TWI869851B - Heat dissipation structure and electronic device - Google Patents

Abstract

A heat dissipation structure includes a heat insulation board, a heat dissipation body, a heating element, a first connection part and a second connection part. The heat insulation board has a first surface and a second surface opposite, and a first side and a second side opposite. The heat dissipation body covers at least part of the heat insulation board, and has a flow channel, and the flow channel has a first area, a second area, and a third area connected to each other, wherein the first area and the second area are located on the first surface, the third area is located on the second surface. The heating element is arranged between the first surface and the first area of the heat insulation board. The first connection part corresponds to the first side and communicates with the second area and the third area. The second connection part corresponds to the second side and passes through the heat insulation board to communicate with the first area, the second area and the third area.

Description

Heat dissipation structure and electronic device

The present invention relates to a heat dissipation structure and an electronic device using the heat dissipation structure.

Generally speaking, the overall thickness of most electronic devices (such as smartphones, 5G base stations, servers, laptops, etc.) is getting thinner and thinner, and the thickness of heat dissipation structures (such as heat spreaders) is also constantly compressed. However, taking the heat spreader as an example, the maximum heat transfer of the heat spreader is positively correlated with the thickness. The thinner the thickness, the lower the maximum heat dissipation, and thus it may not be possible to generate a larger temperature difference to facilitate heat exchange.

The present invention provides a heat dissipation structure with a unique flow channel design to allow the fluid to perform efficient cold and hot cycle exchange, so that the heat source can achieve good heat dissipation efficiency.

The present invention provides an electronic device including the above-mentioned heat dissipation structure.

The heat dissipation structure of the present invention includes a heat insulation board, a heat dissipation body, a heat generating element, a first connecting portion and a second connecting portion. The heat insulation board has a first surface and a second surface opposite to each other and a first side and a second side opposite to each other. The heat dissipation body covers at least a portion of the heat insulation board and has a flow channel, which has a first area, a second area and a third area connected to each other, wherein the first area and the second area are located on the first surface, and the third area is located on the second surface. The heat generating element is arranged between the first surface and the first area of the heat insulation board. The first connecting portion corresponds to the first side and is connected to the second area and the third area. The second connecting portion corresponds to the second side and passes through the heat insulation board to be connected to the first area, the second area and the third area.

In one embodiment of the present invention, the first connecting portion is connected to a first end of the second region close to the first side and a second end of the third region close to the first side.

In one embodiment of the present invention, the second connecting portion passes through the insulation board near the periphery of the heating element to connect to a third end of the second zone away from the first side and a fourth end of the third zone away from the first side, and the first zone is connected to the second connecting portion and the third end of the second zone.

In one embodiment of the present invention, the heat dissipation structure further includes a guide member, which is used to separate the second connecting portion and the first area. One end of the guide member is located at the third end of the second area and connected to the first inner wall of the flow channel. The other end of the guide member extends to the first area and is close to the second inner wall of the flow channel. The second inner wall is closer to the first surface of the heat insulation board than the first inner wall.

In one embodiment of the present invention, the material of the above-mentioned flow guide includes porous material or elastic material.

In one embodiment of the present invention, the filling density in the second region increases from the third end toward the first end.

In one embodiment of the present invention, the cross-sectional area of the second zone decreases from the third end toward the first end, and the surface area of the heat sink body corresponding to the second zone increases from the third end toward the first end.

In one embodiment of the present invention, the above-mentioned heat dissipation structure also includes a heat pipe disposed between the heat generating element and the first zone.

In one embodiment of the present invention, the second connecting portion includes a plurality of heat pipes.

In one embodiment of the present invention, the first connecting portion, the second connecting portion and the heat sink body are integrated.

In one embodiment of the present invention, the heat sink body is used to dissipate heat from the heat generating element in a first circulation path from the first zone through the second zone and then back to the first zone.

In one embodiment of the present invention, the heat dissipation body is used to dissipate heat from the heat generating element through a second circulation path from the first zone through the second zone, the first connecting portion, the third zone and the second connecting portion and then back to the first zone.

In one embodiment of the present invention, the thermal conductivity of the above-mentioned heat insulation board is less than the thermal conductivity of the heat dissipation body.

In one embodiment of the present invention, the above-mentioned heat insulation board is a circuit board.

In one embodiment of the present invention, the electronic device body and the heat dissipation structure are arranged in the body, and the flow directions of the first zone, the second zone and the third zone are parallel to a gravity direction.

In one embodiment of the present invention, the electronic device further includes a display surface, and the normal direction of the heat insulation board is parallel to the normal direction of the display surface.

Based on the above, in the heat dissipation structure of the present invention, a heat generating element is disposed on the first surface of the heat insulation board, and the heat dissipation body covers at least a portion of the first surface and at least a portion of the second surface of the heat insulation board. Through the three-dimensional flow channel structure design of the heat dissipation body, the heat insulation board serves as a partition of the heat dissipation area, which can effectively isolate the temperature and utilize a relatively independent heat dissipation area to increase the heat dissipation efficiency.

In order to make the above features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.

10, 10’: Electronic devices

11: Body

12: Display surface

13: Frame

100, 100B, 100C: heat dissipation structure

110, 110D, 110E, 110F: Insulation board

111: First page

112: Second side

113: First side

114: Second side

120, 120D, 120E, 120F: heat dissipation body

121, 121B, 121D, 121E, 121F: flow channel

1211: Channel

130, 130B: Heating element

140: First connection part

150, 150C: Second connection part

151: Heat pipe

160: flow guide

170: Heat pipe

A1, A1’: District 1

A2: Second District

A3: District 3

C2: Connection surface

E1: First end

E2: Second end

E3: The third end

E4: The fourth end

W1: First inner wall

W2: Second inner wall

G1: Gravity direction

Figure 1 is a three-dimensional diagram of the heat dissipation structure of an embodiment of the present invention.

FIG2A is a side view of the heat dissipation structure of FIG1.

Figure 2B is a partially enlarged schematic diagram of the heat dissipation structure of Figure 2A.

Figure 3 is a front view of the heat dissipation structure of another embodiment of the present invention.

Figure 4 is a perspective view of the heat sink body of Figure 1.

Figure 5 is a three-dimensional diagram of the heat dissipation body of another embodiment of the present invention.

Figures 6A to 6C are three-dimensional diagrams of electronic devices of various embodiments of the present invention.

Figures 7 to 9 are partial schematic diagrams of the heat dissipation body of other embodiments of the present invention.

FIG1 is a three-dimensional diagram of a heat dissipation structure of an embodiment of the present invention. FIG2A is a side view of the heat dissipation structure of FIG1. FIG2B is a partially enlarged schematic diagram of the heat dissipation structure of FIG2A. Referring to FIG1, FIG2A and FIG2B, the heat dissipation structure 100 of the present embodiment includes a heat insulation board 110, a heat dissipation body 120, a heat generating element 130, a first connecting portion 140 and a second connecting portion 150.

In this embodiment, the heat insulation board 110 has a first surface 111 and a second surface 112 opposite to each other and a first side 113 and a second side 114 opposite to each other. The heat dissipation body 120 covers at least a portion of the heat insulation board 110 and has a flow channel 121. The flow channel 121 has a first area A1, a second area A2, and a third area A3 connected to each other. In detail, the first area A1 and the second area A2 are located on the first surface 111, the third area A3 is located on the second surface 112, and is bounded by the second side 114. The second area A2 and the third area A3 are located on the same side of the second side 114, and the first area A1 is located on the other side of the second side 114. In addition, the second area A2 has a first end E1 and a third end E3 opposite to each other, and the third area A3 has a second end E2 and a fourth end E4 opposite to each other, that is, the first end E1 and the second end E2 correspond to the first side 113, and the third end E3 and the fourth end E4 correspond to the second side 114.

In this embodiment, the heat generating element 130 is disposed between the first surface 111 of the heat insulating board 110 and the first area A1. In this embodiment, the heat conductivity coefficient of the heat insulating board 110 is less than the heat conductivity coefficient of the heat dissipation body 120, which can effectively prevent the heat of the heat generating element 130 on the first surface 111 from being directly transferred to the second surface 112 through the heat insulating board 110 itself. The heat insulating board 110 cannot conduct heat quickly, and has an isolation effect.

For example, the heat shield 110 is a circuit board, and the heat generating element 130 is a central processing unit (CPU). In other embodiments, the heat shield 110 is a non-metal plate, a plastic plate, a graphite sheet, or a composite material, but the present invention is not limited thereto.

In detail, in this embodiment, the first connecting portion 140 corresponds to the first side 113 and connects a first end E1 of the second area A2 and a second end E2 of the third area A3. In other words, the first connecting portion 140 is the connection between the second area A2 and the third area A3, and is also the turning point of the flow channel 121 close to the first side 113, wherein the flow direction of the first area A1, the second area A2 and the third area A3 can be understood as a vertical direction, and the flow direction of the first connecting portion 140 is a horizontal direction. In one embodiment, the flow direction of the first connecting portion 140 is perpendicular to the flow direction of the first area A1, the second area A2 and the third area A3, but the present invention is not limited thereto.

In this embodiment, the second connecting portion 150 corresponds to the second side 114 and passes through the heat insulation board 110 to connect the third end E3 of the second area A2 and the fourth end E4 of the third area A3, and the first area A1 is connected to the second connecting portion 150 and the third end E3 of the second area A2. In other words, the second connecting portion 150 is the connection between the third area A3 and the first area A1 and the second area A2 and connects the three, and is also the turning point of the flow channel 121 close to the second side 114.

Under the above configuration, the heat dissipation structure 100 is a three-dimensional heat dissipation structure, which uses the heat insulation board 110 as a partition of the heat dissipation area. The first side 111 where the main heat source (heat generating element 130) is located can be regarded as a high temperature area, and the second side 112 of the heat insulation board 110 can be regarded as a low temperature area. After the separation by the heat insulation board 110, two relatively independent heat dissipation areas are formed, and a set of mechanisms are used to independently or synchronously operate to provide heat dissipation for the system, effectively avoiding heat accumulation and affecting the heat dissipation efficiency of the heat dissipation area. It should be noted that the fluid referred to in the present invention is a cooling liquid, and the cooling liquid is converted into a liquid and a gas in different areas of the heat dissipation body 120 to achieve the purpose of cold and heat circulation exchange.

In this embodiment, the first area A1 of the flow channel 121 corresponding to the heating element 130 can be regarded as an evaporation area, and the first area A1 is arranged below the second connecting portion 150 and close to the bottom edge of the heat insulation board 110.

In this embodiment, the heat-generating element 130 directly contacts the first area A1. Specifically, in the normal direction of the heat-insulating board 110, the orthographic projection of the heat-generating element 130 on the heat-insulating board 110 overlaps the orthographic projection of the first area A1 on the heat-insulating board 110, but the present invention is not limited thereto. FIG. 3 is a front view of a heat-dissipating structure of another embodiment of the present invention. Referring to FIG. 3, in this embodiment, the heat-dissipating structure 100B includes a heat-generating element 130B and a heat-conducting pipe 170. The heat-conducting pipe 170 is disposed between the heat-generating element 130B and the first area A1' to transfer the heat of the heat-generating element 130B to the first area A1'. Specifically, in the normal direction of the heat insulation board 110, the orthographic projection of the heat-generating element 130B on the heat insulation board 110 does not overlap with the orthographic projection of the first area A1 on the heat insulation board 110, and the flow channel 121B does not cover the heat-generating element 130B, but the present invention is not limited to this.

FIG4 is a perspective view of the heat sink body of FIG1 , wherein the heat insulation board 110 is omitted. Referring to FIG2A , FIG2B and FIG4 , in this embodiment, the heat sink body 120 is provided with a guide 160 for separating the second connection portion 150 from the first area A1, wherein the guide 160 extends from the third end E3 of the second area A2 to the first area A1. Specifically, one end of the guide 160 is located at the third end E3 of the second area A2 and connected to a first inner wall W1 of the flow channel 121, and the other end of the guide 160 extends to the first area A1 and is close to a second inner wall W2 of the flow channel 121. In this embodiment, the first inner wall W1 and the second inner wall W2 face the first surface 111 of the heat insulation board 110, and the position of the first inner wall W1 corresponds to the second area A2, and the position of the second inner wall W2 corresponds to the first area A1. In addition, the second inner wall W2 is closer to the first surface 111 of the heat insulation board 110 than the first inner wall W1, but the present invention is not limited to this.

In this embodiment, the guide 160 is a cooling sheet that can absorb the condensed liquid in the third area A3 and cool the first area A1. The material of the guide 160 includes porous materials, elastic materials, metal materials, plastic materials or graphene materials, etc., but the present invention is not limited thereto. In this embodiment, the condensed liquid in the third area A3 can push the guide 160 with elastic force or penetrate the porous structure of the guide 160 through its own gravity, and the guide 160 can guide the condensed liquid to flow back to the first area A1. In one embodiment, after the guide 160 is pushed away, it can rebound to reset by its own elastic restoring force to prevent the high-temperature gas in the first area A1 from flowing back to the third area A3 through the second connecting portion 150.

Please refer to FIG. 4 . In this embodiment, the edge between the third area A3 and the second area A2 and the edge between the third area A3 and the first area A1 can be welded by friction welding, and the connecting surface C2 between the third area A3 and the second area A2 can be glued, but the present invention is not limited thereto.

In one embodiment, the first connection part 140, the second connection part 150 and the heat dissipation body 120 are integrated. The third area A3 is connected to the first area A1 through the second connection part 150, but the present invention is not limited thereto. FIG. 5 is a three-dimensional diagram of the heat dissipation body of another embodiment of the present invention. Referring to FIG. 5, in one embodiment, the second connection part 150C includes a plurality of heat pipes 151. The two ends of each heat pipe 151 are respectively connected to the third area A3 and the first area A1 by crimping or welding, but the present invention is not limited thereto.

For more details, please refer to FIG. 2A and FIG. 2B. In this embodiment, the first zone A1 mainly absorbs heat in the heat dissipation cycle. When the heat from the heat source is transferred to the first zone A1, the fluid in the first zone A1 absorbs the heat from the heat source, and then generates a two-stage condensation cycle.

In this embodiment, the heat dissipation body 120 is used to dissipate heat from the heating element 130 in a first circulation path from the first area A1 through the second area A2 and then back to the first area A1. Specifically, after the fluid in the first area A1 absorbs the heat of the heating element 130, it first undergoes vaporization and turns into gas. The gas that expands due to heat (referring to the second highest temperature) first moves toward the upper end of the second area A2 where the temperature is relatively low. Once it touches the relatively cold area at the upper end of the second area A2 and condenses into liquid, it directly falls back to the first area A1, thereby achieving the effect of heat dissipation circulation only in the first area A1 and the second area A2.

In this embodiment, the heat dissipation body 120 is used to dissipate heat from the heat generating element 130 in a second circulation path from the first area A1 through the second area A2, the first connecting portion 140, the third area A3 and the second connecting portion 150 and then back to the first area A1. Specifically, the condensation heat release in the third area A3 is the second stage heat dissipation cycle. When the high-temperature expanded gas (the highest temperature) moves to the uppermost edge of the second area A2 (i.e., the first end E1), it cannot reach the temperature to condense into liquid. Since the temperature and pressure of the third area A3 are lower than those of the second area A2, the chimney effect forces the high-temperature expanded gas to flow to the third area A3 through the first connecting portion 140, condense into liquid in the third area A3, and then flow back to the first area A1 through the second connecting portion 150, so as to achieve a heat dissipation cycle effect between the first area A1 and the second area A2 on the first surface 111 and the third area A3 on the second surface 112.

In this way, the heat insulation plate 110 is used as a temperature partition, and flow resistance is generated in the turning area of the first connecting portion 140, thereby dividing the second area A2 and the third area A3 of the heat dissipation body 120. When the heat dissipation structure 100 of this embodiment is applied to an electronic device, a suitable heat dissipation cycle can be performed according to the performance status.

FIG. 6A to FIG. 6C are three-dimensional diagrams of electronic devices of various embodiments of the present invention. Referring to FIG. 6A , in this embodiment, the electronic device 10 includes a body 11 and the above-mentioned heat dissipation structure 100. The body 11 has, for example, a display device and a computer processing center. Therefore, the heat dissipation structure 100 is disposed in the body 11, and the flow directions of the first area A1, the second area A2, and the third area A3 are parallel to a gravity direction G1, but not perpendicular to the gravity direction G1. Referring to FIG. 6B , in this embodiment, the body 11 can be rotated to match the viewing angle of the user, and at this time, the flow directions of the first area A1, the second area A2, and the third area A3 are inclined to the gravity direction G1 but not perpendicular to the gravity direction G1. Furthermore, the electronic device 10 further includes a display surface 12, and the normal direction of the heat insulation board 110 is parallel to the normal direction of the display surface 12.

Different from the embodiment of FIG. 6A above, the electronic device 10' of FIG. 6C is another embodiment, including a frame 13 and the above-mentioned heat dissipation structure 100. The frame 13 is used to support the body 11 and has a built-in computer computing center, while the body 11 only has a display device. Therefore, the heat dissipation structure 100 is arranged on the frame 13, and the flow direction of the first area A1, the second area A2 and the third area A3 of the heat dissipation structure 100 is inclined to the gravity direction G1, but not perpendicular to the gravity direction G1.

The placement direction of the heat dissipation structure 100 is not limited to FIG. 6A, FIG. 6B and FIG. 6C. The third area A3 may correspond to the display surface 12, or the second area A2 may correspond to the display surface 12.

Specifically, in one embodiment, when the electronic device operates at low efficiency and generates less heat, it can perform the aforementioned first circulation path. Since the temperature difference between the second area A2 (high temperature area) and the third area A3 (low temperature area) is small, the high temperature expanded gas moves to the first end E1 of the second area A2, and condenses when it contacts the colder area above, and falls back to the first area A1. Since it cannot break through the fluid resistance at the turning point, only the heat exchange of gas-to-liquid conversion is performed in the second area A2 to dissipate heat for the system. The heat is only dissipated through the second area A2, and is not transferred to the third area A3, so that the third area A3 is kept cool.

In one embodiment, when the electronic device operates at a high-performance condition and generates a large amount of heat, it will enter the aforementioned second circulation path. Since the temperature difference between the second area A2 and the third area A3 is large, the higher temperature and more expanded gas moves toward the first end E1 of the second area A2. When it reaches the turning area, due to the sufficiently large temperature and pressure difference (kinetic energy), it can drive the higher temperature and more expanded gas through the first connecting portion 140 (turning area) and enter the third area A3 for heat exchange and heat dissipation. Since the third area A3 has a lower temperature, the flow channel design can also be used to reduce the flow rate of the gas and liquid flowing through the third area A3, so that the gas and liquid are sufficiently cooled in the third area A3, and finally guided back to the first area A1 through the second connecting portion 150 to perform the heat absorption cycle again. It should be noted that the temperature of the liquid flowing back to the first zone A1 in the second circulation path is much lower than the temperature of the liquid flowing back to the first zone A1 in the first circulation path, and a better heat dissipation effect can be achieved.

Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, where the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the previous embodiments, and the following embodiments will not be repeated.

Figures 7 to 9 are partial schematic diagrams of the heat sink body of other embodiments of the present invention. Please refer to Figure 7. In this embodiment, the heat sink body 120D has a flow channel 121D, and the filling density in the second area A2 of the flow channel 121D increases from the third end E3 toward the first end E1. Specifically, the second area A2 of the flow channel 121D is filled with fillers such as sheets or columns to gradually adjust the internal filling density, increase the density from bottom to top, so that the flow resistance increases gradually as the upper layer increases, thereby achieving an increase in the pressure difference between the second area A2 and the third area A3, and the filler not only provides flow resistance, but also indirectly increases the surface area of the flow channel 121D inside the heat sink body 120D, thereby improving the heat exchange efficiency of the second area A2. Here, the filler is, for example, a metal material, and the present invention is not limited to this.

Please refer to FIG. 8 . In this embodiment, the heat sink body 120E has a flow channel 121E. The cross-sectional area of the second area A2 of the flow channel 121E decreases from the third end E3 toward the first end E1, and the surface area of the heat sink body 120E corresponding to the second area A2 increases from the third end E3 toward the first end E1. Specifically, the cross-sectional area is changed by adjusting the flow channel aspect ratio to reduce the cross-sectional area and increase the surface area. In this way, the flow channel is narrowed, the flow resistance of the upper end flow channel is increased, the gas pressure is increased to increase the pressure difference between the second area A2 and the third area A3, and the heat exchange efficiency is also increased by the increased surface area.

In the embodiments shown in FIG. 7 and FIG. 8 , the flow channel design of the first area A1 and the second area A2 can achieve a gradually increasing resistance upwards by changing the filler density and cross-sectional area, thereby increasing the pressure difference between the first end E1 of the second area A2 and the third area A3, thereby enhancing the chimney effect (the greater the temperature difference and pressure difference, the more significant the effect), increasing the flow rate, and guiding more high-temperature expansion gas to the third area A3 for heat dissipation.

Please refer to FIG. 9 . In this embodiment, the heat sink body 120F has a flow channel 121F, and the second area A2 of the flow channel 121F has a plurality of channels 1211 separated from each other. That is, the flow channel is not limited to an open flow channel.

In addition, in other embodiments, fillers can also be placed inside the third area A3 to reduce the flow rate of gas and liquid when flowing through the third area A3, and increase the residence time to achieve sufficient cooling.

In summary, in the heat dissipation structure of the present invention, a heat generating element is disposed on the first surface of the heat insulation board, and the heat dissipation body covers at least a portion of the first surface and at least a portion of the second surface of the heat insulation board. Through the three-dimensional flow channel structure design of the heat dissipation body, the heat insulation board is used as a partition of the heat dissipation area to effectively isolate the temperature, and the relatively independent heat dissipation area is used to increase the heat dissipation efficiency. In other words, the heat dissipation body has a flow channel, and the flow channel has a connected evaporation zone, a high temperature zone and a low temperature zone. The first circulation path is that after the fluid in the evaporation zone (i.e., the first zone A1) absorbs the heat of the heat generating element, it is first converted into gas through vaporization and evaporation, and the gas (referring to the second highest temperature) that expands due to heat first moves toward the upper end of the high temperature zone (i.e., the second zone A2) with a relatively low temperature. Once it touches the cooler area at the top of the high temperature zone and condenses into liquid, it will directly fall back to the evaporation zone, thereby achieving the effect of heat dissipation circulation only in the high temperature zone (second zone A2) and the evaporation zone (first zone A1). The second circulation path is when the high temperature expansion gas (referring to the highest temperature) moves to the upper edge of the high temperature zone. At this time, it cannot reach the temperature of condensation into liquid, and because the temperature and pressure of the low temperature zone are lower than those of the high temperature zone, the chimney effect drives the high temperature expansion gas to flow through the first connection to the low temperature zone (i.e. the third zone A3), condense into liquid in the low temperature zone, and then flow back to the evaporation zone through the second connection, so as to achieve the effect of heat dissipation circulation between the low temperature zone (third zone A3) and the high temperature zone (second zone A2).

Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of the attached patent application.

100: Heat dissipation structure

110: Insulation board

120: Heat dissipation body

121: Runner

130: Heating element

140: First connection part

150: Second connection part

A1: Area 1

A2: Second District

A3: District 3

E1: First end

E2: Second end

E3: The third end

E4: The fourth end

Claims (16)

A heat dissipation structure includes: a heat insulation board having a first surface and a second surface opposite to each other and a first side and a second side opposite to each other; a heat dissipation body covering at least part of the heat insulation board and having a flow channel, the flow channel having a first area, a second area, and a third area connected to each other, wherein the first area and the second area are located on the first surface, and the third area is located on the second surface; a heat generating element disposed between the first surface and the first area of the heat insulation board; a first connecting portion corresponding to the first side and connected to the second area and the third area; and a second connecting portion corresponding to the second side and passing through the heat insulation board, the second connecting portion being a connecting portion between the third area and the first area and the second area to connect to the first area, the second area, and the third area. The heat dissipation structure as described in claim 1, wherein the first connecting portion is connected to a first end of the second zone and a second end of the third zone. The heat dissipation structure as described in claim 2, wherein the second connecting portion passes through the heat insulation board to connect to a third end of the second zone and a fourth end of the third zone, and the first zone is connected to the second connecting portion and the third end of the second zone. The heat dissipation structure as described in claim 3 further includes a guide member, the guide member is used to separate the second connecting portion and the first area, one end of the guide member is located at the third end of the second area and connected to a first inner wall of the flow channel, and the other end of the guide member extends to the first area and is close to a second inner wall of the flow channel, and the second inner wall is closer to the first surface of the heat insulation board than the first inner wall. A heat dissipation structure as described in claim 4, wherein the material of the flow guide comprises a porous material or an elastic material. A heat dissipation structure as described in claim 3, wherein the filling density in the second region increases from the third end toward the first end. A heat dissipation structure as described in claim 3, wherein the cross-sectional area of the second region decreases from the third end toward the first end, and the surface area of the heat dissipation body corresponding to the second region increases from the third end toward the first end. The heat dissipation structure as described in claim 1 further includes a heat pipe disposed between the heat generating element and the first zone. A heat dissipation structure as described in claim 1, wherein the second connection portion includes a plurality of heat pipes. The heat dissipation structure as described in claim 1, wherein the first connecting portion, the second connecting portion and the heat dissipation body are integrated. The heat dissipation structure as described in claim 1, wherein the heat dissipation body is used to dissipate heat from the heat generating element through a first circulation path from the first zone through the second zone and then back to the first zone. The heat dissipation structure as described in claim 1, wherein the heat dissipation body is used to dissipate heat from the heat generating element through a second circulation path from the first zone, through the second zone, the first connecting portion, the third zone and the second connecting portion in sequence and then back to the first zone. A heat dissipation structure as described in claim 1, wherein the thermal conductivity of the heat insulation board is less than the thermal conductivity of the heat dissipation body. A heat dissipation structure as described in claim 1, wherein the heat insulation board is a circuit board. An electronic device, comprising: a body; and a heat dissipation structure as described in any one of claims 1 to 14, arranged in the body, wherein the flow directions of the first zone, the second zone, and the third zone are parallel to or inclined to a gravity direction. The electronic device as described in claim 15 further includes a display surface, and the normal direction of the heat insulation board is parallel to the normal direction of the display surface.

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