TWI865179B - Coating equipment - Google Patents
Coating equipment Download PDFInfo
- Publication number
- TWI865179B TWI865179B TW112144128A TW112144128A TWI865179B TW I865179 B TWI865179 B TW I865179B TW 112144128 A TW112144128 A TW 112144128A TW 112144128 A TW112144128 A TW 112144128A TW I865179 B TWI865179 B TW I865179B
- Authority
- TW
- Taiwan
- Prior art keywords
- anode
- substrate
- substrate holder
- opening
- coating
- Prior art date
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
本發明之課題係檢測在陽極與基板之間形成的電場混亂。 本發明之鍍覆裝置10包含:鍍覆槽50,用以容納鍍覆液Q;陽極21,配置於鍍覆槽50內;基板固持具40,以使被鍍覆面WF1與陽極21對向的方式保持基板WF;陽極遮罩70,配置於陽極21與基板固持具40之間,其具有貫通陽極21側與基板固持具40側的陽極開口70a,其係以可調節陽極開口70a之尺寸的方式構成;調整板30,配置於陽極遮罩70與基板固持具40之間;測定電極74,配置於陽極遮罩70與調整板30之間;基準電極75,配置於鍍覆槽50容納的鍍覆液Q之中;及量測器76,量測基準電極75與測定電極74之間的電壓。 The subject of the present invention is to detect the electric field disorder formed between the anode and the substrate. The coating device 10 of the present invention includes: a coating tank 50 for containing the coating liquid Q; an anode 21, which is arranged in the coating tank 50; a substrate holder 40, which holds the substrate WF in a manner that the coated surface WF1 faces the anode 21; an anode mask 70, which is arranged between the anode 21 and the substrate holder 40, and has an anode opening 70 that passes through the side of the anode 21 and the side of the substrate holder 40. a, which is configured in a manner that the size of the anode opening 70a can be adjusted; the adjustment plate 30 is arranged between the anode shield 70 and the substrate holder 40; the measuring electrode 74 is arranged between the anode shield 70 and the adjustment plate 30; the reference electrode 75 is arranged in the plating liquid Q contained in the plating tank 50; and the measuring device 76 measures the voltage between the reference electrode 75 and the measuring electrode 74.
Description
本案係關於鍍覆裝置。This case concerns a coating device.
作為電鍍裝置的一例,已知浸漬式的鍍覆裝置與杯式的鍍覆裝置。其共通點係將基板(例如半導體晶圓)保持於基板固持具並浸漬於鍍覆液,藉由對於基板(陰極)與陽極之間施加電壓,而使導電膜在基板的表面上析出。兩者之中,基板的被鍍覆面所朝向的方向不同。浸漬式的鍍覆裝置,係以被鍍覆面朝向側方的方式將基板浸漬於鍍覆液,杯式的鍍覆裝置,係以被鍍覆面朝向下方的方式將基板浸漬於鍍覆液。As an example of electroplating equipment, an immersion type plating equipment and a cup type plating equipment are known. The common point is that a substrate (such as a semiconductor wafer) is held in a substrate holder and immersed in a plating liquid, and a conductive film is deposited on the surface of the substrate by applying a voltage between the substrate (cathode) and the anode. The two have different directions in which the surface to be plated of the substrate faces. In the immersion type plating equipment, the substrate is immersed in the plating liquid in a manner that the surface to be plated faces sideways, and in the cup type plating equipment, the substrate is immersed in the plating liquid in a manner that the surface to be plated faces downward.
專利文獻1中揭示了浸漬式的鍍覆裝置。此鍍覆裝置具備陽極遮罩,其係用以調節陽極與基板之間的電場。陽極遮罩,係配置於陽極與基板固持具之間的板狀構件,其中央部具有使在陽極與基板之間流動的電流通過的開口,其構成可調節開口直徑的態樣。 [先前技術文獻] [專利文獻] Patent document 1 discloses an immersion coating device. This coating device has an anode shield, which is used to adjust the electric field between the anode and the substrate. The anode shield is a plate-shaped component arranged between the anode and the substrate holder, and has an opening in the center portion for allowing the current flowing between the anode and the substrate to pass through, and the opening diameter is adjustable. [Prior technical document] [Patent document]
[專利文獻1]日本特許第6335763號公報[Patent Document 1] Japanese Patent No. 6335763
[發明所欲解決之課題][Identify the problem you want to solve]
專利文獻1揭示的鍍覆裝置,並未考慮到針對在陽極與基板之間形成之電場的混亂進行檢測。The coating device disclosed in Patent Document 1 does not take into account the detection of the disturbance of the electric field formed between the anode and the substrate.
亦即,陽極遮罩的一部分(例如用以調節陽極遮罩之開口直徑的構件),會隨著鍍覆液所造成的化學變化導致構件劣化,而有破損的情況。若陽極遮罩的一部分破損,則陽極與基板之間的電場混亂,難以在被鍍覆面形成預期的鍍覆膜厚分布。又,不僅是陽極遮罩,關於配置於鍍覆槽內的其他構件,亦具有因鍍覆液造成的化學變化導致構件破損的疑慮。That is, part of the anode mask (for example, a component used to adjust the opening diameter of the anode mask) may be damaged due to the chemical changes caused by the plating liquid, which may lead to component degradation. If part of the anode mask is damaged, the electric field between the anode and the substrate will be disrupted, making it difficult to form the expected coating film thickness distribution on the plated surface. In addition, not only the anode mask, but also other components arranged in the plating tank may be damaged due to chemical changes caused by the plating liquid.
再者,鍍覆裝置中,要求將陽極、陽極遮罩及基板(基板固持具)配置在各軸彼此對準的適當位置。然而,任一構件的配置位置偏離時,陽極與基板之間的電場混亂,而難以形成預期的鍍覆膜厚分布。Furthermore, in the coating device, the anode, anode mask and substrate (substrate holder) are required to be arranged at appropriate positions with each axis aligned with each other. However, if the arrangement position of any component is deviated, the electric field between the anode and the substrate is disrupted, making it difficult to form the expected coating film thickness distribution.
於是,本案的一目的係檢測形成於陽極與基板之間的電場之混亂。 [解決課題之手段] Therefore, one of the objectives of this project is to detect the disorder of the electric field formed between the anode and the substrate. [Methods of solving the problem]
根據一實施形態,揭示一種鍍覆裝置,其包含:鍍覆槽,用以容納鍍覆液;陽極,配置於該鍍覆槽內;基板固持具,以使被鍍覆面與該陽極對向的方式保持基板;陽極遮罩,配置於該陽極與該基板固持具之間,其具有貫通該陽極側與該基板固持具側的陽極開口,其構成可調節該陽極開口之尺寸的態樣;電場調節構件,配置於該陽極遮罩與該基板固持具之間;測定電極,配置於該陽極遮罩與該電場調節構件之間;基準電極,配置於該鍍覆槽內容納的鍍覆液之中;及量測器,量測該基準電極與該測定電極之間的電壓。According to one embodiment, a coating device is disclosed, which includes: a coating tank for containing a coating liquid; an anode disposed in the coating tank; a substrate holder for holding a substrate in a manner such that a coated surface faces the anode; an anode mask disposed between the anode and the substrate holder, and having an anode opening that passes through a side of the anode and a side of the substrate holder. , which is configured to adjust the size of the anode opening; an electric field adjusting component, arranged between the anode shield and the substrate holder; a measuring electrode, arranged between the anode shield and the electric field adjusting component; a reference electrode, arranged in the plating liquid contained in the plating tank; and a measuring device, measuring the voltage between the reference electrode and the measuring electrode.
以下參照圖式說明本發明的實施形態。以下說明的圖式中,針對相同或相當的構成要件,賦予相同的符號並省略重複之說明。The following is a description of the embodiments of the present invention with reference to the drawings. In the drawings described below, the same or equivalent components are given the same symbols and repeated descriptions are omitted.
圖1係顯示一實施形態之鍍覆裝置的整體構成的剖面圖。如圖所示,本實施形態之鍍覆裝置10具有:陽極固持具20,其構成保持陽極21的態樣;基板固持具40,其構成保持基板WF的態樣;及鍍覆槽50,其內部容納陽極固持具20與基板固持具40。本實施形態中,基板WF形成圓板狀,陽極21與基板WF的形狀對應而形成圓板狀。FIG1 is a cross-sectional view showing the overall structure of a coating device of an embodiment. As shown in the figure, the coating device 10 of this embodiment has: an anode holder 20, which is configured to hold an anode 21; a substrate holder 40, which is configured to hold a substrate WF; and a coating tank 50, which accommodates the anode holder 20 and the substrate holder 40. In this embodiment, the substrate WF is formed into a disk shape, and the anode 21 is formed into a disk shape corresponding to the shape of the substrate WF.
如圖1所示,鍍覆槽50具有:鍍覆處理槽52,容納包含添加劑的鍍覆液Q;鍍覆液排出槽54,接收從鍍覆處理槽52溢流出來的鍍覆液Q並將其排出;及分隔壁55,將鍍覆處理槽52與鍍覆液排出槽54分隔。As shown in FIG. 1 , the coating tank 50 includes: a coating treatment tank 52 for accommodating a coating liquid Q containing an additive; a coating liquid discharge tank 54 for receiving and discharging the coating liquid Q overflowing from the coating treatment tank 52; and a partition wall 55 for separating the coating treatment tank 52 from the coating liquid discharge tank 54.
保持陽極21的陽極固持具20與保持基板WF的基板固持具40,係浸漬於鍍覆處理槽52內的鍍覆液Q,其係以陽極21與基板WF的被鍍覆面WF1成為大致平行的方式對向設置。換言之,基板固持具40在使被鍍覆面WF1朝向側方的狀態下保持基板WF。陽極21與基板WF在浸漬於鍍覆處理槽52之鍍覆液Q的狀態下被施加電壓。藉此,金屬離子在基板WF的被鍍覆面WF1上還原,而在被鍍覆面WF1形成薄膜。The anode holder 20 holding the anode 21 and the substrate holder 40 holding the substrate WF are immersed in the plating liquid Q in the plating treatment tank 52, and are arranged opposite to each other in such a manner that the anode 21 and the plated surface WF1 of the substrate WF are approximately parallel. In other words, the substrate holder 40 holds the substrate WF in a state where the plated surface WF1 faces sideways. A voltage is applied to the anode 21 and the substrate WF while being immersed in the plating liquid Q in the plating treatment tank 52. Thereby, metal ions are reduced on the plated surface WF1 of the substrate WF, and a thin film is formed on the plated surface WF1.
鍍覆處理槽52具有鍍覆液供給口56,其用以將鍍覆液Q供給至槽內部的。鍍覆液排出槽54具有鍍覆液排出口57,其用以將從鍍覆處理槽52溢流出來的鍍覆液Q排出。鍍覆液供給口56配置於鍍覆處理槽52的底部,鍍覆液排出口57配置於鍍覆液排出槽54的底部。The coating treatment tank 52 has a coating liquid supply port 56 for supplying the coating liquid Q into the tank. The coating liquid discharge tank 54 has a coating liquid discharge port 57 for discharging the coating liquid Q overflowing from the coating treatment tank 52. The coating liquid supply port 56 is arranged at the bottom of the coating treatment tank 52, and the coating liquid discharge port 57 is arranged at the bottom of the coating liquid discharge tank 54.
鍍覆液Q若從鍍覆液供給口56被供給至鍍覆處理槽52,則鍍覆液Q從鍍覆處理槽52溢出,越過分隔壁55流入鍍覆液排出槽54。流入鍍覆液排出槽54的鍍覆液Q從鍍覆液排出口57排出,經由鍍覆液循環裝置58所具有的過濾器等而去除雜質。經去除雜質的鍍覆液Q,藉由鍍覆液循環裝置58透過鍍覆液供給口56被供給至鍍覆處理槽52。When the coating liquid Q is supplied to the coating treatment tank 52 from the coating liquid supply port 56, the coating liquid Q overflows from the coating treatment tank 52 and flows into the coating liquid discharge tank 54 over the partition wall 55. The coating liquid Q flowing into the coating liquid discharge tank 54 is discharged from the coating liquid discharge port 57, and impurities are removed by a filter or the like provided in the coating liquid circulation device 58. The coating liquid Q from which impurities have been removed is supplied to the coating treatment tank 52 through the coating liquid supply port 56 by the coating liquid circulation device 58.
鍍覆裝置10具有陽極遮罩70,其用以調節陽極21與基板WF之間的電場。陽極遮罩70例如係由介電體材料所構成之略板狀構件,其設置於陽極固持具20之前表面。此處,所謂的陽極固持具20之前表面,係指與基板固持具40對向之一側的面。亦即,陽極遮罩70配置於陽極21與基板固持具40之間。陽極遮罩70在略中央部具有陽極開口70a,其貫通陽極21側與基板固持具40側,換言之使在陽極21與基板WF之間流動的電流通過。陽極開口70a的直徑較佳係小於陽極21的直徑。陽極遮罩70係構成可調節陽極開口70a之直徑的態樣。以下說明此點。The coating device 10 has an anode shield 70, which is used to adjust the electric field between the anode 21 and the substrate WF. The anode shield 70 is, for example, a roughly plate-shaped component made of a dielectric material, which is arranged on the front surface of the anode holder 20. Here, the so-called front surface of the anode holder 20 refers to the surface on one side opposite to the substrate holder 40. That is, the anode shield 70 is arranged between the anode 21 and the substrate holder 40. The anode shield 70 has an anode opening 70a in the roughly central portion, which passes through the anode 21 side and the substrate holder 40 side, in other words, allows the current flowing between the anode 21 and the substrate WF to pass through. The diameter of the anode opening 70a is preferably smaller than the diameter of the anode 21. The anode shield 70 is configured to be able to adjust the diameter of the anode opening 70a. This point is described below.
圖2係陽極遮罩70的概略前視圖。圖2係圖1中的A-A線的箭視圖。如圖2所示,陽極遮罩70具有板狀的陽極遮罩本體71及形成於陽極遮罩本體71之中央的略環狀緣部73。陽極遮罩70具有多個遮擋葉片72,其構成可調節陽極開口70a的態樣。遮擋葉片72安裝於緣部73,其協作而劃分出陽極開口70a。遮擋葉片72分別藉由與相機的光圈機構相同的結構使陽極開口70a的直徑放大或縮小(調節陽極開口70a的直徑)。圖2所示的陽極遮罩70的陽極開口70a藉由遮擋葉片72而形成非圓形(例如多邊形)。此情況的陽極開口70a之直徑係指多邊形中對向之邊的最短距離、或是內接圓的直徑。或是陽極開口70a的直徑亦可以具有與開口面積等效之面積的圓之直徑來定義。FIG. 2 is a schematic front view of the anode shield 70. FIG. 2 is an arrow view of the A-A line in FIG. 1. As shown in FIG. 2, the anode shield 70 has a plate-shaped anode shield body 71 and a roughly annular edge 73 formed in the center of the anode shield body 71. The anode shield 70 has a plurality of shielding blades 72, which are configured to adjust the anode opening 70a. The shielding blades 72 are mounted on the edge 73, and they cooperate to divide the anode opening 70a. The shielding blade 72 enlarges or reduces the diameter of the anode opening 70a (adjusts the diameter of the anode opening 70a) by the same structure as the aperture mechanism of the camera. The anode opening 70a of the anode shield 70 shown in FIG. 2 is formed into a non-circular shape (e.g., a polygon) by the shielding blade 72. The diameter of the anode opening 70a in this case refers to the shortest distance between the opposite sides of the polygon, or the diameter of the inscribed circle. Alternatively, the diameter of the anode opening 70a can also be defined by the diameter of a circle having an area equivalent to the opening area.
遮擋葉片72分別例如藉由手動而使陽極開口70a的直徑放大或縮小。又,遮擋葉片72分別亦可構成利用空氣壓力或電力驅動力進行驅動的態樣。The shielding blades 72 can be manually operated to enlarge or reduce the diameter of the anode opening 70a. In addition, the shielding blades 72 can also be driven by air pressure or electric drive.
參照圖1,鍍覆裝置10具有調整板30,其係電場調節構件的一例,用以調節陽極21與基板WF之間的電場。調整板30例如係由介電體材料構成的略板狀構件,其配置於陽極遮罩70與基板固持具40(基板WF)之間。調整板30具有調整開口30a,其貫通陽極21側與基板固持具40側,換言之,其使在陽極21與基板WF之間流動的電流通過。調整開口30a的直徑較佳係小於基板WF的直徑。Referring to FIG. 1 , the coating device 10 has an adjustment plate 30, which is an example of an electric field adjustment component for adjusting the electric field between the anode 21 and the substrate WF. The adjustment plate 30 is, for example, a roughly plate-shaped component made of a dielectric material, and is disposed between the anode shield 70 and the substrate holder 40 (substrate WF). The adjustment plate 30 has an adjustment opening 30a, which passes through the anode 21 side and the substrate holder 40 side, in other words, it allows the current flowing between the anode 21 and the substrate WF to pass. The diameter of the adjustment opening 30a is preferably smaller than the diameter of the substrate WF.
調整板30,與陽極遮罩70相同,亦可構成藉由遮擋葉片來調節調整開口30a之直徑的態樣。然而,調整開口30a之直徑的調節並不限於遮擋葉片。例如,亦可在略環狀的緣部上安裝彈性管,使流體(空氣或氮氣等氣體、或是水等流體)進出彈性管內部的空洞而使彈性管膨脹/收縮,藉此亦可對於調整開口30a的直徑進行調節。The adjusting plate 30, like the anode shield 70, can also be configured to adjust the diameter of the adjusting opening 30a by means of a shielding blade. However, the adjustment of the diameter of the adjusting opening 30a is not limited to the shielding blade. For example, an elastic tube can be installed on the slightly annular edge, and a fluid (gas such as air or nitrogen, or a fluid such as water) can be made to enter and exit the cavity inside the elastic tube to expand/contract the elastic tube, thereby also adjusting the diameter of the adjusting opening 30a.
調整板30較佳係位在相較於陽極固持具20與基板固持具40之中間位置更靠近基板固持具40的位置。調整板30配置在越靠近基板固持具40的位置,越能夠正確地藉由控制調整板30的調整開口30a之直徑來控制基板WF之周緣部的膜厚。The adjustment plate 30 is preferably located closer to the substrate holder 40 than the middle position between the anode holder 20 and the substrate holder 40. The closer the adjustment plate 30 is to the substrate holder 40, the more accurately the film thickness of the peripheral portion of the substrate WF can be controlled by controlling the diameter of the adjustment opening 30a of the adjustment plate 30.
調整板30與基板固持具40之間設有槳18,其用以攪拌基板WF之被鍍覆面WF1附近的鍍覆液Q。槳18的一端固定於槳驅動裝置19。槳18藉由槳驅動裝置19沿著基板WF的被鍍覆面WF1移動,藉此攪拌鍍覆液Q。A paddle 18 is provided between the adjustment plate 30 and the substrate holder 40 to stir the coating liquid Q near the coating surface WF1 of the substrate WF. One end of the paddle 18 is fixed to the paddle driving device 19. The paddle 18 is moved along the coating surface WF1 of the substrate WF by the paddle driving device 19 to stir the coating liquid Q.
鍍覆裝置10更具有隔膜箱60。隔膜箱60係用以在鍍覆槽50內中容納陽極固持具20(陽極21)及陽極遮罩70的箱狀構件。隔膜箱60具有配置於陽極遮罩70與調整板30之間的隔膜62。隔膜62係將配置有陽極21的陽極區域與配置有基板WF的陰極區域隔開的薄膜。隔膜箱60具有栓塞64,其在從鍍覆槽50將隔膜箱60抬起時,從隔膜箱60將鍍覆液Q排出。The coating apparatus 10 further includes a diaphragm box 60. The diaphragm box 60 is a box-shaped member for accommodating the anode holder 20 (anode 21) and the anode mask 70 in the coating tank 50. The diaphragm box 60 includes a diaphragm 62 disposed between the anode mask 70 and the adjustment plate 30. The diaphragm 62 is a thin film that separates the anode region where the anode 21 is disposed and the cathode region where the substrate WF is disposed. The diaphragm box 60 includes a plug 64 that discharges the coating liquid Q from the diaphragm box 60 when the diaphragm box 60 is lifted from the coating tank 50.
然後說明檢測鍍覆裝置10之電場混亂的態樣。如圖2所示,鍍覆裝置10具有測定電極74(圖2的實施形態中為3個測定電極74-1、74-2、74-3)、基準電極75及量測基準電極75與測定電極74之間的電壓的量測器76。Next, the state of detecting electric field disorder of the coating device 10 is described. As shown in FIG2 , the coating device 10 has a measuring electrode 74 (three measuring electrodes 74 - 1 , 74 - 2 , and 74 - 3 in the embodiment of FIG2 ), a reference electrode 75 , and a measuring device 76 for measuring the voltage between the reference electrode 75 and the measuring electrode 74 .
圖2的實施形態中,測定電極74-1、74-2、74-3,係在陽極遮罩70的基板固持具40側的面上,在與陽極開口70a之中心相對的圓周上等間隔(120°間隔)配置。更具體而言,測定電極74-1、74-2、74-3配置於遮擋葉片72之基板固持具40側的面上。然而,測定電極74不限於圖2之實施形態的配置態樣,其亦可配置於陽極遮罩70與調整板30(電場調節構件)之間。具有多個測定電極74時,各測定電極74亦可以將陽極21之中心與基板WF之中心連結的虛擬軸為中心而在圓周上等間隔配置。測定電極74的數量亦可為單數。In the embodiment of FIG. 2 , the measuring electrodes 74-1, 74-2, and 74-3 are arranged at equal intervals (120° intervals) on the surface of the anode shield 70 on the substrate holder 40 side, on the circumference opposite to the center of the anode opening 70a. More specifically, the measuring electrodes 74-1, 74-2, and 74-3 are arranged on the surface of the shielding blade 72 on the substrate holder 40 side. However, the measuring electrode 74 is not limited to the arrangement of the embodiment of FIG. 2 , and it can also be arranged between the anode shield 70 and the adjustment plate 30 (electric field adjustment member). When there are a plurality of measuring electrodes 74, the measuring electrodes 74 may be arranged at equal intervals on a circle with the virtual axis connecting the center of the anode 21 and the center of the substrate WF as the center. The number of measuring electrodes 74 may also be singular.
基準電極75,係在陽極遮罩70的基板固持具40側的面上,配置於相對陽極遮罩70的中心遠離測定電極74-1、74-2、74-3之處。然而,基準電極75不限於圖2之實施形態的配置態樣,只要配置在鍍覆槽50所容納之鍍覆液Q中即可。測定電極74及基準電極75分別透過圖案配線77與量測器76連接。The reference electrode 75 is disposed on the surface of the substrate holder 40 side of the anode shield 70, at a position far from the measuring electrodes 74-1, 74-2, and 74-3 relative to the center of the anode shield 70. However, the reference electrode 75 is not limited to the configuration of the embodiment of FIG. 2, as long as it is disposed in the plating liquid Q contained in the plating tank 50. The measuring electrode 74 and the reference electrode 75 are connected to the measuring device 76 through the pattern wiring 77, respectively.
圖3係一實施形態之陽極遮罩70及隔膜62的立體剖面圖。如圖3所示,陽極遮罩本體71具有板狀的第1陽極遮罩本體71-1及板狀的第2陽極遮罩本體71-2。第1陽極遮罩本體71-1及第2陽極遮罩本體71-2係以隔著間隔相互對向的方式配置。圖案配線77係配置於第1陽極遮罩本體71-1與第2陽極遮罩本體71-2之間的空間。圖案配線77可藉由在環氧樹脂等基板上使銅箔形成圖案而構成。第1陽極遮罩本體71-1及第2陽極遮罩本體71-2發揮作為密封材的功能,因此可防止鍍覆液Q侵入容納圖案配線77的內部空間。FIG3 is a three-dimensional cross-sectional view of an anode shield 70 and a diaphragm 62 in an embodiment. As shown in FIG3, the anode shield body 71 has a plate-shaped first anode shield body 71-1 and a plate-shaped second anode shield body 71-2. The first anode shield body 71-1 and the second anode shield body 71-2 are arranged in a manner of facing each other with a gap therebetween. The pattern wiring 77 is arranged in the space between the first anode shield body 71-1 and the second anode shield body 71-2. The pattern wiring 77 can be formed by forming a pattern of copper foil on a substrate such as epoxy resin. The first anode mask body 71 - 1 and the second anode mask body 71 - 2 function as sealing materials, thereby preventing the plating liquid Q from invading the internal space that accommodates the pattern wiring 77 .
鍍覆裝置10,可藉由量測器76量測測定電極74相對於基準電極75的電壓,因此可檢測陽極21與基板WF之間形成的電場之混亂。以下說明與該電場混亂之檢測相關的例子。The coating apparatus 10 can detect the disorder of the electric field formed between the anode 21 and the substrate WF by measuring the voltage of the measuring electrode 74 relative to the reference electrode 75 by the measuring device 76. An example related to the detection of the disorder of the electric field is described below.
參照圖2,鍍覆裝置10具有檢測構件80,其構成根據由量測器76量測到的電壓之時間變化來檢測陽極遮罩70或調整板30(電場調節構件)之破損的態樣。亦即,陽極遮罩70的一部分(例如用以調節陽極開口之直徑的遮擋葉片72),會隨著由鍍覆液所造成之化學變化導致構件劣化而有破損的情況。若陽極遮罩的一部分破損,則陽極與基板之間的電場混亂,而難以在被鍍覆面上形成預期的鍍覆的膜厚分布。又,不僅是陽極遮罩70,關於調整板30,亦有因鍍覆液所造成之化學變化而導致構件破損的疑慮。2, the coating device 10 has a detection component 80, which is configured to detect the damage of the anode shield 70 or the adjustment plate 30 (electric field adjustment component) according to the time change of the voltage measured by the measuring device 76. That is, a part of the anode shield 70 (for example, the shielding blade 72 used to adjust the diameter of the anode opening) may be damaged due to the degradation of the component caused by the chemical change caused by the coating liquid. If a part of the anode shield is damaged, the electric field between the anode and the substrate is disrupted, and it is difficult to form the expected coating film thickness distribution on the coating surface. Furthermore, there is a concern that not only the anode shield 70 but also the adjustment plate 30 may be damaged due to chemical changes caused by the coating liquid.
對此,檢測構件80根據量測器76所量測到的電壓之時間變化,檢測測定電極74-1、74-2、74-3中的至少一者的電壓相對於正常狀態的變化。例如配置於測定電極74-1附近的遮擋葉片72破損時,測定電極74-1的電壓相對於正常狀態發生變化。檢測構件80檢測到測定電極74-1的電壓相對正常狀態發生變化時,則發出警報以提醒配置於測定電極74-1附近的遮擋葉片72可能破損。又,檢測構件80可在發出警報的同時,停止鍍覆裝置10的運轉。In this regard, the detection component 80 detects the change of the voltage of at least one of the measuring electrodes 74-1, 74-2, and 74-3 relative to the normal state according to the time change of the voltage measured by the measuring device 76. For example, when the shielding blade 72 arranged near the measuring electrode 74-1 is damaged, the voltage of the measuring electrode 74-1 changes relative to the normal state. When the detection component 80 detects that the voltage of the measuring electrode 74-1 changes relative to the normal state, an alarm is issued to remind that the shielding blade 72 arranged near the measuring electrode 74-1 may be damaged. In addition, the detection component 80 can stop the operation of the coating device 10 at the same time as issuing the alarm.
圖4係一實施形態的陽極遮罩的概略前視圖。如圖4所示,鍍覆裝置10亦可具有6個測定電極74-1~74-6。此情況中,測定電極74-1~74-6,在陽極遮罩70的基板固持具40側的面上,在與陽極開口70a之中心相對的圓周上等間隔(60°間隔)配置。FIG4 is a schematic front view of an anode mask of an embodiment. As shown in FIG4, the coating device 10 may also have six measuring electrodes 74-1 to 74-6. In this case, the measuring electrodes 74-1 to 74-6 are arranged at equal intervals (60° intervals) on the surface of the substrate holder 40 side of the anode mask 70 on the circumference opposite to the center of the anode opening 70a.
檢測構件80構成下述態樣:分別針對測定電極74-1~74-6,根據由量測器76量測到的電壓之時間變化來檢測陽極遮罩70或調整板30(電場調節構件)的破損。藉由如本實施形態使測定電極74的數量增加,可更具體地檢測出陽極21與基板WF之間形成的電場發生混亂之處。結果,例如在遮擋葉片72發生破損時,可更具體地特定出發生破損之處。The detection member 80 is configured as follows: for each of the measuring electrodes 74-1 to 74-6, damage to the anode shield 70 or the adjustment plate 30 (electric field adjustment member) is detected based on the time variation of the voltage measured by the measuring device 76. By increasing the number of measuring electrodes 74 as in the present embodiment, it is possible to more specifically detect where the electric field formed between the anode 21 and the substrate WF is disrupted. As a result, for example, when the shielding blade 72 is damaged, the damaged portion can be more specifically identified.
圖5係一實施形態的陽極遮罩之概略前視圖。本實施形態係對於形成矩形之基板WF進行鍍覆處理的鍍覆裝置之實施形態。如圖5所示,陽極開口70a形成與矩形基板WF之形狀對應的矩形。Fig. 5 is a schematic front view of an anode mask of an embodiment. This embodiment is an embodiment of a plating device for plating a rectangular substrate WF. As shown in Fig. 5, the anode opening 70a is formed into a rectangle corresponding to the shape of the rectangular substrate WF.
如圖5所示,陽極遮罩70具有多個遮蔽構件79(遮蔽構件79-1、79-2、79-3、79-4),其設於矩形之陽極開口70a的各邊。各遮蔽構件79可在靠近或遠離陽極開口70a之中心的方向上移動。又,如圖5所示,鍍覆裝置10包含多個(4個)測定電極74-1、74-2、74-3、74-4,其係分別對於矩形之陽極開口70a的各邊配置。As shown in FIG5 , the anode shield 70 has a plurality of shielding members 79 (shielding members 79-1, 79-2, 79-3, 79-4), which are arranged on each side of the rectangular anode opening 70a. Each shielding member 79 can move in a direction close to or away from the center of the anode opening 70a. Also, as shown in FIG5 , the coating device 10 includes a plurality of (4) measuring electrodes 74-1, 74-2, 74-3, 74-4, which are respectively arranged for each side of the rectangular anode opening 70a.
鍍覆裝置10具有開口調節構件90,其構成根據由量測器76量測到的多個測定電極之電壓而使遮蔽構件79移動的態樣。開口調節構件90,在陽極21、陽極遮罩70及基板WF(基板固持具40)各軸的對準偏離的情況中,可進行陽極開口70a的調節。The coating apparatus 10 has an opening adjustment member 90 configured to move the shielding member 79 according to the voltages of the plurality of measuring electrodes measured by the measuring device 76. The opening adjustment member 90 can adjust the anode opening 70a when the alignment of the anode 21, the anode mask 70 and the substrate WF (substrate holder 40) is deviated.
亦即,要求陽極21、陽極遮罩70及基板WF(基板固持具40)配置在各軸彼此對準的適當位置。然而,任一構件的配置位置偏離時,陽極與基板之間的電場混亂,難以形成預期的鍍覆膜厚分布。That is, the anode 21, the anode mask 70 and the substrate WF (substrate holder 40) are required to be arranged at appropriate positions with the axes aligned with each other. However, if the arrangement position of any component is deviated, the electric field between the anode and the substrate is disordered, and it is difficult to form the expected coating film thickness distribution.
對此,開口調節構件90比較陽極開口70a中對向之邊的測定電極之電壓值,根據比較結果使遮蔽構件79-1、79-2、79-3、79-4移動,以調節陽極開口70a的位置。例如,基板固持具40配置於比適當位置更低的位置。此情況中,陽極與基板之間的電場混亂,若比較測定電極74-1的電壓與測定電極74-3的電壓,則測定電極74-3的電壓變得較高。開口調節構件90根據此比較結果,使遮蔽構件79-1、79-3向下移動,藉此使陽極開口70a向下移動。開口調節構件90可使遮蔽構件79-1、79-3向下移動至測定電極74-1的電壓與測定電極74-3的電壓相等為止。結果可抑制陽極與基板之間的電場混亂,容易形成預期的鍍覆膜厚分布。In response to this, the opening adjustment member 90 compares the voltage values of the measuring electrodes on the opposite sides of the anode opening 70a, and moves the shielding members 79-1, 79-2, 79-3, and 79-4 according to the comparison result to adjust the position of the anode opening 70a. For example, the substrate holder 40 is arranged at a position lower than the appropriate position. In this case, the electric field between the anode and the substrate is chaotic, and if the voltage of the measuring electrode 74-1 is compared with the voltage of the measuring electrode 74-3, the voltage of the measuring electrode 74-3 becomes higher. The opening adjustment member 90 moves the shielding members 79-1 and 79-3 downward according to the comparison result, thereby moving the anode opening 70a downward. The opening adjustment member 90 can move the shielding members 79-1 and 79-3 downward until the voltage of the measuring electrode 74-1 is equal to the voltage of the measuring electrode 74-3. As a result, the electric field disorder between the anode and the substrate can be suppressed, and the expected coating film thickness distribution can be easily formed.
上述的實施形態中,說明了以被鍍覆面WF1朝向側方的方式使基板WF浸漬於鍍覆液的浸漬式鍍覆裝置作為例子,但並不限定於此。本發明亦可應用於以被鍍覆面WF1朝向下方的方式將基板WF浸漬於鍍覆液的杯式鍍覆裝置。以下說明此點。In the above-mentioned embodiment, an immersion plating apparatus in which the substrate WF is immersed in the plating liquid with the surface WF1 to be coated facing sideways is described as an example, but the present invention is not limited to this. The present invention can also be applied to a cup plating apparatus in which the substrate WF is immersed in the plating liquid with the surface WF1 to be coated facing downward. This point is described below.
圖6係顯示一實施形態的鍍覆裝置之整體構成的剖面圖。針對與上述實施形態具有相同功能的構件,賦予相同符號並省略說明。Fig. 6 is a cross-sectional view showing the overall structure of a coating device of an embodiment. Components having the same functions as those of the above-mentioned embodiment are given the same symbols and their description is omitted.
如圖6所示,基板固持具40係以使被鍍覆面WF1朝向下方的狀態保持基板WF的方式構成。鍍覆裝置10具有電阻體32(電場調節構件),其配置於陽極遮罩70與基板固持具40之間,並具有貫通陽極21側與基板固持具40側的多個開口32a。電阻體32,作為一例,可為形成有多個沖孔開口的沖孔板,但不限定於此。As shown in FIG6 , the substrate holder 40 is configured to hold the substrate WF in a state where the coated surface WF1 faces downward. The coating device 10 has a resistor 32 (electric field adjustment member) disposed between the anode shield 70 and the substrate holder 40 and having a plurality of openings 32a that pass through the anode 21 side and the substrate holder 40 side. The resistor 32 may be, for example, a punching plate having a plurality of punching openings, but is not limited thereto.
根據本實施形態,與上述實施形態相同,鍍覆裝置10可藉由量測器76量測測定電極74相對於基準電極75的電壓,因此可檢測陽極21與基板WF之間形成的電場之混亂。又,鍍覆裝置10具有檢測構件80,其根據由量測器76量測到的電壓之時間變化來檢測陽極遮罩70或電阻體32(電場調節構件)的破損。檢測構件80,在檢測到測定電極74的電壓相對於正常狀態發生變化時,可發出警報以提醒配置於測定電極74附近的遮擋葉片72可能破損。又,檢測構件80可在發出警報的同時,停止鍍覆裝置10的運轉。According to this embodiment, similar to the above-mentioned embodiment, the coating device 10 can measure the voltage of the measuring electrode 74 relative to the reference electrode 75 by the measuring device 76, thereby detecting the disorder of the electric field formed between the anode 21 and the substrate WF. In addition, the coating device 10 has a detection component 80, which detects the damage of the anode shield 70 or the resistor 32 (electric field adjustment component) based on the time change of the voltage measured by the measuring device 76. When the detection component 80 detects that the voltage of the measuring electrode 74 changes relative to the normal state, it can issue an alarm to remind that the shielding blade 72 arranged near the measuring electrode 74 may be damaged. Furthermore, the detection component 80 can stop the operation of the coating device 10 while issuing an alarm.
以上說明了數個本發明之實施形態,但上述發明的實施形態係用以輕易理解本發明,並未限定本發明。本發明只要不脫離其主旨則可進行變更、改良,本發明當然包含其均等物。又,在可解決上述課題的至少一部分之範圍或發揮至少部分效果的範圍內,可將申請專利範圍及說明書記載的各構成要件任意組合或省略。Several embodiments of the present invention are described above, but the embodiments are intended to facilitate understanding of the present invention and do not limit the present invention. The present invention can be modified and improved without departing from its main purpose, and the present invention naturally includes its equivalents. In addition, the constituent elements described in the scope of the patent application and the specification can be arbitrarily combined or omitted within the scope of solving at least part of the above-mentioned problems or exerting at least part of the effects.
本案中,作為一實施形態,揭示一種鍍覆裝置,其包含:鍍覆槽,用以容納鍍覆液;陽極,配置於該鍍覆槽內;基板固持具,以被鍍覆面與該陽極對向的方式保持基板;陽極遮罩,配置於該陽極與該基板固持具之間,具有貫通該陽極側與該基板固持具側的陽極開口,其構成可調節該陽極開口之尺寸的態樣;電場調節構件,配置於該陽極遮罩與該基板固持具之間;測定電極,配置於該陽極遮罩與該電場調節構件之間;基準電極,配置於該鍍覆槽容納的鍍覆液之中;及量測器,用以量測該基準電極與該測定電極之間的電壓。In this case, as an implementation form, a coating device is disclosed, which includes: a coating tank for containing a coating liquid; an anode disposed in the coating tank; a substrate holder for holding a substrate in a manner such that a surface to be coated faces the anode; an anode shield disposed between the anode and the substrate holder, having an anode opening that passes through a side of the anode and a side of the substrate holder. The invention relates to an anode electrode having an opening configured to adjust the size of the anode opening; an electric field adjusting component disposed between the anode shield and the substrate holder; a measuring electrode disposed between the anode shield and the electric field adjusting component; a reference electrode disposed in the plating liquid contained in the plating tank; and a measuring device for measuring the voltage between the reference electrode and the measuring electrode.
又,本案中,作為一實施形態,揭示一種鍍覆裝置,其中,該測定電極包含多個測定電極,其在以該陽極之中心與該基板之中心連結之虛擬軸為中心的圓周上等間隔配置。In addition, in this case, as an embodiment, a coating device is disclosed, wherein the measuring electrode includes a plurality of measuring electrodes which are arranged at equal intervals on a circle centered on a virtual axis connecting the center of the anode and the center of the substrate.
又,本案中,作為一實施形態,揭示一種鍍覆裝置,其中,該多個測定電極配置於該陽極遮罩之該基板固持具側的面。Furthermore, in this case, as an embodiment, a coating device is disclosed, wherein the plurality of measuring electrodes are arranged on the surface of the anode shield on the substrate holder side.
又,本案中,作為一實施形態,揭示一種鍍覆裝置,其更包含檢測構件,其構成根據由該量測器量測到的電壓之時間變化來檢測該陽極遮罩或該電場調節構件之破損的態樣。Furthermore, in this case, as an embodiment, a coating device is disclosed, which further includes a detection component, which is configured to detect damage to the anode shield or the electric field regulating component based on the time variation of the voltage measured by the measurer.
又,本案中,作為一實施形態,揭示一種鍍覆裝置,其中,該陽極開口形成與該基板固持具所保持之矩形基板的形狀對應的矩形;該多個測定電極係分別對於矩形的陽極開口之各邊進行配置;該陽極遮罩包含設於矩形陽極開口之各邊的多個遮蔽構件;其更包含開口調節構件,其構成下述態樣:根據由該量測器量測到的電壓,使該多個遮蔽構件在靠近或遠離該陽極開口之中心的方向上移動。Furthermore, in the present case, as an implementation form, a coating device is disclosed, wherein the anode opening forms a rectangle corresponding to the shape of the rectangular substrate held by the substrate holder; the multiple measuring electrodes are respectively arranged for each side of the rectangular anode opening; the anode shield includes a plurality of shielding components arranged on each side of the rectangular anode opening; it further includes an opening adjusting component, which is constructed in the following manner: according to the voltage measured by the measurer, the plurality of shielding components are moved in a direction close to or away from the center of the anode opening.
又,本案中,作為一實施形態,揭示一種鍍覆裝置,其中,該基板固持具係以使被鍍覆面朝向側方的狀態保持基板的方式構成;該電場調節構件具有調整板,其具有貫通該陽極側與該基板固持具側的單一調整開口。Furthermore, in this case, as an implementation form, a coating device is disclosed, wherein the substrate holder is constructed in a manner to hold the substrate with the coated surface facing sideways; the electric field adjustment component has an adjustment plate having a single adjustment opening that passes through the anode side and the substrate holder side.
又,本案中,作為一實施形態,揭示一種鍍覆裝置,其中,該基板固持具係以使被鍍覆面朝向下方的狀態保持基板的方式構成,該電場調節構件包含電阻體,該電阻體具有貫通該陽極側與該基板固持具側的多個開口。Furthermore, in this case, as an implementation form, a coating device is disclosed, wherein the substrate holder is constructed in a manner to hold the substrate with the coated surface facing downward, and the electric field regulating component includes a resistor having a plurality of openings passing through the anode side and the substrate holder side.
10:鍍覆裝置 18:槳 19:槳驅動裝置 20:陽極固持具 21:陽極 30:調整板 30a:調整開口 32:電阻體 32a:開口 40:基板固持具 50:鍍覆槽 52:鍍覆處理槽 54:鍍覆液排出槽 55:分隔壁 56:鍍覆液供給口 57:鍍覆液排出口 58:鍍覆液循環裝置 60:隔膜箱 62:隔膜 64:栓塞 70:陽極遮罩 70a:陽極開口 71:陽極遮罩本體 71-1:第1陽極遮罩本體 71-2:第2陽極遮罩本體 72:遮擋葉片 73:緣部 74,74-1,74-2,74-3,74-4,74-5,74-6:測定電極 75:基準電極 76:量測器 77:圖案配線 79,79-1,79-2,79-3,79-4:遮蔽構件 80:檢測構件 90:開口調節構件 Q:鍍覆液 WF:基板 WF1:被鍍覆面10: coating device 18: paddle 19: paddle driving device 20: anode holder 21: anode 30: adjustment plate 30a: adjustment opening 32: resistor 32a: opening 40: substrate holder 50: coating tank 52: coating treatment tank 54: coating liquid discharge tank 55: partition wall 56: coating liquid supply port 57: coating liquid discharge port 58: coating liquid circulation device 60: diaphragm box 62: diaphragm 64: plug 70: anode shield 70a: anode opening 71: Anode shield body 71-1: 1st anode shield body 71-2: 2nd anode shield body 72: Shielding blade 73: Edge 74,74-1,74-2,74-3,74-4,74-5,74-6: Measuring electrode 75: Reference electrode 76: Measuring device 77: Pattern wiring 79,79-1,79-2,79-3,79-4: Shielding member 80: Detection member 90: Opening adjustment member Q: Plating liquid WF: Substrate WF1: Plated surface
圖1係顯示一實施形態的鍍覆裝置之整體構成的剖面圖。 圖2係一實施形態的陽極遮罩的概略前視圖。 圖3係一實施形態的陽極遮罩的縱向剖面圖。 圖4係一實施形態的陽極遮罩的概略前視圖。 圖5係一實施形態的陽極遮罩的概略前視圖。 圖6係顯示一實施形態的鍍覆裝置之整體構成的剖面圖。 FIG. 1 is a cross-sectional view showing the overall structure of a coating device of an embodiment. FIG. 2 is a schematic front view of an anode shield of an embodiment. FIG. 3 is a longitudinal cross-sectional view of an anode shield of an embodiment. FIG. 4 is a schematic front view of an anode shield of an embodiment. FIG. 5 is a schematic front view of an anode shield of an embodiment. FIG. 6 is a cross-sectional view showing the overall structure of a coating device of an embodiment.
10:鍍覆裝置 10: Coating device
18:槳 18: Paddle
19:槳驅動裝置 19: Paddle drive device
20:陽極固持具 20: Anode holder
21:陽極 21: Yang pole
30:調整板 30: Adjustment plate
30a:調整開口 30a: Adjust the opening
40:基板固持具 40: Substrate holder
50:鍍覆槽 50: Plated groove
52:鍍覆處理槽 52: Plating treatment tank
54:鍍覆液排出槽 54: Plating liquid discharge tank
55:分隔壁 55: Partition wall
56:鍍覆液供給口 56: Plating liquid supply port
57:鍍覆液排出口 57: Plating liquid discharge port
58:鍍覆液循環裝置 58: Coating liquid circulation device
60:隔膜箱 60: Diaphragm box
62:隔膜 62: Diaphragm
64:栓塞 64: Embolism
70:陽極遮罩 70: Anode mask
70a:陽極開口 70a: Anode opening
72:遮擋葉片 72: shielding blades
73:緣部 73: Fate
74:測定電極 74: Measuring electrode
75:基準電極 75: Reference electrode
76:量測器 76:Measurement device
Q:鍍覆液 Q: Plating liquid
WF:基板 WF: Substrate
WF1:被鍍覆面 WF1: coated
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112144128A TWI865179B (en) | 2023-11-15 | 2023-11-15 | Coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112144128A TWI865179B (en) | 2023-11-15 | 2023-11-15 | Coating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI865179B true TWI865179B (en) | 2024-12-01 |
| TW202521775A TW202521775A (en) | 2025-06-01 |
Family
ID=94769106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112144128A TWI865179B (en) | 2023-11-15 | 2023-11-15 | Coating equipment |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI865179B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104790008A (en) * | 2014-01-17 | 2015-07-22 | 株式会社荏原制作所 | Plating method and plating apparatus |
| CN109753676A (en) * | 2017-11-07 | 2019-05-14 | 株式会社荏原制作所 | Plating analytic method, plating resolution system and the computer readable storage medium for plating parsing |
-
2023
- 2023-11-15 TW TW112144128A patent/TWI865179B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104790008A (en) * | 2014-01-17 | 2015-07-22 | 株式会社荏原制作所 | Plating method and plating apparatus |
| CN109753676A (en) * | 2017-11-07 | 2019-05-14 | 株式会社荏原制作所 | Plating analytic method, plating resolution system and the computer readable storage medium for plating parsing |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202521775A (en) | 2025-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7462125B1 (en) | Plating Equipment | |
| TWI857080B (en) | Apparatus for plating | |
| CN101275267B (en) | Electroplating apparatus and electroplating method for improving thickness uniformity | |
| EP1113487A1 (en) | Method for plating a film on a semiconductor device | |
| TWI529262B (en) | Contact ring for electrochemical processor | |
| KR19980087024A (en) | Process and plating system for depositing material layer on substrate | |
| JP2014129592A (en) | Electrolytic plating shield board and electrolytic plating device possessing the same | |
| US20250146167A1 (en) | Plating apparatus | |
| WO2019047086A1 (en) | Plating chuck | |
| TWI865179B (en) | Coating equipment | |
| JP2013112842A (en) | Electroplating apparatus and plating method | |
| TW201634762A (en) | Electrochemical reaction apparatus | |
| JP4368543B2 (en) | Plating method and plating apparatus | |
| KR101451483B1 (en) | Electro Plating Device | |
| JP6186499B2 (en) | Apparatus and method for plating and / or polishing of wafers | |
| JP6431128B2 (en) | Apparatus and method for plating and / or polishing of wafers | |
| KR102744025B1 (en) | Plating apparatus | |
| EP3287549A1 (en) | Segmented anode | |
| TWI838038B (en) | Coating equipment | |
| TWI821884B (en) | Electroplating devices and methods of manufacturing package structure | |
| KR20020071720A (en) | A plating device and a method for manufacturing of semiconductor device | |
| TWI884924B (en) | Fluid generator, deposition device and material deposition method | |
| JP6127726B2 (en) | Plating equipment | |
| JPS6241320B2 (en) |