TWI864846B - Deposition layer removal method - Google Patents

Abstract

A deposition layer removal method includes spraying a first chemical agent on a substrate having deposited layers thereon by a spraying system, such that debris of the deposited layers is peeled off from the substrate; collecting the first chemical agent and the debris of the deposited layers to a temporary storage tank; driving the debris of the deposited layers and the first chemical agent to flow through a filter by a variable frequency pump, such that the filter absorbs the debris of the deposited layers, and the first chemical agent passes through the filter and re-enters the spray system; a flow rate of the first chemical agent passing through the filter is obtained; discharging a portion of the first chemical agent and the debris of the deposited layers in the temporary storage tank and adding a second chemical agent into the temporary storage tank when the flow rate is less than a first threshold and greater than a second threshold, such that the flow rate of the first chemical agent passing through the filter increases, in which the first chemical agent and the second chemical agent have the same compositions; and replacing the filter when the flow rate is less than the second threshold.

Description

Deposition layer removal method

The present disclosure relates to a deposited layer removal method, and more particularly to a deposited layer removal method for recycling a color filter.

During the manufacturing process of each film layer of the color filter substrate, defects such as foreign matter adhesion or residual photoresist may occur, resulting in peeling of the film layer or abnormal display in the subsequent process, resulting in a decrease in yield. Therefore, in order to avoid the above problems, the color filter substrate with surface defects will be reworked to remove the defects on the glass substrate, such as removing the color filter unit, conductive layer, light shielding layer, spacer, foreign matter or residual photoresist, and then put back into the production line or converted into a dummy glass for use in other process stages.

Currently, the common method for removing deposited layers or materials such as color filter units, conductive layers, light shielding layers, spacers, foreign matter or residual photoresist is to use a specially formulated agent to spray, so that the deposited layer is peeled off from the color filter substrate in the form of debris. In this process, the sprayed agent is circulated through a pipeline.

However, the sedimentation debris is usually recovered together with the reagents in a specific step of the process, so a filtering step is performed before the reagents re-enter the pipeline for circulation. As the degree of contamination of the filter core increases with the use time, the flow rate of the reagent re-entering the pipeline through the filter core gradually decreases. In this case, it is necessary to shut down the machine regularly to replace the filter core used for filtration, compressing the normal operation time of the machine.

Therefore, how to come up with a deposition layer removal method that can solve the above problems is one of the issues that the industry is eager to invest research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide a deposition layer removal method that can solve the above problems.

One aspect of the present disclosure is related to a deposition layer removal method, which includes spraying a first agent on a substrate having a deposition layer thereon by a spray system, so that the deposition layer debris is peeled off from the substrate. The deposition layer removal method also includes recycling the first agent and the deposition layer debris to a temporary storage tank. The deposition layer removal method also includes driving the deposition layer debris and the first agent through a filter core by a variable frequency pump, so that the filter core adsorbs the deposition layer debris, and the first agent passes through the filter core and re-enters the spray system. The deposition layer removal method also includes obtaining a flow value of the first agent passing through the filter core. The deposit layer removal method further includes discharging the deposit layer debris and a portion of the first reagent in the temporary storage tank when the flow value is less than the first threshold value and greater than the second threshold value, and adding the second reagent into the temporary storage tank, so that the flow value of the first reagent passing through the filter element increases, wherein the second reagent and the first reagent contain the same component. The deposit layer removal method further includes replacing the filter element when the flow value is less than the second threshold value.

In some embodiments, after the sedimentation layer debris and a portion of the first reagent in the temporary storage tank are discharged and the second reagent is added, the operating frequency of the variable frequency pump is reduced.

In some embodiments, a portion of the deposition layer debris and the first agent in the temporary storage tank accounts for 14.55% to 15.45% of the total amount of the deposition layer debris and the first agent in the temporary storage tank.

In some embodiments, the deposition layer removal method further includes discharging the deposition layer debris and a portion of the first agent in the temporary storage tank through a control valve and adding a second agent through an injection port of the temporary storage tank.

In some embodiments, the first agent comprises potassium hydroxide or gallium sulfide.

In some embodiments, the first agent has a temperature between 65°C and 75°C when sprayed from the spray system.

In some embodiments, the first threshold is 80 L/min and the second threshold is 50 L/min.

In some embodiments, the deposition layer removal method further includes transferring the substrate from an inlet of the chamber to an outlet of the chamber by a transfer device while spraying the first agent by a spray system.

In some embodiments, the deposition layer removal method further includes performing a mechanical friction process on the substrate during the spraying of the first chemical to scrape off the deposition layer debris from the substrate.

In some embodiments, the deposit layer removal method further includes replacing the deposit layer debris and the first agent in the temporary tank with a second agent while replacing the filter.

In summary, in the deposit removal method of some embodiments of the present disclosure, by monitoring the change in the operating frequency of the variable frequency pump and the flow rate of the reagent, when the proportion of the deposit debris contained in the reagent is too high, a part of the reagent mixed with the deposit debris is discharged in time, and a new reagent without the deposit debris is added, so as to ensure that the flow rate of the reagent entering the spray system remains substantially fixed. Compared with the common deposit removal method, the efficiency of the spray system will not be significantly deteriorated as the degree of contamination of the filter increases, and the service life of the filter can be extended, and the downtime caused by replacing the filter can be reduced.

These and other aspects of the present disclosure will become apparent from the following description of preferred embodiments in conjunction with the drawings, but variations and modifications may be made therein without departing from the spirit and scope of the novel concepts of the present disclosure.

The following disclosure will be more fully described herein through drawings and references, and some exemplary embodiments are illustrated in the drawings. The disclosure may be implemented in different forms and should not be limited by the embodiments mentioned below. However, these embodiments are provided to help a more complete understanding of the content of the disclosure and to fully convey the scope of the disclosure to those skilled in the art.

In the drawings, the thickness of layers, films, panels, regions, etc., is exaggerated for clarity. Throughout the specification, the same reference numerals will refer to similar elements throughout the text. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to another element, or intermediate elements may also exist. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intermediate elements.

It should be understood that although the terms "first", "second", "third", etc. may be used to describe various elements, components, regions, layers and/or parts in this disclosure, these elements, components, regions, and/or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, the "first element", "component", "region", "layer" or "part" discussed below can be referred to as a second element, component, region, layer or part without departing from the teachings of this disclosure.

The terms used herein are for the purpose of describing specific embodiments only and are not restrictive. As used in this disclosure, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms, including "at least one". "Or" means "and/or". As used in this disclosure, the term "and/or" includes any and all combinations of one or more of the relevant listed items. It should also be understood that when used in this specification, the terms "include" and/or "include" specify the presence and/or parts of the features, regions, wholes, steps, operations, elements, components and/or parts, but do not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components and/or combinations thereof.

The term "about", "approximately", or "substantially" as used herein includes the stated value and an average value within an acceptable deviation range of a particular value determined by a person skilled in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the term "about", "approximately", or "substantially" as used herein can select a more acceptable deviation range or standard deviation depending on the optical properties, etching properties, or other properties, and can be applied to all properties without using one standard deviation.

Unless otherwise defined, all terms (including technical and scientific terms) used in this disclosure have the same meaning as commonly understood by those skilled in the art. It will be further understood that those terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as an idealized or overly formal meaning unless expressly defined in this disclosure.

Traditional LCD panels are composed of a thin film transistor (TFT) substrate, a color filter (CF) substrate, a liquid crystal layer, and a frame adhesive. The liquid crystal layer is sandwiched between the TFT substrate and the color filter substrate through the frame adhesive.

The color filter substrate at least includes a conductive layer, a plurality of color filter units, a plurality of black matrix (BM) and a plurality of photo spacers (PS). The spacers are used to fix the distance (cell gap) between the thin film transistor substrate and the color filter substrate.

However, defects such as foreign matter adhesion or photoresist residue may occur during the manufacturing process of each film layer, causing problems such as film peeling or display abnormalities in subsequent processes, resulting in a decrease in yield.

Therefore, in order to avoid the above problems, the color filter substrate with surface defects must be reworked to remove the defects on the glass substrate, such as removing the color filter unit, conductive layer, light shielding layer, spacers, foreign matter or residual photoresist, and then put back into the production line or converted into a dummy glass for use in other process stages.

Currently, the common method for removing deposited layers or materials such as color filter units, conductive layers, light shielding layers, spacers, foreign matter or residual photoresist is to use a specially formulated agent to spray, so that the deposited layer is peeled off from the color filter substrate in the form of debris. In this process, the sprayed agent is circulated through a pipeline.

However, the sedimentation debris is usually recovered together with the reagents in a specific step of the process, so a filtering step is performed before the reagents re-enter the pipeline. As the degree of contamination of the filter element increases with the use time, the flow rate of the reagent re-entering the pipeline through the filter element gradually decreases. In this case, it is necessary to shut down the machine regularly to replace the filter element used for filtration.

In addition, the deposited layer that flows with the agent in the form of debris increases the concentration of the agent and reduces the fluidity, which in turn affects the effect of spraying the agent and peeling off the deposited layer. Therefore, it is also necessary to shut down the machine regularly to discharge some of the agents with excessively high concentrations and add new agents to reduce the concentration and improve the fluidity.

Therefore, the present disclosure aims to provide a deposit layer removal method that can extend the service life of the filter.

Although in the following paragraphs, the deposition layer removal method proposed in the present disclosure is exemplified by removing the deposition layer on the color filter substrate, it should be understood that the deposition layer removal method of the present disclosure can be applied to various processes for removing the deposition layer from the substrate without departing from the scope of the present disclosure.

Please refer to FIG. 1 , which is a schematic diagram of a color filter substrate 100 according to some embodiments of the present disclosure. As shown in FIG. 1 , the color filter substrate 100 includes a glass substrate 101 , a light shielding layer 102 , a color resist layer 103 , a transparent conductive layer 104 , and a spacer layer 105 .

As shown in FIG. 1 , the light shielding layer 102 covers the glass substrate 101. In some embodiments, the light shielding layer 102 includes a metal film or a black photoresist film. As shown in FIG. 1 , the color photoresist layer 103 is disposed above the light shielding layer 102. The color photoresist layer 103 includes a first color filter unit 103a, a second color filter unit 103b, and a third color filter unit 103c. For example, the first color filter unit 103a is a red photoresist, the second color filter unit 103b is a green photoresist, and the third color filter unit 103c is a blue photoresist.

As shown in FIG. 1 , a transparent conductive layer 104 covers the colored photoresist layer 103. In some embodiments, the transparent conductive layer 104 includes indium tin oxide (ITO) or indium zinc oxide (IZO). As shown in FIG. 1 , a spacer layer 105 is disposed above the transparent conductive layer 104. In some embodiments, the spacer layer 105 includes an acrylic resin such as polyimide (PI).

Based on the structure of the color filter substrate 100 in FIG. 1 , in the process of removing the deposited layers on the color filter substrate 100 , the spacer layer 105 , the transparent conductive layer 104 , and then the color photoresist layer 103 and the light shielding layer 102 are removed in sequence.

The chemical composition used varies according to different deposition layers. For example, in some embodiments, potassium hydroxide (KOH) is used to remove the spacer layer 105, the color photoresist layer 103, and the light shielding layer 102, wherein the light shielding layer 102 includes a black photoresist film. In some embodiments, gallium sulfide (Ga2S3) is used to remove the transparent conductive layer 104.

In these embodiments, the color filter substrate 100 first enters the first process chamber to remove the spacer layer 105, then is washed with water, then enters the second process chamber to remove the transparent conductive layer 104, then is washed with water, and finally is removed from the color photoresist layer 103 and the light shielding layer 102 in the third process chamber, and then is washed with water to check whether the formed glass substrate 101 is suitable for being put back into the production line or converted to control wafer use.

Please refer to FIG. 2, which is a schematic diagram of a machine 200 for removing a deposited layer according to some embodiments of the present disclosure. In some embodiments, the machine 200 is a color filter recycle stripper.

As shown in FIG. 2 , the machine 200 includes a spray system. The spray system includes a chamber 201. The chamber 201 includes a spray head 202, an inlet 203a, and an outlet 203b. The chamber 201 obtains the first agent L1 from the circulation pipeline 213, and sprays the first agent L1 on the color filter substrate 100 through the spray head 202. In some embodiments, the first agent L1 is sprayed on the color filter substrate 100 at high pressure. In some embodiments, the first agent L1 is in a high temperature state. For example, when the first agent L1 is sprayed from the spray head 202, the temperature of the first agent L1 is between 65°C and 75°C.

By using a reagent with a specific composition, under the condition of appropriate pressure, temperature and contact time, the deposited layer will undergo a swelling phenomenon and gradually peel off from the color filter substrate 100 to form deposited layer debris. In some embodiments, the chamber 201 further includes a tool such as a brush (not shown), which is configured to perform a mechanical friction process on the color filter substrate 100 during the spraying of the first reagent L1 to scrape off the deposited layer debris from the color filter substrate 100.

In some embodiments, the chamber 201 further includes a conveying device 204. The conveying device 204 is configured to convey the color filter substrate 100 from the inlet 203a to the outlet 203b of the chamber 201 during the spraying of the first agent L1.

As shown in FIG. 2 , in some embodiments, the sprayed first agent L1 flows to the bottom of the chamber 201 through the color filter substrate 100 and the conveying device 204 and mixes with the deposited layer debris peeled off from the color filter substrate 100 to form the first agent L2. Then, the first agent L2 is recovered to the temporary storage tank 207 through the agent recovery pipeline 205.

In some embodiments, the factory system 206 can add the second agent L3 to the temporary tank 207 through the injection port 207a of the temporary tank 207, so that the second agent L3 is mixed with the first agent L2 to adjust the concentration and composition of the agents in the temporary tank 207 and form the first agent L4. In some embodiments, the second agent L3 and the first agent L2 include the same ingredients. In some embodiments, the second agent L3 does not substantially include sedimentation layer debris.

Next, as shown in FIG. 2 , in some embodiments, the variable frequency pump 209 drives the first agent L4 with the sedimentary layer debris to flow through the filter 208. The filter 208 absorbs the sedimentary layer debris, so that the proportion of the sedimentary layer debris in the first agent L4 is reduced, forming the first agent L5.

In some embodiments, the variable frequency pump 209 is configured to increase, maintain or decrease the flow rate of the first agent L5, and form the first agent L6, which enters the circulation line 213 again. In other words, after the first agent L1 at the first time point passes through the chamber 201, the temporary tank 207, the filter 208 and the variable frequency pump 209, the first agent L6 formed enters the circulation line 213 to form the first agent L1 at the second time point.

It should be understood that the composition, flow rate and other properties of the first agent L1 at the first time point may be different from the composition, flow rate and other properties of the first agent L1 at the second time point. For example, when the filter is highly contaminated but has not been replaced, the proportion of debris in the sediment layer in the first agent L1 at the first time point is less than the proportion of debris in the sediment layer in the first agent L1 at the second time point.

In some embodiments, the buffer tank 207 has a sensor 217. The sensor 217 is configured to sense the depth of the first agent L4 in the buffer tank 207.

In some embodiments, a portion of the first agent L4 in the temporary tank 207 can be discharged as the first agent L7 through the discharge system 215. Further, the amount of the first agent L7 can be controlled by the control valve 214. In some embodiments, the control valve 214 is connected to the factory system 206 for communication.

As shown in FIG. 2 , the filter 208 is provided with a flow meter 210. The flow meter 210 can measure the flow rate of the first agent L5. The flow meter 210 is communicatively connected to a programmable logic controller (PLC) 211. The flow meter 210 transmits the flow value to the programmable logic controller 211. According to a preset flow threshold, the programmable logic controller 211 controls the inverter 212 (inverter) of the variable frequency pump 209 to adjust the operating frequency of the variable frequency pump 209, thereby increasing, maintaining or reducing the flow rate of the first agent L5 to within a preset range. In this article, the flow meter 210, the programmable logic controller 211 and the inverter 212 are collectively referred to as a flow control system. In some implementations, the flow control system is in communication with the plant management system 206. In some implementations, the plant management system 206 includes the flow control system.

Please refer to FIG. 2 and FIG. 3. FIG. 3 is a timing diagram of a method 300 for operating the machine 200 according to some embodiments of the present disclosure. As shown in FIG. 3, the method 300 begins with the circulation line executing step S302. In step S302, the circulation line provides a first agent. For example, in some embodiments, the circulation line 213 provides the first agent L1.

Next, in step S304, the spray system sprays the first reagent on the substrate to remove the deposited layer debris from the substrate. For example, as described above, the spray system sprays the first reagent L1 on the color filter substrate 100 through the spray head 202, so that the deposited layer on the color filter substrate 100 swells and is removed from the color filter substrate 100 in the form of debris.

In some embodiments, in step S304, the spray system includes a conveying device 204 configured to convey the color filter substrate 100 from the inlet 203a to the outlet 203b of the chamber 201 of the spray system. In some embodiments, the spray system further includes a tool such as a brush to physically scrape off the deposited layer debris on the color filter substrate 100 while the medicinal agent is sprayed in step S304. In some embodiments, the color filter substrate 100 stays in the chamber 201 for 300 seconds.

As shown in FIG. 3 , the spray system then performs step S306 . In step S306 , the spray system discharges the first agent and the deposited layer debris. For example, in some embodiments, the deposited layer debris and the first agent L1 merge at the bottom of the chamber 201 of the spray system to form the first agent L2, which is discharged from the agent recovery pipeline 205 .

Next, the temporary storage tank executes step S308 to receive the first reagent and the sedimentation layer debris. In this embodiment, assuming that when step S308 is executed, the reagent flow value flowing through the filter 208 is greater than the first threshold value, the flow control system temporarily does not discharge the sedimentation layer debris and the first reagent L4 in the temporary storage tank 207, and the factory system 206 temporarily does not add the second reagent L3 to the temporary storage tank 207. In this way, the temporary storage tank 207 only receives the first reagent L2 from the reagent recovery pipeline 205.

In contrast, assuming that when step S308 is executed, the reagent flow value flowing through the filter 208 is between the first threshold and the second threshold, the flow control system discharges a portion of the sedimentation layer debris and the first reagent L4 in the temporary storage tank 207, and the factory system 206 adds the second reagent L3 to the temporary storage tank 207. In this way, the temporary storage tank 207 receives the first reagent L2 from the reagent recovery pipeline 205 and receives the second reagent L3 from the injection port 207a.

Next, in step S310 , the circulation pipeline receives the first agent and the sediment layer debris. For example, in some embodiments, the first agent L4 in the temporary tank 207 is received by the circulation pipeline 216 .

The method 300 then executes step S312. In step S312, the flow control system drives the first agent and the sedimentation debris to flow through the filter core, so that the filter core absorbs the sedimentation debris. For example, in some embodiments, the flow control system drives the first agent L4 through the filter core 208 by the variable frequency pump 209, so that the filter core 208 absorbs the sedimentation debris and forms the first agent L5 with a lower viscosity.

While executing step S312, the flow control system executes step S314 to obtain the flow value of the first drug passing through the filter. For example, in some embodiments, the flow control system obtains the flow value of the first drug L5 passing through the filter 208 through the flow meter 210, and the flow meter 210 transmits the flow value of the first drug L5 to the programmable logic controller 211.

Next, the flow control system executes step S316 to determine whether the flow value is less than the second threshold. If so, the factory system executes step S318 to stop the machine operation and replace the filter. If not, the flow control system then executes step S320 to confirm whether the flow value is greater than the first threshold.

For example, in step S316, after receiving the flow value transmitted by the flow meter 210, the programmable logic controller 211 determines whether the flow value is less than the second threshold value. In some embodiments, the second threshold value is 50 L/min. In step S316, if it is confirmed that the flow value of the first agent L5 is less than 50 L/min, the programmable logic controller 211 sends a message to the factory system 206 to stop the operation of the machine 200 and replace the filter 208.

In some implementations of step S316, while replacing the filter core 208, the first agent L4 in the temporary tank 207 is replaced with the second agent L3, wherein the proportion of the debris in the sediment layer in the second agent L3 is smaller than the proportion of the debris in the sediment layer in the first agent L4.

In some implementations of step S316, the programmable logic controller 211 sends a warning signal when confirming that the flow value is less than the second threshold. For example, the programmable logic controller 211 reminds the operator to take measures through an alarm and a message.

In step S316, if it is confirmed that the flow value of the first agent L5 is greater than 50 L/min, the flow control system then executes step S320 to determine whether the flow value is greater than the first threshold value. If the flow control system determines that the flow value is greater than the first threshold value, steps S322 and S324 are executed in sequence. In step S322, the operating frequency of the variable frequency pump in the flow control system remains unchanged. In step S324, the circulation pipeline receives the first agent passing through the filter.

For example, in some embodiments, the first threshold is 80 L/min. In step S320, if the programmable logic controller 211 confirms that the flow value of the first agent L5 is greater than 80 L/min, it means that the proportion of sediment debris in the first agent L4 is relatively low, so the flow of the first agent L5 passing through the filter 208 is still above the first threshold, so step S322 can be executed, the operating frequency of the variable frequency pump 209 remains unchanged, and the first agent L5 passes through the variable frequency pump 209 to form the first agent L6 of substantially the same nature, and enters the circulation pipeline 213 in step S324 to be reused by the spray system.

In step S320, if the flow control system determines that the flow value is less than the first threshold value, then steps S326 to S332 are executed simultaneously. In step S326, the operating frequency of the variable frequency pump in the flow control system is increased, so that the flow value of the first reagent passing through the filter core increases, and then in step S328, the circulation pipeline receives the first reagent with an increased flow rate. At the same time, in step S330, the factory system provides the second reagent to the temporary storage tank, and then in step S332, the temporary storage tank discharges a portion of the sediment layer debris and the first reagent, and receives the second reagent.

For example, in some embodiments, the first threshold is 80 L/min. In step S320, if the programmable logic controller 211 confirms that the flow value of the first agent L5 is between 50 L/min and 80 L/min, it means that the proportion of sedimentary debris in the first agent L4 is relatively high, which reduces the flow of the first agent L5 passing through the filter 208. However, the degree of flow reduction at this time can be increased by increasing the operating frequency of the variable frequency pump 209 in step S326 to increase the flow value of the first agent L5, forming the first agent L6, and re-entering the spraying system through the circulation pipeline 213 in step S328 to maintain the sprayed agent flow rate fixed. For example, the operating frequency of the variable frequency pump 209 can be increased from 40 Hz to 60 Hz.

It should be understood that since the first agent L6 may include sediment debris that the filter core 208 cannot filter out, the composition and concentration of the first agent L6 may be different from those of the first agent L1 at the first time point, that is, the properties of the first agent L1 at the second time point may be different from those of the first agent L1 at the first time point.

In some embodiments, while step S326 and step S328 are being executed, the factory system 206 executes step S330 to provide the second agent L3 to the temporary storage tank 207, and then the temporary storage tank 207 executes step S332 to discharge a portion of the first agent L4 as the first agent L7 through, for example, the discharge system 215, and receives the second agent L3.

In some embodiments, the temporary storage tank 207 includes a plurality of sensors 217. The sensors 217 are in communication with the factory system 206. The sensors 217 are configured to sense the depth of the first agent L4 in the temporary storage tank 207 and transmit a sensing signal to the factory system 206 to control the amount of the second agent L3 added.

In some embodiments, the first agent L7 discharged from the temporary storage tank 207 in step S332 accounts for between 14.55% and 15.45% of the total amount of the first agent L4 in the temporary storage tank 207.

In some implementations, the PLC 211 is further configured to reduce the operating frequency of the variable frequency pump 209 after the buffer tank 207 completes step S332.

In some implementations, the method 300 further includes, after step S304, allowing the color filter substrate 100 to enter another process to remove other deposition layers on the color filter substrate 100 or to re-deposit another deposition layer.

Please refer to FIG. 4, which is a schematic diagram of the relationship between the contamination level of the filter and the use time according to some embodiments of the present disclosure. As shown in FIG. 4, the double-point long dashed line represents the trend of the contamination level of the filter over time under normal circumstances. Assuming that the filter 208 needs to be stopped and replaced when the contamination level Vmax is reached (approximately equal to the time when the flow rate drops to the second threshold value), the time T at this time is regarded as the service life of the filter.

However, as shown by the double-dot long dashed line in FIG. 4 , during this period of time T, the filtering effect of the filter core 208 is optimal when the filter core 208 is brand new and when the filter core 208 reaches the contamination level V1. When the contamination level of the filter core 208 exceeds the contamination level V1, the accumulation rate of the contamination will increase rapidly, causing the flow rate of the reagent passing through the filter core 208 to drop sharply.

Therefore, in some embodiments of the present disclosure, the flow rate when the filter 208 reaches the contamination level V1 can be set as the first threshold value, so that when the filter 208 reaches the contamination level V1, the flow control system starts to adjust the flow rate, and at the same time, a part of the reagent is discharged from the temporary tank 207 and a new reagent without sedimentation layer debris is added to reduce the proportion of sedimentation layer debris in the reagent in the temporary tank 207. Under ideal conditions, since the proportion of sedimentation layer debris in the reagent is reduced, the speed of increasing the contamination level of the filter can be slowed down, so that the trend is as shown by the thin solid line in Figure 4, and the service life of the filter can be increased to, for example, time 2.8T. However, in some embodiments, the filter life is only increased to, for example, 1.4T because the sediment debris is attached to the wall of the temporary tank 207, the circulation pipe 216, or the circulation pipe 213, so that the sediment debris still accumulates in the flow channel.

From the above detailed description of the specific implementation methods of the present disclosure, it can be clearly seen that in the deposit layer removal method of some implementation methods of the present disclosure, by monitoring the operating frequency of the variable frequency pump and detecting the change of the agent flow rate, when the proportion of the deposit layer debris contained in the agent is too high, part of the agent mixed with the deposit layer debris is discharged in time, and new agent without the deposit layer debris is added, so as to ensure that the agent flow rate entering the spray system remains substantially fixed. Compared with the common deposit removal method, the efficiency of the spray system will not deteriorate significantly as the degree of filter contamination increases, and it can extend the service life of the filter and reduce the downtime caused by filter replacement.

The foregoing description is only provided to illustrate and describe the exemplary embodiments of the present disclosure, and is not intended to limit the precise form of the invention disclosed by the present disclosure. The above teachings may be modified or varied.

The embodiments selected and described are used to explain the content of the present disclosure and their practical applications to inspire those skilled in the art to utilize the present disclosure and various embodiments and make various modifications to meet the specific intended use. Alternative embodiments will be obvious to those skilled in the art without departing from the spirit and scope of the present disclosure. Therefore, the scope of the present disclosure is determined according to the scope of the attached invention application, rather than being limited by the above specification and the exemplary embodiments described therein.

100: Color filter substrate 101: Glass substrate 102: Shading layer 103: Color photoresist layer 103a: First color filter unit 103b: Second color filter unit 103c: Third color filter unit 104: Transparent conductive layer 105: Spacer layer 200: Machine 201: Chamber 202: Shower head 203a: Inlet 203b: Outlet 204: Conveying device 205: Reagent recovery pipeline 206: Factory system 207: Temporary storage tank 207a: Injection port 208: Filter core 209: Variable frequency pump 210: Flow meter 211: Programmable logic controller 212: Inverter 213,216: Circulation pipeline 214: Control valve 215: Emission system 217: Sensor 300: Method L1,L2,L4,L5,L6,L7: First agent L3: Second agent S302,S304,S306,S308,S310,S312,S314,S316,S318,S320,S322,S324,S326,S328,S330,S332: Steps V1,Vmax: Pollution level

The drawings illustrate one or more embodiments of the present disclosure and are used together with the written description to explain the principles of the present disclosure. In all drawings, the same figure labels are used to refer to similar or identical elements of the embodiments as much as possible, wherein: FIG. 1 is a schematic diagram of a color filter substrate according to some embodiments of the present disclosure. FIG. 2 is a schematic diagram of a machine for removing a deposited layer according to some embodiments of the present disclosure. FIG. 3 is a timing diagram of a method for operating a machine according to some embodiments of the present disclosure. FIG. 4 is a schematic diagram of the relationship between the degree of contamination of the filter core and the use time according to some embodiments of the present disclosure.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

300:Methods

S302, S304, S306, S308, S310, S312, S314, S316, S318, S320, S322, S324, S326, S328, S330, S332: Steps

Claims (10)

A deposition layer removal method comprises: spraying a first agent on a substrate having a deposition layer thereon by a spray system, so that a plurality of deposition layer debris are peeled off from the substrate; recovering the first agent and the deposition layer debris to a temporary storage tank; driving the deposition layer debris and the first agent through a filter core by a variable frequency pump, so that the filter core absorbs the deposition layer debris, and the first agent passes through the filter core and re-enters the spray system; obtaining a flow value of the first agent passing through the filter core ; When the flow value is less than a first threshold value and greater than a second threshold value, the operating frequency of the variable frequency pump increases, so that the flow value of the first agent passing through the filter element increases, and the sedimentation layer debris and a portion of the first agent in the temporary storage tank are discharged, and a second agent is added to the temporary storage tank, wherein the second agent and the first agent contain the same ingredients; after the second agent is added, the operating frequency of the variable frequency pump decreases; and when the flow value is less than the second threshold value, the filter element is replaced. The deposit layer removal method as described in claim 1, wherein the portion accounts for 14.55% to 15.45% of the total amount of the deposit layer debris and the first reagent in the temporary storage tank. The deposit removal method as described in claim 1 further comprises discharging the deposit debris and the portion of the first agent in the temporary storage tank through a control valve and adding the second agent through an injection port of the temporary storage tank. A deposit layer removal method as described in claim 1, wherein the first reagent comprises potassium hydroxide or gallium sulfide. A deposit layer removal method as described in claim 1, wherein the first agent has a temperature between 65°C and 75°C when sprayed from the spray system. A deposit removal method as described in claim 1, wherein the first threshold is 80 L/min and the second threshold is 50 L/min. The deposition layer removal method as described in claim 1 further includes transferring the substrate from an inlet of a chamber to an outlet of the chamber by a transfer device while spraying the first agent by the spray system. The deposition layer removal method as described in claim 1 further includes performing a mechanical friction process on the substrate during the spraying of the first agent to scrape the deposition layer debris off the substrate. The deposit layer removal method as described in claim 1 also includes replacing the deposit layer debris and the first agent in the temporary tank with a second agent while replacing the filter core. The deposit layer removal method as described in claim 1 further includes replacing the deposit layer debris and the first agent in the temporary tank with a second agent while replacing the filter core.

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