TWI864238B - Dresser Plate - Google Patents

Abstract

[Topic] Provide a dresser plate that can prevent particles from scattering. [Solution] The dresser plate of the present invention is a dresser plate used for dressing a cutting blade, and comprises: a dressing layer, which includes abrasive grains fixed by a binder and has a first surface and a second surface; and a scattering prevention film, which is provided on the first surface side and the second surface side of the dressing layer to prevent particles from scattering from the dressing layer.

Description

Dresser Plate

The present invention relates to a dresser plate for dressing a cutting blade for cutting a workpiece.

By dividing a wafer on which multiple IC (Integrated Circuit), LSI (Large Scale Integration) and other components are formed, multiple component chips each having a component are manufactured. In addition, after multiple component chips are mounted on a predetermined substrate, the mounted component chips are covered with a sealing material (molding resin) made of resin to obtain a package substrate. By dividing the package substrate, a package element having multiple packaged component chips is manufactured. Component chips or package elements are mounted on various electronic devices such as mobile phones and personal computers.

When the above-mentioned workpieces such as wafers and package substrates are divided, a cutting device is used which has: a holding platform for holding the workpiece and a mandrel (rotating axis) on which a ring-shaped cutting blade for cutting the workpiece is installed. The cutting blade installed on the mandrel is rotated and cuts into the workpiece held by the holding platform, thereby cutting and dividing the workpiece.

When a workpiece is processed by a cutting blade, a trimming process is performed to intentionally wear the tip of the cutting blade for the purpose of correcting the shape of the cutting blade or ensuring the sharpness of the cutting blade. For example, the trimming process is performed by holding a member (dresser plate) for trimming the cutting blade by a holding platform of a cutting device and causing the cutting blade to cut into the dresser plate (see Patent Document 1).

The cutting blade is composed of: abrasive grains and a binder material for fixing the abrasive grains. When trimming is performed, the binder material contacts the trimmer plate and wears, the shape of the cutting blade is adjusted to be concentric with the spindle (forming a perfect circle), and the abrasive grains are appropriately exposed from the binder material (filing). By using a cutting blade trimmed as shown above, the processing accuracy of the workpiece is improved. [Prior technical literature] [Patent literature]

[Patent Document 1] Japanese Patent Application Publication No. 2000-49120

(Invent the problem you want to solve)

The dresser plate has a property that particles (particles, dust, etc.) are easily generated. Specifically, the dresser plate is composed of abrasive grains that come into contact with the cutting blade to wear the cutting blade, and a binder that fixes the abrasive grains. Then, a part of the abrasive grains or the binder may separate from the dresser plate and become particles.

For example, when the dresser plate is shipped, if a collision is applied to the dresser plate, or the dresser plates collide with each other, abrasive particles may fall off the surface of the dresser plate, or part of the binder may be peeled off from the uneven surface of the dresser plate caused by the falling of abrasive particles. At this time, the abrasive particles or part of the binder separated from the dresser plate become fine particles and adhere to the surface of the dresser plate.

If there are particles on the surface of the dresser plate, the particles will fly when the dresser plate is transported to the cutting device for trimming the cutting blade, thereby causing the inside of the cutting device or the clean room where the cutting device is installed to be contaminated.

The present invention is made in view of this problem, and aims to provide a trimmer plate that can prevent the scattering of particles. (Technical means for solving the problem)

According to one aspect of the present invention, a dresser plate is provided, which is a dresser plate used for dressing a cutting tool, and comprises: a dressing layer, which includes abrasive particles fixed by a binder and has a first surface and a second surface; and a scattering prevention film, which is arranged on the first surface side and the second surface side of the dressing layer to prevent particles from scattering from the dressing layer.

Among them, it is preferred that the anti-scattering film is a water-insoluble resin film. (Effect of the invention)

A dresser plate according to one aspect of the present invention is provided with scattering prevention films respectively disposed on the first and second surfaces of the dresser layer, thereby preventing particles from scattering from the dresser layer and suppressing contamination of a cutting device, a clean room, etc.

The following describes the embodiment of the present invention with reference to the attached drawings. First, the configuration example of the trimmer plate of the present embodiment is described. The trimmer plate of the present embodiment is used to trim a cutting blade for cutting a workpiece. The cutting blade is a processing tool that cuts into the workpiece to cut the workpiece, and is formed by fixing abrasive grains with a binder (joining material).

As an example of a workpiece cut by a cutter, for example, a silicon wafer having components such as ICs and LSIs in a plurality of regions divided by a plurality of predetermined division lines (streets) arranged in a grid pattern is cited. The silicon wafer is cut by a cutter and divided along the predetermined division lines to manufacture a plurality of component chips each having a component.

However, there is no restriction on the material, shape, structure, and size of the workpiece processed by the cutting blade. For example, the workpiece may be a wafer of any shape and size made of semiconductors other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resins, metals, etc. In addition, there is no restriction on the type, quantity, shape, structure, size, and configuration of the components formed on the workpiece, and the workpiece may not have any components formed thereon. In addition, the workpiece may be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate.

When machining a workpiece with a cutting tool, first, the cutting tool is trimmed. Trimming is performed by rotating the cutting tool mounted on the spindle and cutting the tip of the cutting tool into the trimmer plate. As a result, the bonding material and the trimmer plate contact and wear the tip of the cutting tool, and the shape of the cutting tool is trimmed to be concentric with the spindle (forming a perfect circle), and the abrasive grains are appropriately exposed from the bonding material (filing).

Fig. 1(A) is a perspective view of a dresser plate 11, and Fig. 1(B) is a cross-sectional view of the dresser plate 11. The dresser plate 11 is a plate-shaped member for dressing a cutting blade, and has a dressing layer 13.

The trimming layer 13 is a plate-shaped component that is, for example, rectangular in plan view, and has: a surface (first surface) 13a and a back surface (second surface) 13b that are approximately parallel to each other, and a side surface (peripheral surface) 13c connected to the surface 13a and the back surface 13b. The trimming layer 13 includes: abrasive grains, and a binder (bonding material) for fixing the abrasive grains. For example, the trimming layer 13 is formed by fixing abrasive grains made of green silicon carbide (GC, Green Carborundum), white corundum (WA), etc. with a binder such as resin bonding or vitrified bond.

However, the materials of the abrasive grains and the binder contained in the dressing layer 13 are not limited, and they can be appropriately selected according to the material, thickness, diameter, etc. of the cutting blade to be dressed. In addition, the content and particle size of the abrasive grains contained in the dressing layer 13 are also not limited. For example, the abrasive grains are contained in the dressing layer 13 at a weight ratio of 55% to 65%. In addition, the average particle size of the abrasive grains is, for example, 0.1 μm to 50 μm.

There is no limitation on the method for forming the trimming layer 13. For example, the trimming layer 13 can be formed by impregnating abrasive grains with a resin such as a phenolic resin or an epoxy resin, forming the resin into a plate shape, and then firing the plate at a predetermined temperature (eg, 150°C to 200°C).

Here, the conditioning layer 13 has a property of easily generating fine particles (fine particles, dust, etc.). Specifically, a part of the abrasive grains or binder included in the conditioning layer 13 may be separated from the conditioning layer 13 and become fine particles.

For example, when the dresser plate 11 is shipped, if an impact is applied to the dresser plate 11, or the dresser plates 11 collide with each other, abrasive particles may fall off from the surface 13a side or the back side 13b side of the dresser layer 13, or a part of the binder may be peeled off starting from the unevenness generated on the surface 13a or the back side 13b of the dresser layer 13 due to the abrasive particles falling off. At this time, the abrasive particles or a part of the binder separated from the dresser layer 13 become fine particles and adhere to the surface 13a side or the back side 13b side of the dresser layer 13.

If particles exist on the surface 13a or the back surface 13b of the trimming layer 13, the particles will fly when the dresser plate 11 is transported to the cutting device for trimming the cutting blade, thereby contaminating the inside of the cutting device or the clean room where the cutting device is installed.

Therefore, in the dresser plate 11 of this embodiment, a scattering prevention film 15 for preventing scattering of particles is provided on the surface 13a and the back surface 13b of the dressing layer 13. Thus, particles are prevented from scattering from the surface 13a and the back surface 13b of the dressing layer 13, and contamination of the cutting device or the clean room is suppressed.

As shown in Fig. 1 (A) and Fig. 1 (B), the dresser plate 11 includes: a scattering prevention film 15 (scattering prevention film 15A) provided on the surface 13a side of the trimming layer 13, and a scattering prevention film 15 (scattering prevention film 15B) provided on the back side 13b of the trimming layer 13. The scattering prevention film 15A is formed to cover the entire surface 13a of the trimming layer 13, and the scattering prevention film 15B is formed to cover the entire back side 13b of the trimming layer 13.

For example, the anti-scattering film 15A and the anti-scattering film 15B are formed in a rectangular shape in a plan view corresponding to the shapes of the front surface 13a and the back surface 13b of the trimming layer 13, respectively. However, the shapes of the anti-scattering films 15A and 15B are not limited and are appropriately set according to the shape of the trimming layer 13.

The material of the anti-scattering film 15 is not limited as long as the anti-scattering film 15 can prevent particles from scattering from the trimming layer 13 and the anti-scattering film 15 can be cut by a cutter to be trimmed. For example, an organic film (resin film, etc.) or an inorganic film (silicon oxide film, silicon nitride film, metal film, glass film, etc.) can be used as the anti-scattering film 15.

As shown in FIG. 1(A) and FIG. 1(B), if the scattering prevention films 15A and 15B are provided on the trimming layer 13, even if particles are generated on the surface 13a side or the back surface 13b side of the trimming layer 13, the particles are sandwiched and sealed between the trimming layer 13 and the scattering prevention films 15A and 15B. In this way, the particles can be prevented from scattering around the dresser plate 11. For example, even if a part of the abrasive grains or binder included in the trimming layer 13 is separated from the trimming layer 13 to generate powdered particles, the scattering prevention films 15A and 15B prevent the particles from scattering.

In addition, the scattering prevention film 15 is composed of a film that does not contain abrasive particles. Therefore, in the scattering prevention film 15, there is no situation where particles are generated due to the falling of abrasive particles or the film peeling off starting from the unevenness generated by the falling of abrasive particles. Therefore, there is no situation where the particles scattering from the scattering prevention film 15 cause contamination of the cutting device or the clean room to cause problems.

As described later, when the trimmer plate 11 is used to trim the cutting blade, a cutting fluid such as pure water is supplied to the trimmer plate 11. Therefore, the anti-scattering film 15 is preferably water-insoluble. For example, a water-insoluble resin film made of a resin such as polystyrene, polyethylene, acrylic acid, phenolic, or epoxy is used as the anti-scattering film 15.

If the scattering prevention film 15 is a water-insoluble resin film, even if the trimming is performed by the cutter blade, the scattering prevention film 15 remains on the surface 13a and the back surface 13b of the trimming layer 13. Therefore, when the dresser plate 11 is transported again after the trimming by the cutter blade, the scattering of particles is also prevented.

The film forming method of the anti-scattering film 15 can be appropriately selected according to the material of the anti-scattering film 15. For example, a film formed by a dry process such as evaporation, sputtering, CVD (Chemical Vapor Deposition), or a wet process such as coating, spin coating, spray coating, and immersion can be used to form the anti-scattering film 15 on the surface 13a side and the back side 13b side of the trimming layer 13. The anti-scattering film 15 can also be directly formed on the surface 13a side and the back side 13b side of the trimming layer 13, or can be formed separately from the trimming layer 13 and then attached to the trimming layer 13.

The trimmer plate 11 is used to trim the cutter blade. When trimming the cutter blade, the trimmer plate 11 is first supported by a ring-shaped frame. FIG. 2 is a perspective view showing the trimmer plate 11 supported by the frame 19.

A circular tape 17 is attached to the back side (the anti-scattering film 15B side) of the dresser plate 11. The tape 17 has a diameter that can cover the entire back side of the dresser plate 11, and the dresser plate 11 is attached to the center of the tape 17.

The structure and material of the tape 17 are not limited. For example, the tape 17 is a sheet-like member having a circular base material and an adhesive layer (paste layer) provided on the base material. The base material is made of resins such as polyolefin, polyvinyl chloride, polyethylene terephthalate, etc., and the adhesive layer is made of epoxy, acrylic, or rubber adhesives. In addition, the adhesive layer can also be a UV-curing resin that is cured by irradiating ultraviolet rays.

The outer periphery of the tape 17 is adhered to a ring-shaped frame 19 made of metal or the like and having a circular opening 19a in the center. The diameter of the opening 19a is larger than the diameter of the circumscribed circle of the dresser plate 11, and the dresser plate 11 is arranged inside the opening 19a. When the tape 17 is adhered to the dresser plate 11 and the frame 19, the dresser plate 11 is supported by the frame 19 through the tape 17.

The trimming of the cutting blade is performed by cutting the cutting blade into the trimmer plate 11 supported by the frame 19. A cutting device is used for trimming the cutting blade. FIG. 3 is a perspective view showing the cutting device 2.

The cutting device 2 is provided with a holding platform (suction cup platform) 4 for holding a workpiece or a dresser plate 11. The upper surface of the holding platform 4 is formed to be substantially parallel to the X-axis direction (processing feed direction, first horizontal direction) and the Y-axis direction (grading feed direction, second horizontal direction), and constitutes a holding surface 4a (refer to FIG. 4 ) for holding the workpiece or the dresser plate 11. The holding surface 4a is connected to a suction source (not shown) such as an ejector through a suction path (not shown) and a valve (not shown) formed inside the holding platform 4.

A plurality of clamps (not shown) for holding and fixing the frame 19 supporting the dresser plate 11 are provided around the holding platform 4. In addition, the holding platform 4 is connected to a ball screw type moving mechanism (not shown) for moving the holding platform 4 along the X-axis direction, and a rotation drive source (not shown) such as a motor for rotating the holding platform 4 around a rotation axis approximately parallel to the Z-axis direction (vertical direction, vertical direction).

A cutting unit 6 for cutting a workpiece or a dresser plate 11 is disposed above the holding table 4. The cutting unit 6 includes a cylindrical housing 8, and a cylindrical spindle (not shown) is housed in the housing 8 in a state arranged substantially parallel to the Y-axis direction.

The front end (one end) of the spindle is exposed outside the housing 8, and an annular cutter 10 is installed at the front end. In addition, a rotation drive source such as a motor is connected to the base end (the other end) of the spindle. The cutter 10 installed at the front end of the spindle is rotated by the power transmitted from the rotation drive source through the spindle.

As for the cutting blade 10, a hub type cutting blade is used, which is formed by an annular base made of metal or the like and an annular cutting blade formed along the outer periphery of the base. The cutting blade of the hub type cutting blade is formed by an electrocast grindstone, and the electrocast grindstone is fixed with abrasive grains made of diamond or the like by a bonding material such as a nickel coating. In addition, as for the cutting blade 10, a washer type cutting blade can also be used, which is formed by an annular cutting blade with abrasive grains fixed by a bonding material made of metal, ceramics, resin or the like.

If the cutting blade 10 is installed at the front end of the spindle, the cutting blade 10 is covered by a blade cover 12 fixed to the housing 8. The blade cover 12 has: a connection portion 14 connected to a pipe (not shown) for supplying cutting fluid such as pure water; and a pair of nozzles 16 connected to the connection portion 14 and respectively arranged on both side surfaces (front and back sides) of the cutting blade 10. The pair of nozzles 16 are respectively formed with spray ports (not shown) that open toward the cutting blade 10.

When the cutting fluid is supplied to the connection portion 14, the cutting fluid is sprayed from the nozzles of the pair of nozzles 16 toward both sides (front and back) of the cutting blade 10. The cutting fluid cools the cutting blade 10, the workpiece or the dresser plate 11 held by the holding platform 4, and washes away the debris (cutting chips) generated by the cutting process.

A ball screw type moving mechanism (not shown) is connected to the cutting unit 6 to move the cutting unit 6. The moving mechanism moves the cutting unit 6 along the Y axis direction and lifts and lowers along the Z axis direction. The position of the cutting blade 10 in the Y axis direction and the Z axis direction is controlled by the moving mechanism.

When trimming the cutter 10 using the cutting device 2, first, the trimmer plate 11 is held by the holding platform 4 of the cutting device 2. For example, the trimmer plate 11 is arranged on the holding platform 4 in such a manner that the front side (the anti-scattering film 15A side) of the trimmer plate 11 is exposed upward and the back side (the anti-scattering film 15B side, the tape 17 side) of the trimmer plate 11 faces the holding surface 4a (see FIG. 4 ) of the holding platform 4. In addition, the frame 19 that supports the trimmer plate 11 is fixed by a plurality of clamps (not shown) provided around the holding platform 4.

In this state, when the negative pressure of the suction source is applied to the holding surface 4a of the holding platform 4, the back side of the dresser board 11 is sucked by the holding platform 4 through the tape 17. Thus, the dresser board 11 is held by the holding platform 4.

Next, the cutting blade 10 is cut into the dresser plate 11, and the dresser plate 11 is cut by the cutting blade 10. By cutting into the dresser plate 11, the tip end portion (cutting edge) of the cutting blade 10 is worn, and the trimming of the cutting blade 10 is performed.

First, the holding platform 4 is rotated so that the length direction of one side of the dresser plate 11 is aligned with the X-axis direction. In addition, the positions of the holding platform 4 and the cutting unit 6 are adjusted so that the cutting blade 10 is arranged on the side of the dresser plate 11.

In addition, the position of the cutting unit 6 in the Z-axis direction is adjusted so that the front end of the cutting blade 10 cuts into the trimming layer 13 of the dresser plate 11. Specifically, the height of the cutting unit 6 is adjusted so that the lower end of the cutting blade 10 is arranged below the surface 13a of the trimming layer 13 and above the back surface 13b of the trimming layer 13.

Next, while the cutting blade 10 is rotated, the holding table 4 is moved in the X-axis direction, and the dresser plate 11 is moved relative to the cutting blade 10 (processing feed). Thus, the cutting blade 10 cuts into the dresser plate 11 at a cutting depth up to the dressing layer 13, and cuts the dresser plate 11. As a result, a linear cutting groove 11a is formed on the side of the scattering prevention film 15A of the dresser plate 11.

For example, while the cutting blade 10 is rotated in the direction indicated by arrow A, the holding platform 4 is moved in the direction indicated by arrow B. At this time, the holding platform 4 and the cutting blade 10 are relatively moved so that the moving direction of the lower end of the cutting blade 10 coincides with the moving direction of the holding platform 4. Then, the cutting blade 10 cuts from the front side (the anti-scattering film 15A side) of the dresser plate 11 toward the back side (the anti-scattering film 15B side), which is called down cutting.

Fig. 4 is a cross-sectional view showing the dresser plate 11 cut by the cutting blade 10. The cutting blade 10 cuts into the surface 13a side of the dressing layer 13 at a cutting depth reaching the dressing layer 13. Thereby, the abrasive grains included in the dressing layer 13 contact the front end portion (cutting edge) of the cutting blade 10, and the front end portion of the cutting blade 10 is worn.

When the cutting blade 10 cuts into the trimming layer 13, the scattering prevention film 15 (the scattering prevention film 15A) provided on the surface 13a side of the trimming layer 13 is also cut by the cutting blade 10 together with the trimming layer 13. However, the scattering prevention film 15 does not contain abrasive particles, and is not easily worn by the cutting blade 10. Therefore, even if the cutting blade 10 cuts the scattering prevention film 15, there is no unintended excessive wear or deformation of the cutting blade 10.

The anti-scattering film 15 is preferably formed thin so as not to hinder the trimming of the cutting blade 10 by the trimming layer 13. For example, the thickness of the anti-scattering film 15 is set to 100 μm or less.

However, the thickness of the scattering prevention film 15 is preferably such that the surface of the abrasive grains protruding from the binder on the front surface 13a and the back surface 13b of the trimming layer 13 is appropriately covered by the scattering prevention film 15. For example, the thickness of the scattering prevention film 15 is set to be 60% or more of the protrusion amount of the abrasive grains from the binder.

After that, the cutting unit 6 is moved in the Y-axis direction (step feeding), and the cutting blade 10 is further cut into the area of the trimmer plate 11 where the cutting groove 11a is not formed. Then, the same sequence is repeated until the cutting blade 10 is in the desired shape and the abrasive grains at the front end of the cutting blade 10 protrude appropriately from the bonding material. In this way, the trimming of the cutting blade 10 is completed. After that, the trimmer plate 11 is transported from the holding platform 4 to a predetermined storage location.

As described above, the dresser plate 11 of this embodiment has the scattering prevention film 15 provided on the surface 13a and the back surface 13b of the dressing layer 13. This prevents particles from scattering from the dressing layer 13, thereby suppressing contamination of the cutting device, clean room, etc.

In the above-mentioned embodiment, the scattering prevention film 15 is provided on the surface 13a side and the back side 13b side of the trimming layer 13, and the trimming plate 11 is described in a state where the side surface 13c of the trimming layer 13 is exposed (refer to FIG. 1(A) and FIG. 1(B)). However, the scattering prevention film 15 may be provided to cover the side surface 13c of the trimming layer 13 in addition to the surface 13a and the back side 13b of the trimming layer 13.

Fig. 5 is a cross-sectional view of a dresser plate 11 having a scattering prevention film 15 covering the surface 13a, the back surface 13b, and the side surface 13c of the dresser layer 13. The scattering prevention film 15 covers the entire side surface 13c (four surfaces) of the dresser layer 13, thereby preventing particles from scattering from the side surface 13c of the dresser layer 13. This can more effectively suppress contamination of the cutting device 2 or the clean room due to particle scattering.

In addition, the structures, methods, etc. of the above-mentioned embodiments may be implemented with appropriate modifications as long as they do not deviate from the scope of the purpose of the present invention.

11: Dresser plate 11a: Cutting groove 13: Dressing layer 13a: Surface (1st surface) 13b: Back surface (2nd surface) 13c: Side surface (peripheral surface) 15, 15A, 15B: Anti-scattering film 17: Tape 19: Frame 19a: Opening 2: Cutting device 4: Holding platform (suction pad platform) 4a: Holding surface 6: Cutting unit 8: Housing 10: Cutting blade 12: Blade cover 14: Connection part 16: Nozzle

[Fig. 1(A)] is a perspective view of a trimmer plate, and [Fig. 1(B)] is a cross-sectional view of the trimmer plate. [Fig. 2] is a perspective view of a trimmer plate supported by a frame. [Fig. 3] is a perspective view of a cutting device. [Fig. 4] is a cross-sectional view of a trimmer plate cut by a cutting blade. [Fig. 5] is a cross-sectional view of a trimmer plate having a scattering prevention film covering the surface, back, and side of the trimming layer.

11: Dresser plate

13: Finishing layer

13a: Surface (1st side)

13b: Back side (side 2)

13c: Side surface (outer peripheral surface)

15,15A,15B: Anti-scattering film

Claims (4)

A dresser plate is a dresser plate used for dressing a cutting blade, and is characterized by: a dressing layer, which includes abrasive particles fixed by a binder and has a first surface and a second surface; and a scattering prevention film, which is configured to cover the entire first surface side and the second surface side of the dressing layer to prevent particles from scattering from the dressing layer. As in claim 1, the trimmer plate, wherein the anti-scattering film is a water-insoluble resin film. A trimmer plate as claimed in claim 1, wherein the bonding material is a resin bonding material. A trimmer plate as claimed in any one of claims 1 to 3, wherein the trimming layer has a side surface, and the anti-scattering film covers the side surface of the trimming layer.

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