TWI871102B - Heat dissipating system - Google Patents

Abstract

A heat dissipation system includes a casing, a keyboard module, a circuit board, a spacer and a first fan. The casing includes a top and a bottom opposite to each other. The top includes at least one first opening. The keyboard module is disposed in the casing. The keyboard module includes a membrane and a plurality of keys disposed on the membrane, and the keys are exposed from the top. The circuit board is disposed in the casing, and the circuit board is located below the membrane. The spacer is disposed in the casing and located between the circuit board and the membrane. The spacer is used to define a first gas flow space between the circuit board and the membrane. The first gas flow space is connected to the first opening of the casing. The first fan is disposed in the casing and corresponds to the first gas flow space. The first fan includes a first air inlet connected to the first gas flow space.

Description

Cooling system

The present invention relates to a heat dissipation system, and more particularly to a heat dissipation system for electronic devices.

As electronic devices become thinner and lighter and their performance continues to improve, the requirements for heat dissipation efficiency of electronic devices are also getting higher and higher. Take laptops as an example. Currently, most laptops on the market have heat dissipation vents designed at the bottom of the case. However, as the performance of the cooling fan becomes higher and higher, the air intake volume of the vents at the bottom of the case alone is not enough to meet the demand.

Therefore, how to solve the above problems has become the focus of relevant personnel in this field.

One aspect of the present invention is to provide a heat dissipation system for an electronic device to solve the problems caused by the prior art.

The present invention relates to a heat dissipation system for electronic devices, which includes a casing, a keyboard module, a circuit board, a spacer and a first fan. The casing includes a top and a bottom opposite to each other, and the top includes at least one first opening. The keyboard module is disposed in the casing. The keyboard module includes a thin film circuit board and a plurality of keys disposed on the thin film circuit board, and the keys are exposed from the top. The circuit board is disposed in the casing, and the circuit board is located below the thin film circuit board of the keyboard module. The spacer is disposed in the casing and is located between the circuit board and the thin film circuit board, and the spacer is used to define a first gas flow space between the circuit board and the thin film circuit board. The first gas flow space is connected to the first opening of the casing. The first fan is disposed in the housing and corresponds to the first gas flow space, and the first fan includes a first air inlet that is connected to the first gas flow space.

According to one or more embodiments of the present invention, the above-mentioned circuit board includes a first opening, a first fan is configured in the first opening and is located below the thin film circuit board, the first fan further includes a first top surface facing the thin film circuit board, a first air inlet is opened on the first top surface, a first gap is provided between the first top surface and the thin film circuit board, and the first gas flow space includes the first gap.

According to one or more embodiments of the present invention, the above-mentioned heat dissipation system further includes a second fan, the top of the casing further includes at least one second opening, the spacer is used to define a second gas flow space between the circuit board and the thin film circuit board, the second gas flow space is located on one side of the first gas flow space, the second gas flow space is connected to the second opening, the second fan is arranged in the casing and corresponds to the second gas flow space, the second fan includes a second air inlet, and the second air inlet is connected to the second gas flow space.

According to one or more embodiments of the present invention, the above-mentioned circuit board includes a second opening, a second fan is configured in the second opening and is located below the thin film circuit board, the second fan further includes a second top surface facing the thin film circuit board, a second air inlet is opened on the second top surface, a second gap is provided between the second top surface and the thin film circuit board, and the second gas flow space includes the second gap.

According to one or more embodiments of the present invention, the above-mentioned heat dissipation system further includes a third fan, the top of the casing further includes at least one third opening, the spacer is used to define a third gas flow space between the circuit board and the thin film circuit board, the third gas flow space is located on the other side opposite to the first gas flow space, the third gas flow space is connected to the third opening, the third fan is arranged in the casing and corresponds to the third gas flow space, the third fan includes a third air inlet, and the third air inlet is connected to the second gas flow space.

According to one or more embodiments of the present invention, the above-mentioned circuit board further includes a third opening, a third fan is configured in the third opening and is located below the thin film circuit board, the third fan further includes a third top surface facing the thin film circuit board, a third air inlet is opened on the third top surface, a third gap is provided between the third top surface and the thin film circuit board, and the third gas flow space includes the third gap.

According to one or more embodiments of the present invention, the top of the above-mentioned casing further includes at least one fourth opening and at least one fifth opening, the fourth opening is connected to the second gas flow space, and the fourth opening corresponds to the second air inlet of the second fan, and the fifth opening is connected to the third gas flow space, and the fifth opening corresponds to the third air inlet of the third fan.

According to one or more embodiments of the present invention, the top of the above-mentioned casing further includes a key configuration area, and the keys of the keyboard module are exposed from the key configuration area. The number of first openings is multiple, the number of second openings is multiple, the number of third openings is multiple, the number of fourth openings is multiple, and the number of fifth openings is multiple. The first openings are arranged along the first side of the key configuration area, the second openings are arranged along the second side of the key configuration area, the third openings are arranged along the third side of the key configuration area, the fourth openings and the fifth openings are arranged along the fourth side of the key configuration area respectively, and the first side is opposite to the fourth side, and the second side is opposite to the third side.

According to one or more embodiments of the present invention, the above-mentioned casing further includes a plurality of side portions, which are connected between the top and the bottom, and these side portions include a first side opening area, a second side opening area, and a third side opening area, the first side opening area is connected to the first gas flow space, the second side opening area is connected to the second gas flow space, and the third side opening area is connected to the third gas flow space.

According to one or more embodiments of the present invention, the first fan further includes a first air outlet, the second fan further includes a second air outlet, and the third fan further includes a third air outlet. The first air outlet corresponds to the first side opening area, the second air outlet corresponds to the second side opening area, and the third air outlet corresponds to the third side opening area.

According to one or more embodiments of the present invention, the above-mentioned heat dissipation system further includes a first heat dissipation fin set, a second heat dissipation fin set and a third heat dissipation fin set, the first heat dissipation fin set is located between the first air outlet of the first fan and the first side opening area, the second heat dissipation fin set is located between the second air outlet of the second fan and the second side opening area, and the third heat dissipation fin set is located between the third air outlet of the third fan and the third side opening area.

According to one or more embodiments of the present invention, the electronic device includes a first heat source and a second heat source, and a first fan is located between the first heat source and the second heat source.

In summary, the heat dissipation system of the embodiment of the present invention utilizes the opening design in the appearance and defines the first gas flow space, the second gas flow space and the third gas flow space between the thin film circuit board and the circuit board of the keyboard module through the spacer. These gas flow spaces can ensure that the cold air passing through these first openings, these second openings and these third openings flows to the air inlet of the corresponding fan without escaping to other areas, so that the efficiency of the fan to introduce cold air is greatly improved. When the efficiency of the fan to introduce cold air is improved, the heat dissipation efficiency of the entire system is greatly improved, and the use efficiency of the electronic device is effectively improved.

The following will disclose multiple embodiments of the present invention through drawings. For the purpose of clarity, many practical details will be described together in the following description. However, those skilled in the art should understand that in some embodiments of the present invention, these practical details are not necessary and therefore should not be used to limit the present invention. In addition, in order to simplify the drawings, some commonly used structures and components will be depicted in the drawings in a simple schematic manner. In addition, in order to facilitate the reader's viewing, the size of each component in the drawings is not drawn according to the actual scale.

Please refer to Figures 1 to 8, Figure 1 is a schematic top view of a heat dissipation system of an embodiment of the present invention. Figure 2 is a schematic bottom view of a heat dissipation system of an embodiment of the present invention. Figure 3 is a schematic cross-sectional view along the AA line segment shown in Figure 1. Figure 4 is a schematic cross-sectional view along the BB line segment shown in Figure 1. Figure 5 is a schematic cross-sectional view along the CC line segment shown in Figure 1. Figure 6 is a schematic cross-sectional view along the DD line segment shown in Figure 1. Figure 7 is a schematic cross-sectional view along the EE line segment shown in Figure 1. Figure 8 is a schematic top view with some components of Figure 1 omitted.

As shown in FIG. 1 and FIG. 2, the heat dissipation system 1 of this embodiment is used for an electronic device. In this embodiment, the electronic device is a portable electronic device such as a laptop or a palmtop computer, but the present invention is not limited thereto. Taking a laptop as an example, the laptop includes a system end and a panel end connected to each other, and the heat dissipation system 1 of this embodiment is constructed on the system end of the laptop.

As shown in FIGS. 1 to 8 , the heat dissipation system 1 of the present embodiment includes a housing 10, a keyboard module 11, a circuit board 12, a spacer 13, and a first fan 14. The housing 10 includes a top 101 and a bottom 102 opposite to each other. The top 101 of the housing 10 includes at least one first opening T1. The keyboard module 11 is disposed in the housing 10. The keyboard module 11 includes a thin film circuit board 111 and a plurality of keys 112 disposed on the thin film circuit board 111, and the keys 112 are exposed from the top 101 of the housing 10. The circuit board 12 is disposed in the housing 10, and the circuit board 12 is located below the thin film circuit board 111 of the keyboard module 11. The spacer 13 is disposed in the housing 10, and the spacer 13 is located between the circuit board 12 and the thin film circuit board 111 of the keyboard module 11. The spacer 13 is used to define a first gas flow space R1 between the circuit board 12 and the thin film circuit board 111. The first gas flow space R1 is connected to the first opening T1 of the housing 10. The first fan 14 is disposed in the housing 10 and corresponds to the first gas flow space R1. The first fan 14 includes a first air inlet 141, and the first air inlet 141 of the first fan 14 is connected to the first gas flow space R1.

It should be particularly noted that the case 10 of the present embodiment can be regarded as a system terminal case of a notebook computer. Therefore, in addition to accommodating components related to the heat dissipation system 1 of the present embodiment, the case 10 also accommodates other components that do not belong to the heat dissipation system 1, such as a touch panel, a central processing unit, a graphics processing unit, an input/output interface, and other devices or components. In the present embodiment, the first fan 14 is disposed between the first heat source H1 and the second heat source H2, and the first heat source H1 and the second heat source H2 are the aforementioned central processing unit (CPU) and graphics processing unit (GPU), respectively.

The following further describes other detailed structures of the heat dissipation system 1 of this embodiment.

As shown in FIG. 5 and FIG. 8 , the circuit board 12 of the present embodiment includes a first opening 121. The first fan 14 is disposed in the first opening 121 of the circuit board 12, and the first fan 14 is located below the thin film circuit board 111 of the keyboard module 11. In the present embodiment, the first fan 14 further includes a first top surface 140 facing the thin film circuit board 111, a first air inlet 141 of the first fan 14 is opened on the first top surface 140, and a first gap G1 is provided between the first top surface 140 and the thin film circuit board 111. The first gas flow space R1 includes the first gap G1 defined between the first top surface 140 and the thin film circuit board 111, that is, the space between the first fan 14 and the thin film circuit board 111 is connected to the first gas flow space R1.

As shown in FIG. 1, FIG. 3, FIG. 6 and FIG. 8, the heat dissipation system 1 of the present embodiment further includes a second fan 15, and the top 101 of the housing 10 further includes at least one second opening T2. In the present embodiment, the spacer 13 is used to define a second gas flow space R2 between the circuit board 12 and the thin film circuit board 111, the second gas flow space R2 is located on one side of the first gas flow space R1, and the second gas flow space R2 is connected to the second opening T2 of the housing 10. The second fan 15 is disposed in the housing 10 and corresponds to the second gas flow space R2. The second fan 15 includes a second air inlet 151, and the second air inlet 151 of the second fan 15 is connected to the second gas flow space R2.

As shown in FIG6 and FIG8 , the circuit board 12 of this embodiment further includes a second opening 122, and the second opening 122 is located at one side of the first opening 121. The second fan 15 is disposed in the second opening 122 of the circuit board 12, and the second fan 15 is located below the thin film circuit board 111 of the keyboard module 11. In the present embodiment, the second fan 15 further includes a second top surface 150 facing the thin film circuit board 111, a second air inlet 151 of the second fan 15 is opened on the second top surface 150, and a second gap G2 is provided between the second top surface 150 and the thin film circuit board 111. The second gas flow space R2 includes the second gap G2 defined between the second top surface 150 and the thin film circuit board 111, that is, the space between the second fan 15 and the thin film circuit board 111 is connected to the second gas flow space R2.

As shown in FIG. 1, FIG. 4, FIG. 7 and FIG. 8, the heat dissipation system 1 of the present embodiment further includes a third fan 16, and the top 101 of the housing 10 further includes at least one third opening T3. In the present embodiment, the spacer 13 is used to define a third gas flow space R3 between the circuit board 12 and the thin film circuit board 111. The third gas flow space R3 is located on the other side opposite to the first gas flow space R1, that is, the first gas flow space R1 is located between the second gas flow space R2 and the third gas flow space R3, and the third gas flow space R3 is connected to the third opening T3 of the housing 10. The third fan 16 is disposed in the housing 10 and corresponds to the third gas flow space R3. The third fan 16 includes a third air inlet 161 , and the third air inlet 161 of the third fan 16 is connected to the third air flow space R3 .

As shown in FIGS. 7 and 8 , the circuit board 12 of this embodiment further includes a third opening 123, which is located on the other side of the first opening 121. The third fan 16 is disposed in the third opening 123 of the circuit board 12, and the third fan 16 is located below the thin film circuit board 111 of the keyboard module 11. In the present embodiment, the third fan 16 further includes a third top surface 160 facing the thin film circuit board 111, a third air inlet 161 of the third fan 16 is opened on the third top surface 160, and a third gap G3 is provided between the third top surface 160 and the thin film circuit board 111. The third gas flow space R3 includes the third gap G3 defined between the third top surface 160 and the thin film circuit board 111, that is, the space between the third fan 16 and the thin film circuit board 111 is connected to the third gas flow space R3.

As shown in FIG. 1 and FIG. 8 , the housing 10 of the present embodiment further includes at least one fourth opening T4 and at least one fifth opening T5. The fourth opening T4 of the housing 10 is connected to the second air flow space R2, and the fourth opening T4 corresponds to the second air inlet 151 of the second fan 15. The fifth opening T5 of the housing 10 is connected to the third air flow space R3, and the fifth opening T5 corresponds to the third air inlet 161 of the third fan 16.

As shown in FIG. 1 , the top 101 of the housing 10 of the present embodiment further includes a key configuration area R. The keys 112 of the keyboard module 11 are exposed to the outside of the housing 10 through the corresponding holes in the key configuration area R. In the present embodiment, the housing 10 has a plurality of first openings T1, a plurality of second openings T2, a plurality of third openings T3, a plurality of fourth openings T4, and a plurality of fifth openings T5. The openings are arranged along the periphery of the keyboard module 11. For example, the first openings T1 are arranged along the first side S1 of the key configuration area R, the second openings T2 are arranged along the second side S2 of the key configuration area R, the third openings T3 are arranged along the third side S3 of the key configuration area R, and the fourth openings T4 and the fifth openings T5 are arranged along the fourth side S4 of the key configuration area R. The first side S1 and the fourth side S4 of the key configuration area R are opposite to each other, and the second side S2 and the fourth side S4 are opposite to each other.

It should be particularly noted that the present invention does not limit the number of the above-mentioned openings. When there is at least one opening, the number of the openings can be increased or decreased according to the actual needs.

As shown in FIG. 8 , the housing 10 of the present embodiment further includes a plurality of side portions 103. The side portions 103 are connected between the top portion 101 and the bottom portion 102, and the side portions 103 include a first side opening area SH1, a second side opening area SH2, and a third side opening area SH3. In the present embodiment, the first side opening area SH1 is connected to the first gas flow space R1 and corresponds to the first fan 14, the second side opening area SH2 is connected to the second gas flow space R2 and corresponds to the second fan 15, and the third side opening area SH3 is connected to the third gas flow space R3 and corresponds to the third fan 16.

As shown in FIG. 8 , the first fan 14 of the present embodiment further includes a first air outlet 142, the second fan 15 further includes a second air outlet 152, and the third fan 16 further includes a third air outlet 162. The first air outlet 142 of the first fan 14 corresponds to the first side opening area SH1 of the housing 10, the second air outlet 152 of the second fan 15 corresponds to the second side opening area SH2 of the housing 10, and the third air outlet 162 of the third fan 16 corresponds to the third side opening area SH3 of the housing 10.

As shown in FIG. 8 , the heat dissipation system 1 of the present embodiment further includes a first heat dissipation fin set 17, a second heat dissipation fin set 18, and a third heat dissipation fin set 19. The first heat dissipation fin set 17 is located between the first air outlet 142 of the first fan 14 and the first side opening area SH1. The second heat dissipation fin set 18 is located between the second air outlet 152 of the second fan 15 and the second side opening area SH2. The third heat dissipation fin set 19 is located between the third air outlet 162 of the third fan 16 and the third side opening area SH3.

In this embodiment, when the first fan 14 starts to operate, external cold air will be introduced into the interior of the casing 10 by the first fan 14. After the external cold air enters the interior of the casing 10 through these first openings T1 of the casing 10, the cold air will flow to the first air inlet 141 of the first fan 14 through the first gas flow space R1 located between the thin film circuit board 111 and the circuit board 12. Since the cold air passing through these first openings T1 will be confined in the first gas flow space R1 and will not flow to other areas, the cold air entering from some of the first openings T1 farther away from the first fan 14 (such as the first openings T1 located at both ends of the upper side of the casing 10) can also smoothly pass through the first gas flow space R1 and flow to the first air inlet 141 of the first fan 14, thereby ensuring that more cold air enters the interior of the casing 10.

As described above, when external cold air is introduced from the first air inlet 141 of the first fan 14, the first fan 14 blows the cold air radiantly along different air outlet directions to the first heat source H1, the second heat source H2, the heat spreader (not shown in this figure) or other high-power and high-heat electronic components located in the area below the circuit board 12. The cold air takes away the heat generated by the above-mentioned components and is discharged to the outside of the housing 10 through the first air outlet 142 of the first fan 14 and the first heat sink fin assembly 17.

Similarly, when the second fan 15 and the third fan 16 start to operate, the external cold air will be introduced into the interior of the casing 10 by the second fan 15 and the third fan 16. After the external cold air enters the interior of the casing 10 through the second openings T2 and the third openings T3 of the casing 10, the cold air will flow to the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16 through the second gas flow space R2 and the third gas flow space R3 located between the thin film circuit board 111 and the circuit board 12, respectively. Since the cold air passing through the second openings T2 and the third openings T3 will be confined in the first gas flow space R1 and the second gas flow space R2 respectively and will not flow to other areas, the cold air entering from the second openings T2 farther away from the second fan 15 (such as the second openings T2 located on the upper left side of the casing 10) and the third openings T3 farther away from the third fan 16 (such as the second openings T2 located on the upper right side of the casing 10) can also smoothly pass through the second gas flow space R2 and the third gas flow space R3 respectively and flow to the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16, so as to ensure that more cold air enters the interior of the casing 10.

Furthermore, when the second fan 15 and the third fan 16 start to operate, since the fourth openings T4 and the fifth openings T5 correspond to the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16 respectively, the cold air passing through the fourth openings T4 and the fifth openings T5 will be directly introduced into the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16.

As described above, when the external cold air is introduced from the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16, the second fan 15 and the third fan 16 respectively blow the cold air in a radiant manner along different air outlet directions toward the heat spreader (not shown in this figure) or other high-power and high-heat electronic components located in the area below the circuit board 12. The cold air takes away the heat generated by the above-mentioned components and is discharged to the outside of the housing 10 through the second air outlet 152 of the second fan 15 and the second heat sink fin assembly 18, and is discharged to the outside of the housing 10 through the third air outlet 162 of the third fan 16 and the third heat sink fin assembly 19.

It is worth mentioning that, as shown in FIG. 1 and FIG. 2, the bottom 102 of the housing 10 of the present embodiment includes a first bottom opening area BH1, a second bottom opening area BH2, and a third bottom opening area BH3. The first bottom opening area BH1 corresponds to the first fan 14, the second bottom opening area BH2 corresponds to the second fan 15, and the third bottom opening area BH3 corresponds to the third fan 16. The above-mentioned bottom opening areas are matched with the first openings T1, the second openings T2, the third openings T3, the fourth openings T4 and the fifth openings T5 arranged along the periphery of the key configuration area R on the top 101 of the casing 10, so that the electronic device can not only inhale cold air through the bottom of the casing 10, but also inhale cold air through the top of the casing 10, so that the fan can exert higher efficiency, thereby improving the performance of the electronic device.

In summary, the heat dissipation system of the embodiment of the present invention utilizes the opening design in the appearance and defines the first gas flow space, the second gas flow space and the third gas flow space between the thin film circuit board and the circuit board of the keyboard module through the spacer. These gas flow spaces can ensure that the cold air passing through these first openings, these second openings and these third openings flows to the air inlet of the corresponding fan without escaping to other areas, so that the efficiency of the fan to introduce cold air is greatly improved. When the efficiency of the fan to introduce cold air is improved, the heat dissipation efficiency of the entire system is greatly improved, and the use efficiency of the electronic device is effectively improved.

The embodiments selected and described are used to explain the content of the present disclosure and their practical applications to inspire other technical personnel in the field to utilize the present disclosure and various embodiments, and to make various modifications to meet the expected specific use. Alternative embodiments will be obvious to technical personnel in the field to which the present disclosure belongs without departing from the spirit and scope of the present disclosure. Therefore, the scope of the present disclosure is determined according to the scope of the attached invention application, rather than being limited by the above specification and the exemplary embodiments described therein.

1: Cooling system 10: Case 11: Keyboard module 12: Circuit board 13: Spacer 14: First fan 15: Second fan 16: Third fan 17: First heat sink fin set 18: Second heat sink fin set 19: Third heat sink fin set 101: Top 102: Bottom 103: Side 111: Thin film circuit board 112: Key 121: First opening 122: Second opening 123: Third opening 140: First top surface 141: First air inlet 142: First air outlet 150: Second top surface 151: Second air inlet 152: Second air outlet 160: Third top surface 161: Third air inlet 162: Third air outlet G1: First gap G2: Second gap G3: Third gap H1: First heat source H2: Second heat source R: Key configuration area R1: First gas flow space R2: Second gas flow space R3: Third gas flow space S1: First side S2: Second side S3: Third side S4: Fourth side T1: First opening T2: Second opening T3: Third opening T4: Fourth opening T5: Fifth opening SH1: First side opening area SH2: Second side opening area SH3: Third side opening area BH1: First bottom opening area BH2: Second bottom opening area BH3: The third bottom opening area

The drawings illustrate one or more embodiments of the present disclosure and are used together with the written description to explain the principles of the present disclosure. In all drawings, the same drawing marks are used to refer to similar or identical elements of the embodiments as much as possible, wherein: FIG. 1 is a schematic top view of a heat dissipation system of an embodiment of the present invention. FIG. 2 is a schematic bottom view of a heat dissipation system of an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view along the AA line segment shown in FIG. 1. FIG. 4 is a schematic cross-sectional view along the BB line segment shown in FIG. 1. FIG. 5 is a schematic cross-sectional view along the CC line segment shown in FIG. 1. FIG. 6 is a schematic cross-sectional view along the DD line segment shown in FIG. 1. FIG. 7 is a schematic cross-sectional view along the EE line segment shown in FIG. 1. FIG. 8 is a schematic top view after omitting some components of FIG. 1.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

10: Chassis

11: Keyboard module

12: Circuit board

13: Spacer

101: Top

102: Bottom

103: Side

111: Thin film circuit board

112:Key

R1: First gas flow space

R2: Second gas flow space

T2: Second opening

Claims (12)

A heat dissipation system is used for an electronic device. The heat dissipation system includes: a housing, including a top and a bottom facing each other, the top including at least one first opening; a keyboard module, arranged in the housing, the keyboard module including a thin film circuit board and a plurality of keys arranged on the thin film circuit board, the keys being exposed from the top; a circuit board, arranged in the housing, and the circuit board is located below the thin film circuit board of the keyboard module; A spacer is disposed in the housing and located between the circuit board and the thin film circuit board, and the spacer is used to define a first gas flow space between the circuit board and the thin film circuit board, and the first gas flow space is connected to the at least one first opening of the housing; and a first fan is disposed in the housing and corresponds to the first gas flow space, and the first fan includes a first air inlet, and the first air inlet is connected to the first gas flow space. A heat dissipation system as described in claim 1, wherein the circuit board includes a first opening, the first fan is disposed in the first opening and is located below the thin film circuit board, the first fan further includes a first top surface facing the thin film circuit board, the first air inlet is opened on the first top surface, a first gap is provided between the first top surface and the thin film circuit board, and the first gas flow space includes the first gap. The heat dissipation system as described in claim 1 further includes a second fan, the top of the housing further includes at least one second opening, the spacer is used to define a second gas flow space between the circuit board and the thin film circuit board, the second gas flow space is located on one side of the first gas flow space, the second gas flow space is connected to the at least one second opening, the second fan is arranged in the housing and corresponds to the second gas flow space, the second fan includes a second air inlet, and the second air inlet is connected to the second gas flow space. A heat dissipation system as described in claim 3, wherein the circuit board includes a second opening, the second fan is disposed in the second opening and is located below the thin film circuit board, the second fan further includes a second top surface facing the thin film circuit board, the second air inlet is opened on the second top surface, a second gap is provided between the second top surface and the thin film circuit board, and the second gas flow space includes the second gap. The heat dissipation system as described in claim 3 further includes a third fan, the top of the housing further includes at least one third opening, the spacer is used to define a third gas flow space between the circuit board and the thin film circuit board, the third gas flow space is located on the other side opposite to the first gas flow space, the third gas flow space is connected to the at least one third opening, the third fan is arranged in the housing and corresponds to the third gas flow space, the third fan includes a third air inlet, and the third air inlet is connected to the second gas flow space. The heat dissipation system as described in claim 5, wherein the circuit board further includes a third opening, the third fan is arranged in the third opening and is located below the thin film circuit board, the third fan further includes a third top surface facing the thin film circuit board, the third air inlet is opened on the third top surface, there is a third gap between the third top surface and the thin film circuit board, and the third gas flow space includes the third gap. The heat dissipation system as described in claim 5, wherein the top of the housing further includes at least one fourth opening and at least one fifth opening, the at least one fourth opening is connected to the second gas flow space, and the at least one fourth opening corresponds to the second air inlet of the second fan, and the at least one fifth opening is connected to the third gas flow space, and the at least one fifth opening corresponds to the third air inlet of the third fan. The heat dissipation system as described in claim 7, wherein the top of the housing further includes a key configuration area, the keys of the keyboard module are exposed from the key configuration area, the at least one first opening is a plurality of openings, the at least one second opening is a plurality of openings, the at least one third opening is a plurality of openings, the at least one fourth opening is a plurality of openings, the at least one fifth opening is a plurality of openings, and the at least one fifth opening is a plurality of openings. The first opening is arranged along a first side of the key configuration area, the second openings are arranged along a second side of the key configuration area, the third openings are arranged along a third side of the key configuration area, the fourth openings and the fifth openings are arranged along a fourth side of the key configuration area, respectively, and the first side is opposite to the fourth side, and the second side is opposite to the third side. The heat dissipation system as described in claim 5, wherein the housing further includes a plurality of side portions, the side portions are connected between the top portion and the bottom portion, and the side portions include a first side opening area, a second side opening area, and a third side opening area, the first side opening area is connected to the first gas flow space, the second side opening area is connected to the second gas flow space, and the third side opening area is connected to the third gas flow space. The heat dissipation system as described in claim 9, wherein the first fan further includes a first air outlet, the second fan further includes a second air outlet, and the third fan further includes a third air outlet, the first air outlet corresponds to the first side opening area, the second air outlet corresponds to the second side opening area, and the third air outlet corresponds to the third side opening area. The heat dissipation system as described in claim 10 further includes a first heat dissipation fin set, a second heat dissipation fin set and a third heat dissipation fin set, wherein the first heat dissipation fin set is located between the first air outlet of the first fan and the first side opening area, the second heat dissipation fin set is located between the second air outlet of the second fan and the second side opening area, and the third heat dissipation fin set is located between the third air outlet of the third fan and the third side opening area. A heat dissipation system as described in claim 1, wherein the electronic device includes a first heat source and a second heat source, and the first fan is located between the first heat source and the second heat source.