TWI866195B - Injection molding packaging method, package structure, and camera module - Google Patents

Abstract

The present application provides an injection molding packaging method, package structure, and a camera module. The present application involves setting a sealant around sensing area of a photoelectric element, and setting a protrusion in a injection mold, so that the protrusion can touch the sealant during injection molding, thereby enabling the sealant to seal and protect the sensing area and reducing the probability of injection molding materials entering the sensing area. Moreover, the height of the sealant can better compensate for the height difference between the components to be encapsulated and the injection mold when they are attached, and there is no need to change the internal shape of the injection mold to match the release film, making the method has a wider applicability.

Description

Injection molding packaging method, packaging structure and camera module

This application relates to the field of packaging technology, and in particular to an injection molding packaging method, packaging structure, and camera module.

Existing optoelectronic components (such as camera modules, etc.) generally use mold injection packaging methods to package the chip on the substrate, and the connection between the chip and the substrate is protected by plastic filling. This method has a more ideal packaging volume and reliability. The mold injection packaging method generally includes the following steps: Cover the side of the mold facing the product with a soft release film, and pressurize the sensing area (photosensitive area) of the optoelectronic component to isolate the injection material from flowing in, and then inject the injection material (such as epoxy resin, etc.). After the injection material hardens, remove the mold and release film to obtain a packaged semi-finished product.

In the above packaging method, the role of the release film is to use its softness to make it fit tightly with the sensing area (photosensitive area) of the optoelectronic component, isolating the injection molding material from flowing into the sensing area (photosensitive area) of the optoelectronic component. However, in order to ensure that the release film and the mold surface are well bonded, the thickness of the release film can only be up to about 0.1mm. If the optoelectronic component is tilted, or multiple optoelectronic components are injection molded at the same time, the compressible amount of the release film will not be enough to seal the surface of the optoelectronic component to isolate the injection molding material from entering the sensing area (photosensitive area).

In view of this, this application proposes an injection molding packaging method to better isolate the injection molding material from flowing into the sensing area (photosensitive area).

An embodiment of the present application provides an injection molding packaging method, comprising the following steps: Providing an injection molding mold, the injection molding mold comprising a first mold and a second mold, the first mold comprising a main body, the main body being recessed inward to form a groove, the groove being provided with at least one protrusion, the protrusion dividing the groove into a plurality of cavities; placing a component to be packaged in the second mold, the component to be packaged comprising a substrate and an optoelectronic element fixed on the surface of the substrate, the optoelectronic element comprising a sensing area and a non-sensing area surrounding the sensing area; providing a sealant in the non-sensing area so that the sealant is provided around the sensing area; placing the first mold on the surface of the component to be packaged so that the protrusion abuts against the sealant and the cavity covers the non-sensing area; injecting an injection molding material into the cavity, curing the injection molding material, so as to form a plastic package body on the surface of the non-sensing area and the substrate; removing the first mold and the second mold to complete the packaging.

In one embodiment, the optoelectronic element includes a photosensitive chip and/or a laser diode.

In one implementation, when the optoelectronic element of the component to be packaged is a photosensitive chip, the preparation method of the component to be packaged includes the following steps: sticking the photosensitive chip on the substrate; welding wires to electrically connect the photosensitive chip and the substrate through wires.

In one embodiment, the non-sensing area includes a first pad, and the substrate includes a second pad. In the wire bonding step, the first pad and the second pad are connected by the wire, thereby electrically connecting the photosensitive chip to the substrate.

In one implementation, the conductive wire is a gold wire.

In one embodiment, the injection molding material includes epoxy resin.

An embodiment of the present application provides a packaging structure, which is packaged by the above-mentioned injection molding packaging method. The packaging structure includes a substrate, a photoelectric element fixed on the surface of the substrate, and a plastic package. The photoelectric element is electrically connected to the substrate. The photoelectric element includes a sensing area and a non-sensing area surrounding the sensing area, and the non-sensing area is provided with a sealant and the sealant is arranged around the sensing area. The plastic package covers the non-sensing area and the substrate.

In one embodiment, the optoelectronic element includes a photosensitive chip and/or a laser diode.

In one implementation, the material of the plastic package includes epoxy resin.

An embodiment of the present application provides a camera module, which includes a lens and a packaging structure as described in the above item. Wherein, the optoelectronic element in the packaging structure is a photosensitive chip.

This application sets a sealant surrounding the sensing area in the non-sensing area of the photoelectric element, and sets a protrusion in the injection mold so that the protrusion can abut the sealant during injection molding, so that the sealant can seal and protect the sensing area, reducing the probability of the injection material entering the sensing area. In addition, the height of the sealant can better compensate for the height difference when the packaged component and the injection mold are fitted, and there is no need to change the internal shape of the mold to match the shaping ability of the release film, and the scope of application is wider.

10: Injection mold

11: First mold

12: Second mold

111: Headquarters

112: Groove

113: Bump

114: Cavity

20: Components to be packaged

21: Substrate

22: Optoelectronic components

221: Sensing area

222: Non-sensing area

23: Photosensitive chip

24: Conductor wire

223: First pad

121: Second pad

25: Sealant

26: Plastic sealing body

27: Laser diode

100, 200: Packaging structure

1000: Camera module

Figure 1 is a schematic diagram of the structure of the injection mold provided in the first embodiment of this application.

Figure 2 is a schematic diagram of the structure of the injection mold provided in another embodiment of this application.

Figures 3 to 7 are schematic diagrams of the packaging process using the injection mold shown in Figure 1.

Figure 8 is a schematic diagram of the packaging structure provided in the first embodiment of this application.

Figure 9 is a schematic diagram of the module composition of the camera module provided in the first embodiment of this application.

Unless otherwise defined, all technical and scientific terms used in this article have the same meaning as those commonly understood by technicians in the technical field of the embodiment of this application. The terms used in this article are only for the purpose of describing specific implementation methods and are not intended to limit the embodiment of this application.

It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative position relationship and movement status of various components under a certain posture (as shown in the attached figure). If the specific posture changes, the directional indication will also change accordingly.

The following is a detailed description of some implementation methods of this application in conjunction with the attached figures. In the absence of conflict, the following implementation methods and features in the implementation methods can be combined with each other.

Please refer to Figures 1 to 7. The first aspect of this application provides an injection molding packaging method for packaging a photoelectric element 22 and a substrate 21. The injection molding packaging method includes steps S10 to S60. It can be understood that the numbering of the steps is intended to clearly describe the specific preparation method, and is not intended to limit the order of the steps.

Please refer to Figures 1 and 2, step S10: provide an injection mold 10.

The injection mold 10 includes a first mold 11 and a second mold 12 that are arranged opposite to each other. In some embodiments, the first mold 11 is referred to as an upper mold, and the second mold 12 is referred to as a lower mold. The first mold 11 includes a main body 111, and a surface portion of the main body 111 is recessed inward to form a groove 112. At least one protrusion 113 is provided in the groove 112, and the protrusion 113 divides the groove 112 into a plurality of cavities 114. The height of the protrusion 113 is less than the depth of the groove 112, that is, the surface of the protrusion 113 away from the main body 111 is lower than the opening of the groove 112. The protrusion 113 can also be regarded as a structure formed by cutting off a portion of the main body 111 between two adjacent grooves 112 after the surface portion of the main body 111 is recessed inward to form a plurality of grooves 112. The material of the protrusion 113 may be the same as or different from the material of the main body 111. The protrusion 113 can also be made of an elastic material with a certain elasticity.

In FIG1 , the number of protrusions 113 in the groove 112 is one, and the number of cavities 114 formed is two. In FIG2 , the number of protrusions 113 in the groove 112 is two, and the number of cavities 114 formed is three. In other embodiments, the number of protrusions 113 may be greater than two, and the number of cavities 114 formed may be greater than three.

Please refer to Figure 3, step S20: place the component 20 to be packaged on the second mold 12.

The component 20 to be packaged includes a substrate 21 and an optoelectronic component 22 fixed on the surface of the substrate 21, and the substrate 21 is located between the second mold 12 and the optoelectronic component 22. The substrate 21 can be a circuit board, and the circuit board can be a single-layer board or a multi-layer board, which is not limited in this application. Specifically, the substrate 21 can be, but is not limited to, a rigid circuit board (Printed Circuit Board, PCB), a flexible circuit board (Flexible Printed Circuit Board, FPCB) or a rigid-flexible board, etc.

The photoelectric element 22 includes a sensing area 221 and a non-sensing area 222 surrounding the sensing area 221. The sensing area 221 is approximately located in the center area of the photoelectric element 22, and the non-sensing area 222 is approximately located in the edge area of the photoelectric element 22. In this embodiment, the photoelectric element 22 is a photosensitive chip 23. The sensing area 221 is the photosensitive area of the photosensitive chip 23, and a large number of micro-lenses of micron level are provided in the photosensitive area. The non-sensing area 222 is the non-photosensitive area of the photosensitive chip 23. The photosensitive chip 23 can be, but is not limited to, a complementary metal oxide semiconductor image sensor (CMOS) and the like. In other embodiments, the photoelectric element 22 can also be a laser diode. It is understandable that, in order to facilitate packaging, multiple photosensitive chips 23 and/or multiple laser diodes can be arranged on the substrate 21 for packaging at the same time.

In some embodiments, when the optoelectronic element 22 is a photosensitive chip 23, the preparation method of the packaged element 20 includes the following steps: sticking the photosensitive chip 23 on the substrate 21; welding wires to electrically connect the photosensitive chip 23 and the substrate 21 through the wires 24.

Furthermore, the back side (the surface away from the photosensitive area) of the photosensitive chip 23 can be adhered to the substrate 21 by using adhesives such as glue (not shown).

As shown in FIG3 , in some embodiments, the non-sensing area 222 of the photosensitive chip 23 has a first pad 223, and the substrate 21 has a second pad 121. The number of the first pad 223 and the second pad 121 can be multiple, and this application does not limit it. In the wire bonding step, the first pad 223 on the photosensitive chip 23 can be connected to the second pad 121 on the substrate 21 by means of gold wire (i.e., wire 24), so that the photosensitive chip 23 is electrically connected to the substrate 21.

Please refer to Figure 4, step S30: set the sealant 25 in the non-sensing area 222 of the photoelectric element 22, so that the sealant 25 is set around the sensing area 221.

Specifically, the sealant 25 can be set on the outer periphery of the sensing area 221 by painting or spraying. The sealant 25 can be non-sticky or sticky, so that it can be used to adhere to impurities such as dust to reduce the impact on the photoelectric element 22.

Please refer to Figure 5, step S40: place the first mold 11 on the surface of the component 20 to be packaged, so that the protrusion 113 of the first mold 11 abuts against the sealant 25 and the cavity 114 covers the non-sensing area 222 of the photosensitive chip 23. The cavity 114 also covers part of the surface of the substrate 21. Abutment means that two parts are in contact with each other and there is a force between the two, that is, the protrusion 113 is in contact with the sealant 25 and there is a force. The protrusion 113 can be made of an elastic material with a certain elasticity so that it can be more closely in contact with the sealant 25 to prevent the injection material from entering the sensing area 221 during the packaging process.

Please refer to Figure 6, step S50: injecting the injection molding material into the cavity 114 and curing the injection molding material to form a plastic package 26 on the surface of the non-sensing area 222 and the substrate 21.

In some embodiments, the injection molding material is epoxy resin. The injection molding material can be cured by baking or UV light (ultraviolet light) irradiation, or by other methods, which are not limited in this application.

Please refer to Figure 7, step S60: remove the first mold 11 and the second mold 12 to complete the packaging.

Please refer to Figures 7 and 8. The second aspect of this application provides a packaging structure 100 (200) packaged by the above-mentioned injection molding packaging method.

As shown in FIG. 7 , the package structure 100 includes a substrate 21, an optoelectronic element 22, and a plastic package 26. The optoelectronic element 22 is fixed to the surface of the substrate 21, and the optoelectronic element 22 is electrically connected to the substrate 21. The optoelectronic element 22 includes a sensing area 221 and a non-sensing area 222 surrounding the sensing area 221, and the non-sensing area 222 is provided with a sealant 25, and the sealant 25 is provided around the sensing area 221. That is, the sealant 25 forms a boundary between the sensing area 221 and the non-sensing area 222, and the inner side of the sealant 25 is the sensing area 221, and the outer side is the non-sensing area 222. The plastic package 26 covers the non-sensing area 222 and covers part of the surface of the substrate 21. The plastic sealing body 26 is arranged adjacent to the sealant 25, and the plastic sealing body 26 may be in contact with the sealant 25 or not.

As shown in FIG. 7 , in this embodiment, the photoelectric element 22 is a photosensitive chip 23. The substrate 21 can be a circuit board, and the circuit board can be a single-layer board or a multi-layer board, which is not limited in this application. Specifically, the substrate 21 can be, but is not limited to, a rigid circuit board, a flexible circuit board, or a rigid-flexible board, etc.

As shown in FIG8 , the package structure 200 also includes a substrate 21, a photoelectric element 22, and a plastic package 26. The package structure 200 shown in FIG8 is different from the package structure 100 in FIG7 in that the photoelectric element 22 can be a laser diode 27 in addition to the photosensitive chip 23. The rest of the configuration is roughly the same as the package structure 100 in FIG7 , and will not be described here. It is understood that in other embodiments, the photoelectric element 22 can also be other electronic components.

Please refer to Figure 9. The cooperative manufacturer of this application provides a camera module 1000, which includes a package structure 100. In the package structure 100, the optoelectronic element 22 is a photosensitive chip 23. The camera module 1000 also includes components such as a filter (not shown) and a lens element (not shown). Specifically, the photosensitive chip 23 can be a CMOS. The filter is arranged between the lens element and the photosensitive chip 23, and the filter is located on the optical path of the lens element. The filter can be a blue glass filter to filter infrared band light to ensure imaging quality.

This application sets a sealant 25 surrounding the sensing area 221 in the non-sensing area 222 of the photoelectric element 22, and sets a protrusion 113 in the injection mold 10, so that the protrusion 113 can abut the sealant 25 during injection molding, so that the sealant 25 can seal and protect the sensing area 221, reducing the probability of the injection material entering the sensing area 221. In addition, the height of the sealant 25 can better compensate for the height difference when the packaged component 20 and the injection mold 10 are bonded, and there is no need to change the internal shape of the mold to match the shaping ability of the release film, and the scope of application is wider.

The above descriptions are some specific implementation methods of this application, but in the actual application process, it cannot be limited to these implementation methods. For ordinary technical personnel in this field, other variations and changes made based on the technical concept of this application should fall within the scope of protection of this application.

11: First mold

12: Second mold

20: Components to be packaged

21: Substrate

22: Optoelectronic components

221: Sensing area

222: Non-sensing area

23: Photosensitive chip

24: Conductor wire

223: First pad

121: Second pad

25: Sealant

26: Plastic sealing body

Claims (10)

An injection molding packaging method, the improvement of which is that it includes the following steps: providing an injection mold, the injection mold including a first mold and a second mold, the first mold including a body, the body being recessed inward to form a groove, the groove being provided with at least one protrusion, the protrusion dividing the groove into a plurality of cavities; placing a component to be packaged in the second mold, the component to be packaged including a substrate and an optoelectronic element fixed on the surface of the substrate, the optoelectronic element including a sensing area and a non-sensing area surrounding the sensing area; providing a sealant in the non-sensing area so that the sealant is provided around the sensing area; placing the first mold on the surface of the component to be packaged so that the protrusion abuts against the sealant and the cavity covers the non-sensing area; injecting an injection molding material into the cavity covering the non-sensing area, curing the injection molding material to form a plastic package body on the surface of the non-sensing area and the substrate; removing the first mold and the second mold to complete the packaging. The injection molding packaging method as described in claim 1, wherein the optoelectronic element includes a photosensitive chip and/or a laser diode. The injection molding packaging method as described in claim 2, wherein, when the optoelectronic element of the component to be packaged is a photosensitive chip, the preparation method of the component to be packaged includes the following steps: sticking the photosensitive chip on the substrate; welding wires to electrically connect the photosensitive chip and the substrate through wires. The injection molding packaging method as described in claim 3, wherein the non-sensing area includes a first pad, and the substrate includes a second pad; in the wire bonding step, the first pad and the second pad are connected by the wire, thereby electrically connecting the photosensitive chip to the substrate. The injection molding packaging method as described in claim 3, wherein the wire is a gold wire. The injection molding packaging method as described in claim 1, wherein the injection molding material includes epoxy resin. A packaging structure, the improvement of which is that the packaging structure is packaged by the injection molding packaging method as described in any one of claims 1 to 6, the packaging structure comprises: a substrate; a photoelectric element fixed to the surface of the substrate, the photoelectric element being electrically connected to the substrate; the photoelectric element comprising a sensing area and a non-sensing area surrounding the sensing area, the non-sensing area being provided with a sealant and the sealant being provided around the sensing area; and a plastic package, the plastic package covering the non-sensing area and the substrate. The packaging structure as described in claim 7, wherein the optoelectronic element includes a photosensitive chip and/or a laser diode. The packaging structure as described in claim 7, wherein the material of the plastic package includes epoxy resin. A camera module, the improvement of which comprises a lens and a packaging structure as described in any one of claims 7 to 9, wherein the optoelectronic element in the packaging structure is a photosensitive chip.

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