TWI872063B - Method for manufacturing a third laminate, and method for manufacturing a fourth laminate - Google Patents

Abstract

The present invention relates to a method for manufacturing a third laminate, wherein one side of a workpiece (14) is a conductive surface (14a) and the other side is an inner surface (14b). The method for manufacturing the third laminate comprises: a first lamination step, attaching a film (13) for forming an inner surface protective film to the inner surface (14b) of the workpiece (14); and a second lamination step, attaching a support sheet (10) to the film (13) for forming the inner surface protective film; and Between the lamination step and the aforementioned second lamination step, the second lamination body having the inner surface protective film forming film (13) laminated on the workpiece (14) is transported piece by piece, so that the device for attaching the inner surface protective film forming film is connected to the device for attaching the support sheet to carry out the process from the aforementioned first lamination step to the aforementioned second lamination step, or the process from the aforementioned first lamination step to the aforementioned second lamination step is carried out in the same device.

Description

A method for manufacturing a third multilayer body and a method for manufacturing a fourth multilayer body

The present invention relates to a method for manufacturing a third multilayer body. Specifically, the present invention relates to a method for manufacturing a third multilayer body formed by sequentially stacking a workpiece such as a semiconductor wafer, a film for forming an inner surface protective film, and a support sheet.

This application claims priority based on Japanese Special Application No. 2019-086303 filed in Japan on April 26, 2019, and the contents of that application are incorporated herein.

In recent years, a so-called face-down method has been used to manufacture semiconductor devices. In the face-down method, a semiconductor chip having electrodes such as bumps on a conductive surface is used, and the electrodes are bonded to a substrate. Therefore, the inner surface of the semiconductor chip opposite to the conductive surface is sometimes exposed.

On the inner surface of the exposed semiconductor chip, a resin film containing an organic material is sometimes formed as an inner surface protective film, and the semiconductor chip with the inner surface protective film is assembled into a semiconductor device. The inner surface protective film is used to prevent cracks from occurring in the semiconductor chip after the dicing step or packaging (e.g., Patent Document 1, Patent Document 2).

Such a semiconductor chip with an inner surface protective film is manufactured, for example, through the steps shown in FIG. 9 . That is, the following method is known: a film 13 for forming an inner surface protective film is layered on the inner surface 8b of a semiconductor wafer 8 having a conductive surface (FIG. 9(A)), the film 13 for forming an inner surface protective film is thermally cured or energy-beam cured to form an inner surface protective film 13' (FIG. 9(B)), the inner surface protective film 13' is laser marked (FIG. 9(C)), a supporting sheet 10 is layered on the inner surface protective film 13' (FIG. 9(D)), the semiconductor wafer 8 and the inner surface protective film 13' are cut to form a semiconductor chip 7 with an inner surface protective film (FIG. 9(E) and FIG. 9(F)), and the semiconductor chip 7 with the inner surface protective film is picked up from the supporting sheet 10 (FIG. 9(G)). The order of the curing step and the laser marking step is arbitrary. The inner surface protective film forming film 13 may be laminated on the inner surface 8b of the semiconductor wafer 8 having the electrical path (FIG. 9(A)). After the inner surface protective film forming film 13 is laser marked, the inner surface protective film forming film 13 is thermally cured or energy-ray cured to form the inner surface protective film 13', and then the steps of FIG. 9(D) to FIG. 9(G) are performed. In FIG. 9(A), the first lamination step of laminating the inner surface protective film forming film 13 on the inner surface 8b of the semiconductor wafer 8 and the second lamination step of laminating the support sheet 10 on the inner surface protective film 13' in FIG. 9(D) were previously performed using different devices.

In addition, a composite sheet for forming a protective film in which the inner surface protective film forming film 13 and the supporting sheet 10 are integrated is also used for the manufacture of semiconductor chips with inner surface protective films (for example, Patent Document 2).

The method for manufacturing a semiconductor chip with an inner surface protective film using a protective film forming composite sheet is, for example, through the steps shown in FIG10. That is, the following method is known: the inner surface protective film forming film 13 (FIG. 10(A')) of the protective film forming composite sheet 1 formed by laminating the inner surface protective film forming film 13 and the support sheet 10 is attached to the inner surface 8b of the semiconductor wafer 8 having an electric path surface, the electric path protection tape 17 (FIG. 10(B')) is peeled off, and the inner surface protective film forming film 13 is heat-cured or energy-ray-cured to produce The inner protective film 13' (Figure 10 (C')), the inner protective film 13' is laser marked from the side of the support sheet 10 (Figure 10 (D')), the semiconductor wafer 8 and the inner protective film 13' are cut to form a semiconductor chip 7 with an inner protective film (Figure 10 (E') and Figure 10 (F')), and the semiconductor chip 7 with an inner protective film is picked up from the support sheet 10 (Figure 10 (G')). In this case, the order of the hardening step and the laser marking step is also arbitrary.

[Prior Art Literature]

[Patent Literature]

[Patent document 1] Japanese Patent No. 4271597.

[Patent Document 2] Japanese Patent Publication No. 5363662.

As described above, the first lamination step of laminating the inner surface protective film forming film 13 on the inner surface 8b of the semiconductor wafer 8 in FIG. 9(A) and the second lamination step of laminating the support sheet 10 on the inner surface protective film 13' in FIG. 9(D) were previously performed using different devices. The laminated body obtained by the aforementioned first lamination step is contained in a cassette and transported to the device for performing the second step by manual operation. The manual transportation reduces the production efficiency of semiconductor wafers with inner surface protective films.

Furthermore, sometimes the laminate obtained from the aforementioned first lamination step is contaminated or damaged during the period of being transported while being stored in the cassette.

In addition, in the previous method for manufacturing a semiconductor chip with a protective film shown in FIG. 10, since a protective film forming composite sheet 1 is used in which an inner surface protective film forming film 13 and a support sheet 10 are integrated, the step of attaching the inner surface protective film forming film 13 to a workpiece (i.e., semiconductor wafer 8) to be protected by the inner surface protective film forming film 13 and the step of attaching the support sheet 10 can be performed in one step. However, when using the protective film forming composite sheet 1, the characteristics of the inner surface protective film forming film 13 and the characteristics of the support sheet 10 must be combined in accordance with each other, and in order to realize the method for manufacturing a semiconductor chip with a protective film to achieve the desired purpose, a plurality of protective film forming composite sheets 1 must be prepared.

In addition, the composite sheet 1 for forming a protective film can be manufactured by laminating the inner surface protective film forming film 13 which has been punched into a predetermined size on the support sheet 10, punching the laminated body into the size of the cutting jig, and removing the useless parts. Unlike the method shown in FIG. 9 in which the inner surface protective film forming film 13 and the support sheet 10 are sequentially laminated on the hard semiconductor wafer 8, in the manufacture of the composite sheet 1 for forming a protective film, the inner surface protective film forming film 13 and the support sheet 10, which are soft, are bonded together, so there are problems of high difficulty, poor yield, and high manufacturing cost.

The present invention is made in view of the above situation, and its subject is to provide a method for manufacturing a third laminate, which can efficiently and at low cost manufacture a third laminate formed by sequentially stacking a workpiece such as a semiconductor wafer, a film for forming an inner surface protective film, and a support sheet.

The present invention provides the following method for manufacturing the third multilayer body.

[1] A method for manufacturing a third laminate, comprising laminating a workpiece, a film for forming an inner surface protective film, and a support sheet in sequence; wherein one side of the workpiece is a conductive surface, and the other side is an inner surface; the method for manufacturing the third laminate comprises: a first lamination step of attaching the film for forming an inner surface protective film to the inner surface of the workpiece; and a second lamination step of attaching the support sheet to the film for forming an inner surface protective film. sheet; between the aforementioned first lamination step and the aforementioned second lamination step, the second lamination body having the aforementioned inner surface protective film forming film laminated on the aforementioned workpiece is transported piece by piece; the device for attaching the inner surface protective film forming film is connected to the device for attaching the support sheet to perform the process from the aforementioned first lamination step to the aforementioned second lamination step, or the process from the aforementioned first lamination step to the aforementioned second lamination step is performed in the same device.

[2] A method for manufacturing a third laminate, comprising laminating a workpiece, a film for forming an inner surface protective film, and a support sheet in sequence; one side of the workpiece is a conductive surface, and the other side is an inner surface; the method for manufacturing the third laminate comprises: a first lamination step of attaching the film for forming an inner surface protective film to the inner surface of the workpiece; and a second lamination step of attaching the support sheet to the film for forming an inner surface protective film. ; The conveying distance of the workpiece from the starting point of the first lamination step to the ending point of the second lamination step is less than 7000 mm; the device for laminating the inner protective film forming film is connected to the device for laminating the support sheet to carry out the process from the first lamination step to the second lamination step, or the process from the first lamination step to the second lamination step is carried out in the same device.

[3] A method for manufacturing a third laminate, comprising laminating a workpiece, a film for forming an inner surface protective film, and a support sheet in sequence; one side of the workpiece is a conductive surface, and the other side is an inner surface; the method for manufacturing the third laminate comprises: a first lamination step, attaching the film for forming an inner surface protective film to the inner surface of the workpiece; and a second lamination step, attaching the film for forming an inner surface protective film to the inner surface protective film. Support sheet; the workpiece conveying time from the start of the first lamination step to the end of the second lamination step is less than 400 seconds; the device for laminating the inner protective film forming film is connected to the device for laminating the support sheet to carry out the process from the first lamination step to the second lamination step, or the process from the first lamination step to the second lamination step is carried out in the same device.

[4] The method for manufacturing the third laminate as described in [3], wherein the workpiece conveying time from the start of the bonding in the first bonding step to the end of the bonding in the second bonding step is less than 150 seconds.

According to the present invention, a method for manufacturing a third laminate is provided, which can efficiently and at low cost manufacture a third laminate formed by sequentially stacking a workpiece such as a semiconductor wafer, a film for forming an inner surface protective film, and a support sheet.

1: Composite sheet for forming protective film

5: First layer of body

6: Second layer

7: Semiconductor chip with inner protective film

8: Semiconductor wafers

8b: Inner surface of semiconductor wafer

9: Semiconductor chip

10: Support sheet

11: Base material

12: Adhesive layer

13: Film for forming inner protective film

13’: Inner protective film

13a: The exposed surface of the peeling film 151 formed by peeling off the film used for forming the inner protective film

13b: The exposed surface of the peeling film 152 formed by peeling off the film used for forming the inner protective film

14: Workpiece

14a: Electrical path of workpiece

14b: Inner surface of the workpiece

16: Adhesive layer for clamps

17: Electrical road surface protection tape

18: Fixing clamp

19: The third layer

19’: The fourth layer

20:Semiconductor devices

21: Semiconductor device with inner protective film

21’: Semiconductor device with film for forming inner surface protective film

62: Electronic parts

63: Circuit board

63a: Terminal forming surface

64: Sealing resin layer

151: First peeling membrane

152: Second peeling membrane

[Figure 1] is a schematic cross-sectional view schematically showing an example of an implementation form of a method for manufacturing a third multilayer body.

[Figure 2] is a schematic cross-sectional view showing an example of a film for forming an inner surface protective film.

[Figure 3] is a schematic cross-sectional view schematically showing another example of the implementation form of the manufacturing method of the third multilayer body.

[Figure 4] is a schematic cross-sectional view schematically showing an example of an implementation form of the manufacturing method of the fourth multilayer body.

[Figure 5] is a schematic cross-sectional view schematically showing another example of the implementation form of the manufacturing method of the fourth multilayer body.

[Figure 6] is a schematic cross-sectional view schematically showing an example of an implementation form of a method for manufacturing a semiconductor device with an inner surface protective film.

[Figure 7] is a schematic cross-sectional view schematically showing another example of an implementation form of a method for manufacturing a semiconductor device with an inner surface protective film.

[Figure 8] is a schematic cross-sectional view schematically showing another example of an implementation form of a method for manufacturing a semiconductor device with an inner surface protective film.

[Figure 9] is a schematic cross-sectional view schematically showing an example of a previous method for manufacturing a semiconductor chip with an inner surface protective film.

[Figure 10] is a schematic cross-sectional view schematically showing another example of a method for manufacturing a semiconductor chip with an inner surface protective film.

[Figure 11] is a schematic cross-sectional view showing an example of a support sheet 10 having an adhesive layer 12 provided on a substrate 11.

The following is a detailed description of the manufacturing method of the third multilayer body as an implementation form of the present invention. In addition, the drawings used in the following description sometimes enlarge the characteristic parts for the sake of convenience in order to facilitate the understanding of the characteristics, and the size ratio of each component is not limited to the same as the actual one.

[Manufacturing method of the third multilayer body]

FIG1 is a schematic cross-sectional view schematically showing an example of an implementation form of a method for manufacturing a third laminate. The method for manufacturing a third laminate of this implementation form is to manufacture a third laminate 19 formed by laminating a workpiece 14, a film 13 for forming an inner surface protective film, and a support sheet 10 in sequence, and one side of the workpiece 14 is a conductive surface 14a, and the other side is an inner surface 14b (FIG. 1(a)). The manufacturing method of the third laminate comprises: a first lamination step (FIG. 1(b)), attaching the film 13 for forming an inner surface protective film to the inner surface 14b of the workpiece 14; and a second lamination step (FIG. 1(d)), attaching the support sheet 10 to the film 13 for forming an inner surface protective film (FIG. 1(a) to FIG. 1(e)).

In this embodiment, the device for attaching the inner protective film forming film is connected to the device for attaching the support sheet to perform the process from the aforementioned first lamination step to the aforementioned second lamination step (Figure 1 (b) to Figure 1 (d)), or the process from the aforementioned first lamination step to the aforementioned second lamination step is performed in the same device.

Therefore, in this embodiment, the second laminated body in which the inner surface protective film forming film 13 is laminated on the workpiece 14 can be transported piece by piece to the second lamination step shown in FIG. 1(d) without being stored in a cassette between the aforementioned first lamination step and the aforementioned second lamination step. By performing the process in the same device, the device space can be further reduced. By connecting the device for attaching the inner surface protective film forming film and the device for attaching the support sheet to perform the process, even if the design is not started from scratch, it can be handled by modifying the previous device, which can reduce the initial cost. Furthermore, since the second multilayer body is not housed in a cassette but transported outside the device, production efficiency is improved and contamination and damage to the second multilayer body can be suppressed.

The process of connecting the device for attaching the inner surface protective film forming film to the device for attaching the support sheet to perform the process refers to the steps of connecting the device for attaching the inner surface protective film forming film to the device for attaching the support sheet and performing the first lamination step to the second lamination step, or performing the first lamination step to the second lamination step using a device that connects the device for attaching the inner surface protective film forming film to the device for attaching the support sheet.

The inner surface protective film forming film 13 used in the first lamination step can be processed into the shape of the workpiece in advance, or can be processed in the same device just before the first lamination step. When the size of the workpiece is fixed in the manufacturing line used, the former method of being able to process in advance is more efficient. When the size of the workpiece may change, the latter method will not waste the inner surface protective film forming film, which has cost advantages.

In addition, in another embodiment, the conveying distance of the workpiece 14 from the attachment starting point of the aforementioned first lamination step to the attachment ending point of the aforementioned second lamination step can be designed to be less than 7000 mm, which can reduce the device space. The conveying distance of the workpiece 14 from the attachment starting point of the aforementioned first lamination step to the attachment ending point of the aforementioned second lamination step can also be set to less than 6500 mm, can also be set to less than 6000 mm, can also be set to less than 4500 mm, can also be set to less than 3000 mm.

In addition, the conveying distance of the workpiece 14 from the attachment starting point of the aforementioned first lamination step to the attachment ending point of the aforementioned second lamination step can also be set to 200nm to 7000mm or less, or 200nm to 6000mm, or 200nm to 4500mm, or 200nm to 3000mm.

In this specification, the conveying distance of the workpiece 14 from the attachment starting point of the first lamination step to the attachment ending point of the second lamination step refers to the actual moving distance of the workpiece 14 from the attachment starting point of the first lamination step to the attachment ending point of the second lamination step.

In addition, in another embodiment, the conveying time of the workpiece 14 from the start of the attachment of the first lamination step to the end of the attachment of the second lamination step can be set to less than 400 seconds, or less than 150 seconds, which can shorten the step time. The conveying time of the workpiece 14 from the start of the attachment of the first lamination step to the end of the attachment of the second lamination step can also be set to less than 130 seconds, or less than 110 seconds, or less than 90 seconds, or less than 70 seconds.

The conveying time of the workpiece 14 from the start of the attachment of the aforementioned first lamination step to the end of the attachment of the aforementioned second lamination step can also be set to 15 seconds to 400 seconds, 15 seconds to 150 seconds, 15 seconds to 130 seconds, 15 seconds to 110 seconds, 15 seconds to 90 seconds, or 15 seconds to 70 seconds.

The transport time of the workpiece 14 from the start of the aforementioned first lamination step to the end of the aforementioned second lamination step is roughly divided into three times: the time consumed in the first lamination step, the transport time from the place where the first lamination step is performed to the place where the second lamination step is performed, and the time consumed in the second lamination step.

The time consumed by the aforementioned first accumulation step can be set to less than 40 seconds, or less than 15 seconds, which can shorten the step time. The time consumed by the aforementioned first accumulation step can also be set to less than 10 seconds, or less than 8 seconds.

In addition, the time consumed in the aforementioned first accumulation step can also be set to 3 seconds to 40 seconds, 3 seconds to 15 seconds, 3 seconds to 10 seconds, or 3 seconds to 8 seconds.

The transport time from the place where the first layering step is performed to the place where the second layering step is performed can be set to less than 200 seconds, or less than 75 seconds, which can shorten the step time. The transport time from the place where the first layering step is performed to the place where the second layering step is performed can also be set to less than 60 seconds, or less than 37 seconds.

In addition, the aforementioned transport time from the place where the first lamination step is performed to the place where the second lamination step is performed can also be set to 3 seconds to 200 seconds, can also be set to 3 seconds to 75 seconds, can also be set to 3 seconds to 60 seconds, can also be set to 3 seconds to 37 seconds.

The time consumed by the aforementioned second layering step can be set to less than 160 seconds, or less than 60 seconds, which can shorten the step time. The time consumed by the aforementioned second layering step can also be set to less than 40 seconds, or less than 25 seconds.

In addition, the time consumed in the aforementioned second accumulation step can also be set to 3 seconds to 160 seconds, 3 seconds to 60 seconds, 3 seconds to 40 seconds, or 3 seconds to 25 seconds.

The conveying distance of the aforementioned workpiece from the starting point of the attachment of the first lamination step of this embodiment shown in Figure 1(b) to the ending point of the attachment of the second lamination step shown in Figure 1(d) can be set to less than 7000mm, or less than 6500mm, or less than 6000mm, or less than 4500mm, or less than 3000mm. The conveying time of the aforementioned workpiece from the start of the lamination of the first lamination step of the present embodiment shown in FIG1(b) to the end of the lamination of the second lamination step shown in FIG1(d) can be set to less than 400 seconds, or less than 150 seconds, or less than 130 seconds, or less than 110 seconds, or less than 90 seconds, or less than 70 seconds.

The manufacturing method of the third multilayer body of this embodiment can connect the device for attaching the film for forming the inner surface protective film and the device for attaching the support sheet to carry out the process, or carry out the process in the same device.

As the same device, for example, it can be implemented by a device equipped with a film attaching workbench for forming an inner surface protective film, a support sheet attaching workbench, and a conveying arm.

Specifically, the workpiece 14 put into the above-mentioned device is conveyed to the inner surface protective film forming film attaching workbench by the conveying arm, and is set with the inner surface 14b facing upward. In the inner surface protective film forming film attaching workbench, the inner surface protective film forming film 13 processed in advance outside the device or in the device immediately before attaching to the size corresponding to the workpiece 14 is attached to the inner surface 14b side of the above-mentioned workpiece 14 to form a second laminate. The second laminate is conveyed to the above-mentioned support sheet attaching workbench by the conveying arm, and is set with the inner surface protective film forming film side facing upward. In the support sheet attaching workbench, the support sheet 10 is attached to the inner surface protective film forming film 13 of the above-mentioned second laminate to form a third laminate.

The speed of attaching the protective film forming film 13 to the inner side of the workpiece 14 in the first lamination step and the speed of attaching the supporting sheet 10 to the protective film forming film 13 in the second lamination step can also be set to 100 mm/s or less, or 80 mm/s or less, or 60 mm/s or less, or 40 mm/s or less. By setting the aforementioned attaching speed in the first lamination step and the aforementioned attaching speed in the second lamination step to be below the aforementioned upper limit value, the adhesion between the workpiece 14 and the protective film forming film 13 and the adhesion between the protective film forming film 13 and the supporting sheet 10 can be good.

The speed of the aforementioned attachment in the first lamination step and the speed of the aforementioned attachment in the second lamination step can also be set to 2 mm/s or more, 5 mm/s or more, or 10 mm/s or more. By setting the speed of the aforementioned attachment in the first lamination step and the speed of the aforementioned attachment in the second lamination step to be above the aforementioned lower limit, the production efficiency of the third lamination body 19 can be improved, and the conveying time of the workpiece 14 from the start of attachment in the first lamination step to the end of attachment in the second lamination step can be set to less than 400 seconds.

The aforementioned attaching speed in the first lamination step and the aforementioned attaching speed in the second lamination step can also be set to 2mm/s to 100mm/s, 2mm/s to 80mm/s, 5mm/s to 60mm/s, or 10mm/s to 40mm/s.

The aforementioned device preferably has 1 to 5 film-attaching workbenches for forming an inner surface protective film, and more preferably has 1 to 3 film-attaching workbenches for forming an inner surface protective film. If the number of film-attaching workbenches for forming an inner surface protective film in the device is greater than the lower limit of the aforementioned range, the production efficiency is improved. If the number of film-attaching workbenches for forming an inner surface protective film in the device is less than the upper limit of the aforementioned range, the space of the device can be reduced.

The aforementioned device preferably has 1 to 5 support sheet attaching workbenches, and more preferably has 1 to 3 support sheet attaching workbenches. If the number of support sheet attaching workbenches in the device is greater than the lower limit of the aforementioned range, the production efficiency is improved, and if the number of support sheet attaching workbenches in the device is less than the upper limit of the aforementioned range, the space of the device can be reduced.

The aforementioned device is preferably equipped with a transport arm corresponding to each transport path. If the ratio of the number of transport arms to the total number of workbenches is set to 1 or more, the production efficiency can be improved. In addition, when there are more than two workbenches, if the ratio of the number of transport arms to the total number of workbenches is set to more than 0 and less than 1 (for example, the total number of transport arms is 1 for two workbenches), the space of the device can be reduced.

As a specific example of the process of connecting the device for attaching the inner surface protective film forming film and the device for attaching the support sheet, it can be cited that: a device having a mechanism for attaching the inner surface protective film forming film and a device having a mechanism for attaching the support sheet are connected, and between each mechanism, a conveying arm is used to convey the second laminated body with the inner surface protective film forming film 13 attached to the workpiece 14 piece by piece.

In this embodiment, a semiconductor wafer is used as the workpiece 14 shown in FIG. 1(a). One side of the semiconductor wafer is a conductive surface 14a, on which bumps are formed. In addition, in order to prevent the conductive surface 14a and bumps of the semiconductor wafer from being crushed when the inner surface of the semiconductor wafer is ground, or to prevent dimples or cracks from being generated in the inner surface of the wafer, the conductive surface 14a and bumps of the semiconductor wafer can also be protected by a conductive surface protection tape 17. The conductive surface protection tape 17 is a tape for inner surface grinding, and the inner surface of the semiconductor wafer as the workpiece 14 (that is, the inner surface 14b of the workpiece) can also be a ground surface.

The workpiece 14 is not limited as long as it has an electric surface 14a on one side and the other side can be called an inner surface. The workpiece 14 may be exemplified by the following workpieces: a semiconductor wafer having an electric surface on one side; or a semiconductor device panel, which is composed of a semiconductor device assembly with terminals, wherein the semiconductor device assembly with terminals is formed by sealing each electronic component that has been singulated with a sealing resin, and has a terminal forming surface (in other words, an electric surface) of a semiconductor device with terminals on one side.

As the electrical pavement protection tape 17, for example, the surface protection sheet disclosed in Japanese Patent Publication No. 2016-192488 and Japanese Patent Publication No. 2009-141265 can be used. The electrical pavement protection tape 17 has an adhesive layer with moderate releasability. The adhesive layer can also be formed by a common weak adhesive such as rubber, acrylic resin, silicone resin, urethane resin, vinyl ether resin, etc. In addition, the adhesive layer can also be an energy-ray-hardening adhesive that is hardened by irradiation with energy rays to become releasable. The electrical surface protection tape 17 is in the shape of a double-sided tape, and the outer side of the electrical surface protection tape 17 can also be fixed to a hard support body, and the workpiece 14 can also be fixed to a hard support body.

In this specification, the so-called "energy rays" refer to radiation with energy quanta in electromagnetic waves or charged particle beams. Examples of energy rays include ultraviolet rays, radiation, electron beams, etc. Ultraviolet rays can be irradiated by using, for example, high-pressure mercury lamps, fusion lamps, xenon lamps, black light lamps, or LED (Light Emitting Diode) lamps as ultraviolet ray sources. As for electron beams, electron beams generated by electron beam accelerators can be irradiated.

In addition, in this manual, the so-called "energy ray curing property" refers to the property of curing by irradiation with energy rays, and the so-called "non-energy ray curing property" refers to the property of not curing even if irradiated with energy rays.

In the first lamination step of the present embodiment shown in FIG. 1(b), the inner surface protective film forming film 13 can be used as the first lamination body 5 shown in FIG. 2. The first lamination body 5 shown in FIG. 2 has a first release film 151 on one surface of the inner surface protective film forming film 13 and a second release film 152 on the other surface. After the first release film 151 is peeled off, in the first lamination step, the exposed surface 13a (FIG. 1(b)) obtained by peeling off the release film of the inner surface protective film forming film 13 is attached to the inner surface 14b of the workpiece 14 in a facing manner. At this time, the inner surface protective film forming film 13 can be a processed product that has been processed in advance according to the shape of the workpiece 14, or it can be processed in the device just before lamination. Then, it is preferred to peel off the second peeling film 152 to form a second laminate (Figure 1 (c)).

The inner surface protective film forming film shown in FIG2 is formed by coating a protective film forming composition containing a solvent on the release surface of the second release film 152 having a thickness of 10 μm to 100 μm by a blade coater, and then drying the film in an oven at 120° C. for 2 minutes. Then, the release surface of the first release film 151 having a thickness of 10 μm to 100 μm can be overlapped on the inner surface protective film forming film and the two can be bonded together to obtain a first laminate 5 consisting of the first release film 151, the inner surface protective film forming film (the inner surface protective film forming film 13 in FIG2) (thickness: 3 μm to 50 μm), and the second release film 152. This first laminate 5 is suitable for being made into a roll shape and stored, for example.

In the second lamination step shown in FIG. 1( d ), a support sheet 10 is laminated on the inner surface protective film forming film 13 laminated on the inner surface 14b of the workpiece 14 . The support sheet 10 is, for example, a circular polyethylene terephthalate film with a thickness of 80 μm and a diameter of 270 mm, and may also have a clamp adhesive layer 16 on the outer periphery. In this embodiment, the workpiece 14 may also be fixed to a fixing clamp 18 together with the inner surface protective film forming film 13 . In addition, the support sheet 10 may also be laminated on the inner surface protective film forming film 13 and fixed to the fixing clamp 18 via the clamp adhesive layer 16 ( FIG. 1( e ) ).

[Protective film forming composition]

The protective film forming composition used to form the inner protective film forming film preferably contains an adhesive polymer component and a curing component.

[Adhesive polymer component]

In order to give sufficient adhesion and film-forming properties (sheet-forming properties) to the film for forming the inner surface protective film, an adhesive polymer component can be used. As the adhesive polymer component, previously known acrylic resins, polyester resins, urethane resins, acrylic urethane resins, silicone resins, rubber polymers, etc. can be used.

The weight average molecular weight (Mw) of the binder polymer component is preferably 10,000 to 2,000,000, and more preferably 100,000 to 1,200,000. If the weight average molecular weight of the binder polymer component is too low, the adhesion between the inner protective film forming film and the support sheet becomes high, sometimes causing poor transfer of the inner protective film forming film. If the weight average molecular weight of the binder polymer component is too high, the adhesion of the inner protective film forming film is reduced, sometimes failing to transfer to a chip, etc., or the inner protective film peels off from the chip, etc. after transfer.

That is, if Mw is above the lower limit of the aforementioned range, the adhesion between the inner protective film forming film and the support sheet will not become too high, and the transfer failure of the inner protective film forming film can be suppressed. If Mw is below the upper limit of the aforementioned range, the decrease in the adhesion of the inner protective film forming film is suppressed, and the following undesirable conditions are suppressed: the film cannot be transferred to the chip, etc., or the inner protective film is peeled off from the chip, etc. after transfer.

Furthermore, in this embodiment, the weight average molecular weight (Mw) is a polystyrene conversion value measured by GPC (Gel Permeation Chromatography) unless otherwise specified.

As the adhesive polymer component, acrylic resin can be preferably used. The glass transition temperature (Tg) of acrylic resin is preferably in the range of -60°C to 50°C, particularly preferably in the range of -50°C to 40°C, and even more preferably in the range of -40°C to 30°C. If the glass transition temperature of acrylic resin is too low, the peeling force between the inner surface protective film forming film and the support sheet becomes larger, sometimes causing poor transfer of the inner surface protective film forming film. If the glass transition temperature of acrylic resin is too high, the adhesion of the inner surface protective film forming film is reduced, sometimes failing to transfer to a chip, etc., or the inner surface protective film is peeled off from the chip, etc. after transfer.

That is, if Tg is above the lower limit of the aforementioned range, the peeling force between the inner protective film forming film and the support sheet will not become too large, and the transfer failure of the inner protective film forming film can be suppressed. If Tg is below the upper limit of the aforementioned range, the decrease in the adhesion of the inner protective film forming film is suppressed, and the following undesirable conditions are suppressed: the film cannot be transferred to the chip, etc., or the inner protective film is peeled off from the chip, etc. after transfer.

In this manual, the so-called "glass transition temperature" is the temperature of the inflection point of the DSC curve obtained by measuring the DSC (Differential Scanning Calorimetry) curve of the sample using a differential scanning calorimeter.

As the monomer constituting the above-mentioned acrylic resin, there can be listed (meth)acrylate monomers or derivatives thereof. For example, there can be listed (meth)acrylate alkyl esters having an alkyl group with a carbon number of 1 to 18, specifically, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, etc. In addition, there can be listed (meth)acrylates having a cyclic skeleton, specifically, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, imide (meth)acrylate, etc. Furthermore, as monomers having functional groups, there can be listed: hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, etc. having hydroxyl groups; in addition, there can be listed glycidyl (meth)acrylate, etc. having epoxy groups. As acrylic resins, acrylic resins containing monomers having hydroxyl groups are preferably compatible with the curing components described later. In addition, the above-mentioned acrylic resins can also be copolymerized with acrylic acid, methacrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, etc.

Furthermore, in this specification, the term "(meth)acrylic acid" includes both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth)acrylic acid, for example, "(meth)acrylate" includes both "acrylate" and "methacrylate", and "(meth)acryl" includes both "acryl" and "methacryl".

Furthermore, as the adhesive polymer component, a thermoplastic resin may be formulated in order to maintain the flexibility of the protective film after hardening. As such a thermoplastic resin, the weight average molecular weight is preferably 1,000 to 100,000, and particularly preferably 3,000 to 80,000. The glass transition temperature of the thermoplastic resin is preferably -30°C to 120°C, and particularly preferably -20°C to 120°C. Examples of thermoplastic resins include polyester resins, urethane resins, phenoxy resins, polybutene, polybutadiene, polystyrene, and the like. These thermoplastic resins may be used alone or in combination of two or more. By containing the above-mentioned thermoplastic resin, the film for forming the inner surface protective film can follow the transfer surface of the film for forming the inner surface protective film and suppress the generation of voids, etc.

[Hardening ingredients]

The curing component may be a thermosetting component and/or an energy ray curing component.

As the thermosetting component, a thermosetting resin and a thermosetting agent can be used. As the thermosetting resin, for example, epoxy resin is preferred.

As the epoxy resin, any previously known epoxy resin can be used. Specific examples of epoxy resins include: multifunctional epoxy resins, biphenyl compounds, bisphenol A diglycidyl ether or its hydrogenated product, o-cresol novolac epoxy resin, dicyclopentadiene epoxy resin, biphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, or phenylene skeleton epoxy resin, which are epoxy compounds having two or more functional groups in the molecule. These epoxy resins can be used alone or in combination of two or more.

The inner protective film forming film preferably contains 1 to 1000 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass of a thermosetting resin relative to 100 parts by mass of the adhesive polymer component. If the content of the thermosetting resin is less than 1 part by mass, sufficient adhesion may not be obtained. If the content of the thermosetting resin exceeds 1000 parts by mass, the peeling force between the inner protective film forming film and the adhesive sheet or substrate film becomes high, which may cause poor transfer of the inner protective film forming film.

That is, if the content of the thermosetting resin is above the lower limit of the aforementioned range, sufficient adhesion can be obtained. If the content of the thermosetting resin is below the upper limit of the aforementioned range, the peeling force between the inner surface protective film forming film and the adhesive sheet or base film will not become too high, thereby suppressing the transfer failure of the inner surface protective film forming film.

Thermosetting agents function as hardeners for thermosetting resins, especially epoxy resins. As preferred thermosetting agents, compounds having two or more functional groups that can react with epoxy groups in one molecule can be listed. As the functional groups, phenolic hydroxyl groups, alcoholic hydroxyl groups, amino groups, carboxyl groups, and acid anhydrides can be listed. Among these, phenolic hydroxyl groups, amino groups, acid anhydrides, etc. can be listed as preferred, and phenolic hydroxyl groups and amino groups can be listed as particularly preferred.

Specific examples of phenolic hardeners include: multifunctional phenolic resins, biphenol, novolac-type phenolic resins, dicyclopentadiene-type phenolic resins, new phenolic (Xylok)-type phenolic resins, and aralkylphenolic resins. Specific examples of amine-based hardeners include DICY (Dicyandiamide). These hardeners can be used alone or in combination of two or more.

The content of the thermosetting agent is preferably 0.1 to 500 parts by mass, and more preferably 1 to 200 parts by mass, relative to 100 parts by mass of the thermosetting resin. If the content of the thermosetting agent is too little, sometimes adhesion cannot be obtained due to insufficient hardening. If the content of the thermosetting agent is excessive, sometimes the moisture absorption rate of the film used to form the inner surface protective film becomes high, which reduces the reliability of the semiconductor device.

That is, if the content of the thermosetting agent is above the lower limit of the aforementioned range, insufficient curing is unlikely to occur, and adhesion is easily obtained. If the content of the thermosetting agent is below the upper limit of the aforementioned range, the moisture absorption rate of the film used for forming the inner surface protective film will not increase, and the reliability of the semiconductor device will not be reduced.

As the energy ray curable component, a low molecular compound (energy ray polymerizable compound) containing an energy ray polymerizable group that polymerizes and cures when irradiated with energy rays such as ultraviolet rays or electron beams can be used. Specific examples of such energy ray curable components include trihydroxymethylpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxy pentaacrylate, dipentaerythritol hexaacrylate, or 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate oligomer, epoxy-modified acrylate, polyether acrylate, and itaconic acid oligomer. Such a compound has at least one polymerizable double bond in the molecule, and generally has a weight average molecular weight of 100 to 30,000, preferably about 300 to 10,000. Relative to 100 parts by mass of the adhesive polymer component, the amount of the energy ray polymerizable compound is preferably 1 part by mass to 1500 parts by mass, more preferably 10 parts by mass to 500 parts by mass, and even more preferably 20 parts by mass to 200 parts by mass.

In addition, as an energy ray-hardening component, an energy ray-hardening polymer having an energy ray-polymerizing group bonded to the main chain or side chain of the binder polymer component can also be used. This energy ray-hardening polymer has both the function of a binder polymer component and the function of a hardening component.

The main skeleton of the energy-ray-hardening polymer is not particularly limited. It can be a common acrylic resin used as an adhesive polymer component, or a polyester resin, a polyether resin, etc. In terms of ease of synthesis and control of physical properties, it is particularly preferred to use acrylic resin as the main skeleton.

The energy ray polymerizable group bonded to the main chain or side chain of the energy ray curing polymer is, for example, a group containing an energy ray polymerizable carbon-carbon double bond, and specifically, a (meth)acryloyl group or the like can be exemplified. The energy ray polymerizable group can also be bonded to the energy ray curing polymer via an alkylene group, an alkoxyene group, or a polyalkoxyene group.

The weight average molecular weight (Mw) of the energy ray-curing polymer bonded with an energy ray polymerizable group is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000. In addition, the glass transition temperature (Tg) of the energy ray-curing polymer is preferably in the range of -60°C to 50°C, particularly preferably in the range of -50°C to 40°C, and even more preferably in the range of -40°C to 30°C.

Energy ray-curable polymers are obtained by reacting an acrylic resin containing functional groups such as hydroxyl, carboxyl, amine, substituted amine, and epoxy with a compound containing a polymerizable group. The compound containing a polymerizable group has 1 to 5 substituents that react with the aforementioned functional groups and energy ray-polymerizable carbon-carbon double bonds per molecule. The substituents that react with the aforementioned functional groups include: isocyanate group, glycidyl group, carboxyl group, etc.

Examples of compounds containing polymerizable groups include: (meth)acryloyloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate, (meth)acryloyl isocyanate, allyl isocyanate, (meth)glycidyl (meth)acrylate, (meth)acrylic acid, etc.

The acrylic resin is preferably a copolymer as follows, which is composed of a (meth)acrylic acid monomer or its derivative having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, an epoxy group, etc. and other (meth)acrylate monomers or their derivatives that can be copolymerized with the (meth)acrylic acid monomer or its derivative.

Examples of (meth)acrylic acid monomers or their derivatives having functional groups such as hydroxyl, carboxyl, amino, substituted amino, and epoxy groups include: 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate having hydroxyl groups; acrylic acid, methacrylic acid, and itaconic acid having carboxyl groups; and glycidyl methacrylate and glycidyl acrylate having epoxy groups.

As other (meth)acrylate monomers or their derivatives that can be copolymerized with the above-mentioned monomers, for example, (meth)acrylate alkyl esters with an alkyl group having a carbon number of 1 to 18 can be listed, specifically: methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, etc.; (meth)acrylates with a cyclic skeleton can be listed, specifically: cyclohexyl (meth)acrylate, benzyl (meth)acrylate, isobornyl acrylate, dicyclopentyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, imide acrylate, etc. In addition, vinyl acetate, acrylonitrile, styrene, etc. can also be copolymerized with the above-mentioned acrylic resin.

When using energy ray curing polymers, the aforementioned energy ray polymerizable compounds may also be used in combination, and adhesive polymer components may also be used in combination. Regarding the relationship between the proportions of these three in the inner surface protective film forming film of the present invention, the energy ray polymerizable compound is preferably contained in an amount of 1 to 1500 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass, relative to 100 parts by mass of the sum of the mass of the energy ray curing polymer and the adhesive polymer component.

By giving the inner surface protective film forming film energy ray curing properties, the inner surface protective film forming film can be easily cured in a short time, and the production efficiency of chips with protective films is improved. Previously, protective films for chips were usually formed by thermosetting resins such as epoxy resins, but the curing temperature of thermosetting resins needs to be more than 200°C, and the curing time requires about 2 hours, which hinders the improvement of production efficiency. However, the inner surface protective film forming film with energy ray curing properties is cured in a short time by energy ray irradiation, so the protective film can be easily formed, which can help improve production efficiency.

The film for forming the inner surface protective film may contain the following components in addition to the above-mentioned binder polymer component and curing component.

[Colorant]

The film for forming the inner surface protective film preferably contains a colorant. By mixing the colorant in the film for forming the inner surface protective film, when the semiconductor device is assembled into a machine, infrared rays generated by surrounding devices can be shielded to prevent malfunction of the semiconductor device caused by these infrared rays. In addition, when the protective film obtained by curing the film for forming the inner surface protective film is printed with a product number, the visibility of the text is improved. That is, for semiconductor devices or semiconductor chips formed with a protective film, product numbers and the like are usually printed on the surface of the protective film by laser marking (a method of printing by scraping the surface of the protective film with laser light). Since the protective film contains a colorant, the contrast difference between the portion of the protective film scraped by the laser light and the portion not scraped can be fully obtained, thereby improving visibility. As a colorant, organic or inorganic pigments and dyes can be used. Among these, black pigments are preferred in terms of electromagnetic wave or infrared shielding properties. As black pigments, carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, etc. can be used, but are not limited to these. From the perspective of improving the reliability of semiconductor devices, carbon black is particularly preferred. The coloring agent may be used alone or in combination of two or more. When the permeability of ultraviolet light is reduced by using a coloring agent that reduces the permeability of visible light and/or both infrared and ultraviolet light, the high curability of the film for forming the inner surface protective film of the present invention can be particularly well exerted. As a coloring agent that reduces the permeability of visible light and/or both infrared and ultraviolet light, in addition to the above-mentioned black pigment, there is no particular limitation as long as it has absorptivity or reflectivity in the wavelength region of visible light and/or both infrared and ultraviolet light.

The amount of the colorant to be formulated is preferably 0.1 to 35 parts by mass, particularly preferably 0.5 to 25 parts by mass, and even more preferably 1 to 15 parts by mass, relative to 100 parts by mass of the total solid content of the film constituting the inner protective film.

[Hardening accelerator]

The curing accelerator is used to adjust the curing speed of the film used to form the inner surface protective film. The curing accelerator is particularly preferably used when epoxy resin and thermosetting agent are used together in the curing component.

As preferred hardening accelerators, there are: tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol; imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine; tetraphenylborates such as tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, etc. These hardening accelerators can be used alone or in combination of two or more.

The curing accelerator is preferably contained in an amount of 0.01 to 10 parts by mass, and particularly preferably 0.1 to 1 part by mass, relative to 100 parts by mass of the curing component. By containing the curing accelerator in the above range, excellent adhesion characteristics can be achieved even when exposed to high temperature and high humidity, and high reliability can be achieved even when exposed to severe reflow conditions. If the content of the curing accelerator is small, sufficient adhesion characteristics cannot be obtained due to insufficient curing. If the content of the curing accelerator is excessive, the curing accelerator with high polarity moves to the bonding interface side in the film for forming the inner surface protective film under high temperature and high humidity, causing segregation, resulting in reduced reliability of the semiconductor device.

[Coupling agent]

The coupling agent can also be used to improve the adhesion, tightness and/or cohesion of the inner surface protective film forming film to the chip. In addition, by using a coupling agent, the heat resistance of the protective film obtained by curing the inner surface protective film forming film can be improved without damaging the heat resistance of the protective film, thereby improving the water resistance of the protective film.

As the coupling agent, a compound containing a group reactive with a functional group possessed by the polymer component of the adhesive, the curing component, etc. can be preferably used. As the coupling agent, a silane coupling agent is more preferable. Examples of such coupling agents include: γ-glycidyloxypropyl trimethoxysilane, γ-glycidyloxypropyl methyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyl trimethoxysilane, γ-(methacryloyloxypropyl)trimethoxysilane, γ-aminopropyl trimethoxysilane, N-6-(aminoethyl)-γ-aminopropyl trimethoxysilane, N-6-(aminoethyl)- γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-butylpropyltrimethoxysilane, γ-butylpropylmethyldimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfide, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane, etc. These coupling agents can be used alone or in combination of two or more.

The coupling agent is generally contained in a ratio of 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, and more preferably 0.3 to 5 parts by mass, relative to 100 parts by mass of the total of the adhesive polymer component and the curing component. If the content of the coupling agent is less than 0.1 parts by mass, the above-mentioned effect may not be obtained, and if the content of the coupling agent exceeds 20 parts by mass, outgassing may occur.

That is, if the content of the coupling agent is above the lower limit of the above range, the effect of the coupling agent can be obtained, and if the content of the coupling agent is below the upper limit, outgassing is suppressed.

[Inorganic fillers]

By adding inorganic fillers to the film used to form the inner protective film, the thermal expansion coefficient of the protective film after curing can be adjusted. By optimizing the thermal expansion coefficient of the protective film after curing the semiconductor chip, the reliability of the semiconductor device can be improved. In addition, the moisture absorption rate of the protective film after curing can also be reduced.

Preferred inorganic fillers include: powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, etc., beads obtained by sphericalizing these powders, single crystal fibers, and glass fibers. Among these inorganic fillers, silica fillers and alumina fillers are preferred. The above-mentioned inorganic fillers can be used alone or in combination of two or more. The content of the inorganic filler can usually be adjusted within the range of 1 to 80 parts by mass relative to 100 parts by mass of the total solids constituting the film for forming the inner surface protective film.

[Photopolymerization initiator]

When the film for forming the inner protective film contains an energy ray-curable component as the aforementioned curable component, the energy ray-curable component is cured by irradiating energy rays such as ultraviolet rays during use. At this time, by including a photopolymerization initiator in the aforementioned composition, the polymerization curing time and the amount of light irradiation can be reduced.

Specific examples of such photopolymerization initiators include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin benzoic acid methyl ester, benzoin dimethyl ketal, 2,4-diethylthiothionone, α-hydroxycyclohexylphenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzoyl, dibenzoyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone, 2,4,6-trimethylbenzyldiphenylphosphine oxide, and β-chloroanthraquinone. The photopolymerization initiators may be used alone or in combination of two or more.

Regarding the mixing ratio of the photopolymerization initiator, it is preferably 0.1 to 10 parts by mass, and more preferably 1 to 5 parts by mass, relative to 100 parts by mass of the energy ray curable component. If it is less than 0.1 parts by mass, satisfactory transfer properties may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, residues that do not contribute to photopolymerization may be generated, and the curability of the film for forming the inner protective film may become insufficient.

That is, if the mixing ratio of the photopolymerization initiator is above the lower limit of the aforementioned range, the photopolymerization proceeds sufficiently and satisfactory transfer properties can be obtained. If the mixing ratio of the photopolymerization initiator is below the upper limit of the aforementioned range, the generation of residues that do not contribute to the photopolymerization is suppressed and the curing property of the film for forming the inner protective film becomes sufficient.

[Crosslinking agent]

In order to adjust the initial adhesion and cohesion of the film used to form the inner protective film, a crosslinking agent may also be added. Examples of the crosslinking agent include organic polyisocyanate compounds, organic polyimide compounds, etc.

Examples of the above-mentioned organic polyisocyanate compounds include aromatic polyisocyanate compounds, aliphatic polyisocyanate compounds, alicyclic polyisocyanate compounds, trimers of these organic polyisocyanate compounds, and terminal isocyanate urethane prepolymers obtained by reacting these organic polyisocyanate compounds with polyol compounds.

Examples of organic polyisocyanate compounds include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, trihydroxymethylpropane addition toluene diisocyanate, and lysine isocyanate.

As the above-mentioned organic polyimide compounds, there can be listed: N,N'-diphenylmethane-4,4'-bis(1-aziridine carboxylamide), trihydroxymethylpropane-tri-β-aziridine propionate, tetrahydroxymethylmethane-tri-β-aziridine propionate and N,N'-toluene-2,4-bis(1-aziridine carboxylamide) triethyl melamine, etc.

The crosslinking agent is generally used in a ratio of 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, relative to 100 parts by mass of the total amount of the adhesive polymer component and the energy ray-hardening polymer.

[Universal additives]

In addition to the above-mentioned components, various additives can be formulated as needed for the film used to form the inner protective film. As various additives, there are: leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, degassing agents, chain transfer agents, etc.

[Solvent]

The protective film forming composition preferably further contains a solvent. The protective film forming composition containing a solvent has better operability.

The aforementioned solvent is not particularly limited. Preferred solvents include, for example, hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutanol (2-methylpropane-1-ol), and 1-butanol; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides (compounds having amide bonds) such as dimethylformamide and N-methylpyrrolidone, etc.

The protective film forming composition may contain only one solvent or two or more solvents. In the case of two or more solvents, the combination and ratio of these solvents can be selected arbitrarily.

In terms of being able to more evenly mix the components contained in the protective film forming composition, the solvent contained in the protective film forming composition is preferably methyl ethyl ketone or the like.

The inner surface protective film forming film obtained by applying and drying the protective film forming composition composed of the above-mentioned components has adhesiveness and curability, and can be easily bonded to the workpiece (semiconductor wafer or chip, etc.) by pressing in the uncured state. The inner surface protective film forming film can also be heated during pressing. Moreover, it can finally form a protective film with high impact resistance after curing, and the bonding strength is also excellent, and it can maintain sufficient protective function under severe high temperature and high humidity conditions. Furthermore, the inner surface protective film forming film can be a single-layer structure. In addition, as long as it contains more than one layer containing the above-mentioned components, it can also be a multi-layer structure.

The ratio of the contents of the components that do not vaporize at room temperature in the inner protective film forming film is the same as the ratio of the contents of the components mentioned above in the protective film forming composition. In addition, in this specification, the so-called "normal temperature" refers to a temperature that is not particularly cold or hot, that is, a normal temperature, for example, a temperature of 15°C to 25°C.

The coating of the protective film forming composition can be carried out by a known method, for example, methods using various coating machines such as an air knife coater, a doctor blade coater, a rod coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a blade coater, a screen coater, a Mayer rod coater, and a light touch coater.

The drying conditions of the protective film forming composition are not particularly limited. When the protective film forming composition contains a solvent described below, it is preferably dried by heating. The protective film forming composition containing a solvent is preferably dried at 70°C to 130°C for 10 seconds to 5 minutes.

The thickness of the film used to form the inner protective film is not particularly limited, but is preferably 3 μm to 300 μm, particularly preferably 5 μm to 250 μm, and even more preferably 7 μm to 200 μm.

In this manual, the so-called "thickness" refers to the thickness of five randomly selected locations in the cross-section obtained by randomly cutting the object in the thickness direction, measured using a contact thickness gauge, and expressed as the average thickness of the five locations.

[Support sheet]

The supporting sheet 10 used in one aspect of the present invention may be a sheet consisting only of a substrate 11 or an adhesive sheet having an adhesive layer 12 on the substrate 11.

The supporting sheet of the third laminate of one aspect of the present invention plays the role of a peeling sheet for preventing dust and the like from adhering to the surface of the film for forming the inner surface protective film, or a cutting sheet for protecting the surface of the film for forming the inner surface protective film in the cutting step, etc.

The thickness of the support sheet can be appropriately selected according to the application. From the perspective of providing sufficient flexibility and good adhesion to the silicon wafer, the thickness is preferably 10μm to 500μm, more preferably 20μm to 350μm, and particularly preferably 30μm to 200μm.

Furthermore, the thickness of the above-mentioned support sheet not only refers to the thickness of the substrate constituting the support sheet, but also includes the thickness of these layers or films when there is an adhesive layer.

[Base material]

The substrate 11 constituting the supporting sheet 10 is preferably a resin film.

Examples of the aforementioned resin film include polyethylene films such as LDPE (Low Density Polyethylene) film or LLDPE (Linear Low Density Polyethylene) film, ethylene-propylene copolymer film, polypropylene film, polybutylene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate copolymer film, ionic polymer resin film, ethylene-(meth)acrylic acid copolymer film, ethylene-(meth)acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, etc.

The substrate used in one aspect of the present invention may be a single-layer film composed of one resin film, or may be a laminated film formed by laminating two or more resin films.

In addition, in one aspect of the present invention, a sheet having a surface treatment applied to the surface of the above-mentioned resin film or other substrate can also be used as a supporting sheet.

These resin membranes can also be cross-linked membranes.

In addition, films obtained by coloring these resin films or films obtained by printing can also be used.

Furthermore, the resin film can also be formed by extruding a thermoplastic resin into a sheet, or by stretching, or by using a predetermined method to form a film and harden a curable resin to form a sheet.

Among these resin films, a substrate containing a polypropylene film is preferred from the perspectives of excellent heat resistance, moderate softness, expansion suitability, and easy pick-up suitability.

Furthermore, the structure of the substrate containing the polypropylene film may be a single-layer structure consisting of only the polypropylene film, or a multi-layer structure consisting of the polypropylene film and other resin films.

When the film used to form the inner protective film is thermosetting, the resin film constituting the substrate has heat resistance, which can suppress the damage to the substrate caused by heat and prevent defects from occurring during the manufacturing process of the semiconductor device.

When a sheet consisting only of a substrate is used as a supporting sheet, the surface tension of the surface of the substrate in contact with the surface of the inner protective film forming film is preferably 20mN/m to 50mN/m, more preferably 23mN/m to 45mN/m, and particularly preferably 25mN/m to 40mN/m from the viewpoint of adjusting the peeling force to a certain range.

The thickness of the substrate constituting the support sheet is preferably 10μm to 500μm, more preferably 15μm to 300μm, and particularly preferably 20μm to 200μm.

[Adhesive sheet]

As an adhesive sheet used as the support sheet 10 in one embodiment of the present invention, there can be cited: an adhesive sheet having an adhesive layer 12 formed by an adhesive on a substrate 11 such as the above-mentioned resin film.

FIG. 11 is a schematic cross-sectional view showing an example of a support sheet 10 having an adhesive layer 12 disposed on a substrate 11.

When the support sheet 10 has an adhesive layer 12, in the second lamination step, the adhesive layer 12 of the support sheet 10 is laminated on the inner surface protective film forming film 13.

Regarding the adhesive as a forming material of the adhesive layer, there can be cited an adhesive composition containing an adhesive resin, and the aforementioned adhesive composition may further contain general additives such as the above-mentioned crosslinking agent or thickening agent.

As the aforementioned adhesive resin, when focusing on the structure of the resin, for example, acrylic resin, urethane resin, phenoxy resin, silicone resin, saturated polyester resin, vinyl ether resin, etc. can be listed, and acrylic resin is preferred. In addition, when focusing on the function of the resin, for example, energy ray curing adhesive or heat foaming adhesive, energy ray foaming adhesive, etc. can be listed.

In one aspect of the present invention, from the viewpoint of adjusting the peeling force to a certain range and improving the pick-up property, an adhesive sheet having an energy ray-hardening adhesive layer formed by an adhesive composition containing an energy ray-hardening resin or an adhesive sheet having a slightly adhesive adhesive layer is preferred.

As the energy ray-curing resin, any resin having a polymerizable group such as a (meth)acryl group or a vinyl group will suffice, and an adhesive resin having a polymerizable group is preferred.

In the first lamination step, when the inner surface protective film forming film is not pasted on the entire surface of the workpiece such as the semiconductor wafer, bulges are generated on the inner surface protective film forming film, or wrinkles are generated on the inner surface protective film forming film, the support sheet can also serve as a sheet for removing the inner surface protective film forming film. Even if the inner surface protective film forming film is poorly adhered in the first lamination step, the third lamination body is directly manufactured through the second lamination step. Then, by separating the inner surface protective film forming film and the support sheet from the workpiece such as the semiconductor wafer, the workpiece such as the semiconductor wafer can be reprocessed. At this time, if the production cycle is taken into consideration, the support sheet needs to be quickly removed from the fixing jig (i.e., the ring frame), and the adhesive layer for the jig is preferably energy-ray-hardening. In addition, by using a support sheet having an energy-ray-hardening adhesive layer on the substrate, the support sheet can be directly fixed to the fixing jig such as the ring frame without passing through the jig adhesive layer, and by irradiating energy rays such as ultraviolet rays, the reprocessability can be excellent.

In addition, from the perspective of adjusting the peeling force to a certain range, an adhesive containing acrylic resin is preferred.

As the aforementioned acrylic resin, an acrylic polymer having a constituent unit (x1) derived from an alkyl (meth)acrylate is preferred, and an acrylic copolymer having a constituent unit (x1) and a constituent unit (x2) derived from a monomer containing a functional group is more preferred.

The carbon number of the alkyl group of the above-mentioned (meth)acrylic acid alkyl ester is preferably 1 to 18, more preferably 1 to 12, and particularly preferably 1 to 8.

As the aforementioned alkyl (meth)acrylate, there can be cited the same alkyl (meth)acrylate as that described in the above-mentioned adhesive polymer component.

Furthermore, the (meth)acrylic acid alkyl ester may be used alone or in combination of two or more.

Relative to the total constituent units (100 mass%) of the acrylic polymer, the content of the constituent unit (x1) is usually 50 mass% to 100 mass%, preferably 50 mass% to 99.9 mass%, more preferably 60 mass% to 99 mass%, and particularly preferably 70 mass% to 95 mass%.

Examples of the above-mentioned monomers containing functional groups include hydroxyl group-containing monomers, carboxyl group-containing monomers, epoxy group-containing monomers, etc. Specific examples of each monomer include the same monomers as those exemplified in the section on the polymer component of the adhesive.

Furthermore, these monomers can be used alone or in combination of two or more.

Relative to the total constituent units (100 mass%) of the acrylic polymer, the content of the constituent unit (x2) is usually 0 mass% to 40 mass%, preferably 0.1 mass% to 40 mass%, more preferably 1 mass% to 30 mass%, and particularly preferably 5 mass% to 20 mass%.

In addition, the acrylic resin used in one aspect of the present invention may also be an energy ray-curing acrylic resin, which is obtained by reacting an acrylic copolymer having the above-mentioned constituent unit (x1) and constituent unit (x2) with a compound having an energy ray-polymerizable group.

As the compound having an energy ray polymerizable group, any compound having a polymerizable group such as a (meth)acryl group or a vinyl group may be used.

When using an adhesive containing an acrylic resin, it is preferable to contain a crosslinking agent together with the acrylic resin from the viewpoint of adjusting the peeling force to a certain range.

As the aforementioned crosslinking agent, for example, there can be listed: isocyanate crosslinking agent, imine crosslinking agent, epoxy crosslinking agent, oxazoline crosslinking agent, carbodiimide crosslinking agent, etc. From the perspective of adjusting the stripping force to a certain range, isocyanate crosslinking agent is preferred.

Relative to the total mass (100 parts by mass) of the acrylic resin contained in the above adhesive, the content of the crosslinking agent is preferably 0.01 parts by mass to 20 parts by mass, more preferably 0.1 parts by mass to 15 parts by mass, particularly preferably 0.5 parts by mass to 10 parts by mass, and even more preferably 1 parts by mass to 8 parts by mass.

The support sheet 10 may be composed of one layer (single layer) or may be composed of two or more layers. When the support sheet is composed of multiple layers, the constituent materials and thicknesses of these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited as long as it does not impair the effect of the present invention.

Furthermore, in this specification, not limited to the case of the supporting sheet, the so-called "multiple layers may be the same or different from each other" means "all layers may be the same, all layers may be different, or only some layers may be the same", and further, the so-called "multiple layers are different from each other" means "at least one of the constituent materials and thickness of each layer is different from each other".

The support sheet can be transparent or opaque, and can also be colored according to the purpose.

For example, when the film used to form the inner protective film has energy ray curing properties, the support sheet preferably allows the energy ray to pass through.

For example, in order to optically inspect the film for forming the inner surface protective film through the support sheet, the support sheet is preferably transparent.

In this embodiment, the electric surface surface 14a of the workpiece 14 is protected by the electric surface surface protection tape 17. After the aforementioned second lamination step, a peeling step of peeling the electric surface surface protection tape 17 from the electric surface surface 14a of the workpiece 14 may be included. In this embodiment, the electric surface surface protection tape 17 has an energy ray hardening adhesive layer on the side attached to the electric surface surface 14a, which is hardened by irradiation with energy rays to become re-peelable. In the aforementioned peeling step, the adhesive layer of the electric surface surface protection tape 17 is irradiated with energy rays to harden the adhesive layer to become re-peelable, so that the electric surface surface protection tape 17 can be easily peeled from the electric surface surface 14a of the workpiece 14.

The manufacturing method of the third laminate of the present embodiment may also include the following step: irradiating the inner protective film forming film 13 with laser from the side of the support sheet 10 to perform laser marking. The manufacturing method of the third laminate of the present embodiment is to laminate the support sheet 10 on the inner protective film forming film 13, so if the laser is irradiated from the side of the support sheet 10 through the support sheet, the surface of the inner protective film forming film 13 that contacts the support sheet 10 can be laser marked.

FIG3 is a schematic cross-sectional view schematically showing another example of the implementation form of the manufacturing method of the third laminate. In addition, in the figures after FIG3, the same components as those shown in the already described figures are marked with the same symbols as those in the already described figures, and detailed descriptions are omitted.

In this embodiment, the workpiece 14 is a semiconductor device panel, which is composed of a collection of semiconductor devices sealed with at least one electronic component 62 by a sealing resin layer 64 arranged in a planar form. The manufacturing method of the third laminate of this embodiment is to manufacture a third laminate 19 formed by laminating a semiconductor device panel as a workpiece 14, a film 13 for forming an inner surface protective film, and a support sheet 10 in sequence, and one side of the workpiece 14 is a conductive surface 14a, and the other side is an inner surface 14b (Figure 3(a')). The manufacturing method of the third laminate comprises: a first lamination step (Figure 3(b')), attaching the film 13 for forming an inner surface protective film to the inner surface 14b of the workpiece 14; and a second lamination step (Figure 3(c')), attaching the support sheet 10 to the film 13 for forming an inner surface protective film (Figures 3(a') to 3(d')).

In this embodiment, the device for attaching the inner protective film forming film is connected to the device for attaching the support sheet to perform the process from the aforementioned first lamination step to the aforementioned second lamination step (Figure 3 (a') to Figure 3 (d')), or the process from the aforementioned first lamination step to the aforementioned second lamination step is performed in the same device (Figure 3 (a') to Figure 3 (d')).

Therefore, in this embodiment, the second laminated body in which the inner surface protective film forming film 13 is laminated on the workpiece 14 does not need to be stored in a cassette between the first lamination step and the second lamination step, but can be transported piece by piece to the second lamination step shown in FIG. 3(d'). By performing the above process in the same device, the device space can be reduced. By connecting the device for attaching the inner surface protective film forming film and the device for attaching the support sheet to perform the above process, even if the design is not started from scratch, it can be handled by modifying the previous device, which can reduce the initial cost. In addition, since the second multilayer body does not need to be placed in a cassette and transported outside the device, production efficiency is improved and contamination and damage to the second multilayer body can be suppressed.

The inner surface protective film forming film 13 used in the first lamination step can be processed into the shape of the workpiece in advance, or can be processed in the same device just before the first lamination step. When the size of the workpiece is fixed in the manufacturing line used, the former method that can be processed in advance is more efficient. When the size of the workpiece may change, the latter method will not waste the inner surface protective film forming film, which has cost advantages.

In addition, in another embodiment, the conveying distance of the workpiece 14 from the attachment starting point of the aforementioned first lamination step to the attachment ending point of the aforementioned second lamination step can be designed to be less than 7000 mm, which can reduce the device space. The conveying distance of the workpiece 14 from the attachment starting point of the aforementioned first lamination step to the attachment ending point of the aforementioned second lamination step can also be set to less than 6500 mm, can also be set to less than 6000 mm, can also be set to less than 4500 mm, can also be set to less than 3000 mm.

In addition, in another embodiment, the conveying time of the workpiece 14 from the start of the attachment of the first lamination step to the end of the attachment of the second lamination step can be set to less than 400 seconds, or less than 150 seconds, which can shorten the step time. The conveying time of the workpiece 14 from the start of the attachment of the first lamination step to the end of the attachment of the second lamination step can also be set to less than 130 seconds, or less than 110 seconds, or less than 90 seconds, or less than 70 seconds.

When the transport time of the workpiece 14 from the start of the attachment of the aforementioned first lamination step to the end of the attachment of the aforementioned second lamination step is roughly divided into three times: the time consumed in the first lamination step, the transport time from the place where the first lamination step is performed to the place where the second lamination step is performed, and the time consumed in the second lamination step, the preferred range of each time is the same as the preferred range described in the manufacturing method of Figure 1.

The manufacturing method of the third multilayer body of this embodiment can connect the device for attaching the film for forming the inner surface protective film and the device for attaching the support sheet to carry out the above process, or carry out the above process in the same device.

As the same device, it is preferable to use the device described in the manufacturing method of Figure 1.

In this embodiment, the semiconductor device panel can be formed by arranging each semiconductor device in a plane in a roughly circular area, or can be formed by arranging each semiconductor device in a plane in a roughly rectangular area.

In the present embodiment shown in FIG. 3 , the support sheet 10 is laminated on the inner surface protective film forming film 13 as in the embodiment shown in FIG. 1 , so if the laser is irradiated from the side of the support sheet 10 through the support sheet, the surface of the inner surface protective film forming film 13 that contacts the support sheet 10 can be laser marked.

[Method for manufacturing the fourth multilayer body]

The manufacturing method of the fourth laminate of this embodiment is to manufacture a fourth laminate 19' formed by sequentially laminating a workpiece 14, an inner surface protective film 13' and a support sheet 10. The manufacturing method of the fourth laminate includes: a hardening step, which hardens the inner surface protective film forming film 13 of the third laminate 19 manufactured by the aforementioned manufacturing method of the third laminate to manufacture the inner surface protective film 13'.

FIG4 is a schematic cross-sectional view schematically showing an example of an implementation form of the method for manufacturing the fourth laminate. The method for manufacturing the fourth laminate of this implementation form includes, after the aforementioned second lamination step, a peeling step (FIG. 4(e)) of peeling off the electrical surface protection tape 17 from the electrical surface 14a of the workpiece 14; a step of laser marking by irradiating the protective film forming film 13 from the inner side of the support sheet 10 with a laser (FIG. 4(f)); and a curing step (FIG. 4(g)) of curing the inner surface protective film forming film 13 to form an inner surface protective film 13'. In this implementation form, a thermosetting inner surface protective film forming film is used, and in the curing step of this implementation form, thermal curing is performed at 130°C for 2 hours.

The curing conditions when the thermosetting inner surface protective film is heat-treated and heat-cured to form the inner surface protective film are not particularly limited as long as the inner surface protective film has a degree of curing that fully exhibits the function of the inner surface protective film, and can be appropriately selected according to the type of thermosetting inner surface protective film.

For example, the heating temperature during heat curing is preferably 100°C to 200°C, more preferably 110°C to 180°C, and particularly preferably 120°C to 170°C. In addition, the heating time during the aforementioned heat curing is preferably 0.5 hours to 5 hours, more preferably 0.5 hours to 3 hours, and particularly preferably 1 hour to 2 hours. When heat curing is performed during the curing step, considering the heat resistance of the electrical road surface protection tape 17, the order of the aforementioned stripping step is preferably before the curing step.

FIG5 is a schematic cross-sectional view schematically showing another example of the implementation form of the manufacturing method of the fourth laminate. The manufacturing method of the fourth laminate of this implementation form includes: a peeling step (FIG5(e)) to peel off the electrical surface protection tape 17 from the electrical surface 14a of the workpiece 14; a hardening step (FIG5(f')) to harden the inner surface protection film forming film 13 to form an inner surface protection film 13'; and a step of irradiating the inner surface protection film 13' with a laser from the side of the support sheet 10 to perform laser marking (FIG5(g')).

[Method for manufacturing semiconductor device with inner surface protective film]

FIG6 is a schematic cross-sectional view schematically showing an example of an implementation form of the method for manufacturing a semiconductor device with an inner surface protective film. The method for manufacturing a semiconductor device with an inner surface protective film of this implementation form includes: a step of cutting the workpiece 14 and the inner surface protective film 13' of the fourth multilayer body 19' manufactured by the aforementioned method for manufacturing a fourth multilayer body to manufacture a semiconductor device 21 with an inner surface protective film (FIG. 6(h) and FIG6(i)); and a step of picking up the semiconductor device 21 with an inner surface protective film from the support sheet 10 (FIG. 6(j)).

FIG7 is a schematic cross-sectional view schematically showing another example of an implementation form of the method for manufacturing a semiconductor device with an inner surface protective film. The method for manufacturing a semiconductor device with an inner surface protective film of this implementation form includes: a step of cutting the inner surface protective film forming film 13 and the workpiece 14 of the third laminate 19 manufactured by the aforementioned method for manufacturing the third laminate to form a semiconductor device 21' with an inner surface protective film forming film (FIG. 7(h') and FIG. 7(i')); a step of picking up the semiconductor device 21' with an inner surface protective film forming film from the support sheet 10 (FIG. 7(j')); and a step of hardening the inner surface protective film forming film 13 to form an inner surface protective film 13' (FIG. 7(k')).

FIG8 is a schematic cross-sectional view schematically showing another example of an implementation form of the method for manufacturing a semiconductor device with an inner surface protective film. The method for manufacturing a semiconductor device with an inner surface protective film of this implementation form includes: a step of cutting the inner surface protective film forming film 13 and the workpiece 14 of the third multilayer body 19 manufactured by the aforementioned method for manufacturing a third multilayer body to form a semiconductor device 21' with an inner surface protective film forming film (FIG. 8(h) and FIG8(i)); a step of hardening the inner surface protective film forming film 13 to form an inner surface protective film 13' (FIG. 8(j')); and a step of picking up the semiconductor device 21 with an inner surface protective film from the support sheet 10.

In the manufacturing method of the semiconductor device with an inner surface protective film of this embodiment, the film 13 for forming the inner surface protective film is thermosetting. In the step of forming the inner surface protective film of this embodiment, for example, the film 13 for forming the inner surface protective film is thermosetted at 130°C for 2 hours.

As for the curing conditions when the thermosetting inner surface protective film forming film is thermally cured to form the inner surface protective film, as described above, there is no particular limitation as long as the inner surface protective film has a degree of curing that fully exhibits the function of the inner surface protective film, and it can be appropriately selected according to the type of thermosetting inner surface protective film forming film.

The manufacturing method of the semiconductor device with an inner surface protective film of this embodiment can also be: the film 13 for forming the inner surface protective film is energy ray hardening, and the aforementioned step of making the inner surface protective film is a step of irradiating the film 13 for forming the inner surface protective film with energy rays to perform energy ray hardening.

The curing conditions when the energy ray-curable inner surface protective film-forming film is subjected to energy ray curing to form a protective film are not particularly limited as long as the protective film has a degree of curing that fully exhibits the function of the protective film, and can be appropriately selected according to the type of the energy ray-curable inner surface protective film-forming film.

For example, the illuminance of the energy beam during energy beam curing of the energy beam curable inner surface protective film-forming film is preferably 4mW/ ^cm2 to 280mW/ ^cm2 . Furthermore, the amount of energy beam during the curing is preferably 3mJ/ ^cm2 to 1000mJ/ ^cm2 .

As a film for forming an energy ray-curable inner surface protective film, for example, the films disclosed in International Publication No. 2017/188200 and International Publication No. 2017/188218 can also be used.

[Industrial Availability]

The manufacturing method of the third multilayer body of the present invention can be used to manufacture semiconductor devices with inner surface protective films.

6: Second layer

10: Support sheet

13: Film for forming inner protective film

13a: The exposed surface of the peeling film 151 formed by peeling off the film used for forming the inner protective film

13b: The exposed surface of the peeling film 152 formed by peeling off the film used for forming the inner protective film

14: Workpiece

14a: Electrical path of workpiece

14b: Inner surface of the workpiece

16: Adhesive layer for clamps

17: Electrical road surface protection tape

18: Fixing clamp

19: The third layer

152: Second peeling membrane

Claims (8)

A method for manufacturing a third laminate is to manufacture the third laminate by laminating a workpiece, a film for forming an inner surface protective film, and a support sheet in sequence; one side of the workpiece is a conductive surface, and the other side is an inner surface; the method for manufacturing the third laminate comprises: a first lamination step, attaching the film for forming an inner surface protective film to the inner surface of the workpiece; and a second lamination step, attaching the support sheet to the film for forming an inner surface protective film; the attaching speed in the first lamination step and the speed of the second lamination step are controlled. The lamination speed is 2mm/s to 100mm/s; between the aforementioned first lamination step and the aforementioned second lamination step, the second lamination body on which the aforementioned inner surface protective film forming film is laminated on the aforementioned workpiece is not stored in a cassette but is transported piece by piece; the device for laminating the inner surface protective film forming film is connected to the device for laminating the support sheet to perform the process from the aforementioned first lamination step to the aforementioned second lamination step, or the process from the aforementioned first lamination step to the aforementioned second lamination step is performed in the same device. A method for manufacturing a third laminate is to manufacture a third laminate formed by laminating a workpiece, a film for forming an inner surface protective film, and a support sheet in sequence; one side of the workpiece is a conductive surface, and the other side is an inner surface; the method for manufacturing the third laminate comprises: a first lamination step, attaching the inner surface protective film forming film to the inner surface of the workpiece; and a second lamination step, attaching the support sheet to the inner surface protective film forming film; The attachment speed in the first lamination step and the second lamination step are The lamination speed in the lamination step is 2 mm/s to 100 mm/s; the conveying distance of the workpiece from the lamination start point of the first lamination step to the lamination end point of the second lamination step is less than 7000 mm; the device for laminating the inner surface protective film forming film is connected to the device for laminating the support sheet to carry out the process from the first lamination step to the second lamination step, or the process from the first lamination step to the second lamination step is carried out in the same device. A method for manufacturing a third laminate is to manufacture the third laminate by laminating a workpiece, a film for forming an inner surface protective film, and a support sheet in sequence; one side of the workpiece is a conductive surface, and the other side is an inner surface; the method for manufacturing the third laminate comprises: a first lamination step, attaching the film for forming an inner surface protective film to the inner surface of the workpiece; and a second lamination step, attaching the support sheet to the film for forming an inner surface protective film; the attachment speed in the first lamination step and the speed of the second lamination step are controlled. The lamination speed in the second lamination step is 2 mm/s to 100 mm/s; the transport time of the workpiece from the start of lamination in the first lamination step to the end of lamination in the second lamination step is less than 400 seconds; the device for laminating the inner surface protective film forming film is connected to the device for laminating the support sheet to carry out the process from the first lamination step to the second lamination step, or the process from the first lamination step to the second lamination step is carried out in the same device. The manufacturing method of the third laminate as described in claim 3, wherein the transport time of the workpiece from the start of the attachment of the first lamination step to the end of the attachment of the second lamination step is less than 150 seconds. A method for manufacturing a fourth laminate is to manufacture a fourth laminate formed by sequentially laminating a workpiece, an inner surface protective film, and a support sheet; one side of the workpiece is a conductive surface, and the other side is an inner surface; the method for manufacturing the fourth laminate sequentially comprises: a first lamination step, attaching a film for forming an inner surface protective film to the inner surface of the workpiece; a second lamination step, attaching the support sheet to the film for forming the inner surface protective film; and a curing step, curing the film for forming the inner surface protective film to form the inner surface protective film; the attaching speed in the first lamination step is , and the laminating speed in the aforementioned second lamination step is 2mm/s to 100mm/s; between the aforementioned first lamination step and the aforementioned second lamination step, the second lamination body on which the aforementioned inner surface protective film forming film is laminated on the aforementioned workpiece is not stored in a cassette but is transported piece by piece; the device for laminating the inner surface protective film forming film is connected to the device for laminating the support sheet to perform the process from the aforementioned first lamination step to the aforementioned second lamination step, or the process from the aforementioned first lamination step to the aforementioned second lamination step is performed in the same device. A method for manufacturing a fourth laminate is to manufacture a fourth laminate formed by laminating a workpiece, an inner surface protective film, and a support sheet in sequence; one side of the workpiece is a conductive surface, and the other side is an inner surface; the method for manufacturing the fourth laminate comprises: a first lamination step, attaching a film for forming an inner surface protective film to the inner surface of the workpiece; a second lamination step, attaching the support sheet to the film for forming an inner surface protective film; and a hardening step, making the film for forming an inner surface protective film The film is cured to form the aforementioned inner surface protective film; the conveying distance of the aforementioned workpiece from the attachment starting point of the aforementioned first lamination step to the attachment ending point of the aforementioned second lamination step is less than 7000mm; the device for attaching the film for forming the inner surface protective film is connected to the device for attaching the support sheet to carry out the process from the aforementioned first lamination step to the aforementioned second lamination step, or the process from the aforementioned first lamination step to the aforementioned second lamination step is carried out in the same device. A method for manufacturing a fourth laminate is to manufacture a fourth laminate by sequentially laminating a workpiece, an inner surface protective film, and a support sheet; one side of the workpiece is a conductive surface, and the other side is an inner surface; the method for manufacturing the fourth laminate sequentially comprises: a first lamination step, attaching a film for forming an inner surface protective film to the inner surface of the workpiece; a second lamination step, attaching the support sheet to the film for forming the inner surface protective film; and a curing step, so that the inner surface protective film is formed The inner protective film is formed by curing the film; the workpiece conveying time from the start of the first lamination step to the end of the second lamination step is less than 400 seconds; the device for laminating the inner protective film forming film is connected to the device for laminating the support sheet to carry out the process from the first lamination step to the second lamination step, or the process from the first lamination step to the second lamination step is carried out in the same device. The manufacturing method of the fourth laminate as described in claim 7, wherein the transport time of the workpiece from the start of the attachment of the first lamination step to the end of the attachment of the second lamination step is less than 150 seconds.

Images