TWI860220B - Method of manufacturing micro-connecting mechanism - Google Patents

Abstract

A method of manufacturing a micro-connection mechanism is provided. The method includes: providing a material strip including a plurality of stent frames, and manufacturing a micro-connection mechanism in each stent frame; forming an injection object on an inner edge of the stent frame; assembling conductive terminals with solder balls on the injection object to form a micro connector; connecting a micro electronic device at one end of the conductive terminals; connecting micro-sized wire harnesses at the other end of the conductive terminals; and detaching the micro-connection mechanism composed of micro-connector, micro-electronic device, and micro-sized wire harnesses from the stent frame.

Description

Method for manufacturing micro-connection mechanism

The present invention relates to a method for manufacturing a micro-connection mechanism, and in particular to a method for manufacturing a micro-connection mechanism of extremely small size for connecting a micro-lens.

Since the components of micro connectors are tiny, it is difficult to directly assemble the components of each micro connector and produce a micro connector mechanism including a micro connector according to the existing mold. Therefore, in the current field of micro connector manufacturing, there is an urgent need to provide an improved method for mass producing micro connector mechanisms to solve the above problems.

The main purpose of the present invention is to provide a method for manufacturing a micro-connection mechanism, including: providing a material strip having a plurality of bracket outer frames, manufacturing the micro-connection mechanism in each of the bracket outer frames, including: forming an ejection on the inner edge of the bracket outer frame; assembling a conductive terminal having a solder ball on the ejection to form a micro-connector; connecting a micro-electronic device at one end of the conductive terminal; connecting a micro-scale wiring harness at the other end of the conductive terminal; and separating the micro-connection mechanism consisting of the micro-connector, the micro-electronic device and the micro-scale wiring harness from the bracket outer frame.

To achieve the above-mentioned purpose, the present invention further provides a method for manufacturing a micro-connection mechanism, comprising: providing a support frame, manufacturing the micro-connection mechanism in the support frame, including: forming an ejection on the inner edge of the support frame; assembling a conductive terminal with a solder ball on the ejection to form a micro-connector; connecting a micro-electronic device at one end of the conductive terminal; connecting a micro-scale wiring harness at the other end of the conductive terminal; and separating the micro-connection mechanism composed of the micro-connector, the micro-electronic device and the micro-scale wiring harness from the support frame; wherein the size of the micro-connector is between 0.3mm (width) × 0.3mm (height) × 0.9mm (length) and 0.9mm (width) × 0.9mm (height) × 1.5mm (length).

In a preferred embodiment of the present invention, the inner frame edge of the bracket outer frame is further provided with a first auxiliary positioning portion, a second auxiliary positioning portion, a third auxiliary positioning portion and a fourth auxiliary positioning portion, which first protrude in a direction perpendicular to the bracket outer frame and then extend in a direction parallel to the bracket outer frame; wherein the first auxiliary positioning portion located at the diagonal side of the inner frame edge of the bracket outer frame has the same protruding direction as the fourth auxiliary positioning portion, and the first auxiliary positioning portion located at the diagonal side of the inner frame edge of the bracket outer frame has the same protruding direction as the fourth auxiliary positioning portion. The second auxiliary positioning part and the third auxiliary positioning part on the diagonal side of the inner frame edge of the bracket outer frame have the same protruding direction; Wherein, the process of connecting a microelectronic device at one end of the micro connector also includes positioning through the second auxiliary positioning part and the third auxiliary positioning part; the process of connecting a micro-sized wiring harness at the other end of the micro connector also includes positioning through the first auxiliary positioning part and the fourth auxiliary positioning part.

In a preferred embodiment of the present invention, the second auxiliary positioning portion and the third auxiliary positioning portion protrude toward the side of the micro connector connected to the micro electronic device, and the first auxiliary positioning portion and the fourth auxiliary positioning portion protrude toward the side of the micro connector connected to the micro-sized wiring harness; wherein the protruding length of the second auxiliary positioning portion and the third auxiliary positioning portion is shorter than the protruding length of the first auxiliary positioning portion and the fourth auxiliary positioning portion.

In a preferred embodiment of the present invention, the process of assembling a conductive terminal on the ejection object to form a micro connector also includes positioning the conductive terminal through a plurality of positioning through holes provided on the outer frame of the bracket.

In a preferred embodiment of the present invention, the process of forming an ejection on the inner edge of the bracket outer frame includes injecting the molding material of the ejection from the side of the micro-connection mechanism connected to the micro-electronic device.

In a preferred embodiment of the present invention, the size of the micro connector is between 0.3mm (width) × 0.3mm (height) × 0.9mm (length) and 0.9mm (width) × 0.9mm (height) × 1.5mm (length).

In a preferred embodiment of the present invention, the process of connecting a micro-sized wiring harness at the other end of the conductive terminal includes: laser welding the solder ball and the micro-sized wiring harness at the other end of the conductive terminal.

In a preferred embodiment of the present invention, the process of providing a material strip having a plurality of bracket outer frames and the process of forming an injection molded object on the inner edge of each bracket outer frame are completed through the same molding process.

The manufacturing method of the micro-connection mechanism of the present invention has at least the following advantages:

1. The manufacturing method of the micro-connector mechanism of the present invention utilizes the micro-connectors to be formed separately in the material strip, and the micro-connectors, micro-wiring harnesses, and micro-electronic devices are positioned and installed by the outer frame bracket of the material strip, so as to directly mass-produce the micro-connector mechanism including the micro-connector, thereby improving the yield rate and production speed of the manufactured products, and maintaining the consistency of the size of the produced micro-connector mechanism.

2. The manufacturing method of the micro-connection mechanism of the present invention uses multiple auxiliary positioning parts protruding from the inner frame edge of the bracket outer frame to position the micro wiring harness and micro electronic device connected to the conductive terminal from both sides of the bracket outer frame when mass-producing micro-connectors with a size range of 0.3mm (width) × 0.3mm (height) × 0.9mm (length) to 0.9mm (width) × 0.9mm (height) × 1.5mm (length), so as to accurately improve the production yield of the micro-connector and take into account the production speed at the same time.

3. The manufacturing method of the micro-connection mechanism of the present invention positions the conductive terminals and ejected objects on the micro-connector through multiple positioning through holes set on the outer frame of the bracket, uses laser welding to connect the solder balls on the terminals and the micro-sized wiring harness, and processes the ejected objects into micro-connectors in large quantities, thereby maintaining the electrical connection stability of the manufactured micro-connector and the micro-sized wiring harness.

4. From the above three points, it can be seen that the manufacturing method of the micro-connection mechanism of the present invention can stably process a large number of micro-connectors, maintain the size of a large number of products manufactured, and maintain the electrical connection stability between the manufactured micro-connectors and micro-sized wiring harnesses, thereby achieving the effect of improving the mass production speed and yield of the micro-connection mechanism.

S1~S6, S21~S26: Process

ST: material strip

FA: Bracket frame

O: Positioning through hole

F1: ejected objects

J1: Forming through hole

10: Micro connector

111: Conductive terminal

112: Tin Ball

20: Micro size wiring harness

21: External protective film

30: Microelectronic devices

1: Micro connection mechanism

A1: First auxiliary positioning unit

A2: Second auxiliary positioning unit

A3: The third auxiliary positioning unit

A4: The fourth auxiliary positioning unit

In order to more clearly explain the technical solution in the embodiment of the present invention, the following will briefly introduce the drawings required in the description of the embodiment: Figure 1 is a schematic diagram of the process of the manufacturing method of the micro-connection mechanism of an embodiment of the present invention.

Figure 2 is a schematic diagram of a material strip according to an embodiment of the present invention.

Figure 3 is a schematic diagram of the bracket frame and ejected object of an embodiment of the present invention.

Figure 4 is a schematic diagram of the bracket frame and ejected object at another angle of an embodiment of the present invention.

Figure 5 is a schematic diagram of a micro connector formed in the outer frame of a bracket in one embodiment of the present invention.

Figure 6 is a schematic diagram of a micro-connection mechanism formed within the outer frame of the bracket according to an embodiment of the present invention.

Figure 7 is a schematic diagram of the process of manufacturing a micro-connection mechanism of another embodiment of the present invention.

In order to make the above and other purposes, features, and advantages of this application more clearly understood, the following will specifically cite the preferred embodiments of this application and provide a detailed description with the accompanying drawings.

It should be particularly noted that the size of the micro connector in the micro connection mechanism manufacturing method provided by the present invention is between 0.3mm (width) × 0.3mm (height) × 0.9mm (length) and 0.9mm (width) × 0.9mm (height) × 1.5mm (length), and the cross-sectional area of the micro-sized wiring harness is less than 0.08mm ² . Since the manufactured micro connector and micro-sized wiring harness are of small size, the present invention is specifically designed for connecting micro-sized micro connection mechanisms and micro-wiring harnesses, and provides a micro connection mechanism manufacturing method that solves the problem that micro connectors are difficult to mass-produce and have an extremely low production yield.

Please refer to Figure 1. The present invention provides a method for manufacturing a micro-connection mechanism, including:

S1: Provide a material strip with multiple bracket frames, and manufacture micro-connection mechanisms in each bracket frame, including:

S2: An ejection is formed on the inner edge of the bracket frame.

Through processes S1 and S2, it is possible to mass-produce injection moldings used to form micro connectors, and because there is a fixed boundary relationship between the material strip and the bracket frame, there is also a fixed boundary relationship between the multiple injection moldings provided after process S2, thereby positioning each injection molding.

S3: Assemble conductive terminals with solder balls on the ejected object to form a micro connector.

S4: Connect the microelectronic device at one end of the conductive terminal.

S5: Connect the micro-sized wiring harness at the other end of the conductive terminal.

S6: Separate the micro-connection mechanism consisting of a micro-connector, a micro-electronic device, and a micro-sized wiring harness from the bracket frame.

Subsequently, the process S3 of installing the conductive terminal is performed using the positioned material strip and the outer frame bracket. Then, the process S4 of connecting the micro connector and the micro conductive terminal and the process S5 of connecting the micro connector and the micro-sized wiring harness are performed directly in the material strip and the outer frame bracket. Finally, the micro connection mechanism consisting of the micro connector, the micro electronic device, and the micro-sized wiring harness is manufactured in the process S6. The execution order of the aforementioned processes S5 and S6 can be replaced and is not limited to the order of the size of the numbers. Compared with the prior art method of manufacturing micro-connection mechanisms, the present invention uses the positioning results of the micro-connection mechanisms after the S2 injection molding is manufactured, and then continues to use them in the manufacturing of the micro-connection mechanisms. Therefore, there is no need to repeatedly position the micro-connectors, micro-sized wiring harnesses, conductive terminals, and microelectronic devices, thereby achieving the effect of improving the yield and production rate of manufacturing micro-connection mechanisms.

In one embodiment of the present invention, the material constituting the outer frame of the support is metal. Alternatively, in another embodiment of the present invention, the material constituting the outer frame of the support includes: polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polystyrene (PS), polyethylene terephthalate (PET), K-resin (K-Resin), polytetrafluoroethylene (PTFE), ABS resin (Acrylonitrile Butadiene Styrene) or high-performance engineering plastics or a mixture thereof. In one embodiment of the present invention, the outer frame of the support can be made by stamping or plastic molding.

Please refer to Figures 2, 3 and 4, which are three-dimensional schematic diagrams of the material belt provided by the present invention, and three-dimensional schematic diagrams of the bracket frame and the ejected object from different observation angles. In one embodiment of the present invention, the inner frame edge of the bracket frame FA is also provided with a first auxiliary positioning portion A1, a second auxiliary positioning portion A2, a third auxiliary positioning portion A3 and a fourth auxiliary positioning portion A4 that first protrude in a direction perpendicular to the bracket frame FA and then extend in a direction parallel to the bracket frame FA. Alternatively, in another embodiment of the present invention, the inner frame edge of the bracket frame FA is also provided with a first auxiliary positioning portion A1, a second auxiliary positioning portion A2, a third auxiliary positioning portion A3 and a fourth auxiliary positioning portion A4 that first protrude in a direction away from the bracket frame FA and then extend toward the plane center of the bracket frame FA.

In one embodiment of the present invention, the process of providing a material strip ST having a plurality of bracket frames FA and the process of forming an injection molded object F1 on the inner edge of each bracket frame FA are completed through the same molding process, so as to further simplify the product manufacturing process.

Next, please refer to Figures 3, 4 and 5 together. The first auxiliary positioning part A1 and the fourth auxiliary positioning part A4 located at the diagonal side of the inner frame edge of the bracket outer frame FA have the same protruding direction, and the second auxiliary positioning part A2 and the third auxiliary positioning part A3 located at the diagonal side of the inner frame edge of the bracket outer frame FA have the same protruding direction. In particular, in the manufacturing process of the micro-connector of the micro size provided by the present invention, the bracket outer frame FA and the material belt ST can be stabilized from two opposite directions at the two diagonal sides of the inner frame edge of the bracket outer frame FA, respectively, to improve the positioning stability of the ejection F1.

Among them, the second auxiliary positioning portion A2 and the third auxiliary positioning portion A3 protrude toward the side of the micro connector 10 connected to the micro electronic device 30, and the first auxiliary positioning portion A1 and the fourth auxiliary positioning portion A4 protrude toward the side of the micro connector 10 connected to the micro-sized wiring harness 20.

Among them, the process S4 of connecting the microelectronic device 30 at one end of the micro connector 10 also includes positioning the microelectronic device 30 through the second auxiliary positioning portion A2 and the third auxiliary positioning portion A3. The process S5 of connecting the micro-size wiring harness 20 at the other end of the micro connector 10 also includes positioning the micro-size wiring harness 20 through the first auxiliary positioning portion A1 and the fourth auxiliary positioning portion A4. In one embodiment of the present invention, in order to ensure the positioning accuracy and operating space of the micro-size wiring harness 20, the protruding length of the second auxiliary positioning portion A2 and the third auxiliary positioning portion A3 is shorter than the protruding length of the first auxiliary positioning portion A1 and the fourth auxiliary positioning portion A4.

In one embodiment of the present invention, the process of assembling the conductive terminal 111 on the ejection F1 to form the micro connector 10 also includes positioning the conductive terminal 111 through a plurality of positioning through holes O, a first auxiliary positioning portion A1, and a fourth auxiliary positioning portion A4 provided on the bracket frame FA. In the process S5 of connecting the other end of the conductive terminal 111 to the micro-sized wiring harness 20, the process also includes stabilizing the ejection F1 contained in the bracket frame FA by the first auxiliary positioning portion A1 and the fourth auxiliary positioning portion A4 to improve the position accuracy of the conductive terminal 111 installed on the ejection F1.

In one embodiment of the present invention, the process of forming the ejection F1 on the inner edge of the bracket frame FA includes injecting the molding material of the ejection F1 from the side where the micro-connection mechanism 1 is connected to the micro-electronic device 30. As shown in FIG. 3 and FIG. 5, the position of the molding through hole J1 for injecting the molding material is located on the same side where the micro-connector 10 is connected to the micro-electronic device 30.

It should be further explained that in one embodiment of the present invention, the process of connecting the micro-sized wiring harness 20 at the other end of the conductive terminal 111 includes: laser welding the solder ball 112 and the micro-sized wiring harness 20 at the other end of the conductive terminal 111.

The process of connecting the micro-sized wiring harness 20 at the other end of the conductive terminal 111 also includes moving the micro-sized wiring harness 20 by moving the external protective film 21 outside the micro-sized wiring harness 20.

Compared to the aforementioned processes S1 to S6, the present invention further provides a method for manufacturing a micro-connection mechanism using only a bracket frame FA without forming through a material strip ST, including: S21: providing a bracket frame, manufacturing a micro-connection mechanism in the bracket frame, including: S22: forming an ejection on the inner edge of the bracket frame; S23: assembling a conductive terminal with a solder ball on the ejection to form a micro-connector; S24: connecting a micro-electronic device at one end of the conductive terminal; S25: connecting a micro-sized wiring harness at the other end of the conductive terminal; and S26: separating the micro-connection mechanism consisting of the micro-connector, the micro-electronic device and the micro-sized wiring harness from the bracket frame.

Among them, the side where the injection molding is formed on the inner edge of the bracket outer frame and the side where the conductive terminal with the solder ball is assembled on the injection molding are the two sides of the bracket outer frame respectively, so as to improve the yield rate of the combination of the conductive terminal and the injection molding.

Through the above process S21~S26, by utilizing the positional relationship between the bracket frame and the ejected object, a micro-connection mechanism can be manufactured without repeatedly positioning the micro-connector, micro-sized wiring harness, conductive terminal, and micro-electronic device, thereby improving the yield and production rate of the manufactured micro-connection mechanism.

In summary, the manufacturing method of the micro-connection mechanism of the present invention has at least the following advantages:

1. The manufacturing method of the micro-connector mechanism of the present invention utilizes the micro-connectors to be formed separately in the material strip, and the micro-connectors, micro-wiring harnesses, and micro-electronic devices are positioned and installed by the outer frame bracket of the material strip, so as to directly mass-produce the micro-connector mechanism including the micro-connector, thereby improving the yield rate and production speed of the manufactured products, and maintaining the consistency of the size of the produced micro-connector mechanism.

2. The manufacturing method of the micro-connection mechanism of the present invention can simplify the production process, especially when mass-producing micro-connectors with a size range of 0.3mm (width) × 0.3mm (height) × 0.9mm (length) to 0.9mm (width) × 0.9mm (height) × 1.5mm (length), and use multiple auxiliary positioning parts protruding from the inner frame edge of the bracket outer frame to position the connected micro wiring harness and micro electronic device from both sides of the produced micro-connector, thereby improving the production yield and production speed of the micro-connector.

3. The manufacturing method of the micro-connection mechanism of the present invention positions the conductive terminals on the micro-connector and stabilizes the ejected material by means of multiple positioning through holes provided on the outer frame of the bracket, and uses laser welding to connect the solder balls on the terminals and the micro-sized wiring harness, thereby being able to process the ejected material into micro-connectors in large quantities and maintain the electrical connection stability of the manufactured micro-connector and the micro-sized wiring harness.

4. From the above three points, it can be seen that the manufacturing method of the micro-connection mechanism of the present invention can stably manufacture a large number of micro-connectors, and simultaneously complete the connection between the manufactured micro-connectors, micro-sized wiring harnesses and micro-electronic devices. At the same time, the size of the manufactured large number of products is maintained consistent, achieving mass production of micro-connection mechanisms and improving production speed and yield.

The above is only the best implementation method of this disclosure. It should be pointed out that technical personnel in the relevant field can make some improvements and modifications without departing from the principles of this disclosure. These improvements and modifications should also be regarded as the protection scope of this disclosure.

S1~S6: Process

Claims (10)

A method for manufacturing a micro-connection mechanism includes: providing a material strip having a plurality of bracket outer frames, manufacturing the micro-connection mechanism in each of the bracket outer frames, including: forming an ejection on the inner edge of the bracket outer frame; assembling a conductive terminal having a solder ball on the ejection to form a micro-connector; connecting a micro-electronic device at one end of the conductive terminal; connecting a micro-scale wiring harness at the other end of the conductive terminal; and separating the micro-connection mechanism consisting of the micro-connector, the micro-electronic device and the micro-scale wiring harness from the bracket outer frame. A method for manufacturing a micro-connection mechanism as described in claim 1, wherein the inner frame edge of the bracket outer frame is further provided with a first auxiliary positioning portion, a second auxiliary positioning portion, a third auxiliary positioning portion, and a fourth auxiliary positioning portion, which first protrude in a direction perpendicular to the bracket outer frame and then extend in a direction parallel to the bracket outer frame; wherein the protrusion direction of the first auxiliary positioning portion and the fourth auxiliary positioning portion located at the diagonal side of the inner frame edge of the bracket outer frame is The second auxiliary positioning part and the third auxiliary positioning part located at the diagonal side of the inner frame edge of the bracket outer frame have the same protruding direction; wherein the process of connecting a microelectronic device at one end of the micro connector also includes positioning through the second auxiliary positioning part and the third auxiliary positioning part; the process of connecting a micro-sized wiring harness at the other end of the micro connector also includes positioning through the first auxiliary positioning part and the fourth auxiliary positioning part. The manufacturing method of the micro-connection mechanism as described in claim 2, wherein the second auxiliary positioning portion and the third auxiliary positioning portion protrude toward the side of the micro-connector connected to the micro-electronic device, and the first auxiliary positioning portion and the fourth auxiliary positioning portion protrude toward the side of the micro-connector connected to the micro-scale wiring harness; wherein the protruding length of the second auxiliary positioning portion and the third auxiliary positioning portion is shorter than the protruding length of the first auxiliary positioning portion and the fourth auxiliary positioning portion. The method for manufacturing a micro-connection mechanism as described in claim 1, wherein the process of assembling a conductive terminal on the ejected object to form a micro-connector also includes positioning the conductive terminal through a plurality of positioning through holes provided on the outer frame of the bracket. The method for manufacturing a micro-connection mechanism as described in claim 1, wherein the process of forming an ejection object on the inner edge of the bracket outer frame includes injecting the molding material of the ejection object from the side of the micro-connection mechanism connected to the microelectronic device. A method for manufacturing a micro-connection mechanism as described in claim 1, wherein the size of the micro-connector is between 0.3mm (width) × 0.3mm (height) × 0.9mm (length) and 0.9mm (width) × 0.9mm (height) × 1.5mm (length). The manufacturing method of the micro-connection mechanism as described in claim 1, wherein the process of connecting a micro-sized wiring harness at the other end of the conductive terminal includes: laser welding the solder ball and the micro-sized wiring harness at the other end of the conductive terminal. The manufacturing method of the micro-connection mechanism as described in claim 1, wherein the process of providing a material strip having a plurality of bracket outer frames and the process of forming an injection molded object on the inner edge of each bracket outer frame are completed through the same molding process. A method for manufacturing a micro-connection mechanism comprises: providing a support frame, manufacturing the micro-connection mechanism in the support frame, including: forming an ejection on the inner edge of the support frame; assembling a conductive terminal with a solder ball on the ejection to form a micro-connector; connecting a micro-electronic device at one end of the conductive terminal; connecting a micro-scale wiring harness at the other end of the conductive terminal; and separating the micro-connection mechanism composed of the micro-connector, the micro-electronic device and the micro-scale wiring harness from the support frame; wherein the size of the micro-connector is between 0.3mm (width) × 0.3mm (height) × 0.9mm (length) and 0.9mm (width) × 0.9mm (height) × 1.5mm (length). The manufacturing method of the micro-connection mechanism as described in claim 9, wherein one side of the ejection object formed on the inner edge of the bracket outer frame and one side of the conductive terminal with the solder ball assembled on the ejection object are respectively two sides of the bracket outer frame.