[go: up one dir, main page]

TWI863241B - Drawing apparatus and drawing method - Google Patents

Drawing apparatus and drawing method Download PDF

Info

Publication number
TWI863241B
TWI863241B TW112116211A TW112116211A TWI863241B TW I863241 B TWI863241 B TW I863241B TW 112116211 A TW112116211 A TW 112116211A TW 112116211 A TW112116211 A TW 112116211A TW I863241 B TWI863241 B TW I863241B
Authority
TW
Taiwan
Prior art keywords
substrate
calibration
camera
stage
head
Prior art date
Application number
TW112116211A
Other languages
Chinese (zh)
Other versions
TW202414123A (en
Inventor
和田晃生
久野真士
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202414123A publication Critical patent/TW202414123A/en
Application granted granted Critical
Publication of TWI863241B publication Critical patent/TWI863241B/en

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019Calibration
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70283Mask effects on the imaging process
    • G03F7/70291Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7065Production of alignment light, e.g. light source, control of coherence, polarization, pulse length, wavelength
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7076Mark details, e.g. phase grating mark, temporary mark
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

On the stage 21 of the drawing apparatus 1, a substrate holding part 25 is provided to hold a substrate 9. The drawing head 41 irradiates modulated light onto the substrate 9. The scale part 52 is provided adjacent to the substrate holding part 25 in the main scanning direction on the stage 21. The calibration camera 53 captures images of the predetermined calibration pattern projected from the drawing head 41 onto the scale part 52 while the scale part 52 is positioned at the calibration position below the drawing head 41. In the drawing apparatus 1, the scale part 52 is positioned at the calibration position while the stage 21 is positioned at the loading/unloading position where the substrate 9 is loaded/unloaded to/from the substrate holding part 25. This allows the calibration of the drawing head 41 to be performed while suppressing the increase in tact time.

Description

描繪裝置以及描繪方法Drawing device and drawing method

本發明係有關於一種用以對基板照射光線並進行圖案(pattern)的描繪之技術。 [相關申請案的參照] 本申請案係主張2022年9月16日所申請的日本專利申請案JP2022-148502的優先權,將日本專利申請案JP2022-148502的全部的揭示內容援用於本申請案。 The present invention relates to a technique for irradiating a substrate with light and drawing a pattern. [Reference to related applications] This application claims priority to Japanese patent application JP2022-148502 filed on September 16, 2022, and all disclosures of Japanese patent application JP2022-148502 are incorporated herein.

以往,在對印刷基板或者半導體基板等(以下稱為「基板」)描繪圖案時利用了描繪裝置;該描繪裝置係對形成於基板上的感光材料照射經過調變的光線並掃描該光線的照射區域,藉此直接地描繪圖案。In the past, a drawing device was used to draw patterns on a printed circuit board or a semiconductor substrate (hereinafter referred to as a "substrate"). The drawing device irradiates a photosensitive material formed on the substrate with modulated light and scans the irradiated area of the light, thereby directly drawing the pattern.

在此種描繪裝置中會有下述問題:因為從開始描繪起的時間經過所伴隨之描繪頭的溫度上升以及裝置周邊的溫度變化等,來自描繪頭的光線在基板上的照射位置會變動,從而產生描繪於基板上的圖案的位置偏離。因此,在日本特開2014-197136號公報(文獻1)中提出了一種校準(calibration)方法,係預先取得溫度變化所導致的該照射位置的變動資料,並配合測定的溫度來修正該照射位置。然而,在將溫度作為指標之間接性的校準中,會有校準精密度不足之情形。In such a drawing device, there is a problem that the irradiation position of the light from the drawing head on the substrate changes due to the increase in the temperature of the drawing head and the temperature change around the device as time passes from the start of drawing, thereby causing the position of the pattern drawn on the substrate to deviate. Therefore, in Japanese Patent Publication No. 2014-197136 (Document 1), a calibration method is proposed, which is to obtain the change data of the irradiation position caused by the temperature change in advance, and correct the irradiation position in accordance with the measured temperature. However, in the indirect calibration using temperature as an indicator, there is a situation where the calibration precision is insufficient.

另一方面,亦已知有一種校準方法,係與文獻1般從溫度間接地求出照射位置的變動之情形不同,以攝影機觀察來自描繪頭的光線並直接性地求出照射位置的變動。在此種情形中,移動載置有基板的台(stage)且使攝影機位於描繪頭的鉛直下方並進行校準,結束校準後,使台朝描繪頭的鉛直下方移動並對基板進行描繪。因此,於一次的校準需要較長的時間。因此,從縮短產距時間(tact time)(亦即針對一片基板的描繪作業所花費的時間,亦稱為循環時間)的觀點來看,難以於每次結束對於一片基板的描繪時進行校準,而是在每次經過預定的描繪時間時進行校準,或者在每次結束對於兩片以上的預定片數的基板的描繪時進行校準。On the other hand, there is also a known calibration method, which is different from the case in which the change of the irradiation position is indirectly obtained from the temperature as in the literature 1, and the change of the irradiation position is directly obtained by observing the light from the drawing head with a camera. In this case, the stage on which the substrate is mounted is moved and the camera is placed directly below the lead of the drawing head to perform calibration. After the calibration is completed, the stage is moved directly below the lead of the drawing head to draw the substrate. Therefore, a long time is required for one calibration. Therefore, from the perspective of shortening the tact time (i.e., the time spent on the drawing operation for a substrate, also called the cycle time), it is difficult to perform calibration every time the drawing of a substrate is completed. Instead, calibration is performed every time a predetermined drawing time has passed, or every time the drawing of a predetermined number of substrates or more is completed.

此外,在上文所說明般的描繪裝置中,期望進一步地提升描繪位置精密度,需要增大校準的頻繁度且亦需要抑制生產性的降低。因此,要求一邊抑制產距時間的增大一邊進行描繪頭的校準。In addition, in the above-described drawing device, it is desired to further improve the drawing position accuracy, which requires increasing the frequency of calibration and suppressing the reduction of productivity. Therefore, it is required to calibrate the drawing head while suppressing the increase of the production time.

本發明係著眼於一種用以對基板照射光線並進行圖案的描繪之描繪裝置,目的在於一邊抑制產距時間的增大一邊進行描繪頭的校準。The present invention is directed to a drawing device for irradiating a substrate with light and drawing a pattern, and aims to calibrate a drawing head while suppressing an increase in the production time.

本發明的第一態樣為一種描繪裝置,係用以對基板照射光線並進行圖案的描繪,並具備:台,係設置有用以保持前述基板之基板保持部;描繪頭,係對前述基板照射經過調變的光線;主掃描機構,係將前述台於與前述基板的上表面平行的主掃描方向相對於前述描繪頭相對性地移動;刻度部,係在前述台上於前述主掃描方向中與前述基板保持部鄰接地設置;校準攝影機(calibration camera),係在前述刻度部位於前述描繪頭的下方的校準位置的狀態下,拍攝已從前述描繪頭照射至前述刻度部之預定的校準圖案;修正資訊取得部,係基於檢查圖像求出修正資訊,前述檢查圖像係包含藉由前述校準攝影機所取得的前述刻度部以及前述校準圖案,前述修正資訊係被使用於來自前述描繪頭的光線的照射位置的修正;以及描繪控制部,係基於描繪資料以及前述修正資訊來控制前述描繪頭以及前述主掃描機構,藉此一邊使前述基板於前述主掃描方向相對於前述描繪頭相對性地移動一邊使前述描繪頭執行針對前述基板的描繪。在前述台位於搬入搬出位置的狀態下,前述刻度部係位於前述校準位置,前述搬入搬出位置為用以進行前述基板相對於前述基板保持部的搬入以及搬出之位置。The first aspect of the present invention is a drawing device for irradiating light onto a substrate and drawing a pattern, and comprises: a stage provided with a substrate holding portion for holding the substrate; a drawing head for irradiating modulated light onto the substrate; a main scanning mechanism for relatively moving the stage in a main scanning direction parallel to the upper surface of the substrate relative to the drawing head; a scale portion provided on the stage adjacent to the substrate holding portion in the main scanning direction; and a calibration camera. A camera is used to photograph a predetermined calibration pattern irradiated from the drawing head to the scale portion when the scale portion is at a calibration position below the drawing head; a correction information acquisition unit is used to obtain correction information based on an inspection image, wherein the inspection image includes the scale portion and the calibration pattern acquired by the calibration camera, and the correction information is used to correct the irradiation position of the light from the drawing head; and a drawing control unit is used to control the drawing head and the main scanning mechanism based on the drawing data and the correction information, thereby causing the drawing head to perform drawing on the substrate while moving the substrate relatively to the drawing head in the main scanning direction. When the stage is located at the carrying-in and carrying-out position, the scale portion is located at the calibration position. The carrying-in and carrying-out position is a position for carrying the substrate in and out relative to the substrate holding portion.

依據本發明,能一邊抑制產距時間的增大一邊進行描繪頭的校準。According to the present invention, the drawing head can be calibrated while suppressing the increase of the production time.

本發明的第二態樣係如第一態樣所記載之描繪裝置,其中前述描繪裝置係進一步地具備:對準攝影機(alignment camera),係拍攝前述基板上的對準標記;以及對準資訊取得部,係基於藉由前述對準攝影機所取得的前述對準標記的圖像求出對準資訊,前述對準資訊係被使用於前述基板相對於前述描繪頭之相對位置的修正。前述對準攝影機係於前述主掃描方向中隔著前述描繪頭位於前述台中之與前述基板保持部相反之側,且前述台係位於前述搬入搬出位置。The second aspect of the present invention is a drawing device as described in the first aspect, wherein the drawing device further comprises: an alignment camera for photographing the alignment mark on the substrate; and an alignment information acquisition unit for obtaining alignment information based on the image of the alignment mark acquired by the alignment camera, and the alignment information is used to correct the relative position of the substrate with respect to the drawing head. The alignment camera is located on the side of the stage opposite to the substrate holding portion across the drawing head in the main scanning direction, and the stage is located at the carrying-in and carrying-out position.

本發明的第三態樣係如第二態樣所記載之描繪裝置,其中前述描繪裝置係進一步地具備:支撐部,係在前述台的上方支撐前述描繪頭。前述對準攝影機亦被前述支撐部支撐。The third aspect of the present invention is the drawing device as described in the second aspect, wherein the drawing device further comprises: a support portion for supporting the drawing head above the table. The alignment camera is also supported by the support portion.

本發明的第四態樣係如第一態樣(亦可為第一態樣至第三態樣中任一態樣)所記載之描繪裝置,其中前述刻度部為透光性刻度構件,配置於前述台的上表面。前述校準攝影機係在前述透光性刻度構件的下方安裝於前述台,用以拍攝已透過前述透光性刻度構件的前述校準圖案。於前述校準攝影機的上端部施予有低反射加工。The fourth aspect of the present invention is a drawing device as described in the first aspect (or any aspect from the first aspect to the third aspect), wherein the scale portion is a translucent scale member disposed on the upper surface of the table. The calibration camera is mounted on the table below the translucent scale member to photograph the calibration pattern that has passed through the translucent scale member. The upper end of the calibration camera is subjected to low reflection processing.

本發明的第五態樣係如第一態樣(亦可為第一態樣至第四態樣中任一態樣)所記載之描繪裝置,其中前述刻度部上的前述校準圖案的前述主掃描方向中的位置係能夠在前述台已經靜止的狀態下藉由前述描繪頭進行變更。The fifth aspect of the present invention is a drawing device as described in the first aspect (or any aspect from the first aspect to the fourth aspect), wherein the position of the calibration pattern on the scale portion in the main scanning direction can be changed by the drawing head when the stage is stationary.

本發明的第六態樣係如第一態樣(亦可為第一態樣至第五態樣中任一態樣)所記載之描繪裝置,其中前述描繪頭係具備:複數個光源,係射出彼此不同的波長的光線。在對前述基板進行描繪時,使用複數個前述光源中的兩個以上的光源。朝前述刻度部照射前述校準圖案時,僅使用複數個前述光源中的一個光源。The sixth aspect of the present invention is a drawing device as described in the first aspect (or any aspect from the first aspect to the fifth aspect), wherein the drawing head comprises: a plurality of light sources emitting light of different wavelengths. When drawing the substrate, two or more of the plurality of light sources are used. When irradiating the calibration pattern toward the scale portion, only one of the plurality of light sources is used.

本發明的第七態樣係如第一態樣(亦可為第一態樣至第六態樣中任一態樣)所記載之描繪裝置,其中包含前述描繪頭且用以分別對前述基板照射經過調變的光線之複數個描繪頭係排列於與前述基板的上表面平行且相對於前述主掃描方向呈傾斜之排列方向。前述校準攝影機係在前述刻度部位於前述校準位置的狀態下,一邊於前述排列方向移動一邊依序拍攝從複數個前述描繪頭分別照射至前述刻度部之複數個校準圖案。The seventh aspect of the present invention is a drawing device as described in the first aspect (or any aspect from the first aspect to the sixth aspect), wherein the plurality of drawing heads including the drawing heads and used to irradiate the modulated light to the substrate are arranged in an arrangement direction parallel to the upper surface of the substrate and inclined relative to the main scanning direction. The calibration camera moves in the arrangement direction while sequentially photographing the plurality of calibration patterns irradiated to the scale portion from the plurality of drawing heads when the scale portion is at the calibration position.

本發明的第八態樣係如第一態樣至第七態樣中任一態樣所記載之描繪裝置,其中前述校準攝影機所為的前述檢查圖像的取得所需的時間係比為了從前述基板保持部搬出一片基板並將新的基板搬入至前述基板保持部所需的時間還短。The eighth aspect of the present invention is a drawing device as described in any one of the first to seventh aspects, wherein the time required for obtaining the inspection image by the calibration camera is shorter than the time required for moving a substrate out of the substrate holding portion and moving a new substrate into the substrate holding portion.

本發明的第九態樣係如第一態樣至第七態樣任一態樣(亦可為第一態樣至第八態樣中任一態樣)所記載之描繪裝置,其中前述校準攝影機所為的前述檢查圖像的取得係在每次朝前述基板保持部搬入基板時進行。The ninth aspect of the present invention is a drawing device as described in any one of the first to seventh aspects (or any one of the first to eighth aspects), wherein the inspection image obtained by the calibration camera is performed each time a substrate is moved into the substrate holding portion.

本發明亦著眼於一種用以對基板照射光線並進行圖案的描繪之描繪方法。本發明的第十態樣為一種描繪方法,係用以對基板照射光線並進行圖案的描繪,並具備下述工序:工序a,係在設置有基板保持部以及刻度部之台位於搬入搬出位置的狀態下,拍攝已從描繪頭照射至位於前述描繪頭的下方的校準位置的前述刻度部之預定的校準圖案,其中,前述基板保持部係用以保持前述基板,前述刻度部係在與前述基板的上表面平行的主掃描方向中與前述基板保持部鄰接,前述搬入搬出位置為用以進行前述基板相對於前述基板保持部的搬入以及搬出之位置;工序b,係基於檢查圖像求出修正資訊,前述檢查圖像係包含藉由在前述工序a中所取得的前述刻度部以及前述校準圖案,前述修正資訊係被使用於來自前述描繪頭的光線的照射位置的修正;以及工序c,係基於描繪資料以及前述修正資訊,從前述描繪頭對於前述主掃描方向相對於前述描繪頭相對性地移動之前述基板照射經過調變的光線並對前述基板進行描繪。The present invention also focuses on a drawing method for irradiating light onto a substrate and drawing a pattern. The tenth aspect of the present invention is a drawing method for irradiating light onto a substrate and drawing a pattern, and has the following steps: Step a is to photograph a predetermined calibration pattern of the scale portion that has been irradiated from the drawing head to the calibration position located below the drawing head, with a stage provided with a substrate holding portion and a scale portion located at a carry-in/carry-out position, wherein the substrate holding portion is used to hold the substrate, the scale portion is adjacent to the substrate holding portion in a main scanning direction parallel to the upper surface of the substrate, and the carry-in/carry-out position is used to carry out The process comprises: a) checking the position of the substrate being moved in and out relative to the substrate holding portion; b) obtaining correction information based on an inspection image, wherein the inspection image includes the scale portion and the calibration pattern obtained in the process a, and the correction information is used to correct the irradiation position of the light from the scanning head; and c) irradiating the substrate with modulated light and scanning the substrate based on the scanning data and the correction information after the scanning head is relatively moved relative to the scanning head in the main scanning direction.

參照隨附的圖式並藉由以下所進行的本發明的詳細的說明,更明瞭上述目的以及其他的目的、特徵、態樣以及優點。The above objects and other objects, features, aspects and advantages will become more apparent from the following detailed description of the present invention with reference to the accompanying drawings.

圖1係顯示本發明的實施形態之一的描繪裝置1之立體圖。描繪裝置1為直接描繪裝置,用以對基板9上的感光材料照射經過空間調變的略束狀的光線並於基板9上掃描該光線的照射區域,藉此進行圖案的描繪。在圖1中以箭頭顯示彼此正交的三個方向作為X方向、Y方向以及Z方向。在圖1所示的例子中,X方向以及Y方向為彼此垂直的水平方向,Z方向為鉛直方向(亦即上下方向)。在其他的圖中亦相同。FIG. 1 is a three-dimensional diagram showing a drawing device 1 of one embodiment of the present invention. The drawing device 1 is a direct drawing device, which is used to irradiate the photosensitive material on the substrate 9 with a slightly beamed light that has been spatially modulated and scan the irradiated area of the light on the substrate 9, thereby drawing a pattern. In FIG. 1, three directions orthogonal to each other are shown by arrows as the X direction, the Y direction, and the Z direction. In the example shown in FIG. 1, the X direction and the Y direction are horizontal directions perpendicular to each other, and the Z direction is a vertical direction (i.e., the up-down direction). The same is true in other figures.

基板9係例如為略矩形平板狀的印刷基板。在基板9的+Z側的主表面(以下亦稱為「上表面91」)中,於銅層上設置有藉由感光材料所形成的阻劑(resist)膜。在描繪裝置1中,於基板9的該阻劑膜描繪(亦即形成)有電路圖案。此外,基板9的種類以及形狀等亦可進行各種變更。The substrate 9 is, for example, a printed circuit board in a substantially rectangular flat plate shape. A resist film formed of a photosensitive material is provided on a copper layer on the main surface on the +Z side of the substrate 9 (hereinafter also referred to as "upper surface 91"). In the drawing device 1, a circuit pattern is drawn (i.e., formed) on the resist film of the substrate 9. In addition, the type and shape of the substrate 9 can also be changed in various ways.

如圖1所示,描繪裝置1係具備台21、台移動機構22、對準部3、描繪部4、校準部5以及控制部10。控制部10係控制台移動機構22、對準部3、描繪部4以及校準部5等。As shown in Fig. 1, the drawing device 1 includes a stage 21, a stage moving mechanism 22, an alignment unit 3, a drawing unit 4, a calibration unit 5, and a control unit 10. The control unit 10 controls the stage moving mechanism 22, the alignment unit 3, the drawing unit 4, the calibration unit 5, and the like.

台21為略矩形平板狀的構件,配置於對準部3以及描繪部4的下方(亦即-Z側)。台21係具備:基板保持部25,係從下側保持水平狀態的基板9。基板保持部25係例如為真空夾具(vacuum chuck),用以吸附並保持基板9的下表面。基板保持部25亦可具有真空夾具以外的構造,例如亦可為機械夾具。載置於基板保持部25上的基板9的上表面91係與Z方向略垂直,且與X方向以及Y方向略平行。The stage 21 is a roughly rectangular flat plate-shaped member, which is arranged below the alignment section 3 and the drawing section 4 (i.e., the -Z side). The stage 21 is equipped with a substrate holding section 25, which holds the substrate 9 in a horizontal state from the bottom. The substrate holding section 25 is, for example, a vacuum chuck, which is used to absorb and hold the lower surface of the substrate 9. The substrate holding section 25 may also have a structure other than a vacuum chuck, for example, it may also be a mechanical chuck. The upper surface 91 of the substrate 9 placed on the substrate holding section 25 is slightly perpendicular to the Z direction and slightly parallel to the X direction and the Y direction.

台移動機構22為移動機構,用以將台21相對於對準部3以及描繪部4於水平方向(亦即與基板9的上表面91略平行的方向)相對性地移動。台移動機構22係具備第一移動機構23以及第二移動機構24。第二移動機構24係將台21沿著導軌於X方向直線移動。第一移動機構23係將台21與第二移動機構24一起沿著導軌於Y方向直線移動。第一移動機構23以及第二移動機構24的驅動源係例如為線性伺服馬達或者於滾珠螺桿安裝有馬達之構造。第一移動機構23以及第二移動機構24的構造亦可進行各種變更。The stage moving mechanism 22 is a moving mechanism for relatively moving the stage 21 in the horizontal direction (i.e., a direction slightly parallel to the upper surface 91 of the substrate 9) relative to the alignment portion 3 and the drawing portion 4. The stage moving mechanism 22 has a first moving mechanism 23 and a second moving mechanism 24. The second moving mechanism 24 moves the stage 21 linearly in the X direction along the guide rail. The first moving mechanism 23 moves the stage 21 linearly in the Y direction along the guide rail together with the second moving mechanism 24. The driving source of the first moving mechanism 23 and the second moving mechanism 24 is, for example, a linear servo motor or a structure in which a motor is installed on a ball screw. The structures of the first moving mechanism 23 and the second moving mechanism 24 can also be modified in various ways.

在描繪裝置1中亦可設置有:台旋轉機構,係使台21以將於Z方向延伸的旋轉軸作為中心旋轉。此外,亦可於描繪裝置1設置有:台升降機構,係將台21於Z方向移動。作為台旋轉機構,例如能夠利用伺服馬達。作為台升降機構,例如能夠利用線性伺服馬達。台旋轉機構以及台升降機構的構造亦可進行各種變更。The drawing device 1 may also be provided with a stage rotating mechanism that rotates the stage 21 around a rotation axis extending in the Z direction. In addition, the drawing device 1 may also be provided with a stage lifting mechanism that moves the stage 21 in the Z direction. For example, a servo motor may be used as the stage rotating mechanism. For example, a linear servo motor may be used as the stage lifting mechanism. The structures of the stage rotating mechanism and the stage lifting mechanism may also be modified in various ways.

對準部3係具備:複數個(在圖1所示的例子中為兩個)對準攝影機31,係排列於X方向。各個對準攝影機31係藉由跨越台21以及台移動機構22而設置的支撐部40支撐在台21以及台移動機構22的上方。支撐部40為設置於Y方向中的一個位置之單一個構件。在圖1所示的例子中,支撐部40為門形的構件(所謂的高架(gantry)),且跨越台21以及台移動機構22。The alignment section 3 includes: a plurality of (two in the example shown in FIG. 1 ) alignment cameras 31 arranged in the X direction. Each alignment camera 31 is supported above the stage 21 and the stage moving mechanism 22 by a support section 40 provided across the stage 21 and the stage moving mechanism 22. The support section 40 is a single member provided at one position in the Y direction. In the example shown in FIG. 1 , the support section 40 is a door-shaped member (so-called gantry) and extends across the stage 21 and the stage moving mechanism 22.

在圖1所示的例子中,兩個對準攝影機31係安裝於支撐部40的+Y側的側面。兩個對準攝影機31中的例如一方的對準攝影機31係被固定於支撐部40,另一方的對準攝影機31係能夠在支撐部40上於X方向移動。藉此,能變更兩個對準攝影機31之間的X方向的距離。此外,對準部3的對準攝影機31的數量亦可為一個,亦可為三個以上。In the example shown in FIG. 1 , two alignment cameras 31 are mounted on the side surface of the +Y side of the support portion 40. For example, one of the two alignment cameras 31 is fixed to the support portion 40, and the other alignment camera 31 can be moved in the X direction on the support portion 40. In this way, the distance between the two alignment cameras 31 in the X direction can be changed. In addition, the number of alignment cameras 31 of the alignment portion 3 may be one, or may be three or more.

各個對準攝影機31係具備省略圖示的拍攝元件以及光學系統。各個對準攝影機31係例如為用以取得二維的圖像之區域攝影機(area camera)。在各個對準攝影機31中,從省略圖示的照明光源被導引至基板9的上表面91之照明光的反射光係經由光學系統被導引至拍攝元件。該拍攝元件係接收來自基板9的上表面91的反射光,從而取得略矩形狀的拍攝區域的圖像。對準攝影機31係拍攝預先設置於基板9的上表面91的對準標記(省略圖示)。作為上文所說明的照明光源,能夠利用LED(Light Emitting Diode;發光二極體)等各種光源。此外,各個對準攝影機31亦可為線列式攝影機(line camera)等其他種類的攝影機。Each alignment camera 31 is provided with a photographing element and an optical system which are not shown in the figure. Each alignment camera 31 is, for example, an area camera for obtaining a two-dimensional image. In each alignment camera 31, the reflected light of the illumination light which is guided to the upper surface 91 of the substrate 9 from the illumination light source which is not shown in the figure is guided to the photographing element via the optical system. The photographing element receives the reflected light from the upper surface 91 of the substrate 9, thereby obtaining an image of a roughly rectangular photographing area. The alignment camera 31 photographs an alignment mark (not shown in the figure) which is pre-set on the upper surface 91 of the substrate 9. As the illumination light source described above, various light sources such as LED (Light Emitting Diode) can be used. In addition, each alignment camera 31 may also be a line camera or other types of cameras.

藉由對準攝影機31所取得且包含對準標記之圖像(以下亦稱為「對準圖像」)係被輸送至圖1所示的控制部10。在控制部10中,基於對準圖像進行基板9的對準(亦即基板9相對於後述的描繪頭41之相對位置的修正)。The image obtained by the alignment camera 31 and including the alignment mark (hereinafter also referred to as "alignment image") is transmitted to the control unit 10 shown in Fig. 1. In the control unit 10, the substrate 9 is aligned based on the alignment image (i.e., the relative position of the substrate 9 with respect to the later described drawing head 41 is corrected).

描繪部4係具備:複數個(在圖1所示的例子中為六個)描繪頭41,係排列於X方向。複數個描繪頭41係具有略相同的構造。各個描繪頭41係具備:空間光線調變器,係朝向下方照射經過調變(亦即經過空間調變)的光線。各個描繪頭41係藉由上文所說明的支撐部40被支撐於台21以及台移動機構22的上方。在圖1所示的例子中,六個描繪頭41係安裝於支撐部40的-Y側的側面。換言之,六個描繪頭41係於Y方向隔著支撐部40配置於與上文所說明的兩個對準攝影機31相反之側。進一步換言之,兩個對準攝影機31係於Y方向隔著六個描繪頭41位於台21中之與基板保持部25相反之側,其中該台21係位於後述的搬入搬出位置。The drawing section 4 includes: a plurality of (six in the example shown in FIG. 1 ) drawing heads 41 arranged in the X direction. The plurality of drawing heads 41 have a substantially identical structure. Each drawing head 41 includes: a spatial light modulator that irradiates modulated (i.e., spatially modulated) light downward. Each drawing head 41 is supported above the stage 21 and the stage moving mechanism 22 by the supporting portion 40 described above. In the example shown in FIG. 1 , the six drawing heads 41 are mounted on the side surface of the -Y side of the supporting portion 40. In other words, the six drawing heads 41 are arranged on the side opposite to the two alignment cameras 31 described above through the supporting portion 40 in the Y direction. In other words, the two alignment cameras 31 are located on the side of the stage 21 opposite to the substrate holding portion 25 with six drawing heads 41 therebetween in the Y direction, wherein the stage 21 is located at the loading and unloading position described later.

在圖1所示的例子中,六個描繪頭41係與X方向略平行地排列成略直線狀。此外,六個描繪頭41與台21上的基板9的上表面91之間的Z方向的距離係略相同。換言之,六個描繪頭41的排列方向係與基板9的上表面91略平行且與Y方向略垂直。進一步換言之,六個描繪頭41的Y方向以及Z方向中的位置係略相同。In the example shown in FIG. 1 , the six drawing heads 41 are arranged in a substantially straight line substantially parallel to the X direction. In addition, the distances in the Z direction between the six drawing heads 41 and the upper surface 91 of the substrate 9 on the stage 21 are substantially the same. In other words, the arrangement direction of the six drawing heads 41 is substantially parallel to the upper surface 91 of the substrate 9 and substantially perpendicular to the Y direction. In other words, the positions of the six drawing heads 41 in the Y direction and the Z direction are substantially the same.

此外,上文所說明的描繪頭41的排列方向只要為相對於Y方向呈傾斜之方向即可,並不一定需要與X方向平行。在描繪部4中,複數個描繪頭41係不一定需要排列於一條直線上,亦可排列成例如交錯狀。此外,在描繪部4中,描繪頭41的數量係可為一個,亦可為兩個以上。In addition, the arrangement direction of the drawing heads 41 described above only needs to be a direction inclined relative to the Y direction, and does not necessarily need to be parallel to the X direction. In the drawing section 4, the plurality of drawing heads 41 do not necessarily need to be arranged on a straight line, and can also be arranged in a staggered manner, for example. In addition, in the drawing section 4, the number of drawing heads 41 can be one or more than two.

在描繪裝置1中,針對基板9之圖案描繪係藉由所謂的多程(multi pass)方式進行。具體而言,一邊從描繪部4的複數個描繪頭41將經過調變的光線照射至基板9的上表面91上,一邊藉由台移動機構22的第一移動機構23使基板9於Y方向移動並通過描繪頭41的下方。藉此,來自複數個描繪頭41的光線的照射區域係於基板9上朝Y方向掃描,從而對基板9進行描繪。接著,藉由第二移動機構24使基板9於X方向步階移動(step shift)達至預定距離。接著,再度進行第一移動機構23所為之使基板9朝Y方向的移動以及描繪頭41與該基板9朝Y方向的移動並行地朝基板9照射光線,從而對基板9進行描繪。在描繪裝置1中,交互地進行朝於Y方向移動的基板9照射光線以及基板9朝X方向的步階移動,藉此對基板9進行圖案的描繪。In the drawing device 1, the pattern drawing on the substrate 9 is performed by the so-called multi-pass method. Specifically, while the modulated light is irradiated from the plurality of drawing heads 41 of the drawing unit 4 onto the upper surface 91 of the substrate 9, the substrate 9 is moved in the Y direction and passes under the drawing heads 41 by the first moving mechanism 23 of the stage moving mechanism 22. In this way, the irradiation area of the light from the plurality of drawing heads 41 is scanned on the substrate 9 in the Y direction, thereby drawing the substrate 9. Then, the substrate 9 is step-shifted in the X direction to a predetermined distance by the second moving mechanism 24. Next, the first moving mechanism 23 is again used to move the substrate 9 in the Y direction, and the drawing head 41 irradiates light toward the substrate 9 in parallel with the movement of the substrate 9 in the Y direction, thereby drawing the substrate 9. In the drawing device 1, the substrate 9 moving in the Y direction is alternately irradiated with light and the substrate 9 is step-moved in the X direction, thereby drawing a pattern on the substrate 9.

在以下的說明中,亦將Y方向稱為「主掃描方向」,且亦將X方向稱為「副掃描方向」。主掃描方向以及副掃描方向為與基板9的上表面91略平行的方向。在台移動機構22中,第一移動機構23為主掃描機構,用以使台21於主掃描方向相對於描繪頭41相對性地移動。此外,第二移動機構24為副掃描機構,用以使台21於副掃描方向相對於描繪頭41相對性地移動。此外,在描繪裝置1中,亦可藉由單程(single pass)方式(亦稱為單向(one pass)方式)方式對基板9進行描繪;單程方式為:將基板9於Y方向相對於描繪頭41僅進行一次相對移動,藉此完成朝基板9上描繪圖案。在此種情形中,於圖案的描繪時不藉由第二移動機構24進行基板9的副掃描(亦即朝X方向的步階移動)。In the following description, the Y direction is also referred to as the "main scanning direction", and the X direction is also referred to as the "sub-scanning direction". The main scanning direction and the sub-scanning direction are directions that are substantially parallel to the upper surface 91 of the substrate 9. In the stage moving mechanism 22, the first moving mechanism 23 is a main scanning mechanism for moving the stage 21 relatively to the drawing head 41 in the main scanning direction. In addition, the second moving mechanism 24 is a sub-scanning mechanism for moving the stage 21 relatively to the drawing head 41 in the sub-scanning direction. In addition, in the drawing device 1, the substrate 9 can also be drawn by a single pass method (also called a one-way method); the one-way method is: the substrate 9 is relatively moved only once in the Y direction relative to the drawing head 41, thereby completing the drawing of the pattern on the substrate 9. In this case, when drawing the pattern, the second moving mechanism 24 does not perform a secondary scan of the substrate 9 (i.e., a step movement in the X direction).

校準部5係在台21上設置於基板保持部25的+Y側。校準部5係被使用於描繪頭41的校準(亦即來自描繪頭41的光線的照射位置的測定以及修正)。The calibration unit 5 is provided on the stage 21 at the +Y side of the substrate holding unit 25. The calibration unit 5 is used for calibration of the image pickup head 41 (that is, measurement and correction of the irradiation position of the light from the image pickup head 41).

圖2係放大地顯示描繪裝置1的校準部5附近之俯視圖。圖3係顯示校準部5以及描繪頭41的構成之前視圖。在圖3中顯示描繪頭41位於校準部5的鉛直上方的狀態。在圖3中顯示台21的內部的構成以及一個描繪頭41的內部的構成。其他的描繪頭41的構造係與該一個描繪頭41的構造略相同。Fig. 2 is an enlarged top view showing the vicinity of the calibration section 5 of the drawing device 1. Fig. 3 is a front view showing the structure of the calibration section 5 and the drawing head 41. Fig. 3 shows a state where the drawing head 41 is located directly above the calibration section 5. Fig. 3 shows the internal structure of the stage 21 and the internal structure of one drawing head 41. The structure of the other drawing heads 41 is roughly the same as that of the one drawing head 41.

如圖3所示,描繪頭41係具備光源部42、照明光學系統43、空間光線調變器44(以下亦簡稱為「光線調變器44」)以及投影光學系統45。從光源部42射出的光線係藉由照明光學系統43導引至光線調變器44並在光線調變器44中經過調變後,藉由投影光學系統45導引至描繪頭41的下方(亦即-Z方向)。As shown in FIG3 , the drawing head 41 includes a light source unit 42, an illumination optical system 43, a spatial light modulator 44 (hereinafter also referred to as “light modulator 44”), and a projection optical system 45. Light emitted from the light source unit 42 is guided to the light modulator 44 by the illumination optical system 43 and modulated in the light modulator 44 before being guided to the bottom of the drawing head 41 (i.e., in the −Z direction) by the projection optical system 45.

光源部42係具備:複數個光源,係射出彼此不同的波長的光線。在圖3所示的例子中,光源部42係具備三個光源421至423。作為光源421至423,能夠利用LD(Laser Diode;雷射二極體)等各種光源。對基板9描繪圖案時,配合基板9上的感光材料的種類等使用例如光源421至423中的兩個以上的光源。此外,設置於光源部42的光源的數量亦可為一個或者兩個,亦可為四個以上。設置於光源部42的光源並未限定於LD,亦能夠利用各種類種的光源。The light source section 42 has: a plurality of light sources that emit light of different wavelengths. In the example shown in FIG. 3 , the light source section 42 has three light sources 421 to 423. As the light sources 421 to 423, various light sources such as LD (Laser Diode) can be used. When drawing a pattern on the substrate 9, two or more light sources such as the light sources 421 to 423 are used in accordance with the type of photosensitive material on the substrate 9. In addition, the number of light sources provided in the light source section 42 may be one or two, or may be four or more. The light source provided in the light source section 42 is not limited to LD, and various types of light sources can be used.

照明光學系統43以及投影光學系統45係分別具備省略圖示的複數個透鏡等光學元件。作為光線調變器44,能夠利用DMD(Digital Micro Mirror Device;數位微鏡元件)或者GLV(Grating Light Valve;柵光閥)(Silicon Light Machines公司(森尼韋爾(Sunnyvale)、加利福尼亞(California))的註冊商標)等各種光線調變器。光線調變器44並未限定於上文所說明的例子,能夠利用各種種類的光線調變器。The illumination optical system 43 and the projection optical system 45 each include a plurality of optical elements such as lenses not shown. As the light modulator 44, various light modulators such as DMD (Digital Micro Mirror Device) or GLV (Grating Light Valve) (registered trademark of Silicon Light Machines, Sunnyvale, California) can be used. The light modulator 44 is not limited to the examples described above, and various types of light modulators can be used.

校準部5係具備拍攝部51以及刻度部52。刻度部52為略平板狀的構件,設置於台21上。刻度部52係配置於台21的上表面,且鄰接(亦即接近地配置)於基板保持部25的+Y側。在圖2所示的例子中,刻度部52為與X方向略平行地延伸的略矩形帶狀的構件,且具有透光性。於刻度部52的+Z側的主表面設置有眾多的刻度,該眾多的刻度係用以顯示刻度部52的+Z側的主表面上的X方向的位置。換言之,刻度部52為透光性刻度構件,例如為略透明的玻璃刻度尺(glass scale)。刻度部52的該刻度係例如為十字圖案或者其他形狀的圖案。此外,刻度部52亦可為半透明的構件。The calibration section 5 includes a photographing section 51 and a scale section 52. The scale section 52 is a slightly flat member, which is disposed on the table 21. The scale section 52 is arranged on the upper surface of the table 21, and is adjacent to (i.e., closely disposed) the +Y side of the substrate holding section 25. In the example shown in FIG. 2 , the scale section 52 is a slightly rectangular band-shaped member extending slightly parallel to the X direction, and is light-transmissive. A large number of scales are provided on the main surface on the +Z side of the scale section 52, and the large number of scales are used to display the position in the X direction on the main surface on the +Z side of the scale section 52. In other words, the scale section 52 is a light-transmissive scale member, such as a slightly transparent glass scale. The scale of the scale section 52 is, for example, a cross pattern or a pattern of other shapes. In addition, the scale portion 52 may also be a translucent component.

拍攝部51係在刻度部52的下方安裝於台21的內部。拍攝部51係具備校準攝影機53以及攝影機移動機構54。校準攝影機53係在刻度部52的鉛直下方處配置成朝向上方。校準攝影機53係例如為數位攝影機,且具有CCD(Charge Coupled Device;電荷耦合元件)或者CMOS(Complementary Metal-Oxide Semiconductor;互補式金屬氧化物半導體)作為拍攝元件。此外,校準攝影機53的種類以及性能亦可適當地設定。The camera unit 51 is installed inside the table 21 below the scale unit 52. The camera unit 51 includes a calibration camera 53 and a camera moving mechanism 54. The calibration camera 53 is arranged directly below the scale unit 52 so as to face upward. The calibration camera 53 is, for example, a digital camera and has a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor) as a camera element. In addition, the type and performance of the calibration camera 53 can also be appropriately set.

於校準攝影機53的上端部(亦即經由刻度部52而與描繪頭41對向之部位)施加有低反射加工。具體而言,例如於校準攝影機53的物鏡(objective lens)的框架貼附有用以使反射率降低之反射防止膜。藉此,在藉由對準攝影機31進行拍攝時能抑制無意中拍攝到來自校準攝影機53的反射光。此外,上文所說明的低反射加工亦可藉由反射防止膜以外的各種構造以及方法來進行。The upper end of the calibration camera 53 (i.e., the portion facing the drawing head 41 via the scale portion 52) is subjected to low reflection processing. Specifically, for example, an anti-reflection film for reducing reflectivity is attached to the frame of the objective lens of the calibration camera 53. This can prevent the reflected light from the calibration camera 53 from being accidentally photographed when shooting with the calibration camera 31. In addition, the low reflection processing described above can also be performed by various structures and methods other than the anti-reflection film.

攝影機移動機構54為移動機構,用以在台21的內部將校準攝影機53沿著導軌於X方向直線移動。攝影機移動機構54的驅動源係例如為線性伺服馬達或者於滾珠螺桿安裝了馬達之驅動源。攝影機移動機構54的構造亦可進行各種變更。The camera moving mechanism 54 is a moving mechanism for linearly moving the calibration camera 53 along the guide rail in the X direction inside the stage 21. The driving source of the camera moving mechanism 54 is, for example, a linear servo motor or a driving source in which a motor is mounted on a ball screw. The structure of the camera moving mechanism 54 can also be modified in various ways.

在描繪裝置1中,在複數個描繪頭41位於校準部5的刻度部52的鉛直上方的狀態下,藉由攝影機移動機構54移動校準攝影機53並配置於屬於校準對象的一個描繪頭41的鉛直下方。從該一個描繪頭41朝向刻度部52射出預定的校準圖案(亦即被利用於描繪頭41的校準之圖案)。校準圖案係例如為十字型的圖案。校準圖案的形狀只要為能夠算出重心位置之形狀則亦可進行各種變更。In the drawing device 1, when a plurality of drawing heads 41 are located directly above the scale portion 52 of the calibration portion 5, the calibration camera 53 is moved by the camera moving mechanism 54 and arranged directly below one drawing head 41 that is the calibration object. A predetermined calibration pattern (i.e., a pattern used for calibration of the drawing head 41) is emitted from the one drawing head 41 toward the scale portion 52. The calibration pattern is, for example, a cross-shaped pattern. The shape of the calibration pattern can be changed in various ways as long as it is a shape that can calculate the center of gravity position.

校準攝影機53係從下方經由刻度部52一起拍攝刻度部52上之來自描繪頭41的光線的照射區域(亦即校準圖案)以及預先形成於刻度部52上的刻度。換言之,校準攝影機53係一起拍攝透過刻度部52的校準圖案以及刻度。藉由校準攝影機53所取得的圖像(以下亦稱為「檢查圖像」)係被輸送至圖1所示的控制部10。在控制部10中,基於檢查圖案進行上文所說明的一個描繪頭41的校準。此外,在進行其他的描繪頭41的校準之情形中,藉由攝影機移動機構54將校準攝影機53朝X方向移動且在位於該其他的描繪頭41的鉛直下方後,以同樣的順序進行校準。The calibration camera 53 photographs the irradiation area of the light from the drawing head 41 on the scale portion 52 (i.e., the calibration pattern) and the scale formed in advance on the scale portion 52 from below through the scale portion 52. In other words, the calibration camera 53 photographs the calibration pattern and the scale passing through the scale portion 52. The image obtained by the calibration camera 53 (hereinafter also referred to as the "inspection image") is transmitted to the control unit 10 shown in FIG. 1. In the control unit 10, the calibration of one drawing head 41 described above is performed based on the inspection pattern. When calibrating another drawing head 41, the calibration camera 53 is moved in the X direction by the camera moving mechanism 54 and is positioned directly below the other drawing head 41, and then the calibration is performed in the same procedure.

圖4係顯示作為控制部10發揮作用的電腦100的構成之圖。電腦100為具備有處理器(processor)101、記憶體102、輸入輸出部103以及匯流排(bus)104之一般的電腦。匯流排104為用以連接處理器101、記憶體102以及輸入輸出部103之訊號電路。記憶體102係記憶程式以及各種資訊。處理器101係依循記憶於記憶體102的程式等,一邊利用記憶體102等一邊執行各種處理(例如數值計算、圖像處理)。輸入輸出部103係具備:鍵盤105以及滑鼠106,係接受來自操作者的輸入;以及顯示器107,係顯示來自處理器101的輸出等。此外,控制部10係可為可程式邏輯控制器(PLC;Programmable Logic Controller)或者電路基板等,亦可為這些構件與一個以上的電腦的組合。FIG4 is a diagram showing the structure of a computer 100 serving as the control unit 10. The computer 100 is a general computer having a processor 101, a memory 102, an input/output unit 103, and a bus 104. The bus 104 is a signal circuit for connecting the processor 101, the memory 102, and the input/output unit 103. The memory 102 stores programs and various information. The processor 101 executes various processing (e.g., numerical calculation, image processing) while using the memory 102, etc., in accordance with the program, etc. stored in the memory 102. The input/output unit 103 includes a keyboard 105 and a mouse 106 for receiving input from an operator, and a display 107 for displaying output from the processor 101. In addition, the control unit 10 may be a programmable logic controller (PLC) or a circuit board, or a combination of these components and one or more computers.

圖5係顯示藉由電腦100所實現的控制部10的功能之方塊圖。在圖5中亦一併顯示控制部10以外的構成。控制部10係具備記憶部111、拍攝控制部112、位置檢測部113、修正資訊取得部114、對準資訊取得部115以及描繪控制部116。記憶部111係主要藉由記憶體102所實現,並預先記憶欲被描繪至基板9之預定的圖案的資料(亦即描繪用資料)等各種資訊。拍攝控制部112、位置檢測部113、修正資訊取得部114、對準資訊取得部115以及描繪控制部116係主要藉由處理器101所實現。FIG5 is a block diagram showing the functions of the control unit 10 realized by the computer 100. FIG5 also shows the components other than the control unit 10. The control unit 10 includes a memory unit 111, a shooting control unit 112, a position detection unit 113, a correction information acquisition unit 114, an alignment information acquisition unit 115, and a drawing control unit 116. The memory unit 111 is mainly realized by the memory 102, and pre-stores various information such as data of a predetermined pattern to be drawn on the substrate 9 (i.e., drawing data). The shooting control unit 112, the position detection unit 113, the correction information acquisition unit 114, the alignment information acquisition unit 115, and the drawing control unit 116 are mainly realized by the processor 101.

拍攝控制部112係控制描繪頭41以及拍攝部51,藉此從描繪頭41對刻度部52(參照圖2以及圖3)照射預先儲存於記憶部111的校準圖案,並使拍攝部51取得上文所說明的校準用的檢查圖像。該檢查圖像係從拍攝部51被輸送至控制部10並被存儲於記憶部111。The imaging control unit 112 controls the drawing head 41 and the imaging unit 51, thereby irradiating the calibration pattern pre-stored in the memory unit 111 from the drawing head 41 to the scale unit 52 (see FIGS. 2 and 3 ), and causing the imaging unit 51 to obtain the calibration inspection image described above. The inspection image is transmitted from the imaging unit 51 to the control unit 10 and stored in the memory unit 111.

位置檢測部113係基於包含刻度部52以及校準圖案的圖像之該檢查圖像,求出刻度部52上之來自描繪頭41的光線的照射位置(以下亦稱為「測定位置」)。如上所述,由於刻度部52被固定於台21上,因此刻度部52相對於基板保持部25之相對位置亦被固定。因此,檢測刻度部52的上文所說明的眾多的刻度上的校準圖案的照射位置,藉此求出從描繪頭41照射的光線的照射位置相對於基板保持部25之相對性的位置。The position detection unit 113 obtains the irradiation position of the light from the drawing head 41 on the scale portion 52 (hereinafter also referred to as "measured position") based on the inspection image including the scale portion 52 and the calibration pattern. As described above, since the scale portion 52 is fixed on the stage 21, the relative position of the scale portion 52 with respect to the substrate holding portion 25 is also fixed. Therefore, by detecting the irradiation position of the calibration pattern on the scale portion 52 described above, the relative position of the irradiation position of the light irradiated from the drawing head 41 with respect to the substrate holding portion 25 is obtained.

修正資訊取得部114係基於藉由位置檢測部113所求出的上文所說明的測定位置求出修正資訊,該修正資訊係被使用於來自描繪頭41的光線在基板9上的照射位置的修正。具體而言,比較測定位置與從描繪頭41照射的校準圖案在刻度部52上的設計上的照射位置(以下亦稱為「設計位置」),求出測定位置與設計位置之間的X方向以及Y方向中的距離(亦即與設計位置相距的偏離量)。修正資訊取得部114係基於該偏離量求出修正資訊,該修正資訊係以使來自描繪頭41的光線的照射位置與設計位置一致之方式進行修正。該修正資訊係例如為用以配合該偏離量修正被描繪於基板9上的圖案的描繪資料之資訊。或者,該修正資訊亦可為用以在對基板9描繪圖案時修正台移動機構22對於基板9的移動之資訊。The correction information acquisition unit 114 obtains correction information based on the measured position obtained by the position detection unit 113, and the correction information is used to correct the irradiation position of the light from the drawing head 41 on the substrate 9. Specifically, the measured position is compared with the designed irradiation position of the calibration pattern irradiated from the drawing head 41 on the scale portion 52 (hereinafter also referred to as the "design position"), and the distance between the measured position and the design position in the X direction and the Y direction (that is, the deviation from the design position) is obtained. The correction information acquisition unit 114 obtains correction information based on the deviation, and the correction information is corrected in a manner that the irradiation position of the light from the drawing head 41 is consistent with the design position. The correction information is, for example, information for correcting the drawing data of the pattern drawn on the substrate 9 in accordance with the deviation. Alternatively, the correction information may also be information for correcting the movement of the stage moving mechanism 22 with respect to the substrate 9 when drawing a pattern on the substrate 9.

對準資訊取得部115係基於藉由對準部3的對準攝影機31所取得的上文所說明的對準標記的圖像(以下亦稱為「對準圖像」)來取得對準資訊,該對準資訊係被使用於基板9的對準(亦即基板9相對於描繪頭41之相對位置的修正)。具體而言,基於對準圖像中的對準標記的位置求出基板保持部25上的基板9的位置,並求出基板保持部25上的基板9與設計位置相距的偏離量。換言之,求出基板9相對於描繪頭41之相對位置與設計位置相距的偏離量。對準資訊取得部115係基於該偏離量求出對準資訊,該對準資訊係以使基板9相對於描繪頭41之相對位置與設計位置一致之方式進行修正。該對準資訊係例如為用以在針對基板9描繪圖案時修正台移動機構22對於基板9的移動之資訊。或者,該對準資訊亦可為用以配合上文所說明的偏離量修正被描繪於基板9上的圖案的描繪資料之資訊。The alignment information acquisition unit 115 acquires alignment information based on the image of the alignment mark described above acquired by the alignment camera 31 of the alignment unit 3 (hereinafter also referred to as the "alignment image"), and the alignment information is used for the alignment of the substrate 9 (i.e., the correction of the relative position of the substrate 9 with respect to the drawing head 41). Specifically, the position of the substrate 9 on the substrate holding unit 25 is obtained based on the position of the alignment mark in the alignment image, and the deviation of the substrate 9 on the substrate holding unit 25 from the designed position is obtained. In other words, the deviation of the relative position of the substrate 9 with respect to the drawing head 41 from the designed position is obtained. The alignment information acquisition unit 115 obtains alignment information based on the deviation, and the alignment information is corrected in such a way that the relative position of the substrate 9 with respect to the drawing head 41 is consistent with the designed position. The alignment information is, for example, information for correcting the movement of the stage moving mechanism 22 with respect to the substrate 9 when drawing a pattern on the substrate 9. Alternatively, the alignment information may also be information for correcting the drawing data of the pattern drawn on the substrate 9 in accordance with the deviation amount described above.

描繪控制部116係基於記憶於記憶部111的描繪資料、藉由修正資訊取得部114所求出的修正資訊、以及藉由對準資訊取得部115所求出的對準資訊等控制描繪頭41以及台移動機構22,藉此一邊使基板9相對於描繪頭41相對性地移動,一邊使描繪頭41對基板9執行描繪。The drawing control unit 116 controls the drawing head 41 and the stage moving mechanism 22 based on the drawing data stored in the memory unit 111, the correction information obtained by the correction information acquisition unit 114, and the alignment information obtained by the alignment information acquisition unit 115, thereby causing the drawing head 41 to draw on the substrate 9 while moving the substrate 9 relatively with respect to the drawing head 41.

接著,參照圖6以及圖7A至圖7E說明描繪裝置1所為的圖案的描繪。圖6係顯示針對基板9的圖案描繪的流程的一例之圖。圖7A至圖7E係示意性地顯示描繪裝置1的主要構成之前視圖,用以說明描繪裝置1的動作。在圖7A至圖7E中亦以實線顯示台21的內部的構成。Next, the drawing of a pattern by the drawing device 1 is described with reference to FIG. 6 and FIG. 7A to FIG. 7E. FIG. 6 is a diagram showing an example of the process of drawing a pattern on the substrate 9. FIG. 7A to FIG. 7E are schematic front views of the main components of the drawing device 1 to illustrate the operation of the drawing device 1. FIG. 7A to FIG. 7E also show the internal structure of the table 21 with solid lines.

首先,對基板9進行描繪時,台21係位於圖7A所示的位置。在以下的說明中,亦將圖7A所示的台21的Y方向的位置稱為「搬入搬出位置」。在描繪裝置1中,在台21位於搬入搬出位置的狀態下,描繪裝置1中已經結束描繪的基板9係如二點鏈線所示般從台21被搬出至描繪裝置1的外部。此外,新的基板9(亦即預定供描繪裝置1進行描繪的基板9)係被搬入至描繪裝置1,並被保持於基板保持部25的台21上(步驟S11)。亦即,在步驟S11中,在台21位於搬入搬出位置的狀態下,進行基板9相對於基板保持部25的搬入以及搬出。基板9的搬入以及搬出係例如藉由省略圖示的搬入搬出裝置來進行,亦可藉由作業員的手動作業來進行。在台21位於該搬入搬出位置的狀態下,基板保持部25係位於比被安裝於支撐部40(參照圖1)之描繪部4的複數個描繪頭41以及複數個對準攝影機31還要-Y側。First, when the substrate 9 is to be drawn, the table 21 is located at the position shown in FIG. 7A. In the following description, the position of the table 21 in the Y direction shown in FIG. 7A is also referred to as the "carry-in and carry-out position". In the drawing device 1, when the table 21 is located at the carry-in and carry-out position, the substrate 9 that has been drawn in the drawing device 1 is carried out from the table 21 to the outside of the drawing device 1 as shown by the two-point chain. In addition, a new substrate 9 (that is, a substrate 9 that is predetermined for drawing by the drawing device 1) is brought into the drawing device 1 and is held on the table 21 of the substrate holding portion 25 (step S11). That is, in step S11, when the table 21 is located at the carry-in and carry-out position, the substrate 9 is carried in and out of the substrate holding portion 25. The substrate 9 is carried in and out by, for example, a carrying-in and carrying-out device (not shown) or by manual operation of an operator. When the stage 21 is located at the carrying-in and carrying-out position, the substrate holding portion 25 is located on the -Y side of the plurality of drawing heads 41 and the plurality of alignment cameras 31 of the drawing portion 4 mounted on the support portion 40 (see FIG. 1 ).

在圖7A所示的狀態下,校準部5的刻度部52係位於描繪頭41的鉛直下方。在以下的說明中,亦將圖7A所示的刻度部52的Y方向的位置稱為「校準位置」。在描繪裝置1中,在台21位於搬入搬出位置且刻度部52位於校準位置的狀態下,與步驟S11中的基板9的搬入以及搬出並行地進行複數個描繪頭41的校準。In the state shown in FIG. 7A , the scale portion 52 of the calibration portion 5 is located directly below the drawing head 41. In the following description, the position of the scale portion 52 in the Y direction shown in FIG. 7A is also referred to as the "calibration position." In the drawing device 1, when the stage 21 is located at the loading and unloading position and the scale portion 52 is located at the calibration position, the calibration of the plurality of drawing heads 41 is performed in parallel with the loading and unloading of the substrate 9 in step S11.

具體而言,藉由攝影機移動機構54(參照圖2以及圖3)移動校準攝影機53,並配置於屬於校準對象的一個描繪頭41的鉛直下方。接著,藉由控制部10控制該描繪頭41的光源部42以及光線調變器44(參照圖3)等,藉此從該描繪頭41對刻度部52照射上文所說明的校準圖案。在光源部42中,在照射校準圖案時,僅使用上文所說明的光源421至423(參照圖3)中預先決定的一個光源。藉此,藉由單一個波長的光線形成刻度部52上的校準圖案。Specifically, the calibration camera 53 is moved by the camera moving mechanism 54 (see FIG. 2 and FIG. 3 ) and arranged directly below a drawing head 41 that is a calibration object. Then, the control unit 10 controls the light source unit 42 and the light modulator 44 (see FIG. 3 ) of the drawing head 41, so that the calibration pattern described above is irradiated from the drawing head 41 to the scale portion 52. In the light source unit 42, when irradiating the calibration pattern, only one light source predetermined among the light sources 421 to 423 described above (see FIG. 3 ) is used. In this way, the calibration pattern on the scale portion 52 is formed by light of a single wavelength.

校準攝影機53係一起拍攝被照射至位於校準位置的刻度部52的校準圖案以及刻度部52的刻度,從而取得檢查圖像。所取得的檢查圖像係被輸送至控制部10並被儲存於記憶部111(參照圖5)。The calibration camera 53 captures the calibration pattern and the scale of the scale 52 irradiated at the calibration position to obtain a test image. The obtained test image is transmitted to the control unit 10 and stored in the memory unit 111 (see FIG. 5 ).

在取得檢查圖像時會有下述情形等:校準圖案在Y方向偏離地較大,且離開校準攝影機53的視野。在此種情形中,以校準圖案收斂於校準攝影機53的視野內之方式修正刻度部52上的校準圖案的Y方向中的位置後,進行檢查圖像的取得。校準圖案的Y方向中的位置的修正係在台21靜止的狀態下(亦即無需使台21於Y方向移動)藉由描繪頭41來進行。When acquiring the inspection image, there may be a case where the calibration pattern deviates greatly in the Y direction and leaves the field of view of the calibration camera 53. In this case, the Y direction position of the calibration pattern on the scale portion 52 is corrected so that the calibration pattern converges within the field of view of the calibration camera 53, and then the inspection image is acquired. The correction of the Y direction position of the calibration pattern is performed by the drawing head 41 when the stage 21 is stationary (i.e., the stage 21 does not need to be moved in the Y direction).

具體而言,例如在記憶部111預先儲存有Y方向中的位置不同的複數個校準圖案的資料並且刻度部52上的校準圖案的位置偏離至+Y側之情形中,將校準圖案比目前的資料還要位於-Y側之資料與該目前的資料交換。接著,基於交換後的資料來控制描繪頭41,藉此刻度部52上的校準圖案的位置係朝-Y側移動。Specifically, for example, when the memory unit 111 stores data of a plurality of calibration patterns at different positions in the Y direction and the position of the calibration pattern on the scale unit 52 is deviated to the +Y side, the data of the calibration pattern located further to the -Y side than the current data is exchanged with the current data. Then, the drawing head 41 is controlled based on the exchanged data, whereby the position of the calibration pattern on the scale unit 52 is moved to the -Y side.

藉此,由於無需使台21移動(亦即無需使刻度部52移動)即能夠適當地拍攝校準圖案,因此能縮短描繪頭41的校準所需的時間。此外,如上所述,由於描繪頭41的校準係與基板9的搬入以及搬出並行地進行,因此防止因為台21的移動對基板9的搬入以及搬出產生不良影響(例如台21的移動中的搬入搬出作業的中斷)。此外,描繪頭41所為的校準圖案的位置變更並未限定於上文所說明的方法,亦可藉由其他的方法來進行。Thus, since the calibration pattern can be properly photographed without moving the stage 21 (that is, without moving the scale portion 52), the time required for calibration of the drawing head 41 can be shortened. In addition, as described above, since the calibration of the drawing head 41 is performed in parallel with the loading and unloading of the substrate 9, it is prevented that the loading and unloading of the substrate 9 is adversely affected by the movement of the stage 21 (for example, the interruption of the loading and unloading operation during the movement of the stage 21). In addition, the position change of the calibration pattern by the drawing head 41 is not limited to the method described above, and can also be performed by other methods.

接著,藉由攝影機移動機構54將校準攝影機53於X方向移動並配置於下一個描繪頭41的鉛直下方,該下一個描繪頭41係在X方向中與檢查圖像取得完畢的描繪頭41鄰接。接著,與上文所說明同樣地,拍攝從該下一個描繪頭41照射至刻度部52的校準圖案,並取得該下一個描繪頭41的檢查圖像。在描繪裝置1中,針對描繪部4的全部的描繪頭41依序進行校準攝影機53所為的檢查圖像的取得(步驟S12)。換言之,該一個校準攝影機53係一邊於X方向(亦即複數個描繪頭41的排列方向)移動一邊依序拍攝從複數個描繪頭41分別照射至刻度部52的複數個校準圖案。Next, the calibration camera 53 is moved in the X direction by the camera moving mechanism 54 and arranged directly below the next drawing head 41, which is adjacent to the drawing head 41 that has completed the inspection image acquisition in the X direction. Next, as described above, the calibration pattern irradiated from the next drawing head 41 to the scale portion 52 is photographed, and the inspection image of the next drawing head 41 is acquired. In the drawing device 1, the inspection image acquired by the calibration camera 53 is sequentially performed for all the drawing heads 41 of the drawing unit 4 (step S12). In other words, the calibration camera 53 moves in the X direction (i.e., the arrangement direction of the plurality of drawing heads 41) while sequentially photographing the plurality of calibration patterns irradiated from the plurality of drawing heads 41 to the scale portion 52.

在描繪裝置1中,步驟S12的所需時間(亦即複數個描繪頭41的全部的檢查圖像取得所需的時間)係較佳為比在步驟S11中從基板保持部25搬出一個基板9並將新的基板9搬入至基板保持部25所需的時間還短。此外,在描繪裝置1中,在一個描繪頭41的檢查圖像取得時,係可停止從其他的描繪頭41照射校準圖案,亦可從其他的描繪頭41對刻度部52照射校準圖案。In the drawing device 1, the time required for step S12 (i.e., the time required for obtaining all the inspection images of the plurality of drawing heads 41) is preferably shorter than the time required for carrying out one substrate 9 from the substrate holding portion 25 and carrying a new substrate 9 into the substrate holding portion 25 in step S11. In addition, in the drawing device 1, when obtaining the inspection image of one drawing head 41, the irradiation of the calibration pattern from the other drawing heads 41 may be stopped, and the calibration pattern may be irradiated to the scale portion 52 from the other drawing heads 41.

在描繪裝置1中,當取得一個描繪頭41的檢查圖像時,位置檢測部113(參照圖5)係基於該檢查圖像求出刻度部52上之來自描繪頭41的光線的照射位置(亦即校準圖案的測定位置)。接著,修正資訊取得部114(參照圖5)係基於該校準圖案的測定位置求出與從上文所說明的一個描繪頭41的光線的照射位置相關的修正資訊(步驟S13)。如此,較佳為在描繪裝置1中並行地進行複數個描繪頭41的檢查圖像的取得以及基於檢查圖像之修正資訊的取得。In the drawing device 1, when a check image of a drawing head 41 is obtained, the position detection unit 113 (see FIG. 5) obtains the irradiation position of the light from the drawing head 41 on the scale unit 52 (i.e., the measured position of the calibration pattern) based on the check image. Then, the correction information acquisition unit 114 (see FIG. 5) obtains the correction information related to the irradiation position of the light from the one drawing head 41 described above based on the measured position of the calibration pattern (step S13). In this way, it is preferable to perform the acquisition of the check images of a plurality of drawing heads 41 and the acquisition of the correction information based on the check images in parallel in the drawing device 1.

當結束基板9的搬入與搬出(步驟S11)以及針對全部的描繪頭41的檢查圖像的取得(步驟S12)時,藉由台移動機構22的第一移動機構23將台21朝+Y方向移動。台21朝+Y方向的移動係例如在針對全部的描繪頭41取得上文所說明的修正資訊之前(亦即在結束步驟S13之前)開始。在此種情形中,步驟S13亦在基板9的移動中持續地進行。此外,步驟S21的移動亦可在步驟S13結束後再開始。When the loading and unloading of the substrate 9 (step S11) and the acquisition of the inspection images for all the drawing heads 41 (step S12) are completed, the stage 21 is moved in the +Y direction by the first moving mechanism 23 of the stage moving mechanism 22. The movement of the stage 21 in the +Y direction is started, for example, before the correction information described above is acquired for all the drawing heads 41 (that is, before the completion of step S13). In this case, step S13 is also continuously performed during the movement of the substrate 9. In addition, the movement of step S21 may also be started after the completion of step S13.

台21係朝+Y方向移動,藉此如圖7B所示通過對準攝影機31的下方並朝圖7C所示的待機位置移動後則停止。如圖7B所示,在台21通過對準攝影機31的下方時,藉由對準攝影機31拍攝預先設置於基板保持部25上的基板9的對準標記(省略圖示)。在拍攝對準標記時,從對準部3的上文所說明的照明光源朝對準攝影機31的拍攝區域照射脈衝(pulse)狀的照明光(亦即閃光)。藉此,精密度佳地拍攝移動中的基板9上的對準標記。如上所述,在通過對準攝影機31的下方之校準部5中,由於在校準攝影機53的上端部施加了低反射加工,因此抑制或者防止上文所說明的照明光因為校準攝影機53所致使的反射光射入至對準攝影機31。The stage 21 moves in the +Y direction, passes under the alignment camera 31 as shown in FIG. 7B , and stops after moving to the standby position shown in FIG. 7C . As shown in FIG. 7B , when the stage 21 passes under the alignment camera 31, the alignment mark (not shown) of the substrate 9 pre-set on the substrate holding portion 25 is photographed by the alignment camera 31. When photographing the alignment mark, the illumination light source described above of the alignment portion 3 irradiates a pulsed illumination light (i.e., a flash) toward the photographing area of the alignment camera 31. In this way, the alignment mark on the moving substrate 9 is photographed with high precision. As described above, in the calibration section 5 passing below the alignment camera 31 , since low-reflection processing is applied to the upper end of the alignment camera 53 , the illumination light described above is suppressed or prevented from being reflected by the alignment camera 53 and entering the alignment camera 31 .

藉由對準攝影機31所取得且包含對準標記之圖像(亦即對準圖像)係被輸送至控制部10並被儲存於記憶部111(參照圖5)。在對準資訊取得部115中,基於該對準圖像求出對準資訊。接著,描繪控制部116係基於該對準資訊進行基板9的對準處理(步驟S14)。在對準處理中,為了使基板9的位置與預定的設計位置一致,例如進行台21朝X方向以及Y方向的位移(shift)(亦即微小距離的移動)以及旋轉,或者進行被描繪至基板9上之圖案的描繪資料的修正等。The image (i.e., alignment image) acquired by the alignment camera 31 and including the alignment mark is transmitted to the control unit 10 and stored in the memory unit 111 (see FIG. 5 ). In the alignment information acquisition unit 115, alignment information is obtained based on the alignment image. Next, the drawing control unit 116 performs alignment processing of the substrate 9 based on the alignment information (step S14). In the alignment processing, in order to make the position of the substrate 9 consistent with the predetermined design position, for example, the stage 21 is shifted (i.e., moved a small distance) and rotated in the X direction and the Y direction, or the drawing data of the pattern drawn on the substrate 9 is corrected.

當結束上文所說明的對準處理時,使位於待機位置的台21開始朝-Y方向移動。在校準部5中,在台21開始朝-Y方向移動之前,校準攝影機53係朝X方向移動,並從刻度部52的鉛直下方朝位於+X側或者-X側的退避位置退避。亦即,退避位置係位於比在台21中設置有刻度部52的位置還要+X側或者-X側。藉此,能抑制或者防止被使用於圖案的描繪之較高強度的光線射入至校準攝影機53。When the alignment process described above is completed, the stage 21 located at the standby position starts to move in the -Y direction. In the calibration section 5, before the stage 21 starts to move in the -Y direction, the calibration camera 53 moves in the X direction and retreats from directly below the scale section 52 to a retreat position located on the +X side or the -X side. That is, the retreat position is located on the +X side or the -X side of the position where the scale section 52 is provided in the stage 21. In this way, it is possible to suppress or prevent the high-intensity light used for drawing the pattern from entering the calibration camera 53.

如圖7D所示,在描繪裝置1中,被基板保持部25保持的基板9通過描繪頭41的下方。接著,描繪控制部116(參照圖5)係基於上文所說明的描繪資料以及修正資訊等控制描繪頭41以及台移動機構22,藉此從描繪頭41對在描繪頭41的下方朝Y方向移動的台21上的基板9照射經過調變的光線並描繪圖案(步驟S15)。As shown in FIG. 7D , in the drawing device 1, the substrate 9 held by the substrate holding portion 25 passes under the drawing head 41. Next, the drawing control portion 116 (see FIG. 5 ) controls the drawing head 41 and the stage moving mechanism 22 based on the drawing data and correction information described above, thereby irradiating the substrate 9 on the stage 21 moving in the Y direction under the drawing head 41 with modulated light and drawing a pattern (step S15).

在本實施形態中,如上所述,由於以多程方式對基板9進行圖案描繪,因此從描繪頭41對在描繪頭41的下方朝Y方向往復移動的基板9照射經過調變的光線並描繪圖案。此外,較佳為在對基板9描繪圖案時,在各個描繪頭41中使用光源部42的三個光源421至423(參照圖3)中的兩個以上的光源。藉此,能配合基板9上的感光材料的種類等進行適當的圖案描繪。In the present embodiment, as described above, since the pattern is drawn on the substrate 9 in a multi-pass manner, the substrate 9 reciprocating in the Y direction below the drawing head 41 is irradiated with modulated light from the drawing head 41 to draw the pattern. In addition, it is preferable that two or more light sources of the three light sources 421 to 423 (see FIG. 3 ) of the light source unit 42 are used in each drawing head 41 when drawing the pattern on the substrate 9. In this way, it is possible to draw a suitable pattern in accordance with the type of photosensitive material on the substrate 9.

當結束對基板9描繪圖案時,台21係朝圖7E所示的搬入搬出位置移動(步驟S16)。此時,校準攝影機53係從退避位置朝X方向移動並返回至刻度部52的鉛直下方。藉此,結束對一片基板9描繪圖案。When the pattern drawing on the substrate 9 is completed, the stage 21 moves to the loading and unloading position shown in FIG. 7E (step S16). At this time, the calibration camera 53 moves from the retreat position in the X direction and returns to directly below the scale portion 52. Thus, the pattern drawing on one substrate 9 is completed.

在實際的描繪裝置1中,從步驟S16返回至步驟S11,重複進行步驟S11至步驟S16,依序對複數片基板9進行圖案的描繪。如此,在描繪裝置1中,在每次朝基板保持部25搬入基板9(步驟S11)時進行校準攝影機53所為的檢查圖像的取得(步驟S12),藉此即使在連續地對複數片基板9進行圖案描繪之情形中,亦能以高精密度的狀態維持對於基板9的圖案描繪。In the actual drawing device 1, the process returns from step S16 to step S11, and steps S11 to S16 are repeated to sequentially draw patterns on a plurality of substrates 9. In this way, in the drawing device 1, the calibration camera 53 acquires the inspection image (step S12) each time the substrate 9 is loaded into the substrate holding portion 25 (step S11), thereby maintaining the pattern drawing on the substrate 9 in a high-precision state even when the pattern drawing is continuously performed on a plurality of substrates 9.

在描繪裝置1中,針對全部的描繪頭41之修正資訊的取得(步驟S13)以及基板9的對準處理(步驟S14)係只要直至開始對基板9描繪圖案為止再結束即可。此外,步驟S13的結束係可在步驟S14的結束之前或者之後,亦可略同時。In the drawing device 1, the acquisition of correction information for all drawing heads 41 (step S13) and the alignment processing of the substrate 9 (step S14) only need to be completed until the pattern drawing on the substrate 9 begins. In addition, the completion of step S13 can be before or after the completion of step S14, or can be almost simultaneous.

如以上所說明般,用以對基板9照射光線並進行圖案的描繪之描繪裝置1係具備台21、描繪頭41、主掃描機構(亦即第一移動機構23)、刻度部52、校準攝影機53、修正資訊取得部114以及描繪控制部116。於台21設置有用以保持基板9之基板保持部25。描繪頭41係對基板9照射經過調變的光線。第一移動機構23係將台21於與基板9的上表面91平行的主掃描方向(在上述例子中為Y方向)相對於描繪頭41相對性地移動。刻度部52係在台21上於主掃描方向中與基板保持部25鄰接地設置。校準攝影機53係在刻度部52位於描繪頭41的下方的校準位置的狀態下,拍攝已從描繪頭41照射至刻度部52之預定的校準圖案。修正資訊取得部114係基於檢查圖像求出修正資訊,該檢查圖像係包含藉由校準攝影機53所取得的刻度部52以及校準圖案,該修正資訊係被使用於來自描繪頭41的光線的照射位置的修正。描繪控制部116係基於描繪資料以及修正資訊來控制描繪頭41以及第一移動機構23,藉此一邊使基板9於主掃描方向相對於描繪頭41相對性地移動一邊使描繪頭41執行針對基板9的描繪。在描繪裝置1中,在台21位於搬入搬出位置的狀態下,刻度部52係位於校準位置,該搬入搬出位置為用以進行基板9相對於基板保持部25的搬入以及搬出之位置。藉此,能夠與基板9相對於描繪裝置1的搬入以及搬出並行地進行描繪頭41的校準。因此,能一邊抑制產距時間的增大一邊進行描繪頭41的校準。As described above, the drawing device 1 for drawing a pattern by irradiating light to the substrate 9 comprises a stage 21, a drawing head 41, a main scanning mechanism (i.e., a first moving mechanism 23), a scale unit 52, a calibration camera 53, a correction information acquisition unit 114, and a drawing control unit 116. The stage 21 is provided with a substrate holding unit 25 for holding the substrate 9. The drawing head 41 irradiates the substrate 9 with modulated light. The first moving mechanism 23 moves the stage 21 relative to the drawing head 41 in the main scanning direction (in the above example, the Y direction) parallel to the upper surface 91 of the substrate 9. The scale unit 52 is provided on the stage 21 adjacent to the substrate holding unit 25 in the main scanning direction. The calibration camera 53 captures a predetermined calibration pattern irradiated from the drawing head 41 to the scale portion 52 when the scale portion 52 is located at a calibration position below the drawing head 41. The correction information acquisition unit 114 obtains correction information based on the inspection image including the scale portion 52 and the calibration pattern acquired by the calibration camera 53, and the correction information is used to correct the irradiation position of the light from the drawing head 41. The drawing control unit 116 controls the drawing head 41 and the first moving mechanism 23 based on the drawing data and the correction information, thereby causing the drawing head 41 to perform drawing on the substrate 9 while relatively moving the substrate 9 in the main scanning direction relative to the drawing head 41. In the drawing device 1, when the stage 21 is located at the loading and unloading position, which is a position for loading and unloading the substrate 9 relative to the substrate holding portion 25, the scale portion 52 is located at the calibration position. This allows the drawing head 41 to be calibrated in parallel with the loading and unloading of the substrate 9 relative to the drawing device 1. Therefore, the drawing head 41 can be calibrated while suppressing an increase in the production time.

如上所述,較佳為描繪裝置1係進一步地具備對準攝影機31以及對準資訊取得部115。對準攝影機31係拍攝基板9上的對準標記。對準資訊取得部115係基於藉由對準攝影機31所取得的對準標記的圖像(亦即對準圖像)求出對準資訊,該對準資訊係被使用於基板9相對於描繪頭41之相對位置的修正。對準攝影機31係於主掃描方向中隔著描繪頭41位於台21中之與基板保持部25相反之側,該台21係位於搬入搬出位置。藉此,與對準攝影機31位於描繪頭41與台21的基板保持部25之間且該台21位於搬入搬出位置之情形相比,能於主掃描方向將台21小型化。結果,能於主掃描方向將描繪裝置1小型化。As described above, it is preferable that the drawing device 1 further includes an alignment camera 31 and an alignment information acquisition unit 115. The alignment camera 31 captures the alignment mark on the substrate 9. The alignment information acquisition unit 115 obtains alignment information based on the image of the alignment mark acquired by the alignment camera 31 (i.e., the alignment image), and the alignment information is used to correct the relative position of the substrate 9 with respect to the drawing head 41. The alignment camera 31 is located on the side of the stage 21 opposite to the substrate holding unit 25 across the drawing head 41 in the main scanning direction, and the stage 21 is located at the loading and unloading position. Thus, compared with the case where the alignment camera 31 is located between the imaging head 41 and the substrate holding portion 25 of the stage 21 and the stage 21 is located at the loading/unloading position, the stage 21 can be miniaturized in the main scanning direction. As a result, the imaging device 1 can be miniaturized in the main scanning direction.

如上所述,較佳為描繪裝置1係進一步地具備:支撐部40,係在台21的上方支撐描繪頭41。此外,對準攝影機31亦被支撐部40支撐。藉此,與分別設置有描繪頭41用的支撐部與對準攝影機31用的支撐部之情形相比,能簡化描繪裝置1的構造,且能於主掃描方向將描繪裝置1小型化。此外,在分別設置有描繪頭41用的支撐部以及對準攝影機31用的支撐部之情形中,雖然會有描繪頭41以及對準攝影機31的相對位置的偏離因為兩個支撐部的熱變形等而變大之可能性,然而如上所述般,藉由將一個構件的支撐部40共用於描繪頭41以及對準攝影機31的支撐,能抑制描繪頭41以及對準攝影機31的相對位置的偏離。As described above, it is preferable that the drawing device 1 further comprises a support portion 40 for supporting the drawing head 41 above the stage 21. In addition, the aiming camera 31 is also supported by the support portion 40. Thus, compared with the case where a support portion for the drawing head 41 and a support portion for the aiming camera 31 are provided separately, the structure of the drawing device 1 can be simplified, and the drawing device 1 can be miniaturized in the main scanning direction. In addition, in the case where a support portion for the drawing head 41 and a support portion for the alignment camera 31 are separately provided, although there is a possibility that the relative position deviation of the drawing head 41 and the alignment camera 31 may become larger due to thermal deformation of the two support portions, as described above, by using the support portion 40 of a single component in common for supporting the drawing head 41 and the alignment camera 31, the relative position deviation of the drawing head 41 and the alignment camera 31 can be suppressed.

如上所述,刻度部52為透光性刻度構件,配置於台21的上表面。校準攝影機53係在透光性刻度構件的下方安裝於台21,用以拍攝已透過該透光性刻度構件的校準圖案。較佳為,於校準攝影機53的上端部施予有低反射加工。藉此,在對準攝影機31進行拍攝時等,能抑制來自校準攝影機53的反射光(例如來自物鏡的框架的反射光)射入至對準攝影機31。因此,由於在對準攝影機31進行拍攝時無需使校準攝影機53從刻度部52的下方退避,因此能縮短產距時間。As described above, the scale portion 52 is a translucent scale member, and is disposed on the upper surface of the table 21. The calibration camera 53 is mounted on the table 21 below the translucent scale member, and is used to photograph the calibration pattern that has passed through the translucent scale member. Preferably, a low-reflection process is applied to the upper end portion of the calibration camera 53. Thereby, when the alignment camera 31 is shooting, etc., it is possible to suppress the reflected light from the calibration camera 53 (for example, the reflected light from the frame of the objective lens) from entering the alignment camera 31. Therefore, since it is not necessary to retract the calibration camera 53 from the bottom of the scale portion 52 when the alignment camera 31 is shooting, the production time can be shortened.

如上所述,較佳為刻度部52上的校準圖案的主掃描方向中的位置係能夠在台21已經靜止的狀態下藉由描繪頭41進行變更。藉此,在校準圖案從刻度部52上的預定位置朝主掃描方向較大幅地偏離之情形中,無需使台21移動即能夠拍攝校準圖案。因此,能防止校準時台21的移動導致產距時間的增大。As described above, it is preferred that the position of the calibration pattern on the scale portion 52 in the main scanning direction can be changed by the drawing head 41 while the stage 21 is stationary. In this way, when the calibration pattern deviates significantly from the predetermined position on the scale portion 52 in the main scanning direction, the calibration pattern can be photographed without moving the stage 21. Therefore, it is possible to prevent the increase in the tact time caused by the movement of the stage 21 during calibration.

如上所述,較佳為描繪頭41係具備:複數個光源(在上述例子中為光源421至423),係射出彼此不同的波長的光線。此外,在對基板9進行描繪時,使用複數個光源中的兩個以上的光源;朝刻度部52照射校準圖案時,僅使用複數個光源中的一個光源。藉此,在對基板9描繪圖案時,能配合基板9上的感光材料的種類等選擇使用光源以及光量比等,從而能進行適當的圖案描繪。此外,配合來自一個光源的光線的波長來設定校準攝影機53,藉此能精密度佳地拍攝校準圖案。As described above, it is preferable that the drawing head 41 has: a plurality of light sources (light sources 421 to 423 in the above example) that emit light of different wavelengths. In addition, when drawing the substrate 9, two or more of the plurality of light sources are used; when irradiating the calibration pattern toward the scale portion 52, only one of the plurality of light sources is used. Thereby, when drawing the pattern on the substrate 9, the light source and the light quantity ratio can be selected in accordance with the type of photosensitive material on the substrate 9, so that appropriate pattern drawing can be performed. In addition, the calibration camera 53 is set in accordance with the wavelength of the light from one light source, so that the calibration pattern can be photographed with high precision.

如上所述,較佳為在描繪裝置1,複數個描繪頭41係排列於與基板9的上表面91平行且相對於主掃描方向呈傾斜之排列方向。該複數個描繪頭41係包含上文所說明的描繪頭41且分別對基板9照射經過調變的光線。此外,校準攝影機53係在刻度部52位於校準位置的狀態下,一邊於上文所說明的排列方向移動一邊依序拍攝從複數個描繪頭41分別照射至刻度部52之複數個校準圖案。藉此,與於校準部5設置複數個校準攝影機之情形相比,能簡化描繪裝置1的構造並能降低描繪裝置1的製造成本。As described above, it is preferred that in the drawing device 1, the plurality of drawing heads 41 are arranged in an arrangement direction parallel to the upper surface 91 of the substrate 9 and inclined relative to the main scanning direction. The plurality of drawing heads 41 include the drawing heads 41 described above and irradiate the substrate 9 with modulated light respectively. In addition, the calibration camera 53 sequentially photographs the plurality of calibration patterns irradiated from the plurality of drawing heads 41 to the scale portion 52 while moving in the arrangement direction described above when the scale portion 52 is located at the calibration position. In this way, compared with the case where a plurality of calibration cameras are provided in the calibration portion 5, the structure of the drawing device 1 can be simplified and the manufacturing cost of the drawing device 1 can be reduced.

如上所述,較佳為校準攝影機53所為的檢查圖像的取得(步驟S12)所需的時間係比為了從基板保持部25搬出一片基板9並將新的基板9搬入至基板保持部25所需的時間還短。藉此,能在結束基板9的搬入以及搬出後立即開始台21的移動。因此,能防止因為校準導致產距時間的增大。As described above, it is preferable that the time required for obtaining the inspection image (step S12) for calibrating the camera 53 is shorter than the time required for unloading a substrate 9 from the substrate holding portion 25 and loading a new substrate 9 into the substrate holding portion 25. Thus, the movement of the stage 21 can be started immediately after the loading and unloading of the substrate 9 are completed. Therefore, the increase in the production time due to calibration can be prevented.

如上所述,較佳為校準攝影機53所為的檢查圖像的取得係在每次朝基板保持部25搬入基板9時進行。藉此,能一邊抑制產距時間的增大一邊實現高精密度的描繪。As described above, it is preferable that the inspection image is obtained by the calibration camera 53 every time the substrate 9 is carried to the substrate holding portion 25. Thereby, high-precision drawing can be realized while suppressing the increase of the production time.

上文所說明的描繪方法係具備下述工序:在設置有基板保持部25以及刻度部52之台21位於搬入搬出位置的狀態下,拍攝已從描繪頭41照射至位於描繪頭41的下方的校準位置的刻度部52之預定的校準圖案,其中,基板保持部25係用以保持基板9,刻度部52係在與基板9的上表面91平行的主掃描方向中與基板保持部25鄰接,搬入搬出位置為用以進行基板9相對於基板保持部25搬入以及搬出之位置(步驟S12);基於檢查圖像求出修正資訊,該檢查圖像係包含藉由在步驟S12中所取得的刻度部52以及校準圖案,該修正資訊係被使用於來自描繪頭41的光線的照射位置的修正(步驟S13);以及基於描繪資料以及修正資訊,從描繪頭41對於主掃描方向相對於描繪頭41相對性地移動之基板9照射經過調變的光線並對基板9進行描繪(步驟S15)。藉此,與上文所說明同樣地,能一邊抑制產距時間的增大一邊進行描繪頭41的校準。The above-described drawing method comprises the following steps: when the stage 21 provided with the substrate holding portion 25 and the scale portion 52 is located at the loading and unloading position, a predetermined calibration pattern of the scale portion 52 which has been irradiated from the drawing head 41 to the calibration position located below the drawing head 41 is photographed, wherein the substrate holding portion 25 is used to hold the substrate 9, and the scale portion 52 is adjacent to the substrate holding portion 25 in the main scanning direction parallel to the upper surface 91 of the substrate 9, and the loading and unloading position is used to perform the substrate 9 relative to the substrate holding portion. 25 is carried in and out (step S12); correction information is obtained based on the inspection image, the inspection image is composed of the scale portion 52 and the calibration pattern obtained in step S12, and the correction information is used to correct the irradiation position of the light from the drawing head 41 (step S13); and based on the drawing data and the correction information, the drawing head 41 irradiates the substrate 9 that moves relatively in the main scanning direction with respect to the drawing head 41 with modulated light and draws the substrate 9 (step S15). In this way, as described above, the drawing head 41 can be calibrated while suppressing the increase of the production time.

在上文所說明的描繪裝置1以及描繪方法中能夠進行各種變更。Various modifications can be made to the drawing device 1 and the drawing method described above.

例如,在描繪頭41的光源部42中,在拍攝檢查圖像時亦可從兩個以上的光源射出光線。此外,光源部42並不一定需要具備複數個光源,亦可僅具備一個光源。For example, in the light source unit 42 of the drawing head 41, light may be emitted from two or more light sources when photographing the inspection image. In addition, the light source unit 42 does not necessarily need to have a plurality of light sources, and may only have one light source.

在描繪裝置1中,刻度部52上的校準圖案的Y方向的位置並不一定需要藉由描繪頭41而變更,亦可藉由台21於Y方向移動而變更。In the drawing device 1, the position of the calibration pattern on the scale portion 52 in the Y direction does not necessarily need to be changed by the drawing head 41, and can also be changed by moving the stage 21 in the Y direction.

在描繪裝置1中,校準攝影機53所為的檢查圖像的取得(步驟S12)所需的時間亦可比從基板保持部25搬出一片基板9並將新的基板9搬入至基板保持部25所需的時間還長,亦可略相同。在任一種情形中,並行地進行基板9的搬入與搬出以及描繪頭41的校準,藉此能縮短產距時間。In the drawing device 1, the time required for obtaining the inspection image by calibrating the camera 53 (step S12) may be longer than the time required for unloading a substrate 9 from the substrate holding portion 25 and loading a new substrate 9 into the substrate holding portion 25, or may be approximately the same. In either case, the loading and unloading of the substrate 9 and the calibration of the drawing head 41 are performed in parallel, thereby shortening the production time.

在描繪裝置1中亦可為:在校準部5的拍攝部51中,在刻度部52的鉛直下方於X方向排列有分別與複數個描繪頭41分別對應的複數個(亦即與描繪頭41相同數量)的校準攝影機53,且略同時地取得複數個描繪頭41的檢查圖像。In the drawing device 1, in the shooting section 51 of the calibration section 5, a plurality of calibration cameras 53 (i.e., the same number as the drawing heads 41) corresponding to the plurality of drawing heads 41 are arranged in the X direction directly below the scale section 52, and inspection images of the plurality of drawing heads 41 are obtained approximately simultaneously.

在描繪裝置1中,校準攝影機53的上端部中的低反射加工並不一定需要施予。在此種情形中,在對準攝影機31所為的對準圖像的取得時,校準攝影機53亦可因應需要從刻度部52的鉛直下方朝+X側或者-X側的退避位置退避。In the drawing device 1, it is not necessary to perform low reflection processing on the upper end of the calibration camera 53. In this case, when the calibration camera 31 acquires the alignment image, the calibration camera 53 can also retreat to the retreat position on the +X side or -X side from directly below the scale portion 52 as needed.

在描繪裝置1中,校準攝影機53的退避位置不一定需要位於比刻度部52還要+X側或者-X側。例如,該退避位置亦可設定成在X方向中鄰接的兩個描繪頭41之間。在此種情形中,與將退避位置設置於比刻度部52還要+X側或者-X側之情形相比,由於能減少校準攝影機53的退避時的X方向的移動量,因此能進一步地縮短產距時間。In the drawing device 1, the retreat position of the calibration camera 53 does not necessarily need to be located on the +X side or -X side of the scale portion 52. For example, the retreat position may be set between two adjacent drawing heads 41 in the X direction. In this case, compared with the case where the retreat position is set on the +X side or -X side of the scale portion 52, the movement amount of the calibration camera 53 in the X direction during retreat can be reduced, so the production time can be further shortened.

在描繪裝置1中,描繪頭41以及對準攝影機31不一定需要藉由一個支撐部40支撐,亦可藉由於Y方向分離地配置且為各自獨立的構件之兩個支撐部分別支撐。In the drawing device 1, the drawing head 41 and the aiming camera 31 do not necessarily need to be supported by one supporting portion 40, and may be supported by two supporting portions which are separately arranged in the Y direction and are independent components.

在描繪裝置1中,對準攝影機31亦可設置於描繪頭41與位於搬入搬出位置的台21的基板保持部25之間。In the image drawing apparatus 1, the alignment camera 31 may be provided between the image drawing head 41 and the substrate holding portion 25 of the stage 21 located at the loading/unloading position.

在描繪裝置1中,刻度部52並不一定需要具有透光性,校準攝影機53亦不一定需要安裝於台21。例如,刻度部52亦可為反射板,用以將從描繪頭41照射的光線反射至預定的方向。亦可為:校準攝影機53係例如在從台21離開的位置處被固定於描繪裝置1的框架等,接收來自刻度部52的反射光,藉此拍攝檢查圖像,該檢查圖像係包含被照射至刻度部52上的校準圖案以及刻度部52上的刻度。In the drawing device 1, the scale portion 52 does not necessarily need to be light-transmissive, and the calibration camera 53 does not necessarily need to be installed on the stage 21. For example, the scale portion 52 may also be a reflector for reflecting the light irradiated from the drawing head 41 in a predetermined direction. Alternatively, the calibration camera 53 may be fixed to a frame of the drawing device 1 at a position away from the stage 21, for example, to receive the reflected light from the scale portion 52, thereby capturing an inspection image, which includes the calibration pattern irradiated on the scale portion 52 and the scale on the scale portion 52.

台21係只要藉由第一移動機構23於主掃描方向相對於描繪頭41相對性地移動即可。因此,例如亦可為:台21係被固定;在台21的上方,描繪頭41係藉由第一移動機構23於主掃描方向移動。同樣地,亦可藉由第二移動機構24使描繪頭41朝副掃描方向移動。The stage 21 can be moved relative to the drawing head 41 in the main scanning direction by the first moving mechanism 23. Therefore, for example, the stage 21 can be fixed, and the drawing head 41 can be moved in the main scanning direction by the first moving mechanism 23 above the stage 21. Similarly, the drawing head 41 can be moved in the sub-scanning direction by the second moving mechanism 24.

在描繪裝置1中,不一定需要在每次搬入基板9時進行校準,例如亦可在結束對兩片以上的預定片數的基板9描繪圖案時進行描繪頭41的校準。In the drawing device 1, it is not necessary to perform calibration every time a substrate 9 is loaded. For example, the drawing head 41 may be calibrated when the drawing of patterns on a predetermined number of substrates 9 of two or more sheets is completed.

上文所說明的基板9並未限定於印刷基板。在描繪裝置1中,例如亦可對半導體基板、半導體封裝用基板、液晶顯示裝置或者電漿顯示裝置等平板面板顯示裝置用的玻璃基板、光罩用的玻璃基板、太陽電池面板用的基板等進行圖案的描繪。The substrate 9 described above is not limited to a printed circuit board. In the drawing device 1, for example, patterns can be drawn on semiconductor substrates, semiconductor packaging substrates, glass substrates for flat panel display devices such as liquid crystal display devices or plasma display devices, glass substrates for photomasks, and substrates for solar cell panels.

上述實施形態以及各個變化例中的構成只要未相互矛盾亦可適當地組合。The configurations in the above-mentioned embodiments and various modifications may be appropriately combined as long as they do not contradict each other.

雖然已經詳細地描述並說明本發明,然而上述說明僅為例示性而非示限定性。因此,只要不脫離本發明的範圍,則能視為能夠有各種變化以及各種態樣。Although the present invention has been described and illustrated in detail, the above description is for illustrative purposes only and is not intended to be limiting. Therefore, various changes and modifications can be made without departing from the scope of the present invention.

1:描繪裝置 3:對準部 4:描繪部 5:校準部 9:基板 10:控制部 21:台 22:台移動機構 23:第一移動機構 24:第二移動機構 25:基板保持部 31:對準攝影機 40:支撐部 41:描繪頭 42:光源部 43:照明光學系統 44:空間光線調變器(光線調變器) 45:投影光學系統 51:拍攝部 52:刻度部 53:校準攝影機 54:攝影機移動機構 91:(基板的)上表面 100:電腦 101:處理器 102:記憶體 103:輸入輸出部 104:匯流排 105:鍵盤 106:滑鼠 107:顯示器 111:記憶部 112:拍攝控制部 113:位置檢測部 114:修正資訊取得部 115:對準資訊取得部 116:描繪控制部 421至423:光源 S11至S16:步驟 1: Drawing device 3: Alignment unit 4: Drawing unit 5: Calibration unit 9: Substrate 10: Control unit 21: Stage 22: Stage moving mechanism 23: First moving mechanism 24: Second moving mechanism 25: Substrate holding unit 31: Alignment camera 40: Support unit 41: Drawing head 42: Light source unit 43: Illumination optical system 44: Spatial light modulator (light modulator) 45: Projection optical system 51: Shooting unit 52: Scale unit 53: Calibration camera 54: Camera moving mechanism 91: Upper surface (of substrate) 100: Computer 101: Processor 102: Memory 103: Input/output unit 104: Bus 105: Keyboard 106: Mouse 107: Display 111: Memory unit 112: Shooting control unit 113: Position detection unit 114: Correction information acquisition unit 115: Alignment information acquisition unit 116: Drawing control unit 421 to 423: Light source S11 to S16: Steps

[圖1]係顯示實施形態之一的描繪裝置之立體圖。 [圖2]係放大地顯示校準部附近之俯視圖。 [圖3]係顯示校準部以及描繪頭的內部的構成之圖。 [圖4]係顯示電腦的構成之圖。 [圖5]係顯示控制部的功能之方塊圖。 [圖6]係顯示圖案描繪的流程之圖。 [圖7A]係示意性地顯示描繪裝置的主要構成之前視圖。 [圖7B]係示意性地顯示描繪裝置的主要構成之前視圖。 [圖7C]係示意性地顯示描繪裝置的主要構成之前視圖。 [圖7D]係示意性地顯示描繪裝置的主要構成之前視圖。 [圖7E]係示意性地顯示描繪裝置的主要構成之前視圖。 [Figure 1] is a three-dimensional diagram showing a drawing device of one embodiment. [Figure 2] is an enlarged top view showing the vicinity of the calibration unit. [Figure 3] is a diagram showing the internal structure of the calibration unit and the drawing head. [Figure 4] is a diagram showing the structure of the computer. [Figure 5] is a block diagram showing the functions of the control unit. [Figure 6] is a diagram showing the flow of pattern drawing. [Figure 7A] is a schematic front view showing the main structure of the drawing device. [Figure 7B] is a schematic front view showing the main structure of the drawing device. [Figure 7C] is a schematic front view showing the main structure of the drawing device. [Figure 7D] is a schematic front view showing the main structure of the drawing device. [Figure 7E] is a schematic front view showing the main structure of the drawing device.

1:描繪裝置 1: Drawing device

4:描繪部 4: Drawing Department

5:校準部 5: Calibration Department

9:基板 9: Substrate

21:台 21: Taiwan

22:台移動機構 22: Mobile mechanism

23:第一移動機構 23: First moving mechanism

25:基板保持部 25: Substrate holding part

41:描繪頭 41: Drawing head

52:刻度部 52: Scale part

53:校準攝影機 53: Calibrate the camera

Claims (10)

一種描繪裝置,係用以對基板照射光線並進行圖案的描繪,並具備:台,係設置有用以保持前述基板之基板保持部;描繪頭,係對前述基板照射經過調變的光線;主掃描機構,係將前述台於與前述基板的上表面平行的主掃描方向相對於前述描繪頭相對性地移動;刻度部,係在前述台上於前述主掃描方向中與前述基板保持部鄰接地設置;校準攝影機,係在前述刻度部位於前述描繪頭的下方的校準位置的狀態下,拍攝已從前述描繪頭照射至前述刻度部之預定的校準圖案;修正資訊取得部,係基於檢查圖像求出修正資訊,前述檢查圖像係包含藉由前述校準攝影機所取得的前述刻度部以及前述校準圖案,前述修正資訊係被使用於來自前述描繪頭的光線的照射位置的修正;以及描繪控制部,係基於描繪資料以及前述修正資訊來控制前述描繪頭以及前述主掃描機構,藉此一邊使前述基板於前述主掃描方向相對於前述描繪頭相對性地移動一邊使前述描繪頭執行針對前述基板的描繪;在前述台位於搬入搬出位置的狀態下,前述刻度部係位於前述校準位置,且藉由前述校準攝影機拍攝從前述描繪頭照射至前述刻度部的前述校準圖案,前述搬入搬出位置為用以進行前述基板相對於前述基板保持部的搬入以及搬出之位置。 A drawing device is used to irradiate light onto a substrate and draw a pattern, and comprises: a stage, which is provided with a substrate holding portion for holding the substrate; a drawing head, which irradiates the substrate with modulated light; a main scanning mechanism, which moves the stage relatively to the drawing head in a main scanning direction parallel to the upper surface of the substrate; a scale portion, which is provided on the stage adjacent to the substrate holding portion in the main scanning direction; a calibration camera, which photographs a predetermined calibration pattern irradiated from the drawing head to the scale portion when the scale portion is at a calibration position below the drawing head; and a correction information acquisition portion, which obtains correction information based on an inspection image, wherein the inspection image includes the calibration image obtained by the calibration camera. The calibration part and the calibration pattern obtained by the imager are used to correct the irradiation position of the light from the imager; and the imager control part controls the imager head and the main scanning mechanism based on the imager data and the correction information, thereby causing the imager head to perform image drawing on the substrate while moving the substrate relative to the imager head in the main scanning direction; when the stage is located at the loading and unloading position, the calibration part is located at the calibration position, and the calibration pattern irradiated from the imager head to the calibration part is photographed by the calibration camera, and the loading and unloading position is a position for loading and unloading the substrate relative to the substrate holding part. 如請求項1所記載之描繪裝置,其中進一步地具備: 對準攝影機,係拍攝前述基板上的對準標記;以及對準資訊取得部,係基於藉由前述對準攝影機所取得的前述對準標記的圖像求出對準資訊,前述對準資訊係被使用於前述基板相對於前述描繪頭之相對位置的修正;前述對準攝影機係於前述主掃描方向中隔著前述描繪頭位於前述台中之與前述基板保持部相反之側,且前述台係位於前述搬入搬出位置。 The drawing device as described in claim 1 further comprises: an alignment camera for photographing the alignment mark on the substrate; and an alignment information acquisition unit for obtaining alignment information based on the image of the alignment mark acquired by the alignment camera, wherein the alignment information is used to correct the relative position of the substrate relative to the drawing head; the alignment camera is located on the side of the stage opposite to the substrate holding portion across the drawing head in the main scanning direction, and the stage is located at the carrying-in and carrying-out position. 如請求項2所記載之描繪裝置,其中前述描繪裝置係進一步地具備:支撐部,係在前述台的上方支撐前述描繪頭;前述對準攝影機亦被前述支撐部支撐。 The drawing device as described in claim 2, wherein the drawing device further comprises: a support portion, which supports the drawing head above the platform; the alignment camera is also supported by the support portion. 如請求項1所記載之描繪裝置,其中前述刻度部為透光性刻度構件,配置於前述台的上表面;前述校準攝影機係在前述透光性刻度構件的下方安裝於前述台,用以拍攝已透過前述透光性刻度構件的前述校準圖案;於前述校準攝影機的上端部施予有低反射加工。 The drawing device described in claim 1, wherein the scale portion is a translucent scale member disposed on the upper surface of the table; the calibration camera is mounted on the table below the translucent scale member to photograph the calibration pattern that has passed through the translucent scale member; and a low-reflection process is applied to the upper end of the calibration camera. 如請求項1所記載之描繪裝置,其中前述刻度部上的前述校準圖案的前述主掃描方向中的位置係能夠在前述台已經靜止的狀態下藉由前述描繪頭進行變更。 A drawing device as described in claim 1, wherein the position of the calibration pattern on the scale portion in the main scanning direction can be changed by the drawing head when the stage is stationary. 如請求項1所記載之描繪裝置,其中前述描繪頭係具備:複數個光源,係射出彼此不同的波長的光線;在對前述基板進行描繪時,使用複數個前述光源中的兩個以上的光源;朝前述刻度部照射前述校準圖案時,僅使用複數個前述光源中的一個光源。 The drawing device as described in claim 1, wherein the drawing head comprises: a plurality of light sources emitting light of different wavelengths; when drawing the substrate, two or more of the plurality of light sources are used; when irradiating the calibration pattern toward the scale portion, only one of the plurality of light sources is used. 如請求項1所記載之描繪裝置,其中包含前述描繪頭且用以分別 對前述基板照射經過調變的光線之複數個描繪頭係排列於與前述基板的上表面平行且相對於前述主掃描方向呈傾斜之排列方向;前述校準攝影機係在前述刻度部位於前述校準位置的狀態下,一邊於前述排列方向移動一邊依序拍攝從複數個前述描繪頭分別照射至前述刻度部之複數個校準圖案。 The drawing device as described in claim 1, wherein the drawing heads include the drawing heads and are used to irradiate the modulated light to the substrate respectively. The drawing heads are arranged in an arrangement direction parallel to the upper surface of the substrate and inclined relative to the main scanning direction; the calibration camera moves in the arrangement direction while the calibration portion is in the calibration position, and sequentially photographs the calibration patterns irradiated to the calibration portion by the drawing heads. 如請求項1至7中任一項所記載之描繪裝置,其中前述校準攝影機所為的前述檢查圖像的取得所需的時間係比為了從前述基板保持部搬出一片基板並將新的基板搬入至前述基板保持部所需的時間還短。 A drawing device as recited in any one of claims 1 to 7, wherein the time required for the calibration camera to obtain the inspection image is shorter than the time required to remove a substrate from the substrate holding portion and to move a new substrate into the substrate holding portion. 如請求項1至7中任一項所記載之描繪裝置,其中前述校準攝影機所為的前述檢查圖像的取得係在每次朝前述基板保持部搬入基板時進行。 A drawing device as described in any one of claims 1 to 7, wherein the acquisition of the inspection image by the calibration camera is performed each time the substrate is moved into the substrate holding portion. 一種描繪方法,係用以對基板照射光線並進行圖案的描繪,並具備下述工序:工序a,係在設置有基板保持部以及刻度部之台位於搬入搬出位置的狀態下,拍攝已從描繪頭照射至位於前述描繪頭的下方的校準位置的前述刻度部之預定的校準圖案,其中,前述基板保持部係用以保持前述基板,前述刻度部係在與前述基板的上表面平行的主掃描方向中與前述基板保持部鄰接,前述搬入搬出位置為用以進行前述基板相對於前述基板保持部的搬入以及搬出之位置;工序b,係基於檢查圖像求出修正資訊,前述檢查圖像係包含藉由在前述工序a中所取得的前述刻度部以及前述校準圖案,前述修正資訊係被使用於來自前述描繪頭的光線的照射位置的修正;以及工序c,係基於描繪資料以及前述修正資訊,從前述描繪頭對於前述主掃 描方向相對於前述描繪頭相對性地移動之前述基板照射經過調變的光線並對前述基板進行描繪。 A drawing method is used to irradiate light onto a substrate and draw a pattern, and has the following steps: Step a, when a stage provided with a substrate holding part and a scale part is located at a carry-in/carry-out position, photographing a predetermined calibration pattern of the scale part that has been irradiated from a drawing head to a calibration position located below the drawing head, wherein the substrate holding part is used to hold the substrate, the scale part is adjacent to the substrate holding part in a main scanning direction parallel to the upper surface of the substrate, and the carry-in/carry-out position is used to carry out relative scanning of the substrate. The process b is to obtain correction information based on the inspection image, the inspection image includes the scale part and the calibration pattern obtained in the process a, and the correction information is used to correct the irradiation position of the light from the drawing head; and the process c is to irradiate the substrate with the modulated light from the drawing head relative to the main scanning direction relative to the drawing head based on the drawing data and the correction information, and draw the substrate.
TW112116211A 2022-09-16 2023-05-02 Drawing apparatus and drawing method TWI863241B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022148502A JP2024043357A (en) 2022-09-16 2022-09-16 Drawing device and drawing method
JP2022-148502 2022-09-16

Publications (2)

Publication Number Publication Date
TW202414123A TW202414123A (en) 2024-04-01
TWI863241B true TWI863241B (en) 2024-11-21

Family

ID=90209436

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112116211A TWI863241B (en) 2022-09-16 2023-05-02 Drawing apparatus and drawing method

Country Status (4)

Country Link
JP (1) JP2024043357A (en)
KR (1) KR102913486B1 (en)
CN (1) CN117724297A (en)
TW (1) TWI863241B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8785888B2 (en) * 2012-09-27 2014-07-22 Dainippon Screen Mfg. Co., Ltd. Apparatus for and method of drawing
JP6206945B2 (en) * 2013-03-07 2017-10-04 株式会社ブイ・テクノロジー Scanning exposure apparatus and scanning exposure method
CN111033388A (en) * 2017-09-05 2020-04-17 株式会社 V 技术 Exposure device
TW202234729A (en) * 2018-06-20 2022-09-01 日商信越化學工業股份有限公司 Transfer device, method of use and method of adjustment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6225012B1 (en) * 1994-02-22 2001-05-01 Nikon Corporation Method for positioning substrate
JP2006301301A (en) 2005-04-20 2006-11-02 Fuji Photo Film Co Ltd Conveyance error measuring method, calibration method, drawing method, exposure drawing method, drawing device, and exposure drawing device
JP6117594B2 (en) * 2013-03-29 2017-04-19 株式会社Screenホールディングス Drawing apparatus and drawing method
JP6480680B2 (en) * 2014-08-02 2019-03-13 株式会社アドテックエンジニアリング Illuminance ratio changing method and exposure method
JP2021021782A (en) 2019-07-25 2021-02-18 株式会社Screenホールディングス Pattern forming apparatus and pattern forming method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8785888B2 (en) * 2012-09-27 2014-07-22 Dainippon Screen Mfg. Co., Ltd. Apparatus for and method of drawing
JP6206945B2 (en) * 2013-03-07 2017-10-04 株式会社ブイ・テクノロジー Scanning exposure apparatus and scanning exposure method
CN111033388A (en) * 2017-09-05 2020-04-17 株式会社 V 技术 Exposure device
TW202234729A (en) * 2018-06-20 2022-09-01 日商信越化學工業股份有限公司 Transfer device, method of use and method of adjustment

Also Published As

Publication number Publication date
JP2024043357A (en) 2024-03-29
CN117724297A (en) 2024-03-19
KR20240038572A (en) 2024-03-25
KR102913486B1 (en) 2026-01-15
TW202414123A (en) 2024-04-01

Similar Documents

Publication Publication Date Title
US9001306B2 (en) Exposure apparatus, exposure method, and method of manufacturing device
US9441957B2 (en) Three-dimensional shape measuring apparatus
TWI759621B (en) Drawing apparatus and drawing method
TWI794438B (en) Wafer Position Measuring Device
CN101185035A (en) Method and device for obtaining workpiece position information
JP2022046117A (en) Board inspection equipment
TWI863241B (en) Drawing apparatus and drawing method
TWI845977B (en) Writing apparatus and writing method
KR20180037590A (en) Assist exposure apparatus and method of obtaining exposure distribution
KR20080088946A (en) Three-dimensional shape inspection device and three-dimensional shape inspection method using the same
TWI876025B (en) Methods and non-transitory computer-readable medium for correcting lithography systems
JP7489913B2 (en) Drawing device and drawing method
KR20080089314A (en) Three-dimensional shape inspection device and three-dimensional shape inspection method using the same
TW202246910A (en) Exposure apparatus, method for manufacturing device, method for manufacturing flat panel display, and exposure method
CN120295061A (en) Drawing device and drawing method
KR102831172B1 (en) Method of acquiring drawing position information and Drawing method
JP2006058496A (en) Substrate measurement device, substrate carrying device, and image forming apparatus equipped with substrate measuring device, and substrate measuring method
KR20250017679A (en) Detecting apparatus, exposure apparatus, and detecting method
JP2024062787A (en) Exposure apparatus and article manufacturing method
TW202414105A (en) Exposure apparatus and beam distance measuring method thereof
JP2022042086A (en) Recognition camera calibration system and recognition camera calibration method