TWI863679B - Substrate structure, electronic packakge having the same and the method of manufacture the electronic package - Google Patents

Abstract

The present invention discloses a substrate structure and an electronic package having the same. The electronic package comprises: a substrate structure, including a substrate body and a groove; and at least one electronic component; the substrate body has a first surface and a second surface, wherein the second surface is provided with at least one electrically connecting device; the groove are located on the second surface and surround the at least one electrically connecting device; and the at least one electronic component is provided on the first surface. By the implementation of the present invention, the electronic package can protect the electrically connecting device on the substrate structure by combining with a carrier through the groove to avoid damage or contamination, and strengthen the substrate structure, so that it will not be deformed during the manufacturing process and will not be damaged or defective due to deformation.

Description

Substrate structure, electronic package having the substrate structure and manufacturing method

The present invention relates to a semiconductor device, in particular to a substrate structure, an electronic package having the substrate structure, and a manufacturing method.

As various smart mobile communication devices become more popular and penetrate into the lives of the general public, consumers not only have higher and higher requirements for the performance of these mobile communication devices, but also increasingly stringent requirements for portability and manufacturing costs. However, to improve performance, it is necessary to improve the core semiconductor components, such as the computing power of the central processing unit and the capacity of the memory chip, as well as the processing speed of all these components. To improve the computing power and memory capacity of semiconductor components, the number of components must be increased. On the other hand, to improve portability, these components must be made thinner and smaller.

Under the above requirements, the thickness of the substrate used in today's semiconductor components is constantly being thinned. However, after being greatly thinned, the substrate is not only prone to warping due to various factors during the process, but these warping phenomena are also prone to causing its electrical connectors, such as solder pads, to have unnecessary accidental contact with the outside world due to the unevenness caused by the warping, and thus suffer damage such as scratches, or be contaminated by process chemicals. In addition, the warping of the substrate will also cause some other problems in the process that will eventually lead to defective products, resulting in a decrease in manufacturing yield, which is equivalent to increasing the manufacturing cost required to be shared by individual products.

Therefore, how to overcome the above-mentioned problems of known technology has become a difficult problem that the industry needs to overcome urgently.

In view of the various deficiencies of the above-mentioned prior art, the present invention provides a substrate structure, comprising: a substrate body having a first surface and a second surface opposite to each other, the second surface being provided with at least one electrical connector; and a groove, which is provided near the edge of the second surface and surrounds the at least one electrical connector.

The present invention also provides an electronic package, comprising: a substrate structure, including a substrate body and a groove; and at least one electronic component; wherein the substrate body has a first surface and a second surface opposite to each other, at least one electrical connector is provided on the second surface, the groove is located near the edge of the second surface and surrounds the at least one electrical connector, and the at least one electronic component is provided on the first surface of the substrate body.

In the aforementioned substrate structure and electronic package, a carrier is composited on the second surface to cover the second surface.

In the aforementioned substrate structure and electronic package, a bonding portion is provided on the carrier, and the bonding portion is bonded to the groove correspondingly to bond the carrier to the second surface.

The present invention also provides a method for manufacturing an electronic package, which includes: providing a substrate structure, the substrate structure including a substrate body and a groove, the substrate body having a first surface and a second surface opposite to each other, the second surface being provided with at least one electrical connector, the groove being located near the edge of the second surface and surrounding the at least one electrical connector; a carrier having a coupling portion is coupled to the groove through the coupling portion to couple the carrier to the second surface and cover the second surface; and at least one electronic component is disposed on the first surface of the substrate body.

The aforementioned method for manufacturing the electronic package further includes removing the carrier from the second surface.

The aforementioned electronic package and its manufacturing method further include disposing a conductive element on the at least one electrical connector on the second surface.

The aforementioned electronic package and its manufacturing method further include combining a heat sink with the at least one electronic component.

As can be seen from the above, the substrate structure of the present invention and the electronic package having the substrate structure can be combined with the carrier by the groove in the substrate structure, and then the carrier can protect the electrical connector in the substrate structure to prevent it from being damaged or contaminated during the manufacturing process, and can also strengthen the strength of the substrate structure so that it will not be deformed such as warping during the manufacturing process, and damage or defects caused by deformation will be avoided, thereby improving the yield rate and reducing the manufacturing cost.

1: Electronic packaging components

10: Substrate structure

11: Substrate body

11a: First surface

11b: Second surface

111: Base glue

112: Heat sink

113: Thermal conductive interface material

114: Packaging plastic

12: Groove

13: Electrical connectors

131: Conductive bump

132: Conductive element

14: Carrier

141:Joint part

141a: Bump

141b: Soft cushion

141c: concave part

141d: Soft column

20: Electronic components

Figures 1 to 4 are schematic cross-sectional views of the substrate structure of the present invention and a method for manufacturing an electronic package having the substrate structure.

Figure 1-1 is a bottom view of the substrate structure of an embodiment of the present invention.

Figure 1-2 is a cross-sectional schematic diagram of a variation of the substrate structure of an embodiment of the present invention.

The following is a specific and concrete example to illustrate the implementation of the present invention. People familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this manual.

It should be noted that the structures, proportions, sizes, etc. depicted in the drawings attached to this specification are only used to match the contents disclosed in the specification for understanding and reading by people familiar with this technology, and are not used to limit the restrictive conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "one", "first" and "second" used in this specification are only for the convenience of description, and are not used to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships, without substantial changes to the technical content, should also be regarded as the scope of implementation of the present invention.

Figures 1 to 4 are schematic cross-sectional views of the substrate structure of the present invention and a method for manufacturing an electronic package having the substrate structure.

As shown in FIG. 1 , a substrate structure 10 is provided. The substrate structure 10 includes a substrate body 11 and at least one groove 12. The substrate body 11 has a first surface 11a and a second surface 11b opposite to the first surface 11a. The groove 12 is disposed on the second surface 11b so that a carrier 14 is coupled to the second surface 11b via a coupling portion 141 disposed thereon corresponding to the groove 12 to cover the second surface 11b.

The substrate body 11 may be a package substrate with a circuit structure having a core layer or a circuit structure without a core layer. In terms of the current mainstream semiconductor component structure, the substrate body 11 usually includes at least one dielectric layer (not shown) and a circuit layer (not shown) bonded to the dielectric layer. For example, the circuit layer is formed in the form of a circuit redistribution layer (RDL). The material used to form the dielectric layer may be, for example, a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg. It should be understood that the substrate body 11 can also be other plates that can be used to carry electronic components, such as wafers, silicon interposers, glass, etc., but is not limited to the above.

The substrate body 11 has a first surface 11a and a second surface 11b opposite to the first surface 11a. A plurality of electrical connectors 13 are provided on the second surface 11b. Each electrical connector 13 can be, for example, a metal connection pad, but is not limited thereto. As shown in FIG1 , a plurality of metal connection pads are provided on the second surface 11b of the substrate body 11 in this embodiment as the electrical connectors 13. At the same time, a plurality of metal connection pads as electrical connectors 13 are also provided on the first surface 11a of the substrate body 11 in this embodiment. In addition, although the number of electrical connectors 13 on the second surface 11b and the first surface 11a is the same in the example shown in FIG1 , it can actually be different according to the design of the circuit and is not limited to the state shown in FIG1 .

Please refer to Figure 1-1, which is a top view of the bottom surface of the substrate body 11. The groove 12 is provided on the second surface 11b, adjacent to the edge of the second surface 11b, and surrounds the electrical connectors 13. Preferably, the groove 12 is annular to surround the electrical connectors 13 on the second surface 11b of the substrate body 11.

In this embodiment, a carrier 14 may be further combined on the second surface 11b of the substrate body 11 in the substrate structure 10 to cover the second surface 11b of the substrate body 11. In addition, the carrier 14 is also used to carry and support the substrate body 11 during the entire packaging process. Generally speaking, the carrier 14 is usually made of metal material, but is not limited thereto.

In the embodiment shown in FIG. 1 , the coupling portion 141 includes a bump 141a formed on the surface of the carrier 14 and a soft pad 141b sleeved on each bump 141a. In one embodiment, the bump 141a is formed integrally with the substrate body 11, and the carrier 14 is connected to the second surface 11b by correspondingly coupling the coupling portion 141 with the groove 12.

Please refer to Figures 1-2. In a modified embodiment, the coupling portion 141 of the carrier 14 can also be composed of a recess 141c formed in the substrate body 11 and a soft column 141d inserted in the recess 141c. The carrier 14 is fixed to the second surface 11b of the substrate body 11 by tightly plugging the coupling portion 141 into the corresponding groove 12.

In addition to the above materials, the coupling part 141 can be made of metal, plastic, rubber, polymer and other materials, and is coupled to the corresponding groove 12 by means of, for example, snaps, locks, or clamping. Moreover, the coupling method of the coupling part 141 and the groove 12 can usually be easily tightened or loosened, so that the coupling part 141 and the carrier 14 can be reused. In this embodiment, the coupling part 141 is made of a soft material (for example, a heat-resistant plastic soft pad), and one end of the coupling part 141 is sealed and fixed in the groove 12 by clamping. In this embodiment, the coupling portion 141 is in a ring shape around the periphery of the carrier 14 in accordance with the shape of the groove 12, which can effectively prevent foreign matter from contaminating the electrical connector 13 and prevent the substrate body 11 from being damaged.

Since the second surface 11b of the substrate body 11 in this embodiment is covered by the carrier 14, and the electrical connectors 13 located on the second surface 11b are surrounded by the joints 141 made of soft material and sealed and fixed in each groove 12, the electrical connectors 13 located on the second surface 11b of the substrate body 11 are completely isolated from the external environment. Therefore, they can be protected by the carrier 14 in the subsequent process and will not be damaged by scratches or corrosion by process chemicals.

As shown in FIG. 2 , the method for manufacturing the electronic package provided in this embodiment can place an electronic component 20 on the first surface 11a of the substrate body 11 after bonding the carrier 14 to the second surface 11b of the substrate body 11, and connect the corresponding electrical connector 13 on the first surface 11a through a plurality of conductive bumps 131 such as solder balls.

In this embodiment, the electronic component 20 can be an active component such as a semiconductor die or chip, or a passive component such as a resistor, capacitor or inductor, or a combination of one or more of the above active and/or passive components. This embodiment does not have any special restrictions on this, and it depends on the design requirements of the product.

As shown in FIG. 3 , the bottom glue 111 is filled between the bottom of the electronic component 20 and the first surface 11a of the substrate body 11, and a heat sink 112 can be bonded to the top of the electronic component 20 through a thermally conductive material such as a thermal interface material 113 (TIM), and the heat sink 112 is bonded and fixed to the periphery of the first surface 11a of the substrate body 11 through a packaging glue 114.

In this stage of the manufacturing process, since most of the glue used needs to be filled or applied in a hot melt state, various parts of the substrate structure 10 will also directly or indirectly receive different degrees of heat. However, because the substrate body 11 is fixedly bonded to the carrier 14 via the bonding portion 141, rather than simply placed on the surface of the carrier 14 without any restrictions, even if various parts may be subjected to different degrees of heat, they can be unaffected or only slightly affected by the reinforcement provided by the carrier 14, and deformation such as warping will not occur.

Then, please refer to FIG. 4 , and remove the carrier 14 from the second surface 11b. Then, a ball implantation process can be performed on the second surface 11b of the substrate body 11 to set conductive elements 132 on each electrical connector 13 on the second surface 11b, so that the electronic package 1 to be manufactured by the manufacturing method of this embodiment can be obtained.

As mentioned above, the electronic package 1 includes a substrate structure 10 and at least one electronic component 20. The substrate structure 10 includes a substrate body 11 having a first surface 11a and a second surface 11b and a groove 12 located near the edge of the second surface 11b; and at least one electrical connector 13 surrounded by the groove 12 is disposed on the second surface 11b, and the electronic component 20 is disposed on the first surface 11a.

In summary, the substrate structure 10 and the electronic package 1 having the substrate structure 10 of the present invention can be combined with the carrier 14 by the groove 12 in the substrate structure 10, and then the carrier 14 can protect the electrical connector 13 in the substrate structure 10 to prevent it from being damaged or contaminated during the manufacturing process. The rigidity of the carrier 14 can be used to reinforce the strength of the substrate structure 10, so that deformation such as warping and damage or defects caused by deformation will not occur during the manufacturing process, thereby improving the yield rate. At the same time, the carrier 14 can be reused to reduce the manufacturing cost.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the attached patent application scope.

1: Electronic packaging components

10: Substrate structure

11: Substrate body

11a: First surface

11b: Second surface

111: Base glue

112: Heat sink

113: Thermal conductive interface material

114: Packaging plastic

12: Groove

13: Electrical connectors

131: Conductive bump

132: Conductive element

20: Electronic components

Claims (10)

A substrate structure includes: a substrate body having a first surface and a second surface opposite to each other, wherein the second surface is provided with at least one electrical connector; and a groove, which is provided near the edge of the second surface and surrounds the at least one electrical connector, wherein a carrier is compositely bonded on the second surface to cover the second surface, and an integrally formed bonding portion is provided on the carrier, and the bonding portion is bonded to the groove correspondingly to bond the carrier to the second surface. An electronic package includes: a substrate structure including a substrate body and a groove, wherein the substrate body has a first surface and a second surface opposite to each other, at least one electrical connector is provided on the second surface, and the groove is located near the edge of the second surface and surrounds the at least one electrical connector, wherein a carrier is compositely bonded on the second surface to cover the second surface, and an integrally formed bonding portion is provided on the carrier, and the bonding portion is bonded to the groove correspondingly to bond the carrier to the second surface; and at least one electronic component is provided on the first surface of the substrate body. An electronic package as described in claim 2, wherein a carrier is composited on the second surface to cover the second surface. The electronic package as described in claim 3, wherein the carrier is provided with a bonding portion, and the bonding portion is bonded to the groove to bond the carrier to the second surface. The electronic package as described in claim 2 further includes a conductive element disposed on the at least one electrical connector on the second surface. The electronic package as described in claim 2 further includes a heat sink coupled to the at least one electronic component. A method for manufacturing an electronic package includes: providing a substrate structure, the substrate structure including a substrate body and a groove, the substrate body having a first surface and a second surface opposite to each other, the second surface being provided with at least one electrical connector, the groove being located near the edge of the second surface and surrounding the at least one electrical connector, wherein a carrier is compositely bonded to the second surface to cover the second surface, the carrier having an integrally formed bonding portion, and the bonding portion is bonded to the groove correspondingly to bond the carrier to the second surface; a carrier having a bonding portion is bonded to the groove correspondingly through the bonding portion to bond the carrier to the second surface and cover the second surface; and at least one electronic component is disposed on the first surface of the substrate body. The method as described in claim 7 further includes removing the carrier from the second surface. The manufacturing method as described in claim 8 further includes disposing a conductive element on at least one electrical connector on the second surface. The manufacturing method as described in claim 7 further includes combining a heat sink with the at least one electronic component.

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