TWI864072B - Measuring device, inspection method of workpiece, and display method of image data - Google Patents

Abstract

[Topic] Provide a measuring device that records the image data of the entire object to be processed, so that the processing result can be confirmed later when necessary. [Solution] A measuring device 56 that measures the object to be measured 1 after processing, and has: an object holding mechanism 58 that holds the object to be measured 1; a camera mechanism 82 that photographs the object to be measured 1 held by the object holding mechanism 58 and forms image data; a moving mechanism (X-axis moving unit 64a and Y-axis moving unit 64b) that causes the camera mechanism 82 to move relative to the object holding mechanism 58; a controller 400 that has a memory unit that stores image data; and a display screen 89 that displays image data, and the display screen 89 has: The position designated image display areas 202, 302 display the position designated images 204, 304 formed based on the image data Ra11, Ra12..., wherein the image data Ra11, Ra12... are obtained by moving the photographing mechanism 82 by utilizing a moving mechanism and sequentially photographing each small area A11, A12...; and the enlarged image display areas 206, 306 display the enlarged images 207, 307 of the designated positions of the measured objects displayed in the position designated image display areas 202, 302 and/or predetermined measurement values (average crack size U1, etc.).

Description

Measuring device, inspection method of workpiece, and display method of image data

The present invention relates to a technique for measuring and inspecting a processed object after processing.

A technique is known in which a plate-shaped wafer, which is a workpiece, is cut by a dicing blade or laser irradiation.

For example, it is known that in a cutting process using a dicing blade, a cut groove formed by cutting is photographed to perform a so-called cut mark inspection for confirming the size of a chip (a chip generated at the edge of the cut groove), the width of the cut groove (knife mark width), the cutting position, etc.

Patent document 1 discloses a technology that detects the result of pre-cutting performed before cutting by processing and inspecting the knife marks. If the inspection result is good, the wafer is cut; if it is bad, the pre-cutting is performed again.

Patent document 2 discloses a tool mark inspection method, which comprises: a shape recognition step, which uses shape recognition means to identify the position, shape, and size of the workpiece; and a tool mark inspection step, which locates the tool mark directly below the optical means based on the information obtained by shape recognition and performs tool mark inspection.

In the above-mentioned knife mark inspection, through image analysis, if the size of the chipping, the deviation of the cutting position, or the width of the cutting groove exceeds the predetermined allowable range, a warning will be issued, and the device will be stopped and inspection will be carried out. [Known technical literature] [Patent literature]

[Patent document 1] Japanese Patent Publication No. 5-326700 [Patent document 2] Japanese Patent Publication No. 7-130806

[Problem to be solved by the invention] Tool mark inspection is automatically performed at a pre-set position. If the number of tool mark inspections increases, the time required for processing increases and productivity decreases.

Furthermore, in a cutting device, since image data used for inspecting the cutter marks on the workpiece is usually deleted after the cutting of the workpiece is completed, it is impossible to analyze the processing results by referring to the image data after the cutting is completed.

Furthermore, it is desired that the image data used for tool mark inspection not only record the set partial position in the workpiece, but also record the processing results for each workpiece, so that it can be used for reference when needed in the future.

In view of the above, the present invention provides a measuring device that records the image data of the entire object being processed and can confirm the processing results when necessary.

[Technical means for solving the problem] According to one embodiment of the present invention, a measuring device is provided, which measures a measured object after processing and has: A measuring object holding mechanism, which holds the measured object; A photographing mechanism, which photographs the measured object held by the measuring object holding mechanism and forms image data; A moving mechanism, which moves the photographing mechanism relative to the measuring object holding mechanism; A controller, which has a memory for storing the image data. memory; and a display screen that displays the image data, the display screen having: a position-specified image display area that displays a position-specified image formed based on the image data, the image data being obtained by moving the camera mechanism using the moving mechanism and sequentially photographing each small area; and an enlarged image display area that displays an enlarged image of a specified position of the object to be measured displayed in the position-specified image display area, and/or a predetermined measurement value.

Furthermore, the measured object holding mechanism has a loading surface, which is composed of a transparent body constituting the holding surface, and the holding surface holds the measured object. The imaging unit has: an upper imaging unit, which photographs the upper surface of the measured object; and a lower imaging unit, which is arranged face to face with the upper imaging unit across the loading surface and photographs the lower surface of the measured object. The position-specified image display area and the enlarged image display area are respectively configured to display at least one of the following: a position-specified image, an enlarged image, and a predetermined measurement value based on image data respectively photographed by the upper imaging unit and the lower imaging unit.

In addition, a method for inspecting a workpiece comprises: a holding step, in which the workpiece holding mechanism is used to hold the workpiece; an imaging step, in which the imaging mechanism is used to photograph the workpiece held by the workpiece holding mechanism; a workpiece carrying-out step, in which after the imaging step is performed, the workpiece is carried out from the workpiece holding mechanism; and a display step, in which after the workpiece carrying-out step is performed, at least one of the following is displayed on the display screen: a position-specified image based on the image data, an enlarged image, and a predetermined measurement value.

In addition, a method for displaying image data of a measured object is a method for displaying processed image data of a measured object, which displays at least one of the following: A position-specified image, which is formed based on image data, and the image data is obtained by sequentially photographing the measured object at each small area; An enlarged image, which is an enlarged image of the measured object at a specified position of the position-specified image; A predetermined measurement value, which is measured based on the image data.

[Effect of the invention] According to the structure of the present invention, since the entire object to be processed is photographed and the image data is stored in the memory unit, the processing result of the entire object to be processed can be recorded, and the processing result can also be confirmed when necessary later.

With reference to the attached drawings, an embodiment of the present invention is described. The measuring device of the embodiment, for example, uses a workpiece (processed object) processed by a processing device as a measured object, and can simultaneously photograph and inspect the measured object from the upper surface and the lower surface.

First, the object to be measured is explained. The object to be measured is, for example, a roughly circular wafer made of Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor materials. Alternatively, the object to be measured is a substrate made of sapphire, glass, quartz, etc. In addition, the object to be measured can also be a package substrate containing multiple component chips that have been sealed with a sealing resin.

FIG. 1 schematically shows a three-dimensional view of an example of a wafer as an object to be measured 1. The front surface 1a of the object to be measured 1 is divided by a plurality of predetermined dividing lines called scribe lines 3 that intersect each other. In each area of the front surface 1a of the object to be measured 1, which is the wafer, divided by the scribe lines 3, components 5 such as IC (Integrated Circuit) and LSI (Large-Scale Integrated Circuit) are formed. If the wafer is divided along the scribe lines 3, individual component chips can be formed.

In the division of the object 1, for example, a cutting device is used, which can cut the object 1 along the cutting line 3 with a circular cutting blade. Alternatively, a laser processing device is used, which irradiates the object 1 with a laser along the cutting line 3 to perform laser processing on the object 1.

Before the object 1 to be measured is carried into a processing device such as a cutting device or a laser processing device, as shown in FIG1 , the object 1 to be measured is integrated with a ring-shaped frame 9 and an adhesive film 7 attached so as to block the opening of the frame 9 to form a frame unit 11. The object 1 to be measured 1 attached with the adhesive film 7 and mounted on the frame 9 through the adhesive film 7 is carried into the processing device in this state and processed.

FIG. 2 shows the object 1 to be measured after being processed by a processing device and divided into components 5, 5. In this example, the object 1 is shown after being cut by a blade.

In order to confirm that the object 1 to be measured is properly processed along the cutting path 3, in the measuring device of the present embodiment, the processed part of the object 1 to be measured is photographed and the object 1 to be measured is inspected. In the measuring device, for example, the position where the processing mark is formed, the shape, size, distribution, cracks (turtle cracks) of the chipping called chipping formed on the object 1 along the processing mark, etc. are investigated. In addition, the size of the component wafer formed by dividing the object 1 to be measured is confirmed. However, the use of the measuring device is not limited to this.

The following describes the present embodiment by taking the case where the object 1 to be measured is a wafer formed with a plurality of elements 5 and divided along the dicing streets 3, but the object 1 to be measured is not limited thereto. The object 1 to be measured inspected by the measuring device of the present embodiment may also be processed without using a processing device or the like.

FIG3 is a perspective view schematically showing a measuring device 56. The measuring device 56 includes a base 60 that supports the components of the measuring device 56. An opening 62 is formed on the base 60 along the X-axis direction. The measuring device 56 includes: a measurement object holding mechanism 58 that is arranged to cross the opening 62 of the base 60 and can hold the measurement object 1; and a camera mechanism 82 that can photograph the measurement object 1 held by the measurement object holding mechanism 58.

The measuring device 56 includes an X-axis moving unit 64a that can move the measured object holding mechanism 58 and the imaging mechanism 82 relatively along the X-axis direction, and a Y-axis moving unit 64b that can move the measured object holding mechanism 58 and the imaging mechanism 82 relatively along the Y-axis direction. FIG4 (A) schematically shows a three-dimensional view of the X-axis moving unit 64a and the measured object holding mechanism 58 of the measuring device 56. FIG4 (B) schematically shows a three-dimensional view of the imaging mechanism 82.

The X-axis moving unit 64a includes a guide rail 66a extending in the X-axis direction on the side of the opening 62 on the upper surface of the base 60. In addition, a guide rail 66b extending parallel to the guide rail 66a is provided on the side of the opening 62 on the opposite side of the upper surface of the base 60 to the guide rail 66a. A moving body 68a is slidably mounted on the guide rail 66a, and a moving body 68b is slidably mounted on the guide rail 66b.

A bridge-shaped support structure 74 is provided on the moving body 68a and the moving body 68b so as to span the moving bodies 68a and 68b. A nut portion (not shown) is provided at the lower end of one of the moving body 68a and the moving body 68b, and a ball screw 70 parallel to the guide rails 66a and 66b is screwed into the nut portion.

A pulse motor 72 is connected to one end of the ball screw 70. When the ball screw 70 is rotated by the pulse motor 72, the moving bodies 68a and 68b move in the X-axis direction along the guide rails 66a and 66b, and the bridge-shaped support structure 74 moves in the X-axis direction. The object holding mechanism 58 is supported by the support structure 74 at a position overlapping with the opening 62 of the base 60. The X-axis moving unit 64a can move the object holding mechanism 58 in the X-axis direction by moving the support structure 74 in the X-axis direction.

The object holding mechanism 58 has a loading portion 76 having a transparent body exposed at the top and bottom. The transparent body is formed of a material such as glass or resin. The upper surface of the transparent body is a loading surface 76a on which the object 1 to be measured is loaded through the adhesive film 7. The object holding mechanism 58 can support the object 1 to be measured loaded on the loading surface 76a.

As shown in FIG. 3 , the measuring device 56 is provided with a display screen 89 as an operation interface, which is configured as a touch panel type, and the detailed contents are as described later, and can display the inspection results of the wafer, etc.

The measuring device 56 constructed as described above can also be incorporated into a part of the processing device 2 for use as shown in FIG. 5 .

The processing device 2 is a device in which a cassette support table 6 is provided on a base table 4, and a cassette containing a frame unit 11 (FIG. 1) is placed on the cassette support table 6. The wafer removed from the cassette is held by a workpiece holding unit 14, and a moving table 12 on which the workpiece holding unit 14 is provided is moved in the X-axis direction to perform processing feeding at the positions of the processing units 32, 32.

By processing using the processing units 32 , 32 , as shown in FIG. 2 , dicing grooves 3 a are formed along the dicing streets 3 ( FIG. 1 ) in the wafer (object to be measured 1 ), and dicing is performed.

The processed wafer is cleaned by the cleaning device 40 and then transported to the placement portion 76 of the object holding mechanism 58 of the inspection unit.

In the present specification, the processing device 2 may be a laser processing device that performs laser dicing, in addition to a device that performs dicing processing on a wafer (the object to be measured 1 ).

Fig. 6 (A) schematically shows the upper surface of the object holding mechanism 58, and Fig. 6 (B) schematically shows the cross-sectional view of the object holding mechanism 58. Since the transparent body is also exposed on the back side opposite to the mounting surface 76a, the object 1 mounted on the mounting surface 76a can be observed from the lower surface side.

The object holding mechanism 58 includes a film holding portion 78 having a film suction holding surface 78b on the outer peripheral side of the placing portion 76. The film holding portion 78 includes a suction groove 78a formed on the film suction holding surface 78b. The suction groove 78a is connected to a suction source (not shown) via a suction path (not shown). The object holding mechanism 58 further includes an annular frame support portion 80 that is arranged around the film holding portion 78 and can support the frame 9 of the frame unit 11.

The frame unit 11 is placed on the object holding mechanism 58 in such a way that the frame support portion 80 overlaps with the frame 9. When the suction source is operated, the object 1 is sucked and held on the object holding mechanism 58 through the adhesive film 7. At this time, since the object holding mechanism 58 and the adhesive film 7 are attracted and the entire mounting surface 76a is in close contact with the adhesive film 7, the object 1 held on the object holding mechanism 58 will not shift during inspection.

For example, even when the object 1 is a wafer having a warp, when the object holding mechanism 58 holds the object 1, the entire mounting surface 76a is in close contact with the adhesive film 7. Therefore, the object 1 is held by the object holding mechanism 58 while being attracted and held in the state where the warp is relaxed. If the warp of the object 1 held by the object holding mechanism 58 is relaxed, the focus of the imaging unit becomes less likely to shift from the object 1 when photographing each region of the object 1 in succession, so that the object 1 can be photographed more clearly.

Next, the camera mechanism 82 is described. As shown in FIG. 3 and FIG. 4 (A), the camera mechanism 82 is supported by, for example, a door-shaped support structure 84, which is arranged on the base 60 in a manner spanning the opening 62, the X-axis moving unit 64a, and the object holding mechanism 58. The Y-axis moving unit 64b is arranged on the support structure 84, which moves the camera mechanism 82 along the Y-axis direction.

The Y-axis moving unit 64b has a pair of guide rails 86 disposed on the upper surface of the support structure 84 along the Y-axis direction. A moving body 88 supporting the camera mechanism 82 is slidably mounted on the pair of guide rails 86. A nut portion (not shown) is provided on the lower surface of the moving body 88, and a ball screw 90 parallel to the pair of guide rails 86 is screwed into the nut portion.

A pulse motor 92 is connected to one end of the ball screw 90. When the ball screw 90 is rotated by the pulse motor 92, the moving body 88 moves in the Y-axis direction along the guide rail 86, and the camera mechanism 82 moves in the Y-axis direction. The X-axis moving unit 64a and the Y-axis moving unit 64b work together to function as a moving mechanism that can move the object holding mechanism 58 and the camera mechanism 82 relative to each other in a direction parallel to the mounting surface 76a.

As shown in Fig. 3 and Fig. 4 (B), the imaging mechanism 82 includes: an upper imaging unit 106a, which is arranged above the placement portion 76 of the object holding mechanism 58; and a lower imaging unit 106b, which is arranged below the placement portion 76. Thus, the measuring device 56 is configured as a measuring device that can simultaneously observe the same position of the object 1 from both the upper surface side (front surface 1a side) and the lower surface side (back surface 1b side).

The camera mechanism 82 is further provided with a connecting portion 108 connecting the upper camera unit 106a and the lower camera unit 106b.

The upper camera unit 106a is supported by the columnar support structure 94a. A lifting mechanism 96a is provided in front of the columnar support structure 94a to lift the upper camera unit 106a. The lifting mechanism 96a has: a pair of guide rails 98a along the Z-axis direction; a moving body 100a slidably mounted on the guide rails 98a; and a ball screw 102a screwed with a nut portion provided at the rear of the moving body 100a.

The upper camera unit 106a is fixed in front of the moving body 100a. In addition, a pulse motor 104a is connected to one end of the ball screw 102a. When the ball screw 102a is rotated by the pulse motor 104a, the moving body 100a moves along the guide rail 98a in the Z-axis direction, and the upper camera unit 106a fixed to the moving body 100a moves up and down.

The upper end of the connecting portion 108 is connected to the lower end of the rear side of the supporting structure 94a, and the lower end of the connecting portion 108 is connected to the upper end of the rear side of the columnar supporting structure 94b supporting the lower camera unit 106b. A lifting mechanism 96b is provided in front of the supporting structure 94b, which is configured in the same manner as the lifting mechanism 96a provided on the supporting structure 94a.

The lifting mechanism 96b has: a pair of guide rails 98b along the Z-axis direction; a moving body 100b slidably mounted on the guide rails 98b; and a ball screw 102b screwed with a nut portion provided at the rear of the moving body 100aB. A pulse motor 104b is connected to one end of the ball screw 102b. When the pulse motor 104b rotates the ball screw 102b, the lower camera unit 106b fixed to the front of the moving body 100b is raised and lowered.

The upper imaging unit 106a faces downward and can photograph the object 1 placed on the upper surface of the object holding mechanism 58 from above. The lower imaging unit 106b faces upward and can photograph the object 1 from below through the placement portion 76 formed of a transparent body and the adhesive film 7. The upper imaging unit 106a and the lower imaging unit 106b are, for example, area scan cameras, line cameras, 3D cameras, or infrared cameras.

Next, the implementation method of photography and inspection using the imaging unit is described. FIG. 7 schematically shows a cross-sectional view of the frame unit 11 and the object holding mechanism 58 when the object 1 is held by the object holding mechanism 58. As shown in FIG. 7, when the suction source is operated, the gap between the adhesive film 7 and the mounting surface 76a is exhausted, and the adhesive film 7 and the mounting surface 76a are in close contact.

When the inspection of the object 1 is completed, the suction source is stopped, and the frame unit 11 is removed from the object holding mechanism 58. For example, fluorine resin may be applied to the mounting surface 76a to facilitate the peeling of the adhesive film 7 from the mounting surface 76a.

In Fig. 7, the upper imaging unit 106a composed of a visible light camera is used to photograph the front side of the object to be measured 1 located on the upper side. As shown in Fig. 8 (A), the imaging area of the object to be measured 1 (wafer) is divided into small areas A11, A12, ... in x rows and y columns, and each small area A11, A12, ... (front side) is photographed in sequence.

Similarly, in Fig. 7, the lower imaging unit 106b composed of an infrared camera is used to photograph the back side of the object 1 under test. Similarly, as shown in Fig. 8 (A), each small area A11, A12 ... (back side) is photographed in sequence.

The above shooting is performed by the control of the controller 400 as shown in FIG8 (B), and the image data of the front and back of each small area A11, A12, ... are sequentially stored in the memory unit 402 (storage). For example, the image of the front of the small area A11 is stored as image data Ra11, and the image of the back is stored as image data Rb11 in the memory unit 402.

The calculation unit 401 of the controller 400 reads each image data stored in the memory unit 402 into the memory 404 (RAM), and displays the position designation images 204, 304 (refer to FIG. 9) formed by arranging and combining a plurality of image data on the same plane on the display screen 89 as shown in FIG. 9. The position designation images 204, 304 (FIG. 9) are image data of each small area A11, A12, ... shown in FIG. 8 (B) that are reduced, and the reduced image data are arranged on the same plane in the order shown in FIG. 8 (A) to form one image.

FIG9 shows a display example of the display screen 89, in which a first position specifying image display area 202 is provided in the upper left section, and a position specifying image 204 on the front side is displayed. Similarly, a second position specifying image display area 302 is provided in the upper right section, and a position specifying image 304 on the back side is displayed. The position specifying images 204 and 304 shown in FIG9 are displayed when a magnification for displaying the entire object 1 is set, and the magnification at this time is set to "1x" as a default magnification.

In addition, the first position specifying image display area 202 may selectively display the position specifying images 204 and 304 of the front side and the back side, and the same is true for the second position specifying image display area 302. In addition, the left and right position specifying image display areas 202 and 302 may respectively display the position specifying images 204 and 304 of the other object to be measured, and the structures of the two objects to be measured may be compared.

In the display form of the display screen 89 shown in FIG9 , a first enlarged image display area 206 is provided below the first position designated image display area 202, and is used to display an enlarged image of an arbitrary area designated in the first position designated image display area 202. Similarly, a second enlarged image display area 306 is provided below the second position designated image display area 302, and is used to display an enlarged image of an arbitrary area designated in the second position designated image display area 302.

As shown in FIG9 , in the position designation image display area 202, 302, the enlargement designation frame 203, 303 is displayed respectively. When the enlargement designation frame 203, 303 is touched, the enlarged image 207, 307 of the position designation image 204, 304 contained in the enlargement designation frame 203, 303 is displayed in the enlarged image display area 206, 306. The enlarged image 207, 307 can be magnified by, for example, increasing the magnification according to the number of times the enlargement designation frame 203, 303 is touched, and the enlarged image 207, 307 can be magnified by 2 times each time it is touched. In the vicinity of the enlarged image display area 206, 306, the enlargement and reduction buttons 212, 312 are arranged, so that the enlargement and reduction can also be performed by the touch operation of the buttons 212, 312.

The enlarged designation frame 203, 303 can be arbitrarily moved within the position designation image display area 202, 302, and an enlarged image 207, 307 of an arbitrary position of the object to be measured can be displayed. In this case, the following configuration can also be set: in conjunction with the movement of the enlarged designation frame 203, 303, the enlarged image 207, 307 is also automatically updated and displayed.

Alternatively, the enlarged designation frame 203, 303 may be fixed, and the enlarged image 207, 307 of an arbitrary position of the object to be measured may be displayed by moving the position designation image 204, 304. In this case, the enlarged image 207, 307 may be automatically updated and displayed in conjunction with the movement of the position designation image 204, 304.

Furthermore, the size of the enlargement designation frames 203 and 303 may be configured to be enlargeable or reducible.

Furthermore, the position designation images 204 and 304 displayed in the position designation image display areas 202 and 302 in the upper stage can be displayed in an enlarged manner, as shown in the states of FIG9 to FIG10. Thus, the user can enlarge the desired enlarged portion by touching the enlargement designation frame 203 and 303 while referring to the enlarged position designation image 204 and 304, thereby achieving excellent operability.

As shown in Fig. 10, the automatically measured predetermined measurement values are displayed next to the magnified image display area 206, 306. The predetermined measurement values are, for example, the average chipping size U1 (e.g., the average value of the area of each chipping, or the average value of the distance of each chipping from the edge of the tool mark), the maximum erosion size U2 (e.g., the largest among the chippings included in the magnified image), the groove width U3 (the longitudinal width of the cutting groove displayed as the transverse direction, the transverse width of the cutting groove displayed as the longitudinal direction, also referred to as the tool mark width), etc. The calculation of each measurement item is performed by using the calculation unit 401 in the controller 400 shown in FIG. 8(B) to execute a program stored in the memory unit 402 , and the specific calculation method is not particularly limited.

Next, the content of the display method of the position designation image 204 shown in Figures 11 (A) to (D) is explained. The position designation image 204 shown in Figure 11 (D) at the bottom shows the appearance of the entire workpiece being displayed with the magnification set to 1 (default magnification). Then, by the pinch-out operation, the display magnification is increased in the order of 2T times in Figure 11 (C), 4T times in Figure 11 (D), and 8T times in Figure 11 (A), showing the appearance of the displayed image being enlarged (T in 2T times, 4T times, and 8T times is a natural number used for the convenience of explanation).

For example, the frame A in the position designation image display area 202 shown in FIG. 11 (A) is displayed in the entire range of the position designation image display area 202 in FIG. 11 (B) by zooming in. In addition, in FIG. 11 (A) to (D), the position designation image 204 displayed in the front position designation image display area 202 is described, but the same is true for the front position designation image display area 302 shown in FIG. 10 .

The position designation image 204 shown in FIG. 11 (A) is an image generated by arranging the image data Ra11 (RAW), Ra12 (RAW) ... shown on the left side on the same plane. It shows an example of forming the position designation image 204 by arranging four adjacent image data Ra11 (RAW), Ra12 (RAW), Ra21 (RAW), and Ra22 (RAW) in the position designation image display area 202. The image data Ra11 (RAW) and the like shown in FIG. 11 (A) are processed data (RAW images) that also include so-called raw data (pixel number (high resolution)) that directly maintains the number of pixels at the time of shooting.

The same is true for the other FIGS. 11(B) to (D), but the captured image data Ra11 (RAW) is reduced to form the position specifying image 204. For example, in FIG. 11(B), the image data used to create the position specifying image 204 of FIG. 11(A) is reduced to 1/4 (change in the number of pixels), and the reduced image data Ra11 (1/4) ... are arranged to form the position specifying image 204. In addition, the value in the brackets of Ra11 (1/4) indicates that the number of pixels is set to 1/4.

Similarly, in FIG. 11 (B) to FIG. 11 (C), the number of pixels is set to 1/4. FIG. 11 (D) shows the entire object being measured with the minimum number of pixels.

The so-called original data, i.e., image data Ra11 (RAW) which maintains the number of pixels at the time of shooting as shown in FIG. 11 (A) can be used when the enlarged images 207 and 307 displayed in the enlarged image display areas 206 and 306 shown in FIG. 10 are to be displayed at the highest magnification. In this way, by also storing the so-called original data, i.e., image data Ra11 (RAW) in the memory unit 402, it is possible to display a high-quality image without reducing the image quality.

As described above, the image data obtained by photographing the small areas A11, A12, ... (FIG. 8(A)) are stored in the memory unit 402 (FIG. 8(B)) as image data Ra11 (RAW), Ra12 (RAW), ... and are read as appropriate to form the position specifying image 204.

As shown in FIG. 11 (A) to (D), appropriate image data is read in accordance with the magnification of the position specifying image 204, and the number of pixels is changed (reduced) and arranged to display the position specifying image 204. For example, as shown in FIG. 11 (C), when the magnification of the position specifying image 204 is as low as 2T times, the position specifying image 204 is formed using image data Ra11 (1/16) ... whose number of pixels has been reduced to 1/16. At this time, since it is not necessary to confirm the details of the position specifying image 204, it is not inappropriate to display it as a coarse image.

Furthermore, as shown in FIG. 11(B) , when the magnification of the position specifying image 204 is increased, the position specifying image 204 is formed using image data Ra11 (1/4) . . . having a larger number of pixels.

On the other hand, as shown in FIG. 11(D) , at the lowest magnification (1x), a full map M is formed using image data whose number of pixels has been reduced, and this full map M is used as the position specifying image 204 .

In addition, in addition to reading appropriate image data and changing (reducing) the number of pixels according to the magnification of the position designation image 204, image data with a reduced number of pixels may be prepared in advance and stored in the memory unit 402 and then read out.

In this way, as shown in FIG8(B), the operation unit 401 can reduce the image data to the number of pixels corresponding to the magnification and load it into the memory 404 (RAM), thereby forming the position designated image 204 corresponding to the magnification. In this way, the usage of the memory 404 can be reduced and the display speed can also be high.

Furthermore, in the production of the position designation image 204 shown in FIG. 11 (A) to (D), in order to display it within the range of the position designation image display area 202, only the necessary image data Ra11 may be changed to an appropriate number of pixels and loaded into the memory 404 (RAM). That is, instead of loading all of the image data Ra11 used to produce the position designation image 204 of the specified magnification into the memory 404 (RAM), the position designation image 204 is produced using part of the image data Ra11.

Thus, the calculation unit 401 can load the minimum image data required to produce the position designation image 204 into the memory 404 (RAM) according to the magnification, and form the position designation image 204 required to be displayed in the position designation image display area 202. This can reduce the usage of the memory 404 and the display speed can also be high.

The present invention can be implemented as described above. That is, as shown in Fig. 1, Fig. 3, Fig. 8 (A) (B), and Fig. 9, a measuring device 56 is provided, which measures a processed object 1 and has: an object holding mechanism 58, which holds the object 1; a camera mechanism 82, which photographs the object 1 held by the object holding mechanism 58 and forms image data; a moving mechanism (X-axis moving unit 64a and Y-axis moving unit 64b), which moves the camera mechanism 82 relative to the object holding mechanism 58; a controller 400, which has a memory unit for storing image data; and a display screen 89, which displays image data. The display screen 89 has: position designated image display areas 202, 302, which display position designated images 204, 304 formed based on image data Ra11, Ra12..., which are obtained by moving the camera mechanism 82 using a moving mechanism and sequentially photographing each small area A11, A12...; and enlarged image display areas 206, 306, which display enlarged images 207, 307 of the designated position of the measured object displayed in the position designated image display areas 202, 302 and/or predetermined measurement values (average crack size U1, etc.).

In this way, since the entire object to be processed is photographed and the image data is stored in the memory unit, the processing result of the entire object to be processed can be recorded, and the processing result can be confirmed when necessary later.

4 (A) and (B) respectively show that: The object holding mechanism 58 has a mounting surface 76a, which is composed of a transparent body constituting a holding surface, and the holding surface holds the object 1 to be measured; The imaging unit 82 has: The upper imaging unit 106a, which photographs the upper surface of the object to be measured; and The lower imaging unit 106b, which is arranged to face the upper imaging unit 106a across the mounting surface 76a and photographs the upper surface of the object to be measured. Photograph the lower surface of the object being measured; The position-specified image display areas 202, 302 and the enlarged image display areas 206, 306 are respectively configured to display at least one of the following: position-specified images 204, 304, enlarged images 207, 307, and predetermined measurement values (average crack size U1, etc.) based on the image data respectively photographed by the upper imaging unit 106a and the lower imaging unit 106b.

Thereby, both the front and back sides of a plate-shaped object to be measured can be measured and observed at the same time, and the throughput of the measurement of the object to be measured can be improved.

As shown in Fig. 3 and Fig. 9, is a method for inspecting a workpiece, which uses a measuring device 56 to inspect a workpiece 1, and has: a holding step, which uses a workpiece holding mechanism 58 to hold the workpiece 1; an imaging step, which uses an imaging mechanism 82 to photograph the workpiece 1 held by the workpiece holding mechanism 58; a workpiece unloading step, which, after the imaging step, unloads the workpiece 1 from the workpiece holding mechanism 58; and a display step, which, after the workpiece unloading step, displays at least one of the following on a display screen 89: position-specified images 204, 304 based on image data, enlarged images 207, 307, predetermined measurement values (average crack size U1, etc.).

Here, in FIG3 , the object carrying out step is a step of carrying out the object 1 (frame unit 11) held in the object holding mechanism 58 from the object holding mechanism 58 to another location by a carrying out mechanism not shown in the figure. The series of measurement processes are terminated by the object carrying out step. Moreover, after the measurement is completed, the state of the object is confirmed and inspected based on various images. This inspection can be performed even after a period of time has passed after the measurement, which can be achieved by saving the image data. In this way, the so-called need to confirm the processing results when needed in the future can also be met.

Furthermore, in order to perform measurement and observation of the object to be measured afterwards, a serial number etc. for specifying the object to be measured is configured, and various image data can be read.

As shown in FIGS. 8 to 11 , a method for displaying image data of a measured object is a method for displaying image data of a processed measured object 1, which displays at least one of the following: position designated images 204, 304, which are formed based on image data Ra11, Ra12…, and the image data Ra11, Ra12… are obtained by sequentially photographing the measured object 1 at each small area A11, A12…; enlarged images 207, 307, which are enlarged images of the measured object at the designated position of the position designated images 204, 304; predetermined measurement values (average crack size U1, etc.), which are measured based on the image data Ra11, Ra12….

In this configuration, by referring to the position designation images 204 and 304 and designating a desired position, the enlarged images 207 and 307 and the predetermined measurement value can be confirmed, thereby realizing an interactive display method that is easy for the operator to operate, and measurement and observation can be performed efficiently.

1: Object to be measured 1a: Front 1b: Back 2: Processing device 3a: Cutting groove 56: Measuring device 58: Object holding mechanism 89: Display screen 106a: Upper camera unit 106b: Lower camera unit 202: First position specified image display area 203: Enlarged specified frame 303: Enlarged specified frame 204: Position specified image 206: First enlarged image display area 207: Enlarged image 302: Second position specified image display area 304: Position specified image 306: Second enlarged image display area 307: Enlarged image A11: Small area Ra11: Image data U1: Average chipping size U2: Maximum erosion size U3: Groove width

FIG. 1 is a schematic perspective view of an object to be measured. FIG. 2 is a schematic perspective view of an object to be measured divided into components. FIG. 3 is a schematic perspective view of a measuring device. FIG. 4 (A) is a schematic perspective view of a holding mechanism for an object to be measured, and FIG. 4 (B) is a schematic perspective view of a camera mechanism. FIG. 5 is a schematic perspective view of a processing device equipped with a measuring device. FIG. 6 (A) is a schematic top view of a mounting portion, and FIG. 6 (B) is a schematic cross-sectional view of the mounting portion. FIG. 7 is a cross-sectional view schematically showing the positional relationship between the holding mechanism for an object to be measured, the camera mechanism, and the object to be measured during inspection. FIG. 8 (A) is a diagram illustrating the appearance of continuously photographing an object to be measured. FIG8 (B) is a diagram for explaining the configuration of image data and a controller. FIG9 is a diagram showing an example of the configuration of a display screen (low magnification display) of a display screen. FIG10 is a diagram showing an example of the configuration of a display screen (high magnification display). FIG11 (A) to (D) are diagrams for explaining the formation of a position-specified image of a specific magnification using image data of a specific resolution and displaying it.

89: Display screen

202: The first position specifies the image display area

203: Enlarge the specified frame

204: Location specified image

206: First enlarged image display area

207: Enlarge image

212:Button

302: The second position specifies the image display area

303: Enlarge the specified frame

304: Location specified image

306: Second enlarged image display area

307: Enlarge image

312:Button

Claims (4)

A measuring device measures a processed object to be measured and comprises: an object holding mechanism for holding the object to be measured; a camera mechanism for photographing the object to be measured held by the object holding mechanism and forming image data; a moving mechanism for moving the camera mechanism relative to the object holding mechanism; a controller having a memory unit for storing the image data; and a display screen for displaying the image data, the display screen having: a position-specified image display area for displaying the image data; A position-specified image formed based on image data, the image data is obtained by using the moving mechanism to move the camera mechanism and sequentially photograph each small area; and an enlarged image display area, which displays an enlarged image of the specified position of the measured object displayed in the position-specified image display area, and/or a predetermined measurement value. The position-specified image is formed by reducing the number of pixels of the image data of each small area, arranging the image data with the reduced number of pixels on the same plane, thereby forming an image. The measuring device of claim 1, wherein the measured object holding mechanism has a loading surface, which is composed of a transparent body constituting the holding surface, the holding surface holds the measured object, the camera mechanism has: an upper camera unit, which photographs the upper surface of the measured object; and a lower camera unit, which is arranged face to face with the upper camera unit across the loading surface and photographs the lower surface of the measured object, the position-specified image display area is configured to display a position-specified image based on image data respectively photographed by the upper camera unit and the lower camera unit, and the enlarged image display area is configured to display an enlarged image of a specified position of the measured object displayed in the position-specified image display area and/or a predetermined measurement value. A method for inspecting a workpiece, which uses a measuring device as in claim 1 or 2 to inspect the workpiece, and comprises: a holding step, which uses the workpiece holding mechanism to hold the workpiece; a photographing step, which uses the photographing mechanism to photograph the workpiece held by the workpiece holding mechanism; a workpiece removal step, which removes the workpiece from the workpiece holding mechanism after the photographing step; and a display step, which displays at least one of the following on the display screen after the workpiece removal step: a position-specified image based on the image data, and an enlarged image and a predetermined measurement value. A method for displaying image data of a measured object, which is a method for displaying image data of a processed measured object, and displays a position-specified image, an enlarged image and/or a predetermined measurement value, wherein the position-specified image is formed based on image data, and the image data is obtained by sequentially photographing the measured object at each small area; the enlarged image is an enlarged image of the measured object at a specified position of the position-specified image; the predetermined measurement value is measured based on the image data, and the position-specified image is formed by reducing the number of pixels of the image data of each small area, and arranging the image data with the reduced number of pixels on the same plane, thereby forming an image.