TWI871806B - Device control method and a data storage system - Google Patents

Abstract

A device control method and a data storage system are disclosed. The method includes: detecting a temperature of a storage device; in response to the temperature being higher than a first threshold value, activating a cooling operation of the storage device; and in response to the temperature being lower than a second threshold value which is lower than the first threshold value, stopping the cooling operation, wherein the cooling operation includes: determining a control parameter according to a temperature variation of the storage device; and during a period of the storage device performing the cooling operation, controlling the storage device to switch at least once between a first state and a second state, wherein a performance of the storage device operated at the first state is lower than a performance of the storage device operated at the second state.

Description

Device control method and data storage system

The present invention relates to a device control technology, and in particular to a device control method and a data storage system.

As the data access speed of storage devices becomes faster and faster, the temperature of storage devices during operation is also more and more likely to rise. Once the temperature of the storage device is too high, it may damage the internal circuit components of the storage device and even cause the loss of user data stored in the storage device. Therefore, some storage devices have supported automatic cooling processing, such as starting the cooling operation when the temperature of the storage device is higher than a certain threshold, and stopping the cooling operation when the temperature of the storage device is lower than a certain threshold. In addition, during the cooling operation, the performance of the storage device will generally be greatly reduced and remain in low-performance mode for a long time. However, in practice, although such cooling operation can effectively reduce the temperature of the storage device, there is a high probability that the performance of the storage device will be excessively reduced, seriously affecting the user experience.

The present invention provides a device control method and a data storage system, which can improve the device performance and/or user experience as much as possible while satisfying the basic cooling requirements of the storage device.

An embodiment of the present invention provides a device control method, which includes: detecting the temperature of a storage device; in response to the temperature being higher than a first critical value, starting a cooling operation of the storage device; in response to the temperature being lower than a second critical value, stopping the cooling operation, wherein the second critical value is lower than the first critical value, wherein the cooling operation includes: determining a control parameter according to a change in the temperature of the storage device; and during the period when the storage device performs the cooling operation, controlling the storage device to switch between a first state and a second state at least once according to the control parameter, wherein the performance of the storage device operating in the first state is lower than the performance of the storage device operating in the second state.

The embodiment of the present invention further provides a data storage system, which includes a host system and a storage device. The storage device is coupled to the host system. The storage device is used to: detect the temperature of the storage device; in response to the temperature being higher than a first critical value, start a cooling operation of the storage device; in response to the temperature being lower than a second critical value, stop the cooling operation, wherein the second critical value is lower than the first critical value, wherein during the period when the storage device performs the cooling operation, the host system is used to: determine a control parameter according to a change in the temperature of the storage device; and control the storage device to switch between a first state and a second state at least once according to the control parameter, wherein the performance of the storage device operating in the first state is lower than the performance of the storage device operating in the second state.

Based on the above, after the cooling operation of the storage device is started, during the period when the storage device performs the cooling operation, the control parameter can be dynamically determined according to the temperature change of the storage device. Thereafter, during the period when the storage device performs the cooling operation, the control parameter can be used to control the storage device to switch between the first state and the second state at least once. The performance of the storage device operating in the first state is lower than the performance of the storage device operating in the second state. In this way, the device performance and/or user experience can be improved as much as possible under the premise of meeting the basic cooling requirements of the storage device.

FIG1 is a schematic diagram of a data storage system according to an embodiment of the present invention. Referring to FIG1 , the data storage system 10 includes a host system 11 and a storage device 12. The host system 11 can store data in the storage device 12 or read data from the storage device 12. For example, the host system 11 is any system that can actually cooperate with the storage device 12 to store data, such as various systems such as smart phones, tablet computers, laptops, desktop computers, industrial computers, servers, smart TVs or car computers, and the storage device 12 can be various non-volatile storage devices such as a flash drive, a memory card, a solid state drive (SSD), a secure digital (SD) card, a compact flash (CF) card or an embedded storage device.

The host system 11 may include a processor 111 and a connection interface 112. The processor 111 may include a central processing unit (CPU) or other programmable general-purpose or special-purpose microprocessor, a digital signal processor (DSP), a programmable controller, an application specific integrated circuit (ASIC), a programmable logic device (PLD) or other similar devices or a combination of these devices. The processor 111 is used to control the entire or partial operation of the host system 11. In the following embodiments, the description of the operation of the host system 11 may be equivalent to the description of the operation of the processor 111.

The connection interface 112 is coupled to the processor 111 and is used to transmit signals (including data and instructions) to the storage device 12 or receive signals from the storage device 12. In one embodiment, the host system 11 also includes any practically required hardware devices, such as a battery unit, a network interface card, a keyboard (or a touch pad), a screen and/or a speaker, etc.

The storage device 12 may include a connection interface 121, a memory controller 122, and a memory module 123. The connection interface 121 is used to connect to the connection interface 112 of the host system 11 and communicate with the host system 11 via the connection interface 112. In one embodiment, the connection interfaces 112 and 121 comply with the NVM Express (NVMe) interface specification. In another embodiment, the connection interfaces 112 and 121 may also comply with various connection interface standards such as Serial Advanced Technology Attachment (SATA), Parallel Advanced Technology Attachment (PATA), Peripheral Component Interconnect Express (PCI Express), or Universal Serial Bus (USB).

The memory controller 122 is coupled to the connection interface 121 and the memory module 123. The memory controller 122 is used to execute a plurality of logic gates or control instructions implemented in hardware or firmware and to perform operations such as writing, reading and erasing data in the memory module 123 according to instructions from the host system 11. In addition, the memory controller 122 can also control the overall operation of the storage device 12. In one embodiment, the memory controller 122 is also called a flash memory controller.

The memory module 123 is used to store data written by the host system 11. For example, the memory module 123 may include a single level cell (SLC) NAND type flash memory module (i.e., a flash memory module in which one memory cell can store one bit), a multi level cell (MLC) NAND type flash memory module (i.e., a flash memory module in which one memory cell can store two bits), a triple level cell (TLC) NAND type flash memory module (i.e., a flash memory module in which one memory cell can store three bits), a quad level cell (MLC) NAND type flash memory module (i.e., a flash memory module in which one memory cell can store three bits), or a quad level cell (MLC) NAND type flash memory module. The memory module 123 may be a QLC (quad-quad-cell) NAND type flash memory module (i.e., a flash memory module in which one memory cell can store 4 bits) or other types of memory modules. For example, the memory cells in the memory module 123 store data by changing the critical voltage.

In one embodiment, the memory controller 122 can detect the temperature of the storage device 12. For example, the memory controller 122 can detect the temperature of the storage device 12 through a temperature sensor (not shown) disposed inside the storage device 12. In one embodiment, the memory controller 122 can report the detected temperature of the storage device 12 to the host system 11 through the connection interface 121.

In one embodiment, the memory controller 122 may determine whether the temperature of the storage device 12 is higher than a critical value (also referred to as a first critical value). In response to the temperature of the storage device 12 being higher than the first critical value, the memory controller 122 may initiate a cooling operation of the storage device 12. The cooling operation may be used to reduce the temperature of the storage device 12. For example, during the period when the storage device 12 performs the cooling operation, the memory controller 122 may reduce the performance of the storage device 12 to cool the storage device 12. For example, the memory controller 122 can cool down the storage device 12 by reducing the clock frequency of the storage device 12 and/or reducing the performance of the memory module 123 (for example, reducing the data writing speed and/or data reading speed of the memory module 123). It should be noted that during the period when the storage device 12 performs the cooling operation, the memory controller 122 can also reduce the performance of the storage device 12 by other control means to cool down the storage device 12, and the present invention is not limited thereto.

In one embodiment, after starting the cooling operation, the memory controller 122 may determine whether the temperature of the storage device 12 is lower than another critical value (also referred to as a second critical value). The second critical value is lower than the first critical value. In response to the temperature of the storage device 12 being lower than the second critical value, the memory controller 122 may stop the cooling operation.

FIG2 is a schematic diagram of a storage device starting and stopping a cooling operation at different time points according to an embodiment of the present invention. Referring to FIG2, in one embodiment, it is assumed that at time point T(0), the memory controller 122 determines that the temperature of the storage device 12 is higher than the critical value THR(1) (i.e., the first critical value). Therefore, at time point T(0), the memory controller 122 can control the storage device 12 to perform a cooling operation. After the storage device 12 performs the cooling operation for a period of time, it is assumed that at time point T(1), the memory controller 122 determines that the temperature of the storage device 12 is lower than the critical value THR(2) (i.e., the second critical value). Therefore, at time point T(1), the memory controller 122 can control the storage device 12 to stop executing the cooling operation. In one embodiment, between time points T(0) and T(1), the cooling operation executed by the storage device 12 can be used to perform intermittent temperature control on the storage device 12. The operation details of the intermittent temperature control will be described in detail later.

In one embodiment, during the period when the storage device 12 performs a cooling operation (e.g., from time point T(0) to T(1) in FIG. 2 ), the host system 11 may continuously receive temperature information from the storage device 12. This temperature information may reflect the temperature detected by the storage device 12 at multiple time points. The host system 11 may obtain the temperature change of the storage device 12 during the period when the storage device 12 performs a cooling operation based on this temperature information. For example, this temperature change may reflect that during the period when the storage device 12 performs a cooling operation, the temperature of the storage device 12 continues to increase, continues to decrease, or remains unchanged as time increases.

In one embodiment, the host system 11 may determine a control parameter based on the temperature change. Then, during the period when the storage device 12 performs a cooling operation, the host system 11 may control the storage device 12 to switch between multiple states at least once based on the control parameter. For example, assuming that the multiple states include a first state and a second state, during the period when the storage device 12 performs a cooling operation, the host system 11 may control the storage device 12 to switch between the first state and the second state at least once based on the control parameter. For example, each switching may include controlling or instructing the storage device 12 to switch from the first state to the second state, or from the second state to the first state.

It should be noted that during the period when the storage device 12 performs the cooling operation, the performance of the storage device 12 operating in the first state may be lower than the performance of the storage device 12 operating in the second state. For example, during the period when the storage device 12 performs the cooling operation, in different states (i.e., the first state and the second state), the memory controller 122 may reduce, maintain or improve the performance of the storage device 12 through different control strategies, as long as the performance of the storage device 12 operating in the first state is lower than the performance of the storage device 12 operating in the second state. In addition, the power consumption per unit time of the storage device 12 operating in the first state may be lower than the power consumption per unit time of the storage device 12 operating in the second state.

In one embodiment, during the period when the storage device 12 performs the cooling operation, in the second state, the memory controller 122 may not reduce the performance of the storage device 12 (equivalent to restoring the performance of the storage device 12 operating in the second state to the default performance), as long as the performance of the storage device 12 operating in the first state is lower than the performance of the storage device 12 operating in the second state. In this way, during the period when the storage device 12 performs the cooling operation, the performance of the storage device 12 can be intermittently reduced in part of the time period and intermittently increased (or restored) in the remaining time period, so as to perform intermittent temperature control on the storage device 12. In this way, while satisfying the basic cooling requirements of the storage device, an attempt can be made to intermittently improve the performance of the storage device, thereby improving the user experience.

In one embodiment, the control parameter is used to control the length of time that the storage device 12 operates in the first state (also referred to as the first length of time) and/or the length of time that the storage device 12 operates in the second state (also referred to as the second length of time) during the period when the storage device 12 performs the cooling operation. For example, during the period when the storage device 12 performs the cooling operation, the host system 11 can control the duration of a single operation of the storage device 12 in the first state (i.e., the first length of time) and/or the duration of a single operation in the second state (i.e., the second length of time) according to the determined control parameter.

FIG3 is a schematic diagram of multiple switching states of a storage device during a cooling operation of the storage device according to an embodiment of the present invention. Referring to FIG3 , continuing from the embodiment of FIG2 , it is assumed that at time point T(0), the cooling operation of the storage device 12 is started, and at time point T(1), the cooling operation of the storage device 12 is stopped. Between time points T(0) and T(1), the storage device 12 continues to perform the cooling operation to intermittently control the temperature of the storage device 12.

In one embodiment, during the period when the storage device 12 performs the cooling operation, the host system 11 may control the storage device 12 to switch between state A (i.e., the first state) and state B (i.e., the second state) at least once. For example, the number of times the storage device 12 switches between state A and state B may be positively correlated to the length of time the cooling operation is performed. If the length of time the cooling operation is performed is longer, the number of times the storage device 12 switches between state A and state B may continue to increase. In addition, the performance of the storage device 12 operating in state A may be lower than the performance of the storage device 12 operating in state B.

In one embodiment, between time points T(0) and T(2), the host system 11 may control the storage device 12 to operate in state A with lower performance to cool the storage device 12. At time point T(2), the host system 11 may control the storage device 12 to switch from state A to state B. Between time points T(2) and T(3), the host system 11 may control the storage device 12 to operate in state B with higher performance to improve or restore the performance of the storage device 12. At time point T(3), the host system 11 may control the storage device 12 to switch from state B to state A. Between time points T(3) and T(4), the host system 11 can control the storage device 12 to operate in state A with lower performance to cool down the storage device 12 again. At time point T(4), the host system 11 can control the storage device 12 to switch from state A to state B. In other words, between time points T(4) and T(5), the host system 11 can control the storage device 12 to operate in state B with higher performance to improve or restore the performance of the storage device 12. Similarly, during the period when the storage device 12 performs a cooling operation (i.e., from time point T(0) to T(1)), the host system 11 can control the storage device 12 to switch between state A and state B multiple times to perform intermittent temperature control on the storage device 12 until the cooling operation is stopped at time point T(1).

In one embodiment, during the cooling operation of the storage device 12, the host system 11 can control the time point of the storage device 12 to switch the state according to the determined control parameters. Taking FIG. 2 as an example, the time point of the storage device 12 to switch the state includes time point T(2), T(3), T(4) and/or T(5).

In one embodiment, while the storage device 12 is performing a cooling operation, the host system 11 may control the time length ΔT(1) (i.e., the first time length) between time points T(0) and T(2), the time length ΔT(2) (i.e., the second time length) between time points T(2) and T(3), the time length ΔT(1)' (i.e., the first time length) between time points T(3) and T(4), and the time length ΔT(2)' (i.e., the second time length) between time points T(4) and T(5) according to the determined control parameters.

In one embodiment, during the period when the storage device 12 performs a cooling operation, the host system 11 can determine whether the temperature change trend of the storage device 12 meets the preset condition. In response to the temperature change trend of the storage device 12 meeting the preset condition, the host system 11 can adjust the control parameter. In particular, the adjusted control parameter can be used to change the first time length (e.g., ΔT(1) and/or ΔT(1)' in FIG. 3) that the storage device 12 operates in the first state and/or the second time length (e.g., ΔT(2) and/or ΔT(2)' in FIG. 3) that the storage device 12 operates in the second state during the period when the storage device 12 performs a cooling operation. However, if the temperature variation trend of the storage device 12 does not meet the preset condition, the host system 11 may not adjust the control parameter. If the host system 11 does not adjust the control parameter, the first time length and the second time length may not be adjusted (ie, maintained as the previous setting value).

In one embodiment, during the cooling operation of the storage device 12, the host system 11 can determine whether the temperature of the storage device 12 increases with time. In response to the temperature of the storage device 12 increasing with time (for example, the temperature of the storage device 12 detected at at least one time point is higher than the temperature of the storage device 12 detected at at least one previous time point), the host system 11 can determine that the temperature change trend of the storage device 12 meets the preset condition.

In one embodiment, in response to the temperature change trend of the storage device 12 meeting a preset condition (i.e., the temperature of the storage device 12 increases as time increases), the host system 11 may extend the first time length that the storage device 12 operates in the first state and/or shorten the second time length that the storage device 12 operates in the second state according to the adjusted control parameters during the period when the storage device 12 performs a cooling operation. By extending the first time length that the storage device 12 operates in the first state and/or shortening the second time length that the storage device 12 operates in the second state, the cooling efficiency of the storage device 12 may be improved during the period when the storage device 12 performs a cooling operation.

Taking FIG. 3 as an example, it is assumed that after the cooling operation is started and at least one state switching is performed, the temperature change trend of the storage device 12 meets the preset condition (i.e., the temperature of the storage device 12 continues to rise as time increases). In response to the temperature change trend of the storage device 12 meeting the preset condition, the host system 11 can adjust the control parameters and increase the time length between time points T(3) and T(4) (i.e., ΔT(1)') and/or reduce the time length between time points T(4) and T(5) (i.e., ΔT(2)') during the cooling operation of the storage device 12 according to the adjusted control parameters. For example, the host system 11 may set ΔT(1)' to ΔT(1)+S(1) and/or set ΔT(2)' to ΔT(2)-S(2). S(1) and S(2) are adjustment parameters, and S(1) and S(2) may be set according to practical requirements. In one embodiment, the cooling efficiency of the storage device 12 between time points T(3) and T(5) may be improved by increasing ΔT(1)' (i.e., extending the time that the storage device 12 operates in the less efficient state A) and/or reducing ΔT(2)' (i.e., shortening the time that the storage device 12 operates in the more efficient state B).

In one embodiment, during the cooling operation of the storage device 12, in response to the fact that the temperature of the storage device 12 does not increase with time (indicating that the cooling efficiency of the current storage device 12 is good), the host system 11 may determine that the temperature change trend of the storage device 12 does not meet the preset conditions. If the temperature change trend of the storage device 12 does not meet the preset conditions, the host system 11 may not adjust the control parameters. In an embodiment of FIG. 3 , if the control parameter is not adjusted, the first time length that the storage device 12 operates in the first state and/or the second time length that the storage device 12 operates in the second state may not be adjusted (i.e., ΔT(1)' may be equal to ΔT(1) and/or ΔT(2)' may be equal to ΔT(2)). Similarly, during the period when the storage device 12 performs the cooling operation, the host system 11 may continue to dynamically adjust or maintain the first time length and/or the second time length for the next time according to whether the temperature change trend of the storage device 12 meets the preset conditions.

In one embodiment, the sum of ΔT(1) and ΔT(2) is equal to the sum of ΔT(1)' and ΔT(2)'. In one embodiment, if ΔT(1)' is increased, ΔT(2)' will be reduced accordingly. Alternatively, in one embodiment, if ΔT(2)' is increased, ΔT(1)' will be reduced accordingly.

In one embodiment, the host system 11 may send a control instruction to the storage device 12 at a time point when the state of the storage device 12 needs to be switched (e.g., time points T(2), T(3), T(4), and T(5) in FIG. 3 ) according to the determined control parameters. Thus, at a time point when the state of the storage device 12 needs to be switched (e.g., time points T(2), T(3), T(4), and T(5) in FIG. 3 ), the memory controller 122 may switch the state of the storage device 12 according to the control instruction from the host system 11, for example, from the first state to the second state, or from the second state to the first state.

In one embodiment, starting the cooling operation of the storage device 12 and/or stopping the cooling operation of the storage device 12 is controlled by the memory controller 122. However, in one embodiment, starting the cooling operation of the storage device 12 and/or stopping the cooling operation of the storage device 12 may also be controlled by the host system 11. For example, in one embodiment, in response to the temperature of the storage device 12 being higher than the first critical value, the host system 11 may send a control instruction to the storage device 12 to instruct the memory controller 122 to start the cooling operation of the storage device 12. Thereafter, in response to the temperature of the storage device 12 being lower than the second critical value, the host system 11 may send a control instruction to the storage device 12 to instruct the memory controller 122 to stop the cooling operation of the storage device 12.

FIG4 is a flow chart of a device control method according to an embodiment of the present invention. Referring to FIG4, in step S401, the temperature of the storage device is detected. In step S402, it is determined whether the temperature of the storage device is higher than a first critical value. In response to the temperature of the storage device being higher than the first critical value, in step S403, a cooling operation of the storage device is started. However, if the temperature of the storage device is not higher than the first critical value, after step S402, the process may return to step S401 to continue detecting the temperature of the storage device. After the cooling operation of the storage device is started, in step S404, it is determined whether the temperature of the storage device is lower than the second critical value. The second critical value is lower than the first critical value. In response to the temperature of the storage device being lower than the second critical value, in step S405, the cooling operation of the storage device is terminated. However, if the temperature of the storage device is not lower than the second critical value, step S404 and the cooling operation of the storage device can continue to be executed.

FIG5 is a flow chart of a device control method according to an embodiment of the present invention. Referring to FIG5, in step S501, a control parameter is determined according to a temperature change of the storage device. In step S502, during the period when the storage device performs a cooling operation, the storage device is controlled to switch between a first state and a second state at least once according to the control parameter, wherein the performance of the storage device operating in the first state is lower than the performance of the storage device operating in the second state.

FIG6 is a flow chart of a device control method according to an embodiment of the present invention. Referring to FIG6, in step S601, it is determined whether the temperature change trend of the storage device meets the preset conditions. In response to the temperature change trend of the storage device meeting the preset conditions, in step S602, the control parameters are adjusted. The adjusted control parameters can be used to change the first time length of the storage device operating in the first state and/or the second time length of the storage device operating in the second state during the storage device performing a cooling operation. However, if the temperature change trend of the storage device does not meet the preset conditions, the control parameters may not be adjusted.

However, each step in FIG. 4 to FIG. 6 has been described in detail above, and will not be repeated here. It is worth noting that each step in FIG. 4 to FIG. 6 can be implemented as multiple program codes or circuits, and the present invention is not limited thereto. In addition, the method of FIG. 4 to FIG. 6 can be used in conjunction with the above exemplary embodiments, or can be used alone, and the present invention is not limited thereto.

In summary, the device control method and data storage system proposed by the present invention can control the storage device to switch between the first state and the second state at least once during the period when the storage device performs a cooling operation. In addition, according to whether the temperature change trend of the storage device during the period when the storage device performs a cooling operation meets the preset conditions, the first time length of the storage device operating in the first state and/or the second time length of the storage device operating in the second state can be dynamically adjusted. In this way, the device performance and/or user experience can be improved as much as possible under the premise of meeting the basic cooling requirements of the storage device.

Although the present invention has been disclosed as above by the embodiments, they are not intended to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the scope of the attached patent application.

10: Data storage system 11: Host system 111: Processor 112, 121: Connection interface 12: Storage device 122: Memory controller 123: Memory module T(0)~T(5): Time point ΔT(1), ΔT(2), ΔT(1)’, ΔT(2)’: Time length S(1), S(2): Adjustment parameters S401~S405, S501, S502, S601, S602: Steps

FIG. 1 is a schematic diagram of a data storage system according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a storage device starting and stopping a cooling operation at different time points according to an embodiment of the present invention. FIG. 3 is a schematic diagram of switching the state of a storage device multiple times during a cooling operation of the storage device according to an embodiment of the present invention. FIG. 4 is a flow chart of a device control method according to an embodiment of the present invention. FIG. 5 is a flow chart of a device control method according to an embodiment of the present invention. FIG. 6 is a flow chart of a device control method according to an embodiment of the present invention.

S501, S502: Steps

Claims (10)

A device control method, comprising: detecting the temperature of a storage device; in response to the temperature being higher than a first critical value, starting a cooling operation of the storage device; in response to the temperature being lower than a second critical value, stopping the cooling operation, wherein the second critical value is lower than the first critical value, wherein the cooling operation comprises: determining a control parameter according to a change in the temperature of the storage device; and during the period when the storage device performs the cooling operation, controlling the storage device to switch between a first state and a second state at least once according to the control parameter, wherein the storage device The performance of the storage device in the first state is lower than the performance of the storage device in the second state, wherein the step of determining the control parameter according to the temperature change of the storage device includes: during the period when the storage device performs the cooling operation, in response to the temperature change trend of the storage device meeting the preset condition, adjusting the control parameter, wherein the adjusted control parameter is used to change the first time length of the storage device operating in the first state or the second time length of the storage device operating in the second state during the period when the storage device performs the cooling operation. The device control method as described in claim 1, wherein the control parameter is used to control the storage device to operate in the first state for the first time length or the storage device to operate in the second state for the second time length during the cooling operation of the storage device. The device control method as described in claim 1 further includes: during the period when the storage device performs the cooling operation, in response to the temperature of the storage device increasing with time, determining that the temperature change trend of the storage device meets the preset condition. The device control method as described in claim 1, wherein the adjusted control parameter is used to extend the first time length of the storage device operating in the first state or shorten the second time length of the storage device operating in the second state during the cooling operation of the storage device. The device control method as described in claim 1 further includes: during the period when the storage device performs the cooling operation, in response to the temperature of the storage device not rising with time, determining that the temperature change trend of the storage device does not meet the preset condition. A data storage system includes: a host system; and a storage device coupled to the host system, wherein the storage device is used to: detect the temperature of the storage device; in response to the temperature being higher than a first critical value, start a cooling operation of the storage device; in response to the temperature being lower than a second critical value, stop the cooling operation, wherein the second critical value is lower than the first critical value, wherein during the period when the storage device performs the cooling operation, the host system is used to: determine a control parameter according to the temperature change of the storage device; and control the storage device between a first state and a second state according to the control parameter. Perform at least one switching, wherein the performance of the storage device operating in the first state is lower than the performance of the storage device operating in the second state; wherein the operation of determining the control parameter according to the temperature change of the storage device includes: during the period when the storage device performs the cooling operation, in response to the temperature change trend of the storage device meeting the preset condition, adjusting the control parameter, wherein the adjusted control parameter is used to change the first time length of the storage device operating in the first state or the second time length of the storage device operating in the second state during the period when the storage device performs the cooling operation. A data storage system as described in claim 6, wherein the control parameter is used to control the first time length of the storage device operating in the first state or the second time length of the storage device operating in the second state during the cooling operation of the storage device. The data storage system as described in claim 6, wherein the host system is further used to: during the period when the storage device performs the cooling operation, in response to the temperature of the storage device increasing with time, determine that the temperature change trend of the storage device meets the preset condition. A data storage system as described in claim 6, wherein the adjusted control parameter is used to extend the first time length that the storage device operates in the first state or shorten the second time length that the storage device operates in the second state during the cooling operation of the storage device. The data storage system as described in claim 6, wherein the host system is further used to: during the period when the storage device performs the cooling operation, in response to the fact that the temperature of the storage device does not increase with time, determine that the temperature change trend of the storage device does not meet the preset condition.

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