TWI863130B - Cooling structure having metal plating layer - Google Patents

Abstract

A cooling structure having a metal plating layer is provided. The cooling structure has a substrate, a first metal plating layer and a second metal plating layer that are made of materials different from one another and are formed on the substrate by different processes. The first metal plating layer is formed on the substrate by wet processing. The second metal plating layer having a thickness of 0.1 to 5μm is formed on the first metal plating layer by sputtering. The second metal plating layer is composed of at least three blocks arranged at intervals, and the distance between at least two adjacent blocks is not equal to the distance between the other adjacent blocks.

Description

Heat sink structure with metal coating

The present invention relates to a heat sink structure, and more specifically to a heat sink structure with a metal coating.

Some heat sinks have a coating for sintering on their surface, which is used to connect to the power chip. However, the shrinkage of the coating after sintering and the stress shock caused by the thermal changes of the power chip on it during operation are very detrimental to the heat sink.

In view of this, the inventor has been engaged in the development and design of related products for many years and feels that the above-mentioned deficiencies can be improved. Therefore, he has devoted himself to research and applied academic theories, and finally proposed a reasonable design and effective improvement of the above-mentioned deficiencies.

The technical problem that the present invention aims to solve is to provide a heat sink structure with a metal coating to address the deficiencies of the existing technology.

The present invention discloses a heat sink structure with a metal coating, which has a substrate and a first metal coating and a second metal coating formed on the substrate by two different materials and processes; wherein the first metal coating is a coating formed on the substrate by a wet process, and the second metal coating is a coating with a thickness of 0.1 to 5 μm formed on the first metal coating by a sputtering process, and the second metal coating is composed of at least three or more spaced blocks, and the spacing between at least two of the blocks is unequal to the spacing between the other blocks.

In a preferred embodiment, the substrate is at least one of a copper/copper alloy layer and an aluminum/aluminum alloy layer.

In a preferred embodiment, the first metal plating layer is at least one of a nickel/nickel alloy layer and a nickel-phosphorus alloy layer.

In a preferred embodiment, the second metal plating layer is a silver/silver alloy layer.

In a preferred embodiment, the multiple blocks of the second metal coating layer are arranged symmetrically relative to the center line of the substrate, and the arrangement spacing between the two blocks closest to the center line of the substrate is greater than the arrangement spacing between the other blocks.

In a preferred embodiment, when the arrangement spacing between the two blocks closest to the center line of the substrate is 1, the arrangement spacing between the other blocks gradually decreases by 1/2^N times in the direction away from the center line of the substrate, where N starts from 1 and the increment is 1.

In a preferred embodiment, when each of the blocks is rectangular and has the same size, the arrangement spacing between the two blocks closest to the center line of the substrate is twice the width of each of the blocks along the arrangement direction.

In a preferred embodiment, the substrate surface is integrally formed with a plurality of fins, and the fins are needle fins.

In a preferred embodiment, the base has a water inlet and a water outlet connected to each other.

In a preferred embodiment, a plurality of the second metal coating layers are formed on the first metal coating layer on the substrate in parallel with each other.

The present invention also discloses a heat sink structure with a metal coating, which has a substrate and a first metal coating and a second metal coating formed on the substrate by two different materials and processes; wherein the first metal coating is a coating formed on the substrate by a wet process, and the second metal coating is a coating with a thickness of 0.1 to 5 μm formed on the substrate by a sputtering process, the first metal coating is formed on the substrate not covered by the second metal coating, and the second metal coating is composed of at least three or more spaced blocks, and the spacing between at least two of the blocks is unequal to the spacing between the other blocks.

The present invention also discloses a heat sink structure with a metal coating, which has a substrate and at least one metal coating formed on the substrate. The metal coating is formed on the substrate by a sputtering process to form a 0.1 to 5 μm thick coating. The metal coating is composed of at least three or more spaced blocks, and the spacing between at least two of the blocks is unequal to the spacing between the other blocks.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not used to limit the present invention.

10: Base

13: Water inlet

14: Water outlet

15: Fins

20: First metal plating layer

30: Second metal plating layer

31,31a,31b,31c,31d: Block

D1, D2, D3: Arrangement spacing

W: Width

L: Center line

Figure 1 is a schematic top view of the structure of the first embodiment of the present invention.

Figure 2 is a schematic side view of the structure of the first embodiment of the present invention.

Figure 3 is a schematic top view of the structure of the second embodiment of the present invention.

Figure 4 is a schematic side view of the structure of the second embodiment of the present invention.

Figure 5 is a schematic top view of the structure of the third embodiment of the present invention.

Figure 6 is a schematic side view of the structure of the fourth embodiment of the present invention.

Figure 7 is a schematic side view of the structure of the fifth embodiment of the present invention.

The following is a specific embodiment to illustrate the implementation methods disclosed by the present invention. The technical personnel in this field can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments. The details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration and are not depicted according to actual dimensions. Please note in advance. In addition, the same or similar parts in the drawings are marked with the same reference numerals. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not used to limit the scope of protection of the present invention. In addition, the term "or" used in this document may include any one or more combinations of the associated listed items as the case may be.

[First embodiment]

Please refer to Figures 1 and 2, which are the first embodiment of the present invention. The embodiment of the present invention provides a heat sink structure with a metal coating. According to the heat sink structure with a metal coating provided by the embodiment of the present invention, it has a substrate 10, and a first metal coating layer 20 and a second metal coating layer 30 are formed on the substrate 10 by two different materials and process technologies.

In this embodiment, the substrate 10 may be a copper/copper alloy layer or an aluminum/aluminum alloy layer. The first metal coating layer 20 may be a coating layer formed on the substrate 10 by a wet process, and the second metal coating layer 30 may be a coating layer with a thickness of 0.1 to 5 μm formed on the first metal coating layer 20 by a sputtering process.

Furthermore, the first metal coating layer 20 can be formed on the surface of the substrate 10 by a wet process, such as a chemical plating/electroplating process. Furthermore, the second metal coating layer 30 can be formed on the first metal coating layer 20 by a sputtering process.

In this embodiment, the first metal plating layer 20 can be formed by chemical plating/electroplating nickel, nickel alloy, or nickel-phosphorus alloy. Therefore, the first metal plating layer 20 can be a nickel/nickel alloy layer or a nickel-phosphorus alloy layer. In addition, by forming the first metal plating layer 20 on the surface of the substrate 10, the oxidation resistance and aesthetics of the substrate 10 can be effectively increased.

In this embodiment, the second metal coating layer 30 can be formed by direct sputtering of silver or silver alloy. Therefore, the second metal coating layer 30 can be a sputtering silver/silver alloy layer, so that the second metal coating layer 30 can have the functionality of silver sintering, so that it can be connected to one or more power chips through the functionality of silver sintering. In addition, since the second metal coating layer 30 is formed by direct sputtering of silver/silver alloy on the surface of nickel/nickel alloy or nickel-phosphorus alloy, the second metal coating layer 30 is an extremely thin coating layer with high adhesion and good uniformity.

In other words, the second metal coating layer 30 may be composed of at least three or more spaced blocks 31, and the spacing between at least two blocks 31 is unequal to the spacing between other blocks 31. In this embodiment, the second metal coating layer 30 is composed of four spaced blocks 31, which can be further divided into blocks 31a, 31b, 31c, and 31d, and the spacing D1 between two blocks 31b and 31c is unequal to the spacing between other blocks 31, such as unequal to the spacing D2 between blocks 31a and 31b, or unequal to the spacing D3 between blocks 31d and 31c.

This is because if the arrangement spacing between the blocks 31 is equal, the shrinkage after sintering and the thermal changes of the power chip thereon during operation will cause greater stress impact. Therefore, in this embodiment, the arrangement spacing between at least two blocks 31 and the arrangement spacing between other blocks 31 are unequal, so that the blocks on the surface of the nickel/nickel alloy or nickel-phosphorus alloy are arranged at unequal spacing by directly sputtering silver/silver alloy, thereby reducing stress impact.

Furthermore, in order to more effectively reduce stress impact, these blocks 31 are arranged symmetrically relative to the center line L of the substrate 10, and the arrangement spacing D1 between the two blocks 31 closest to the center line L of the substrate 10 must be greater than the arrangement spacing between other blocks 31. Furthermore, when each block 31 of the second metal plating layer 30 is rectangular and has the same size (length, width, height), the arrangement spacing D1 between the two blocks 31 closest to the center line L of the substrate 10 is twice (1.9 to 2.1 times) the width W of each block 31 along the arrangement direction (i.e., along the length direction of the substrate 10). The center line L mentioned in this embodiment refers to a straight line passing through the center point of the substrate 10 and dividing the substrate 10 into two symmetrical parts.

[Second embodiment]

Please refer to Figures 3 and 4, which are the second embodiment of the present invention. This embodiment is roughly the same as the first embodiment, and the differences are described as follows.

In this embodiment, the arrangement spacing between the blocks 31 gradually decreases in the direction away from the center line L of the substrate 10. Specifically, when the arrangement spacing D1 between the two blocks 31 closest to the center line L of the substrate 10 is 1, the arrangement spacing between the other blocks 31 is approximately 1/2 times (0.45 to 0.55 times), 1/4 times (0.2025 to 0.3025 times), 1/8 times (0.091125 to 0.166375 times) of the arrangement spacing D1, and so on. That is to say, when the arrangement spacing between the two blocks 31 closest to the center line L of the substrate 10 is 1, the arrangement spacing between the other blocks 31 gradually decreases by 1/2^N times (0.45^N~0.55^N times) in the direction away from the center line L of the substrate 10, where N starts from 1 and the increment is 1. In this way, through actual tests, the stress variation range is the smallest (+43.83~-46.29MPa), that is, the shrinkage of each block 31 of the second metal coating 30 after sintering and the stress impact caused by the thermal changes of the power chip thereon during operation are minimized, making the possibility of shrinkage and deformation of the overall heat sink structure smaller, and the possibility of coating and even power chip peeling also smaller.

[Third embodiment]

Please refer to Figure 5, which is the third embodiment of the present invention. This embodiment is roughly the same as the first embodiment, and the differences are described as follows.

In this embodiment, the base 10 is a closed heat dissipation structure having a water inlet 13 and a water outlet 14 connected to each other, so that the cooling fluid can flow into the base 10 through the water inlet 13 and flow out of the base 10 through the water outlet 14, thereby quickly taking away the heat absorbed by the base 10.

Furthermore, there are multiple second metal coating layers 30 that can be directly formed on the substrate 10 or can be formed on the first metal coating layer on the substrate 10, and the multiple second metal coating layers 30 are parallel to each other. In this embodiment, there are three second metal coating layers 30, but the number of second metal coating layers 30 is not limited and can be repeated on the same heat sink structure. In addition, each second metal coating layer 30 can be as shown in the second embodiment, but can also be as shown in the first embodiment.

[Fourth embodiment]

Please refer to Figure 6, which is the fourth embodiment of the present invention. This embodiment is roughly the same as the first embodiment, and the differences are described as follows.

In this embodiment, the second metal coating layer 30 can be directly formed on the substrate 10, and the first metal coating layer 20 can be formed on the substrate 10 not covered by the second metal coating layer 30, or there is no first metal coating layer 20 at all, that is, this embodiment may not have the first metal coating layer 20.

[Fifth embodiment]

Please refer to Figure 7, which is the fifth embodiment of the present invention. This embodiment is roughly the same as the first embodiment, and the differences are described as follows.

In this embodiment, in order to increase the heat dissipation area, the substrate 10 may have a plurality of fins 15, and the fins 15 may be integrally formed on the surface of the substrate 10. Further, the fins 15 of this embodiment are integrally formed on the surface of the substrate 10 by mechanical processing, such as cutting or grinding. In addition, the fins 15 of this embodiment may be integrally formed on the surface of the substrate 10 by forging, or may be integrally formed on the surface of the substrate 10 by stamping. Moreover, in order to have a better heat dissipation effect, the fins 15 of this embodiment are pin-fins arranged at a high density.

In summary, the heat sink structure with metal coating provided by the present invention can at least be formed by "a first metal coating layer and a second metal coating layer are formed on the substrate by two different materials and processes", "the first metal coating layer is first formed on the substrate by a wet process, and the second metal coating layer is formed on the first metal coating layer by a sputtering process The technical solution of "a 0.1 to 5μm thick coating on the second metal coating", "the second metal coating is composed of at least three or more spaced blocks, and the spacing between at least two blocks is unequal to the spacing between other blocks", can effectively reduce the shrinkage of the second metal coating after sintering and the stress impact caused by the hot and cold changes of the power chip on it during operation.

The above disclosed contents are only the preferred feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.

20: First metal plating layer

30: Second metal plating layer

31,31a,31b,31c,31d: Block

D1, D2, D3: Arrangement spacing

W: Width

Claims (10)

A heat sink structure with a metal coating has a substrate on which a first metal coating and a second metal coating are formed by two different materials and processes; wherein the first metal coating is a coating formed on the substrate by a wet process, and the second metal coating is a coating with a thickness of 0.1 to 5 μm formed on the first metal coating by a sputtering process, and the second metal coating is composed of at least three The second metal plating layer is composed of blocks arranged at intervals, and the arrangement spacing between at least two of the blocks is unequal to the arrangement spacing between the other blocks; wherein the multiple blocks of the second metal plating layer are arranged symmetrically relative to the center line of the substrate, and the arrangement spacing between the two blocks closest to the center line of the substrate is greater than the arrangement spacing between the other blocks, and is twice the width of each block along the arrangement direction. The heat sink structure with metal plating as described in claim 1, wherein the substrate is at least one of a copper/copper alloy layer and an aluminum/aluminum alloy layer. A heat sink structure with a metal coating as described in claim 1, wherein the first metal coating is at least one of a nickel/nickel alloy layer and a nickel-phosphorus alloy layer. A heat sink structure with a metal coating as described in claim 3, wherein the second metal coating is a silver/silver alloy layer. A heat sink structure with a metal coating as described in claim 1, wherein when the arrangement spacing between the two blocks closest to the center line of the substrate is 1, the arrangement spacing between the other blocks gradually decreases by 1/2^N times in the direction away from the center line of the substrate, where N starts from 1 and the increment is 1. A heat sink structure with a metal coating as described in claim 1, wherein the substrate surface is integrally formed with a plurality of fins, and the fins are needle fins. A heat sink structure with a metal coating as described in claim 1, wherein the base has a water inlet and a water outlet connected to each other. A heat sink structure with a metal coating as described in claim 1, wherein a plurality of the second metal coatings are formed on the first metal coating on the substrate in parallel with each other. A heat sink structure with a metal coating has a substrate on which a first metal coating and a second metal coating are formed by two different materials and processes; wherein the first metal coating is a coating formed on the substrate by a wet process, and the second metal coating is a coating with a thickness of 0.1 to 5 μm formed on the substrate by a sputtering process, and the first metal coating is formed on the substrate not covered by the second metal coating, and The second metal coating layer is composed of at least three blocks arranged at intervals, and the arrangement spacing between at least two of the blocks is unequal to the arrangement spacing between the other blocks; wherein the multiple blocks of the second metal coating layer are arranged symmetrically relative to the center line of the substrate, and the arrangement spacing between the two blocks closest to the center line of the substrate is greater than the arrangement spacing between the other blocks, and is twice the width of each block along the arrangement direction. A heat sink structure with a metal coating, which has a substrate and at least one metal coating formed on the substrate, wherein the metal coating is formed on the substrate by a sputtering process to form a coating with a thickness of 0.1 to 5 μm, and the metal coating is composed of at least three or more spaced blocks, and the arrangement spacing between at least two of the blocks is unequal to the arrangement spacing between the other blocks; wherein the multiple blocks of the metal coating are arranged symmetrically relative to the center line of the substrate, and the arrangement spacing between the two blocks closest to the center line of the substrate is greater than the arrangement spacing between the other blocks, and is twice the width of each block along the arrangement direction.

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