TWI865091B - Semiconductor device and installation method thereof - Google Patents

Abstract

The invention discloses a semiconductor device and installation method thereof. An inspection component is arranged on the side of a circuit structure of the semiconductor device, and therefore when a thermal head presses the semiconductor device down to a substrate, a height of the semiconductor device relative to the substrate can be detected, and the thermal head can be controlled to raise or press the semiconductor device for a predetermined distance. In this way, the height can be adjusted instantly while the thermal head presseing process is in progress to improve product accuracy and simplify the process.

Description

Semiconductor module and its setting method

The present invention relates to a semiconductor connection technology, in particular to a semiconductor module and its installation method.

With the evolution of semiconductor technology, semiconductor products have developed different packaging product types. In the process of placing a semiconductor device on a substrate, the semiconductor device electrically connects the active surface of the chip to the circuit structure through a plurality of solder bumps, and a plurality of conductive elements that can be used as input/output (I/O) terminals are implanted on the other surface of the circuit structure to configure the semiconductor device on the substrate through the conductive elements.

As a method of placing the semiconductor device on the substrate, a heat press head can be used to heat and press down the semiconductor device, so that the semiconductor device is bonded to the substrate through the conductive element.

However, during this process, the conductive element will be heated and pressed down by the hot press head, causing it to melt and deform. Therefore, the height of the conductive element will change after being heated and pressed down by the hot press head, which will affect the size of the overall product. Although the height of the conductive element can be measured after the hot press process is completed to confirm whether it meets the requirements, this will prolong the product manufacturing time and consume a lot of manpower and time, increasing the manufacturing cost.

Therefore, how to overcome the above-mentioned problems of known technology has become a difficult problem that the industry needs to overcome urgently.

In view of the various deficiencies of the above-mentioned prior art, the present invention provides a semiconductor module, comprising: a circuit structure having a first side and a second side opposite to each other and sides adjacent to the first side and the second side; an electronic element disposed on the first side of the circuit structure and electrically connected to the circuit structure; a conductive element disposed on the second side of the circuit structure and electrically connected to the circuit structure; and a check element disposed on the circuit structure, and the check element is exposed on the side of the circuit structure.

The present invention further provides a method for setting a semiconductor module, comprising: providing a semiconductor module and a substrate, wherein the semiconductor module comprises a circuit structure, an electronic component, a conductive component and a check component, wherein the electronic component and the conductive component are respectively arranged on the first side and the second side opposite to the circuit structure and electrically connected to the circuit structure, and the check component is arranged on the circuit structure and exposed to the sides adjacent to the first side and the second side; moving the semiconductor module toward the substrate by a hot press; and sensing the check component by a sensor to sense the height of the semiconductor module relative to the substrate, and transmitting the sensing result to a control system.

In the aforementioned semiconductor module and its setting method, the control system transmits instructions to the hot pressing head according to the sensing result, so that the hot pressing head raises or presses the semiconductor module a predetermined distance.

In the aforementioned semiconductor module and its installation method, the check element is manufactured simultaneously with the circuit structure or the conductive element.

In the aforementioned semiconductor module and its installation method, the check element is arranged around the outside of the circuit structure.

In the aforementioned semiconductor module and its installation method, the sensor is an infrared sensor or an image capture lens sensor.

In the aforementioned semiconductor module and its installation method, the check element is made of metal material.

In the aforementioned semiconductor module and its setting method, the control system is a computer.

As can be seen from the above, the semiconductor module and its installation method of the present invention mainly configures a check element on the side of the circuit structure of the semiconductor module, so that when the hot press head presses the semiconductor module down to the substrate, the height of the semiconductor module relative to the substrate is judged by the sensing check element, and the hot press head is controlled to raise or press the semiconductor module down a predetermined distance. In this way, the height can be adjusted in real time during the hot press process, so compared with the known semiconductor device, the product accuracy can be improved and the operation process can be simplified.

1:Semiconductor module

2: Substrate

3: Hot press head

4: Sensor

5: Control system

10: Circuit structure

10a: First side

10b: Second side

10c: Side

11: Electronic components

11a: Action surface

11b: Non-active surface

110: Conductive bump

111: Base glue

12: Check components

13: Packaging layer

14: Conductive element

140:Metal column

141: Metal bump

H: Height

Figure 1 is a schematic cross-sectional view of the semiconductor module of the present invention.

Figure 2 is a schematic diagram of the semiconductor module of the present invention being arranged on a substrate.

The following is a specific and concrete example to illustrate the implementation of the present invention. People familiar with this technology can easily understand the other advantages and effects of the present invention from the content disclosed in this manual.

It should be noted that the structures, proportions, sizes, etc. depicted in the drawings attached to this manual are only used to match the contents disclosed in the manual for people familiar with this technology to understand and read, and are not used to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effect and purpose that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "one", "first" and "second" used in this specification are only for the convenience of description, and are not used to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships, without substantial changes to the technical content, should also be regarded as the scope of implementation of the present invention.

FIG1 is a schematic cross-sectional view of the semiconductor module 1 of the present invention. As shown in FIG1 , the semiconductor module 1 of the present embodiment includes: a circuit structure 10, at least one electronic component 11, a check component 12, a packaging layer 13 and a conductive component 14.

The circuit structure 10 may be a package substrate (substrate) having a core layer and a circuit portion or a circuit structure without a core layer (coreless). In the present embodiment, the circuit structure 10 includes at least one dielectric layer and a circuit layer combined with the dielectric layer, such as a fan-out type redistribution layer (RDL) specification. However, it should be understood that the circuit structure 10 may also be other carrier units for carrying chips, such as a lead frame, a wafer, a silicon interposer, or other boards with metal routing, etc., and is not limited to the above. In addition, the circuit structure 10 has a first side 10a and a second side 10b opposite to each other and a side 10c adjacent to the first side 10a and the second side 10b.

The at least one electronic component 11 is disposed on the first side 10a of the circuit structure 10 through a plurality of conductive bumps 110, and a coating layer such as a primer 111 is filled and formed between the first side 10a of the circuit structure 10 and the electronic component 11 to cover the conductive bumps 110. In this embodiment, two electronic components 11 are disposed on the circuit structure 10, but the desired type and quantity of electronic components 11 can be placed on the circuit structure 10, and are not limited to the above.

Furthermore, the electronic component 11 is an active component, a passive component or a combination of the two, and the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. In this embodiment, the electronic component 11 is a semiconductor chip, which has an active surface 11a and an inactive surface 11b opposite to each other, and the active surface 11a has a plurality of electrode pads (not shown), so that the electrode pads are flip-chip bonded and electrically connected to the circuit layer of the circuit structure 10 through a plurality of conductive bumps 110 such as solder materials.

In other embodiments, the electronic component 11 can also be electrically connected to the circuit layer of the circuit structure 10 by bonding multiple wires; or, the electronic component 11 can directly contact the circuit layer of the circuit structure 10. It should be understood that there are many ways to electrically connect the electronic component 11 to the circuit structure 10, and they are not limited to the above.

The check element 12 is disposed on the circuit structure 10, for example, on the side 10c of the circuit structure 10, so that the check element 12 can be exposed on the side 10c of the circuit structure 10, so that the sensor 4 described later can easily sense the check element 12.

In this embodiment, the check element 12 is arranged around the outer periphery of the circuit structure 10, but in other embodiments, as long as the sensor 4 can easily sense the check element 12, the check element 12 can also be arranged on only one side of the circuit structure 10, and is not limited to the above. Furthermore, the check element 12 is made of metal material or a material that can be easily identified by the sensor 4. In addition, in one embodiment, the check element 12 can be manufactured together with the circuit layer of the circuit structure 10, for example, the check element 12 can be a metal block formed around the circuit structure 10, without adding a manufacturing process.

The packaging layer 13 is formed on the first side 10a of the circuit structure 10 so that the packaging layer 13 covers the electronic component 11. In this embodiment, the packaging layer 13 exposes the inactive surface 11b of the electronic component 11, but the packaging layer 13 can also completely cover the electronic component 11 without exposing the inactive surface 11b of the electronic component 11.

In this embodiment, the packaging layer 13 is an insulating material, such as polyimide (PI), dry film, packaging glue such as epoxy, or molding compound. For example, the packaging layer 13 can be formed on the first side 10a of the circuit structure 10 by a process such as liquid compound, injection, lamination, or compression molding.

The conductive element 14 is disposed on the second side 10b of the circuit structure 10. The conductive element 14 can be a plurality of metal pillars such as copper pillars, metal bumps coated with insulating blocks, solder balls, solder balls with core copper balls (Cu core balls) or other conductive structures. In this embodiment, the conductive element 14 includes a metal pillar 140 (such as a copper pillar) and a metal bump 141 (such as a solder ball) formed on the metal pillar 140. In addition, in one embodiment, the check element 12 can also be selectively manufactured on the circuit structure 10 when manufacturing the conductive element 14, without increasing the manufacturing process.

Through the above design, the present invention can efficiently and accurately set the semiconductor module 1 on the substrate, and its setting method will be described in detail below.

FIG2 is a schematic diagram of the present invention for placing the semiconductor module 1 on the substrate 2. As shown in FIG2, the equipment for placing the semiconductor module 1 on the substrate 2 includes: a hot press head 3, a sensor 4 and a control system 5.

The heat press head 3 receives the command of the control system 5 to heat and lift the semiconductor module 1 based on the command of the control system 5. The heat press head 3 can be connected to the control system 5 by wired or wireless communication to receive the command, and the present invention has no special limitation on this.

Furthermore, the hot press head 3 can move the semiconductor module 1 by clamping or adsorption, and it has at least the function of heating and lifting the semiconductor module 1. In detail, the hot press head 3 heats the semiconductor module 1 to melt the conductive element 14, so that the semiconductor module 1 can be bonded to the substrate 2 by the melted conductive element 14. In addition, the hot press head 3 can at least move up and down in the vertical direction to press down or lift the semiconductor module 1. In other embodiments, the hot press head 3 can also be configured to be able to move left and right in the horizontal direction, so that the semiconductor module 1 can be moved from another place to the top of the substrate 2, and is not limited to the above.

The sensor 4 is an infrared sensor or an image sensor, which is disposed on the upper side of the substrate 2 to sense the check element 12 of the semiconductor module 1 located above the substrate 2 and transmit the sensing result to the control system 5. The sensor 4 can be connected to the control system 5 by wired or wireless communication to transmit the sensing result, and the present invention has no special limitation on this.

The control system 5 is a computer. The user can input relevant data into the control system 5 in advance. After receiving the sensing result from the sensor 4, the control system 5 can analyze and judge the sensing result according to the data input by the user, and then output instructions to the hot pressing head 3.

The following is a detailed description of the process of placing the semiconductor module 1 on the substrate 2. First, the semiconductor module 1 and the substrate 2 as described above are provided, and the semiconductor module 1 is placed on the substrate 2.

Furthermore, the hot press head 3 heats and presses the semiconductor module 1 from above, and the conductive element 14 of the semiconductor module 1 is melted by the heat of the hot press head 3, thereby bonding with the substrate 2. Moreover, due to the downward pressure of the hot press head 3, the melted conductive element 14 is deformed and flattened. In other words, the height H of the conductive element 14 changes according to the downward pressing distance of the hot press head 3.

Next, the sensor 4 senses the position of the check element 12, and based on the position of the check element 12, calculates the distance between the check element 12 and the substrate 2, that is, the height H of the conductive element 14. Here, the sensor 4 can transmit the position of the check element 12 as a sensing result to the control system 5, and the control system 5 calculates the height H of the conductive element 14, or the sensor 4 can also have a calculation function built in, and transmit the calculated height H of the conductive element 14 as a sensing result to the control system 5, and the present invention is not particularly limited to this.

After receiving the sensing result, the control system 5 can analyze the sensing result according to the data input by the user in advance, and output the instruction corresponding to the analysis result to the hot pressing head 3.

Specifically, when the height H of the conductive element 14 sensed is higher than the predetermined height, the control system 5 calculates the difference between the height H of the conductive element 14 sensed and the predetermined height, and outputs a command to the thermal press head 3, so that the thermal press head 3 continues to press down the semiconductor module 1 by a predetermined distance, and the predetermined distance can be set to the difference between the height H of the conductive element 14 sensed and the predetermined height.

Furthermore, when the height H of the conductive element 14 sensed is lower than a predetermined height, the control system 5 calculates the difference between the height H of the conductive element 14 sensed and the predetermined height, and outputs a command to the thermal press head 3, so that the thermal press head 3 raises the semiconductor module 1 by a predetermined distance, and the predetermined distance can be set to the difference between the height H of the conductive element 14 sensed and the predetermined height.

After the hot press head 3 presses down or raises the semiconductor module 1, the sensor 4 can sense the position of the check element 12 again and output the sensing result to the control system 5. If the control system 5 determines after analysis that the height H of the sensed conductive element 14 is still not equal to the predetermined height, the above steps are repeated. When the height H of the sensed conductive element 14 is equal to the predetermined height, the control system 5 outputs a stop command, thereby completing the processing of placing the semiconductor module 1 on the substrate 2.

By using the above-mentioned method for setting the semiconductor module 1, the bonding between the semiconductor module 1 and the substrate 2 can be efficiently and accurately controlled during the hot pressing process, so that the height H of the conductive element 14 of the semiconductor module 1 meets the predetermined height, thereby making the entire product meet the predetermined size.

In summary, the semiconductor module and its installation method of the present invention mainly configures the circuit structure of the semiconductor module with a check element, so that when the hot press head presses the semiconductor module down to the substrate, the height of the semiconductor module relative to the substrate is judged by the sensing check element, so as to control the hot press head to raise or press the semiconductor module down a predetermined distance. In this way, the height can be adjusted in real time during the hot press process, thereby improving the product accuracy and simplifying the operation process.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the attached patent application scope.

1:Semiconductor module

2: Substrate

3: Hot press head

4: Sensor

5: Control system

10: Circuit structure

10a: First side

10b: Second side

10c: Side

11: Electronic components

12: Check components

13: Packaging layer

14: Conductive element

H: Height

Claims (12)

A semiconductor module includes: a circuit structure having a first side and a second side opposite to each other and sides adjacent to the first side and the second side; an electronic element disposed on the first side of the circuit structure and electrically connected to the circuit structure; a conductive element disposed on the second side of the circuit structure and electrically connected to the circuit structure; and a check element disposed on the circuit structure and exposed on the side of the circuit structure, and the check element is used for sensing by a sensor. A semiconductor module as described in claim 1, wherein the check element is manufactured simultaneously with the circuit structure or the conductive element. A semiconductor module as described in claim 1, wherein the check element is arranged around the outside of the circuit structure. A semiconductor module as described in claim 1, wherein the verification element is sensed by an infrared sensor or an image capture lens sensor. A semiconductor module as described in claim 1, wherein the check element is made of metal material. A method for setting up a semiconductor module includes: providing a semiconductor module and a substrate, wherein the semiconductor module includes a circuit structure, an electronic component, a conductive component and a check component, wherein the electronic component and the conductive component are respectively arranged on the first side and the second side opposite to the circuit structure and electrically connected to the circuit structure, and the check component is arranged on the circuit structure and exposed to the side adjacent to the first side and the second side; Moving the semiconductor module toward the substrate by a hot press head; and sensing the check component by a sensor, and transmitting the sensing result to a control system. A method for setting up a semiconductor module as described in claim 6, wherein the control system transmits instructions to the hot pressing head based on the sensing result, so that the hot pressing head raises or presses the semiconductor module a predetermined distance. A method for setting up a semiconductor module as described in claim 6, wherein the check element is manufactured simultaneously with the circuit structure or the conductive element. A method for setting up a semiconductor module as described in claim 6, wherein the check element is arranged around the outside of the circuit structure. A method for setting up a semiconductor module as described in claim 6, wherein the sensor is an infrared sensor or an image capture lens sensor. A method for setting up a semiconductor module as described in claim 6, wherein the check element is made of metal material. A method for setting up a semiconductor module as described in claim 6, wherein the control system is a computer.

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