TWI871420B - Install substrate inspection device and inspection device - Google Patents

Abstract

The mounting substrate inspection device of the present invention comprises: a concentric circle lighting unit, which irradiates the inspection object with RGB concentric circle lights arranged in concentric circles of red (R), green (G) and blue (B); and a control unit, which performs the following control, namely, based on the shooting result of the inspection object irradiated with RGB concentric circle lights by the imaging unit, obtains the tilt angle of the inspection object, and inspects the state of the inspection object based on the obtained tilt angle of the inspection object.

Description

Install substrate inspection device and inspection device

The present invention relates to a mounting substrate inspection device and an inspection device, and more particularly to a mounting substrate inspection device and an inspection device having an imaging unit for photographing an inspection object.

Previously, there is known an inspection device having an imaging unit for photographing an inspection object. Such a device is disclosed in Japanese Patent No. 5866573, for example.

The above-mentioned Japanese Patent Gazette No. 5866573 discloses an inspection system (inspection device) which includes an inspection lighting device for irradiating inspection light to an inspection object, and an imaging device for photographing the inspection object. The inspection system is configured to obtain the tilt angle of the inspection object by utilizing the inclusive relationship between the irradiation stereo angle of the inspection light formed by the inspection lighting device and the observation stereo angle formed by the imaging device. Specifically, the inspection system is configured to obtain the tilt angle of the inspection object by utilizing the following situation, that is, the irradiation stereo angle included in the observation stereo angle changes according to the tilt angle of the inspection object, thereby changing the amount of light in the observation stereo angle. That is, the inspection system is configured to obtain the tilt angle of the inspection object based on light and dark information.

However, the inspection system described in the above-mentioned Japanese Patent No. 5866573 has the following disadvantages: since the tilt angle of the inspection object is obtained based on the light and dark information, when the reflectivity of the inspection object changes and the light quantity changes, the light quantity change caused by the reflectivity change of the inspection object is mistakenly regarded as the change of the tilt angle and obtained. In this case, the tilt angle of the inspection object cannot be obtained with high accuracy, and therefore there is a problem that the state of the inspection object cannot be inspected with high accuracy based on the tilt angle.

The present invention is made to solve the above-mentioned problems. One object of the present invention is to provide a mounting substrate inspection device and an inspection device that can inspect the state of an inspection object with high precision based on a tilt angle.

The first aspect of the present invention includes a mounting substrate inspection device, which includes: a camera unit that photographs an inspection object including a mounting substrate on which parts are mounted; a concentric circle illumination unit that irradiates the inspection object with RGB concentric circle lights arranged in concentric circles of red (R), green (G) and blue (B); and a control unit that performs the following control, i.e., based on the result of the camera unit photographing the inspection object irradiated with RGB concentric circle lights, the tilt angle of the inspection object is obtained, and based on the obtained tilt angle of the inspection object, the state of the inspection object is inspected. Furthermore, the so-called RGB is composed of the first letters of "Red", "Green" and "Blue".

In the first aspect of the present invention, the mounting substrate inspection device is provided as described above: a camera unit that photographs an inspection object including a mounting substrate on which parts are mounted; a concentric circle illumination unit that irradiates the inspection object with RGB concentric circle lights arranged in concentric circles of red (R), green (G) and blue (B); and a control unit that performs the following control, i.e., based on the photographing result of the inspection object irradiated with the RGB concentric circle lights by the camera unit, the tilt angle of the inspection object is obtained, and based on the obtained tilt angle of the inspection object, the state of the inspection object is inspected. In this way, the tilt angle of the inspection object can be obtained by utilizing the fact that the brightness of each RGB color in the photographing result changes according to the tilt angle of the inspection object. Here, when the reflectivity of the inspection object changes, the brightness (brightness) of each RGB color changes, but the change state (state) of the brightness of each RGB color remains unchanged. Therefore, by using the fact that the brightness of each RGB color in the shooting result changes according to the tilt angle of the inspection object, the tilt angle of the inspection object is obtained. Unlike the case where the tilt angle of the inspection object is obtained based on the light and dark information of a single color, the tilt angle of the inspection object can be obtained with high accuracy regardless of how the reflectivity of the inspection object changes. As a result, the state of the inspection object can be inspected with high accuracy based on the tilt angle.

In the mounting substrate inspection device of the first aspect, it is preferred that the control unit is configured to obtain the tilt angle of the inspection object based on the ratio of red, green and blue of the inspection object in the photographing result, that is, the RGB ratio. If configured in this way, the tilt angle of the inspection object can be obtained with higher accuracy based on the RGB ratio that is not affected by the change in the reflectivity of the inspection object, so the state of the inspection object can be inspected with higher accuracy based on the tilt angle.

In this case, it is preferred that the control unit is configured to obtain the tilt angle of the inspection object based on the RGB ratio of the inspection object and conversion information for converting the RGB ratio obtained in advance into the tilt angle. If configured in this way, the tilt angle of the inspection object can be simply and accurately obtained by converting the RGB ratio of the inspection object into the tilt angle using only the conversion information for converting the RGB ratio into the tilt angle.

In the mounting substrate inspection device of the first aspect, it is preferred that the concentric circle illumination section includes a red light source, a green light source, and a blue light source arranged in a concentric circle shape, or includes a white light source and an RGB concentric circle color filter arranged at a position opposite to the white light source. If constructed in this manner, when the concentric circle illumination section includes a red light source, a green light source, and a blue light source arranged in a concentric circle shape, RGB concentric circle lights of red, green, and blue arranged in a concentric circle shape can be easily obtained. Furthermore, when the concentric circle illumination section includes a white light source and an RGB concentric circle color filter arranged at a position opposite to the white light source, unlike the case where light sources of each RGB color are individually provided, there is no need to separate the light sources from each other in order to suppress color mixing, and thus the structure of the concentric circle illumination section can be simplified.

In the mounting substrate inspection device of the first aspect, it is preferred that the concentric circle illumination unit is configured to illuminate RGB concentric circle lights, and the RGB concentric circle lights include one circle of each of the three RGB colors, and include the same color as the color located at the center of the concentric circle in RGB at the outermost side of the concentric circle. If configured in this manner, by making the RGB concentric circle lights include the same color as the color located at the center of the concentric circle in RGB at the outermost side of the concentric circle, even in the final stage of the tilt angle measurement range of the inspection object (i.e., when the tilt angle of the inspection object is large), the tilt angle of the inspection object can be obtained with high precision based on the brightness changes of multiple colors.

In the above-mentioned first embodiment of the mounting substrate inspection device, it is preferred that the control unit is configured to perform the following control, that is, based on the tilt angle of the inspection object, the change point of the tilt angle is detected as a crack. If configured in this way, when a crack occurs, the tilt angles on both sides of the crack are usually different, so the change point of the tilt angle corresponds to the crack. By utilizing this situation, the crack of the inspection object can be detected with high precision. Here, although there is a method of detecting the dark part of the image as a crack, when the dark part of the image is detected as a crack, there is a situation where the crack cannot be detected because the crack cannot be identified in the image when the width of the crack is narrow (for example, less than 1 pixel). On the other hand, in the present configuration, the point where the tilt angle changes is detected as a crack, so unlike the case where the dark portion of the image is detected as a crack, even when the width of the crack is narrower than the dark portion in the image and the crack cannot be identified, the crack can be detected with high accuracy.

In this case, it is preferred that the component includes a semiconductor wafer, and the control unit is configured to perform the following control, that is, to detect cracks in the semiconductor wafer based on the tilt angle of the inspection object. If configured in this way, cracks can be detected with high accuracy in semiconductor wafers that are prone to cracks.

In the mounting substrate inspection device of the first aspect, it is preferred that the control unit is configured to perform the following control, that is, to detect the component protrusion on the mounting substrate based on the tilt angle of the inspection object. If configured in this way, the component protrusion on the mounting substrate can be detected with high precision based on the tilt angle of the inspection object obtained with high precision.

In the above-mentioned first aspect of the mounting substrate inspection device, it is preferred that it further has a three-dimensional measuring unit capable of measuring the height information of the inspection object, and the control unit is configured to perform the following control, namely, inspecting the state of the inspection object based on the inclination angle of the inspection object and the height information of the inspection object, the inclination angle of the inspection object being obtained based on the result of photographing the inspection object irradiated with RGB concentric circle light by the camera unit, and the height information of the inspection object being obtained by the three-dimensional measuring unit. If constructed in this way, not only can the state of the inspection object be inspected with higher accuracy based on the tilt angle of the inspection object obtained by the imaging unit based on the result of photographing the inspection object irradiated with RGB concentric light, but also the height information of the inspection object obtained by the three-dimensional measurement unit.

In the above-mentioned first embodiment of the mounting substrate inspection device, it is preferred that the imaging unit has a photographing lens, and the concentric circle illumination unit is configured to use the photographing lens to illuminate the inspection object with RGB concentric circle light. If configured in this manner, the existing photographing lens can be effectively utilized to illuminate the inspection object with RGB concentric circle light, without the need to separately and independently set an illumination lens in the concentric circle illumination unit. As a result, the structures of the imaging unit and the concentric circle illumination unit can be simplified, and the configuration space of the imaging unit and the concentric circle illumination unit can be saved.

In this case, it is preferred that the photographing lens is an object lens disposed at a position closest to the inspection object in the imaging unit. If configured in this way, the photographing lens as an object lens can be effectively utilized to irradiate the inspection object with RGB concentric circular light.

In the mounting substrate inspection device of the first aspect, it is preferred that the control unit is configured to obtain the tilt angle of the inspection object based on the photographing result of the inspection object irradiated with RGB concentric light by the camera unit and the hue information of the inspection object obtained from the photographing result of the inspection object irradiated with white light. If configured in this way, the tilt angle of the inspection object can be obtained with higher accuracy by taking into account the difference in RGB reflection characteristics between the surface with hue and the surface without hue, and the difference in RGB reflection characteristics of each hue in the surface with hue.

The inspection device of the second aspect of the present invention comprises: an imaging unit, which photographs an inspection object; a concentric circle illumination unit, which irradiates the inspection object with RGB concentric circle lights arranged in concentric circles and having red (R), green (G) and blue (B); and a control unit, which performs the following control, namely, based on the result of the imaging unit photographing the inspection object irradiated with the RGB concentric circle lights, obtains the tilt angle of the inspection object, and inspects the state of the inspection object based on the obtained tilt angle of the inspection object.

In the inspection device of the second aspect of the present invention, as described above, there are provided: an imaging unit that photographs the inspection object; a concentric circle illumination unit that irradiates the inspection object with RGB concentric circle lights arranged in concentric circles of red (R), green (G) and blue (B); and a control unit that performs the following control, i.e., based on the result of the imaging unit photographing the inspection object irradiated with RGB concentric circle lights, the tilt angle of the inspection object is obtained, and based on the obtained tilt angle of the inspection object, the state of the inspection object is inspected. Thus, similar to the mounting substrate inspection device of the first aspect, an inspection device that can inspect the state of the inspection object with high precision based on the tilt angle can be provided.

The following is an explanation of the implementation method of the present invention based on the drawings.

[First embodiment] (Structure of the mounting substrate inspection device) Referring to FIG. 1 , the structure of the mounting substrate inspection device 100 of the embodiment of the present invention is described. The mounting substrate inspection device 100 is an example of an "inspection device" within the scope of the patent application.

As shown in FIG. 1 , the mounting substrate inspection device 100 is an appearance inspection device that photographs a mounting substrate P such as a printed substrate as an inspection object P1 (photographing object) and performs various inspections on the mounting substrate P and the parts E on the mounting substrate P. The mounting substrate inspection device 100 constitutes a part of a substrate production line, which is used to mount parts E (electronic parts) such as ICs, transistors, capacitors, resistors, and semiconductor wafers on the mounting substrate P to manufacture circuit substrates. Furthermore, the mounting substrate inspection device 100 is an example of the "inspection device" of the present invention.

As an overview of the substrate manufacturing process, first, solder (solder paste) is printed (applied) in a specific pattern on the mounting substrate P on which a wiring pattern is formed using a solder printing device (not shown) (solder printing step). Then, on the mounting substrate P after printing the solder, the component E is mounted (mounted) using a component mounting device (not shown) (mounting step), thereby placing the terminal portion of the component E on the solder. Thereafter, the mounting substrate P after mounting is transported to a reflow furnace (not shown) to melt and harden (cool) the solder (reflow step), thereby soldering the terminal portion of the component E to the wiring of the mounting substrate P. In this way, the component E is fixed to the mounting substrate P in a state of being electrically connected to the wiring, thereby completing the substrate manufacturing.

The mounting substrate inspection device 100 is used, for example, to inspect the mounting state of the component E after the mounting step, or the mounting state of the component E after the reflow step. Therefore, one or more mounting substrate inspection devices 100 are provided in the substrate production line. The following inspections are performed on the mounting state of the component E: whether the type and orientation (polarity) of the component E are accurate; whether the positional deviation of the component E relative to the designed mounting position is within the allowable range; whether the soldering state of the terminal portion is normal; whether the component E on the mounting substrate P has bulges; and whether the component E has cracks (breaks). In addition, as a common inspection content between each step, foreign matter such as dirt or other attachments is also detected.

The mounted substrate inspection device 100 includes: a substrate transport conveyor 10 for transporting the mounted substrate P; a head moving mechanism 20 capable of moving above the substrate transport conveyor 10 in the XY direction (horizontal direction) and the Z direction (vertical direction); a camera head 30 held by the head moving mechanism 20; and a control device 40 for controlling the mounted substrate inspection device 100. The control device 40 is an example of a "control unit" in the scope of the patent application.

The substrate transport conveyor 10 is configured to transport the mounted substrate P along the X direction, stop the mounted substrate P at a specific inspection position and hold it at the position. In addition, the substrate transport conveyor 10 is configured to transport the mounted substrate P that has been inspected from the specific inspection position along the X direction, and remove the mounted substrate P from the mounted substrate inspection device 100.

The head moving mechanism 20 is disposed above the substrate transport conveyor 10 (in the Z1 direction), and is composed of, for example, an orthogonal three-axis (XYZ axis) robot using a ball screw shaft and a servo motor. The head moving mechanism 20 has an X-axis motor 21, a Y-axis motor 22, and a Z-axis motor 23 for driving the X-axis, Y-axis, and Z-axis. The head moving mechanism 20 is configured to enable the camera head 30 to move above the substrate transport conveyor 10 (where the substrate P is mounted) (in the Z1 direction) in the XY direction (horizontal direction) and the Z direction (up and down direction).

The camera unit 30 is configured to measure (acquire) two-dimensional information (two-dimensional image) and three-dimensional information (three-dimensional image) of the mounting substrate P (inspection object P1). The camera unit 30 includes an imaging unit 31, a concentric circle illumination unit 32, a two-dimensional illumination unit 33 as a two-dimensional measurement unit, and a three-dimensional measurement unit 34.

The imaging unit 31 is a camera that photographs the mounting substrate P (inspection object P1) disposed at the inspection position. The imaging unit 31 is configured to photograph the mounting substrate P (inspection object P1) under the illumination of the concentric circle illumination unit 32, the two-dimensional illumination unit 33, or the three-dimensional measurement unit 34. Furthermore, the optical axis of the imaging unit 31 is configured in a direction perpendicular to the horizontal reference plane. That is, the imaging unit 31 is configured to photograph the upper surface of the mounting substrate P (inspection object P1) from a position approximately vertically above, and obtain a two-dimensional image of the mounting substrate P (inspection object P1).

The concentric circle illumination unit 32 is configured to irradiate the mounting substrate P (inspection object P1) with RGB concentric circle lights of red (R), green (G) and blue (B) arranged in concentric circles. The detailed configuration of the concentric circle illumination unit 32 will be described below.

The two-dimensional illumination section 33 includes a dome illumination section 33a and a low-angle illumination section 33b. The dome illumination section 33a has a dome-shaped (hemispherical shell-shaped) reflection section 51 and a plurality of light source sections 52 disposed on the inner surface side of the reflection section 51. Under the illumination of the dome illumination section 33a, a shadowless photographic image of the mounting substrate P (inspection object P1) can be obtained. The low-angle illumination section 33b has a ring-shaped mounting section 53 and a plurality of light source sections 54 disposed in a ring shape on the inner surface side of the mounting section 53. Under the illumination of the low-angle illumination section 33b, a photographic image with a clear edge of the mounting substrate P (inspection object P1) can be obtained. The light source units 52 and 54 are, for example, white LEDs (Light Emitting Diodes).

The three-dimensional measuring unit 34 is configured to measure three-dimensional information including height information of the mounting substrate P (inspection object P1). The three-dimensional measuring unit 34 is, for example, a laser measuring unit that can measure three-dimensional information by a photosection method using laser light, or a phase illumination unit that can measure three-dimensional information by a phase shift method using stripe pattern light. Based on the photographing result of the laser light of the photosection method or the stripe pattern light of the phase shift method, three-dimensional information including height information of the mounting substrate P (inspection object P1) can be obtained.

The control device 40 includes a control unit 41 , a memory unit 42 , an image processing unit 43 , an imaging control unit 44 , a lighting control unit 45 , and a motor control unit 46 .

The control unit 41 includes a CPU (Central Processing Unit) that performs logical operations, a ROM (Read Only Memory) that stores programs for controlling the CPU, and a RAM (Random Access Memory) that temporarily stores various data during the operation of the device. The control unit 41 is configured to control various parts of the mounting substrate inspection device 100 through the image processing unit 43, the imaging control unit 44, the lighting control unit 45, and the motor control unit 46 according to the program stored in the ROM or the software (program) stored in the memory unit 42. In addition, the control unit 41 controls the imaging head unit 30 to perform various appearance inspections on the mounting substrate P.

The memory unit 42 includes a non-volatile memory device capable of storing various data and reading them by the control unit 41. The memory unit 42 stores the image data captured by the imaging unit 31 and the substrate data defining the design position information of the parts E to be mounted on the mounting substrate P. The image processing unit 43 is configured to perform image processing on the captured image captured by the imaging unit 31 to generate image data suitable for identifying (image recognition) the mounting substrate P and the parts E on the mounting substrate P.

The imaging control unit 44 is configured to read the shooting signal from the imaging unit 31 at a specific time point based on the control signal output from the control unit 41, and output the read shooting signal to the image processing unit 43. The lighting control unit 45 is configured to light up the concentric circle lighting unit 32 and the two-dimensional lighting unit 33 at a specific time point based on the control signal output from the control unit 41. The motor control unit 46 is configured to control the driving of each servo motor (the X-axis motor 21, the Y-axis motor 22, and the Z-axis motor 23 of the head moving mechanism 20, and the motor (not shown) for driving the substrate transport conveyor 10, etc.) of the mounted substrate inspection device 100 based on the control signal output from the control unit 41. Furthermore, the motor control unit 46 is configured to obtain the positions of the camera head 30 and the mounting substrate P, etc. based on the signals from the encoders (not shown) of the servo motors.

(Constitution of the imaging unit and the concentric circle illumination unit) As shown in FIG2, the imaging unit 31 has an objective lens (front lens) 31a, an imaging lens 31b, and an imaging element 31c. The objective lens 31a is a lens that is disposed in the imaging unit 31 at a position closest to the inspection object P1 side (object side). Furthermore, the objective lens 31a is disposed as a telecentric lens, and this telecentric lens is on the imaging element 31c side (image side), and the main light ray of the light passing through the objective lens 31a is roughly parallel to the optical axis of the objective lens 31a. The imaging lens 31b is configured to form an image of the light passing through the objective lens 31a. The objective lens 31a and the imaging lens 31b are disposed in the lens barrel 31d. The imaging element 31c includes, for example, a CMOS (Complementary Metal-Oxide Semiconductor) image sensor, which is configured to receive light passing through the objective lens 31a and the imaging lens 31b and convert it into an electrical signal. The imaging unit 31 has a telecentric optical system.

The concentric lighting section 32 has a concentric light source section 32a, an irradiation lens 32b, and a semi-reflecting mirror 32c. The concentric light source section 32a is configured to emit RGB concentric light in which red, green, and blue are arranged in concentric circles. The RGB concentric light includes a first color light in a substantially circular shape, a second color light in a substantially annular shape arranged in a manner surrounding the outer periphery of the first color light in a substantially circular shape, and a third color light in a substantially annular shape arranged in a manner surrounding the outer periphery of the second color light in a substantially annular shape. The first color light, the second color light, and the third color light are arranged in sequence from the center side toward the outer periphery side. Furthermore, there is no particular restriction on the arrangement order of red, green and blue in the RGB concentric circle light. In the first to fourth embodiments, for convenience, an example in which red, green and blue are arranged in sequence from the center side toward the peripheral side is described.

Referring to FIG. 3(A)(B), the first configuration example of the concentric light source section 32a is described. As shown in FIG. 3(A)(B), the concentric light source section 32a of the first configuration example includes a red light source 61, a green light source 62, and a blue light source 63 arranged in a concentric circle shape. The red light source 61 is arranged at the centermost side, and is configured to emit approximately circular red light. The red light source 61 includes a plurality of (4 in FIG. 3(B)) red LEDs. The green light source 62 is arranged in the middle position, and is configured to emit approximately annular green light. The green light source 62 includes a plurality of (16 in FIG. 3(B)) green LEDs. The blue light source 63 is arranged at the outermost peripheral side, and is configured to emit approximately annular blue light. The blue light source 63 includes a plurality of (32 in FIG. 3(B)) blue LEDs.

In the concentric light source section 32a of the first configuration example, a diffusion plate 64 is provided in front of the light emission direction of each color light source (61, 62, 63), and a partition plate 65 is provided between each color light source (61, 62, 63). The diffusion plate 64 is configured to diffuse the light emitted from the light source (61, 62, 63). The partition plate 65 is configured to separate the adjacent light sources in order to prevent the light (color) of the adjacent light sources from mixing. With these configurations, the concentric light source section 32a of the first configuration example is configured to emit RGB concentric light.

Referring to FIG. 4(A)(B), the second configuration example of the concentric light source portion 32a is described. As shown in FIG. 4(A)(B), the concentric light source portion 32a of the second configuration example includes a white light source 71, and an RGB concentric color filter 72 arranged at a position opposite to the white light source 71. The white light source 71 is configured to emit roughly circular white light. The white light source 71 includes a plurality of (17 in FIG. 4(B)) white LEDs. The concentric color filter 72 includes a red filter 72a, a green filter 72b, and a blue filter 72c arranged in a concentric shape. The red filter 72a is arranged at the centermost side, and is configured to selectively allow red light to pass through. The red filter 72a has a roughly circular shape, and is configured to allow roughly circular red light to pass through. The red filter 72a is made of, for example, red cellophane. The green filter 72b is arranged in the middle position and is configured to selectively allow green light to pass through. The green filter 72b has a roughly annular shape and is configured to allow roughly annular green light to pass through. The green filter 72b is made of, for example, green cellophane. The blue filter 72c is arranged on the outermost peripheral side and is configured to selectively allow blue light to pass through. The blue filter 72c has a roughly annular shape and is configured to allow roughly annular blue light to pass through. The blue filter 72c is made of, for example, blue cellophane.

In the concentric light source section 32a of the second configuration example, a diffusion plate 73 is provided between the white light source 71 and the concentric color filter 72. The diffusion plate 73 is configured to diffuse the light emitted from the white light source 71. With these configurations, the concentric light source section 32a of the second configuration example is configured to emit RGB concentric light.

As shown in FIG. 2 , the irradiation lens 32b is disposed between the concentric light source section 32a and the inspection object P1, and is configured to irradiate RGB concentric light from the concentric light source section 32a. The irradiation lens 32b is disposed as a telecentric lens, and this telecentric lens is disposed on the inspection object P1 side (object side), and the main light of the light (RGB concentric light from the concentric light source section 32a) passing through the irradiation lens 32b is substantially parallel to the optical axis of the irradiation lens 32b. The inspection object P1 is irradiated with RGB concentric light whose main light is substantially parallel to the optical axis of the irradiation lens 32b. Furthermore, the concentric light source section 32a is disposed at a position spaced apart from the irradiation lens 32b by a distance corresponding to the focal point of the irradiation lens 32b, so as to irradiate the inspection object P1 with RGB concentric light whose main light ray is substantially parallel to the optical axis of the irradiation lens 32b.

The semi-reflecting mirror 32c is disposed between the irradiating lens 32b and the inspection object P1, and is configured to be irradiated with the RGB concentric circular light passing through the irradiating lens 32b. The semi-reflecting mirror 32c is configured to change the advancing direction of the RGB concentric circular light by reflecting the RGB concentric circular light, thereby irradiating the inspection object P1 with the RGB concentric circular light. Furthermore, the semi-reflecting mirror 32c is configured to allow the RGB concentric circular light reflected by the inspection object P1 to pass through, so that the light is received by the imaging element 31c of the imaging section 31. The concentric circular illumination section 32 has a telecentric optical system, and functions as a coaxial illumination that irradiates the inspection object P1 with light (RGB concentric circular light) that is substantially coaxial with the optical axis of the imaging section 31. Furthermore, the center of the diameter of the RGB concentric light (the center of the diameter of the concentric light source section 32a), the optical axis of the irradiation lens 32b, and the optical axis of the imaging lens (objective lens 31a, imaging lens 31b) of the imaging section 31 are aligned so as to be roughly consistent.

With such a configuration, as shown in FIG5 , the concentric circle illumination unit 32 is configured to illuminate each point of the inspection surface of the inspection object P1 with RGB concentric circle lights whose main light is substantially parallel to the optical axis of the illumination lens 32b. Furthermore, the concentric circle illumination unit 32 is configured to illuminate the inspection surface of the inspection object P1 (substantially horizontal inspection surface) when the inspection object P1 is not tilted with RGB concentric circle lights whose main light is substantially perpendicular. Furthermore, in FIG5 , the illustration of the semi-reflective mirror 32c is omitted for easier understanding.

Here, in the present embodiment, the control device 40 of the installed substrate inspection device 100 is configured to perform the following control: based on the photographing result of the inspection object P1 irradiated with RGB concentric light by the concentric lighting unit 32 by the imaging unit 31, the tilt angle of the inspection object P1 is obtained, and based on the obtained tilt angle of the inspection object P1, the state of the inspection object P1 is inspected.

(Principle of Obtaining the Tilt Angle) Refer to Figures 6 and 7 to explain the principle of obtaining the tilt angle using RGB concentric circle light.

FIG6 shows the inclusive relationship between the observation stereo angle O formed by the camera unit 31 and the illumination stereo angle I formed by the concentric circle illumination unit 32. Here, the so-called observation stereo angle O represents the shooting range (light receiving range) of the camera unit 31 for each point on the inspection surface of the inspection object P1, and can be represented as a pyramid with each point on the inspection surface as the vertex. In addition, the so-called illumination stereo angle I represents the illumination range of the illumination light (RGB concentric circle light) for each point on the inspection surface of the inspection object P1, and can be represented as a pyramid with each point on the inspection surface as the vertex. In addition, the reflected light of the illumination light can also be represented by the same illumination stereo angle I as the illumination light. The so-called receiving light (shooting) by the imaging unit 31 refers to the part of the reflected light irradiating the stereo angle I that is included in the observation stereo angle O (the part overlapping with the observation stereo angle O).

Here, when the inspection surface of the inspection object P1 is not tilted (when the inspection surface is horizontal), if the irradiation light is reflected regularly on the inspection surface of the inspection object P1, the reflected light (regularly reflected light) is consistent with the irradiation light. On the other hand, when the inspection surface of the inspection object P1 is tilted at a tilt angle θb, if the irradiation light is reflected regularly on the inspection surface of the inspection object P1, the reflected light (regularly reflected light) is reflected in a direction symmetrical to the normal of the inspection surface of the inspection object P1 and the irradiation light (the direction after the irradiation light is tilted at a tilt angle 2θb). In this case, the inclusion relationship between the observation stereo angle O and the irradiation stereo angle I of the reflected light changes. Thereby, the brightness of each RGB color received (photographed) by the camera 31 changes.

FIG. 7 is a curve graph showing the change in brightness of each RGB color corresponding to the tilt angle of the inspection surface of the inspection object P1. In the curve graph of FIG. 7 , the vertical axis represents brightness (256 gray levels), and the horizontal axis represents the tilt angle of the inspection surface of the inspection object P1. According to the curve graph of FIG. 7 , it can be concluded that the brightness of each RGB color changes continuously according to the tilt angle of the inspection surface of the inspection object P1. Specifically, when the tilt angle of the inspection surface of the inspection object P1 is smaller, the ratio of red (R) is greater than that of green (G) and blue (B). Thereafter, as the tilt angle of the inspection surface of the inspection object P1 becomes medium, the ratio of red (R) gradually decreases, while the ratio of green (G) gradually increases. Thereafter, as the inclination angle of the inspection surface of the inspection object P1 further increases, the ratio of green (G) gradually decreases, while the ratio of blue (B) gradually increases.

Therefore, the tilt angle of the inspection surface of the inspection object P1 can be obtained by using the brightness change of each RGB color in the shooting result of the imaging unit 31. Specifically, the tilt angle of the inspection surface of the inspection object P1 can be obtained by using the ratio change of RGB in the shooting result of the imaging unit 31.

(Design example of stereo angle) Next, referring to Figures 8(A) to (C), the design example of the observation stereo angle O and the illumination stereo angle I is explained.

As shown in FIG8(A), the value of the observation angle O can be obtained using the following formulas (1) and (2). NA = M/2Fe        ・・・(1) θw = arcsin(NA)       ・・・(2) Here, NA: the numerical aperture of the object side of the imaging lens (objective lens) M: the shooting magnification of the imaging element Fe: the effective F value of the imaging lens (objective lens) θw: the value of the observation angle.

For example, when the shooting magnification M is 0.45 and the operating F-number Fe is 14.7, the numerical aperture NA is approximately 0.015306 (0.45/(2×14.7)). In this case, the value θw of the observation angle O is approximately 0.88 degrees (arcsin(0.015306)).

As shown in FIG8(B), the value of the illumination angle I can be obtained using the following formulas (3) to (5). F = f/Φ                ・・・(3) NA = 1/2F           ・・・(4) θL = arcsin(NA)        ・・・(5) Here, F: F value of the illumination lens f: focal distance of the illumination lens Φ: maximum diameter of the concentric light source part NA: numerical aperture of the illumination lens θL: value of the illumination angle (maximum value).

For example, when the focal distance f is 208.2 mm and the maximum diameter Φ is 26 mm, the F value F is about 8.007692 (208.2/26). In this case, the numerical aperture NA is about 0.06244 (1/(2×8.007692)). In addition, the value θL of the illumination angle I is about 3.58 degrees (arcsin(0.06244)).

In addition, the value of the illumination angle I of each RGB color can be obtained using the following formulas (6) to (8). θz＝θL×Φz/Φx         ・・・(6) θy＝θL×Φy/Φx－θz       ・・・(7) θx＝θL－(θy＋θz)          ・・・(8) Here, θz: The value of the illumination angle of the center color θy: The value of the illumination angle of the middle color θx: The value of the illumination angle of the outermost color θL: The value of the illumination angle (maximum value) Φz: The outermost diameter of the light source of the center color Φy: The outermost diameter of the light source of the middle color Φx: The outermost diameter of the light source of the outermost color.

For example, when the maximum value θL of the illumination stereo angle I is approximately 3.58 degrees, the outermost diameter Φz of the light source of the center color (red in the first embodiment) is 8.6 mm, the outermost diameter Φy of the light source of the middle color (green in the first embodiment) is 17.4 mm, and the outermost diameter Φx of the light source of the outermost color (blue in the first embodiment) is 26 mm, the value θx of the illumination stereo angle I of the center color is approximately 1.18 degrees (3.58×8.6/26), the value θy of the illumination stereo angle I of the middle color is approximately 1.21 degrees (3.58×17.4/26-1.18), and the value θx of the illumination stereo angle I of the outermost color is approximately 1.19 degrees (3.58-(1.21+1.18)). The value of the illumination angle I for each color can be set based on the outermost diameter of the light source for each color.

As shown in FIG8(C), the limit angle (see FIG6) can be obtained using the following formula (9). The limit angle is the angle between the optical axis of the observation angle O and the optical axis of the irradiation angle I of the reflected light when the observation angle O does not include the irradiation angle I of the reflected light. In addition, the tilt angle of the inspection surface of the inspection object P1 when the limit angle is included can be obtained using the following formula (10). θe＝θw＋θL        ・・・(9) θb＝θe/2       ・・・(10) Here, θe: limit angle θw: observation angle value θL: irradiation angle value θb: tilt angle of the inspection surface of the inspection object when the limit angle is included.

For example, when the value θw of the observation stereo angle O is about 0.88 degrees and the value θL of the illumination stereo angle I is about 3.58 degrees, the inclusive limit angle θe is about 4.46 degrees (0.88+3.58). Furthermore, the tilt angle θb of the inspection surface of the inspection object P1 when the inclusive limit angle θe is included is about 2.23 degrees (4.46/2). In this case, the range of the tilt angle of the inspection surface of the inspection object P1 that can be measured using the inclusive relationship between the observation stereo angle O and the illumination stereo angle I is 0 degrees to about 2.23 degrees.

Based on the above content, it can be concluded that by setting the value θw of the observation stereo angle O and the value θL of the illumination stereo angle I according to the angle range to be measured, the inclination angle of the inspection surface of the inspection object P1 can be measured within the required angle range.

(Inspection of inspection object) Next, referring to Figures 9 to 11, the inspection of inspection object P1 using RGB concentric circle light is explained.

In the present embodiment, the control device 40 is configured to perform the following control, i.e., to make the imaging unit 31 photograph the inspection object P1 (mounting substrate P) irradiated with RGB concentric circular light. Furthermore, the control device 40 is configured to obtain the imaging result of the inspection object P1 irradiated with RGB concentric circular light by the imaging unit 31. Furthermore, the control device 40 is configured to obtain the brightness of each color of red, green and blue (brightness of RGB) of the inspection object P1 in the imaging result based on the acquired imaging result. Furthermore, the control device 40 is configured to obtain the ratio of red, green and blue of the inspection object P1 in the imaging result, i.e., the RGB ratio, based on the brightness of each color of RGB obtained. Furthermore, the control device 40 is configured to obtain the tilt angle of the inspection object P1 based on the obtained RGB ratio of the inspection object P1. Specifically, the control device 40 is configured to obtain the tilt angle of the inspection object P1 based on the RGB ratio of the inspection object P1 and conversion information 42a for converting the pre-acquired RGB ratio into the tilt angle.

As shown in FIG9 , the conversion information 42a is a conversion table for converting the RGB ratio into the tilt angle. In the conversion information 42a, the RGB ratio is corresponded to the tilt angle. Specifically, in the conversion information 42a, the tilt angle is corresponded to each specific RGB ratio range. Furthermore, in FIG9 , for the sake of convenience, only the center value of the specific RGB ratio range is illustrated. The control device 40 is configured to obtain the tilt angle corresponding to the specific RGB ratio range from the conversion information 42a as the tilt angle of the inspection object P1 when the RGB ratio of the inspection object P1 obtained is within the specific RGB ratio range. The conversion information 42a is obtained in advance and stored in the memory unit 42. Furthermore, the details of the method for obtaining the conversion information 42a will be described below.

As shown in FIG. 10 and FIG. 11, the control device 40 is configured to perform the following control, that is, based on the tilt angle of the inspection object P1, the component E on the mounting substrate P as the inspection object P1 is inspected.

Specifically, as shown in FIG. 10 , the control device 40 is configured to perform the following control, that is, based on the tilt angle of the inspection object P1, the change point of the tilt angle (the change boundary of the tilt angle) is detected as a crack. Thus, the control device 40 is configured to perform the following control, that is, based on the tilt angle of the inspection object P1, the crack of the component E which is a semiconductor wafer chip (so-called die) is detected. The control device 40 is configured to perform the following control, that is, when the change of the tilt angle is greater than the reference value, the change point of the tilt angle is detected as a crack.

FIG10 is a schematic diagram of a cracked component E photographed under RGB concentric light. When component E is photographed under RGB concentric light, the two sides of the crack are usually photographed with surfaces having colors with different RGB ratios due to the different tilt angles on both sides of the crack. FIG10 shows an example in which one side of the crack is photographed with a blue color and the other side is photographed with a green color. In this case, the boundary between the blue color and the green color becomes a change point of the tilt angle, and is therefore detected as a crack. Furthermore, in order to make it easier to understand, Figure 10 shows an example where the colors on both sides of the crack are of different systems. However, even if the colors on both sides of the crack are of the same system (blue colors, etc.), as long as there is a change in the tilt angle above the reference value, it can be detected as a crack.

As shown in FIG. 11 , the control device 40 is configured to perform the following control, that is, based on the tilt angle of the inspection object P1, the bulge of the component E on the mounting substrate P is detected. Here, when the RGB concentric circle light is used, the tilt angle can be obtained, but the tilt direction is unknown. Therefore, it is difficult to distinguish between the case where the tilt angle of the component E is obtained due to the bulge of the component E on the mounting substrate P and the case where the tilt angle of the component E is obtained due to the tilt of the mounting substrate P itself even though the component E does not bulge.

Therefore, in the present embodiment, the control device 40 is configured to perform the following control, namely, to detect the protrusion of the part E on the mounting substrate P (the state of the inspection object P1) based on the tilt angle of the inspection object P1 and the height information of the inspection object P1, wherein the tilt angle of the inspection object P1 is obtained based on the result of photographing the inspection object P1 irradiated with RGB concentric circular light by the imaging unit 31, and the height information of the inspection object P1 is obtained using the three-dimensional measurement unit 34.

Specifically, the control device 40 is configured to obtain the tilt direction and tilt angle of the mounting substrate P and the tilt direction of the component E based on the height information of the inspection object P1 obtained by the three-dimensional measurement unit 34. Furthermore, the control device 40 is configured to obtain the angle difference between the tilt angle of the mounting substrate P obtained by the three-dimensional measurement unit 34 and the tilt angle of the component E obtained by the RGB concentric circle light, taking into account the tilt direction of the mounting substrate P obtained by the three-dimensional measurement unit 34 and the tilt direction of the component E. Furthermore, the control device 40 is configured to perform control such that, when the obtained angle difference is greater than a reference value, it is considered that the bulge of the component E on the mounting substrate P is detected. Furthermore, since this configuration cannot obtain sufficient scattered light, it is particularly effective for detecting the protrusion of certain parts E (semiconductor wafers, etc.), for example, parts E (semiconductor wafers, etc.) having a mirror surface whose tilt angle is difficult to accurately measure by the three-dimensional measurement unit 34 that uses scattered light for measurement. In addition, since the mounting substrate P can usually obtain sufficient scattered light, the tilt direction and tilt angle can be measured by the three-dimensional measurement unit 34. In addition, the tilt direction of the part E can also be measured by the three-dimensional measurement unit 34 when sufficient scattered light cannot be obtained.

(Table acquisition processing) Next, referring to FIG. 12 and FIG. 13 , the table acquisition processing performed by the mounting substrate inspection device 100 of the first embodiment is described based on the flowchart. Furthermore, the table acquisition processing is performed before the inspection object P1 is inspected by the mounting substrate inspection device 100. In addition, each processing of the flowchart can be performed by the control device 40 or by an operator.

As shown in FIG13, a jig J dedicated to obtaining the conversion information 42a is used to perform the table acquisition process. The jig J is a flat plate without color. For example, a mirrored aluminum plate can be used as the jig J.

As shown in FIG12 and FIG13, first, in step S1, the image capturing unit 31 captures the jig J illuminated with RGB concentric light by the concentric illumination unit 32. In the first step S1, the jig J is set to a horizontal state (a state with a tilt angle of 0).

Then, in step S2, based on the photographing result of the jig J, the RGB ratio of the jig J is obtained and saved.

Then, in step S3, the jig J is tilted at a specific angle (eg, 0.1 degrees).

Then, in step S4, it is determined whether the entire measurement range (e.g., a range of 2.5 degrees) has been measured. If it is determined that the entire measurement range has not been measured, the process proceeds to step S1. Then, until the measurement of the entire measurement range is completed, the process of steps S1 to S4 is repeated.

Furthermore, in step S4, when it is determined that the entire measurement range has been measured, the process proceeds to step S5. At the stage of proceeding to step S5, the measurement result of the change of the RGB ratio corresponding to the tilt angle of the jig J as shown in FIG. 9 can be obtained.

Then, in step S5, based on the measurement result of the RGB ratio change corresponding to the tilt angle of the jig J, conversion information 42a for converting the RGB ratio into the tilt angle is obtained (produced) and stored in the memory unit 42.

(Substrate inspection process) Next, referring to FIG. 14 , the substrate inspection process performed by the substrate inspection device 100 of the first embodiment will be described based on the flowchart. Furthermore, each process in the flowchart is performed by the control device 40.

As shown in FIG. 14 , first, in step S11 , the photographing result of the inspection object P1 (mounting substrate P) irradiated with RGB concentric circle light by the concentric circle illumination unit 32 by the photographing unit 31 is obtained.

Then, in step S12, the RGB ratio of the inspection object P1 is obtained based on the photographing result of the inspection object P1. In step S12, for example, the RGB ratio of each pixel in the photographing result (image) is obtained. Also, in step S12, for example, the RGB ratio of each pixel group in the photographing result (image) (the average RGB ratio in the group) is obtained. Furthermore, the pixel group is, for example, a group of pixels in the photographing result (image) that are considered to be on the same plane.

Then, in step S13, the tilt angle of the inspection object P1 is obtained based on the RGB ratio of the inspection object P1 and the conversion information 42a. In step S13, for example, the tilt angle of each pixel in the shooting result (image) is obtained. In step S12, for example, the tilt angle of each pixel group in the shooting result (image) is obtained.

Then, in step S14, the state of the inspection object P1 is inspected based on the tilt angle of the inspection object P1. In step S14, based on the tilt angle of the inspection object P1, the change point of the tilt angle is detected as a crack of the part E. In step S14, based on the tilt angle of the part E and the tilt direction of the mounting substrate P obtained by the three-dimensional measurement unit 34, the tilt angle and the tilt direction of the part E, the part E having an extreme angle difference with the mounting substrate P is detected as a part E that has generated a bulge from the mounting substrate P. Then, the substrate inspection process ends.

(Effects of the first implementation method) In the first implementation method, the following effects can be obtained.

In the first embodiment, as described above, the mounting substrate inspection device 100 is provided with: an imaging unit 31, which photographs the inspection object P1 including the mounting substrate P on which the part E is mounted; a concentric circle illumination unit 32, which irradiates the inspection object P1 with RGB concentric circle light arranged in concentric circles and having red (R), green (G) and blue (B); and a control device 40, which performs the following control, namely, based on the photographing result of the imaging unit 31 of the inspection object P1 irradiated with the RGB concentric circle light, obtains the tilt angle of the inspection object P1, and based on the obtained tilt angle of the inspection object P1, inspects the state of the inspection object P1. In this way, the tilt angle of the inspection object P1 can be obtained by using the fact that the brightness of each RGB color in the shooting result changes according to the tilt angle of the inspection object P1. Here, when the reflectivity of the inspection object P1 changes, the brightness (brightness) of each RGB color changes, but the change state (situation) of the brightness of each RGB color remains unchanged. Therefore, by utilizing the fact that the brightness of each RGB color in the photographing result changes according to the tilt angle of the inspection object P1, the tilt angle of the inspection object P1 can be obtained, which is different from the case where the tilt angle of the inspection object P1 is obtained based on the light and dark information of a single color. Regardless of how the reflectivity of the inspection object P1 changes, the tilt angle of the inspection object P1 can be obtained with high accuracy. As a result, the state of the inspection object P1 can be inspected with high accuracy based on the tilt angle.

In the first embodiment, as described above, the control device 40 is configured to obtain the tilt angle of the inspection object P1 based on the ratio of red, green and blue of the inspection object P1 in the photographing result, that is, the RGB ratio. In this way, the tilt angle of the inspection object P1 can be obtained with higher accuracy based on the RGB ratio that is not affected by the change in the reflectivity of the inspection object P1, so the state of the inspection object P1 can be inspected with higher accuracy based on the tilt angle.

In the first embodiment, as described above, the control device 40 is configured to obtain the tilt angle of the inspection object P1 based on the RGB ratio of the inspection object P1 and the conversion information 42a for converting the RGB ratio obtained in advance into the tilt angle. Thus, the tilt angle of the inspection object P1 can be simply and accurately obtained by converting the RGB ratio of the inspection object P1 into the tilt angle using only the conversion information 42a for converting the RGB ratio into the tilt angle.

Furthermore, in the first embodiment, as described above, the concentric circle illumination section 32 includes the red light source 61, the green light source 62, and the blue light source 63 arranged in a concentric circle shape, or includes the white light source 71 and the RGB concentric circle color filter 72 arranged at a position opposite to the white light source 71. Thus, when the concentric circle illumination section 32 includes the red light source 61, the green light source 62, and the blue light source 63 arranged in a concentric circle shape, RGB concentric circle lights of red, green, and blue arranged in a concentric circle shape can be easily obtained. Furthermore, when the concentric circle illumination section 32 includes the white light source 71 and the RGB concentric circle color filter 72 arranged at a position opposite to the white light source 71, unlike the case where the light sources of the RGB colors are provided individually, there is no need to separate the light sources from each other in order to suppress color mixing, so the structure of the concentric circle illumination section 32 can be simplified.

Furthermore, in the first embodiment, as described above, the control device 40 is configured to perform the following control, that is, based on the tilt angle of the inspection object P1, the change point of the tilt angle is detected as a crack. In this way, when a crack is generated, the tilt angles on both sides of the crack are usually different, so the change point of the tilt angle can be used to correspond to the crack, and the crack of the inspection object P1 can be detected with high precision. Here, although there is a method of detecting the dark part of the image as a crack, when detecting the dark part of the image as a crack, if the width of the crack is narrow (for example, less than 1 pixel), the crack in the image cannot be identified, and therefore the crack may not be detected. On the other hand, in the present configuration, the change point of the tilt angle is detected as a crack. Therefore, unlike the case where the dark part of the image is detected as a crack, even when the width of the crack is narrow and the crack in the image cannot be identified by the shape of the dark part, the crack can be detected with high accuracy.

In the first embodiment, as described above, the component E includes a semiconductor wafer. In addition, the control device 40 is configured to perform the following control, that is, to detect cracks in the semiconductor wafer based on the tilt angle of the inspection object P1. In this way, cracks can be detected with high accuracy in semiconductor wafers that are prone to cracks.

In the first embodiment, as described above, the control device 40 is configured to perform the following control, that is, based on the tilt angle of the inspection object P1, the bulge of the part E on the mounting substrate P is detected. Thereby, based on the tilt angle of the inspection object P1 obtained with high accuracy, the bulge of the part E on the mounting substrate P can be detected with high accuracy.

Furthermore, in the first embodiment, as described above, the mounted substrate inspection device 100 has a three-dimensional measuring unit 34 capable of measuring the height information of the inspection object P1. Furthermore, the control device 40 is configured to perform the following control, that is, to inspect the state of the inspection object P1 based on the tilt angle of the inspection object P1 and the height information of the inspection object P1, the tilt angle of the inspection object P1 being obtained based on the result of photographing the inspection object P1 irradiated with RGB concentric circular light by the imaging unit 31, and the height information of the inspection object P1 being obtained using the three-dimensional measuring unit 34. In this way, not only can the tilt angle of the inspection object P1 be obtained based on the shooting result of the inspection object P1 irradiated with RGB concentric light by the imaging unit 31, but also the state of the inspection object P1 can be inspected with higher accuracy based on the height information of the inspection object P1 obtained by the three-dimensional measurement unit 34.

[Second embodiment] Next, the second embodiment is described with reference to FIG. 15. In the second embodiment, unlike the first embodiment described above in which an illumination lens is provided in the concentric illumination section, an example in which the objective lens of the imaging section is used as the illumination lens of the concentric illumination section is described. Furthermore, the same components as those of the first embodiment described above are illustrated by the same symbols in the figure, and their description is omitted.

(Structure of the mounted substrate inspection device) As shown in FIG. 15 , the mounted substrate inspection device 200 of the second embodiment of the present invention is different from the mounted substrate inspection device 100 of the first embodiment in that it has a concentric circle illumination unit 132 instead of the concentric circle illumination unit 32 of the first embodiment. Furthermore, the mounted substrate inspection device 200 has a two-dimensional illumination unit 33 and a three-dimensional measurement unit 34. Furthermore, the mounted substrate inspection device 200 is an example of an "inspection device" in the scope of the patent application.

Here, in the second embodiment, as shown in FIG. 15 , the concentric circle illumination section 132 is configured to use the objective lens 31a disposed at the position closest to the inspection object P1 in the imaging section 31 to irradiate the inspection object P1 with RGB concentric circle light. That is, the concentric circle illumination section 132 of the second embodiment includes the objective lens 31a of the imaging section 31 instead of the irradiation lens 32b of the first embodiment described above. The objective lens 31a serves as both a photographing lens of the imaging section 31 and an irradiation lens of the concentric circle illumination section 132. Furthermore, the objective lens 31a is an example of a "photographing lens" in the scope of the patent application.

In the second embodiment, the objective lens 31a is disposed between the semi-reflecting mirror 32c and the inspection object P1, and is configured to be irradiated with RGB concentric light reflected by the semi-reflecting mirror 32c. The objective lens 31a is disposed as a telecentric lens so that the main light ray of the light (RGB concentric light from the concentric light source section 32a) passing through the objective lens 31a is substantially parallel to the optical axis of the objective lens 31a on the inspection object P1 side (object side). In addition, the concentric light source section 32a is disposed at a position separated from the objective lens 31a by a degree corresponding to the focal distance of the objective lens 31a, so as to irradiate the inspection object P1 with RGB concentric light whose main light ray is substantially parallel to the optical axis of the objective lens 31a.

Furthermore, the other structures of the second embodiment are the same as those of the first embodiment described above.

(Effects of the second implementation method) In the second implementation method, the following effects can be obtained.

In the second embodiment, as described above, the imaging unit 31 has the objective lens 31a. Furthermore, the concentric circle illumination unit 132 is configured to irradiate the inspection object P1 with RGB concentric circle light using the objective lens 31a. Thus, the existing objective lens 31a can be effectively utilized to irradiate the inspection object P1 with RGB concentric circle light, so there is no need to separately and independently provide an illumination lens in the concentric circle illumination unit 132. As a result, the structures of the imaging unit 31 and the concentric circle illumination unit 132 can be simplified, and the configuration space of the imaging unit 31 and the concentric circle illumination unit 132 can be saved.

In the second embodiment, as described above, the objective lens 31a is disposed at the position closest to the inspection object P1 in the imaging unit 31. Thus, the inspection object P1 can be irradiated with RGB concentric light using the objective lens 31a effectively.

Furthermore, other effects of the second embodiment are the same as those of the first embodiment described above.

[Third embodiment] Next, the third embodiment is described with reference to FIGS. 16 to 18. In the third embodiment, an example is described in which four colors are provided in the concentric circle illumination section, which is different from the first and second embodiments described above in which three colors are provided in the concentric circle illumination section. Furthermore, the same components as the first and second embodiments described above are illustrated by the same symbols in the drawings, and their description is omitted.

(Structure of the mounted substrate inspection device) As shown in FIG. 16, the mounted substrate inspection device 300 of the third embodiment of the present invention is different from the mounted substrate inspection device 200 of the second embodiment in that it has a concentric circle illumination unit 232 instead of the concentric circle illumination unit 132 of the second embodiment. Furthermore, the mounted substrate inspection device 300 has a two-dimensional illumination unit 33 and a three-dimensional measurement unit 34. Furthermore, the mounted substrate inspection device 300 is an example of an "inspection device" in the scope of the patent application.

Here, in the third embodiment, as shown in FIG. 16 , the concentric circle illumination section 232 is configured to emit RGB concentric circle light, which includes one circle of each of the three colors of RGB, and includes the same color as the color located at the center of the concentric circle in RGB at the outermost side of the concentric circle. Specifically, the concentric circle illumination section 232 has a concentric circle light source section 232a to replace the concentric circle light source section 32a of the second embodiment.

As shown in FIG. 16 and FIG. 17 , the concentric light source portion 232a is configured to emit RGB concentric light, which includes one circle of each of the three colors of RGB, and includes the same color as the color located at the center of the concentric circle in RGB at the outermost side of the concentric circle. The RGB concentric light includes a roughly circular first colored light, a roughly annular second colored light arranged in a manner surrounding the outer periphery of the roughly circular first colored light, a roughly annular third colored light arranged in a manner surrounding the outer periphery of the roughly annular second colored light, and a roughly annular first colored light arranged in a manner surrounding the outer periphery of the roughly annular third colored light. The first colored light at the center, the second colored light, the third colored light, and the first colored light at the outermost side are arranged in sequence from the center side toward the outer periphery side. Furthermore, there is no particular restriction on the arrangement order of red, green and blue in the RGB concentric circle light and the colors of the center and the outermost side. In the examples shown in Figures 16 and 17, as an example, red, green, blue and red are arranged in sequence from the center side to the peripheral side.

Furthermore, the concentric light source section 232a is configured to irradiate RGB concentric light such that the angle between the end (outer end) of the irradiation stereoscopic angle I of the center color and the start end (inner end) of the irradiation stereoscopic angle I of the outermost color is greater than the value of the observation stereoscopic angle O. That is, the concentric light source section 232a is configured to irradiate RGB concentric light such that two lights of the same color, the light of the center color and the light of the outermost color, are not simultaneously included in the observation stereoscopic angle O.

FIG. 18 is a graph showing the change in the RGB ratio corresponding to the tilt angle of the inspection surface of the inspection object P1 when the concentric circle illumination unit 232 of the third embodiment is used. Comparing the graph shown in FIG. 18 with the graph shown in FIG. 9 of the first embodiment, it can be seen that in the graph shown in FIG. 18, the ratio of red to blue changes in the final stage of the tilt angle measurement range of the inspection object P1 (that is, when the tilt angle of the inspection object P1 is larger). That is, according to the graph shown in FIG. 18, the tilt angle can also be obtained based on the brightness change (ratio change) of a plurality of colors (two colors) in the final stage of the tilt angle measurement range of the inspection object P1. That is, in the third embodiment, the tilt angle can be obtained when the reference data is increased in the last stage of the tilt angle measurement range of the inspection object P1. Furthermore, in the third embodiment, information corresponding to the curve diagram shown in FIG. 18 is obtained (created) as the conversion information 42a, but detailed description is omitted.

Furthermore, the other structures of the third embodiment are the same as those of the first and second embodiments described above.

(Effects of the third implementation method) In the third implementation method, the following effects can be obtained.

In the third embodiment, as described above, the concentric circle illumination unit 232 is configured to illuminate RGB concentric circle lights, which include one circle of each of the three colors of RGB, and include the same color as the color located at the center of the concentric circle in RGB at the outermost side of the concentric circle. Thus, by making the RGB concentric circle lights include the same color as the color located at the center of the concentric circle in RGB at the outermost side of the concentric circle, even in the final stage of the tilt angle measurement range of the inspection object P1 (i.e., when the tilt angle of the inspection object P1 is large), the tilt angle of the inspection object P1 can be obtained with high precision based on the brightness changes of multiple colors.

Furthermore, other effects of the third embodiment are the same as those of the first and second embodiments described above.

[Fourth Implementation] Next, the fourth implementation is described with reference to FIGS. 19 to 23. In the fourth implementation, in addition to the configuration of the first implementation, an example of obtaining the tilt angle by taking hue information into consideration is described. Furthermore, the same configuration as the first implementation is illustrated in the figure with the same symbols, and its description is omitted.

(Structure of the mounted substrate inspection device) As shown in FIG. 19(A)(B), the mounted substrate inspection device 400 of the fourth embodiment of the present invention is different from the mounted substrate inspection device 100 of the first embodiment in that it has a concentric circle illumination unit 332 instead of the concentric circle illumination unit 32 of the first embodiment. Furthermore, the mounted substrate inspection device 400 has a two-dimensional illumination unit 33 and a three-dimensional measurement unit 34. Furthermore, the mounted substrate inspection device 400 is an example of an "inspection device" in the scope of the patent application.

In the fourth embodiment, as shown in FIG. 19 (A) (B), the concentric circle illumination unit 332 is configured to illuminate the inspection object P1 with white light in addition to RGB concentric circle light. Specifically, the concentric circle illumination unit 332 has a concentric circle light source unit 332a instead of the concentric circle light source unit 32a of the first embodiment.

The concentric light source section 332a includes a red light source 61, a green light source 62, and a blue light source 63, and further includes a white light source 366. The white light source 366 is configured to emit white light that is roughly circular and roughly the same as the RGB concentric light. The white light source 366 includes a plurality of (17 in FIG. 19(B)) white LEDs. Furthermore, the concentric light source section 332a is configured to enable the red light source 61, the green light source 62, the blue light source 63, and the white light source 366 to be lit independently of each other. Thus, the concentric lighting section 332 is configured to independently illuminate the inspection object P1 with the RGB concentric light and the white light. In this case, there is no need to separately provide white lighting from the concentric lighting section 332, thereby being able to suppress the complexity of the device structure.

Here, referring to FIG. 20 and FIG. 21 , the difference in RGB reflection characteristics between a surface having hue and a surface having no hue is described.

As shown in FIG20 , the reflection characteristics of the surfaces without hue (mirror, white, black, and gray surfaces, etc.) for each RGB color are the same. Therefore, when the surface without hue is irradiated with RGB concentric light, the intensity of the reflected light will change according to the type of the surface without hue (mirror, white, black, and gray surfaces, etc.), but regardless of the type of the surface without hue (mirror, white, black, and gray surfaces, etc.), the RGB ratio of the reflected light remains unchanged. In this case, the tilt angle can be obtained by the conversion information 42a shown in FIG9 .

On the other hand, as shown in FIG. 21 , the reflection characteristics of the surfaces with hue (green surface, yellow surface, and red surface, etc.) to each RGB color will be different depending on the hue. Therefore, when the surfaces with hue are irradiated with RGB concentric circle light, the RGB ratio of the reflected light changes according to the type of the surfaces with hue (green surface, yellow surface, and red surface, etc.). In this case, it is difficult to obtain the tilt angle using only the conversion information 42a shown in FIG. 9 . Furthermore, in the mounting substrate P, the surfaces with hue are, for example, copper foil surfaces (surfaces with red hue) and gold foil surfaces (surfaces with yellow hue).

Therefore, as shown in Figure 22, in the fourth embodiment, the control device 40 is configured to obtain the tilt angle of the inspection object P1 based on the shooting result of the inspection object P1 irradiated with RGB concentric circular light by the imaging unit 31 and the hue information of the inspection object P1 obtained from the shooting result of the inspection object P1 irradiated with white light.

Specifically, the control device 40 is configured to perform the following control, namely, to make the imaging unit 31 photograph the inspection object P1 (mounting substrate P) irradiated with white light by the concentric circle illumination unit 332. Furthermore, the control device 40 is configured to obtain the photographing result of the inspection object P1 irradiated with white light by the imaging unit 31. Furthermore, the control device 40 is configured to obtain the brightness (hue information) of each RGB color of the inspection object P1 in the photographing result based on the obtained photographing result. Furthermore, the control device 40 is configured to obtain the hue correction coefficient (hue information) of the inspection object P1 based on the brightness of each RGB color of the inspection object P1 obtained. The hue correction coefficient is a coefficient used to eliminate the RGB ratio difference caused by hue. The hue correction coefficient is obtained, for example, as the inverse of the RGB ratio of the inspection object P1 under white light irradiation.

In addition, the control device 40 is configured to obtain the brightness of each RGB color based on the photographing result of the inspection object P1 irradiated with RGB concentric circle light by the concentric circle illumination unit 332, similarly to the first embodiment described above. In addition, the control device 40 is configured to perform the following control, that is, by multiplying the brightness of each RGB color of the inspection object P1 obtained using the RGB concentric circle light by the hue correction coefficient of the inspection object P1, to correct the photographing result of the inspection object P1 obtained using the RGB concentric circle light. In this way, the control device 40 is configured to obtain the photographing result of the inspection object P1 with the hue difference corrected.

Furthermore, the control device 40 is configured to obtain the RGB ratio of the inspection object P1 in which the hue difference is corrected based on the photographing result of the inspection object P1 after correction. Furthermore, the control device 40 is configured to obtain the tilt angle of the inspection object P1 based on the obtained RGB ratio of the inspection object P1. Specifically, the control device 40 is configured to obtain the tilt angle of the inspection object P1 based on the RGB ratio of the inspection object P1 and the conversion information 42a.

Furthermore, in the fourth embodiment, white light is irradiated along the same optical path (same irradiation path) of the RGB concentric circular light to obtain a photographing result of the inspection object P1 using the white light. Therefore, the hue correction coefficient (hue information) of the inspection object P1 can be obtained with high precision based on the photographing result of the inspection object P1 obtained using the white light.

Fig. 22 shows an example of performing the above hue correction on three surfaces: a silver surface without hue (semiconductor wafer chip), a yellow surface with hue (gold foil), and a red surface with hue (copper foil). The three surfaces are tilted at the same angle.

In the results of shooting under white light, the silver surface without hue has the same reflection characteristics for each RGB color, so the brightness of red, green and blue is 100. In addition, the yellow surface with hue has different reflection characteristics for each RGB color, so the brightness of red is 100, the brightness of green is 100, and the brightness of blue is 50. In addition, the red surface with hue has different reflection characteristics for each RGB color, so the brightness of red is 100, the brightness of green is 50, and the brightness of blue is 25.

When the hue correction coefficient is obtained based on the shooting result, the hue correction coefficient of the silver color without hue is 1 for red, green and blue (R coefficient: G coefficient: B coefficient = 1:1:1). In addition, the hue correction coefficient of the yellow color with hue is 1 for red, 1 for green and 2 for blue (R coefficient: G coefficient: B coefficient = 1:1:2). In addition, the hue correction coefficient of the red color with hue is 1 for red, 2 for green and 4 for blue (R coefficient: G coefficient: B coefficient = 1:2:4).

In the results of the shooting under the illumination of RGB concentric circle light, on the silver surface without hue, the brightness of red is 42, the brightness of green is 5, and the brightness of blue is 92. On the yellow surface with hue, it is difficult to obtain blue reflected light, so unlike the silver surface without hue, the brightness of red is 42, the brightness of green is 5, and the brightness of blue is 46. On the red surface with hue, it is difficult to obtain green and blue reflected light, so unlike the silver surface without hue, the brightness of red is 42, the brightness of green is 2.5, and the brightness of blue is 23.

In this way, when the above-mentioned hue correction is not performed, the RGB ratios of the three surfaces, namely the silver surface without hue, the yellow surface with hue, and the red surface with hue, are different. Therefore, even though the three surfaces have the same inclination angle, different inclination angles are obtained on the three surfaces.

On the other hand, when the shooting result under the illumination of RGB concentric circle light is corrected based on the hue correction coefficient, on the silver plane without hue, R coefficient: G coefficient: B coefficient = 1:1:1, so if the brightness is multiplied by the hue correction coefficient, the brightness of the corrected red becomes 42, the brightness of the corrected green becomes 5, and the brightness of the corrected blue becomes 92. On the yellow plane with hue, R coefficient: G coefficient: B coefficient = 1:1:2, so if the brightness is multiplied by the hue correction coefficient, the brightness of the corrected red becomes 42, the brightness of the corrected green becomes 5, and the brightness of the blue becomes 92. Moreover, on the red plane with hue, R coefficient: G coefficient: B coefficient = 1:2:4. Therefore, if the brightness is multiplied by the hue correction coefficient, the brightness of the corrected red becomes 42, the brightness of the corrected green becomes 5, and the brightness of the blue becomes 92.

In this way, when the above-mentioned hue correction is performed, since the RGB ratios of the three surfaces, namely the silver surface without hue, the yellow surface with hue, and the red surface with hue, are the same, the same inclination angle can be obtained on the three surfaces with the same inclination angle.

(Substrate inspection process) Next, referring to FIG. 23 , the substrate inspection process performed by the substrate inspection device 400 of the fourth embodiment will be described based on the flowchart. Furthermore, each process in the flowchart is performed by the control device 40.

As shown in FIG. 23 , first, in step S21 , the image capturing result of the inspection object P1 (mounting substrate P) irradiated with white light by the concentric circle illumination unit 332 by the image capturing unit 31 is obtained.

Then, in step S22, the hue correction coefficient of the inspection object P1 is obtained based on the photographing result of the inspection object P1. In step S22, for example, the hue correction coefficient of each pixel in the photographing result (image) is obtained. Also, in step S22, for example, the hue correction coefficient of each pixel group in the photographing result (image) (the average hue correction coefficient in the group) is obtained.

Then, in step S23, the photographing result of the inspection object P1 (mounting substrate P) irradiated with RGB concentric circle light by the concentric circle illumination unit 332 by the imaging unit 31 is obtained.

Then, in step S24, based on the hue correction coefficient, the photographing result of the inspection object P1 obtained using the RGB concentric circle light is corrected.

Then, in step S25, based on the corrected photographing result of the inspection object P1, the RGB ratio of the inspection object P1 is obtained. In step S25, for example, the RGB ratio of each pixel in the photographing result (image) is obtained. Also, in step S25, for example, the RGB ratio of each pixel group in the photographing result (image) is obtained.

Then, in step S26, based on the corrected RGB ratio of the inspection object P1 and the conversion information 42a, the tilt angle of the inspection object P1 is obtained. In step S26, for example, the tilt angle of each pixel in the shooting result (image) is obtained. In step S12, for example, the tilt angle of each pixel group in the shooting result (image) is obtained.

Then, in step S27, the state of the inspection object P1 is inspected based on the tilt angle of the inspection object P1. In step S27, based on the tilt angle of the inspection object P1, the change point of the tilt angle is detected as a crack of the part E. In step S27, based on the tilt angle of the part E and the tilt direction of the mounting substrate P obtained by the three-dimensional measurement unit 34, the tilt angle and the tilt direction of the part E, the part E having an extreme angle difference with the mounting substrate P is detected as the part E that is raised from the mounting substrate P. Then, the substrate inspection process is terminated.

Furthermore, the other structures of the fourth embodiment are the same as those of the first embodiment described above.

(Effects of the 4th Implementation Method) In the 4th Implementation Method, the following effects can be obtained.

In the fourth embodiment, as described above, the control device 40 is configured to obtain the tilt angle of the inspection object P1 based on the image capturing result of the inspection object P1 irradiated with RGB concentric light and the hue information of the inspection object P1 obtained from the image capturing result of the inspection object P1 irradiated with white light by the imaging unit 31. In this way, the tilt angle of the inspection object P1 can be obtained with higher accuracy, taking into account that the RGB reflection characteristics on the surface with hue and the surface without hue are different, and that even for the surface with hue, the RGB reflection characteristics are different depending on the hue.

Furthermore, other effects of the fourth embodiment are the same as those of the first embodiment described above.

(Variations) Furthermore, it should be understood that the embodiments disclosed this time are illustrative in all aspects and are not limiting. The scope of the present invention is not indicated by the description of the embodiments above, but by the scope of the patent application, and further includes all changes (variations) within the same meaning and scope as the scope of the patent application.

For example, the first to fourth embodiments above show an example of applying the present invention to a mounting substrate inspection device, but the present invention is not limited thereto. The present invention can also be applied to inspection devices other than mounting substrate inspection devices. Furthermore, the present invention is difficult to obtain sufficient scattered light from mirror components and transparent components (transparent housings, etc.), so it is particularly suitable for inspecting components (inspection objects) whose tilt angle information is difficult to obtain.

Furthermore, in the above-mentioned first to fourth embodiments, an example is shown in which the mounted substrate inspection device (inspection device) is equipped with a two-dimensional illumination unit and a three-dimensional measurement unit, but the present invention is not limited thereto. In the present invention, the inspection device may not be equipped with a two-dimensional illumination unit and a three-dimensional measurement unit. Furthermore, the inspection device may only be equipped with one of the two-dimensional illumination unit and the three-dimensional measurement unit.

Furthermore, in the first to fourth embodiments, a half mirror is provided between the concentric light source and the inspection object, but the present invention is not limited thereto. In the present invention, a prism may also be provided between the concentric light source and the inspection object.

Furthermore, in the first to fourth embodiments, the conversion information is shown as an example of a conversion table, but the present invention is not limited thereto. In the present invention, the conversion information may also be a conversion function for converting an RGB ratio into a tilt angle.

Furthermore, in the first to fourth embodiments, examples of detecting cracks and bulges of parts based on the tilt angle of the inspection object are shown, but the present invention is not limited thereto. In the present invention, deformation of the inspection object (parts and substrate, etc.) can also be detected based on the tilt angle of the inspection object.

Furthermore, in the first to fourth embodiments, the cracks of the semiconductor wafer are detected based on the tilt angle of the inspection object, but the present invention is not limited to this. In the present invention, the cracks of the mold part (transparent resin part) of the LED component can also be detected based on the tilt angle of the inspection object.

Furthermore, in the first to fourth embodiments, an example of detecting the bulge of a part based on the tilt angle of the inspection object and the height information of the inspection object is shown, the tilt angle of the inspection object is obtained based on the result of photographing the inspection object irradiated with RGB concentric light by the imaging unit, and the height information of the inspection object is obtained using the three-dimensional measurement unit, but the present invention is not limited to this. In the present invention, cracks of a part can also be detected based on the tilt angle of the inspection object and the height information of the inspection object, the tilt angle of the inspection object is obtained based on the result of photographing the inspection object irradiated with RGB concentric light by the imaging unit, and the height information of the inspection object is obtained using the three-dimensional measurement unit. Furthermore, in the present invention, if possible, the bulge of the part can be detected only based on the tilt angle of the inspection object obtained based on the result of photographing the inspection object irradiated with RGB concentric circular light by the imaging unit.

In the first and fourth embodiments, for the sake of convenience, the control process is described using a process-driven process in which the process is performed sequentially according to the process flow, but the present invention is not limited thereto. In the present invention, the control process can also be performed by an event-driven process in which the process is performed in units of events. In this case, the control process can be performed by a complete event-driven process or by combining event-driven and process-driven processes.

10: Substrate transport conveyor 20: Head moving mechanism 21: X-axis motor 22: Y-axis motor 23: Z-axis motor 30: Camera head 31: Camera unit 31a: Objective lens 31b: Imaging lens 31c: Camera element 31d: Lens barrel 32: Concentric circle illumination unit 32a: Concentric circle light source unit 32b: Illumination lens 32c: Semi-reflective mirror 33: Two-dimensional illumination unit 33a: Dome illumination unit 33b: Low-angle illumination unit 34: Three-dimensional measurement unit 40: Control device 41: Control unit 42: Memory unit 42a: Conversion information 43: Image processing unit 44: Camera control unit 45: Lighting control unit 46: Motor control unit 51: Reflection unit 52: Light source unit 53: Mounting unit 54: Light source unit 61: Red light source 62: Green light source 63: Blue light source 64: Diffuser 65: Spacer 71: White light source 72: RGB concentric circle color filter 72a: Red filter 72b: Green filter 72c: Blue filter 73: Diffuser 100: Mounting substrate inspection device 132: Concentric circle lighting unit 200: Mounting substrate inspection device 300: Mounting substrate inspection device 332: Concentric circle lighting unit 332a: Concentric circle light source unit 366: White light source 400: Mounting substrate inspection device E: Parts I: Illumination angle J: Fixture O: Observation angle P: Mounting substrate P1: Inspection object

FIG. 1 is a schematic diagram showing a mounting substrate inspection device of the first embodiment. FIG. 2 is a schematic diagram showing a concentric circle illumination unit and an imaging unit of the first embodiment. FIG. 3A is a schematic diagram showing a light source unit of the first example of the concentric circle illumination unit of the first embodiment observed from a direction substantially orthogonal to the optical axis. FIG. 3B is a schematic diagram showing a light source unit of the first example of the concentric circle illumination unit of the first embodiment observed from the direction of the optical axis. FIG. 4A is a schematic diagram showing a light source unit of the second example of the concentric circle illumination unit of the first embodiment observed from a direction substantially orthogonal to the optical axis. FIG. 4B is a schematic diagram showing a light source unit of the second example of the concentric circle illumination unit of the first embodiment observed from the direction of the optical axis. FIG. 5 is a schematic diagram for explaining RGB concentric circle lights emitted by the concentric circle illumination unit of the first embodiment. FIG. 6 is a schematic diagram for explaining the principle of obtaining the tilt angle of the inspection object using the mounting substrate inspection device of the first embodiment. FIG. 7 is a curve diagram for explaining the change in brightness of each RGB color corresponding to the tilt angle of the inspection object of the first embodiment. FIG. 8A is a schematic diagram showing the observation stereo angle of the first embodiment. FIG. 8B is a schematic diagram showing the illumination stereo angle of the first embodiment. FIG. 8C is a schematic diagram showing the limit angle of the first embodiment. FIG. 9 is a schematic diagram for explaining the change in RGB ratio corresponding to the tilt angle of the inspection object of the first embodiment, and the acquisition of conversion information for converting the RGB ratio into the tilt angle. FIG. 10 is a schematic diagram for explaining the detection of component cracks in the first embodiment. FIG. 11 is a schematic diagram for explaining the detection of component bulges in the first embodiment. FIG. 12 is a flow chart for explaining the table acquisition process in the first embodiment. FIG. 13 is a schematic diagram for explaining the table acquisition process in the first embodiment. FIG. 14 is a flow chart for explaining the substrate inspection process in the first embodiment. FIG. 15 is a schematic diagram showing the concentric circle illumination unit and the imaging unit in the second embodiment. FIG. 16 is a schematic diagram showing the concentric circle illumination unit and the imaging unit in the third embodiment. FIG. 17 is a schematic diagram for explaining the RGB concentric circle light emitted by the concentric circle illumination unit in the third embodiment. FIG. 18 is a graph for explaining the change of the RGB ratio corresponding to the tilt angle of the inspection object of the third embodiment. FIG. 19A is a schematic diagram obtained by observing the light source part of the concentric circle illumination part of the fourth embodiment from a direction substantially orthogonal to the optical axis. FIG. 19B is a schematic diagram obtained by observing the light source part of the concentric circle illumination part of the fourth embodiment from the optical axis direction. FIG. 20 is a schematic diagram for explaining the RGB ratio in a surface without hue. FIG. 21 is a schematic diagram for explaining the RGB ratio in a surface with hue. FIG. 22 is a schematic diagram for explaining the acquisition of hue information and the correction based on hue information of the fourth embodiment. FIG. 23 is a flowchart for explaining the substrate inspection process of the fourth embodiment.

31: Camera Department

31a:Objective lens

31b: Imaging lens

31c: Imaging components

31d: Lens tube

32: Concentric circle lighting unit

32a: Concentric light source section

32b: Irradiation lens

32c: Half-reflective mirror

P1: Inspection object

Claims (12)

A mounting substrate inspection device comprises: a camera unit for photographing an inspection object including a mounting substrate on which parts are mounted; a concentric circle illumination unit for irradiating the inspection object with RGB concentric circle lights arranged in concentric circles of red (R), green (G) and blue (B); and a control unit for performing the following control, namely, obtaining the tilt angle of the inspection object based on the photographing result of the inspection object irradiated with the RGB concentric circle lights by the camera unit, and inspecting the state of the inspection object based on the obtained tilt angle of the inspection object; and the concentric circle illumination unit is configured to irradiate the RGB concentric circle lights, the RGB concentric circle lights include one circle of each of the three RGB colors, and the outermost side of the concentric circle includes the same RGB color as the RGB color at the center of the concentric circle. As in claim 1, the control unit is configured to obtain the tilt angle of the inspection object based on the ratio of red, green and blue of the inspection object in the shooting result, i.e., the RGB ratio. As in claim 2, the mounting substrate inspection device, wherein the control unit is configured to obtain the tilt angle of the inspection object based on the RGB ratio of the inspection object and conversion information for converting the pre-acquired RGB ratio into a tilt angle. As in any one of claims 1 to 3, the mounting substrate inspection device, wherein the concentric circle illumination unit includes a red light source, a green light source and a blue light source arranged in a concentric circle shape, or includes a white light source and an RGB concentric circle color filter arranged at a position opposite to the white light source. As in any one of claims 1 to 3, the control unit is configured to perform the following control, that is, when the tilt angle of the inspection object changes to a value greater than a reference value, the change point of the tilt angle is detected as a crack. As in claim 5, the mounting substrate inspection device, wherein the above-mentioned parts include semiconductor wafer chips, and the above-mentioned control unit is configured to perform the following control, that is, based on the tilt angle of the above-mentioned inspection object, detect cracks in the above-mentioned semiconductor wafer chips. As in any one of claims 1 to 3, the control unit is configured to perform the following control, that is, to detect the protrusion of the above-mentioned part on the above-mentioned mounting substrate based on the tilt angle of the above-mentioned inspection object. The mounting substrate inspection device of any one of claims 1 to 3 further comprises a three-dimensional measuring unit, which is capable of measuring the height information of the inspection object, and the control unit is configured to perform the following control, that is, inspect the state of the inspection object according to the tilt angle of the inspection object and the height information of the inspection object, the tilt angle of the inspection object is obtained based on the result of the photography unit photographing the inspection object irradiated with the RGB concentric circle light, and the height information of the inspection object is obtained using the three-dimensional measuring unit. As in any one of claims 1 to 3, the mounting substrate inspection device, wherein the imaging unit has a photographing lens, and the concentric circle illumination unit is configured to irradiate the inspection object with the RGB concentric circle light using the photographing lens. As in claim 9, the substrate inspection device is installed, wherein the photographing lens is an objective lens arranged in the imaging unit at a position closest to the inspection object side. The mounting substrate inspection device of any one of claims 1 to 3, wherein the concentric circle illumination unit further comprises a white light source that is independent of the RGB concentric circle light and can irradiate white light to the inspection object; the control unit is configured to obtain the tilt angle of the inspection object based on the photographing result of the inspection object irradiated with the RGB concentric circle light by the imaging unit and the hue information of the inspection object obtained from the photographing result of the inspection object irradiated with the white light. A testing device comprises: an imaging unit for photographing a test object; a concentric circle illumination unit for irradiating the test object with RGB concentric circle lights arranged in concentric circles of red (R), green (G) and blue (B); and a control unit for performing the following control, i.e., obtaining the tilt angle of the test object based on the photographing result of the test object irradiated with the RGB concentric circle lights by the imaging unit, and inspecting the state of the test object based on the obtained tilt angle of the test object; and the concentric circle illumination unit is configured to irradiate the RGB concentric circle lights, wherein the RGB concentric circle lights include one circle of each of the three RGB colors, and the outermost side of the concentric circle includes the same RGB color as the RGB color at the center of the concentric circle.