TWI869159B - Heat dissipation composition - Google Patents
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本發明係關於一種組合物，尤其是一種散熱組合物。The present invention relates to a composition, in particular to a heat dissipation composition.
變壓器、功率放大器或電晶體等高功率的電子元件在運轉時會產生熱能，若未能將熱能及時排出，過高的溫度會影響電子元件的運轉及壽命，散熱遂成為研發電子元件時最重要的課題之一。實務上電子元件最常用的散熱方式為散熱片，散熱片係由具有良好熱傳導率的材料所製成，能夠快速地將電子元件產生的熱能轉移至周圍環境，使電子元件在穩定的溫度下運轉，降低電子元件故障的風險。High-power electronic components such as transformers, power amplifiers or transistors generate heat during operation. If the heat is not discharged in time, the excessive temperature will affect the operation and life of the electronic components. Heat dissipation has become one of the most important issues in the development of electronic components. In practice, the most commonly used heat dissipation method for electronic components is heat sinks. Heat sinks are made of materials with good thermal conductivity and can quickly transfer the heat generated by electronic components to the surrounding environment, allowing electronic components to operate at a stable temperature and reduce the risk of electronic component failure.
然而，隨著科技快速發展，電子元件的運算速度大幅提高，產生的熱能也隨之增加，習知散熱片已不足以將多餘的熱能及時地散發至周遭環境，導致電子元件運轉的穩定度及可靠度降低。However, with the rapid development of technology, the computing speed of electronic components has been greatly improved, and the heat energy generated has also increased. Conventional heat sinks are no longer sufficient to dissipate the excess heat energy to the surrounding environment in a timely manner, resulting in reduced stability and reliability of electronic components.
有鑑於此，仍需要提供一種用以形成散熱片的散熱組合物，以解決上述問題。In view of this, there is still a need to provide a heat dissipation composition for forming a heat sink to solve the above problems.
為解決上述問題，本發明的目的是提供一種散熱組合物，係可以形成具有較佳熱傳導率的散熱片者。To solve the above problems, the object of the present invention is to provide a heat dissipation composition that can form a heat sink with better thermal conductivity.
本發明全文所記載的元件及構件使用「一」或「一個」之量詞，僅是為了方便使用且提供本發明範圍的通常意義；於本發明中應被解讀為包括一個或至少一個，且單一的概念也包括複數的情況，除非其明顯意指其他意思。The quantifiers "a" or "an" used in the elements and components described throughout the present invention are only for convenience of use and to provide a general meaning of the scope of the present invention; they should be interpreted in the present invention as including one or at least one, and the single concept also includes the plural case unless it is obvious that it means otherwise.
本發明的散熱組合物，用以燒結形成一散熱片，包含：以重量百分比計為30～55%的鋁顆粒、40～65%的碳化矽顆粒及1～6%的玻璃顆粒；其中，該碳化矽顆粒包含以重量百分比計為50～60%的第一碳化矽顆粒及40～50%的第二碳化矽顆粒，且該第一碳化矽顆粒的粒徑大於該第二碳化矽顆粒的粒徑。The heat dissipation composition of the present invention is used for sintering to form a heat sink, comprising: 30-55% by weight of aluminum particles, 40-65% by weight of silicon carbide particles and 1-6% by weight of glass particles; wherein the silicon carbide particles comprise 50-60% by weight of first silicon carbide particles and 40-50% by weight of second silicon carbide particles, and the particle size of the first silicon carbide particles is larger than that of the second silicon carbide particles.
據此，本發明的散熱組合物中，藉由該鋁顆粒、該碳化矽顆粒及該玻璃顆粒的組成配比，以及該碳化矽顆粒中不同粒徑大小的第一碳化矽顆粒與第二碳化矽顆粒的混合比例，使該散熱組合物經過燒結而形成該散熱片時，可以具有良好的熱傳導率，因此可以提升該散熱片的散熱效果；再且，經試驗證實，由該散熱組合物所形成的散熱片的熱傳導率顯著優於市售的散熱片，可以進一步達成擴大該散熱片的應用範圍的功效。Accordingly, in the heat dissipation composition of the present invention, by means of the composition ratio of the aluminum particles, the silicon carbide particles and the glass particles, and the mixing ratio of the first silicon carbide particles and the second silicon carbide particles of different particle sizes in the silicon carbide particles, the heat dissipation composition can have good thermal conductivity when it is sintered to form the heat sink, thereby improving the heat dissipation effect of the heat sink; furthermore, it has been verified through experiments that the thermal conductivity of the heat sink formed by the heat dissipation composition is significantly better than that of the heat sink available on the market, thereby further achieving the effect of expanding the application range of the heat sink.
其中，該鋁顆粒的粒徑可以介於1～10 μm之間。如此，可以增加該鋁顆粒的總表面積，並減少該散熱組合物的熱阻，係具有提升該散熱組合物的熱傳導率的功效。The particle size of the aluminum particles may be between 1 and 10 μm. In this way, the total surface area of the aluminum particles can be increased, and the thermal resistance of the heat dissipation composition can be reduced, which has the effect of improving the thermal conductivity of the heat dissipation composition.
其中，該第一碳化矽顆粒的粒徑可以介於20～40 μm之間，該第二碳化矽顆粒的粒徑介於1～10 μm之間。如此，該碳化矽顆粒可以分散在由該鋁顆粒形成的骨架中，增加該鋁顆粒與該碳化矽顆粒的接觸表面積，係具有提升該散熱組合物的熱傳導效果的功效。The particle size of the first silicon carbide particles may be between 20 and 40 μm, and the particle size of the second silicon carbide particles may be between 1 and 10 μm. In this way, the silicon carbide particles may be dispersed in the skeleton formed by the aluminum particles, increasing the contact surface area between the aluminum particles and the silicon carbide particles, thereby enhancing the heat conduction effect of the heat dissipation composition.
其中，該玻璃顆粒的粒徑可以介於1～10 μm之間。如此，該玻璃顆粒可以降低該鋁顆粒及該碳化矽顆粒的表面張力，使該鋁顆粒及該碳化矽顆粒可以容易地燒結在一起，係具有降低該散熱組合物之孔隙率的功效。The particle size of the glass particles may be between 1 and 10 μm. Thus, the glass particles can reduce the surface tension of the aluminum particles and the silicon carbide particles, so that the aluminum particles and the silicon carbide particles can be easily sintered together, which has the effect of reducing the porosity of the heat dissipation composition.
其中，該玻璃顆粒係可以選自由二氧化矽顆粒、三氧化二硼顆粒、三氧化二鉍顆粒、氧化鋅顆粒及二氧化鈦顆粒所組成之群組。如此，該二氧化矽顆粒可以提升該鋁顆粒及該碳化矽顆粒之間的介面潤濕性，該三氧化二硼顆粒與該三氧化二鉍顆粒可以降低該碳化矽顆粒與該鋁顆粒的表面張力，係具有提升該散熱組合物的混合效果、降低該散熱組合物的孔隙率的功效。The glass particles can be selected from the group consisting of silicon dioxide particles, boron trioxide particles, bismuth trioxide particles, zinc oxide particles and titanium dioxide particles. Thus, the silicon dioxide particles can improve the interface wettability between the aluminum particles and the silicon carbide particles, and the boron trioxide particles and the bismuth trioxide particles can reduce the surface tension between the silicon carbide particles and the aluminum particles, thereby improving the mixing effect of the heat dissipation composition and reducing the porosity of the heat dissipation composition.
為讓本發明之上述及其他目的、特徵及優點能更明顯易懂，下文特舉本發明之較佳實施例，並配合所附圖式作詳細說明。In order to make the above and other purposes, features and advantages of the present invention more clearly understood, the following specifically describes the preferred embodiments of the present invention in detail with reference to the accompanying drawings.
本發明所述之「散熱片」係指能夠用於電子元件或各種機械設備中，並將元件或設備產生的熱能轉移至周圍環境的散熱裝置或零件，該散熱片可以依據使用環境而成形為不同形狀或構造，此為本發明所屬技術領域中具有通常知識者可以理解，於此不加以限制。The "heat sink" mentioned in the present invention refers to a heat sink or part that can be used in electronic components or various mechanical equipment to transfer the heat energy generated by the components or equipment to the surrounding environment. The heat sink can be formed into different shapes or structures according to the use environment. This is understandable to those with ordinary knowledge in the technical field to which the present invention belongs and is not limited here.
本發明之一實施例的散熱組合物可以包含鋁（Aluminum，Al）顆粒、碳化矽（Silicon carbide，SiC）顆粒及玻璃顆粒。舉例而言，該散熱組合物可以包含以重量百分比計為30～55%的鋁顆粒、40～65%的碳化矽顆粒及1～6%的玻璃顆粒；較佳地，該散熱組合物可以包含以重量百分比計為35～43%的鋁顆粒、55～63%的碳化矽顆粒及1～5%的玻璃顆粒。其中，該鋁顆粒的粒徑係可以介於1～10 μm之間，如此，該鋁顆粒可以具有較大的總表面積，可以降低該散熱組合物的熱阻，具有提升該散熱組合物的熱傳導性的作用。該玻璃顆粒的粒徑則可以介於1～10 μm之間，如此，該玻璃顆粒可以降低該鋁顆粒及該碳化矽顆粒的表面張力，使該鋁顆粒及該碳化矽顆粒可以容易地燒結在一起，降低該散熱組合物的孔隙率，進而提升該散熱組合物所形成的散熱片的熱傳導率。The heat dissipation composition of one embodiment of the present invention may include aluminum (Aluminum, Al) particles, silicon carbide (Silicon carbide, SiC) particles and glass particles. For example, the heat dissipation composition may include 30-55% aluminum particles, 40-65% silicon carbide particles and 1-6% glass particles by weight; preferably, the heat dissipation composition may include 35-43% aluminum particles, 55-63% silicon carbide particles and 1-5% glass particles by weight. The particle size of the aluminum particles may be between 1 and 10 μm, so that the aluminum particles may have a larger total surface area, which may reduce the thermal resistance of the heat sink composition and improve the thermal conductivity of the heat sink composition. The particle size of the glass particles may be between 1 and 10 μm, so that the glass particles may reduce the surface tension of the aluminum particles and the silicon carbide particles, so that the aluminum particles and the silicon carbide particles may be easily sintered together, reduce the porosity of the heat sink composition, and thus improve the thermal conductivity of the heat sink formed by the heat sink composition.
該碳化矽顆粒可以包含以重量百分比計為50～60%的第一碳化矽顆粒及40～50%的第二碳化矽顆粒，且該第一碳化矽顆粒的粒徑大於該第二碳化矽顆粒的粒徑。較佳地，該第一碳化矽顆粒的粒徑係可以介於20～40 μm之間，該第二碳化矽顆粒的粒徑係可以介於1～10 μm之間。如此，該碳化矽顆粒可以形成不規則形狀，並分散在由該鋁顆粒所形成的骨架中，可以增加該鋁顆粒與該碳化矽顆粒的接觸表面積，進而提高提升該散熱組合物的熱傳導效果。The silicon carbide particles may include 50-60% by weight of first silicon carbide particles and 40-50% by weight of second silicon carbide particles, and the particle size of the first silicon carbide particles is larger than that of the second silicon carbide particles. Preferably, the particle size of the first silicon carbide particles may be between 20 and 40 μm, and the particle size of the second silicon carbide particles may be between 1 and 10 μm. In this way, the silicon carbide particles may form irregular shapes and be dispersed in the skeleton formed by the aluminum particles, which may increase the contact surface area between the aluminum particles and the silicon carbide particles, thereby improving the thermal conductivity of the heat dissipation composition.
該玻璃顆粒係可以選自由二氧化矽（silicon dioxide (SiO 2)）顆粒、三氧化二硼（boron trioxide (B 2O 3)）顆粒、三氧化二鉍（bismuth trioxide (Bi 2O 3)）顆粒、氧化鋅（zinc oxide (ZnO)）顆粒及二氧化鈦（titanium dioxide (TiO 2)）顆粒所組成之群組，於本實施例中，該玻璃顆粒包含以重量百分比計為20～35%的二氧化矽顆粒、20～35%的三氧化二硼顆粒、20～35%的三氧化二鉍顆粒、10～20%的氧化鋅顆粒及10～20%的二氧化鈦顆粒。 The glass particles can be selected from the group consisting of silicon dioxide (SiO 2 ) particles, boron trioxide (B 2 O 3 ) particles, bismuth trioxide (Bi 2 O 3 ) particles, zinc oxide (ZnO) particles, and titanium dioxide (TiO 2 ) particles. In this embodiment, the glass particles contain 20-35% of silicon dioxide particles, 20-35% of boron trioxide particles, 20-35% of bismuth trioxide particles, 10-20% of zinc oxide particles, and 10-20% of titanium dioxide particles in weight percentage.
詳言之，該二氧化矽顆粒可以提升該鋁顆粒及該碳化矽顆粒的介面潤濕性，具有進一步增加該鋁顆粒及該碳化矽顆粒的混合效果的作用；該三氧化二硼顆粒及該三氧化二鉍顆粒具有較低的熔點（三氧化二硼：450℃；三氧化二鉍：817℃），因而可以降低該碳化矽顆粒與該鋁顆粒的表面張力，使該碳化矽顆粒與該鋁顆粒可以容易地燒結在一起，進而降低該散熱組合物的孔隙率。In detail, the silicon dioxide particles can improve the interface wettability of the aluminum particles and the silicon carbide particles, and have the effect of further increasing the mixing effect of the aluminum particles and the silicon carbide particles; the boron trioxide particles and the bismuth trioxide particles have a relatively low melting point (boron trioxide: 450°C; bismuth trioxide: 817°C), and thus can reduce the surface tension of the silicon carbide particles and the aluminum particles, so that the silicon carbide particles and the aluminum particles can be easily sintered together, thereby reducing the porosity of the heat dissipation composition.
該散熱組合物可以經由燒結而形成該散熱片；惟前述燒結法僅為舉例而已，本發明所屬技術領域中具有通常知識者可以自行選用各種習知成形方法（例如，壓製法或擠壓法）來成形該散熱片，於此不加以限制。於本實施例中，係將該鋁顆粒、該碳化矽顆粒及該玻璃顆粒分別熔融形成膏狀物，混合該等膏狀物後，於700℃之溫度下進行燒結而形成該散熱片。The heat sink can be formed by sintering the heat sink; however, the above sintering method is only an example, and a person skilled in the art can select various known forming methods (e.g., pressing or extrusion) to form the heat sink, without limitation. In this embodiment, the aluminum particles, the silicon carbide particles, and the glass particles are melted to form pastes, and the pastes are mixed and then sintered at 700°C to form the heat sink.
為證實本發明之散熱組合物所形成的散熱片確實具有良好的熱傳導率，遂進行以下試驗：In order to verify that the heat sink formed by the heat dissipation composition of the present invention does have good thermal conductivity, the following tests were conducted:
（A）本發明之散熱組合物與市售散熱片熱傳導率的比較(A) Comparison of thermal conductivity between the heat sink composition of the present invention and commercially available heat sinks
本試驗係將包含以重量百分比計為48.4%的鋁顆粒、47.5%的碳化矽顆粒及4.1%的玻璃顆粒的散熱組合物形成散熱片，其中，該碳化矽顆粒包含以重量百分比計為60%的第一碳化矽顆粒及40%的第二碳化矽顆粒，並比較市售之散熱片與該散熱片的熱傳導率，市售之散熱片（A1）與由本發明之散熱組合物（A2）中各成分的的配比係如第1表所示。In this test, a heat sink is formed from a heat sink comprising 48.4% by weight of aluminum particles, 47.5% by weight of silicon carbide particles, and 4.1% by weight of glass particles, wherein the silicon carbide particles comprise 60% by weight of first silicon carbide particles and 40% by weight of second silicon carbide particles, and the thermal conductivity of the heat sink is compared with that of the heat sink. The proportions of the components in the heat sink (A1) and the heat sink composition (A2) of the present invention are shown in Table 1.
第1表：本試驗各組散熱組合物之組成配比
請參照第1圖及第2圖所示，其分別為市售之散熱片及本發明的散熱組合物形成的散熱片的金相圖，將第1圖分割成9個面積相等的區域，經換算可以得知各區域中鋁顆粒與碳化矽顆粒的比例分別為：32.2：61.6（左上）、30.1：66.4（中上）、42.7：55.7（右上）、31.3：65.4（左中）、41.1：58.2（正中）、37.9：55.9（右中）、28.4：67.8（左下）、29.1：66.6（中下）、24.8：64.8（右下）。第2圖各區域中鋁顆粒與碳化矽顆粒的比例分別為：49.6：46.4（左上）、53.1：42.3（中上）、45.1：51.2（右上）、47.3：48.6（左中）、52.1：43.1（正中）、52.5：44.8（右中）、43.7：52.1（左下）、46.6：48.2（中下）、45.8：50.6（右下）。Please refer to FIG. 1 and FIG. 2, which are metallographic phase diagrams of a commercially available heat sink and a heat sink formed by the heat dissipation composition of the present invention, respectively. FIG. 1 is divided into 9 regions of equal area. After conversion, it can be known that the ratio of aluminum particles to silicon carbide particles in each region is: 32.2:61.6 (upper left), 30.1:66.4 (upper middle), 42.7:55.7 (upper right), 31.3:65.4 (middle left), 41.1:58.2 (middle), 37.9:55.9 (middle right), 28.4:67.8 (lower left), 29.1:66.6 (lower middle), 24.8:64.8 (lower right). The ratios of aluminum particles to silicon carbide particles in each area of Figure 2 are: 49.6:46.4 (upper left), 53.1:42.3 (upper middle), 45.1:51.2 (upper right), 47.3:48.6 (middle left), 52.1:43.1 (middle), 52.5:44.8 (middle right), 43.7:52.1 (lower left), 46.6:48.2 (lower middle), and 45.8:50.6 (lower right).
詳言之，於第1圖中，市售之散熱片可觀察到較大的孔隙，且其孔隙率為4.4%，而本發明的散熱組合物形成的散熱片的孔隙率僅為4.1%，且本發明的散熱組合物形成的散熱片具有200 W/m‧K的熱傳導率，而市售之散熱片的熱傳導率僅150 W/m‧K，顯示本發明的散熱組合物確實能夠提升所形成的散熱片的熱傳導率。Specifically, in FIG. 1 , relatively large pores can be observed in the commercially available heat sink, and its porosity is 4.4%, while the porosity of the heat sink formed by the heat sink composition of the present invention is only 4.1%. Furthermore, the heat sink formed by the heat sink composition of the present invention has a thermal conductivity of 200 W/m‧K, while the thermal conductivity of the commercially available heat sink is only 150 W/m‧K, indicating that the heat sink composition of the present invention can indeed improve the thermal conductivity of the formed heat sink.
（B）玻璃顆粒含量對熱傳導率的影響(B) Effect of glass particle content on thermal conductivity
本試驗係將包含以重量百分比計為49.0%的鋁及51.0%的碳化矽的該散熱組合物形成一散熱片，其中，該碳化矽顆粒包含以重量百分比計為60%的第一碳化矽顆粒及40%的第二碳化矽顆粒，並比較該散熱片與前述試驗（A）中A2組之散熱片的熱傳導率，各組之散熱組合物中各成分的配比係如第2表所示。In this test, the heat sink composition including 49.0% aluminum and 51.0% silicon carbide by weight is formed into a heat sink, wherein the silicon carbide particles include 60% first silicon carbide particles and 40% second silicon carbide particles by weight, and the thermal conductivity of the heat sink is compared with the heat sink of group A2 in the above test (A). The proportions of the components in each group of the heat sink composition are shown in Table 2.
第2表：本試驗各組散熱組合物之組成配比
請參照第2圖及第3圖所示，其分別為A2及A3組之散熱組合物形成的散熱片的金相圖，第3圖各區域中鋁顆粒與碳化矽顆粒的比例分別為：53.1：40.4（左上）、50.7：42.9（中上）、49.1：41.6（右上）、44.4：36.9（左中）、46.4：38.3（正中）、53.2：36.7（右中）、41.2：37.4（左下）、52.9： 36.6（中下）、49.4： 37.5（右下）。Please refer to Figures 2 and 3, which are metallographic images of heat sinks formed by heat sink compositions of Groups A2 and A3, respectively. The ratios of aluminum particles to silicon carbide particles in each region of Figure 3 are: 53.1:40.4 (upper left), 50.7:42.9 (upper middle), 49.1:41.6 (upper right), 44.4:36.9 (middle left), 46.4:38.3 (middle), 53.2:36.7 (middle right), 41.2:37.4 (lower left), 52.9:36.6 (lower middle), 49.4:37.5 (lower right).
詳言之，與A2組相比，未加入該玻璃顆粒的A3組所形成的散熱片的孔隙率大幅上升至15.6%，且其熱傳導率僅為72 W/m‧K，顯示該玻璃顆粒確實可以填補該鋁顆粒與該碳化矽顆粒之間的孔隙，進而降低所形成的散熱片的孔隙率，從而進一步提升該散熱片的熱傳導率。Specifically, compared with the A2 group, the porosity of the heat sink formed by the A3 group without the glass particles increased significantly to 15.6%, and its thermal conductivity was only 72 W/m‧K, indicating that the glass particles can indeed fill the pores between the aluminum particles and the silicon carbide particles, thereby reducing the porosity of the heat sink formed, thereby further improving the thermal conductivity of the heat sink.
（C）第一碳化矽顆粒及第二碳化矽顆粒的比例對熱傳導率的影響(C) Effect of the ratio of first silicon carbide particles to second silicon carbide particles on thermal conductivity
本試驗係取前述試驗（A）中A2組之散熱組合物，分別將該碳化矽顆粒中的該第一碳化矽顆粒佔比調整為100%（A4組）、0%（A5組）及75%（A6組），鋁顆粒及玻璃顆粒之佔比不變，並比較各組所形成之散熱片的熱傳導率，各組之散熱組合物中各成分的配比係如第3表所示。This test takes the heat dissipation composition of group A2 in the above test (A), and adjusts the proportion of the first silicon carbide particles in the silicon carbide particles to 100% (group A4), 0% (group A5) and 75% (group A6), respectively, while the proportion of aluminum particles and glass particles remains unchanged, and compares the thermal conductivity of the heat sinks formed by each group. The proportion of each component in the heat dissipation composition of each group is shown in Table 3.
第3表：本試驗各組散熱組合物之組成配比
以僅包含第一碳化矽顆粒的散熱組合物所製成的散熱片（A4組）、以僅包含第二碳化矽顆粒的散熱組合物所製成的散熱片（A5組），及以包含以重量百分比計為75%的第一碳化矽顆粒及25%的第二碳化矽顆粒的散熱組合物所製成的散熱片（A6組），其熱傳導率分別為120 W/m‧K 、150 W/m‧K 及150 W/m‧K，顯示本發明的散熱組合物確實可以藉由以特定比例混合不同粒徑大小的第一碳化矽顆粒與第二碳化矽顆粒，大幅提升該散熱組合物形成的散熱片的熱傳導率。The heat sink made of the heat sink composition containing only the first silicon carbide particles (group A4), the heat sink made of the heat sink composition containing only the second silicon carbide particles (group A5), and the heat sink made of the heat sink composition containing 75% by weight of the first silicon carbide particles and 25% by weight of the second silicon carbide particles (group A6) have thermal conductivities of 120 W/m‧K, 150 W/m‧K, and 150 W/m‧K, respectively, indicating that the heat sink composition of the present invention can indeed significantly improve the thermal conductivity of the heat sink formed by the heat sink composition by mixing the first silicon carbide particles and the second silicon carbide particles of different particle sizes in a specific ratio.
綜上所述，本發明的散熱組合物中，藉由該鋁顆粒、該碳化矽顆粒及該玻璃顆粒的組成配比，以及該碳化矽顆粒中不同粒徑大小的第一碳化矽顆粒與第二碳化矽顆粒的混合比例，使該散熱組合物經過燒結而形成一散熱片時，可以具有良好的熱傳導率，因此可以提升該散熱片的散熱效果；再且，經試驗證實，由該散熱組合物所形成的散熱片的熱傳導率顯著優於市售的散熱片，可以進一步達成擴大該散熱片的應用範圍的功效。In summary, in the heat dissipation composition of the present invention, by means of the composition ratio of the aluminum particles, the silicon carbide particles and the glass particles, and the mixing ratio of the first silicon carbide particles and the second silicon carbide particles of different particle sizes in the silicon carbide particles, the heat dissipation composition can have good thermal conductivity when it is sintered to form a heat sink, thereby improving the heat dissipation effect of the heat sink; furthermore, it is confirmed by experiments that the thermal conductivity of the heat sink formed by the heat dissipation composition is significantly better than that of the heat sink available on the market, which can further achieve the effect of expanding the application range of the heat sink.
雖然本發明已利用上述較佳實施例揭示，然其並非用以限定本發明，任何熟習此技藝者在不脫離本發明之精神和範圍之內，相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇，因此本發明之保護範圍當包含後附之申請專利範圍所記載的文義及均等範圍內之所有變更。Although the present invention has been disclosed using the above-mentioned preferred embodiments, they are not intended to limit the present invention. Any person skilled in the art may make various changes and modifications to the above-mentioned embodiments without departing from the spirit and scope of the present invention, and the scope of protection of the present invention shall include all changes within the meaning and equivalent scope recorded in the attached patent application.
［第1圖］ 試驗（A）中，市售之散熱片的金相圖。 ［第2圖］ 試驗（A）中，本發明之散熱組合物形成的散熱片的金相圖。 ［第3圖］ 試驗（B）中，不含玻璃顆粒的散熱組合物形成的散熱片的金相圖。[Figure 1] Metallographic image of a commercially available heat sink in test (A). [Figure 2] Metallographic image of a heat sink formed by the heat sink composition of the present invention in test (A). [Figure 3] Metallographic image of a heat sink formed by a heat sink composition that does not contain glass particles in test (B).
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