TWI872227B - Connection of components and arrangement having a connecting element and a component - Google Patents

Abstract

Method for connecting a first component (2) to a second component (3), comprising: a) providing a connecting element (6) with a respective multiplicity of nanowires (1) on a first connecting area (7) on a first side (10) of the connecting element (6) and on a second connecting area (8) on a second side (11), opposite the first side (10), of the connecting element (6), wherein the first connecting area (7) and the second connecting area (8) are electrically insulated from one another, b) bringing a contact area (4) of the first component (2) and the first connecting area (7) of the connecting element (6) together, and c) bringing a contact area (5) of the second component (3) and the second connecting area (8) of the connecting element (6) together.

Description

Component connection technology and a configuration having a connection element and a component

Invention Field

The invention relates to a method and a connecting element for connecting a first component to a second component, and also to a configuration of two components connected together, in particular with respect to components from electronic devices.

The invention also relates to a method for connecting a first contact area to a second contact area and the use of a connecting element, and also to a configuration of two contact areas connected together, in particular with respect to a component from an electronic device.

Invention background

In a wide variety of applications, there is a need to connect bodies to one another. By way of example, two metal bodies or two bodies made of different materials may need to be connected to one another. This is the case in particular in electronic devices. In order to form this type of connection, a wide variety of methods are known from the prior art. Particularly known are methods for connecting electrical conductors or bodies, for example, made of copper, by welding, brazing or soldering, adhesive bonding, threading, riveting or embossing. In methods of this type, the prepared surfaces are precisely oriented relative to one another and connected to one another. It is therefore necessary to clearly define the bodies to be connected geometrically and to prepare them lengthwise in their extent and their connection locations. In addition, preparations for producing the connection must be carried out in advance, such as drilling holes or providing corresponding connecting elements. Here, adhesive bonding, threaded connections and riveted connection technologies are room temperature processes. In contrast, welding, soldering and brazing are hot processes in which liquid metal is produced and inserted into the joint in a volumetric filling and metal interaction manner.

As a result of its considerable temperature input, which is usually up to 1400°C, welding has the following disadvantages: On the one hand, the bodies in question are heated to such a great extent that there is a risk of igniting flammable materials. Visual changes in the surface of the bodies to be connected can also occur, which can be problematic, especially in the case of pre-treated surfaces with lacquers, films or coatings. Many materials are also not weldable.

Brazing of copper, for example, can likewise have the consequence, as a result of its considerable heat output, that the components involved in the connection are heated considerably (in particular, above 400°C). This can lead to ignition of non-combustible materials.

Soft soldering of copper, for example, can have the following disadvantages: On the one hand, the shear strength of the connection is lower than necessary, and on the other hand, the alternating temperature load in the case of soft soldering leads to delamination of the metal and thus to embrittlement of the connection. This can lead to connection failures. Furthermore, soft soldering has the disadvantage that it has a significantly greater transfer resistance at the connection than, for example, pure copper. A further disadvantage of soft soldered connections is the low mechanical fatigue strength, which generally only exists up to approximately 120° C. The corrosion resistance of this type of connection with respect to acidic media is also generally inadequate.

During the adhesive bonding of certain conductive components such as copper components, the following disadvantages generally exist: The electrical transfer resistance is adversely influenced by the adhesive bonding to a considerable extent. The mechanical requirements with regard to the mechanical strength of the connection cannot always be met by the conductive bond. Sufficient mechanical strength generally exists only in a temperature range of only 120°C. This can in particular make use in warm or hot environments and/or the use of thermal media impossible.

In the case of threaded connections and riveted connections, the parts must be pulled together in a particularly precise manner. The required holes and the assembly by means of screws or rivets also often result in a visual impairment of the visual and mechanical appearance of the entire construction. Furthermore, in terms of construction, it is necessary to ensure that the exact location at which the connection is to be made is known in advance. The usability of components that are not defined by length can thus become more difficult or be prevented. In addition, in the case of such connections, there is often a residual gap between the components. As a result of capillary action, moisture can enter the residual gap and corrosion can subsequently occur. Corrosion can damage the connection. The electrical and/or thermal transfer resistance of the connection can also be increased. Furthermore, the screws or rivets used can cause leakage in the area of the connection. This can make the use of this connection more difficult for containers or pressure systems, for example, in particular because additional sealing components are required.

Summary of invention

Continuing from this, one object of the present invention is to solve or at least alleviate the technical problems associated with the previous technical discussions. The intention is in particular to propose a method and a connecting element for connecting a first component to a second component, and also to propose an arrangement of two components connected together, in which case a connection is or has been formed between the components in a particularly reliable and simple manner, which connection is particularly mechanically stable and has a particularly good thermal conductivity.

Continuing from this, one object of the present invention is to solve or at least alleviate the technical problems associated with the previous technical discussions. The intention is in particular to propose a method and a connecting element for connecting a first component to a second component, and also to propose an arrangement of two components connected together, in which case a connection is or has been formed between the components in a particularly reliable and simple manner, which connection is particularly mechanically stable and has a particularly good thermal conductivity.

The intention is also to propose, in particular, a method for connecting a first contact area to a second contact area and the use of a connecting element, and also to propose an arrangement of two contact areas connected together, in which case a connection is or has been formed between the contact areas in a particularly reliable and simple manner, which connection is particularly mechanically stable and has a particularly good electrical and/or thermal conductivity.

These objects are achieved by a method, by a connection element, by the use of a connection element and by a configuration according to the features of the independent patent application. Further advantageous improvements are specified in the respective independently filed patent application. The features specified individually in the patent solution can be combined with one another in any desired technically advantageous manner and can be supplemented by explanatory facts from the description, which highlight further design variants of the invention.

According to the present invention, a method for connecting a first component to a second component is provided. The method comprises: a) providing a connection element having a plurality of individual nanowires on a first connection region on a first side of the connection element and on a second connection region on a second side of the connection element opposite to the first side, wherein the first connection region and the second connection region are electrically insulated from each other, b) bringing a contact region of the first component together with the first connection region of the connection element, and c) bringing a contact region of the second component together with the second connection region of the connection element.

The first component and the second component are preferably electronic components, such as semiconductor components, computer chips, microprocessors or printed circuit boards. The first component and/or the second component are preferably at least partially thermally conductive. The first component and/or the second component may be fully or partially electrically conductive or electrically insulating. As a result of the electrical insulation between the connection areas, the electrically conductive components are also not electrically connected to each other.

Electrical conductivity and/or thermal conductivity in the sense used herein is particularly present in metals such as copper, which are often referred to as "conductive" or equivalently as "electrically conductive" or "thermally conductive" or "thermally conductive". In particular, materials that are usually considered to be electrically and/or thermally insulating are not intended to be considered as being electrically and/or thermally conductive herein. In any case, the first connection region and the second connection region are intended to be considered to be electrically isolated from each other if a resistance between the first connection region and the second connection region is measured to be at least 100 KΩ under the following conditions in a four-point measurement: room temperature, air humidity 20%, measurement at a constant voltage (i.e., not under alternating voltage), measurement by a respective electrode on the first connection region and on the second connection region, the electrodes contacting the respective connection region over an area of ¹ cm2.

The method described is not limited to applications in the field of electronics. For example, according to the method described, it is also possible to mount a component such as a sensor (as a first component) on a wall or a mount (as a second component). By means of the method described, it is particularly possible to form a mechanically stable, electrically insulating and preferably thermally conductive connection between the first component and the second component. The method described can therefore be used in all fields in which a corresponding connection between two components is required. The method described is also not limited to a certain size of the components. The method described is therefore suitable, for example, for applications in the field of electronics, in particular microelectronics, or for the connection of relatively large components on a macroscopic level.

The components can be connected to the connection element via respective contact areas. A contact area is in particular a spatially significant area of a surface of the respective component. In particular, it is preferred that the contact areas are significant due to the formation of the connection. This means that the contact area does not initially differ from the rest of the surface of the component and is distinguished only by the formation of the connection, in that the contact area is the area in which the connection is formed. In this case, the contact area initially differs only conceptually from the rest of the surface of the component. In the region of the contact areas, the nanowires of the connection element can make contact with the respective component.

In each case, the contact areas are preferably areas of simply adjacent form of the surface of the respective component. As an alternative, it is possible to subdivide the respective contact area of the first component and/or the second component into a plurality of separate subareas of the surface of the respective component. A contact area may thus comprise two or more separate parts of the surface of the respective component. The contact areas may be electrically and/or thermally conductive, or electrically and/or thermally insulating. Due to the electrical insulation between the connection areas, the connection is in any case electrically insulating.

Preferably, the components have a rigid design or have at least one rigid surface on which the respective contact area is provided. This means in particular that the components (or at least the contact areas) are preferably not flexible. With rigid components or contact areas, it is possible to form a connection in a particularly satisfactory manner according to the described method. If, for example, one of the components were to have a flexible design, the connection could be destroyed by a loading of the nanowires. However, depending on the precise circumstances, it is also possible to implement the described method advantageously with flexible components or contact areas.

In the described method, the connections between the first components and the connecting element are formed via a plurality of nanowires.

Here, nanowires are understood to mean any material body having a linear form and a size in the range from a few nanometers to a few micrometers. A nanowire may, for example, have a circular, elliptical or polygonal base. In particular, a nanowire may have a hexagonal base. Preferably, all the nanowires involved in the connection are formed from the same material. Depending on the configuration of the connecting element, when the nanowires are formed from a conductive material, an electrical insulation between the contact areas of the components to be connected is also provided. It is therefore possible for the nanowires to be formed from a conductive and/or from an electrically insulating material.

The nanowires on the first connection region are preferably formed from the same material as the nanowires on the second connection region. Alternatively, the nanowires on the first connection region and the nanowires on the second connection region are preferably formed from different materials.

Particularly preferably, the nanowires on the first connection region and/or the nanowires on the second connection region are formed from a respective metal. Further preferably, the nanowires on the first connection region are formed from the material of the contact region of the first component and/or the nanowires on the second connection region are formed from the material of the contact region of the second component. If the nanowires are formed from the same material as the respective contact region, a particularly tight connection can be formed. However, in any case, connections between materials having a similar diffusion tendency are also possible. Thus, for example, it is possible to easily connect copper to silver, nickel or gold.

Depending on the material of the nanowires, the connection can have different properties. In particular, the mechanical strength and thermal conductivity of the connection are influenced by the material of the nanowires. As a result of the fact that the nanowires on the two connection regions are formed from different materials, it is possible to form two connections with different properties. The connecting element can therefore also be regarded as a facilitator between the two components to be connected, since two components that would otherwise not be connectable to one another or would only be connectable with difficulty can be connected to one another via the connecting element.

The nanowires preferably have a length in the range from 100 nm [nanometer] to 100 μm [micrometer], in particular in the range from 500 nm to 60 μm. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 μm, in particular in the range from 30 nm to 2 μm. Here, the term "directly" refers to a circular base surface, wherein in the case of a base surface deviating from this circular base surface, a similar definition of diameter is considered. Particularly preferably, all nanowires used have the same length and the same diameter.

In the method currently described, the components are connected to each other indirectly via the connecting element. This has the following advantages: the nanowires do not need to be provided on any of the components. It is sufficient for the nanowires to be present on the connecting element. In particular, preferably, the nanowires are not provided on the contact areas of the components, but on the contrary, only on the connection areas of the connecting element. This makes it easier to carry out the method and, in particular, also broadens the field of application of the method to those components that are inaccessible or only accessible with difficulty for the growth of the nanowires. The growth of the nanowires can also be carried out locally separately from the components. However, alternatively preferably, a large number of individual nanowires are also provided on the contact area of the first component and/or on the contact area of the second component.

The connection element preferably has a flexible configuration. As an alternative, the connection element preferably has a rigid configuration. The connection element can be assembled, for example, in the form of a solid small metal plate. In that case, the electrical insulation between the connection areas can be achieved by one or more coatings.

Preferably, the connecting element is formed from a plastic. By way of example, the connecting element can be formed from a polymer, in particular, from polycarbonate, PVC, polyester, polyethylene, polyamide and/or PET. It is also possible that the connecting element is formed, for example, from a ceramic material, silicon, alumina or glass. Furthermore, the connecting element can be formed from stainless steel, aluminum or non-ferrous metal. It is also preferred that the connecting element is formed from a composite material comprising several of the materials mentioned.

In step a), a connection element is provided, which has two connection regions. The two connection regions each have a large number of nanowires. The first connection region is arranged on a first side of the connection element, and the second connection region is arranged on a second side of the connection element. The first side and the second side of the connection element are arranged in a mutually opposite manner. The first side of the connection element is the side of the connection element that faces the first component after the connection is formed. The second side of the connection element is the side of the connection element that faces the second component after the connection is formed. The components can therefore be connected by the described method because, after the connection is formed, the contact regions of the two components are arranged on the two sides of the connection element in a mutually opposite manner. In this case, a distance between the two contact areas is caused only by the thickness of the connecting element and by the space occupied by the nanowires.

In step a) of the described method, the connection element is provided. In this case, provision is to be understood, on the one hand, as meaning that a connection element assembled as described is provided as part of the method. Thus, as part of the method, it is particularly possible to apply the nanowires to the connection regions, in particular by current growth. However, on the other hand, provision also encompasses the use of a connection element on which the nanowires are already provided on the connection regions. Thus, for example, it is possible that a correspondingly prepared connection element is obtained from a supplier and used for the described method. Obtaining a prepared connection element in this way is also a provision of a connection element in the sense used here.

The nanowires are preferably provided on the connection regions in such a way that they are substantially perpendicular (preferably, perpendicular) to the respective connection regions. All of the nanowires on a connection region may in particular be referred to as a block of nanowires. However, the nanowires may also be provided on the connection regions in any desired orientation. It is also possible to subdivide a connection region into a plurality of (connected together or individually) subregions, wherein the nanowires are oriented differently in the various subregions. In this way, a particularly stable connection may be utilized, which in particular is also able to withstand shear forces in a particularly satisfactory manner. Furthermore, it is possible to arrange the nanowires differently at various points in the connection regions, in particular with regard to their length, diameter, material and density (the density of the nanowires specifies how many nanowires are provided per unit area).

The connecting element can be understood in particular as an intermediate object of the connection between the first component and the second component. In particular, any physical object suitable for being arranged between the contact areas of the components for the connection of the components is considered as a connecting element.

A connection zone is in particular a spatially prominent area of a surface of the connection element on the respective side of the connection element. In particular, it is preferred that the connection zones are prominent due to the formation of the connection. This means that the connection zones do not initially differ from the rest of the surface of the connection element and are only distinguished due to the formation of the connection in that the connection zones are the zones where the connection is formed. In this case, before the connection is formed, the connection zones differ only conceptually from the rest of the surface of the connection element. By way of example, a connection zone of a zone connection element may be prominent in that a zone connection to the respective component is formed on a demarcated area of the connection element (i.e. on the connection zone).

The connection areas are preferably as large as the corresponding contact areas and particularly preferably have the same form. However, it is also possible that the contact areas are larger or smaller than the corresponding connection areas and/or that the contact areas and the corresponding connection areas have different forms.

In each case, the connection regions are preferably regions of simply adjacent form of the surface of the connection element. As an alternative, it is possible to subdivide the first connection region and/or the second connection region into a plurality of separate subregions of the surface of the connection element. A connection region can thus comprise two or more separate parts of the surface of the connection element.

In steps b) and c), the contact regions are brought together with the connection regions, i.e. moved towards each other. As a result, the nanowires on the connection regions come into contact with the respective contact regions. In this case, the nanowires are connected to the corresponding contact regions, as a result of which corresponding connections are formed between the components and the connection element.

The connection is formed in which the nanowires, in particular their ends facing the respective contact area, are connected to the contact area. The connection is formed at an atomic level. The operation performed with atomic energy is similar to the operation that occurs during sintering. The connection obtained can be impermeable to gases and/or liquids, in particular in such a way that corrosion of the connection and/or the components connected together can be prevented or at least limited in the area of the connection. In particular, the connection formed can be considered as all-metal. The described method can also be referred to as "Klett Welding". The connection is obtained by a large number of nanowires, and therefore by a large number of elongated hair structures, and by heating. The large number of nanowires can compensate for the unevenness and roughness of the contact areas.

Due to the size of the nanowires in the nanometer range, the surface of the connection (i.e. the area on which forces such as van der Waals forces act at the atomic level) is particularly large. The connection can therefore have a particularly good thermal conductivity and/or mechanical stability. For a thermally specific conductive connection, the nanowires are preferably formed from a thermally conductive material. The use of copper is particularly preferred here. The contact areas are preferably also formed from a thermally conductive material, in particular, from copper. As described further above, the use of copper is not possible, in particular in the case of a solder connection. Due to the large surface of the connection obtained by the described method, a particularly large thermal conductivity of the connection is possible. The particularly good thermal conductivity of the connection can improve, for example, the cooling of the components involved in the connection. In particular, for this purpose, the use of copper for the nanowires and/or for the contact areas is preferred.

The connection described can also be produced in a particularly simple manner and without tools. It is only necessary to connect the components and bring the connection elements together. The application of heat and pressure can be carried out optionally but is not absolutely necessary.

The method steps a) to c) are preferably performed in the order described, in particular, continuously. In particular, step a) is preferably performed before steps b) and c) are started.

If steps b) and c) are performed consecutively, the contact area of the first component and the first connection area (i.e., the first component and the connection element) can be initially brought together (step b)). Subsequently, the connection element brought together with the first component according to step b) can be brought together with the second component in the following manner: the contact area of the second component and the second connection area are brought together (step c)).

Steps b) and c) may alternatively be performed simultaneously, in a temporarily overlapping manner or in succession. This is possible, for example, in which the connecting element is held between the two components and the components are simultaneously moved from both sides towards the connecting element.

In a preferred embodiment of the method, step b) and/or step c) is performed at room temperature.

The described connection between the contact areas and the connection areas may have been formed at room temperature. In this case, it is preferred to push the two components against each other in order to form the connection. Preferably, the pressure used here is in the range between 3 MPa and 200 MPa, in particular in the range between 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.

Preferably, heating also does not occur after the completion of steps b) and c). As a result, it is possible to prevent damage to the components as a result of the temperature effect.

In another preferred embodiment, the method further comprises: d) heating at least the contact areas to a temperature of at least 90°C.

The contact areas are heated to a temperature of at least 90°C (as a minimum temperature), preferably to a temperature of at least 150°C (as a minimum temperature). The temperature is preferably 200°C. Preferably, the heating is carried out to a temperature of at most 450°C, in particular, to a temperature of at most 240°C. In this embodiment, it is also preferred to carry out step b) and/or step c) at room temperature. This means that the heating occurs only after the connection is formed according to step b) and step c). By the heating, the connection thus formed is strengthened.

The heating according to step d) connects the nanowires to the contact regions in a particularly satisfactory manner. Accordingly, it is sufficient to heat only the contact regions. In practice, with this type of heating, it is generally not possible to make a distinction as to whether the contact regions, the nanowires, the connecting element, the first component are heated partially or entirely and/or whether the second component is heated partially or entirely. This is particularly the case if thermally conductive materials are used. For the formation of the connection, (joint) heating of components other than the contact regions is not required, but this (joint) heating is also not harmful. The heating according to step d) can therefore be carried out in particular, wherein the first component, the second component and the connecting element are heated jointly, for example in a furnace. However, as an alternative, it is also possible to introduce the heat locally in the area of the connection, in particular, in the area of the contact areas.

For the formation of the connection, it is sufficient to reach the described minimum temperature at least once within a short period of time. It is not necessary to maintain the minimum temperature. However, it is preferred to maintain the temperature at which the heating is carried out in step d) for at least ten seconds, preferably at least 30 seconds. This makes it possible to ensure that the connection is formed as desired. In principle, it is not harmful to maintain the temperature for a longer time.

Steps b) and c) and also step d) can be performed in an at least partially temporarily overlapping manner. For example, it is thus possible to carry out preheating before or during steps b) and c), which preheating can be constructed as part of step d). It is also possible to heat the respective contact area of the first component and/or the second component before step d) in such a way that the temperature required for the formation of the connection has been reached during the operation together according to step b) or c). In particular, in this respect, it is thus also possible to start step d) before step b) or c). In that case, step d) is performed because even after the end of step b) or c), the temperature required according to step d) is still at least temporarily present.

By means of the described method, it is possible to obtain a connection between two components without reaching a temperature having a value such as in the case of welding or brazing, for example. In the present embodiment, this advantage can be utilized, wherein unnecessary heating is avoided. By way of example, damage to the components can thus be avoided. As a result of the described low temperatures, ignition of combustible materials can also be excluded. Correspondingly, at any point in time of the described method, a temperature of the first component and/or the second component does not exceed 270° C., in particular 240° C. is particularly preferred.

In another preferred embodiment of the method, in step b) and/or c), the connecting element, the first component and/or the second component are acted on by ultrasound.

The connecting element and the first component are preferably subjected to ultrasound in step b). As an alternative or in addition, the connecting element and the second component are preferably subjected to ultrasound in step c). The ultrasound can be performed in such a way that it is completely impossible or only very unlikely to distinguish whether the connecting element, the first component and/or the second component are acted upon. Correspondingly, it is also preferred to act upon the connecting element, the first component and the second component by ultrasound in step b) and/or in step c).

It has been found that ultrasound helps to form the connection between the nanowires and the contact areas.

In a further preferred embodiment of the method, at least during a part of the heating, the first component and the second component are pushed against the connecting element by a pressure of at least 3 MPa, in particular at least 15 MPa and/or at most 200 MPa, in particular 70 MPa. This can be implemented in particular in the following situation: the two components are pushed towards each other while the connecting element is arranged between the two components.

Preferably, the pressure used is in the range between 3 MPa and 200 MPa, in particular, in the range between 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.

At least during a time period in which the temperature exceeds its specified lower limit, the pressure is preferably above the indicated lower limit. In this respect, at least during this time period, the nanowires and the contact area are therefore both exposed to a corresponding pressure and to a corresponding temperature. As a result, the connection can be formed by the action of pressure and temperature.

In another preferred embodiment of the method, the first connection area and the second connection area are assembled in a relative manner.

The first connection area and the second connection area are preferably arranged parallel to each other.

In this embodiment, the connecting element can be arranged between the two components to be connected. In this case, the connecting element has only the following effect (apart from the formation of the connection): the contact areas are not arranged directly adjacent to each other, but are spaced apart from each other in particular according to the material thickness of the connecting element. The orientation of the contact areas relative to each other remains unaffected by the connecting element.

As an alternative, it is possible, for example, to provide the first connection area and the second connection area also at different positions of the respective (in particular, flat) surface of the connection element. In that case, the first component can be connected to the connection element at a first of the positions and the second component can be connected to the connection element at a second of the positions. In another preferred embodiment of the method, the connection element provided in step a) also has a plurality of nanowires on a third connection region on the first side of the connection element and on a fourth connection region on the second side of the connection element, wherein the third connection region and the fourth connection region are connected to each other in a conductive manner, and wherein the method also includes the following steps: b') bringing a contact region of a third component together with the third connection region of the connection element, and c') bringing a contact region of a fourth component together with the fourth connection region of the connection element.

In this embodiment, the method may also be referred to as a "method for connecting four components."

Steps b), b'), c) and c') may be performed simultaneously, in a temporarily overlapping manner or continuously in any desired order.

In this embodiment, an electrically insulating connection is formed between the first component and the second component, and also an electrically conductive connection is formed between the third component and the fourth component. In this regard, multiple pairs of a first component and a second component, and/or multiple pairs of a third component and a fourth component are provided in each case.

The first connection region is preferably insulated from all other connection regions in a conductive manner. The second connection region is preferably insulated from all other connection regions in a conductive manner.

Unless otherwise indicated, the contents stated above for the first component and the second component apply to the third component and the fourth component accordingly, and the contents stated above for the first connection area and the second connection area apply to the third connection area and the fourth connection area accordingly.

This embodiment can be used, for example, to connect a transistor such as a MOSFET or an IGBT as a first component to a cooling body as a second component in an electrically insulating manner, and to connect a microcontroller as a third component to a data line as a fourth component.

In each case, the third connection region and the fourth connection region are preferably regions of simply adjacent form of the surface of the connection element. As an alternative, it is possible to subdivide the third connection region and/or the fourth connection region into a plurality of separate subregions of the surface of the connection element. A connection region can thus comprise two or more separate parts of the surface of the connection element. As a result, it is possible, for example, to attach a microcontroller as a third component to a multipolar data line as a fourth component via a large number of connections.

The first connection area and the third connection area are preferably arranged spaced apart from each other on the first surface of the connection element. The second connection area and the fourth connection area are preferably arranged spaced apart from each other on the second surface of the connection element. The first connection area is preferably located opposite to the second connection area. The third connection area is preferably located opposite to the fourth connection area.

In principle, the connection element is preferably formed from an electrically insulating material. In this respect, the conductive connection between the third connection area and the fourth connection area can be realized by one or more connection lines, which pass through the connection element in the region of the third connection area and the fourth connection area. The connection lines can be formed from copper, for example. They can be obtained by lithography.

As another aspect of the present invention, a connecting element for connecting a first component to a second component is proposed. The connecting element has a large number of individual nanowires on a first connecting region on a first side of the connecting element and on a second connecting region on a second side of the connecting element opposite to the first side. The first connecting region and the second connecting region are electrically insulated from each other.

Certain advantages and design features of the method described further above are applicable and transferable to the connection element described therein, and vice versa.

In a preferred embodiment, the connecting element has a film-like configuration.

A film-like configuration is understood to mean that the connecting element has a thickness with a much smaller extension of the connecting element in other directions. In a preferred embodiment, the connecting element has a thickness of at most 5 mm. Preferably, the thickness of the connecting element is in the range of 0.005 mm and 5 mm [millimeters], in particular in the range of 0.01 mm and 1 mm.

Furthermore, preferably, the connecting element has a strip-shaped configuration. In this embodiment, the first side of the connecting element and the second side opposite thereto are two surfaces of the strip, which have a relatively large surface area relative to all other surfaces (due to the material thickness of the strip).

The strip material can be provided, for example, in the form of a roll. In this case, the nanowires can already be provided at the strip material station and can, for example, be protected by a protective lacquer. Before using the connecting element, the protective lacquer can be removed and the nanowires can thus be exposed. A respectively desired portion of the strip material can be separated from the roll in order to be used.

In this embodiment, the connecting element may also be referred to as a "connecting belt", and in particular, is referred to as a "Klett Welding belt".

In a further preferred embodiment of the connection element, the material of the connection element in the region between the first connection region and the second connection region has a specific resistance of at least 10 ⁵ Ωm, preferably at least 10 ⁸ Ωm at room temperature.

In the present embodiment, the specific electrical resistance of the material of the connection element at least in the region between the first connection region and the second connection region is at least 10 ⁵ Ωm, in particular at least 10 ⁸ Ωm at room temperature. However, it is also preferably the case that outside this region, in particular, preferably, through all points of the connection element, the specific electrical resistance of the connection element is at least 10 ⁵ Ωm, in particular at least 10 ⁸ Ωm.

The specification describing the specific resistance of the material of the connection element relates to a measurement at a constant voltage. When an alternating voltage is applied, varying results are obtained which depend in particular on the frequency of the alternating voltage.

The stated values of at least 10 ⁵ Ωm, preferably at least 10 ⁸ Ωm, relate to the material of the connecting element. The specific resistances of a wide variety of materials can be found in the expert literature, for example, in tables. Reference is made here to specifications of this kind. If the connecting element is formed entirely from a specific material, the specific resistance of the material of the connecting element to be used here is the value specified in the expert literature for this specific material. This definition is meant to exclude all effects which are not caused by the material but rather by, for example, the form of the connecting element. If the connecting element consists of different materials, the specific resistances of the individual materials can be determined from the expert literature and the total specific resistance of the material of the connecting element, i.e. the composition of these materials, can be determined. If the value of the specific resistivity of a material is not found in the specialist literature, it can be determined by measurement.

In particular, in the case of the specific resistances given in the present embodiment, it is intended to take into account an electrical insulation between the connection areas as given.

In another preferred embodiment, the connecting element is formed from a ceramic material in the area between the first connecting area and the second connecting area.

In the present embodiment, the connection element is formed from a ceramic material at least in the region between the first connection region and the second connection region. However, preferably, outside this region, in particular, preferably, throughout all points of the connection element, the connection element is also formed from a ceramic material.

In particular, a connecting element formed from a ceramic material can have the described specific resistance.

In another preferred embodiment, the connecting element is at least partially thermally conductive.

In particular, in this embodiment, the connection formed can have a particularly good thermal conductivity.

In another preferred embodiment, the connection element has a plurality of nanowires on a third connection region on the first side of the connection element and on a fourth connection region on the second side of the connection element, respectively, wherein the third connection region and the fourth connection region are connected to each other in a conductive manner.

As another aspect of the present invention, a configuration is proposed, comprising: - a first component connected to a connection element via a plurality of nanowires on a first connection region on a first side of the connection element, and - a second component connected to the connection element via a plurality of nanowires on a second connection region on a second side of the connection element opposite to the first side.

The first connection area and the second connection area are electrically insulated from each other.

The specific advantages and design features of the method and connection element described further above are applicable and transferable to the described configuration. The connection element is preferably assembled as described.

The configuration is preferably produced by the method described.

As an alternative, preferably, the arrangement is produced by a method comprising the following steps: A) providing a connection element having a first connection region on a first side of the connection element and a second connection region on a second side of the connection element opposite to the first side, wherein the first connection region and the second connection region are electrically insulated from each other, B) providing a plurality of individual nanowires on a contact region of the first component and on a contact region of the second component, C) bringing the contact region of the first component together with the first connection region of the connection element, and D) bringing the contact region of the second component together with the second connection region of the connection element.

This method is therefore also proposed as an aspect of the present invention. The specific advantages and design features further described above are applicable and transferable to this method, and vice versa.

In this method, the nanowires are not provided on the connecting element, but rather on the first component and on the second component. This has the advantage that the production of the connecting element is particularly simple.

As a further alternative, preferably, the arrangement is produced by a method comprising the following steps: i) providing a connection element having a plurality of nanowires on a first connection region on a first side of the connection element and on a second connection region on a second side of the connection element opposite to the first side, wherein the first connection region and the second connection region are electrically insulated from each other, ii) providing a plurality of nanowires on a contact region of the second component, iii) bringing the contact region of the first component together with the first connection region of the connection element, and iv) bringing the contact region of the second component together with the second connection region of the connection element.

This method is therefore also proposed as an aspect of the present invention. The specific advantages and design features further described above are applicable and transferable to this method, and vice versa.

In the method, a nanowire is provided for one of the connections on the connection element and for another of the connections on the component.

In summary, it is thus possible to provide the nanowire on a contact area of a component involved in a connection or on a corresponding contact area. Correspondingly, there is the possibility of providing the nanowire on two contact areas of a connection element (as in the case of a method comprising steps a) to c), on contact areas of two components (as in the case of a method comprising steps A) to D), or on one of the contact areas of a connection element and on one contact of the components (as in the case of a method comprising steps i) to iv). In all methods, it is also preferred to provide the nanowire on a connection area and on the associated contact areas. In this case, the connection is formed between the nanowires.

As another aspect of the present invention, a configuration is proposed, comprising: - a first component, - a functional element, - a second component, - a first connecting element, and - a second connecting element, wherein the first component is connected to a first connecting region of the first connecting element via a large number of nanowires, wherein the functional element is connected to a second connecting region of the first connecting element via a large number of nanowires on a first side, and is connected to a first connecting region of the second connecting element via a large number of nanowires on a second side, wherein the second component is connected to a second connecting region of the second connecting element via a large number of nanowires, wherein the first connecting region and the second connecting region of the first connecting element are electrically insulated from each other, and wherein the first connecting region and the second connecting region of the second connecting element are electrically insulated from each other.

The specific advantages and design features of the method, connecting elements and the above-described configuration further described above are applicable and transferable to the configuration described herein. The configuration is preferably produced by applying the described method twice. The two connecting elements are preferably formed as described.

The functional element may in particular be part of a functional layer of an electronic device. The functional element preferably fulfills one or more of the following functions: heat dissipation, vibration reduction, mechanical stability. The functional element may, for example, be formed from a textile. The functional element may also be part of a housing.

As another aspect of the present invention, a method for connecting a first contact region to a second contact region is proposed. The method comprises: a) providing a connection element having a large number of nanowires on a first connection region and on a second connection region, wherein the first connection region and the second connection region are arranged on the same side of the connection element, b) bringing the first contact region together with the first connection region of the connection element, and c) bringing the second contact region together with the second connection region of the connection element.

The method described makes it possible to form a connection between the two contact areas. The first contact area and the second contact area can be arranged on the same component or on different components. The one component or the two components can be in particular an electronic component or two electronic components, such as semiconductor elements, computer chips, microprocessors or printed circuit boards. The component or components are preferably at least partially electrically and/or thermally conductive.

Electrical conductivity and/or thermal conductivity in the sense used here is particularly present in metals such as copper, which are usually referred to as "conductive" or equivalently as "electrically conductive" or "thermally conductive" or "thermally conductive". In particular, materials that are usually regarded as electrically and/or thermally insulating are not intended to be considered as electrically and/or thermally conductive here.

However, the described method is not limited to applications in the field of electronic devices. By means of the described method, it is particularly possible to form a mechanically stable and electrically and/or thermally conductive connection between the first contact area and the second contact area. The described method can therefore be used in all fields in which a connection between two contact areas having one or more of these properties is necessary. The described method is also not limited to a certain size of the components. The described method is therefore suitable, for example, for applications in the field of (micro)electronics or for the connection of relatively large contact areas on a macroscopic level.

A contact area is in particular a spatially distinct area of a surface of a component. In particular, it is preferred that the contact areas are distinguished by the formation of the connection. This means that the connection areas are not initially different from the rest of the surface of the component (with the exception of individual other contact areas, as described below) and are only distinguished by the formation of the connection in that the connection areas are the areas where the connection is formed. In this case, the contact areas differ conceptually (i.e. not spatially different) from the rest of the surface of the component. By way of example, a contact area of an electrical conductor may be distinguished in that a connection to a second electrical conductor is formed on a demarcated area of the conductor (i.e. on the contact area). In each case, the contact areas are preferably areas of simply adjacent form of the surface of the same component or of a separate component. As an alternative, it is possible to subdivide the first contact area and/or the second contact area into a plurality of separate subareas of the surface of the one component and/or of the separate component. A contact area may thus comprise two or more separate parts of the surface.

The two contact areas to be connected can already be distinguished from each other before the connection is formed. If a connection area with a nanowire is thus connected to a contact area, this cannot be understood as a connection of two contact areas, because the one contact area is arbitrarily and conceptually subdivided into two contact areas. The two contact areas to be connected by the described method are preferably functionally distinguishable from each other. If a contact area consisting of multiple subareas is brought into contact with a nanowire of a connection area, the connection cannot therefore be regarded as a connection of one of the two contact areas, with the restrictive condition that the individual subareas of the contact area all fulfill the same function. In particular, an electrical contact is considered to be a function. The two contact areas to be connected by the described method are preferably electrically insulated from each other. Forming the connection by means of the connecting element makes it possible to produce an electrical connection between the contact areas. The contact areas may be electrically and/or thermally conductive, or electrically and/or thermally insulating. Preferably, the contact areas are electrically and/or thermally conductive, so that an electrically and/or thermally conductive connection can be formed.

The contact regions preferably have a rigid design. This means that the surface of the respective component on which the contact region is located has a rigid configuration at least in the region of the contact region. The contact regions are therefore inflexible. It is possible to form a connection between rigid contact regions in a particularly satisfactory manner according to the described method. If, for example, one of the contact regions were to have a flexible design, the connection could be destroyed by a loading of the nanowires. However, depending on the precise circumstances, it is also possible to advantageously implement the described method by means of flexible contact regions.

In the described method, the connection between the first contact areas and the second contact area is formed via a plurality of nanowires.

Here, nanowires are understood to mean any material body having a linear form and a size in the range from a few nanometers to a few micrometers. A nanowire may, for example, have a circular, elliptical or polygonal base. In particular, a nanowire may have a hexagonal base. Preferably, all of the nanowires involved in the connection are formed from the same material. It is particularly preferred that the nanowires are formed completely from an electrically and/or thermally conductive material.

The nanowires on the first connection region are preferably formed from the same material as the nanowires on the second connection region. Alternatively, the nanowires on the first connection region and the nanowires on the second connection region are preferably formed from different materials.

Particularly preferably, the nanowires on the first connection region and/or the nanowires on the second connection region are formed from a respective metal. Further preferably, the nanowires on the first connection region are formed from the material of the first contact region, and/or the nanowires on the second connection region are formed from the material of the second contact region.

Depending on the material of the nanowires, the connection can have different properties. In particular, the mechanical strength and the electrical and/or thermal conductivity of the connection are influenced by the material of the nanowires. As a result of the fact that the nanowires on the two connection areas are formed from different materials, it is possible to form two connections with different properties. The connection element can therefore also be regarded as a promoter between the two contact areas to be connected, since two contact areas that would otherwise not be connectable to one another or would only be connectable with difficulty can be connected to one another via the connection element.

The nanowires preferably have a length in the range from 100 nm [nanometer] to 100 μm [micrometer], in particular in the range from 500 nm to 60 μm. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 μm, in particular in the range from 30 nm to 2 μm. Here, the term "directly" refers to a circular base surface, wherein in the case of a base surface deviating from this circular base surface, a similar definition of diameter is considered. Particularly preferably, all nanowires used have the same length and the same diameter.

In the method currently described, the contact areas are indirectly connected to one another via the connecting element. This has the advantage that the nanowires do not need to be provided on any of the contact areas. It is sufficient that the nanowires are present on the connecting element. This makes the execution of the method easier and, in particular, also broadens the field of application of the method to those contact areas which are inaccessible or only accessible with difficulty for the growth of nanowires. The growth of the nanowires can also be carried out locally, separate from the contact areas. However, alternatively preferably, a large number of individual nanowires are also provided on the first contact area and/or on the second contact area.

The connecting element preferably has a flexible configuration. As an alternative, the connecting element preferably has a rigid configuration. The connecting element can thus be assembled, for example, in the form of a solid small metal plate.

Preferably, the connecting element is formed from a plastic. By way of example, the connecting element can be formed from a polymer, in particular, from polycarbonate, PVC, polyester, polyethylene, polyamide and/or PET. It is also possible that the connecting element is formed, for example, from a ceramic material, silicon, alumina or glass. Furthermore, the connecting element can be formed from stainless steel, aluminum or non-ferrous metal. It is also preferred that the connecting element is formed from a composite material comprising several of the materials mentioned.

In step a), a connection element is provided, which has two connection regions. The two connection regions each have a large number of nanowires. The first connection region and the second connection region are arranged on the same side of the connection element. This means that the two connection regions are close to each other. The connection regions can touch each other, that is, merge into each other. As an alternative, the connection regions can be formed spaced apart from each other. The described method therefore makes it particularly possible to connect contact regions that are close to each other. The contact regions can touch each other. However, the two contact regions are separated from each other in a way that makes it possible to delineate the two contact regions before the connection is formed. The contact regions are preferably formed spaced apart from each other. In this case, the contact areas are separated from one another by a spatial separation and, in this respect, can be distinguished from one another.

In step a) of the described method, the connection element is provided. In this case, provision is to be understood, on the one hand, as meaning that a connection element assembled as described is provided as part of the method. As part of the method, it is particularly possible to apply the nanowires to the connection regions, in particular by current growth. On the other hand, however, provision also encompasses the use of a connection element on which the nanowires are already provided on the connection regions. Thus, for example, it is possible that a correspondingly prepared connection element is obtained from a supplier and used for the described method. Obtaining a prepared connection element in this way is also a provision of a connection element in the sense used here.

The nanowires are preferably provided on the connection regions in such a way that they are substantially perpendicular (preferably perpendicular) to the respective connection regions. All of the nanowires on a connection region may in particular be referred to as a block of nanowires. However, the nanowires may also be provided on the connection regions in any desired orientation. It is also possible to subdivide a connection region into a plurality of (connected together or separately) subregions, wherein the nanowires are oriented differently in the various subregions. In this way, a particularly stable connection may be utilized, which in particular is also able to withstand shear forces in a particularly satisfactory manner. Furthermore, it is possible to arrange the nanowires differently at various points in the connection regions, in particular with regard to their length, diameter, material and density (the density of the nanowires specifies how many nanowires are provided per unit area).

The connecting element may in particular be interpreted as an intermediary of the connection between the first component and the second component. In particular, any physical object suitable for covering the two contact areas in order to connect the components is considered as a connecting element.

A connection zone is in particular a spatially prominent area of a surface of the connection element on the respective side of the connection element. In particular, it is preferred that the connection zones are prominent due to the formation of the connection. This means that the connection zones do not initially differ from the rest of the surface of the connection element and are only distinguished due to the formation of the connection in that the connection zones are the zones where the connection is formed. In this case, before the connection is formed, the connection zones differ only conceptually from the rest of the surface of the connection element. By way of example, a connection zone of a zone connection element can be prominent in that a zone connection to the respective contact zone is formed on a demarcated area of the connection element (i.e. on the connection zone).

The connection areas are preferably as large as the corresponding contact areas and particularly preferably have the same form. However, it is also possible that the contact areas are larger or smaller than the corresponding connection areas and/or that the contact areas and the corresponding connection areas have different forms.

In each case, the connection regions are preferably regions of simply adjacent form of the surface of the connection element. As an alternative, it is possible to subdivide the first connection region and/or the second connection region into a plurality of separate subregions of the surface of the connection element. A connection region can thus comprise two or more separate parts of the surface of the connection element.

In steps b) and c), the contact regions are brought together with the connection regions, i.e. moved towards each other. As a result, the nanowires on the connection regions come into contact with the respective contact regions. In this case, the nanowires are connected to the corresponding contact regions, as a result of which corresponding connections are formed between the components and the connection element.

The connection is formed in which the nanowires, in particular their ends facing the respective contact area, are connected to the contact area. The connection is formed at an atomic level. The operation performed with atomic energy is similar to the operation that occurs during sintering. The connection obtained can be impermeable to gases and/or liquids, in particular in such a way that corrosion of the connection and/or the components connected together can be prevented or at least limited in the area of the connection. In particular, the connection formed can be considered as all-metal. The described method can also be referred to as "Klett Welding". The connection is obtained by a large number of nanowires, and therefore by a large number of elongated hair structures, and by heating. The large number of nanowires can compensate for the unevenness and roughness of the contact areas.

Due to the size of the nanowires in the nanometer range, the surface of the connection (i.e. the area on which forces such as van der Waals forces act at the atomic level) is particularly large. The connection can therefore have a particularly good electrical and/or thermal conductivity and/or mechanical stability. For an electrically and/or thermally conductive connection, the nanowires are preferably formed from an electrically and/or thermally conductive material. The use of copper is particularly preferred here. The contact areas are preferably also formed from an electrically and/or thermally conductive material, in particular, from copper. As described further above, the use of copper is not possible, in particular in the case of solder connections. Due to the large surface of the connection obtained by the method described, a particularly large electrical and/or thermal conductivity of the connection is possible. The particularly good thermal conductivity of the connection can improve, for example, the cooling of the components involved in the connection. In particular, for this purpose, the use of copper for the nanowires and/or for the contact areas is preferred.

The connection described can also be produced in a particularly simple manner and without tools. It is only necessary to connect the contact areas and bring the connection elements together. The application of heat and pressure can be carried out optionally but is not absolutely necessary.

The method steps a) to c) are preferably performed in the order described, in particular, continuously. In particular, step a) is preferably performed before steps b) and c) are started.

If steps b) and c) are performed consecutively, the first contact area can initially be brought together with the first connection area (step b)). Subsequently, the connection element can be brought together with the component in which the first contact area is located and with the second contact area (step c)). This is particularly possible if the first contact area and the second contact area are arranged on different components.

Steps b) and c) can alternatively be carried out simultaneously, in a temporarily overlapping manner or in succession. This is particularly possible when the connecting element is moved towards two contact areas simultaneously. This is particularly possible in the case of two contact areas that are adjacent to each other, in particular if the two contact areas are formed on the same component.

It is preferred that the first connection region and the second connection region are connected to each other in an electrically conductive manner. The first component and the second component can therefore be connected to each other in an electrically conductive manner. As an alternative, it is preferred that the first connection region and the second connection region are electrically insulated from each other. It is therefore possible to mechanically connect the first component and the second component to each other without forming a conductive connection. A combination of these two components is also possible. In this way, the connection element can also have a large number of nanowires on a third connection region and on a fourth connection region, wherein the third connection region and the fourth connection region are arranged on the same side of the connection element. This can be the side on which the first connection region and the second connection region are also arranged. As an alternative, the first connection region and the second connection region can be arranged on a side of the connection element that is different from the third connection region and the fourth connection region. The method preferably further comprises: b') bringing a third contact region together with the third connection region of the connection element, and c') bringing a fourth contact region together with the fourth connection region of the connection element.

In this embodiment, the method may also be referred to as a "method for connecting four contact areas".

Steps b), b'), c) and c') may be performed simultaneously, in a temporarily overlapping manner or continuously in any desired order.

The above contents apply to the third connection area and the fourth connection area accordingly.

The four connection areas can be connected to each other in any desired combination in a conductive or electrically insulating manner. By way of example, the third connection area and the fourth connection area can be connected to each other in a conductive manner, and all other pairs of connection areas can be electrically insulated from each other. As another example, the first connection area and the second connection area can be connected to each other in a conductive manner, the third connection area and the fourth connection area can be connected to each other in a conductive manner, and all other pairs of connection areas can be electrically insulated from each other. It is also possible that all connection areas are connected to each other in a conductive manner. It is also possible that all connection areas are electrically insulated from each other.

In a preferred embodiment of the method, the connecting element in step a) is formed by severing from a starting body.

The nanowires can be grown on a substrate. The substrate can serve as a starting body from which the connecting element is cut. The starting body preferably has a large number of nanowires on individual separate areas. The starting body can have, for example, one or more strips with nanowires. A plurality of these strips are separated from each other by strips without nanowires. The connecting element can be produced, for example, by cutting out parts of the starting body. The cut-off part forming the connecting element preferably has a width such that the connecting element has a nanostrip in the center and respective parts of the strip without nanowires on either side thereof. The connecting element can also have a plurality of nanowire strips. The length of this part can be selected according to requirements.

The formation of the connecting element from a starting body makes it possible to carry out step a) in a particularly simple and flexible manner.

In another preferred embodiment of the method, step b) and/or step c) is performed at room temperature.

The described connection between the contact areas and the connection areas can already be formed at room temperature. In this case, it is preferred to push the connection element against the contact areas in order to form the connection. Preferably, the pressure used here is in the range between 3 MPa and 200 MPa, in particular, in the range between 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.

Preferably, heating also does not occur after the completion of steps b) and c). As a result, it is possible to prevent damage to the components as a result of the temperature.

In another preferred embodiment, the method further comprises: d) heating at least the contact areas to a temperature of at least 150°C.

The contact areas are heated to a temperature of at least 150°C (as a minimum temperature), preferably to a temperature of at least 170°C (as a minimum temperature). The temperature is preferably 200°C. Preferably, the heating is carried out to a temperature of at most 450°C, in particular, to a temperature of at most 240°C. In this embodiment, it is also preferred to carry out step b) and/or step c) at room temperature. This means that the heating occurs only after the connection is formed according to step b) and step c). By the heating, the connection thus formed is strengthened.

The heating according to step d) connects the nanowires to the contact areas in a particularly satisfactory manner. Accordingly, it is sufficient to heat only the contact areas. In practice, with this type of heating, it is generally not possible to distinguish whether the heating of the contact areas, the nanowires, the connecting element and/or the first component and/or both components is carried out partially or in total. This is particularly the case if thermally conductive materials are used. For the formation of the connection, (co-)heating of components other than the contact areas is not required, but this (co-)heating is also not harmful. The heating according to step d) can therefore be carried out in particular, wherein the one component or the two components are heated together with the connecting element, for example in a furnace. However, as an alternative, it is also possible to introduce the heat locally in the area of the connection, in particular, in the area of the contact areas.

For the formation of the connection, it is sufficient to reach the described minimum temperature at least once within a short period of time. It is not necessary to maintain the minimum temperature. However, it is preferred to maintain the temperature at which the heating is carried out in step d) for at least 2 seconds, preferably at least 30 seconds. This makes it possible to ensure that the connection is formed as desired. In principle, it is not harmful to maintain the temperature for a longer time.

Steps b) and c) and also step d) can be performed in an at least partially temporarily overlapping manner. For example, it is thus possible to carry out preheating before or during steps b) and c), which preheating can be constructed as part of step d). It is also possible to heat the respective contact areas of the first component and/or the second component before step d) in such a way that the temperature required for the formation of the connection has already been reached during the operation together according to step b) or c). In particular, in this respect, it is thus also possible to start step d) before step b) or c). In that case, step d) is performed because even after the end of step b) or c), the temperature required according to step d) is still at least temporarily present.

By means of the described method, it is possible to obtain a connection between two contact zones without reaching a temperature having a value such as in the case of welding or brazing, for example. In the present embodiment, this advantage can be utilized, wherein unnecessary heating is avoided. By way of example, damage to the components involved can thus be avoided. As a result of the described low temperatures, ignition of combustible materials can also be excluded. Correspondingly, at any point in time of the described method, a temperature of the first contact zone and/or the second contact zone does not exceed 270° C., in particular 240° C. is particularly preferred.

In a further preferred embodiment of the method, at least during a part of the heating, the connecting element is pushed against the first contact area and/or against the second contact area by a pressure of at least 3 MPa, in particular at least 15 MPa and/or at most 200 MPa, in particular 70 MPa. This can be implemented, in particular, by pushing the connecting element against one component or against two components.

Preferably, the pressure used is in the range between 3 MPa and 200 MPa, in particular, in the range between 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.

At least during a time period in which the temperature exceeds its specified lower limit, the pressure is preferably above the indicated lower limit. In this respect, at least during this time period, the nanowires and the contact area are therefore both exposed to a corresponding pressure and to a corresponding temperature. As a result, the connection can be formed by the action of pressure and temperature.

As another aspect of the present invention, a connection element is provided for connecting a first contact area to a second contact area. The connection element has a large number of individual nanowires on a first connection area and on a second connection area. The first connection area and the second connection area are arranged on the same side of the connection element.

Certain advantages and design features of the method described further above may be applicable and transferable to the use described therein, and vice versa.

The connection element is preferably formed to be electrically and/or thermally conductive. As a result, the contact areas can be connected to each other in an electrically and/or thermally conductive manner. As an alternative, it is preferred that the first connection area and the second connection area are electrically insulated from each other.

In any case, the first connection region and the second connection region are intended to be considered to be electrically isolated from each other if a resistance between the first connection region and the second connection region is measured to be at least 100 KΩ under the following conditions in a four-point measurement: room temperature, air humidity 20%, measurement at a constant voltage (i.e., not under alternating voltage), measurement by a respective electrode on the first connection region and on the second connection region, the electrodes contacting the respective connection region over an area of ¹ cm2.

If the connection areas are electrically insulated from one another, an electrically insulating, but mechanically stable and optionally also thermally conductive connection can be formed between the contact areas. Preferably, the material of the connection element in the region between the first connection area and the second connection area has a specific electrical resistance of at least 10 ⁵ Ωm, preferably at least 10 ⁸ Ωm at room temperature.

The specification describing the specific resistance of the material of the connection element relates to a measurement at a constant voltage. When an alternating voltage is applied, varying results are obtained which depend in particular on the frequency of the alternating voltage.

The stated values of at least 10 ⁵ Ωm, preferably at least 10 ⁸ Ωm, relate to the material of the connecting element. The specific resistances of a wide variety of materials can be found in the expert literature, for example, in tables. Reference is made here to specifications of this kind. If the connecting element is formed entirely from a specific material, the specific resistance of the material of the connecting element to be used here is the value specified in the expert literature for this specific material. This definition means that all effects which are not caused by the material but rather, for example, by the form of the connecting element remain excluded. If the connecting element consists of different materials, the specific resistances of the individual materials can be determined from the expert literature and the total specific resistance of the material of the connecting element, i.e. the composition of these materials, can be determined. If the value of the specific resistivity of a material is not found in the specialist literature, it can be determined by measurement.

In a preferred embodiment of the use, the first contact area is configured in a first region of a component, and the second contact area is configured in a second region of the component.

In this embodiment, two contact areas are formed on the same component. However, the component is subdivided into at least two different areas. The individual areas can be distinguished from each other by design features. The individual areas can also preferably be distinguished from each other by function. In particular, the individual areas can be areas where an electronic component is subdivided to facilitate construction and assembly.

In a preferred embodiment of the use, the first connection area and the second connection area are configured separately.

The connection regions can be distinguished purely conceptually by the formation of the connection. In this case, in the present embodiment, a connection can exist between the connection regions that are arranged spaced apart from each other. In particular, nanowires can also be provided between the connection regions to be distinguished as described. This can contribute to the growth of the nanowires, since no measures need to be taken to inhibit the growth of the nanowires between the connection regions. It is also possible to significantly facilitate the positioning of the connection elements, since the connection regions and the contact regions do not need to be placed one on top of the other in an exactly fitting manner. Instead, the connection regions are formed precisely, wherein the connection regions are required when they are brought into contact with the respective contact regions. It is also the case that the connection elements do not need to be produced for a specific intended use. Instead, a connection element can be flexibly used in a wide variety of applications. Nanowires between connection areas can remain unused, or connections can be made to surface areas outside of the contact area.

In another preferred embodiment of the use, the first contact area and the second contact area are connected to each other by the connecting element in an electrically conductive, thermally conductive and/or mechanical manner.

In this embodiment, an electrically conductive, thermally conductive and/or mechanical connection between the contact areas can be formed, in particular if the nanowires are formed from electrically conductive, thermally conductive and/or mechanically stable materials. The first contact area and the second contact area are preferably connected to each other in an electrically and/or thermally conductive manner. The electrically and/or thermally conductive connection between the connection areas can be formed by the material of the connection element. In this respect, it is sufficient that the surface of the connection element on which the nanowires are arranged is electrically and/or thermally conductive.

The latter is the case, in particular, in a preferred embodiment of the use of the nanowire to be connected to the connection element via a layer, wherein the layer is formed between the first connection region and the second connection region.

The layer is preferably used for the electric current growth of nanowires. The layer is preferably formed from the material of the nanowires. In this way, a substrate can be coated with the material of the nanowires, as a result of which the layer is obtained. Subsequently, the nanowires can be grown on the surface. The growth of the nanowires can be directed on the layer. If the layer is structured by a lithographic intermediate step before the growth of the nanowires, it is possible to locally direct the growth of the nanowires. In this way, a starting body can be obtained in which the nanowires are provided, for example, in the form of strips.

In another preferred embodiment of the use, the layer is formed to be thermally conductive, electrically conductive, and/or for the purpose of forming a mechanical connection.

The connection areas can be connected to each other in a thermally, electrically and/or mechanically conductive manner, in particular, by means of a layer of this type. Preferably, the layer is electrically and/or thermally conductive. If, in addition, the nanowires are electrically and/or thermally conductive, an electrically and/or thermally conductive connection between the contact areas can be produced.

In another preferred embodiment of the use, the connecting element has a film-like configuration.

A film-like configuration is understood to mean that the connecting element has a thickness with a much smaller extension of the connecting element in other directions. In a preferred embodiment, the connecting element has a thickness of at most 5 mm. Preferably, the thickness of the connecting element is in the range of 0.005 mm and 5 mm [millimeters], in particular in the range of 0.01 mm and 1 mm.

In particular, a film-like connecting element preferably has a flexible configuration.

Furthermore, preferably, the connection element has a strip-shaped configuration. In this embodiment, the connection areas are arranged on one of the two surfaces of the strip, which two surfaces have a relatively large surface area relative to all other surfaces (due to the material thickness of the strip).

The strip material can be provided, for example, in the form of a roll. In this case, the nanowires can already be provided at the strip material station and can, for example, be protected by a protective lacquer. Before using the connecting element, the protective lacquer can be removed and the nanowires can thus be exposed. A respectively desired portion of the strip material can be separated from the roll in order to be used.

In this embodiment, the connecting element may also be referred to as a "connecting belt", and in particular, as a "Klett Welding belt".

As another aspect of the present invention, a configuration having a connection element and a component is proposed. The component has: - a first contact area, which is connected to a first connection area of the connection element through a large number of nanowires, and - a second contact area, which is connected to a second connection area of the connection element through a large number of nanowires, wherein the first connection area and the second connection area are arranged on the same side of the connection element.

The specific advantages and design features of the methods and uses of the connection elements described further above are applicable and transferable to the described configurations.

1,101:Nanowires

2,110: First component

3,113: Second component

4: Contact area of the first component

5: Contact area of the second component

6: First connecting element

7,107: First connection area

8,108: Second connection area

9,12,15,109:Configuration

10: First side

11: Second side

13: Functional components

14: Second connecting element

16: The third component

17: The fourth component

18: Contact area of the third component

19: Contact area of the fourth component

20: Third connection area

21: Fourth connection area

102: First contact area

103: Second contact area

104: First Area

105: Second Area

106: Connecting components

111: Layer

112: Starting subject

The present invention and technical field will be described in more detail below based on the figures. The figures show particularly preferred exemplary embodiments, however, the present invention is not limited to the embodiments. It is particularly pointed out that the figures, and in particular, the scales shown, are only schematic. In these figures, in each case, schematically: FIG. 1: shows a diagram of a method according to the present invention for connecting two components, and FIG. 2: shows a diagram of a configuration according to the present invention of two components connected to each other according to the method from FIG. 1, and FIG. 3: shows a diagram of a further configuration according to the present invention, FIG. 4: shows a diagram of a further configuration according to the present invention, FIG. 5: shows a diagram of a method according to the present invention for connecting two contact areas, FIG. 6: shows a component having two contact areas connected to each other according to the method from FIG. 5 7: a view from below the connecting element from FIG. 6, FIG. 8: a view from below a starting body from which the connecting elements from FIG. 6 and FIG. 7 are obtained, FIG. 9: a view from below a second embodiment of a connecting element, FIG. 10: a view from below a third embodiment of a connecting element, and FIG. 11: a side view of a further configuration according to the invention showing a component with two contact areas connected to each other according to the method from FIG. 5.

Detailed description of the preferred embodiment

FIG. 1 shows a method for connecting a first component 2 to a second component 3. The reference symbols used are related to FIG. 2. The method comprises: a) providing a connection element 6 having a plurality of individual nanowires 1 on a first connection region 7 on a first side 10 of the connection element 6 and on a second connection region 8 on a second side 11 of the connection element 6 opposite to the first side 10, wherein the first connection region 7 and the second connection region 8 are electrically insulated from each other, b) bringing together a contact region 4 of the first component 2 and the first connection region 7 of the connection element 6, and c) bringing together a contact region 5 of the second component 3 and the second connection region 8 of the connection element 6.

Steps b) and/or c) are preferably performed at room temperature. The method may further comprise the following optional step, which is indicated by a dashed box in FIG. 1 : d) heating at least the contact areas 4, 5 to a temperature of at least 150°C.

FIG. 2 shows a configuration 9 obtainable by the method from FIG. 1 . Configuration 9 comprises a first component 2, which is connected to a connection element 6 via a plurality of nanowires 1 on a first connection region 7 on a first side 10 of the connection element 6. Configuration 9 further comprises a second component 3, which is connected to the connection element 6 via a plurality of nanowires 1 on a second connection region 8 on a second side 11 of the connection element 6 opposite the first side 10. For this purpose, the first component 2 and the second component 3 have a respective contact region 4, 5.

The first connection region 7 and the second connection region 8 are electrically insulated from each other. For this purpose, the connection element 6 is formed from a ceramic material at least in the region between the first connection region 7 and the second connection region 8, as a result of which a specific resistance of the connection element 6 at least in this region is at least 10 ¹⁰ Ωm. The connection element 6 has a film-like configuration. The thickness of the connection element 6 is at most 5 mm. The thickness of the connection element 6 can be identified in FIG. 2 as the extent of the connection element 6 in the vertical direction.

FIG. 3 shows a configuration 12 having a first component 2, a functional element 13, a second component 3, a first connection element 6 and a second connection element 14. The first component 2 is connected to a first connection region 7 of the first connection element 6 via a plurality of nanowires 1. The functional element 13 is connected to a second connection region 8 of the first connection element 6 via a plurality of nanowires 1 on a first side and to a first connection region 7 of the second connection element 14 via a plurality of nanowires 1 on a second side. The second component 3 is connected to a second connection region 8 of the second connection element 14 via a plurality of nanowires 1. The connection regions 7, 8 of the connection elements 6, 14 are each electrically insulated from one another. The configuration 12 shown in FIG. 3 can be produced by applying the method from FIG. 1 twice.

FIG4 shows an arrangement 15 with a first component 2, a second component 3, a third component 16 and a fourth component 17. The first component 2 is connected to a connection element 6 by a plurality of nanowires 1 on a first connection region 7 on a first side 10 of the connection element 6. The second component 3 is connected to the connection element 6 by a plurality of nanowires 1 on a second connection region 8 on a second side 11 of the connection element 6 opposite to the first side 10. The first connection region 7 and the second connection region 8 are electrically insulated from each other. The third component 16 is connected to the connection element 6 by a plurality of nanowires 1 on a third connection region 20 on the first side 10 of the connection element 6. The fourth component 17 is connected to the connection element 6 by a plurality of nanowires 1 on a fourth connection region 21 on the second side 11 of the connection element 6. The third connection area 20 and the fourth connection area 21 are connected to each other in a conductive manner. Also depicted are the respective contact areas 4, 5, 18, and 19 of components 2, 3, 16, and 17.

FIG. 5 shows a method for connecting a first contact region 102 to a second contact region 103. The reference symbols used are related to FIG. 6. The method comprises: a) providing a connection element 106 having a plurality of nanowires 101 on a first connection region 107 and on a second connection region 108, wherein the first connection region 107 and the second connection region 108 are arranged on the same side of the connection element 106, b) bringing the first contact region 102 together with the first connection region 107 of the connection element 106, and c) bringing the second contact region 103 together with the second connection region 108 of the connection element 106.

In step a), the connecting element 106 can be formed by cutting from the starting body 112 shown in FIG. 8 .

Steps b) and/or c) are preferably performed at room temperature. The method may further comprise the following optional step, which is indicated by a dashed box in FIG. 5 : d) heating at least the contact areas 102, 103 to a temperature of at least 150°C.

FIG. 6 shows a configuration 109 having a connection element 106 and a component 110. Component 110 has a first contact region 102 and a second contact region 103. The first contact region 102 is connected to a first connection region 107 of the connection element 106 via a plurality of nanowires 101. The second contact region 103 is connected to a second connection region 108 of the connection element 106 via a plurality of nanowires 101. The first connection region 107 and the second connection region 108 are arranged on the same side of the connection element 106. In the example shown in FIG. 6, it is the side of the connection element 106 that faces downward.

The first contact area 102 is disposed in the first area 104 of the component 110. The second contact area 103 is disposed in the second area 105 of the component 110.

The connection areas 107 and 108 are spaced apart from each other.

The nanowire 101 is connected to the connection element 106 via a layer 111. The layer 111 is formed between the first connection region 107 and the second connection region 108.

The layer 111 is electrically and thermally conductive. The nanowire 101 is formed from an electrically and thermally conductive material. In this regard, the contact areas 102, 103 are connected to each other in an electrically and thermally conductive manner.

FIG. 7 shows a view from below of the connection element 106 from FIG. 6 which can be used in the method from FIG. 5 . The layer 111 can be seen. FIG. 7 shows the situation before the connection is made, as a result of which the connection area has not yet been defined.

FIG. 8 shows a starting body 112 with a plurality of strips of a layer 111. These strips with nanowires 101 are spaced apart from strips without nanowires 101. The dashed lines indicate the manner in which the connecting element 106 can be obtained by cutting out from the preferably film-like starting body 112. The extent of the strips of the connecting element 106 along the layer 111 can be selected as required. The connecting element 106 can also be formed as more than one strip of the layer 111. A plurality of connecting elements 106 can be cut out from the starting body 112. The connecting element 106 depicted in dashed lines is a first connecting element which, in the example shown, is cut out at a corner. As an alternative, for example, the entire starting body 112 can also be used as a connecting element 106. The strips of layer 111 also need not be arranged in a regular manner, as in the embodiment shown. A regular pattern with different strip widths, with different spacing between adjacent strips, with different lengths of the strips (in the right-to-left direction in FIG. 8 ), and/or with different orientations of the strips is also possible.

FIG. 9 and FIG. 10 respectively show two embodiments of the connecting element 6 with a different configuration of the layer 111.

The connecting element 106 according to FIG. 9 comprises a strip of layer 111, the width of which decreases continuously. This connecting element 6 can be used in particular to connect a large contact area (on the left side of the connecting element 106) to a small contact area (on the right side).

The connection element 6 according to FIG. 10 comprises four strips of layer 111. The strips have different lengths. The connection element 106 can be used to form four connections accordingly, wherein the respective first contact area is arranged on a line and the respective second contact area is arranged on a line inclined to the line.

FIG. 11 shows a second configuration 109 of interconnected contact areas 102, 103. This configuration 109 differs from the configuration 109 from FIG. 6 in that the contact areas 2, 3 are not arranged on different areas 104, 105 of the component 110. Instead, the first contact area 102 is arranged on the first component 110 and the second contact area 103 is arranged on the second component 113. The two components 110, 113 are not arranged parallel to each other. By way of example, the two components form an angle of 90° to each other. Configurations at different angles are similarly possible. The features of the separate components 110, 113 and the features of the contact areas 102, 103 not being aligned parallel to each other are independent of each other. This means, for example, that the regions 104, 105 of the component 110 can also form an angle with respect to each other.

In FIG. 11 , the two components 110 and 113 form an angled arrangement, on the inner side of which the connecting element 106 is arranged. As an alternative, the connecting element 106 can also be arranged on the outer side of the angled arrangement. In FIG. 11 , the outer side of the angled arrangement is formed by the left side of the first component 110 and the bottom side of the second component 113.

Claims (13)

A method for connecting a first component to a second component, comprising: a) providing a connecting element having a plurality of individual nanowires on a first connecting region on a first side of the connecting element and on a second connecting region on a second side of the connecting element opposite the first side, wherein the first connecting region and the second connecting region are electrically insulated from each other, and wherein the connecting element is formed from a polymer, b) bringing together a contact region of the first component and the first connecting region of the connecting element, and c) bringing together a contact region of the second component and the second connecting region of the connecting element. The method as described in claim 1, wherein step b) and/or step c) is performed at room temperature. The method as described in any one of claims 1 to 2 further comprises: d) heating at least the contact areas to a temperature of at least 90°C. A method as claimed in claim 1, wherein in step b) and/or c), the connecting element, the first component and/or the second component are acted on by ultrasound. The method as claimed in claim 1, wherein the connection element provided in step a) also has a plurality of nanowires on a third connection region on the first side of the connection element and on a fourth connection region on the second side of the connection element, wherein the third connection region and the fourth connection region are connected to each other in a conductive manner, and wherein the method also includes the following steps: b') bringing a contact region of a third component together with the third connection region of the connection element, and c') bringing a contact region of a fourth component together with the fourth connection region of the connection element. A connecting element for connecting a first component to a second component, wherein the connecting element has a plurality of individual nanowires on a first connecting region on a first side of the connecting element and on a second connecting region on a second side of the connecting element opposite to the first side, and wherein the first connecting region and the second connecting region are electrically insulated from each other, and wherein the connecting element is formed from a polymer. A connecting element as described in claim 6, wherein the connecting element has a film-like configuration. A connecting element as described in claim 6 or 7, wherein one thickness of the connecting element is at most 5 mm. A connection element as claimed in claim 6, wherein a material of the connection element in the region between the first connection region and the second connection region has a specific resistance of at least 105Ωm at room temperature. A connecting element as described in claim 6, wherein the connecting element is formed of a ceramic material in the region between the first connecting region and the second connecting region. The connection element as described in claim 6 further comprises a plurality of nanowires on a third connection region on the first side of the connection element and on a fourth connection region on the second side of the connection element, wherein the third connection region and the fourth connection region are connected to each other in a conductive manner. A configuration having a connection element and a component, comprising: a first component connected to the connection element via a plurality of nanowires on a first connection region on a first side of the connection element, and a second component connected to the connection element via a plurality of nanowires on a second connection region on a second side of the connection element opposite to the first side, wherein the first connection region and the second connection region are electrically insulated from each other, and wherein the connection element is formed from a polymer. A configuration having a connection element and a component, comprising: a first component, a functional component, a second component, a first connection element, and a second connection element, wherein the first component is connected to a first connection region of the first connection element via a large number of nanowires, wherein the functional element is connected to a second connection region of the first connection element via a large number of nanowires on a first side, and is connected to a first connection region of the second connection element via a large number of nanowires on a second side, wherein the second component is connected to a second connection region of the second connection element via a large number of nanowires, wherein the first connection region and the second connection region of the first connection element are electrically insulated from each other, and wherein the first connection region and the second connection region of the second connection element are electrically insulated from each other.

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