TWI870437B - Light-emitting module and display apparatus - Google Patents

Abstract

The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface corresponding to the first surface. The first surface includes a plurality of separated conducting channels, and the second surface includes a plurality of separated conducting pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light- emitting diode chip. An electronic component is disposed on the first surface and not overlapped with the light-emitting groups matrix. A translucent encapsulating element covers the plurality of light-emitting groups and the electronic component.

Description

Light-emitting module and display device

This application relates to a light-emitting module and a display device, and in particular to a light-emitting module including a light-emitting diode with a specific structure and a display device using the light-emitting diode with a specific structure.

Light-emitting diodes (LEDs) have the characteristics of low power consumption, low heat generation, long operating life, impact resistance, small size, and fast response speed. Therefore, they are widely used in various fields that require the use of light-emitting components, such as: vehicles, home appliances, backlight modules, lighting fixtures, and display devices.

Taking display devices as an example, LEDs are a type of monochromatic light. Using LED chips of the three primary colors of red, green, and blue to match each other, the color can be changed as the basic unit for information display, forming a full-color light emitting group, which can be used as a pixel unit in the display device.

How to use packaging technology to produce compactly arranged light-emitting modules that contain multiple light-emitting groups suitable for information display is one of the main purposes of this application. In addition, the compactly arranged light-emitting modules can further have sensing functions and achieve the effect of interactive mode with the outside world, which is also one of the important topics to be achieved in this application.

The present application provides a light-emitting module. The light-emitting module includes a circuit substrate, the circuit substrate includes a first surface and a second surface opposite to the first surface, the first surface has a plurality of separated conductive channels, and the second surface has a plurality of separated conductive pads; a plurality of light-emitting groups are arranged in a matrix on the first surface, wherein each light-emitting group includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip; an electronic component is located on the first surface and does not overlap with the aforementioned light-emitting group matrix; and a light-transmissive packaging component covers the plurality of light-emitting group matrixes and the electronic component.

On the other hand, the present application also provides a display device, comprising a carrier board; a plurality of light-emitting modules are located on the carrier board, including a first light-emitting module; and a second light-emitting module; wherein the electronic components in the first light-emitting module are of different types from those in the second light-emitting module.

100, 100’, 200, 300: Light-emitting module

120: Circuit board

120’: Insulating base

121: First surface

121’: Upper conductive layer

121A~121J: Conductive channel

121A’1~121A’2, 121B’1~121B’2, 121C’1~121C’2, 121D’1~121D’6, 121E’1, 121F’1, 121G’1~121G’6, 121H’1~121H’2, 121I’1~121I’2, 121J’1~121J’2: Conductive pad

122A~122J: Conductive pad

122: Second surface

130: The first light group

140: Second light group

150: The third light group

160: The fourth light group

170, 170’: Electronic components

180: Translucent packaging components

180’, 180”: Shading structure

1801: Upper surface

400: Equivalent circuit diagram

131, 141, 151, 161: Red LED chips

132, 142, 152, 162: Green LED chips

133, 143, 153, 163: Blue LED chips

133a, 143a: Carrier substrate

133b, 143b: semiconductor epitaxial layer

133-1, 143-1: Cathode contact electrode

133-2, 143-2: Anode contact electrode

1331: First electrical connection part

1333: Second electrical connection part

1332: First Protection Department

1334: Second Protection Department

1000, 2000: Display device

1100: Target carrier board

d1: distance

g1, g2: spacing

A-A’: line segment

θ1, θ2: viewing angle

Figure 1A is a three-dimensional diagram of a light-emitting module disclosed according to an embodiment of the present invention.

Figure 1B shows a top view of the light-emitting module in Figure 1A.

Figure 1C shows a bottom view of the light-emitting module in Figure 1A.

Figure 1D shows a partial cross-sectional view of the light-emitting module along the line segment A-A’ in Figure 1B.

Figure 1E is a three-dimensional diagram of a light-emitting module disclosed according to an embodiment of the present invention.

Figure 1F is a three-dimensional diagram of a light-emitting module disclosed according to an embodiment of the present invention.

Figure 2 is a perspective view of the top surface of the circuit substrate of the light-emitting module in Figure 1A.

Figure 3 is a schematic diagram showing the equivalent circuit of the light-emitting module in Figure 1A.

Figure 4 is a top view of a display device disclosed according to an embodiment of the present invention.

Figure 5 is a top view of a display device disclosed according to an embodiment of the present invention.

FIG. 1A is a three-dimensional diagram of a light-emitting module 100 disclosed according to an embodiment, FIG. 1B is a top view of the light-emitting module 100 in FIG. 1A, and FIG. 1C is a bottom view of the light-emitting module 100 in FIG. 1A. The light-emitting module 100 includes a circuit substrate 120, a first light-emitting group 130, a second light-emitting group 140, a third light-emitting group 150, a fourth light-emitting group 160, an electronic component 170, and a light-transmissive packaging component 180.

In this embodiment, the circuit substrate 120 is composed of an insulating base 120' and an upper conductive layer 121', and the upper conductive layer 121' has a specific pattern. The circuit substrate 120 has a first surface 121 and a second surface 122 opposite to each other. From FIG. 1B, the first surface 121 has a plurality of conductive channels 121A~121J separated from each other and penetrating the circuit substrate 120. The first light emitting group 130, the second light emitting group 140, the third light emitting group 150, and the fourth light emitting group 160 are arranged on the upper conductive layer 121' in the form of a 2-row × 2-row matrix, and together form a light emitting group matrix. Each light-emitting group 130/140/150/160 may include light-emitting elements that can emit different colors of light, such as a red light-emitting diode chip 131/141/151/161, a green light-emitting diode chip 132/142/152/162, and a blue light-emitting diode chip 133/143/153/163. The electronic element 170 is also disposed on the first surface 121 and is disposed in the light-emitting group matrix (130/140/150/160). For example, the electronic element 170 is disposed between rows and columns in the light-emitting group matrix (130/140/150/160) and does not overlap with the light-emitting group matrix (130/140/150/160). In addition, the light-transmissive packaging component 180 is disposed on the first surface 121, covering the light-emitting group matrix (130/140/150/160) and the electronic component 170.

Referring to FIG. 1C , a plurality of conductive pads 122A to 122J separated from each other are arranged on the second surface 122. The dotted circles 121A to 121J represent the corresponding positions of the conductive channels 121A to 121J that penetrate the circuit substrate 120 from the first surface 121 to the second surface 122. It can be seen from the figure that each conductive pad 122A to 122J is connected to each conductive channel 121A to 121J. In addition, a triangular conductive pad 122K is also included on the second surface 122. In general, the light-emitting module 100 has 11 separated conductive pads 122A to 122K on the second surface 122.

The conductive pad 122K is arranged in the center of the bottom view of the light-emitting module 100, and is separated from all other conductive pads 122A~122J, and is not electrically connected to any conductive channel 121A~121J. When the overall structure of the light-emitting module 100 is mirror-symmetrical in appearance and the up and down directions cannot be distinguished, the conductive pad 122K with a directional appearance is provided to enable the entire light-emitting module 100 to have a direction recognition effect. The directional appearance is not limited to a triangle, and can also be, for example, an odd polygon, an asymmetric polygon, an even polygon with a chamfer, etc., which can display the shape or structure of the light-emitting module 100.

It is worth noting that the position of the conductive pad 122K is not limited and can be configured at any appropriate position on the outer surface of the light-emitting module 100 to indicate the orientation of the light-emitting module 100. In addition, since the conductive pads 122A~122K are generally made of metals with high thermal conductivity, such as copper, tin, aluminum, silver or gold. In this embodiment, when the conductive pad 122K is configured at the position of the second surface 122 corresponding to the electronic element 170, because it has the shortest distance with the electronic element 170, the heat dissipation effect of the electronic element 170 to the outside can be improved.

In this embodiment, the upper conductive layer 121' is used for electrical connection with the aforementioned light emitting diode chips 131/141/151/161/132/142/152/162/133/143/153/163, and is electrically connected to the conductive pads 122A~122J through the conductive channels 121A~121J. The conductive pads 122A~122J are used for electrical connection with the outside of the light emitting module 100. Therefore, the conductive channels 121A~121J penetrate the insulating substrate 120'. In addition, the conductive channels 121A~121J can be formed at the edge or inner area of the insulating substrate 120', and the distance between the conductive pads 122A~122J should preferably comply with relevant safety requirements.

The material of the insulating substrate 120' can be epoxy resin, BT (Bismaleimide Triazine) resin, polyimide resin, a composite material of epoxy resin and glass fiber, or a composite material of BT resin and glass fiber. The material of the upper conductive layer 121' and the conductive channels 121A~121J can be metal, such as copper, tin, aluminum, silver, palladium, gold, alloys of the above materials, or stacked layers of the above materials. In one embodiment, when the light-emitting module 100 is used as a pixel of a display device, a light-shielding structure (not shown) may be formed on the first surface 121 of the circuit substrate 120, such as a black coating or an anti-reflection layer, to reduce the reflection of the upper conductive layer 121' and to cover the color difference between different insulating substrates 120', so that the contrast of the display device can be improved.

In this embodiment, the number of light emitting groups is four (2×2), but is not limited thereto. In another embodiment, the number of light emitting groups may be m×n, so as to form a light emitting group matrix composed of a plurality of light emitting groups in m columns×n rows. In addition, each light-emitting group 130/140/150/160 includes a red light-emitting diode chip 131/141/151/161, which can emit a first light by supplying power to the power source, and the dominant wavelength (dominant wavelength) or peak wavelength (peak wavelength) of the first light is between 600nm and 660nm; a green light-emitting diode chip 132/142/152/162, which can emit a second light by supplying power to the power source, and the dominant wavelength or peak wavelength of the second light is between 515nm and 575nm; and a blue light-emitting diode chip 133/143/153/163, which can emit a third light by supplying power to the power source, and the dominant wavelength or peak wavelength of the third light is between 430nm and 490nm. The above wavelength range is only an example. Other color lights that can be used in displays can all be applied to the technical solutions disclosed in this application within a reasonable range.

Referring to FIG. 1D, FIG. 1D is a partial cross-sectional view of the light-emitting module 100 cut along the line segment A-A' in FIG. 1B. In this embodiment, the two blue light-emitting diode chips 133/143 respectively include a carrier substrate 133a/143a (which may also be selectively removed or omitted), a semiconductor epitaxial layer 133b/143b, a cathode contact electrode 133-1/143-1, and an anode contact electrode 133-2/143-2. Among them, one side of the semiconductor epitaxial layer 133b/143b faces the carrier substrate 133a/143a, and the other side faces the contact electrode 133-1/143-1/133-2/143-2. The carrier substrate 133a/143a can be used to carry or support the semiconductor epitaxial layer 133b/143b. In addition, the side of the carrier substrate 133a/143a away from the semiconductor epitaxial layer 133b/143b, that is, the upper surface of the blue LED chip 133/143, is the light-emitting surface of the blue LED chip 133/143. If there is no carrier substrate 133a/143a, the light-emitting surface of the blue LED chip 133/143 is the uppermost surface of the semiconductor epitaxial layer 133b/143b.

In this embodiment, the carrier substrate 133a/143a is a sapphire substrate, that is, a direct growth substrate (growth substrate) when the semiconductor epitaxial layer 133b/143b is epitaxially grown. In one embodiment, the carrier substrate 133a/143a can also be a light-transmitting secondary substrate (non-growth substrate), and the material of the secondary substrate is, for example, alumina ceramics, glass, sapphire, carbon-like diamond, quartz, and is connected to the semiconductor epitaxial layer 133b/143b through a light-transmitting bonding layer (not shown).

As shown in the figure, the cathode contact electrode 133-1/143-1 and the anode contact electrode 133-2/143-2 of the blue light-emitting diode chip 133/143 are electrically connected to the upper conductive layer 121' through a first electrical connection portion 1331 and a second electrical connection portion 1333, respectively, and the peripheries of the first electrical connection portion 1331 and the second electrical connection portion 1333 are further surrounded by a first protective portion 1332 and a second protective portion 1334, respectively. The contours of the first electrical connection portion 1331 and the second electrical connection portion 1333 can be a smooth surface or a surface with convex and concave surfaces. In this embodiment, the first electrical connection portion 1331 and the second electrical connection portion 1333 have a neck contour. In other words, the first electrical connection portion 1331 has a width between the cathode contact electrode 133-1/143-1 and the upper conductive layer 121' that is smaller than the width of the interface between the first electrical connection portion 1331 and the upper conductive layer 121'; similarly, the second electrical connection portion 1333 has a width between the anode contact electrode 133-2/143-2 and the upper conductive layer 121' that is smaller than the width of the interface between the second electrical connection portion 1333 and the upper conductive layer 121'. In this embodiment, the first electrical connection part 1331 and the second electrical connection part 1333 are mostly composed of conductive materials. The first electrical connection part 1331 and the second electrical connection part 1333 may contain more or less holes (not shown), and the holes may contain air, materials of the protective part 1332/1334, material residues in the process, and/or pollutants in the environment. In another embodiment, the first electrical connection part 1331 and the second electrical connection part 1333 may all be composed of conductive materials. In another embodiment, the first protective part 1332 may be located between the first electrical connection part 1331 and the second electrical connection part 1333, and simultaneously cover and surround the first electrical connection part 1331 and the second electrical connection part 1333, and be connected to the first surface 121 of the circuit substrate 120.

The first protective portion 1332 can not only protect the first electrical connection portion 1331 and the second electrical connection portion 1333 to prevent oxidation of the conductive material by the external environment medium, but also prevent the first electrical connection portion 1331 and the second electrical connection portion 1333 from causing a short circuit due to softening or melting of the material in a high temperature environment. In addition, the first protective portion 1332 can increase the bonding strength between the circuit substrate 120 and the blue light-emitting diode chip 133/143. In one embodiment, the first protective portion 1332 and/or the second protective portion 1334 are mainly composed of resin and may also include a small amount of conductive material (for example, the material of the electrical connection portion 1331/1333). It is worth noting that the conductive material in the first protective portion 1332 exists in the first protective portion 1332 in a discontinuous form. In another embodiment, the first protective portion 1332 and/or the second protective portion 1334 are mainly composed of resin but do not contain conductive material.

The conductive materials contained in the first electrical connection part 1331, the second electrical connection part 1333, the first protective part 1332, and the second protective part 1334 may be the same or different, for example: gold, silver, copper, tin, indium, bismuth, or their alloys. In one embodiment, the conductive material is a low melting point metal or a low liquid melting point alloy. In one embodiment, the melting point or liquefaction temperature of the low melting point metal or the low liquid melting point alloy is lower than 210°C. In another embodiment, the melting point or liquefaction temperature of the low melting point metal or the low liquid melting point alloy is lower than 170°C. The material of the low liquid melting point alloy may be a tin-indium alloy or a tin-bismuth alloy.

The resins contained in the first electrical connection portion 1331, the second electrical connection portion 1333, the first protective portion 1332, and the second protective portion 1334 may be the same or different, for example, they may be thermosetting resins. In one embodiment, the resin is a thermosetting epoxy resin. In one embodiment, the resin has a glass transition temperature (Tg), and Tg is greater than 50°C. In another embodiment, the Tg of the resin is greater than 120°C.

In this embodiment, the light-transmitting package component 180 covers the light-emitting groups 130-160 and the electronic components 170, and directly contacts the upper conductive layer 121' and the first surface 121. As shown in FIG. 1D, the sidewalls of the light-transmitting package component 180 and the sidewalls of the circuit substrate 120 can be coplanar, but in another embodiment, the sidewalls of the light-transmitting package component 180 and the sidewalls of the circuit substrate 120 can also be non-coplanar. The light-transmitting package component 180 can protect the light-emitting group matrix (130/140/150/160) and the electronic components 170. In addition, the light-transmitting package component 180 has an upper surface 1801 which can be used as the main light-emitting surface of the light-emitting module 100, and the light emitted by the light-emitting groups 130-160 can be transmitted through the light-transmitting package component 180 through the upper surface 1801. In one embodiment, the light-transmitting package component 180 has a transmittance greater than 80% for all wavelengths of 440nm to 470nm, 510nm to 540nm, and/or 610nm to 640nm. In one embodiment, the refractive index of the light-transmitting package component 180 is between 1.30 and 2.0, and the light-emitting angle of the light-emitting module 100 can be adjusted by changing the refractive index of the light-transmitting package component 180. That is, the smaller the difference in refractive index between the light-emitting surface of the light-transmitting package element 180, such as the upper surface 1801, and the external environment, such as air, the larger the light-emitting angle. In another embodiment, the refractive index of the light-transmitting package element 180 is between 1.35 and 1.70. In addition, the light-transmitting package element 180 can also reduce the oxidation of the upper conductive layer 121' by the external environment and/or the light-emitting elements in the light-emitting groups 130~160 from falling off during use.

The material of the light-transmitting packaging element 180 can be resin, ceramic, glass, or a combination thereof. In one embodiment, the material of the light-transmitting packaging element 180 is a thermosetting resin, which can be an epoxy resin or a silicone resin. In one embodiment, the light-transmitting packaging element 180 is a silicone resin, and the composition of the silicone resin can be adjusted according to the required physical properties or optical properties. In one embodiment, the light-transmitting packaging element 180 contains an aliphatic silicone resin, such as a methyl silicone compound, and therefore has greater ductility and can better withstand the thermal stress generated by the light-emitting groups 130~160. In another embodiment, the light-transmitting package component 180 contains an aromatic silicone resin, such as a phenylsilicone compound, and thus has a larger refractive index. In this way, the refractive index difference between the light-transmitting package component 180 and the light-emitting groups 130-160 can be reduced to improve the light extraction efficiency of the light-emitting groups 130-160. In other words, when the refractive index difference between the light-emitting groups 130-160 and the refractive index of the material adjacent to the light-emitting surface of the light-emitting groups 130/140/150/160 is smaller, the light-emitting angle is larger, and the light extraction efficiency can be further improved. In one embodiment, the material of the light-emitting surface of the light-emitting groups 130-160 is sapphire, whose refractive index is about 1.77, and the material of the light-transmissive packaging element 180 is a silicone resin containing aromatics, whose refractive index is greater than 1.50.

In this embodiment, the light-transmitting packaging component 180 uses a material that is transparent to red light wavelengths of 600nm to 660nm, green light wavelengths of 515nm to 575nm, and blue light wavelengths of 430nm to 490nm. In one embodiment, the light-transmitting packaging component 180 is based on the same transparent material as mentioned above, and carbon black is mixed therein. When the light-emitting module 100 is used as a pixel of a display device, the light-transmitting packaging component 180 mixed with carbon black can be used to increase the contrast. However, carbon black has the property of absorbing light. The shorter the wavelength of light, the greater the absorption of carbon black. In a preferred embodiment, the light-transmitting packaging component 180 contains carbon black greater than or equal to 0.005wt% and less than 1wt%. In another embodiment, the light-transmitting packaging component 180 is based on the same transparent material as mentioned above, and an inorganic particle filler is uniformly mixed therein. The inorganic particle filler is, for example, molten silicon particles, silicon dioxide ( _SiO2 ) particles, or metal particles. The inorganic particle filler may have an average particle size of 100 μm or less. Depending on the refractive index and reflectivity characteristics of the added inorganic particle filler, the light scattering ability of the light-transmitting packaging component 180 and the overall light-emitting characteristics of the light-emitting module 100 may be changed; depending on the hardness characteristics of the added inorganic particle filler, the component strength of the light-transmitting packaging component 180 and the overall light-emitting module 100 may be increased. In a preferred embodiment, in order to reduce the degradation of the overall light transmittance of the light emitting module 100 due to light scattering, the light-transmissive packaging component 180 contains less than 50 wt % of inorganic particle filler.

FIG. 1E is a perspective view of another light-emitting module 200 disclosed according to an embodiment. In this embodiment, the configuration and structure of the circuit substrate 120, the light-emitting groups 130-160, the electronic components 170, and the light-transmissive packaging component 180 are substantially the same as those of the light-emitting module 100. The difference is that the light-emitting module 100 further includes a light-shielding structure 180'. The light-shielding structure 180' is located on the first surface 121 and covers the upper conductive layer 121' and the conductive channels 121A-121J between the light-emitting groups 130-160. The structure of the light shielding structure 180' is, for example, a black coating or an anti-reflection layer, which is used to reduce the reflection of the upper conductive layer 121' and cover the color difference between different insulating substrates 120', so that the contrast of the light emitting module 200 and the display device using the light emitting module 200 can be improved.

FIG. 1F is a perspective view of another light emitting module 300 according to an embodiment. In this embodiment, the arrangement and structure of the circuit substrate 120, the light emitting groups 130-160, the electronic element 170, and the light-transmissive packaging element 180 are substantially the same as those of the light emitting module 200. The difference is that the shading structure 180" included in the light-emitting module 300 completely covers all the upper conductive layers and conductive channels except the light-emitting groups 130~160 and the electronic components 170. The structure of the shading structure 180" is, for example, a black coating or an anti-reflection layer. Such a design can be used to better reduce the reflection of the upper conductive layer 121' and cover the color difference between different insulating substrates 120', so that the contrast of the light-emitting module 300 and the display device using the light-emitting module 300 can be improved. It is worth mentioning that the height of the light shielding structure 180" in this embodiment is slightly lower than the light-emitting groups 130~160 and the electronic components 170, but the actual design is not limited to this. According to different implementations of the electronic components 170, the material and height of the light shielding structure 180" also need to be appropriately adjusted, which will be described separately in subsequent embodiments.

FIG. 2 is a perspective view of the upper surface of the circuit substrate in the light-emitting module 100, in which the light-emitting groups 130 to 160 and the electronic components 170 are indicated by dotted lines. As shown in the figure, the upper conductive layer 121' has conductive lines 121A' to 121J' that are electrically connected to the conductive channels 121A to 121J and separated from each other, and each conductive line 121A' to 121J' also has conductive pads 121A'1 and 121A'2 to 121J'1 and 121J'2 at the end thereof for electrically connecting to the aforementioned light-emitting diode chips 131/141/151/161/132/142/152/162/133/143/153/163, and its detailed structure is described as follows.

As shown in FIG. 2, each end of the conductive lines 121A', 121B', 121C', 121H', 121I', 121J' has an enlarged conductive pad 121A'1 and 121A'2, 121B'1 and 121B'2, 121C'1 and 121C'2, 121H'1 and 121H'2, 121I'1 and 121J'. I’2, and 121J’1 and 121J’2; the two ends of the conductive lines 121D’ and 121G’ have an enlarged comb-shaped conductive pad 121D’1~121D’6 and 121G’1~121G’6 respectively; the conductive lines 121E’ and 121F’ have an enlarged conductive pad 121E’1 and 121F’1 at one end. In a preferred embodiment, the width of the conductive pad is wider than the width of the corresponding conductive line, so that the aforementioned light-emitting diode chip and each contact electrode of the electronic component can be electrically connected to it independently through the aforementioned electrical connection material.

Referring to FIG. 1B and FIG. 1D together, the cross-sectional view along the line segment A-A' is taken as an example. It can be seen from the cross-sectional view that the two blue LED chips 133 and 143 respectively have a cathode contact electrode 133-1 and 143-1 and an anode contact electrode 133-2 and 143-2. The cathode contact electrode 133-1 of the blue LED chip 133 is electrically connected to the conductive pad 121D'1 of the conductive line 121D' through the first electrical connection portion 1331, the anode contact electrode 133-2 of the blue LED chip 133 is electrically connected to the conductive pad 121A'1 of the conductive line 121A' through the second electrical connection portion 1333, and the blue The cathode contact electrode 143-1 of the blue LED chip 143 is electrically connected to the conductive pad 121G'1 of the conductive line 121G' through the first electrical connection part 1331, and the anode contact electrode 143-2 of the blue LED chip 143 is electrically connected to the conductive pad 121A'2 of the conductive line 121A' through the second electrical connection part 1333. As mentioned above, each conductive pad 121D'1, 121A'1, 121G'1, 121A'2 is electrically connected to the corresponding conductive channels 121D, 121A, 121G, 121A, and then electrically connected to the corresponding conductive pads 122D, 122A, 122G, 122A on the second surface 122 through the conductive channels 121D, 121A, 121G, 121A, and then electrically connected to the external power source.

By analogy, in the light-emitting module 100, the red LED chips 131/141/151/161, the green LED chips 132/142/152/162, and the blue LED chips 133/143/153/163 in each light-emitting group 130/140/150/160 respectively have a cathode contact electrode and an anode contact electrode (as shown in FIG. 1D ), and each independent cathode contact electrode and anode contact electrode are electrically connected to the conductive pads 122A-122J corresponding to the second surface 122.

In the present application, the light emitting module 100 further includes an electronic component 170. The electronic component is disposed in the central area of the light emitting module 100 and does not overlap with the light emitting group matrix (130/140/150/160). In one embodiment, the electronic component 170 is a single photodetector that can be used to detect the light intensity of the red light emitting diode chip 131/141/151/161, the green light emitting diode chip 132/142/152/162, or the blue light emitting diode chip 133/143/153/163. When the light detector is arranged in the central area of the light module 100, it is nearly equidistant from the four light groups 130-160 in the light module 100, so it can receive the light emitted by different light groups in the light module 100 without deviation and convert the received light into an electronic signal, which is then transmitted to the processing unit (not shown) at the back. It can also be used as a basis for light feedback control adjustment. The control mechanism of this part will be described in detail in the application section of the display device later.

FIG. 3 is an equivalent circuit diagram 400 of the light-emitting module 100. In FIG. 3, the position of the circuit symbol representing the light-emitting diode chip corresponds to the configuration of the light-emitting diode chips 131-163 in the light-emitting module 100. In the light-emitting module 100, each of the light-emitting diode chips 131-163 of the light-emitting groups 130-160 includes an anode contact electrode (not shown) and a cathode contact electrode (not shown).

Further, regarding the connection relationship of the light-emitting group array (130/140/150/160), in the same vertical row, the cathode contact electrodes of all the LED chips are electrically connected to the same conductive pad. For example, the cathode contact electrodes of the LED chips 131-133 and 161-163 are electrically connected to the conductive pad 122D, and the cathode contact electrodes of the LED chips 141-143 and 151-153 are electrically connected to the conductive pad 122G; in the same horizontal row, the anode contact electrodes of the LED chips of the same color are electrically connected to the same conductive pad. For example, the anode contact electrodes of the blue LED chips 133 and 143 are electrically connected to the conductive pad 122A, the anode contact electrodes of the green LED chips 132 and 142 are electrically connected to the conductive pad 122B, and the anode contact electrodes of the red LED chips 131 and 141 are electrically connected to the conductive pad 122. C. The anode contact electrodes of the blue LED chips 163 and 153 are electrically connected to the conductive pad 122H, the anode contact electrodes of the green LED chips 162 and 152 are electrically connected to the conductive pad 122I, and the anode contact electrodes of the red LED chips 161 and 151 are electrically connected to the conductive pad 122J. With such a design, after the same anode voltage level is given to all LED chips through the conductive pads 122D and 122G, different voltage levels and/or switching voltage times can be applied to different conductive pads 122A-C and 122H-J, so that the LED chips of different colors in the light-emitting module 100 can achieve the effect of independently controlling the luminous brightness and/or switching timing. In addition, the number of conductive pads on the second surface 122 is also reduced. In another embodiment, the anode contact electrodes of all LED chips can be electrically connected to an electrode pad with the same voltage level, and then the LED chips of different colors can be connected to different cathode conductive pads respectively. By applying different voltage levels and/or switching voltage times to the cathode conductive pads of different colors, the LED chips of different colors in the light-emitting module 100 can achieve the effect of independently controlling the luminous brightness and/or switching timing.

In one embodiment, the electronic component 170 represents an integrated photodetector or several independent photodetectors. The electronic component 170 can detect light of several different wavelengths, for example, red luminous wavelength 600nm to 660nm, green luminous wavelength 515nm to 575nm, and blue luminous wavelength 430nm to 490nm. The two electrodes (not shown) of the electronic component 170 are electrically connected to the conductive pads 121F'1 and 121E'1 respectively, and then electrically connected to the conductive pads 122F and 122E respectively through the conductive channels 121F and 121E, and electrically connected to the outside through the conductive pads 122F and 122E.

When the electronic component in the light-emitting module is a single photodetector, an integrated photodetector, or a plurality of independent photodetectors, refer to FIG. 1E , FIG. 1F , etc. for the structural design of the light-emitting modules 200 , 300 . Since the electronic element 170 is a light-collecting element, when the electronic element 170 collects light from the side and a material that is transparent relative to the absorption wavelength of the electronic element 170 is selected as the shading structure 180' and 180", in addition to being slightly lower than the light-emitting groups 130~160 and the electronic element 170 as shown in Figures 1E and 1F, the shading structure 180' and 180" can also be the same height as the light-emitting groups 130~160 and the electronic element 170 or higher than the light-emitting groups 130~160 and the electronic element 170 to cover the entire upper surface of the light-emitting groups 130~160 and the electronic element 170. When the upper surface of the electronic component 170 collects light and a material that is transparent relative to the absorption wavelength of the electronic component 170 is selected as the shading structure 180' and 180", the shading structure 180' and 180" can also be at the same height as the light-emitting groups 130~160 and the electronic component 170 or slightly higher than the light-emitting groups 130~160 and the electronic component 170 to cover the entire upper surface of the light-emitting groups 130~160 and the electronic component 170. When the upper surface of the electronic element 170 collects light, and a material that is opaque relative to the absorption wavelength of the electronic element 170 is selected as the light-shielding structure 180' and 180", the light-shielding structure 180' and 180" can be the same height as the light-emitting group 130~160 and the electronic element 170, but it is not suitable to be high enough to cover the entire upper surface of the electronic element 170 to avoid affecting the light collection of the electronic element 170. However, in all the above designs, the thickness of the light-shielding structure 180' and 180" still needs to allow the light-emitting group 130~160 to be transparent to achieve the function of the light-emitting module 100~300 itself.

In one embodiment, the electronic element 170 is one or more light-emitting diode elements, which can emit one or more light of different wavelengths from the light-emitting group array (130/140/150/160). For example: amber, cool white, warm white, fluorescent, etc. The cathode and anode electrodes (not shown) of the electronic element 170 are electrically connected to the conductive pads 121F'1 and 121E'1 respectively, and then electrically connected to the conductive pads 122F and 122E respectively through the conductive channels 121F and 121E, and electrically connected to the outside through the conductive pads 122F and 122E. By adding electronic components 170 with different luminous wavelengths and/or different color temperatures, the luminous module 100 can have a multi-functional effect. For example, when used in a car, the luminous group array (130/140/150/160) in the luminous module 100 can be used as an interactive tail light, and when a (fluorescent conversion type) amber LED component is used as the electronic component 170, the electronic component 170 can have the effect of a direction light.

When the electronic element in the light emitting module is one or more light emitting diode elements, refer to FIG. 1E , FIG. 1F , etc. for the structural design of the light emitting modules 200 , 300 . Since the electronic component 170 is a light-emitting component, in addition to being slightly lower than the light-emitting groups 130-160 and the electronic component 170 as shown in FIG. 1E and FIG. 1F, the light-shielding structures 180' and 180" can also be the same height as the light-emitting groups 130-160 and the electronic component 170 or higher than the light-emitting groups 130-160 and the electronic component 170 to cover the entire upper surface of the light-emitting groups 130-160 and the electronic component 170. However, in this design, the thickness of the light-shielding structures 180' and 180" still needs to allow the light-emitting groups 130-160 and the electronic component 170 to be transparent to achieve the effect of the light-emitting module itself.

In one embodiment, the electronic component 170 is a non-light-receiving and light-emitting component, such as an integrated circuit (driver IC) or a varistor, etc., used to drive the entire light-emitting module, and adjusts the overall light-emitting intensity or effect of the light-emitting module by receiving an external non-light signal (driver IC receives external electrical signals; varistor receives external pressure signals). The cathode and anode electrodes (not shown) of the electronic component 170 are electrically connected to the conductive pads 121F'1 and 121E'1, respectively, and then electrically connected to the conductive pads 122F and 122E through the conductive channels 121F and 121E, respectively, and electrically connected to the outside through the conductive pads 122F and 122E.

When the electronic component 170 is a non-light-retracting component, refer to FIG. 1E, FIG. 1F, etc. for the structural design of the light-emitting modules 200, 300. Since the operation of the electronic component 170 is not affected by light, in addition to being slightly lower than the light-emitting groups 130-160 and the electronic component 170 as shown in FIG. 1E and FIG. 1F, the shading structures 180' and 180" can also be the same height as the light-emitting groups 130-160 and the electronic component 170 or higher than the light-emitting groups 130-160 and the electronic component 170 to cover the entire upper surface of the light-emitting groups 130-160 and the electronic component 170. However, in this design, the thickness of the shading structures 180' and 180" must allow the light-emitting groups 130-160 to be transparent to achieve the function of the light-emitting modules 100-300 themselves.

In another embodiment, the light shielding structure 180'/180" may also completely cover the electronic element 170 alone while still exposing the light emitting groups 130-160. However, the electronic element 170 does not affect its normal operation due to being covered, such as heat dissipation and receiving pressure. The light shielding structure 180'/180" has a uniform height in the light emitting module (that is, the light shielding structure 180'/180" has a flat surface in a single light emitting module). In another embodiment, the light shielding structure 180'/180" has different heights above and/or around the electronic element 170 and the light-emitting groups 130~160, that is, the light shielding structure 180'/180" has an uneven top surface in macroscopic terms. Regardless of the surface shape of the light shielding structure 180'/180", the light output of the light-emitting groups 130~160 should not be affected.

FIG. 4 is an embodiment, showing a top view of a display device 1000 using the aforementioned light-emitting modules 100. The display device 1000 includes a target carrier 1100 and a plurality of light-emitting modules 100 fixed on the target carrier 1100 in an array. In the display device 1000, each light-emitting module 100 includes four light-emitting groups 130, 140, 150, and 160 capable of emitting red light, blue light, and green light, and each light-emitting group 130, 140, 150, and 160 can be a pixel in the display device 1000. The method of arranging and fixing the plurality of light-emitting modules 100 on the target carrier 1100 includes arranging and fixing the plurality of light-emitting modules 100 on the target carrier 1100 one by one or arranging and fixing the plurality of light-emitting modules 100 on the target carrier 1100 at a time. On the X-axis (horizontally), the distances between the two red LED chips 131-161, the two green LED chips 132-162, and the two blue LED chips 133-163 in the corresponding light-emitting groups 130-160 in the two adjacent light-emitting modules 100 are all d1 (the distances here are measured with the X-axis length center point of the two same-color LED chips as the starting and ending positions); on the Y-axis (horizontally), the distances between the two red LED chips 131-161, the two green LED chips 132-162, and the two blue LED chips 133-163 are all d1 (the distances here are measured with the X-axis length center point of the two same-color LED chips as the starting and ending positions); Similarly, the distances between the two red LED chips 131-161, the two green LED chips 132-162, and the two blue LED chips 133-163 in the corresponding light-emitting groups 130-160 in two adjacent light-emitting modules 100 are all d1 (the distances here are measured with the Y-axis length center point of the two same-color LED chips as the starting and ending positions). The distance d1 is determined according to the size of the target carrier 1100 and the resolution of the display device 1000.

On the X-axis, there is a distance g1 between two adjacent light-emitting modules 100, and on the Y-axis, there is a distance g2 between two adjacent light-emitting modules 100. In one embodiment, the distance g1 and the distance g2 are between 5 μm and 1000 μm. A larger distance facilitates the subsequent replacement of a faulty light-emitting module 100. Under normal usage conditions, viewers of the display device 1000 usually change the viewing position on the X-axis (horizontal direction) and rarely change the viewing position on the Y-axis (vertical direction). Therefore, the viewing angle θ1 on the X-axis (horizontal direction) of the display device 1000 should be large, that is, the luminous angle of the luminous group 130/140/150/160 on the X-axis (horizontal direction) should be large and the light intensity distribution should be even. In order to ensure that the color difference of the display device 1000 is minimized within the viewing angle θ1 range of the X-axis, as shown in Figure 4, the difference in the luminous intensity distribution of the luminous group 130/140/150/160 along the X-axis must be reduced, or the luminous intensity distribution must be uniform.

In one embodiment, since each light-emitting module 100 includes four light-emitting groups, when manufacturing a display device with the same resolution, the number of steps for arranging and fixing the light-emitting module 100 on the target carrier 1100 is 1/4 of that for fixing a single light-emitting group on the target carrier 1100, which can greatly reduce the process time.

In addition, in one embodiment, the electronic component 170 is a photodetector. As mentioned above, when the photodetector 170 is disposed in the central area of each light-emitting module 100, it is approximately equidistant from the four light-emitting groups 130-160 in the light-emitting module 100, and the electronic component 170 can receive the same light intensity from different light-emitting groups 130-160. In this embodiment, the display device 1000 also includes a signal receiving unit (not shown), a comparison unit (not shown), and a feedback control unit (not shown). When each electronic component 170 on the display device 1000 receives a specific color light, it converts it into an electronic signal and transmits it to the signal receiving unit. After the electronic signal is received by the signal receiving unit, it is compared by the comparison unit to determine whether each light-emitting module 100 reaches an appropriate brightness range. After the comparison, when the light intensity of some of the light-emitting modules 100 is not within the appropriate range, the feedback control unit provides corresponding feedback control signals to the light-emitting modules 100, so that the light-emitting modules 100 adjust the brightness to the appropriate brightness range accordingly. In another embodiment, the display device 1000 may further include an environment sensing unit (not shown), which can detect the brightness of the environment around the display device 1000 and provide corresponding feedback control signals to the light-emitting modules 100 in the display device 1000 through the feedback control unit, so that the light-emitting modules 100 can adjust the brightness to an appropriate brightness range according to the ambient brightness.

FIG. 5 is a top view of another display device 2000 disclosed in another embodiment. In this embodiment, the same display device 1000 is composed of two or more light-emitting modules 100 and 100'. The electronic components 170 and 170' included in the light-emitting module 100 and the light-emitting module 100' are different. In the light-emitting module 100, the electronic component 170 is an infrared light-emitting diode that can emit fourth light; in the light-emitting module 100', the electronic component 170' is an infrared photodiode that can absorb infrared light. As shown in the figure, the light-emitting module 100 and the light-emitting module 100' are arranged in groups and staggered on the display device 1000. The infrared photodiode 170' detects the amount and time of light reflected by the infrared light-emitting diode 170 from the external object, so as to achieve the function of measuring the distance of the external object. Furthermore, in the entire display device 1000, the relative position of the movement/gesture detection can be confirmed through the combination of electronic components 170 and 170', so as to achieve the effect of an interactive screen.

The implementation examples described above are only for illustrating the technical ideas and features of this application. Their purpose is to enable people familiar with this technology to understand the content of this application and implement it accordingly. They cannot be used to limit the patent scope of this application. In other words, all equivalent changes or modifications made according to the spirit disclosed in this application should still be covered by the patent scope of this application.

100: Light-emitting module

120: Circuit board

120’: Insulating base

121: First surface

121’: Upper conductive layer

121A~121J: Conductive channel

122: Second surface

130: The first light group

140: Second light group

150: The third light group

160: The fourth light group

170: Electronic components

180: Translucent packaging components

131, 141, 151, 161: Red LED chips

132, 142, 152, 162: Green LED chips

133, 143, 153, 163: Blue LED chips

Claims (10)

A light-emitting module comprises: a circuit substrate, comprising a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of separated conductive channels, and the second surface has a plurality of separated conductive pads; a plurality of light-emitting groups are arranged on the first surface in a matrix, each light-emitting group comprising a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. A light emitting diode chip; an electronic component located on the first surface and not overlapping with the light emitting group matrix; and a light-transmissive packaging component covering the plurality of light emitting group matrices and the electronic component; wherein the plurality of separated conductive pads include a conductive pad K, and the conductive pad K is not electrically connected to the red light emitting diode chip, the green light emitting diode chip, and the blue light emitting diode chip. As described in the first item of the patent application scope, the light-emitting module, wherein each of the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip respectively comprises an anode contact electrode and a cathode contact electrode, and the cathode contact electrodes of all the light-emitting diode chips in the same row in the plurality of light-emitting group matrix are electrically connected to one of the plurality of separated conductive pads. As described in item 2 of the patent application scope, the anode contact electrodes of the same color light-emitting diode chips located in the same horizontal row in the plurality of light-emitting group matrix are all electrically connected to one of the plurality of separated conductive pads. The light-emitting module as described in item 1 of the patent application, wherein the electronic component is located in a central area of the first surface. The light-emitting module as described in item 1 of the patent application further comprises a plurality of separated conductive lines located on the first surface, wherein the light-transmissive packaging element comprises carbon black greater than or equal to 0.005wt% and less than 1wt%. The light-emitting module as described in item 1 of the patent application further comprises a plurality of separated conductive lines located on the first surface, wherein the light-transmissive packaging element comprises an inorganic particle filler. A display device comprises: a carrier board; the light-emitting module described in item 1 of the multiple patent application scope is located on the carrier board, comprising: a first light-emitting module; and a second light-emitting module; and a signal receiving unit for receiving electronic signals emitted by the first light-emitting module and the second light-emitting module. The display device as described in item 7 of the patent application scope further includes a feedback control unit electrically connected to the first light-emitting module and the second light-emitting module; wherein the feedback control unit can feedback control the brightness of the first light-emitting module and the second light-emitting module. The display device as described in item 7 of the patent application scope, wherein the electronic component in the first light-emitting module and the electronic component in the second light-emitting module are different electronic components. The display device as described in item 7 of the patent application scope, wherein the electronic component in the first light-emitting module is an infrared light-emitting diode, and the electronic component in the second light-emitting module is an infrared photodiode.