaped, the conductive layer 340 can be electrically connected to the side and end of the connecting column 230. When the conductive layer 340 is located at the end of the assembly hole 330, the conductive layer 340 can be electrically connected to the end of the connecting column 230. In this way, the possibility of poor electrical connection between the connecting column 230 and the second circuit structure 310 due to size error can be reduced.

Furthermore, the conductive layer 340 can be made of conductive silver paste, and the material of the connecting column 230 can be copper metal. Since the conductivity of the conductive silver paste is greater than that of the copper metal, the contact resistance when the connecting column 230 is electrically connected to the second circuit structure 310 can be reduced. On the other hand, by providing the conductive layer 340, the distance between the second circuit structure 310 and the connecting column 230 can be shortened, and the length of the connecting column 230 can be further shortened, thereby reducing the difficulty in manufacturing.

The material of the first magnetic attraction layer 220 and the second magnetic attraction layer 320 may include a ferromagnetic material or a ferrite magnetic material, and may further include a polymer material. The polymer material may be an epoxy resin, a phenolic resin or other resin materials, and the polymer material and the ferromagnetic material or the ferrite magnetic material may have a composite structure, such as a core-shell structure (polymer material is the shell, ferromagnetic material or ferrite magnetic material is the core or vice versa), a sandwich structure (ferromagnetic material or ferrite magnetic material is located between two layers of polymer material) or a dispersed structure (ferromagnetic material or ferrite magnetic material is dispersed in the polymer material). In addition, in addition to providing a magnetic attraction effect, the ferromagnetic material or the ferrite magnetic material may also serve as a shield for electromagnetic signals to prevent electromagnetic signals from interfering with each other.

The ferromagnetic material or the ferrite magnetic material may have a relatively large specific surface area and a high surface energy, and may be made of iron, cobalt, nickel or an alloy thereof, so as to obtain sufficient magnetic attraction to combine and fix the first circuit board 200 and the second circuit board 300. It should be particularly noted that the first magnetic attraction layer 220 and the second magnetic attraction layer 320 do not need to be permanent magnets, as long as one of any two corresponding magnetic attraction layers is a permanent magnet and the other magnetic attraction layer can be magnetized to achieve the purpose of magnetic attraction and bonding. In other words, whether the first magnetic attraction layer 220 and the second magnetic attraction layer 320 are both permanent magnets or only one of them is a permanent magnet, they all fall within the protection scope of the present application.

When the materials of the first magnetic attraction layer 220 and the second magnetic attraction layer 320 include the ferromagnetic material, the first circuit board 200 may further include a first glue layer (not shown) disposed between the first circuit structure 210 and the first magnetic attraction layer 220, and the second circuit board 300 may further include a second glue layer 350 disposed between the second circuit structure 310 and the second magnetic attraction layer 320, so as to prevent the ferromagnetic material from interfering with the current transmission of the first circuit structure 210 and the second circuit structure 310.

The first circuit board 200 may further include a first waterproof layer 240 connected to the first magnetic layer 220 and located between the first waterproof layer 240 and the first circuit structure 210. The second circuit board 300 may further include a second waterproof layer 360 connected to the second magnetic layer 320 and located between the second circuit structure 310 and the second waterproof layer 360. The first waterproof layer 240 and the second waterproof layer 360 may have elasticity and insulation, and the material thereof may be polypropylene (PP) or polyethylene (PE) and the thickness may be less than 50 μm. When the first circuit board 200 and the second circuit board 300 are assembled together due to magnetic force, the first waterproof layer 240 and the second waterproof layer 360 are sandwiched between the first magnetic layer 220 and the second magnetic layer 320, and deformed due to the force of the sandwiching, reducing the gap between the first circuit board 200 and the second circuit board 300, thereby reducing the possibility of liquid or water vapor entering between the first circuit board 200 and the second circuit board 300, thereby achieving a waterproof function. In addition, the first waterproof layer 240 and the second waterproof layer 360 can also serve as a buffer between the first circuit board 200 and the second circuit board 300, reducing the possibility of damage during assembly.

It should be particularly noted that other components may be embedded in the first circuit board 200 and the second circuit board 300, and because the first circuit board 200 and the second circuit board 300 are electrically connected via the connecting posts 230, the other components do not need to be exposed outside the circuit board, and thus can be well protected and have a longer service life.

The second circuit board 300 may further include an insulating layer 370 connected to the second circuit structure 310, so that the second circuit structure 310 is located between the insulating layer 370 and the second magnetic layer 320. Thus, through magnetic bonding and the provision of the insulating layer 370, the outermost layer of the circuit board assembly 100 may be designed without openings to ensure that the circuit board assembly 100 has a waterproof effect and improves reliability. The insulating layer 370 may be made of polyimide (PI), which is acid-resistant, alkali-resistant and heat-resistant. The insulating layer 370 may provide a further waterproof function to maintain the stable operation of the circuit board assembly 100, so that the circuit board assembly 100 is suitable for use in various environments.

Referring to FIG. 2 , another embodiment of the present application provides a method for manufacturing a circuit board assembly, which includes the following steps: First, a first circuit board 200 and a second circuit board 300 are provided. The structural features of the first circuit board 200 and the second circuit board 300 are as described in the previous paragraphs and will not be repeated here.

Next, the second circuit board 300 is assembled with the first circuit board 200 by utilizing the magnetic attraction force generated between the first magnetic attraction layer 220 and the second magnetic attraction layer 320, so that the connecting column 230 is inserted into the assembly hole 330, and the connecting column 230 is electrically connected to the second circuit structure 310. In this way, the connection of multiple circuit boards can be completed by magnetic attraction, without the need to adopt the known solder paste welding, surface mount technology (SMT) or anisotropic conductive film bonding processes, which can save manufacturing costs and reduce preparation steps and materials. Furthermore, since the first circuit board 200 and the second circuit board 300 are connected by magnetic attraction, they can still be separated and reconnected after connection, which can enhance the freedom of assembly and manufacturing.

Please refer to FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, FIG. 3F, FIG. 3G, FIG. 3H, FIG. 3I, FIG. 3J, FIG. 3K and FIG. 3L. FIG. 3A to FIG. 3L are cross-sectional schematic diagrams of the manufacturing steps of the first circuit board 200 at various stages of the manufacturing method of the circuit board assembly of an embodiment of the present application. First, as shown in FIG. 3A, the first substrate 400 is provided. The first substrate 400 may include an insulating structure (not numbered) and two copper layers (not numbered), and the insulating structure is sandwiched between the two copper layers. The first substrate 400 may also have other structures, so the present application is not limited thereto.

Next, as shown in FIG. 3B and FIG. 3C , a circuit is fabricated on the first substrate 400 to obtain the first circuit structure 210. For example, holes may be drilled on the insulating structure and one of the copper layers of the first substrate 400, and then copper plating may be performed so that copper metal fills the holes of the first substrate 400 and covers one of the copper layers to form the structure shown in FIG. 3B . After copper plating, the two copper layers of the first substrate 400 are cut to produce the structure shown in FIG. 3C .

Next, as shown in FIGS. 3D to 3H, the first magnetic attraction layer 220 is connected to one side of the first circuit structure 210, so that the first circuit structure 210 is located between the first magnetic attraction layer 220 and the first substrate 400. For example, if there are two first magnetic attraction layers 220, as shown in FIG. 3D, one of the first magnetic attraction layers 220 is first connected to one side of the first circuit structure 210, and a first add-on layer structure 410 is added to the other side of the first circuit structure 210 to form a structure as shown in FIG. 3E. Next, the first build-up layer structure 410 is cut and copper-plated to form the structure shown in FIGS. 3F and 3G , and another first magnetic layer 220 is connected to the first build-up layer structure 410 so that the two first magnetic layers 220 are located on both sides of the first circuit structure 210 to produce the structure shown in FIG. 3H .

It should be particularly noted that after the first magnetic layer 220 is provided, a first waterproof layer 240 may be provided on the first magnetic layer 220, so that the first magnetic layer 220 is located between the first waterproof layer 240 and the first circuit structure 210. The number of the first waterproof layer 240 may be the same as the first magnetic layer 220. In this embodiment, the number of the first waterproof layer 240 may be two, and as shown in FIGS. 3D to 3H, the first waterproof layer 240 may be provided together with the corresponding first magnetic layer 220, or after the two first magnetic layers 220 are provided, the first waterproof layer 240 may be provided on the two first magnetic layers 220. Therefore, the present application does not particularly limit the timing of providing the first waterproof layer 240.

Next, as shown in FIG. 3I and FIG. 3J , a release layer L is connected to the first magnetic layer 220 so that the first magnetic layer 220 is located between the release layer L and the first circuit structure 210, and then the first magnetic layer 220 and the release layer L are cut to form an injection hole H, wherein the injection hole H can extend from the release layer L to the first circuit structure 210 or the first build-up structure 410 to ensure that the subsequently formed components can be electrically connected to the first circuit structure 210. Similarly, the number of the release layer L can be the same as that of the first magnetic layer 220, so the present application is not limited to the number of the release layer L.

Next, as shown in FIG. 3K and FIG. 3L , a conductive material is injected into the injection hole H to form the connecting column 230 , and after the connecting column 230 is completely set, the release layer L is removed to obtain the first circuit board 200 .

Please refer to Figures 4A, 4B, 4C, 4D, 4E, 4F, 4G, 4H, 4I, 4J and 4K, Figures 4A to 4K are cross-sectional schematic diagrams of the manufacturing steps of the second circuit board 300 at various stages of the manufacturing method of the circuit board assembly of an embodiment of the present application. First, as shown in Figure 4A, a second substrate 500 is provided, and the second substrate 500 may include an insulating layer 370 and a copper layer (not numbered), and the copper layer is disposed on the insulating layer 370.

Next, as shown in FIGS. 4B to 4H, a circuit is fabricated on the second substrate 500 to obtain the second circuit structure 310. Specifically, the copper layer of the second substrate 500 may be cut as shown in FIG. 4B, and then a mounting component M may be disposed on the copper layer using surface mounting technology to form a structure as shown in FIG. 4C.

Next, as shown in FIG. 4D, a conductive silver paste is coated on the copper layer of the second substrate 500 to form a conductive layer 340, and a second build-up layer structure 510 is disposed on the second substrate 500 to produce a structure as shown in FIG. 4E. The copper layer of the second substrate 500, the mounting component M and the conductive layer 340 can all be encapsulated in the second build-up layer structure 510 to obtain good protection. Next, the second build-up layer structure 510 is subjected to processes such as cutting and copper plating to form a structure as shown in FIGS. 4F to 4H.

Next, as shown in FIG. 4I, the second magnetic layer 320 is disposed on the second circuit structure 310. It should be particularly noted that if the material of the second magnetic layer 320 is a non-conductive magnetic material, the second magnetic layer 320 can be directly connected to the second circuit structure 310, but if the material of the second magnetic layer 320 is conductive, a second adhesive layer 350 can be first disposed as shown in FIG. 4I, and then the second magnetic layer 320 can be disposed on the second adhesive layer 350 to prevent the second magnetic layer 320 from interfering with the current transmission of the second circuit structure 310. In addition, before the second magnetic layer 320 or the second adhesive layer 350 is disposed, other components (such as mounted components) can also be disposed on the second circuit structure 310 to meet the use requirements.

Next, as shown in FIG. 4J, a second waterproof layer 360 may be firstly disposed on the second magnetic layer 320, and then as shown in FIG. 4K, the second magnetic layer 320 and the second circuit structure 310 may be cut to form the assembly hole 330, thereby obtaining the second circuit board 300. The end of the assembly hole 330 may be located on the surface of the conductive layer 340, inside the conductive layer 340, or penetrate the conductive layer 340 and be located on the surface of the copper layer, that is, the depth of the assembly hole 330 may be adjusted according to the length of the connecting column 230 of the first circuit board 200, and is not limited in the present application.

In summary, the circuit board assembly of the present application achieves connection and positioning with other circuit board assemblies through the adsorption effect of the magnetic attraction layer, without relying on the conventional solder paste welding or component plug-in methods for connection, thereby obtaining a more flexible configuration method, and the waterproof effect of the circuit board assembly can be enhanced by providing a waterproof layer and an insulating layer.

Although the present application has been disclosed as above by way of embodiments, it is not intended to limit the present application. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be subject to the scope defined by the attached patent application.

100:Circuit board assembly

200: First circuit board

210: first circuit structure

220: First magnetic layer

230:Connecting column

240: First waterproof layer

300: Second circuit board

310: Second circuit structure

320: Second magnetic layer

330: Assembly hole

340: Conductive layer

350: Second adhesive layer

360: Second waterproof layer

370: Insulation layer

400: first substrate

410: First additional layer structure

500: Second substrate

510: Second floor structure

L: Release layer

H: injection hole

M: Mounting components

FIG. 1 is a schematic cross-sectional view of a circuit board assembly of an embodiment of the present application; FIG. 2 is a schematic cross-sectional view of the circuit board assembly of FIG. 1; FIG. 3A to FIG. 3L are schematic cross-sectional views of the manufacturing steps of the first circuit board at various process stages in the manufacturing method of the circuit board assembly of an embodiment of the present application; and FIG. 4A to FIG. 4K are schematic cross-sectional views of the manufacturing steps of the second circuit board at various process stages in the manufacturing method of the circuit board assembly of an embodiment of the present application.

100:Circuit board components

200: First circuit board

210: First circuit structure

220: First magnetic layer

230: Connecting column

240: First waterproof layer

300: Second circuit board

310: Second circuit structure

320: Second magnetic layer

330: Assembly hole

340: Conductive layer

350: Second adhesive layer

360: Second waterproof layer

370: Insulation layer

Claims (9)

A circuit board assembly comprises: a first circuit board, comprising: a first substrate; a first circuit structure connected to the first substrate; a first magnetic layer connected to the first circuit structure and arranged so that the first circuit structure is located between the first magnetic layer and the first substrate, and the first magnetic layer is not electrically connected to the first circuit structure; and a connecting post connected to the first circuit structure, the connecting post extending from the first circuit structure to the first magnetic layer and passing through the first magnetic layer, and the connecting post electrically connected to the first circuit structure; and a second circuit The board comprises: a second circuit structure; a second magnetic attraction layer, disposed on the second circuit structure; and at least one assembly hole, formed in the second magnetic attraction layer so that the second circuit structure is partially exposed in the assembly hole; wherein a mutual attraction magnetic force is generated between the first magnetic attraction layer and the second magnetic attraction layer, and the mutual attraction magnetic force connects the first circuit board to the second circuit board; wherein, after the first circuit board is connected to the second circuit board by the mutual attraction magnetic force, the connecting post is inserted into the assembly hole, and the connecting post is electrically connected to the second circuit structure. A circuit board assembly as described in claim 1, wherein the second circuit board further comprises a conductive layer electrically connected to the second circuit structure, and the conductive layer electrically connected to at least one of a side surface and an end surface of the connecting column. A circuit board assembly as described in claim 1, wherein the material of the first magnetic attraction layer and the second magnetic attraction layer includes a ferromagnetic material or a ferrite magnetic material. The circuit board assembly as described in claim 3, wherein the materials of the first magnetic attraction layer and the second magnetic attraction layer include the ferromagnetic material, the first circuit board further includes a first rubber layer disposed between the first circuit structure and the first magnetic attraction layer, and the second circuit board further includes a second rubber layer disposed between the second circuit structure and the second magnetic attraction layer. The circuit board assembly as described in claim 1, wherein the second circuit board further comprises a second waterproof layer, connected to the second magnetic layer and the second magnetic layer is located between the second circuit structure and the second waterproof layer. The circuit board assembly as described in claim 1, wherein the first circuit board further comprises a first waterproof layer, connected to the first magnetic layer and the first magnetic layer is located between the first waterproof layer and the first circuit structure. A method for manufacturing a circuit board assembly includes: providing a first circuit board, the first circuit board including: a first substrate; a first circuit structure connected to the first substrate; a first magnetic layer connected to the first circuit structure and arranged between the first magnetic layer and the first substrate, and the first magnetic layer is not electrically connected to the first circuit structure; and a connecting post connected to the first circuit structure, the connecting post extending from the first circuit structure toward the first magnetic layer and passing through the first magnetic layer, and the connecting post extending from the first circuit structure toward the first magnetic layer and passing through the first magnetic layer. The connecting post is electrically connected to the first circuit structure; a second circuit board is provided, comprising: a second circuit structure; a second magnetic attraction layer, disposed on the second circuit structure; and at least one assembly hole, formed in the second magnetic attraction layer so that the second circuit structure is partially exposed in the assembly hole; and the second circuit board is assembled with the first circuit board by utilizing a mutual attraction magnetic force generated between the first magnetic attraction layer and the second magnetic attraction layer, so that the connecting post is inserted into the assembly hole, and the connecting post is electrically connected to the second circuit structure. The manufacturing method of the circuit board assembly as described in claim 7, wherein the manufacturing steps of the first circuit board include: providing the first substrate; making a circuit on the first substrate to obtain the first circuit structure; connecting the first magnetic attraction layer to one side of the first circuit structure so that the first circuit structure is located between the first magnetic attraction layer and the first substrate; connecting a release layer to the first magnetic attraction layer so that the first magnetic attraction layer is located between the release layer and the first circuit structure; cutting the first magnetic attraction layer and the release layer to form an injection hole; injecting a conductive material into the injection hole to form the connecting column; and removing the release layer after the connecting column is set. The manufacturing method of the circuit board assembly as described in claim 7, wherein the manufacturing steps of the second circuit board include: providing a second substrate; making a circuit on the second substrate to obtain the second circuit structure; setting the second magnetic attraction layer on the second circuit structure; and cutting the second magnetic attraction layer and the second circuit structure to form the assembly hole.