TWI869390B - Retainer unit and pin - Google Patents
Retainer unit and pin Download PDFInfo
- Publication number
- TWI869390B TWI869390B TW109111633A TW109111633A TWI869390B TW I869390 B TWI869390 B TW I869390B TW 109111633 A TW109111633 A TW 109111633A TW 109111633 A TW109111633 A TW 109111633A TW I869390 B TWI869390 B TW I869390B
- Authority
- TW
- Taiwan
- Prior art keywords
- pin
- scribing wheel
- wheel
- retainer unit
- retainer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
本發明之目的在於提供一種可容易地形成沿著保持器單元之掃描方向之劃線的保持器單元。 The object of the present invention is to provide a retainer unit that can easily form a line along the scanning direction of the retainer unit.
於本發明之保持器單元40中,支持劃線輪60之銷70具備阻擋劃線輪60於銷70之軸方向上相對於銷70移動的限制部80,且劃線輪60之被限制部與銷70之限制部80以2點接觸而支持劃線輪60,藉此抑制劃線輪之偏移。 In the retainer unit 40 of the present invention, the pin 70 supporting the scribing wheel 60 has a limiting portion 80 that blocks the scribing wheel 60 from moving relative to the pin 70 in the axial direction of the pin 70, and the restricted portion of the scribing wheel 60 and the limiting portion 80 of the pin 70 are in contact at two points to support the scribing wheel 60, thereby suppressing the deviation of the scribing wheel.
Description
本發明係關於一種保持器單元及銷。 The present invention relates to a retainer unit and a pin.
對玻璃基板等脆性材料基板形成劃線時使用劃線裝置。於劃線裝置設置有保持器單元、及對此進行掃描之掃描裝置。保持器單元由保持器本體、銷、及劃線輪構成。保持器本體安裝於掃描裝置。銷支持於保持器本體。劃線輪支持於銷。於專利文獻1中,揭示保持器單元之一例即劃線單元(20)。劃線單元(20)由劃線輪(60)、支持劃線輪(60)且使之可旋轉之銷(32)、及支持銷(32)之支持框體(33)構成。藉由使劃線單元(20)對脆性材料基板沿特定之掃描方向掃描而於脆性材料基板形成劃線。 A marking device is used when marking a brittle material substrate such as a glass substrate. The marking device is provided with a retainer unit and a scanning device for scanning the same. The retainer unit is composed of a retainer body, a pin, and a marking wheel. The retainer body is mounted on the scanning device. The pin is supported on the retainer body. The marking wheel is supported on the pin. Patent document 1 discloses an example of a retainer unit, namely a marking unit (20). The marking unit (20) is composed of a marking wheel (60), a pin (32) that supports the marking wheel (60) and allows it to rotate, and a support frame (33) that supports the pin (32). A marking unit (20) is used to scan the brittle material substrate along a specific scanning direction to form a marking line on the brittle material substrate.
[專利文獻1]日本專利特開2012-106479號公報 [Patent document 1] Japanese Patent Publication No. 2012-106479
於先前之劃線裝置中,例如,於使保持器單元沿直線方向掃描之情 形時,有時於脆性材料基板形成非直線狀之劃線。一例中,非直線狀之劃線包含沿劃線輪之掃描方向之直線部分、及沿與掃描方向不同之方向行進之非直線部分。存在非直線部分局部形成於劃線之1個部位或數個部位之情形、於劃線之大致全體交替形成直線部分與非直線部分之情形等,非直線狀之劃線之形狀多樣。基於提高經裂斷之脆性材料基板之品質之點,較佳形成沿掃描方向之劃線。其係不僅於形成直線狀之劃線之情形,於形成與直線不同之形狀之劃線之情形時亦同樣。 In a previous scribing device, for example, when the retainer unit is scanned in a straight direction, a non-straight scribing line is sometimes formed on a brittle material substrate. In one example, the non-straight scribing line includes a straight line portion along the scanning direction of the scribing wheel and a non-straight line portion that moves in a direction different from the scanning direction. There are cases where the non-straight line portion is partially formed in one or several parts of the scribing line, and there are cases where the straight line portion and the non-straight line portion are alternately formed in the substantially entire scribing line, and the shape of the non-straight scribing line is varied. Based on the point of improving the quality of the brittle material substrate that has been broken, it is better to form a scribing line along the scanning direction. This applies not only to the case of forming a straight line, but also to the case of forming a scribing line of a shape different from a straight line.
(1)本發明相關之保持器單元之特徵在於包含:劃線輪;銷,其插入至上述劃線輪之插入孔,將上述劃線輪可旋轉地支持;及保持器,其保持上述銷;且上述劃線輪藉由設置於上述插入孔之內周面之被限制部、與設置於上述銷之限制部以2點接觸而受支持;上述限制部為形成於上述銷之外周之凹部。 (1) The retainer unit related to the present invention is characterized in that it includes: a scribing wheel; a pin inserted into the insertion hole of the scribing wheel to rotatably support the scribing wheel; and a retainer that retains the pin; and the scribing wheel is supported by a restricted portion provided on the inner circumference of the insertion hole and a restricting portion provided on the pin in contact at two points; the restricting portion is a recessed portion formed on the outer circumference of the pin.
於劃線輪掃描時,劃線輪中產生沿銷之軸方向發揮作用之反作用力之情形時,該反作用力由銷之限制部承受。因此,抑制銷之軸方向上劃線輪相對於銷之移動。藉此,可容易地形成沿保持器單元之掃描方向之劃線。又,藉由銷之限制部與劃線輪之被限制部以2點接觸,而易於在保持器內穩定劃線輪之位置及姿勢。 When the scribing wheel is scanning, if a reaction force is generated in the scribing wheel in the axial direction of the pin, the reaction force is borne by the limiting portion of the pin. Therefore, the movement of the scribing wheel relative to the pin in the axial direction of the pin is suppressed. In this way, it is easy to form a scribing line along the scanning direction of the retainer unit. In addition, the limiting portion of the pin and the restricted portion of the scribing wheel are in contact at two points, so it is easy to stabilize the position and posture of the scribing wheel in the retainer.
(2)如(1)所記載之保持器單元,於較佳之例中,上述被限制部為凸曲面。 (2) In the retainer unit described in (1), in a preferred embodiment, the above-mentioned restricted portion is a convex surface.
因此,限制部之構成簡單。 Therefore, the structure of the restriction part is simple.
(3)如(2)所記載之保持器單元,於較佳之例中,上述凹部之寬度小於上述劃線輪之厚度。 (3) In the retainer unit described in (2), in a preferred embodiment, the width of the recess is smaller than the thickness of the scribing wheel.
因此,使被限制部與限制部確實地以2點接觸。 Therefore, the restricted part and the restricting part are surely in contact at two points.
(4)如(2)記載之保持器單元,於較佳之例中,上述凸曲面在劃線輪之整個厚度方向上設置。 (4) In the retainer unit described in (2), in a preferred embodiment, the convex surface is provided in the entire thickness direction of the scoring wheel.
因凹部與凸部線接觸,故劃線時之摩擦電阻變小。 Since the concave and convex parts are in contact, the friction resistance when drawing lines becomes smaller.
(5)本發明相關之銷係插入至劃線輪之插入孔、將上述劃線輪可旋轉地支持者,且具備:與上述劃線輪之插入孔以2點接觸之限制部;上述限制部為形成於上述銷之外周之凹部。 (5) The pin related to the present invention is inserted into the insertion hole of the scribing wheel, supports the scribing wheel rotatably, and has: a limiting portion that contacts the insertion hole of the scribing wheel at two points; the limiting portion is a recessed portion formed on the outer periphery of the pin.
根據上述銷,可獲得與(1)所記載之效果同樣之效果。 According to the above method, the same effect as described in (1) can be obtained.
根據本發明相關之保持器單元及銷,可容易形成沿保持器單元之掃描方向之劃線。 According to the retainer unit and pin related to the present invention, it is easy to form a line along the scanning direction of the retainer unit.
1:劃線裝置 1: Marking device
10:移動裝置 10: Mobile devices
11:移動台 11: Mobile platform
12:軌條 12: Tracks
13:旋轉直進轉換裝置 13: Rotational-linear conversion device
13A:馬達 13A: Motor
13B:導螺桿部 13B: Lead screw part
20:平台裝置 20: Platform device
21:平台 21: Platform
22:馬達 22: Motor
30:保持機構 30:Maintaining mechanism
31:橋 31: Bridge
31A:導引 31A: Guidance
32:支柱 32: Pillar
33:連結部 33: Connection part
34:劃線頭 34: Marking the thread ends
35:保持器接頭 35: Retainer joint
40:保持器單元 40: Retainer unit
50:保持器 50: Retainer
51:溝槽部 51: Groove
51A:面 51A: Noodles
51B:面 51B: Noodles
52:支持孔 52: Support hole
60:劃線輪 60: Scoring wheel
61:本體部 61: Main body
61A:第1側面 61A: 1st side
61B:第2側面 61B: 2nd side
62:刀尖部 62: Blade tip
63:插入孔 63: Insertion hole
70:銷 70: Sales
70A:端部 70A: End
71:外周面 71: Outer surface
80:限制部 80: Restriction Department
81:凹部 81: Concave part
81A:底部 81A: Bottom
81B:緣 81B: Fate
81C:緣 81C: Fate
90:被限制部 90: Restricted Department
91:凸部 91: convex part
91A:面 91A: Noodles
91B:頂點 91B: Top point
170:銷 170:Sales
180:限制部 180: Restriction Department
181:凹部 181: Concave part
270:銷 270:Sales
280:限制部 280: Restriction Department
281:凹部 281: Concave part
370:銷 370: Sales
380:限制部 380: Restriction Department
381:凹部 381: Concave part
DT:厚度方向 DT: thickness direction
GB:脆性材料基板 GB: brittle material substrate
HA:高度 HA:Height
J:中心軸 J: Center axis
LA:直線 LA: Straight Line
LB:直線 LB: Straight line
SA:間隙 SA: gap
SB:間隙 SB: Gap
XA:深度 XA: Depth
XB:寬度 XB: Width
圖1係實施形態之劃線裝置之立體圖。 Figure 1 is a three-dimensional diagram of the line drawing device in the implementation form.
圖2係圖1之保持器單元之剖視圖。 Figure 2 is a cross-sectional view of the retainer unit in Figure 1.
圖3係顯示使用實施形態之保持器單元進行劃線時之劃線之偏移的 圖。 FIG. 3 is a diagram showing the deviation of the drawn line when the drawn line is drawn using the retainer unit of the embodiment.
圖4係顯示使用先前之保持器單元進行劃線時之劃線之偏移的圖。 FIG. 4 is a diagram showing the deviation of the marking line when the marking is performed using the previous retainer unit.
圖5(a)~(c)係顯示實施形態之保持器單元之限制部之變化例之放大側視圖。 Figures 5(a) to (c) are enlarged side views showing variations of the limiting portion of the retainer unit of the embodiment.
(實施形態) (Implementation form)
圖1所示之劃線裝置1係為了分斷由例如玻璃基板或陶瓷基板等脆性材料形成之基板(以下為「脆性材料基板GB」)而於脆性材料基板GB之表面形成劃線而使用。脆性材料基板GB之一例為玻璃基板。玻璃基板之一例為無鹼玻璃。無鹼玻璃用於平板顯示器等。 The scribing device 1 shown in FIG. 1 is used to form scribing lines on the surface of a brittle material substrate GB in order to separate a substrate formed of a brittle material such as a glass substrate or a ceramic substrate (hereinafter referred to as a "brittle material substrate GB"). An example of the brittle material substrate GB is a glass substrate. An example of a glass substrate is alkali-free glass. Alkali-free glass is used in flat panel displays, etc.
構成劃線裝置1之主要素為移動裝置10、平台裝置20、保持機構30、及保持器單元40。移動裝置10使脆性材料基板GB沿掃描方向接受掃描。移動裝置10具備搭載有平台裝置20之移動台11。移動台11載置於一對軌條12上。旋轉直進轉換裝置13使移動台11沿軌條12移動。旋轉直進轉換裝置13之一例為導螺桿裝置,具備成為驅動源之馬達13A、與連接於馬達13A之輸出軸之導螺桿部13B。 The main elements constituting the marking device 1 are a moving device 10, a platform device 20, a holding mechanism 30, and a retainer unit 40. The moving device 10 allows the brittle material substrate GB to be scanned along the scanning direction. The moving device 10 has a moving table 11 on which the platform device 20 is mounted. The moving table 11 is mounted on a pair of rails 12. The rotation-to-linear conversion device 13 moves the moving table 11 along the rails 12. An example of the rotation-to-linear conversion device 13 is a lead screw device, which has a motor 13A as a driving source and a lead screw portion 13B connected to the output shaft of the motor 13A.
平台裝置20具備可以旋轉中心軸J為中心旋轉之平台21、及用以使平台21旋轉之馬達22。脆性材料基板GB載置於平台21上,藉由以真空吸引機構(省略圖示)吸附於平台21而保持於平台21。馬達22收納於平台21內。馬達22藉由使平台21旋轉,而決定平台21之旋轉方向上之脆性材料基板 GB之位置。 The platform device 20 has a platform 21 that can rotate around a rotation center axis J, and a motor 22 for rotating the platform 21. The brittle material substrate GB is placed on the platform 21 and is held on the platform 21 by being adsorbed on the platform 21 by a vacuum suction mechanism (not shown). The motor 22 is housed in the platform 21. The motor 22 determines the position of the brittle material substrate GB in the rotation direction of the platform 21 by rotating the platform 21.
保持機構30保持保持器單元40。保持機構30具備以自上方橫跨平台21之方式設置之橋31、及支持橋31之一對支柱32。於橋31設置有導引31A。劃線頭34經由連結部33可移動地安裝於導引31A。連結部33及劃線頭34沿導引31A移動。連結部33與劃線頭34經由升降機構(省略圖示)連結。藉由驅動升降機構,劃線頭34相對於連結部33沿上下方向移動。於劃線頭34,經由保持器接頭35可裝卸地安裝有保持器單元40。 The holding mechanism 30 holds the retainer unit 40. The holding mechanism 30 has a bridge 31 arranged to cross the platform 21 from above, and a pair of pillars 32 supporting the bridge 31. A guide 31A is provided on the bridge 31. The marking head 34 is movably mounted on the guide 31A via a connecting portion 33. The connecting portion 33 and the marking head 34 move along the guide 31A. The connecting portion 33 and the marking head 34 are connected via a lifting mechanism (not shown). By driving the lifting mechanism, the marking head 34 moves in the up and down direction relative to the connecting portion 33. The retainer unit 40 is detachably mounted on the marking head 34 via a retainer joint 35.
構成圖2所示之保持器單元40之主要素為保持器50、劃線輪60、及劃線輪60之銷70(以下為「銷70」)。因劃線輪60為消耗品,故定期更換。一例中,藉由僅更換劃線輪60,或更換保持器單元40,而進行劃線輪60之更換。 The main elements constituting the retainer unit 40 shown in FIG2 are the retainer 50, the scribing wheel 60, and the pin 70 of the scribing wheel 60 (hereinafter referred to as "pin 70"). Since the scribing wheel 60 is a consumable part, it is replaced regularly. In one example, the scribing wheel 60 is replaced by replacing only the scribing wheel 60 or the retainer unit 40.
構成保持器50之材料之一例為磁性體金屬。保持器50為大致圓柱形狀或角柱形狀。保持器50具備用以收納劃線輪60之一部分之溝槽部51、及以連通於溝槽部51之方式貫通保持器50之支持孔52。溝槽部51於在劃線頭34(參照圖1)安裝有保持器50之狀態下,向脆性材料基板GB開口。 An example of a material constituting the retainer 50 is a magnetic metal. The retainer 50 is roughly cylindrical or prism-shaped. The retainer 50 has a groove portion 51 for accommodating a portion of the scribing wheel 60, and a support hole 52 that penetrates the retainer 50 in a manner connected to the groove portion 51. The groove portion 51 opens toward the brittle material substrate GB when the retainer 50 is mounted on the scribing head 34 (see FIG. 1 ).
銷70支持劃線輪60。銷70插入至支持孔52。銷70之一端部70A為漸細之形狀。支持孔52與銷70之關係可任意選擇。於第1例中,銷70以相對於支持孔52無法旋轉之方式,固定於支持孔52。固定方法為壓入或接著。於第1例之情形時,較佳為支持孔52之最大內徑與銷70之最大外徑實 質相等。於第2列中,銷70以相對於支持孔52可旋轉之方式,插入至支持孔52。於第2例之情形時,支持孔52之最大內徑稍大於銷70之最大外徑。於以下,將銷70之中心軸之延伸方向稱為銷軸方向。 The pin 70 supports the scribing wheel 60. The pin 70 is inserted into the support hole 52. One end 70A of the pin 70 is a tapered shape. The relationship between the support hole 52 and the pin 70 can be selected arbitrarily. In the first example, the pin 70 is fixed to the support hole 52 in a manner that it cannot rotate relative to the support hole 52. The fixing method is press-in or connection. In the case of the first example, it is preferred that the maximum inner diameter of the support hole 52 and the maximum outer diameter of the pin 70 are substantially equal. In the second row, the pin 70 is inserted into the support hole 52 in a manner that it can rotate relative to the support hole 52. In the case of the second example, the maximum inner diameter of the support hole 52 is slightly larger than the maximum outer diameter of the pin 70. In the following, the extension direction of the center axis of the pin 70 is referred to as the pin axis direction.
構成劃線輪60及銷70之材料之一例為燒結金剛石、超硬合金、單晶金剛石、及多晶金剛石。於其他例中,有於劃線輪60塗佈硬質材料之情形。硬質材料為例如金剛石。 An example of the material constituting the scribing wheel 60 and the pin 70 is sintered diamond, superhard alloy, single crystal diamond, and polycrystalline diamond. In other examples, there is a case where a hard material is coated on the scribing wheel 60. The hard material is, for example, diamond.
劃線輪60主要區分為本體部61及刀尖部62。本體部61為圓板狀,即劃線輪60中較刀尖部62更靠徑向內側之部分。刀尖部62為剖面V字狀,形成於劃線輪60之外周部之整周。剖面V字狀是指於沿著劃線輪60之厚度方向(以下為「厚度方向DT」)之平面切開劃線輪60之剖面中,向劃線輪60之外周緣漸細之形狀。以下之說明中,將與平行於劃線輪60之徑向之平面正交的剖面稱為正交剖面。於較佳之例中,劃線輪60之外徑之一例含在Φ1mm~Φ7mm之範圍內。於一例中,劃線輪60之外徑為Φ2.5mm。於較佳之例中,劃線輪60之厚度含在0.38mm~1.1mm之範圍內。劃線輪60之厚度之一例為0.64mm。另,溝槽部51之厚度方向DT之長度,即溝槽部51之內表面中於厚度方向DT相向之2個面51A、51B之厚度方向DT間之距離之一例為0.66mm。 The scribing wheel 60 is mainly divided into a main body 61 and a blade tip 62. The main body 61 is in the shape of a circular plate, i.e., the portion of the scribing wheel 60 that is closer to the inner side of the blade tip 62 in diameter. The blade tip 62 is in the shape of a V-shaped cross section, formed on the entire periphery of the scribing wheel 60. The V-shaped cross section refers to a shape that tapers toward the outer periphery of the scribing wheel 60 in a cross section of the scribing wheel 60 cut along a plane in the thickness direction of the scribing wheel 60 (hereinafter referred to as "thickness direction DT"). In the following description, a cross section that is orthogonal to a plane parallel to the radial direction of the scribing wheel 60 is referred to as an orthogonal cross section. In a preferred example, an example of the outer diameter of the scribing wheel 60 is within the range of Φ1mm~Φ7mm. In one example, the outer diameter of the scribing wheel 60 is Φ2.5 mm. In a preferred example, the thickness of the scribing wheel 60 is within the range of 0.38 mm to 1.1 mm. An example of the thickness of the scribing wheel 60 is 0.64 mm. In addition, the length of the groove portion 51 in the thickness direction DT, that is, the distance between the two surfaces 51A and 51B facing each other in the thickness direction DT in the inner surface of the groove portion 51, is 0.66 mm.
於本體部61之中心部,形成有於厚度方向DT貫通本體部61之插入孔63。於插入孔63插入有銷70。本體部61具備形成插入孔63之一端之第1側面61A、及形成插入孔63之另一端之第2側面61B。第1側面61A中收納於 溝槽部51之部分介隔特定之間隙SA與溝槽部51之面51A對向。第2側面61B中收納於溝槽部51之部分介隔特定之間隙SB與溝槽部51之面51B對向。厚度方向DT上之間隙SA之大小與間隙SB之大小之關係可根據稍後敘述之限制部80之位置及大小而任意選擇。於圖2所示之第1例中,厚度方向DT上之間隙SA之大小與間隙SB之大小相等。於第2例中,厚度方向DT上之間隙SA之大小與間隙SB之大小不同。 An insertion hole 63 is formed at the center of the main body 61 and penetrates the main body 61 in the thickness direction DT. A pin 70 is inserted into the insertion hole 63. The main body 61 has a first side surface 61A forming one end of the insertion hole 63 and a second side surface 61B forming the other end of the insertion hole 63. The portion of the first side surface 61A received in the groove portion 51 is opposite to the surface 51A of the groove portion 51 through a specific gap SA. The portion of the second side surface 61B received in the groove portion 51 is opposite to the surface 51B of the groove portion 51 through a specific gap SB. The relationship between the size of the gap SA in the thickness direction DT and the size of the gap SB can be arbitrarily selected according to the position and size of the limiting portion 80 described later. In the first example shown in FIG. 2 , the size of the gap SA in the thickness direction DT is equal to the size of the gap SB. In the second example, the size of the gap SA in the thickness direction DT is different from the size of the gap SB.
厚度方向DT上之間隙SA、SB之大小可任意設定。於較佳之例中,厚度方向DT上之間隙SA、SB之大小乃基於抑制劃線輪60於厚度方向DT上在保持器50之溝槽部51內傾斜的容易度、及異物堵塞間隙SA、SB之難度之關係而決定。異物之一例為藉由形成劃線而產生之脆性材料基板GB之碎屑等。厚度方向DT上之間隙SA、SB之大小之最大值之一例分別為10μm。於間隙SA、SB之大小為10μm以下之情形時,容易抑制劃線輪60於厚度方向DT上在保持器50之溝槽部51內傾斜。厚度方向DT上之間隙SA、SB之大小之最小值之一例分別為2μm。於間隙SA、SB之大小為2μm以上之情形時,異物不易堵塞間隙SA、SB。再者,劃線輪60與保持器50不易干擾。厚度方向DT上之間隙SA、SB之合計大小之可取範圍的一例為4μm~20μm。 The sizes of the gaps SA and SB in the thickness direction DT can be set arbitrarily. In a preferred example, the sizes of the gaps SA and SB in the thickness direction DT are determined based on the relationship between the ease of suppressing the tilting of the scribing wheel 60 in the groove portion 51 of the retainer 50 in the thickness direction DT and the difficulty of blocking the gaps SA and SB by foreign matter. An example of foreign matter is debris of the brittle material substrate GB generated by forming the scribing line. An example of the maximum values of the sizes of the gaps SA and SB in the thickness direction DT is 10 μm, respectively. When the sizes of the gaps SA and SB are less than 10 μm, it is easy to suppress the tilting of the scribing wheel 60 in the groove portion 51 of the retainer 50 in the thickness direction DT. An example of the minimum values of the sizes of the gaps SA and SB in the thickness direction DT is 2 μm, respectively. When the size of the gaps SA and SB is greater than 2μm, foreign matter is less likely to block the gaps SA and SB. Furthermore, the scribing wheel 60 and the retainer 50 are less likely to interfere with each other. An example of the desirable range of the total size of the gaps SA and SB in the thickness direction DT is 4μm~20μm.
在脆性材料基板GB形成劃線之步驟中,於將劃線輪60按壓於脆性材料基板GB之表面之狀態下,使保持器單元40沿特定之掃描方向掃描。作為掃描方法,可列舉使保持器單元40相對於脆性材料基板GB移動之方法、使脆性材料基板GB相對於保持器單元40移動之方法、及該等之組合 之方法。劃線脆性材料基板GB時,劃線輪60中,不僅包含沿與掃描方向相反方向發揮作用之成分之第1反作用力,包含銷軸方向成分之第2反作用力亦發揮作用。此係主要因脆性材料基板GB之表面性狀之不均一而產生。表面性狀之不均一係因例如於表面不均一分佈之多個微小之凹凸、及表面之彎曲等而產生。第2反作用力包含作用於銷軸方向之一方向即第1銷軸方向之反作用力、及作用於銷軸方向之另一方向即第2銷軸方向之反作用力。由於脆性材料基板GB之表面凹凸之形狀因每個部位而異,故作用於劃線輪60之第2反作用力之方向及強度隨著劃線輪60之行進而變化。因劃線輪60未相對於銷70固定,故隨著第2反作用力作用於劃線輪60,劃線輪60相對於銷70沿銷軸方向位移。以下之說明中,將劃線輪60相對於銷70向銷軸方向之移動稱為「輪軸方向位移」。 In the step of forming a score line on the brittle material substrate GB, the retainer unit 40 is scanned along a specific scanning direction while the scoring wheel 60 is pressed against the surface of the brittle material substrate GB. As a scanning method, there can be listed a method of moving the retainer unit 40 relative to the brittle material substrate GB, a method of moving the brittle material substrate GB relative to the retainer unit 40, and a method of combining these. When the brittle material substrate GB is scored, the scoring wheel 60 not only has a first reaction force including a component that acts in the direction opposite to the scanning direction, but also has a second reaction force including a component in the pin direction. This is mainly caused by the uneven surface properties of the brittle material substrate GB. The unevenness of the surface properties is caused by, for example, a plurality of tiny unevennesses distributed unevenly on the surface and the curvature of the surface. The second reaction force includes a reaction force acting in one direction of the pin axis, namely, the first pin axis direction, and a reaction force acting in the other direction of the pin axis, namely, the second pin axis direction. Since the shape of the surface unevenness of the brittle material substrate GB is different for each part, the direction and strength of the second reaction force acting on the scribing wheel 60 change as the scribing wheel 60 moves. Since the scribing wheel 60 is not fixed relative to the pin 70, as the second reaction force acts on the scribing wheel 60, the scribing wheel 60 is displaced relative to the pin 70 along the pin axis direction. In the following description, the movement of the scoring wheel 60 relative to the pin 70 in the direction of the pin axis is referred to as "axis direction displacement".
輪軸方向位移之方向及位移量主要依存於作用於第1銷軸方向之第2反作用力之強度與作用於第2銷軸方向之第2反作用力之強度的關係。因產生輪軸方向位移而形成非直線狀之劃線。藉由抑制該位移而不易形成非直線狀之劃線。保持器單元40具備抑制輪軸方向位移之位移抑制構造。位移抑制構造包含設置於銷70之限制部80、及設置於劃線輪60之被限制部90。 The direction and amount of the axle-direction displacement mainly depend on the relationship between the strength of the second reaction force acting in the first pin direction and the strength of the second reaction force acting in the second pin direction. A non-straight line is formed due to the axle-direction displacement. By suppressing the displacement, it is difficult to form a non-straight line. The retainer unit 40 has a displacement suppression structure for suppressing the axle-direction displacement. The displacement suppression structure includes a limiting portion 80 provided on the pin 70 and a restricted portion 90 provided on the scoring wheel 60.
限制部80之構成可任意選擇。於圖2所示之例中,限制部80包含形成於銷70之外周之凹部81。因此,限制部80之構成簡單。凹部81係為了可與被限制部90以2點接觸,而藉由例如於銷70之外周部實施研磨加工、放電加工、及雷射加工等形成之部分,且不包含製造銷70時所形成之微小之 凹凸。凹部81繞銷70之外周1圈。銷70之軸方向上之凹部81之位置可任意選擇。一例中,凹部81設置於銷70之軸方向之中央。凹部81為相對於銷70之外周面71向銷70之中心軸側凹陷之形狀。 The structure of the limiting portion 80 can be selected arbitrarily. In the example shown in FIG. 2 , the limiting portion 80 includes a recess 81 formed on the outer periphery of the pin 70. Therefore, the structure of the limiting portion 80 is simple. The recess 81 is formed by, for example, grinding, discharge processing, and laser processing on the outer periphery of the pin 70 in order to be able to contact the restricted portion 90 at two points, and does not include the tiny bumps and depressions formed when the pin 70 is manufactured. The recess 81 goes around the outer periphery of the pin 70 once. The position of the recess 81 in the axial direction of the pin 70 can be selected arbitrarily. In one example, the recess 81 is set at the center of the axial direction of the pin 70. The recess 81 is a shape that is recessed toward the center axis side of the pin 70 relative to the outer peripheral surface 71 of the pin 70.
銷70之直徑包含於0.35mm~1.5mm之範圍。凹部81之深度XA包含於1μm~100μm之範圍。凹部81之深度XA較佳包含於15μm~60μm之範圍。凹部81之深度XA以例如正交剖面上通過銷70之外周面71之直線LA與凹部81之底部81A之距離表示。 The diameter of the pin 70 is within the range of 0.35 mm to 1.5 mm. The depth XA of the recess 81 is within the range of 1 μm to 100 μm. The depth XA of the recess 81 is preferably within the range of 15 μm to 60 μm. The depth XA of the recess 81 is represented by the distance between a straight line LA passing through the outer peripheral surface 71 of the pin 70 on an orthogonal cross section and the bottom 81A of the recess 81.
銷軸方向之凹部81之寬度XB以正交剖面上通過外周面71之直線LA上之凹部81之一緣81B與另一緣81C之距離表示。凹部81之寬度XB較佳小於劃線輪60之厚度,且為50μm以上。 The width XB of the recess 81 in the pin axis direction is represented by the distance between one edge 81B and the other edge 81C of the recess 81 on the straight line LA passing through the outer peripheral surface 71 on the orthogonal section. The width XB of the recess 81 is preferably smaller than the thickness of the scribing wheel 60 and is greater than 50μm.
被限制部90包含與凹部81以2點接觸之凸部91。因此,被限制部90之構成簡單。凸部91之面91A為厚度方向DT上形成於第1側面61A與第2側面61B之間,且藉由特定之曲率半徑RB規定之曲面。因此,不易於凸部91產生應力集中。凹部81之寬度與凸部91之曲率半徑RB之關係可任意選擇。於第1例之情形時,因凹部81之緣81B、81C與凸部91之面91A以2點線接觸,故將劃線輪60穩定地支持於銷70且使劃線時之摩擦電阻變小。凸部之高度HA包含於0.1μm~20μm之範圍。凸部91之高度HA較佳包含於0.5μm~15μm之範圍。凸部91之高度HA以通過本體部61之側面61A、61B與面91A之邊界之直線LB與凸部91之頂點91B的距離表示。劃線輪60之插入孔63之凸部91處之最小內徑稍大於銷70之最大外徑。 The restricted portion 90 includes a convex portion 91 that contacts the concave portion 81 at two points. Therefore, the structure of the restricted portion 90 is simple. The surface 91A of the convex portion 91 is a curved surface formed between the first side surface 61A and the second side surface 61B in the thickness direction DT and is defined by a specific curvature radius RB. Therefore, it is not easy to generate stress concentration on the convex portion 91. The relationship between the width of the concave portion 81 and the curvature radius RB of the convex portion 91 can be arbitrarily selected. In the case of the first example, since the edges 81B and 81C of the concave portion 81 and the surface 91A of the convex portion 91 are in line contact at two points, the marking wheel 60 is stably supported on the pin 70 and the friction resistance during marking is reduced. The height HA of the convex portion is included in the range of 0.1μm~20μm. The height HA of the protrusion 91 is preferably within the range of 0.5 μm to 15 μm. The height HA of the protrusion 91 is represented by the distance between the straight line LB passing through the boundary between the side surfaces 61A, 61B of the main body 61 and the surface 91A and the vertex 91B of the protrusion 91. The minimum inner diameter of the protrusion 91 of the insertion hole 63 of the scribing wheel 60 is slightly larger than the maximum outer diameter of the pin 70.
對保持器單元40之作用及效果進行說明。將劃線輪60按壓於脆性材料基板GB,並未掃描之狀態下,正交剖面上,劃線輪60之被限制部90之頂點91B接觸於銷70之限制部80。實際上,被限制部90之固定範圍與限制部80線接觸。被限制部90自限制部80受到沿按壓方向發揮作用之反作用力。隨著劃線輪60之掃描,第2反作用力作用於劃線輪60之情形時,欲使被限制部90沿銷軸方向移動之第2反作用力由銷70之限制部80承受。因此,阻擋劃線輪60之輪軸方向位移,使劃線輪60沿掃描方向行進,於脆性材料基板GB形成直線狀之劃線。因此,可容易地形成沿保持器單元40之掃描方向之劃線。 The function and effect of the retainer unit 40 are explained. When the scribing wheel 60 is pressed against the brittle material substrate GB, and in a state where no scanning is performed, on the orthogonal section, the vertex 91B of the restricted portion 90 of the scribing wheel 60 contacts the restricting portion 80 of the pin 70. In fact, the fixed range of the restricted portion 90 is in line contact with the restricting portion 80. The restricted portion 90 receives a reaction force from the restricting portion 80 that acts in the pressing direction. When the second reaction force acts on the scribing wheel 60 as the scribing wheel 60 scans, the second reaction force that is intended to move the restricted portion 90 in the pin axis direction is borne by the restricting portion 80 of the pin 70. Therefore, the displacement of the scribing wheel 60 in the axle direction is blocked, so that the scribing wheel 60 moves along the scanning direction, and a straight scribing line is formed on the brittle material substrate GB. Therefore, a scribing line along the scanning direction of the retainer unit 40 can be easily formed.
(實驗) (Experiment)
使用本實施形態之保持器單元進行劃線,並進行關於劃線輪向軸方向之位移量之驗證。作為劃線輪,使用於外徑2.5mm、內徑0.82mm、厚度0.64mm之劃線輪,且形成有具有13μm之高度之曲面形狀之凸部。又,作為銷,使用於外徑0.80mm、長度5.99mm之銷,且形成有寬度285μm、底部深度50μm之凹部之銷。 The retainer unit of this embodiment was used to perform scribing and verify the displacement of the scribing wheel in the axial direction. As the scribing wheel, a scribing wheel with an outer diameter of 2.5 mm, an inner diameter of 0.82 mm, and a thickness of 0.64 mm was used, and a convex portion with a curved surface shape of 13 μm in height was formed. In addition, as the pin, a pin with an outer diameter of 0.80 mm and a length of 5.99 mm was used, and a pin with a concave portion with a width of 285 μm and a bottom depth of 50 μm was formed.
使用該保持器單元,於玻璃基板形成80mm長度之劃線。且,為去除剛開始劃線之影響,自距離劃線起點5mm之位置起,對20mm之長度之劃線,以0.2mm間隔測定朝橫向(垂直於劃線方向之方向)之劃線偏移量。認為該劃線之偏移量係主要因保持器內之輪軸方向位移所引起者。於圖3顯示該測定結果。又,作為比較例,使用除了未設置凸部之點以外, 與實施形態相同形狀之先前之劃線輪、及除了未設置凹部之點以外,與實施形態相同形狀之先前之銷的保持器單元,同樣地測定劃線之偏移量。於圖4顯示比較例之測定結果。 Using this retainer unit, a 80mm long line is formed on the glass substrate. In addition, in order to eliminate the influence of the initial line drawing, the offset of the line in the horizontal direction (perpendicular to the line drawing direction) is measured at intervals of 0.2mm for a line drawing of 20mm in length starting from a position 5mm away from the starting point of the line drawing. It is believed that the offset of the line drawing is mainly caused by the displacement of the wheel axis direction in the retainer. The measurement results are shown in Figure 3. In addition, as a comparative example, a retainer unit of a previous line drawing wheel with the same shape as the implementation form except for the point where the convex portion is not provided, and a previous pin with the same shape as the implementation form except for the point where the concave portion is not provided are used to measure the offset of the line drawing in the same manner. The measurement results of the comparative example are shown in Figure 4.
於實施形態之保持器單元中,確認劃線雖週期性左右蜿蜒,但劃線之偏移量最大為2μm左右。於實施形態之保持器單元中,因劃線輪穩定地受限制部與被限制部之間之2點支持,故抑制輪軸方向位移,藉此,可以說能抑制劃線之偏移量。因此,本實施形態之保持器單元可容易形成沿著保持器單元之掃描方向之劃線。 In the retainer unit of the embodiment, it is confirmed that the marking line periodically meanders left and right, but the maximum deviation of the marking line is about 2μm. In the retainer unit of the embodiment, since the marking wheel is stably supported by two points between the limiting part and the restricted part, the displacement in the wheel axis direction is suppressed, thereby suppressing the deviation of the marking line. Therefore, the retainer unit of this embodiment can easily form a marking line along the scanning direction of the retainer unit.
對此,於比較例之保持器單元中,劃線不規則地蜿蜒,且最大之偏移量為14μm左右。於比較例之保持器單元中,於劃線時劃線輪與銷之接觸位置不穩定,產生劃線輪之軸方向位移,或劃線輪於保持器內傾斜,由此認為劃線中會產生較大且不規則之偏移。 In contrast, in the retainer unit of the comparative example, the marking line meanders irregularly, and the maximum offset is about 14μm. In the retainer unit of the comparative example, the contact position between the marking wheel and the pin is unstable during marking, resulting in axial displacement of the marking wheel, or the marking wheel tilts in the retainer, which is considered to cause larger and irregular offsets in marking.
再者,於使用將凹部81之寬度設為408μm、其他構成與上述實施形態相同之保持器單元之情形時,亦發現與上述實施形態同樣之傾向。 Furthermore, when the width of the recess 81 is set to 408 μm and the retainer unit is otherwise configured the same as the above-mentioned embodiment, the same tendency as the above-mentioned embodiment is also found.
(變化例) (Example of variation)
上述實施形態係例示本發明相關之保持器單元以及其劃線輪及銷可採取之形態,並非意在限制其形態。本發明相關之保持器單元以及其劃線輪及銷可採取與實施形態所例示之形態不同之形態。其一例為置換、變更、或省略實施形態之構成之一部分之形態、或對實施形態附加新的構成 之形態。於以下顯示實施形態之變化例之一例。 The above-mentioned embodiments are examples of the forms that the retainer unit and the scoring wheel and pin related to the present invention can take, and are not intended to limit their forms. The retainer unit and the scoring wheel and pin related to the present invention can take forms different from the forms illustrated in the embodiments. One example is a form that replaces, changes, or omits a part of the structure of the embodiment, or adds a new structure to the embodiment. An example of a variation of the embodiment is shown below.
設置於銷70之限制部80之構成可任意變更。圖5係顯示具備變化例之限制部之銷之構成。圖5(a)係第1變化例之銷170之包含限制部180之部分之放大側視圖。於銷限制部180中,凹部181為具有側視下具有特定之曲率半徑之曲面的溝槽,且以繞銷170之外周一圈之方式設置。此處,較佳為凹部181之曲率半徑小於凸部91之曲率半徑RB。 The structure of the limiting portion 80 provided on the pin 70 can be arbitrarily changed. FIG. 5 shows the structure of the pin having the limiting portion of the variation. FIG. 5(a) is an enlarged side view of the portion of the pin 170 including the limiting portion 180 of the first variation. In the pin limiting portion 180, the recess 181 is a groove having a curved surface with a specific radius of curvature in a side view, and is provided in a circle around the outer circumference of the pin 170. Here, it is preferred that the radius of curvature of the recess 181 is smaller than the radius of curvature RB of the convex portion 91.
圖5(b)係第2變化例之銷270之包含限制部280之部分之放大側視圖。於限制部280中,凹部281為側視下具有特定之深度之矩形狀之溝槽,且以繞銷270之外周一圈之方式設置。又,圖5(c)係第3變化例之銷370之包含限制部380之部分之放大側視圖。於限制部380中,凹部381為側視下具備朝向最深部之傾斜面之V字形狀之溝槽,且以繞銷370之外周一圈之方式設置。 FIG5(b) is an enlarged side view of the portion of the pin 270 of the second variation including the limiting portion 280. In the limiting portion 280, the recess 281 is a rectangular groove having a specific depth in a side view, and is arranged around the outer circumference of the pin 270. FIG5(c) is an enlarged side view of the portion of the pin 370 of the third variation including the limiting portion 380. In the limiting portion 380, the recess 381 is a V-shaped groove having an inclined surface toward the deepest part in a side view, and is arranged around the outer circumference of the pin 370.
若限制部之形狀為具備不與劃線輪之被限制部之頂點接觸之特定深度者,則不限於該等變化例。例如,亦可以特定之間隔繞銷70之外周一圈之方式設置具有與實施形態之凹部之深度同等高度之2個凸部。 If the shape of the limiting portion is a specific depth that does not contact the vertex of the restricted portion of the scoring wheel, it is not limited to these variations. For example, two convex portions having the same height as the depth of the concave portion of the embodiment can be provided in a specific spacing around the outer circumference of the pin 70.
劃線輪60之被限制部90之構成可任意變更。於一例中,保持器單元40之被限制部90亦可為包含劃線輪60之插入孔63之內表面所形成之微小之凹凸者。於此情形時,被限制部90較佳為設置於插入孔63之特定高度之凸部,且其表面之最大高度Rz為0.5μm~2.0μm。藉此,於被限制部 之凸部高度相對較小之情形時,與限制部之緣81B及另一緣81C之2點接觸時,亦可更確實地抑制輪軸方向位移。又,被限制部90之形狀並非限定於上述實施形態所揭示之構成者,亦可設為例如於一部分具有平坦部之形狀。 The structure of the restricted portion 90 of the scribing wheel 60 can be changed arbitrarily. In one example, the restricted portion 90 of the retainer unit 40 can also be a small concave-convex portion formed by the inner surface of the insertion hole 63 of the scribing wheel 60. In this case, the restricted portion 90 is preferably a convex portion provided at a specific height of the insertion hole 63, and the maximum height Rz of its surface is 0.5μm~2.0μm. Thereby, when the height of the convex portion of the restricted portion is relatively small, when it contacts the edge 81B and the other edge 81C of the restricting portion at two points, the displacement in the axle direction can be more reliably suppressed. In addition, the shape of the restricted portion 90 is not limited to the structure disclosed in the above-mentioned embodiment, and can also be set to a shape having a flat portion in a part, for example.
40:保持器單元 40: Retainer unit
50:保持器 50: Retainer
51:溝槽部 51: Groove
51A:面 51A: Noodles
51B:面 51B: Noodles
52:支持孔 52: Support hole
60:劃線輪 60: Scoring wheel
61:本體部 61: Main body
61A:第1側面 61A: 1st side
61B:第2側面 61B: 2nd side
62:刀尖部 62: Blade tip
63:插入孔 63: Insertion hole
70:銷 70: Sales
70A:端部 70A: End
71:外周面 71: Outer surface
80:限制部 80: Restriction Department
81:凹部 81: Concave part
81A:底部 81A: Bottom
81B:緣 81B: Fate
81C:緣 81C: Fate
90:被限制部 90: Restricted Department
91:凸部 91: convex part
91A:面 91A: Noodles
91B:頂點 91B: Top point
DT:厚度方向 DT: thickness direction
GB:脆性材料基板 GB: brittle material substrate
HA:高度 HA:Height
LA:直線 LA: Straight Line
LB:直線 LB: Straight line
SA:間隙 SA: gap
SB:間隙 SB: Gap
XA:深度 XA: Depth
XB:寬度 XB: Width
Claims (5)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019100896 | 2019-05-30 | ||
| JP2019-100896 | 2019-05-30 | ||
| JP2020-057727 | 2020-03-27 | ||
| JP2020057727A JP7474475B2 (en) | 2019-05-30 | 2020-03-27 | Holder Unit and Pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202043164A TW202043164A (en) | 2020-12-01 |
| TWI869390B true TWI869390B (en) | 2025-01-11 |
Family
ID=73647610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109111633A TWI869390B (en) | 2019-05-30 | 2020-04-07 | Retainer unit and pin |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7474475B2 (en) |
| KR (1) | KR102816547B1 (en) |
| TW (1) | TWI869390B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007296832A (en) * | 2006-04-28 | 2007-11-15 | Hidekazu Obayashi | Tip holder of cutter wheel for brittle materials |
| CN100430327C (en) * | 2001-04-02 | 2008-11-05 | 三星钻石工业股份有限公司 | Cutter roller, scoring device using the same, scoring method, and method of breaking bonded substrates, and method and device for manufacturing the cutter roller |
| CN204076540U (en) * | 2013-04-01 | 2015-01-07 | 应用材料公司 | A kind of pulley used in wire sawing apparatus and the wire sawing apparatus with this pulley |
| TWI499571B (en) * | 2012-05-17 | 2015-09-11 | Mitsuboshi Diamond Ind Co Ltd | Scribing process system |
| TWI625211B (en) * | 2015-08-31 | 2018-06-01 | Mitsuboshi Diamond Industrial Co., Ltd. | Method for forming inclined cracks in brittle material substrate and method for breaking brittle material substrate |
| TWI636025B (en) * | 2016-06-15 | 2018-09-21 | 三星鑽石工業股份有限公司 | Marking device and holder unit |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3370314B2 (en) * | 2000-08-04 | 2003-01-27 | 三星ダイヤモンド工業株式会社 | Cutter wheel for brittle substrates |
| JP2003137575A (en) * | 2001-10-25 | 2003-05-14 | Toyo Sangyo Kk | Supporting device for glass cutter wheel and glass cutter |
| JP2003171133A (en) * | 2001-12-04 | 2003-06-17 | Toyo Sangyo Kk | Apparatus for supporting cutter wheel |
| KR20060017058A (en) * | 2004-08-19 | 2006-02-23 | 엠.제이.테크(주) | Scribing wheel cutter |
| KR20090058806A (en) * | 2007-12-05 | 2009-06-10 | 주식회사 탑 엔지니어링 | Scribe device |
| JP5332344B2 (en) * | 2008-06-30 | 2013-11-06 | 三星ダイヤモンド工業株式会社 | Chip holder and holder unit |
| JP5195982B2 (en) | 2010-10-18 | 2013-05-15 | 三星ダイヤモンド工業株式会社 | Scribe head and scribing device |
| TW201412665A (en) * | 2012-09-26 | 2014-04-01 | 三星鑽石工業股份有限公司 | Cutter wheel holder unit |
| JP6013210B2 (en) * | 2013-01-29 | 2016-10-25 | 三星ダイヤモンド工業株式会社 | Scribing wheel pin, holder unit and scribing device |
| JP2015000497A (en) * | 2013-06-14 | 2015-01-05 | 三星ダイヤモンド工業株式会社 | Tip holder unit, tip holder, pin, wheel tip, and substrate processing device |
-
2020
- 2020-03-27 JP JP2020057727A patent/JP7474475B2/en active Active
- 2020-04-07 TW TW109111633A patent/TWI869390B/en active
- 2020-05-07 KR KR1020200054542A patent/KR102816547B1/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100430327C (en) * | 2001-04-02 | 2008-11-05 | 三星钻石工业股份有限公司 | Cutter roller, scoring device using the same, scoring method, and method of breaking bonded substrates, and method and device for manufacturing the cutter roller |
| JP2007296832A (en) * | 2006-04-28 | 2007-11-15 | Hidekazu Obayashi | Tip holder of cutter wheel for brittle materials |
| TWI499571B (en) * | 2012-05-17 | 2015-09-11 | Mitsuboshi Diamond Ind Co Ltd | Scribing process system |
| CN204076540U (en) * | 2013-04-01 | 2015-01-07 | 应用材料公司 | A kind of pulley used in wire sawing apparatus and the wire sawing apparatus with this pulley |
| TWI625211B (en) * | 2015-08-31 | 2018-06-01 | Mitsuboshi Diamond Industrial Co., Ltd. | Method for forming inclined cracks in brittle material substrate and method for breaking brittle material substrate |
| TWI636025B (en) * | 2016-06-15 | 2018-09-21 | 三星鑽石工業股份有限公司 | Marking device and holder unit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200137987A (en) | 2020-12-09 |
| JP7474475B2 (en) | 2024-04-25 |
| JP2020196254A (en) | 2020-12-10 |
| KR102816547B1 (en) | 2025-06-04 |
| TW202043164A (en) | 2020-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7975589B2 (en) | Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the same | |
| KR101173875B1 (en) | Fin for holding scribing wheel | |
| TWI530466B (en) | Scribing apparatus for glass panel and scribing method thereof | |
| CN101657388A (en) | Scribing device and method | |
| CN109849196B (en) | Scribing wheel, cutter point support and supporting pin | |
| KR102902023B1 (en) | Holder unit and pin | |
| KR101895778B1 (en) | Holder joint | |
| TWI869390B (en) | Retainer unit and pin | |
| TW201604159A (en) | Glass Cutting Tool | |
| TWI796448B (en) | Retainer unit with marking wheels and pins | |
| TWI504576B (en) | A holder, a holder unit and a scribing device | |
| ES2882595T3 (en) | Transport system for annealing glass containers | |
| CN112008890B (en) | Cage unit and pin | |
| TW201811525A (en) | Scribe device and holder unit | |
| JP2017119347A (en) | Holder joint | |
| JP6936485B2 (en) | Scrivener and holder unit | |
| TWI705046B (en) | Method for manufacturing plate glass | |
| JP2020037194A (en) | Holder unit and scribe device | |
| JP2008100389A (en) | Diamond scriber |