TWI862929B - Bended vapor chamber radiator - Google Patents

Abstract

A bended vapor chamber radiator having a vapor chamber and a heat-dissipation body is provided. The vapor chamber has a base portion and a covering portion, a curved portion is formed between the base portion and the covering portion. The interiors of the base portion, the covering portion and the curved portion are connected with each other and formed an accommodation space. The heat-dissipation body has a first contact surface, a second contact surface and a plurality of flow channels between the first contact surface and the second contact surface. The first contact surface is attached to an inner surface of the base portion, the second contact surface is covered by an inner surface of the covering portion. So that the heat-dissipation body is arranged in the accommodation space and each flow channel is corresponding to an opening of the accommodation space.

Description

Bending temperature plate heat dissipation device

The present invention relates to a heat sink, in particular to a bending temperature averaging plate heat sink.

According to the existing heat sinks used to cool electronic power generation components (such as CPU or graphics card chips, etc.), they are mostly used in combination with heat pipes or vapor chambers. Among them, the vapor chamber itself has a thin design, which can be applied to thinning occasions.

Among the heat sinks that can be used in thinning applications, some are made by flattening a heat pipe and combining it with a solid copper plate or aluminum plate, and then adding a heat sink fin; others are made by placing a heat sink fin on a temperature equalizer. However, the existing heat sinks often only place the heat sink fin on one side or one side of the heat pipe or temperature equalizer for condensation, so that the protruding fin can be cooled or heat-transferred by the outside air, and thus the cooling efficiency cannot be further improved.

In view of this, the inventors of the present invention have conducted intensive research and applied theories to improve and solve the above-mentioned deficiencies, and finally proposed the present invention which has a reasonable design and effectively improves the above-mentioned deficiencies.

The main purpose of the present invention is to provide a bent vapor chamber heat sink device, which uses a vapor chamber to cover a heat sink body, so as to utilize the chamber inside the single vapor chamber itself for heat transfer, and can quickly transfer the absorbed heat from one side of the heat sink body to the other side for cooling or heat dissipation, thereby accelerating the cooling efficiency.

In order to achieve the above-mentioned purpose, the present invention provides a bent temperature averaging plate heat dissipation device, comprising a temperature averaging plate and a heat dissipation body; the temperature averaging plate is a heat conduction element having a vacuum chamber inside and sealing a working fluid, and has a base and a covering portion extending from at least one side of the base, a bent portion is formed between the base and the covering portion, and the insides of the base, the covering portion and the bent portion are interconnected, and the base, the covering portion and the bent portion enclose a heat dissipation body. The heat dissipation body is surrounded by a first contact surface and a second contact surface, and a plurality of air flow channels arranged at intervals are formed between the first contact surface and the second contact surface; wherein the first contact surface is attached to the inner surface of the base, and the second contact surface is provided to cover the inner surface of the cover, so that the heat dissipation body is arranged in the accommodation area between the inner surface of the base and the inner surface of the cover of the temperature equalizing plate, and the air flow channel of the heat dissipation body corresponds to the opening of the accommodation area.

In order to enable the Honorable Review Committee to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the attached drawings are only provided for reference and explanation and are not used to limit the present invention.

Please refer to Figures 1 and 2, which are the three-dimensional exploded view and three-dimensional assembly view of the present invention respectively. The present invention provides a bent temperature averaging plate heat dissipation device, comprising a temperature averaging plate 1, and a heat dissipation body 2 which is bent and wrapped by the temperature averaging plate 1; wherein:

The vapor chamber 1 is a heat transfer element having a vacuum chamber inside and sealing a working fluid. As shown in FIG3 , after being formed, the vapor chamber 1 has a base 10 and a cover 11 extending from at least one side of the base, and a curved portion 12 is formed between the base 10 and the cover 11, and the interior of the base 10, the cover 11 and the curved portion 12 is a common vacuum chamber (i.e., the interiors thereof are interconnected).

As mentioned above, in the embodiment of the present invention, the above-mentioned temperature equalizing plate 1 can bend a covering portion 11 through its two sides respectively, and each covering portion 11 and the base 10 have a bending portion 12, so that the two covering portions 11 are bent relative to each other to present a symmetrical or asymmetrical shape, and a receiving area 13 is formed by the base 10, the two covering portions 11 and the two bending portions 12. Furthermore, in the present invention, when bending the covering portion 11 of the temperature balancing plate 1, a jig (not shown) can be provided to roughly abut against one or both sides of the inner surface of the base 10, and then one or both sides of the temperature balancing plate 1 are bent upward by equipment such as stamping or sheet metal bending (not shown), so as to attach the jig to form the bent portion 12, and then further bend it inward to form the covering portion 11.

In a preferred embodiment, the thickness t of the temperature averaging plate 1 can be between 0.3 mm and 6.0 mm (preferably between 1 mm and 3 mm), and the inner arc angle radius r formed by the bending portion 12 of the temperature averaging plate 1 is at least greater than 1.2 mm (preferably greater than or equal to 12 mm). Under this condition, it can be ensured that the overall height of the temperature averaging plate 1 after bending is suitable for the thinning space, and the temperature averaging plate 1 can also be bent without breaking.

Referring to FIG. 1 and FIG. 2 , the heat sink body 2 is disposed in the accommodation area 13 and has a first contact surface 20 and a second contact surface 21, and a plurality of airflow channels 22 arranged at intervals are formed between the first contact surface 20 and the second contact surface 21. In the embodiment of the present invention, the heat sink body 2 can be formed by stacking a plurality of vertical fins in a horizontal direction, and the airflow channels 22 are formed between the fins, and the first contact surface 20 and the second contact surface 21 are respectively formed at the bottom and the top of each fin stack.

Please refer to Figures 1, 2 and 4 together. The heat sink body 2 is arranged in the accommodation area 13 after the temperature averaging plate 1 is bent, and the air flow channel 22 of the heat sink body 2 corresponds to the opening of the accommodation area 13, and the first contact surface 20 of the heat sink body 2 is attached to the inner surface of the base 10 of the temperature averaging plate 1, and the second contact surface 21 is provided to cover the inner surface of the cover 11 of the temperature averaging plate 1, so that the heat sink body 2 can be arranged in the accommodation area 13 between the inner surface of the base 10 and the inner surface of the cover 11 of the temperature averaging plate 1.

Therefore, by means of the above-mentioned structural composition, the bent temperature averaging plate heat dissipation device of the present invention can be obtained.

Accordingly, as shown in FIG. 4 , in the use of the present invention, since the periphery of the heat sink body 2 is covered by the heat sink 1 by bending the heat sink 1, most of the heat generated by the heat source can be quickly transferred to the covering portion 11 of the heat sink 1 through vapor phase change inside the heat sink 1 after the base 10 of the heat sink 1 is attached to the heat source (not shown), and the remaining heat can be transferred to the second contact surface 21 through the first contact surface 20 of the heat sink body 2, so that the heat sink body 2 can be cooled or dissipated through the airflow channel 22 and the outside air or by adding a forced airflow such as a fan after being away from the base 10 of the heat sink 1.

It is worth mentioning that the present invention is not limited to the use of the base portion 10 being attached to a heat source, but can also be used by attaching the cover portion 11 to a heat source.

Therefore, by using the bent heat spreader heat sink device of the present invention, since the heat spreader 1 covers the heat sink body 2, most of the heat can be transferred through the chamber inside the heat spreader, and the absorbed heat can be quickly transferred from the first contact surface 20 of the heat spreader body 2 to the second contact surface 21 for cooling or heat dissipation, thereby accelerating the cooling efficiency. In addition to having the advantage of being applied to thinning occasions, it is more suitable for heat dissipation with high heat flux requirements such as high wattage and a small contact area.

In summary, this invention can achieve the intended purpose and solve the lack of knowledge. It is also extremely novel and progressive and fully meets the requirements for invention patent application. Therefore, we have filed an application in accordance with the Patent Law. We sincerely request that you carefully examine and grant the patent in this case to protect the rights of the inventor.

However, the above is only the preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technologies, means and other changes made by using the contents of the description and drawings of the present invention are also included in the scope of the present invention and are appropriately stated.

<The present invention> 1: Temperature balancing plate 10: Base 11: Covering part 12: Bend part 13: Accommodation area 2: Heat dissipation body 20: First contact surface 21: Second contact surface 22: Air flow channel t: Thickness r: Inner arc angle radius

FIG. 1 is a three-dimensional exploded view of the present invention.

FIG. 2 is a three-dimensional assembly diagram of the present invention.

FIG. 3 is a schematic diagram showing the bending of the temperature equalizing plate of the present invention.

FIG. 4 is a schematic diagram of the combined end surface of the present invention.

1: Temperature plate 10: Base 11: Covering part 12: Bend part 2: Heat dissipation body 20: First contact surface 21: Second contact surface 22: Air flow channel

Claims (5)

A bending temperature averaging plate heat dissipation device comprises: a temperature averaging plate, which is a heat conducting element having a vacuum chamber inside and sealing a working fluid, and the temperature averaging plate has a base, and a covering portion extending from two sides of the base by bending, respectively, a bending portion is formed between the base and each of the covering portions, and the base, the covering portion and the inner parts of the bending portions are interconnected, and a receiving area is formed by the base, the covering portion and the bending portion; and a heat dissipation body, which has a first contact surface and a second contact surface, and a first contact surface is formed between the first contact surface and the second contact surface. A plurality of airflow channels arranged at intervals are formed between the second contact surfaces; wherein the first contact surface of the heat sink body is attached to the inner surface of the base of the temperature averaging plate, and the second contact surface of the heat sink body is provided to cover the inner surface of the cover portion of the temperature averaging plate, so that the heat sink body is arranged in the accommodation area between the inner surface of the base of the temperature averaging plate and the inner surface of the cover portion, and the airflow channel of the heat sink body corresponds to the opening of the accommodation area; wherein the thickness of the temperature averaging plate is between 0.3mm and 6.0mm, and the inner arc angle radius of the curved portion of the temperature averaging plate is greater than 1.2mm. The bent temperature averaging plate heat sink device as described in claim 1, wherein the two covering parts are bent relative to each other and are symmetrical or asymmetrical to each other. The bent temperature-averaging plate heat sink device as described in claim 1, wherein the heat sink body is formed by a plurality of vertical fins stacked horizontally. The bent heat spreader heat sink device as described in claim 3, wherein the air flow channel is formed between each of the fins. A bent temperature-averaging plate heat sink as described in claim 3 or 4, wherein the lower and upper parts of the fin stacks constitute the first contact surface and the second contact surface respectively.

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