TWI863654B - Wafer holding device having function of positioning wafer - Google Patents

Abstract

A wafer holding device having function of positioning wafer, configured to fix a wafer thereon and position the wafer having a positioning structure at an edge of the wafer. The wafer holding device includes a base, a holder plate, a plurality of lifting pins, a linear actuator, and a positioning member. The holder plate is disposed on the base. The holder plate includes an upper surface and a lower surface. The upper surface is provided for the wafer to be placed thereon. And the upper surface is provided with an adsorption structure for adsorbing and fixing the wafer. The lifting pins are disposed on the upper surface in a protruding manner, and each of the lifting pins is disposed on the holder plate at intervals around the holder plate with respect to a predetermined datum center on the holder plate. The linear actuator is disposed on the base, and an actuating direction of the linear actuator is parallel to the upper surface. The positioning member is configured to be driven by the linear actuator to move in the actuating direction to contact and push against the positioning structure of the wafer.

Description

Wafer carrier with wafer positioning function

The present invention relates to the carrying and positioning of wafers, and in particular to a wafer carrying device with a wafer positioning function.

The existing wafer manufacturing process continuously processes the wafer surface with multiple steps, continuously etching or stacking wafer patterns. Each step of etching or stacking must fall on the predetermined position of the same component to complete the manufacturing of the component.

The above processes are performed on different wafer chucks. When the wafer is transferred to a wafer chuck, the wafer must be positioned so that the processing performed on the wafer chuck will fall on the correct position on the wafer.

Most of the existing wafer positioning is performed by optical detection or image recognition. Generally speaking, a positioning structure or pattern is set on the wafer first. As for the positioning structure, the common practice is to set a flat edge or notch on the edge of the wafer, and use optical detection or image recognition to identify the position of the flat edge/notch, and use a rotating mechanism to rotate the wafer on the vertical axis of the wafer so that the flat edge/notch is located in the correct position.

In the above positioning method, a rotation mechanism must be set up, and the accuracy of positioning depends on the accuracy of optical detection or image recognition to identify the flat edge/notch. Not only does it make the mechanism of the wafer suction cup device complicated. High-precision identification and rotation will also increase equipment costs and the time required for positioning.

In view of the above technical problems, the present invention proposes a wafer carrier with a wafer positioning function, which can quickly position the wafer.

The present invention proposes a wafer carrier with a wafer positioning function, which is used to fix a wafer thereon and can position the wafer, and the edge of the wafer has a positioning structure. The wafer carrier includes a base, a carrier plate, a plurality of ejector pins, a linear actuator and an aligner. The carrier plate is arranged on the base. The carrier plate has an upper surface and a lower surface; the upper surface is used for the wafer to be placed thereon, and the upper surface is provided with an adsorption structure for adsorbing and fixing the wafer. The ejector pins are protrudingly arranged on the upper surface, and each ejector pin is arranged on the carrier plate at intervals around a preset reference center on the carrier plate. The linear actuator is arranged on the base, and a uniform actuation direction of the linear actuator is parallel to the upper surface. The aligner can be driven by a linear actuator and moved along the actuation direction to contact and push against the positioning structure of the wafer.

In at least one embodiment, the adsorption structure is a vacuum adsorption hole and an air guide groove connected to the vacuum adsorption hole, and the vacuum adsorption hole connects the upper surface and the lower surface.

In at least one embodiment, the wafer carrier with wafer positioning function further includes an air pump, and the vacuum adsorption hole is connected to the air pump on the lower surface.

In at least one embodiment, the wafer carrier with wafer positioning function further includes a plurality of lifting rods that can be lifted and lowered on the carrier plate; wherein the lifting rods can be lowered and buried in the carrier plate, or raised and protruded from the upper surface.

In at least one embodiment, the linear actuator is connected to the base through a bracket, and the linear actuator has at least one linear slide rail unit, a moving member, and a lead screw. The moving member is movably coupled to the at least one linear slide rail unit, and a moving direction of the moving member is parallel to the actuation direction of the linear actuator. One end of the lead screw is rotatably fixed to the bracket, and the other end passes through a hollow space of the moving member and is rotatably fixed to the moving member.

In at least one embodiment, the linear actuator also has a compression spring, which is sleeved on the lead screw, one end of the compression spring presses against the moving part, and the other end is connected to at least one linear slide rail unit.

In at least one embodiment, the linear actuator also has a compression spring, which is sleeved on the lead screw, with one end of the compression spring abutting against the moving part and the other end abutting against the bracket.

In at least one embodiment, the front end of the aligner has a positioning plane.

In at least one embodiment, the aligner is in the form of a flat plate, perpendicular to the upper surface, and extending toward a preset reference center.

In at least one embodiment, the carrier plate is further provided with a groove, which is located on the upper surface and connected to the edge of the carrier plate; the aligner and the part of the linear actuator are movably disposed in the groove.

The present invention proposes a wafer carrier with a wafer positioning function, which achieves wafer positioning through the cooperation of a positioning structure, an aligner, and an ejector pin. The positioning process does not involve the detection and identification of the wafer position/positioning structure, which greatly simplifies the complexity of the positioning mechanism. In addition, the present invention can achieve rapid positioning and easily improve the accuracy of positioning without affecting the execution rate of the positioning operation.

100: Wafer carrier

110: Base

112: Bottom

114: Side wall

120: Carrier plate

121: Slot

122: Upper surface

123: Groove

123a: Extension

124: Lower surface

126: Adsorption structure

126a: Vacuum adsorption hole

126b: air channel

128: Lifting hole

130: Top needle

132: Flat cam

132a: Outer vertex

132b: Indentation

134: Elastic parts

136:Servo motor

140: Linear actuator

142: Linear slide unit

142a: Slider

142b: Track

144: Moving parts

146: Lead screw

148:Compression spring

150: Alignment device

152: Positioning plane

160: Lifting rod

170:Fixed block

180: Bracket

190: Lifting unit

200: Wafer

212: Flat edge

214: Gap

300: Air pump

C1: Default reference center

C2: Wafer center

R1: Maximum outer contour

R2: Minimum outline

FIG1 is a top view of a wafer carrier having a wafer positioning function in the first embodiment of the present invention.

Figure 2 is a partial three-dimensional diagram of a wafer carrier having a wafer positioning function in the first embodiment of the present invention.

Figure 3 is a top view of the linear actuator in the first embodiment of the present invention, showing a partial cross section.

Figure 4 is a top view of some components in the first embodiment of the present invention.

FIG5 is a partial cross-sectional view of a wafer carrier having a wafer positioning function in the first embodiment of the present invention.

Figure 6 is a cross-sectional view of some components in the first embodiment of the present invention.

Figure 7 is a top view of some components in the first embodiment of the present invention.

Figure 8 is a cross-sectional view of some components in the first embodiment of the present invention.

Figure 9 is a top view of some components in the first embodiment of the present invention.

Figures 10 and 11 are bottom views of the carrier plate in an embodiment of the present invention, revealing a driving mechanism for the ejector pin.

Figure 12 is a schematic diagram of the maximum and minimum outer contours of the planar cam in an embodiment of the present invention.

Figure 13 is a top view of the linear actuator in the second embodiment of the present invention, showing a partial cross section.

Figure 14 is a cross-sectional view of some components in the second embodiment of the present invention.

Figure 15 is a top view of some components in the second embodiment of the present invention.

Figure 16 is a cross-sectional view of some components in the second embodiment of the present invention.

Figure 17 is a top view of some components in the second embodiment of the present invention.

Please refer to Figures 1, 2, 3 and 4, which are wafer carriers 100 with wafer positioning function in the first embodiment of the present invention. The wafer carrier 100 is used to fix a wafer 200 thereon and can position the wafer 200. The edge of the wafer 200 has a positioning structure, which can be but is not limited to a flat edge 212 (flat edge) or a notch (notch). In the first embodiment, the positioning structure is first illustrated as a flat edge 212.

As shown in FIG. 1 and FIG. 2 , the wafer carrier 100 includes a base 110, a carrier plate 120, a plurality of ejector pins 130, a linear actuator 140, and an aligner 150.

As shown in FIG. 1 and FIG. 2 , the base 110 is used as a base for the support plate 120 and the linear actuator 140, that is, the support plate 120 and the linear actuator 140 are directly or indirectly disposed on the base 110. The base 110 can be a flat plate structure, a tank structure or other types; the first embodiment uses a tank structure as an example of the base 110. As shown in the figure, the base 110 includes a bottom 112 and a side wall 114 surrounding the bottom 112.

As shown in FIG. 1 , FIG. 2 and FIG. 5 , the support plate 120 is disposed on the bottom 112 of the base 110 . The support plate 120 can be disposed on the bottom 112 through a support member so that a spacing distance is maintained between the support plate 120 and the bottom 112 for other components to be disposed between the support plate 120 and the bottom 112 .

As shown in FIG. 1 , FIG. 2 and FIG. 5 , the carrier plate 120 has an upper surface 122 and a lower surface 124. The upper surface 122 is used for placing the wafer 200 thereon. A suction structure 126 is provided on the upper surface 122. The suction structure 126 is a vacuum suction hole 126a connected to an air pump 300 and an air guide groove 126b connected to the vacuum suction hole 126a, so as to generate a negative pressure to suck the wafer 200. The vacuum suction hole 126a can be connected to the upper surface 122 and the lower surface 124, and the vacuum suction hole 126a is connected to the air pump 300 on the lower surface 124.

As shown in FIG. 1 and FIG. 5 , the carrier plate 120 also has a plurality of lifting holes 128, and the wafer carrier device 100 further includes a plurality of lifting rods 160. The lifting rods 160 pass through the lifting holes 128 from the lower surface 124 of the carrier plate 120, and are driven by a lifting unit 190 such as a hydraulic cylinder, a pneumatic cylinder or a linear motor, so that the plurality of lifting rods 160 can be lifted and lowered on the carrier plate 120. Therefore, the lifting rods 160 can be lowered and completely buried in the carrier plate 120, or raised and protruded from the upper surface 122. In addition, the edge of the upper surface 122 can also be configured as a stepped structure.

As shown in FIG. 1 , FIG. 2 and FIG. 5 , a plurality of ejector pins 130 are protrudingly disposed on the upper surface 122 of the carrier plate 120 and are matched with the edge of the wafer 200 . Each ejector pin 130 is disposed on the carrier plate 120 at intervals around a preset reference center C1 on the carrier plate 120 .

As shown in FIG. 1 , FIG. 2 and FIG. 5 , the ejector pin 130 can be movably disposed on the carrier plate 120 and protrude from the upper surface 122 of the carrier plate 120. Taking the first embodiment as an example, the carrier plate 120 further includes a plurality of slots 121, each slot 121 connecting the upper surface 122 and the lower surface 124 of the carrier plate 120, and the extension direction of each slot 121 is toward the preset reference center C1. The ejector pin 130 is fixed on a fixing block 170, and the fixing block 170 is movably disposed on the lower surface 124, and the ejector pin 130 passes through the slot 121 from the lower surface 124 and protrudes from the upper surface 122. By adjusting the position of the fixing block 170, the distance between the ejector pin 130 and the preset reference center C1 can be changed, so that multiple ejector pins 130 can be matched with wafers 200 of different diameters.

As shown in FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , the linear actuator 140 is directly or indirectly fixed to the base 110 , and the actuation direction of the linear actuator 140 is parallel to the upper surface 122 . Specifically, in the first embodiment, the linear actuator 140 is connected to the side wall 114 through a bracket 180 .

As shown in FIG3 , the linear actuator 140 of the first embodiment has two linear rail units 142, a moving member 144, a lead screw 146, and a compression spring 148. The two linear rail units 142 are arranged in parallel and connected to the bracket 180. The linear rail unit 142 has a slider 142a and a track 142b, and the slider 142a is slidably coupled to the track 142b. The moving member 144 is movably coupled to the two linear rail units 142, and a moving direction of the moving member 144 is parallel to the actuation direction of the linear actuator 140. Specifically, the interior of the moving member 144 may be a hollow space, so that the linear slide rail unit 142 is partially located in the hollow space of the moving member 144. One end of the lead screw 146 is rotatably fixed to the bracket 180, and the other end passes through the hollow space of the moving member 144 and is rotatably fixed to the moving member 144, and the lead screw 146 is located between the two linear slide rail units 142. The compression spring 148 is sleeved on the lead screw 146, one end of the compression spring 148 presses against the moving member 144, and the other end is connected to the two linear slide rail units 142, so that the elastic force of the compression spring 148 normally pushes the moving member 144 toward the carrier plate 120 to achieve forward and backward buffering and eliminate the clearance caused by tolerance in the linear slide rail unit 142. The compression spring 148 can make the moving member 144 move more smoothly, and the moving member 144 will not be jerked when moving forward and backward due to the clearance between parts. The aligner 150 is connected to the linear actuator 140 and can be driven by the linear actuator 140 to move along the actuation direction to contact and push against the positioning structure of the wafer 200. Specifically, the aligner 150 is fixed to the moving member 144, or the aligner 150 is integrally formed on the moving member 144. The front end of the aligner 150 has a positioning plane 152, which matches the flat edge 212 of the wafer 200 and is perpendicular to the actuation direction of the linear actuator 140 and the upper surface 122.

The above-mentioned linear actuator 140 is only an example, and other forms of linear actuators 140 are not excluded, such as a motor, a combination of gears and racks, or a linear motor driven by magnetic force.

It is difficult to make the aligner 150 slide on the upper surface 122 and contact the flat edge 212 of the wafer 200. The aligner 150 contacting the upper surface 122 and sliding will cause excessive friction resistance, and the aligner 150 and the upper surface 122 will maintain a spacing distance, which will cause the aligner 150 to be unable to accurately contact the flat edge 212. The aligner 150 may even be unable to contact the flat edge 212 because the spacing distance is greater than the thickness of the wafer 200.

As shown in FIG. 1 , FIG. 2 and FIG. 5 , in one or more embodiments of the present invention, the carrier plate 120 is further provided with a groove 123, which is located on the upper surface 122 and connected to the edge of the carrier plate 120. The aligner 150 and a part of the linear actuator 140 (moving member 144) are movably disposed in the groove 123.

The following describes the process of placing and positioning the wafer 200 in the first embodiment.

As shown in FIG. 5 , a plurality of lifting rods 160 first rise and protrude above the upper surface 122 of the carrier plate 120 . The wafer 200 is moved by a robot or other handling equipment and placed on the plurality of lifting rods 160 , with the flat edge 212 of the wafer 200 roughly corresponding to the aligner 150 .

As shown in FIG6 and FIG7, the lifting rod 160 then descends and is completely buried in the carrier plate 120, so that the wafer 200 is placed on the upper surface 122. The linear actuator 140 starts to operate, so that the alignment device 150 contacts the flat edge 212 of the wafer 200 with the positioning plane 152, and starts to push the wafer 200 to move and rotate horizontally on the upper surface 122.

As shown in FIG. 7 and FIG. 8 , by pushing the aligner 150, the wafer 200 moves on the upper surface 122 and contacts the ejector pin 130 with its edge. The ejector pin 130 also moves toward the preset reference center C1 to a position matching the outer diameter of the wafer 200, so that the wafer center C2 moves to coincide with the preset reference center C1. Then, the wafer 200 pushed by the aligner 150 begins to rotate so that the positioning plane 152 of the aligner 150 is attached to the flat edge 212 of the wafer 200, completing the positioning of the wafer 200.

Afterwards, the vacuum pump 300 can start to operate, so that the suction structure 126 starts to provide negative pressure to attract/fix the wafer 200.

Referring to Figures 10 and 11, a driving mechanism of a top pin 130 proposed in an embodiment of the present invention is applicable to one or more embodiments of the present invention.

Figures 10 and 11 show bottom views of the carrier plate 120. As shown in the figure, the driving mechanism of the ejector pin 130 includes a flat cam 132, a plurality of elastic members 134, and a servo motor 136.

As shown in FIG. 12 , the planar cam 132 is rotatably disposed on the lower surface 124 of the carrier plate 120, and the cam center coincides with the preset reference center C1. The planar cam 132 has a maximum outer profile R1 and a minimum outer profile R2. The diameter of the maximum outer profile R1 is greater than the diameter of the wafer 200, and the diameter of the minimum outer profile R2 is approximately equal to the diameter of the wafer 200. The planar cam 132 has a plurality of outer apex points 132a, which correspond to the ejector pins 130, respectively, and are located at the maximum outer profile R1. The planar cam 132 also has a plurality of inner concave points 132b, which correspond to the ejector pins 130, respectively, and are located at the minimum outer profile R2.

As shown in FIG. 12 , a plurality of elastic members 134 are disposed on the lower surface 124 of the carrier plate 120 , and each elastic member 134 is used to normally push the ejector pin 130 toward the preset reference center C1 and make the ejector pin 130 abut against the flat cam 132 .

As shown in FIG. 12 , the servo motor 136 is connected to the planar cam 132 so that the planar cam 132 can be relative to the carrier plate 120.

Referring to FIG. 10 and FIG. 12 , taking three ejector pins 130 as an example, the planar cam 132 has three outer apex points 132a and three inner concave points 132b, which are arranged in a staggered manner. When the wafer 200 is to be placed on the upper surface 122 of the carrier plate 120, the servo motor 136 rotates the planar cam 132 so that the three outer apex points 132a contact one ejector pin 130 respectively, so that the ejector pin 130 is pushed outward to a position corresponding to the maximum outer contour R1, so that the wafer 200 can be placed on the upper surface 122 of the carrier plate 120 without hindrance.

Referring to FIG. 11 and FIG. 12 , the servo motor 136 then drives the planar cam 132 to rotate a predetermined angle. For example, in the present embodiment, the servo motor 136 drives the planar cam 132 to rotate 60 degrees, so that the three inner concave points 132b contact the ejector pin 130. At this time, the ejector pin 130 is also pushed by the elastic member 134, and moves toward the preset reference center C1 and continues to abut against the outer contour of the planar cam 132 and contact the inner concave points 132b. At this time, the distance from the ejector pin 130 to the preset reference center C1 is roughly equal to the diameter of the wafer 200, and the wafer 200 can be positioned so that the wafer center C2 of the wafer 200 moves to coincide with the preset reference center C1.

Through the interference of the planar cam 132, multiple ejector pins 130 can be displaced synchronously to ensure that the distances from multiple ejector pins 130 to the preset reference center C1 remain consistent. In addition, the aligner 150 can start to align after the ejector pin 130 contacts the inner concave point 132b to complete the positioning of the wafer 200. The aligner 150 can also be actuated simultaneously with the ejector pin 130 to complete the positioning and alignment of the wafer 200 at the same time.

Please refer to FIG. 13 , which shows a linear actuator 140 and an aligner 150 proposed in the second embodiment of the present invention, which are applied in one or more embodiments of the present invention. The wafer 200 used in the second embodiment has a positioning structure of a notch 214.

As shown in FIG. 13 , the linear actuator 140 is directly or indirectly fixed to the base 110, and the actuation direction of the linear actuator 140 is parallel to the upper surface 122. Specifically, in the second embodiment, the linear actuator 140 is connected to the side wall 114 via a bracket 180.

As shown in FIG13 , the linear actuator 140 of the second embodiment has a linear slide rail unit 142, a moving member 144, a lead screw 146, and a compression spring 148. The linear slide rail unit 142 is connected to the bracket 180. The linear actuator 140 may also be configured with two linear slide rail units 142 symmetrically as in the first embodiment. The moving member 144 is movably coupled to the linear slide rail unit 142, and a moving direction of the moving member 144 is parallel to the actuation direction of the linear actuator 140. The linear slide rail unit 142 is partially located in the hollow space of the moving member 144. One end of the lead screw 146 is rotatably fixed to the bracket 180, and the other end passes through the hollow space of the moving member 144 and is rotatably fixed to the moving member 144. The compression spring 148 is sleeved on the lead screw 146, and one end of the compression spring 148 abuts against the moving member 144, and the other end abuts against the bracket 180, so that the elastic force of the compression spring 148 normally pushes the moving member 144 toward the supporting plate 120. Different from the first embodiment, the compression spring 148 in the second embodiment is located outside the moving member 144 and is compressed between the moving member 144 and the bracket 180.

As shown in FIG. 13 , FIG. 14 and FIG. 15 , the aligner 150 is fixed to the moving member 144 . The aligner 150 is in the shape of a flat plate, perpendicular to the upper surface 122 , and extends toward the preset reference center C1 . The front end of the aligner 150 can be configured to have a rounded corner. The front end of the aligner 150 is used to be inserted into the notch 214 matching the wafer 200 to abut against the corner of the notch 214 .

Similarly, the carrier plate 120 of the second embodiment is also provided with a groove 123, which is located on the upper surface 122 and connected to the edge of the carrier plate 120, and the groove 123 is further provided with an extension portion 123a extending toward the preset reference center C1, for the front end of the aligner 150 to be inserted and further approach the preset reference center C1.

The following describes the process of placing and positioning the wafer 200 in the second embodiment.

As shown in FIG. 14 and FIG. 15 , after the wafer 200 is placed on the upper surface 122 , the linear actuator 140 starts to operate, so that the front end of the aligner 150 is inserted into the notch 214 of the wafer, and starts to push the wafer 200 to move and rotate horizontally on the upper surface 122 .

As shown in Figures 16 and 17, by pushing the aligner 150, the wafer 200 moves on the upper surface 122 and contacts the ejector 130 with its edge, so that the wafer center C2 moves to coincide with the preset reference center C1. Then the wafer 200 starts to rotate so that the front end of the aligner 150 presses against the corner of the notch 214, completing the positioning of the wafer 200. After that, the vacuum pump 300 can start to operate, so that the suction structure 126 starts to provide negative pressure to attract/fix the wafer 200.

The present invention proposes a wafer carrier 100 with a wafer positioning function, which achieves the positioning of the wafer 200 through the cooperation of the positioning structure, the aligner 150 and the ejector pin 130. The positioning process does not involve the detection and identification of the position/positioning structure of the wafer 200, which greatly simplifies the complexity of the positioning mechanism. In addition, the present invention can achieve rapid positioning and easily improve the accuracy of positioning without affecting the execution rate of the positioning operation.

100: Wafer carrier

110: Base

112: Bottom

114: Side wall

120: Carrier plate

121: Slot

123: Groove

126: Adsorption structure

126a: Vacuum adsorption hole

126b: air channel

128: Lifting hole

130: Top needle

140: Linear actuator

142: Linear slide unit

144: Moving parts

150: Alignment device

160: Lifting rod

170:Fixed block

180: Bracket

Claims (10)

A wafer carrier with a wafer positioning function is used to fix a wafer thereon and position the wafer, and the edge of the wafer has a positioning structure, which includes: a base; a carrier plate, which is arranged on the base; wherein the carrier plate has an upper surface and a lower surface; the upper surface is used for the wafer to be placed thereon, and the upper surface is provided with an adsorption structure for adsorbing and Fix the wafer; multiple ejector pins are protrudingly disposed on the upper surface, and each of the ejector pins is disposed on the carrier plate at intervals around a preset reference center on the carrier plate; a linear actuator is disposed on the base, and a driving direction of the linear actuator is parallel to the upper surface; and an aligner can be driven by the linear actuator to move along the driving direction to contact and push against the positioning structure of the wafer. The wafer carrier with wafer positioning function as described in claim 1, wherein the adsorption structure is a vacuum adsorption hole and an air guide groove connected to the vacuum adsorption hole, and the vacuum adsorption hole is connected to the upper surface and the lower surface. The wafer carrier with wafer positioning function as described in claim 2 further includes an air pump, and the vacuum adsorption hole is connected to the air pump on the lower surface. The wafer carrier with wafer positioning function as described in claim 1 further comprises a plurality of lifting rods which can be lifted and lowered on the carrier plate; wherein the lifting rods can be lowered and buried in the carrier plate, or raised and protruded from the upper surface. A wafer carrier with a wafer positioning function as described in claim 1, wherein the linear actuator is connected to the base through a bracket, and the linear actuator has: at least one linear slide rail unit; a moving member movably coupled to the at least one linear slide rail unit, and a moving direction of the moving member is parallel to the actuation direction of the linear actuator; and a lead screw, one end of which is rotatably fixed to the bracket, and the other end of which passes through a hollow space of the moving member and is rotatably fixed to the moving member. As described in claim 5, the wafer carrier with wafer positioning function, wherein the linear actuator also has a compression spring, which is sleeved on the lead screw, one end of the compression spring presses against the moving part, and the other end is connected to the at least one linear slide rail unit. As described in claim 5, the wafer carrier with wafer positioning function, wherein the linear actuator also has a compression spring, the compression spring is sleeved on the lead screw, one end of the compression spring presses against the moving part, and the other end presses against the bracket. A wafer carrier with wafer positioning function as described in claim 1, wherein the front end of the aligner has a positioning plane. A wafer carrier with wafer positioning function as described in claim 1, wherein the aligner is in the shape of a flat plate, perpendicular to the upper surface, and extends toward the preset reference center. As described in claim 1, the wafer carrier with wafer positioning function is further provided with a groove, which is located on the upper surface and connected to the edge of the carrier; the aligner and part of the linear actuator are movably arranged in the groove.

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