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TWI861105B - Reticle cage actuator with shape memory alloy and magnetic coupling mechanisms - Google Patents

Reticle cage actuator with shape memory alloy and magnetic coupling mechanisms Download PDF

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Publication number
TWI861105B
TWI861105B TW109115163A TW109115163A TWI861105B TW I861105 B TWI861105 B TW I861105B TW 109115163 A TW109115163 A TW 109115163A TW 109115163 A TW109115163 A TW 109115163A TW I861105 B TWI861105 B TW I861105B
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Taiwan
Prior art keywords
safety
magnetic coupling
safety latch
latch
rotating shaft
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TW109115163A
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Chinese (zh)
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TW202107212A (en
Inventor
哈里 克里斯南
考沙爾 桑迪普 杜希
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荷蘭商Asml控股公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/707Chucks, e.g. chucking or un-chucking operations or structural details
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/707Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983Optical system protection, e.g. pellicles or removable covers for protection of mask

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dynamo-Electric Clutches, Dynamo-Electric Brakes (AREA)

Abstract

Embodiments herein describe methods and safety devices used to provide support for an object. A safety device includes a driving side comprising a driving motor and a driven side. The driven side of the safety device includes a housing having a rotating shaft extending along a length of the housing and a safety latch. The driven side is coupled to the driving motor via a non-contact, magnetic coupling device at a first end of the rotating shaft, and the safety latch is coupled to a second end of the rotating shaft opposite from the first end of the rotating shaft. The driving motor is configured to cause rotation in a radial direction of the safety latch on the driving side via the non-contact, magnetic coupling device.

Description

具有形狀記憶體合金及磁耦合機構的倍縮光罩籠致動器Multiplying mask cage actuator with shape memory alloy and magnetic coupling mechanism

本發明係關於安全機構,諸如用於保持微影系統中之圖案化器件的倍縮光罩籠致動器及磁耦合機構。 The present invention relates to safety mechanisms, such as a zoom mask cage actuator and a magnetic coupling mechanism for holding patterned devices in a lithography system.

微影裝置係將所要圖案施加至基板上(通常施加至基板之目標部分上)之機器。微影裝置可用於(例如)積體電路(IC)之製造中。在該個例中,替代地稱作光罩或倍縮光罩的圖案化器件可用以產生待形成於IC之個別層上之電路圖案。可將此圖案轉印至基板(例如,矽晶圓)上之目標部分(例如,包含晶粒之部分、一個或若干晶粒)上。通常經由成像至提供於基板上之輻射敏感材料(抗蝕劑)層上來進行圖案之轉移。大體而言,單個基板將含有順次圖案化之鄰近目標部分之網路。已知的微影裝置包括:所謂的步進器,其中藉由一次性將整個圖案暴露至目標部分上來輻照每一目標部分;及所謂的掃描器,其中藉由在給定方向(「掃描」方向)上經由輻射光束而掃描圖案同時平行或反平行於此掃描方向而同步地掃描目標部分來輻照每一目標部分。亦有可能藉由將圖案壓印至基板上而將圖案自圖案化器件轉印至基板。 A lithographic apparatus is a machine that applies a desired pattern to a substrate, typically to a target portion of the substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to produce the circuit pattern to be formed on individual layers of the IC. This pattern may be transferred to a target portion (e.g., a portion containing a die, one or several dies) on a substrate (e.g., a silicon wafer). Transfer of the pattern is typically performed by imaging onto a layer of radiation-sensitive material (resist) provided on the substrate. Generally, a single substrate will contain a network of adjacent target portions that are patterned in sequence. Known lithography devices include so-called steppers, in which each target portion is irradiated by exposing the entire pattern onto the target portion at once, and so-called scanners, in which each target portion is irradiated by scanning the pattern in a given direction (the "scanning" direction) by means of a radiation beam while simultaneously scanning the target portion parallel or antiparallel to this scanning direction. It is also possible to transfer the pattern from the patterned device to the substrate by embossing the pattern onto the substrate.

微影被廣泛地認為係在IC以及其他器件及/或結構之製造中 之關鍵步驟中的一者。然而,隨著使用微影所製造之特徵之尺寸變得愈來愈小,微影正變為用於使得能夠製造小型IC或其他器件及/或結構之更關鍵的因素。 Lithography is widely recognized as one of the key steps in the manufacture of ICs and other devices and/or structures. However, as the size of features produced using lithography becomes smaller and smaller, lithography is becoming a more critical factor in enabling the manufacture of small ICs or other devices and/or structures.

為了將圖案投影在基板上,微影裝置可使用電磁輻射。此輻射之波長決定可形成於基板上的特徵之最小大小。相較於使用例如具有193nm之波長之輻射的微影裝置,使用具有在4至20nm之範圍內(例如6.7nm或13.5nm)之波長之極紫外線(EUV)輻射的微影裝置可用以在基板上形成較小特徵。 To project a pattern onto a substrate, a lithography apparatus may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of features that can be formed on the substrate. Lithography apparatus using extreme ultraviolet (EUV) radiation with a wavelength in the range of 4 to 20 nm (e.g. 6.7 nm or 13.5 nm) can be used to form smaller features on a substrate than lithography apparatus using radiation with a wavelength of, for example, 193 nm.

使用EUV輻射之微影裝置可需要EUV輻射光束路徑或EUV輻射光束路徑之至少相當大部分在微影操作期間必須保持在真空中。在微影裝置之此等真空區域中,靜電夾具可用以將物件(諸如,圖案化器件及/或基板)分別夾持至微影裝置之結構(諸如,圖案化器件台及/或基板台)。 Lithography apparatus using EUV radiation may require that the EUV radiation beam path or at least a substantial portion of the EUV radiation beam path must be maintained in a vacuum during lithography operations. In such vacuum regions of the lithography apparatus, electrostatic chucks may be used to clamp objects (e.g., patterned devices and/or substrates) to structures of the lithography apparatus (e.g., patterned device stages and/or substrate stages), respectively.

習知圖案化器件(諸如倍縮光罩)係極昂貴的。因此,當在微影裝置內操作倍縮光罩時應極其小心。雖然通常將倍縮光罩夾持至夾盤結構,但是期望包括在夾持失效的情況下之安全機構。否則,倍縮光罩可能掉落,不僅對倍縮光罩自身造成損壞,而且對微影裝置內之其他昂貴的光學件造成損壞。 It is known that patterned devices such as reticles are extremely expensive. Therefore, extreme caution should be exercised when handling reticles within a lithography apparatus. Although reticles are typically clamped to a chuck structure, it is desirable to include a safety mechanism in the event of clamping failure. Otherwise, the reticles may fall, causing damage not only to the reticles themselves, but also to other expensive optical components within the lithography apparatus.

習知安全設計可用於確保圖案化器件(諸如倍縮光罩)不會不經意地自夾盤(例如,倍縮光罩載物台)掉落。此類設計通常使用電磁鐵來打開或閉合金屬臂以在倍縮光罩掉落時「抓住」倍縮光罩。此等設計並非極有效的,係因為其需要大型馬達以產生打開臂必需之力,且亦需要恆定功率消耗以將臂保持於打開位置。由於功率需求,安全設計亦需要電磁 鐵之有效冷卻以消散系統內之熱量。此外,若在操作期間切斷電源,則由電磁鐵供電之安全閂鎖之臂將自動閉合並有可能在諸如倍縮光罩交換操作期間損壞倍縮光罩。 It is known that safety designs can be used to ensure that patterned devices such as reticle do not inadvertently fall from a chuck (e.g., reticle stage). Such designs typically use electromagnets to open or close metal arms to "catch" the reticle if it falls. Such designs are not very efficient because they require large motors to generate the force necessary to open the arms, and also require constant power consumption to hold the arms in the open position. Due to the power requirements, safety designs also require effective cooling of the electromagnets to dissipate heat within the system. In addition, if the power is cut off during operation, the arm of the safety latch powered by the solenoid will automatically close and may damage the zoom mask during operations such as zoom mask exchange.

因此,需要提供用於以可靠及有效方式增強倍縮光罩安全機構之新器件及方法。本文中之實施例描述用於不需要電磁鐵來保持倍縮光罩的經改良之安全器件之系統、器件及方法。本發明提供利用永久的非接觸式磁耦合來促進旋轉致動機構支撐微影系統中之倍縮光罩的安全器件。磁耦合允許安全器件之軸在驅動載體側與夾盤側之間旋轉而不需要實體接觸,同時經由雙穩態致動器機構最小化功率需求。本發明亦包括用於形狀記憶體合金(SMA)及用於倍縮光罩安全性之壓縮彈簧激活式致動器之器件及方法。藉由將電流或熱量施加至安全器件之形狀記憶體合金,可回應於安全器件中由形狀記憶體合金之改變激活的彈簧的壓縮而將安全器件之安全閂鎖致動至「開啟」或「閉合」位置。 Therefore, there is a need to provide new devices and methods for enhancing the safety mechanism of a zoom mask in a reliable and efficient manner. The embodiments herein describe systems, devices and methods for an improved safety device that does not require an electromagnet to hold the zoom mask. The present invention provides a safety device that utilizes permanent non-contact magnetic coupling to facilitate a rotational actuator mechanism to support a zoom mask in a lithography system. The magnetic coupling allows the axis of the safety device to rotate between the drive carrier side and the chuck side without physical contact, while minimizing power requirements via a dual-stable actuator mechanism. The present invention also includes devices and methods for shape memory alloys (SMA) and compression spring activated actuators for zoom mask safety. By applying an electric current or heat to the shape memory alloy of the security device, the safety latch of the security device can be actuated to an "open" or "closed" position in response to the compression of a spring activated by the change in the shape memory alloy in the security device.

在一些實施例中,用於為物件提供支撐之安全器件包括驅動側及從動側。驅動側包括驅動馬達。從動側包括殼體,該殼體具有沿殼體之長度延伸的旋轉軸,及安全閂鎖,其中該從動側在該旋轉軸之第一端處經由非接觸式磁耦合器件耦合至驅動馬達。安全閂鎖耦合至與旋轉軸之第一端相對之旋轉軸之第二端。驅動馬達經組態以在驅動側上經由非接觸式磁耦合器件使安全閂鎖在徑向方向旋轉。 In some embodiments, a safety device for providing support for an object includes a driving side and a driven side. The driving side includes a driving motor. The driven side includes a housing having a rotating shaft extending along the length of the housing, and a safety latch, wherein the driven side is coupled to the driving motor at a first end of the rotating shaft via a non-contact magnetic coupling device. The safety latch is coupled to a second end of the rotating shaft opposite the first end of the rotating shaft. The driving motor is configured to rotate the safety latch in a radial direction on the driving side via a non-contact magnetic coupling device.

在一些實施例中,微影裝置包括照明系統、支撐結構、投影系統及一或多個安全器件。照明系統調節輻射光束。支撐結構經構造以支撐圖案化器件,該圖案化器件能夠在輻射光束之橫截面中向該輻射光束賦予圖案以形成經圖案化之輻射光束。投影系統經組態以將經圖案化之輻 射光束投影至基板之目標部分上。一或多個安全器件耦合至支撐結構且各自包括驅動側及從動側。一或多個安全器件之驅動側包括驅動馬達。一或多個安全器件之從動側包括殼體,該殼體具有沿殼體之長度延伸之旋轉軸,及安全閂鎖,其中從動側在該旋轉軸之第一端處經由非接觸式磁耦合器件耦合至驅動馬達。安全閂鎖耦合至與旋轉軸之第一端相對之旋轉軸之第二端。驅動馬達經組態以在驅動側上經由非接觸式耦合器件使安全閂鎖在徑向方向上旋轉。 In some embodiments, a lithography apparatus includes an illumination system, a support structure, a projection system, and one or more safety devices. The illumination system conditions a radiation beam. The support structure is configured to support a patterning device capable of imparting a pattern to the radiation beam in a cross-section of the radiation beam to form a patterned radiation beam. The projection system is configured to project the patterned radiation beam onto a target portion of a substrate. One or more safety devices are coupled to the support structure and each includes a driving side and a driven side. The driving side of the one or more safety devices includes a drive motor. The driven side of one or more safety devices includes a housing having a rotating shaft extending along the length of the housing, and a safety latch, wherein the driven side is coupled to a drive motor at a first end of the rotating shaft via a contactless magnetic coupling device. The safety latch is coupled to a second end of the rotating shaft opposite the first end of the rotating shaft. The drive motor is configured to rotate the safety latch in a radial direction on the driving side via the contactless coupling device.

在一些實施例中,一種方法包括使用用以支撐圖案化器件之安全器件,該安全器件具有包含至少一個形狀記憶體合金之致動器、安全閂鎖及耦合至該安全閂鎖的至少一個彈簧。安全閂鎖包括在安全閂鎖之遠端處之支腳部分,其中該支腳部分經組態以充當圖案化器件之接觸點。該方法亦包括將電流施加至安全器件之至少一個形狀記憶體合金以激活至少一個形狀記憶體合金,及回應於至少一個形狀記憶體合金之激活而將安全閂鎖自圖案化器件下方的第一位置致動至第二位置。 In some embodiments, a method includes using a security device for supporting a patterned device, the security device having an actuator including at least one shape memory alloy, a security latch, and at least one spring coupled to the security latch. The security latch includes a foot portion at a distal end of the security latch, wherein the foot portion is configured to serve as a contact point for the patterned device. The method also includes applying a current to at least one shape memory alloy of the security device to activate the at least one shape memory alloy, and actuating the security latch from a first position below the patterned device to a second position in response to the activation of the at least one shape memory alloy.

下文參考隨附圖式來詳細地描述其他態樣、特徵及優點,以及本發明之各種實施例之結構及操作。應注意,本發明不限於本文中所描述之特定實施例。本文中僅出於說明性目的呈現此類實施例。基於本文中所含之教示,額外實施例對於熟習相關技術者將為顯而易見的。 Other aspects, features and advantages, as well as the structure and operation of various embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be noted that the present invention is not limited to the specific embodiments described herein. Such embodiments are presented herein for illustrative purposes only. Based on the teachings contained herein, additional embodiments will be apparent to those skilled in the relevant art.

10:琢面化場鏡面器件 10: Faceted field mirror device

11:琢面化光瞳鏡面器件 11: Faceted pupil mirror device

13:鏡面 13: Mirror

14:鏡面 14: Mirror

200:倍縮光罩載物台/夾盤 200: Zoom mask stage/chuck

201:緩衝器器件 201: Buffer device

202:頂部載物台表面 202: Top stage surface

204:底部載物台表面 204: Bottom stage surface

206:側載物台表面 206: Side stage surface

208:倍縮光罩 208: Zoom mask

212:第一編碼器 212: First encoder

214:第二編碼器 214: Second encoder

300:安全器件 300: Safety device

401:驅動側 401:Drive side

402:從動側 402: Driven side

404:驅動馬達 404: Driving motor

406:磁耦合 406: Magnetic coupling

406a:驅動組件 406a:Driver assembly

406b:從動組件 406b: Driven component

408:殼體 408: Shell

410:軸 410: Axis

412:安全閂鎖 412: Security latch

414:支腳區域 414: Foot support area

416:安全緩衝器 416: Security buffer

418:感測器 418:Sensor

420:目標 420: Target

422:顆粒密封件 422: Particle seal

424:上端顆粒密封件 424: Upper particle seal

426:軸承 426: Bearings

428:下端顆粒密封件 428: Lower end particle seal

600:面對面磁耦合組態 600: Face-to-face magnetic coupling configuration

610:共軸磁耦合組態 610: Coaxial magnetic coupling configuration

620:磁耦合表面 620: Magnetic coupling surface

625:磁鐵 625: Magnet

802:形狀記憶體合金 802: Shape memory alloy

802:致動器機構 802: Actuator mechanism

804:銷子接頭 804: Pin connector

806:彈簧 806: Spring

808:安全閂鎖 808: Security latch

809:倍縮光罩支腳 809: Zoom mask support

810:致動器機構 810: Actuator mechanism

811:電流 811: Current

900:致動器機構 900: Actuator mechanism

902:形狀記憶體合金 902: Shape memory alloy

906:彈簧 906: Spring

908:安全閂鎖 908: Safety latch

909:倍縮光罩支腳 909: Zoom mask support foot

910:致動器機構 910: Actuator mechanism

1000:安全器件 1000: Safety device

1002:形狀記憶體合金 1002: Shape memory alloy

1004:驅動馬達 1004: Driving motor

1006:彈簧 1006: Spring

1008:安全閂鎖 1008: Safety latch

1009:倍縮光罩支腳 1009: Zoom mask support

1010:安全器件 1010: Safety device

1020:安全器件 1020: Safety device

1030:夾盤 1030: Clamp

1100:方法 1100:Methods

1102:操作 1102: Operation

1104:操作 1104: Operation

1106:操作 1106: Operation

1108:操作 1108: Operation

1110:操作 1110: Operation

B:輻射光束 B:Radiation beam

B':輻射光束 B': Radiation beam

IL:照明系統 IL: Lighting system

LA:微影系統 LA: Lithography System

MA:圖案化器件 MA: Patterned device

MT:支撐結構 MT: Support structure

PS:投影系統 PS: Projection system

SO:輻射源 SO: Radiation source

W:基板 W: Substrate

WT:基板台 WT: Substrate table

併入本文中且形成本說明書之部分的隨附圖式說明本發明,且與實施方式一起進一步用於解釋本發明之原理且使熟習相關技術者能夠製造並使用本發明。 The accompanying drawings, which are incorporated herein and form part of this specification, illustrate the invention and, together with the implementation method, further serve to explain the principles of the invention and enable those skilled in the relevant art to make and use the invention.

圖1為根據本發明之實施例的微影裝置之示意性說明。 FIG1 is a schematic diagram of a lithography apparatus according to an embodiment of the present invention.

圖2為根據本發明之實施例的倍縮光罩載物台之立體示意性說明。 FIG2 is a three-dimensional schematic illustration of a zoom mask stage according to an embodiment of the present invention.

圖3為圖2之倍縮光罩載物台之頂部平面圖。 Figure 3 is a top plan view of the zoom mask stage in Figure 2.

圖4A及圖4B為根據本發明之實施例的安全器件之示意性說明。 Figures 4A and 4B are schematic illustrations of a safety device according to an embodiment of the present invention.

圖5為展示根據本發明之實施例的圖4A及圖4B之安全器件之等距視圖的示意性說明。 FIG. 5 is a schematic illustration showing an isometric view of the security device of FIG. 4A and FIG. 4B according to an embodiment of the present invention.

圖6A、圖6B及圖6C為用於根據本發明之實施例的安全器件之實例磁耦合組態之示意性說明。 Figures 6A, 6B and 6C are schematic illustrations of example magnetic coupling configurations for a safety device according to an embodiment of the present invention.

圖7為根據本發明之實施例的旋轉安全閂鎖之示意性說明。 Figure 7 is a schematic illustration of a rotary safety latch according to an embodiment of the present invention.

圖8A及圖8B為展示根據本發明之實施例的形狀記憶體合金(SMA)致動器機構之正視圖的示意性說明。 FIG. 8A and FIG. 8B are schematic illustrations showing front views of a shape memory alloy (SMA) actuator mechanism according to an embodiment of the present invention.

圖9A及圖9B為展示根據本發明之實施例的形狀記憶體合金(SMA)致動器機構之俯視圖的示意性說明。 FIG. 9A and FIG. 9B are schematic illustrations showing a top view of a shape memory alloy (SMA) actuator mechanism according to an embodiment of the present invention.

圖10A至圖10D為根據本發明之實施例的形狀記憶體合金致動器及用於倍縮光罩安全性之安全器件的示意性說明。 Figures 10A to 10D are schematic illustrations of a shape memory alloy actuator and a safety device for multiplying mask safety according to an embodiment of the present invention.

圖11為根據本發明之實施例的用於操作用於支撐圖案化器件之安全器件之流程圖的示意性說明。 FIG. 11 is a schematic illustration of a flow chart for operating a security device for supporting a patterned device according to an embodiment of the present invention.

根據以下結合圖式所闡述之詳細描述,本發明之特徵及優點將變得更顯而易見,在該等圖式中,相同參考標號始終識別對應元件。在圖式中,相同的附圖標號通常指示相同、功能上相似及/或結構上相似之元件。除非另有指示,否則貫穿本發明提供之圖式不應解釋為按比例繪 製。 Features and advantages of the present invention will become more apparent from the following detailed description in conjunction with the accompanying drawings, in which the same reference numerals identify corresponding elements throughout. In the drawings, the same figure numerals generally indicate identical, functionally similar, and/or structurally similar elements. Unless otherwise indicated, the drawings provided throughout the present invention should not be interpreted as being drawn to scale.

本說明書揭示併入本發明之特徵之一或多個實施例。所揭示之實施例僅例示本發明。本發明之範疇不限於所揭示之實施例。本發明由在此隨附之申請專利範圍定義。 This specification discloses one or more embodiments incorporating features of the present invention. The disclosed embodiments are merely illustrative of the present invention. The scope of the present invention is not limited to the disclosed embodiments. The present invention is defined by the scope of the patent application attached hereto.

所描述之實施例及本說明書中對「一個實施例」、「一實施例」、「一實例實施例」等之參照指示所描述之實施例可包括特定特徵、結構或特性,但每一實施例可未必包括該特定特徵、結構或特性。此外,此類片語未必指相同實施例。另外,當結合實施例來描述特定特徵、結構或特性時,應理解,無論是否予以明確描述,結合其他實施例影響此特徵、結構或特性在熟習此項技術者之認識範圍內。 The embodiments described and references to "an embodiment", "an embodiment", "an example embodiment" and the like in this specification indicate that the embodiments described may include specific features, structures or characteristics, but each embodiment may not necessarily include the specific features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure or characteristic is described in conjunction with an embodiment, it should be understood that whether or not it is explicitly described, it is within the scope of knowledge of those skilled in the art that the feature, structure or characteristic is affected by the combination with other embodiments.

為了易於描述的,空間相對術語(諸如「在......之下」、「在......下方」、「下部」、「在......上方」、「在......之上」、「上部」及其類似者)可在本文中用以描述一個元件或特徵與圖中所說明之另一個元件或特徵之關係。除了圖中所描繪之定向以外,空間相對術語亦意欲涵蓋器件在使用或操作中的不同定向。裝置可以其他方式定向(旋轉90度或處於其他定向)且本文中所使用之空間相對描述詞可同樣相應地進行解譯。 For ease of description, spatially relative terms (such as "under", "beneath", "lower", "above", "on", "upper", and the like) may be used herein to describe the relationship of one element or feature to another element or feature illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

如本文中所使用之術語「約」指示可基於特定技術變化之給定數量之值。基於特定技術,術語「約」可指示例如在該值之10至30%內(例如,該值之±10%、±20%或±30%)變化之給定數量之值。 As used herein, the term "approximately" indicates a value of a given quantity that may vary based on a particular technology. Based on a particular technology, the term "approximately" may indicate a value of a given quantity that varies, for example, within 10 to 30% of the value (e.g., ±10%, ±20%, or ±30% of the value).

本發明之實施例可以硬體、韌體、軟體或其任何組合予以實施。本發明之實施例亦可實施為儲存於機器可讀媒體上之指令,該等指令可由一或多個處理器讀取及執行。機器可讀媒體可包括用於儲存或傳輸 呈可由機器(例如,計算器件)讀取之形式之資訊的任何機制。舉例而言,機器可讀媒體可包括:唯讀記憶體(ROM));隨機存取記憶體(RAM);磁碟儲存媒體;光學儲存媒體;快閃記憶體器件;電氣、光學、聲學或其他形式之傳播信號(例如,載波、紅外線信號、數位信號等)及其他。另外,韌體、軟體、常式及/或指令可在本文中描述為執行某些動作。然而,應瞭解,此類描述僅出於方便起見,且此等動作實際上由計算器件、處理器、控制器或執行韌體、軟體、常式、指令等之其他器件所引起,且在執行此操作時可造成致動器或其他器件與實體世界交互。 Embodiments of the present invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the present invention may also be implemented as instructions stored on a machine-readable medium that can be read and executed by one or more processors. Machine-readable media may include any mechanism for storing or transmitting information in a form that can be read by a machine (e.g., a computing device). For example, machine-readable media may include: read-only memory (ROM); random access memory (RAM); disk storage media; optical storage media; flash memory devices; electrical, optical, acoustic, or other forms of propagation signals (e.g., carrier waves, infrared signals, digital signals, etc.), and others. Additionally, firmware, software, routines, and/or instructions may be described herein as performing certain actions. However, it should be understood that such descriptions are for convenience only and that such actions are actually caused by a computing device, processor, controller, or other device executing the firmware, software, routines, instructions, etc., and that in performing such operations may cause actuators or other devices to interact with the physical world.

然而,在更詳細地描述此類實施例之前,有指導性地呈現可實施本發明之實施例的實例環境。 However, before describing such embodiments in more detail, an example environment in which embodiments of the present invention may be implemented is presented for guidance.

實例微影系統Example lithography system

圖1展示包含輻射源SO及微影裝置LA之微影系統。輻射源SO經組態以產生EUV輻射光束B且將EUV輻射光束B供應至微影裝置LA。微影裝置LA包含照明系統IL、經組態以支撐圖案化器件MA(例如,光罩)之支撐結構(例如,光罩台)MT、投影系統PS及經組態以支撐基板W之基板台WT。大體而言,可憑藉長衝程模組(粗略定位)及短衝程模組(精細定位)來實現支撐結構MT之移動,如下文進一步描述。 FIG1 shows a lithography system including a radiation source SO and a lithography apparatus LA. The radiation source SO is configured to generate an EUV radiation beam B and supply the EUV radiation beam B to the lithography apparatus LA. The lithography apparatus LA includes an illumination system IL, a support structure (e.g., a mask stage) MT configured to support a patterned device MA (e.g., a mask), a projection system PS, and a substrate stage WT configured to support a substrate W. In general, the movement of the support structure MT can be achieved by means of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), as further described below.

照明系統IL經組態以在EUV輻射光束B入射於圖案化器件MA上之前調節EUV輻射光束B。另外,照明系統IL可包括琢面化場鏡面器件10及琢面化光瞳鏡面器件11。琢面化場鏡面器件10及琢面化光瞳鏡面器件11共同提供具有所要橫截面形狀及所要強度分佈之EUV輻射光束B。除了琢面化場鏡面器件10及琢面化光瞳鏡面器件11以外或代替琢面化場鏡面器件10及琢面化光瞳鏡面器件11,照明系統IL可包括其他鏡面或器 件。 The illumination system IL is configured to condition the EUV radiation beam B before the EUV radiation beam B is incident on the patterned device MA. In addition, the illumination system IL may include a faceted field mirror device 10 and a faceted pupil mirror device 11. The faceted field mirror device 10 and the faceted pupil mirror device 11 together provide an EUV radiation beam B having a desired cross-sectional shape and a desired intensity distribution. In addition to or in place of the faceted field mirror device 10 and the faceted pupil mirror device 11, the illumination system IL may include other mirrors or devices

在由此調節之後,EUV輻射光束B與圖案化器件MA相互作用。由於此相互作用,產生經圖案化之EUV輻射光束B'。投影系統PS經組態以將經圖案化之EUV輻射光束B'投影至基板W上。出於該目的,投影系統PS可包含複數個鏡面13、14,其經組態以將經圖案化之EUV輻射光束B'投影至由基板台WT固持之基板W上。投影系統PS可將縮減因數應用至經圖案化之EUV輻射光束B',因此形成具有小於圖案化器件MA上之對應特徵之特徵的影像。舉例而言,可應用縮減因數4或8。儘管在圖1中將投影系統PS說明為僅具有兩個鏡面13、14,但該投影系統PS可包括不同數目之鏡面(例如,六個或八個鏡面)。 After being conditioned in this way, the EUV radiation beam B interacts with the patterned device MA. As a result of this interaction, a patterned EUV radiation beam B' is generated. The projection system PS is configured to project the patterned EUV radiation beam B' onto the substrate W. For this purpose, the projection system PS may comprise a plurality of mirrors 13, 14, which are configured to project the patterned EUV radiation beam B' onto the substrate W held by the substrate table WT. The projection system PS may apply a reduction factor to the patterned EUV radiation beam B', thereby forming an image having features that are smaller than the corresponding features on the patterned device MA. For example, a reduction factor of 4 or 8 may be applied. Although the projection system PS is illustrated in FIG. 1 as having only two mirrors 13, 14, the projection system PS may include a different number of mirrors (e.g., six or eight mirrors).

基板W可包括先前形成之圖案。在此情況下,微影裝置LA將由經圖案化之EUV輻射光束B'形成之影像與先前形成於基板W上之圖案對準。 The substrate W may include a previously formed pattern. In this case, the lithography device LA aligns the image formed by the patterned EUV radiation beam B' with the pattern previously formed on the substrate W.

可在輻射源SO中、在照明系統IL中及/或在投影系統PS中提供相對真空,亦即在遠低於大氣壓力之壓力下之少量氣體(例如氫氣)。 A relative vacuum, i.e. a small amount of gas (e.g. hydrogen) at a pressure much lower than atmospheric pressure, may be provided in the radiation source SO, in the illumination system IL and/or in the projection system PS.

輻射源SO可為雷射產生電漿(LPP)源、放電產生電漿(DPP)源、自由電子雷射(FEL)或能夠產生EUV輻射之任何其他輻射源。 The radiation source SO may be a laser produced plasma (LPP) source, a discharge produced plasma (DPP) source, a free electron laser (FEL) or any other radiation source capable of generating EUV radiation.

實例倍縮光罩載物台及安全器件系統Example of zoom mask stage and safety device system

圖2及圖3展示根據本發明之一些實施例的例示性倍縮光罩載物台200之示意性說明。倍縮光罩載物台200可包括頂部載物台表面202、底部載物台表面204、側載物台表面206、倍縮光罩208及安全器件300。在一些實施例中,具有倍縮光罩208之倍縮光罩載物台200可實施於微影裝置LA中。舉例而言,倍縮光罩載物台200可表示支撐結構MT且倍 縮光罩208可表示微影裝置LA中之圖案化器件MA。在一些實施例中,倍縮光罩208及複數個安全器件300可安置於頂部載物台表面202上。舉例而言,如圖2中所展示,倍縮光罩208可安置於頂部載物台表面202之中心處,而安全器件300鄰近於倍縮光罩208之每一隅角安置。 FIG. 2 and FIG. 3 show schematic illustrations of an exemplary reticle stage 200 according to some embodiments of the present invention. The reticle stage 200 may include a top stage surface 202, a bottom stage surface 204, a side stage surface 206, a reticle 208, and a safety device 300. In some embodiments, the reticle stage 200 with the reticle 208 may be implemented in a lithography apparatus LA. For example, the reticle stage 200 may represent a support structure MT and the reticle 208 may represent a patterning device MA in the lithography apparatus LA. In some embodiments, the reticle 208 and the plurality of safety devices 300 may be disposed on the top stage surface 202. For example, as shown in FIG. 2 , the zoom mask 208 may be disposed at the center of the top stage surface 202, and the safety device 300 may be disposed adjacent to each corner of the zoom mask 208.

在一些微影裝置(例如微影裝置LA)中,倍縮光罩載物台或夾盤200可用以固持及定位倍縮光罩208以用於掃描或圖案化操作。倍縮光罩載物台200需要強力驅動、大平衡質量及承力框架以支撐自身。倍縮光罩載物台200具有大慣性且可重達500kg以上以推動及定位重約0.5kg之倍縮光罩208。為實現通常在微影掃描或圖案化操作中發現的倍縮光罩208之往復運動,可藉由驅動倍縮光罩載物台200之直線馬達提供加速力及減速力。 In some lithography apparatuses (e.g., lithography apparatus LA), a zoom mask stage or chuck 200 may be used to hold and position a zoom mask 208 for scanning or patterning operations. Zoom mask stage 200 requires a strong drive, a large counterweight, and a load-bearing frame to support itself. Zoom mask stage 200 has a large inertia and may weigh more than 500 kg to push and position a zoom mask 208 weighing approximately 0.5 kg. To achieve the reciprocating motion of zoom mask 208 typically found in lithography scanning or patterning operations, acceleration and deceleration forces may be provided by a linear motor driving zoom mask stage 200.

在倍縮光罩載物台200例如因大功率損耗或嚴重系統故障而突發故障期間,倍縮光罩載物台200之加速力及減速力可轉移至倍縮光罩208並導致倍縮光罩碰撞。倍縮光罩208可碰撞到倍縮光罩載物台200之其他組件,導致倍縮光罩208及/或其他附近組件損壞。倍縮光罩208可在較高力(亦即,高加速度)下發生碰撞,其視倍縮光罩載物台200之預撞擊運動及動量而定。較軟倍縮光罩撓曲可引起金屬破裂(例如,圖案損壞),同時較硬之倍縮光罩撓曲可引起玻璃破裂(例如,倍縮光罩中之裂痕)。當前方法使用某種形式之安全機構以降低或減小倍縮光罩在碰撞期間之力。然而,由於倍縮光罩在最壞情況碰撞下之衝擊應力(力)較高,倍縮光罩及/或當前安全機構可亦發生損壞。 During a sudden failure of the reticle stage 200, such as due to a large power loss or a severe system failure, the acceleration and deceleration forces of the reticle stage 200 may be transferred to the reticle 208 and cause the reticle to crash. The reticle 208 may crash into other components of the reticle stage 200, causing damage to the reticle 208 and/or other nearby components. The reticle 208 may crash at relatively high forces (i.e., high accelerations), depending on the pre-crash motion and momentum of the reticle stage 200. Softer zoom mask deflections may cause metal fractures (e.g., pattern damage), while stiffer zoom mask deflections may cause glass fractures (e.g., cracks in the zoom mask). Current approaches use some form of safety mechanism to reduce or mitigate the force of the zoom mask during impact. However, due to the higher impact stress (force) of the zoom mask under worst case impact, the zoom mask and/or current safety mechanisms may also be damaged.

一種可能的解決方案係將安全機構(例如安全器件300)定位在倍縮光罩208周圍以充當減震器來降低倍縮光罩208在碰撞期間之衝擊 力。舉例而言,可在倍縮光罩208周圍使用具有減震器之緩衝器裝置201以吸收由碰撞帶來的可能的力或震動,使得可完全減少或消除對倍縮光罩208及安全器件300之損壞。根據實施例,安全器件300亦可各自包括安全閂鎖(圖中未展示),該安全閂鎖在倍縮光罩208下方適當旋轉,使得安全閂鎖防止倍縮光罩208自倍縮光罩載物台200掉落。可藉由四個安全器件300(例如,鄰近於倍縮光罩208之隅角配置)來限制倍縮光罩208。在一實施例中,安全器件300可與用以阻止物件位移或掉落之「籠」起相同作用。當安全器件300用以為倍縮光罩提供緊急支撐時,該等安全器件300可統稱為倍縮光罩籠,但安全器件300亦可用以支撐其他類型的圖案化器件或任何其他類型的經夾持物件。 One possible solution is to position a safety mechanism (e.g., safety device 300) around the zoom mask 208 to act as a shock absorber to reduce the impact force of the zoom mask 208 during a collision. For example, a buffer device 201 with a shock absorber can be used around the zoom mask 208 to absorb possible forces or shocks caused by the collision, so that damage to the zoom mask 208 and the safety device 300 can be completely reduced or eliminated. According to an embodiment, the safety devices 300 can also each include a safety latch (not shown in the figure), which is appropriately rotated under the zoom mask 208 so that the safety latch prevents the zoom mask 208 from falling from the zoom mask stage 200. The zoom mask 208 can be restrained by four safety devices 300 (e.g., disposed adjacent to the corners of the zoom mask 208). In one embodiment, the safety devices 300 can function similarly to a "cage" used to prevent objects from being displaced or dropped. When the safety devices 300 are used to provide emergency support for the zoom mask, the safety devices 300 can be collectively referred to as a zoom mask cage, but the safety devices 300 can also be used to support other types of patterned devices or any other type of clamped objects.

在一些實施例中,如圖2及圖3中所展示,倍縮光罩載物台200可包括用於定位操作之第一編碼器212及第二編碼器214。舉例而言,第一編碼器212及第二編碼器214可為干涉計。第一編碼器212可沿第一方向,例如倍縮光罩載物台200之橫向方向(亦即,X方向)附接,且第二編碼器214可沿第二方向,例如倍縮光罩載物台200之縱向方向(亦即,Y方向)附接。在一些實施例中,如圖2及圖3中所展示,第一編碼器212可與第二編碼器214正交。 In some embodiments, as shown in FIGS. 2 and 3, the zoom mask stage 200 may include a first encoder 212 and a second encoder 214 for positioning operations. For example, the first encoder 212 and the second encoder 214 may be interferometers. The first encoder 212 may be attached along a first direction, such as a lateral direction of the zoom mask stage 200 (i.e., X direction), and the second encoder 214 may be attached along a second direction, such as a longitudinal direction of the zoom mask stage 200 (i.e., Y direction). In some embodiments, as shown in FIGS. 2 and 3, the first encoder 212 may be orthogonal to the second encoder 214.

安全器件300可經組態以穩定及減小在碰撞期間對倍縮光罩208之損壞。安全器件300可經組態以使倍縮光罩208在碰撞期間之衝擊力均一地分佈。在一些實施例中,複數個安全器件300可安置於頂部載物台表面202中且可配置於倍縮光罩208之周邊周圍。舉例而言,多個安全器件300可鄰近於倍縮光罩208之每一隅角安置以使倍縮光罩208之衝擊力均一地分佈於複數個衝擊位置上。 The safety device 300 can be configured to stabilize and reduce damage to the zoom mask 208 during a collision. The safety device 300 can be configured to evenly distribute the impact force of the zoom mask 208 during a collision. In some embodiments, a plurality of safety devices 300 can be disposed in the top stage surface 202 and can be arranged around the periphery of the zoom mask 208. For example, a plurality of safety devices 300 can be disposed adjacent to each corner of the zoom mask 208 so that the impact force of the zoom mask 208 is evenly distributed over a plurality of impact locations.

在一些實施例中,諸如在倍縮光罩交換操作或倍縮光罩208之手動恢復期間,可利用安全器件300來將倍縮光罩208(例如,具有安全閂鎖之倍縮光罩)固持在適當位置。安全器件300亦適用於在倍縮光罩208在掃描期間自固持倍縮光罩之靜電夾具脫離的情況下防止該倍縮光罩在Z方向上位移。 In some embodiments, the safety device 300 can be used to hold the reticle 208 (e.g., a reticle with a safety latch) in place, such as during a reticle swap operation or manual recovery of the reticle 208. The safety device 300 is also suitable for preventing the reticle 208 from being displaced in the Z direction if it is disengaged from an electrostatic fixture that holds the reticle during scanning.

具有磁耦合之安全器件之實例設計Example design of a safety device with magnetic coupling

圖4A及圖4B說明根據本發明之實施例的一個安全器件300之實例視圖。特定而言,圖4A說明安全器件300之側視圖,而圖4B說明安全器件300之橫截面圖。如上文圖2至圖3中所論述,一或多個安全器件300可安置在倍縮光罩208周圍且耦合至夾盤(例如,倍縮光罩載物台200)。 FIG. 4A and FIG. 4B illustrate example views of a security device 300 according to an embodiment of the present invention. Specifically, FIG. 4A illustrates a side view of the security device 300, and FIG. 4B illustrates a cross-sectional view of the security device 300. As discussed above in FIG. 2-3, one or more security devices 300 may be disposed around the zoom mask 208 and coupled to a chuck (e.g., the zoom mask stage 200).

安全器件300包括驅動側401(例如,在載體上)及從動側402(例如,在夾盤上)。特定而言,驅動側401包括安全器件300之移動件組件,而從動側402包括對驅動側401之運動作出反應之從動件組件。驅動側401包括驅動馬達404、驅動組件406a及感測器418。 The safety device 300 includes a driving side 401 (e.g., on a carrier) and a driven side 402 (e.g., on a chuck). Specifically, the driving side 401 includes a moving component of the safety device 300, and the driven side 402 includes a driven component that responds to the movement of the driving side 401. The driving side 401 includes a driving motor 404, a driving component 406a, and a sensor 418.

在一些實施例中,感測器418包含位置感測器,該位置感測器經組態以感測物件或目標(例如,目標420)之近接度或位置。舉例而言,感測器418可為電容式感測器、電感式感測器、光學反射式感測器、斷裂光束感測器。在一些實施例中,感測器418可位於驅動側401(例如,載體)上,而感測器418感測到之物件可位於從動側402(例如,夾盤)上。在其他實施例中,感測器418及感測器418感測到之物件兩者可位於從動側402(例如,夾盤)上。在一些情況下,若感測器418及物件位於安全器件300之不同側上(例如,感測器418位於驅動側401上且物件位於從動側 402上,或反之亦然),則從動側402及驅動側401之移動可影響感測器資料。藉由使感測器418及物件兩者定位於從動側402上,從動側402及驅動側401可相對於彼此移動而不影響感測器資料。 In some embodiments, sensor 418 includes a position sensor configured to sense the proximity or position of an object or target (e.g., target 420). For example, sensor 418 can be a capacitive sensor, an inductive sensor, an optical reflective sensor, a broken beam sensor. In some embodiments, sensor 418 can be located on the driving side 401 (e.g., a carrier), and the object sensed by sensor 418 can be located on the driven side 402 (e.g., a chuck). In other embodiments, both sensor 418 and the object sensed by sensor 418 can be located on the driven side 402 (e.g., a chuck). In some cases, if the sensor 418 and the object are located on different sides of the security device 300 (e.g., the sensor 418 is located on the driving side 401 and the object is located on the slave side 402, or vice versa), the movement of the slave side 402 and the driving side 401 can affect the sensor data. By positioning both the sensor 418 and the object on the slave side 402, the slave side 402 and the driving side 401 can move relative to each other without affecting the sensor data.

驅動馬達404為移動安全器件300及控制安全器件300之移動的組件。在一些實施例中,驅動馬達404可為旋轉馬達、致動器及/或直接驅動器、雙穩態致動器。特定而言,驅動馬達404驅動或致動驅動組件406a,該驅動組件406a為磁耦合器件406之部分。可替代地,可使用旋轉螺線管代替馬達或具有制動機構之另一電旋轉馬達。驅動馬達404之雙穩態性質意謂馬達之運動僅在功率不足時發生。當驅動馬達404固定於給定位置時,其不會消耗功率。驅動馬達404可為壓電馬達或DC馬達。 The drive motor 404 is a component that moves the safety device 300 and controls the movement of the safety device 300. In some embodiments, the drive motor 404 can be a rotary motor, an actuator and/or a direct drive, a bi-stable actuator. Specifically, the drive motor 404 drives or actuates a drive assembly 406a, which is part of the magnetic coupling device 406. Alternatively, a rotary solenoid can be used instead of a motor or another electric rotary motor with a braking mechanism. The bi-stable nature of the drive motor 404 means that the movement of the motor only occurs when the power is insufficient. When the drive motor 404 is fixed in a given position, it does not consume power. The driving motor 404 can be a piezoelectric motor or a DC motor.

磁耦合器件406為安全器件300提供非接觸式永久磁耦合。磁耦合器件406包括兩個組件:驅動組件406a及從動組件406b。該兩個組件406a及406b具有面向彼此但不彼此接觸之永久磁鐵。舉例而言,驅動組件406a及從動組件406b可藉由約1至4mm之間距實體分離。驅動組件406a及從動組件406b之永久磁鐵之間的吸引力允許驅動側401以旋轉方式驅動或移動安全器件之從動側402。 The magnetic coupling device 406 provides non-contact permanent magnetic coupling for the safety device 300. The magnetic coupling device 406 includes two components: a driving component 406a and a driven component 406b. The two components 406a and 406b have permanent magnets facing each other but not touching each other. For example, the driving component 406a and the driven component 406b can be physically separated by a distance of about 1 to 4 mm. The attractive force between the permanent magnets of the driving component 406a and the driven component 406b allows the driving side 401 to drive or move the driven side 402 of the safety device in a rotational manner.

從動側402包括從動組件406b、殼體408、軸410、安全緩衝器416、安全閂鎖412、支腳區域414、安全緩衝器416及目標420。經由磁耦合器件406,從動組件406b對驅動組件406a之運動作出反應,使得機械能非接觸式地傳輸至從動側402。從動側402之殼體408可沿Z軸具有最長長度,且可提供該殼體408以保護安置於內部之移動組件。殼體408可為射出模製材料,諸如聚合物材料,或殼體408可為經機械加工之金屬。在一些實施例中,殼體408沿Z方向之長度可為約20至70毫米。 The driven side 402 includes a driven component 406b, a housing 408, a shaft 410, a safety buffer 416, a safety latch 412, a foot area 414, a safety buffer 416, and a target 420. The driven component 406b reacts to the movement of the driving component 406a via the magnetic coupling device 406, so that mechanical energy is transmitted to the driven side 402 in a non-contact manner. The housing 408 of the driven side 402 can have a longest length along the Z axis, and the housing 408 can be provided to protect the moving components disposed inside. The housing 408 can be an injection molded material, such as a polymer material, or the housing 408 can be a machined metal. In some embodiments, the length of the housing 408 along the Z direction may be approximately 20 to 70 mm.

殼體408包括經由磁耦合器件406附接至驅動馬達404之軸410。特定而言,軸410可安置於殼體408內,而磁耦合器件406可耦合至殼體408外之軸410之一端。軸410可沿殼體408之長度延伸。 The housing 408 includes a shaft 410 attached to the drive motor 404 via a magnetic coupling device 406. Specifically, the shaft 410 can be disposed within the housing 408, and the magnetic coupling device 406 can be coupled to one end of the shaft 410 outside the housing 408. The shaft 410 can extend along the length of the housing 408.

亦可包括安全緩衝器416作為馬達設計之部分且該安全緩衝器416安置於安全器件之從動側402內。任何類型之套管或軸承設計可用於安全緩衝器設計中。根據一些實施例,一旦倍縮光罩失去對從動側402(例如,夾盤)之夾持力,一或多個安全緩衝器416即可包括於安全器件300中以在X方向及Y方向上充當倍縮光罩之停止機構。安全緩衝器416更詳細地描述於美國申請案第62/768,161號中,該美國申請案以全文引用之方式併入本文中。 A safety buffer 416 may also be included as part of the motor design and disposed within the driven side 402 of the safety device. Any type of bushing or bearing design may be used in the safety buffer design. According to some embodiments, one or more safety buffers 416 may be included in the safety device 300 to act as a stop mechanism for the zoom mask in the X and Y directions once the zoom mask loses its grip on the driven side 402 (e.g., a chuck). The safety buffer 416 is described in more detail in U.S. Application No. 62/768,161, which is incorporated herein by reference in its entirety.

安全器件300亦包括安全閂鎖412,其耦合至軸410之與耦合至磁耦合器件406之末端相對的末端。安全閂鎖412沿旋轉軸410旋轉。在一些實施例中,安全閂鎖412可在殼體408下方圍繞平行於Z方向之軸旋轉完整的360度。安全閂鎖412自軸410徑向朝外延伸且可具有小於60mm之長度。舉例而言,安全閂鎖412可具有大於10mm且小於60mm長度。安全閂鎖412之確切所說明之設計僅為一個實例且並不意欲為限制性的。安全閂鎖412可包括如圖4A、圖4B或圖5所說明之兩個或更多個獨立光束,或其可為一個實心件。 The safety device 300 also includes a safety latch 412 coupled to the end of the shaft 410 opposite the end coupled to the magnetic coupling device 406. The safety latch 412 rotates along the rotation axis 410. In some embodiments, the safety latch 412 can rotate a full 360 degrees around an axis parallel to the Z direction below the housing 408. The safety latch 412 extends radially outward from the shaft 410 and can have a length of less than 60 mm. For example, the safety latch 412 can have a length greater than 10 mm and less than 60 mm. The exact illustrated design of the safety latch 412 is only an example and is not intended to be limiting. The safety latch 412 may include two or more separate beams as illustrated in FIG. 4A, FIG. 4B, or FIG. 5, or it may be a solid piece.

在一些實施例中,支腳區域414可安置於安全閂鎖412之遠端處。支腳區域414可被稱為安全支腳或倍縮光罩支腳。支腳區域414可實質上為平坦的且經設計以接觸圖案化器件(例如,倍縮光罩)之一部分。根據一些實施例,支腳區域414僅為安全閂鎖412中在圖案化器件將在Z方向上自其夾持位置掉落的情況下將與該器件有任何接觸之部分。 In some embodiments, the foot region 414 may be disposed at a distal end of the safety latch 412. The foot region 414 may be referred to as a safety foot or a zoom mask foot. The foot region 414 may be substantially flat and designed to contact a portion of a patterned device (e.g., a zoom mask). According to some embodiments, the foot region 414 is the only portion of the safety latch 412 that will have any contact with the patterned device if the device were to fall from its clamping position in the Z direction.

圖4B之橫截面圖進一步說明安全器件300之額外組件,包括顆粒顆粒密封件422、上端顆粒密封件424、軸承426及下端顆粒密封件428。軸承426包括承受殼體408中之旋轉部分之間的摩擦之陶瓷組件。顆粒密封件422、424及428可設計成使得在安全閂鎖412旋轉期間自移動部分產生之顆粒仍被截留於客體408內且不會被排出而進入安全器件300周圍的空間內。在一些實施例中,上端顆粒密封件424、軸承426及下端顆粒密封件428可安置於安全器件之殼體408內。 The cross-sectional view of FIG. 4B further illustrates additional components of the safety device 300, including a particle-particle seal 422, an upper particle seal 424, a bearing 426, and a lower particle seal 428. The bearing 426 includes a ceramic component that withstands the friction between the rotating parts in the housing 408. The particle seals 422, 424, and 428 can be designed so that particles generated from the moving parts during the rotation of the safety latch 412 remain trapped in the object 408 and are not expelled into the space around the safety device 300. In some embodiments, the upper particle seal 424, the bearing 426, and the lower particle seal 428 can be disposed in the housing 408 of the safety device.

圖5說明根據本發明之實施例的圖4A及圖4B之安全器件300之等距視圖的示意性說明。安全器件300包括驅動馬達404、磁耦合器件406、殼體408、軸410、安全閂鎖412及支腳區域414以及安全緩衝器416。 FIG. 5 illustrates a schematic illustration of an isometric view of the safety device 300 of FIG. 4A and FIG. 4B according to an embodiment of the present invention. The safety device 300 includes a drive motor 404, a magnetic coupling device 406, a housing 408, a shaft 410, a safety latch 412, a foot area 414, and a safety buffer 416.

如圖5中所展示,支腳區域414可自安全閂鎖412之剩餘部分以一角度(諸如約90度角)彎曲。根據一些實施例,傾斜部件(圖中未展示)可將安全閂鎖412連接至支腳區域414,使得支腳區域414安置於低於安全閂鎖412之平行平面處。 As shown in FIG. 5 , the foot region 414 can be bent at an angle (e.g., approximately 90 degrees) from the remainder of the safety latch 412. According to some embodiments, a tilting member (not shown) can connect the safety latch 412 to the foot region 414 so that the foot region 414 is disposed below a parallel plane of the safety latch 412.

在一些實施例中,安全器件300可為剛性材料,例如金屬或陶瓷。在一些實施例中,安全器件300之殼體408可為圓柱形且延伸穿過倍縮光罩載物台200之一部分以用於與倍縮光罩之隅角剛性對準。在一些實施例中,安全閂鎖412可經組態以穩定(例如,發現)並減小在碰撞期間對倍縮光罩之損壞。舉例而言,安全閂鎖412之支腳區域414可在倍縮光罩之頂部表面上方延伸,且可經組態以防止倍縮光罩在垂直於頂部載物台表面202之表面的方向(例如,Z方向)上移動。 In some embodiments, the safety device 300 can be a rigid material, such as metal or ceramic. In some embodiments, the housing 408 of the safety device 300 can be cylindrical and extend through a portion of the zoom mask stage 200 for rigid alignment with the corner of the zoom mask. In some embodiments, the safety latch 412 can be configured to stabilize (e.g., detect) and reduce damage to the zoom mask during a collision. For example, the foot region 414 of the safety latch 412 can extend above the top surface of the zoom mask and can be configured to prevent the zoom mask from moving in a direction perpendicular to the surface of the top stage surface 202 (e.g., the Z direction).

圖6A、圖6B及圖6C說明根據本發明之實施例的用於安全 器件之實例磁耦合組態的示意圖。特定而言,圖6A說明面對面磁耦合組態600、圖6B說明共軸磁耦合組態610,且圖6C說明磁耦合表面620之實例。 6A, 6B, and 6C illustrate schematic diagrams of example magnetic coupling configurations for a safety device according to an embodiment of the present invention. Specifically, FIG. 6A illustrates a face-to-face magnetic coupling configuration 600, FIG. 6B illustrates a coaxial magnetic coupling configuration 610, and FIG. 6C illustrates an example of a magnetic coupling surface 620.

圖6A之面對面磁耦合組態600為面對面磁耦合機構,其中驅動組件406a與從動組件406b之表面鄰近於彼此置放,其間有材料。驅動組件406a及從動組件406b之表面內襯有複數個彼此吸引之永久磁鐵,得到磁耦合器件406。在一些實施例中,驅動組件406a及從動組件406b之表面可由該兩個組件之間由具有預定厚度之材料分隔(例如約1.5mm至6mm之距離可分隔驅動組件406a與從動組件406b)。 The face-to-face magnetic coupling configuration 600 of FIG. 6A is a face-to-face magnetic coupling mechanism, in which the surfaces of the driving component 406a and the driven component 406b are placed adjacent to each other with a material therebetween. The surfaces of the driving component 406a and the driven component 406b are lined with a plurality of permanent magnets that attract each other, resulting in a magnetic coupling device 406. In some embodiments, the surfaces of the driving component 406a and the driven component 406b may be separated by a material having a predetermined thickness between the two components (e.g., a distance of about 1.5 mm to 6 mm may separate the driving component 406a and the driven component 406b).

圖6B之共軸磁耦合組態610為共軸磁耦合機構,其中驅動組件406a及從動組件406b之圓柱形末端彼此同軸耦合。驅動組件406a及從動組件406b之圓柱形末端可由材料(例如,絕緣體)分離,以便在安全器件中提供非接觸式磁耦合機構。在一些實施例中,驅動組件406a之外部圓柱形末端可與從動組件406b之內部圓柱形末端同軸耦合。舉例而言,驅動組件406a之外部圓柱形末端之內部表面可內襯有吸引至極性相反之永久磁鐵之永久磁鐵,該等極性相反之永久磁鐵鋪設在從動組件406b之內部圓柱形末端之外部表面上。 The coaxial magnetic coupling configuration 610 of FIG. 6B is a coaxial magnetic coupling mechanism in which the cylindrical ends of the driver component 406a and the driven component 406b are coaxially coupled to each other. The cylindrical ends of the driver component 406a and the driven component 406b can be separated by a material (e.g., an insulator) to provide a contactless magnetic coupling mechanism in a safety device. In some embodiments, the outer cylindrical end of the driver component 406a can be coaxially coupled with the inner cylindrical end of the driven component 406b. For example, the inner surface of the outer cylindrical end of the driver component 406a may be lined with permanent magnets that are attracted to oppositely polarized permanent magnets that are laid on the outer surface of the inner cylindrical end of the driven component 406b.

在其他實施例中,從動組件406b之外部圓柱形末端可與驅動組件406a之內部圓柱形末端同軸耦合。舉例而言,從動組件406b之外部圓柱形末端之內部表面可內襯有吸引至極性相反之永久磁鐵之永久磁鐵,該等極性相反之永久磁鐵鋪設在驅動組件406a之內部圓柱形末端之外部表面上。 In other embodiments, the outer cylindrical end of the driven component 406b may be coaxially coupled to the inner cylindrical end of the driving component 406a. For example, the inner surface of the outer cylindrical end of the driven component 406b may be lined with permanent magnets that are attracted to oppositely polarized permanent magnets that are laid on the outer surface of the inner cylindrical end of the driving component 406a.

圖6C進一步說明磁耦合表面620之實例。磁耦合表面620 可表示面對面耦合機構(例如,面對磁耦合組態600)中之驅動組件406a之表面及/或從動組件406b之表面。耦合表面620可包括以圓形方式配置於驅動組件406a及/或從動組件406b之表面上之複數個磁鐵625。在一些實施例中,可基於驅動馬達404之運動之解析度及驅動組件406a與從動組件406b之耦合強度選擇磁鐵625之間的間距及磁鐵625之數目。 FIG. 6C further illustrates an example of a magnetic coupling surface 620. Magnetic coupling surface 620 may represent a surface of a driving component 406a and/or a surface of a driven component 406b in a face-to-face coupling mechanism (e.g., face-to-face magnetic coupling configuration 600). Coupling surface 620 may include a plurality of magnets 625 arranged in a circular manner on the surface of driving component 406a and/or driven component 406b. In some embodiments, the spacing between magnets 625 and the number of magnets 625 may be selected based on the resolution of the motion of the driving motor 404 and the coupling strength between the driving component 406a and the driven component 406b.

雖然圖6A至圖6C僅展示兩個磁耦合組態時,但應理解,磁耦合器件406可利用磁耦合機構或組態之其他實施例來耦合驅動組件406a與從動組件406b。藉由利用各種磁耦合機構(例如,面對面耦合機構、共軸耦合機構或其類似者),安全器件之從動側可基於其與具有驅動馬達之驅動側之連接移動。 Although only two magnetic coupling configurations are shown in FIG. 6A to FIG. 6C , it should be understood that the magnetic coupling device 406 can utilize other embodiments of magnetic coupling mechanisms or configurations to couple the driving component 406a and the driven component 406b. By utilizing various magnetic coupling mechanisms (e.g., face-to-face coupling mechanisms, coaxial coupling mechanisms, or the like), the driven side of the safety device can move based on its connection with the driving side having a driving motor.

此外,非接觸式磁耦合器件406可藉由提供雙穩態致動機構而具有優勢,其中驅動側401(驅動馬達404定位之處)上之振動與從動側402實體隔離,使得對夾盤之振動或干擾的傳遞極大地減少。此外,安全器件中之驅動側401與從動側402之間的間隔在兩側之間提供有助於阻止顆粒自驅動側401進入之障壁或顆粒捕集器。在一些實施例中,因為耦合件係以磁性方式連接,所以本發明考慮到耦合件之間(例如,驅動組件406a與從動組件406b之間)的一些未對準(例如,軸向及角向),同時維持雙穩態致動機構。換言之,當未致動驅動側401時,從動側402保持在適當位置。 In addition, the contactless magnetic coupling device 406 can have advantages by providing a dual-stable actuation mechanism, where vibrations on the driving side 401 (where the drive motor 404 is located) are physically isolated from the driven side 402, so that the transmission of vibrations or disturbances to the chuck is greatly reduced. In addition, the spacing between the driving side 401 and the driven side 402 in the safety device provides a barrier or particle trap between the two sides that helps prevent particles from entering from the driving side 401. In some embodiments, because the couplings are magnetically connected, the present invention allows for some misalignment (e.g., axial and angular) between the couplings (e.g., between the driver assembly 406a and the driven assembly 406b) while maintaining a bi-stable actuation mechanism. In other words, when the driver side 401 is not actuated, the driven side 402 remains in place.

圖7說明根據本發明之實施例的鄰近於圖案化器件圖案化器件208之一個隅角之圖案化器件208及安全器件300之俯視圖。應注意,圖7並不按比例繪製且為清楚起見而使某些特徵較大。此外,安全器件300相對於圖案化器件208之定位並不意欲為限制性的一安全器件300可位 於圖案化器件208之周邊周圍之任何地方。 FIG. 7 illustrates a top view of a patterned device 208 and a security device 300 adjacent to a corner of the patterned device 208 according to an embodiment of the present invention. It should be noted that FIG. 7 is not drawn to scale and certain features are larger for clarity. Furthermore, the positioning of the security device 300 relative to the patterned device 208 is not intended to be limiting. The security device 300 may be located anywhere around the perimeter of the patterned device 208.

如圖7中所展示,安全器件300之安全閂鎖412在左側上所示之第一位置與右側上所示之第二位置之間旋轉。在第一位置中,支腳區域414對準於圖案化器件208之下,使得在圖案化器件208與夾盤脫離(圖7中未展示)且沿Z方向掉落的情況下圖案化器件208接觸支腳區域414。在第二位置中,安全閂鎖412已旋轉遠離圖案化器件208,使得沒有安全閂鎖412之部分在圖案化器件208下方。根據一實施例,圖案化器件208耦合至夾盤時,安全閂鎖412將旋轉至第一位置內。根據實施例,安全閂鎖412將在圖案化器件208自夾盤裝載或移除期間旋轉至第二位置中。安全閂鎖412在第一位置與第二位置之間的旋轉角θ可介於5度與20度之間。基於安全閂鎖412之長度,其他旋轉角同樣係有可能的。 As shown in FIG7 , the safety latch 412 of the safety device 300 rotates between a first position shown on the left side and a second position shown on the right side. In the first position, the foot area 414 is aligned under the patterned device 208 so that the patterned device 208 contacts the foot area 414 if the patterned device 208 is disengaged from the chuck (not shown in FIG7 ) and falls in the Z direction. In the second position, the safety latch 412 has rotated away from the patterned device 208 so that no portion of the safety latch 412 is under the patterned device 208. According to one embodiment, the safety latch 412 will rotate into the first position when the patterned device 208 is coupled to the chuck. According to an embodiment, the safety latch 412 will rotate to the second position during loading or removal of the patterned device 208 from the chuck. The rotation angle θ of the safety latch 412 between the first position and the second position may be between 5 degrees and 20 degrees. Other rotation angles are also possible based on the length of the safety latch 412.

在一些實施例中,使用具有雙穩態馬達(例如,驅動馬達404)及磁耦合器件之安全器件來旋轉安全閂鎖412的優勢為:馬達僅在旋轉期間消耗功率,且在安全閂鎖412在第一位置或第二位置中靜止時不消耗功率。舉例而言,僅在安全閂鎖412自第一位置旋轉至第二位置時(且反之亦然)對馬達供電,持續僅短時間(例如0.5秒至3秒)。因此,並不需要長時間開啟馬達,且最終並不需要主動冷卻。 In some embodiments, the advantage of using a safety device having a dual-state motor (e.g., drive motor 404) and a magnetic coupling device to rotate the safety latch 412 is that the motor consumes power only during rotation and does not consume power when the safety latch 412 is stationary in the first position or the second position. For example, the motor is powered only when the safety latch 412 rotates from the first position to the second position (and vice versa), and lasts only for a short time (e.g., 0.5 seconds to 3 seconds). Therefore, the motor does not need to be turned on for a long time, and ultimately no active cooling is required.

在一些實施例中,具有磁耦合之安全器件300可能不依賴於旋轉或壓縮彈簧來提供用於將安全閂鎖412維持在第一位置中的力。此外,與先前安全設計(例如,使用電磁鐵之安全器件)相比,具有驅動馬達及磁耦合器件之安全器件300可具有低質量。 In some embodiments, the safety device 300 with magnetic coupling may not rely on a rotational or compression spring to provide a force for maintaining the safety latch 412 in the first position. In addition, the safety device 300 with a drive motor and a magnetic coupling device may have a low mass compared to previous safety designs (e.g., safety devices using electromagnets).

用於安全器件之實例形狀記憶體合金(SMA)機構Example Shape Memory Alloy (SMA) Mechanism for Security Devices

圖8A及圖8B說明根據本發明之實施例的用於安全器件(例 如,安全器件300)之形狀記憶體合金(SMA)致動器機構之實例圖。特定而言,圖8A說明處於第一位置(例如,閉合位置)之致動器機構800的正視圖,而圖8B說明處於第二位置(例如,開啟位置)之致動器機構810的正視圖。 FIG8A and FIG8B illustrate an example diagram of a shape memory alloy (SMA) actuator mechanism for a security device (e.g., security device 300) according to an embodiment of the present invention. Specifically, FIG8A illustrates a front view of the actuator mechanism 800 in a first position (e.g., a closed position), and FIG8B illustrates a front view of the actuator mechanism 810 in a second position (e.g., an open position).

致動器機構800及810包括形狀記憶體合金802、銷子接頭804、彈簧806、安全閂鎖808及倍縮光罩支腳809。安全器件中之致動器機構800及810的運動係藉由安全閂鎖808(例如,槓桿或蹺板機構)在Z方向上之移位而發生。雖然圖8A及圖8B中僅展示一個形狀記憶體合金802、銷子接頭804及彈簧806時,但致動器機構800及810可在安全器件中利用任何數目之形狀記憶體合金802、銷子接頭804及/或彈簧806,以便增加安全器件中之致動力。 The actuator mechanisms 800 and 810 include a shape memory alloy 802, a pin joint 804, a spring 806, a safety latch 808, and a multiplying mask foot 809. The movement of the actuator mechanisms 800 and 810 in the safety device occurs by displacement of the safety latch 808 (e.g., a lever or seesaw mechanism) in the Z direction. Although only one shape memory alloy 802, pin joint 804, and spring 806 are shown in FIGS. 8A and 8B, the actuator mechanisms 800 and 810 may utilize any number of shape memory alloys 802, pin joints 804, and/or springs 806 in the safety device to increase the actuation force in the safety device.

在圖8A中,諸如在倍縮光罩掃描期間,在倍縮光罩(例如,倍縮光罩208)夾持至夾盤之表面時,致動器機構800經展示處於非致動、閉合位置。彈簧806可將致動器固持於閉合位置直至該致動器致動為止。舉例而言,彈簧806可為拉力彈簧。在一些實施例中,可基於致動器件所需之致動力及將致動器固持在閉合位置所需之固持力來預先選擇形狀記憶體合金802及彈簧806。特定而言,蹺板機構可用以將形狀記憶體合金802之線性運動轉換為在安全閂鎖808中在Z方向上擺動。 In FIG. 8A , the actuator mechanism 800 is shown in a non-actuated, closed position when a reticle (e.g., reticle 208) is clamped to the surface of a chuck, such as during a reticle scan. A spring 806 can hold the actuator in the closed position until the actuator is actuated. For example, the spring 806 can be a tension spring. In some embodiments, the shape memory alloy 802 and the spring 806 can be pre-selected based on the actuation force required to actuate the device and the holding force required to hold the actuator in the closed position. Specifically, the seesaw mechanism can be used to convert the linear motion of the shape memory alloy 802 into a swing in the Z direction in the safety latch 808.

為了將安全閂鎖808旋轉至藉由如圖8B中之致動器機構810所展示的打開位置,可將電流811施加至形狀記憶體合金802以激活該形狀記憶體合金802(例如,藉由加熱)且使安全閂鎖808移動(例如,旋轉)。釋放或移除電流811之後,彈簧806可壓縮且使安全閂鎖808自圖8B中之打開位置回到圖8A中之閉合位置。在一些實施例中,可冷卻形狀記 憶體合金802以促進形狀記憶體合金802回到其原始形狀(例如,閉合位置或打開位置)。 To rotate the safety latch 808 to the open position as shown by the actuator mechanism 810 in FIG. 8B , a current 811 may be applied to the shape memory alloy 802 to activate the shape memory alloy 802 (e.g., by heating) and cause the safety latch 808 to move (e.g., rotate). After releasing or removing the current 811, the spring 806 may compress and cause the safety latch 808 to return from the open position in FIG. 8B to the closed position in FIG. 8A . In some embodiments, the shape memory alloy 802 may be cooled to facilitate the shape memory alloy 802 to return to its original shape (e.g., closed position or open position).

在一些實施例中,安全閂鎖808可具有約15mm之長度且可回應於形狀記憶體合金802之激活藉由在約5度與約20度之間的預定旋轉角而自閉合位置旋轉至打開位置。在一些實施例中,安全閂鎖808可自閉合位置旋轉約5mm而到達K打開位置,或反之亦然。倍縮光罩支腳809可與安全閂鎖808之剩餘部分成一角度(例如,90度)安置於安全閂鎖808之遠端處。 In some embodiments, the safety latch 808 may have a length of about 15 mm and may rotate from a closed position to an open position by a predetermined rotation angle between about 5 degrees and about 20 degrees in response to activation of the shape memory alloy 802. In some embodiments, the safety latch 808 may rotate about 5 mm from the closed position to the K open position, or vice versa. The zoom shield foot 809 may be disposed at the distal end of the safety latch 808 at an angle (e.g., 90 degrees) to the remainder of the safety latch 808.

圖9A及圖9B說明根據本發明之實施例的用於安全器件(例如,安全器件300)之形狀記憶體合金(SMA)致動器機構的額外實例圖。特定而言,圖9A說明處於第一位置(例如,閉合位置)之致動器機構900的正視圖,而圖9B說明處於第二位置(例如,打開位置)之致動器機構910的俯視圖。 9A and 9B illustrate additional example diagrams of a shape memory alloy (SMA) actuator mechanism for a security device (e.g., security device 300) according to an embodiment of the present invention. Specifically, FIG. 9A illustrates a front view of the actuator mechanism 900 in a first position (e.g., a closed position), and FIG. 9B illustrates a top view of the actuator mechanism 910 in a second position (e.g., an open position).

致動器機構900及910使用旋轉組態,其中形狀記憶體合金902及彈簧906整合於驅動馬達404中且耦合至具有倍縮光罩支腳909之安全閂鎖908。雖然圖9A及圖9B中展示三個形狀記憶體合金902及彈簧906,但致動器機構900及910可在安全器件中利用任何數目之形狀記憶體合金902及/或彈簧906,以便減少或增加安全器件中之致動力。在一些實施例中,彈簧906可為膨脹彈簧及/或壓縮彈簧,且致動器機構900及910中之安全閂鎖908可在如藉由圖9A及圖9B之俯視圖所展示之X及Y方向上移位。 The actuator mechanisms 900 and 910 use a rotational configuration where the shape memory alloy 902 and spring 906 are integrated into the drive motor 404 and coupled to a safety latch 908 having a multiplied mask leg 909. Although three shape memory alloys 902 and springs 906 are shown in Figures 9A and 9B, the actuator mechanisms 900 and 910 may utilize any number of shape memory alloys 902 and/or springs 906 in the security device in order to reduce or increase the actuation force in the security device. In some embodiments, spring 906 may be an expansion spring and/or a compression spring, and safety latch 908 in actuator mechanisms 900 and 910 may be displaceable in the X and Y directions as shown by the top views of FIGS. 9A and 9B .

舉例而言,彈簧906可為與致動器機構900及910中的形狀記憶體合金902平行配置之壓縮彈簧。當將電流施加至形狀記憶體合金 902時,該形狀記憶體合金902可變熱並膨脹,使得安全閂鎖908自第一位置旋轉至第二位置。一旦切斷電流,彈簧906就可壓縮且促進形狀記憶體合金902收縮至其先前形狀/組態,使得安全閂鎖908自第二位置旋轉回至第一位置。 For example, spring 906 may be a compression spring arranged in parallel with shape memory alloy 902 in actuator mechanisms 900 and 910. When current is applied to shape memory alloy 902, the shape memory alloy 902 may heat up and expand, causing safety latch 908 to rotate from the first position to the second position. Once the current is cut off, spring 906 may compress and promote the shape memory alloy 902 to shrink to its previous shape/configuration, causing safety latch 908 to rotate back from the second position to the first position.

在另一實例中,彈簧906可為與致動器機構900及910中之形狀記憶體合金902平行配置的膨脹彈簧。形狀記憶體合金902可抵抗彈簧906之膨脹直至電流通過形狀記憶體合金902為止。在一些情況下,一旦電流已施加至形狀記憶體合金902,該形狀記憶體合金902即膨脹,且彈簧906促進形狀記憶體合金902膨脹,使得安全閂鎖908自第一位置旋轉至第二位置。一旦切斷電流,形狀記憶體合金902即冷卻並收縮至其原始位置,同時亦使彈簧906收縮回至其原始位置內。此收縮使得安全閂鎖908自第二位置旋轉回至第一位置。 In another example, the spring 906 can be an expansion spring arranged in parallel with the shape memory alloy 902 in the actuator mechanisms 900 and 910. The shape memory alloy 902 can resist the expansion of the spring 906 until current flows through the shape memory alloy 902. In some cases, once current has been applied to the shape memory alloy 902, the shape memory alloy 902 expands, and the spring 906 promotes the expansion of the shape memory alloy 902, causing the safety latch 908 to rotate from the first position to the second position. Once the current is cut off, the shape memory alloy 902 cools and contracts to its original position, while also causing the spring 906 to contract back to its original position. This contraction causes the safety latch 908 to rotate from the second position back to the first position.

在一些實施例中,致動器機構800、810、900及/或910可與圖4A、圖4B及圖5所展示之磁耦合器件406組合,以便提供經增強之安全器件。圖10A至圖10D展示根據本發明之實施例的形狀記憶體合金致動器及用於倍縮光罩安全性之安全器件的實例。特定而言,圖10A說明安全器件1000之俯視圖之示意性說明、圖10B說明安全器件1010之側視圖,且圖10C說明安全器件1020之等距視圖。圖10D說明夾盤1030中之形狀記憶體合金致動器及安全器件之等距視圖。 In some embodiments, the actuator mechanisms 800, 810, 900, and/or 910 may be combined with the magnetic coupling device 406 shown in FIGS. 4A, 4B, and 5 to provide an enhanced security device. FIGS. 10A to 10D show examples of shape memory alloy actuators and security devices for multiplied mask security according to embodiments of the present invention. Specifically, FIG. 10A illustrates a schematic illustration of a top view of security device 1000, FIG. 10B illustrates a side view of security device 1010, and FIG. 10C illustrates an isometric view of security device 1020. FIG. 10D illustrates an isometric view of a shape memory alloy actuator and security device in a chuck 1030.

圖10A至圖10C中展示之安全器件包括與彈簧1006平行配置且耦合至具有倍縮光罩支腳1009之安全閂鎖1008之形狀記憶體合金1002。在一些實施例中,可將形狀記憶體合金1002及彈簧1006封裝或整合至旋轉驅動馬達1004中,該旋轉驅動馬達1004可用以驅動安全閂鎖在X 及Y方向上移位。 The safety device shown in FIGS. 10A to 10C includes a shape memory alloy 1002 arranged in parallel with a spring 1006 and coupled to a safety latch 1008 having a multiplied mask leg 1009. In some embodiments, the shape memory alloy 1002 and the spring 1006 may be packaged or integrated into a rotary drive motor 1004, which may be used to drive the safety latch to shift in the X and Y directions.

實例操作方法Example operation method

圖11為根據本發明之實施例的用於操作用於支撐圖案化器件之例示性方法1100的流程圖。方法1100可描述安全器件300及其對應之安全閂鎖412的操作,如上文參考圖2至圖10所論述。應理解,方法1100中所示之操作並非詳盡的,且可在所說明操作中之任一者之前、之後或之間同樣執行其他操作。在本發明之各種實施例中,方法1100之操作可以不同次序執行及/或變化。 FIG. 11 is a flow chart of an exemplary method 1100 for operating a device for supporting patterning according to an embodiment of the present invention. Method 1100 may describe the operation of a security device 300 and its corresponding security latch 412, as discussed above with reference to FIGS. 2 to 10 . It should be understood that the operations shown in method 1100 are not exhaustive, and other operations may be performed before, after, or between any of the operations described. In various embodiments of the present invention, the operations of method 1100 may be performed in different orders and/or varied.

在操作1102中,安全器件用以支撐圖案化器件。安全器件可包括具有至少一個形狀記憶體合金之致動器、安全閂鎖及耦合至該安全閂鎖的至少一個彈簧。安全閂鎖包括在該安全閂鎖之遠端處之支腳部分,其中該支腳部分經組態以充當圖案化器件之接觸點。在一些實施例中,可在旋轉組態中使用安全器件。在其他實施例中,可在蹺板組態中使用安全器件。 In operation 1102, a safety device is used to support a patterned device. The safety device may include an actuator having at least one shape memory alloy, a safety latch, and at least one spring coupled to the safety latch. The safety latch includes a foot portion at a distal end of the safety latch, wherein the foot portion is configured to serve as a contact point for the patterned device. In some embodiments, the safety device may be used in a rotational configuration. In other embodiments, the safety device may be used in a seesaw configuration.

在操作1104中,將電流施加至安全器件之至少一個形狀記憶體合金以激活該至少一個形狀記憶體合金。在一些實施例中,至少一個形狀記憶體合金之激活可包括至少一個形狀記憶體合金之膨脹,以及安全器件中之至少一個彈簧的膨脹。在其他實施例中,至少一個形狀記憶體合金之激活可包括至少一個形狀記憶體合金之壓縮,以及安全器件中之至少一個彈簧的壓縮。 In operation 1104, a current is applied to at least one shape memory alloy of the security device to activate the at least one shape memory alloy. In some embodiments, the activation of the at least one shape memory alloy may include expansion of the at least one shape memory alloy and expansion of at least one spring in the security device. In other embodiments, the activation of the at least one shape memory alloy may include compression of the at least one shape memory alloy and compression of at least one spring in the security device.

在操作1106中,回應於激活至少一個形狀記憶體合金,將安全器件之安全閂鎖自圖案化器件下方的第一位置致動至第二位置。在一些實施例中,形狀記憶體合金之膨脹可導致安全閂鎖自「打開」位置旋轉 至「閉合」位置,或反之亦然。安全閂鎖包括在該安全閂鎖之遠端處之支腳部分,其中該支腳部分經組態以充當倍縮光罩之接觸點。應理解,只要安全閂鎖並不發妨礙將倍縮光罩裝載至倍縮光罩夾盤,安全閂鎖之任何位置就可視為「打開」位置。 In operation 1106, in response to activating at least one shape memory alloy, a safety latch of the security device is actuated from a first position below the patterned device to a second position. In some embodiments, expansion of the shape memory alloy may cause the safety latch to rotate from an "open" position to a "closed" position, or vice versa. The safety latch includes a foot portion at a distal end of the safety latch, wherein the foot portion is configured to serve as a contact point for a zoom mask. It should be understood that any position of the safety latch may be considered an "open" position as long as the safety latch does not interfere with loading the zoom mask into the zoom mask chuck.

在操作1108中,自安全器件之至少一個形狀記憶體合金移除電流。在一些實施例中,可藉由冷卻形狀記憶體合金802或藉由關斷至該至少一個形狀記憶體合金的電流源來移除電流。 In operation 1108, current is removed from at least one shape memory alloy of the security device. In some embodiments, the current may be removed by cooling the shape memory alloy 802 or by shutting off a current source to the at least one shape memory alloy.

在操作1110中,回應於自至少一個形狀記憶體合金移除電流,將安全器件之安全閂鎖自第二位置致動至第一位置。在一些情況下,形狀記憶體合金可收縮至其原始位置,其使得安全閂鎖自「閉合」位置旋轉至「打開」位置,或反之亦然。 In operation 1110, in response to removing current from at least one shape memory alloy, a safety latch of the security device is actuated from a second position to a first position. In some cases, the shape memory alloy may contract to its original position, which causes the safety latch to rotate from a "closed" position to an "open" position, or vice versa.

可使用以下條款來進一步描述實施例: The following terms may be used to further describe the embodiments:

1.一種用以為一物件提供支撐之安全器件,其包含:一驅動側,其包含一驅動馬達;及一從動側,其包含:一殼體,其包含沿該殼體之一長度延伸之一旋轉軸;及一安全閂鎖,其中該從動側在該旋轉軸之一第一端處經由一非接觸式磁耦合器件耦合至該驅動馬達,其中該安全閂鎖耦合至與該旋轉軸之該第一端相對之該旋轉軸之一第二端,且其中該驅動馬達經組態以在該驅動側上經由該非接觸式磁耦合器件使該安全閂鎖在一徑向方向上旋轉。 1. A safety device for providing support for an object, comprising: a driving side, comprising a driving motor; and a driven side, comprising: a housing, comprising a rotating shaft extending along a length of the housing; and a safety latch, wherein the driven side is coupled to the driving motor at a first end of the rotating shaft via a non-contact magnetic coupling device, wherein the safety latch is coupled to a second end of the rotating shaft opposite to the first end of the rotating shaft, and wherein the driving motor is configured to rotate the safety latch in a radial direction on the driving side via the non-contact magnetic coupling device.

2.如條項1之安全器件,其中:該非接觸式磁耦合器件包含兩個組件;且複數個永久磁鐵配置於該兩個組件之鄰近表面上且在該磁耦合器件之該兩個組件之間提供吸引力。 2. A safety device as in item 1, wherein: the non-contact magnetic coupling device comprises two components; and a plurality of permanent magnets are arranged on adjacent surfaces of the two components and provide an attractive force between the two components of the magnetic coupling device.

3.如條項1之安全器件,其中該非接觸式磁耦合器件包含一面對面耦合機構。 3. A safety device as in item 1, wherein the contactless magnetic coupling device comprises a face-to-face coupling mechanism.

4.如條項1之安全器件,其中該非接觸式磁耦合器件包含一共軸耦合機構。 4. A safety device as in item 1, wherein the non-contact magnetic coupling device comprises a coaxial coupling mechanism.

5.如條項1之安全器件,其中該安全閂鎖經組態以在一第一位置與一第二位置之間旋轉,該第一位置及第二位置係由約5度與約20度之間的角分隔。 5. A safety device as in clause 1, wherein the safety latch is configured to rotate between a first position and a second position, the first position and the second position being separated by an angle between about 5 degrees and about 20 degrees.

6.如條項1之安全器件,其中該驅動馬達包含一壓電馬達或一雙穩態DC馬達。 6. A safety device as in clause 1, wherein the drive motor comprises a piezoelectric motor or a dual-state DC motor.

7.如條項1之之安全器件,其中該安全閂鎖包含在安全閂鎖的遠離旋轉軸之一遠端處之一支腳部分,該支腳部分經組態以充當該物件之一接觸點。 7. A safety device as in clause 1, wherein the safety latch comprises a foot portion at a distal end of the safety latch away from the rotation axis, the foot portion being configured to serve as a contact point for the object.

8.一種微影裝置,其包含:一照明系統,其經組態以調節一輻射光束;一支撐結構,其經構造以支撐一圖案化器件,該圖案化器件能夠在該輻射光束之橫截面中向該輻射光束賦予一圖案以形成一經圖案化之輻射光束;一投影系統,其經組態以將該經圖案化之輻射光束投影至一基板之一目標部分上;及 一或多個安全器件,其耦合至該支撐結構,該一或多個安全器件中之每一者包含:一驅動側,其包含一驅動馬達;及一從動側,其包含:一殼體,其包含沿該殼體之一長度延伸之一旋轉軸;及一安全閂鎖,其中該從動側在該旋轉軸之一第一端處經由一非接觸式磁耦合器件耦合至該驅動馬達,其中該安全閂鎖耦合至與該旋轉軸之該第一端相對之該旋轉軸之一第二端,且其中該驅動馬達經組態以在該驅動側上經由該非接觸式磁耦合器件使該安全閂鎖在一徑向方向上旋轉。 8. A lithography apparatus comprising: an illumination system configured to modulate a radiation beam; a support structure configured to support a patterning device capable of imparting a pattern to the radiation beam in a cross-section of the radiation beam to form a patterned radiation beam; a projection system configured to project the patterned radiation beam onto a target portion of a substrate; and one or more security devices coupled to the support structure, each of the one or more security devices comprising: a A driving side including a driving motor; and a driven side including: a housing including a rotating shaft extending along a length of the housing; and a safety latch, wherein the driven side is coupled to the driving motor via a contactless magnetic coupling device at a first end of the rotating shaft, wherein the safety latch is coupled to a second end of the rotating shaft opposite to the first end of the rotating shaft, and wherein the driving motor is configured to rotate the safety latch in a radial direction on the driving side via the contactless magnetic coupling device.

9.如條項8之微影器件,其中:非接觸式磁耦合器件包含兩個組件;且複數個永久磁鐵配置於該兩個組件之鄰近表面上且在該磁耦合器件之該兩個組件之間提供吸引力。 9. A lithography device as in item 8, wherein: the non-contact magnetic coupling device comprises two components; and a plurality of permanent magnets are arranged on adjacent surfaces of the two components and provide an attractive force between the two components of the magnetic coupling device.

10.如條項8之微影裝置,其中該非接觸式磁耦合器件包含一面對面耦合機構。 10. A lithography device as in item 8, wherein the non-contact magnetic coupling device comprises a surface-to-surface coupling mechanism.

11.如條項8之微影裝置,其中該非接觸式磁耦合器件包含一共軸耦合機構。 11. A lithography apparatus as in clause 8, wherein the non-contact magnetic coupling device comprises a coaxial coupling mechanism.

12.如條項8之微影裝置,其中該安全閂鎖經組態以在一第一位置及一第二位置之間旋轉,該第一位置及該第二位置係由在約5度與約20度之間的角分隔。 12. The lithography apparatus of clause 8, wherein the safety latch is configured to rotate between a first position and a second position, the first position and the second position being separated by an angle between about 5 degrees and about 20 degrees.

13.如條項8之微影裝置,其中該驅動馬達包含一壓電馬達或一雙穩態DC馬達。 13. A lithography apparatus as in clause 8, wherein the drive motor comprises a piezoelectric motor or a dual-state DC motor.

14.如條項8之微影裝置,其中該安全閂鎖包含在該安全閂鎖的遠離該旋轉軸之一遠端處之一支腳部分,該支腳部分經組態以充當該圖案化器件之一接觸點。 14. A lithography apparatus as in clause 8, wherein the safety latch comprises a foot portion at a distal end of the safety latch away from the rotation axis, the foot portion being configured to serve as a contact point for the patterning device.

15.一種方法,其包含:使用一安全器件支撐一圖案化器件,該安全器件包含具有至少一個形狀記憶體合金之一致動器、一安全閂鎖及耦合至該安全閂鎖之至少一個彈簧,該安全閂鎖包含位於該安全閂鎖之一遠端處之一支腳部分,該支腳部分經組態以充當該圖案化器件之一接觸點;將一電流施加至該安全器件之至少一個形狀記憶體合金以激活該至少一個形狀記憶體合金;及回應於該至少一個形狀記憶體合金之激活而將該安全閂鎖自該圖案化器件下方的一第一位置致動至一第二位置。 15. A method comprising: supporting a patterned device using a security device, the security device comprising an actuator having at least one shape memory alloy, a security latch and at least one spring coupled to the security latch, the security latch comprising a foot portion at a distal end of the security latch, the foot portion being configured to serve as a contact point of the patterned device; applying a current to at least one shape memory alloy of the security device to activate the at least one shape memory alloy; and actuating the security latch from a first position below the patterned device to a second position in response to the activation of the at least one shape memory alloy.

16.如條項15之方法,其中該使用包含:在一旋轉組態中使用該至少一個形狀記憶體合金及該致動器中耦合至該安全閂鎖之該至少一個彈簧。 16. The method of clause 15, wherein the use comprises: using the at least one shape memory alloy and the at least one spring coupled to the safety latch in the actuator in a rotational configuration.

17.如條項15之方法,其中該使用包含:在一蹺板組態中使用該至少一個形狀記憶體合金及該致動器中耦合至該安全閂鎖之至少一個彈簧。 17. The method of clause 15, wherein the use comprises: using the at least one shape memory alloy in a seesaw configuration and at least one spring in the actuator coupled to the safety latch.

18.如條項15之方法,其進一步包含:自該安全器件之該至少一個形狀記憶體合金移除電流以將該安全閂鎖自該第二位置致動至該第一位置。 18. The method of clause 15, further comprising: removing current from the at least one shape memory alloy of the security device to actuate the security latch from the second position to the first position.

19.如條項15之方法,其進一步包含: 回應於將該電流施加至該至少一個形狀記憶體合金來使該至少一個彈簧膨脹。 19. The method of clause 15, further comprising: Expanding the at least one spring in response to applying the current to the at least one shape memory alloy.

20.如條項15之方法,其進一步包含:回應於將該電流施加該至少一個形狀記憶體合金來壓縮至少一個彈簧。 20. The method of clause 15, further comprising: compressing at least one spring in response to applying the current to the at least one shape memory alloy.

最終結論Final Conclusion

雖然在本文中可特定地參考「倍縮光罩」,但應理解,此僅為圖案化器件之一個實例且本文所描述之實施例可適用於任何類型的圖案化器件。此外,本文所描述之實施例可用以為任何物件提供安全支撐,以確保夾持失效不會導致物件掉落並損壞自身或其他設備。 Although specific reference may be made herein to a "reduction mask," it should be understood that this is only one example of a patterned device and the embodiments described herein may be applicable to any type of patterned device. In addition, the embodiments described herein may be used to provide secure support for any object to ensure that a clamping failure does not cause the object to fall and damage itself or other equipment.

雖然在本文中可特定地參考微影裝置在IC製造中之使用,但應理解,本文中所描述之微影裝置可具有其他應用,諸如製造積體光學系統、用於磁疇記憶體之導引及偵測圖案、平板顯示器、LCD、薄膜磁頭等。熟習此項技術者應瞭解,在此等替代應用之上下文中,可認為本文中對術語「晶圓」或「晶粒」之任何使用分別與更一般術語「基板」或「目標部分」同義。可在曝光之前或之後在(例如)自動化光阻塗佈及顯影系統單元(通常將抗蝕劑層施加至基板且顯影經曝光之抗蝕劑之工具)、度量衡單元及/或檢測單元中處理本文中所提及之基板。在適用情況下,可將本文中之揭示內容施加至此等及其他基板處理工具。此外,可將基板處理多於一次,(例如)以便產生多層IC,使得本文所使用之術語「基板」亦可指已含有多個經處理之層的基板。 Although specific reference may be made herein to the use of lithography apparatus in IC manufacturing, it should be understood that the lithography apparatus described herein may have other applications, such as the manufacture of integrated optical systems, guide and detection patterns for magnetic resonance memory, flat panel displays, LCDs, thin film heads, etc. Those skilled in the art should understand that in the context of such alternative applications, any use of the terms "wafer" or "die" herein may be considered synonymous with the more general terms "substrate" or "target portion," respectively. The substrates mentioned herein may be processed before or after exposure in, for example, an automated photoresist coating and development system unit (a tool that typically applies a resist layer to a substrate and develops the exposed resist), a metrology unit, and/or an inspection unit. Where applicable, the disclosures herein may be applied to these and other substrate processing tools. Furthermore, a substrate may be processed more than once, for example, to produce a multi-layer IC, so that the term "substrate" as used herein may also refer to a substrate that already contains multiple processed layers.

雖然上文可特定地參考在光學微影之上下文中本發明之實施例的使用,但將瞭解,本發明可用於其他應用(例如,壓印微影)中,且 在上下文允許之情況下不限於光學微影。在壓印微影中,圖案化器件中之構形(topography)定義在基板上產生之圖案。可將圖案化器件之構形壓入至供應至基板之抗蝕劑層中,在基板上,抗蝕劑係由施加電磁輻射、熱、壓力或其組合而固化。在抗蝕劑固化之後,將圖案化器件移出抗蝕劑,從而在其中留下圖案。 Although the above may specifically refer to the use of embodiments of the invention in the context of optical lithography, it will be appreciated that the invention may be used in other applications, such as imprint lithography, and is not limited to optical lithography where the context permits. In imprint lithography, the topography in the patterned device defines the pattern produced on the substrate. The topography of the patterned device may be pressed into a layer of resist supplied to the substrate, where the resist is cured by applying electromagnetic radiation, heat, pressure, or a combination thereof. After the resist has cured, the patterned device is removed from the resist, leaving the pattern therein.

應理解,本文中之措詞或術語係出於描述而非限制之目的,使得本說明書之術語或措詞應由在所屬領域具通常知識者鑒於本文中之教示予以解譯。 It should be understood that the terms and expressions used herein are for descriptive purposes rather than limiting purposes, so that the terms and expressions used in this specification should be interpreted by a person of ordinary knowledge in the relevant field in light of the teachings herein.

如本文所使用之術語「基板」描述材料層經添加至之材料。在一些實施例中,基板自身可經圖案化,且添加於基板之頂部上之材料亦可經圖案化,或可保持不圖案化。 As used herein, the term "substrate" describes the material to which a layer of material is added. In some embodiments, the substrate itself may be patterned, and the material added on top of the substrate may also be patterned, or may remain unpatterned.

本發明之實施例可以硬體、韌體、軟體或其任何組合來實施。本發明之實施例亦可實施為儲存於機器可讀媒體上之指令,該等指令可由一或多個處理器讀取及執行。機器可讀媒體可包括用於儲存或傳輸呈可由機器(例如,計算器件)讀取之形式之資訊的任何機制。舉例而言,機器可讀媒體可包括唯讀記憶體(ROM);隨機存取記憶體(RAM);磁碟儲存媒體;光學儲存媒體;快閃記憶體元件;電氣、光學、聲學或其他形式之傳播信號及其他。另外,韌體、軟體、常式及/或指令可在本文中描述為執行某些動作。然而,應瞭解,此等描述僅出於方便起見,且此等動作實際上由計算器件、處理器、控制器或執行韌體、軟體、常式及/或指令之其他器件所導致。 Embodiments of the present invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the present invention may also be implemented as instructions stored on a machine-readable medium that may be read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a form that is readable by a machine (e.g., a computing device). For example, a machine-readable medium may include read-only memory (ROM); random access memory (RAM); disk storage media; optical storage media; flash memory devices; electrical, optical, acoustic, or other forms of propagated signals, and others. Additionally, firmware, software, routines, and/or instructions may be described herein as performing certain actions. However, it should be understood that such descriptions are for convenience only and that such actions are actually caused by a computing device, processor, controller or other device executing firmware, software, routines and/or instructions.

以下實例說明但不限制本發明之實施例。通常在該領域中遇到的將對熟習此項技術者顯而易見之多種條件及參數的其他適合之修改 及調整在本發明之精神及範疇內。 The following examples illustrate but do not limit embodiments of the present invention. Other suitable modifications and adjustments of the various conditions and parameters commonly encountered in the field that will be apparent to those skilled in the art are within the spirit and scope of the present invention.

雖然可在本文中特定地參考根據本發明之裝置及/或系統在IC之製造中的使用,但仍應明確理解,此類裝置及/或系統具有多種其他可能的應用。舉例而言,其可用於製造積體光學系統、用於磁疇記憶體之導引及偵測圖案、LCD面板、薄膜磁頭等。熟習此項技術者將瞭解,在此類替代應用之上下文中,本文中之術語「倍縮光罩」、「晶圓」或「晶粒」之任何使用應視為分別由更一般術語「光罩」、「基板」及「目標部分」替代。 Although specific reference may be made herein to the use of devices and/or systems according to the present invention in the manufacture of ICs, it should be expressly understood that such devices and/or systems have a variety of other possible applications. For example, they may be used in the manufacture of integrated optical systems, guide and detection patterns for magnetic memory, LCD panels, thin film heads, etc. Those skilled in the art will understand that in the context of such alternative applications, any use of the terms "mask", "wafer" or "die" herein should be considered to be replaced by the more general terms "mask", "substrate" and "target portion", respectively.

雖然上文已描述本發明之特定實施例,但應瞭解,可以與所描述方式不同之其他方式來實踐本發明。該描述不意欲限制本發明。 Although specific embodiments of the present invention have been described above, it should be understood that the present invention may be practiced in other ways than those described. This description is not intended to limit the present invention.

應瞭解,[實施方式]章節而非[發明內容]及[中文發明摘要]章節意欲用以解譯申請專利範圍。[發明內容]及[中文發明摘要]章節可闡述如由發明者預期之一或多個但並非所有本發明之例示性實施例,且因此,並不意欲以任何方式限制本發明及所附申請專利範圍。 It should be understood that the [Implementation Method] section, rather than the [Contents of the Invention] and [Abstract of the Invention in Chinese] sections, is intended to be used to interpret the scope of the patent application. The [Contents of the Invention] and [Abstract of the Invention in Chinese] sections may describe one or more but not all exemplary embodiments of the invention as intended by the inventor, and therefore, are not intended to limit the scope of the invention and the attached patent application in any way.

上文已憑藉說明特定功能及其關係的實施之功能建置區塊來描述本發明。為便於描述,本文中已任意地定義此等功能建置區塊的邊界。只要適當地執行指定功能及該等功能之關係,便可界定替代邊界。 The present invention has been described above by means of functional building blocks that illustrate the implementation of specific functions and their relationships. For ease of description, the boundaries of such functional building blocks have been arbitrarily defined herein. Alternative boundaries may be defined as long as the specified functions and relationships of such functions are properly performed.

特定實施例之前述描述將充分地揭露本發明之一般性質,使得在不脫離本發明之一般概念的情況下,其他人可藉由應用此項技術之技能範圍內之知識針對各種應用而容易地修改及/或調整此等特定實施例,而無需進行不當實驗。因此,基於本文中所呈現之教示及導引,此等調整及修改意欲在所揭示之實施例之等效者的涵義及範圍內。 The foregoing description of specific embodiments will fully disclose the general nature of the present invention so that others can easily modify and/or adjust these specific embodiments for various applications by applying knowledge within the skill of this technology without undue experimentation without departing from the general concept of the present invention. Therefore, based on the teachings and guidance presented herein, such adjustments and modifications are intended to be within the meaning and scope of equivalents of the disclosed embodiments.

因此,本發明之廣度及範疇不應受上述例示性實施例中之 任一者限制,而應僅根據以下申請專利範圍及其等效者來界定。 Therefore, the breadth and scope of the present invention should not be limited by any of the above-mentioned exemplary embodiments, but should be defined solely according to the scope of the following patent applications and their equivalents.

200:倍縮光罩載物台 200: Zoom mask stage

201:緩衝器器件 201: Buffer device

202:頂部載物台表面 202: Top stage surface

208:倍縮光罩 208: Zoom mask

212:第一編碼器 212: First encoder

214:第二編碼器 214: Second encoder

300:安全器件 300: Safety device

Claims (14)

一種用以為一物件提供支撐之安全器件,其包含: 一驅動側,其包含一驅動馬達;及 一從動側,其包含: 一殼體,其包含沿該殼體之一長度延伸之一旋轉軸;及 一安全閂鎖, 其中該從動側在該旋轉軸之一第一端處經由一非接觸式磁耦合器件耦合至該驅動馬達, 其中該安全閂鎖耦合至與該旋轉軸之該第一端相對之該旋轉軸之一第二端,且 其中該驅動馬達經組態以在該驅動側上經由該非接觸式磁耦合器件使該安全閂鎖在一徑向方向上旋轉。A safety device for providing support for an object, comprising: a driving side including a driving motor; and a driven side including: a housing including a rotating shaft extending along a length of the housing; and a safety latch, wherein the driven side is coupled to the driving motor via a contactless magnetic coupling device at a first end of the rotating shaft, wherein the safety latch is coupled to a second end of the rotating shaft opposite the first end of the rotating shaft, and wherein the driving motor is configured to rotate the safety latch in a radial direction on the driving side via the contactless magnetic coupling device. 如請求項1之安全器件,其中: 該非接觸式磁耦合器件包含兩個組件;且 複數個永久磁鐵配置於該兩個組件之鄰近表面上且在該磁耦合器件之該兩個組件之間提供吸引力。A safety device as claimed in claim 1, wherein: The non-contact magnetic coupling device comprises two components; and A plurality of permanent magnets are arranged on adjacent surfaces of the two components and provide an attractive force between the two components of the magnetic coupling device. 如請求項1之安全器件,其中該非接觸式磁耦合器件包含一面對面耦合機構。A safety device as claimed in claim 1, wherein the contactless magnetic coupling device includes a surface-to-surface coupling mechanism. 如請求項1之安全器件,其中該非接觸式磁耦合器件包含一共軸耦合機構。A safety device as claimed in claim 1, wherein the contactless magnetic coupling device includes a coaxial coupling mechanism. 如請求項1之安全器件,其中該安全閂鎖經組態以在一第一位置及一第二位置之間旋轉,該第一位置及該第二位置係由約5度與約20度之間的角分隔。A security device as in claim 1, wherein the security latch is configured to rotate between a first position and a second position, the first position and the second position being separated by an angle between approximately 5 degrees and approximately 20 degrees. 如請求項1之安全器件,其中該驅動馬達包含一壓電馬達或一雙穩態DC馬達。A safety device as claimed in claim 1, wherein the drive motor comprises a piezoelectric motor or a dual-state DC motor. 如請求項1之安全器件,其中該安全閂鎖包含在該安全閂鎖的遠離該旋轉軸之一遠端處之一支腳部分,該支腳部分經組態以充當該物件之一接觸點。A safety device as claimed in claim 1, wherein the safety latch includes a foot portion at a distal end of the safety latch away from the rotation axis, the foot portion being configured to serve as a contact point for the object. 一種微影裝置,其包含: 一照明系統,其經組態以調節一輻射光束; 一支撐結構,其經構造以支撐一圖案化器件,該圖案化器件能夠在該輻射光束之橫截面中向該輻射光束賦予一圖案以形成一經圖案化之輻射光束; 一投影系統,其經組態以將該經圖案化之輻射光束投影至一基板之一目標部分上;及 一或多個安全器件,其耦合至該支撐結構,該一或多個安全器件中之每一者包含: 一驅動側,其包含一驅動馬達;及 一從動側,其包含: 一殼體,其包含沿該殼體之一長度延伸之一旋轉軸;及 一安全閂鎖, 其中該從動側在該旋轉軸之一第一端處經由一非接觸式磁耦合器件耦合至該驅動馬達, 其中該安全閂鎖耦合至與該旋轉軸之該第一端相對之該旋轉軸之一第二端,且 其中該驅動馬達經組態以在該驅動側上經由該非接觸式磁耦合器件使該安全閂鎖在一徑向方向上旋轉。A lithography apparatus comprises: an illumination system configured to modulate a radiation beam; a support structure configured to support a patterning device capable of imparting a pattern to the radiation beam in a cross-section of the radiation beam to form a patterned radiation beam; a projection system configured to project the patterned radiation beam onto a target portion of a substrate; and one or more security devices coupled to the support structure, each of the one or more security devices comprising: a driver a driving side including a drive motor; and a driven side including: a housing including a rotating shaft extending along a length of the housing; and a safety latch, wherein the driven side is coupled to the drive motor at a first end of the rotating shaft via a contactless magnetic coupling device, wherein the safety latch is coupled to a second end of the rotating shaft opposite the first end of the rotating shaft, and wherein the drive motor is configured to rotate the safety latch in a radial direction on the driving side via the contactless magnetic coupling device. 如請求項8之微影裝置,其中: 非接觸式磁耦合器件包含兩個組件;且 複數個永久磁鐵配置於該兩個組件之鄰近表面上且在該磁耦合器件之該兩個組件之間提供吸引力。A lithography device as claimed in claim 8, wherein: The non-contact magnetic coupling device comprises two components; and A plurality of permanent magnets are arranged on adjacent surfaces of the two components and provide an attractive force between the two components of the magnetic coupling device. 如請求項8之微影裝置,其中該非接觸式磁耦合器件包含一面對面耦合機構。A lithography apparatus as claimed in claim 8, wherein the non-contact magnetic coupling device comprises a surface-to-surface coupling mechanism. 如請求項8之微影裝置,其中該非接觸式磁耦合器件包含一共軸耦合機構。A lithography apparatus as claimed in claim 8, wherein the non-contact magnetic coupling device comprises a coaxial coupling mechanism. 如請求項8之微影裝置,其中該安全閂鎖經組態以在一第一位置與一第二位置之間旋轉,該第一位置及第二位置係由約5度及約20度之間的角分隔。A lithography apparatus as in claim 8, wherein the safety latch is configured to rotate between a first position and a second position, the first position and the second position being separated by an angle between about 5 degrees and about 20 degrees. 如請求項8之微影裝置,其中該驅動馬達包含一壓電馬達或一雙穩態DC馬達。A lithography apparatus as claimed in claim 8, wherein the drive motor comprises a piezoelectric motor or a dual-state DC motor. 如請求項8之微影裝置,其中該安全閂鎖包含在該安全閂鎖的遠離該旋轉軸之一遠端處之一支腳部分,該支腳部分經組態以充當該圖案化器件之一接觸點。A lithography apparatus as claimed in claim 8, wherein the safety latch includes a foot portion at a distal end of the safety latch away from the rotation axis, the foot portion being configured to serve as a contact point for the patterned device.
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